TWI669815B - Side film package on flexible substrate - Google Patents

Abstract

The invention relates to a flexible substrate lateral film package, comprising: a flexible substrate, a pixel defining layer having a material of a cross-linked organic material or a low thermal expansion coefficient of tantalum nitride; and a light-emitting element disposed on the flexible substrate Above the zone; the barrier layer may be made of an organic material of a crosslinked structure or a tantalum nitride having a low coefficient of thermal expansion, and the barrier layer is disposed on the side of the pixel defining layer at the outermost periphery of the flexible substrate; the flexible film cover is sealed by the package surface Forming a flexible organic light-emitting diode device above the light-emitting element and the barrier layer; accordingly, the present invention utilizes a barrier layer on the side of the pixel defining layer at the outermost periphery of the flexible substrate to match the pixel defining layer to block moisture from the side Edge penetration enhances the lateral compaction of water-oxygen permeation of the flexible organic light-emitting diode device.

Description

Flexible substrate lateral film package

The invention relates to a thin film encapsulation technique, in particular to a flexible substrate lateral thin film encapsulation.

OLED (Organic Light Emitting Diode) has the advantages of self-luminescence, fast response, high color saturation and simple process. With the gradual expansion of electronic product demand and the improvement of lighting application technology standards in recent years, Organic light-emitting diodes have gradually become the mainstream in the market as display devices or lighting devices.

Please refer to FIG. 1 , which is a schematic diagram of a conventional organic light emitting diode package structure. As shown in the figure, since the active metal and the organic light emitting material used in the organic light emitting diode element 92 are very sensitive to moisture and oxygen, Therefore, in the conventional packaging method of the organic light emitting diode device, the organic light emitting diode element 92 located between the glass substrate 90 and the package cover 91 is encapsulated by the melt adhesive 93, thereby achieving the separation of moisture and oxygen. The effect is to prevent the organic light-emitting diode element 92 from being deteriorated by the infiltration of moisture and oxygen.

However, whether the glass substrate 90, the package cover 91 or the melt adhesive 93 are hard and fragile, the above package method cannot be applied to a flexible organic light-emitting diode device; In other words, for a flexible organic light-emitting diode device using a flexible substrate, it is necessary to adopt other types of packaging methods to achieve the effect of blocking moisture and oxygen.

To this end, please refer to FIG. 2, which is a package structure of a flexible organic light-emitting diode device, which is packaged by placing an OLED on a substrate, covering a thin film encapsulation layer on the OLED, and then on the thin film encapsulation layer. Covering the organic resin layer, and finally covering the glass cover sheet with the organic resin layer, the packaging feature of the prior art is that the thin film encapsulation layer comprises a complex array of Al ₂ O ₃ thin films, and the SiN _x thin films are sequentially overlapped, so that the thin film encapsulation layer is high. The compactness can effectively prevent the moisture and oxygen of the environment from entering the interior of the OLED, causing erosion of metal and organic luminescent materials.

Referring to FIG. 3, a package film stack applied to an FOLED is disposed on the flexible substrate 106. The contact layer 108 is disposed between the substrate 106 and the OLED 102, and the first barrier layer 110 is disposed. The OLED 102, and the dielectric layer 112 disposed on the first barrier layer 110, the buffer layer 114 disposed on the dielectric layer 112, and the second barrier layer 116 disposed on the buffer layer 114. A dielectric layer formed by Atomic Layer Deposition (ALD) and at least two barrier layers enhance the barrier properties of the package and block moisture and oxygen from entering the OLED.

In the above, regarding the thin film encapsulation of the flexible organic light emitting diode device, a common technical method is to cover the multi-layer encapsulation film over the OLED in a longitudinal manner. In the conventional technology of FIG. 2, the overlying OLED is covered. The complex array of Al ₂ O ₃ thin film SiN _x thin films are sequentially stacked to form a thin film encapsulation layer to enhance the compactness of the package; in the conventional technique of FIG. 3, the dielectric layer and the first and second barriers are used over the OLED. The layer enhances the barrier properties of the package. However, whether using an Al ₂ O ₃ thin film SiN _x thin film or a dielectric layer to perform thin film encapsulation on the OLED, only water oxygen permeation from above the OLED can be improved, but in fact, water oxygen is infiltrated from above the OLED. It will also be infiltrated laterally by the OLED; therefore, when the water oxygen is infiltrated laterally by the flexible organic light-emitting diode device, the outer frame of the OLED is preferentially disabled, as shown in FIG.

Therefore, if only the vertical thin film encapsulation method is used, the upper layer of the OLED is covered with multiple layers. The encapsulation film does not really solve the problem that the flexible organic light-emitting diode device is laterally penetrated by moisture and oxygen.

The main object of the present invention is to disclose a technology of a lateral thin film encapsulation of a flexible substrate, which can effectively solve the lateral metal and organic light emission caused by water and oxygen permeation of the flexible organic light emitting diode device without changing the structure of the vertical thin film package. The problem of material damage.

To achieve the foregoing objective, the present invention is a flexible substrate lateral film package comprising: a flexible substrate having a pixel defining layer of a material having a crosslinked structure or a low thermal expansion coefficient of tantalum nitride; The flexible barrier layer is formed on the flexible display substrate; The adhesive is bonded over the light-emitting element and the barrier layer to form a flexible organic light-emitting diode device.

<知知>

90‧‧‧ glass substrate

91‧‧‧Packing cover

92‧‧‧Organic LED components

93‧‧‧ melt adhesive

102‧‧‧ OLED

106‧‧‧Flexible substrate

108‧‧‧Contact layer

110‧‧‧First barrier layer

112‧‧‧ dielectric layer

114‧‧‧buffer layer

116‧‧‧second barrier layer

<present invention>

10, 30, 50‧‧‧ flexible substrate

100, 300, 500‧‧‧ display area

101, 301, 501‧‧‧ non-display area

11, 31, 51‧ ‧ pixel definition layer

12, 32, 52‧‧‧Lighting elements

13, 33, 53‧‧ ‧ isolation layer

14, 34, 54‧‧ ‧ barrier

340, 540‧‧‧ first barrier

341, 541‧‧‧ second barrier

15, 35, 55‧‧‧ flexible film cover

20, 40, 60‧‧‧Flexible organic light emitting diode device

FIG. 1 is a schematic diagram of a conventional organic light emitting diode package structure.

2 is a schematic view showing a package structure of a conventional flexible organic light emitting diode device.

FIG. 3 is a schematic diagram of a conventional packaging film stack applied to a FOLED.

FIG. 4 is a schematic diagram of a conventional OLED frame failure.

FIG. 5 is a schematic view showing a lateral film package of a flexible substrate according to a first embodiment of the present invention.

6 is a schematic view showing a lateral film package of a flexible substrate according to a second embodiment of the present invention.

7 is a schematic view showing a lateral film package of a flexible substrate according to a third embodiment of the present invention.

Referring to FIG. 5, a flexible substrate lateral film package according to a first embodiment of the present invention is further described. The flexible substrate 10 is provided with a pixel defining layer 11 disposed on the two pixel defining layers 11 of the flexible substrate 10. The area between the sides of the pixel defining layer 11 at the outermost periphery of the flexible substrate 10 is the non-display area 101. In this embodiment, the pixel defining layer 11 is made of a material having a barrier property of water and oxygen. An organic material having a cross-linked structure, or may be a low thermal expansion coefficient of tantalum nitride; the light-emitting element 12 is disposed above the display area 100 of the flexible substrate 10. In the embodiment, the light-emitting element 12 is an OLED; the isolation layer 13 is provided. The barrier layer 14 is disposed on the side of the pixel defining layer 11 at the outermost periphery of the flexible substrate 10 (ie, the non-display area 101). In this embodiment, the barrier layer 14 is made of a material having a barrier property of water and oxygen. The material may be an organic material having a cross-linked structure, or may be a low thermal expansion coefficient of tantalum nitride; the flexible film cover 15 has a package surface adhesive (not shown), and is attached to the light-emitting element 12 and the isolation layer 13 14 above the barrier layer is formed OLED device 20 may be flexible (Flexible).

Regarding the effect of the flexible substrate lateral film package of the first embodiment of the present invention, please refer to FIG. 5, the barrier layer 14 is disposed between the flexible substrate 10 and the flexible film cover 15 and located at the outermost periphery of the flexible substrate 10. The pixel defines the side of the layer 11, so that when the external water oxygen is to be infiltrated from the longitudinal direction (upper side) of the flexible organic light-emitting diode device 20, it can be blocked by the flexible film cover 15 while the external water When the oxygen is to be infiltrated laterally from the flexible organic light-emitting diode device 20, the first barrier can be blocked by the barrier layer 14 having the barrier property of water and oxygen, and if the water and oxygen continue to penetrate and block In the case of the layer 14, the second blocking is performed by the pixel defining layer 11 which also has the water-oxygen barrier property; accordingly, the present invention utilizes the barrier layer 14 on the side of the pixel defining layer 11 of the outermost periphery of the flexible substrate 10 to match the pixel defining layer. 11, can truly improve the flexibility of the flexible organic light-emitting diode device 20 laterally to water oxygen permeation.

Accordingly, in the first embodiment of the present invention, the main feature is that the structure of the vertical film package is not changed, but the density of the side package is emphasized, which is defined by the barrier layer 14 at the outermost periphery of the flexible substrate 10. The side of the layer 11 and the barrier layer 14 are not the encapsulating surface of the flexible film cover 15, but have a material that blocks the water-oxygen property, may be an organic material having a cross-linked structure, or may be nitrided with a low coefficient of thermal expansion. Hey.

Referring to FIG. 6 , a flexible substrate lateral film package according to a second embodiment of the present invention is further described. The flexible substrate 30 is provided with a pixel defining layer 31 disposed on the two pixel defining layers 31 of the flexible substrate 30 . The area between the sides of the pixel defining layer 31 at the outermost periphery of the flexible substrate 30 is the non-display area 301. In this embodiment, the pixel defining layer 11 is made of a material having a barrier property of water and oxygen. An organic material having a cross-linked structure, or may be a low thermal expansion coefficient of tantalum nitride; the light-emitting element 32 is disposed above the display area 300 of the flexible substrate 30. In this embodiment, the light-emitting element 32 is an OLED; the isolation layer 33 is provided. Above the pixel defining layer 31; the blocking layer 34 is disposed on the side of the pixel defining layer 31 at the outermost periphery of the flexible substrate 30 (ie, the non-display area 301), and the barrier layer 34 comprises two different materials and has the function of blocking water oxygen permeation. a first barrier layer 340 and a second barrier layer 341, the first barrier layer 340 is stacked on the second barrier layer 341 The pixel defining layer 31 covers a portion of the area of the second barrier layer 341. In this embodiment, the material of the first barrier layer 340 is a low thermal expansion coefficient of tantalum nitride, and the second barrier layer 341 The material is an organic material having a cross-linked structure, and the water permeability of the first barrier layer 340 is smaller than that of the second barrier layer 341; the flexible film cover 35 has a sealing surface (not shown), and is attached to the light-emitting element 32, Above the isolation layer 33 and the barrier layer 34, a flexible organic light-emitting diode device 40 is formed.

With regard to the effect of the flexible substrate lateral film package of the second embodiment of the present invention, please refer to FIG. 6 , the barrier layer 34 is disposed between the flexible substrate 30 and the flexible film cover 35 , and is located at the outermost periphery of the flexible substrate 30 . The pixel defines the side of the layer 31, and therefore, when the external water oxygen is to be infiltrated from the longitudinal direction (upper side) of the flexible organic light-emitting diode device 40, it is blocked by the flexible film cover 35, and when the external water oxygen To penetrate from the lateral direction of the flexible organic light-emitting diode device 40, the first barrier layer 340 having the water-oxygen barrier property is blocked from the second barrier layer 341, and the first barrier layer 340 is stacked on the first barrier layer 340. The second barrier layer 341 is disposed above and adjacent to the pixel defining layer 31, and the pixel defining layer 31 covers a partial area of the second barrier layer 341, so that when the water oxygen penetrates into the first barrier layer 340, the second barrier layer can be further utilized. 341 is blocked if water oxygen inadvertently penetrates into the second barrier layer 341. The blocking can be performed again by the pixel defining layer 31 having the water-oxygen barrier property; accordingly, the present invention utilizes the first barrier layer 340 and the second barrier layer 341 on the side of the pixel defining layer 31 of the outermost periphery of the flexible substrate 30 to be matched with the pixel definition. The layer 31 can truly improve the lateral denseness of the water-oxygen permeation of the flexible organic light-emitting diode device 30.

Accordingly, in the second embodiment of the present invention, the main feature is that the structure of the vertical thin film package is not changed, but the denseness of the side package is emphasized, which utilizes the first barrier layer 340. The second barrier layer 341 is disposed on the side of the pixel defining layer 31 at the outermost periphery of the flexible substrate 30, and is disposed between the flexible substrate 30 and the flexible film cover 35, and the first barrier layer 340 and the second barrier layer 341 are not The flexible film cover 35 has a sealing surface, but has a material that blocks water and oxygen properties, and may be an organic material having a crosslinked structure or may be a tantalum nitride having a low coefficient of thermal expansion.

Referring to FIG. 7 , a flexible substrate lateral film package according to a third embodiment of the present invention is further described. The flexible substrate 50 is provided with a pixel defining layer 51 disposed on the two pixel defining layers 51 of the flexible substrate 50 . The area between the pixels is defined as the display area 500, and the side of the pixel defining layer 51 at the outermost periphery of the flexible substrate 50 is a non-display area 501. In this embodiment, the pixel defining layer 51 is made of a material having a barrier property of water and oxygen, and may have a The organic material of the cross-linked structure may be a tantalum nitride having a low coefficient of thermal expansion; the light-emitting element 52 is disposed above the display area 500 of the flexible substrate 50. In this embodiment, the light-emitting element 52 is an OLED; and the isolation layer 53 is disposed on Above the pixel defining layer 51; the blocking layer 54 is disposed on the side of the pixel defining layer 51 at the outermost periphery of the flexible substrate 50 (ie, the non-display area 501), and the blocking layer 54 comprises two different materials and has the function of blocking water oxygen permeation. The first barrier layer 540 and the second barrier layer 541 are stacked on the second barrier layer 541 and cover a portion of the area of the pixel defining layer 51. The pixel defining layer 51 covers a portion of the second barrier layer 541. In this embodiment, the material of the first barrier layer 540 is a low thermal expansion coefficient of tantalum nitride, the material of the second barrier layer 541 is an organic material having a crosslinked structure, and the water permeability of the first barrier layer 540 is less than the second. a barrier film 541; a flexible film cover 55 having a package surface adhesive (not shown) attached to the light-emitting element 52. Above the isolation layer 53 and the barrier layer 54, a flexible organic light emitting diode device 60 is formed.

Regarding the effect of the flexible substrate lateral film package of the third embodiment of the present invention, please refer to FIG. 7 , the barrier layer 54 is disposed between the flexible substrate 50 and the flexible film cover 55 and located at the outermost periphery of the flexible substrate 50 . The pixel defines the side of the layer 51, and therefore, when the external water oxygen is to be infiltrated from the longitudinal direction (upper side) of the flexible organic light-emitting diode device 60, it can be blocked by the flexible film cover 55, and the external water When the oxygen is to be infiltrated laterally from the flexible organic light-emitting diode device 60, the first barrier layer 540 may be blocked by the first barrier layer 540 having the water-oxygen barrier property and the second barrier layer 541. The second barrier layer 541 covers the partial area of the pixel defining layer 51, and the pixel defining layer 51 covers a portion of the second barrier layer 541. Therefore, when the water oxygen penetrates into the first barrier layer 540, the second blocking layer can be used. The layer 541 is blocked. If the water oxygen inadvertently penetrates into the second barrier layer 541, it can be again blocked by the pixel defining layer 51 having the water-oxygen barrier property; accordingly, the present invention utilizes the outermost pixel definition of the flexible substrate 50. First resistance on the side of layer 51 Barrier layer 540 and second layer 541 with the pixel definition layer 51, can actually increase the compactness of the flexible (Flexible) OLED device 60 side to water to oxygen permeation.

Accordingly, in the third embodiment of the present invention, the main feature is that the structure of the vertical film package is not changed, but the density of the side package is emphasized, which is set by the first barrier layer 540 and the second barrier layer 541. The pixel defining layer 31 of the outermost periphery of the flexible substrate 50 is disposed between the flexible substrate 50 and the flexible film cover 55, and the first barrier layer 540 and the second barrier layer 541 are not the package surface of the flexible film cover 55. The glue, but a material having a barrier property of water and oxygen, may be an organic material having a crosslinked structure, or may be a tantalum nitride having a low coefficient of thermal expansion.

In summary, the flexible substrate of the first to third embodiments of the present invention is laterally thin. Membrane packaging, the common technical feature is to use a barrier layer having a barrier to water and oxygen to be disposed on the side of the pixel defining layer at the outermost periphery of the flexible substrate, and the barrier layer can be selected from two different materials of the first barrier layer according to actual needs. The second barrier layer is arranged in a stack, so that when the water oxygen is infiltrated from the side of the flexible organic light emitting diode device, the two barrier layers can be blocked by the first barrier layer and the second barrier layer. The effectiveness of the flexible organic light-emitting diode device in laterally affecting water oxygen permeation is effectively improved.

The above embodiments are merely illustrative of the present invention and its effects, and are not intended to limit the present invention, and those skilled in the art can modify and modify the above embodiments without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as listed in the scope of the patent application to be described later.

Claims (10)

A flexible substrate lateral film package comprises: a flexible substrate, a pixel defining layer of an organic material having a cross-connect structure thereon; and a region between the two pixel defining layers of the flexible substrate is a display area, located at the outermost periphery of the flexible substrate The area of the side of the pixel defining layer is a non-display area; the light emitting element is disposed above the display area of the flexible substrate; the barrier layer is an organic material of the interconnected structure and is disposed at the outermost periphery of the flexible substrate. a flexible film cover plate is attached to the light-emitting element and the barrier layer by a package surface adhesive to form a flexible organic light-emitting diode device. A flexible substrate lateral film package includes: a flexible substrate, a pixel defining layer having a low thermal expansion coefficient of tantalum nitride thereon; and a region between the two pixel defining layers of the flexible substrate is a display area, and the flexible substrate is located on the flexible substrate The outermost portion of the pixel defining layer is a non-display area; the light emitting element is disposed above the display area of the flexible substrate; and the barrier layer is a low thermal expansion coefficient of tantalum nitride and is disposed at the outermost periphery of the flexible substrate. The pixel defines a layer side; a flexible film cover is attached to the light-emitting element and the barrier layer by a package surface adhesive to form a flexible organic light-emitting diode device. A flexible substrate lateral film package comprises: a flexible substrate, a pixel defining layer of an organic material having a cross-connect structure thereon; and a region between the two pixel defining layers of the flexible substrate is a display area, located in the soft The area of the pixel defining layer at the outermost periphery of the substrate is a non-display area; the light emitting element is disposed above the display area of the flexible substrate; and the blocking layer is disposed at a side of the pixel defining layer at the outermost periphery of the flexible substrate. And the barrier layer comprises a first barrier layer of tantalum nitride having a low thermal expansion coefficient and a second barrier layer of an organic material of a crosslinked structure, wherein the first barrier layer is disposed above the second barrier layer and defined with pixels The layer is disposed adjacent to the layer, and the pixel defining layer covers the second barrier layer portion area; the flexible film cover plate is pasted on the light emitting element and the barrier layer by the package surface adhesive to form the flexible organic light emitting diode device . The flexible substrate lateral film package of claim 3, wherein the first barrier layer has a water permeability lower than the second barrier layer. A flexible substrate lateral film package includes: a flexible substrate, a pixel defining layer having a low thermal expansion coefficient of tantalum nitride thereon; and a region between the two pixel defining layers of the flexible substrate is a display area, and the flexible substrate is located on the flexible substrate The outermost portion of the pixel defining layer is a non-display area; the light emitting element is disposed above the display area of the flexible substrate; and the blocking layer is disposed at a side of the pixel defining layer at the outermost periphery of the flexible substrate, and the blocking The layer includes a first barrier layer of tantalum nitride having a low thermal expansion coefficient and a second barrier layer of an organic material of a crosslinked structure, wherein the first barrier layer is disposed over the second barrier layer and adjacent to the pixel defining layer Provided, the pixel defining layer covers the second barrier layer portion area; the flexible film cover plate is attached to the light emitting element and the barrier layer by the package surface adhesive Above, a flexible organic light emitting diode device is formed. The flexible substrate lateral film package of claim 5, wherein the first barrier layer has a water permeability lower than the second barrier layer. A flexible substrate lateral film package comprises: a flexible substrate, a pixel defining layer of an organic material having a cross-connect structure thereon; and a region between the two pixel defining layers of the flexible substrate is a display area, located at the outermost periphery of the flexible substrate The area of the side of the pixel defining layer is a non-display area; the light emitting element is disposed above the display area of the flexible substrate; the blocking layer is disposed at a side of the pixel defining layer at the outermost periphery of the flexible substrate, and the blocking layer comprises a first barrier layer of a low thermal expansion coefficient of tantalum nitride and a second barrier layer of an organic material of a crosslinked structure, wherein the first barrier layer is disposed over the second barrier layer and covers a portion of the pixel defining layer. The pixel defining layer covers the second barrier layer portion area; the flexible film cover plate is pasted on the light emitting element and the barrier layer by the package surface adhesive to form a flexible organic light emitting diode device. The flexible substrate lateral film package of claim 7, wherein the first barrier layer has a water permeability lower than the second barrier layer. A flexible substrate lateral film package includes: a flexible substrate, a pixel defining layer having a low thermal expansion coefficient of tantalum nitride thereon; and a region between the two pixel defining layers of the flexible substrate is a display area, and the flexible substrate is located on the flexible substrate The outermost portion of the pixel defining layer side is a non-display area; the light emitting element is disposed above the display area of the flexible substrate; a barrier layer disposed on a side of the pixel defining layer at the outermost periphery of the flexible substrate, and the barrier layer comprises a first barrier layer of tantalum nitride having a low thermal expansion coefficient and a second barrier layer of an organic material of a crosslinked structure, wherein The first barrier layer is disposed above the second barrier layer and covers an area of the pixel defining layer, the pixel defining layer covers a second barrier layer portion area; and the flexible film cover is adhered to the Above the light-emitting element and the barrier layer, a flexible organic light-emitting diode device is formed. The flexible substrate lateral film package of claim 9, wherein the first barrier layer has a water permeability lower than the second barrier layer.