TWI674703B - Wide beam high gain array antenna - Google Patents

Wide beam high gain array antenna Download PDF

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TWI674703B
TWI674703B TW107120369A TW107120369A TWI674703B TW I674703 B TWI674703 B TW I674703B TW 107120369 A TW107120369 A TW 107120369A TW 107120369 A TW107120369 A TW 107120369A TW I674703 B TWI674703 B TW I674703B
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substrate
metal
antenna
array antenna
patch antenna
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TW202002406A (en
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金國生
李仲益
葉昱辰
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長庚大學
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Abstract

本發明提供了一種寬波束高增益陣列天線,包括一第一基板、一接地層以及一第二基板。該第一基板、接地層以及第二基板為層疊結構,該第一基板的一表面上設置有饋電網路層,該第二基板的一表面上設置有主貼片天線以及寄生貼片天線。其中,該主貼片天線包括一第一金屬貫孔,該第一金屬貫孔貫穿該第一基板、該接地層以及該第二基板並與該饋電網路層電訊連接;該等寄生貼片天線各自包括一第二金屬貫孔,該第二金屬貫孔貫穿該第二基板並與該接地層電訊連接。本發明利用具有金屬貫孔的寄生貼片天線輔助主貼片天線,使兩種場型疊加使波束寬度增加,可有效改善天線波束寬度不足之問題,並符合車用天線波束寬度的需求。The invention provides a wide-beam high-gain array antenna including a first substrate, a ground layer, and a second substrate. The first substrate, the ground layer, and the second substrate have a laminated structure. A feeding network layer is disposed on one surface of the first substrate, and a main patch antenna and a parasitic patch antenna are disposed on one surface of the second substrate. Wherein, the main patch antenna includes a first metal through-hole, the first metal through-hole penetrates the first substrate, the ground layer, and the second substrate and is electrically connected to the feeding network layer; the parasitic patches The antennas each include a second metal through-hole that penetrates the second substrate and is electrically connected to the ground layer. The present invention utilizes a parasitic patch antenna with a metal through-hole to assist the main patch antenna, and superimposes two field types to increase the beam width, which can effectively improve the problem of insufficient antenna beam width, and meets the requirements of automotive antenna beam width.

Description

寬波束高增益陣列天線Wide beam high gain array antenna

本發明之技術涉及天線領域,特別是指一種具有寬波束高增益的防撞雷達陣列天線。The technology of the present invention relates to the field of antennas, and particularly to an anti-collision radar array antenna with a wide beam and high gain.

隨時代發展與社會進步,汽車數量日益增多,交通事故也增加,而人們對車輛安全也更加重視。讓車輛具有碰撞預警或主動避撞之功能,可有效降低事故和提升車輛安全,因此汽車前向碰撞預警系統(Forward collision warning systems,FCWS)、前向主動避撞系統(Forward collision avoidance systems,FCAS)、自適應性巡航控制系統(Adaptive cruise control,ACC)等車輛安全技術近年發展迅速 。上述系統共同點為透過車用防撞雷達測量主車與目標車間距離、相對速度及相對方位角等資料,將其傳送給控制系統。近年來,先進駕駛輔助系統(Advanced driver assistance systems;ADAS)逐漸成為車廠積極發展的智慧車輛技術之一,目前ADAS為最主要偵測領域,包括車前、車側及車後可導入攝影鏡頭、微波雷達或雷射雷達等感測器,擷取即時道路資訊協助駕駛判斷。With the development of the times and social progress, the number of cars is increasing, traffic accidents are increasing, and people pay more attention to vehicle safety. Give the vehicle a collision warning or active collision avoidance function, which can effectively reduce accidents and improve vehicle safety. Therefore, the vehicle's forward collision warning systems (FCWS), forward collision avoidance systems (FCAS) ), Adaptive cruise control (ACC) and other vehicle safety technologies have developed rapidly in recent years. The common point of the above systems is to measure the distance, relative speed, and relative azimuth between the host vehicle and the target workshop through the vehicle collision avoidance radar, and transmit it to the control system. In recent years, advanced driver assistance systems (ADAS) have gradually become one of the smart vehicle technologies actively developed by car manufacturers. At present, ADAS is the most important detection field, including the introduction of photographic lenses in the front, side and rear of the vehicle, Sensors such as microwave radar or laser radar capture real-time road information to assist driving judgment.

車用防撞雷達多使用微帶貼片天線作為偵測車間距離及方向之感測器,然而其貼片單元天線之增益約為 4~7 dBi,且其波束寬度多為 70°~90°之間,相較於理想增益10 dBi以及理想波束寬度120°仍顯不足,故在電性上有增益不足以及波束寬度不足之缺點。為了改善上述之缺點,目前已有文獻提出利用陣列天線(Antenna array)來提高增益,另一方面可使用寄生元件來增寬波束寬度。又或者利用較低之介電常數板材、減小接地面或增加基板大小以到增寬波束,然而將接地面縮小或增加基板面積也會減小增益。若在接地面下方加金屬介面牆,可透過影響主貼片周圍場分佈來增寬波束,但此方法需額外加工,因此會增加製作成本與天線尺寸。是以,目前車用防撞雷達天線之設計,仍具有可改良之空間。Automotive anti-collision radar mostly uses microstrip patch antennas as sensors to detect the distance and direction in the workshop. However, the gain of the patch unit antenna is about 4 ~ 7 dBi, and its beam width is mostly 70 ° ~ 90 ° Compared with the ideal gain of 10 dBi and the ideal beam width of 120 °, it is still insufficient, so it has the disadvantages of insufficient gain and insufficient beam width in terms of electrical properties. In order to improve the above-mentioned shortcomings, existing literature has proposed the use of an antenna array (Antenna array) to increase the gain, and on the other hand, a parasitic element can be used to widen the beam width. Or use a lower dielectric constant plate, reduce the ground plane, or increase the substrate size to widen the beam. However, reducing the ground plane or increasing the substrate area will also reduce the gain. If a metal interface wall is added below the ground plane, the beam can be widened by affecting the field distribution around the main patch, but this method requires additional processing, which will increase the production cost and antenna size. Therefore, the current design of anti-collision radar antennas for vehicles still has room for improvement.

本發明之主要目的係提供一種寬波束高增益陣列天線,可有效改善天線波束寬度不足之問題,並符合車用天線波束寬度的需求。為了達到上述目的,本發明係採取以下之技術手段予以達成,其中,本發明提供一種寬波束高增益陣列天線,包括:一第一基板、一饋電網路層、一接地層、一第二基板、至少一主貼片天線以及複數個寄生貼片天線。該饋電網路層設置於該第一基板的一表面上,用以與一信號源電訊連接。該接地層設置於該第一基板的另一表面上,該第二基板其一表面與該接地層相連接。主貼片天線設置於該第二基板的另一表面上,該等寄生貼片天線設置於該主貼片天線的兩側,並與該主貼片天線相距一第一距離。其中,該主貼片天線包括一第一金屬貫孔,該第一金屬貫孔貫穿該第一基板、該接地層以及該第二基板,並分別與該饋電網路層以及該主貼片天線電訊連接,該等寄生貼片天線各自包括一第二金屬貫孔,該第二金屬貫孔貫穿該第二基板,並分別與該接地層以及該寄生貼片天線電訊連接。The main purpose of the present invention is to provide a wide-beam high-gain array antenna, which can effectively improve the problem of insufficient antenna beam width, and meets the requirements of automotive antenna beam width. In order to achieve the above object, the present invention adopts the following technical means to achieve it. Among them, the present invention provides a wide beam high gain array antenna including: a first substrate, a feeding network layer, a ground layer, and a second substrate. , At least one main patch antenna and a plurality of parasitic patch antennas. The feeding network layer is disposed on a surface of the first substrate and is used for telecommunication connection with a signal source. The ground layer is disposed on the other surface of the first substrate, and one surface of the second substrate is connected to the ground layer. The main patch antenna is disposed on the other surface of the second substrate, and the parasitic patch antennas are disposed on both sides of the main patch antenna and a first distance from the main patch antenna. The main patch antenna includes a first metal through-hole, the first metal through-hole penetrates the first substrate, the ground layer, and the second substrate, and is respectively connected to the feeding network layer and the main patch antenna. For telecommunication connection, each of the parasitic patch antennas includes a second metal through-hole, the second metal through-hole penetrates the second substrate, and is electrically connected to the ground layer and the parasitic patch antenna, respectively.

在本發明較佳實施例中,該主貼片天線以及該等寄生貼片天線沿著一第一方向排列設置於該第二基板上。In a preferred embodiment of the present invention, the main patch antenna and the parasitic patch antennas are arranged on the second substrate along a first direction.

在本發明較佳實施例中,該主貼片天線以及該等寄生貼片天線的形狀為矩形。In a preferred embodiment of the present invention, the shape of the main patch antenna and the parasitic patch antennas are rectangular.

在本發明較佳實施例中,所述主貼片天線與所述寄生貼片天線為陣列式排列,每一個所述主貼片天線的兩側分別包括兩個所述寄生貼片天線。In a preferred embodiment of the present invention, the main patch antenna and the parasitic patch antenna are arranged in an array, and two sides of each of the main patch antennas respectively include two of the parasitic patch antennas.

在本發明較佳實施例中,該第一金屬貫孔為一中空金屬圓柱。In a preferred embodiment of the present invention, the first metal through hole is a hollow metal cylinder.

在本發明較佳實施例中,該第二金屬貫孔為一中空金屬圓柱。In a preferred embodiment of the present invention, the second metal through hole is a hollow metal cylinder.

在本發明較佳實施例中,該陣列天線包括複數個主貼片天線,每一個所述主貼片天線旁皆具有四個所述寄生貼片天線。In a preferred embodiment of the present invention, the array antenna includes a plurality of main patch antennas, and each of the main patch antennas has four of the parasitic patch antennas.

在本發明較佳實施例中,該饋電網路層包括複數條金屬線路、一阻抗轉換器、一功分器以及一信號源端線路。In a preferred embodiment of the present invention, the feeding network layer includes a plurality of metal lines, an impedance converter, a power divider, and a signal source end line.

在本發明較佳實施例中,該等金屬線路一端分別與該等第一金屬貫孔電訊連接,該阻抗轉換器一端與該等金屬線路的另一端電訊連接,該功分器一端與該阻抗轉換器的另一端電訊連接,該信號源端線路分別與該功分器的另一端以及該信號源電訊連接。In a preferred embodiment of the present invention, one end of the metal lines is connected to the first metal through-hole telecommunications, one end of the impedance converter is connected to the other end of the metal lines, and one end of the power divider is connected to the impedance. The other end of the converter is connected by telecommunications, and the signal source end line is connected with the other end of the power divider and the signal source by telecommunications.

在本發明較佳實施例中,該等金屬線路的線路寬度為0.5毫米,該阻抗轉換器的線路寬度為2毫米,該功分器的線路寬度為1.8毫米,該信號源端線路的寬度為0.5毫米。In a preferred embodiment of the present invention, the line width of the metal lines is 0.5 mm, the line width of the impedance converter is 2 mm, the line width of the power divider is 1.8 mm, and the width of the signal source side line is 0.5 mm.

本發明所採用之技術手段及構造,茲繪圖就本發明實施例詳加說明其特徵與功能如下,但須注意的是,所述內容不構成本發明的限定。The technical means and structure adopted in the present invention are described in detail below with reference to the embodiments of the present invention. The features and functions are as follows, but it should be noted that the content does not limit the present invention.

請同時參閱圖1、圖2及圖3所示, 其為本發明寬波束高增益陣列天線較佳實施例之結構示意圖、剖面示意圖以及與局部放大示意圖。本發明提供一種寬波束高增益陣列天線,包括:一第一基板 1、一饋電網路層 2、一接地層 3、一第二基板 4、至少一主貼片天線 5以及複數個寄生貼片天線 6。Please refer to FIG. 1, FIG. 2 and FIG. 3 at the same time, which are structural schematic diagrams, cross-sectional schematic diagrams, and partial enlarged schematic diagrams of the preferred embodiment of the wide beam high gain array antenna of the present invention. The invention provides a wide-beam high-gain array antenna, which includes a first substrate 1, a feeding network layer 2, a ground layer 3, a second substrate 4, at least one main patch antenna 5, and a plurality of parasitic patches. Antenna 6.

該第一基板 1為具有低介電常數、低損耗因子,頻率和溫度穩定等優點之層壓基板,適合作為貼片天線、饋電網路的乘載板。The first substrate 1 is a laminated substrate having the advantages of low dielectric constant, low loss factor, stable frequency and temperature, etc., and is suitable as a carrier plate for a patch antenna and a feeding network.

該饋電網路層 2設置於該第一基板 1的一表面 11上,該接地層 3設置於該第一基板 1的另一表面上,該第二基板 4一表面與該接地層 3相連接。本發明的陣列天線為雙層基板結構,並在第一基板 1以及第二基板 4之間設置有金屬接地層。The feeding network layer 2 is disposed on one surface 11 of the first substrate 1, the ground layer 3 is disposed on the other surface of the first substrate 1, and one surface of the second substrate 4 is connected to the ground layer 3 . The array antenna of the present invention has a double-layer substrate structure, and a metal ground layer is provided between the first substrate 1 and the second substrate 4.

該主貼片天線 5設置於該第二基板 4的另一表面 41上,每一個該主貼片天線 5各自包括一第一金屬貫孔 51,該第一金屬貫孔 51貫穿該第一基板 1、該接地層 3以及該第二基板 4,並分別與該饋電網路層 2以及該主貼片天線 5電訊連接。該第一金屬貫孔 51為一中空金屬圓柱或一實心金屬圓柱,其貫通該第一基板 1、該接地層 3以及該第二基板 4與該饋電網路層 2電訊連接,以傳輸陣列天線的感應訊號。本發明並未限定該第一金屬貫孔 51與該主貼片天線 5的相對位置關係,其可連接於該主貼片天線 5的中央,然而考慮到輻射邊緣之相互耦合效應,該第一金屬貫孔 51的位置會影響到輸入阻抗,因此亦可調整該第一金屬貫孔 51之位置來達到所需之輸入阻抗。The main patch antenna 5 is disposed on the other surface 41 of the second substrate 4. Each of the main patch antennas 5 includes a first metal through-hole 51, and the first metal through-hole 51 penetrates the first substrate. 1. The ground layer 3 and the second substrate 4 are electrically connected to the feeding network layer 2 and the main patch antenna 5, respectively. The first metal through-hole 51 is a hollow metal cylinder or a solid metal cylinder, which penetrates the first substrate 1, the ground layer 3, and the second substrate 4 and is electrically connected to the feeding network layer 2 to transmit the array antenna. Signal. The present invention does not limit the relative positional relationship between the first metal through-hole 51 and the main patch antenna 5, and it can be connected to the center of the main patch antenna 5. However, considering the mutual coupling effect of the radiation edges, the first The position of the metal through hole 51 will affect the input impedance, so the position of the first metal through hole 51 can also be adjusted to achieve the required input impedance.

請更加參閱圖4及5所示,其為本發明寬波束高增益陣列天線較佳實施例之饋電網路層示意圖以及貼片天線示意圖。在本發明一實施例中,該陣列天線包括複數個主貼片天線 5,每一個所述主貼片天線 5旁皆具有四個所述寄生貼片天線 6,而該饋電網路層 2包括複數條金屬線路 21、一阻抗轉換器 22、一功分器 23以及一信號源端線路 24。該等金屬線路 21一端分別與該等第一金屬貫孔 51電訊連接,該阻抗轉換器 22一端與該等金屬線路 21的另一端電訊連接,該功分器 23一端與該阻抗轉換器 22的另一端電訊連接,該信號源端線路 24分別與該功分器 23的另一端以及該信號源電訊連接。較佳者,該等金屬線路 21的線路寬度為0.5毫米,該阻抗轉換器 22的線路寬度為2毫米,該功分器 23的線路寬度為1.8毫米,該信號源端線路 24的寬度為0.5毫米。本發明之饋電網路層 2採用串併聯饋電網路方式連接,該等金屬線路 21、阻抗轉換器 22以及該等第一金屬貫孔 51採用併聯方式連接;信號源、信號源端線路 24、功分器 23之間採用串聯方式連接。Please refer to FIGS. 4 and 5, which are schematic diagrams of a feeding network layer and a patch antenna of a preferred embodiment of a wide beam high gain array antenna according to the present invention. In an embodiment of the present invention, the array antenna includes a plurality of main patch antennas 5, each of the main patch antennas 5 has four parasitic patch antennas 6, and the feeding network layer 2 includes The plurality of metal lines 21, an impedance converter 22, a power divider 23, and a signal source end line 24. One end of the metal lines 21 is electrically connected to the first metal through holes 51, one end of the impedance converter 22 is electrically connected to the other end of the metal lines 21, and one end of the power divider 23 is connected to the impedance converter 22. The other end is connected by telecommunications, and the signal source end line 24 is connected with the other end of the power divider 23 and the signal source by telecommunications. Preferably, the line width of the metal lines 21 is 0.5 mm, the line width of the impedance converter 22 is 2 mm, the line width of the power divider 23 is 1.8 mm, and the width of the signal source line 24 is 0.5. Mm. The feed network layer 2 of the present invention is connected in a series-parallel feed network. The metal lines 21, the impedance converter 22, and the first metal through holes 51 are connected in parallel. The signal source, the signal source end line 24, The power dividers 23 are connected in series.

該寄生貼片天線 6與主貼片天線 5位於同一層介質上,用以增加主貼片天線 5之頻寬與增益。該寄生貼片天線 6藉由鄰近主貼片來耦合能量輻射,由於防撞雷達天線所需之波束寬度相當寬,為進一步增加陣列天線之波束寬度,將寄生貼片天線 6設置於主貼片天線 5的兩側,使寄生元件之電流相位與主貼片天線 5相反,並產生抵消作用,藉以減小有效輻射孔徑,同時使波束之寬度增加。The parasitic patch antenna 6 and the main patch antenna 5 are located on the same layer of medium to increase the bandwidth and gain of the main patch antenna 5. The parasitic patch antenna 6 couples energy radiation by being adjacent to the main patch. Since the beam width required by the anti-collision radar antenna is quite wide, in order to further increase the beam width of the array antenna, the parasitic patch antenna 6 is set on the main patch. On both sides of the antenna 5, the current phase of the parasitic element is opposite to that of the main patch antenna 5, and a canceling effect is generated, thereby reducing the effective radiation aperture and increasing the beam width.

該等寄生貼片天線 6各自包括一第二金屬貫孔 61,該等第二金屬貫孔 61貫穿該第二基板 4,並分別與該接地層 3以及其中一個該寄生貼片天線 6電訊連接,其中該第二金屬貫孔 61為一中空金屬圓柱或一實心金屬圓柱。Each of the parasitic patch antennas 6 includes a second metal through-hole 61 that penetrates the second substrate 4 and is electrically connected to the ground layer 3 and one of the parasitic patch antennas 6 respectively. The second through-hole 61 is a hollow metal cylinder or a solid metal cylinder.

在本發明一實施例中,該等第二金屬貫孔 61之位置設計於該等寄生貼片天線 6之中間處,半徑為 0.2 mm,高度與該第二基板 4的厚度相同。In one embodiment of the present invention, the positions of the second metal through-holes 61 are designed in the middle of the parasitic patch antennas 6 with a radius of 0.2 mm and the same height as the thickness of the second substrate 4.

在本實施例中,該主貼片天線 5以及該等寄生貼片天線 6的形狀為矩形,但不限於此。本發明並無限制該主貼片天線 5的數量,為了提昇陣列天線的整體增益,可以依照實際需求增加該主貼片天線 5的數量,例如四個、八個等等。於本較佳實施例中,陣列天線包括八個主貼片天線 5,每一個主貼片天線 5旁皆具有四個寄生貼片天線 6。該等主貼片天線 5以及該等寄生貼片天線 6沿著一第一方向排列設置於該第二基板 4上,所述主貼片天線 5與所述寄生貼片天線 6為陣列式排列,每一個所述主貼片天線 5的兩側分別包括兩個所述寄生貼片天線 6,較佳者,該等寄生貼片天線 6沿著該第一方向排列於該主貼片天線 5的兩側。該主貼片天線 5與等寄生貼片天線 6相距一水平間距 d 1,而位於同一側的兩寄生貼片天線 6之間相距一間距 d 2。由於頻率響應程度會隨著水平間距 d 1大小而變化,當水平間距 d 1越小則耦合會較強,可得到較佳的阻抗匹配,反之則較差。 In this embodiment, the shapes of the main patch antenna 5 and the parasitic patch antennas 6 are rectangular, but are not limited thereto. The present invention does not limit the number of the main patch antennas 5, in order to improve the overall gain of the array antenna, the number of the main patch antennas 5 can be increased according to actual needs, such as four, eight, and so on. In the preferred embodiment, the array antenna includes eight main patch antennas 5, and each main patch antenna 5 has four parasitic patch antennas 6. The main patch antennas 5 and the parasitic patch antennas 6 are arranged on the second substrate 4 along a first direction. The main patch antennas 5 and the parasitic patch antennas 6 are arrayed. Each side of each of the main patch antennas 5 includes two of the parasitic patch antennas 6, preferably, the parasitic patch antennas 6 are arranged along the first direction on the main patch antenna 5. On both sides. The main patch antenna 5 and the isoparasitic patch antenna 6 are separated by a horizontal distance d 1 , and the two parasitic patch antennas 6 on the same side are separated by a distance d 2 . Because the frequency response degree changes with the horizontal distance d 1 , the smaller the horizontal distance d 1 is, the stronger the coupling is, and a better impedance matching can be obtained, otherwise it is worse.

值得一提的是,該寄生貼片天線 6的長度 L及寬度 W對共振頻率以及阻抗匹配有明顯影響,當長度越大會往低頻移動,反之則往高頻移動。當共振頻率決定之後,可透過調整該寄生貼片天線 6的寬度來做阻抗匹配。It is worth mentioning that the length L and width W of the parasitic patch antenna 6 have a significant impact on the resonance frequency and impedance matching. When the length is larger, it will move to low frequencies, and vice versa. After the resonance frequency is determined, impedance matching can be performed by adjusting the width of the parasitic patch antenna 6.

請參閱圖6及7所示,其分別為本發明寬波束高增益陣列天線之S11(回波損耗,Return loss)頻率響應圖以及輻射場型圖。根據S11頻率響應圖可看出模擬與量測之中心頻率分別位於 24 GHz 及 23.7 GHz,量測結果顯示頻率傾向於低頻,模擬與量測比例頻寬分別為 16.2%及 16.9%。根據輻射場型圖亦可看出量測增益值約為 11 dBi,E-plane 量測波束寬度約為 150°、H-plane 量測波束寬度約為 10°,符合車用天線波束寬度的需求。Please refer to FIGS. 6 and 7, which are S11 (Return Loss) frequency response diagrams and radiation field diagrams of the wide beam high gain array antenna of the present invention, respectively. According to the S11 frequency response diagram, it can be seen that the center frequencies of the simulation and measurement are located at 24 GHz and 23.7 GHz, respectively. The measurement results show that the frequency tends to be low, and the analog and measurement ratio bandwidths are 16.2% and 16.9%, respectively. According to the radiation field pattern, it can also be seen that the measured gain value is about 11 dBi, the E-plane measurement beam width is about 150 °, and the H-plane measurement beam width is about 10 °, which meets the requirements of automotive antenna beam width. .

綜上所述,本發明提供的一種寬波束高增益陣列天線,其設置具有金屬貫孔的寄生貼片天線輔助主貼片天線,並與串併聯饋線網路結合組成天線陣列,利用兩種貼片天線場型疊加使波束寬度增加,可有效改善天線波束寬度不足之問題,並符合車用天線波束寬度的需求。In summary, a wide beam high gain array antenna provided by the present invention is provided with a parasitic patch antenna with metal through holes to assist the main patch antenna, and is combined with a series-parallel feeder network to form an antenna array. The superposition of the patch antenna field pattern increases the beam width, which can effectively improve the problem of insufficient antenna beam width, and meets the requirements of automotive antenna beam width.

以上所述僅為本發明的實施例,並非因此限制本發明的實施方式及保護範圍,對於本領域技術人員而言,應當能夠意識到凡運用本發明說明書及圖示內容所作出的等同替換和顯而易見的變化所得到的方案,均應當包含在本發明的保護範圍內。The above descriptions are only examples of the present invention, and thus do not limit the implementation and protection scope of the present invention. For those skilled in the art, they should be able to realize that equivalent substitutions and Obvious changes should be included in the protection scope of the present invention.

1‧‧‧第一基板1‧‧‧ the first substrate

2‧‧‧饋電網路層2‧‧‧Feed network layer

21‧‧‧金屬線路21‧‧‧Metal circuit

22‧‧‧阻抗轉換器22‧‧‧Impedance Converter

23‧‧‧功分器23‧‧‧ Power Divider

24‧‧‧信號源端線路24‧‧‧Signal source line

3‧‧‧接地層3‧‧‧ ground plane

4‧‧‧第二基板4‧‧‧ second substrate

5‧‧‧主貼片天線5‧‧‧Main patch antenna

51‧‧‧第一金屬貫孔51‧‧‧The first metal through hole

6‧‧‧寄生貼片天線6‧‧‧ Parasitic patch antenna

61‧‧‧第二金屬貫孔61‧‧‧Second metal through hole

11, 41‧‧‧表面11, 41‧‧‧ surface

d 1‧‧‧水平間距d 1 ‧‧‧horizontal spacing

d 2‧‧‧間距d 2 ‧‧‧ pitch

L‧‧‧長度L‧‧‧ length

W‧‧‧寬度W‧‧‧Width

圖1為本發明寬波束高增益陣列天線較佳實施例之結構示意圖。 圖2為本發明寬波束高增益陣列天線較佳實施例之剖面示意圖。 圖3為本發明寬波束高增益陣列天線較佳實施例之局部放大示意圖。 圖4為本發明寬波束高增益陣列天線較佳實施例之饋電網路層示意圖。 圖5為本發明寬波束高增益陣列天線較佳實施例之貼片天線示意圖。 圖6為本發明寬波束高增益陣列天線較佳實施例之S11頻率響應圖。 圖7為本發明寬波束高增益陣列天線較佳實施例之輻射場型圖。FIG. 1 is a schematic structural diagram of a preferred embodiment of a wide beam high gain array antenna according to the present invention. FIG. 2 is a schematic cross-sectional view of a preferred embodiment of a wide beam high gain array antenna according to the present invention. FIG. 3 is a partially enlarged schematic diagram of a preferred embodiment of a wide beam high gain array antenna according to the present invention. FIG. 4 is a schematic diagram of a feeding network layer of a preferred embodiment of a wide beam high gain array antenna according to the present invention. FIG. 5 is a schematic diagram of a patch antenna according to a preferred embodiment of the wide beam high gain array antenna of the present invention. FIG. 6 is an S11 frequency response diagram of a preferred embodiment of the wide beam high gain array antenna of the present invention. FIG. 7 is a radiation pattern diagram of a preferred embodiment of a wide beam high gain array antenna according to the present invention.

Claims (9)

一種寬波束高增益陣列天線,包括:一第一基板;一饋電網路層,設置於該第一基板的一表面上,用以與一信號源電訊連接,其中該饋電網路層包括複數條金屬線路,且該金屬線路的線路寬度為0.5毫米,該阻抗轉換器的線路寬度為2毫米,該功分器的線路寬度為1.8毫米,該信號源端線路的寬度為0.5毫米;一接地層,設置於該第一基板的另一表面上;一第二基板,其一表面與該接地層相連接;至少一主貼片天線,設置於該第二基板的另一表面上;以及複數個寄生貼片天線,設置於該主貼片天線的兩側,並與該主貼片天線相距一第一距離;其中,該主貼片天線包括一第一金屬貫孔,該第一金屬貫孔貫穿該第一基板、該接地層以及該第二基板,並分別與該饋電網路層以及該主貼片天線電訊連接,該等寄生貼片天線各自包括一第二金屬貫孔,該第二金屬貫孔貫穿該第二基板,並分別與該接地層以及該寄生貼片天線電訊連接。 A wide-beam high-gain array antenna includes a first substrate and a feeding network layer disposed on a surface of the first substrate for telecommunication connection with a signal source. The feeding network layer includes a plurality of bars. A metal line, and the line width of the metal line is 0.5 mm, the line width of the impedance converter is 2 mm, the line width of the power divider is 1.8 mm, and the width of the signal source side line is 0.5 mm; a ground plane Is disposed on the other surface of the first substrate; a second substrate having a surface connected to the ground layer; at least one main patch antenna is disposed on the other surface of the second substrate; and a plurality of Parasitic patch antennas are disposed on both sides of the main patch antenna and are at a first distance from the main patch antenna; wherein the main patch antenna includes a first metal through-hole, the first metal through-hole The first substrate, the ground layer, and the second substrate pass through and are electrically connected to the feeding network layer and the main patch antenna, respectively. The parasitic patch antennas each include a second metal through hole, and the second Metal through hole The second substrate passes through the second substrate and is electrically connected to the ground layer and the parasitic patch antenna, respectively. 如申請專利範圍第1項所述的寬波束高增益陣列天線,其中該主貼片天線以及該等寄生貼片天線沿著一第一方向排列設置於該第二基板上。 The wide-beam high-gain array antenna according to item 1 of the patent application scope, wherein the main patch antenna and the parasitic patch antennas are arranged on the second substrate along a first direction. 如申請專利範圍第1項所述的寬波束高增益陣列天線,其中該主貼片天線以及該等寄生貼片天線的形狀為矩形。 The wide beam high gain array antenna according to item 1 of the scope of patent application, wherein the shape of the main patch antenna and the parasitic patch antennas are rectangular. 如申請專利範圍第1項所述的寬波束高增益陣列天線,其中所 述主貼片天線與所述寄生貼片天線為陣列式排列,每一個所述主貼片天線的兩側分別包括兩個所述寄生貼片天線。 The wide-beam high-gain array antenna according to item 1 of the patent application range, wherein The main patch antenna and the parasitic patch antenna are arranged in an array, and two sides of each main patch antenna include two of the parasitic patch antennas respectively. 如申請專利範圍第1項所述的寬波束高增益陣列天線,其中該第一金屬貫孔為一中空金屬圓柱或一實心金屬圓柱。 The wide-beam high-gain array antenna according to item 1 of the patent application scope, wherein the first metal through-hole is a hollow metal cylinder or a solid metal cylinder. 如申請專利範圍第1項所述的寬波束高增益陣列天線,其中該第二金屬貫孔為一中空金屬圓柱或一實心金屬圓柱。 The wide-beam high-gain array antenna according to item 1 of the patent application scope, wherein the second metal through-hole is a hollow metal cylinder or a solid metal cylinder. 如申請專利範圍第1項所述的寬波束高增益陣列天線,其中該陣列天線包括複數個主貼片天線,每一個所述主貼片天線旁皆具有四個所述寄生貼片天線。 The wide beam high gain array antenna according to item 1 of the patent application scope, wherein the array antenna includes a plurality of main patch antennas, and each of the main patch antennas has four of the parasitic patch antennas. 如申請專利範圍第7項所述的寬波束高增益陣列天線,其中該饋電網路層另包括一阻抗轉換器、一功分器以及一信號源端線路。 The wide beam high gain array antenna according to item 7 of the patent application scope, wherein the feeding network layer further includes an impedance converter, a power divider, and a signal source end line. 如申請專利範圍第8項所述的寬波束高增益陣列天線,其中該等金屬線路一端分別與該等第一金屬貫孔電訊連接,該阻抗轉換器一端與該等金屬線路的另一端電訊連接,該功分器一端與該阻抗轉換器的另一端電訊連接,該信號源端線路分別與該功分器的另一端以及該信號源電訊連接。 The wide-beam high-gain array antenna according to item 8 of the scope of the patent application, wherein one end of the metal lines is connected to the first metal through-hole telecommunications, and one end of the impedance converter is connected to the other end of the metal lines. One end of the power divider is electrically connected to the other end of the impedance converter, and the signal source line is connected to the other end of the power divider and the signal source.
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CN112803148A (en) * 2019-11-13 2021-05-14 Tdk株式会社 Antenna device and circuit board having the same
CN114784495A (en) * 2022-05-11 2022-07-22 南通至晟微电子技术有限公司 Millimeter wave wide bandwidth wave beam patch antenna

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CN117423994A (en) * 2023-12-15 2024-01-19 北京木牛领航科技有限公司 Millimeter wave radar antenna meeting specific airspace coverage requirement

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112803148A (en) * 2019-11-13 2021-05-14 Tdk株式会社 Antenna device and circuit board having the same
CN112803148B (en) * 2019-11-13 2023-04-11 Tdk株式会社 Antenna device and circuit board having the same
CN114784495A (en) * 2022-05-11 2022-07-22 南通至晟微电子技术有限公司 Millimeter wave wide bandwidth wave beam patch antenna

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