TWI677545B - Surface protection film - Google Patents

Surface protection film Download PDF

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TWI677545B
TWI677545B TW104129520A TW104129520A TWI677545B TW I677545 B TWI677545 B TW I677545B TW 104129520 A TW104129520 A TW 104129520A TW 104129520 A TW104129520 A TW 104129520A TW I677545 B TWI677545 B TW I677545B
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protection film
surface protection
meth
energy ray
acrylate
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TW201627445A (en
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堀米克彦
Katsuhiko Horigome
富永知親
Tomochika TOMINAGA
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日商琳得科股份有限公司
Lintec Corporation
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Abstract

本發明的表面保護薄膜為貼合於光學構件或電子構件上而使用於保護該表面者,其具備基材、與設置於該基材的一面之黏著劑層,前述黏著劑層係由含有丙烯酸系共聚物(A)之能量線硬化型黏著劑組成物所成,前述丙烯酸系共聚物(A)為共聚合至少含有5~50質量%之烷基的碳數為1或2之烷基(甲基)丙烯酸酯的同時,未含含有羧基的單體或含有未達5質量%之該含有羧基的單體之單體成分所得者。 The surface protection film of the present invention is used for protecting an optical member or an electronic member and is used to protect the surface. The surface protective film includes a substrate and an adhesive layer provided on one side of the substrate. The adhesive layer is made of acrylic acid. The acrylic copolymer (A) is a copolymer of an energy ray-curable adhesive composition of the copolymer (A). The acrylic copolymer (A) copolymerizes an alkyl group having 1 or 2 carbon atoms containing at least 5 to 50% by mass of an alkyl group ( A meth) acrylic acid ester is obtained without a carboxyl group-containing monomer or a monomer component containing less than 5% by mass of the carboxyl group-containing monomer.

Description

表面保護薄膜 Surface protection film

本發明係關於於基材的一面上層合黏著劑而成的表面保護薄膜,特別為貼合於各種光學構件或電子構件之表面上,使用於保護該表面的表面保護薄膜。 The present invention relates to a surface protection film formed by laminating an adhesive on one side of a substrate, and is particularly a surface protection film for bonding to the surface of various optical components or electronic components for protecting the surface.

過去對於照相機的鏡片單元、通信.感應模組、振動子等馬達單元、圖像模組等,例如單元化的光學構件或電子構件在進行加工、裝配、檢查、輸送等時,欲防止表面受到傷害,有時於露出面貼著表面保護薄膜。表面保護薄膜在無需要表面保護之時點,可自光學構件或電子構件剝離。 For the lens unit and communication of the camera. Motor units such as induction modules and vibrators, image modules, etc. For example, when unitized optical or electronic components are processed, assembled, inspected, or conveyed to prevent damage to the surface, they may be attached to the exposed surface. Surface protection film. The surface protection film can be peeled off from an optical member or an electronic member when no surface protection is required.

又,上述光學構件或電子構件可貼合在表面保護薄膜下,連接於基板等其他構件上,但在進行該連接時有時使用熱硬化性接著劑。此時,光學構件或電子構件欲進行接著劑硬化時,一般將表面保護薄膜在貼合下進行加熱,故對於表面保護薄膜,被要求即使加熱亦對黏著性能或剝離性能不會產生太大變化者。例如,欲符合如此要求特性,已知有於黏著劑層上使用含有作為主劑的丙烯酸 系共聚物之含氮單體的黏著劑(專利文獻1參照)。 The optical member or the electronic member may be bonded under a surface protection film and connected to another member such as a substrate. However, a thermosetting adhesive may be used for the connection. At this time, when the optical member or the electronic member is to be cured by the adhesive, the surface protective film is generally heated under bonding, so for the surface protective film, it is required that the adhesive property or peeling property does not change much even if heated. By. For example, in order to meet such required characteristics, it is known to use acrylic acid as a main agent on the adhesive layer. Adhesive of a nitrogen-containing monomer of a copolymer (refer to Patent Document 1).

[先前技術文獻] [Prior technical literature] [專利文獻] [Patent Literature]

[專利文獻1]特開2006-332419號公報 [Patent Document 1] JP 2006-332419

[發明之概要] [Summary of Invention]

於是表面保護薄膜因在步驟中會藉由衝撃等而造成不經意的剝落,故欲適當地保護黏合體時,要求高接著力且可接著光學構件或電子構件。特別在近年來,如上述光學構件或電子構件逐漸小型化,隨之因表面保護薄膜的尺寸亦變小,故表面保護薄膜會有不經意的剝落,對其要求日漸提高。 Therefore, the surface protection film may be inadvertently peeled off by punching or the like in the step. Therefore, in order to properly protect the bonded body, a high adhesive force is required and an optical member or an electronic member can be bonded. Especially in recent years, as the above-mentioned optical components or electronic components are gradually miniaturized, the size of the surface protection film is also reduced, so the surface protection film may be inadvertently peeled off, and its requirements are increasing.

又,表面保護薄膜的貼合及剝離,一般係以手工作業來進行,即使為小尺寸的薄膜,亦要求良好的作業性。具體為要求可使表面保護薄膜之剝離時的剝離性能良好。又,因薄膜為小尺寸,貼合時的位置容易產生偏差,使重新貼合修正的頻度變高,故所謂再加工性的貼合修正的容易度亦被要求。 In addition, the bonding and peeling of the surface protection film are generally performed manually, and even a small-sized film requires good workability. Specifically, it is required that the peeling performance at the time of peeling of the surface protective film be good. In addition, since the film has a small size, the position at the time of bonding is likely to vary, and the frequency of re-bonding correction is increased. Therefore, the ease of so-called reworkable bonding correction is also required.

且,光學構件或電子構件之高性能化正進行著,要求減少糊殘等黏著劑所引起的污染。例如,圖像模組等鏡片部分即使是微量糊殘留亦可會造成性能的顯著降低,故要更進一步提高剝離性能。 In addition, the performance of optical components and electronic components is being improved, and it is required to reduce contamination caused by adhesives such as paste residues. For example, even a small amount of paste residue in lens parts such as image modules can cause a significant decrease in performance, so it is necessary to further improve the peeling performance.

例如使用專利文獻1所揭示的黏著劑之表面保護薄膜,其並非具有優良的接著性、剝離性、及再加工性,在表面保護薄膜必須做進一步改良。 For example, the surface protection film using the adhesive disclosed in Patent Document 1 does not have excellent adhesion, peelability, and reworkability, and the surface protection film must be further improved.

本發明為有鑑於以上問題點所得者,本發明之課題為提供一種具有優良接著性、剝離性、及再加工性的光學構件或電子構件用表面保護薄膜。 The present invention has been made in view of the above problems, and an object of the present invention is to provide a surface protective film for an optical member or an electronic member having excellent adhesiveness, peelability, and reworkability.

本發明者們,經詳細檢討結果,發現於表面保護薄膜的黏著劑使用能量線硬化型之同時,特定該黏著成分之丙烯酸系共聚物的構成時,可解決上述課題,而完成以下本發明。 As a result of detailed review, the present inventors found that when the energy ray hardening type of the adhesive for the surface protection film is used and the composition of the acrylic copolymer of the adhesive component is specified, the above problems can be solved and the following invention has been completed.

(1)一種表面保護薄膜,其為貼合於光學構件或電子構件上而使用於保護該表面者,其特徵為具備基材、與設置於該基材的一面之黏著劑層,前述黏著劑層係由含有丙烯酸系共聚物(A)之能量線硬化型黏著劑組成物所成,前述丙烯酸系共聚物(A)為共聚合至少含有5~50質量%之烷基的碳數為1或2之烷基(甲基)丙烯酸酯的同時,未含含有羧基的單體或含有未達5質量%之該含有羧基的單體之單體成分所得者。 (1) A surface protection film, which is adhered to an optical member or an electronic member and is used to protect the surface, and is characterized by including a base material and an adhesive layer provided on one side of the base material, and the aforementioned adhesive The layer is made of an energy ray-curable adhesive composition containing an acrylic copolymer (A), and the acrylic copolymer (A) is copolymerized with at least 5 to 50% by mass of an alkyl group having a carbon number of 1 or The alkyl (meth) acrylate of 2 is obtained without a carboxyl group-containing monomer or a monomer component containing less than 5 mass% of the carboxyl group-containing monomer.

(2)如上述(1)之表面保護薄膜,其中前述能量線硬化型黏著劑組成物為進一步含有能量線聚合性化合物(B)。 (2) The surface protection film according to the above (1), wherein the energy ray-curable adhesive composition further contains an energy ray polymerizable compound (B).

(3)如上述(1)之表面保護薄膜,其中前述丙烯酸系共聚物(A)為含有於側鏈具有不飽和基之能量線硬化型丙烯酸系共聚物者。 (3) The surface protection film according to the above (1), wherein the acrylic copolymer (A) is an energy ray-curable acrylic copolymer having an unsaturated group in a side chain.

(4)如上述(1)之表面保護薄膜,其中前述丙烯酸系共聚物(A)為含有於側鏈具有不飽和基之能量線硬化型丙烯酸系共聚物之同時,前述能量線硬化型黏著劑組成物為進一步含有能量線聚合性化合物(B)。 (4) The surface protective film according to the above (1), wherein the acrylic copolymer (A) is an energy ray-curable acrylic copolymer having an unsaturated group in a side chain, and the energy ray-curable adhesive The composition further contains an energy ray polymerizable compound (B).

(5)如上述(2)或(4)之表面保護薄膜,其中前述能量線聚合性化合物(B)為胺基甲酸酯丙烯酸酯系寡聚物。 (5) The surface protective film according to the above (2) or (4), wherein the energy ray polymerizable compound (B) is a urethane acrylate-based oligomer.

(6)如上述(1)~(5)中任一項之表面保護薄膜,其中前述丙烯酸系共聚物(A)為進一步共聚合含有30~85質量%的烷基之碳數為3以上的烷基(甲基)丙烯酸酯之單體成分所得者。 (6) The surface protection film according to any one of (1) to (5) above, wherein the acrylic copolymer (A) is further copolymerized with a carbon number of 3 or more containing 30 to 85% by mass of an alkyl group. A monomer component of an alkyl (meth) acrylate.

(7)如上述(6)之表面保護薄膜,其中前述烷基的碳數為3以上之烷基(甲基)丙烯酸酯為烷基的碳數為3~8的烷基(甲基)丙烯酸酯。 (7) The surface protective film according to the above (6), wherein the alkyl (meth) acrylate having an alkyl group having a carbon number of 3 or more is an alkyl (meth) acrylic acid having an alkyl group having a carbon number of 3 to 8 ester.

(8)如上述(1)~(7)中任一項之表面保護薄膜,其中前述丙烯酸系共聚物(A)為進一步共聚合含有0.2~40質量份%的含有羥基之(甲基)丙烯酸酯的單體成分所得者。 (8) The surface protective film according to any one of (1) to (7) above, wherein the acrylic copolymer (A) is further copolymerized with a hydroxyl group-containing (meth) acrylic acid containing 0.2 to 40% by mass The monomer component of the ester.

(9)如上述(1)~(8)中任一項之表面保護薄膜,其中前述黏著劑層為能量線照射前之黏著力為1000~20000mN/25mm的同時,能量線照射後之黏著力為0.1 ~100mN/25mm者。 (9) The surface protection film according to any one of (1) to (8) above, wherein the adhesive layer is an adhesive force before the energy ray irradiation is 1000 to 20000 mN / 25mm, and an adhesive force after the energy ray irradiation 0.1 ~ 100mN / 25mm.

(10)如上述(1)~(9)中任一項之表面保護薄膜,其中前述黏著劑層為能量線照射前之初期黏著力為未達10000mN/25mm者。 (10) The surface protective film according to any one of (1) to (9) above, wherein the aforementioned adhesive layer is one whose initial adhesive force before energy beam irradiation is less than 10,000 mN / 25 mm.

(11)如上述(1)~(10)中任一項之表面保護薄膜,其中前述黏著劑層經著色後,使表面保護薄膜的光透過率成為未達50%者。 (11) The surface protective film according to any one of (1) to (10) above, wherein after the aforementioned adhesive layer is colored, the light transmittance of the surface protective film becomes less than 50%.

(12)如上述(1)~(11)中任一項之表面保護薄膜,其為貼合於圖像模組上,使用於保護該圖像模組之受光部者。 (12) The surface protection film according to any one of (1) to (11) above, which is adhered to an image module and is used to protect a light receiving portion of the image module.

(13)一種附有表面保護薄膜的構件,其特徵為具備選自光學構件或電子構件的任一構件、與貼合於該構件表面之如上述(1)~(12)中任一項之表面保護薄膜者。 (13) A member with a surface protection film, comprising any member selected from an optical member or an electronic member, and any one of (1) to (12) described above bonded to the surface of the member. Surface protection film.

(14)一種保護表面的方法,其特徵為將如上述(1)~(12)中任一項之表面保護薄膜貼合於光學構件或電子構件之表面上而保護該表面之方法。 (14) A method for protecting a surface, which is characterized in that a surface protection film according to any one of (1) to (12) above is bonded to a surface of an optical member or an electronic member to protect the surface.

本發明為提供一種具有優良接著性、剝離性、及再加工性之光學構件或電子構件用的表面保護薄膜。 The present invention is to provide a surface protection film for an optical member or an electronic member having excellent adhesion, peelability, and reworkability.

[實施發明的形態] [Mode for Carrying Out the Invention]

以下記載中,「重量平均分子量」為使用凝 膠滲透層析法(GPC)法所測定的聚苯乙烯換算之值,具體為依據實施例所記載的方法所測定之值。 In the following description, "weight average molecular weight" The polystyrene conversion value measured by the gel permeation chromatography (GPC) method is specifically a value measured according to the method described in the examples.

又,對於本說明書中之記載,例如所謂「(甲基)丙烯酸酯」表示「丙烯酸酯」及「甲基丙烯酸酯」之雙方意思,其他類似用語亦相同。 For the description in this specification, for example, "(meth) acrylate" means both "acrylate" and "methacrylate", and other similar terms are also the same.

以下對於本發明使用實施形態做詳細說明。 Hereinafter, the embodiments of the present invention will be described in detail.

〔表面保護薄膜〕 〔Surface protection film〕

本發明之表面保護薄膜為貼合於光學構件或電子構件,使用於保護該表面者,具備基材與設置於基材的一面之黏著劑層。以下對於黏著片之各構件做說明。 The surface protection film of the present invention is adhered to an optical member or an electronic member, and is used for protecting the surface, and includes a substrate and an adhesive layer provided on one side of the substrate. Each component of the adhesive sheet is described below.

<黏著劑層> <Adhesive layer>

本發明之黏著劑層係由含有丙烯酸系共聚物(A)之能量線硬化型黏著劑組成物所成者。能量線硬化型黏著劑組成物為藉由照射能量線經硬化使黏著力降低者。作為能量線,具體可舉出紫外線、電子線等,使用紫外線為佳。 The adhesive layer of the present invention is made of an energy ray-curable adhesive composition containing an acrylic copolymer (A). The energy ray-curable adhesive composition is one that is hardened by irradiating the energy ray to reduce the adhesion. Specific examples of the energy rays include ultraviolet rays and electron rays, and ultraviolet rays are preferably used.

丙烯酸系共聚物(A)一般為對黏著劑層賦予黏著性之化合物。丙烯酸系共聚物(A)係為共聚合含有烷基(甲基)丙烯酸酯作為主單體的單體成分(以下亦稱為「共聚物成分」)者。作為烷基(甲基)丙烯酸酯,可舉出烷基之碳數為1~18者,可舉出甲基(甲基)丙烯酸酯、乙基(甲基)丙烯酸酯、異丙基(甲基)丙烯酸酯、 n-丙基(甲基)丙烯酸酯、丁基(甲基)甲基丙烯酸酯、2-乙基己基(甲基)丙烯酸酯、n-辛基(甲基)丙烯酸酯、異辛基(甲基)丙烯酸酯、壬基(甲基)丙烯酸酯、癸基(甲基)丙烯酸酯、十一烷基(甲基)丙烯酸酯、十二烷基(甲基)丙烯酸酯等。 The acrylic copolymer (A) is generally a compound that imparts adhesiveness to an adhesive layer. The acrylic copolymer (A) is a copolymerized monomer component (hereinafter also referred to as a "copolymer component") containing an alkyl (meth) acrylate as a main monomer. Examples of the alkyl (meth) acrylate include those having 1 to 18 carbon atoms, and meth (meth) acrylate, ethyl (meth) acrylate, and isopropyl (methyl) Base) acrylate, n-propyl (meth) acrylate, butyl (meth) methacrylate, 2-ethylhexyl (meth) acrylate, n-octyl (meth) acrylate, isooctyl (methyl Acrylate), nonyl (meth) acrylate, decyl (meth) acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate, and the like.

丙烯酸系共聚物(A)作為共聚物成分,烷基(甲基)丙烯酸酯之含有量對於共聚物成分全量而言,一般為50質量%以上,較佳為50~95質量%,更佳為60~90質量%。 As the copolymer component of the acrylic copolymer (A), the content of the alkyl (meth) acrylate is generally 50% by mass or more, preferably 50 to 95% by mass, and more preferably the total content of the copolymer component. 60 to 90% by mass.

丙烯酸系共聚物(A)作為共聚物成分,烷基(甲基)丙烯酸酯之中烷基的碳數為1或2之烷基(甲基)丙烯酸酯的含有量對於共聚物成分全量而言為5~50質量%者。含有量未達5質量%時,黏著力特別經能量線照射後的黏著力會過高,而有使剝離性能降低的顧慮。又,若初期黏著力過高時,無法得到充分再加工性。含有量比50質量%高時,黏著力會不足,表面保護薄膜在後述各步驟中由電子構件及光學構件會有不經意的剝落產生,且有著無法充分保護電子構件及光學構件之顧慮。 The acrylic copolymer (A) is used as a copolymer component, and the content of the alkyl (meth) acrylate having 1 or 2 carbon atoms in the alkyl (meth) acrylate is included in the total amount of the copolymer component. 5 to 50% by mass. When the content is less than 5% by mass, the adhesive force is particularly high after irradiation with energy rays, and there is a concern that the peeling performance may be reduced. If the initial adhesion is too high, sufficient reworkability cannot be obtained. When the content is higher than 50% by mass, the adhesive force may be insufficient, and the surface protective film may be inadvertently peeled off from the electronic member and the optical member in each step described later, and there is a concern that the electronic member and the optical member cannot be fully protected.

由以上觀點來看,上述丙烯酸系共聚物(A),作為共聚物成分,烷基的碳數為1或2之烷基(甲基)丙烯酸酯的含有量對於共聚物成分全量而言以10~40質量%為佳,以15~35質量%為較佳。 From the above viewpoint, as the copolymer component, the content of the alkyl (meth) acrylate having 1 or 2 carbon atoms in the alkyl group as the copolymer component is 10 based on the total amount of the copolymer component. It is preferably 40% by mass, and more preferably 15 to 35% by mass.

且,作為烷基的碳數為1或2之烷基(甲基)丙烯酸酯,可舉出甲基(甲基)丙烯酸酯、乙基(甲基)丙烯酸 酯,這些中亦以甲基丙烯酸酯、甲基甲基丙烯酸酯為佳。 Examples of the alkyl (meth) acrylate having 1 or 2 carbon atoms in the alkyl group include meth (meth) acrylate and ethyl (meth) acrylate Among these, methacrylate and methmethacrylate are also preferable.

又,丙烯酸系共聚物(A),作為共聚物成分,烷基(甲基)丙烯酸酯之中,烷基的碳數為3以上之烷基(甲基)丙烯酸酯的含有量對於共聚物成分全量而言以30~85質量%為佳。烷基的碳數為3以上的烷基(甲基)丙烯酸酯之含有量若在如此範圍時,可容易適切地將黏著性能與剝離性能賦予表面保護薄膜。由如此觀點來看,烷基之碳數為3以上之烷基(甲基)丙烯酸酯的含有量以40~80質量%為佳,以45~75質量%為更佳。 The acrylic copolymer (A) has a content of an alkyl (meth) acrylate having an alkyl group of 3 or more in the alkyl (meth) acrylate as a copolymer component with respect to the copolymer component. The total amount is preferably 30 to 85% by mass. When the content of the alkyl (meth) acrylate having an alkyl group having 3 or more carbon atoms is within such a range, it is possible to easily and appropriately impart adhesive properties and peeling properties to a surface protective film. From such a viewpoint, the content of the alkyl (meth) acrylate having 3 or more carbon atoms is preferably 40 to 80% by mass, and more preferably 45 to 75% by mass.

上述烷基的碳數為3以上的烷基(甲基)丙烯酸酯係以烷基的碳數為3~8之烷基(甲基)丙烯酸酯者為佳,以烷基的碳數為4~8之烷基(甲基)丙烯酸酯為較佳,以烷基的碳數為4~8之烷基丙烯酸酯為更佳。具體以n-丁基丙烯酸酯、2-乙基己基丙烯酸酯、n-辛基丙烯酸酯、異辛基丙烯酸酯等為佳。 The alkyl (meth) acrylate having a carbon number of 3 or more is preferably an alkyl (meth) acrylate having a carbon number of 3 to 8 and the carbon number of the alkyl group is 4 Alkyl (meth) acrylates of 8 to 8 are more preferred, and alkyl acrylates of 4 to 8 carbons are more preferred. Specifically, n-butyl acrylate, 2-ethylhexyl acrylate, n-octyl acrylate, isooctyl acrylate and the like are preferable.

丙烯酸系共聚物(A),作為共聚物成分,可含有烷基(甲基)丙烯酸酯以外的聚合性單體為佳,具體以含有含官能基之單體者為佳。含官能基之單體為提供如後述將含有不飽和基之化合物含於丙烯酸系共聚物(A)時,或如後述欲與交聯劑進行反應時的必要官能基。含官能基之單體為在分子內具有聚合性之雙鍵與羥基、羧基、胺基、取代胺基、環氧基等官能基的單體。 The acrylic copolymer (A) preferably contains a polymerizable monomer other than an alkyl (meth) acrylate as a copolymer component, and particularly preferably contains a functional group-containing monomer. The functional group-containing monomer is a functional group necessary to provide an unsaturated group-containing compound in the acrylic copolymer (A) as described later, or to react with a crosslinking agent as described later. The functional group-containing monomer is a monomer having a polymerizable double bond and functional groups such as a hydroxyl group, a carboxyl group, an amine group, a substituted amine group, and an epoxy group in the molecule.

其中,本發明之丙烯酸系共聚物(A),作為共聚物成分,未含有含有羧基的單體,或即使含有含有羧 基的單體,該含有量對於共聚物成分全量為未達5質量%者。含有含有羧基的單體5質量%以上時,黏著劑層經能量線照射後的黏著力會過高,會有使表面保護薄膜的剝離性惡化的顧慮。又,若初期黏著力過高時會有再加工性降低之顧慮。 Among them, the acrylic copolymer (A) of the present invention does not contain a carboxyl group-containing monomer as a copolymer component, or even contains a carboxyl group-containing monomer. The content of the monomer is less than 5% by mass based on the total amount of the copolymer component. When the carboxyl group-containing monomer is contained in an amount of 5% by mass or more, the adhesive force of the adhesive layer after irradiation with energy rays is excessively high, and there is a concern that the peelability of the surface protective film is deteriorated. In addition, if the initial adhesion is too high, there is a concern that the reworkability will decrease.

由這些觀點得知,共聚物成分中之含有羧基的單體之含有量以未達3質量%者為佳,未達1質量%者較佳,且未含有作為共聚物成分的含有羧基的單體時為最佳。且,作為含有羧基的單體,可舉出丙烯酸、甲基丙烯酸、衣康酸等。 From these viewpoints, it is known that the content of the carboxyl group-containing monomer in the copolymer component is preferably less than 3% by mass, more preferably less than 1% by mass, and does not contain a carboxyl group-containing monomer as a copolymer component. Body time is optimal. Examples of the carboxyl group-containing monomer include acrylic acid, methacrylic acid, and itaconic acid.

作為上述含官能基之單體,較佳為使用含有羥基之化合物,較佳為使用含有羥基之(甲基)丙烯酸酯。而丙烯酸系共聚物(A)為,將含有羥基之(甲基)丙烯酸酯的含有量對於共聚物成分全量而言為0.2~40質量%之共聚物成分經共聚合所得者為佳。含有羥基之(甲基)丙烯酸酯的含有量為上述範圍內時,丙烯酸系共聚物(A)可藉由後述交聯劑適切地進行交聯。 As the functional group-containing monomer, a hydroxyl-containing compound is preferably used, and a (meth) acrylate containing a hydroxyl group is preferably used. The acrylic copolymer (A) is preferably one obtained by copolymerizing a copolymer component having a hydroxyl group-containing (meth) acrylate content of 0.2 to 40% by mass based on the total amount of the copolymer component. When the content of the hydroxyl group-containing (meth) acrylate is within the above range, the acrylic copolymer (A) can be appropriately crosslinked by a crosslinking agent described later.

又,含有羥基之(甲基)丙烯酸酯的上述含有量以1~30質量%為佳,以5~30質量%為更佳。含有羥基之(甲基)丙烯酸酯若為1~30質量%時,可確保適切黏著性能,且可將後述含有不飽和基之化合物適切地導入於側鏈,更可藉由交聯劑將丙烯酸系共聚物(A)適切地進行交聯。 The content of the hydroxyl group-containing (meth) acrylate is preferably 1 to 30% by mass, and more preferably 5 to 30% by mass. When the (meth) acrylic acid ester containing a hydroxyl group is 1 to 30% by mass, suitable adhesive properties can be ensured, and a compound containing an unsaturated group described later can be appropriately introduced into a side chain, and acrylic acid can be further added with a crosslinking agent. The copolymer (A) is appropriately crosslinked.

作為含有羥基之(甲基)丙烯酸酯的具體例子,可舉 出2-羥基甲基(甲基)丙烯酸酯、2-羥基乙基(甲基)丙烯酸酯、2-羥基丙基(甲基)丙烯酸酯、2-羥基丁基(甲基)丙烯酸酯等。 As a specific example of the (meth) acrylate containing a hydroxyl group, Examples include 2-hydroxymethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, and the like.

以上含官能基之單體可單獨1種,或組合2種以上使用。 The above functional group-containing monomers may be used alone or in combination of two or more.

丙烯酸系共聚物(A)如上述單體以外,亦可將烷基(甲基)丙烯酸酯及含官能基之單體以外的(甲基)丙烯酸酯、二烷基(甲基)丙烯醯胺、甲酸乙烯酯、乙酸乙烯酯、苯乙烯、乙烯基乙酸酯等作為共聚物成分而含有。作為(甲基)丙烯酸烷基酯及含官能基之單體以外的(甲基)丙烯酸酯,可使用(甲基)丙烯酸烷氧基烷基酯、(甲基)丙烯酸伸烷基氧基烷基酯、(甲基)丙烯酸壬基苯氧基聚乙二醇、丙烯酸四氫呋喃糠酯、聚醚與丙烯酸之酯的二丙烯酸酯類等。 The acrylic copolymer (A) may be an alkyl (meth) acrylate or a (meth) acrylic acid ester other than the functional group-containing monomer, or a dialkyl (meth) acrylamide in addition to the monomers described above. , Vinyl formate, vinyl acetate, styrene, vinyl acetate and the like are contained as copolymer components. As the (meth) acrylic acid ester other than the (meth) acrylic acid alkyl ester and the functional group-containing monomer, an alkoxyalkyl (meth) acrylate or an alkyloxyalkyl (meth) acrylate can be used. Esters, nonylphenoxy polyethylene glycol (meth) acrylate, tetrahydrofuran acrylate, diacrylates of polyether and acrylic esters, and the like.

又,作為二烷基(甲基)丙烯醯胺,可使用二甲基(甲基)丙烯醯胺、二乙基(甲基)丙烯醯胺等。二烷基(甲基)丙烯醯胺為能量線硬化型黏著劑組成物使用於後述X-Y型時者為佳。藉由將二烷基(甲基)丙烯醯胺作為構成單體,對於極性高的胺基甲酸酯系丙烯酸酯等能量線聚合性化合物(B)之能量線硬化型丙烯酸系共聚物的相溶性會提高。 Examples of the dialkyl (meth) acrylamide include dimethyl (meth) acrylamide, diethyl (meth) acrylamide, and the like. Dialkyl (meth) acrylamide is an energy ray hardening type adhesive composition, and it is preferable to use it in the X-Y type mentioned later. By using dialkyl (meth) acrylamide as a constituent monomer, the phase of an energy ray-curable acrylic copolymer of an energy ray polymerizable compound (B) such as a highly polar urethane acrylate is used. Solubility will increase.

丙烯酸系共聚物之重量平均分子量以100,000以上為佳,較佳為100,000~1,500,000,更佳為150,000~1,000,000。且,其中所謂的丙烯酸系聚合物之重量平均分 子量為,後述含有不飽和基之化合物經反應成為能量線硬化型丙烯酸系聚合物時,表示含有不飽和基之化合物在反應前之丙烯酸系共聚物。 The weight average molecular weight of the acrylic copolymer is preferably 100,000 or more, more preferably 100,000 to 1,500,000, and still more preferably 150,000 to 1,000,000. In addition, the average weight of the so-called acrylic polymer The sub-quantity is an acrylic copolymer before the reaction when a compound containing an unsaturated group described later becomes an energy ray-curable acrylic polymer through reaction.

能量線硬化型黏著劑組成物僅具有能量線硬化性即可,並無特別限定,以使用X型者為較佳態樣。所謂X型之能量線硬化型黏著劑組成物表示丙烯酸系共聚物(A)本身具有能量線硬化性者,具體為將丙烯酸系共聚物(A)的至少一部分,作為於側鏈具有不飽和基的能量線硬化型丙烯酸系共聚物者。 The energy ray-curable adhesive composition is only required to have energy ray-curable properties, and is not particularly limited, and an X-type is preferred. The so-called X-type energy ray hardening adhesive composition means that the acrylic copolymer (A) itself has energy ray curability, and specifically, at least a part of the acrylic copolymer (A) has an unsaturated group in a side chain. Energy ray hardening acrylic copolymer.

能量線硬化型丙烯酸系共聚物為於共聚合上述共聚物成分而成的丙烯酸系共聚物,與含有不飽和基之化合物進行反應所得者。 The energy ray-curable acrylic copolymer is an acrylic copolymer obtained by copolymerizing the above-mentioned copolymer components and reacted with a compound containing an unsaturated group.

含有不飽和基之化合物為,具有可與構成丙烯酸系共聚物之含官能基之單體的官能基進行反應的取代基。該取代基取決於官能基單體所具有的官能基種類而具有各式各樣種。例如,官能基若為羥基或羧基時,作為取代基以異氰酸酯基、環氧基等為佳,官能基若為羧基時,作為取代基以異氰酸酯基、環氧基等為佳,官能基若為胺基或取代胺基時,作為取代基以異氰酸酯基等為佳,官能基若為環氧基時,作為取代基以羧基為佳,彼等中亦以異氰酸酯基為佳。如此取代基為每1分子的含有不飽和基之化合物中各含有1個。 The unsaturated group-containing compound is a substituent having a function capable of reacting with a functional group of a functional group-containing monomer constituting the acrylic copolymer. This substituent has various kinds depending on the kind of the functional group which the functional monomer has. For example, when the functional group is a hydroxyl group or a carboxyl group, an isocyanate group or an epoxy group is preferred as the substituent. When the functional group is a carboxyl group, an isocyanate group or an epoxy group is preferred as the substituent. If the functional group is In the case of an amine group or a substituted amine group, an isocyanate group or the like is preferred as the substituent. When the functional group is an epoxy group, a carboxyl group is more preferred as the substituent, and an isocyanate group is more preferred among them. In this way, one substituent is contained in one molecule of the unsaturated group-containing compound.

於含有不飽和基之化合物中,能量線聚合性碳-碳雙鍵為每1分子中含有1~5個為佳,較佳為含有1 ~2個。能量線聚合性碳-碳雙鍵係以(甲基)丙烯醯基者為佳。作為如此含有不飽和基之化合物的具體例子,可舉出(甲基)丙烯醯氧基乙基異氰酸酯、甲基-異丙烯基-α,α-二甲基苯甲基異氰酸酯、(甲基)丙烯醯基異氰酸酯、烯丙基異氰酸酯、縮水甘油基(甲基)丙烯酸酯、(甲基)丙烯酸等。又,可舉出藉由二異氰酸酯化合物或聚異氰酸酯化合物與羥基乙基(甲基)丙烯酸酯之反應而得之丙烯醯基單異氰酸酯化合物;藉由二異氰酸酯化合物或聚異氰酸酯化合物、多元醇化合物與羥基乙基(甲基)丙烯酸酯之反應所得之丙烯醯基單異氰酸酯化合物等。 In the compound containing an unsaturated group, the energy ray polymerizable carbon-carbon double bond preferably contains 1 to 5 molecules per molecule, and more preferably contains 1 ~ 2. The energy ray polymerizable carbon-carbon double bond is preferably a (meth) acrylfluorenyl group. Specific examples of such an unsaturated group-containing compound include (meth) acryloxyethyl isocyanate, methyl-isopropenyl-α, α-dimethylbenzyl isocyanate, and (methyl) Acrylic fluorenyl isocyanate, allyl isocyanate, glycidyl (meth) acrylate, (meth) acrylic acid, and the like. In addition, there may be mentioned an acrylfluorenyl monoisocyanate compound obtained by reacting a diisocyanate compound or a polyisocyanate compound with a hydroxyethyl (meth) acrylate; a diisocyanate compound or a polyisocyanate compound, a polyol compound, and Acrylic fluorenyl monoisocyanate compounds and the like obtained by the reaction of hydroxyethyl (meth) acrylate.

又作為含有不飽和基之化合物,亦可使用如下述式(1)之含有聚合性基之聚伸烷基氧基化合物。 As the unsaturated group-containing compound, a polymerizable group-containing polyalkyleneoxy compound such as the following formula (1) can also be used.

Figure TWI677545B_D0001
Figure TWI677545B_D0001

式中,R1為氫或甲基,較佳為甲基,R2~R5各獨立為氫或碳數1~4的烷基,較佳為氫,又n為2以上的整數,較佳為2~4。複數存在的R2~R5彼此可相同或相異。即,因n為2以上,於上述(1)式所示含有聚合性基之聚伸烷基氧基中,含有2個以上的R2。此時,存在2個以上之R2彼此可相同或相異。對於R3~R5亦相同。NCO表示異氰酸酯基。 In the formula, R 1 is hydrogen or methyl, preferably methyl, and R 2 to R 5 are each independently hydrogen or an alkyl group having 1 to 4 carbons, preferably hydrogen, and n is an integer of 2 or more. It is preferably 2 to 4. The plural R 2 to R 5 may be the same or different from each other. That is, since n is 2 or more, the polyalkyleneoxy group containing a polymerizable group represented by the above formula (1) contains two or more R 2 . In this case, two or more R 2 may be the same or different. The same applies to R 3 to R 5 . NCO represents an isocyanate group.

含有不飽和基之化合物對於具有丙烯酸系共 聚物之官能基100當量而言,通常為10~100當量程度,若比官能基的當量少時,因藉由交聯劑的交聯可適切地進行,較佳為使用15~95當量,更佳為使用20~90當量程度之比例。 Compounds containing unsaturated groups In terms of 100 equivalents of the functional group of the polymer, it is usually about 10 to 100 equivalents. If it is less than the equivalents of the functional group, the crosslinking by the cross-linking agent can be appropriately performed, and it is preferable to use 15 to 95 equivalent , It is more preferable to use a ratio of about 20 to 90 equivalents.

作為含有不飽和基之化合物,使用具有(甲基)丙烯醯基與異氰酸酯基之化合物為佳,具體以(甲基)丙烯醯氧基乙基異氰酸酯為佳。 As the unsaturated group-containing compound, a compound having a (meth) acrylfluorenyl group and an isocyanate group is preferably used, and a (meth) acrylfluorenyl ethyl isocyanate is particularly preferable.

能量線硬化型黏著劑組成物,作為其他較佳態樣,可使用Y型的能量線硬化型黏著劑組成物。Y型的能量線硬化型黏著劑組成物與丙烯酸系共聚物(A)不同,其為藉由添加能量線聚合性化合物(B),賦予能量線硬化性者。 The energy ray-curable adhesive composition may be a Y-type energy ray-curable adhesive composition. The Y-type energy ray-curable adhesive composition is different from the acrylic copolymer (A) in that it imparts energy ray curability by adding an energy ray polymerizable compound (B).

作為能量線聚合性化合物(B),可使用環氧丙烯酸酯系、胺基甲酸酯丙烯酸酯系、聚酯丙烯酸酯系、聚醚丙烯酸酯系等之能量線聚合性的寡聚物或能量線聚合性單體。 As the energy ray polymerizable compound (B), an energy ray polymerizable oligomer or energy such as epoxy acrylate type, urethane acrylate type, polyester acrylate type, polyether acrylate type can be used. Linear polymerizable monomer.

作為能量線聚合性單體,使用於分子內具有至少2個以上光聚合性碳-碳雙鍵之2官能基以上的低分子量化合物,具體可使用三羥甲基丙烷三(甲基)丙烯酸酯、四羥甲基甲烷四(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、二季戊四醇單羥基五(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯或者1,4-丁二醇二(甲基)丙烯酸酯、1,6-已二醇二(甲基)丙烯酸酯等。 As the energy ray polymerizable monomer, a low-molecular-weight compound having at least two or more photopolymerizable carbon-carbon double bonds in a molecule, and a low molecular weight compound is used, and specifically, trimethylolpropane tri (meth) acrylate can be used , Tetramethylolmethane tetra (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol monohydroxypenta (meth) acrylate, dipentaerythritol hexa (methyl) ) Acrylate or 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, and the like.

這些中,特別以使用胺基甲酸酯丙烯酸酯系寡聚物為佳。胺基甲酸酯丙烯酸酯系寡聚物為含有異氰酸酯單位與多元醇單位,於末端具有(甲基)丙烯醯基之化合物。作為胺基甲酸酯丙烯酸酯系寡聚物,可舉出藉由於聚醚型多元醇、聚酯型多元醇等之末端具有羥基之多元醇、與聚異氰酸酯之反應生成末端異氰酸酯胺基甲酸酯寡聚物,反應於該末端的官能基具有(甲基)丙烯醯基之化合物而得之化合物等。如此胺基甲酸酯丙烯酸酯系寡聚物藉由(甲基)丙烯醯基之作用具有能量線硬化性。 Among these, it is particularly preferable to use a urethane acrylate-based oligomer. The urethane acrylate-based oligomer is a compound containing an isocyanate unit and a polyol unit and having a (meth) acrylfluorene group at a terminal. Examples of the urethane acrylate-based oligomer include a polyol having a hydroxyl group at a terminal thereof such as a polyether polyol, a polyester polyol, and the like, and reacting with a polyisocyanate to generate a terminal isocyanate urethane Ester oligomers, compounds obtained by reacting compounds having a (meth) acrylfluorenyl functional group at the terminal. In this way, the urethane acrylate-based oligomer has energy ray-hardenability by the action of a (meth) acrylfluorenyl group.

作為在胺基甲酸酯丙烯酸酯系寡聚物中所使用的聚異氰酸酯,例如可舉出2,4-二異氰酸甲苯、2,6-二異氰酸甲苯、1,3-二異氰酸二甲苯、1,4-二異氰酸二甲苯、二苯基甲烷4,4-二異氰酸酯、異佛爾酮二異氰酸酯、1,3-雙-(異氰酸根甲基)-環己烷、4,4’-二環己基甲烷二異氰酸酯等。作為具有(甲基)丙烯醯基之化合物,例如可舉出2-羥基乙基(甲基)丙烯酸酯、2-羥基丙基(甲基)丙烯酸酯、聚乙二醇(甲基)丙烯酸酯等具有羥基之(甲基)丙烯酸酯。又作為具有羥基之(甲基)丙烯酸酯,亦可舉出季戊四醇等多元醇與(甲基)丙烯酸之部分酯。 Examples of the polyisocyanate used in the urethane acrylate-based oligomer include toluene 2,4-diisocyanate, toluene 2,6-diisocyanate, and 1,3-diisocyanate. Xylene cyanate, 1,4-diisocyanate xylene, diphenylmethane 4,4-diisocyanate, isophorone diisocyanate, 1,3-bis- (isocyanatomethyl) -cyclohexyl Alkanes, 4,4'-dicyclohexylmethane diisocyanate and the like. Examples of the compound having a (meth) acrylfluorenyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and polyethylene glycol (meth) acrylate (Meth) acrylates having a hydroxyl group. Examples of the (meth) acrylic acid ester having a hydroxyl group include a partial ester of a polyhydric alcohol such as pentaerythritol and (meth) acrylic acid.

胺基甲酸酯丙烯酸酯系寡聚物以於1分子中具有2個以上(甲基)丙烯醯基的2官能基以上者為佳,但未與X型併用時,以3官能基以上者為佳,以4官能基以上者為較佳。使用3官能基以上者時,可容易降低能量 線照射後之黏著力,使表面保護薄膜之剝離性能變的容易良好。又,胺基甲酸酯丙烯酸酯系寡聚物一般為使用12官能基以下者。 The urethane acrylate oligomer is preferably one having two or more (meth) acrylfluorene groups in one molecule and having two or more functional groups, but when not used in combination with the X type, one having three or more functional groups More preferably, it is a tetrafunctional group or more. When using more than three functional groups, energy can be easily reduced The adhesive force after the irradiation of the radiation makes the peeling performance of the surface protection film easy and good. The urethane acrylate-based oligomer is generally one having 12 or less functional groups.

又,胺基甲酸酯丙烯酸酯系寡聚物以重量平均分子量為1000~15000者為佳,以1500~8500為較佳。 In addition, the urethane acrylate-based oligomer is preferably one having a weight average molecular weight of 1,000 to 15,000, and more preferably 1500 to 8500.

能量線聚合性化合物(B)對於丙烯酸系共聚物(A)100質量份而言,通常添加5~200質量份,但不與X型併用時,以40~200質量份為佳,以70~150質量份為較佳。能量線聚合性化合物(B)的含有量若在上述範圍時,不僅可適切地保持能量線照射前之黏著劑層的黏著力,亦可適切地降低藉由能量線之硬化的黏著力。 The energy ray polymerizable compound (B) is usually added in an amount of 5 to 200 parts by mass to 100 parts by mass of the acrylic copolymer (A), but when not used in combination with the X type, it is preferably 40 to 200 parts by mass, and 70 to 70 parts by mass. 150 parts by mass is preferred. When the content of the energy ray polymerizable compound (B) is within the above range, not only the adhesive force of the adhesive layer before energy ray irradiation can be appropriately maintained, but also the adhesive force hardened by energy ray can be appropriately reduced.

作為能量線硬化型黏著劑組成物,併用X型與Y型之即含有於丙烯酸系聚合物(A)加入能量線聚合性化合物(B)之同時,丙烯酸系共聚物(A)的至少一部分為於側鏈具有不飽和基之能量線硬化型丙烯酸系共聚物者(以下亦稱為X-Y型)亦可作為較佳態樣而使用。藉由使用X-Y型,可使黏著劑層的斷裂強度及斷裂伸度變的良好,對於剝離表面保護薄膜時的黏合體之糊殘留減少可變的容易。 As the energy ray-curable adhesive composition, X-type and Y-type, that is, contained in the acrylic polymer (A) and added to the energy ray polymerizable compound (B), at least a part of the acrylic copolymer (A) is An energy ray-curable acrylic copolymer having an unsaturated group in a side chain (hereinafter also referred to as an XY type) can also be used as a preferred embodiment. By using the X-Y type, it is possible to improve the breaking strength and elongation at break of the adhesive layer, and it is easy to make it easier to reduce the paste residue of the adherend when peeling the surface protection film.

使用於X-Y型時的能量線硬化型丙烯酸系共聚物可使用與上述X型所使用的相同者。 When the X-Y type is used, the same energy ray-curable acrylic copolymer can be used as the X-type type.

又,能量線聚合性化合物(B)亦使用與上述Y型所使用的相同者,以胺基甲酸酯丙烯酸酯系寡聚物為佳,作為此時的聚異氰酸酯,可使用異佛爾酮二異氰酸 酯、1,3-雙-(異氰酸根甲基)-環己烷、4,4’-二環己基甲烷二異氰酸酯等為較佳。又作為形成胺基甲酸酯丙烯酸酯中之多元醇單位的多元醇,以使用聚丙二醇(PPG)、聚乙二醇(PEG)、聚四伸甲基甘醇、聚碳酸酯二醇等為佳,這些多元醇之數平均分子量以300~2000為佳,以500~1000為特佳。 The energy ray polymerizable compound (B) is the same as that used for the Y-form, and preferably a urethane acrylate oligomer. As the polyisocyanate at this time, isophorone can be used. Diisocyanate Esters, 1,3-bis- (isocyanatomethyl) -cyclohexane, 4,4'-dicyclohexylmethane diisocyanate and the like are preferred. In addition, as a polyol forming a polyol unit in the urethane acrylate, polypropylene glycol (PPG), polyethylene glycol (PEG), polytetramethylene glycol, polycarbonate diol, etc. are used as The number average molecular weight of these polyols is preferably from 300 to 2000, and particularly preferably from 500 to 1,000.

又,多元醇因可使黏著劑層的斷裂應力及斷裂伸度更為良好,故以含有2種類以上多元醇為更佳,作為該多元醇,以含有PPG與PEG為特佳,僅由PPG與PEG所成為最佳。PPG與PEG之莫耳比以9:1~1:9為佳,以9:1~1:4為較佳,以4:1~3:2為更佳,以7.5:2.5~6.5:3.5為最佳。 In addition, since the polyhydric alcohol can make the fracture stress and elongation of the adhesive layer better, it is more preferable to contain two or more kinds of polyhydric alcohol. As the polyhydric alcohol, it is particularly preferable to contain PPG and PEG. Become the best with PEG. The molar ratio of PPG to PEG is preferably 9: 1 to 1: 9, more preferably 9: 1 to 1: 4, more preferably 4: 1 to 3: 2, and 7.5: 2.5 to 6.5: 3.5. For the best.

且,作為X-Y型中之胺基甲酸酯丙烯酸酯系寡聚物,以於1分子中具有2個(甲基)丙烯醯基之2官能基者為佳。藉由使用2官能基者,不僅剝離性能或黏著性良好,且容易成為使斷裂強度及斷裂伸度提高者。 The urethane acrylate oligomer in the X-Y type is preferably one having two (meth) acrylfluorenyl bifunctional groups in one molecule. By using a bifunctional group, not only the peelability and the adhesiveness are good, but also it is easy to improve the breaking strength and elongation at break.

又,X-Y型中之能量線聚合性化合物(B)對於丙烯酸系共聚物(A)100質量份而言以1~50質量份為佳,以5~30質量份為較佳。 The energy ray polymerizable compound (B) in the X-Y type is preferably 1 to 50 parts by mass, and more preferably 5 to 30 parts by mass for 100 parts by mass of the acrylic copolymer (A).

黏著劑層可具有使丙烯酸系共聚物(A)交聯的交聯結構。作為欲進行交聯而含於能量線硬化型黏著劑組成物之交聯劑(C),可舉出有機多價異氰酸酯化合物、有機多價環氧化合物、有機多價亞胺化合物等,彼等中亦以有機多價異氰酸酯化合物(異氰酸酯系交聯劑)為 佳。 The adhesive layer may have a crosslinked structure which crosslinks the acrylic copolymer (A). Examples of the crosslinking agent (C) contained in the energy ray-curable adhesive composition to be crosslinked include organic polyvalent isocyanate compounds, organic polyvalent epoxy compounds, and organic polyvalent imine compounds, and the like. Organic polyvalent isocyanate compounds (isocyanate-based crosslinking agents) are also used as good.

作為有機多價異氰酸酯化合物,可舉出芳香族多價異氰酸酯化合物、脂肪族多價異氰酸酯化合物、脂環族多價異氰酸酯化合物及這些有機多價異氰酸酯化合物之三聚體、以及將這些有機多價異氰酸酯化合物與多元醇化合物進行反應所得之末端異氰酸酯胺基甲酸酯預聚物等。 Examples of the organic polyvalent isocyanate compound include an aromatic polyvalent isocyanate compound, an aliphatic polyvalent isocyanate compound, an alicyclic polyvalent isocyanate compound, a trimer of these organic polyvalent isocyanate compounds, and the organic polyvalent isocyanate. A terminal isocyanate urethane prepolymer and the like obtained by reacting a compound with a polyol compound.

作為有機多價異氰酸酯化合物的進一步具體例,可舉出2,4-二異氰酸甲苯、2,6-二異氰酸甲苯、1,3-二異氰酸二甲苯、1,4-二甲苯二異氰酸酯、二苯基甲烷-4,4’-二異氰酸酯、二苯基甲烷-2,4’-二異氰酸酯、3-甲基二苯基甲烷二異氰酸酯、六伸甲基二異氰酸酯、異佛爾酮二異氰酸酯、二環己基甲烷-4,4’-二異氰酸酯、二環己基甲烷-2,4’-二異氰酸酯、二異氰酸甲苯與三羥甲基丙烷之加成物等。 Further specific examples of the organic polyvalent isocyanate compound include toluene 2,4-diisocyanate, toluene 2,6-diisocyanate, 1,3-diisocyanate, and 1,4-diisocyanate. Toluene diisocyanate, diphenylmethane-4,4'-diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylidene diisocyanate, isophor Ketone diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, the addition of toluene diisocyanate and trimethylolpropane.

作為有機多價環氧化合物之具體例,可舉出1,3-雙(N,N’-二縮水甘油基胺基甲基)環己烷、N,N,N’,N’-四縮水甘油基-m-苯二甲基二胺、乙二醇二縮水甘油基醚、1,6-已二醇二縮水甘油基醚、三羥甲基丙烷二縮水甘油基醚、二縮水甘油基苯胺、二縮水甘油基胺等。 Specific examples of the organic polyvalent epoxy compound include 1,3-bis (N, N'-diglycidylaminomethyl) cyclohexane, N, N, N ', N'-tetrashrink Glyceryl-m-xylylene diamine, ethylene glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, trimethylolpropane diglycidyl ether, diglycidyl aniline , Diglycidylamine, etc.

作為有機多價亞胺化合物之具體例,可舉出N,N’-二苯基甲烷-4,4’-雙(1-氮雜環丙烷羧基醯胺)、三羥甲基丙烷-三-β-氮丙啶丙酸酯、四羥甲基甲烷-三-β-氮丙啶丙酸酯及N,N’-甲苯-2,4-雙(1-氮雜環丙烷羧基醯 胺)三伸乙基三聚氰胺等。 Specific examples of the organic polyvalent imine compound include N, N'-diphenylmethane-4,4'-bis (1-azacyclopropanecarboxyamidoamine), and trimethylolpropane-tri- β-aziridine propionate, tetramethylolmethane-tri-β-aziridine propionate, and N, N'-toluene-2,4-bis (1-azetidinyl carboxyfluorene Amine) triethylene melamine and the like.

交聯劑(C)的含有量對於丙烯酸系共聚物(A)100質量份而言,以0.01~20質量份為佳,較佳為0.1~15質量份,特佳為0.5~8質量份之比率下使用。將交聯劑(C)的含有量在上述上限以下時,會防止黏著劑層的過度交聯,可容易得到適當的黏著力。又,將交聯劑的使用量在上述下限值以上時,可防止在電子構件或光學構件之黏著劑的殘留。 The content of the cross-linking agent (C) is preferably 0.01 to 20 parts by mass, more preferably 0.1 to 15 parts by mass, and particularly preferably 0.5 to 8 parts by mass for 100 parts by mass of the acrylic copolymer (A). Used at the ratio. When the content of the cross-linking agent (C) is below the above-mentioned upper limit, excessive cross-linking of the adhesive layer can be prevented, and an appropriate adhesive force can be easily obtained. Moreover, when the usage-amount of a crosslinking agent is more than the said lower limit, it can prevent the adhesive agent from remaining on an electronic member or an optical member.

能量線硬化型黏著劑組成物以含有光聚合起始劑(D)者為佳。 The energy ray-curable adhesive composition is preferably one containing a photopolymerization initiator (D).

作為光聚合起始劑,可舉出安息香化合物、苯乙酮化合物、醯基氧化膦化合物、茂鈦化合物、噻噸酮化合物、過氧化物化合物等光起始劑、胺或醌等光增感劑等,具體可例示出1-羥基環己基苯基酮、安息香、安息香甲基醚、安息香乙基醚、安息香異丙基醚、苯甲基二苯基硫化物、四甲基秋蘭姆單硫化物、偶氮二異丁腈、二苯甲基、二乙醯、β-氯蒽醌、2,4,6-三甲基苯甲醯基二苯基氧化膦等。藉由添加光聚合起始劑(D),可減少使用於硬化的能量線之照射時間及照射量。 Examples of the photopolymerization initiator include a photoinitiator such as a benzoin compound, an acetophenone compound, a fluorenylphosphine oxide compound, a titanocene compound, a thioxanthone compound, or a peroxide compound, and a photosensitizer such as an amine or a quinone. Specific examples include 1-hydroxycyclohexylphenyl ketone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyl diphenyl sulfide, and tetramethylthiuram monomer. Sulfides, azobisisobutyronitrile, diphenylmethyl, diethylhydrazone, β-chloroanthraquinone, 2,4,6-trimethylbenzylidene diphenylphosphine oxide, and the like. By adding a photopolymerization initiator (D), the irradiation time and amount of energy rays used for curing can be reduced.

光聚合起始劑(D)的含有量並無特別限定,對於丙烯酸系共聚物(A)100質量份而言以0.1~10質量份為佳,較佳為1~5質量份。 The content of the photopolymerization initiator (D) is not particularly limited, but it is preferably 0.1 to 10 parts by mass, and more preferably 1 to 5 parts by mass, for 100 parts by mass of the acrylic copolymer (A).

又,欲使表面保護薄膜的光透過率未達50%,可使黏著劑層著色。藉由黏著劑層經著色,可提高 表面保護薄膜之辨識性,故例如藉由人工可使表面保護薄膜自後述剝離片變的容易剝離。且所謂表面保護薄膜的光透過率為,在波長600nm中藉由島津製作所製股份有限公司分光光度計UV-3600進行測定所得者。上述光透過率以10~40%程度為佳。 In addition, if the light transmittance of the surface protection film is less than 50%, the adhesive layer can be colored. By coloring the adhesive layer, it can improve Since the surface protection film is distinguishable, for example, the surface protection film can be easily peeled off from a peeling sheet described later by humans. The light transmittance of the so-called surface protection film was measured at a wavelength of 600 nm using a UV-3600 spectrophotometer manufactured by Shimadzu Corporation. The light transmittance is preferably about 10 to 40%.

欲使黏著劑層著色,於能量線硬化型黏著劑組成物中通常可含有染料、顏料,其中亦以含有藍色染料、藍色顏料者為佳。 To color the adhesive layer, the energy ray-curable adhesive composition may generally contain dyes and pigments, and among them, blue dyes and blue pigments are also preferred.

又,能量線硬化型黏著劑組成物中亦可適宜地含有除防劣化劑、防靜電劑、難燃劑、聚矽氧化合物、連鎖移動劑等上述成分以外的成分。 The energy ray-curable adhesive composition may suitably contain components other than the above-mentioned components such as an anti-deterioration agent, an antistatic agent, a flame retardant, a polysiloxane, and a chain transfer agent.

黏著劑層的能量線照射前之黏著力以1000~20000mN/25mm者為佳,以4000~16000mN/25m為較佳。能量線照射前之黏著力在1000mN/25m以上時,對於表面保護薄膜之光學構件或電子構件的接著力會變高,該保護性能會變的良好。又,若在20000mN/25mm以下時,可容易使能量線照射後之黏著力成為所望大小。能量線照射前之黏著力可藉由烷基(甲基)丙烯酸酯之種類及配合比、交聯劑之使用量等而做調整。 The adhesive force before the energy ray irradiation of the adhesive layer is preferably 1000 to 20,000 mN / 25 mm, and more preferably 4000 to 16000 mN / 25 m. When the adhesive force before the energy ray irradiation is more than 1000mN / 25m, the adhesion force to the optical member or electronic member of the surface protection film will be high, and the protection performance will be good. Moreover, when it is 20000mN / 25mm or less, the adhesive force after irradiation with an energy ray can be easily made into a desired magnitude. The adhesive force before energy ray irradiation can be adjusted by the type and mixing ratio of the alkyl (meth) acrylate, the amount of cross-linking agent used, and the like.

又,黏著劑層的能量線照射後之黏著力以0.1~100mN/25mm者為佳,以20~90mN/25mm為較佳。若能量線照射後之黏著力在此範圍時,能量線照射後可使表面保護薄膜容易地由光學構件或電子構件剝離。 In addition, the adhesive force after the energy ray irradiation of the adhesive layer is preferably 0.1 to 100 mN / 25 mm, and more preferably 20 to 90 mN / 25 mm. If the adhesive force after the energy ray irradiation is in this range, the surface protection film can be easily peeled off by the optical member or the electronic member after the energy ray irradiation.

能量線照射後之黏著力可藉由能量線聚合性化合物 (B)之種類或量、導入於丙烯酸系共聚物之不飽和基的量而做控制。 Energy ray polymerizable compound The type or amount of (B) and the amount of unsaturated groups introduced into the acrylic copolymer are controlled.

又,黏著劑層的能量線照射前之初期黏著力以未達10000mN/25mm者為佳。將初期黏著力設定在此比較低值時,表面保護薄膜的貼合容易修正,可提高再加工性。初期黏著力的下限值並無特別限定,通常為500mN/25mm以上。初期黏著力以3000~9500mN/25mm為較佳。 The initial adhesive force before the energy ray irradiation of the adhesive layer is preferably less than 10,000 mN / 25 mm. When the initial adhesive force is set to this relatively low value, the adhesion of the surface protective film is easily corrected, and reworkability can be improved. The lower limit of the initial adhesive force is not particularly limited, but is usually 500 mN / 25 mm or more. The initial adhesion is preferably 3000 ~ 9500mN / 25mm.

且,初期黏著力可藉由烷基(甲基)丙烯酸酯之種類及配合比、含官能基之單體之種類及配合比、交聯劑之使用量等做調整。 In addition, the initial adhesive force can be adjusted by the type and mixing ratio of the alkyl (meth) acrylate, the type and mixing ratio of the functional group-containing monomer, the amount of the crosslinking agent used, and the like.

又,上述黏著力及初期黏著力之測定方法為依據實施例所記載的方法所測定之值。 The method for measuring the adhesive force and the initial adhesive force is a value measured according to the method described in the examples.

黏著劑層的厚度並無特別限定,以3~50μm為佳,較佳為5~30μm。黏著劑層的厚度若在上述範圍內時,容易提高對於黏合體之密著性。 The thickness of the adhesive layer is not particularly limited, but is preferably 3 to 50 μm, and more preferably 5 to 30 μm. When the thickness of an adhesive layer exists in the said range, it will become easy to improve the adhesiveness with respect to an adhesive body.

<基材> <Substrate>

基材之材質並無特別限定,可使用聚乙烯薄膜、聚丙烯薄膜、聚丁烯薄膜、聚丁二烯薄膜、聚甲基戊烯薄膜、聚氯乙烯薄膜、氯化乙烯基共聚物薄膜、聚乙烯對苯二甲酸乙二醇酯薄膜、聚丁烯對苯二甲酸乙二醇酯薄膜、聚胺基甲酸酯薄膜、伸乙基乙酸乙烯基薄膜、離聚物樹脂薄膜、乙烯.(甲基)丙烯酸共聚物薄膜、聚苯乙烯薄膜、 聚碳酸酯薄膜、氟樹脂薄膜等薄膜。又,亦可為這些之交聯薄膜、層合薄膜。 The material of the substrate is not particularly limited. Polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, chlorinated vinyl copolymer film, Polyethylene terephthalate film, polybutylene terephthalate film, polyurethane film, vinyl acetate film, ionomer resin film, ethylene. (Meth) acrylic copolymer film, polystyrene film, Films such as polycarbonate films and fluororesin films. Moreover, these may be a crosslinked film and a laminated film.

且,基材為對於所使用的能量線之波長必須具有透過性。即,作為能量線使用紫外線時,基材為使用光透過性薄膜。又,作為能量線使用電子線時,基材無需為光透過性,可使用施予著色的薄膜。又,基材厚度可配合表面保護薄膜所要求的性能等做調整,較佳為10~300μm,特佳為30~150μm。 In addition, the substrate must be transmissive to the wavelength of the energy ray used. That is, when ultraviolet rays are used as the energy ray, a light-transmitting film is used as the base material. When an electron beam is used as the energy ray, the substrate does not need to be light-transmissive, and a film to be colored can be used. In addition, the thickness of the substrate can be adjusted according to the required properties of the surface protection film, etc., preferably 10 to 300 μm, and particularly preferably 30 to 150 μm.

表面保護薄膜之薄膜面積以100mm2以下者為佳,較佳為10~80mm2程度。表面保護薄膜可配合光學構件及電子構件而使尺寸變小,但如上述欲使剝離性能良好,即使尺寸變小,亦可藉由手工作業而容易剝離。又,表面保護薄膜的形狀雖無限定,例如可加工為圓形、環狀形、正方形、矩形等。 The film area of the surface protection film is preferably 100 mm 2 or less, and more preferably about 10 to 80 mm 2 . The surface protection film can be reduced in size in accordance with the optical member and the electronic member. However, if the peeling performance is desired as described above, even if the size is reduced, it can be easily peeled by manual operation. The shape of the surface protection film is not limited, and it can be processed into, for example, a circle, a ring, a square, a rectangle, or the like.

表面保護薄膜之黏著劑層側上貼合剝離片,可藉由剝離片保護。作為剝離片,可使用於聚乙烯對苯二甲酸乙二醇酯、聚乙烯萘二甲酸酯、聚丙烯、聚乙烯等薄膜的單面上以聚矽氧樹脂等剝離劑施予剝離處理者等,但並未限定於此等。且表面保護薄膜可在比表面保護薄膜更充分大尺寸之1片剝離片上設置複數個。 A release sheet is attached to the adhesive layer side of the surface protection film, and can be protected by the release sheet. As a release sheet, one side of a film such as polyethylene terephthalate, polyethylene naphthalate, polypropylene, and polyethylene can be subjected to a release treatment with a release agent such as silicone resin. Etc., but it is not limited to these. In addition, a plurality of surface protection films may be provided on one release sheet having a sufficiently larger size than the surface protection film.

形成黏著劑層之方法,並無特別限定,將視必要以適當溶劑經稀釋的能量線硬化型黏著劑組成物,塗布於剝離片上至所定乾燥膜厚,其後經乾燥,形成黏著劑層後,於黏著劑層貼合基材而形成。又,將視必要以適當 溶劑經稀釋的能量線硬化型黏著劑組成物直接塗布於基材上,其後乾燥,形成黏著劑層。 The method for forming the adhesive layer is not particularly limited. The energy-ray-curable adhesive composition diluted with an appropriate solvent as necessary is applied to a release sheet to a predetermined dry film thickness, and then dried to form an adhesive layer. , Formed by bonding a substrate to an adhesive layer. Also, as necessary, The diluted energy ray-curable adhesive composition is directly coated on the substrate by the solvent, and then dried to form an adhesive layer.

又,表面保護薄膜為於基材上以部份性設置黏著劑層,於基材上可同時形成黏著部與非黏著部。欲作成部分性設置黏著劑層的表面保護薄膜,可藉由進行絲網印刷或噴墨印刷,同時形成黏著部與非黏著部。黏著部及非黏著部的至少任一者與黏著部的圖型為選自複數排列成條紋形狀、格子形狀、點形狀、波線之形狀、複數排列成方格圖案、及各種模樣之任一形狀者為佳,亦可為其他形狀。 In addition, the surface protection film is an adhesive layer partially provided on the substrate, and an adhesive portion and a non-adhesive portion can be formed on the substrate at the same time. To create a surface protection film with a partially-adhesive layer, it is possible to form an adhesive part and a non-adhesive part by screen printing or inkjet printing. The pattern of at least one of the adhesive part and the non-adhesive part and the adhesive part is selected from a plurality of shapes arranged in a stripe shape, a lattice shape, a dot shape, a wave line shape, a plurality of arranged in a checkered pattern, and various shapes It is better to have other shapes.

且,對於各圖型,圖型之間隔(即,鄰接黏著部彼此間之間隔、或鄰接非黏著部彼此間之間隔)以10~500μm為佳,較佳為10~300μm,特佳為10~250μm。 Moreover, for each pattern, the interval between the patterns (that is, the interval between adjacent adhering portions or the interval between adjacent non-adhesive portions) is preferably 10 to 500 μm, more preferably 10 to 300 μm, and particularly preferably 10 ~ 250μm.

即,各條紋的寬、各波線的寬及波線與波線之間的間隔、成為格子之各線寬、及構成格子所鄰接的線與線之間的間隔、點間之間隔以及點寬與高度、或者構成方格圖案之各四角形的高度及寬,以10~500μm為佳,較佳為10~300μm,特佳為10~250μm。 That is, the width of each stripe, the width of each wave line, and the interval between wave lines and wave lines, the width of each line that becomes a grid, and the interval between the lines and lines adjacent to the grid, the interval between points, and the point width and height, Alternatively, the height and width of each of the squares constituting the checkered pattern are preferably 10 to 500 μm, more preferably 10 to 300 μm, and particularly preferably 10 to 250 μm.

又,於黏著劑層之形成前或者形成後,可沖壓加工。沖壓加工為,例如對於剝離片上所設置的基材及黏著劑層的層合體進行即可,藉由該沖壓加工,可將表面保護薄膜形狀成為如上述之圓形等。又,在任意時間點藉由壓紋等可於表面保護薄膜形成適宜凹凸。 In addition, before or after the formation of the adhesive layer, press processing is possible. The pressing process may be performed on, for example, a laminate of a substrate and an adhesive layer provided on a release sheet, and the surface protection film may be formed into a circular shape as described above by the pressing process. In addition, suitable irregularities can be formed on the surface protective film by embossing or the like at any time.

〔光學構件或電子構件〕 [Optical or electronic components]

作為藉由本發明之表面保護薄膜進行保護的光學構件或電子構件,可舉出1或2片以上鏡片與CCD、CMOS等圖像感應器收納於框體或封裝內部之圖像模組;複數鏡片保存於鏡片鏡筒中,視必要收納於框體或封裝內之鏡片單位;具有LED等發光元件之發光元件單位;振動子等馬達單位;通信模組、感應模組等。這些光學構件或電子構件係以連接於基板等其他構件而使用的構件為佳。 Examples of optical or electronic components protected by the surface protection film of the present invention include image modules in which one or more lenses and image sensors such as CCD and CMOS are housed in a frame or package; multiple lenses Lens units stored in lens barrels and stored in frames or packages as necessary; light-emitting element units with light-emitting elements such as LEDs; motor units such as vibrators; communication modules, induction modules, etc. These optical members or electronic members are preferably members connected to other members such as a substrate and used.

且,所謂光學構件可為具備將光經受光或者發光,或傳送光的光學零件者,上述中圖像模組、鏡片單位、發光元件單位、將光信號傳輸或接收的通信模組、光感應模組等可作為光學構件之具體例子而舉出。又,所謂電子構件,通常為構成電氣線路的至少一部分,可舉出具備將電氣信號傳輸或接收之電子零件、將電氣信號經處理的電子零件、藉由電氣信號或電力起動作的電子零件等者,上述中圖像模組、發光元件單位、振動子等馬達單位、將電氣信號傳輸或接收之通信模組、各種感應模組等可作為電子構件之具體例子而舉出。且,將光信號傳輸或接收的通信模組或光感應模組、圖像模組及發光元件單位等,通常可為電子構件亦可為光學構件之構件。 In addition, the so-called optical member may be an optical component that is capable of subjecting light to light or emitting light, or transmitting light. Among the aforementioned image modules, lens units, light-emitting element units, communication modules that transmit or receive optical signals, and light sensors, Modules and the like can be given as specific examples of the optical member. The electronic component generally constitutes at least a part of an electrical circuit, and includes electronic components that transmit or receive electrical signals, electronic components that process electrical signals, and electronic components that operate by electrical signals or electricity. The above-mentioned image module, light-emitting element unit, motor unit such as a vibrator, a communication module that transmits or receives electrical signals, various induction modules, and the like can be cited as specific examples of electronic components. In addition, a communication module or a light-sensing module, an image module, and a light-emitting element unit that transmit or receive optical signals may generally be electronic components or optical component components.

又,光學構件或電子構件,例如以將上述電子零件或光學零件收納於封裝或框體內部,或者於支持構件經支持者為佳。又,電子零件或光學零件的一部分露出於表面者為佳,表面保護薄膜,例如可使用於保護該露出的零件。 The optical member or the electronic member is preferably, for example, a case in which the electronic component or the optical component is housed in a package or a housing, or a support member is supported by the support member. In addition, it is preferable that a part of the electronic component or the optical component is exposed on the surface, and the surface protective film can be used to protect the exposed component, for example.

〔表面保護薄膜之使用方法〕 〔How to use surface protection film〕

本發明之表面保護薄膜為使用於貼合於光學構件或電子構件之表面上進而保護該表面者。具體為貼合有表面保護薄膜之光學構件或電子構件(以下僅稱為附有表面保護薄膜之構件)為經加工、安裝於其他構件、被檢查或被搬送等者,表面保護薄膜為對於這些步驟中保護光學構件或電子構件之表面。又,表面保護薄膜在這些步驟結束,在無須表面保護之時間點時,經能量線照射降低黏著力後,自光學構件或電子構件剝離。 The surface protection film of the present invention is used to adhere to a surface of an optical member or an electronic member, thereby protecting the surface. Specifically, an optical member or an electronic member with a surface protective film (hereinafter referred to as a member with a surface protective film) is processed, mounted on another member, inspected or transported, etc. The surface protective film is for these The surface of the optical or electronic component is protected in the step. In addition, at the end of these steps, the surface protection film is peeled from the optical member or the electronic member after the adhesive force is reduced by irradiation with energy rays when the surface protection is not required.

且,附有表面保護薄膜之構件於上述加工、安裝、檢查或搬送等步驟中可進行加熱。此時的加熱溫度並無特別限定,以60~200℃程度為佳,較佳為70~150℃程度。黏著劑層為藉由加熱而提高其黏著力,但本發明之表面保護薄膜的黏著劑層即使藉由加熱提高其黏著力,其後經能量線照射後可降低黏著力,故不容易產生剝離表面保護薄膜時的剝離不良或糊殘留等。 In addition, the member with a surface protective film can be heated in the above-mentioned steps of processing, installation, inspection, or transportation. The heating temperature at this time is not particularly limited, but is preferably about 60 to 200 ° C, and more preferably about 70 to 150 ° C. The adhesive layer improves its adhesive force by heating, but even if the adhesive layer of the surface protection film of the present invention improves its adhesive force by heating, it can reduce the adhesive force after being irradiated with energy rays, so it is not easy to peel off. Insufficient peeling or paste residue during surface protection film.

貼合有表面保護薄膜之光學構件或電子構件(附有表面保護薄膜之構件),例如以藉由接著劑安裝於基板等其他構件者為佳。此時,接著劑可使用熱硬化性者,欲使該接著劑硬化,附有表面保護薄膜之構件通常在上述60~200℃以上,較佳為70~150℃程度下進行加熱為佳。其後,不需要表面保護時,於表面保護薄膜照射能量線而使黏著力降低後,自表面保護薄膜為光學構件或電子構件剝離。 An optical member or an electronic member (a member with a surface protective film) bonded with a surface protection film is preferably one that is mounted on another member such as a substrate with an adhesive. In this case, the adhesive may be a thermosetting material. To harden the adhesive, the member with a surface protective film is usually heated at a temperature of 60 to 200 ° C or higher, preferably 70 to 150 ° C. After that, when surface protection is not required, after the surface protection film is irradiated with energy rays to reduce the adhesive force, the surface protection film is peeled from the optical member or the electronic member.

又,表面保護薄膜在上述光學構件或電子構件之中,作為圖像模組用之表面保護薄膜使用者為特佳。 Further, the surface protection film is particularly suitable for a user of a surface protection film for an image module among the above-mentioned optical members or electronic members.

圖像模組通常設置又受光部,該受光部為使用於於圖像模組的一面自外部接受光,將該光介著模組內部之鏡片引導至圖像元件時受光部。受光部為設置於圖像模組之一面的一部分(例如中央),由玻璃或透明樹脂所成。表面保護薄膜以包覆受光部的方式,貼合於在設置有圖像模組之受光部的一面上者為佳。表面保護薄膜為於能量線照射前,於受光部、及受光部周圍之框體或封裝的表面以高密著力下接著,故可適切地保護設置於圖像模組的一面之受光部。又,表面保護薄膜在能量線照射後,因黏著力降低,故可容易由圖像模組剝離,防止於受光部等之糊殘留產生。 An image module is usually provided with a light receiving portion. The light receiving portion is a light receiving portion used when one side of the image module receives light from the outside and guides the light through the lens inside the module to the image element. The light receiving portion is a portion (for example, the center) provided on one surface of the image module, and is made of glass or transparent resin. The surface protection film preferably covers the light receiving portion and is adhered to the surface of the light receiving portion provided with the image module. The surface protection film is attached to the light receiving part and the surface of the frame or package around the light receiving part with high adhesion before the energy ray is irradiated. Therefore, the light receiving part provided on one side of the image module can be appropriately protected. In addition, since the surface protection film has a reduced adhesive force after being irradiated with energy rays, it can be easily peeled off from the image module, and it is possible to prevent generation of paste residue in the light receiving portion and the like.

且,表面保護薄膜所貼合的圖像模組如上述,欲使熱硬化性接著劑硬化,可安裝於經加熱的基板等其他構件者為佳。 In addition, as described above, the image module to which the surface protection film is bonded is preferably one that can be mounted on a heated substrate such as a heated substrate in order to harden the thermosetting adhesive.

〔實施例〕 [Example]

以下依據實施例對本發明做更詳細說明,但本發明並未受限於這些例子。 Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited to these examples.

本發明中之測定方法及評估方法如以下所示。 The measurement method and evaluation method in the present invention are as follows.

〔重量平均分子量(Mw)〕 [Weight average molecular weight (Mw)]

使用凝膠滲透層析法裝置,以下述條件下進行測定, 使用經標準聚苯乙烯換算後的測定值。 The measurement was performed under the following conditions using a gel permeation chromatography apparatus, The measured value converted from standard polystyrene was used.

(測定條件) (Measurement conditions)

測定裝置:製品名「HLC-8220GPC」,Tosoh股份有限公司製) Measuring device: Product name "HLC-8220GPC", manufactured by Tosoh Corporation)

管柱:製品名「TSKGel SuperHZM-M」,Tosoh股份有限公司製) Column: Product name "TSKGel SuperHZM-M", manufactured by Tosoh Co., Ltd.)

展開溶劑:四氫呋喃 Development solvent: tetrahydrofuran

管柱溫度:40℃ Column temperature: 40 ℃

流速:1.0mL/min Flow rate: 1.0mL / min

〔黏著力〕 〔Adhesiveness〕

將黏著片裁成25mm寬的試料,在23℃,50%相對濕度之環境下,以2kg輥貼合於黏合體之矽晶圓。在23℃ 50%相對濕度之環境下靜置20分鐘後,測定以拉伸速度300mm/分,180°下進行剝離時的黏著力,作為能量線照射前之黏著力。又,於20分鐘靜置後的矽晶圓所貼合的試料,使用紫外線照射裝置(Lintec Corporation製RAD-2000m/l2),在氮環境下照射紫外線(照度230mW/cm2,光量190mJ/cm2)。其後,在23℃ 50%相對濕度之環境下,測定以拉伸速度300mm/分,180°下經剝離時的黏著力,作為能量線照射後之黏著力。 The adhesive sheet was cut into a 25 mm wide sample, and the silicon wafer was bonded to the bonded body with a 2 kg roller under an environment of 23 ° C and 50% relative humidity. After standing for 20 minutes in an environment of 23 ° C and 50% relative humidity, the adhesive force at the time of peeling at a tensile speed of 300 mm / min and 180 ° was measured as the adhesive force before energy ray irradiation. In addition, the sample bonded to the silicon wafer after standing for 20 minutes was irradiated with ultraviolet rays (illuminance 230 mW / cm 2 , light quantity 190 mJ / cm) under a nitrogen environment using an ultraviolet irradiation device (RAD-2000m / l2 manufactured by Lintec Corporation). 2 ). Thereafter, in an environment of 23 ° C and 50% relative humidity, the adhesive force at the time of peeling at a tensile speed of 300 mm / min and 180 ° was measured as the adhesive force after energy ray irradiation.

〔初期黏著力〕 [Initial adhesion]

經黏著片裁成25mm寬的試料,在23℃,50%相對濕度之環境下,以2kg輥貼合於黏合體之矽晶圓。該貼合後(1分鐘以內),在23℃、50%相對濕度之環境下,測定 以拉伸速度300mm/分,180°下進行剝離時的黏著力,該黏著力作為初期黏著力。 The adhesive sheet was cut into a 25 mm wide sample, and the silicon wafer was bonded to the bonded body with a 2 kg roller under an environment of 23 ° C and 50% relative humidity. After this lamination (within 1 minute), measure under the environment of 23 ° C and 50% relative humidity The adhesive force at the time of peeling at a tensile speed of 300 mm / min at 180 ° was used as the initial adhesive force.

〔評估方法〕 〔assessment method〕

將直徑5mm之圓形,薄膜面積19.6mm2之表面保護薄膜,貼合於設有圖像模組之受光部的一面,依據以下評估基準進行評估。 A surface protective film with a diameter of 5 mm and a film area of 19.6 mm 2 was attached to the side of the light receiving part provided with the image module and evaluated according to the following evaluation criteria.

<再加工性> <Reworkability>

A:將表面保護薄膜貼合於圖像模組後,亦容易貼合修正之再加工性良好者。 A: After the surface protection film is attached to the image module, it is easy to attach the corrected reworkability.

B:將表面保護薄膜一旦貼合於圖像模組後,難以貼合修正之再加工性不充分者。 B: Once the surface protection film is attached to the image module, it is difficult to attach the correction and the reworkability is insufficient.

<保護性> <Protective>

A:對於表面保護薄膜之圖像模組的密著性良好之保護性優良者。 A: Those with good adhesion to the surface protection film of the image module are excellent.

B:對於表面保護薄膜之圖像模組的密著性較低之表面保護薄膜會有不經意剝落之顧慮者。 B: There is a concern that the surface protection film of the surface protection film with a low adhesion of the surface protection film may inadvertently peel off.

<剝離性> <Peelability>

A:將貼合於圖像模組的表面保護薄膜經紫外線照射後,自圖像模組剝離時可容易剝離,又以目視觀察時,見不到於圖像模組有糊殘留。 A: After the surface protection film attached to the image module is irradiated with ultraviolet rays, it can be easily peeled when peeled from the image module, and when visually observed, there is no paste residue in the image module.

B:經貼合於圖像模組之表面保護薄膜經紫外線照射後,自圖像模組剝離時,因剝離抵抗高,以手工作業之剝離所需時間較長,又以目視觀察時,於圖像模組見到有糊 殘留。 B: After the surface protection film attached to the image module is irradiated with ultraviolet rays, when peeling from the image module, the peel resistance is high due to high peel resistance, and the time required for manual peeling is longer. Image module sees ambiguity Residual.

〔實施例1〕 [Example 1]

將n-丁基丙烯酸酯69.5質量份、甲基丙烯酸酯30質量份、2-羥基乙基丙烯酸酯0.5質量份在乙酸乙酯溶劑中進行聚合,得到重量平均分子量46萬之丙烯酸系共聚物。於以該乙酸乙酯溶劑經稀釋的丙烯酸系共聚物100質量份(固體成分換算)中混合重量平均分子量2300之季戊四醇系的5~9官能胺基甲酸酯丙烯酸酯系寡聚物120質量份、作為光聚合起始劑之IRGACURE184(BASF公司製)2.0質量份、與作為交聯劑之有機多價異氰酸酯化合物(製品名「BHS8515」、Toyokemu股份有限公司製)8質量份後得到能量線硬化型黏著劑組成物(Y型)之乙酸乙酯稀釋液。將該稀釋液於由厚度50μm之聚乙烯對苯二甲酸乙二醇酯薄膜所成的基材,塗布至乾燥後的厚度為20μm,其後在100℃進行1分鐘加熱乾燥,於基材上形成黏著劑層後得到表面保護薄膜。 69.5 parts by mass of n-butyl acrylate, 30 parts by mass of methacrylate, and 0.5 parts by mass of 2-hydroxyethyl acrylate were polymerized in an ethyl acetate solvent to obtain an acrylic copolymer having a weight average molecular weight of 460,000. 120 parts by mass of pentaerythritol-based 5-9 functional urethane acrylate-based oligomer having a weight average molecular weight of 2300 was mixed with 100 parts by mass of the acrylic copolymer (solid content conversion) diluted with the ethyl acetate solvent. 2.0 mass parts of IRGACURE184 (manufactured by BASF) as a photopolymerization initiator, and 8 mass parts of an organic polyvalent isocyanate compound (product name "BHS8515", manufactured by Toyokemu Co., Ltd.) as a cross-linking agent, energy ray hardening was obtained A dilute solution of ethyl acetate with an adhesive composition (type Y). The diluted solution was applied to a substrate made of a polyethylene terephthalate film having a thickness of 50 μm to a thickness of 20 μm after drying, and then heated and dried at 100 ° C. for 1 minute on the substrate. A surface protective film is obtained after forming the adhesive layer.

〔實施例2〕 [Example 2]

將n-丁基丙烯酸酯52質量份、甲基甲基丙烯酸酯20質量份、2-羥基乙基丙烯酸酯28質量份在乙酸乙酯溶劑中進行聚合後得到重量平均分子量50萬之丙烯酸系共聚物,再於丙烯酸系共聚物100質量份中,反應含有不飽和基之化合物的甲基丙烯醯氧乙基異氰酸酯(MOI)33.7質 量份(對於2-羥基乙基丙烯酸酯100當量而言為90當量),得到能量線硬化型丙烯酸系共聚物之乙酸乙酯稀釋液。其次,於以該乙酸乙酯經稀釋的能量線硬化型丙烯酸系共聚物100質量份(固體成分換算),混合作為光聚合起始劑之IRGACURE184(BASF公司製)3.3質量份、作為交聯劑之有機多價異氰酸酯化合物(製品名「BHS8515」、Toyokemu股份有限公司)0.5質量份,得到能量線硬化型黏著劑組成物(X型)之稀釋液。其後,與實施例1之相同方法於基材上形成黏著劑層,得到表面保護薄膜。 52 parts by mass of n-butyl acrylate, 20 parts by mass of methmethacrylate, and 28 parts by mass of 2-hydroxyethyl acrylate were polymerized in an ethyl acetate solvent to obtain an acrylic copolymer having a weight average molecular weight of 500,000. In 100 parts by mass of acrylic copolymer, methacryloxyethyl isocyanate (MOI) containing 33.7 mass of unsaturated compound is reacted. Parts by weight (90 equivalents for 100 equivalents of 2-hydroxyethyl acrylate) to obtain an ethyl acetate dilution solution of the energy ray-curable acrylic copolymer. Next, 3.3 parts by mass of IRGACURE 184 (manufactured by BASF) as a photopolymerization initiator was mixed with 100 parts by mass (solid content conversion) of the energy ray-curable acrylic copolymer diluted with ethyl acetate, and used as a crosslinking agent. 0.5 parts by mass of an organic polyvalent isocyanate compound (product name "BHS8515", Toyokemu Co., Ltd.), to obtain a dilute solution of an energy ray-curable adhesive composition (type X). Thereafter, an adhesive layer was formed on the substrate in the same manner as in Example 1 to obtain a surface protective film.

〔實施例3〕 [Example 3]

於實施例2之能量線硬化型黏著劑組成物的稀釋液中,進一步將重量平均分子量5500的2官能胺基甲酸酯丙烯酸酯系寡聚物,除去使用對於能量線硬化型丙烯酸系共聚物100質量份添加10質量份者,與實施例2同樣地實施(X-Y型)。且,作為2官能胺基甲酸酯丙烯酸酯系寡聚物,使用聚合異佛爾酮二異氰酸酯3質量份、聚丙二醇1.4質量份、及聚乙二醇0.6質量份所得者,進一步與2-羥基丙基丙烯酸酯2質量份進行反應者。 The difunctional urethane acrylate-based oligomer having a weight average molecular weight of 5,500 was further diluted in the dilute solution of the energy ray-curable adhesive composition of Example 2, and the energy ray-curable acrylic copolymer was removed. The addition of 100 parts by mass to 10 parts by mass was carried out in the same manner as in Example 2 (XY type). In addition, as the bifunctional urethane acrylate-based oligomer, 3 parts by mass of polymerized isophorone diisocyanate, 1.4 parts by mass of polypropylene glycol, and 0.6 parts by mass of polyethylene glycol were used. Those who react with 2 parts by mass of hydroxypropyl acrylate.

〔比較例1〕 [Comparative Example 1]

將n-丁基丙烯酸酯90質量份與、丙烯酸10質量份在乙酸乙酯溶劑中進行聚合,得到重量平均分子量55萬之 丙烯酸系共聚物。於經該乙酸乙酯進行稀釋的丙烯酸系共聚物100質量份(固體成分換算)中,將混合重量平均分子量2300之5~9官能胺基甲酸酯丙烯酸酯寡聚物120質量份、作為光聚合起始劑之IRGACURE184(BASF公司製)2.0質量份、與作為交聯劑的有機多價異氰酸酯化合物(製品名「BHS8515」、Toyokemu股份有限公司製)17質量份而得者,除去使用作為能量線硬化型黏著劑組成物(Y型)之稀釋液的步驟而與實施例1同樣地實施。 90 parts by mass of n-butyl acrylate and 10 parts by mass of acrylic acid were polymerized in an ethyl acetate solvent to obtain a weight average molecular weight of 550,000. Acrylic copolymer. In 100 parts by mass (in terms of solid content) of the acrylic copolymer diluted with this ethyl acetate, 120 parts by mass of a 5 to 9 functional urethane acrylate oligomer having a weight average molecular weight of 2,300 was mixed as the photocatalyst. A polymerization initiator containing 2.0 parts by mass of IRGACURE184 (manufactured by BASF) and 17 parts by mass of an organic polyvalent isocyanate compound (product name "BHS8515", manufactured by Toyokemu Co., Ltd.) as a cross-linking agent were used as energy The step of diluting the linear curing adhesive composition (Y type) was carried out in the same manner as in Example 1.

〔比較例2〕 [Comparative Example 2]

將n-丁基丙烯酸酯90質量份及丙烯酸10質量份在乙酸乙酯溶劑中進行聚合後得到重量平均分子量55萬之丙烯酸系共聚物。將混合以該乙酸乙酯經稀釋的丙烯酸系共聚物100質量份(固體成分換算)、重量平均分子量8000之3~4官能胺基甲酸酯丙烯酸酯寡聚物120質量份、作為光聚合起始劑之IRGACURE184(BASF公司製)2.0質量份、作為交聯劑之有機多價異氰酸酯化合物(製品名「BHS8515」,Toyokemu股份有限公司製)11質量份者,除去使用作為能量線硬化型黏著劑組成物(Y型)之稀釋液的步驟而與實施例1同樣地實施。 90 parts by mass of n-butyl acrylate and 10 parts by mass of acrylic acid were polymerized in an ethyl acetate solvent to obtain an acrylic copolymer having a weight average molecular weight of 550,000. 100 parts by mass of the ethyl acetate-diluted acrylic copolymer (in terms of solid content) and 120 parts by mass of a 3 to 4-functional urethane acrylate oligomer having a weight average molecular weight of 8,000 were mixed as photopolymerization. 2.0 parts by mass of IRGACURE184 (manufactured by BASF) as an initiator and 11 parts by mass of an organic polyvalent isocyanate compound (product name "BHS8515", manufactured by Toyokemu Co., Ltd.) as a crosslinking agent, except for use as an energy ray hardening adhesive The step of diluting the composition (Y type) was carried out in the same manner as in Example 1.

〔比較例3〕 [Comparative Example 3]

將2-乙基己基丙烯酸酯80質量份及2-羥基乙基丙烯酸酯20質量份在乙酸乙酯溶劑中進行聚合得到重量平均 分子量47萬之丙烯酸系共聚物,進一步對於丙烯酸系共聚物100質量份(固體成分換算),與含有不飽和基之化合物的甲基丙烯醯氧乙基異氰酸酯(MOI)21質量份(對於2-羥基乙基丙烯酸酯100當量而言為80當量)進行反應,得到能量線硬化型丙烯酸系共聚物。除去使用於以該乙酸乙酯進行稀釋的能量線硬化型丙烯酸系共聚物100質量份(固體成分換算),混合作為光聚合起始劑之IRGACURE184(BASF公司製)2.0質量份、作為交聯劑之有機多價異氰酸酯化合物(製品名「BHS8515」、Toyokemu股份有限公司製)1質量份而得之能量線硬化型黏著劑組成物(X型)的稀釋液以外,與實施例1同樣地實施。 A weight average was obtained by polymerizing 80 parts by mass of 2-ethylhexyl acrylate and 20 parts by mass of 2-hydroxyethyl acrylate in an ethyl acetate solvent. An acrylic copolymer having a molecular weight of 470,000 is further added to 100 parts by mass of the acrylic copolymer (in terms of solid content) and 21 parts by mass of methacryloxyethyl isocyanate (MOI) of the unsaturated group-containing compound (for 2- 100 equivalents of hydroxyethyl acrylate were reacted) to obtain an energy ray-curable acrylic copolymer. 100 parts by mass of the energy ray-curable acrylic copolymer (solid content conversion) used for diluting with this ethyl acetate was removed, and 2.0 parts by mass of IRGACURE184 (manufactured by BASF) as a photopolymerization initiator was mixed and used as a crosslinking agent An energy ray-curable adhesive composition (type X) obtained by diluting 1 part by mass of an organic polyvalent isocyanate compound (product name "BHS8515", manufactured by Toyokemu Co., Ltd.) was implemented in the same manner as in Example 1.

〔比較例4〕 [Comparative Example 4]

將丁基丙烯酸酯85質量份、甲基甲基丙烯酸酯9質量份、羥基丙烯酸酯5質量份、及丙烯酸1質量份在乙酸乙酯溶劑中進行聚合,得到重量平均分子量46萬之丙烯酸系共聚物。於以該乙酸乙酯溶劑經稀釋的丙烯酸系共聚物100質量份(固體成分換算)中,混合作為交聯劑之有機多價異氰酸酯化合物(製品名「BHS8515」、Toyokemu股份有限公司製)8質量份,得到非能量線硬化型黏著劑組成物之稀釋液。使用該非能量線硬化型黏著劑組成物之稀釋液,取代能量線硬化型黏著劑組成物之稀釋液以外,與實施例1同樣地實施。 85 parts by mass of butyl acrylate, 9 parts by mass of methacrylate, 5 parts by mass of hydroxyacrylate, and 1 part by mass of acrylic acid were polymerized in an ethyl acetate solvent to obtain an acrylic copolymer having a weight average molecular weight of 460,000. Thing. 8 parts by mass of an organic polyvalent isocyanate compound (product name "BHS8515", manufactured by Toyokemu Co., Ltd.) as a crosslinking agent was mixed with 100 parts by mass of the acrylic copolymer (solid content conversion) diluted with the ethyl acetate solvent. Parts to obtain a diluent of the non-energy ray-curable adhesive composition. This diluent of the non-energy-ray-curable adhesive composition was used in the same manner as in Example 1 except that the diluent of the energy-ray-curable adhesive composition was used instead.

在以上實施例1~3中,丙烯酸系共聚物為含有所定量的作為共聚物成分之烷基的碳數為1或2的烷基(甲基)丙烯酸酯之同時,因未含含有羧基的單體,故UV照射前之黏著力及初期黏著力為良好值,可得到具有優良的再加工性、保護性之表面保護薄膜。又,經UV照射後之黏著力會變低,故剝離性能亦良好。 In the above Examples 1 to 3, the acrylic copolymer was an alkyl (meth) acrylate having a carbon number of 1 or 2 as the amount of the alkyl group as a copolymer component. Monomer, so the adhesion and initial adhesion before UV irradiation are good values, and a surface protective film with excellent reworkability and protection can be obtained. In addition, since the adhesive force becomes low after UV irradiation, the peeling performance is also good.

另一方面,在比較例1~3中,丙烯酸系共聚物中為未含有所定量的作為共聚物成分之烷基的碳數為1或2的烷基(甲基)丙烯酸酯,或含含有羧基的單體5質量%以上,故經UV照射後之黏著力並未充分地降低,剝離性能並非良好。又,在比較例2中,並未成為初期黏著力亦高,再加工性亦良好者。且在比較例4中,因使用非能量線硬化型,故難成為保護性、剝離性良好者。 On the other hand, in Comparative Examples 1 to 3, the acrylic copolymer did not contain an alkyl (meth) acrylate having a carbon number of 1 or 2 as a specified amount of the alkyl group as a copolymer component, or contained The carboxyl monomer is 5 mass% or more, so the adhesive force after UV irradiation is not sufficiently reduced, and the peeling performance is not good. Moreover, in Comparative Example 2, it was not the case where the initial adhesion was also high and the reworkability was also good. Moreover, in Comparative Example 4, since a non-energy ray hardening type was used, it was difficult to be a person with good protective properties and peelability.

Claims (11)

一種表面保護薄膜,其為貼合於光學構件或電子構件上而使用於保護該表面者,其特徵為具備基材,與設置於該基材的一面之黏著劑層,前述黏著劑層係由含有丙烯酸系共聚物(A)之能量線硬化型黏著劑組成物所成,前述丙烯酸系共聚物(A)為共聚合至少含有5~50質量%之烷基的碳數為1或2之烷基(甲基)丙烯酸酯的同時,未含含有羧基的單體或含有未達5質量%之該含有羧基的單體之單體成分所得者,其中前述能量線硬化型黏著劑組成物為進一步含有能量線聚合性化合物(B),前述能量線聚合性化合物(B)為胺基甲酸酯丙烯酸酯系寡聚物,且該胺基甲酸酯丙烯酸酯系寡聚物的重量平均分子量為1000~15000。A surface protection film, which is used for protecting an optical member or an electronic member and is used for protecting the surface, is characterized by having a substrate, and an adhesive layer provided on one side of the substrate. The aforementioned adhesive layer is composed of It is made of an energy ray hardening adhesive composition containing an acrylic copolymer (A). The acrylic copolymer (A) is an alkane having a carbon number of 1 or 2 which copolymerizes at least 5 to 50% by mass of an alkyl group. (Meth) acrylic acid ester, a monomer component containing no carboxyl group-containing monomer or a monomer component containing less than 5% by mass of the carboxyl group-containing monomer, wherein the aforementioned energy ray-curable adhesive composition is further An energy ray polymerizable compound (B) is contained, the energy ray polymerizable compound (B) is a urethane acrylate oligomer, and the weight average molecular weight of the urethane acrylate oligomer is 1000 ~ 15000. 如請求項1之表面保護薄膜,其中前述丙烯酸系共聚物(A)為含有於側鏈具有不飽和基之能量線硬化型丙烯酸系共聚物者。The surface protective film according to claim 1, wherein the acrylic copolymer (A) is an energy ray-curable acrylic copolymer having an unsaturated group in a side chain. 如請求項1或2之表面保護薄膜,其中前述丙烯酸系共聚物(A)為進一步共聚合含有30~85質量%的烷基之碳數為3以上的烷基(甲基)丙烯酸酯之單體成分所得者。For example, the surface protection film of claim 1 or 2, wherein the aforementioned acrylic copolymer (A) is a unit of further copolymerizing an alkyl (meth) acrylate containing 30 to 85% by mass of an alkyl group having a carbon number of 3 or more Body composition income. 如請求項3之表面保護薄膜,其中前述烷基的碳數為3以上之烷基(甲基)丙烯酸酯為烷基的碳數為3~8的烷基(甲基)丙烯酸酯。For example, the surface protection film of claim 3, wherein the alkyl (meth) acrylate having an alkyl group having a carbon number of 3 or more is an alkyl (meth) acrylate having an alkyl group having a carbon number of 3 to 8. 如請求項1或2之表面保護薄膜,其中前述丙烯酸系共聚物(A)為進一步共聚合含有0.2~40質量份%的含有羥基之(甲基)丙烯酸酯的單體成分所得者。The surface protection film according to claim 1 or 2, wherein the acrylic copolymer (A) is obtained by further copolymerizing a monomer component containing a hydroxyl group-containing (meth) acrylate in an amount of 0.2 to 40 parts by mass. 如請求項1或2之表面保護薄膜,其中能量線照射前之黏著力為1000~20000mN/25mm的同時,能量線照射後之黏著力為0.1~100mN/25mm者。For example, the surface protection film of item 1 or 2 in which the adhesive force before the energy ray irradiation is 1000 ~ 20,000mN / 25mm, and the adhesive force after the energy ray irradiation is 0.1 ~ 100mN / 25mm. 如請求項1或2之表面保護薄膜,其中能量線照射前之初期黏著力為未達10000mN/25mm者。For example, the surface protection film of claim 1 or 2, in which the initial adhesive force before energy ray irradiation is less than 10000mN / 25mm. 如請求項1或2之表面保護薄膜,其中前述黏著劑層經著色後,使表面保護薄膜的光透過率成為未達50%者。For example, the surface protection film of claim 1 or 2, wherein the aforementioned adhesive layer is colored so that the light transmittance of the surface protection film becomes less than 50%. 如請求項1或2之表面保護薄膜,其為貼合於圖像模組上,使用於保護該圖像模組之受光部者。If the surface protection film of claim 1 or 2 is attached to the image module, it is used to protect the light receiving part of the image module. 一種附有表面保護薄膜的構件,其特徵為具備選自光學構件或電子構件的任一構件、與貼合於該構件表面之如請求項1~9中任一項之表面保護薄膜者。A member with a surface protection film, comprising any member selected from an optical member or an electronic member, and a surface protection film according to any one of claims 1 to 9 attached to the surface of the member. 一種保護表面的方法,其特徵為將如請求項1~9中任一項之表面保護薄膜貼合於光學構件或電子構件之表面上而保護該表面之方法。A method for protecting a surface, which is characterized in that a surface protection film according to any one of claims 1 to 9 is attached to a surface of an optical member or an electronic member to protect the surface.
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