TWI672492B - Inspection method and inspection device for hexagonal crystal single crystal substrate - Google Patents
Inspection method and inspection device for hexagonal crystal single crystal substrate Download PDFInfo
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Abstract
本發明的課題為提供一種可高精度地檢測形成有偏角的方向(亦即c軸傾斜的方向)的六方晶體單晶的檢查方法及檢查裝置。解決手段是檢測c軸相對於上表面的垂線傾斜的方向的六方晶體單晶基板的檢查方法,其為準備產生直線偏光之雷射光束的雷射光束產生機構,且該直線偏光之雷射光束具有穿透六方晶體單晶基板的波長、及預定方向的偏光面。然後,將六方晶體單晶基板的上表面保持為相對於雷射光束的光路垂直地定位,並且使雷射光束穿透六方晶體單晶基板,且使六方晶體單晶基板相對於該雷射光束產生機構所產生的雷射光束的偏光面,以雷射光束的中心為旋轉中心而相對地旋轉,並將已穿透六方晶體單晶基板的雷射光束分歧成P偏光與S偏光。更包含算出步驟與傾斜檢測步驟,該算出步驟是使用量測以該偏振光束分光器所分歧的P偏光之光量的第1受光元件、與量測S偏光之光量的第2受光元件,算出該第1受光元件與第2受光元件所量測的光量比,該傾斜檢測步驟是將相對於該雷射光束的偏光面的六方晶體單晶基板的相對旋轉角度、與藉由該算出步驟所算出的光量比對比並顯示,而檢測c軸相對於該上表面的垂線傾斜的方向。 An object of the present invention is to provide a method and an apparatus for inspecting a hexagonal crystal single crystal that can accurately detect a direction in which an off-angle is formed (that is, a direction in which the c-axis is inclined). The solution is an inspection method of a hexagonal crystal single crystal substrate that detects the direction in which the c-axis is inclined with respect to the vertical line of the upper surface. The method is a laser beam generating mechanism for preparing a linearly polarized laser beam, and the linearly polarized laser beam It has a wavelength that penetrates a hexagonal crystal single crystal substrate and a polarizing surface in a predetermined direction. Then, the upper surface of the hexagonal crystal single crystal substrate is maintained to be positioned vertically with respect to the optical path of the laser beam, and the laser beam is made to penetrate the hexagonal crystal single crystal substrate, and the hexagonal crystal single crystal substrate is opposed to the laser beam. The polarization plane of the laser beam generated by the generating mechanism is relatively rotated with the center of the laser beam as a rotation center, and the laser beam that has penetrated the hexagonal crystal single crystal substrate is divided into P-polarized light and S-polarized light. It further includes a calculation step and a tilt detection step. This calculation step uses a first light receiving element that measures the amount of P-polarized light split by the polarized beam splitter and a second light receiving element that measures the amount of S-polarized light. The ratio of the light quantity measured by the first light-receiving element and the second light-receiving element. The inclination detection step is to calculate the relative rotation angle of the hexagonal crystal single crystal substrate with respect to the polarization plane of the laser beam, and the angle calculated by the calculation step. The light quantity ratio is compared and displayed, and the direction in which the c-axis is inclined with respect to the vertical line of the upper surface is detected.
Description
本發明是有關一種SiC基板、GaN基板等之六方晶體單晶基板的檢查方法及檢查裝置。 The invention relates to an inspection method and an inspection device of a hexagonal crystal single crystal substrate such as a SiC substrate and a GaN substrate.
功率器件或LED、LD等之光器件,是在將SiC、GaN等之六方晶體單晶作為素材之晶圓的表面積層機能層,並藉由形成格子狀之複數條分割預定線區劃而形成於所積層之機能層。 Optical devices such as power devices, LEDs, and LDs are formed on the surface area layer of a wafer using hexagonal single crystals of SiC, GaN, and other materials as a material, and are formed by forming a plurality of divided predetermined line divisions in a grid shape. Functional layer of the layer.
形成有器件之晶圓,一般是將晶錠以線鋸切片而生成,並且是研磨被切片之晶圓的正反面而加工成為鏡面(參照例如日本專利特開2000-94221號公報)。 The wafer on which the device is formed is generally produced by slicing an ingot with a wire saw, and polishing the front and back surfaces of the sliced wafer to produce a mirror surface (see, for example, Japanese Patent Laid-Open No. 2000-94221).
六方晶體單晶基板具有第1定向平面、及與第1定向平面正交的第2定向平面。例如,第1定向平面的長度可形成為比第2定向平面的長度還短。 The hexagonal crystal single crystal substrate has a first orientation plane and a second orientation plane orthogonal to the first orientation plane. For example, the length of the first orientation plane may be shorter than the length of the second orientation plane.
六方晶體單晶基板具有相對於上表面的垂線朝第1定向平面方向傾斜偏角α的c軸、及與c軸正交的c面。c面會相對於基板的上表面傾斜偏角α。一般而言,在六方晶體單晶基板中,與短的第1定向平面的伸長方向正交的方 向為c軸的傾斜方向。 The hexagonal crystal single crystal substrate has a c-axis that is inclined at an off-angle α from the vertical line of the upper surface in the direction of the first orientation plane, and a c-plane orthogonal to the c-axis. The c-plane is inclined at an off-angle α with respect to the upper surface of the substrate. Generally, in a hexagonal crystal single crystal substrate, a square orthogonal to the elongation direction of the short first orientation plane To the tilt direction of the c-axis.
c面在六方晶體單晶基板中,在基板的分子層級上設定為無數個。偏角α是在例如1°~6°的範圍內自由地設定而製造基板。 In the hexagonal crystal single crystal substrate, the c-plane is set to an infinite number at the molecular level of the substrate. The deflection angle α is freely set in a range of, for example, 1 ° to 6 °, and a substrate is manufactured.
專利文獻1:日本專利特開2000-94221號公報 Patent Document 1: Japanese Patent Laid-Open No. 2000-94221
如上所述,在六方晶體單晶基板中,是以與較短的第1定向平面的伸長方向正交的方向為c軸的傾斜方向之方式來製造基板。不過,因製造誤差等,而有定向平面相對於與c軸方向的傾斜方向正交的方向以±5°左右的誤差而被製造之情形。因此,以定向平面為基準進行加工後,會有有時無法施行所期望的加工的問題。 As described above, in the hexagonal crystal single crystal substrate, the substrate is manufactured such that the direction orthogonal to the elongation direction of the shorter first orientation plane is the oblique direction of the c-axis. However, due to manufacturing errors, the orientation plane may be manufactured with an error of about ± 5 ° with respect to the direction orthogonal to the tilt direction of the c-axis direction. Therefore, there is a problem that desired processing cannot be performed after processing with the orientation plane as a reference.
本發明是有鑒於這樣的問題點而作成的發明,其目的在於提供一種可高精度地檢測形成有偏角的方向(亦即c軸的傾斜方向)的六方晶體單晶基板的檢查方法及檢查裝置。 The present invention has been made in view of such problems, and an object thereof is to provide an inspection method and inspection of a hexagonal crystal single crystal substrate that can accurately detect a direction in which an off-angle is formed (that is, a tilt direction of a c-axis). Device.
依據第1項記載的發明,是提供一種六方晶體單晶基板的檢查方法,該六方晶體單晶基板具有第1面及與該第1面為相反側的第2面、從該第1面到該第2面的c軸、以及 與該c軸正交的c面,該六方晶體單晶基板的檢查方法是檢測c軸相對於該第1面的垂線傾斜的方向,且其特徵在於具備有:準備步驟,準備產生直線偏光之雷射光束的雷射光束產生機構,且該直線偏光之雷射光束具有穿透六方晶體單晶基板的波長、及預定方向之偏光面;保持步驟,將六方晶體單晶基板的第1面保持為相對於雷射光束的光路垂直地定位,並且使雷射光束穿透六方晶體單晶基板;旋轉步驟,使六方晶體單晶基板相對於該雷射光束產生機構所產生的雷射光束的偏光面,以雷射光束的中心為旋轉中心而相對地旋轉;分歧步驟,將已穿透六方晶體單晶基板的雷射光束以偏振光束分光器分歧成P偏光與S偏光;算出步驟,使用量測以該偏振光束分光器所分歧的P偏光之光量的第1受光元件、與量測S偏光之光量的第2受光元件,算出該第1受光元件與第2受光元件所量測的光量之光量比;及傾斜檢測步驟,將相對於該雷射光束的偏光面的六方晶體單晶基板的相對旋轉角度、與藉由該算出步驟所算出的光量比對比並顯示,而檢測c軸相對於該第1面的垂線傾斜的方向。 The invention according to the first aspect is to provide a method for inspecting a hexagonal crystal single crystal substrate, the hexagonal crystal single crystal substrate having a first surface and a second surface opposite to the first surface, from the first surface to The c-axis of the second surface, and A c-plane orthogonal to the c-axis, and the inspection method of the hexagonal crystal single crystal substrate is to detect a direction in which the c-axis is inclined with respect to a vertical line of the first surface. A laser beam generating mechanism for a laser beam, and the linearly polarized laser beam has a wavelength that penetrates a hexagonal crystal single crystal substrate and a polarizing plane in a predetermined direction; a holding step that holds the first surface of the hexagonal crystal single crystal substrate Positioned perpendicular to the optical path of the laser beam, and allowing the laser beam to penetrate the hexagonal crystal single crystal substrate; the rotation step causes the hexagonal crystal single crystal substrate to be polarized with respect to the laser beam generated by the laser beam generating mechanism Plane, rotates relatively with the center of the laser beam as the rotation center; the branching step divides the laser beam that has penetrated the hexagonal crystal single crystal substrate into a polarized beam splitter into P polarized light and S polarized light; a calculation step, the amount of use The first light receiving element that measures the amount of P-polarized light split by the polarized beam splitter and the second light receiving element that measures the amount of S-polarized light, and calculates the first light receiving element and the second light receiving The light quantity ratio of the light quantity measured by the element; and the tilt detection step, comparing and displaying the relative rotation angle of the hexagonal crystal single crystal substrate with respect to the polarization plane of the laser beam with the light quantity ratio calculated by the calculation step While detecting the direction in which the c-axis is inclined with respect to the vertical line of the first surface.
較理想的是,更具備檢測該旋轉步驟中的六方晶體單晶基板的定向平面的定向平面檢測步驟,且在該定向 平面檢測步驟中,以與檢測出定向平面的旋轉角度近似之旋轉角度所顯現之光量比之峰值的旋轉角度來作為c軸傾斜的方向。 Ideally, it is further provided with an orientation plane detection step for detecting the orientation plane of the hexagonal crystal single crystal substrate in the rotation step, and In the plane detection step, the rotation angle at which the peak value of the light amount ratio appears at a rotation angle that is similar to the rotation angle at which the orientation plane is detected is taken as the direction in which the c-axis is inclined.
依據第3項記載的發明,是提供一種六方晶體單晶基板的檢查裝置,該六方晶體單晶基板具有第1面及與該第1面為相反側的第2面、從該第1面到該第2面的c軸、以及與該c軸正交的c面,該六方晶體單晶基板的檢查裝置是檢測c軸相對於該第1面的垂線傾斜的方向,且其特徵在於具備有:雷射光束產生機構,產生直線偏光之雷射光束,且該直線偏光之雷射光束具有穿透六方晶體單晶基板的波長、及預定方向的偏光面;保持機構,將六方晶體單晶基板的第1面保持為相對於該雷射光束產生機構所產生的雷射光束的光路垂直地定位,並且使雷射光束穿透六方晶體單晶基板;旋轉機構,使六方晶體單晶基板相對於該雷射光束產生機構所產生的雷射光束的偏光面,以雷射光束的中心為旋轉中心而相對地旋轉;偏振光束分光器,將已穿透六方晶體單晶基板的雷射光束分歧為P偏光與S偏光;第1受光元件,量測以該偏振光束分光器所分歧的P偏光之光量;第2受光元件,量測以該偏振光束分光器所分歧的S偏光之光量; 算出機構,算出該第1受光元件與該第2受光元件所量測的光量之光量比;以及顯示機構,將藉由該旋轉機構的作動而相對於雷射光束的偏光面的六方晶體單晶的相對的旋轉角度、與藉由該算出機構所算出的光量比對比並顯示。 According to the invention described in item 3, there is provided an inspection device for a hexagonal crystal single crystal substrate, the hexagonal crystal single crystal substrate having a first surface and a second surface opposite to the first surface, from the first surface to The c-axis of the second surface and the c-plane orthogonal to the c-axis, the inspection device for the hexagonal crystal single crystal substrate detects a direction in which the c-axis is inclined with respect to a vertical line of the first surface, and is characterized in that: : The laser beam generating mechanism generates a linearly polarized laser beam, and the linearly polarized laser beam has a wavelength that penetrates the hexagonal crystal single crystal substrate and a polarization plane in a predetermined direction; a holding mechanism converts the hexagonal crystal single crystal substrate The first surface of is maintained to be positioned vertically with respect to the optical path of the laser beam generated by the laser beam generating mechanism, and the laser beam penetrates the hexagonal crystal single crystal substrate; the rotation mechanism makes the hexagonal crystal single crystal substrate opposite to The polarizing surface of the laser beam generated by the laser beam generating mechanism is relatively rotated with the center of the laser beam as a rotation center; the polarization beam splitter splits the laser beam that has penetrated the hexagonal crystal single crystal substrate. The P polarized light and S-polarized light; a first light receiving element, measurement of light amount P polarized light of to the polarizing beam splitter being imprisoned by; the second light receiving element, measuring the amount of light polarization them with the divergence of the polarization beam splitter S by; A calculation mechanism calculates a light quantity ratio of the light quantity measured by the first light receiving element and the second light receiving element; and a display mechanism that will act as a hexagonal crystal single crystal with respect to the polarization plane of the laser beam by the operation of the rotation mechanism. The relative rotation angle of is compared with the light amount ratio calculated by the calculation mechanism and displayed.
較理想的是,更具備檢測六方晶體單晶基板的定向平面的檢測機構,且該顯示機構是以與檢測出定向平面的旋轉角度近似之旋轉角度所顯現之光量比之峰值的旋轉角度作為c軸傾斜的方向而顯示。 Preferably, a detection mechanism for detecting an orientation plane of a hexagonal crystal single crystal substrate is further provided, and the display mechanism uses a rotation angle of a peak value of a light amount ratio that appears at a rotation angle similar to the rotation angle of the detected orientation plane as c The axis is tilted.
依據本發明,相對於雷射光束將第1面垂直地定位,使相對於第1面以偏角而傾斜的六方晶體單晶基板的c面為雷射光束之偏光面而使其折射,且藉由相對的六方晶體單晶基板的旋轉而改變折射方向,藉此,使藉由偏振光束分光器所分歧的P偏光與S偏光的光量比因應旋轉角度而如正弦曲線地變化,並將最接近定向平面的角度位置的正弦曲線的波峰或波谷的角度位置作為c軸相對於第1面的垂線的傾斜的方向而被檢測。 According to the present invention, the first surface is positioned vertically with respect to the laser beam, so that the c-plane of the hexagonal crystal single crystal substrate inclined at an off-angle with respect to the first surface is a polarizing surface of the laser beam and refracted, and The refraction direction is changed by the rotation of the opposite hexagonal crystal single crystal substrate, whereby the light amount ratio of the P-polarized light and the S-polarized light divided by the polarizing beam splitter is changed as a sinusoid according to the rotation angle, and the most The angular position of the peak or trough of the sine curve near the angular position of the orientation plane is detected as the direction of the tilt of the c-axis with respect to the vertical line of the first surface.
從而,若定向平面的角度位置與正弦曲線的波峰或波谷的角度位置一致,即可信任定向平面而施行加工,若不一致,只需將定向平面的角度位置與正弦曲線的波峰或波谷的角度位置之角度差作為定向平面的補正值,並進行加工,即可施行所期望的加工。 Therefore, if the angular position of the orientation plane is consistent with the angular position of the crest or trough of the sinusoidal curve, the orientation plane can be trusted to perform processing. The angular difference is used as a correction value for the orientation plane, and processing is performed to perform the desired processing.
10‧‧‧六方晶體單晶基板的檢查裝置 10‧‧‧Hexagonal crystal single crystal substrate inspection device
11‧‧‧六方晶體單晶基板(SiC基板) 11‧‧‧Hexagonal crystal single crystal substrate (SiC substrate)
11a‧‧‧第1面(上表面) 11a‧‧‧First side (upper surface)
11b‧‧‧第2面(背面) 11b‧‧‧ 2nd side (back)
12‧‧‧基座 12‧‧‧ base
13‧‧‧第1定向平面 13‧‧‧The first orientation plane
14‧‧‧保持台 14‧‧‧ holding table
15‧‧‧第2定向平面 15‧‧‧ 2nd orientation plane
22‧‧‧馬達 22‧‧‧ Motor
24‧‧‧小齒輪 24‧‧‧ Pinion
26‧‧‧齒輪 26‧‧‧Gear
28‧‧‧刻度 28‧‧‧ scale
30‧‧‧旋轉編碼器 30‧‧‧Rotary encoder
32‧‧‧He-Ne雷射振盪器 32‧‧‧He-Ne laser oscillator
34‧‧‧1/2波長板 34‧‧‧1 / 2 wavelength plate
36‧‧‧偏振分離膜 36‧‧‧Polarization separation film
38‧‧‧偏振光束分光器 38‧‧‧ Polarized Beamsplitter
40‧‧‧第1受光元件 40‧‧‧1st light receiving element
42‧‧‧第2受光元件 42‧‧‧ 2nd light receiving element
44‧‧‧定向平面檢測器 44‧‧‧directional plane detector
46‧‧‧演算機構 46‧‧‧Calculation Agency
50‧‧‧監視器(顯示機構) 50‧‧‧Monitor (display mechanism)
α、β‧‧‧偏角 α, β‧‧‧ declination
P1、P2、P3、P4‧‧‧峰值 P1, P2, P3, P4‧‧‧ peak
R1‧‧‧箭頭 R1‧‧‧arrow
圖1是本發明實施形態的六方晶體單晶基板的檢查裝置之立體圖。 FIG. 1 is a perspective view of an inspection device for a hexagonal crystal single crystal substrate according to an embodiment of the present invention.
圖2是顯示六方晶體單晶基板的第1面的垂線與c軸的關係之圖。 FIG. 2 is a diagram showing a relationship between a vertical line on a first surface of a hexagonal crystal single crystal substrate and a c-axis.
圖3是說明以圖1所示的檢查裝置進行的檢查方法的立體圖。 FIG. 3 is a perspective view illustrating an inspection method performed by the inspection device shown in FIG. 1.
圖4是說明定向平面的檢測方法的平面圖。 FIG. 4 is a plan view illustrating a method of detecting an orientation plane.
圖5是顯示相對於旋轉角度的P偏光與S偏光的光量比的圖形。 FIG. 5 is a graph showing a light amount ratio of P-polarized light to S-polarized light with respect to a rotation angle.
以下,參照圖式詳細地說明本發明的實施形態。參照圖1,所示為本發明實施形態的六方晶體單晶基板的檢查裝置10的立體圖。檢查裝置10具備有基座12。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, a perspective view of an inspection device 10 for a hexagonal crystal single crystal substrate according to an embodiment of the present invention is shown. The inspection apparatus 10 includes a base 12.
在基座12上可旋轉地安裝有保持台14。保持台14具有中央開口部16與環狀吸引溝18,環狀吸引溝18中開口有複數個吸引孔20。吸引孔20是透過電磁切換閥而選擇性地連接到圖未示的吸引源。 A holding table 14 is rotatably mounted on the base 12. The holding table 14 has a central opening 16 and an annular suction groove 18. A plurality of suction holes 20 are opened in the annular suction groove 18. The suction hole 20 is selectively connected to a suction source (not shown) through an electromagnetic switching valve.
基座12上安裝有馬達22,並將固定在馬達22的輸出軸的小齒輪24與形成於保持台14的下端部的齒輪26嚙合。保持台14的外周配置有用於檢測旋轉角度的刻度28。 A motor 22 is mounted on the base 12, and a pinion gear 24 fixed to an output shaft of the motor 22 is meshed with a gear 26 formed at a lower end portion of the holding table 14. A scale 28 for detecting a rotation angle is arranged on the outer periphery of the holding table 14.
藉由以搭載於基座12上的旋轉編碼器30來讀取刻度28,以檢測保持台14的旋轉角度。在此,採用的旋轉編碼器30的角度解析能力雖然為0.5°,但也可採用具有不同 的解析能力的旋轉編碼器。 The rotation angle of the holding table 14 is detected by reading the scale 28 with the rotary encoder 30 mounted on the base 12. Here, although the angular resolution of the rotary encoder 30 used is 0.5 °, it is also possible to use Rotary encoder with parsing capabilities.
44為定向平面檢測器,且可以採用例如下列的檢測器:射出雷射光束以檢測來自吸引保持在保持台14上之如圖2所示的六方晶體單晶基板11的定向平面13或15的反射光之雷射檢測器、或檢測已產生的超音波的反射波之超音波檢測器等。 Reference numeral 44 is an orientation plane detector, and for example, the following detectors can be used: a laser beam is emitted to detect the orientation plane 13 or 15 from the hexagonal crystal single crystal substrate 11 attracted and held on the holding table 14 as shown in FIG. 2. Laser detectors for reflected light, or ultrasonic detectors that detect reflected waves that have been generated.
32為He-Ne雷射振盪器,會振盪產生波長632nm的雷射光束。本實施形態的He-Ne雷射振盪器雖然振盪產生平均輸出0.1W的雷射光束,但輸出並不受限於此,也可採用振盪產生其他輸出的雷射光束之He-Ne雷射振盪器,也可取代He-Ne雷射振盪器32,採用振盪產生不同的波長的雷射光束之其他種類的雷射振盪器。 32 is a He-Ne laser oscillator, which oscillates and generates a laser beam with a wavelength of 632nm. Although the He-Ne laser oscillator of this embodiment oscillates to produce a laser beam with an average output of 0.1 W, the output is not limited to this. He-Ne laser oscillations that generate other output laser beams by oscillation may also be used. Instead of the He-Ne laser oscillator 32, other types of laser oscillators that oscillate and generate laser beams with different wavelengths may be used.
He-Ne雷射振盪器32與保持於保持台14上的六方晶體單晶基板11之間安裝有1/2波長板34。在本實施形態中,是以He-Ne雷射振盪器32與1/2波長板34構成可產生具有預定方向的偏光面之雷射光束之雷射光束產生機構。 A half-wavelength plate 34 is mounted between the He-Ne laser oscillator 32 and the hexagonal crystal single crystal substrate 11 held on the holding table 14. In this embodiment, a He-Ne laser oscillator 32 and a half-wavelength plate 34 constitute a laser beam generating mechanism capable of generating a laser beam having a polarization plane with a predetermined direction.
38是具有偏振分離膜36的偏振光束分光器,並配置有檢測穿透偏振分離膜36的P偏光的雷射光束之光電二極體等之第1受光元件40、與檢測在偏振分離膜36反射的S偏光的雷射光束之光電二極體等之第2受光元件42。第1受光元件40以及第2受光元件42的輸出會被輸入到圖3所示的演算機構46。 38 is a polarization beam splitter having a polarization separation film 36, and a first light receiving element 40, such as a photodiode, which detects a P-polarized laser beam that penetrates the polarization separation film 36, and a detection beam polarization detector 36 A second light receiving element 42 such as a photodiode of the reflected S-polarized laser beam. The outputs of the first light-receiving element 40 and the second light-receiving element 42 are input to the calculation mechanism 46 shown in FIG. 3.
接著,參照圖2,說明六方晶體單晶基板11的c軸與定向平面13的關係。六方晶體單晶基板11可以選用SiC 基板或GaN基板,以下的說明是以採用SiC基板11的基板來進行說明。 Next, the relationship between the c-axis of the hexagonal crystal single crystal substrate 11 and the orientation plane 13 will be described with reference to FIG. 2. Hexagonal crystal single crystal substrate 11 can use SiC The substrate or the GaN substrate will be described below using a substrate using the SiC substrate 11.
SiC基板11具有第1面(上表面)11a及與第1面為相反側的第2面(背面)11b。基板11的上表面11a是被研磨成用於成為雷射光束的照射面之鏡面。 The SiC substrate 11 has a first surface (upper surface) 11a and a second surface (back surface) 11b opposite to the first surface. The upper surface 11a of the substrate 11 is a mirror surface polished to become an irradiation surface of a laser beam.
SiC基板11具有第1定向平面13、及與第1定向平面13正交的第2定向平面15。第1定向平面13的長度形成為比第2定向平面15的長度短。 The SiC substrate 11 includes a first alignment plane 13 and a second alignment plane 15 that is orthogonal to the first alignment plane 13. The length of the first orientation plane 13 is shorter than the length of the second orientation plane 15.
SiC基板11具有相對於上表面11a的垂線17在第1定向平面13方向上傾斜偏角α的c軸19、及與c軸19正交的圖未示的c面。c面會相對於SiC基板11的上表面11a而傾斜偏角α。一般而言,在SiC基板11中,與短的第1定向平面13的伸長方向正交的方向為c軸19的傾斜方向。 The SiC substrate 11 has a c-axis 19 which is inclined at an off-angle α from the vertical line 17 of the upper surface 11 a in the direction of the first orientation plane 13, and a c-plane (not shown) orthogonal to the c-axis 19. The c-plane is inclined at an off-angle α with respect to the upper surface 11 a of the SiC substrate 11. In general, in the SiC substrate 11, a direction orthogonal to the elongation direction of the short first alignment plane 13 is an oblique direction of the c-axis 19.
c面在基板11中,在基板11的分子層級上設定為無數個。本實施形態中,是將偏角α設定為4°。然而,偏角α並不受限於4°,可在例如1°~6°的範圍內自由地設定而製造SiC基板11。 The c-plane in the substrate 11 is set to an infinite number at the molecular level of the substrate 11. In this embodiment, the deflection angle α is set to 4 °. However, the deflection angle α is not limited to 4 °, and the SiC substrate 11 can be freely set within a range of, for example, 1 ° to 6 °.
如上所述,雖然是以使c軸19的傾斜方向與第1定向平面13的伸長方向正交的方式形成第1定向平面13及第2定向平面15,但由於基板11的製造誤差,會有下列情形:c軸的傾斜方向不一定嚴密地與第1定向平面13的伸長方向正交,並以非常小的角度,例如1°~2°左右從正交方向偏離。 As described above, although the first orientation plane 13 and the second orientation plane 15 are formed so that the inclination direction of the c-axis 19 and the elongation direction of the first orientation plane 13 are orthogonal, there may be a manufacturing error of the substrate 11 and there may be In the following case, the inclination direction of the c-axis is not necessarily strictly orthogonal to the elongation direction of the first orientation plane 13 and deviates from the orthogonal direction at a very small angle, for example, about 1 ° to 2 °.
像這樣的情況下,當以第1定向平面13的伸長方向為基準來實施加工時,會有有時無法施行所期望的加工 之問題。本發明是做成嚴密地檢查c軸19相對於第1定向平面13的伸長方向而傾斜的偏角α之方向以解決這個問題的發明。 In such a case, when the processing is performed based on the elongation direction of the first orientation plane 13, the desired processing may not be performed in some cases. Problem. The present invention solves this problem by strictly inspecting the direction of the deflection angle α of the c-axis 19 inclined with respect to the elongation direction of the first orientation plane 13.
接著,參照圖3,詳細地說明本實施形態的檢查方法。再者,在以下的說明中,所說明的是將SiC基板採用作為六方晶體單晶基板11,並使偏角α相對於SiC基板11的上表面11a的垂線17為4°之例。 Next, the inspection method according to this embodiment will be described in detail with reference to FIG. 3. In the following description, an example is described in which a SiC substrate is used as a hexagonal crystal single crystal substrate 11 and the deflection angle α is 4 ° with respect to the vertical line 17 of the upper surface 11 a of the SiC substrate 11.
將保持台14的吸引孔20連接至吸引源,以保持台14將已載置在保持台14上的SiC基板11吸引保持。然後,作動He-Ne雷射振盪器32,從He-Ne雷射振盪器32振盪產生波長632nm、平均輸出0.1W的雷射光束,以1/2波長板34將其偏光面旋轉,而將雷射光束轉換成P偏光的雷射光束,並垂直地照射在保持於保持台14的SiC基板11的第1面(上表面)11a。 The suction hole 20 of the holding stage 14 is connected to a suction source so that the holding stage 14 sucks and holds the SiC substrate 11 already placed on the holding stage 14. Then, the He-Ne laser oscillator 32 is operated, and the He-Ne laser oscillator 32 is oscillated to generate a laser beam with a wavelength of 632 nm and an average output of 0.1 W. The polarization plane is rotated by a 1/2 wavelength plate 34, and The laser beam is converted into a P-polarized laser beam, and irradiates the first surface (upper surface) 11 a of the SiC substrate 11 held on the holding table 14 vertically.
在照射雷射光束的同時,驅動馬達22,以將保持有SiC基板11的保持台14朝箭頭R1方向旋轉。已穿透SiC基板11的雷射光束是以偏振光束分光器(PBS)38,而被分歧成穿透偏振分離膜36的P偏光雷射光束、與在偏振分離膜36反射的S偏光雷射光束。 While irradiating the laser beam, the motor 22 is driven to rotate the holding table 14 holding the SiC substrate 11 in the direction of the arrow R1. The laser beam that has penetrated the SiC substrate 11 is a polarization beam splitter (PBS) 38, and is split into a P-polarized laser beam that penetrates the polarization separation film 36 and an S-polarized laser that is reflected by the polarization separation film 36. beam.
P偏光雷射光束是以第1受光元件40檢測,S偏光雷射光束是以第2受光元件42檢測。以第1受光元件40所檢測出的P偏光雷射光束的光量會被轉換成例如電壓值,而被輸入到演算機構46,以第2受光元件42所檢測出的S偏光雷射光束的光量會被轉換成例如電壓值,而被輸入到演算機 構46。 The P-polarized laser beam is detected by the first light receiving element 40, and the S-polarized laser beam is detected by the second light receiving element 42. The light amount of the P-polarized laser beam detected by the first light receiving element 40 is converted into, for example, a voltage value, and is input to the calculation mechanism 46. The light amount of the S-polarized laser beam detected by the second light receiving element 42 is Will be converted to, for example, a voltage value and input to a computer 建 46.
在演算機構46中,會計算以第1受光元件40所檢測出的P偏光的光量相對於以第2受光元件42所檢測出的S偏光的光量的比例,亦即(P偏光的光量)/(S偏光的光量)。並且,將計算結果顯示在如圖5所示的監視器(顯示機構)50上。 The calculation mechanism 46 calculates the ratio of the amount of P-polarized light detected by the first light-receiving element 40 to the amount of S-polarized light detected by the second light-receiving element 42, that is, (the amount of P-polarized light) / (Light quantity of S polarized light). Then, the calculation result is displayed on a monitor (display mechanism) 50 as shown in FIG. 5.
顯示在顯示機構50上的光量比,因為c軸19方向的折射率與c面方向的折射率不同,而成為正弦曲線,並在將SiC基板11旋轉1圈的期間,於4個方向上出現峰值。亦即,如圖5所示,在360°的範圍出現4個山峰的峰值P1~P4。 The light quantity ratio displayed on the display mechanism 50 has a sinusoidal curve because the refractive index in the c-axis 19 direction is different from the refractive index in the c-plane direction, and appears in four directions while rotating the SiC substrate 11 by one turn. Peak. That is, as shown in FIG. 5, four peaks P1 to P4 appear in a range of 360 °.
另一方面,在SiC基板11旋轉的期間以定向平面檢測器44檢測出第1定向平面13時的旋轉角度是如圖5所示為42.5°。 On the other hand, the rotation angle when the first orientation plane 13 is detected by the orientation plane detector 44 during the rotation of the SiC substrate 11 is 42.5 ° as shown in FIG. 5.
由於將SiC基板11製造成第1定向平面13相對於形成有偏角α的方向(亦即c軸19相對於基板11的上表面11a的垂線17傾斜的方向)正交,因此,以與檢測出第1定向平面13的旋轉角度42.5°近似之旋轉角度所顯現之光量比之峰值P1的旋轉角度(在本實施形態中為44°的旋轉角度),決定為c軸19傾斜的方向。 Since the SiC substrate 11 is manufactured so that the first orientation plane 13 is orthogonal to the direction in which the deflection angle α is formed (that is, the direction in which the c-axis 19 is inclined with respect to the vertical line 17 of the upper surface 11a of the substrate 11), The rotation angle (the rotation angle of 44 ° in this embodiment) at which the peak value P1 of the light quantity ratio appears from the rotation angle of the first orientation plane 13 approximately 42.5 ° is determined as the direction in which the c-axis 19 is inclined.
從而,如圖4所示,將相對於第1定向平面13的垂線21的偏角的方向(亦即c軸19傾斜的方向β)算出為42.5°-44°=-1.5°。據此,只要相對於第1定向平面13的垂線21以-1.5°作為補正值來進行加工,即可施行所期望的加工。 Therefore, as shown in FIG. 4, the direction of the deflection angle of the vertical line 21 with respect to the first orientation plane 13 (that is, the direction β in which the c-axis 19 is inclined) is calculated as 42.5 ° -44 ° = -1.5 °. Accordingly, as long as the vertical line 21 of the first orientation plane 13 is processed with a correction value of -1.5 °, a desired processing can be performed.
再者,當相對於SiC基板11照射S偏光的雷射光束 後,(P偏光的光量)/(S偏光的光量)會顯現為正弦曲線的波谷。因此,在此情況下是做成以演算機構46演算(P偏光的光量)/(S偏光的光量),而使c軸方向顯現在正弦曲線的波谷的底部附近。 Furthermore, when an S-polarized laser beam is irradiated onto the SiC substrate 11 Later, (the amount of light of P polarized light) / (the amount of light of S polarized light) appears as a trough of a sinusoidal curve. Therefore, in this case, the calculation mechanism 46 calculates (the amount of light of P polarized light) / (the amount of light of S polarized light) so that the c-axis direction appears near the bottom of the trough of the sine curve.
當偏角α為0時,亦即當SiC基板11的上表面11a的垂線17與c軸19一致時,在已將P偏光的雷射光束照射在SiC基板11的情形下,不論旋轉角度為何,都使(P偏光的光量)/(S偏光的光量)成為固定,且大約為2。 When the deflection angle α is 0, that is, when the vertical line 17 of the upper surface 11a of the SiC substrate 11 coincides with the c-axis 19, in the case where the laser beam of P polarization has been irradiated on the SiC substrate 11, regardless of the rotation angle , Both make (the amount of light of P polarized light) / (the amount of light of S polarized light) fixed, and are about 2.
在上述的實施形態中,雖然是做成一邊使已保持有SiC基板11的保持台14旋轉一邊照射P偏光的雷射光束之構成,但也可以做成不使保持台14旋轉而將其固定,並一邊使1/2波長板34旋轉一邊將雷射光束照射在已保持於保持台20上的SiC基板11上。在此情況下,P偏光與S偏光的光量比也會形成正弦曲線,而使c軸顯現在正弦曲線的峰值的旋轉角度上。 In the above-mentioned embodiment, although the laser beam is irradiated with P-polarized light while the holding table 14 holding the SiC substrate 11 is rotated, the holding table 14 may be fixed without rotating it. While irradiating the laser beam on the SiC substrate 11 already held on the holding table 20 while rotating the 1/2 wavelength plate 34. In this case, the light amount ratio of the P-polarized light and the S-polarized light also forms a sinusoidal curve, and the c-axis appears at the rotation angle of the peak of the sinusoidal curve.
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JP2014194352A (en) * | 2013-03-28 | 2014-10-09 | Nippon Steel & Sumitomo Metal | Method for measuring plane orientation of single crystal substrate comprising uniaxial crystal, and device for measuring plane orientation used for the method |
Also Published As
Publication number | Publication date |
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CN105895546A (en) | 2016-08-24 |
JP2016151457A (en) | 2016-08-22 |
CN105895546B (en) | 2020-06-30 |
JP6444207B2 (en) | 2018-12-26 |
KR102425117B1 (en) | 2022-07-26 |
TW201631308A (en) | 2016-09-01 |
KR20160101679A (en) | 2016-08-25 |
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