TWI678108B - Image processing system and method for an image sensor - Google Patents
Image processing system and method for an image sensor Download PDFInfo
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Abstract
一種影像感測器的影像處理系統,包含類比至數位轉換單元,對像素信號執行類比至數位轉換,以產生數位像素信號;相關雙重取樣單元,對數位像素信號執行相關雙重取樣;黑階預估單元,根據預估光學黑像素經執行數位相關雙重取樣所得到的暗電壓以產生負偏移電壓,像素信號減去負偏移電壓之後饋至類比至數位轉換單元;及黑階補償單元,對主動像素感測元件及補償光學黑像素執行黑階補償。An image processing system of an image sensor includes an analog-to-digital conversion unit that performs analog-to-digital conversion on pixel signals to generate digital pixel signals; a correlated double sampling unit that performs correlated double sampling on digital pixel signals; black level estimation A unit that generates a negative offset voltage according to the estimated dark voltage obtained by performing digital correlation double sampling of the optical black pixel, and feeds the pixel signal to the analog to digital conversion unit after subtracting the negative offset voltage; The active pixel sensing element and the compensation optical black pixel perform black level compensation.
Description
本發明係有關一種影像感測器,特別是關於一種具改良信號鏈(signal-chain)動態範圍的行平行(column-parallel)影像感測器。 The invention relates to an image sensor, in particular to a column-parallel image sensor with an improved signal-chain dynamic range.
影像感測器(例如互補金屬氧化物半導體影像感測器)係一種將光學影像轉換為電子信號的裝置。影像感測器普遍使用於各類應用,例如行動電話或相機。互補金屬氧化物半導體(CMOS)影像感測器可使用於嚴苛的應用,例如汽車及保全。 An image sensor (such as a complementary metal oxide semiconductor image sensor) is a device that converts an optical image into an electronic signal. Image sensors are commonly used in various applications, such as mobile phones or cameras. Complementary metal oxide semiconductor (CMOS) image sensors can be used in demanding applications such as automotive and security.
即使沒有光線照射,仍然會有暗電流通過互補金屬氧化物半導體(CMOS)影像感測器的光二極體。由於暗電流會依溫度的上升而呈指數增加,因此於高溫時(例如高於攝氏60度),暗電流會成為重要的雜訊源,使得輸出影像變為飽和。即使使用傳統的黑階補償(black level compensation)機制,也無法辨識輸出影像。 Even if there is no light, dark current will still pass through the photodiode of the complementary metal oxide semiconductor (CMOS) image sensor. Since the dark current increases exponentially with temperature, at high temperatures (for example, above 60 degrees Celsius), the dark current can become an important source of noise, making the output image saturated. Even if the traditional black level compensation mechanism is used, the output image cannot be recognized.
鑑於傳統影像感測器於高溫時無法有效運作,因此亟需提出一種適用於高溫且具改良信號鏈動態範圍的新穎影像感測器。 In view of the fact that traditional image sensors cannot operate effectively at high temperatures, it is urgent to propose a novel image sensor that is suitable for high temperatures and has an improved signal chain dynamic range.
鑑於上述,本發明實施例的目的之一在於提出一種影像感測器,基於黑階預估(black level estimation),於高溫時可有效增進信號鏈動態範圍。 In view of the foregoing, one object of the embodiments of the present invention is to provide an image sensor based on black level estimation, which can effectively improve the dynamic range of the signal chain at high temperatures.
根據本發明實施例,影像感測器的影像處理系統包含像素陣列、類比至數位轉換單元、相關雙重取樣單元、黑階預估單元及黑階補償單元。像素陣列提供像素信號,該像素陣列包含主動像素感測元件(APS)、補償光學黑像素(OBP)及預估光學黑像素。類比至數位轉換單元對像素信號執行類比至數位轉換,以產生數位像素信號。相關雙重取樣單元對數位像素信號執行相關雙重取樣。黑階預估單元根據預估光學黑像素經執行數位相關雙重取樣所得到的暗電壓以產生負偏移電壓,該像素信號減去該負偏移電壓之後饋至類比至數位轉換單元。黑階補償單元對主動像素感測元件及補償光學黑像素執行黑階補償。 According to an embodiment of the present invention, the image processing system of the image sensor includes a pixel array, an analog-to-digital conversion unit, a correlated double sampling unit, a black level estimation unit, and a black level compensation unit. The pixel array provides pixel signals. The pixel array includes an active pixel sensing element (APS), a compensated optical black pixel (OBP), and an estimated optical black pixel. The analog-to-digital conversion unit performs analog-to-digital conversion on the pixel signal to generate a digital pixel signal. The correlated double sampling unit performs correlated double sampling on the digital pixel signal. The black level estimation unit generates a negative offset voltage according to the estimated dark voltage obtained by performing digital correlated double sampling of the optical black pixel, and the pixel signal is fed to the analog-to-digital conversion unit after subtracting the negative offset voltage. The black level compensation unit performs black level compensation on the active pixel sensing element and the compensated optical black pixel.
100‧‧‧影像感測器 100‧‧‧Image Sensor
11‧‧‧像素陣列 11‧‧‧ pixel array
110‧‧‧像素 110‧‧‧ pixels
111‧‧‧主動像素感測元件 111‧‧‧active pixel sensing element
112‧‧‧補償光學黑像素 112‧‧‧Compensated optical black pixels
113‧‧‧預估光學黑像素 113‧‧‧Estimated optical black pixels
12‧‧‧列解碼器 12‧‧‧ column decoder
13‧‧‧電流汲取列 13‧‧‧Current draw column
131‧‧‧電流汲取電路 131‧‧‧ current draw circuit
14‧‧‧比較器 14‧‧‧ Comparator
141A‧‧‧放大器 141A‧‧‧amplifier
141B‧‧‧放大器 141B‧‧‧Amplifier
141C‧‧‧放大器 141C‧‧‧amplifier
15‧‧‧斜坡產生器 15‧‧‧Slope generator
16‧‧‧計數器 16‧‧‧ Counter
17‧‧‧記憶裝置 17‧‧‧Memory device
18‧‧‧黑階預估單元 18‧‧‧ black level estimation unit
181‧‧‧預估器 181‧‧‧Estimator
182‧‧‧偏移產生器 182‧‧‧Offset generator
400‧‧‧影像處理系統 400‧‧‧Image Processing System
41‧‧‧類比至數位轉換單元 41‧‧‧ Analog to Digital Conversion Unit
42‧‧‧相關雙重取樣單元 42‧‧‧ Related Double Sampling Unit
43‧‧‧黑階補償單元 43‧‧‧black level compensation unit
431‧‧‧光學黑像素次單元 431‧‧‧ Optical Black Pixel Subunit
432‧‧‧主動像素感測元件次單元 432‧‧‧ active pixel sensing element subunit
433‧‧‧減法器 433‧‧‧Subtractor
600‧‧‧影像感測器 600‧‧‧Image Sensor
700‧‧‧影像處理系統 700‧‧‧Image Processing System
72‧‧‧減法器 72‧‧‧ Subtractor
91‧‧‧多工器 91‧‧‧ Multiplexer
92‧‧‧緩衝器 92‧‧‧Buffer
APS‧‧‧主動像素感測元件 APS‧‧‧Active Pixel Sensor
OBP‧‧‧光學黑像素 OBP‧‧‧ Optical Black Pixel
VDD‧‧‧電源電壓 VDD‧‧‧ supply voltage
RX‧‧‧重置電晶體 RX‧‧‧Reset transistor
TX‧‧‧傳送電晶體 TX‧‧‧Transistor
PD‧‧‧光二極體 PD‧‧‧Photodiode
FD‧‧‧浮動擴散節點 FD‧‧‧Floating Diffusion Node
SF‧‧‧源極隨耦電晶體 SF‧‧‧Source Followed Coupling Transistor
SX‧‧‧選擇電晶體 SX‧‧‧Select transistor
BL‧‧‧位元線 BL‧‧‧bit line
Vramp‧‧‧斜坡信號 Vramp‧‧‧ Ramp signal
t1~t4‧‧‧時間 t1 ~ t4‧‧‧Time
VBL‧‧‧位元線電壓 V BL ‧‧‧Bit Line Voltage
Vrst‧‧‧重置電壓 Vrst‧‧‧ reset voltage
Vsig‧‧‧光信號 Vsig‧‧‧Optical Signal
BLC‧‧‧黑階補償 BLC‧‧‧Black level compensation
ADC‧‧‧類比至數位轉換 ADC‧‧‧ Analog to Digital Conversion
CDS‧‧‧相關雙重取樣 CDS‧‧‧ Related Double Sampling
BLE‧‧‧黑階預估 BLE‧‧‧Black Level Estimate
Neg_offset‧‧‧負偏移電壓 Neg_offset‧‧‧Negative offset voltage
BLE<M:0>‧‧‧偏移控制信號 BLE <M: 0> ‧‧‧Offset control signal
VB1‧‧‧輸入電壓 VB 1 ‧‧‧ input voltage
VB2‧‧‧輸入電壓 VB 2 ‧‧‧ input voltage
R0~RN‧‧‧電阻列 R 0 ~ R N ‧‧‧Resistance column
ref1~refN‧‧‧參考電壓 ref 1 ~ ref N ‧‧‧ reference voltage
SW1‧‧‧第一開關 SW 1 ‧‧‧First switch
SW2‧‧‧第二開關 SW 2 ‧‧‧Second switch
C1‧‧‧第一電容器 C1‧‧‧First capacitor
C2‧‧‧第二電容器 C2‧‧‧Second capacitor
C3‧‧‧第三電容器 C3‧‧‧Third capacitor
第一圖顯示行平行影像感測器的方塊圖。 The first figure shows a block diagram of a line-parallel image sensor.
第二圖例示第一圖的像素的電路圖。 The second figure illustrates a circuit diagram of the pixels of the first figure.
第三圖例示第一圖之影像感測器執行相關雙重取樣的時序圖。 The third diagram illustrates a timing diagram of the image sensor in the first diagram performing correlated double sampling.
第四圖顯示影像感測器的影像處理系統的方塊圖。 The fourth figure shows a block diagram of the image processing system of the image sensor.
第五圖例示第一圖之影像感測器執行相關雙重取樣的另一時序圖。 The fifth diagram illustrates another timing diagram of the image sensor in the first diagram performing correlated double sampling.
第六圖顯示本發明實施例之行平行影像感測器的方塊圖。 FIG. 6 is a block diagram of a parallel image sensor according to an embodiment of the present invention.
第七圖顯示本發明實施例之影像感測器的影像處理系統的方塊圖。 The seventh figure shows a block diagram of an image processing system of an image sensor according to an embodiment of the present invention.
第八圖例示第六圖之影像感測器執行相關雙重取樣的時序圖。 The eighth figure illustrates a timing diagram of the image sensor in the sixth figure performing correlated double sampling.
第九圖例示第七圖之偏移產生器的電路圖。 The ninth figure illustrates a circuit diagram of the offset generator of the seventh figure.
第十A圖例示第六圖之比較器的電路圖。 The tenth diagram A illustrates the circuit diagram of the comparator of the sixth diagram.
第十B圖例示第六圖之比較器的另一電路圖。 The tenth diagram B illustrates another circuit diagram of the comparator of the sixth diagram.
第十C圖例示第六圖之比較器的又一電路圖。 The tenth diagram C illustrates another circuit diagram of the comparator of the sixth diagram.
第一圖顯示行平行(column-parallel)影像感測器100的方塊圖,例如互補金屬氧化物半導體(CMOS)影像感測器。影像感測器100可包含像素陣列11,其包含排列為矩陣形式的複數像素110。像素陣列可包含複數主動像素感測元件(APS)111及複數光學黑像素(OBP)112。主動像素感測元件(APS)111接收入射光,然而光學黑像素(OBP)112被阻擋而不會接收入射光。光學黑像素(OBP)112係作為黑階補償(black level compensation,BLC),其細節將於後續說明。 The first figure shows a block diagram of a column-parallel image sensor 100, such as a complementary metal oxide semiconductor (CMOS) image sensor. The image sensor 100 may include a pixel array 11 including a plurality of pixels 110 arranged in a matrix form. The pixel array may include a complex active pixel sensing element (APS) 111 and a complex optical black pixel (OBP) 112. The active pixel sensing element (APS) 111 receives incident light, whereas the optical black pixel (OBP) 112 is blocked from receiving incident light. The optical black pixel (OBP) 112 is used as black level compensation (BLC). The details will be described later.
第二圖例示第一圖的像素110的電路圖。像素110可包含光二極體PD、重置電晶體RX、傳送電晶體TX、源極隨耦電晶體SF及選擇電晶體SX,其連接為圖示的四電晶體架構。當重置電晶體RX開啟時,於浮動擴散節點FD定義重置電壓,其大小為電源電壓VDD減重置電晶體RX的壓降。當傳送電晶體TX開啟時,光二極體PD所累積的光信號可藉由浮動擴散節點FD而傳送。開啟源極隨耦電晶體SF以緩衝或放大光二極體PD的光信號。當選擇電晶體SX開啟時,可經由位元線BL而從像素陣列11讀出像素信號。 The second figure illustrates a circuit diagram of the pixel 110 of the first figure. The pixel 110 may include a photodiode PD, a reset transistor RX, a transmission transistor TX, a source follower transistor SF, and a selection transistor SX, which are connected as a four-transistor structure as shown in the figure. When the reset transistor RX is turned on, the reset voltage is defined at the floating diffusion node FD, and its magnitude is the power supply voltage VDD minus the voltage drop of the reset transistor RX. When the transmitting transistor TX is turned on, the optical signal accumulated by the photodiode PD can be transmitted through the floating diffusion node FD. The source follower transistor SF is turned on to buffer or amplify the optical signal of the photodiode PD. When the selection transistor SX is turned on, a pixel signal can be read out from the pixel array 11 via the bit line BL.
參閱第一圖,影像感測器100的像素陣列11可包含電流汲取列13,其包含複數電流汲取(current sink)電路131,分別耦接至選擇電晶體SX的輸出節點,如第二圖所例示。電流汲取電路131(例如電流源)耦接於選擇電晶體SX的輸出節點與地之間,作為偏壓電路,用以從選擇電晶體SX的輸出節點汲取電流。 Referring to the first figure, the pixel array 11 of the image sensor 100 may include a current sinking column 13 including a plurality of current sink circuits 131 respectively coupled to the output nodes of the selection transistor SX, as shown in the second figure. Instantiation. The current drawing circuit 131 (for example, a current source) is coupled between the output node of the selection transistor SX and the ground, and serves as a bias circuit for drawing current from the output node of the selection transistor SX.
影像感測器100可包含列解碼器12,其每次選擇像素陣列11當中的一列,用以讀出被選擇列的像素信號。 The image sensor 100 may include a column decoder 12 which selects one column of the pixel array 11 at a time for reading out pixel signals of the selected column.
第一圖的影像感測器100可採用單斜率(single-slope)行平行(column-parallel)類比至數位轉換機制,用以將像素信號從類比形式轉換為數位形式。類比至數位轉換機制可包含一組比較器14。每一比較器14耦接以接收像素陣列11的相應像素信號,以及接收斜坡(ramp)產生器15所產生 的斜坡信號Vramp。類比至數位轉換機制可包含一組計數器16,其耦接以分別接收比較器14的比較結果,且接收計數時脈。類比至數位轉換機制可更包含一組記憶裝置17,其耦接以分別接收計數器16的計數值。儲存於記憶裝置17的資料可由數位影像處理器(未顯示)來處理,以產生數位影像輸出。比較器14、計數器16及記憶裝置17主要建構出影像感測器100的信號鏈的像素讀出電路。 The image sensor 100 of the first figure may use a single-slope column-parallel analog-to-digital conversion mechanism to convert a pixel signal from an analog form to a digital form. The analog-to-digital conversion mechanism may include a set of comparators 14. Each comparator 14 is coupled to receive a corresponding pixel signal of the pixel array 11 and to receive a signal generated by a ramp generator 15 Ramp signal Vramp. The analog-to-digital conversion mechanism may include a set of counters 16 which are coupled to receive the comparison results of the comparator 14 and receive the counting clock, respectively. The analog-to-digital conversion mechanism may further include a set of memory devices 17 coupled to receive the count values of the counters 16 respectively. The data stored in the memory device 17 can be processed by a digital image processor (not shown) to generate a digital image output. The comparator 14, the counter 16 and the memory device 17 mainly construct a pixel readout circuit of a signal chain of the image sensor 100.
第三圖例示第一圖之影像感測器100執行相關雙重取樣(CDS)的時序圖。於重置期間,浮動擴散節點FD(第二圖)的重置電壓Vrst被取樣並饋至相應比較器14。當斜坡信號Vramp於時間t1開始產生時,計數器16則開始計數。當比較器14(於時間t2)偵測到斜坡信號Vramp與像素信號兩者相等的交叉點時,計數器16即停止計數。值得注意的是,重置期間的計數值包含(比較器相關的)偏移電壓與重置電壓Vrst,圖式當中的重置電壓Vrst為負值。 The third diagram illustrates a timing diagram of the image sensor 100 in the first diagram performing a correlated double sampling (CDS). During the reset period, the reset voltage Vrst of the floating diffusion node FD (second figure) is sampled and fed to the corresponding comparator 14. When the ramp signal Vramp starts to be generated at time t1, the counter 16 starts counting. When the comparator 14 (at time t2) detects a cross point where both the ramp signal Vramp and the pixel signal are equal, the counter 16 stops counting. It is worth noting that the count value during the reset period includes the (comparator-related) offset voltage and reset voltage Vrst. The reset voltage Vrst in the figure is negative.
於信號期間,光二極體PD的光信號Vsig加上浮動擴散節點FD的重置電壓Vrst被取樣並饋至相應的比較器14,圖式當中的光信號Vsig為負值。當斜坡信號Vramp於時間t3開始產生時,計數器16則開始計數。當比較器14(於時間t4)偵測到斜坡信號Vramp與像素信號兩者相等的交叉點時,計數器16即停止計數。值得注意的是,信號期間的計數值包含偏移電壓與重置電壓Vrst(相同於重置期間),且更包含光信號Vsig與暗電壓,其中暗電壓係由光二極體PD的暗電子(或暗電流)所造成。 During the signal period, the optical signal Vsig of the photodiode PD plus the reset voltage Vrst of the floating diffusion node FD is sampled and fed to the corresponding comparator 14. The optical signal Vsig in the figure is negative. When the ramp signal Vramp starts to be generated at time t3, the counter 16 starts counting. When the comparator 14 (at time t4) detects a cross point where both the ramp signal Vramp and the pixel signal are equal, the counter 16 stops counting. It is worth noting that the count value during the signal period includes the offset voltage and the reset voltage Vrst (same as the reset period), and further includes the optical signal Vsig and the dark voltage, where the dark voltage is a dark electron of the photodiode PD ( Or dark current).
第四圖顯示影像感測器(例如互補金屬氧化物半導體影像感測器)的影像處理系統400的方塊圖。影像處理系統(以下簡稱系統400)可包含類比至數位轉換(ADC)單元41,用以對接收自像素陣列11的像素信號執行類比至數位轉換。系統400可包含相關雙重取樣(CDS)單元42,用以對ADC單元所產生的數位像素信號執行相關雙重取樣(例如數位相關雙重取樣或DDS),藉以除去偏移電壓及重置電壓,因而產生相關像素信號。系統 400還可包含黑階補償(BLC)單元43,用以去除暗電壓,因而產生補償像素信號。於另一例子中,CDS單元42位於ADC單元41之前,因此於執行類比至數位轉換前,先對像素信號執行(類比)相關雙重取樣。 The fourth figure shows a block diagram of an image processing system 400 of an image sensor, such as a complementary metal oxide semiconductor image sensor. The image processing system (hereinafter referred to as the system 400) may include an analog-to-digital conversion (ADC) unit 41 for performing analog-to-digital conversion on a pixel signal received from the pixel array 11. The system 400 may include a correlated double sampling (CDS) unit 42 for performing correlated double sampling (such as digital correlated double sampling or DDS) on the digital pixel signals generated by the ADC unit to remove the offset voltage and reset voltage, thereby generating Related pixel signals. system The 400 may further include a black level compensation (BLC) unit 43 for removing a dark voltage, thereby generating a compensated pixel signal. In another example, the CDS unit 42 is located before the ADC unit 41. Therefore, before performing the analog-to-digital conversion, the pixel signal is subjected to (analog) correlated double sampling.
詳而言之,於重置期間,ADC單元41首先處理像素陣列11的光學黑像素(OBP)112(第一圖),因而產生第一數位像素信號,其包含偏移電壓與重置電壓。接著,於信號期間,ADC單元41處理光學黑像素(OBP)112,因而產生第二數位像素信號,其包含偏移電壓、重置電壓與暗電壓。CDS單元42將第二數位像素信號減去第一數位像素信號,因而產生暗電壓(但不包含偏移電壓與重置電壓)。所產生的暗電壓暫存於BLC單元43當中的光學黑像素(OBP)次單元431。 In detail, during the reset period, the ADC unit 41 first processes the optical black pixels (OBP) 112 (first image) of the pixel array 11, and thus generates a first digital pixel signal including an offset voltage and a reset voltage. Then, during the signal period, the ADC unit 41 processes the optical black pixel (OBP) 112, thereby generating a second digital pixel signal including an offset voltage, a reset voltage, and a dark voltage. The CDS unit 42 subtracts the first digital pixel signal from the second digital pixel signal, thereby generating a dark voltage (but excluding the offset voltage and the reset voltage). The generated dark voltage is temporarily stored in the optical black pixel (OBP) sub-unit 431 among the BLC units 43.
類似的情形,於重置期間,ADC單元41首先處理像素陣列11的主動像素感測元件(APS)111(第一圖),因而產生第三數位像素信號,其包含偏移電壓與重置電壓。接著,於信號期間,ADC單元41處理主動像素感測元件(APS)111,因而產生第四數位像素信號,其包含偏移電壓、重置電壓、暗電壓與光信號。CDS單元42將第四數位像素信號減去第三數位像素信號,因而產生暗電壓與光信號(但不包含偏移電壓與重置電壓)。所產生的暗電壓與光信號暫存於BLC單元43當中的主動像素感測元件(APS)次單元432。 In a similar situation, during the reset period, the ADC unit 41 first processes the active pixel sensing element (APS) 111 (first picture) of the pixel array 11 and thus generates a third digital pixel signal including an offset voltage and a reset voltage. . Then, during the signal period, the ADC unit 41 processes the active pixel sensing element (APS) 111, thereby generating a fourth digital pixel signal including an offset voltage, a reset voltage, a dark voltage, and an optical signal. The CDS unit 42 subtracts the third digital pixel signal from the fourth digital pixel signal, thereby generating a dark voltage and a light signal (but not including an offset voltage and a reset voltage). The generated dark voltage and light signal are temporarily stored in the active pixel sensing element (APS) sub-unit 432 of the BLC unit 43.
最後,BLC單元43的減法器433將儲存於APS次單元432的暗電壓與光信號減去儲存於OBP次單元431的暗電壓,因而產生補償像素信號,其不含有暗電壓。黑階補償可表示為:(‘暗電壓+光信號’)APS-(‘暗電壓’)OBP=光信號 Finally, the subtractor 433 of the BLC unit 43 subtracts the dark voltage and the light signal stored in the APS sub-unit 432 from the dark voltage stored in the OBP sub-unit 431, thereby generating a compensated pixel signal that does not contain the dark voltage. Black level compensation can be expressed as: ('dark voltage + light signal') APS -('dark voltage') OBP = light signal
藉此,黑色的補償像素信號的值可非常接近數位零值。相反地,若未進行黑階補償,則黑色的相關像素信號看起來為灰色。甚者,光二極體PD的暗電流會依溫度的上升而呈指數增加。 Thereby, the value of the black compensation pixel signal can be very close to the digital zero value. Conversely, if black level compensation is not performed, the black related pixel signal looks gray. Furthermore, the dark current of the photodiode PD increases exponentially with temperature.
第五圖例示第一圖之影像感測器100執行相關雙重取樣(CDS)的另一時序圖。於高溫情形下,比較器14無法偵測到斜坡信號Vramp與像素信號的交叉點,且計數器16造成溢位(overflow)。此外,隨著溫度上升,OBP次單元431與APS次單元432需要使用更多儲存空間或更多位元。為了克服系統400的缺點,以下提出一種新穎的系統。 The fifth diagram illustrates another timing diagram of the image sensor 100 in the first diagram performing a correlated double sampling (CDS). In a high temperature situation, the comparator 14 cannot detect the intersection of the ramp signal Vramp and the pixel signal, and the counter 16 causes an overflow. In addition, as the temperature rises, the OBP subunit 431 and the APS subunit 432 need to use more storage space or more bits. To overcome the shortcomings of the system 400, a novel system is proposed below.
第六圖顯示本發明實施例之行平行(column-parallel)影像感測器600(例如互補金屬氧化物半導體影像感測器)的方塊圖。影像感測器600可包含像素陣列11,其包含排列為矩陣形式的複數像素110。在本實施例中,像素陣列可包含複數主動像素感測元件(APS)111、複數補償光學黑像素(OBP)112及複數預估光學黑像素(OBP)113。主動像素感測元件(APS)111接收入射光,然而補償光學黑像素(OBP)112及預估光學黑像素(OBP)113被阻擋而不會接收入射光。補償光學黑像素(OBP)112係作為黑階補償,如前所述,而預估光學黑像素(OBP)113則作為黑階預估,其細節將於後續說明。 The sixth figure shows a block diagram of a column-parallel image sensor 600 (such as a complementary metal oxide semiconductor image sensor) according to an embodiment of the present invention. The image sensor 600 may include a pixel array 11 including a plurality of pixels 110 arranged in a matrix form. In this embodiment, the pixel array may include a complex active pixel sensing element (APS) 111, a complex compensated optical black pixel (OBP) 112, and a complex estimated optical black pixel (OBP) 113. The active pixel sensing element (APS) 111 receives the incident light, but the compensated optical black pixel (OBP) 112 and the estimated optical black pixel (OBP) 113 are blocked without receiving the incident light. The compensated optical black pixel (OBP) 112 is used as the black level compensation, as described above, and the estimated optical black pixel (OBP) 113 is used as the black level estimation. The details will be described later.
類似於第一圖,影像感測器600可包含列解碼器12,其每次選擇像素陣列11當中的一列,用以讀出被選擇列的像素信號。影像感測器600可包含電流汲取列13,其包含複數電流汲取電路131,分別耦接至選擇電晶體SX的輸出節點,如第二圖所例示。電流汲取電路131(例如電流源)耦接於選擇電晶體SX的輸出節點與地之間,作為偏壓電路,用以從選擇電晶體SX的輸出節點汲取電流。 Similar to the first figure, the image sensor 600 may include a column decoder 12 which selects one column of the pixel array 11 at a time for reading out pixel signals of the selected column. The image sensor 600 may include a current drawing column 13 including a plurality of current drawing circuits 131 respectively coupled to the output nodes of the selection transistor SX, as illustrated in the second figure. The current drawing circuit 131 (for example, a current source) is coupled between the output node of the selection transistor SX and the ground, and serves as a bias circuit for drawing current from the output node of the selection transistor SX.
本實施例之影像感測器600可採用單斜率行平行(column-parallel)類比至數位轉換機制,用以將像素信號從類比形式轉換為數位形式。類比至數位轉換機制可包含一組比較器14。每一比較器14耦接以接收像素陣列11的相應像素信號,以及接收斜坡(ramp)產生器15所產生的斜坡信號Vramp。類比至數位轉換機制可包含一組計數器16,其耦接以分別接收比較器14的比較結果,且接收計數時脈。類比至數位轉換機制可 更包含一組記憶裝置17,其耦接以分別接收計數器16的計數值。儲存於記憶裝置17的資料可由數位影像處理器(未顯示)來處理,以產生數位影像輸出。 The image sensor 600 of this embodiment may use a single-slope column-parallel analog-to-digital conversion mechanism to convert a pixel signal from an analog form to a digital form. The analog-to-digital conversion mechanism may include a set of comparators 14. Each comparator 14 is coupled to receive a corresponding pixel signal of the pixel array 11 and to receive a ramp signal Vramp generated by a ramp generator 15. The analog-to-digital conversion mechanism may include a set of counters 16 which are coupled to receive the comparison results of the comparator 14 and receive the counting clock, respectively. Analog to digital conversion mechanism It further includes a set of memory devices 17 coupled to receive the count values of the counter 16 respectively. The data stored in the memory device 17 can be processed by a digital image processor (not shown) to generate a digital image output.
根據本實施例的特徵之一,影像感測器600可包含黑階預估(black level estimation,BLE)單元18,其根據相關雙重取樣(例如對預估光學黑像素(OBP)113執行的數位相關雙重取樣)的輸出以產生負偏移電壓Neg_offset。負偏移電壓Neg_offset被饋至比較器14,用以抵消像素信號的暗電壓。 According to one of the features of this embodiment, the image sensor 600 may include a black level estimation (BLE) unit 18, which is based on correlated double sampling (e.g., digitally performed on estimated optical black pixel (OBP) 113) Correlation Double Sampling) to generate a negative offset voltage Neg_offset. The negative offset voltage Neg_offset is fed to the comparator 14 to cancel the dark voltage of the pixel signal.
第七圖顯示本發明實施例之影像感測器(例如互補金屬氧化物半導體影像感測器)的影像處理系統700的方塊圖。第七圖的方塊可使用硬體(例如電路)或軟體(例如執行於數位信號處理器)來實施。方塊11、41、42、43已於第四圖討論過,其細節不再贅述。在本實施例中,影像處理系統700(以下簡稱系統700)可包含黑階預估(BLE)單元18,其耦接以接收CDS單元42的輸出,藉以產生負偏移電壓Neg_offset。減法器72將(像素陣列11輸出的)像素信號減去負偏移電壓Neg_offset,減法器72的輸出饋至ADC單元41。 The seventh figure shows a block diagram of an image processing system 700 of an image sensor (such as a complementary metal oxide semiconductor image sensor) according to an embodiment of the present invention. The blocks of the seventh figure may be implemented using hardware (such as a circuit) or software (such as being executed on a digital signal processor). Blocks 11, 41, 42, 43 have been discussed in the fourth figure, and the details will not be repeated. In this embodiment, the image processing system 700 (hereinafter referred to as the system 700) may include a black level estimation (BLE) unit 18 that is coupled to receive the output of the CDS unit 42 to generate a negative offset voltage Neg_offset. The subtracter 72 subtracts the negative offset voltage Neg_offset from the pixel signal (output from the pixel array 11), and the output of the subtractor 72 is fed to the ADC unit 41.
詳而言之,本實施例之黑階預估(BLE)單元18可包含預估器181與偏移產生器182。在本實施例中,預估器181為數位電路或程式,且偏移產生器182為類比電路。預估器181耦接以接收針對預估光學黑像素(OBP)113執行相關雙重取樣所得到的暗電壓,可表示為:BLE:(偏移信號+重置電壓+暗電壓)-(偏移信號+重置電壓)=暗電壓 In detail, the black level estimation (BLE) unit 18 in this embodiment may include an estimator 181 and an offset generator 182. In this embodiment, the estimator 181 is a digital circuit or program, and the offset generator 182 is an analog circuit. The estimator 181 is coupled to receive the dark voltage obtained by performing correlated double sampling on the estimated optical black pixel (OBP) 113, which can be expressed as: BLE: (offset signal + reset voltage + dark voltage)-(offset (Signal + reset voltage) = dark voltage
如果預估器181判定暗電壓大於預設臨界值,則預估器181以偏移控制信號BLE<M:0>驅動偏移產生器182,以產生(類比)負偏移電壓Neg_offset,用以對補償光學黑像素(OBP)112及主動像素感測元件(APS)111執行黑階補償。藉此,補償光學黑像素(OBP)112及主動像素感測元件(APS)111的暗電壓即可被負偏移電壓Neg_offset抵消。所產生的負偏移 電壓Neg_offset可作為目前列及後續列的主動像素感測元件(APS)111以執行黑階補償。BLC單元43執行如下的黑階補償:OBP:(偏移電壓+重置電壓+暗電壓-負偏移電壓)-(偏移電壓+重置電壓)=暗電壓-負偏移電壓 If the estimator 181 determines that the dark voltage is greater than a preset threshold, the estimator 181 drives the offset generator 182 with an offset control signal BLE <M: 0> to generate (analogically) a negative offset voltage Neg_offset for Black level compensation is performed on the compensated optical black pixels (OBP) 112 and the active pixel sensing element (APS) 111. Thereby, the dark voltages of the compensated optical black pixel (OBP) 112 and the active pixel sensing element (APS) 111 can be cancelled by the negative offset voltage Neg_offset. The resulting negative offset The voltage Neg_offset can be used as the active pixel sensing element (APS) 111 of the current column and subsequent columns to perform black level compensation. The BLC unit 43 performs the following black level compensation: OBP: (offset voltage + reset voltage + dark voltage-negative offset voltage)-(offset voltage + reset voltage) = dark voltage-negative offset voltage
APS:(偏移電壓+重置電壓+暗電壓+光信號-負偏移電壓)-(偏移電壓+重置電壓)=暗電壓+光信號-負偏移電壓 APS: (offset voltage + reset voltage + dark voltage + optical signal-negative offset voltage)-(offset voltage + reset voltage) = dark voltage + optical signal-negative offset voltage
BLC:(暗電壓+光信號-負偏移電壓)APS-(暗電壓-負偏移電壓)OBP=光信號 BLC: (dark voltage + light signal-negative offset voltage) APS- (dark voltage-negative offset voltage) OBP = light signal
第八圖例示第六圖之影像感測器600執行相關雙重取樣(CDS)的時序圖。於高溫情形下,暗電壓可被負偏移電壓Neg_offset抵消。圖式當中的負偏移電壓Neg_offset為正值,其係相反於負值的光信號Vsig。藉此,比較器14可偵測到斜坡信號Vramp與像素信號的交叉點,不會造成計數器16的溢位。因此,OBP次單元431與APS次單元432的儲存空間或位元數可以有效降低,且信號鏈的動態範圍於高溫情形下可大量增進。 The eighth figure illustrates a timing diagram of the image sensor 600 of the sixth figure performing a correlated double sampling (CDS). Under high temperature conditions, the dark voltage can be offset by the negative offset voltage Neg_offset. The negative offset voltage Neg_offset in the figure is a positive value, which is opposite to the optical signal Vsig of a negative value. As a result, the comparator 14 can detect the intersection of the ramp signal Vramp and the pixel signal without causing the counter 16 to overflow. Therefore, the storage space or number of bits of the OBP sub-unit 431 and the APS sub-unit 432 can be effectively reduced, and the dynamic range of the signal chain can be greatly improved under high temperature conditions.
第九圖例示第七圖之偏移產生器182的電路圖。在本實施例中,偏移產生器182可包含電阻列R0~RN組成的分壓器。分壓器將輸入電壓VB1-VB2分配於電阻列R0~RN,因而產生參考電壓ref1~refN。偏移產生器182可包含多工器91,其耦接以接收參考電壓ref1~refN。多工器91根據偏移控制信號BLE<M:0>當中的選擇位元,選擇參考電壓ref1~refN的其中之一作為輸出。 The ninth figure illustrates a circuit diagram of the offset generator 182 of the seventh figure. In this embodiment, the offset generator 182 may include a voltage divider composed of the resistor columns R 0 to R N. The voltage divider distributes the input voltages VB 1 -VB 2 to the resistor columns R 0 ~ R N , and thus generates reference voltages ref 1 ~ ref N. The offset generator 182 may include a multiplexer 91 coupled to receive the reference voltages ref 1 to ref N. The multiplexer 91 selects one of the reference voltages ref 1 to ref N as an output according to a selection bit in the offset control signal BLE <M: 0>.
偏移產生器182可包含第一開關SW1及第二開關SW2。第一開關SW1連接於多工器91的輸出與緩衝器92的輸入之間。第二開關SW2的第一端連接至緩衝器92的輸入,第二端連接至地。當預估光學黑像素(OBP)113執行黑階補償時,第一開關SW1閉合且第二開關SW2斷開,因此多工器91輸出選擇的參考電壓,其通過緩衝器92作為負偏移電壓Neg_offset。當預估 光學黑像素(OBP)113不執行黑階補償時,第一開關SW1斷開且第二開關SW2閉合,因此多工器91不會產生任何負偏移電壓Neg_offset。 The offset generator 182 may include a first switch SW 1 and a second switch SW 2 . Between the first input is connected to the out switch SW 1 of the multiplexer 91 and output buffer 92. A first terminal of the second switch SW 2 is connected to the input of the buffer 92 and a second terminal is connected to the ground. When the estimated optical black pixel (OBP) 113 performs black level compensation, the first switch SW 1 is closed and the second switch SW 2 is open, so the multiplexer 91 outputs the selected reference voltage, which is passed through the buffer 92 as a negative bias. Shift voltage Neg_offset. When the estimated optical black pixel (OBP) 113 does not perform black level compensation, the first switch SW1 is opened and the second switch SW2 is closed, so the multiplexer 91 does not generate any negative offset voltage Neg_offset.
第十A圖例示第六圖之比較器14的電路圖。比較器14可包含差動(differential)至單端放大器141A(例如運算放大器)。像素信號與負偏移電壓Neg_offset分別經由第一電容器C1與第二電容器C2連接至放大器141A的反相輸入。斜坡信號Vramp連接至放大器141A的非反相輸入。第十B圖例示第六圖之比較器14的另一電路圖。比較器14可包含差動至差動放大器141B(例如運算放大器)。像素信號與負偏移電壓Neg_offset分別經由第一電容器C1與第二電容器C2連接至放大器141B的反相輸入。斜坡信號Vramp經由第三電容器C3連接至放大器141B的非反相輸入。第十C圖例示第六圖之比較器14的又一電路圖。比較器14可包含單端輸入單端輸出放大器141C(例如運算放大器)。像素信號、負偏移電壓Neg_offset及斜坡信號Vramp分別經由第一電容器C1、第二電容器C2及第三電容器C3連接至放大器141C的輸入。 The tenth diagram A illustrates a circuit diagram of the comparator 14 of the sixth diagram. The comparator 14 may include a differential to single-ended amplifier 141A (eg, an operational amplifier). The pixel signal and the negative offset voltage Neg_offset are connected to the inverting input of the amplifier 141A via the first capacitor C1 and the second capacitor C2, respectively. The ramp signal Vramp is connected to a non-inverting input of the amplifier 141A. The tenth diagram B illustrates another circuit diagram of the comparator 14 of the sixth diagram. The comparator 14 may include a differential-to-differential amplifier 141B (eg, an operational amplifier). The pixel signal and the negative offset voltage Neg_offset are connected to the inverting input of the amplifier 141B via the first capacitor C1 and the second capacitor C2, respectively. The ramp signal Vramp is connected to the non-inverting input of the amplifier 141B via a third capacitor C3. The tenth diagram C illustrates another circuit diagram of the comparator 14 of the sixth diagram. The comparator 14 may include a single-ended input single-ended output amplifier 141C (eg, an operational amplifier). The pixel signal, the negative offset voltage Neg_offset and the ramp signal Vramp are connected to the input of the amplifier 141C via the first capacitor C1, the second capacitor C2, and the third capacitor C3, respectively.
以上所述僅為本發明之較佳實施例而已,並非用以限定本發明之申請專利範圍;凡其它未脫離發明所揭示之精神下所完成之等效改變或修飾,均應包含在下述之申請專利範圍內。 The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of patent application of the present invention; all other equivalent changes or modifications made without departing from the spirit disclosed by the invention should be included in the following Within the scope of patent application.
Claims (20)
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