TWI659215B - Probe card device and signal transmitting module thereof - Google Patents

Probe card device and signal transmitting module thereof Download PDF

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Publication number
TWI659215B
TWI659215B TW107132439A TW107132439A TWI659215B TW I659215 B TWI659215 B TW I659215B TW 107132439 A TW107132439 A TW 107132439A TW 107132439 A TW107132439 A TW 107132439A TW I659215 B TWI659215 B TW I659215B
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Taiwan
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contact
electrical contacts
groove
card device
probe card
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TW107132439A
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Chinese (zh)
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TW201925790A (en
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李文聰
謝智鵬
蘇偉誌
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中華精測科技股份有限公司
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Publication of TW201925790A publication Critical patent/TW201925790A/en

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Abstract

本發明公開一種探針卡裝置,包含轉接板、位於轉接板一側的定位座體、及設置於定位座體的多個矩形探針。轉接板包含有多個電性接點,每個矩形探針包含有穿出定位座體的第一接觸段與第二接觸段,多個矩形探針的第一接觸段分別抵接於多個電性接點。每個第一接觸段與相對應電性接點的連接為凹凸配合且能在相對位移量(10微米以下)內保持接觸,以使每個第一接觸段與相對應電性接點的相對位置能在相對位移量內被調整,而令多個矩形探針的第二接觸段末端緣大致彼此對齊。本發明另公開一種探針卡裝置的信號傳輸模組。 The invention discloses a probe card device, which comprises an adapter plate, a positioning base on one side of the adapter plate, and a plurality of rectangular probes arranged on the positioning base. The adapter board includes a plurality of electrical contacts. Each rectangular probe includes a first contact section and a second contact section that penetrate the positioning base. The first contact sections of the plurality of rectangular probes respectively abut against multiple contacts. Electrical contacts. The connection between each first contact segment and the corresponding electrical contact is a concave-convex fit and can maintain contact within a relative displacement amount (less than 10 microns), so that the first contact segment and the corresponding electrical contact are opposite each other. The position can be adjusted within the relative displacement, so that the end edges of the second contact segments of the plurality of rectangular probes are substantially aligned with each other. The invention also discloses a signal transmission module of a probe card device.

Description

探針卡裝置及其信號傳輸模組 Probe card device and its signal transmission module

本發明涉及一種偵測裝置,尤其涉及一種探針卡裝置及其信號傳輸模組。 The invention relates to a detection device, in particular to a probe card device and a signal transmission module thereof.

如圖1所示,現有的探針卡裝置100a是以多個探針2a的一端連接於轉接板1a上的呈突出狀的多個電性接點11a,但由於上述多個探針2a所存在著長度上的公差以及轉接板1a上的多個電性接點11a在高度上的公差,使得所述多個探針2s另一端的共面度不佳,進而影響到現有探針卡裝置100a對於待測物的量測精準度。 As shown in FIG. 1, the conventional probe card device 100 a is a plurality of electrical contacts 11 a in a protruding shape connected to one end of a plurality of probes 2 a on the adapter board 1 a. The existing tolerance in length and the tolerance in height of the plurality of electrical contacts 11a on the adapter board 1a make the coplanarity of the other ends of the plurality of probes 2s poor, which further affects the existing probes. The measurement accuracy of the card device 100a for the object to be measured.

於是,本發明人認為上述缺陷可改善,乃特潛心研究並配合科學原理的運用,終於提出一種設計合理且有效改善上述缺陷的本發明。 Therefore, the present inventor believes that the above-mentioned defects can be improved, and with special research and cooperation with the application of scientific principles, he finally proposes an invention with a reasonable design and effective improvement of the above-mentioned defects.

本發明實施例在於提供一種探針卡裝置及其信號傳輸模組,其能有效地改善現有探針卡裝置所可能產生的缺陷。 An embodiment of the present invention is to provide a probe card device and a signal transmission module thereof, which can effectively improve defects that may occur in the existing probe card device.

本發明實施例公開一種探針卡裝置,包括:一轉接板,包含有一板面及位於所述板面的多個電性接點;一定位座體,對應設置於多個所述電性接點的一側;以及多個矩形探針,設置於所述定位座體,並且每個所述矩形探針包含有位於相反兩側且穿出所述定位座體的一第一接觸段與一第二接觸段,並且多個所述矩形探針的所述第一接觸段分別抵接於多個所述電性接點;其中,每 個所述第一接觸段與相對應的所述電性接點之間的連接為凹凸配合且能在一相對位移量內保持彼此接觸,以使每個所述第一接觸段與相對應所述電性接點的相對位置能在所述相對位移量內被調整,而令多個所述矩形探針的所述第二接觸段末端緣大致彼此對齊;其中,所述相對位移量為10微米以下。 An embodiment of the present invention discloses a probe card device, which includes: an adapter board including a board surface and a plurality of electrical contacts located on the board surface; a positioning base body correspondingly disposed on a plurality of the electric devices; One side of the contact point; and a plurality of rectangular probes disposed on the positioning base, and each of the rectangular probes includes a first contact segment located on opposite sides and penetrating the positioning base and A second contact segment, and the first contact segments of the plurality of rectangular probes respectively abut a plurality of the electrical contacts; wherein each The connection between each of the first contact sections and the corresponding electrical contact is a concave-convex fit and can maintain contact with each other within a relative displacement, so that each of the first contact sections and the corresponding contact The relative positions of the electrical contacts can be adjusted within the relative displacement amount, so that the end edges of the second contact segments of the plurality of rectangular probes are substantially aligned with each other; wherein the relative displacement amount is 10 Below micron.

本發明實施例也公開一種探針卡裝置的信號傳輸模組,包括:一轉接板,包含有一板面及位於所述板面的多個電性接點;以及多個矩形探針,各包含有位於相反兩側的一第一接觸段與一第二接觸段,並且多個所述矩形探針的所述第一接觸段分別抵接於多個所述電性接點;其中,每個所述第一接觸段與相對應的所述電性接點之間的連接為凹凸配合且能在一相對位移量內保持彼此接觸,以使每個所述第一接觸段與相對應所述電性接點的相對位置能在所述相對位移量內被調整,而令多個所述矩形探針的所述第二接觸段末端緣大致彼此對齊;其中,所述相對位移量為10微米以下。 An embodiment of the present invention also discloses a signal transmission module of a probe card device, including: an adapter board including a board surface and a plurality of electrical contacts located on the board surface; and a plurality of rectangular probes, each The first contact section and the second contact section on opposite sides are included, and the first contact sections of the plurality of rectangular probes respectively abut on the plurality of electrical contacts; The connection between each of the first contact sections and the corresponding electrical contact is a concave-convex fit and can maintain contact with each other within a relative displacement, so that each of the first contact sections and the corresponding contact The relative positions of the electrical contacts can be adjusted within the relative displacement amount, so that the end edges of the second contact segments of the plurality of rectangular probes are substantially aligned with each other; wherein the relative displacement amount is 10 Below micron.

綜上所述,本發明實施例所公開的探針卡裝置及其信號傳輸模組,能夠通過可以在相對位移量內調整彼此相對位置且保持彼此接觸的每個第一接觸段與相對應電性接點之結構設計,藉以吸收多個矩形探針之間的長度公差及多個電性接點在高度上的公差,進而使多個矩形探針的第二接觸段末端緣大致彼此對齊,並有效地提升探針卡裝置的量測精準度。 In summary, the probe card device and its signal transmission module disclosed in the embodiments of the present invention can be adjusted to each other's relative positions within a relative displacement amount and keep each first contact section in contact with the corresponding power. The structural design of the electrical contacts makes it possible to absorb the length tolerances between multiple rectangular probes and the height tolerances of multiple electrical contacts, so that the end edges of the second contact segments of the multiple rectangular probes are substantially aligned with each other. And effectively improve the measurement accuracy of the probe card device.

為能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與附圖,但是此等說明與附圖僅用來說明本發明,而非對本發明的保護範圍作任何的限制。 In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention, but these descriptions and drawings are only used to illustrate the present invention, and not to make any limitation to the scope of the present invention limit.

[先前技術] [Prior art]

100a‧‧‧探針卡裝置 100a‧‧‧probe card device

1a‧‧‧轉接板 1a‧‧‧ Adapter Board

11a‧‧‧電性接點 11a‧‧‧electric contact

2a‧‧‧探針 2a‧‧‧ Probe

[本實施例] [This embodiment]

100‧‧‧探針卡裝置 100‧‧‧ Probe Card Device

1‧‧‧轉接板 1‧‧‧ transfer board

11‧‧‧板面 11‧‧‧ plate surface

12‧‧‧電性接點 12‧‧‧electric contact

121‧‧‧凹槽 121‧‧‧ groove

122‧‧‧凸塊 122‧‧‧ bump

13‧‧‧基板 13‧‧‧ substrate

14‧‧‧金屬墊 14‧‧‧metal pad

15‧‧‧絕緣層 15‧‧‧ Insulation

151‧‧‧通孔 151‧‧‧through hole

16‧‧‧金屬鍍層 16‧‧‧metal plating

2‧‧‧定位座體 2‧‧‧ positioning base

21‧‧‧第一導板 21‧‧‧The first guide plate

211‧‧‧第一貫孔 211‧‧‧The first through hole

22‧‧‧第二導板 22‧‧‧Second Guide

221‧‧‧第二貫孔 221‧‧‧Second through hole

23‧‧‧間隔板 23‧‧‧ Spacer

3‧‧‧矩形探針 3‧‧‧ rectangular probe

31‧‧‧第一接觸段 31‧‧‧ the first contact

311‧‧‧自由端部 311‧‧‧ free end

3111‧‧‧接觸臂 3111‧‧‧Contact Arm

3112‧‧‧凹槽 3112‧‧‧Groove

312‧‧‧倒刺 312‧‧‧ barb

32‧‧‧第二接觸段 32‧‧‧ second contact

4‧‧‧緩衝體 4‧‧‧ buffer

M‧‧‧信號傳輸模組 M‧‧‧Signal transmission module

圖1為先前技術中的現有探針卡裝置示意圖。 FIG. 1 is a schematic diagram of a conventional probe card device in the prior art.

圖2為本發明實施例一的探針卡裝置示意圖(一)。 FIG. 2 is a schematic diagram (1) of a probe card device according to the first embodiment of the present invention.

圖3為圖2的轉接板其中一種具體構造的示意圖。 FIG. 3 is a schematic diagram of a specific structure of the adapter plate of FIG. 2.

圖4為本發明實施例一的探針卡裝置示意圖(二)。 FIG. 4 is a schematic diagram (2) of a probe card device according to the first embodiment of the present invention.

圖5為本發明實施例一的探針卡裝置示意圖(三)。 FIG. 5 is a schematic diagram (c) of a probe card device according to the first embodiment of the present invention.

圖6為本發明實施例二的探針卡裝置示意圖(一)。 FIG. 6 is a schematic diagram (a) of a probe card device according to a second embodiment of the present invention.

圖7為本發明實施例二的探針卡裝置示意圖(二)。 FIG. 7 is a schematic diagram (2) of a probe card device according to a second embodiment of the present invention.

圖8為本發明實施例三的探針卡裝置示意圖。 FIG. 8 is a schematic diagram of a probe card device according to a third embodiment of the present invention.

圖9為本發明實施例四的探針卡裝置示意圖。 FIG. 9 is a schematic diagram of a probe card device according to a fourth embodiment of the present invention.

請參閱圖2至圖9所示,其為本發明的實施例,需先說明的是,本實施例對應附圖所提及的相關數量與外型,僅用來具體地說明本發明的實施方式,以便於了解本發明的內容,而非用來侷限本發明的保護範圍。需額外說明的是,下述多個實施例所公開的技術特徵能夠彼此相互參考與轉用,以構成本發明所未繪示的其他實施例。 Please refer to FIG. 2 to FIG. 9, which are embodiments of the present invention. It should be noted that this embodiment corresponds to the related quantities and appearances mentioned in the drawings, and is only used to specifically describe the implementation of the present invention. Mode to facilitate understanding of the content of the present invention, but not to limit the protection scope of the present invention. It should be additionally noted that the technical features disclosed in the following multiple embodiments can be mutually referenced and transferred to each other to form other embodiments not shown in the present invention.

[實施例一] [Example 1]

如圖2至圖5所示,其為本發明的實施例一。本實施例公開一種探針卡裝置100,其包含有一轉接板1、位於上述轉接板1一側的一定位座體2、及設置於上述定位座體2的多個矩形探針3。其中,上述每個矩形探針3的一端抵接於轉接板1,而所述每個矩形探針3的另一端則是用來抵接並測試一待測物(如:半導體晶圓)。 As shown in FIG. 2 to FIG. 5, this is a first embodiment of the present invention. This embodiment discloses a probe card device 100, which includes an adapter plate 1, a positioning base 2 located on one side of the adapter plate 1, and a plurality of rectangular probes 3 disposed on the positioning base 2. Wherein, one end of each of the rectangular probes 3 is in contact with the adapter board 1, and the other end of each of the rectangular probes 3 is used to contact and test an object to be tested (such as a semiconductor wafer). .

再者,所述轉接板1與多個矩形探針3於本實施例中能合稱為一信號傳輸模組M,並且所述信號傳輸模組M不以搭配於定位座體2為限。也就是說,在本發明未繪示的其他實施例中,所述信號傳輸模組M也可以單獨販售或應用於其他構件。需先說明的是,本實施例的圖式是呈現上述矩形探針3的植針過程示意圖, 但本發明不受限於此。另,為了便於理解本實施例,所以圖式僅呈現探針卡裝置100的局部構造,以便於清楚地呈現探針卡裝置100的各個元件構造與連接關係。以下將分別介紹所述探針卡裝置100的各個元件構造及其連接關係。 Furthermore, the adapter plate 1 and the plurality of rectangular probes 3 can be collectively referred to as a signal transmission module M in this embodiment, and the signal transmission module M is not limited to being matched with the positioning base 2 . That is, in other embodiments not shown in the present invention, the signal transmission module M may be sold separately or applied to other components. It should be noted that the diagram of this embodiment is a schematic diagram showing the needle implantation process of the rectangular probe 3 described above. However, the present invention is not limited to this. In addition, in order to facilitate understanding of this embodiment, the drawings only show a partial structure of the probe card device 100, so as to clearly show the structure and connection relationship of each element of the probe card device 100. The structure of each element of the probe card device 100 and its connection relationship will be described below.

所述轉接板1包含有一板面11及位於上述板面11的多個電性接點12。本實施例中的每個電性接點12包含有凹設於上述板面11的一凹槽121,並且上述凹槽121的內側壁為導電材質。需說明的是,本實施例不限制轉接板1的具體構造,所以圖式的轉接板1是以示意的方式呈現。 The adapter board 1 includes a board surface 11 and a plurality of electrical contacts 12 located on the board surface 11. Each of the electrical contacts 12 in this embodiment includes a groove 121 recessed in the board surface 11, and an inner wall of the groove 121 is made of conductive material. It should be noted that this embodiment does not limit the specific structure of the adapter plate 1, so the adapter plate 1 in the figure is presented in a schematic manner.

舉例來說,本實施例的轉接板1構造可以如圖3所示,但不以此為限。其中,轉接板1包含有一基板13、位於上述基板13上的多個金屬墊14、覆蓋於上述基板13的一絕緣層15、及分別連接於上述多個金屬墊14的多個金屬鍍層16。進一步地說,所述絕緣層15的外表面定義為上述轉接板1的板面11,所述絕緣層15形成有分別裸露多個金屬墊14的多個通孔151,並且多個金屬鍍層16鍍設於多個所述通孔151的內側壁。其中,每個金屬墊14及相連接的金屬鍍層16合併定義為一個所述電性接點12並且共同包圍形成有所述凹槽121。 For example, the structure of the adapter plate 1 in this embodiment may be shown in FIG. 3, but is not limited thereto. The adapter board 1 includes a substrate 13, a plurality of metal pads 14 on the substrate 13, an insulating layer 15 covering the substrate 13, and a plurality of metal plating layers 16 respectively connected to the plurality of metal pads 14. . Further, the outer surface of the insulating layer 15 is defined as the board surface 11 of the above-mentioned adapter board 1, the insulating layer 15 is formed with a plurality of through holes 151 respectively exposing a plurality of metal pads 14, and a plurality of metal plating layers 16 is plated on the inner sidewalls of the plurality of through holes 151. Wherein, each of the metal pads 14 and the connected metal plating layers 16 are combined and defined as one of the electrical contacts 12 and collectively surround and form the groove 121.

所述定位座體2對應設置於上述轉接板1的多個電性接點12一側,並且定位座體2於本實施例中包含有一第一導板21(upper die)、大致平行於第一導板21的一第二導板22(lower die)、及夾持於上述第一導板21與第二導板22之間的一間隔板23(圖中未示出)。其中,所述第一導板21形成有多個第一貫孔211,所述第二導板22形成有多個第二貫孔221,並且上述多個第二貫孔221的位置分別對應於多個第一貫孔211的位置,而每個第二貫孔221的孔徑不大於第一貫孔211的孔徑。 The positioning base 2 is correspondingly disposed on one side of the plurality of electrical contacts 12 of the adapter board 1, and the positioning base 2 includes a first die 21 (upper die) in this embodiment, which is substantially parallel to A second guide plate 22 (lower die) of the first guide plate 21 and a spacer plate 23 (not shown) clamped between the first guide plate 21 and the second guide plate 22. Wherein, the first guide plate 21 is formed with a plurality of first through holes 211, the second guide plate 22 is formed with a plurality of second through holes 221, and the positions of the plurality of second through holes 221 respectively correspond to The positions of the plurality of first through holes 211, and the diameter of each second through hole 221 is not larger than the diameter of the first through hole 211.

多個矩形探針3大致呈矩陣狀排列並穿設於定位座體2,上述多個矩形探針3的一端分別穿出第一導板21的多個第一貫孔211,而多個矩形探針3的另一端分別穿出第二導板22的多個第二貫孔221。也就是說,所述每個矩形探針3是依序穿設於上述第一導板21的相對應第一貫孔211、間隔板23、及第二導板22的相對應第二貫孔221,而穿出上述定位座體2的每個矩形探針3的相反兩側部位分別定義為一第一接觸段31與一第二接觸段32,並且多個矩形探針3的第一接觸段31分別抵接於上述轉接板1的多個電性接點12。 A plurality of rectangular probes 3 are arranged substantially in a matrix and pass through the positioning base 2. One end of each of the plurality of rectangular probes 3 passes through a plurality of first through holes 211 of the first guide plate 21, and a plurality of rectangles are formed. The other ends of the probes 3 respectively pass through the second through holes 221 of the second guide plate 22. That is to say, each of the rectangular probes 3 is sequentially passed through the corresponding first through hole 211, the spacer 23, and the corresponding second through hole of the first guide plate 21. 221, and the opposite sides of each rectangular probe 3 passing through the positioning base 2 are respectively defined as a first contact section 31 and a second contact section 32, and the first contacts of the plurality of rectangular probes 3 The segments 31 respectively abut on the plurality of electrical contacts 12 of the above-mentioned adapter board 1.

進一步地說,所述每個第一接觸段31與相對應電性接點12之間的連接為凹凸配合(如:具備緊配合效果的凹凸配合構造)且能在一相對位移量內保持彼此接觸,以使每個第一接觸段31與相對應電性接點12的相對位置能在所述相對位移量內被調整,而令所述多個矩形探針3的第二接觸段32末端緣大致彼此對齊。於本實施例中,所述相對位移量為10微米(μm)以下、較佳為5微米以下。再者,本實施例中的”大致彼此對齊”是指任兩個第二接觸段32末端緣之間的高度差為10微米以下,其遠小於多個矩形探針3之間的長度公差(約50微米)、或是多個電性接點12在高度上的公差(約50微米)。 Further, the connection between each first contact segment 31 and the corresponding electrical contact 12 is a concave-convex fit (such as a concave-convex fit structure with a tight-fitting effect) and can maintain each other within a relative displacement amount. Making contact so that the relative position of each first contact segment 31 and the corresponding electrical contact 12 can be adjusted within the relative displacement, so that the ends of the second contact segments 32 of the plurality of rectangular probes 3 The edges are approximately aligned with each other. In this embodiment, the relative displacement is 10 micrometers (μm) or less, and preferably 5 micrometers or less. Furthermore, the phrase “substantially aligned with each other” in this embodiment means that the height difference between the end edges of any two second contact segments 32 is 10 micrometers or less, which is much smaller than the length tolerance between the rectangular probes 3 ( (About 50 microns), or the height tolerance (about 50 microns) of the plurality of electrical contacts 12.

換個角度來說,所述相對位移量於本實施例中能夠用來吸收上述多個矩形探針3之間的長度公差及多個電性接點12在高度上的公差。舉例來說,如圖2所示,位在左右兩外側但具有不同長度的兩個矩形探針3,其第一接觸段31在插入兩個電性接點12的凹槽121內時,該兩個第一接觸段31能在相對位移量內移動不同的距離,以使該兩個外側矩形探針3的第二接觸段32末端緣大致呈共平面。再者,如圖2所示,位在左側與中央且具有相同長度的兩個矩形探針3,其第一接觸段31在插入具有不同深度的兩 個凹槽121內時,該兩個第一接觸段31能在相對位移量內移動相同的距離,以使該兩個左側矩形探針3的第二接觸段32末端緣大致呈共平面。 To put it another way, the relative displacement amount can be used to absorb the length tolerance between the plurality of rectangular probes 3 and the height tolerance of the plurality of electrical contacts 12 in this embodiment. For example, as shown in FIG. 2, when two rectangular probes 3 located on the left and right outer sides but having different lengths, the first contact segments 31 of the two rectangular probes 3 are inserted into the grooves 121 of the two electrical contacts 12. The two first contact sections 31 can move different distances within the relative displacement, so that the end edges of the second contact sections 32 of the two outer rectangular probes 3 are substantially coplanar. Furthermore, as shown in FIG. 2, two rectangular probes 3 having the same length are located on the left and center, and the first contact segments 31 of the two probes are inserted into two probes having different depths. In the two grooves 121, the two first contact sections 31 can move the same distance within the relative displacement, so that the end edges of the second contact sections 32 of the two left rectangular probes 3 are substantially coplanar.

更詳細地說,所述每個第一接觸段31具有一自由端部311,並且上述自由端部311的寬度較佳是小於相對應電性接點12的寬度;而於每個矩形探針3及相對應電性接點12中,上述自由端部311於所述相對位移量內可移動地插設於電性接點12的凹槽121內,並且所述自由端部311抵接於上述凹槽121的內側壁,而所述自由端部311與凹槽121的槽底相隔有一距離。 In more detail, each of the first contact sections 31 has a free end portion 311, and the width of the free end portion 311 is preferably smaller than the width of the corresponding electrical contact 12; and each rectangular probe In 3 and the corresponding electrical contact 12, the free end portion 311 is movably inserted into the groove 121 of the electrical contact 12 within the relative displacement amount, and the free end portion 311 abuts on The inner side wall of the groove 121 is separated from the bottom of the groove 121 by a distance.

此外,由於所述間隔板23以及每個矩形探針3在其第一接觸段31與第二接觸段32之間的部位是與本發明的改良重點的相關性較低,所以下述不詳加說明。再者,本實施例探針卡裝置100是限定使用矩形探針3,其可以是由微機電系統(MEMS)技術所製造,所以本實施例是排除製造工序截然不同的圓形探針。換句話說,本實施例的矩形探針3相較於圓形探針來說,由於兩者的製造工序截然不同,所以並未有彼此參考的動機存在。 In addition, since the portion of the spacer plate 23 and each rectangular probe 3 between the first contact section 31 and the second contact section 32 thereof has a low correlation with the improvement point of the present invention, the following details are not added. Instructions. Furthermore, the probe card device 100 of this embodiment is limited to the use of rectangular probes 3, which may be manufactured by micro-electromechanical systems (MEMS) technology, so this embodiment is to exclude circular probes with completely different manufacturing processes. In other words, compared with the round probe, the rectangular probe 3 of this embodiment has different manufacturing processes, so there is no motivation to refer to each other.

另,雖然本實施例的多個矩形探針3及其分別搭配的多個電性接點12構造皆大致相同,但在本發明未繪示的實施例中,所述探針卡裝置100的多個矩形探針3其分別搭配的多個電性接點12也可以是形成彼此相異的構造。再者,本實施例探針卡裝置100的具體結構能夠依據設計者的需求而加以調整與改變,而不受限於圖2所示。 In addition, although the structures of the plurality of rectangular probes 3 and the multiple electrical contacts 12 respectively matched in this embodiment are substantially the same, in an embodiment not shown in the present invention, the probe card device 100 The plurality of rectangular probes 3 and the plurality of electrical contacts 12 respectively matched with each other may have different structures. Furthermore, the specific structure of the probe card device 100 in this embodiment can be adjusted and changed according to the needs of the designer, and is not limited to that shown in FIG. 2.

舉例來說,如圖4所示,在每個矩形探針3及相對應電性接點12中,所述電性接點12的凹槽121截面大致呈梯形,而矩形探針3的自由端部311截面形狀則是對應於上述凹槽121截面的形狀。也就是說,當自由端部311在凹槽121內移動時,上述自 由端部311的側緣能保持接觸於凹槽121的內側壁,並且隨著自由端部311插入凹槽121越深處,所述自由端部311與凹槽121之間的作用力越大(如:緊配合)。 For example, as shown in FIG. 4, in each rectangular probe 3 and the corresponding electrical contact 12, the groove 121 of the electrical contact 12 has a substantially trapezoidal cross-section, and the rectangular probe 3 is free. The cross-sectional shape of the end portion 311 is a shape corresponding to the cross-section of the groove 121. That is, when the free end portion 311 moves within the groove 121, the above-mentioned self- The side edge of the end portion 311 can be kept in contact with the inner side wall of the groove 121, and the deeper the free end portion 311 is inserted into the groove 121, the greater the force between the free end portion 311 and the groove 121 (Eg: tight fit).

再者,如圖5所示,在每個矩形探針3及相對應電性接點12中,所述自由端部311包含有兩個接觸臂3111,並且上述兩個接觸臂3111之間的距離,其由所述第二接觸段32朝向第一接觸段31的方向逐漸地增加。具體來說,上述兩個接觸臂3111在未插入凹槽121時大致彼此平行;而在該兩個接觸臂3111插入凹槽121之後,兩個接觸臂3111的末端緣頂抵於凹槽121槽底而彼此向外彎折,並且隨著該兩個接觸臂3111插入凹槽121越深處,上述兩個接觸臂3111的末端緣距離越大。 Furthermore, as shown in FIG. 5, in each of the rectangular probes 3 and the corresponding electrical contacts 12, the free end portion 311 includes two contact arms 3111, and a distance between the two contact arms 3111. The distance gradually increases from the second contact section 32 toward the first contact section 31. Specifically, the two contact arms 3111 are substantially parallel to each other when the groove 121 is not inserted. After the two contact arms 3111 are inserted into the groove 121, the end edges of the two contact arms 3111 abut against the groove 121. The two contact arms 3111 are bent outward from each other, and as the two contact arms 3111 are inserted deeper into the groove 121, the distance between the ends of the two contact arms 3111 is larger.

[實施例二] [Example 2]

如圖6和圖7所示,其為本發明的實施例二,本實施例與上述實施例一類似,兩者相同的技術特徵則不再加以贅述,本實施例與上述實施例一的主要差異如下所載。 As shown in FIG. 6 and FIG. 7, this is a second embodiment of the present invention. This embodiment is similar to the first embodiment described above, and the same technical features of the two are not described again. The main features of this embodiment and the first embodiment are as follows. The differences are set out below.

具體來說,如圖6所示,本實施例在每個矩形探針3及相對應電性接點12中,所述電性接點12是突伸出上述轉接板1的板面11,並且所述凹槽121自該電性接點12的末端面凹設所形成。其中,所述凹槽121於本實施例中是位在上述轉接板1的板面11外側,但本發明不受限於此。 Specifically, as shown in FIG. 6, in this embodiment, in each of the rectangular probes 3 and the corresponding electrical contacts 12, the electrical contacts 12 are protruding from the board surface 11 of the adapter board 1. The groove 121 is formed by being recessed from the end surface of the electrical contact 12. The groove 121 is located outside the plate surface 11 of the adapter plate 1 in this embodiment, but the present invention is not limited thereto.

再者,如圖7所示,所述每個矩形探針3能在其自由端部311側緣延伸形成有多個倒刺312,並且上述多個倒刺312能夠刺入凹槽121的內側壁,以提升矩形探針3與相對應電性接點12的電性連接效果。其中,任一個倒刺312與自由端部311側緣之間的距離較佳是由所述第二接觸段32朝向第一接觸段31的方向逐漸地縮小,但本發明不受限於此。 Further, as shown in FIG. 7, each of the rectangular probes 3 can be formed with a plurality of barbs 312 on the side edge of the free end portion 311 thereof, and the plurality of barbs 312 can be inserted into the groove 121. The side wall to improve the electrical connection effect of the rectangular probe 3 and the corresponding electrical contact 12. The distance between any one barb 312 and the side edge of the free end 311 is preferably gradually reduced from the second contact section 32 toward the first contact section 31, but the present invention is not limited thereto.

[實施例三] [Example Three]

如圖8所示,其為本發明的實施例三,本實施例與上述實施例一類似,兩者相同的技術特徵則不再加以贅述,本實施例與上述實施例一的主要差異如下所載。 As shown in FIG. 8, this is the third embodiment of the present invention. This embodiment is similar to the first embodiment described above, and the same technical features of the two will not be described again. The main differences between this embodiment and the first embodiment are as follows. Set.

具體來說,本實施例在每個矩形探針3及相對應電性接點12中,所述電性接點12未形成有凹槽121、但包含有突伸出上述轉接板1板面11的一凸塊122,所述矩形探針3的自由端部311形成有一凹槽3112,並且所述凹槽3112於所述相對位移量內可移動地套設在該電性接點12的凸塊122內,而所述凸塊122與凹槽3112的槽底相隔有一距離。 Specifically, in this embodiment, in each of the rectangular probes 3 and the corresponding electrical contacts 12, the electrical contacts 12 are not formed with the groove 121, but include a plate protruding from the adapter plate 1 described above. A bump 122 on the surface 11, a free end portion 311 of the rectangular probe 3 is formed with a groove 3112, and the groove 3112 is movably sleeved on the electrical contact 12 within the relative displacement amount. Inside the protruding block 122, and the protruding block 122 is separated from the bottom of the groove 3112 by a distance.

[實施例四] [Example 4]

如圖9所示,其為本發明的實施例四,本實施例與上述實施例一類似,兩者相同的技術特徵則不再加以贅述,本實施例與上述實施例一的主要差異如下所載。 As shown in FIG. 9, this is Embodiment 4 of the present invention. This embodiment is similar to the above-mentioned Embodiment 1. The same technical features of the two are not described again. The main differences between this embodiment and the above-mentioned Embodiment 1 are as follows. Set.

具體來說,本實施例的探針卡裝置100進一步包含有設置於多個電性接點12凹槽121內的多個緩衝體4。而於每個矩形探針3、相對應電性接點12、及相對應緩衝體4中,所述緩衝體4受壓迫地抵接於所述矩形探針3的自由端部311以及電性接點12的凹槽121槽底。其中,所述相對位移量小於上述緩衝體4的彈性壓縮量,並且緩衝體4的彈性壓縮量例如是50微米以下。再者,所述緩衝體4的彈性模量大於矩形探針3的彈性模量,並且所述緩衝體4的彈性模量較佳為65GPa,而所述矩形探針3的彈性模量較佳為60GPa,但本發明不受限於此。 Specifically, the probe card device 100 of this embodiment further includes a plurality of buffer bodies 4 disposed in the grooves 121 of the plurality of electrical contacts 12. In each rectangular probe 3, the corresponding electrical contact 12, and the corresponding buffer body 4, the buffer body 4 is pressed against the free end portion 311 of the rectangular probe 3 and the electrical property. The groove 121 of the contact 12 has a groove bottom. The relative displacement is smaller than the elastic compression amount of the buffer body 4, and the elastic compression amount of the buffer body 4 is, for example, 50 μm or less. Furthermore, the elastic modulus of the buffer body 4 is greater than that of the rectangular probe 3, and the elastic modulus of the buffer body 4 is preferably 65 GPa, and the elastic modulus of the rectangular probe 3 is better It is 60 GPa, but the present invention is not limited to this.

再者,所述每個緩衝體4於本實施例中可以是由導電材質(如:金、銀、銅)或是非導電材質(如:高分子材料)所製成,本發明在此不加以限制。 Furthermore, in this embodiment, each of the buffer bodies 4 may be made of a conductive material (such as gold, silver, copper) or a non-conductive material (such as a polymer material), which is not described in the present invention. limit.

[本發明實施例的技術效果] [Technical effect of the embodiment of the present invention]

綜上所述,本發明實施例所公開的探針卡裝置100及其信號傳輸模組M,能夠通過可以在相對位移量內調整彼此相對位置且保持彼此接觸的每個第一接觸段31與相對應電性接點12之結構設計,藉以吸收上述多個矩形探針3之間的長度公差及多個電性接點12在高度上的公差,進而使多個矩形探針3的第二接觸段32末端緣大致彼此對齊,並有效地提升所述探針卡裝置100的量測精準度。 In summary, the probe card device 100 and its signal transmission module M disclosed in the embodiments of the present invention can be adjusted by each of the first contact segments 31 and Corresponding to the structural design of the electrical contacts 12, so as to absorb the length tolerances between the plurality of rectangular probes 3 and the height tolerances of the plurality of electrical contacts 12, the second The end edges of the contact segments 32 are substantially aligned with each other, and effectively improve the measurement accuracy of the probe card device 100.

再者,所述探針卡裝置100能在每個電性接點12的凹槽121內進一步設有緩衝體4,並且上述緩衝體4能受壓迫地抵接於矩形探針3的自由端部311以及電性接點12的凹槽121槽底,藉以在矩形探針3插入凹槽121的過程中,通過上述緩衝體4提供回彈與吸震的功能,進而進一步提升多個矩形探針3的第二接觸段32末端緣的共面度。 Furthermore, the probe card device 100 can further be provided with a buffer body 4 in the groove 121 of each electrical contact 12, and the buffer body 4 can be pressed against the free end of the rectangular probe 3 under pressure. The bottom of the groove 121 of the portion 311 and the electrical contact 12 is used to provide the rebound and shock absorption functions through the buffer body 4 during the insertion of the rectangular probe 3 into the groove 121, thereby further improving a plurality of rectangular probes. Coplanarity of the end edge of the second contact segment 32 of 3.

以上所述僅為本發明的優選可行實施例,並非用來侷限本發明的保護範圍,凡依本發明申請專利範圍所做的均等變化與修飾,皆應屬本發明的權利要求書的保護範圍。 The above are only the preferred and feasible embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. Any equal changes and modifications made in accordance with the scope of patent application of the present invention shall fall within the protection scope of the claims of the present invention .

Claims (9)

一種探針卡裝置,包括:一轉接板,包含有一板面及位於所述板面的多個電性接點;一定位座體,對應設置於多個所述電性接點的一側;以及多個矩形探針,設置於所述定位座體,並且每個所述矩形探針包含有位於相反兩側且穿出所述定位座體的一第一接觸段與一第二接觸段,並且多個所述矩形探針的所述第一接觸段分別抵接於多個所述電性接點;其中,每個所述第一接觸段與相對應的所述電性接點之間的連接為凹凸配合且能在一相對位移量內保持彼此接觸,以使每個所述第一接觸段與相對應所述電性接點的相對位置能在所述相對位移量內被調整,而令多個所述矩形探針的所述第二接觸段末端緣彼此對齊;其中,所述相對位移量為10微米(μm)以下;其中,於每個所述矩形探針及相對應所述電性接點中,所述電性接點包含有一凹槽,所述第一接觸段的一自由端部於所述相對位移量內可移動地插設於所述凹槽,並且所述自由端部抵接於所述凹槽的內側壁,而所述自由端部與所述凹槽的槽底相隔有一距離;其中,於每個所述矩形探針及相對應所述電性接點中,所述電性接點突伸出所述板面,並且所述凹槽自所述電性接點的末端面凹設所形成。A probe card device includes: an adapter board including a board surface and a plurality of electrical contacts located on the board surface; a positioning base corresponding to one side of the plurality of electrical contacts And a plurality of rectangular probes disposed on the positioning base, and each of the rectangular probes includes a first contact segment and a second contact segment located on opposite sides and penetrating the positioning base. And the first contact sections of the plurality of rectangular probes respectively abut against the plurality of electrical contacts; wherein each of the first contact sections is corresponding to one of the corresponding electrical contacts. The connection between them is a concave-convex fit and can maintain contact with each other within a relative displacement, so that the relative position of each of the first contact segments and the corresponding electrical contact can be adjusted within the relative displacement. , So that the end edges of the second contact segments of the plurality of rectangular probes are aligned with each other; wherein the relative displacement is less than 10 micrometers (μm); wherein each of the rectangular probes and the corresponding In the electrical contact, the electrical contact includes a groove, and the A free end portion is movably inserted into the groove within the relative displacement amount, and the free end portion abuts an inner side wall of the groove, and the free end portion and the groove The bottoms of the slots are separated by a distance; in each of the rectangular probes and the corresponding electrical contacts, the electrical contacts protrude from the board surface, and the grooves extend from the board. The end surface of the electrical contact is formed by being recessed. 如請求項1所述的探針卡裝置,其進一步包含有設置於多個所述電性接點的所述凹槽內的多個緩衝體;其中,於每個所述矩形探針、相對應所述電性接點、及相對應所述緩衝體中,所述緩衝體受壓迫地抵接於所述自由端部以及所述凹槽的所述槽底。The probe card device according to claim 1, further comprising a plurality of buffer bodies disposed in the grooves of the plurality of electrical contacts; Corresponding to the electrical contacts and corresponding to the buffer body, the buffer body abuts against the free end portion and the groove bottom of the groove under pressure. 如請求項1所述的探針卡裝置,其中,於每個所述矩形探針及相對應所述電性接點中,所述自由端部的寬度小於所述電性接點的寬度。The probe card device according to claim 1, wherein in each of the rectangular probes and the corresponding electrical contacts, a width of the free end portion is smaller than a width of the electrical contacts. 如請求項1所述的探針卡裝置,其中,所述凹槽位在所述轉接板的所述板面外側。The probe card device according to claim 1, wherein the groove is located outside the board surface of the adapter board. 如請求項1所述的探針卡裝置,其中,於每個所述矩形探針及相對應所述電性接點中,所述矩形探針在所述自由端部側緣延伸形成有多個倒刺,並且多個所述倒刺是刺入所述凹槽的所述內側壁。The probe card device according to claim 1, wherein in each of the rectangular probes and the corresponding electrical contacts, the rectangular probes are extended at a side edge of the free end to form a plurality of Barbs, and multiple barbs are pierced into the inner side wall of the groove. 如請求項1所述的探針卡裝置,其中,所述相對位移量進一步限定為5微米以下。The probe card device according to claim 1, wherein the relative displacement is further limited to 5 μm or less. 一種探針卡裝置的信號傳輸模組,包括:一轉接板,包含有一板面及位於所述板面的多個電性接點;以及多個矩形探針,各包含有位於相反兩側的一第一接觸段與一第二接觸段,並且多個所述矩形探針的所述第一接觸段分別抵接於多個所述電性接點;其中,每個所述第一接觸段與相對應的所述電性接點之間的連接為凹凸配合且能在一相對位移量內保持彼此接觸,以使每個所述第一接觸段與相對應所述電性接點的相對位置能在所述相對位移量內被調整,而令多個所述矩形探針的所述第二接觸段末端緣彼此對齊;其中,所述相對位移量為10微米以下;其中,於每個所述矩形探針及相對應所述電性接點中,所述電性接點包含有一凹槽,所述第一接觸段的一自由端部於所述相對位移量內可移動地插設於所述凹槽,並且所述自由端部抵接於所述凹槽的內側壁,而所述自由端部與所述凹槽的槽底相隔有一距離;其中,於每個所述矩形探針及相對應所述電性接點中,所述電性接點突伸出所述板面,並且所述凹槽自所述電性接點的末端面凹設所形成。A signal transmission module of a probe card device includes: an adapter board including a board surface and a plurality of electrical contacts located on the board surface; and a plurality of rectangular probes each including opposite sides A first contact segment and a second contact segment, and the first contact segments of the plurality of rectangular probes respectively abut a plurality of the electrical contacts; wherein each of the first contacts The connection between the segment and the corresponding electrical contact is a concave-convex fit and can maintain contact with each other within a relative displacement, so that each of the first contact segments and the corresponding electrical contact are The relative position can be adjusted within the relative displacement amount, so that the end edges of the second contact segments of the plurality of rectangular probes are aligned with each other; wherein the relative displacement amount is 10 μm or less; Among the rectangular probes and the corresponding electrical contacts, the electrical contacts include a groove, and a free end portion of the first contact section is movably inserted within the relative displacement amount. Is provided in the groove, and the free end portion abuts an inner side wall of the groove The free end is separated from the bottom of the groove by a distance; wherein, in each of the rectangular probes and the corresponding electrical contacts, the electrical contacts protrude from the A plate surface, and the groove is formed by being recessed from the end surface of the electrical contact. 如請求項7所述的探針卡裝置的信號傳輸模組,其中,所述凹槽位在所述轉接板的所述板面外側。The signal transmission module of the probe card device according to claim 7, wherein the groove is located outside the board surface of the adapter board. 如請求項7所述的探針卡裝置的信號傳輸模組,其中,於每個所述矩形探針及相對應所述電性接點中,所述矩形探針在所述自由端部側緣延伸形成有多個倒刺,並且多個所述倒刺是刺入所述凹槽的所述內側壁。The signal transmission module of the probe card device according to claim 7, wherein in each of the rectangular probes and the corresponding electrical contacts, the rectangular probe is on the free end side The edge extends to form a plurality of barbs, and the plurality of barbs are pierced into the inner side wall of the groove.
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200737388A (en) * 2006-03-28 2007-10-01 Taiwan Semiconductor Mfg Co Ltd Space transformer substrate, method of forming the same, and pad structure thereof
US20080020566A1 (en) * 2005-04-21 2008-01-24 Endicott Interconnect Technologies, Inc. Method of making an interposer
TW201518733A (en) * 2013-11-04 2015-05-16 Via Tech Inc Probe card
TWM529167U (en) * 2016-06-08 2016-09-21 中華精測科技股份有限公司 Probe device of vertical probe card
TWI596346B (en) * 2016-08-24 2017-08-21 中華精測科技股份有限公司 Probe device of vertical probe card

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080020566A1 (en) * 2005-04-21 2008-01-24 Endicott Interconnect Technologies, Inc. Method of making an interposer
TW200737388A (en) * 2006-03-28 2007-10-01 Taiwan Semiconductor Mfg Co Ltd Space transformer substrate, method of forming the same, and pad structure thereof
TW201518733A (en) * 2013-11-04 2015-05-16 Via Tech Inc Probe card
TWM529167U (en) * 2016-06-08 2016-09-21 中華精測科技股份有限公司 Probe device of vertical probe card
TWI596346B (en) * 2016-08-24 2017-08-21 中華精測科技股份有限公司 Probe device of vertical probe card

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