TWI672508B - Probe card device - Google Patents

Abstract

The invention discloses a probe card device, which comprises a flat signal switching structure and a plurality of conductive probes inserted in the flat signal switching structure. The flat panel signal transfer structure comprises an transfer carrier board and a positioning cover. The transfer carrier board is recessed from the board surface with a receiving slot and includes a plurality of signal lines, and each signal line forms a signal contact at the bottom of the receiving slot. The transfer carrier portion surrounding the receiving slot is defined as a support portion. The positioning cover is formed with a plurality of perforations, and the positioning cover is disposed on the supporting portion, so that the positioning cover and the receiving groove of the transfer carrier jointly surround and define a receiving space. Accordingly, the present invention provides a probe card device that is distinct from the prior art.

Description

Probe card device

The present invention relates to a probe card, and more particularly to a probe card device.

The existing probe card comprises a probe holder, a plurality of probes penetrating the probe holder, and an adapter carrier separated from the probe holder and abutting the plurality of probes. Wherein, the probe base comprises two guide plates, and two end portions of each probe respectively pass through the two guide plates of the probe base, so that one end portion of each probe can abut against the The transfer carrier is described, and the other end of each probe is used to detect an object to be tested (eg, a wafer).

However, the architecture of the above existing probe card has been in existence for many years, and the research of the probe card by those skilled in the art has not been able to break away from the above existing architecture, thereby making the development direction of the existing probe card invisibly Limitations and difficulties in making significant advances and advances in existing probe cards.

Accordingly, the inventors believe that the above-mentioned defects can be improved, and that the invention has been studied with great interest and with the use of scientific principles, and finally proposes a present invention which is rational in design and effective in improving the above-mentioned defects.

Embodiments of the present invention provide a probe card device that can effectively improve defects that may be generated by an existing probe card.

The embodiment of the invention discloses a probe card device, comprising: a flat-plate adapter structure, comprising: an transfer carrier board having a first board surface and a second board surface on opposite sides, the transfer load The board is recessed from the first board surface to form a receiving slot, and the transfer carrier board includes a plurality of signal lines, and the plurality of signal lines are received by the Each of the groove bottoms of the receiving groove is formed with a signal contact; wherein the transfer carrier portion surrounding the receiving groove is defined as a support portion; and a positioning cover plate is formed with a plurality of perforations, and the positioning The cover plate is disposed on the support portion; wherein the positioning cover and the receiving groove of the transfer carrier jointly define a receiving space. a plurality of conductive probes each having an elastic segment and a connecting segment on opposite sides of the elastic segment and a test segment, and the plurality of conductive probes respectively pass through the plurality of the perforations of the positioning cover The elastic section of each of the conductive probes and the connecting section are located in the receiving space, and the test section of each of the conductive probes is exposed outside the receiving space and protrudes Extending the first board surface, the connecting segments of the plurality of conductive probes are respectively fixed to the plurality of the signal contacts of the transfer carrier; wherein the positioning cover is fixed to the And a plurality of the perforations of the positioning cover respectively correspond to a plurality of the signal contacts in a height direction, and the elastic segments of each of the conductive probes pass through the phase by elastic deformation Corresponding to the perforations, and the plurality of the conductive probes can respectively maintain the relative positions of each other by a plurality of the elastic segments located in the receiving space respectively abutting against the positioning cover.

In summary, the probe card device disclosed in the embodiment of the present invention uses only a single positioning cover plate and omits the spacer plate used in the prior art, which is obviously different from the existing structure, thereby effectively reducing the probe card. The manufacturing cost of the device (such as: reducing structural complexity and assembly process), and can provide a new direction of research and development. Further, the stereo signal switching structure employed in the probe card device described above can be used with a shorter conductive probe to enable the probe card device to be applied to higher frequency signal transmission.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying claims limit.

100‧‧‧ probe card device

1‧‧‧flat signal transfer structure

11‧‧‧Transfer carrier board

111‧‧‧ first board

112‧‧‧ second board

113‧‧‧ accommodation trough

1131‧‧‧ bottom

114‧‧‧Signal lines

1141‧‧‧Signal contacts

115‧‧‧ Groove structure

116‧‧‧ impedance matching circuit

117‧‧‧Support

12‧‧‧ Positioning cover

121‧‧‧ outer surface

122‧‧‧Perforation

2‧‧‧ Conductive probe

21‧‧‧Flexible section

22‧‧‧ Connection section

23‧‧‧Detection section

200‧‧‧Test object

300‧‧‧ boards

H‧‧‧ Height direction

S‧‧‧ accommodating space

1A is a schematic diagram of a flat panel signal switching structure according to Embodiment 1 of the present invention.

FIG. 1B is a schematic diagram of another aspect of a flat-panel signal switching structure according to Embodiment 1 of the present invention.

1C is a schematic diagram of another aspect of a flat-panel signal switching structure according to Embodiment 1 of the present invention.

FIG. 2 is a schematic diagram of a flat signal conversion structure in a needle implantation process according to Embodiment 1 of the present invention.

3 is a partially enlarged schematic view of the III block of FIG. 2.

4 is a partially enlarged schematic view showing another aspect of the III block of FIG. 2.

FIG. 5A is a schematic diagram of a probe card device according to Embodiment 1 of the present invention.

FIG. 5B is a schematic diagram of another aspect of the probe card device according to Embodiment 1 of the present invention.

FIG. 6 is a schematic diagram of a probe card device mounted on a circuit board and used for detecting an object to be tested according to the first embodiment of the present invention.

FIG. 7 is a schematic diagram (1) of a flat signal switching structure according to a second embodiment of the present invention.

FIG. 8 is a schematic diagram (2) of a flat signal conversion structure according to a second embodiment of the present invention.

FIG. 9 is a schematic diagram of a probe card device according to a second embodiment of the present invention.

Please refer to FIG. 1A to FIG. 9 , which are embodiments of the present invention. It should be noted that the related embodiments of the present invention are only used to specifically describe the embodiments of the present invention. The scope of the present invention is not to be construed as limiting the scope of the present invention.

[Example 1]

As shown in FIG. 1A to FIG. 6, it is the first embodiment of the present invention. This embodiment discloses a probe card device 100 that can be used to test a test object 200 (eg, a semiconductor wafer). The probe card device 100 includes a flat signal switching structure 1 and installation The plurality of conductive probes 2 of the flat signal switching structure 1 described above. The flat signal switching structure 1 is described in the present embodiment in combination with the plurality of conductive probes 2, but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, the flat signal switching structure 1 may also be applied separately (eg, sold).

As shown in FIG. 1A , the flat signal conversion structure 1 includes an transfer carrier 11 and a positioning cover 12 disposed on the transfer carrier 11 . It should be noted that the shape of the flat signal switching structure 1 in this embodiment is similar to a circuit board, and the flat signal switching structure 1 preferably excludes any non-flat signal. The connection structure (eg, at least 50% of any one of the conductive probes 2 is located outside the transfer carrier 11). The construction and connection relationship between the transfer carrier 11 and the positioning cover 12 of the flat signal switching structure 1 will be described below.

Referring to FIG. 1A and FIG. 2, the transfer carrier 11 is substantially flat in the embodiment, and the transfer carrier 11 has a first plate surface 111 and a second plate on opposite sides. Face 112. Further, the transfer carrier 11 is preferably a multilayer laminate, but the invention is not limited thereto.

The transfer carrier 11 is recessed from the first plate surface 111 to form a receiving slot 113, and the transfer carrier 11 includes a plurality of signal lines 114. The plurality of signal lines 114 are in the slots of the receiving slot 113. Each of the bottoms 1131 is formed with a signal contact 1141. That is, the plurality of signal contacts 1141 of the transfer carrier 11 are located in the receiving slot 113. Moreover, the second board surface 112 of the transfer carrier 11 is for mounting on a circuit board 300 (eg, FIG. 6).

Further, as shown in FIG. 2 to FIG. 4 , the transfer carrier 11 is formed with a groove-like structure 115 at the bottom 1131 of the receiving groove 113 at each signal contact 1141 . The groove-like structure 115 may be formed by the signal contact 1141 and the portion of the transfer carrier 11 adjacent thereto (as shown in FIG. 3), or the groove-like structure 115 may also be a signal contact. 1141 (as shown in Figure 4), The invention is not limited herein.

In addition, the transfer carrier 11 includes an impedance matching circuit 116 embedded therein, and the impedance matching circuit 116 is electrically coupled to at least a portion of the plurality of signal lines 114. In FIG. 5A of the embodiment, the portion of the transfer carrier 11 surrounding the receiving slot 113 is defined as a support portion 117, and the impedance matching circuit 116 is embedded in the support portion 117, and the impedance is The matching circuit 116 is preferably disposed adjacent to the plurality of conductive probes 2, but the invention is not limited thereto. For example, as shown in FIG. 5B, the impedance matching circuit 116 may also be buried in the portion of the transfer carrier 11 outside the support portion 117. Accordingly, the transfer carrier 11 is embedded in the transfer carrier 11 (preferably embedded in the support portion 117) to effectively shorten the impedance matching circuit 116 and its electrical properties. The distance of the coupled signal contact 1141.

It should be noted that the support portion 117 has an annular shape (eg, a square ring shape) and is preferably a part of the transfer carrier 11 instead of being separately mounted on the transfer carrier 11 . Independent component. That is, the support portion 117 of the present embodiment preferably excludes any separate components that are separately mounted (eg, screwed, fitted, bonded) to the transfer carrier 11, but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, the transfer carrier 11 may be formed with a recess, and then a support frame is disposed in the recess, and the inner edge of the support frame and the groove of the groove The bottom portion defines the receiving groove 113 together, and the support frame can be regarded as a part of the transfer carrier 11 and is defined as the support portion 117.

Referring to FIG. 1A and FIG. 2 , the positioning cover 12 is substantially flat in the embodiment and is disposed on the support portion 117 of the transfer carrier 11 and outside the positioning cover 12 . The surface 121 is preferably disposed substantially coplanar with the first plate surface 111 of the transfer carrier 11 but the invention is not limited thereto. For example, the outer surface 121 of the positioning cover 12 may be lower than the first plate surface 111 of the transfer carrier 11 (eg, FIG. 1B); or the outer surface 121 of the positioning cover 12 may also be It may be a first plate surface 111 protruding from the transfer carrier 11 (e.g., Fig. 1C).

Further, the positioning cover 12 is formed with a plurality of through holes 122, and the plurality of through holes 122 are located inside the positioning cover 12 of the contact supporting portion 117. The positioning cover 12 and the receiving slot 113 of the transfer carrier 11 collectively define a receiving space S, and the plurality of through holes 122 communicate with the receiving space S respectively. Further, the accommodation space S of the flat-panel signal transmission structure 1 may be connected to the external space only by the plurality of perforations 122, but the present invention is not limited thereto.

Furthermore, in the embodiment, the positioning cover 12 can be in a misalignment direction (parallel to the first plate surface 111) relative to the support portion 117 at a needle placement position (as shown in FIG. 1A or FIG. 2). Moves between a positioning position (as shown in Figure 5A). Wherein, when the positioning cover 12 is located at the needle placement position or the positioning position, the positioning cover 12 can be locked on the support portion 117 by a plurality of screws (not shown), so that the positioning cover 12 can be held. In the needle position or positioning position. In addition, in other embodiments not shown in the present invention, the positioning cover 12 can also be fixed to the support portion 117 by other means (eg, fitting), so that the positioning cover 12 is held at the needle placement position. Or locate the location.

As shown in FIG. 2 and FIG. 5A , each of the conductive probes 2 has an elastic section 21 and a detecting section 23 and a connecting section 22 on opposite sides of the elastic section 21 . It should be noted that the conductive probe 2 is electrically conductive and has a flexible strip structure in the embodiment, and the conductive probe 2 is not limited to a rectangular conductive probe or a circular conductive probe. Or other constructed conductive probes.

Furthermore, the plurality of conductive probes 2 respectively pass through the plurality of through holes 122 of the positioning cover 12 such that the elastic segments 21 and the connecting segments 22 of each of the conductive probes 2 are substantially located in the receiving space S (or the receiving slots 113). The detection section 23 of each of the conductive probes 2 is a first plate surface 111 that is exposed outside the receiving space S and protrudes from the transfer carrier 11 . That is, the conductive probe used in the probe card device 100 of this embodiment 2 only one end portion (eg, the detecting portion 23) is exposed outside the flat signal signal transmission structure 1 and protrudes from the first board surface 111 of the transfer carrier 11 so that a conductive probe is used. Any device in which both ends are exposed is not the probe card device 100 of the present embodiment.

Further, the connecting segments 22 of the plurality of conductive probes 2 are respectively fixed to the plurality of signal contacts 1141 of the transfer carrier 11 so that the impedance matching circuit 116 of the transfer carrier 11 can Electrically coupled to at least a portion of the signal lines 114 and their corresponding at least portions of the conductive probes 2.

In the present embodiment, the (connecting section 22) of each of the conductive probes 2 is explained by being inserted and fixed to the groove-like structure 115 corresponding to the signal contact 1141, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the connecting portion 22 of the conductive probe 2 may also be formed with a groove-like structure, and the transfer carrier 11 is at the signal contact 1141. Forming a convex structure having a geometrically corresponding groove-like structure, so that the connecting portion 22 of the conductive probe 2 and the signal contact 1141 of the transfer carrier 11 can pass through the groove-like structure and the convex structure. The cooperation keeps the connection relationship with each other.

In addition, when the positioning cover 12 is located at the needle position (as shown in FIG. 2), the plurality of through holes 122 of the positioning cover 12 respectively correspond to a height direction H (vertical first board surface 111). The plurality of signal contacts 1141 are configured to respectively pass the plurality of conductive probes 2 (the elastic segments 21 and the connecting segments 22) through the plurality of through holes 122, and the plurality of connecting segments 22 respectively abut the plurality of signal contacts 1141. Moreover, when the positioning cover 12 is located at the positioning position (as shown in FIG. 5A), the elastic segments 21 of the plurality of conductive probes 2 are pressed by the (positioning plate 12) to be curved.

Further, when the positioning cover 12 is located at the needle position (as shown in FIG. 2), the correspondence between the plurality of through holes 122 and the plurality of signal contacts 1141 along the height direction H is in the present embodiment. In the example, when the transfer carrier 11 is orthographically projected toward the positioning cover 12 in the height direction H, the plurality of projection regions formed by the plurality of signal contacts 1141 are preferably located in the plurality of Perforated 122, but The invention is not limited thereto.

As described above, the flat-panel signal switching structure 1 used in the probe card device 100 of the present embodiment has only a single positioning cover 12 and omits the spacers used in the prior art. This is different from the existing structure and is effective. The manufacturing cost of the probe card device 100 is reduced, and a new research and development direction can be provided. Further, the flat-panel signal switching structure 1 used in the probe card device 100 can be used to match the shorter conductive probe 2, so that the probe card device 100 can be applied to higher-frequency signal transmission. .

[Embodiment 2]

Referring to FIG. 7 to FIG. 9 , which is the second embodiment of the present invention, the embodiment is similar to the first embodiment, so the same portions of the two embodiments are not described in detail, and the embodiment and the foregoing embodiment are not described herein. The difference is mainly as follows: the positioning cover 12 is directly fixed to the support portion 117 in this embodiment, that is, there is only a relative matching position between the positioning cover 12 and the support portion 117. And the two cannot move relative to each other. Wherein, the plurality of through holes 122 of the positioning cover 12 respectively correspond to the plurality of signal contacts 1141 in the height direction H, and the elastic segments 21 of each of the conductive probes 2 are elastically deformed to pass through the corresponding through holes 122, and The plurality of conductive probes 2 can respectively abut against the positioning cover 12 through a plurality of elastic segments 21 located in the receiving space S to maintain relative positions of each other.

Further, the probe card device 100 of the present embodiment can be designed by the structure of the conductive probe 2 so that the positioning cover 12 of the flat signal conversion structure 1 does not need to be moved relative to the support portion 117. The structural complexity and assembly process of the probe card device 100 are further reduced.

[Technical Effects of Embodiments of the Invention]

In summary, the probe card device 100 disclosed in the embodiment of the present invention has a flat type signal conversion structure 1 having only a single positioning cover 12, and omits the conventional The spacer used, which is different from the existing structure, is effective in reducing the manufacturing cost of the probe card device 100 (e.g., reducing structural complexity and assembly process) and providing a new research and development direction. Further, the flat-panel signal switching structure 1 used in the probe card device 100 can be used to match the shorter conductive probe 2, so that the probe card device 100 can be applied to higher-frequency signal transmission. .

Furthermore, the flat-panel signal switching structure 1 disclosed in the embodiment of the present invention has a shape similar to that of a circuit board, thereby making the use of the flat-panel signal switching structure 1 and the matching with other components more convenient. For example, during the transport of the flat signal switching structure 1, a plurality of flat signal switching structures 1 can be stacked together to achieve a minimum footprint.

The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. All changes and modifications made to the scope of the present invention are intended to be within the scope of the appended claims.

Claims (5)

A probe card device comprising: a flat-panel transfer structure, comprising: an transfer carrier plate having a first plate surface and a second plate surface on opposite sides, the transfer carrier plate from the first a receiving surface is formed in a recessed surface, and the transfer carrier includes a plurality of signal lines, and the plurality of signal lines respectively form a signal contact at the bottom of the receiving slot; The transfer carrier portion of the receiving slot is defined as a support portion; and a positioning cover plate is formed with a plurality of through holes, and the positioning cover plate is disposed on the support portion; wherein the positioning cover plate And the receiving slot of the transfer carrier jointly defines a receiving space; and a plurality of conductive probes each having an elastic segment and a connecting segment on a opposite side of the elastic segment and a test segment. A plurality of the conductive probes respectively pass through the plurality of the perforations of the positioning cover such that the elastic segment of each of the conductive probes and the connecting segment are located in the receiving space, and each The test segments of the conductive probes are exposed to the receiving Exciting the first board surface, and the connecting sections of the plurality of conductive probes are respectively fixed to the plurality of signal contacts of the transfer carrier; wherein the positioning cover The plate is fixed on the support portion, and the plurality of the perforations of the positioning cover respectively correspond to a plurality of the signal contacts in a height direction, and the elastic segments of each of the conductive probes pass the elasticity The plurality of the conductive probes are deformed to pass through the corresponding perforations, and the plurality of the conductive probes can respectively abut the positioning cover by a plurality of the elastic segments located in the receiving space to maintain relative positions of each other. The probe card device of claim 1, wherein the transfer carrier is a multi-layer ply, and an outer surface of the positioning cover is substantially the first of the transfer carrier The panels are coplanar. The probe card device of claim 1, wherein the transfer carrier is located in each of the The signal contact is formed with a groove-like structure at the bottom of the groove of the receiving groove, and each conductive probe is inserted and fixed to the groove-like structure corresponding to the signal contact. The probe card device of claim 1, wherein the transfer carrier includes an impedance matching circuit embedded therein, and the impedance matching circuit is electrically coupled to the plurality of signal lines At least a portion of the signal lines and their corresponding at least portions of the conductive probes. The probe card device of claim 4, wherein the impedance matching circuit is embedded in the support portion, and the impedance matching circuit is adjacent to the plurality of conductive probes.