TWI666451B - Probe device and guide plate thereof - Google Patents

Abstract

A probe device includes: a first guide plate including a first plate body formed with a plurality of first through holes; and a plurality of first internal insulating portions respectively formed in a plurality of the first through holes. An inner side wall, so that the inner side wall of each of the first through holes is completely covered by the corresponding first inner insulation portion, and a first perforation is formed inside the first inner insulation portion Each of the first through holes has a first aperture smaller than 100 micrometers ( μm ); and a plurality of conductive probes each having a first end portion and a second end portion on opposite sides, and more The first end portions of each of the conductive probes respectively pass through a plurality of the first perforations of the first guide plate. The invention also provides a guide plate of the probe device.

Description

Probe device and its guide plate

The invention relates to a probe device, in particular to a probe device suitable for a vertical probe card and a guide plate thereof.

A conventional probe device (ie, a probe head) for a vertical probe card includes a probe base and a plurality of probes. The probe base has an upper guide plate and a lower guide plate, and the upper guide plate and the lower guide plate have a micro-hole array according to the requirements of the object to be measured (such as a wafer).

With the development of electronic products toward precision and multi-functionalization, the chip structure of integrated circuits used in electronic products has also become more complex. In order to be able to test the increasingly complex wafer structure, the number of probes of the probe device has been increased to more than tens of thousands, and the pitch between the two probes is also getting smaller and smaller, making multiple probes penetrate The pore diameter of the passed micro-hole array is approaching the limit of processing, and its processing accuracy is more and more difficult to grasp.

Therefore, the present inventor believes that the above-mentioned defects can be improved, and with special research and cooperation with the application of scientific principles, he finally proposes an invention with a reasonable design and effective improvement of the above-mentioned defects.

An embodiment of the present invention is to provide a probe device and a guide plate thereof, which can effectively improve defects that may occur in the existing probe device.

An embodiment of the present invention discloses a probe device, including: a first guide plate including a first plate body formed with a plurality of first through holes; and a plurality of first internal insulation portions respectively formed in a plurality of the aforesaid An inner side wall of the first through hole, so that the inner side wall of each of the first through holes is completely covered by the corresponding first inner insulating portion, and an inner side of each of the first inner insulating portion A first perforation is formed, and each of the first perforations has a first aperture smaller than 100 micrometers ( μm ); and a plurality of conductive probes each having a first end portion and a second An end portion, the first end portions of the plurality of conductive probes respectively pass through the plurality of first perforations of the first guide plate, and are located outside the first guide plate.

The embodiment of the present invention further discloses a guide plate of a probe device, which includes: a plate body formed with a plurality of through holes; and a plurality of internal insulation portions respectively formed on the inner side walls of the plurality of through holes so that each The inner side walls of each of the through holes are completely covered by the corresponding inner insulation portion, and a perforation is formed on the inner side of each of the inner insulation portions, and each of the perforations has an aperture smaller than 100 microns. Wherein the surface roughness of the inner surface of each of the inner insulating portions is smaller than the surface roughness of the inner sidewall of any one of the through holes.

In summary, the probe device and its guide plate according to the embodiment of the present invention can form a plurality of through holes with a large hole diameter through the plate body, and form multiple holes on the inner side walls of the plurality of through holes, respectively. Internal insulation portions to form a plurality of perforations with smaller pore diameters (apertures smaller than 100 microns), so that the processing accuracy of the plurality of perforations is effectively improved, and the processing threshold and the overall of the plurality of perforations are improved. The processing cost is effectively reduced.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention, but these descriptions and drawings are only used to illustrate the present invention, and not to make any limitation to the scope of the present invention limit.

100‧‧‧ Probe device

1‧‧‧ Probe Block

11‧‧‧ the first guide

111‧‧‧The first plate

112‧‧‧The first internal insulation department

113‧‧‧First external insulation department

114‧‧‧The first through hole

115‧‧‧ first perforation

12‧‧‧ second guide

121‧‧‧Second plate

122‧‧‧Second Internal Insulation Department

123‧‧‧Second External Insulation Department

124‧‧‧Second through hole

125‧‧‧ second perforation

2‧‧‧ conductive probe

21‧‧‧first end

22‧‧‧ second end

R1‧‧‧first aperture

R2‧‧‧Second Aperture

FIG. 1 is a schematic perspective view of a probe device according to the present invention.

FIG. 2 is a schematic cross-sectional view of the probe device of FIG. 1 along a line II-II.

FIG. 3 is a schematic perspective cross-sectional view of a first plate of a probe device according to the present invention.

FIG. 4 is a schematic perspective sectional view of a first guide plate of a probe device according to the present invention.

FIG. 5 is a schematic perspective cross-sectional view of a first perforated shape of the probe device according to the present invention in a rectangular shape.

FIG. 6 is a schematic perspective cross-sectional view of a first guide plate of a probe device of the present invention including only a first plate body and a plurality of first internal insulation portions.

Please refer to FIGS. 1 to 6, which are embodiments of the present invention. It should be noted that this embodiment corresponds to the related quantities and appearances mentioned in the drawings, and is only used to specifically describe the embodiments of the present invention. In order to facilitate understanding of the content of the present invention, it is not intended to limit the protection scope of the present invention.

As shown in FIGS. 1 and 2, a probe device 100 is provided in this embodiment. The probe device 100 includes a probe base 1 and a plurality of conductive probes 2. Wherein, the probe base 1 includes a first guide plate 11 (upper die) and a second guide plate 12 (lower die). The first guide plate 11 and the second guide plate 12 are spaced from each other. A plurality of the conductive probes 2 can pass through the first guide plate 11 and the second guide plate 12 respectively to assemble the probe device 100. In addition, the probe holder may be provided with a spacer (not shown) between the first guide plate 11 and the second guide plate 12, but the present invention is not limited thereto.

The specific structure of each element of the probe device 100 in this embodiment will be described below, and then the connection relationship between the various elements of the probe device 100 will be described in due course. It should be noted that, in order to facilitate understanding of this embodiment, the drawings only show a partial structure of the probe device 100, so as to clearly show the structure and connection relationship of each element of the probe device 100.

As shown in FIG. 2 to FIG. 4, the first guide plate 11 includes a first plate body 111, a plurality of first inner insulation portions 112, and a first outer insulation portion 113. The first plate body 111 is formed with a plurality of circular first through holes 114 (eg, FIG. 3), and the plurality of first internal insulation portions 112 are respectively formed in the plurality of first through holes 114. An inner side wall, so that the inner side wall of each of the first through holes 114 is completed by the corresponding first inner insulating portion 112 Whole coverage. The first outer insulating portion 113 is formed on an outer surface of the first plate body 111, and the first outer insulating portion 113 is connected to both ends of each of the first inner insulating portions 112 so that the first plate The body 111 is completely buried within the first outer insulating portion 113 and the plurality of first inner insulating portions 112.

In more detail, a first through hole 115 (eg, FIG. 4) having a circular shape is formed on the inner side of each of the first inner insulating portions 112, and the first through hole 115 has a diameter of less than 100 micrometers (μm). A first aperture R1. Preferably, the first aperture R1 is smaller than 50 micrometers, and the first aperture R1 is smaller than the thickness of the first guide plate 11, and the thickness of any portion of the first outer insulation portion 113 is substantially equal to The thickness of any one of the first inner insulating portions 112.

Furthermore, the second guide plate 12 includes a second plate body 121, a plurality of second inner insulation portions 122, and a second outer insulation portion 123. The second plate body 121 is formed with a plurality of second through holes 124 in a circular shape, and the plurality of second inner insulation portions 122 are respectively formed on the inner side walls of the plurality of second through holes 124 so that each The inner side walls of each of the second through holes 124 are completely covered by the corresponding second inner insulation portions 122. The second outer insulating portion 123 is formed on an outer surface of the second plate body 121, and the second outer insulating portion 123 is connected to two ends of each of the second inner insulating portions 122 so that the second plate The body 121 is completely buried within the second outer insulating portion 123 and the plurality of second inner insulating portions 122.

In more detail, a circular second through hole 125 is formed on the inner side of each of the second inner insulation portions 122, and the second through hole 125 has a second aperture R2 smaller than 100 micrometers (μm). Preferably, the second aperture R2 is smaller than 50 micrometers, and the second aperture R2 is smaller than the thickness of the second guide plate 12, and the thickness of any portion of the first outer insulating portion 113 is substantially equal to The thickness of any one of the first inner insulating portions 112.

Therefore, compared with the perforated structure of the existing guide plate, the perforated structure of the first guide plate 11 and the second guide plate 12 in this embodiment is easy to process, has high processing accuracy, and can reduce the overall manufacturing cost. In addition, the processing accuracy limit of the perforation hole diameter of the existing guide plate can only be roughly It is about 100 microns, but the structure of the first guide plate 11 and the second guide plate 12 in this embodiment can make the first aperture R1 and the second aperture R2 smaller than 50 microns, thereby breaking the threshold of the existing processing technology. .

Furthermore, the first plate 111 and the second plate 121 may be thin with a surface flatness of 30 μm or less, a parallelism of 40 μm or less, and a line arithmetic average height (Ra) of approximately 0.3 μm. Layer substrate, and the material of the thin layer substrate may be conductive or non-conductive. Preferably, the thin-layer substrate may be made of a material with high mechanical strength, such as a metal plate, a ceramic plate, or a silicon substrate.

In addition, the material of the first outer insulating portion 113 is the same as that of each of the first inner insulating portions 112 and is a structure integrally formed with each other. The material of the second outer insulating portion 123 is the same as that of each of the second inner insulating portions 122 and is a structure integrally formed with each other. Preferably, the materials of the first outer insulating portion 113, the second outer insulating portion 123, each of the first inner insulating portion 112, and each of the second inner insulating portion 122 may be selected from ceramic materials and polytetrafluoroethylene, respectively. (Polytetrafluoroethylene, PTFE), or at least one of parylene. The surface roughness of the inner surface of each of the first inner insulating portions 112 is smaller than the surface roughness of the inner sidewall of any one of the first through holes 114, and the surface of the inner surface of each of the second inner insulating portions 122 The roughness is smaller than the surface roughness of the inner sidewall of any one of the second through holes 124.

Please continue to refer to FIG. 3 and FIG. 4. The method for preparing the first guide plate 11 in this embodiment is described below. The method for preparing the second guide plate 12 is substantially the same as the method for preparing the first guide plate 11. More details. It must be noted that the method for preparing the first guide plate 11 described below is only one embodiment of the present invention, and the present invention is not limited thereto. That is, as long as it is any manufacturing method that can achieve the structural characteristics of the first guide plate 11, it conforms to the spirit of the present invention and belongs to the scope of the present invention. In addition, the thicknesses of the following first plate body 111, the first inner insulating portion 112, and the first outer insulating portion 113, and the sizes of the first through holes 114 and the first through holes 115 are merely exemplary. It is clear that the present invention is not limited to this.

The method for preparing the first guide plate 11 includes: providing the first plate body 111 with a thickness of about 150 μm; and performing a drilling process (such as mechanical drilling or laser drilling) on the first plate body 111. Holes) to form a plurality of first through holes 114 (eg, FIG. 3) with a diameter of about 150 μm on the first plate body 111; and perform a deposition process on the first plate body 111 (eg: Anodization, chemical vapor deposition, or physical vapor deposition) to form a plurality of first inner insulating portions 112 with a thickness of about 50 micrometers on the inner sidewalls of the plurality of first through holes 114, and A first outer insulating portion 113 (eg, FIG. 4) having a thickness of about 50 μm is formed on the outer surfaces of both sides of the first plate body 111.

Through the above-mentioned manufacturing method of the first guide plate 11, the thickness of the first guide plate 11 can be effectively increased, and the aperture of each of the first through holes 115 can be effectively reduced. In more detail, since the first outer insulation portion 113 of about 50 micrometers is added to the upper and lower sides of the first plate body 111, the thickness of the first guide plate 11 can be effectively increased to about 250 micrometers, and A first inner insulating portion 112 of about 50 micrometers is added to both sides of the inner side wall of each of the first through holes 114, so the aperture of the first through hole 115 can be effectively reduced to about 50 micrometers. As a result, the aspect ratio (ratio of the plate thickness to the aperture) of the first guide plate 11 can be greatly increased from the original 1: 1 (150: 150) to 5: 1 (250: 50), thereby effectively overcoming The processing difficulties of the plurality of first perforations 115 (microhole arrays) of the first guide plate 11 in the existing probe device are eliminated, and the processing accuracy of the plurality of first perforations 115 can be effectively improved.

Further, when the first plate body 111 is a metal plate (conductor material), the first guide plate 11 must be completely covered with the first outer insulation portion 113 and the first inner insulation portion 112 on the first plate body. 111 to achieve insulation effect. Thereby, the first guide plate 11 can use a metal plate that is easy to process and has high processing accuracy as the first plate body 111.

Furthermore, when the first through-hole 114 is formed by drilling the first plate body 111, the inner side wall of the first through-hole 114 is generally rough, but the first inner insulating portion 112 of this embodiment is formed by deposition. Shape, so its inner surface is relatively smooth. That is That is, through the deposition process, the surface roughness of the inner surface of each of the first inner insulating portions 112 can be made smaller than the surface roughness of the inner sidewall of any one of the first through holes 114. Thereby, when the plurality of conductive probes 2 respectively touch the inner surfaces of the plurality of first inner insulation portions 112, the damage caused by the first guide plate 11 to the plurality of conductive probes 2 can be reduced. .

It is worth mentioning that, in this embodiment, the first perforation 115 shown in FIG. 4 is circular, but the present invention is not limited thereto. In practical applications, the shape of the first perforation 115 can be adjusted to match the cross-sectional shape of the conductive probe 2, for example, when the cross-sectional shape of the conductive probe 2 is rectangular, the shape of the first perforation 115 It can be correspondingly designed as a rectangle (eg, Fig. 5). In addition, the thickness of the first guide plate 11 can also be adjusted according to the mechanism design of the probe base 1 (such as thickening or thinning). Furthermore, the thickness of any portion of the first outer insulating portion 113 may be greater than or less than the thickness of any one of the first inner insulating portions 112, and is not limited to that described in this embodiment. Alternatively, the first guide plate 11 may include only the first plate body 111 and the plurality of first inner insulation portions 112, but not the first outer insulation portion 113 (eg, FIG. 6). As for the structural design of the second guide plate 12 is similar to the first guide plate 11, it will not be repeated here.

Please continue to refer to FIG. 2. In this embodiment, a plurality of the conductive probes 2 have a strip-shaped structure, and the material may be nickel (Ni), copper (Cu), gold (Au), or the like. Each of the conductive probes 2 has a first end portion 21 and a second end portion 22 on opposite sides, and the first end portions 21 of the plurality of conductive probes 2 pass through the first guide plate 11 respectively. The plurality of first perforations 115 are located outside the first guide plate 11, and the second ends 22 of the plurality of conductive probes 2 pass through the plurality of second perforations of the second guide plate 12, respectively. 125, and located outside the second guide plate 12.

Wherein, a plurality of the first end portions 21 protruding from the first guide plate 11 can be assembled and electrically connected to a circuit board or a carrier board (not shown) to form a vertical probe card structure. . A plurality of portions of the second end portion 22 protruding from the second guide plate 12 can be used to touch electrical contacts (not shown) of a chip to be electrically connected to the chip. In this In the embodiment, the ends of the plurality of first end portions 21 and the plurality of second end portions 22 are in a flat shape, but in the embodiment not shown in the present invention, they may also have a tapered shape.

It is worth mentioning that, in this embodiment, a plurality of the conductive probes 2 can pass through the first guide plate 11 and the second guide plate 12 respectively to assemble the probe device 100. However, in an embodiment not shown in the present invention, the probe device 100 may include only the first guide plate 11 and not the second guide plate 12.

It should be noted that the “first” and “second” used in this embodiment are to facilitate the distinction between different components, but there is no meaning of sequence. Therefore, the “first” and “second” in the component names "Can also be omitted. For example, the first and second guide plates 11 and 12 may also be named as guide plates, and the first and second plate bodies 111 and 121 may also be named as plate bodies. The two internal insulating portions 122 may also be named internal insulating portions. In addition, the guide plate provided in this embodiment (such as the above-mentioned first guide plate 11 or second guide plate 12) may be a separately sold product, and it is not limited to being applicable to the above-mentioned probe device 100 only. That is, the guide plate can also be applied to other types of probe devices 100.

[Technical effect of the embodiment of the present invention]

In summary, the probe device and the guide plate of the probe device according to the embodiments of the present invention can form a plurality of through holes with a large aperture through the plate body, and can be formed on the inner side walls of the plurality of through holes, respectively. A plurality of internal insulation portions are formed to form a plurality of perforations with smaller pore diameters (apertures smaller than 100 microns), so that the aspect ratio (ratio of plate thickness to pore diameter) of the guide plate and a plurality of The processing accuracy is effectively improved, and the processing threshold of multiple perforations and the overall processing cost are effectively reduced.

Furthermore, the probe device and the guide plate of the probe device according to the embodiments of the present invention can pass the surface roughness of the inner surface of each of the inner insulation portions to be smaller than the surface roughness of the inner sidewall of any through hole, so When a plurality of the conductive probes respectively touch the inner surfaces of the plurality of internal insulation portions, the conductive plate can be reduced to the plurality of conductive probes. Damage.

The above are only the preferred and feasible embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. Any equal changes and modifications made in accordance with the scope of patent application of the present invention shall fall within the protection scope of the claims of the present invention .

Claims (10)

A probe device includes: a first guide plate including a first plate body formed with a plurality of first through holes; and a plurality of first internal insulating portions respectively formed in a plurality of the first through holes. An inner side wall, so that the inner side wall of each of the first through holes is completely covered by the corresponding first inner insulation portion, and a first perforation is formed inside the first inner insulation portion And each of the first perforations has a first aperture smaller than 100 micrometers (μm); and a plurality of conductive probes each having a first end portion and a second end portion on opposite sides, a plurality of The first end portions of the conductive probes respectively pass through the plurality of first through holes of the first guide plate and are located outside the first guide plate; wherein each of the first through holes It is a mechanical or laser drilling, and the surface roughness of the inner surface of each of the first inner insulating portions is smaller than the surface roughness of the inner sidewall of any one of the first through holes. The probe device according to claim 1, wherein the first guide plate includes a first outer insulating portion formed on an outer surface of the first plate, and the first outer insulating portion is connected to each The two ends of the first inner insulating portion are so that the first plate body is completely buried in the first outer insulating portion and a plurality of the first inner insulating portions. The probe device according to claim 2, wherein the first plate is a metal plate, a ceramic plate, or a silicon substrate; the first outer insulating portion and each of the first inner insulating portions The material is the same, and is ceramic material, polytetrafluoroethylene (PTFE), or parylene. The probe device according to claim 2, wherein a thickness of any portion of the first outer insulating portion is equal to a thickness of any one of the first inner insulating portions. The probe device according to claim 1, wherein the first aperture is smaller than a thickness of the first guide plate, and the first aperture is smaller than 50 microns. The probe device according to any one of claims 1 to 5, further comprising a second guide plate, and the second guide plate includes: a second plate body formed with a plurality of second through holes; And a plurality of second inner insulating portions, respectively formed on the inner side walls of the plurality of second through holes, so that the inner side walls of each of the second through holes are corresponding to the second inner insulating portions It is completely covered, and a second perforation is formed on the inner side of each of the second inner insulation portions, and each of the second perforations has a second aperture smaller than 100 micrometers (μm), and the second aperture is smaller than The first aperture; wherein the second ends of the plurality of conductive probes respectively pass through the plurality of second perforations of the second guide plate and are located outside the second guide plate . The probe device according to claim 6, wherein the second guide plate includes a second outer insulating portion formed on an outer surface of the second plate, and the second outer insulating portion is connected to each Two ends of the second inner insulating portion, so that the second plate body is completely buried in the second outer insulating portion and a plurality of the second inner insulating portions; wherein the second plate The body is a metal plate, a ceramic plate, or a silicon substrate; the second outer insulating portion is made of the same material as each of the second inner insulating portions, and is a ceramic material, polytetrafluoroethylene, or poly-to-two Toluene; the surface roughness of the inner surface of each of the second inner insulating portions is smaller than the surface roughness of the inner sidewall of any one of the second through holes. A guide plate of a probe device includes: a plate body formed with a plurality of through holes; and a plurality of internal insulating portions respectively formed on the inner side walls of the plurality of through holes so that each of the through holes is The inner side wall is completely covered by the corresponding inner insulation portion, and a perforation is formed on the inner side of each of the inner insulation portions, and each of the perforations has an aperture smaller than 100 micrometers; The through holes are mechanical or laser drilled holes, and the surface roughness of the inner surface of each of the inner insulating portions is smaller than the surface roughness of the inner sidewall of any one of the through holes. The guide plate of the probe device according to claim 8, further comprising an outer insulating portion formed on an outer surface of the board, and the outer insulating portion is connected to both ends of each of the inner insulating portions, In this way, the board body is completely buried in the outer insulating portion and the plurality of inner insulating portions. The guide plate of the probe device according to claim 9, wherein the plate body is a metal plate, a ceramic plate, or a silicon substrate; and the outer insulating portion is made of the same material as each of the inner insulating portions And is a ceramic material, polytetrafluoroethylene, or parylene.