TWI669497B - Gas analyzing device and method for gas analysis - Google Patents

Gas analyzing device and method for gas analysis Download PDF

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TWI669497B
TWI669497B TW107147752A TW107147752A TWI669497B TW I669497 B TWI669497 B TW I669497B TW 107147752 A TW107147752 A TW 107147752A TW 107147752 A TW107147752 A TW 107147752A TW I669497 B TWI669497 B TW I669497B
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chamber
analysis
gas
residual gas
vacuum
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TW202007945A (en
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西川祐介
衣川勝
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日商三菱電機股份有限公司
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Abstract

本發明提供在於無論在試驗體中的殘留氣體量多或少的情況下,均可高敏感度地分析殘留氣體之裝置及方法。 The present invention provides an apparatus and method for analyzing residual gas with high sensitivity regardless of the amount of residual gas in the test body.

本發明之裝置包括:試料室1,用以在真空中從試驗體3取出殘留氣體;中間室4,在真空中透過第一真空閥與試料室1連接;第一分析室6,在真空狀態,透過第二真空閥與中間室4連接;第二分析室7,在真空狀態透過孔口板5與中間室4連接;真空計,測量試料室1之氣體量;釋氣部8,自第二分析室7將殘留氣體釋氣;控制演算部9,當氣體量為閾值以上時關閉第二真空閥,而當氣體量未達閾值時開啟第二真空閥;以及一台或複數台質量分析計,當氣體量為閾值以上時,分析被獲取至第二分析室7之殘留氣體,而當氣體量未達閾值時,分析被獲取至第一分析室6之殘留氣體。 The apparatus of the present invention comprises: a sample chamber 1 for taking out residual gas from the test body 3 in a vacuum; an intermediate chamber 4 connected to the sample chamber 1 through a first vacuum valve in a vacuum; a first analysis chamber 6, in a vacuum state Connected to the intermediate chamber 4 through a second vacuum valve; the second analysis chamber 7 is connected to the intermediate chamber 4 through the orifice plate 5 in a vacuum state; a vacuum gauge measures the amount of gas in the sample chamber 1; The second analysis chamber 7 releases the residual gas; the control calculation unit 9 closes the second vacuum valve when the gas amount is above the threshold value, and opens the second vacuum valve when the gas amount does not reach the threshold value; and one or more mass analysis The residual gas acquired to the second analysis chamber 7 is analyzed when the gas amount is above the threshold, and the residual gas acquired to the first analysis chamber 6 is analyzed when the gas amount does not reach the threshold.

Description

氣體分析裝置及氣體分析方法 Gas analysis device and gas analysis method

本發明有關於氣體分析裝置及氣體分析方法。 The present invention relates to a gas analysis device and a gas analysis method.

對於如氣密密封之半導體封裝以及燈(lamp)等氣密密封之中空的半導體封裝那樣的試驗體之殘留氣體,一般係於真空中使用質量分析計進行組成分析。於試驗體之密封構造中會因為殘留氣體之洩漏,或來自使用材料之脫離氣體,使得試驗體之殘留氣體量有所變化。因此,試驗體之殘留氣體量如不破壞密封構造而開封的話無法得知。 The residual gas of the test body such as a hermetically sealed semiconductor package and a hermetically sealed hollow semiconductor package such as a lamp is generally subjected to composition analysis using a mass spectrometer in a vacuum. In the sealing structure of the test body, the amount of residual gas in the test body may vary due to leakage of residual gas or detachment of gas from the use of the material. Therefore, the amount of residual gas in the test body cannot be known without opening the seal without breaking the seal structure.

並且,若在具備質量分析計之分析室中一次流入大量之氣體,則會超過動作壓力的上限,故若是殘留氣體量多時,則無法進行殘留氣體的組成分析。並且,殘留氣體量過多時有時還會造成質量分析計故障。 Further, when a large amount of gas is introduced into the analysis chamber having the mass spectrometer, the upper limit of the operating pressure is exceeded. Therefore, if the amount of residual gas is large, the composition analysis of the residual gas cannot be performed. Also, if the amount of residual gas is too large, the mass spectrometer may malfunction.

為了對應殘留氣體大量之情況,有考量到在將殘留氣體獲取至分析室時,於分析室的入口設有孔口板,減小進入分析室的殘留氣體量。由於係通過孔口板讓殘留 氣體依次流入分析室中,故須從分析室適時地讓殘留氣體由釋氣部釋氣。藉由孔口板與釋氣部,可以控制滯留在分析室之殘留氣體量。 In order to cope with a large amount of residual gas, it is considered that when the residual gas is taken into the analysis chamber, an orifice plate is provided at the inlet of the analysis chamber to reduce the amount of residual gas entering the analysis chamber. Because the residue is passed through the orifice plate The gas flows into the analysis chamber in sequence, so it is necessary to timely release the residual gas from the outgas portion from the analysis chamber. The amount of residual gas retained in the analysis chamber can be controlled by the orifice plate and the venting portion.

例如,專利文獻1中,揭示有在試料室與分析室之間設有孔口板,分析流入至具有質量分析計之分析室的殘留氣體之技術。 For example, Patent Document 1 discloses a technique in which an orifice plate is provided between a sample chamber and an analysis chamber to analyze a residual gas flowing into an analysis chamber having a mass spectrometer.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開2008-180581號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2008-180581

如前所述,藉由孔口板與釋氣部,可以控制滯留在分析室之殘留氣體量,但殘留氣體少時,因為孔口板會使得到達質量分析計之殘留氣體量減到比質量分析計的測定下限值小,或是到達分析室的微量殘留氣體在經質量分析計分析前,就被釋氣部釋氣掉。 As described above, the amount of residual gas retained in the analysis chamber can be controlled by the orifice plate and the gas release portion, but when the residual gas is small, the orifice plate can reduce the amount of residual gas reaching the mass spectrometer to the specific mass. The lower limit of the measurement of the analyzer is small, or the trace residual gas reaching the analysis chamber is released from the gas release portion before being analyzed by the mass spectrometer.

因此,殘留氣體量少時,有時會無法為組成分析,或是分析效率低落。另一方面,若不設置孔口板或釋氣部,則會如前所述,有時會無法對應大量的殘留氣體。 本發明之目的在於無論在試驗體中的殘留氣體量多或少的情況,均可高敏感度地分析殘留氣體。 Therefore, when the amount of residual gas is small, composition analysis may be impossible or the analysis efficiency may be low. On the other hand, if the orifice plate or the gas release portion is not provided, as described above, a large amount of residual gas may not be able to correspond. An object of the present invention is to analyze residual gas with high sensitivity regardless of the amount of residual gas in the test body.

為解決上述課題,本發明係具備:試料室, 用以在真空中從試驗體取出殘留氣體;中間室,在真空中,透過第一真空閥,以能獲取來自試料室之殘留氣體的方式與試料室連接;第一分析室,在真空狀態,以能獲取來自中間室之殘留氣體的方式透過第二真空閥與中間室連接;第二分析室,在真空狀態,以能獲取來自中間室之殘留氣體的方式透過孔口板與中間室連接;真空計,用以測量試料室之殘留氣體之氣體量;釋氣部,用以自第二分析室將殘留氣體釋氣;控制演算部,當氣體量為閾值以上時關閉第二真空閥,而當氣體量未達閾值時開啟第二真空閥,在真空計測量殘留氣體之氣體量後開啟第一真空閥;以及一台或複數台質量分析計,當氣體量為閾值以上時,分析被獲取至第二分析室之殘留氣體,而當氣體量未達閾值時,分析被獲取至第一分析室之殘留氣體。 In order to solve the above problems, the present invention includes a sample chamber. The residual gas is taken out from the test body in a vacuum; the intermediate chamber is connected to the sample chamber in a vacuum through the first vacuum valve in such a manner as to obtain residual gas from the sample chamber; the first analysis chamber is in a vacuum state, Connecting to the intermediate chamber through a second vacuum valve in such a manner as to obtain residual gas from the intermediate chamber; the second analysis chamber is connected to the intermediate chamber through the orifice plate in a vacuum state in such a manner as to obtain residual gas from the intermediate chamber; a vacuum gauge for measuring the amount of gas of the residual gas in the sample chamber; a gas release portion for releasing the residual gas from the second analysis chamber; and a control calculation unit that closes the second vacuum valve when the gas amount is above a threshold value, and When the amount of gas does not reach the threshold, the second vacuum valve is opened, and after the vacuum gauge measures the amount of residual gas, the first vacuum valve is opened; and one or more mass spectrometers, when the gas amount is above the threshold, the analysis is obtained. The residual gas to the second analysis chamber, and when the amount of gas does not reach the threshold, the residual gas obtained to the first analysis chamber is analyzed.

依據本發明,無論在試驗體中的殘留氣體量多或少的情況,均可分析殘留氣體。 According to the present invention, the residual gas can be analyzed regardless of the amount of residual gas in the test body.

1‧‧‧試料室 1‧‧‧ sample room

2‧‧‧開封器 2‧‧‧Opener

3‧‧‧試驗體 3‧‧‧Test body

4‧‧‧中間室 4‧‧‧Intermediate room

5‧‧‧孔口板 5‧‧‧ orifice plate

6‧‧‧第一分析室 6‧‧‧First Analysis Room

7‧‧‧第二分析室 7‧‧‧Second analysis room

8‧‧‧釋氣部 8‧‧‧Detonation Department

9‧‧‧控制演算部 9‧‧‧Control and Calculation Department

10‧‧‧通信通路 10‧‧‧Communication pathway

12‧‧‧可變孔口板 12‧‧‧Variable orifice plate

13‧‧‧孔口 13‧‧‧孔口

14‧‧‧中心軸 14‧‧‧ center axis

15‧‧‧蓋 15‧‧‧ Cover

100、200、300‧‧‧氣體分析裝置 100, 200, 300‧‧‧ gas analysis device

201‧‧‧輸入界面 201‧‧‧ input interface

202‧‧‧演算裝置 202‧‧‧calculation device

203‧‧‧記憶裝置 203‧‧‧ memory device

204‧‧‧輸出界面 204‧‧‧ Output interface

G0、G1、G2‧‧‧真空計 G0, G1, G2‧‧‧ vacuum gauge

MS1、MS2‧‧‧質量分析計 MS1, MS2‧‧‧ quality analyzer

S101至S114、S201、S202、S301、S302‧‧‧步驟 S101 to S114, S201, S202, S301, S302‧‧‧ steps

VV1、VV2、VV3‧‧‧真空閥 VV1, VV2, VV3‧‧‧ vacuum valve

第1圖係顯示於本發明之實施方式1中之氣體分析裝置之構成之一之概略圖。 Fig. 1 is a schematic view showing one of the constitutions of the gas analyzer according to the first embodiment of the present invention.

第2圖係顯示控制演算部之構成之概略圖。 Fig. 2 is a schematic view showing the configuration of a control calculation unit.

第3圖係表示本發明之實施方式1中使用氣體分析裝置的氣體分析方法之流程圖。 Fig. 3 is a flow chart showing a gas analysis method using a gas analyzer in the first embodiment of the present invention.

第4圖係顯示關於本發明之實施方式1中之氣體分析 裝置之試料室之壓力與緊接著開啟真空閥後第一分析室之壓力之關係之一例之圖表。 Figure 4 is a diagram showing gas analysis in Embodiment 1 of the present invention. A graph of a relationship between the pressure of the sample chamber of the apparatus and the pressure of the first analysis chamber immediately after opening the vacuum valve.

第5圖係顯示於依據本發明之實施方式1之氣體分析裝置中,在第一分析室進行氣體分析之際,於真空閥開閉前後之第一分析室內之壓力的時間變化之一例之圖表。 Fig. 5 is a graph showing an example of temporal changes in pressure in the first analysis chamber before and after opening and closing of the vacuum valve in the gas analysis apparatus according to the first embodiment of the present invention.

第6圖係顯示於依據本發明之實施方式1之氣體分析裝置中,在第二分析室進行氣體分析之際,在真空閥開閉前後之第二分析室內之壓力的時間變化之一例之圖表。 Fig. 6 is a graph showing an example of temporal changes in pressure in a second analysis chamber before and after opening and closing of a vacuum valve in the gas analysis apparatus according to the first embodiment of the present invention.

第7圖係顯示依據本發明之實施方式2之氣體分析裝置之構成之概略圖。 Fig. 7 is a schematic view showing the configuration of a gas analyzer according to a second embodiment of the present invention.

第8圖係顯示使用依據本發明之實施方式2之氣體分析裝置之氣體分析方法之流程圖。 Fig. 8 is a flow chart showing a gas analysis method using a gas analysis device according to Embodiment 2 of the present invention.

第9圖係顯示依據本發明之實施方式3之氣體分析裝置之構成之概略圖。 Fig. 9 is a schematic view showing the configuration of a gas analysis device according to Embodiment 3 of the present invention.

第10圖係顯示依據本發明之實施方式3之氣體分析裝置所使用之可變孔口板之構成之概略圖。 Fig. 10 is a schematic view showing the configuration of a variable orifice plate used in the gas analyzer according to the third embodiment of the present invention.

第11圖係顯示使用依據本發明之實施方式3之氣體分析裝置的氣體分析方法之流程圖。 Fig. 11 is a flow chart showing a gas analysis method using the gas analysis device according to Embodiment 3 of the present invention.

第12圖係顯示依據本發明之實施方式3之氣體分析裝置,在第一分析室進行氣體分析之際,在真空閥開閉前後,於第一分析室內之壓力之時間變化中之可變孔口板的孔口板開口數相依性之一例之圖表。 Figure 12 is a view showing a variable orifice in the time change of the pressure in the first analysis chamber before and after the vacuum valve is opened and closed in the gas analysis device according to Embodiment 3 of the present invention. A chart of one example of the number of aperture openings in a plate.

第13圖係顯示依據本發明之實施方式3之氣體分析裝置,在第二分析室進行氣體分析之際,在真空閥開閉前 後,於第一分析室內之壓力之時間變化中之可變孔口板之孔口板開口數相依性之一例之圖表。 Figure 13 is a view showing a gas analysis device according to Embodiment 3 of the present invention, before the vacuum valve is opened and closed, when the gas analysis is performed in the second analysis chamber. Thereafter, a graph of an example of the number of orifice plate openings of the variable orifice plate in the time change of the pressure in the first analysis chamber.

以下,基於圖式詳細說明關於本發明之實施方式之氣體分析裝置。另外,本發明不受該實施方式所限定。 Hereinafter, a gas analysis device according to an embodiment of the present invention will be described in detail based on the drawings. Further, the present invention is not limited by the embodiment.

實施方式1. Embodiment 1.

關於本發明之氣體分析裝置100係分析密封在試料內之殘留氣體的組成。另外,說明所使用之圖並非表示發明實際的尺寸或比例,而係表示來用以說明本發明之示意圖。 The gas analyzer 100 of the present invention analyzes the composition of the residual gas sealed in the sample. In addition, the drawings used are not intended to represent actual dimensions or proportions of the invention, but are used to illustrate the invention.

第1圖係顯示依據本發明之實施方式1之氣體分析裝置100之構成之概略圖。如第1圖所例示,本實施方式之氣體分析裝置100,大致由試料室1與第一分析室6與第二分析室7、中間室4、孔口板5、釋氣部8、控制演算部9所構成。構成之細節係如下述說明。 Fig. 1 is a schematic view showing the configuration of a gas analysis device 100 according to Embodiment 1 of the present invention. As illustrated in Fig. 1, the gas analysis device 100 of the present embodiment is substantially composed of a sample chamber 1 and a first analysis chamber 6 and a second analysis chamber 7, an intermediate chamber 4, an orifice plate 5, an outgassing portion 8, and a control calculation. Part 9 is composed. The details of the configuration are as follows.

試料室1係具有將置於試料室1內之試驗體3開封之開封器2、真空計G0、真空閥VV1。試料室1係透過真空閥VV1連接至中間室4。真空計G0、G1、G2係例如有轉子真空計(spinning rotor gauge)、隔膜真空計、晶體真空計(crystal gauge)。 The sample chamber 1 has a sealer 2 for opening the test body 3 placed in the sample chamber 1, a vacuum gauge G0, and a vacuum valve VV1. The sample chamber 1 is connected to the intermediate chamber 4 through a vacuum valve VV1. The vacuum gauges G0, G1, and G2 are, for example, a spinning rotor gauge, a diaphragm vacuum gauge, and a crystal gauge.

而且,真空計G0、G1、G2例如有冷陰極真空計(cold cathode ionization gauge)或B-A(Bayard-Alpert) 真空計等之電離真空計,或組合晶體真空計與冷陰極真空計等之電離真空計而成的複合真空計。真空計G0、G1、G2係測量壓力者。 Moreover, the vacuum gauges G0, G1, G2 have, for example, a cold cathode ionization gauge or a B-A (Bayard-Alpert). An ionization vacuum gauge such as a vacuum gauge, or a composite vacuum gauge combined with an ionization vacuum gauge such as a crystal vacuum gauge and a cold cathode vacuum gauge. The vacuum gauges G0, G1, and G2 measure the pressure.

真空計G0測量試料室1內之壓力。真空閥VV1例如使用閘閥(gate valve)。真空閥VV1係藉著該閥的開閉來進行試料室1與中間室4之空間的阻斷以及開放。 The vacuum gauge G0 measures the pressure in the sample chamber 1. The vacuum valve VV1 uses, for example, a gate valve. The vacuum valve VV1 blocks and opens the space between the sample chamber 1 and the intermediate chamber 4 by opening and closing the valve.

在此,試驗體3係想定為具有中空構造,該中空構造內的容積未達5mm3之非常小的半導體裝置,或所謂的MEMS(Micro Electro Mechanical Systems;微機電系統)。而且,在此,試驗體3之開封,係指藉由試驗體3之破壞,使試驗體3之殘留氣體釋放至試料室1內。 Here, the test body 3 is intended to have a hollow structure, a semiconductor device having a volume of less than 5 mm 3 in the hollow structure, or a so-called MEMS (Micro Electro Mechanical Systems). Here, the opening of the test body 3 means that the residual gas of the test body 3 is released into the sample chamber 1 by the destruction of the test body 3.

中間室4係具備真空閥VV1、真空閥VV2、孔口板5,並透過真空閥VV1以能從試料室1獲取殘留氣體之方式連接。並且,中間室4係透過真空閥VV2與第一分析室6連接,透過孔口板5與第二分析室7連接。孔口板5有著減少殘留氣體之流動的功用。孔口板5係例如可使用金屬板中開有小洞之具有圓筒形狀者。例如可使用閘閥作為真空閥VV2。 The intermediate chamber 4 is provided with a vacuum valve VV1, a vacuum valve VV2, and an orifice plate 5, and is connected to the vacuum chamber VV1 so that residual gas can be obtained from the sample chamber 1. Further, the intermediate chamber 4 is connected to the first analysis chamber 6 through the vacuum valve VV2, and is connected to the second analysis chamber 7 through the orifice plate 5. The orifice plate 5 has a function of reducing the flow of residual gas. The orifice plate 5 can be, for example, a cylindrical shape in which a small hole is formed in a metal plate. For example, a gate valve can be used as the vacuum valve VV2.

真空閥VV2係藉著該閥的開閉來進行第一分析室6與中間室4之間的空間的阻斷以及開放的真空閥,且期望係有著在藉由控制演算部9將真空閥開放,使得真空閥的大小讓中間室4與第一分析室6看起來成為一個大的空間的方式的大小。 The vacuum valve VV2 performs the opening and closing of the valve to block the space between the first analysis chamber 6 and the intermediate chamber 4 and the open vacuum valve, and it is desirable to open the vacuum valve by the control calculation unit 9, The size of the vacuum valve is such that the intermediate chamber 4 and the first analysis chamber 6 appear to be a large space.

第一分析室6係具備真空計G1與質量分析 計MS1。第一分析室6係藉由真空閥VV2以能獲取來自中間室4之殘留氣體的方式與中間室4連接。真空計G1係測量第一分析室6內之壓力。真空計G1係例如可使用冷陰極真空計或B-A真空計,裸規(nude gauge)等之電離真空計。 The first analysis room 6 is equipped with a vacuum gauge G1 and mass analysis Count MS1. The first analysis chamber 6 is connected to the intermediate chamber 4 by means of the vacuum valve VV2 so that the residual gas from the intermediate chamber 4 can be obtained. The vacuum gauge G1 measures the pressure in the first analysis chamber 6. The vacuum gauge G1 can be, for example, a cold cathode vacuum gauge or a B-A vacuum gauge, an ion gauge of a nude gauge or the like.

試從驗體3內部解放之殘留氣體係通過真空閥VV1與中間室4,通過真空閥VV2進入第一分析室6。然後,質量分析計MS1係測量、分析被獲取至第一分析室6之殘留氣體。 The residual gas system liberated from the inside of the test body 3 passes through the vacuum valve VV1 and the intermediate chamber 4, and enters the first analysis chamber 6 through the vacuum valve VV2. Then, the mass spectrometer MS1 measures and analyzes the residual gas that is taken to the first analysis chamber 6.

質量分析計MS1、MS2係例如使用四極型質量分析計。在此,質量分析計MS1、MS2係預想為於使用中決定有上限之壓力,不適合於大量氣體的測量、分析者。質量分析計MS1、MS2因為大量之氣體於氛圍中壓力大時,有可能會造成故障。 The mass spectrometers MS1, MS2 are, for example, quadrupole mass spectrometers. Here, the mass spectrometers MS1 and MS2 are expected to determine the pressure with an upper limit during use, and are not suitable for measurement and analysis of a large amount of gas. The mass spectrometers MS1 and MS2 may cause malfunctions because a large amount of gas is pressurized in the atmosphere.

並且,在本實施方式中,質量分析計之數量不限於在第一分析室6中有的質量分析計MS1,以及在第二分析室7中有的質量分析計MS2這兩台。亦可藉由一台質量分析計測量、分析被獲取至第一分析室之前述殘留氣體,以及被獲取至第二分析室之殘留氣體。並且,設置質量分析計之位置,只要可測量、分析被獲取至第一分析室之前述殘留氣體及被獲取至第二分析室之殘留氣體即可,無特別限定。 Further, in the present embodiment, the number of the mass spectrometers is not limited to the mass spectrometer MS1 included in the first analysis chamber 6, and the mass spectrometer MS2 included in the second analysis chamber 7. The residual gas obtained to the first analysis chamber and the residual gas obtained to the second analysis chamber may also be measured and analyzed by a mass spectrometer. Further, the position of the mass spectrometer is not particularly limited as long as the residual gas obtained in the first analysis chamber and the residual gas obtained in the second analysis chamber can be measured and analyzed.

第二分析室7係連接有真空計G2、質量分析計MS2與釋氣部8。第二分析室7係藉由孔口板5以能獲 取來自中間室4之殘留氣體的方式與中間室4連接。真空計G2測量第二分析室7內之壓力。可使用B-A真空計或裸規等之電離真空計作為真空計G2。 The second analysis chamber 7 is connected to a vacuum gauge G2, a mass spectrometer MS2, and an outgassing portion 8. The second analysis chamber 7 is obtained by the orifice plate 5 The residual gas from the intermediate chamber 4 is connected to the intermediate chamber 4. The vacuum gauge G2 measures the pressure in the second analysis chamber 7. An ionization vacuum gauge such as a B-A vacuum gauge or a bare gauge can be used as the vacuum gauge G2.

真空計G2只要可測量壓力即可,真空計G0、G1可為同種類或不同種類者,並無限定。本實施方式雖然係測量殘留氣體之壓力,但只要可測量氣體量即可。質量分析計MS2係為了針對從試驗體3內部解放之殘留氣體,測量通過真空閥VV1與中間室4,通過孔口板5導入第二分析室7之殘留氣體而設置。 The vacuum gauge G2 may be any pressure measurement, and the vacuum gauges G0 and G1 may be of the same type or different types, and are not limited. In the present embodiment, the pressure of the residual gas is measured, but the amount of gas can be measured. The mass spectrometer MS2 is provided for measuring the residual gas released from the inside of the test body 3, and measuring the residual gas introduced into the second analysis chamber 7 through the orifice plate 5 through the vacuum valve VV1 and the intermediate chamber 4.

孔口板5可減少從中間室4移動至第二分析室7之殘留氣體之氣體量。孔口板5的傳導性過小時,通過孔口板5移動至第二分析室7之氣體量變少,超過測量下限,故孔口板5的傳導性較佳為不要過小。 The orifice plate 5 can reduce the amount of gas of the residual gas moving from the intermediate chamber 4 to the second analysis chamber 7. When the conductivity of the orifice plate 5 is too small, the amount of gas that moves through the orifice plate 5 to the second analysis chamber 7 decreases, and the measurement limit is exceeded. Therefore, the conductivity of the orifice plate 5 is preferably not too small.

質量分析計MS2與質量分析計MS1相同,例如可使用四極型質量分析計。在此,預想質量分析計MS1與質量分析計MS2係具有同等之性能,但這不表示限定於此,只要是可測量、分析殘留氣體之組成者均可,有性能差異者亦可。 The mass spectrometer MS2 is the same as the mass spectrometer MS1, and for example, a quadrupole mass spectrometer can be used. Here, it is expected that the mass spectrometer MS1 and the mass spectrometer MS2 have the same performance, but this is not limited thereto, and any one may be a component that can measure and analyze the residual gas, and may have a difference in performance.

第二分析室7係連接有釋氣部8。釋氣部8係由主釋氣部與補助泵所構成,例如以使用有迴轉式泵(rotary pump)之渦輪分子泵(turbo-molecular pump)作為補助泵。並且,釋氣部8除了使用渦輪分子泵外,亦有使用有併用NEG(Non Evaporated Getter)泵、離子泵之釋氣部8。 The second analysis chamber 7 is connected to the gas release portion 8. The venting portion 8 is composed of a main venting portion and a sub-pump, and is, for example, a turbo-molecular pump using a rotary pump as a submersible pump. Further, in addition to the turbomolecular pump, the deflation portion 8 also uses an outgassing portion 8 using a NEG (Non Evaporated Getter) pump or an ion pump.

藉由該釋氣部8,從試料室1通過孔口板5流入到第二分析室7之殘留氣體係自第二分析室7釋氣。藉由釋氣部8與孔口板5組合,可控制從試料室1以及中間室4釋氣之殘留氣體的流量。在試驗開始前,藉由將氣體分析裝置100全部的真空閥開啟並釋氣,可使試料室1、中間室4、第一分析室6與第二分析室7為真空。在此所謂的真空係指於JIS定義的真空。 The residual gas system flowing from the sample chamber 1 through the orifice plate 5 to the second analysis chamber 7 by the gas release portion 8 is released from the second analysis chamber 7. By combining the venting portion 8 and the orifice plate 5, the flow rate of the residual gas released from the sample chamber 1 and the intermediate chamber 4 can be controlled. Before the start of the test, the sample chamber 1, the intermediate chamber 4, the first analysis chamber 6, and the second analysis chamber 7 can be evacuated by opening and releasing the entire vacuum valve of the gas analysis device 100. The term "vacuum" as used herein refers to a vacuum defined by JIS.

第一分析室6以及第二分析室7中各別使用之質量分析計MS1、質量分析計MS2係連接有具有控制質量分析計之動作的機能以及處理所得數據之演算機能的控制演算部9。質量分析計MS1、MS2的檢測器係例如使用有法拉第杯(Faraday cup)或2次電子倍增管。另外,以法拉第杯可測量的分析室內壓力上限為0.01Pa至0.001Pa左右。以2次電子倍增管可測量的分析室內壓力的上限為0.001Pa至0.0001Pa左右。 The mass spectrometer MS1 and the mass spectrometer MS2 used in the first analysis chamber 6 and the second analysis chamber 7 are connected to a control calculation unit 9 having a function of controlling the operation of the mass spectrometer and an arithmetic function for processing the obtained data. The detectors of the mass spectrometers MS1, MS2 are, for example, Faraday cups or secondary electron multiplier tubes. In addition, the upper limit of the analytical chamber measurable by the Faraday cup is about 0.01 Pa to 0.001 Pa. The upper limit of the analytical chamber pressure measurable by the secondary electron multiplier tube is about 0.001 Pa to 0.0001 Pa.

作為質量分析計,代表性者有四極質量分析計,但在測量複數之質量電荷比時,因為其測量週期實質上會花上數秒,若殘留氣體從分析室去除的時間比測量的週期短,則質量分析計將無法測量質量電荷比。 As a mass spectrometer, a representative has a quadrupole mass spectrometer, but when measuring a mass-to-charge ratio of a complex number, since the measurement period actually takes a few seconds, if the residual gas is removed from the analysis chamber for a shorter period of time than the measurement period, The mass analyzer will not be able to measure the mass-to-charge ratio.

質量分析計MS1在來自第一分析室6殘留氣體釋氣為止之間,至少須測量一次所著眼之殘留氣體。試驗體3開封之際,在該殘留氣體為微量時,會期望增長第一分析室6內的殘留氣體之停留時間。依據本實施方式1中之構成,第一分析室6可使通過孔口板5從第一分析室 6釋氣之殘留氣體量變小。並且,如先前所述,質量分析計MS1、質量分析計MS2已決定於使用中上限之壓力。 The mass spectrometer MS1 must measure at least one residual gas of the eye between the residual gas from the first analysis chamber 6 when it is released. When the test body 3 is opened, when the residual gas is minute, it is desirable to increase the residence time of the residual gas in the first analysis chamber 6. According to the configuration of the first embodiment, the first analysis chamber 6 can pass through the orifice plate 5 from the first analysis chamber. 6 The amount of residual gas released from the gas becomes small. And, as previously described, the mass spectrometer MS1, the mass spectrometer MS2 have been determined to use the medium upper limit pressure.

並且,氣體分析裝置100之真空計G0、G1、G2,以及,質量分析計MS1、MS2,以及,真空閥VV1、VV2,係各別藉由通信通路10與控制演算部9電性連接。控制演算部9可藉由進行演算由真空計G0、G1、G2,以及,質量分析計MS1、MS2取得之測量數據的記録,並且控制各真空閥VV1、VV2之開閉操作。 Further, the vacuum gauges G0, G1, and G2 of the gas analyzer 100, and the mass spectrometers MS1 and MS2, and the vacuum valves VV1 and VV2 are electrically connected to the control calculation unit 9 via the communication path 10, respectively. The control calculation unit 9 can calculate the measurement data acquired by the vacuum gauges G0, G1, and G2 and the mass spectrometers MS1 and MS2, and control the opening and closing operations of the vacuum valves VV1 and VV2.

第2圖係顯示控制演算部9之構成之概略圖。控制演算部9係具有真空計G0、G1、G2、接收部、記憶部、演算部、判斷部,以及發送部,其中,該接收部係接受來自質量分析計M1,M2之測量數據;該記憶部係記憶所接收之測量數據;該演算部係演算測量數據;該判斷部係判斷真空閥VV1、VV2之開閉;該發送部係將操作真空閥VV1、VV2之開閉的開閉命令發送至真空閥VV1、VV2。 Fig. 2 is a schematic view showing the configuration of the control calculation unit 9. The control calculation unit 9 includes vacuum gauges G0, G1, G2, a receiving unit, a memory unit, a calculation unit, a determination unit, and a transmission unit that receives measurement data from the mass spectrometers M1 and M2; the memory The calculation unit receives the measurement data; the calculation unit calculates the measurement data; the determination unit determines the opening and closing of the vacuum valves VV1 and VV2; and the transmission unit transmits an opening and closing command for opening and closing the operation of the vacuum valves VV1 and VV2 to the vacuum valve. VV1, VV2.

演算部或判斷部之處理係藉由CPU等之演算裝置202來實現,記憶部係藉由記憶體、HDD、SSD等之記憶裝置203來實現。接收部係藉由輸入界面(IF)201來實現,發送部係藉由輸出界面(IF)204來實現。控制演算部9係藉由通信通路10連接至真空計G0、G1、G2、質量分析計MS1、MS2、真空閥VV1、VV2等。 The processing of the calculation unit or the determination unit is realized by the calculation device 202 such as a CPU, and the memory unit is realized by the memory device 203 such as a memory, an HDD or an SSD. The receiving unit is implemented by an input interface (IF) 201, and the transmitting unit is implemented by an output interface (IF) 204. The control calculation unit 9 is connected to the vacuum gauges G0, G1, G2, the mass spectrometers MS1, MS2, the vacuum valves VV1, VV2, and the like via the communication path 10.

第3圖係顯示使用氣體分析裝置100之氣體分析方法之流程圖。沿著第3圖的流程圖說明試驗體3的殘留氣體之分析順序。依據本實施方式1,要由第一分析 室6或第二分析室7之何者測量分壓,係因應試驗體3開封之際試料室1內之壓力值(真空計G0)而選擇。藉此,變得可對應更廣範的壓力範圍來分析氣密密封裝置內部的殘留氣體。 Fig. 3 is a flow chart showing a gas analysis method using the gas analysis device 100. The analysis sequence of the residual gas of the test body 3 will be described along the flowchart of Fig. 3. According to the first embodiment, the first analysis is performed. Which of the chamber 6 or the second analysis chamber 7 measures the partial pressure is selected in accordance with the pressure value (vacuum gauge G0) in the sample chamber 1 when the test body 3 is opened. Thereby, it becomes possible to analyze the residual gas inside the hermetic sealing device in response to a wider range of pressures.

首先,將試料室1大氣開放,於試料室1設置屬於氣密密封裝置之試驗體3(步驟S101)。裝置內的各空間(試料室1、中間室4、第一分析室6、第二分析室7)全部均大氣開放,且停止釋氣部8,並且將真空閥VV1、VV2開啟之狀態設為初始狀態。於初始狀態中,試驗體3設置於試料室1的內部。本實施方式雖然係將全部的空間大氣開放,但這不表示限定於此,設置試驗體3時,只要至少試料室1為大氣開放即可。 First, the sample chamber 1 is opened to the atmosphere, and the test body 3 belonging to the hermetic sealing device is placed in the sample chamber 1 (step S101). Each of the spaces (the sample chamber 1, the intermediate chamber 4, the first analysis chamber 6, and the second analysis chamber 7) in the apparatus are all open to the atmosphere, and the gas release portion 8 is stopped, and the state in which the vacuum valves VV1 and VV2 are opened is set to Initial state. In the initial state, the test body 3 is placed inside the sample chamber 1. In the present embodiment, the entire space atmosphere is opened, but this is not limited thereto. When the test body 3 is provided, at least the sample chamber 1 may be opened to the atmosphere.

設置試驗體3後,以氣體分析裝置100之真空閥VV1、VV2全部開啟的狀態啟動釋氣部8,全部的空間(試料室1、中間室4、第一分析室6、第二分析室7)開始真空釋氣(步驟S102)。使用釋氣部8,將裝置內的全部的空間(試料室1、中間室4、第一分析室6、第二分析室7)釋氣。在此,釋氣係充份地進行至全部的空間(試料室1、中間室4、第一分析室6、第二分析室7)的背景之壓力到安定為止(步驟S103)。 After the test body 3 is installed, the gas release unit 8 is activated in a state where the vacuum valves VV1 and VV2 of the gas analysis device 100 are all turned on, and all the spaces (the sample chamber 1, the intermediate chamber 4, the first analysis chamber 6, and the second analysis chamber 7) The vacuum outgassing is started (step S102). The air release unit 8 is used to degas all the spaces in the apparatus (the sample chamber 1, the intermediate chamber 4, the first analysis chamber 6, and the second analysis chamber 7). Here, the outgassing system is sufficiently performed until the pressure of the background of all the spaces (the sample chamber 1, the intermediate chamber 4, the first analysis chamber 6, and the second analysis chamber 7) is stabilized (step S103).

全部的空間(試料室1、中間室4、第一分析室6、第二分析室7)真空釋氣完成時,關閉真空閥VV1將試料室1與中間室4隔離(步驟S104)。使用開封器2,破壞試驗體3之密封構造並開封(步驟S105)。封入試驗體3 內部的殘留氣體瞬時擴散至試料室1。以真空計G0測量該擴散後的殘留氣體之壓力。 When all of the space (the sample chamber 1, the intermediate chamber 4, the first analysis chamber 6, and the second analysis chamber 7) is completed, the vacuum valve VV1 is closed to isolate the sample chamber 1 from the intermediate chamber 4 (step S104). Using the unsealing device 2, the sealing structure of the test body 3 is broken and unsealed (step S105). Encapsulation test body 3 The internal residual gas instantaneously diffuses to the sample chamber 1. The pressure of the diffused residual gas was measured by a vacuum gauge G0.

在此,設試料室1的內部的容積為V0,設試驗體3開封前之試料室1的內部之壓力為p0,藉由真空計G0測量之緊接著試驗體3開封後之壓力設為P0的話,封入試驗體3的內部之殘留氣體之氣體量Q係以Q=V0×(P0-p0)表示。 Here, the volume inside the sample chamber 1 is V 0 , and the pressure inside the sample chamber 1 before the test body 3 is opened is p 0 , and the pressure after the opening of the test body 3 is measured by the vacuum gauge G0. In the case of P 0 , the gas amount Q of the residual gas enclosed in the test body 3 is represented by Q = V 0 × (P 0 - p 0 ).

p0係可藉由積累(buildup)法大致推定其大小。例如,將在破壞試驗體3之密封構造前,於真空釋氣後之本氣體分析裝置100中,真空閥VV1關閉之時之真空計G0之值,亦即,無殘留氣體之試料室1之壓力為背景之壓力設為p0而得。 The p 0 system can be roughly estimated by the buildup method. For example, before the sealing structure of the test body 3 is destroyed, in the gas analyzer 100 after vacuum gassing, the value of the vacuum gauge G0 when the vacuum valve VV1 is closed, that is, the sample chamber 1 without residual gas The pressure is the background pressure set to p 0 .

而且,在此時,若將試驗體3的容積設為Vs,試驗體3的殘留氣體之壓力設為Ps,試驗體3開封時,由試料室1之壓力P0,試驗體3的殘留氣體之壓力係以Ps=(V0/Vs)×P0表示。亦即,由試料室1之壓力P0可得知殘留氣體之氣體量Q、殘留氣體之壓力PsFurther, at this time, when the volume of the test body 3 is V s , the pressure of the residual gas of the test body 3 is P s , and when the test body 3 is opened, the pressure P 0 of the sample chamber 1 and the test body 3 are The pressure of the residual gas is expressed by P s = (V 0 /V s ) × P 0 . That is, the gas amount Q of the residual gas and the pressure P s of the residual gas can be known from the pressure P 0 of the sample chamber 1.

在第一分析室6或第二分析室7之何者進行殘留氣體測量之選擇,係依據殘留氣體之氣體量Q來決定。在此係由氣體量Q進行,但不表示限定於此,如本實施方式,亦可基於殘留氣體之壓力來進行分析室的選擇而無特別限定。在試料室1之背景之壓力p0與P0相比為非常小(P0>>p0)的時候,試料室1之壓力P0可當作(P0-p0)≒P0,試料室1的容積V0為常數時,殘留氣體之氣體量Q可依 據試料室1之壓力P0唯一地決定,故可依據壓力P0來進行第一分析室6與第二分析室7的選擇。 The selection of the residual gas measurement in the first analysis chamber 6 or the second analysis chamber 7 is determined based on the gas amount Q of the residual gas. Although the amount of gas is Q here, it is not limited thereto. In the present embodiment, the selection of the analysis chamber may be performed based on the pressure of the residual gas, and is not particularly limited. When the pressure p 0 of the background of the sample chamber 1 is very small (P 0 >>p 0 ) compared with P 0 , the pressure P 0 of the sample chamber 1 can be regarded as (P 0 -p 0 )≒P 0 . sample chamber volume V 0 1 is constant, the amount of gas remaining gases Q may be a pressure sample chamber of 1 P 0 is uniquely determined based, it can be a first analysis chamber 6 and a second analysis chamber 7 based on the pressure P 0 of select.

本發明之氣體分析裝置100係基於該試驗體3開封時試料室1之壓力P0之值,進行殘留氣體之分析係使用第一分析室6或使用第二分析室7之判斷(步驟S106)。以下,於分析室之切換判斷中,係不用氣體量Q而是使用以真空計G0之測量值(試料室1之壓力P0)為基礎之判斷方法說明流程。另外,於本發明之裝置中,試料室1之容積V0及其他空間的容積均係常數。 In the gas analyzer 100 of the present invention, based on the value of the pressure P 0 of the sample chamber 1 at the time of opening the test body 3, the analysis of the residual gas is performed by using the first analysis chamber 6 or the second analysis chamber 7 (step S106). . In the following, in the determination of the switching of the analysis chamber, the determination method based on the measurement value of the vacuum gauge G0 (the pressure P 0 of the sample chamber 1) is used instead of the gas amount Q. Further, in the apparatus of the present invention, the volume V 0 of the sample chamber 1 and the volume of other spaces are constant.

將試料室1所測量之真空計G0之值發送至控制演算部9。控制演算部9根據接收到的真空計G0之值,進行真空閥VV2之開閉控制。真空計G0之值,亦即試料室1之壓力P0為閾值P0 *以上時,控制演算部9將位於第一分析室6與中間室4之間的真空閥VV2關閉(步驟S107),將第一分析室6與中間室4隔離。然後,控制演算部9開啟試料室1與中間室4之間的真空閥VV1(步驟S108),第二分析室7之質量分析計MS2測量、分析被密封於試驗體3之殘留氣體(步驟S109)。 The value of the vacuum gauge G0 measured by the sample chamber 1 is sent to the control calculation unit 9. The control calculation unit 9 performs opening and closing control of the vacuum valve VV2 based on the value of the received vacuum gauge G0. When the value of the vacuum gauge G0, that is, the pressure P 0 of the sample chamber 1 is equal to or greater than the threshold value P 0 * , the control calculation unit 9 closes the vacuum valve VV2 located between the first analysis chamber 6 and the intermediate chamber 4 (step S107). The first analysis chamber 6 is isolated from the intermediate chamber 4. Then, the control calculation unit 9 opens the vacuum valve VV1 between the sample chamber 1 and the intermediate chamber 4 (step S108), and the mass analyzer MS2 of the second analysis chamber 7 measures and analyzes the residual gas sealed to the test body 3 (step S109). ).

試驗體3開封之際,壓力P0為閾值P0 *以上,亦即,殘留氣體之氣體量Q(壓力)大時,殘留氣體藉由中間室4通過孔口板5而移動至第二分析室7,使用第二分析室7之質量分析計MS2測量、分析殘留氣體。此時,第二分析室7內之壓力必須不能比質量分析計MS2的使用上限的壓力還高。 When the test body 3 is opened, the pressure P 0 is equal to or greater than the threshold value P 0 * , that is, when the gas amount Q (pressure) of the residual gas is large, the residual gas moves through the orifice plate 5 through the intermediate chamber 4 to the second analysis. The chamber 7 measures and analyzes the residual gas using the mass spectrometer MS2 of the second analysis chamber 7. At this time, the pressure in the second analysis chamber 7 must not be higher than the pressure of the upper limit of the use of the mass spectrometer MS2.

氣體分析裝置100係通過孔口板5使試驗體3的殘留氣體緩緩流入第二分析室7,接續地通過孔口板5而流入的殘留氣體係以釋氣部8釋氣,抑制因第二分析室7內的殘留氣體造成的壓力上昇。藉由此構成機制,可將第二分析室7內的殘留氣體之壓力保持成比質量分析計MS2的使用上限之壓力還小,即便試驗體3中的殘留氣體量多,亦能夠以質量分析計MS2測量。 In the gas analyzer 100, the residual gas of the test body 3 is gradually flowed into the second analysis chamber 7 through the orifice plate 5, and the residual gas system that has flowed through the orifice plate 5 continuously releases the gas to the gas release portion 8 to suppress the gas. The pressure caused by the residual gas in the analysis chamber 7 rises. By this mechanism, the pressure of the residual gas in the second analysis chamber 7 can be kept smaller than the upper limit of the upper limit of the mass spectrometer MS2, and even if the amount of residual gas in the test body 3 is large, mass analysis can be performed. Count MS2 measurement.

真空計G0之值,亦即試料室1之壓力P0未達閾值P0 *時,控制演算部9開啟第一分析室6與中間室4之間之真空閥VV2,或在保持開啟的狀態,開啟隔在試料室1與中間室4之間的真空閥VV1(步驟S110)。藉由開啟真空閥VV1,使殘留氣體從中間室4擴散至第一分析室6。然後,以第一分析室6之質量分析計MS1測量、分析殘留氣體(步驟S111)。 When the value of the vacuum gauge G0, that is, the pressure P 0 of the sample chamber 1 does not reach the threshold value P 0 * , the control calculation unit 9 opens the vacuum valve VV2 between the first analysis chamber 6 and the intermediate chamber 4, or remains open. The vacuum valve VV1 interposed between the sample chamber 1 and the intermediate chamber 4 is opened (step S110). The residual gas is diffused from the intermediate chamber 4 to the first analysis chamber 6 by opening the vacuum valve VV1. Then, the residual gas is measured and analyzed by the mass spectrometer MS1 of the first analysis chamber 6 (step S111).

試驗體3開封之際,壓力P0未達閾值P0 *,亦即,殘留氣體之氣體量Q(壓力)小時,殘留氣體係自中間室4通過真空閥VV2移動至第一分析室6,使用第一分析室6之質量分析計MS1測量、分析殘留氣體。此時,第一分析室6內之壓力亦必須不能比質量分析計MS1之使用上限之壓力還高。然而,所謂閾值未達P0 *係被預想為比質量分析計MS1之使用上限之壓力還小,導入至第一分析室6之殘留氣體不可能超過質量分析計MS1之使用上限之壓力。詳細如後所述。 When the test body 3 is opened, the pressure P 0 does not reach the threshold value P 0 * , that is, the gas amount Q (pressure) of the residual gas is small, and the residual gas system moves from the intermediate chamber 4 to the first analysis chamber 6 through the vacuum valve VV2. The residual gas was measured and analyzed using the mass spectrometer MS1 of the first analysis chamber 6. At this time, the pressure in the first analysis chamber 6 must also be higher than the pressure of the upper limit of the use of the mass spectrometer MS1. However, the threshold value of not reaching P 0 * is expected to be smaller than the upper limit of the use limit of the mass spectrometer MS1, and the residual gas introduced into the first analysis chamber 6 may not exceed the pressure of the upper limit of the use of the mass spectrometer MS1. The details are as described later.

殘留氣體會通過真空閥VV2而流入於第一分 析室6。真空閥VV2的配管內徑與該真空閥的徑係遠大於孔口板5的內徑。因此,比起自中間室4通過通過孔口板5釋氣之氣體分子,向第一分析室6移動的氣體分子較多,故變得能以質量分析計MS1測定。 The residual gas flows into the first point through the vacuum valve VV2 Analysis chamber 6. The inner diameter of the piping of the vacuum valve VV2 and the diameter of the vacuum valve are much larger than the inner diameter of the orifice plate 5. Therefore, the number of gas molecules moving to the first analysis chamber 6 is larger than that of the gas molecules that are released from the intermediate chamber 4 through the orifice plate 5, so that it can be measured by the mass spectrometer MS1.

另一方面,第二分析室7係設置有釋氣部8,故移動至中間室4以及第一分析室6之殘留氣體,係通過中間室4之孔口板5向第二分析室7緩慢移動,進一步藉由釋氣部8釋氣。 On the other hand, the second analysis chamber 7 is provided with the deflation portion 8, so that the residual gas moved to the intermediate chamber 4 and the first analysis chamber 6 is slowly passed to the second analysis chamber 7 through the orifice plate 5 of the intermediate chamber 4. Moving, further outgassing by the venting section 8.

在本實施方式,係預想在壓力P0未達閾值P0 *時釋氣部8亦連續地動作,但不表示限定於此,控制演算部9在判斷壓力P0未達閾值P0 *時亦能夠以停止釋氣部8動作的方式進行控制。 In the present embodiment, it is assumed that the deflux portion 8 also continuously operates when the pressure P 0 does not reach the threshold value P 0 *. However, the present invention is not limited thereto, and the control calculation unit 9 determines that the pressure P 0 does not reach the threshold value P 0 * . It is also possible to control so as to stop the operation of the air release unit 8.

以質量分析計MS1或是質量分析計MS2的任一者進行的測量、分析完畢後就結束測量(步驟S112)。當測量結束時,控制演算裝置9關閉真空閥VV1(步驟S113),將試料室1大氣開放,使得試驗體3能夠被取出(步驟S114)。接著針對閾值P0 *進行說明。閾值P0 *係基於試料室1之壓力與第一分析室6之壓力的關係而決定。 The measurement is performed after the measurement or analysis by any of the mass spectrometer MS1 or the mass spectrometer MS2 is completed (step S112). When the measurement is completed, the control calculation device 9 closes the vacuum valve VV1 (step S113), and opens the atmosphere of the sample chamber 1 so that the test body 3 can be taken out (step S114). Next, the threshold P 0 * will be described. The threshold value P 0 * is determined based on the relationship between the pressure of the sample chamber 1 and the pressure of the first analysis chamber 6.

在此,設第一分析室6之容積為V1,中間室4之容積為Vc,將試料室1與真空閥VV1、VV2開啟時的第一分析室之壓力為P1時,P1係表示為P1=(V0/(V0+Vc+V1))×P0Here, the volume of the first analysis chamber 6 is V 1 , the volume of the intermediate chamber 4 is V c , and the pressure of the first analysis chamber when the sample chamber 1 and the vacuum valves VV1 and VV2 are opened is P 1 , P 1 It is expressed as P 1 =(V 0 /(V 0 +V c +V 1 ))×P 0 .

亦即,在質量分析計MS1可動作的上限之壓力為Pqms時,真空閥VV1、VV2開啟之際,第一分析室6 之壓力P1成為質量分析計MS1之動作壓力的上限Pqms之試料室1之壓力P0設為P0 *時,P0 *係表示為P0 *=((V0+Vc+V1)/V0)×PqmsThat is, a pressure gauge in the mass spectrometer MS1 is operable upper limit of P qms, the vacuum valve VV1, VV2 open occasion, a first analysis chamber 6 of the pressure P 1 becomes the upper limit of operation pressure gauge MS1 mass spectrometry of P qms When the pressure P 0 of the sample chamber 1 is P 0 * , P 0 * is expressed as P 0 * = ((V 0 + V c + V 1 ) / V 0 ) × P qms .

因此,藉由將閾值設為P0 *,於殘留氣體之壓力未超過質量分析計MS1的動作壓力之上限時,氣體分析裝置100係能以第一分析室6之質量分析計MS1來測量、分析,而在超過動作壓力的上限時,氣體分析裝置100係能減少殘留氣體之氣體量(壓力)並以第二分析室7之質量分析計MS2,來測量、分析。 Therefore, by setting the threshold value to P 0 * , when the pressure of the residual gas does not exceed the upper limit of the operating pressure of the mass spectrometer MS1, the gas analyzer 100 can be measured by the mass spectrometer MS1 of the first analysis chamber 6, In the analysis, when the upper limit of the operating pressure is exceeded, the gas analyzer 100 can reduce the amount of gas (pressure) of the residual gas and measure and analyze it by the mass spectrometer MS2 of the second analysis chamber 7.

在此,作為一個例子,係把基於質量分析計之動作壓力之上限Pqms所計算出的P0 *設為閾值,但不表示僅限於此。閾值可為依照使用本氣體分析裝置100之使用者適時設定之值,例如,可設為在Pqms以下之壓力所得之P0 *Here, as an example, P 0 * calculated based on the upper limit P qms of the operating pressure of the mass spectrometer is set as a threshold value, but is not limited thereto. The threshold value may be a value set in time according to a user who uses the gas analysis device 100, and may be, for example, P 0 * obtained by a pressure of Pqms or less.

第4圖顯示氣體分析裝置100之試料室1之壓力與緊接著開啟真空閥VV1之後之第一分析室6之壓力之關係之一例之圖表。第4圖的橫軸係表示於試驗體3開封後之試料室1之壓力P0,縱軸係表示開啟試驗體3之真空閥VV1之際的第一分析室6之壓力P1。圖中的作圖係表示P1相對於將試驗體3開封之際的各P0之關係之一例。 Fig. 4 is a graph showing an example of the relationship between the pressure of the sample chamber 1 of the gas analysis device 100 and the pressure of the first analysis chamber 6 immediately after the vacuum valve VV1 is opened. The horizontal axis of Fig. 4 shows the pressure P 0 of the sample chamber 1 after the test body 3 is opened, and the vertical axis indicates the pressure P 1 of the first analysis chamber 6 when the vacuum valve VV1 of the test body 3 is opened. Plotted lines in FIG. 3 shows an example of relations between each of P 0 P 1 on the occasion of the opening with respect to the test sample.

在本發明之氣體分析裝置100中,P0與P1之關係在使用試料室1之容積V0以及中間室4之容積Vc,第一分析室6之容積V1以及試驗體3之中空構造內部的容積Vs時,係以P1=(V0/(V0+Vc+V1))×P0表示。於第4圖 中的P0與P1之關係中,若已決定質量分析計MS1之動作上限壓力Pqms,則可唯一地決定判斷氣體分析所要使用之分析室的試料室1之壓力P0的閾值P0 *In the gas analyzer 100 of the present invention, the relationship between P 0 and P 1 is the volume V 0 of the sample chamber 1 and the volume V c of the intermediate chamber 4, the volume V 1 of the first analysis chamber 6, and the hollow of the test body 3. When the internal volume V s is constructed, it is represented by P 1 = (V 0 / (V 0 + V c + V 1 )) × P 0 . In the relationship between P 0 and P 1 in Fig. 4, if the upper limit pressure P qms of the mass spectrometer MS1 is determined, the pressure P 0 of the sample chamber 1 of the analysis chamber to be used for determining the gas analysis can be uniquely determined. The threshold P 0 * .

第5圖係顯示於氣體分析裝置100中,在第一分析室6進行氣體分析之際,真空閥VV1之於開閉前後中之第一分析室6內之壓力的時間變化之一例之圖表。若開啟真空閥VV1,則擴散在試驗體3內的殘留氣體會瞬間向中間室4擴散,進一步擴散至第一分析室6(在真空閥VV2為開啟之狀態)。 Fig. 5 is a graph showing an example of a temporal change in pressure of the vacuum valve VV1 in the first analysis chamber 6 before and after opening and closing in the gas analysis device 100, when the gas analysis is performed in the first analysis chamber 6. When the vacuum valve VV1 is opened, the residual gas diffused in the test body 3 is instantaneously diffused into the intermediate chamber 4, and further diffused to the first analysis chamber 6 (in a state where the vacuum valve VV2 is opened).

由於擴散至該第一分析室6之試驗體3的殘留氣體,第一分析室6內之壓力增加。由真空計G1測量其壓力,將所測量的壓力與質量分析計MS1所測量的各質量電荷比的離子強度輸入至控制演算部9並演算,控制演算部9則得到試驗體3的殘留氣體的分壓以及組成。 Due to the residual gas diffused to the test body 3 of the first analysis chamber 6, the pressure in the first analysis chamber 6 increases. The pressure is measured by the vacuum gauge G1, and the measured pressure and the ion intensity of each mass-to-charge ratio measured by the mass spectrometer MS1 are input to the control calculation unit 9 and calculated, and the control calculation unit 9 obtains the residual gas of the test body 3. Partial pressure and composition.

例如在第一分析室6,求取作為殘留氣體之氮的分壓時,第一分析室6僅充滿氮氣,依據第一分析室6之壓力變化,得到與質量分析計MS1之檢測強度之關係。然後,在第一分析室6分析混合有複數種類之氣體的殘留氣體時,可按質量分析計MS1的測量數據之內之每一時間的氮氣檢測強度,得到殘留氣體之氮之分壓的時間變化。 For example, in the first analysis chamber 6, when the partial pressure of nitrogen as the residual gas is obtained, the first analysis chamber 6 is only filled with nitrogen gas, and the relationship with the detection intensity of the mass spectrometer MS1 is obtained according to the pressure change of the first analysis chamber 6. . Then, when the residual gas in which a plurality of types of gases are mixed is analyzed in the first analysis chamber 6, the nitrogen gas detection intensity at each time within the measurement data of the mass spectrometer MS1 can be obtained to obtain the partial pressure of the residual gas nitrogen. Variety.

使第一分析室6僅充滿氮氣的方法並無限定,亦可利用已知氮分壓之複數種類之氣體混合而成的混合氣體,得到氮氣的分壓與質量分析計MS1的檢測強度之關係,按質量分析計MS1的測量數據內之每一時間從氮氣的檢 測強度得到殘留氣體之氮之分壓的時間變化。 The method of filling the first analysis chamber 6 with only nitrogen gas is not limited, and a mixed gas obtained by mixing a plurality of types of gases having a known partial pressure of nitrogen may be used to obtain a relationship between the partial pressure of nitrogen and the detection intensity of the mass spectrometer MS1. According to the mass analysis, the measurement data of MS1 is checked from nitrogen every time. The measured intensity gives a time change of the partial pressure of nitrogen of the residual gas.

第6圖係顯示於依據本發明之實施方式1之氣體分析裝置100中,在第二分析室7進行氣體分析之際,在真空閥VV1之開閉前後之第二分析室7內之壓力的時間變化之一例之圖表。若開啟真空閥VV1,則擴散在試料室1內之試驗體3內的殘留氣體會瞬間向中間室4內擴散。移動至該中間室4之殘留氣體,通過中間室4的孔口板5向第二分析室7移動。 Fig. 6 is a view showing the time of the pressure in the second analysis chamber 7 before and after opening and closing of the vacuum valve VV1 in the gas analysis apparatus 100 according to the first embodiment of the present invention, when the gas analysis is performed in the second analysis chamber 7. A chart of one of the changes. When the vacuum valve VV1 is opened, the residual gas diffused in the test body 3 in the sample chamber 1 is instantaneously diffused into the intermediate chamber 4. The residual gas moved to the intermediate chamber 4 is moved to the second analysis chamber 7 through the orifice plate 5 of the intermediate chamber 4.

由於移動至該第二分析室7之試驗體3的內部氣體,第二分析室7內之壓力增加。該壓力藉由真空計G2測量,將經測量之壓力與質量分析計MS2所測量之各質量電荷比之離子強度,輸入控制演算部9並演算,控制演算部9則得到試驗體3的內部的殘留氣體之分壓以及組成。 Due to the internal gas moving to the test body 3 of the second analysis chamber 7, the pressure in the second analysis chamber 7 is increased. The pressure is measured by the vacuum gauge G2, and the measured pressure and the mass-to-charge ratio measured by the mass spectrometer MS2 are input to the control calculation unit 9 and calculated, and the control calculation unit 9 obtains the inside of the test body 3. The partial pressure and composition of the residual gas.

於第二分析室7中,分壓係與第一分析室6之情況相同,例如得到氮氣之分壓與質量分析計MS2之檢測強度之關係的話,藉由與測量數據組合,可得到氮氣之分壓之時間變化。例如可藉由對試料室1內導入氮分壓為已知之混合氣體,藉由得到以真空計G2所測量到的第二分析室7內之氮分壓之測量值與以質量分析計MS2所獲得的氮氣的檢測強度之值來求得氮氣與質量分析計MS2之檢測強度之關係。 In the second analysis chamber 7, the partial pressure system is the same as in the case of the first analysis chamber 6. For example, if the partial pressure of nitrogen is obtained in relation to the detection intensity of the mass spectrometer MS2, by combining with the measurement data, nitrogen gas can be obtained. The time of partial pressure changes. For example, by introducing a nitrogen partial pressure into the sample chamber 1 into a known mixed gas, the measured value of the partial pressure of nitrogen in the second analysis chamber 7 measured by the vacuum gauge G2 can be obtained by using the mass spectrometer MS2. The value of the detected intensity of the obtained nitrogen gas was used to determine the relationship between the nitrogen gas and the detection intensity of the mass spectrometer MS2.

依據本發明,可進行以下兩者的分析,亦即從如非冷卻紅外線感應器或真空密封MEMS裝置般未達 1mm3之小模穴、以及於真空氣密之密封試驗體3中之微量的殘留氣體,因試料之密封構造中之洩漏的分析,或從密封構造的內部的部材因某些原因所產生之脫氣體所導致內部的殘留氣體之壓力變高的分析。依據本實施方式,可對以往未有過的廣大壓力範圍分析氣密密封裝置的殘留氣體。 According to the present invention, analysis of the following two can be performed, that is, a small mold hole of less than 1 mm 3 as in a non-cooled infrared sensor or a vacuum sealed MEMS device, and a trace amount in the vacuum sealed test body 3 The analysis of the residual gas, the leakage in the sealed structure of the sample, or the pressure of the internal residual gas caused by the degassing of the internal material of the sealed structure for some reason. According to the present embodiment, the residual gas of the hermetic sealing device can be analyzed for a wide range of pressures that have not been conventionally used.

實施方式2. Embodiment 2.

本實施方式在,第二分析室7與第一分析室6以真空閥VV3連接,第二分析室7中不具有質量分析計MS2之點與實施方式1相異。 In the present embodiment, the second analysis chamber 7 is connected to the first analysis chamber 6 by the vacuum valve VV3, and the second analysis chamber 7 does not have the mass spectrometer MS2, which is different from the first embodiment.

第7圖係顯示依據實施方式2之氣體分析裝置200之構成之概略圖。如第7圖所例示,與實施方式1之氣體分析裝置100比較,本實施方式之氣體分析裝置200於第二分析室7設有真空閥VV3,第二分析室7與第一分析室6係透過真空閥VV3連接。並且,真空閥VV3係與控制演算裝置9連接。 Fig. 7 is a schematic view showing the configuration of a gas analysis device 200 according to the second embodiment. As illustrated in Fig. 7, the gas analysis device 200 of the present embodiment is provided with a vacuum valve VV3 in the second analysis chamber 7, and the second analysis chamber 7 and the first analysis chamber 6 are compared with the gas analysis device 100 of the first embodiment. Connected through vacuum valve VV3. Further, the vacuum valve VV3 is connected to the control calculation device 9.

進一步,在省略了於實施方式1中第二分析室7所備有之真空計G2以及質量分析計MS2之點與實施方式1的構成相異。真空閥VV3係使用閘閥。真空閥VV3係藉著該閥的開閉來進行第一分析室6與第二分析室7之空間的阻斷以及開放。 Further, the point in which the vacuum gauge G2 and the mass spectrometer MS2 provided in the second analysis chamber 7 in the first embodiment are omitted is different from the configuration of the first embodiment. The vacuum valve VV3 uses a gate valve. The vacuum valve VV3 blocks and opens the space of the first analysis chamber 6 and the second analysis chamber 7 by opening and closing the valve.

並且,在本實施方式2,於實施方式1在第二分析室7進行之分壓測量,係可藉由真空閥開閉操作而 能在第一分析室6進行可能。因此,於分析順序中之閥的開閉方法與實施方式1相異。 Further, in the second embodiment, the partial pressure measurement performed in the second analysis chamber 7 in the first embodiment can be performed by the vacuum valve opening and closing operation. It is possible to perform in the first analysis room 6. Therefore, the opening and closing method of the valve in the analysis sequence is different from that of the first embodiment.

本實施方式2僅有上述的點與實施方式1相異,本實施方式大致原則上係與實施方式1相同。因此對於同一要素係附以同一符號並省略其說明。接著,沿著第8圖的流程圖來說明於實施方式2中使用氣體分析裝置200之試驗體3的殘留氣體的分析順序。 In the second embodiment, only the above points are different from the first embodiment, and the present embodiment is basically the same as the first embodiment. Therefore, the same elements are denoted by the same reference numerals and their description will be omitted. Next, the analysis procedure of the residual gas of the test body 3 using the gas analysis device 200 in the second embodiment will be described along the flowchart of FIG.

第8圖係顯示依據實施方式2之使用氣體分析裝置200之氣體分析方法之流程圖。在此,僅就與實施方式1相異之流程進行說明。除此之外的說明因係與實施方式1為相同流程,故予以省略。具體而言,係在第二分析室7沒有質量分析計與真空計,故透過真空閥VV3以第一分析室6分析的方式與實施方式1相異。 Fig. 8 is a flow chart showing a gas analysis method using the gas analysis device 200 according to Embodiment 2. Here, only the flow different from the first embodiment will be described. Since the other descriptions are the same as those in the first embodiment, they are omitted. Specifically, since the second analysis chamber 7 does not have a mass spectrometer and a vacuum gauge, it is different from the first embodiment in that it is analyzed by the first analysis chamber 6 through the vacuum valve VV3.

雖然在分析室之選擇上,在基於試料室1之壓力與第一分析室6之壓力之關係做決定之點與實施方式1相同,但於本實施方式中,係就真空閥的操作方法與實施方式1相異,故進行說明。 Although the determination of the relationship between the pressure of the sample chamber 1 and the pressure of the first analysis chamber 6 is the same as that of the first embodiment in the selection of the analysis chamber, in the present embodiment, the operation method of the vacuum valve is Since the first embodiment differs, the description will be made.

對於真空計G0之測量值在閾值P0 *以上時進行說明。真空計G0之值,亦即試料室1之壓力P0為閾值P0 *以上時,控制演算部9關閉在第一分析室6與中間室4之間之真空閥VV2,開啟在第一分析室6與中間室4之間之真空閥VV3(步驟S201)。 The case where the measured value of the vacuum gauge G0 is equal to or greater than the threshold value P 0 * will be described. When the value of the vacuum gauge G0, that is, the pressure P 0 of the sample chamber 1 is equal to or greater than the threshold value P 0 * , the control calculation unit 9 closes the vacuum valve VV2 between the first analysis chamber 6 and the intermediate chamber 4, and opens in the first analysis. The vacuum valve VV3 between the chamber 6 and the intermediate chamber 4 (step S201).

在此步驟S201,控制演算裝置9係以開啟真空閥VV3的方式進行控制,但不表示限定於此,在已經開 啟真空閥VV3時,亦可不進行開啟的控制。若開啟真空閥VV1(步驟S110),則擴散在試料室1內的試驗體3內的殘留氣體會瞬間向中間室4內擴散。 In this step S201, the control calculation device 9 performs control so as to open the vacuum valve VV3, but is not limited thereto, and has been opened. When the vacuum valve VV3 is activated, the opening control may not be performed. When the vacuum valve VV1 is opened (step S110), the residual gas diffused in the test body 3 in the sample chamber 1 is instantaneously diffused into the intermediate chamber 4.

移動至中間室4之殘留氣體,通過中間室4之孔口板5向第二分析室7移動。然後,移動至第二分析室7之試驗體3內的殘留氣體透過真空閥VV3擴散至第一分析室6,增加第一分析室6內之壓力。該壓力係藉由真空計G1測量。並且,試驗體3的殘留氣體之分壓,係可將藉由質量分析計MS1與真空計G1所得之測量值,以控制演算部9演算來獲得。 The residual gas moved to the intermediate chamber 4 is moved to the second analysis chamber 7 through the orifice plate 5 of the intermediate chamber 4. Then, the residual gas in the test body 3 moved to the second analysis chamber 7 is diffused to the first analysis chamber 6 through the vacuum valve VV3, and the pressure in the first analysis chamber 6 is increased. This pressure is measured by a vacuum gauge G1. Further, the partial pressure of the residual gas of the test body 3 can be obtained by calculating the measured value obtained by the mass spectrometer MS1 and the vacuum gauge G1 by the control calculation unit 9.

就真空計G0之測量值比閾值P0 *小之情況進行說明。未達閾值P0 *時,於步驟S106判斷為否(No),則控制演算裝置9關閉真空閥VV3(步驟S202)。藉由關閉真空閥VV3,阻斷第一分析室6與第二分析室7之間的空間。 The case where the measured value of the vacuum gauge G0 is smaller than the threshold P 0 * will be described. When the threshold value P 0 * is not reached, if the determination in step S106 is NO (No), the control calculation device 9 closes the vacuum valve VV3 (step S202). The space between the first analysis chamber 6 and the second analysis chamber 7 is blocked by closing the vacuum valve VV3.

接著,控制演算裝置9開啟真空閥VV1(步驟S110)。若真空閥VV1開啟,則擴散在試料室1內之試驗體3內的殘留氣體會通過中間室4,瞬間擴散至第一分析室6(在真空閥VV2開啟的狀態)。之後之移送質量分析計MS1之測量、分析的處理係與實施方式1相同,故省略其說明。 Next, the control calculation device 9 turns on the vacuum valve VV1 (step S110). When the vacuum valve VV1 is opened, the residual gas diffused in the test body 3 in the sample chamber 1 passes through the intermediate chamber 4 and instantaneously diffuses to the first analysis chamber 6 (in a state where the vacuum valve VV2 is opened). The subsequent measurement and analysis processing of the transfer quality analyzer MS1 is the same as that of the first embodiment, and thus the description thereof will be omitted.

以下說明依據本實施方式之作用效果。本實施方式2之質量分析計與真空計和實施方式1相比係各少一個。由於儀器較少,故可進行裝置的省空間化以及減少維修的頻率。 The effects of the present embodiment will be described below. The mass spectrometer of the second embodiment is one less than the vacuum gauge and the first embodiment. Since there are fewer instruments, it is possible to save space and reduce the frequency of maintenance.

並且,於本實施方式2中,真空閥VV3係發揮作為向中間室4以及試料室1之旁路(bypass)之配管的機能,故於裝設試驗體3後之真空釋氣中,藉由開啟真空閥VV3與真空閥VV2,可讓第一分析室6、中間室4以及試料室1更迅速地釋氣。另外,在本實施方式係說明與實施方式1相異之部分。除此以外之部分係與實施方式1相同。 Further, in the second embodiment, the vacuum valve VV3 functions as a bypass for the intermediate chamber 4 and the sample chamber 1, so that the vacuum is released from the vacuum after the test body 3 is installed. Opening the vacuum valve VV3 and the vacuum valve VV2 allows the first analysis chamber 6, the intermediate chamber 4, and the sample chamber 1 to be released more quickly. Further, in the present embodiment, a portion different from the first embodiment will be described. The other parts are the same as those in the first embodiment.

實施方式3. Embodiment 3.

本實施方式係在孔口板5為可改變傳導性之可變孔口板12之點與實施方式1相異。並且,藉由將孔口板5設為可變孔口板12,在分析上會產生與實施方式1相異之處理,故就相異之部分進行說明。 This embodiment differs from the first embodiment in that the orifice plate 5 is a variable orifice plate 12 capable of changing conductivity. Further, by forming the orifice plate 5 as the variable orifice plate 12, a process different from that of the first embodiment is generated in the analysis, and therefore, the differences will be described.

第9圖係顯示依據實施方式3之氣體分析裝置300之構成之概略圖。與實施方式1之氣體分析裝置100相比較,第9圖所示之本實施方式之氣體分析裝置300不具備孔口板5,而具備可變孔口板12。並且,在分析順序中增加可變孔口板12的傳導性調整之處理之點與實施方式1相異。 Fig. 9 is a schematic view showing the configuration of a gas analysis device 300 according to the third embodiment. Compared with the gas analysis device 100 of the first embodiment, the gas analysis device 300 of the present embodiment shown in FIG. 9 does not include the orifice plate 5, and includes the variable orifice plate 12. Further, the point of increasing the process of adjusting the conductivity of the variable orifice plate 12 in the analysis sequence is different from that of the first embodiment.

本實施方式3僅有在上述之點與實施方式1相異,本實施方式大致原則上係與實施方式1相同。因此對於同一要素係附以同一符號,並省略其說明。 The third embodiment differs from the first embodiment only in the above points, and the present embodiment is basically the same as the first embodiment in principle. Therefore, the same elements are denoted by the same reference numerals, and the description thereof will be omitted.

第10圖係顯示依據實施方式3之氣體分析裝置300所使用之可變孔口板12之構成之概略圖。可變孔口 板12係例如將金屬圓盤中做有小洞的孔口13以金屬圓盤的中心軸14作為中心,於圓周方向排列有複數個的方式設置。另外,孔口13的孔徑可完全相同,亦可各別相異。 Fig. 10 is a schematic view showing the configuration of a variable orifice plate 12 used in the gas analysis device 300 according to the third embodiment. Variable orifice The plate 12 is provided, for example, such that the orifices 13 having small holes in the metal disk are arranged in a plurality of ways in the circumferential direction centering on the central axis 14 of the metal disk. In addition, the apertures of the apertures 13 may be identical or different.

可變孔口板12係具備有半圓狀或扇形狀的蓋15。蓋15係以中心軸14為軸而旋轉,成為阻擋孔口13之機構。控制演算部9係可藉由控制蓋15之旋轉角,改變孔口13之阻擋個數,藉此改變可變孔口板12之傳導性。 The variable orifice plate 12 is provided with a cover 15 having a semicircular shape or a fan shape. The cover 15 is rotated about the central axis 14 and serves as a mechanism for blocking the opening 13. The control calculation unit 9 can change the number of blocks of the orifice 13 by controlling the rotation angle of the cover 15, thereby changing the conductivity of the variable orifice plate 12.

來自複數個之孔口13之可變孔口板12的合成傳導性CTP,係以孔口13之各傳導性Cn之和,例如在具備有10個孔口13時係以CTP=C1+C2+...+C10的方式,以各別的傳導性之和表示。 The synthetic conductivity C TP of the variable orifice plate 12 from the plurality of orifices 13 is the sum of the conductivity C n of the orifices 13 , for example, when there are 10 orifices 13 , C TP = The manner of C 1 + C 2 + ... + C 10 is expressed by the sum of the respective conductivities.

第11圖係顯示使用依據實施方式3之氣體分析裝置300之氣體分析方法之流程圖。沿著第11圖的流程圖,說明依照本實施方式之氣體的分析方法。與實施方式1相同之部分係省略其說明。 Fig. 11 is a flow chart showing a gas analysis method using the gas analysis device 300 according to Embodiment 3. The analysis method of the gas according to the present embodiment will be described along the flowchart of Fig. 11. The same portions as those of the first embodiment are omitted.

於本實施方式中亦與實施方式1相同,依照真空計G0所測量之試驗體3的殘留氣體之氣體量進行用以做測量、分析之分析室之選擇。雖然在分析室之選擇係與殘留氣體之氣體量呈正比之源自試料室1之壓力之所決定之點與實施方式1相同,但於本實施方式中,在之後加有可變孔口板12之傳導性調整的操作之點與實施方式1相異,故進行說明。 Also in the present embodiment, as in the first embodiment, the analysis chamber for measurement and analysis is selected in accordance with the gas amount of the residual gas of the test body 3 measured by the vacuum gauge G0. Although the selection in the analysis chamber is the same as that of the first embodiment in determining the pressure derived from the sample chamber 1 in proportion to the amount of gas of the residual gas, in the present embodiment, a variable orifice plate is added afterwards. The point of operation of the conductivity adjustment of 12 is different from that of the first embodiment, and therefore, the description will be made.

首先,真空計G0之測量值未達P0 *時,氣體分析裝置300係如第11圖之流程圖所示,與實施方式1 相同地,在第一分析室6測量、分析殘留氣體。之後,在本實施方式3之控制演算裝置9調整可變孔口板12的傳導性(步驟S301)。調整方法之例係使用第12圖說明。 First, when the measured value of the vacuum gauge G0 is less than P 0 * , the gas analyzer 300 is as shown in the flowchart of FIG. 11, and the residual gas is measured and analyzed in the first analysis chamber 6 in the same manner as in the first embodiment. Thereafter, the control calculation device 9 of the third embodiment adjusts the conductivity of the variable orifice plate 12 (step S301). An example of the adjustment method is illustrated using Figure 12.

第12圖係顯示於基於試料室1之壓力P1而以控制演算部9所計算之真空閥VV1之開閉前後之第一分析室6之壓力的時間變化之一例。第12圖中係顯示以可變孔口板12之孔口13之開口數各別改變為1個、3個、10個之際得到之在各傳導性之第一分析室6之壓力P1Fig. 12 is a view showing an example of temporal changes in the pressure of the first analysis chamber 6 before and after opening and closing of the vacuum valve VV1 calculated by the control calculation unit 9 based on the pressure P 1 of the sample chamber 1. Fig. 12 shows the pressure P 1 of the first analysis chamber 6 obtained in each conductivity when the number of openings of the orifice 13 of the variable orifice plate 12 is changed to 1, 3, or 10, respectively. .

於第12圖中開口數為10個之作圖,於開啟真空閥VV1後,殘留氣體以數秒時間釋氣,壓力P1到達第一分析室6之背景壓力p1。亦即得知到開口數為10個時,無法得到足以由質量分析計MS1解析分壓之測量點。相對於此,於可變孔口板12中之孔口13之開口數以蓋15阻擋,傳導性變小時,如圖中之開口數3、開口數1之作圖般,可讓測量點增加。 In Figure 12 the opening 10 of the number of plotted, after opening the vacuum valve VV1, several seconds of residual gas outgassing, pressure P 1 is a first analysis chamber 6 reaches the background pressure p1. That is, when the number of openings is 10, it is impossible to obtain a measurement point sufficient for the mass spectrometer MS1 to resolve the partial pressure. On the other hand, the number of openings of the orifices 13 in the variable orifice plate 12 is blocked by the lid 15, and the conductivity becomes small. As shown in the figure, the number of openings 3 and the number of openings 1 can increase the measurement points. .

但是,傳導性過小時,圖表的傾斜度變得更小,而變得無法忽略從空間(試料室1、中間室4、第一分析室6、第二分析室7)的內壁面釋放出之氣體所致壓力上昇之影響。此時於分壓測量中之解析的準確度亦減低,故控制演算裝置9係進行使傳導性變大,讓自第一分析室6釋氣之氣體流量變大的調整。 However, when the conductivity is too small, the inclination of the graph becomes smaller, and it becomes impossible to ignore the release from the inner wall surface of the space (the sample chamber 1, the intermediate chamber 4, the first analysis chamber 6, and the second analysis chamber 7). The effect of pressure rise caused by gas. At this time, the accuracy of the analysis in the partial pressure measurement is also reduced. Therefore, the control calculation device 9 adjusts the flow rate of the gas which is released from the first analysis chamber 6 by increasing the conductivity.

如此般在第一分析室6測量、分析殘留氣體時,對應第一分析室6之壓力,控制演算裝置9係以使來自第一分析室6之釋氣不會變得過大或過小之方式,調整 可變孔口板12之傳導性。在此係對應第一分析室6之壓力調整傳導性,但不表示限定於此,只要可對應殘留氣體之氣體量調整傳導性即可,亦可對應試料室1之壓力調整傳導性,調整的方式並無限定。 When the residual gas is measured and analyzed in the first analysis chamber 6 as described above, the calculation device 9 is controlled so that the outgas from the first analysis chamber 6 does not become too large or too small, corresponding to the pressure of the first analysis chamber 6. Adjustment The conductivity of the variable orifice plate 12. Here, the pressure is adjusted in accordance with the pressure of the first analysis chamber 6, but it is not limited thereto, and the conductivity may be adjusted in accordance with the amount of gas of the residual gas, and the conductivity may be adjusted in accordance with the pressure of the sample chamber 1 and adjusted. There is no limit to the method.

接續著,真空計G0之測量值在閾值P0 *以上時,係如第11圖的流程圖所示,與實施方式1相同,氣體分析裝置300實行在第二分析室7之殘留氣體的測量、分析。之後,控制演算裝置9調整可變孔口板12之傳導性(步驟S302)。調整方法之例係使用第13圖說明。 Next, when the measured value of the vacuum gauge G0 is equal to or greater than the threshold value P 0 * , as shown in the flowchart of FIG. 11, the gas analyzing device 300 performs the measurement of the residual gas in the second analysis chamber 7 as in the first embodiment. ,analysis. Thereafter, the control calculation device 9 adjusts the conductivity of the variable orifice plate 12 (step S302). An example of the adjustment method is illustrated using Figure 13.

第13圖係顯示於基於試料室1之壓力P1以控制演算部9計算之真空閥VV1之開閉前後之第二分析室7之壓力的時間變化之一例。在第13圖中係顯示以可變孔口板12之孔口13之開口數各別改變為1個、3個、10個之際得到之在各傳導性之第二分析室7之壓力P2Fig. 13 is a view showing an example of temporal changes in the pressure of the second analysis chamber 7 before and after opening and closing of the vacuum valve VV1 calculated by the control unit 9 based on the pressure P 1 of the sample chamber 1. In Fig. 13, the pressure P in the second analysis chamber 7 of each conductivity obtained when the number of openings of the orifice 13 of the variable orifice plate 12 is changed to 1, 3, and 10, respectively. 2 .

於第13圖中顯示開口數為10個時,緊接著開啟真空閥VV1後之第二分析室7之壓力超過Pqms(=1.0×10-3Pa),且無法立即將殘留氣體釋氣,無法得到足夠的測量點。 When the number of openings is 10 in Fig. 13, the pressure of the second analysis chamber 7 immediately after the vacuum valve VV1 is opened exceeds P qms (= 1.0 × 10 -3 Pa), and the residual gas cannot be immediately released. Unable to get enough measurement points.

此時,控制演算裝置9係藉由蓋15阻擋可變孔口板12之開口,以開口數3、開口數1之方式使傳導性變小。藉此,氣體分析裝置300係可抑制第二分析室7之壓力未達Pqms,同時確保測量點。 At this time, the control calculation device 9 blocks the opening of the variable orifice plate 12 by the lid 15, and the conductivity is made small by the number of openings 3 and the number of openings 1. Thereby, the gas analyzing device 300 can suppress the pressure of the second analysis chamber 7 from reaching P qms while securing the measurement point.

但是,傳導性過小時,每單位時間導入第二分析室7之殘留氣體之氣體量係小,在真空閥VV1之開 閉前後的第二分析室7之壓力變化變得過小。此時於分壓測量中之解析的準確度亦減低,故控制演算裝置9係進行使傳導性變大,讓到第二分析室7的殘留氣體之氣體流量變大的調整。 However, when the conductivity is too small, the amount of gas introduced into the second analysis chamber 7 per unit time is small, and the vacuum valve VV1 is opened. The pressure change of the second analysis chamber 7 before and after closing becomes too small. At this time, the accuracy of the analysis in the partial pressure measurement is also reduced. Therefore, the control calculation device 9 performs adjustment for increasing the conductivity and increasing the gas flow rate of the residual gas in the second analysis chamber 7.

如此般在第二分析室7測量殘留氣體、分析時,對應第二分析室7之壓力,控制演算裝置9係以使來自中間室4之釋氣不會變得過大或過小之方式,調整可變孔口板12之傳導性。在此,係對應第二分析室7之壓力調整傳導性,但不表示限定於此,只要可對應殘留氣體之氣體量調整傳導性即可,亦可對應試料室1之壓力調整傳導性,調整的方式並無限定。 When the residual gas is measured in the second analysis chamber 7 and analyzed, the pressure of the second analysis chamber 7 is controlled, and the calculation device 9 is adjusted so that the outgas from the intermediate chamber 4 does not become too large or too small. The conductivity of the orifice plate 12 is changed. Here, the conductivity is adjusted in accordance with the pressure of the second analysis chamber 7, but it is not limited thereto, and the conductivity may be adjusted in accordance with the amount of gas of the residual gas, and the conductivity may be adjusted in accordance with the pressure of the sample chamber 1 to adjust the conductivity. There is no limit to the way.

傳導性調整之後,由於與實施方式1、實施方式2相同,故省略說明。以下說明依據本實施方式之作用效果。本實施方式由於係藉由具備可變孔口板12,在選擇分析室之後,實施檢測感度的調整,故與實施方式1以及實施方式2相比,可實施準確度更高的氣體分壓測量。另外,本實施方式係就與實施方式1相異之部分說明。除此之外的部分係與實施方式1相同。 Since the conductivity adjustment is the same as that of the first embodiment and the second embodiment, the description thereof is omitted. The effects of the present embodiment will be described below. In the present embodiment, since the variable aperture plate 12 is provided, since the detection sensitivity is adjusted after the analysis chamber is selected, the gas partial pressure measurement with higher accuracy can be performed as compared with the first embodiment and the second embodiment. . In addition, this embodiment demonstrates the part different from Embodiment 1. The other parts are the same as those in the first embodiment.

於本發明之氣體分析裝置中,從各空間(試料室1、中間室4、第一分析室6、第二分析室7)的內壁面釋放出之氣體係作為真空計以及質量分析計之背景,對測量準確度有不良影響。 In the gas analyzer of the present invention, the gas system released from the inner wall surfaces of the respective spaces (the sample chamber 1, the intermediate chamber 4, the first analysis chamber 6, and the second analysis chamber 7) serves as a background for the vacuum gauge and the mass spectrometer. , has an adverse effect on measurement accuracy.

因此,各空間所使用之材料期望係以釋放出氣體較少的材料所構成,且係施有用以減少該等氣體之 放出之利用研磨或蝕刻之表面處理等,可以儘量減少內壁面的表面積。進一步,進行抽真空之際,各空間(試料室1、中間室4、第一分析室6、第二分析室7)係期望以橡膠加熱器(Rubber heater)等之加熱裝置預先從外部烘烤(baking)。 Therefore, the materials used in each space are desirably constructed of materials that release less gas, and are useful to reduce the gases. The surface area of the inner wall surface can be minimized by the surface treatment by polishing or etching. Further, when vacuuming is performed, each space (the sample chamber 1, the intermediate chamber 4, the first analysis chamber 6, and the second analysis chamber 7) is desirably baked from the outside in advance by a heating device such as a rubber heater. (baking).

另外,本發明之氣體分析裝置及氣體分析方法,只要在氣體分析裝置之各空間內以及於孔口板中氣體分子之運動作為分子流操作之條件成立之設計的話,於未脫離本發明之要旨之範圍內能以施以多種變更之形態實施。 Further, the gas analysis device and the gas analysis method of the present invention are designed so as not to deviate from the present invention as long as the movement of the gas molecules in the respective spaces of the gas analysis device and the movement of the gas molecules in the orifice plate is established as a condition for molecular flow operation. It can be implemented in a variety of variations within the scope.

Claims (5)

一種氣體分析裝置,係具備:試料室,用以在真空中從試驗體取出殘留氣體,中間室,在真空中,透過第一真空閥,以能獲取來自前述試料室之前述殘留氣體的方式連接至前述試料室;第一分析室,在真空中,透過第二真空閥,以能獲取來自前述中間室之前述殘留氣體的方式連接至前述中間室;第二分析室,在真空中,透過孔口板,以能獲取來自前述中間室之前述殘留氣體的方式連接至前述中間室;真空計,用以測量前述試料室的前述殘留氣體之氣體量;釋氣部,用以自前述第二分析室將前述殘留氣體釋氣;控制演算部,當前述氣體量為閾值以上時,關閉前述第二真空閥,而當前述氣體量未達前述閾值時,開啟前述第二真空閥,前述真空計測量前述殘留氣體之氣體量後開啟前述第一真空閥;以及一台或複數台質量分析計,用以當前述氣體量為前述閾值以上時,分析被獲取至前述第二分析室之前述殘留氣體,而當前述氣體量未達前述閾值時,分析被獲取至前述第一分析室之前述殘留氣體。 A gas analysis device comprising: a sample chamber for taking out residual gas from a test body in a vacuum, wherein the intermediate chamber is connected to the residual gas from the sample chamber through a first vacuum valve in a vacuum To the sample chamber; the first analysis chamber is connected to the intermediate chamber through a second vacuum valve in a vacuum to obtain the residual gas from the intermediate chamber; the second analysis chamber is in the vacuum, through the hole a mouth plate connected to the intermediate chamber in such a manner as to obtain the aforementioned residual gas from the intermediate chamber; a vacuum gauge for measuring the amount of the gas of the residual gas in the sample chamber; and an outgas portion for performing the second analysis from the foregoing The chamber releases the residual gas; the control calculation unit closes the second vacuum valve when the gas amount is greater than a threshold value, and when the gas amount does not reach the threshold value, opens the second vacuum valve, and the vacuum gauge measures After the amount of the residual gas, the first vacuum valve is opened; and one or more mass spectrometers are used to When the above value, the analysis is to obtain a second analysis of the residual gas chamber, while gas amount is less than the aforementioned threshold foregoing, the analysis is to obtain the first chamber of the residual gas analysis. 如申請專利範圍第1項所述之氣體分析裝置,其中前述質量分析計係第一質量分析計,係設置於前述第一分析室,於前述氣體量未達前述閾值時,分析被獲取至前述第一分析室之前述殘留氣體,以及第二質量分析計,係設置於前述第二分析室,於前述氣體量為前述閾值以上時,分析被獲取至前述第二分析室之前述殘留氣體。 The gas analysis device according to claim 1, wherein the mass spectrometer first mass spectrometer is disposed in the first analysis chamber, and when the gas amount does not reach the threshold value, the analysis is obtained as described above. The residual gas in the first analysis chamber and the second mass spectrometer are provided in the second analysis chamber, and when the gas amount is equal to or higher than the threshold value, the residual gas obtained in the second analysis chamber is analyzed. 如申請專利範圍第1項所述之氣體分析裝置,其中,前述第一分析室係透過第三真空閥,以能獲取前述殘留氣體的方式與前述第二分析室連接,前述控制演算部,係當前述氣體量為前述閾值以上時開啟前述第三真空閥,而當前述氣體量未達前述閾值時關閉前述第三真空閥,前述質量分析計,係設置於前述第一分析室,當前述氣體量為前述閾值以上時,分析被獲取至前述第二分析室之前述殘留氣體,而當前述氣體量未達前述閾值時,分析被獲取至前述第一分析室之前述殘留氣體。 The gas analysis device according to claim 1, wherein the first analysis chamber is connected to the second analysis chamber so as to be capable of acquiring the residual gas through a third vacuum valve, and the control calculation unit is And opening the third vacuum valve when the gas amount is greater than the threshold value, and closing the third vacuum valve when the gas amount does not reach the threshold value, wherein the mass spectrometer is disposed in the first analysis chamber when the gas is When the amount is equal to or higher than the threshold value, the residual gas obtained in the second analysis chamber is analyzed, and when the gas amount does not reach the threshold value, the residual gas obtained in the first analysis chamber is analyzed. 如申請專利範圍第1至3項中任一項所述之氣體分析裝置,其中,前述控制演算部,係對應前述殘留氣體之氣體量來調整前述孔口板之 傳導性。 The gas analysis device according to any one of claims 1 to 3, wherein the control calculation unit adjusts the orifice plate in accordance with a gas amount of the residual gas. Conductivity. 一種氣體分析方法,係包含:在試料室從試驗體取出殘留氣體之步驟;測量前述殘留氣體之氣體量之步驟;當前述殘留氣體之氣體量未達閾值時,對透過真空閥和與前述試料室連接之中間室連接之第一分析室,於開啟了前述真空閥的狀態,將前述殘留氣體自前述試料室獲取至前述第一分析室之步驟;而當前述殘留氣體之氣體量為前述閾值以上時,於關閉了前述真空閥的狀態,對透過孔口板與前述中間室連接之第二分析室,經由孔口板,將前述殘留氣體自前述試料室獲取至前述第二分析室之步驟;以及將被獲取至前述第一分析室與前述第二分析室之前述殘留氣體各別以質量分析計進行分析之步驟。 A gas analysis method comprising: a step of taking out a residual gas from a test body in a sample chamber; a step of measuring a gas amount of the residual gas; and when the gas amount of the residual gas does not reach a threshold value, the through-vacuum valve and the sample are a first analysis chamber connected to the intermediate chamber connected to the chamber, in a state in which the vacuum valve is opened, a step of obtaining the residual gas from the sample chamber to the first analysis chamber; and when the gas amount of the residual gas is the threshold value In the above, the step of closing the vacuum valve and the step of obtaining the residual gas from the sample chamber to the second analysis chamber through the orifice plate in the second analysis chamber through which the perforated orifice plate is connected to the intermediate chamber And a step of analyzing the residual gas to be obtained by the first analysis chamber and the second analysis chamber described above by a mass spectrometer.
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