TWI671928B - Display panel - Google Patents
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- TWI671928B TWI671928B TW107121008A TW107121008A TWI671928B TW I671928 B TWI671928 B TW I671928B TW 107121008 A TW107121008 A TW 107121008A TW 107121008 A TW107121008 A TW 107121008A TW I671928 B TWI671928 B TW I671928B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H10K59/12—Active-matrix OLED [AMOLED] displays
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Abstract
一種顯示面板,包括以下元件。至少一主動元件位於基底上。絕緣層位於至少一主動元件上。畫素定義層位於絕緣層上。至少一電致發光層的至少一部分位於畫素定義層之至少一容置部中,且電性連接至至少一主動元件以構成至少一畫素。至少一溝槽貫穿畫素定義層且鄰近於電致發光層。上電極位於至少一電致發光層上且其至少一部分填入至少一溝槽中。封裝層位於上電極上,且封裝層的至少一部分填入至少一溝槽中。A display panel includes the following elements. At least one active element is located on the substrate. The insulating layer is on the at least one active device. The pixel definition layer is located on the insulation layer. At least a part of the at least one electroluminescent layer is located in at least one accommodating portion of the pixel definition layer, and is electrically connected to at least one active device to form at least one pixel. At least one trench runs through the pixel definition layer and is adjacent to the electroluminescent layer. The upper electrode is located on the at least one electroluminescent layer and at least a part of the upper electrode is filled in the at least one trench. The encapsulation layer is located on the upper electrode, and at least a portion of the encapsulation layer fills at least one trench.
Description
本發明是有關於一種顯示面板,且特別是有關於一種具有電致發光元件的顯示面板。The present invention relates to a display panel, and more particularly, to a display panel having an electroluminescent element.
有機電致發光元件(organic electroluminescent device)是一種可將電能轉換成光能且具有高轉換效率的半導體元件,其常見的用途為指示燈以及顯示面板之發光元件等。由於有機電致發光元件具備如無視角問題與全彩化等特性,因此符合多媒體時代顯示器特性的要求,可望成為平面顯示器之主流。Organic electroluminescent device (organic electroluminescent device) is a semiconductor device that can convert electrical energy into light energy and has high conversion efficiency. Its common uses are light emitting devices such as indicator lights and display panels. Since the organic electroluminescent device has characteristics such as no viewing angle problem and full color, it meets the requirements of the display characteristics of the multimedia era and is expected to become the mainstream of flat panel displays.
然而,空氣中的氧氣及水分等成分會破壞有機電致發光元件中的有機電致發光層,進而影響有機電致發光元件的使用壽命。因此,如何提供一種有機電致發光元件的封裝技術,以增加有機電致發光元件的使用壽命將成為重要的一門課題。However, components such as oxygen and moisture in the air will damage the organic electroluminescent layer in the organic electroluminescent device, and then affect the service life of the organic electroluminescent device. Therefore, how to provide an organic electroluminescence element packaging technology to increase the service life of the organic electroluminescence element will become an important subject.
本發明之一實施例提供一種顯示面板,其將封裝層的一部分填入鄰近電致發光元件的溝槽中,以增加顯示面板的側向之阻水氧能力,進而提升顯示面板的使用壽命。An embodiment of the present invention provides a display panel in which a part of the encapsulation layer is filled into a trench adjacent to the electroluminescent element, so as to increase the lateral water and oxygen blocking ability of the display panel, thereby improving the service life of the display panel.
本發明之一實施例提供一種顯示面板,包括基底、至少一主動元件、絕緣層、畫素定義層、至少一電致發光層、上電極以及封裝層。至少一主動元件位於基底上。絕緣層位於至少一主動元件上。畫素定義層位於絕緣層上。至少一電致發光層的至少一部分位於畫素定義層之至少一容置部中,且電性連接至至少一主動元件以構成至少一畫素。至少一溝槽貫穿畫素定義層且鄰近於至少一電致發光層。上電極位於至少一電致發光層上且其至少一部分填入至少一溝槽中。封裝層位於上電極上,且封裝層的至少一部分填入至少一溝槽中。An embodiment of the present invention provides a display panel including a substrate, at least one active element, an insulating layer, a pixel definition layer, at least one electroluminescent layer, an upper electrode, and a packaging layer. At least one active element is located on the substrate. The insulating layer is on the at least one active device. The pixel definition layer is located on the insulation layer. At least a part of the at least one electroluminescent layer is located in at least one accommodating portion of the pixel definition layer, and is electrically connected to at least one active device to form at least one pixel. At least one trench runs through the pixel defining layer and is adjacent to the at least one electroluminescent layer. The upper electrode is located on the at least one electroluminescent layer and at least a part of the upper electrode is filled in the at least one trench. The encapsulation layer is located on the upper electrode, and at least a portion of the encapsulation layer fills at least one trench.
基於上述,本發明之一實施例將封裝層的一部分填入鄰近電致發光元件的溝槽中,以增加顯示面板的側向之阻水氧能力,進而提升顯示面板的使用壽命。本發明之另一實施例可在相鄰兩個畫素之間形成貫穿畫素定義層與絕緣層的多個開口,以增加顯示面板的可撓性。此外,封裝層的另一部分亦可填入多個開口中,以更進一步地增加顯示面板的阻水氧能力。Based on the above, an embodiment of the present invention fills a part of the encapsulation layer into a trench adjacent to the electroluminescent element to increase the lateral water and oxygen blocking ability of the display panel, thereby improving the service life of the display panel. According to another embodiment of the present invention, a plurality of openings penetrating the pixel definition layer and the insulation layer may be formed between two adjacent pixels to increase the flexibility of the display panel. In addition, another part of the encapsulation layer can also be filled into the plurality of openings, so as to further increase the water and oxygen blocking ability of the display panel.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above features and advantages of the present invention more comprehensible, embodiments are hereinafter described in detail with reference to the accompanying drawings.
參照本實施例之圖式以更全面地闡述本發明。然而,本發明亦可以各種不同的形式體現,而不應限於本文中所述之實施例。圖式中的層與區域的厚度會為了清楚起見而放大。相同或相似之標號表示相同或相似之元件,以下段落將不再一一贅述。The invention is explained more fully with reference to the drawings of this embodiment. However, the present invention may be embodied in various forms and should not be limited to the embodiments described herein. The thicknesses of layers and regions in the drawings are exaggerated for clarity. The same or similar reference numerals indicate the same or similar elements, and the following paragraphs will not repeat them one by one.
圖1是依照本發明的第一實施例的一種顯示面板的剖面示意圖。FIG. 1 is a schematic cross-sectional view of a display panel according to a first embodiment of the present invention.
請參照圖1,本發明的第一實施例提供一種顯示面板10,其包括基底100、主動元件AD、層間絕緣層108、114、116、118、畫素定義層122、電致發光元件EL以及封裝層130。在一實施例中,基板100的材料可以是無機透明材料(例如玻璃、石英、其它適合材料及其組合)、有機透明材料(例如聚烯類、聚酼類、聚醇類、聚酯類、橡膠、熱塑性聚合物、熱固性聚合物、聚芳香烴類、聚甲基丙醯酸甲酯類、聚碳酸酯類、其它合適材料、上述之衍生物及其組合)或其組合。Referring to FIG. 1, a first embodiment of the present invention provides a display panel 10 including a substrate 100, an active element AD, an interlayer insulating layer 108, 114, 116, 118, a pixel definition layer 122, an electroluminescent element EL, and Capsulation layer 130. In an embodiment, the material of the substrate 100 may be an inorganic transparent material (such as glass, quartz, other suitable materials, and combinations thereof), an organic transparent material (such as polyolefin, polyfluorene, polyalcohol, polyester, Rubber, thermoplastic polymer, thermosetting polymer, polyaromatic hydrocarbon, polymethylpropionate, polycarbonate, other suitable materials, derivatives thereof and combinations thereof) or a combination thereof.
如圖1所示,主動元件AD位於基底100上。主動元件AD包括主動層102、閘絕緣層104、閘極106、汲極110以及源極112,但本發明不以此為限。主動層102配置在基底100上。在一實施例中,主動層102的材料包括半導體材料。所述半導體材料包括(但不限於)矽基半導體材料(例如多晶矽)、氧化物基半導體材料(例如氧化銦、氧化錫、氧化鋅、氧化銦鎵鋅等)或其組合。As shown in FIG. 1, the active element AD is located on a substrate 100. The active device AD includes an active layer 102, a gate insulating layer 104, a gate 106, a drain 110, and a source 112, but the invention is not limited thereto. The active layer 102 is disposed on the substrate 100. In one embodiment, the material of the active layer 102 includes a semiconductor material. The semiconductor material includes, but is not limited to, a silicon-based semiconductor material (such as polycrystalline silicon), an oxide-based semiconductor material (such as indium oxide, tin oxide, zinc oxide, indium gallium zinc oxide, etc.), or a combination thereof.
閘絕緣層104配置在主動層102上,以覆蓋主動層102與基底100的表面。在一實施例中,閘絕緣層104的材料包括矽的氧化物(例如氧化矽)、矽的氮化物(例如氮化矽)或其組合。雖然圖1僅繪示出單一層的閘絕緣層104,但本發明不以此為限。在其他實施例中,閘絕緣層104可以是兩層結構或是更多層結構。在替代實施例中,當閘絕緣層104為兩層結構時,其可包括不同材料。The gate insulation layer 104 is disposed on the active layer 102 to cover the surfaces of the active layer 102 and the substrate 100. In one embodiment, the material of the gate insulating layer 104 includes an oxide of silicon (such as silicon oxide), a nitride of silicon (such as silicon nitride), or a combination thereof. Although FIG. 1 illustrates only a single layer of the gate insulating layer 104, the present invention is not limited thereto. In other embodiments, the gate insulation layer 104 may have a two-layer structure or a multi-layer structure. In an alternative embodiment, when the gate insulation layer 104 is a two-layer structure, it may include different materials.
閘極106配置在閘絕緣層104上,使得閘絕緣層104位於主動層102與閘極106之間。在一實施例中,閘極106可包括金屬材料,例如是鉬、鋁、鉻、金、鈦、鎳、銅及其合金。The gate electrode 106 is disposed on the gate insulating layer 104 such that the gate insulating layer 104 is located between the active layer 102 and the gate electrode 106. In one embodiment, the gate electrode 106 may include a metal material, such as molybdenum, aluminum, chromium, gold, titanium, nickel, copper, and alloys thereof.
層間絕緣層108配置在閘極106上,以覆蓋閘極106與閘絕緣層104的表面。在一實施例中,層間絕緣層108的材料包括無機介電材料,其包括矽的氧化物(例如氧化矽)、矽的氮化物(例如氮化矽)或其組合。The interlayer insulating layer 108 is disposed on the gate electrode 106 to cover the surfaces of the gate electrode 106 and the gate insulating layer 104. In one embodiment, the material of the interlayer insulating layer 108 includes an inorganic dielectric material, which includes an oxide of silicon (such as silicon oxide), a nitride of silicon (such as silicon nitride), or a combination thereof.
汲極110與源極112分別配置在層間絕緣層108上。汲極110與源極112藉由層間絕緣層108與閘絕緣層104中的接觸洞(未標示)分別與主動層102電性連接。在一實施例中,汲極110與源極112的材料包括導電材料,其包括金屬、金屬氧化物或其組合。所述金屬可例如是鉬、鋁、鉻、金、鈦、鎳、銅及其合金。所述金屬氧化物可例如是銦錫氧化物(ITO)、銦鋅氧化物(IZO)或其組合。在其他實施例中,汲極110與源極112可以是相同的導電材料。在替代實施例中,汲極110與源極112亦可以是不同的導電材料。The drain electrode 110 and the source electrode 112 are respectively disposed on the interlayer insulating layer 108. The drain electrode 110 and the source electrode 112 are electrically connected to the active layer 102 through contact holes (not labeled) in the interlayer insulating layer 108 and the gate insulating layer 104, respectively. In an embodiment, the material of the drain electrode 110 and the source electrode 112 includes a conductive material including a metal, a metal oxide, or a combination thereof. The metal may be, for example, molybdenum, aluminum, chromium, gold, titanium, nickel, copper, and alloys thereof. The metal oxide may be, for example, indium tin oxide (ITO), indium zinc oxide (IZO), or a combination thereof. In other embodiments, the drain 110 and the source 112 may be the same conductive material. In alternative embodiments, the drain 110 and the source 112 may also be different conductive materials.
如圖1所示,層間絕緣層114、116、118依序配置在汲極110與源極112上。在一實施例中,依序堆疊的層間絕緣層114、116、118可視為一絕緣層。舉例而言,層間絕緣層114覆蓋汲極110、源極112以及層間絕緣層108的表面上。層間絕緣層116位於層間絕緣層114、118之間。在一實施例中,層間絕緣層114的材料包括無機介電材料,其包括矽的氧化物(例如氧化矽)、矽的氮化物(例如氮化矽)或其組合。在替代實施例中,層間絕緣層108的材料與層間絕緣層114的材料相同。在其他實施例中,層間絕緣層108的材料與層間絕緣層114的材料不同。舉例來說,層間絕緣層108可以是氧化矽;層間絕緣層114可以是氮化矽。As shown in FIG. 1, the interlayer insulation layers 114, 116, and 118 are sequentially disposed on the drain electrode 110 and the source electrode 112. In an embodiment, the inter-layer insulation layers 114, 116, and 118 sequentially stacked can be regarded as an insulation layer. For example, the interlayer insulating layer 114 covers the surfaces of the drain 110, the source 112, and the interlayer insulating layer 108. The interlayer insulating layer 116 is located between the interlayer insulating layers 114 and 118. In one embodiment, the material of the interlayer insulating layer 114 includes an inorganic dielectric material, which includes an oxide of silicon (such as silicon oxide), a nitride of silicon (such as silicon nitride), or a combination thereof. In an alternative embodiment, the material of the interlayer insulating layer 108 is the same as the material of the interlayer insulating layer 114. In other embodiments, the material of the interlayer insulating layer 108 is different from the material of the interlayer insulating layer 114. For example, the interlayer insulating layer 108 may be silicon oxide; the interlayer insulating layer 114 may be silicon nitride.
在一實施例中,層間絕緣層116的材料包括無機介電材料,其包括矽的氧化物(例如氧化矽)、矽的氮化物(例如氮化矽)或其組合。在其他實施例中,層間絕緣層118的材料包括有機介電材料,其可例如是光阻材料、丙烯酸類樹脂、環氧樹脂、聚醯亞胺樹脂或其組合。但本發明不以此為限,在其他實施例中,層間絕緣層116亦可以是有機介電材料;而層間絕緣層118亦可以是無機介電材料。In an embodiment, the material of the interlayer insulating layer 116 includes an inorganic dielectric material, which includes an oxide of silicon (such as silicon oxide), a nitride of silicon (such as silicon nitride), or a combination thereof. In other embodiments, the material of the interlayer insulating layer 118 includes an organic dielectric material, which may be, for example, a photoresist material, an acrylic resin, an epoxy resin, a polyimide resin, or a combination thereof. However, the present invention is not limited to this. In other embodiments, the interlayer insulating layer 116 may also be an organic dielectric material; and the interlayer insulating layer 118 may also be an inorganic dielectric material.
如圖1所示,電致發光元件EL配置在層間絕緣層118上,並電性連接至主動元件AD以構成畫素P。電致發光元件EL包括下電極120、電致發光層124以及上電極126,但本發明不以此為限。下電極120配置在層間絕緣層118上,且藉由層間絕緣層118、116、114中的接觸洞(未標示)電性連接於汲極110。As shown in FIG. 1, the electroluminescent element EL is disposed on the interlayer insulating layer 118 and is electrically connected to the active element AD to form a pixel P. The electroluminescent element EL includes a lower electrode 120, an electroluminescent layer 124, and an upper electrode 126, but the invention is not limited thereto. The lower electrode 120 is disposed on the interlayer insulating layer 118 and is electrically connected to the drain electrode 110 through contact holes (not labeled) in the interlayer insulating layers 118, 116, and 114.
畫素定義層122配置在下電極120上。如圖1所示,畫素定義層122具有對應於下電極120的容置部123。在一實施例中,畫素定義層122包括有機介電材料、無機介電材料或其組合。所述有機介電材料可例如是光阻材料、丙烯酸類樹脂、環氧樹脂、聚醯亞胺樹脂或其組合。所述無機介電材料包括矽的氧化物(例如氧化矽)、矽的氮化物(例如氮化矽)或其組合。The pixel definition layer 122 is disposed on the lower electrode 120. As shown in FIG. 1, the pixel definition layer 122 has a receiving portion 123 corresponding to the lower electrode 120. In one embodiment, the pixel definition layer 122 includes an organic dielectric material, an inorganic dielectric material, or a combination thereof. The organic dielectric material may be, for example, a photoresist material, an acrylic resin, an epoxy resin, a polyimide resin, or a combination thereof. The inorganic dielectric material includes an oxide of silicon (such as silicon oxide), a nitride of silicon (such as silicon nitride), or a combination thereof.
電致發光層124之至少一部分配置在容置部123中。在一實施例中,電致發光層124可包括依序堆疊的電洞注入層、電洞傳輸層、發光層、電子傳輸層以及電子注入層。但本發明不以此為限,在其他實施例中可依據設計來調整或更動電致發光層124的配置。上電極126配置在電致發光層124上且延伸覆蓋畫素定義層122的頂面。At least a part of the electroluminescent layer 124 is disposed in the accommodating portion 123. In one embodiment, the electroluminescent layer 124 may include a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer that are sequentially stacked. However, the present invention is not limited thereto. In other embodiments, the configuration of the electroluminescent layer 124 can be adjusted or changed according to the design. The upper electrode 126 is disposed on the electroluminescent layer 124 and extends to cover the top surface of the pixel definition layer 122.
畫素定義層122更包括溝槽125,其鄰近於電致發光元件EL。舉例而言,溝槽125貫穿畫素定義層122與層間絕緣層118,以暴露出層間絕緣層116的頂面。雖然剖面圖1繪示出兩個溝槽125分別位於電致發光元件EL的兩側,但本發明不以此為限。請參照圖1,上電極126的一部分填入溝槽125中,舉例而言,上電極126自電致發光層124的頂面,經由畫素定義層122的頂面,延伸且覆蓋溝槽125的表面。在一實施例中,上電極126可以是透明電極。The pixel definition layer 122 further includes a trench 125, which is adjacent to the electroluminescent element EL. For example, the trench 125 penetrates the pixel definition layer 122 and the interlayer insulation layer 118 to expose the top surface of the interlayer insulation layer 116. Although the cross-sectional view of FIG. 1 shows that the two trenches 125 are respectively located on two sides of the electroluminescent element EL, the present invention is not limited thereto. Referring to FIG. 1, a part of the upper electrode 126 is filled in the trench 125. For example, the upper electrode 126 extends from the top surface of the electroluminescent layer 124 and covers the trench 125 through the top surface of the pixel definition layer 122. s surface. In one embodiment, the upper electrode 126 may be a transparent electrode.
如圖1所示,封裝層130配置在上電極126上。封裝層130包括但不限於封裝材料132、134、136。封裝材料132全面性地形成在基底100上,且填入(或填滿)溝槽125中。封裝材料134配置在封裝材料132、136之間。在一實施例中,封裝材料132、136的材料包括無機材料,例如是氮化矽、氧化矽、氮氧化矽、氧化鋁、氮化鋁、其組合或其他合適的無機材料。封裝材料134包括有機材料,例如是丙烯酸酯(acrylate)、丙烯酸甲酯(methacrylate)、丙烯酸(acrylic acid)、六甲基二矽氧烷(hexamethyldisiloxane,HMDSO)、其組合或其他合適的有機材料。雖然圖1所繪示出的封裝層130僅包括3層封裝材料132、134、136,但本發明不以此為限。在其他實施例中,封裝層130可包括多個無機材料與多個有機材料所構成的堆疊層。As shown in FIG. 1, the packaging layer 130 is disposed on the upper electrode 126. The packaging layer 130 includes, but is not limited to, packaging materials 132, 134, and 136. The packaging material 132 is comprehensively formed on the substrate 100 and fills (or fills) the trenches 125. The sealing material 134 is disposed between the sealing materials 132 and 136. In one embodiment, the materials of the packaging materials 132 and 136 include inorganic materials, such as silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, aluminum nitride, a combination thereof, or other suitable inorganic materials. The packaging material 134 includes an organic material, such as acrylate, methacrylate, acrylic acid, hexamethyldisiloxane (HMDSO), a combination thereof, or other suitable organic materials. Although the packaging layer 130 shown in FIG. 1 includes only three layers of packaging materials 132, 134, and 136, the present invention is not limited thereto. In other embodiments, the encapsulation layer 130 may include a stacked layer composed of a plurality of inorganic materials and a plurality of organic materials.
在本實施例中,封裝層130的封裝材料132填入鄰近電致發光元件EL的溝槽125中,其可增加顯示面板10的側向之阻水氧能力,進而提升顯示面板10的使用壽命。另外,多個畫素P所在的顯示區(未標示)內因設置了溝槽125來作為阻水氧結構之一部分,故不須額外在顯示面板10之週邊區設置阻水氧結構或不須將位於週邊區之封裝層130設計為具有足夠大的寬度用以阻水氧,故本實施例亦可達到窄邊框的效果。In this embodiment, the encapsulation material 132 of the encapsulation layer 130 is filled in the trench 125 adjacent to the electroluminescent element EL, which can increase the lateral water and oxygen blocking ability of the display panel 10, thereby improving the service life of the display panel 10. . In addition, since a groove 125 is provided as a part of the water blocking oxygen structure in the display area (not labeled) where multiple pixels P are located, there is no need to additionally provide a water blocking oxygen structure or surround the display panel 10. The encapsulation layer 130 located in the peripheral area is designed to have a sufficiently large width to block water and oxygen, so this embodiment can also achieve the effect of a narrow frame.
另外,本實施例的顯示面板10亦可選擇性地包括緩衝層101。緩衝層101配置在基底100與主動元件AD之間。在一實施例中,緩衝層101的材料可包括氮化矽、氧化矽、氮氧化矽或其組合。In addition, the display panel 10 of this embodiment may optionally include a buffer layer 101. The buffer layer 101 is disposed between the substrate 100 and the active device AD. In one embodiment, the material of the buffer layer 101 may include silicon nitride, silicon oxide, silicon oxynitride, or a combination thereof.
圖2是依照本發明的第二實施例的一種顯示面板的剖面示意圖。FIG. 2 is a schematic cross-sectional view of a display panel according to a second embodiment of the present invention.
請參照圖2,第二實施例的顯示面板20與第一實施例的顯示面板10基本上相似,相似的構件的材料與配置已於上述段落說明過,於此便不再贅述。上述兩者不同之處在於:第二實施例的顯示面板20的溝槽225貫穿畫素定義層122、層間絕緣層118、116、114、108、閘絕緣層104以及緩衝層101,以暴露出基底100的頂面。上電極126的一部分填入溝槽225中。封裝層130的封裝材料132的一部分亦填入(或填滿)溝槽225中。Referring to FIG. 2, the display panel 20 of the second embodiment is basically similar to the display panel 10 of the first embodiment. The materials and configurations of similar components have been described in the above paragraphs, and will not be repeated here. The difference between the above two is that the trench 225 of the display panel 20 of the second embodiment penetrates the pixel definition layer 122, the interlayer insulation layers 118, 116, 114, 108, the gate insulation layer 104 and the buffer layer 101 to expose The top surface of the substrate 100. A part of the upper electrode 126 is filled in the trench 225. A portion of the encapsulation material 132 of the encapsulation layer 130 is also filled (or filled) in the trench 225.
在本實施例中,以填入溝槽225的封裝材料132當作阻水氧結構,其不僅可側向保護電致發光元件EL,還可進一步地側向保護主動元件AD,以達到更全面性的封裝。In this embodiment, the encapsulation material 132 filling the trench 225 is used as a water blocking oxygen structure, which can not only protect the electroluminescent element EL laterally, but also further protect the active element AD laterally to achieve a more comprehensive Sexual encapsulation.
另外,顯示面板20更包括線路結構210、212、214配置在基底100的下方。舉例來說,線路結構210配置在基底100的底面100b上,線路結構210藉由基底100、緩衝層101、閘絕緣層104以及層間絕緣層108中的接觸洞(未標示)電性連接於汲極110。線路結構212配置在基底100的底面100b上,線路結構212藉由基底100、緩衝層101、閘絕緣層104以及層間絕緣層108中的接觸洞(未標示)電性連接於源極112。線路結構214配置在底面100b上,線路結構214藉由基底100以及緩衝層101中的接觸洞(未標示)電性連接於主動層102。In addition, the display panel 20 further includes circuit structures 210, 212, and 214 disposed under the substrate 100. For example, the circuit structure 210 is disposed on the bottom surface 100b of the substrate 100. The circuit structure 210 is electrically connected to the drain via the contact holes (not labeled) in the substrate 100, the buffer layer 101, the gate insulation layer 104, and the interlayer insulation layer 108.极 110。 The pole 110. The circuit structure 212 is disposed on the bottom surface 100b of the substrate 100. The circuit structure 212 is electrically connected to the source electrode 112 through contact holes (not labeled) in the substrate 100, the buffer layer 101, the gate insulation layer 104, and the interlayer insulation layer 108. The circuit structure 214 is disposed on the bottom surface 100 b. The circuit structure 214 is electrically connected to the active layer 102 through the contact holes (not labeled) in the substrate 100 and the buffer layer 101.
圖3是依照本發明的第三實施例的一種顯示面板的剖面示意圖。3 is a schematic cross-sectional view of a display panel according to a third embodiment of the present invention.
請參照圖3,第三實施例的顯示面板30與第一實施例的顯示面板10基本上相似,相似的構件的材料與配置已於上述段落說明過,於此便不再贅述。上述兩者不同之處在於:顯示面板30之封裝材料134的一部分亦填入(或填滿)溝槽325中。也就是說,填入溝槽325的封裝材料132、134可用以當作阻水氧結構,以側向保護電致發光元件EL。Referring to FIG. 3, the display panel 30 of the third embodiment is basically similar to the display panel 10 of the first embodiment. The materials and configurations of similar components have been described in the above paragraphs, and will not be repeated here. The difference between the above two is that a part of the packaging material 134 of the display panel 30 is also filled (or filled) in the trench 325. That is, the packaging materials 132 and 134 filling the trench 325 can be used as a water blocking oxygen structure to protect the electroluminescent element EL laterally.
圖4是依照本發明的第四實施例的一種顯示面板的剖面示意圖。4 is a schematic cross-sectional view of a display panel according to a fourth embodiment of the present invention.
請參照圖4,第四實施例的顯示面板40與第二實施例的顯示面板20基本上相似,相似的構件的材料與配置已於上述段落說明過,於此便不再贅述。上述兩者不同之處在於:顯示面板40之封裝材料134的一部分亦填入(或填滿)溝槽425中。也就是說,填入溝槽425的封裝材料132、134可用以當作阻水氧結構,以側向保護電致發光元件EL與主動元件AD。Referring to FIG. 4, the display panel 40 of the fourth embodiment is basically similar to the display panel 20 of the second embodiment. The materials and configurations of similar components have been described in the above paragraphs, and will not be repeated here. The difference between the above two is that a part of the packaging material 134 of the display panel 40 is also filled (or filled) in the trench 425. In other words, the packaging materials 132 and 134 filling the trench 425 can be used as a water blocking oxygen structure to protect the electroluminescent element EL and the active element AD laterally.
圖5是依照本發明的第五實施例的一種顯示面板的剖面示意圖。FIG. 5 is a schematic cross-sectional view of a display panel according to a fifth embodiment of the present invention.
請參照圖5,第五實施例的顯示面板50與第一實施例的顯示面板10基本上相似,相似的構件的材料與配置已於上述段落說明過,於此便不再贅述。上述兩者不同之處在於:顯示面板50包括兩個畫素P配置在基底100上,而開口505配置在相鄰兩個畫素P之間。舉例來說,開口505貫穿畫素定義層122、層間絕緣層118、116、114、108、閘絕緣層104以及緩衝層101,以暴露基底100的頂面。在一實施例中,開口505、容置部123以及溝槽125可同時形成。但本發明不以此為限,在其他實施例中,開口505、容置部123以及溝槽125亦可分別形成。在形成開口505之後,可在基底100上全面性地形成上電極126,並在上電極126上依序形成封裝材料132、134。在上電極126與封裝材料132、134填入開口505中之後,移除封裝材料134的一部分,以暴露出封裝材料132的表面。在此情況下,如圖5所示,封裝材料134被分成兩個部分134a、134b,以分別配置在畫素P上。在形成封裝材料134a、134b之後,在基底100上全面性地形成封裝材料136。如圖5所示,封裝材料136共形地覆蓋封裝材料134a、134b的頂面與側壁。Referring to FIG. 5, the display panel 50 of the fifth embodiment is basically similar to the display panel 10 of the first embodiment. The materials and configurations of similar components have been described in the above paragraphs, and will not be repeated here. The above two are different in that the display panel 50 includes two pixels P disposed on the substrate 100, and the opening 505 is disposed between two adjacent pixels P. For example, the opening 505 penetrates the pixel definition layer 122, the interlayer insulation layers 118, 116, 114, 108, the gate insulation layer 104, and the buffer layer 101 to expose the top surface of the substrate 100. In one embodiment, the opening 505, the accommodating portion 123, and the groove 125 may be formed simultaneously. However, the present invention is not limited thereto. In other embodiments, the opening 505, the accommodating portion 123, and the groove 125 may be formed separately. After the opening 505 is formed, the upper electrode 126 can be formed on the substrate 100 in a comprehensive manner, and packaging materials 132 and 134 can be sequentially formed on the upper electrode 126. After the upper electrode 126 and the packaging materials 132 and 134 are filled in the opening 505, a part of the packaging material 134 is removed to expose the surface of the packaging material 132. In this case, as shown in FIG. 5, the packaging material 134 is divided into two portions 134 a and 134 b to be disposed on the pixels P, respectively. After the packaging materials 134 a and 134 b are formed, the packaging material 136 is formed on the substrate 100 in a comprehensive manner. As shown in FIG. 5, the packaging material 136 conformally covers the top surfaces and sidewalls of the packaging materials 134 a and 134 b.
值得注意的是,如圖5所示,開口505的寬度大於溝槽125的寬度。開口505可以是上寬下窄的開口。也就是說,開口505具有上部505a與下部505b,上部505a的寬度大於下部505b的寬度。但本發明不以此為限,在其他實施例中,上部505a的寬度可等於下部505b的寬度,以形成寬度一致的開口。另外,開口505的深度大於溝槽125的深度。但本發明不以此為限,在其他實施例中,開口505的深度亦可等於溝槽225(如圖2所示)的深度。It is worth noting that, as shown in FIG. 5, the width of the opening 505 is greater than the width of the trench 125. The opening 505 may be an upper wide lower narrow opening. That is, the opening 505 has an upper portion 505a and a lower portion 505b, and the width of the upper portion 505a is larger than the width of the lower portion 505b. However, the present invention is not limited thereto. In other embodiments, the width of the upper portion 505a may be equal to the width of the lower portion 505b, so as to form an opening with a uniform width. In addition, the depth of the opening 505 is greater than the depth of the trench 125. However, the present invention is not limited to this. In other embodiments, the depth of the opening 505 may be equal to the depth of the groove 225 (as shown in FIG. 2).
在本實施例中,溝槽125位於畫素P(或電致發光元件EL)與開口505之間。某種程度來說,填入溝槽125的封裝層130可用以當作第一阻水氧結構;而填入開口505的封裝層130可用以當作第二阻水氧結構。在此情況下,如圖5所示,此雙重阻水氧結構可進一步增加顯示面板50的側向之阻水氧能力,進而提升顯示面板50的使用壽命。另一方面,若顯示面板50應用於透明顯示器時,開口505的設置亦有增加顯示面板50的透明度的優點。In this embodiment, the groove 125 is located between the pixel P (or the electroluminescent element EL) and the opening 505. To a certain extent, the encapsulation layer 130 filled in the trench 125 can be used as a first water blocking oxygen structure; and the encapsulation layer 130 filled in the opening 505 can be used as a second water blocking oxygen structure. In this case, as shown in FIG. 5, the dual water-blocking oxygen structure can further increase the lateral water-blocking oxygen capacity of the display panel 50, thereby improving the service life of the display panel 50. On the other hand, if the display panel 50 is applied to a transparent display, the arrangement of the opening 505 also has the advantage of increasing the transparency of the display panel 50.
圖6是依照本發明的第六實施例的一種顯示面板的上視示意圖。為了圖式清楚起見,圖6僅繪示出畫素定義層122、溝槽125、畫素P1、P2(或電致發光元件EL1、EL2)以及開口605,其他構件的配置關係請參照剖面圖5。FIG. 6 is a schematic top view of a display panel according to a sixth embodiment of the present invention. For clarity of the drawing, FIG. 6 only illustrates the pixel definition layer 122, the groove 125, the pixels P1, P2 (or the electroluminescent elements EL1, EL2), and the opening 605. For the configuration relationship of other components, please refer to the section Figure 5.
請參照圖6,第六實施例的顯示面板60的溝槽125可以是單一個環狀溝槽,其環繞單一個畫素P1或電致發光元件EL1。另外,溝槽125可以是兩個環狀溝槽125a、125b,其環繞單一個畫素P1或電致發光元件EL1。但本發明不以此為限,溝槽125的數量與配置可依據實際需求來進行調整。在其他實施例中,環狀溝槽125可環繞由多個畫素P2(或電致發光元件EL2)所構成的陣列。在替代實施例中,兩個環狀溝槽125a、125b亦可環繞由多個畫素P2(或電致發光元件EL2)所構成的陣列。雖然圖6僅繪示出3×3的畫素陣列,但本發明不以此為限。畫素P2(或電致發光元件EL2)的數量與排列方式可依據實際需求來進行調整。Referring to FIG. 6, the groove 125 of the display panel 60 according to the sixth embodiment may be a single annular groove that surrounds a single pixel P1 or an electroluminescent element EL1. In addition, the trench 125 may be two annular trenches 125a, 125b that surround a single pixel P1 or the electroluminescent element EL1. However, the present invention is not limited thereto, and the number and configuration of the trenches 125 can be adjusted according to actual needs. In other embodiments, the annular groove 125 may surround an array composed of a plurality of pixels P2 (or the electroluminescent element EL2). In an alternative embodiment, the two annular grooves 125a, 125b may also surround an array composed of a plurality of pixels P2 (or the electroluminescent element EL2). Although FIG. 6 only illustrates a 3 × 3 pixel array, the present invention is not limited thereto. The number and arrangement of the pixels P2 (or the electroluminescent element EL2) can be adjusted according to actual needs.
值得注意的是,顯示面板60的開口605可以是環狀開口或是網格狀開口,其環繞溝槽125。由於開口605中的畫素定義層122、層間絕緣層118、116、114、108、閘絕緣層104以及緩衝層101已被移除,因此,整個顯示面板60的可撓性可隨之增加。另外,填入溝槽125的封裝層130與填入開口505的封裝層130可用以當作雙重阻水氧結構,以增加顯示面板60的側向之阻水氧能力,進而提升顯示面板60的使用壽命。It is worth noting that the opening 605 of the display panel 60 may be a ring-shaped opening or a grid-like opening, which surrounds the trench 125. Since the pixel definition layer 122, the interlayer insulating layers 118, 116, 114, 108, the gate insulating layer 104, and the buffer layer 101 in the opening 605 have been removed, the flexibility of the entire display panel 60 can be increased accordingly. In addition, the encapsulation layer 130 filling the trench 125 and the encapsulation layer 130 filling the opening 505 can be used as a double water-blocking oxygen structure to increase the lateral oxygen-blocking ability of the display panel 60, thereby improving the display panel 60's Service life.
圖7是依照本發明的第七實施例的一種顯示面板的剖面示意圖。FIG. 7 is a schematic cross-sectional view of a display panel according to a seventh embodiment of the present invention.
請參照圖7,第七實施例的顯示面板70與第五實施例的顯示面板50基本上相似,相似的構件的材料與配置已於上述段落說明過,於此便不再贅述。上述兩者不同之處在於:顯示面板70的開口705中填滿封裝材料134,以更進一步地增加顯示面板70的側向之阻水氧能力。Referring to FIG. 7, the display panel 70 of the seventh embodiment is basically similar to the display panel 50 of the fifth embodiment. The materials and configurations of similar components have been described in the above paragraphs, and will not be repeated here. The difference between the above two is that the opening 705 of the display panel 70 is filled with the packaging material 134 to further increase the lateral water and oxygen blocking ability of the display panel 70.
圖8是依照本發明的第八實施例的一種顯示面板的剖面示意圖。FIG. 8 is a schematic cross-sectional view of a display panel according to an eighth embodiment of the present invention.
請參照圖8,第八實施例的顯示面板80與第五實施例的顯示面板50基本上相似,相似的構件的材料與配置已於上述段落說明過,於此便不再贅述。上述兩者不同之處在於:顯示面板80的封裝材料136、132的一部分以及上電極126的一部分被進一步地移除,開口805進一步暴露出基底100的頂面。在此情況下,如圖8所示,開口805包括上部805a、下部805b以及上述兩者之間的中間部805c。上部805a的寬度大於中間部805c的寬度;而中間部805c的寬度大於下部805b的寬度。但本發明不以此為限,在其他實施例中,開口805可具有一致的寬度。Referring to FIG. 8, the display panel 80 of the eighth embodiment is basically similar to the display panel 50 of the fifth embodiment. The materials and configurations of similar components have been described in the above paragraphs, and will not be repeated here. The above two are different in that a part of the packaging material 136 and 132 of the display panel 80 and a part of the upper electrode 126 are further removed, and the opening 805 further exposes the top surface of the substrate 100. In this case, as shown in FIG. 8, the opening 805 includes an upper portion 805a, a lower portion 805b, and an intermediate portion 805c therebetween. The width of the upper portion 805a is larger than the width of the middle portion 805c; and the width of the middle portion 805c is larger than the width of the lower portion 805b. However, the present invention is not limited thereto. In other embodiments, the opening 805 may have a uniform width.
圖9是依照本發明的第九實施例的一種顯示面板的上視示意圖。FIG. 9 is a schematic top view of a display panel according to a ninth embodiment of the present invention.
請參照圖9,第九實施例的顯示面板90與第六實施例的顯示面板60基本上相似,相似的構件的材料與配置已於上述段落說明過,於此便不再贅述。上述兩者不同之處在於:顯示面板90的溝槽925可以是直條狀溝槽925a、925b。舉例來說,直條狀溝槽925a位於單一個畫素P1或電致發光元件EL1的兩側。也就是說,單一個畫素P1或電致發光元件EL1位於直條狀溝槽925a之間。另外,直條狀溝槽925b位於多個畫素P2(或電致發光元件EL2)所構成的陣列的兩側。也就是說,多個畫素P2(或電致發光元件EL2)所構成的陣列位於直條狀溝槽925b之間。雖然圖9的畫素P1、P2的單一側僅繪示出兩個直條狀溝槽925a、925b,但本發明不以此為限。直條狀溝槽925a、925b的數量與配置可依據實際需求來進行調整。Referring to FIG. 9, the display panel 90 of the ninth embodiment is basically similar to the display panel 60 of the sixth embodiment. The materials and configurations of similar components have been described in the above paragraphs, and will not be repeated here. The difference between the above two is that the grooves 925 of the display panel 90 may be straight grooves 925a, 925b. For example, the straight grooves 925a are located on both sides of a single pixel P1 or the electroluminescent element EL1. That is, a single pixel P1 or the electroluminescent element EL1 is located between the straight grooves 925a. In addition, the straight grooves 925b are located on both sides of an array composed of a plurality of pixels P2 (or the electroluminescent element EL2). That is, an array composed of a plurality of pixels P2 (or the electroluminescent element EL2) is located between the straight grooves 925b. Although the two sides of the pixels P1 and P2 in FIG. 9 only show two straight grooves 925a and 925b, the present invention is not limited thereto. The number and configuration of the straight grooves 925a, 925b can be adjusted according to actual needs.
此外,由於顯示面板90的溝槽925為直條狀溝槽,因此,顯示面板90的開口905亦為直條狀開口,其位於溝槽925旁。具體來說,如圖9所示,開口905位於畫素P1與多個畫素P2所構成的陣列之間。直條狀溝槽925a則是位於開口905與畫素P1之間;而直條狀溝槽925b則是位於開口905與多個畫素P2所構成的陣列之間。In addition, since the groove 925 of the display panel 90 is a straight strip-shaped groove, the opening 905 of the display panel 90 is also a straight strip-shaped opening, which is located beside the groove 925. Specifically, as shown in FIG. 9, the opening 905 is located between the pixel P1 and an array formed by a plurality of pixels P2. The straight groove 925a is located between the opening 905 and the pixel P1; and the straight groove 925b is located between the opening 905 and an array formed by a plurality of pixels P2.
圖10是依照本發明的第十實施例的一種顯示面板的上視示意圖。FIG. 10 is a schematic top view of a display panel according to a tenth embodiment of the present invention.
請參照圖10,第十實施例的顯示面板90’與第九實施例的顯示面板90基本上相似,相似的構件的材料與配置已於上述段落說明過,於此便不再贅述。上述兩者不同之處在於:顯示面板90’的直條狀溝槽925a為非連續性的直條狀溝槽,其分成兩個直條狀子溝槽925a1、925a2。直條狀子溝槽925a1位於畫素P1a的兩側;直條狀子溝槽925a2位於畫素P1b的兩側。直條狀子溝槽925a1、925a2之間是斷開的。也就是說,畫素定義層122配置在直條狀子溝槽925a1、925a2之間,以分隔上述兩者。相似地,直條狀溝槽925b也是非連續性的直條狀溝槽,其分成兩個直條狀子溝槽925b1、925b2。直條狀子溝槽925b1位於多個畫素P2a所構成的陣列的兩側;直條狀子溝槽925b2位於多個畫素P2b所構成的陣列的兩側。直條狀子溝槽925b1、925b2之間是斷開的。在其他實施例中,相鄰之直條狀子溝槽925a1、925a2可彼此連接,相鄰之直條狀子溝槽925b1、925b2可彼此連接,但本發明不以此為限。Referring to FIG. 10, the display panel 90 'of the tenth embodiment is basically similar to the display panel 90 of the ninth embodiment. The materials and configurations of similar components have been described in the above paragraphs, and will not be repeated here. The difference between the above two is that the straight groove 925a of the display panel 90 'is a discontinuous straight groove, which is divided into two straight sub-grooves 925a1, 925a2. The straight sub-grooves 925a1 are located on both sides of the pixel P1a; the straight sub-grooves 925a2 are located on both sides of the pixel P1b. The straight sub-grooves 925a1, 925a2 are disconnected. That is, the pixel definition layer 122 is disposed between the straight sub-grooves 925a1 and 925a2 to separate the two. Similarly, the straight groove 925b is also a discontinuous straight groove, which is divided into two straight sub-grooves 925b1, 925b2. The straight sub-grooves 925b1 are located on both sides of an array formed by a plurality of pixels P2a; the straight sub-grooves 925b2 are located on both sides of an array formed by a plurality of pixels P2b. The straight sub-grooves 925b1, 925b2 are disconnected. In other embodiments, the adjacent straight sub-grooves 925a1, 925a2 may be connected to each other, and the adjacent straight sub-grooves 925b1, 925b2 may be connected to each other, but the present invention is not limited thereto.
綜上所述,本發明之一實施例將封裝層的一部分填入鄰近電致發光元件的溝槽中,以增加顯示面板的側向之阻水氧能力,進而提升顯示面板的使用壽命。本發明之另一實施例可在主動區中形成貫穿畫素定義層與絕緣層的多個開口,以增加顯示面板的可撓性。此外,封裝層的另一部分亦可填入多個開口中,以更進一步地增加顯示面板的阻水氧能力。In summary, in one embodiment of the present invention, a part of the encapsulation layer is filled into a trench adjacent to the electroluminescent element to increase the lateral water and oxygen blocking ability of the display panel, thereby improving the service life of the display panel. According to another embodiment of the present invention, a plurality of openings penetrating the pixel definition layer and the insulating layer may be formed in the active area to increase the flexibility of the display panel. In addition, another part of the encapsulation layer can also be filled into the plurality of openings, so as to further increase the water and oxygen blocking ability of the display panel.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed as above with the examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some modifications and retouching without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be determined by the scope of the attached patent application.
10、20、30、40、50、60、70、80、90、90’‧‧‧顯示面板10, 20, 30, 40, 50, 60, 70, 80, 90, 90’‧‧‧ display panel
100‧‧‧基底100‧‧‧ substrate
100b‧‧‧基底的底面100b‧‧‧ Underside of the base
101‧‧‧緩衝層101‧‧‧ buffer layer
102‧‧‧主動層102‧‧‧Active Level
104‧‧‧閘絕緣層104‧‧‧Gate insulation
106‧‧‧閘極106‧‧‧Gate
108、114、116、118‧‧‧層間絕緣層108, 114, 116, 118‧‧‧ interlayer insulation
110‧‧‧汲極110‧‧‧ Drain
112‧‧‧源極112‧‧‧Source
120‧‧‧下電極120‧‧‧ lower electrode
122‧‧‧畫素定義層122‧‧‧Pixel Definition Layer
123‧‧‧容置部123‧‧‧accommodation department
124‧‧‧電致發光層124‧‧‧electroluminescent layer
125、225、325、425、925‧‧‧溝槽125, 225, 325, 425, 925‧‧‧ groove
125a、125b‧‧‧環狀溝槽125a, 125b‧‧‧Circular groove
126‧‧‧上電極126‧‧‧up electrode
130‧‧‧封裝層130‧‧‧Encapsulation layer
132、134、134a、134b、136‧‧‧封裝材料132, 134, 134a, 134b, 136‧‧‧ packaging materials
210、212、214‧‧‧線路結構210, 212, 214‧‧‧ line structure
505、605、705、805、905‧‧‧開口505, 605, 705, 805, 905‧‧‧ opening
505a、805a‧‧‧開口的上部505a, 805a‧ upper part of opening
505b、805b‧‧‧開口的下部505b, 805b‧‧‧ lower part of opening
805c‧‧‧開口的中間部805c‧‧‧ opening middle
925a、925b‧‧‧直條狀溝槽925a, 925b‧‧‧Straight groove
925a1、925a2、925b1、925b2‧‧‧直條狀子溝槽925a1, 925a2, 925b1, 925b2
AD‧‧‧主動元件AD‧‧‧Active Components
EL、EL1、EL2‧‧‧電致發光元件EL, EL1, EL2‧‧‧ electroluminescence element
P、P1、P1a、P1b、P2、P2a、P2b‧‧‧畫素P, P1, P1a, P1b, P2, P2a, P2b ‧‧‧ pixels
圖1是依照本發明的第一實施例的一種顯示面板的剖面示意圖。 圖2是依照本發明的第二實施例的一種顯示面板的剖面示意圖。 圖3是依照本發明的第三實施例的一種顯示面板的剖面示意圖。 圖4是依照本發明的第四實施例的一種顯示面板的剖面示意圖。 圖5是依照本發明的第五實施例的一種顯示面板的剖面示意圖。 圖6是依照本發明的第六實施例的一種顯示面板的上視示意圖。 圖7是依照本發明的第七實施例的一種顯示面板的剖面示意圖。 圖8是依照本發明的第八實施例的一種顯示面板的剖面示意圖。 圖9是依照本發明的第九實施例的一種顯示面板的上視示意圖。 圖10是依照本發明的第十實施例的一種顯示面板的上視示意圖。FIG. 1 is a schematic cross-sectional view of a display panel according to a first embodiment of the present invention. FIG. 2 is a schematic cross-sectional view of a display panel according to a second embodiment of the present invention. 3 is a schematic cross-sectional view of a display panel according to a third embodiment of the present invention. 4 is a schematic cross-sectional view of a display panel according to a fourth embodiment of the present invention. FIG. 5 is a schematic cross-sectional view of a display panel according to a fifth embodiment of the present invention. FIG. 6 is a schematic top view of a display panel according to a sixth embodiment of the present invention. FIG. 7 is a schematic cross-sectional view of a display panel according to a seventh embodiment of the present invention. FIG. 8 is a schematic cross-sectional view of a display panel according to an eighth embodiment of the present invention. FIG. 9 is a schematic top view of a display panel according to a ninth embodiment of the present invention. FIG. 10 is a schematic top view of a display panel according to a tenth embodiment of the present invention.
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US20010015618A1 (en) * | 1999-12-15 | 2001-08-23 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device |
TW201735417A (en) * | 2016-03-24 | 2017-10-01 | 三星顯示器有限公司 | Organic light-emitting display apparatus |
US20170154935A1 (en) * | 2016-09-20 | 2017-06-01 | Shanghai Tianma Micro-electronics Co., Ltd. | Organic light emitting display panel and method for fabricating the same |
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