TWI676712B - Steel plate for container and manufacturing method thereof - Google Patents

Steel plate for container and manufacturing method thereof Download PDF

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TWI676712B
TWI676712B TW107121990A TW107121990A TWI676712B TW I676712 B TWI676712 B TW I676712B TW 107121990 A TW107121990 A TW 107121990A TW 107121990 A TW107121990 A TW 107121990A TW I676712 B TWI676712 B TW I676712B
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tin
oxide film
steel sheet
tin oxide
plating layer
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TW107121990A
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TW201912836A (en
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須藤幹人
Mikito Suto
鈴木威
Takeshi Suzuki
山中洋一郎
Yoichiro Yamanaka
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日商Jfe鋼鐵股份有限公司
Jfe Steel Corporation
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/08Tin or alloys based thereon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/07Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing phosphates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/04Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
    • C23C28/048Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material with layers graded in composition or physical properties
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02Anodisation
    • C25D11/34Anodisation of metals or alloys not provided for in groups C25D11/04 - C25D11/32
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/36Phosphatising

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Coating With Molten Metal (AREA)
  • Laminated Bodies (AREA)

Abstract

有關本發明之容器用鋼板係其特徵為具備於表面具有錫鍍敷層之錫鍍敷鋼板,和形成於錫鍍敷層之表面上的氧化錫皮膜,和形成於氧化錫皮膜的表面上,作為P量而含有0.1mg/m2 以上3.0mg/m2 以下之磷酸錫的磷酸錫皮膜,氧化錫皮膜係在0.001N之溴化氫水溶液中,將電位自浸漬電位掃描至負側之同時,還原氧化錫皮膜時,於-800~ -500mV vs 飽和KCl-Ag/AgCl參照電極之範圍內具有還原電流峰值,A值則不足1.0,對於自氧化錫皮膜的還原電流-電位曲線所計算之氧化錫皮膜之還原所需的電量則位於1.5mC/cm2 以上5.0mC/cm2 以下之範圍內者。The steel sheet for a container according to the present invention is characterized by including a tin-plated steel sheet having a tin plating layer on the surface, a tin oxide film formed on the surface of the tin plating layer, and a surface of the tin oxide film, A tin phosphate film containing 0.1 mg / m 2 or more and 3.0 mg / m 2 or less of tin phosphate as the amount of P. The tin oxide film was in a 0.001 N hydrogen bromide aqueous solution, and the potential was scanned from the immersion potential to the negative side. When reducing the tin oxide film, there is a reduction current peak in the range of -800 ~ -500mV vs saturated KCl-Ag / AgCl reference electrode, and the A value is less than 1.0. Calculated for the reduction current-potential curve of the self-tin oxide film The amount of electricity required for the reduction of the tin oxide film is within the range of 1.5 mC / cm 2 to 5.0 mC / cm 2 .

Description

容器用鋼板及其製造方法Container steel plate and manufacturing method thereof

本發明係有關適用於飲料罐或食罐等之容器用素材而最佳,對於塗料密著性與耐錫氧化性優越之容器用鋼板及其製造方法。The present invention relates to a steel material for a container, which is optimal for use as a container material for a beverage can, a food can, and the like, and is excellent in coating adhesion and tin oxidation resistance, and a method for manufacturing the same.

作為飲料罐或食罐等之容器用素材所利用之容器用鋼板的1種之鍍錫鐵的合成處理,係從對於塗料密著性及耐錫氧化性優越之情況,自以往採用鉻酸鹽處理。另一方面,從近來之環境負擔降低的觀點,在容器用鋼板的製造工程中,未含有6價鉻之合成處理為佳。從如此之背景,設計有將鉻酸鹽處理,以磷酸鹽處理而代替之方法。例如,對於專利文獻1係記載有控制在磷酸鹽皮膜形成過程中之電解條件,形成對於耐錫氧化性優越之磷酸鹽皮膜的方法。另外,對於專利文獻2係記載有具有於錫鍍敷層上包含氧化錫,磷酸錫,及矽醇基含有有機化合物之皮膜的容器用鋼板。 [先前技術文獻] [專利文獻]Synthetic treatment of tin-plated iron, which is a type of steel plate for containers used as a container material for beverage cans, food cans, etc., has been used in the past since it has excellent coating adhesion and tin oxidation resistance. deal with. On the other hand, from the standpoint of the recent reduction in environmental burden, it is preferable that in the manufacturing process of a steel sheet for a container, a synthetic treatment not containing hexavalent chromium is used. From such a background, a method of treating chromate and replacing it with phosphate was devised. For example, Patent Document 1 describes a method of controlling a electrolytic condition during the formation of a phosphate film to form a phosphate film excellent in tin oxidation resistance. In addition, Patent Document 2 describes a steel sheet for a container having a film containing tin oxide, tin phosphate, and a silanol group containing an organic compound on a tin plating layer. [Prior Art Literature] [Patent Literature]

[專利文獻1]日本特開2012-197495號公報   [專利文獻2]日本特開2008-202094號公報[Patent Document 1] Japanese Patent Application Publication No. 2012-197495 95 [Patent Document 2] Japanese Patent Application Publication No. 2008-202094

[發明欲解決之課題][Questions to be Solved by the Invention]

但以記載於專利文獻1之方法所製造之磷酸鹽皮膜係缺乏塗料密著性,更且在高溫多濕環境下,錫氧化的抑制則為不充分。另外,記載於專利文獻2之容器用鋼板係於表面賦予矽醇基含有有機化合物層之故而對於塗料密著性係雖為優越,但對於錫氧化的抑制係為不充分。However, the phosphate film system produced by the method described in Patent Document 1 lacks paint adhesion, and further, under high temperature and humidity environments, the inhibition of tin oxidation is insufficient. In addition, the steel sheet for containers described in Patent Document 2 is superior in coating adhesion because it provides a silanol group-containing organic compound layer on the surface, but is insufficient in suppressing tin oxidation.

本發明係有鑑於上述課題所作為之構成,其目的為提供:對於塗料密著性及耐錫氧化性優越之容器用鋼板及其製造方法者。 [為了解決課題之手段]The present invention has a structure made in view of the above-mentioned problems, and an object thereof is to provide a steel sheet for a container excellent in paint adhesion and tin oxidation resistance and a method for manufacturing the same. [Means for solving problems]

本發明之發明者們係為了達成上述目的而進行銳意檢討之結果,發現經由特定量形成氧化錫皮膜於錫鍍敷鋼板的表面,適當地控制其氧化錫皮膜之形態,更且於其表面形成磷酸錫皮膜之時,可得到對於塗料密著性及耐錫氧化性優越之容器用鋼板,至發想到本發明。As a result of an intensive review by the inventors of the present invention in order to achieve the above-mentioned object, it was found that a tin oxide film was formed on a surface of a tin-plated steel sheet by a specific amount, and the form of the tin oxide film was appropriately controlled, and formed on the surface. In the case of a tin phosphate film, a steel sheet for a container excellent in coating adhesion and tin oxidation resistance can be obtained, and the present invention has been conceived.

有關本發明之容器用鋼板係其特徵為具備:於表面具有錫鍍敷層之錫鍍敷鋼板,和形成於前述錫鍍敷層之表面上的氧化錫皮膜,和形成於前述氧化錫皮膜的表面上,作為P量而含有0.1mg/m2 以上3.0mg/m2 以下之磷酸錫的磷酸錫皮膜,前述氧化錫皮膜係在0.001N之溴化氫水溶液中,將電位自浸漬電位掃描至負側之同時,還原前述氧化錫皮膜時,於-800~-500mV vs 飽和KCl-Ag/AgCl參照電極之範圍內具有還原電流峰值,以後記數式(1)所定義之A值則不足1.0,對於自前述氧化錫皮膜之還原電流-電位曲線所計算之氧化錫皮膜之還原所需的電量則位於1.5mC/cm2 以上5.0mC/cm2 以下之範圍內者。The steel sheet for a container according to the present invention is characterized by comprising a tin-plated steel sheet having a tin plating layer on the surface, a tin oxide film formed on the surface of the tin plating layer, and a tin oxide film formed on the tin oxide film. On the surface, a tin phosphate film containing 0.1 mg / m 2 or more and 3.0 mg / m 2 or less of tin phosphate as the amount of P. The tin oxide film is in a 0.001 N hydrogen bromide aqueous solution, and the potential is scanned from the immersion potential to At the same time on the negative side, when reducing the aforementioned tin oxide film, there is a reduction current peak in the range of -800 ~ -500mV vs. saturated KCl-Ag / AgCl reference electrode, and the A value defined by the following formula (1) is less than 1.0 The amount of electricity required for the reduction of the tin oxide film calculated from the reduction current-potential curve of the aforementioned tin oxide film is within the range of 1.5 mC / cm 2 to 5.0 mC / cm 2 .

在此,Q1 係表示具有還原電流峰值於-600~-500mV之範圍內,對於氧化錫皮膜之還原所需的電量,而Q2 係表示於比-600mV偏負側具有還原電流峰值,對於氧化錫皮膜之還原所需的電量。 Here, Q 1 means that it has the reduction current peak in the range of -600 ~ -500mV, which is the amount of electricity required for the reduction of the tin oxide film, and Q 2 means that it has the reduction current peak on the side more negative than -600mV. The amount of electricity required to reduce the tin oxide film.

有關本發明之容器用鋼板的製造方法係其特徵為包含:經由在pH位於8以上13以下之範圍內的水溶液中,將於表面具有錫鍍敷層之錫鍍敷鋼板,作為陽極而施以電解處理,再進行水洗,接著於磷酸鹽水溶液中,將錫鍍敷鋼板進行1.0秒以上5.0秒以下浸漬,或將錫鍍敷鋼板作為陽極而施以0.1A/dm2 以上10A/dm2 、0.1秒以上2.0秒以下之電解處理之時而製造容器用鋼板之步驟者。 [發明效果]A method for manufacturing a steel sheet for a container according to the present invention is characterized by including, as an anode, applying a tin-plated steel sheet having a tin plating layer on its surface through an aqueous solution having a pH in a range of 8 to 13 inclusive. Electrolytic treatment, followed by water washing, followed by dipping the tin-plated steel sheet in a phosphate aqueous solution for 1.0 seconds or more and 5.0 seconds or less, or using the tin-plated steel sheet as an anode and applying 0.1A / dm 2 to 10A / dm 2 , A step of manufacturing a steel sheet for a container during an electrolytic treatment of 0.1 seconds to 2.0 seconds. [Inventive effect]

如根據本發明,可提供對於塗料密著性及耐錫氧化性優越之容器用鋼板及其製造方法者。According to the present invention, it is possible to provide a steel sheet for a container excellent in paint adhesion and tin oxidation resistance, and a method for producing the same.

以下,對於有關本發明之容器用鋼板及其製造方法加以詳細說明。Hereinafter, the steel plate for containers and its manufacturing method according to the present invention will be described in detail.

有關本發明之容器用鋼板係經由具有鋼板,和選自被覆鋼板之表面之至少一部分之Sn層、Fe-Sn合金層、及Fe-Ni-Sn合金層之中至少1層所成之錫鍍敷層的錫鍍敷鋼板而加以形成。作為素材之鋼板係可使用一般的容器用之鋼板。錫鍍敷層係可為連續層,而亦可為非連續的島狀。另外,錫鍍敷層係如設置於鋼板之至少單面即可,而亦可設置於兩面。錫鍍敷層之形成係可以因應所含有之金屬元素的公知方法進行者。以下,對於鋼板及錫鍍敷層之最佳形態而詳述之。The steel sheet for a container according to the present invention is tin-plated through a tin layer having a steel sheet and at least one layer selected from the group consisting of a Sn layer, an Fe-Sn alloy layer, and an Fe-Ni-Sn alloy layer on at least a part of the surface of the coated steel sheet. The coated tin is formed by plating a steel plate. The steel plate used as a material can be a steel plate for general containers. The tin plating layer may be a continuous layer or a discontinuous island shape. In addition, the tin plating layer may be provided on at least one side of the steel plate, or may be provided on both sides. The formation of the tin plating layer can be performed according to a known method according to the metal element contained. Hereinafter, the best form of a steel plate and a tin plating layer is explained in full detail.

[鋼板]   鋼板的種類係未特別加以限定者,通常,可使用作為容器用材料所使用之鋼板(例如,極低碳鋼板或低碳鋼板)者。鋼板的製造方法或材質等均未特別加以限定者,從通常之鋼片製造工程,歷經熱間壓延,酸洗,冷間壓延,退火,及調質壓延等之工程而加以製造。[Steel plate] The type of the steel plate is not particularly limited, and generally, a steel plate (for example, an extremely low carbon steel plate or a low carbon steel plate) used as a container material can be used. The manufacturing method and material of the steel sheet are not particularly limited, and they are manufactured from ordinary steel sheet manufacturing processes through processes such as hot rolling, pickling, cold rolling, annealing, and temper rolling.

鋼板係因應必要,使用形成鎳(Ni)含有層於其表面者,形成錫鍍敷層於Ni含有層上亦可。因經由使用具有Ni含有層之鋼板而施以錫鍍敷之時,可形成含有島狀Sn之錫鍍敷層之故,熔接性則提升。作為Ni含有層係如含有鎳即可,例如,可舉出Ni鍍敷層或Ni-Fe合金層等。The steel sheet system may be formed by forming a nickel (Ni) -containing layer on the surface thereof and forming a tin plating layer on the Ni-containing layer as necessary. When tin plating is performed by using a steel plate having a Ni-containing layer, a tin plating layer containing island-like Sn can be formed, and the weldability is improved. The Ni-containing layer system may include nickel, and examples thereof include a Ni plating layer and a Ni-Fe alloy layer.

賦予Ni含有層於鋼板之方法係未特別加以限定,而例如,可舉出公知電鍍等之方法。另外,作為Ni含有層,賦予Ni-Fe合金層之情況,經由電鍍等而賦予Ni於鋼板表面上之後,經由進行退火之時,而可使Ni擴散層進行配位,形成Ni-Fe合金層。The method for imparting the Ni-containing layer to the steel sheet is not particularly limited, and examples thereof include a known method such as electroplating. In addition, in the case where a Ni-Fe alloy layer is provided as the Ni-containing layer, after Ni is provided on the surface of the steel plate by electroplating or the like, the Ni diffusion layer can be coordinated to form a Ni-Fe alloy layer through annealing. .

Ni含有層中之Ni量係未特別加以限定,而每單面之金屬Ni換算量則位於50mg/m2 以上2000mg/m2 以下之範圍內者為佳。如為上述範圍內,經由耐硫化黑變性而為優越,在成本面亦成為有利。The amount of Ni in the Ni-containing layer is not particularly limited, but the amount of Ni conversion per metal on one side is preferably within a range of 50 mg / m 2 to 2000 mg / m 2 . If it is in the said range, it will be superior by sulfur blackening resistance, and it will become advantageous also in terms of cost.

[錫鍍敷層]   在錫鍍敷層中,每鋼板片之Sn附著量係位於0.1g/m2 以上15.0g/m2 以下之範圍內者為佳。Sn附著量如為上述範圍內,對於容器用鋼板之外觀特性及耐蝕性為優越。其中,在此等特性更優越的點,Sn附著量係0.2g/m2 以上15.0 g/m2 以下之範圍內則更佳,而在加工性更優越的點,1.0 g/m2 以上15.0g/m2 以下之範圍內則更佳。[Tin Plating Layer] In the tin plating layer, the Sn adhesion amount per steel sheet is preferably within a range of 0.1 g / m 2 or more and 15.0 g / m 2 or less. If the amount of Sn deposited is within the above range, the appearance characteristics and corrosion resistance of the steel sheet for a container are excellent. Among these, at the point where these characteristics are more superior, the Sn adhesion amount is more preferably within the range of 0.2 g / m 2 to 15.0 g / m 2 , and at the point of more excellent processability, 1.0 g / m 2 is 15.0 or more. It is more preferably within a range of g / m 2 or less.

然而,Sn附著量係可根據經由電量法或螢光X線而進行表面分析之時而測定。對於使用螢光X線之情況係使用金屬Sn量既知的Sn附著量樣本,預先特定有關金屬Sn量之校準曲線,再使用同校準曲線而相對性地特定金屬Sn量。However, the amount of Sn deposited can be measured from the time of surface analysis by the electric quantity method or fluorescent X-ray. In the case of using fluorescent X-rays, a sample of Sn attachment amount that is known for the amount of metal Sn is used, and a calibration curve for the amount of metal Sn is specified beforehand, and then the amount of metal Sn is specified relatively using the same calibration curve.

錫鍍敷層係被覆鋼板表面上之至少一部分的層,亦可為連續層,而非連續的島狀亦可。作為錫鍍敷層係亦包含鍍敷錫所得到之錫鍍敷層,或錫鍍敷後,經由通電加熱等而使錫加熱熔融,於錫鍍敷最下層(錫鍍敷/基底界面)一部分形成Fe-Sn合金層之錫鍍敷層。另外,作為錫鍍敷層係亦包含對於具有Ni含有層於表面之鋼板而言進行錫鍍敷,更且,經由通電加熱等而使錫加熱熔融,於錫鍍敷最下層(錫鍍敷層/鋼板界面)一部分形成Fe-Sn-Ni合金層、Fe-Sn合金層等之錫鍍敷層。The tin plating layer is a layer covering at least a part of the surface of the steel sheet, and may be a continuous layer, or a non-continuous island shape. The tin plating layer also includes a tin plating layer obtained by plating tin, or after tin plating, the tin is heated and melted by electric heating, etc., and is part of the lowest layer (tin plating / base interface) of the tin plating. A tin plating layer of an Fe-Sn alloy layer is formed. In addition, the tin plating layer includes tin plating for a steel sheet having a Ni-containing layer on the surface, and further, tin is heated and melted by electric heating and the like, and the lowermost layer (tin plating layer) is tin-plated. (Steel plate interface) partly forms a tin plating layer such as an Fe-Sn-Ni alloy layer, an Fe-Sn alloy layer.

作為錫鍍敷層之製造方法,係可舉出周知的方法(例如,電鍍法或浸漬於熔融的Sn而進行鍍敷之方法)。例如,使用苯酚磺酸錫鍍敷浴,甲磺酸錫鍍敷浴,或鹵素系錫鍍敷浴,每單面之附著量則呈成為特定量(例如,2.8g/m2 )地,於鋼板表面,電鍍Sn之後,以Sn之熔點(231.9℃)以上之溫度進行迴焊處理,可製造形成Fe-Sn合金層於錫單體之鍍敷層之最下層的錫鍍敷層。省略迴焊處理之情況,可製造錫單體之鍍敷層。As a method for producing a tin plating layer, a known method (for example, a plating method or a method of plating by immersing in molten Sn) can be mentioned. For example, using a tin phenolsulfonate plating bath, a tin methanesulfonate plating bath, or a halogen-based tin plating bath, the amount of adhesion per side is a specific amount (for example, 2.8 g / m 2 ). After plating Sn on the surface of the steel sheet, reflow treatment is performed at a temperature above the melting point of Sn (231.9 ° C) to form a tin plating layer that forms the lowermost layer of the Fe-Sn alloy layer and the tin plating layer. By omitting the reflow process, a plating layer made of tin alone can be manufactured.

另外,鋼板則具有Ni含有層於其表面上之情況,使錫鍍敷層形成於Ni含有層上,進行迴焊處理時,形成Fe-Sn-Ni合金層或Fe-Sn合金層等於錫單體之鍍敷層之最下層(錫鍍敷層/鋼板界面)。In addition, the steel sheet may have a Ni-containing layer on its surface, and a tin plating layer is formed on the Ni-containing layer. When performing a reflow process, the Fe-Sn-Ni alloy layer or the Fe-Sn alloy layer is formed equal to the tin single. The lowest layer of the body's plating layer (tin plating layer / steel plate interface).

[氧化錫皮膜]   有關本發明之容器用鋼板係於錫鍍敷層與磷酸錫皮膜之間,具有氧化錫皮膜。經由適當地控制氧化錫皮膜的量與質之時,可提供對於耐錫氧化性優越的容器用鋼板。具體而言,在後述之容器用鋼板的還原電流-電位曲線中,於-800~-500mV vs 飽和KCl-Ag/AgCl參照電極之範圍內具有氧化錫皮膜之還原電流峰值,以以下所示之數式(1)所定義之A值則不足1.0,對於自還原電流-電位曲線所計算之氧化錫皮膜之還原所需的電量則位於1.5mC/cm2 以上5.0mC/cm2 以下之範圍內。[Tin oxide film] The steel sheet for a container according to the present invention is provided between a tin plating layer and a tin phosphate film, and has a tin oxide film. By appropriately controlling the amount and quality of the tin oxide film, it is possible to provide a steel sheet for a container excellent in tin oxidation resistance. Specifically, the reduction current-potential curve of a steel plate for a container described later has a reduction current peak of a tin oxide film in a range of -800 to -500 mV vs. a saturated KCl-Ag / AgCl reference electrode. The A value defined by the formula (1) is less than 1.0, and the amount of electricity required for the reduction of the tin oxide film calculated from the self-reduction current-potential curve is within the range of 1.5 mC / cm 2 to 5.0 mC / cm 2 .

在此,Q1 係表示對於具有還原電流峰值於-600~-500 mV之範圍內的氧化錫皮膜之還原所需的電量,Q2 係表示於比-600mV偏負側具有還原電流峰值,對於氧化錫皮膜之還原所需的電量。 Here, Q 1 refers to the amount of electricity required for the reduction of tin oxide films with a reduction current peak in the range of -600 to -500 mV, and Q 2 refers to the reduction current peak on the negative side of -600 mV. The amount of electricity required to reduce the tin oxide film.

具有還原電流峰值於-600~-500mV之範圍內的還原電流係推定為來自於SnO之還原,而於比-600mV偏負側具有還原電流峰值之還原電流係推定為來自於SnO2 及Sn-Fe或Sn-Fe-Ni合金層氧化膜之還原。賦予錫鍍敷層與磷酸錫皮膜之間的氧化錫皮膜則為SnO主體之情況,耐錫氧化性則產生劣化。對此,氧化錫皮膜則為SnO2 主體之情況,也就是對於A值為不足1.0之情況,耐錫氧化性則提升。此係SnO2 則與SnO做比較,對於在大氣下的經時而言為安定,成為可抑制經由自製造之後的時點,賦予SnO2 而根據經時之錫氧化之故而加以推定。但,當加厚賦予氧化錫皮膜時,氧化錫皮膜之凝集破壞則成為起點,使塗料密著性降低。另外,即使氧化錫皮膜過薄,亦無法得到充分的耐錫氧化性。從以上的觀點,氧化錫皮膜的量係以對於其還原所需之還原電量換算,位於1.5mC/cm2 以上5.0mC/cm2 以下之範圍內者為佳。The reduction current with a reduction current peak in the range of -600 ~ -500mV is estimated to be derived from SnO, and the reduction current with a reduction current peak on the negative side of -600mV is estimated to be derived from SnO 2 and Sn- Reduction of oxide film of Fe or Sn-Fe-Ni alloy layer. In the case where the tin oxide film provided between the tin plating layer and the tin phosphate film is a SnO main body, the tin oxidation resistance is deteriorated. On the other hand, when the tin oxide film is mainly composed of SnO 2 , that is, when the A value is less than 1.0, the tin oxidation resistance is improved. This series of SnO 2 is compared with SnO. It is stable with respect to the passage of time in the atmosphere, and it can be estimated from the reason of tin oxidation over time that SnO 2 can be prevented from being given to the point of time after the manufacture. However, when the tin oxide film is imparted by thickening, the aggregation failure of the tin oxide film becomes a starting point, and the paint adhesion is reduced. In addition, even if the tin oxide film is too thin, sufficient tin oxidation resistance cannot be obtained. From the above point of view, the amount of tin oxide film is preferably in the range of 1.5 mC / cm 2 or more and 5.0 mC / cm 2 or less in terms of the reduction power required for its reduction.

然而,容器用鋼板的還原電流-電位曲線係可經由將容器用鋼板,浸漬於以Ar等之非活性氣體加以置換之0.001N的溴化氫水溶液中,作為參照電極而將飽和KCl-Ag/AgCl電極,而作為對極使用白金板,將容器用鋼板之電位,自浸漬電位,以掃描速度1mV/秒而掃描至負側之時,進行測定者。經由自所得到之還原電流-電位曲線減去充電電流及伴隨氫產生之還原電流,進行峰值分離處理之時,可分離來自SnO、SnO2 、及Sn-Fe或Sn-Fe-Ni合金層氧化膜(合金Sn)還原之還原電流,可自其峰值面積算出對於各還原所需之電量者。以下,參照圖1,圖2,對於還原所需之電量的算出方法之一例加以說明。However, the reduction current-potential curve of a steel plate for a container can be obtained by immersing a steel plate for a container in a 0.001 N hydrogen bromide aqueous solution replaced with an inert gas such as Ar, and using saturated KCl-Ag / An AgCl electrode was measured when a platinum plate was used as the counter electrode, and the potential of the steel plate for a container was scanned from the immersion potential to the negative side at a scanning speed of 1 mV / sec. By subtracting the charging current and the reduction current accompanying hydrogen from the reduction current-potential curve obtained, the peak separation process can be used to separate the oxidation from SnO, SnO 2 , and Sn-Fe or Sn-Fe-Ni alloy layers. The reduction current of the film (alloy Sn) reduction can be calculated from its peak area for the amount of electricity required for each reduction. Hereinafter, an example of a method for calculating the amount of electricity required for reduction will be described with reference to FIGS. 1 and 2.

圖1(a),(b)係各顯示存在有合金Sn之情況與未存在之情況的還原電流-電位曲線之一例的圖。在此,在圖1(a),(b)中,曲線L1,L2,L3係各顯示還原電流的實測值,背景(基準線)電流,及背景電流除去後之還原電流的實測值。另外,圖1(a),(b)所示之背景電流係經由以下所示之數式(2)所求取之背景電流I則呈與電位-0.9~-0.8V之範圍的還原電流之實測值一致地,經由調整數式(2)中之參數α,β而求取。如圖1(a),(b)所示,經由自還原電流之實測值除去背景電流之時,可求取減去充電電流及伴隨氫產生之還原電流之還原電流-電位曲線者。1 (a) and 1 (b) are diagrams each showing an example of a reduction current-potential curve when the alloy Sn is present and when it is not present. Here, in FIGS. 1 (a) and (b), the curves L1, L2, and L3 each show the measured value of the reduction current, the background (reference line) current, and the measured value of the reduction current after the background current is removed. In addition, the background currents shown in Figs. 1 (a) and (b) are obtained from the following formula (2). The background current I is equal to the reduction current in the range of potential -0.9 to -0.8V. The measured values are uniformly obtained by adjusting the parameters α, β in Expression (2). As shown in Figures 1 (a) and (b), when the background current is removed from the measured value of the self-reduction current, the reduction current-potential curve obtained by subtracting the charging current and the reduction current accompanied by hydrogen can be obtained.

在此,I係顯示背景電流,Ich 係顯示充電電流,I0 係顯示在浸漬電位的電流,E0 係顯示浸漬電位。 Here, I indicates the background current, I ch indicates the charging current, I 0 indicates the current at the immersion potential, and E 0 indicates the immersion potential.

圖2(a),(b)係顯示在各圖1(a)及圖1(b)所示之情況的峰值分離結果的圖。在此,圖2(a),(b)中,曲線L11,L12,L13,L14,L15係顯示各減去充電電流及伴隨氫產生之還原電流之還原電流-電位曲線,來自SnO之還原電流-電位曲線,來自SnO2 之還原電流-電位曲線,來自合金Sn之還原電流-電位曲線,及顯示曲線L12與曲線L13與曲線L15的和之曲線。另外,曲線L12,L13,L14之電流值係應用表示吸附於電極表面之物質的氧化還原電流,以下所示之數式(3),將曲線L11,L12,L13,L14之電流值,各作為I,I1 ,I2 ,I3 ,經由呈成為I=I1 +I2 +I3 地調整數式(3)中之參數n,A,Γ,Eo 而求取。並且,自曲線L12,L13,L14之峰值面積,算出各SnO、SnO2 、及合金Sn之還原所需之電量Q1,Q2,Q3。將算出結果之一例示於以下的表1。2 (a) and 2 (b) are graphs showing peak separation results in the cases shown in each of Figs. 1 (a) and 1 (b). Here, in Figures 2 (a) and (b), the curves L11, L12, L13, L14, and L15 show the reduction current-potential curves each minus the charging current and the reduction current accompanied by hydrogen, and the reduction current from SnO -Potential curve, reduction current-potential curve from SnO 2 , reduction current-potential curve from alloy Sn, and a curve showing the sum of the curve L12 and the curve L13 and the curve L15. In addition, the current values of the curves L12, L13, and L14 are applied to the oxidation-reduction current of the substance adsorbed on the electrode surface. The following formula (3) is used to calculate the current values of the curves L11, L12, L13, and L14 as I, I 1 , I 2 , and I 3 are obtained by adjusting parameters n, A, Γ, and E o in Equation (3) such that I = I 1 + I 2 + I 3 . Further, since the peak area of the curve L12, L13, L14, the respective calculated SnO, the desired SnO 2, Sn and alloys of reduction charge Q1, Q2, Q3. An example of the calculation result is shown in Table 1 below.

在此,n係電子數,F係法拉第常數,A係電極面積,v係掃描速度,R係氣體常數,T係溫度,Γ係吸附量,E係電極電位,Eo 係顯示氧化還原電位。 Here, the n-series electron number, the F-series Faraday constant, the A-series electrode area, the v-series scanning speed, the R-series gas constant, the T-series temperature, the Γ-series adsorption amount, the E-series electrode potential, and the E o- series display redox potential.

[磷酸錫皮膜]   接著,對於配置於上述之錫鍍敷鋼板的錫鍍敷層側之表面上的磷酸錫皮膜而加以說明。磷酸錫皮膜係概略來說係作為其成分而含有磷酸及Sn之皮膜,使用後述之處理液而加以形成。磷酸錫皮膜係每錫鍍敷鋼板之單面之P換算的附著量(以下,亦稱為「P附著量」)則呈成為0.1mg/m2 以上3.0mg/m2 以下之範圍內地加以形成。P附著量則為不足0.1mg/m2 之情況,貢獻於與塗料之結合的磷酸錫皮膜則無法被覆錫鍍敷層整面之故,塗料密著性則劣化。另一方面,對於P附著量則較3.0mg/m2 為多之情況,經由磷酸錫皮膜本身的凝集破壞而塗料密著性則產生劣化。P附著量則如為0.1mg/m2 以上3.0mg/m2 以下之範圍內,對於塗料密著性優越,經由與上述之氧化錫皮膜併用之時,對於塗料密著性及耐錫氧化性優越。然而,P附著量係可經由螢光X線的表面分析而進行測定。[Tin Phosphate Film] Next, a tin phosphate film disposed on the surface of the tin plating layer side of the above tin-plated steel sheet will be described. A tin phosphate film is a film which contains phosphoric acid and Sn as its components, and is formed using the processing liquid mentioned later. The tin phosphate film is formed in a range of 0.1 mg / m 2 or more and 3.0 mg / m 2 or less in terms of P-based adhesion amount (hereinafter, also referred to as “P adhesion amount”) per one side of a tin-plated steel sheet. . When the adhesion amount of P is less than 0.1 mg / m 2 , the tin phosphate film, which contributes to the combination with the paint, cannot cover the entire surface of the tin plating layer, and the paint adhesion deteriorates. On the other hand, in the case where the P adhesion amount is more than 3.0 mg / m 2 , the adhesion of the paint is deteriorated due to the aggregation failure of the tin phosphate film itself. If the amount of P adhered is within a range of 0.1 mg / m 2 to 3.0 mg / m 2 , the coating adhesion is excellent. When used in combination with the above-mentioned tin oxide film, the coating adhesion and tin oxidation resistance are excellent. superior. However, the amount of P adhesion can be measured by surface analysis of fluorescent X-rays.

[容器用鋼板之製造方法]   作為有關本發明之容器用鋼板之製造方法,首先,將錫鍍敷鋼板浸漬於鹼性的處理液中,由錫鍍敷鋼板呈成為陽極,以適當之電量密度進行電解處理者,賦予氧化錫皮膜於錫鍍敷層之表面。接著,浸漬錫鍍敷鋼板於後述之處理液中,或浸漬於處理液中之錫鍍敷鋼板則呈成為陽極,施以電解處理。以下,對於有關本發明之容器用鋼板之製造方法進行說明。[Manufacturing method of steel plate for containers] As a method for manufacturing a steel plate for containers according to the present invention, first, a tin-plated steel plate is immersed in an alkaline treatment solution, and the tin-plated steel plate is used as an anode, with an appropriate electric density. For electrolytic treatment, a tin oxide film is applied to the surface of the tin plating layer. Next, the tin-plated steel sheet immersed in a treatment solution described later, or the tin-plated steel sheet immersed in the treatment liquid becomes an anode and is subjected to electrolytic treatment. Hereinafter, the manufacturing method of the steel plate for containers concerning this invention is demonstrated.

[前處理工程]   在有關本發明之容器用鋼板之製造方法中,於後述之磷酸錫皮膜形成工程之前,進行後述之前處理工程。前處理工程係經由對於鹼性前處理液,將錫鍍敷鋼板,呈成為陽極地進行電解處理之時,於錫鍍敷鋼板之錫鍍敷層側的表面上,形成氧化錫皮膜之工程。經由以前處理液將錫鍍敷鋼板進行陽極電解處理之時,錫鍍敷鋼板所具有之錫鍍敷層的一部分則成為含有氧化錫的氧化錫皮膜。鹼性前處理液係無特別加以限定。例如,可舉出碳酸鈉或碳酸鉀等之鹼金屬的碳酸鹽類之水溶液,氫氧化鈉或氫氧化鉀等之鹼金屬的氫氧化物類之水溶液。[Pre-treatment process] (1) In the method for manufacturing a steel sheet for a container according to the present invention, a pre-treatment process described later is performed before a tin phosphate film formation process described later. The pretreatment process is a process of forming a tin oxide film on the surface of the tin plating layer side of the tin plated steel sheet when the tin plated steel sheet is electrolytically treated as an anode with respect to an alkaline pretreatment solution. When the tin-plated steel sheet is subjected to anodic electrolytic treatment through the previous treatment solution, a part of the tin-plated layer included in the tin-plated steel sheet becomes a tin oxide film containing tin oxide. The alkaline pretreatment liquid system is not particularly limited. Examples thereof include an aqueous solution of an alkali metal carbonate such as sodium carbonate or potassium carbonate, or an aqueous solution of an alkali metal hydroxide such as sodium hydroxide or potassium hydroxide.

前處理液中之成分濃度係未特別加以限定,但從可於錫鍍敷鋼板的表面上,連續性且緻密地形成氧化錫皮膜之理由,5g/L以上30g/L以下之範圍內為佳,而10 g/L以上20g/L以下之範圍內則更佳。前處理液的pH係從可於錫鍍敷鋼板上,連續性且緻密地形成氧化錫皮膜之理由,位於8以上13以下之範圍內者為佳,而位於10以上12以下之範圍內者為更佳。在前處理工程中,實施處理時之前處理液的液溫係所形成之氧化錫皮膜量則成為適量,從更可抑制經由經時之錫氧化之理由,20℃以上60℃以下之範圍內者為佳,而30℃以上50℃以下之範圍內者為更佳。The concentration of the components in the pretreatment solution is not particularly limited, but from the reason that a tin oxide film can be continuously and densely formed on the surface of a tin-plated steel sheet, it is preferable that the range is 5 g / L or more and 30 g / L or less. , And more preferably within the range of 10 g / L to 20 g / L. The pH of the pretreatment solution is based on the reason that tin oxide film can be continuously and densely formed on tin-plated steel plates. The range of 8 to 13 is preferable, and the range of 10 to 12 is Better. In the pre-treatment process, the amount of tin oxide film formed by the liquid temperature system of the pre-treatment liquid at the time of the treatment becomes an appropriate amount. From the reason that tin oxidation over time can be more suppressed, it is within a range of 20 ° C to 60 ° C. It is preferably, and it is more preferably within a range of 30 ° C to 50 ° C.

在前處理液中的電解條件係錫鍍敷鋼板側則呈成為陽極地進行電解,但此時,對於為了作為成上述之氧化錫皮膜的量及質,係適用最佳的電量密度。最佳的電量密度的絕對值係經由整流器,鋼板,其他配線等之阻抗而產生變化之故,經由裝置而成。最佳的電量密度條件係以各條件而測定經由上述之氧化錫皮膜的還原之還原電流-電位曲線,如選擇A值則不足1.0,還原電量則成為1.5mC/cm2 以上8.0mC/cm2 以下之範圍內的電量密度即可。然而,在前處理液中的電解處理後,係因應必要而施以水洗處理亦可。The electrolytic conditions in the pretreatment solution are electrolytically performed on the side of the tin-plated steel sheet as an anode. However, at this time, the optimum electric density is applied for the amount and quality of the tin oxide film. The absolute value of the optimal electric density is changed by the device through the impedance of the rectifier, steel plate, and other wiring. The optimal electric density conditions are measured under various conditions for the reduction current-potential curve of the reduction through the above-mentioned tin oxide film. If the A value is selected, it is less than 1.0, and the reduced electric quantity is 1.5 mC / cm 2 to 8.0 mC / cm 2 It is sufficient to have a charge density within the following range. However, after the electrolytic treatment in the pretreatment liquid, a water washing treatment may be applied as necessary.

[磷酸錫皮膜形成工程]   磷酸錫皮膜形成工程係在形成氧化錫皮膜層於錫鍍敷鋼板之錫鍍敷層側的表面上之後,形成磷酸錫皮膜之工程,其中,於處理液中浸漬錫鍍敷鋼板(浸漬處理),或於浸漬之錫鍍敷鋼板,施以陽極電解處理之工程。作為處理液係可使用市售之磷酸錫處理液者。例如,可舉出Nihon Parkerizing公司製之磷酸錫處理液PF-K5102等。錫鍍敷鋼板之浸漬時間係從將P附著量確保於0.1mg/m2 以上3.0 mg/m2 以下的範圍內的點,位於1.0秒以上5.0秒以下之範圍內者為佳,而位於2.0秒以上4.0秒以下之範圍內者為更佳。[Tin phosphate film formation process] The tin phosphate film formation process is a process of forming a tin oxide film layer on the surface of the tin plating layer side of a tin plated steel sheet to form a tin phosphate film, in which tin is immersed in a treatment solution The process of anodic electrolytic plating on the plated steel plate (immersion treatment), or on the immersed tin plated steel plate. As the treatment liquid, a commercially available tin phosphate treatment liquid can be used. Examples thereof include tin phosphate treatment liquid PF-K5102 manufactured by Nihon Parkerizing. The immersion time of the tin-plated steel sheet is from the point that the P adhesion amount is kept within the range of 0.1 mg / m 2 to 3.0 mg / m 2 , and it is preferable that it is in the range of 1.0 seconds to 5.0 seconds, and is 2.0. It is more preferably within a range of from seconds to 4.0 seconds.

浸漬錫鍍敷鋼板,更加地施以陽極電解處理亦可。此情況,與僅浸漬之情況做比較,可以更短時間形成磷酸錫皮膜,對於成本上為有利。施以陽極電解處理時之電解電流密度係從將P附著量確保於0.1mg/m2 以上3.0 mg/m2 以下的範圍內的點,位於0.1A/dm2 以上10A/dm2 以下之範圍內者為佳,而位於0.5A/dm2 以上5A/dm2 以下之範圍內者為更佳。另外,電解時間係從將P附著量確保於0.1 mg/m2 以上3.0mg/m2 以下的範圍內的點,位於0.1秒以上2.0秒以下之範圍內者為佳,而位於0.2秒以上1.0秒以下之範圍內者為更佳。然而。在處理液中的浸漬或電解處理後,因應必要而以室溫至90℃的水,施以洗淨處理亦可。 [實施例]The dip-tin-plated steel sheet may be further subjected to anodic electrolytic treatment. In this case, a tin phosphate film can be formed in a shorter time as compared with the case of only dipping, which is advantageous in terms of cost. The electrolytic current density at the time of anodic electrolytic treatment is from the point of ensuring that the amount of P deposited is within a range of 0.1 mg / m 2 to 3.0 mg / m 2 , and is in a range of 0.1 A / dm 2 to 10 A / dm 2 The content within the range is preferably from 0.5 A / dm 2 to 5 A / dm 2 . In addition, the electrolysis time is from the point that the amount of P deposited is kept within the range of 0.1 mg / m 2 or more and 3.0 mg / m 2 or less, and it is preferably in the range of 0.1 seconds to 2.0 seconds, and is 0.2 seconds to 1.0. It is more preferable if it is within the range of seconds. however. After immersion in the treatment liquid or electrolytic treatment, if necessary, washing treatment may be performed with water at room temperature to 90 ° C. [Example]

以下,舉出實施例而具體地說明本發明。但本發明係並未限定於此等者。Hereinafter, the present invention will be specifically described with reference to examples. However, the present invention is not limited to these.

[錫鍍敷鋼板之製造]   首先,電解脫脂板厚0.22mm之鋼板(T4原板),使用瓦特浴,由以下表2所示之每單片之Ni附著量,形成鎳鍍敷層於兩面之後,經由在10vol.%H2 +90vol.%N2 環境中,以700℃進行退火,使鎳鍍敷擴散浸透之時而將Fe-Ni合金層(Ni含有層)形成於兩面。接著,對於具有Ni含有層於表層之鋼板而言使用錫鍍敷浴,由表2中所示之每單片之Sn附著量,形成Sn層於兩面之後,以Sn之熔點以上施以迴焊處理,將錫鍍敷層形成於T4原板的兩面。[Manufacture of tin-plated steel sheet] First, an electrolytic degreased steel sheet (T4 original sheet) with a thickness of 0.22 mm was used to form a nickel-plated layer on both sides using a Watt bath from the amount of Ni deposited per single sheet shown in Table 2 below. The Fe-Ni alloy layer (Ni-containing layer) was formed on both sides when annealing was performed at 700 ° C in a 10 vol.% H 2 +90 vol.% N 2 environment to diffuse and permeate the nickel plating. Next, for a steel plate having a Ni-containing layer on the surface layer, a tin plating bath is used. After forming the Sn layer on both sides from the Sn adhesion amount of each sheet shown in Table 2, reflow soldering is performed at a melting point of Sn or more. Processing, the tin plating layer is formed on both sides of the T4 original plate.

[皮膜之形成]   於浴溫30℃、pH為11之10g/L的碳酸鈉,或氫氧化鈉水溶液中,浸漬附有鍍敷層鋼板,由以下表2所示之前處理條件進行陽極電解處理,形成氧化錫皮膜。接著,水洗所得到之附有氧化錫皮膜鋼板,使用呈成為100g/L地添加Nihon Parkerizing公司製之磷酸錫處理液PF-K5102之60℃之處理液(溶媒:水),由以下表2所示之電解條件(電流密度,浸漬時間,電解時間)施以陽極電解處理。之後,以85℃的水洗淨所得到之附有氧化錫皮膜鋼板,經由使用送風機,以室溫使其乾燥之時,形成本發明之皮膜於鋼板的兩面。經由此,製作容器用鋼板的試驗材。之後,對於所製作之容器用鋼板的試驗材,以後述的方法而評估塗料密著性及耐錫氧化性。將評估結果彙整示於以下的表3。[Formation of film] 浸渍 Immersion in a plated steel sheet with a 10g / L sodium carbonate or a sodium hydroxide aqueous solution at a bath temperature of 30 ° C and a pH of 11, and anodizing under the pretreatment conditions shown in Table 2 below To form a tin oxide film. Next, the obtained steel sheet with a tin oxide film was washed with water, and a treatment solution (solvent: water) at 60 ° C (solvent: water) was added at 100 g / L to which tin phosphate treatment solution PF-K5102 manufactured by Nihon Parkerizing was added. The electrolytic conditions shown (current density, immersion time, and electrolysis time) were subjected to anode electrolytic treatment. Thereafter, the obtained tin oxide film-coated steel sheet was washed with water at 85 ° C. and dried at room temperature by using a blower to form the film of the present invention on both sides of the steel sheet. As a result, a test material for a steel plate for a container is produced. Then, the test material of the produced steel plate for containers was evaluated for paint adhesion and tin oxidation resistance by the method described later. The evaluation results are shown in Table 3 below.

[塗料密著性]   塗佈附著量50mg/dm2 之環氧酚系塗料於所製作之容器用鋼板的表面之後,以210℃進行10分鐘的燒付。接著,於進行上述塗佈及燒付之容器用鋼板,以截切刀切入棋盤格100方格(1方格之面積為1mm2 ),之後,進行膠帶剝離,由以下所示之評估基準而評估塗料的剝離率。實用上,評估如為◎或○,可評估為對於塗料密著性優越之構成。[Paint Adhesiveness] After applying an epoxy phenol-based coating having an adhesion amount of 50 mg / dm 2 to the surface of the steel plate for a container to be produced, it was fired at 210 ° C. for 10 minutes. Next, the steel plate for a container to be coated and fired was cut into a checkerboard grid of 100 squares (the area of one square is 1 mm 2 ) with a cutter, and thereafter, the tape was peeled off and evaluated based on the evaluation criteria shown below. Evaluate paint peeling rate. Practically, if the evaluation is ◎ or ○, it can be evaluated as a composition that is superior in coating adhesion.

◎:0.0%以上,不足10.0%(鉻酸鹽處理材同等)   ○:10.0%以上,不足60.0%   ×:60%以上:: 0.0% or more and less than 10.0% (equivalent to chromate-treated materials) ○: 10.0% or more and less than 60.0% ×: 60% or more

[耐錫氧化性]   對於製作完成之後(製作後1週以內)的容器用鋼板,以溫度50℃、相對濕度80%之環境下進行2週保管,評估其前後之鋼板表面的呈色。具體而言,使用日本電色工業公司製SQ-2000而測定b值,由以下所示之評估基準而評估Δb值(試驗後鋼板b值-試驗前鋼板b值)。並且,評估如為○,評估為對於耐錫氧化性優越之構成。[Tin oxidation resistance] After the production is completed (within 1 week after the production), the steel sheet for containers is stored under the environment of a temperature of 50 ° C and a relative humidity of 80% for 2 weeks, and the surface color of the steel sheet before and after the evaluation is evaluated. Specifically, the b value was measured using SQ-2000 manufactured by Nippon Denshoku Industries, Ltd., and the Δb value (b value of the steel sheet after the test-b value of the steel sheet before the test) was evaluated from the evaluation criteria shown below. In addition, if the evaluation is ○, it is evaluated as a composition excellent in tin oxidation resistance.

○:Δb值0.0以上,不足1.0   △:Δb值1.0以上,不足2.0   ×:Δb值2.0以上○: Δb value is 0.0 or more and less than 1.0 Δ: Δb value is 1.0 or more and less than 2.0 ×: Δb value is 2.0 or more

從表2,3所示的結果,本發明例係均確認到對於塗料密著性及耐錫氧化性優越之情況。對此,在磷酸錫皮膜的P附著量未位於0.1mg/m2 以上3.0mg/m2 以下之範圍內的比較例,或氧化錫皮膜的還原電量則較5.0 mC/cm2 為多之比較例中,塗料密著性為差。另外,在A值為1.0以上、氧化錫皮膜的還原電量則較1.5mC/cm2 為少之比較例中,耐錫氧化性為差。 [產業上之利用可能性]From the results shown in Tables 2 and 3, it was confirmed that the examples of the present invention are superior to paint adhesion and tin oxidation resistance. In contrast, in a comparative example where the amount of P deposited on the tin phosphate film is not within the range of 0.1 mg / m 2 to 3.0 mg / m 2 , or the reduction amount of the tin oxide film is larger than 5.0 mC / cm 2 In the example, the paint adhesion was poor. Further, in the comparative example in which the A value was 1.0 or more and the reduction amount of the tin oxide film was less than 1.5 mC / cm 2 , the tin oxidation resistance was poor. [Industrial possibilities]

如根據本發明,可提供對於塗料密著性及耐錫氧化性優越之容器用鋼板及其製造方法者。According to the present invention, it is possible to provide a steel sheet for a container excellent in paint adhesion and tin oxidation resistance, and a method for producing the same.

圖1係顯示存在有合金Sn之情況與未存在之情況的還原電流-電位曲線之一例的圖。   圖2係顯示峰值分離結果之一例的圖。FIG. 1 is a diagram showing an example of a reduction current-potential curve when the alloy Sn is present and when it is not present. FIG. 2 is a graph showing an example of peak separation results.

Claims (3)

一種容器用鋼板,其特徵為具有於表面具有錫鍍敷層之錫鍍敷鋼板,和形成於前述錫鍍敷層之表面上的氧化錫皮膜,和形成於前述氧化錫皮膜的表面上,作為P量為0.1mg/m2以上3.0mg/m2以下之含有磷酸錫的磷酸錫皮膜,前述氧化錫皮膜係在0.001N之溴化氫水溶液中,將電位自浸漬電位至負側進行掃描之同時,還原前述氧化錫皮膜時,於-800~-500mV vs飽和KCl-Ag/AgCl參照電極之範圍內具有還原電流峰值,後記[數1]所定義之A值則不足1.0,以自前述氧化錫皮膜之還原電流-電位曲線所計算之氧化錫皮膜之還原所需的電量則位於1.5mC/cm2以上5.0mC/cm2以下之範圍內[數1]A=Q1/Q2…(1)在此,Q1係表示具有還原電流峰值於-600~-500mV之範圍內的氧化錫皮膜之還原所需的電量,Q2係表示於比-600mV偏負側具有還原電流峰值之氧化錫皮膜之還原所需的電量。A steel sheet for a container, comprising a tin-plated steel sheet having a tin plating layer on the surface, a tin oxide film formed on the surface of the tin plating layer, and a surface of the tin oxide film, as A tin phosphate film containing tin phosphate with a P content of 0.1 mg / m 2 to 3.0 mg / m 2 or less. The tin oxide film is a 0.001 N hydrogen bromide aqueous solution, and the potential is scanned from the immersion potential to the negative side. At the same time, when reducing the aforementioned tin oxide film, there is a reduction current peak in the range of -800 ~ -500mV vs. saturated KCl-Ag / AgCl reference electrode, and the A value defined by the postscript [Number 1] is less than 1.0 in order to reduce the The amount of electricity required for the reduction of the tin oxide film calculated from the reduction current-potential curve of the tin film is within the range of 1.5 mC / cm 2 to 5.0 mC / cm 2 [Number 1] A = Q 1 / Q 2 … ( 1) Here, Q 1 represents the amount of electricity required for the reduction of tin oxide films with a reduction current peak in the range of -600 to -500 mV, and Q 2 represents the oxidation with a reduction current peak on the negative side of -600 mV. The amount of electricity required to restore the tin film. 一種容器用鋼板的製造方法,其特徵為經由在pH位於8以上13以下之範圍內的水溶液中,將於表面具有錫鍍敷層之錫鍍敷鋼板,作為陽極,施以電解處理,於前述錫鍍敷層之表面上,形成氧化錫皮膜,再進行水洗,接著於磷酸鹽水溶液中,將錫鍍敷鋼板進行1.0秒以上5.0秒以下浸漬,於前述氧化錫皮膜之表面上,形成磷酸錫皮膜,製造容器用鋼板。A method for manufacturing a steel sheet for a container, characterized in that an electrolytic solution is applied to a tin-plated steel sheet having a tin plating layer on its surface through an aqueous solution having a pH in the range of 8 to 13 inclusive. A tin oxide film is formed on the surface of the tin plating layer, and then washed with water. Then, the tin plated steel plate is immersed in a phosphate aqueous solution for 1.0 to 5.0 seconds, and tin phosphate is formed on the surface of the tin oxide film. Coating to produce steel plates for containers. 一種容器用鋼板的製造方法,其特徵為經由在pH位於8以上13以下之範圍內的水溶液中,將於表面具有錫鍍敷層之錫鍍敷鋼板,作為陽極,施以電解處理,於前述錫鍍敷層之表面上,形成氧化錫皮膜,再進行水洗,接著於磷酸鹽水溶液中,將錫鍍敷鋼板作為陽極而施以0.1A/dm2以上10A/dm2、0.1秒以上2.0秒以下之電解處理,於氧化錫皮膜之表面上,形成磷酸錫皮膜,製造容器用鋼板。A method for manufacturing a steel sheet for a container, characterized in that an electrolytic solution is applied to a tin-plated steel sheet having a tin plating layer on its surface through an aqueous solution having a pH in the range of 8 to 13 inclusive. On the surface of the tin plating layer, a tin oxide film is formed, and then washed with water. Then, in a phosphate aqueous solution, a tin plated steel plate is used as an anode, and is applied at 0.1 A / dm 2 to 10 A / dm 2 for 0.1 seconds to 2.0 seconds. The following electrolytic treatment forms a tin phosphate film on the surface of the tin oxide film to manufacture a steel sheet for a container.
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