TWI671113B - Desiccant, sealing structure and organic electroluminescent element - Google Patents
Desiccant, sealing structure and organic electroluminescent element Download PDFInfo
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Abstract
本發明揭示一種乾燥劑,其含有黏合劑樹脂與分散於黏合劑樹脂中的氧化物顆粒。氧化物顆粒的至少一部分形成二次顆粒,該二次顆粒包含複數個一次顆粒。氧化物顆粒的平均粒徑為4μm以下。氧化物顆粒的比表面積為5~60m2 /g。The invention discloses a desiccant, which contains a binder resin and oxide particles dispersed in the binder resin. At least a portion of the oxide particles form secondary particles, the secondary particles including a plurality of primary particles. The average particle diameter of the oxide particles is 4 μm or less. The specific surface area of the oxide particles is 5 to 60 m 2 / g.
Description
本發明涉及一種乾燥劑、密封結構及有機電致發光元件。The invention relates to a desiccant, a sealing structure and an organic electroluminescent element.
有機EL(Electroluminescence:電致發光)元件一般具有發光部,該發光部包含:含有有機發光材料的薄膜也就是有機層、夾持該有機層的一對電極。有機EL元件是透過向薄膜注入電洞(hole)及電子並使其再結合,而產生激子(exciton)並且利用該激子去活化時放射出的光(螢光或磷光)的自發光元件。An organic EL (Electroluminescence) element generally includes a light-emitting portion including a thin film containing an organic light-emitting material, that is, an organic layer, and a pair of electrodes sandwiching the organic layer. Organic EL devices are self-emitting devices that inject holes and electrons into a thin film and recombine them to generate excitons and use the excitons to deactivate light (fluorescent or phosphorescent) that is emitted when they are deactivated. .
關於有機EL元件,被期待著防止被稱作黑點的有機層的非發光部的產生和成長。作為產生黑點的主要原因,已知水分及氧氣的影響較大,尤其即使存在微量的水分也會對黑點的產生帶來很大的影響。Regarding the organic EL element, it is expected to prevent generation and growth of a non-light emitting portion of an organic layer called a black dot. As the main cause of the black spots, it is known that the influence of moisture and oxygen is large. In particular, the presence of a small amount of moisture can greatly affect the generation of black spots.
因此,人們對防止水分及氧氣侵入有機EL元件的方法進行了各種研究。例如,提出有將有機層以及電極密封在乾燥的惰性氣體環境的氣密容器內,並將乾燥劑封入於氣密容器內的中空密封結構。例如,專利文獻1中揭示有一種有機EL元件,其在密封蓋的內表面具備乾燥劑含有層,該乾燥劑含有層包含五氧化二磷的粉末與低溫固化型環氧系黏接劑。Therefore, various studies have been made on methods for preventing moisture and oxygen from entering the organic EL element. For example, a hollow sealing structure is proposed in which an organic layer and an electrode are sealed in a hermetic container in a dry inert gas environment, and a desiccant is sealed in the hermetic container. For example, Patent Document 1 discloses an organic EL element including a desiccant-containing layer on the inner surface of a sealing cap, the desiccant-containing layer containing a powder of phosphorus pentoxide and a low-temperature curing epoxy-based adhesive.
另一方面,作為除溼劑,有時利用生石灰(氧化鈣)。例如,在專利文獻2中記載有,生石灰較佳為包含50質量%以上之粒徑為75μm以上的顆粒。On the other hand, as a dehumidifier, quicklime (calcium oxide) is sometimes used. For example, Patent Document 2 describes that quicklime preferably contains 50% by mass or more of particles having a particle diameter of 75 μm or more.
(專利文獻) 專利文獻1:日本特開2001-035659號公報。 專利文獻2:日本特開2005-335987號公報。(Patent Document) Patent Document 1: Japanese Patent Application Laid-Open No. 2001-035659. Patent Document 2: Japanese Patent Application Laid-Open No. 2005-335987.
本發明的主要目的在於提供一種乾燥劑,其能夠在更長時間中有效地抑制有機EL元件產生黑點。The main object of the present invention is to provide a desiccant which can effectively suppress the generation of black spots in an organic EL element for a longer period of time.
在本發明的其中一個方面中提供一種乾燥劑,其包含黏合劑樹脂和分散於黏合劑樹脂中的氧化物顆粒,氧化物顆粒的至少一部分形成包含複數個一次顆粒的二次顆粒,氧化物顆粒的平均粒徑為4μm以下,氧化物顆粒的比表面積為5~60m2 /g。根據上述乾燥劑,能夠在更長時間中有效地抑制有機EL元件產生黑點。In one aspect of the present invention, a desiccant is provided, which comprises a binder resin and oxide particles dispersed in the binder resin. At least a part of the oxide particles forms a secondary particle including a plurality of primary particles. The oxide particles The average particle diameter is 4 μm or less, and the specific surface area of the oxide particles is 5 to 60 m 2 / g. According to the desiccant, it is possible to effectively suppress the occurrence of black spots in the organic EL element for a longer period of time.
本發明還可以提供一種組合物,該組合物使用來作為乾燥劑(應用),使用來製備乾燥劑(應用),前述組合物包含黏合劑樹脂和分散於黏合劑樹脂中的氧化物顆粒,氧化物顆粒的至少一部分形成包含複數個一次顆粒的二次顆粒,氧化物顆粒的平均粒徑為4μm以下,氧化物顆粒的比表面積為5~60m2 /g。The present invention can also provide a composition which is used as a desiccant (application) and used to prepare a desiccant (application). The foregoing composition comprises a binder resin and oxide particles dispersed in the binder resin, and oxidizes. At least a part of the material particles form secondary particles including a plurality of primary particles, the average particle diameter of the oxide particles is 4 μm or less, and the specific surface area of the oxide particles is 5 to 60 m 2 / g.
並且,前述氧化物顆粒的比表面積亦可為5~35m2 /g。若氧化物顆粒的比表面積在上述範圍中,則能夠提高乾燥劑的捕水性能。基於相同觀點,黏合劑樹脂亦可包含矽酮樹脂。The specific surface area of the oxide particles may be 5 to 35 m 2 / g. When the specific surface area of the oxide particles is within the above range, the water-capturing performance of the desiccant can be improved. From the same viewpoint, the binder resin may also include a silicone resin.
在本發明的另一方面中提供一種密封結構,其具備:彼此對置配置的一對基板;密封劑,其密封前述一對基板的外周部;乾燥劑層,其在密封劑的內側且被設置於前述一對基板之間,並且包含前述乾燥劑。In another aspect of the present invention, there is provided a sealing structure including: a pair of substrates disposed opposite to each other; a sealant that seals an outer peripheral portion of the pair of substrates; and a desiccant layer that is inside the sealant and is sealed by the sealant. It is provided between the aforementioned pair of substrates and contains the aforementioned desiccant.
在本發明的又一方面中提供一種有機EL元件,其具備:元件基板;密封基板,其相對於元件基板而被對置配置;密封劑,其密封元件基板以及密封基板的外周部;層疊體,其在密封劑的內側且被設置於前述元件基板之上,並且具有有機層以及夾持該有機層的一對電極;乾燥劑層,其在密封劑的內側且被設置於密封基板上,並且包含前述乾燥劑。According to still another aspect of the present invention, there is provided an organic EL element including: an element substrate; a sealing substrate that is disposed opposite to the element substrate; a sealant that seals the element substrate and an outer peripheral portion of the sealing substrate; and a laminated body , Which is located inside the sealant and is disposed on the aforementioned element substrate, and has an organic layer and a pair of electrodes sandwiching the organic layer; a desiccant layer, which is located inside the sealant and is disposed on the sealing substrate, It also contains the aforementioned desiccant.
根據本發明的一個方面所涉及的乾燥劑,能夠在更長時間中有效地抑制有機EL元件產生黑點。因為氧化物顆粒分散於黏合劑樹脂中,所以能夠均勻地分散配置作為捕水成分的氧化物顆粒。According to the desiccant according to one aspect of the present invention, it is possible to effectively suppress the generation of black spots in the organic EL element for a longer period of time. Since the oxide particles are dispersed in the binder resin, it is possible to uniformly disperse and arrange the oxide particles as a water-capturing component.
以下,對本發明的實施型態進行詳細說明。但是,本發明不只限於以下實施型態。Hereinafter, embodiments of the present invention will be described in detail. However, the present invention is not limited to the following embodiments.
在本說明書中,“一次顆粒”是指,從表觀上的幾何學形態來判斷時一體地形成為單一顆粒的顆粒。“二次顆粒”包括複數個一次顆粒。通常,會透過聚集複數個一次顆粒而形成二次顆粒。In the present specification, the "primary particle" means a particle that is integrally formed into a single particle when judged from the apparent geometric form. "Secondary particles" includes a plurality of primary particles. Generally, secondary particles are formed by aggregating a plurality of primary particles.
(乾燥劑) 一實施型態的乾燥劑包括:黏合劑樹脂和分散在黏合劑樹脂中的氧化物顆粒。(Desiccant) An embodiment of the desiccant includes a binder resin and oxide particles dispersed in the binder resin.
[氧化物顆粒] 乾燥劑中所含的氧化物顆粒的至少一部分形成包括複數個一次顆粒的二次顆粒。氧化物顆粒形成二次顆粒的情況例如可以透過掃描電子顯微鏡(SEM)等觀察氧化物顆粒而進行確認。在乾燥劑中所含的氧化物顆粒中,可以例如有10~100質量%或者50~100質量%形成二次顆粒。根據本發明人等的見解,氧化物顆粒形成二次顆粒的情形有助於抑制黑點的產生。並且,形成二次顆粒的氧化物顆粒難以成為大體積,其有助於以更小體積的乾燥劑來實現充分的捕水性能。[Oxide particles] At least a part of the oxide particles contained in the desiccant form secondary particles including a plurality of primary particles. The formation of secondary particles of the oxide particles can be confirmed by observing the oxide particles with a scanning electron microscope (SEM) or the like. Among the oxide particles contained in the desiccant, for example, 10 to 100% by mass or 50 to 100% by mass may form secondary particles. According to the findings of the present inventors, the case where the oxide particles form secondary particles helps to suppress the generation of black spots. In addition, it is difficult for the oxide particles forming the secondary particles to have a large volume, which helps achieve a sufficient water-capturing performance with a smaller volume of the desiccant.
氧化物顆粒的平均粒徑可以是4μm以下。若氧化物顆粒的平均粒徑為4μm以下,則有助於抑制有機EL元件產生黑點。基於相同觀點,氧化物顆粒的平均粒徑也可以是3.9μm以下或3.8μm以下。氧化物顆粒的平均粒徑的下限並不受特別限制,例如可以是0.5μm以上或1μm以上。例如,可以透過調整氧化物顆粒的煆燒溫度、煆燒時間、粉碎條件等而控制氧化物顆粒的平均粒徑。The average particle diameter of the oxide particles may be 4 μm or less. When the average particle diameter of the oxide particles is 4 μm or less, it contributes to suppressing the generation of black spots in the organic EL element. From the same viewpoint, the average particle diameter of the oxide particles may be 3.9 μm or less or 3.8 μm or less. The lower limit of the average particle diameter of the oxide particles is not particularly limited, and may be, for example, 0.5 μm or more or 1 μm or more. For example, the average particle diameter of the oxide particles can be controlled by adjusting the calcination temperature, the calcination time, and the pulverization conditions of the oxide particles.
在本說明書中,氧化物顆粒的平均粒徑是指,用動態光散射粒徑分析儀測量到的體積分佈的中位數。該平均粒徑是包括一次顆粒以及二次顆粒在內的氧化物顆粒整體的平均粒徑,且該平均粒徑是使用將氧化物顆粒分散於規定的分散劑中而調製出的分散液來進行測量。In the present specification, the average particle diameter of the oxide particles refers to the median of the volume distribution measured by a dynamic light scattering particle size analyzer. The average particle diameter is an average particle diameter of the entire oxide particles including the primary particles and the secondary particles, and the average particle diameter is performed using a dispersion liquid prepared by dispersing the oxide particles in a predetermined dispersant. measuring.
氧化物顆粒的一次顆粒的平均粒徑並不受特別限制,例如可以是0.5μm以下或0.1μm以下。氧化物顆粒的一次顆粒的平均粒徑也可以是0.01μm以上。氧化物顆粒的一次顆粒的平均粒徑,可以是利用電子顯微鏡等觀察氧化物顆粒時,在觀察視野中存在的一次顆粒的粒徑(最大寬度)的平均值。The average particle diameter of the primary particles of the oxide particles is not particularly limited, and may be, for example, 0.5 μm or less or 0.1 μm or less. The average particle diameter of the primary particles of the oxide particles may be 0.01 μm or more. The average particle diameter of the primary particles of the oxide particles may be an average value of the particle diameter (maximum width) of the primary particles existing in the observation field when the oxide particles are observed with an electron microscope or the like.
氧化物顆粒包含可對氧化物顆粒賦予捕水性能的無機氧化物。以氧化物顆粒的質量為基準,氧化物顆粒通常包含80質量%以上或者90質量%以上的無機氧化物。乾燥劑可以包含一種氧化物顆粒或者成分不同的兩種以上的氧化物顆粒。氧化物顆粒例如包含選自由五氧化二磷(P4 O10 )、氧化鎂(MgO)、氧化鈣(CaO)、氧化鍶(SrO)、氧化鋇(BaO)以及氧化鋁(Al2 O3 )構成的群組中的至少一種無機氧化物。氧化物顆粒也可以包含選自由氧化鎂、氧化鈣、氧化鍶以及氧化鋇構成的群組中的至少一種鹼土族金屬氧化物,也可以包含氧化鈣。The oxide particles include an inorganic oxide that can impart water-capturing properties to the oxide particles. Based on the mass of the oxide particles, the oxide particles usually contain 80% by mass or more or 90% by mass of an inorganic oxide. The desiccant may include one kind of oxide particles or two or more kinds of oxide particles having different components. The oxide particles include, for example, selected from the group consisting of phosphorus pentoxide (P 4 O 10 ), magnesium oxide (MgO), calcium oxide (CaO), strontium oxide (SrO), barium oxide (BaO), and aluminum oxide (Al 2 O 3 ). At least one inorganic oxide in the group. The oxide particles may include at least one alkaline earth metal oxide selected from the group consisting of magnesium oxide, calcium oxide, strontium oxide, and barium oxide, and may also include calcium oxide.
氧化物顆粒的比表面積為5~60m2 /g,也可以是5~35 m2 /g。若比表面積為5~60m2 /g,則乾燥劑能夠具有更加優異的捕水性能。基於相同觀點,氧化物顆粒的比表面積可以是10m2 /g以上或者15m2 /g以上,也可以是50m2 /g以下、40m2 /g以下或者35m2 /g以下。The specific surface area of the oxide particles is 5 to 60 m 2 / g, and may be 5 to 35 m 2 / g. When the specific surface area is 5 to 60 m 2 / g, the desiccant can have more excellent water-capturing performance. From the same viewpoint, the specific surface area of the oxide particles may be 10 m 2 / g or more or 15 m 2 / g or more, or may be 50 m 2 / g or less, 40 m 2 / g or less, or 35 m 2 / g or less.
在本說明書中,氧化物顆粒的比表面積是指,包括一次顆粒以及二次顆粒在內的氧化物顆粒的總體的比表面積,是透過BET法進行測定的。In this specification, the specific surface area of the oxide particles refers to the total specific surface area of the oxide particles including the primary particles and the secondary particles, and is measured by the BET method.
氧化物顆粒在乾燥劑中的含量可以是乾燥劑總質量的10質量%以上、20質量%以上或30質量%以上。氧化物顆粒的含量也可以是80質量%以下、70質量%以下或60質量%以下。The content of the oxide particles in the desiccant may be 10% by mass or more, 20% by mass or more, or 30% by mass or more of the total mass of the desiccant. The content of the oxide particles may be 80% by mass or less, 70% by mass or less, or 60% by mass or less.
包含氧化鈣的氧化物顆粒例如可以透過如下方法獲得,該方法依序包括如下步驟:對生石灰(CaO)進行氫氧化處理而獲得熟石灰(Ca(OH)2 )、對熟石灰進行煆燒而獲得生石灰以及將生石灰粉碎。對熟石灰進行煆燒的溫度可以是300~600℃。煆燒時間可以是1~20小時。The oxide particles containing calcium oxide can be obtained, for example, by the following method. The method includes the following steps: hydrated quick lime (CaO) to obtain hydrated lime (Ca (OH) 2 ); And crush the quicklime. The temperature at which slaked lime is torrefied can be 300 ~ 600 ° C. The simmering time can be from 1 to 20 hours.
透過粉碎生石灰,能夠將氧化物顆粒的平均粒徑調整為所希望的範圍。例如,可以將生石灰分散在庚烷等溶劑中並用球磨機等進行粉碎。By pulverizing the quicklime, the average particle diameter of the oxide particles can be adjusted to a desired range. For example, quicklime can be dispersed in a solvent such as heptane and pulverized with a ball mill or the like.
包含氧化鈣的氧化物顆粒的一次顆粒的直徑,具有依存於熟石灰的一次顆粒的傾向。透過對生石灰進行氫氧化處理,能夠將氧化物顆粒的一次顆粒的直徑調整為所希望的範圍。The diameter of primary particles including oxide particles of calcium oxide tends to depend on the primary particles of slaked lime. By subjecting quicklime to a hydroxide treatment, the diameter of the primary particles of the oxide particles can be adjusted to a desired range.
[黏合劑樹脂] 黏合劑樹脂只要能夠分散氧化物顆粒即可,並不受特別限制。在與氧化物顆粒進行混合時,可以使用能夠形成糊劑的黏合劑樹脂。透過使用乾燥劑的糊劑,能夠容易形成氧化物顆粒均勻分散的乾燥劑層。[Binder resin] The binder resin is not particularly limited as long as it can disperse the oxide particles. When mixing with the oxide particles, a binder resin capable of forming a paste can be used. By using a paste of a desiccant, a desiccant layer in which oxide particles are uniformly dispersed can be easily formed.
黏合劑樹脂例如可以包含選自由聚氯乙烯樹脂、酚醛樹脂、矽酮樹脂、環氧樹脂、聚酯樹脂、氨基甲酸乙酯樹脂、丙烯樹脂以及烯烴樹脂構成的群組中的至少一種樹脂。黏合劑樹脂也可以包含矽酮樹脂。The binder resin may include, for example, at least one resin selected from the group consisting of a polyvinyl chloride resin, a phenol resin, a silicone resin, an epoxy resin, a polyester resin, a urethane resin, an acrylic resin, and an olefin resin. The binder resin may include a silicone resin.
乾燥劑中的氧化物顆粒和黏合劑樹脂的質量比並不受特別限制,可以是1:4~4:1或1:2~2:1。若氧化物顆粒和黏合劑樹脂的質量比在上述範圍內,則有著能夠容易形成後述的乾燥劑層的傾向。The mass ratio of the oxide particles and the binder resin in the desiccant is not particularly limited, and may be 1: 4 ~ 4: 1 or 1: 2 ~ 2: 1. When the mass ratio of the oxide particles and the binder resin is within the above range, there is a tendency that a desiccant layer described later can be easily formed.
乾燥劑除了氧化物顆粒以及黏合劑樹脂之外還可以包含例如有機金屬化合物、固化性樹脂等成分。The desiccant may contain components such as an organometallic compound and a curable resin in addition to the oxide particles and the binder resin.
乾燥劑可以透過包括將氧化物顆粒和黏合劑樹脂進行混合的步驟在內的方法來製造出。上述混合動作可以透過離心分離等來進行。離心分離的旋轉速度例如可以為100~3000轉/分鐘。離心分離的時間可以為1~60分鐘。The desiccant can be produced by a method including a step of mixing oxide particles and a binder resin. The mixing operation can be performed by centrifugation or the like. The rotation speed of centrifugation can be, for example, 100 to 3000 revolutions per minute. The centrifugation time can be from 1 to 60 minutes.
(密封結構) 本實施型態的密封結構具備彼此對置配置的一對基板、密封前述一對基板的外周部的密封劑以及在密封劑的內側且被設置於前述一對基板之間的乾燥劑層。乾燥劑層可以包含上述實施型態所涉及的乾燥劑。乾燥劑層可以填充被密封的空間(前述一對基板之間且在密封劑內側的空間)。(Sealing Structure) The sealing structure of this embodiment includes a pair of substrates disposed opposite to each other, a sealant sealing the outer peripheral portion of the pair of substrates, and a drying provided inside the sealant and disposed between the pair of substrates.剂 层。 The agent layer. The desiccant layer may include a desiccant according to the above embodiment. The desiccant layer may fill the sealed space (the space between the aforementioned pair of substrates and inside the sealant).
本實施型態的密封結構,特別適合利用在要對容易受水分影響的設備進行封裝時。作為這種設備,例如可例舉出有機EL元件、有機半導體、有機太陽電池等有機電子設備。The sealing structure of this embodiment is particularly suitable for use when packaging equipment that is easily affected by moisture. Examples of such devices include organic electronic devices such as organic EL elements, organic semiconductors, and organic solar cells.
(有機EL元件) 第1圖是表示有機EL元件的一種實施型態的示意剖視圖。第1圖所示的有機EL元件1是所謂的中空密封結構的有機EL元件,且由以下部分所構成:元件基板2、相對於元件基板2被對置配置的密封基板3、被設置在元件基板2之上的層疊體(該層疊體具有有機層4以及夾持該有機層4的陽極5和陰極6)、密封元件基板2以及密封基板3的外周部的密封劑8、在密封劑8的內側且被設置於密封基板3上的乾燥劑層7。乾燥劑層7可以包含上述實施型態的乾燥劑。(Organic EL Element) FIG. 1 is a schematic cross-sectional view showing an embodiment of an organic EL element. The organic EL element 1 shown in FIG. 1 is a so-called hollow-sealed organic EL element, and is composed of an element substrate 2, a sealing substrate 3 disposed opposite to the element substrate 2, and provided on the element. A laminate on the substrate 2 (the laminate having an organic layer 4 and an anode 5 and a cathode 6 sandwiching the organic layer 4), a sealing element substrate 2, and a sealant 8 sealing the outer peripheral portion of the substrate 3; Is provided inside the desiccant layer 7 on the sealing substrate 3. The desiccant layer 7 may include a desiccant of the above-mentioned embodiment.
在有機EL元件1中,除了乾燥劑層7以外的要件均可以使用先前習知的結構。下面對有機EL元件1的一例進行簡單說明。In the organic EL element 1, a conventionally known structure can be used for the elements other than the desiccant layer 7. An example of the organic EL element 1 will be briefly described below.
元件基板2由具有絕緣性以及透光性的矩形玻璃基板構成,在該元件基板2之上,由透明導電材料也就是ITO(Indum Tin Oxide:氧化銦錫)形成有陽極5(電極)。該陽極5例如如下形成:針對透過真空蒸鍍法、濺鍍法等PVD(Physical Vapor Deposition:物理氣相沉積)法在元件基板2上形成的ITO膜,進行基於光刻法的蝕刻而形成規定的圖案形狀,從而形成陽極5。作為電極的陽極5的一部分,被引出至元件基板2的端部而與驅動電路(未圖示)連接。The element substrate 2 is made of a rectangular glass substrate having insulation and light transmission properties. On the element substrate 2, an anode 5 (electrode) is formed of a transparent conductive material, that is, ITO (Indum Tin Oxide). The anode 5 is formed by, for example, forming an ITO film formed on the element substrate 2 by a PVD (Physical Vapor Deposition) method such as a vacuum evaporation method or a sputtering method by etching using a photolithography method to form a predetermined electrode. Pattern shape, thereby forming the anode 5. A part of the anode 5 as an electrode is drawn out to an end of the element substrate 2 and is connected to a driving circuit (not shown).
在陽極5的上表面,透過真空蒸鍍法、電阻加熱法等PVD法層疊有包含有機發光材料的薄膜也就是有機層4。有機層4可以由單一的層形成,也可以由功能不同的複數個層形成。本實施型態中的有機層4為從陽極5側依序層疊有電洞注入層4a、電洞傳輸層4b、發光層4c以及電子傳輸層4d的四層結構。電洞注入層4a例如由膜厚為數十奈米的酞菁銅(CuPc)形成。電洞傳輸層4b例如由膜厚為數十奈米的二[N-(1-萘基)-N-苯基]聯苯胺(bis[N-(1-naphthyl)-N-phenyl]benzidine,α-NPD)所形成。發光層4c例如由膜厚為數十奈米的三(8-羥基喹啉)鋁(Alq3 )所形成。電子傳輸層4d例如由膜厚為數奈米的氟化鋰(LiF)形成。而且,陽極5、有機層4以及後述的陰極6依序層疊的層疊體構成發光部。On the upper surface of the anode 5, a thin film containing an organic light-emitting material, that is, an organic layer 4 is laminated by a PVD method such as a vacuum evaporation method or a resistance heating method. The organic layer 4 may be formed of a single layer or a plurality of layers having different functions. The organic layer 4 in this embodiment has a four-layer structure in which a hole injection layer 4a, a hole transport layer 4b, a light emitting layer 4c, and an electron transport layer 4d are sequentially stacked from the anode 5 side. The hole injection layer 4 a is formed of, for example, copper phthalocyanine (CuPc) having a film thickness of several tens of nanometers. The hole transport layer 4b is made of, for example, bis [N- (1-naphthyl) -N-phenyl] benzidine with a film thickness of tens of nanometers, α-NPD). The light emitting layer 4 c is formed of, for example, tris (8-hydroxyquinoline) aluminum (Alq 3 ) having a film thickness of several tens of nanometers. The electron transport layer 4d is formed of, for example, lithium fluoride (LiF) having a thickness of several nanometers. A laminate in which the anode 5, the organic layer 4, and a cathode 6 described later are sequentially stacked constitutes a light-emitting portion.
在有機層4(電子傳輸層4d)的上表面,透過真空蒸鍍法等PVD法形成有金屬薄膜即陰極6(電極)。作為金屬薄膜的材料,可例舉出Al(鋁)、Li(鋰)、Mg(鎂)、In(銦)等功函數較小的金屬單體或Al-Li(鋁-鋰)、Mg-Ag(鎂-金)等功函數較小的合金等。陰極6的膜厚例如形成為數十奈米~數百奈米(較佳為50nm~200nm)。陰極6的一部分被引出至元件基板2的端部而與驅動電路(未圖示)連接。A cathode 6 (electrode), which is a metal thin film, is formed on the upper surface of the organic layer 4 (electron transport layer 4d) by a PVD method such as a vacuum evaporation method. Examples of the material of the metal thin film include a metal monomer having a small work function such as Al (aluminum), Li (lithium), Mg (magnesium), and In (indium), or Al-Li (aluminum-lithium), Mg- Alloys with smaller work functions such as Ag (magnesium-gold). The thickness of the cathode 6 is, for example, tens of nanometers to hundreds of nanometers (preferably 50 nm to 200 nm). A part of the cathode 6 is drawn out to an end of the element substrate 2 and is connected to a driving circuit (not shown).
密封基板3被配置成隔著有機層4而與元件基板2對置,並且元件基板2以及密封基板3的外周部由密封劑8所密封。作為密封劑,例如可以使用紫外線固化樹脂。而且,乾燥劑層7在密封劑8的內側且被設置於密封基板3的一部分上或者整個密封基板3上。乾燥劑層7是透過塗布上述實施型態的乾燥劑而形成。乾燥劑層7的膜厚被形成為1~300μm。The sealing substrate 3 is arranged to face the element substrate 2 with the organic layer 4 interposed therebetween, and the outer peripheral portions of the element substrate 2 and the sealing substrate 3 are sealed with a sealant 8. As the sealant, for example, an ultraviolet curable resin can be used. The desiccant layer 7 is provided on the inside of the sealant 8 on a part of the sealing substrate 3 or on the entire sealing substrate 3. The desiccant layer 7 is formed by applying the desiccant of the embodiment described above. The desiccant layer 7 has a film thickness of 1 to 300 μm.
(有機EL元件的製造方法) 首先,準備在元件基板2上層疊有有機層4等(未圖示出電極)的層疊體。(Manufacturing method of an organic EL element) First, the laminated body which laminated | stacked the organic layer 4 etc. (electrode not shown) on the element substrate 2 is prepared.
接著,使用塗布機在另行準備的密封基板3上塗布本實施型態的乾燥劑而形成乾燥劑層7。而且,使用塗布機以包圍塗布在密封基板3上的乾燥劑的方式塗布密封劑8。這些操作較佳在以露點為-76℃的氮氣來置換過的手套箱中進行。Next, a desiccant layer 7 is formed by applying a desiccant of this embodiment on a separately prepared sealing substrate 3 using a coater. Then, the sealant 8 is applied using a coater so as to surround the desiccant applied to the seal substrate 3. These operations are preferably performed in a glove box replaced with nitrogen having a dew point of -76 ° C.
接著,將層疊有有機層4等的元件基板2和密封基板3貼合在一起。透過對貼合在一起的基板照射UV(紫外線)和加熱至80℃左右而進行密封,從而製造出本實施型態的有機EL元件1。Next, the element substrate 2 on which the organic layer 4 and the like are laminated and the sealing substrate 3 are bonded together. The bonded substrates are irradiated with UV (ultraviolet rays) and heated to about 80 ° C. for sealing, so that the organic EL element 1 of this embodiment is manufactured.
(實施例) 以下,根據實施例對本發明進行更加具體地說明。但是,本發明並不只限於這些實施例。(Examples) Hereinafter, the present invention will be described more specifically based on examples. However, the present invention is not limited to these examples.
1.氧化物顆粒的合成 [氧化物顆粒1] 將市面上銷售的氧化物顆粒用作氧化物顆粒1。氧化物顆粒1並未形成二次顆粒。氧化物顆粒1的平均粒徑為2.5μm,比表面積為2.5m2 /g。 將氧化物顆粒分散在分散劑(酒精)中而製備測量用的分散液,並將使用該分散液透過動態光散射粒徑分析儀而得到的體積分佈的中位數,作為氧化物顆粒的平均粒徑而加以記錄。並且,將氧化物顆粒在減壓至500Pa以下的環境下以120℃乾燥8小時以上,然後僅取得液態氮溫度中的氮吸附側的等溫吸附線。利用BET法分析等溫吸附線,從而求出氧化物顆粒的比表面積。其他氧化物顆粒的平均粒徑以及比表面積也以相同方法測量。1. Synthesis of oxide particles [oxide particles 1] Commercially available oxide particles are used as the oxide particles 1. The oxide particles 1 do not form secondary particles. The average particle diameter of the oxide particles 1 was 2.5 μm, and the specific surface area was 2.5 m 2 / g. The oxide particles are dispersed in a dispersant (alcohol) to prepare a dispersion for measurement, and the median volume distribution of the dispersion obtained through a dynamic light scattering particle size analyzer is used as the average of the oxide particles. The particle size is recorded. Then, the oxide particles were dried at 120 ° C. for 8 hours or more under an environment where the pressure was reduced to 500 Pa or less, and then only the isothermal adsorption line on the nitrogen adsorption side at the liquid nitrogen temperature was obtained. The isothermal adsorption line was analyzed by the BET method to determine the specific surface area of the oxide particles. The average particle diameter and specific surface area of other oxide particles were also measured in the same manner.
[氧化物顆粒2] 將比表面積為17.1m2 /g的生石灰粉末(純度:99質量%)分散於溶劑(庚烷)中,並用球磨機進行粉碎。粉碎之後進行蒸餾從而去除溶劑,而得到氧化物顆粒2。用掃描電子顯微鏡(SEM)觀察氧化物顆粒2發現,幾乎所有氧化物顆粒都形成包含複數個一次顆粒的二次顆粒。氧化物顆粒2的平均粒徑為2.5μm,比表面積為5.3m2 /g。[Oxide Particle 2] A quicklime powder (purity: 99% by mass) having a specific surface area of 17.1 m 2 / g was dispersed in a solvent (heptane) and pulverized with a ball mill. After the pulverization, the solvent was removed by distillation to obtain the oxide particles 2. Observing the oxide particles 2 with a scanning electron microscope (SEM), it was found that almost all oxide particles formed secondary particles including a plurality of primary particles. The average particle diameter of the oxide particles 2 was 2.5 μm, and the specific surface area was 5.3 m 2 / g.
[氧化物顆粒3] 將比表面積為47m2 /g的熟石灰粉末(純度:73.2質量%)放入煆燒爐中,以450℃的溫度煆燒3小時,從而製備出生石灰粉末。將所得到的生石灰粉末分散於溶劑(庚烷)中,並用球磨機進行粉碎。粉碎之後去除溶劑,而得到氧化物顆粒3。用掃描電子顯微鏡(SEM)觀察氧化物顆粒3發現,幾乎所有氧化物顆粒都形成包含複數個一次顆粒的二次顆粒。氧化物顆粒3的平均粒徑為3.8μm,比表面積為34.6m2 /g。[Oxide Particle 3] A slaked lime powder (purity: 73.2% by mass) having a specific surface area of 47 m 2 / g was placed in an incinerator and calcined at a temperature of 450 ° C. for 3 hours to prepare a raw lime powder. The obtained quicklime powder was dispersed in a solvent (heptane) and pulverized with a ball mill. After the pulverization, the solvent was removed to obtain the oxide particles 3. Observing the oxide particles 3 with a scanning electron microscope (SEM), it was found that almost all of the oxide particles formed secondary particles including a plurality of primary particles. The average particle diameter of the oxide particles 3 was 3.8 μm, and the specific surface area was 34.6 m 2 / g.
[氧化物顆粒4] 將比表面積為47m2 /g的熟石灰粉末(純度:73.2質量%)放入煆燒爐中,利用真空泵將壓力設為5×10-3 Pa以下,並以450℃的溫度煆燒3小時,從而製備出氧化物顆粒4。氧化物顆粒4形成包含複數個一次顆粒的二次顆粒。氧化物顆粒4的平均粒徑為4.1μm,比表面積為82.5m2 /g。[Oxide Particle 4] A slaked lime powder (purity: 73.2% by mass) having a specific surface area of 47 m 2 / g was placed in an sintering furnace, and the pressure was set to 5 × 10 -3 Pa or lower by a vacuum pump, and the temperature was measured at 450 ° C. The temperature was calcined for 3 hours, thereby preparing the oxide particles 4. The oxide particles 4 form secondary particles including a plurality of primary particles. The average particle diameter of the oxide particles 4 was 4.1 μm, and the specific surface area was 82.5 m 2 / g.
[氧化物顆粒5] 將比表面積為35m2 /g的熟石灰粉末(純度:73.3質量%)放入煆燒爐中,利用真空泵將壓力設為5×10-3 Pa以下,並以450℃的溫度煆燒3小時,從而製備出氧化物顆粒5。氧化物顆粒5形成包含複數個一次顆粒的二次顆粒。氧化物顆粒5的平均粒徑為5μm,比表面積為76.1m2 /g。[Oxide Particle 5] A slaked lime powder (purity: 73.3% by mass) having a specific surface area of 35 m 2 / g was placed in an sintering furnace, and the pressure was set to 5 × 10 -3 Pa or less by a vacuum pump, and the temperature was measured at 450 ° C. The temperature was calcined for 3 hours, thereby preparing oxide particles 5. The oxide particles 5 form secondary particles including a plurality of primary particles. The average particle diameter of the oxide particles 5 was 5 μm, and the specific surface area was 76.1 m 2 / g.
[氧化物顆粒6] 將比表面積為35m2 /g的熟石灰粉末(純度:73.3質量%)替換成比表面積為15m2 /g的熟石灰粉末(純度:74.7質量%),除此以外以與氧化物顆粒5相同的方法製備出氧化物顆粒6。氧化物顆粒6形成包含複數個一次顆粒的二次顆粒。氧化物顆粒6的平均粒徑為5μm,比表面積為68.9m2 /g。[Oxide Particle 6] A slaked lime powder (purity: 73.3% by mass) with a specific surface area of 35 m 2 / g was replaced with a slaked lime powder (purity: 74.7% by mass) with a specific surface area of 15 m 2 / g. The oxide particles 6 were prepared in the same manner as the material particles 5. The oxide particles 6 form secondary particles including a plurality of primary particles. The average particle diameter of the oxide particles 6 was 5 μm, and the specific surface area was 68.9 m 2 / g.
[氧化物顆粒7] 將比表面積為35m2 /g的熟石灰粉末(純度:73.3質量%)替換成比表面積為12m2 /g的熟石灰粉末(純度:74.2質量%),除此以外以與氧化物顆粒5相同的製備方法製備出氧化物顆粒7。氧化物顆粒7形成包含複數個一次顆粒的二次顆粒。氧化物顆粒7的平均粒徑為5μm,比表面積為67.2m2 /g。[Oxide Particle 7] The slaked lime powder (purity: 73.3% by mass) with a specific surface area of 35 m 2 / g was replaced with the slaked lime powder (purity: 74.2% by mass) with a specific surface area of 12 m 2 / g. The oxide particles 7 are prepared by the same method for preparing the particles 5. The oxide particles 7 form secondary particles including a plurality of primary particles. The average particle diameter of the oxide particles 7 was 5 μm, and the specific surface area was 67.2 m 2 / g.
2.乾燥劑的調製 以1:1的質量比分別將氧化物顆粒1~7和矽酮樹脂進行混合,並以1000轉/分鐘的轉速離心攪拌5分鐘,從而獲得表1所示的實施例1、2以及比較例1~5的乾燥劑。2. Preparation of the desiccant The oxide particles 1 to 7 and the silicone resin were respectively mixed at a mass ratio of 1: 1, and the mixture was centrifuged and stirred at a rotation speed of 1000 rpm for 5 minutes to obtain Example 1 shown in Table 1. 2 and the desiccants of Comparative Examples 1 to 5.
3.評價 透過濺鍍法,將具有透明性的導電材料的ITO在元件基板上形成膜厚為140nm的膜。利用光刻法對ITO膜進行蝕刻而形成預定的圖案形狀,從而形成陽極。 利用電阻加熱法。在所形成的陽極的上表面將酞菁銅(CuPc)形成膜厚為70nm的膜,從而形成電洞注入層,並在電洞注入層的上表面將二[N-(1-萘基)-N-苯基]聯苯胺(α-NPD)形成膜厚為30nm的膜,從而形成電洞傳輸層,接著在電洞傳輸層的上表面將三(8-羥基喹啉)鋁(Alq3 )形成膜厚為50nm的膜,從而形成發光層。接著,在發光層的上表面將氟化鋰(LiF)形成膜厚為7nm的膜,從而形成電子傳輸層,並將鋁以150nm的膜厚物理蒸鍍在電子傳輸層的表面以作為陰極。藉此,在元件基板上形成依序層疊有陽極、有機層(電洞注入層/電洞傳輸層/發光層)、電子傳輸層以及陰極的層疊體。 接著,在由露點為-76℃的氮所置換過的手套箱中,利用塗布機將各個實施例或比較例的乾燥劑塗布於密封基板的中央部,從而形成乾燥劑層。並且,利用塗布機將由紫外線固化型樹脂構成的密封劑以包圍所塗布的乾燥劑的方式塗布於密封基板上。 然後,以使層疊體、乾燥劑層以及密封劑位於內側的方式來貼合元件基板和密封基板。在該狀態下,透過照射紫外線和加熱至80℃來密封元件基板及密封基板的外周部,從而得在由密封劑所包圍的氣密空間內設置有乾燥劑的中空密封結構的有機EL元件。 將所獲得的有機EL元件放置於85℃、85%RH的高溫高濕環境中,追蹤發光面積率相對於經過時間的變化。3. Evaluation The sputtering method was used to form a film having a thickness of 140 nm on the element substrate from ITO, which is a conductive material having transparency. The ITO film is etched by photolithography to form a predetermined pattern shape, thereby forming an anode. Use resistance heating method. Copper phthalocyanine (CuPc) was formed on the upper surface of the formed anode to a thickness of 70 nm to form a hole injection layer, and di [N- (1-naphthyl) was formed on the upper surface of the hole injection layer. -N-phenyl] benzidine (α-NPD) forms a film with a thickness of 30 nm to form a hole transport layer, and then on the top surface of the hole transport layer, tris (8-hydroxyquinoline) aluminum (Alq 3 ) A film having a film thickness of 50 nm is formed to form a light emitting layer. Next, lithium fluoride (LiF) was formed on the upper surface of the light-emitting layer into a 7-nm-thick film to form an electron-transporting layer, and aluminum was physically vapor-deposited on the surface of the electron-transporting layer with a thickness of 150 nm as a cathode. Thereby, a stacked body in which an anode, an organic layer (hole injection layer / hole transport layer / light emitting layer), an electron transport layer, and a cathode are sequentially stacked on the element substrate is formed. Next, in the glove box replaced with nitrogen having a dew point of -76 ° C, the desiccant of each of the examples or comparative examples was applied to the central portion of the sealing substrate by a coater to form a desiccant layer. Then, a sealant made of an ultraviolet curable resin is applied to the sealing substrate with a coater so as to surround the applied desiccant. Then, the element substrate and the sealing substrate are bonded so that the laminate, the desiccant layer, and the sealant are located inside. In this state, the element substrate and the outer peripheral portion of the sealing substrate are sealed by irradiating ultraviolet rays and heating to 80 ° C., thereby obtaining an organic EL element having a hollow sealing structure in which a desiccant is provided in an air-tight space surrounded by the sealing agent. The obtained organic EL element was placed in a high-temperature, high-humidity environment at 85 ° C. and 85% RH, and the change in light-emitting area ratio with respect to elapsed time was tracked.
第2圖是表示高溫高濕環境下的有機EL元件的發光面積率和經過時間之間的關係的圖表。包含實施例1、2的乾燥劑的有機EL元件在經過500小時後顯示出80%以上的發光面積率,而且發光面積率在經過1000小時後也維持在75%以上。相對於此,包含比較例1~5的乾燥劑的有機EL元件在經過500小時的時間點中,發光面積率下降到低於80%。由該結果可知,本發明的乾燥劑能夠充分地抑制有機EL元件產生黑點。FIG. 2 is a graph showing the relationship between the light-emitting area ratio and the elapsed time of the organic EL element in a high-temperature and high-humidity environment. The organic EL element including the desiccants of Examples 1 and 2 showed a light emitting area ratio of 80% or more after 500 hours, and the light emitting area ratio was maintained at 75% or more after 1000 hours. On the other hand, in the organic EL element including the desiccants of Comparative Examples 1 to 5, the light emitting area ratio decreased to less than 80% at the elapse of 500 hours. From this result, it is understood that the desiccant of the present invention can sufficiently suppress the occurrence of black spots in the organic EL element.
1‧‧‧有機EL元件1‧‧‧Organic EL element
2‧‧‧元件基板 2‧‧‧Element substrate
3‧‧‧密封基板 3‧‧‧sealed substrate
4‧‧‧有機層 4‧‧‧ organic layer
4a‧‧‧電洞注入層 4a‧‧‧ Hole injection layer
4b‧‧‧電洞傳輸層 4b‧‧‧hole transmission layer
4c‧‧‧發光層 4c‧‧‧Light-emitting layer
4d‧‧‧電子傳輸層 4d‧‧‧ electron transmission layer
5‧‧‧陽極 5‧‧‧ anode
6‧‧‧陰極 6‧‧‧ cathode
7‧‧‧乾燥劑層 7‧‧‧ Desiccant layer
8‧‧‧密封劑 8‧‧‧ Sealant
第1圖是表示本發明的一實施型態所涉及的有機EL元件的示意剖視圖。 第2圖是表示高溫高濕環境下的有機EL元件的發光面積率和經過時間之間的關係的圖表。FIG. 1 is a schematic cross-sectional view showing an organic EL element according to an embodiment of the present invention. FIG. 2 is a graph showing the relationship between the light-emitting area ratio and the elapsed time of the organic EL element in a high-temperature and high-humidity environment.
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW575654B (en) * | 2001-11-07 | 2004-02-11 | Futaba Denshi Kogyo Kk | Drying agent |
JP2011084667A (en) * | 2009-10-16 | 2011-04-28 | Ajinomoto Co Inc | Resin composition |
TW201315593A (en) * | 2011-10-12 | 2013-04-16 | Asahi Glass Co Ltd | Manufacturing method of electronic device and manufacturing method of carrier substrate with resin layer |
TW201500444A (en) * | 2013-04-18 | 2015-01-01 | Mitsui Chemicals Inc | Composition, cured product, display device and method of producing the same |
TW201522491A (en) * | 2013-11-08 | 2015-06-16 | Ajinomoto Kk | Hydrotalcite-containing sealing resin composition and sealing sheet |
Family Cites Families (11)
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US6740145B2 (en) * | 2001-08-08 | 2004-05-25 | Eastman Kodak Company | Desiccants and desiccant packages for highly moisture-sensitive electronic devices |
JP2004273348A (en) * | 2003-03-11 | 2004-09-30 | Dynic Corp | Organic el device |
JP2005243556A (en) * | 2004-02-27 | 2005-09-08 | Shin Etsu Polymer Co Ltd | Drying agent for organic el devices, and its manufacturing method |
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JP5556501B2 (en) * | 2010-08-19 | 2014-07-23 | マツダ株式会社 | Exhaust gas purification catalyst and method for producing exhaust gas purification catalyst |
JP5252327B2 (en) * | 2011-07-14 | 2013-07-31 | 宇部マテリアルズ株式会社 | Moisture adsorbent for organic EL device and method for producing the same |
JP6002075B2 (en) * | 2013-04-09 | 2016-10-05 | 双葉電子工業株式会社 | Complex compound, desiccant, sealing structure and organic EL device |
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Publication number | Priority date | Publication date | Assignee | Title |
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TW201500444A (en) * | 2013-04-18 | 2015-01-01 | Mitsui Chemicals Inc | Composition, cured product, display device and method of producing the same |
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