TWI666438B - Humidity detection device - Google Patents

Abstract

An object of the present invention is to provide a humidity detection device that can stabilize the capacitance of a reference capacitor portion and suppress variations in humidity detection characteristics. One aspect of the present invention is a humidity detection device including a base material, a reference portion provided on the base material, and a humidity detection portion provided on the reference portion. As another aspect, further comprising: a lower electrode provided on the base material; a first dielectric portion provided on the lower electrode; and an intermediate electrode provided on the first dielectric portion; The second dielectric portion is provided on the intermediate electrode; and the upper electrode is provided on the second dielectric portion; and the reference portion is constituted by the lower electrode, the first dielectric portion, and the intermediate electrode. The reference capacitor section includes a humidity detecting capacitor section including a top electrode, a second dielectric section, and an intermediate electrode.

Description

Humidity detection device

The present invention relates to a humidity detection device. More specifically, the present invention relates to a humidity detection device provided with two electrodes and a dielectric portion of a moisture sensing portion.

As a humidity detection device, a configuration is known in which a moisture-sensitive portion is provided between two electrodes and the humidity is detected based on a change in capacitance or resistance. Among them, a device (capacitive humidity detection device) that detects humidity based on changes in electrostatic capacitance includes: a reference capacitor section that is not affected by the humidity of the outside air; and a humidity detection capacitor section that has a capacitance that Variety.

The reference capacitor section has a structure in which moisture does not enter from outside air, and it has a specific capacitor irrespective of humidity. On the other hand, the humidity detecting capacitor has a structure in which moisture can invade from outside air, and has a structure in which the capacitance changes in accordance with humidity. In the capacitive humidity detection device, the relative humidity is calculated based on the difference between the output voltage from the detection capacitor section and the output voltage from the reference capacitor section.

As described above, in the humidity detection device, a part necessary for the humidity detection of the capacitor portion for detection is exposed to the outside air, and the other parts are covered with a protective member.

Patent Document 1 discloses a humidity sensor which can more effectively suppress the adhesion of the protective gel portion to the moisture-sensitive film. The humidity sensor includes a humidity detection section, a pad section covered with a protective gel section, and a bank section for suppressing a flow of the protection gel section from the pad section side to the humidity detection section side.

Patent Document 2 discloses a humidity sensor package which is inexpensive and has excellent waterproofness and dustproofness. The humidity sensor package is provided with: a humidity sensor that measures a change in humidity; a protective member that is formed protruding from the humidity sensor and has a moisture absorption that exposes a moisture-sensitive portion of the humidity sensor to outside air And a sealing resin that covers the humidity sensor in a state where the protective member is exposed. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2012-251933 [Patent Document 2] Japanese Patent Laid-Open No. 2011-151225

[Problems to be solved by the invention]

In a capacitive humidity detection device, the capacitance of the reference portion that becomes the reference when performing humidity detection must be stable. For example, when a protective member other than a part necessary for detecting humidity is provided, the capacitance of the reference portion may be affected by the intrusion of moisture into the protective member. In addition, due to structural differences between the reference portion and the humidity detection portion or differences in the sealing structure, the stress applied to the humidity detection portion and the reference portion is unbalanced, which may cause variations in capacitance, temperature characteristics, and hysteresis.

An object of the present invention is to provide a humidity detection device that can stabilize the capacitance of a reference portion and suppress the detection of humidity fluctuations. [Technical means to solve the problem]

In order to solve the above-mentioned problem, one aspect of the present invention is a humidity detection device including a base material, a reference portion provided on the base material, and a humidity detection portion provided on the reference portion. According to this humidity detection device, since the reference portion and the humidity detection portion are laminated on the base material, the humidity detection portion functions as a protective member covering the reference portion, and it is not necessary to cover the reference portion with another protective material. Furthermore, the structure of the reference portion and the humidity detection portion is laminated to suppress structural imbalances and stabilize the humidity detection characteristics.

In the above-mentioned humidity detection device, the reference portion may be covered by the humidity detection portion in order to prevent moisture from entering the reference portion from the outside. Thereby, the humidity detection part functions as a protective member as a reference part.

The humidity detection device further includes a lower electrode provided on the base material, a first dielectric portion provided on the lower electrode, and an intermediate electrode provided on the first dielectric portion. ; A second dielectric portion provided on the intermediate electrode; and an upper electrode provided on the second dielectric portion; and may be constituted by the lower electrode, the first dielectric portion, and the intermediate electrode The reference capacitor portion of the reference portion includes a humidity detection capacitor portion of the humidity detection portion by an upper electrode, a second dielectric portion, and an intermediate electrode.

According to this configuration, since the reference capacitor portion and the humidity detection capacitor portion are laminated on the base material, the reference capacitor portion is disposed between the base material and the humidity detection capacitor portion. Therefore, the humidity detecting capacitor portion functions as a protective member covering the reference capacitor portion, and it is not necessary to cover the reference capacitor portion with another protective material. Furthermore, the structure of the reference capacitor portion and the humidity detection capacitor portion is laminated to suppress the structural imbalance and stabilize the humidity detection characteristics.

In the above-mentioned humidity detection device, a moisture-sensing hole may be provided in the upper electrode. Thereby, the moisture of the outside air easily penetrates from the sensing wet hole and reaches the second dielectric portion between the upper electrode and the central electrode.

In the above-mentioned humidity detection device, at least the lower electrode, the first dielectric portion, and the intermediate electrode may be covered with a protective layer. Such a protective layer can more effectively suppress the intrusion of moisture into the first dielectric portion.

The above-mentioned humidity detection device may further include a frame portion provided on the base material and provided so as to surround the reference portion and the outside of the humidity detection portion. Thereby, the reference part and the humidity detection part can be accommodated inside (inside the frame) the frame part.

In the above-mentioned humidity detection device, the frame portion may be formed of silicon. Thereby, a frame part can be comprised by the workability and hardness of silicon.

In the above-mentioned humidity detection device, the surface on the substrate side of the frame portion may include: a first region that is halfway from the inner peripheral surface to an outer peripheral surface; and a second region that is closer to the outer periphery than the first region. On the surface side, an adhesive agent for adhering the frame portion to the substrate is provided in the second area, and an adhesive agent is not provided in the first area. In this case, the surface on the substrate side of the frame portion in the first region is in a state of directly contacting the substrate or the exposed surface of a member (lead wire, etc.) provided on the substrate. Take this. The adhesive agent may be provided so as not to be exposed inside the frame portion, and the detection capacitor portion and the reference capacitor portion housed inside the frame portion (inside the frame) and the adhesive agent for adhering the frame portion can be reliably separated.

In the above-mentioned humidity detection device, the surface on the substrate side of the frame portion may further include a third region closer to the outer peripheral surface side than the second region, and an adhesive agent may not be provided in the third region. Accordingly, since the adhesive is surrounded by the first region and the third region of the frame portion, it is possible to effectively suppress moisture from entering the adhesive from outside air.

The humidity detection device may further include a sealing resin surrounding the outside of the frame portion. Thereby, in a state where the reference capacitor portion and the humidity detection capacitor portion are housed inside (inside the frame) the frame portion, a packaging structure can be formed that surrounds the outside of the frame portion with a sealing resin. [Effect of the invention]

According to the present invention, it is possible to provide a humidity detection device that stabilizes the capacitance of the reference portion and suppresses variations in humidity detection characteristics.

Hereinafter, embodiments of the present invention will be described based on the drawings. In the following description, the same components are denoted by the same reference numerals, and descriptions of components that have already been described are appropriately omitted.

(Configuration of Humidity Detection Device) Figs. 1 (a) and 1 (b) are diagrams illustrating a humidity detection device according to this embodiment. A sectional view of the humidity detection device 1 is shown in FIG. 1 (a), and a top view of the humidity detection device 1 is shown in FIG. 1 (b). The sectional view shown in FIG. 1 (a) is an enlarged sectional view of a portion A shown in FIG. 1 (b).

As shown in FIG. 1, the humidity detection device 1 of this embodiment is a device that detects the humidity of the outside air as an electrical signal, and includes a reference portion 20 provided on the base material 50 and Upper humidity detection section 10. The humidity detection device 1 detects humidity based on a capacitance difference between the humidity detection section 10 and the reference section 20.

As the base material 50, for example, silicon is used. A first insulating layer 55 such as silicon oxide is formed on the first main surface 50 a of the base material 50, and a humidity detecting section 10 and a reference section 20 are formed on the first insulating layer 55. Further, a pad electrode 15 is provided on the first insulating layer 55 to conduct the humidity detection section 10 and the reference section 20 through the lead-out wiring 12.

On the first insulating layer 55 of the substrate 50, a lower electrode 110, a first dielectric portion 210, an intermediate electrode 130, a second dielectric portion 220, and an upper electrode 120 are sequentially laminated. As the lower electrode 110, the intermediate electrode 130, and the upper electrode 120, for example, ruthenium (Ru) is used. The first dielectric portion 210 and the second dielectric portion 220 are, for example, polyimide-based resin or silicon oxide.

In this way, the lower electrode 110, the first dielectric portion 210, the intermediate electrode 130, the first dielectric portion 210, and the upper electrode 120 are laminated by the lower electrode 110, the first dielectric portion 210, and the intermediate electrode 130. Reference section (reference capacitor section) 20. In addition, the upper electrode 120, the second dielectric portion 220, and the intermediate electrode 130 constitute a humidity detection section (humidity detection capacitor section) 10. That is, the middle electrode 130 serves as a common electrode, and among the three electrodes, the lower electrode 110 is closer to the substrate 50 side than the intermediate electrode 130, and the upper electrode 120 is located closer to the substrate 50 on the opposite side than the intermediate electrode 130. Two of them constitute the reference unit 20, and two of them constitute the humidity detection unit 10 on the opposite side from the base material 50.

A plurality of moisture-sensing holes 121 are provided in the upper electrode 120. The moisture from the outside passes through the moisture-sensing hole 121 and reaches the second dielectric portion 220. The second dielectric portion 220 functions as a moisture-sensitive portion, and the dielectric constant of the second dielectric portion 220 changes according to the amount of water contained in the second dielectric portion 220. As a result, the electrostatic capacitance between the upper electrode 120 and the middle electrode 130 changes, and humidity can be detected based on the changed electrostatic capacitance.

On the other hand, the first dielectric portion 210 of the reference portion 20 does not function as a moisture-sensitive layer. That is, since there is no change in the external humidity and the dielectric constant of the first dielectric portion 210 hardly changes, the electrostatic capacitance between the lower electrode 110 and the intermediate electrode 130 is substantially constant. Therefore, the relative humidity can be detected from the difference between the output voltage of the electrostatic capacitance of the reference section 20 and the output voltage of the electrostatic capacitance of the humidity detection section 10.

A frame portion 60 is provided around the laminated structure of the humidity detection portion 10 and the reference portion 20. The frame portion 60 is formed by etching silicon to form a frame type, and is connected via an adhesive 65. By using silicon as the frame portion 60, the frame portion 60 can be constituted by the workability and hardness of silicon. Since the humidity detection unit 10 and the reference unit 20 are disposed in the opening 601 of the frame portion 60, the external moisture-sensing wet hole 121 is taken from the opening 601 to the second dielectric portion 220.

In this embodiment, since the reference portion 20 and the humidity detection portion 10 are laminated on the first main surface 50 a of the base material 50, the reference portion 20 is disposed between the base material 50 and the humidity detection portion 10. In other words, the humidity detection unit 10 covers the reference unit 20, and the humidity detection unit 10 functions as a protective member that suppresses moisture from entering the reference unit 20 from the outside. Therefore, even if the reference portion 20 is not covered by another protective member, the humidity detecting portion 10 can suppress moisture from entering the first dielectric portion 210 from the outside.

In this embodiment, from the viewpoint of more reliably suppressing the intrusion of moisture into the first dielectric portion 210, at least a portion of the first dielectric portion 210, specifically, a portion of the side surface and the upper surface are It is covered with a protective layer 70 containing a non-wettable material such as a silicon nitride film (SiN). As described above, by completely covering the first dielectric portion 210 with the humidity detection portion 10 and the protective layer 70, moisture can be prevented from entering the humidity detection portion 10. Such a structure can be formed stably by providing the protective layer 70 so as to cover a part of the intermediate electrode 130 shared by the humidity detection section 10 and the first dielectric section 210.

FIG. 2 is a cross-sectional view illustrating a humidity detection device of a reference example. The humidity detection device 2 of the reference example is formed on the first insulating layer 55 provided on the first main surface 50a of the base material 50, and the humidity detection section 10 and the reference section 20 are juxtaposed along the first main surface 50a. .

A common electrode 310 is provided on the first insulating layer 55. A dielectric portion 330 is juxtaposed on the common electrode 310 along the first main surface 50a. A reference electrode 320 is provided on the dielectric portion 330 on one side, and a detection electrode 340 is provided on the dielectric portion 330 on the other side. The reference electrode 20 is configured by the common electrode 310, the dielectric portion 330 on one side, and the reference electrode 320, and the humidity detection portion 10 is configured by the common electrode 310, the dielectric portion 330 on the other side, and the detection electrode 340. .

The frame portion 60 is connected to the substrate 50 by an adhesive 65. The frame portion 60 covers the reference portion 20. This prevents moisture from entering the dielectric portion 330 of the reference portion 20 from the outside. On the other hand, the frame portion 60 is not covered on the humidity detection portion 10. The humidity detection section 10 is disposed in the opening 601 of the frame section 60. Moisture enters the humidity detection unit 10 through the opening 601 of the frame portion 60, and the humidity can be detected.

The humidity detection device 2 of the reference example is a structure in which the humidity detection section 10 and the reference section 20 are juxtaposed on the base material 50, and the frame section 60 is covered on the reference section 20 to prevent moisture from entering the reference section 20. However, since the adhesive 65 of the mounting frame portion 60 has higher hygroscopicity than the frame portion 60, there is a possibility that the moisture absorbed by the adhesive 65 reaches the dielectric portion 330 of the reference portion 20. Especially considering heat resistance, when polyimide is used as the adhesive 65, because of its high hygroscopicity, only part of the side of the adhesive 65 is exposed to absorb moisture, and the moisture reaches the reference portion 20 as time passes. Of the dielectric portion 330. The change in the electrostatic capacitance of the reference section 20 due to the inhalation and discharge of the moisture causes the humidity detection accuracy to become unstable.

In addition, as in the humidity detection device 2 of the reference example, the humidity detection section 10 and the reference section 20 are juxtaposed, and only when the reference section 20 covers the frame section 60 through the adhesive 65, and the humidity detection section 10 is open, a structural difference occurs. unbalanced. Therefore, stress is preferably applied to the reference portion 20 from the frame portion 60 or the adhesive 65. Since the bonding state and the like of the frame 60 are different for each device, the magnitude of the applied stress is different for each device. The electrostatic capacitance of the humidity detection section 10 and the reference section 20 changes according to the stress. Therefore, the deviation of the applied stress of each device changes the electrostatic capacitance, which changes the humidity detection characteristics of each device (drift of the detection value, temperature characteristics, Lag, etc.). Furthermore, in a configuration in which the outside of the frame portion 60 is covered with a mold resin (sealing resin), stress from the mold resin is also preferentially applied to the reference portion 20. This stress also causes a change in the humidity detection characteristics.

In the present embodiment, the structure of the tandem layer humidity detection unit 10 and the reference unit 20 is in a state where the reference unit 20 is covered by the humidity detection unit 10. This makes it possible to substantially cover the reference portion 20 with a member having low hygroscopicity, and to effectively prevent moisture from entering the first dielectric portion 210 from the outside.

However, the structure of the laminated humidity detection section 10 and the reference section 20 is not covered by the frame section 60, and structural imbalance is suppressed. Therefore, it is difficult for the stress received from the frame portion 60 or the adhesive 65 to cause imbalance in the detection portion 10 and the reference portion 20. Moreover, even if it is the structure which sealed the outer side of the frame part 60 with the mold resin, it is hard to generate | occur | produce the imbalance of the stress received by the humidity detection part 10 and the reference part 20. Therefore, variations in the humidity detection characteristics due to the imbalance are suppressed.

3 (a) and 3 (b) are cross-sectional views illustrating a mold seal. FIG. 3 (a) shows a state where the humidity detection device 1 is installed in the mold 800, and FIG. 3 (b) shows a state after the mold is sealed.

As shown in FIG. 3 (a), the mold 800 is composed of an upper mold 810 and a lower mold 820, and a cavity 850 is provided therebetween in a state where the upper mold 810 and the lower mold 820 are closed. The humidity detection device 1 of this embodiment is arranged in the cavity 850.

In the example shown in FIG. 3 (a), a plurality of humidity detection devices 1 are arranged on one substrate 500. That is, the substrate 500 is divided after the mold is sealed to obtain a humidity detection device 1 having a packaging structure that surrounds the outside of the frame portion 60 with a sealing resin (mold resin 80 shown in FIG. 3 (b)). The substrate 500 may be the base material 50.

When the upper mold 810 and the lower mold 820 are closed, the frame portion 60 of the humidity detection device 1 touches the upper mold 810. When the mold resin is injected into the cavity 850, the mold resin does not enter the frame of the frame portion 60, and the outside of the frame portion 60 is sealed by the mold resin 80.

Here, when the frame portion 60 is not provided, it is necessary to install a male mold at a position corresponding to the position of the frame portion 60 above the mold 810. If such a male mold is provided on the upper mold 810, the structure of the mold 800 becomes complicated, resulting in an increase in cost. By providing the frame portion 60 in this embodiment, the frame portion 60 functions as a male mold, and the structure of the upper mold 810 can be simplified.

(Retracting Structure of Wiring) In the humidity detection device 1 shown in FIGS. 1 (a) and 3 (b), the lead wiring 12 extending from the upper electrode 120 is arranged along the protective layer 70. When the frame portion 60 is mounted, the lead-out wiring 12 is embedded in the adhesive 65. A configuration may also be adopted in which the lead-out wiring 12 and the frame portion 60 are actively separated.

4 (a) and 4 (b) are cross-sectional views showing an example of a withdrawal structure of the lead-out wiring. FIG. 4 (a) is an overall view, and FIG. 4 (b) is an enlarged view of a portion where the wiring 12 is drawn out. In this structure, a via hole 70 h is formed in the protective layer 70. When the lead-out wiring 12 is divided into the first portion 12a, the second portion 12b, and the third portion 12c, the first portion 12a is formed from the upper electrode 120 to the via hole 70h along the protective layer 70, and is turned on A second portion 12b is formed in the hole 70h, and a third portion 12c is formed between the protective layer 70 and the first insulating layer 55. Then, the frame portion 60 is mounted on the third portion 12c. Thereby, at least the protective layer 70 is interposed between the lead-out wiring 12 and the frame portion 60 at the position of the third portion 12c, and the lead-out wiring 12 can be separated from the frame portion 60 at a position where the lead-out wiring 12 and the frame portion 60 overlap. .

(Structure for preventing the adhesive from being exposed) As shown in FIGS. 4 (a) and 4 (b), a structure that prevents the side surface of the adhesive 65 from being exposed by using the shape of the base material 50 side of the frame portion 60 may be employed. For example, as shown in FIGS. 1 (a) and 3 (b), an adhesive 65 is uniformly provided on the surface of the substrate 50 side of the frame portion 60. In this structure, the side surface of the opening 601 side of the adhesive 65 is exposed. If moisture is absorbed from the side of the adhesive 65 exposed to the opening 601 side into the adhesive 65, the absorbed moisture due to the passage of time is discharged to the opening 601 side, and the humidity is detected by the humidity detecting section 10 possibility. In addition, the moisture contained in the mold resin 80 may be released into the frame portion 60 through the adhesive 65, and the humidity based on the released moisture may be detected by the humidity detection unit 10.

Therefore, as shown in FIGS. 4 (a) and 4 (b), the surface on the base material 50 side of the frame portion 60 is divided into a first region 60a which is halfway from the inner peripheral surface to the outer peripheral surface, which is more than the first region 60a. The second region 60b near the outer peripheral surface is provided with an adhesive 65 in the second region 60b, and the adhesive 65 is not provided in the first region 60a.

The first region 60a is convex toward the substrate 50 side, and the second region 60b is concave toward the substrate 50 side. An adhesive 65 is provided in the concave portion of the second region 60b, and the frame portion 60 is fixed by the adhesive 65. The adhesive 65 is not provided on the convex portion of the first region 60a, so the adhesive 65 is not exposed on the opening 601 side of the frame portion 60. Thereby, the humidity detection section 10 and the reference section 20 housed inside (in the frame) of the frame section 60 and the adhesive 65 for adhering the frame section 60 can be reliably separated, and the absorption by the adhesive 65 can be effectively suppressed. Effect of moisture on humidity detection.

5 (a) and 5 (b) are cross-sectional views showing other examples of the withdrawal structure of the lead-out wiring. In the structure shown in FIG. 5 (a), a groove 70a is formed in a part of the protective layer 70, and the lead-out wiring 12 is formed along the groove 70a. The groove 70 a is provided at a position facing at least the first region 60 a of the surface on the base material 50 side of the frame portion 60. By setting the thickness of the lead-out wiring 12 provided in the groove 70a to be the same as the depth of the groove 70a, the surface facing the first region 60a (the upper surface of the lead-out wiring 12 embedded in the groove 70a and the area other than the groove 70a) The upper surface of the protective layer 70 is flat. Therefore, the surface contacted by the first region 60a is flat, and the frame portion 60 can be stably fixed.

In the structure shown in FIG. 5 (b), a second insulating layer 72 is provided on the protective layer 70 and planarized. That is, in order to actively flatten a position facing at least the first region 60a of the frame portion 60, a second insulating layer 72 is provided on the groove 70a of the embedded lead-out wiring 12, and the second insulating layer 72 The surface is flat.

A first via hole 72h1 and a second via hole 72h2 are provided on the second insulating layer 72. The lead-out wiring 12 is divided into a first portion 12a, a second portion 12b, a third portion 12c, a fourth portion 12d, and a fifth portion 12e. The first portion 12a is formed from the upper electrode 120 to the first via hole 72h1 along the protective layer 70 and the second insulating layer 72. The second portion 12b is formed in the first via hole 72h1. The third portion 12c is provided in the groove 70a between the first via hole 72h1 and the second via hole 72h2. The fourth portion 12d is formed in the second via hole 72h2. The fifth portion 12e is formed on the second insulating layer 72 from the second via hole 72h2.

In the case of forming such a structure, after forming the protective layer 70, a groove 70a is formed and a third portion 12c is formed in the groove 70a. Thereafter, a second insulating layer 72 is formed on the protective layer 70. The second insulating layer 72 is made of, for example, silicon nitride (SiN). Next, the surface of the second insulating layer 72 is planarized by CMP (Chemical Mechanical Polishing) or the like.

Next, a first via hole 72h1 and a second via hole 72h2 are formed in the second insulating layer 72, a second portion 12b is embedded in the first via hole 72h1, and a fourth portion 12d is embedded in the second via hole 72h2. Thereafter, the first electrode 12a and the fifth electrode 12e are formed at the same time as the upper electrode 120 is formed.

Thereby, the second insulating layer 72 facing at least the first region 60a of the frame portion 60 is flattened, and the frame portion 60 can be stably fixed. However, since the second insulating layer 72 is interposed between the first region 60a of the frame portion 60 and the third portion 12c of the lead-out wiring 12, the lead-out wiring 12 can be separated from the frame portion 60 at a position overlapping the frame portion 60. .

FIG. 6 is a plan view showing an example of a planarized region. A region D shown by a dot in FIG. 6 is a region where the adhesive 65 is applied. The region H shown by hatching in FIG. 6 is a flattened region. In the structure shown in FIG. 5 (b), the flattened area H of the second insulating layer 72 is from the position closer to the inner side than the opening 601 of the frame portion 60 and closer to the outer side than the first via hole 72h1 to the coating application. The second region 60b of the agent 65 is at least halfway.

7 (a) and 7 (b) are sectional views showing examples of other frame portions. FIG. 7 (a) is an overall view, and FIG. 7 (b) is an enlarged view of a connection portion of the frame portion 60. The surface on the substrate 50 side of the frame portion 60 shown in FIGS. 7 (a) and (b) has a first region 60a halfway from the inner peripheral surface to the outer peripheral surface, and is closer to the outer peripheral surface side than the first region 60a. The second region 60b and the third region 60c closer to the outer peripheral surface side than the second region 60b.

Facing the substrate 50 side, the first region 60a is a male mold, the second region 60b is a concave mold, and the third region 60c is a male mold. That is, in the frame portion 60, a concave second region 60b is provided in a central portion of the surface on the side of the substrate 50. An adhesive 65 is provided in the concave portion of the second region 60b to connect the frame portion 60.

According to such a frame portion 60, the adhesive 65 is surrounded by the first region 60a and the third region 60c, which are male molds, on the surface of the substrate 50 side of the frame portion 60, so that the intrusion of moisture from outside air can be more effectively suppressed剂 65。 Agent 65.

In addition, although FIG. 7 shows the example in which the surface of the substrate 50 side of the frame portion 60 has the first region 60a, the second region 60b, and the third region 60c, it may have a position closer to the outer peripheral surface than the third region 60c. The side becomes a concave area. In addition, a region that is concave on the outer peripheral surface side of the third region 60c may have a region that becomes a male mold on the outer peripheral surface side. That is, the surface on the side of the base material 50 of the frame portion 60 may have a region having a concave shape in two or more rows.

(Other Structure of Humidity Detection Device) FIG. 8 is a cross-sectional view showing an example of another structure of the humidity detection device. The humidity detection device 1B shown in FIG. 8 is different from the humidity detection device 1 shown in FIG. 1 in that the frame portion 60 is not provided around the laminated structure of the humidity detection portion 10 and the reference portion 20. The other components are the same as those of the humidity detection device 1.

Even if the frame portion 60 is not provided, if the humidity detection portion 10 and the reference portion 20 are laminated on the base material 50, the humidity detection portion 10 functions as a protective member covering the reference portion 20. The section 20 need not be covered with other protective materials. In addition, the stacked structure of the humidity detection unit 10 and the reference unit 20 can reduce the area in plan view as compared with the case where these are placed on the base material 50, and the device can be miniaturized.

As described above, according to this embodiment, even if the reference portion 20 is covered with another protective material, the intrusion of moisture into the reference portion 20 can be suppressed and the reference capacitor can be stabilized, which can improve the accuracy of humidity detection.

In addition, although the present embodiment has been described as above, the present invention is not limited to these examples. For example, the intermediate electrode 130 may be divided into upper and lower portions, and an upper intermediate electrode portion may be used as an electrode of the humidity detection unit 10, and a lower intermediate electrode portion may be used as an electrode of the reference portion 20. The detection method of the humidity detection unit may be a method of measuring capacitance and detecting humidity as described in the above embodiment, or a method of measuring resistance and detecting humidity. Although an example of using ruthenium (Ru) as an electrode material is shown, other conductive materials such as aluminum or copper may be used.

Furthermore, those skilled in the art can add, reduce, or change design elements as appropriate to the above-mentioned embodiments, or appropriately combine features of the configuration examples of the embodiments, as long as they include the gist of the present invention, they are all included in the present invention. Within range.

1‧‧‧Humidity detection device

1B‧‧‧Humidity detection device

2‧‧‧Humidity detection device

10‧‧‧Humidity Detection Department

12‧‧‧ lead-out wiring

12a‧‧‧Part 1

12b‧‧‧Part 2

12c‧‧‧Part 3

12d‧‧‧Part 4

12e‧‧‧Part 5

15‧‧‧pad electrode

20‧‧‧Reference Department

50‧‧‧ substrate

50a‧‧‧1st main face

55‧‧‧The first insulation layer

60‧‧‧Frame

60a‧‧‧Zone 1

60b‧‧‧Zone 2

60c‧‧‧Region 3

65‧‧‧ Adhesive

70‧‧‧ protective layer

70a‧‧‧slot

70h‧‧‧via

72‧‧‧Second insulation layer

72h1‧‧‧1st via

72h2‧‧‧ 2nd via

80‧‧‧ mold resin

110‧‧‧lower electrode

120‧‧‧upper electrode

121‧‧‧ Wet hole

130‧‧‧ intermediate electrode

210‧‧‧The first dielectrics department

220‧‧‧Second Dielectric Department

310‧‧‧Common electrode

320‧‧‧Reference electrode

330‧‧‧Dielectrics Department

340‧‧‧ Detection electrode

500‧‧‧ substrate

601‧‧‧ opening

800‧‧‧mould

810‧‧‧Mould

820‧‧‧Lower mold

850‧‧‧cavity

A-A‧‧‧ Section

D‧‧‧area

H‧‧‧area

1 (a) and 1 (b) are diagrams illustrating a humidity detection device according to this embodiment. FIG. 2 is a cross-sectional view illustrating a humidity detection device of a reference example. 3 (a) and 3 (b) are cross-sectional views illustrating the sealing of a mold. 4 (a) and 4 (b) are cross-sectional views showing an example of a withdrawal structure of the lead-out wiring. 5 (a) and 5 (b) are cross-sectional views showing other examples of the withdrawal structure of the lead-out wiring. FIG. 6 is a plan view showing an example of a planarized region. 7 (a) and 7 (b) are cross-sectional views showing other examples of frame portions. FIG. 8 is a cross-sectional view showing another configuration example of the humidity detection device.

Claims (10)

A humidity detection device includes: a base material; a reference portion provided on the base material; and a humidity detection portion provided on the reference portion. The humidity detecting device according to claim 1, wherein the reference unit is covered by the humidity detecting unit in order to prevent moisture from entering the reference unit from the outside. For example, the humidity detection device of claim 1 or 2 further includes a lower electrode provided on the base material; a first dielectric portion provided on the lower electrode; and an intermediate electrode provided on the first portion. 1 on the dielectric portion; second dielectric portion provided on the intermediate electrode; and upper electrode provided on the second dielectric portion; and through the lower electrode, the first A dielectric portion and the intermediate electrode constitute a reference capacitance portion of the reference portion, and the upper electrode, the second dielectric portion, and the intermediate electrode constitute a humidity detection capacitance portion of the humidity detection portion. The humidity detecting device according to claim 3, wherein a moisture-sensing hole is provided in the upper electrode. The humidity detection device according to claim 3, wherein at least the lower electrode, the first dielectric portion, and the intermediate electrode are covered with a protective layer. The humidity detection device according to claim 1 or 2 further includes a frame portion provided on the base material and surrounding the reference portion and the outside of the humidity detection portion. The humidity detecting device according to claim 6, wherein the frame portion is formed of silicon. The humidity detection device according to claim 6, wherein the surface on the substrate side of the frame portion has a first region halfway from the inner peripheral surface to the outer peripheral surface, and a second region closer to the outer peripheral surface side than the first region. A region is provided with an adhesive agent for adhering the frame portion to the substrate in the second region, and the adhesive agent is not provided in the first region. According to the humidity detection device of claim 8, wherein the surface on the substrate side of the frame portion further has a third region closer to the outer peripheral surface side than the second region, and the adhesive is not provided in the third region. The humidity detecting device according to claim 6, further comprising a sealing resin which surrounds the outside of the frame portion.