TWI665781B - Three-dimentsional complementary-conducting-strip structure - Google Patents

Abstract

The invention discloses a three-dimensional complementary conduction band structure. A plurality of two-dimensional mesh metal layers are stacked on top of each other and connected to each other through a plurality of metal connection holes to form a three-dimensional grid structure. One or more signal lines are three-dimensionally routed in this three-dimensional grid structure and separated from the three-dimensional grid structure. . In addition, each two-dimensional mesh metal layer is a planar metal layer having one or more empty areas. The three-dimensional grid structure is grounded and one or more signal lines are electrically connected to one or more components or terminals, respectively. Materials are used to electrically isolate the three-dimensional grid structure from these signal lines.

Description

Three-dimensional complementary conduction band structure

The present invention relates to a complementary-conducting-strip structure, in particular to a three-dimensional complementary conductive band structure in which one or more signal lines can be arbitrarily three-dimensionally routed, and the three-dimensional complementary conductive band structure can be applied. Interconnects such as microwave millimeter wave integrated circuits and high-frequency system modules.

The development of the semiconductor industry over the years has continuously increased the demand for high-density integrated circuits with advantages such as small area and high operating speed, whether it is a central processing unit (CPU) or a graphics processing unit (graphic processing unit, CPU), integrated circuits used in wireless products such as microwave millimeter wave or UHF communication, or other products.

In addition to directly reducing the development direction of the critical dimension (CD) of components (such as newly developed components such as FinFETs and carbon nanotubes), multilayered technology is used integration technology) is also a development direction for transmitting signals between multiple components and / or endpoints. For example, thin-film microstrips (TFMSs) interact with Complementary-conducting-strip (CCS) are technologies that have been commonly developed and applied to form signal lines in applications such as monolithic microwave integrated circuits (MMICs) in recent years. In any case, all existing technologies have room for improvement in terms of saving wafer area, reducing interference, facilitating heat dissipation, and design flexibility.

In summary, there is a need to improve existing technology or develop new technologies to further develop and implement high-density integrated circuits, especially when commercial applications require denser and more efficient integrated circuits.

The present invention proposes a three-dimensional complementary conduction band structure, which can be applied to at least transmission lines and coupled lines. Among them, two or more two-dimensional mesh metal layers are stacked on top of each other and connected to each other into a three-dimensional mesh through one or more metal connecting holes (can be regarded as two-dimensional mesh connecting holes). Three-dimensional network structure, and one or more signal lines are three-dimensionally routed in this three-dimensional grid structure. Here, any signal line may be formed by connecting one or more horizontal metal lines and one or more vertical metal connection holes (which can be regarded as signal line connection holes) to each other.

The invention proposes a three-dimensional complementary conduction band structure, which can be applied to transmission lines, coupling lines, and the like. Among them, one or more signal lines are three-dimensionally routed in a plurality of unit cells arranged three-dimensionally, and the routing method of any signal line can be arbitrarily changed (such as a bent signal line, meander signal lines). in In any one structural unit, each signal line is separated from each edge of the structural unit and other signal lines.

The three-dimensional complementary conduction band structure proposed by the present invention is located on a substrate, and can be regarded as a plurality of two-dimensional mesh metal layers and a plurality of signal line metal layers stacked vertically and alternately on the substrate, and connected to these A plurality of two-dimensional mesh connection holes of the two-dimensional mesh metal layer are formed together with a plurality of signal line connection holes connecting the signal line metal layers. Among them, each two-dimensional mesh metal layer is a planar metal layer having one or more empty areas, and each signal line metal layer is located on the same plane (or It is composed of one or more metal lines (especially one or more metal lines parallel to the substrate surface and / or these two-dimensional mesh metal layers) located between two adjacent two-dimensional mesh metal layers. In addition, the signal lines pass through the empty areas in a direction perpendicular to the substrate surface, and the signal lines pass through the two-dimensional meshes to connect the gaps between the holes in a direction parallel to the substrate surface. Here, the two-dimensional mesh metal layer or the signal line metal layer directly contacts the substrate (or is located at the bottom of these metal layers) does not need to be limited. In addition, most dielectric layers (or inner metal dielectric layers) can be located between any two adjacent metal layers (or integrated with some metal layers) to provide the required Electrical isolation and mechanical support, etc. Here, the dielectric layer surrounds at least the edges of the signal lines and the structural units, and usually fills the space between the signal lines and the edges of the structural units.

Generally speaking, there are no restrictions on how these signal lines are routed and distributed, as long as different signal lines do not touch each other and are in contact with these two-dimensional meshes. The metal layer and the two-dimensional mesh connection holes used to connect the two-dimensional mesh metal layers may be separated from each other. For example, in any structural unit, the possible routings of these signal lines are at least the following: single routing in the horizontal direction, double parallel routing in the horizontal direction, bent routing in the horizontal direction, and vertical direction Single trace, double parallel traces in the vertical direction, bent traces in the vertical direction, coupled line structure in the horizontal direction, coupled line structure in the vertical direction, two side-by-side shuttles in the horizontal direction, two in the vertical direction Three side-by-side shuttles and three or more signal lines pass through. In addition, the possible outlines of these signal lines in any structural unit are at least the following: straight shape, L shape, T shape, cross shape, five straight lines connected to each other or six straight lines connected to each other.

Compared with the conventional two-dimensional complementary conduction band structure, the three-dimensional complementary conduction band structure proposed by the present invention has at least the following advantages, whether it is applied to transmission lines, coupling lines, or other fields. First, more design flexibility, because the vertical direction of the three-dimensional grid structure provides adjustment flexibility not found in the conventional two-dimensional complementary conduction band structure. Second, a better shielding effect, because each signal line can be shielded by a grounded three-dimensional grid structure in the horizontal and vertical three-dimensional directions. Third, better heat dissipation, because each signal line is adjacent to the metal forming the three-dimensional grid structure in the horizontal and vertical three-dimensional directions (regardless of the horizontal two-dimensional mesh metal layer or the vertical signal line connection hole) . Fourth, save the area of the integrated circuit, because these signal lines can be arbitrarily three-dimensionally routed, the area of the integrated circuit occupied by the majority of the signal lines used to connect the same number of components / endpoints can be two-dimensionally complementary than the conventional one. The conduction band structure is sometimes reduced. In addition, more adjustable parameters and more adjustable ranges are also beneficial to improve the characteristic impedance in conjunction with the adjustment of the fab process, etc. (characteristic impedance (Zc) and quality factor (Q value) and reduce the effect on slow wave factor (SWF).

100‧‧‧ three-dimensional complementary conduction band structure

110‧‧‧ substrate

120‧‧‧ signal line

130‧‧‧ three-dimensional grid structure

140‧‧‧port

MET‧‧‧ metal layer

IMD‧‧‧Inner metal dielectric layer

The first diagram A, the first diagram B, the first diagram C, and the first diagram D respectively show an oblique view, a bottom view, and two different angles of an example of the application of the three-dimensional complementary conduction band structure of the present invention to a transmission line. Side view.

Figures 2A to 2G respectively show in summary the structural unit and three types of three-dimensional wirings of an example of the application of the three-dimensional complementary conduction band structure of the present invention to a coupling line.

The third A to third D, the third E to third H, and the third I to third L respectively show that the signal line spirals in the horizontal direction, the spiral spiral in the vertical direction, and Slanted, top, side, and front views of the three applications of horizontal and vertical spiral routing.

Figures 4A to 4C summarize the perspective, top, and side views of the structural unit of the three-dimensional complementary conduction band structure applied to the transmission line proposed by the present invention.

The fifth diagram A shows the distribution of the components to be connected, the fifth diagram B shows the routing of the signal lines when using the conventional two-dimensional complementary conduction band structure, and the fifth diagram C shows the three-dimensional complementary conduction band structure when the present invention is used. How the signal lines are routed. The fifth diagram D and the fifth diagram E show the condition of all signal lines on the same plane, the fifth diagram F and the fifth diagram G show the condition of all signal lines on the upper and lower planes, and the fifth diagram H and the fifth Figure I shows the condition of all signal lines in four planes above and below.

The sixth graph A shows the condition of a single transmission line and the sixth graph B to sixth D respectively show the results of simulation calculations of the relationship between the characteristic impedance, the slow wave coefficient and the quality factor and the frequency of the transmitted signal under this condition. The sixth E diagram shows the condition of a single bend line, and the sixth F to sixth H diagrams respectively show the results of the simulation calculation of the relationship between the characteristic impedance, the slow wave coefficient and the quality factor and the frequency of the transmitted signal under these conditions. The sixth graphs I to K show the calculation results of the relationship between the characteristic impedance, slow wave coefficient, and quality factor of the application and the frequency of the transmitted signal shown in the third graphs A to D, and the sixth L graph. Figures 6 to N show simulation calculation results of the relationship between the characteristic impedance, slow wave coefficient, and quality factor of the applications shown in Figures 3 E to 3 H, and the frequency of the transmitted signal. The Q diagram shows the simulation calculation results of the relationship between the characteristic impedance, slow wave coefficient, and quality factor of the application and the frequency of the transmitted signal shown in the third I to third L diagrams.

The invention will be described in detail in the following examples. However, in addition to the disclosed embodiments, the present invention can also be widely applied to other various changes. The scope of the present invention is not limited to the disclosed embodiments, but is based on the scope of patent application. In order to provide a clearer description, even if the person skilled in the art can understand the content of the present invention, the parts in the diagram are not drawn according to their actual relative sizes. The proportion of the size of some parts to other relevant dimensions is highlighted or recognized. Simplified, and irrelevant details are not completely drawn, in order to simplify the illustration.

The invention relates to a three-dimensional complementary conduction band structure, that is, to a further improvement and innovation in the technical field of the complementary conduction band structure. Conventional two-dimensional The details of the complementary conduction band structure will be omitted without much repetition, but only focus on the differences and advantages of the three-dimensional complementary conduction band structure proposed by the present invention over the conventional two-dimensional complementary conduction band structure. Regarding the conventional two-dimensional complementary conductive band structure, whether it is applied to transmission lines, coupled lines, or other, whether it is to interleave a plurality of signal lines with a plurality of two-dimensional mesh metal layers Stacking or placing a plurality of signal lines on top of some two-dimensional mesh metal layers of the stack, or other related details, can be understood by referring to at least the following files: US 8183961, US8106729, US8106721, and US8085113.

The first diagram A schematically shows a perspective view of an example of a three-dimensional complementary conduction band structure applied to a transmission line according to the present invention. The first diagram B is a corresponding bottom view and the first diagram C and the first diagram D are Corresponding side view of different angles. The entire three-dimensional complementary conduction band structure 100 is located above the substrate 110 and includes n metal layers MET1, MET2, MET3, MET10, MET10, and MTE11 stacked alternately on adjacent metals in a direction perpendicular to the surface of the substrate 110. Inter-metal dielectric layers (IMDs) IMD1-2, IMD2-3, ..., IMD10-11 between layers (or inlaid between adjacent metal layers). Among them, MET1, MET3, MET5, etc. are all planar metal layers having at least one empty area, and can also be regarded as all two-dimensional mesh metal layers. Among them, any of MET2, MET4, MET6, etc. are all at least one metal line located on the same plane (or between two adjacent two-dimensional mesh metal layers), or can be regarded as all signal line metal layers. Wherein, the metal lines of different planes (or different signal line metal layers) are connected to each other through one or more signal line connection holes to form a signal line 120 that can be routed in a horizontal direction and a vertical direction. Since it is applied in An example of a transmission line is that there is only one unit cell in the three-dimensional grid structure 130 formed by the two-dimensional mesh metal layers and the two-dimensional mesh connection holes used to connect the two-dimensional mesh metal layers. Signal line 120. Obviously, the three-dimensional grid structure 130 can be regarded as a three-dimensional arrangement of a plurality of structural units. Herein, any structural unit is adjacent to two two-dimensional mesh metal layers on two sides of the Z direction of the vertical substrate surface and parallel to the substrate. The two sides of the surface direction, the X direction and the Y direction, are both defined by adjacent two-dimensional mesh connection holes. Obviously, as shown in Figures A through D, in any structural unit, the routing of these signal lines includes a single straight line and a single bend line in the horizontal direction, and also includes a single line in the vertical direction. Straight line and single bend line. With this, any signal line can be arbitrarily three-dimensionally routed within the three-dimensional grid structure 130 (whether it is a bent route on a certain plane or a straight route in a certain direction). Here, the signal lines in the direction perpendicular to the substrate surface pass through the empty areas, and the signal lines in the direction parallel to the substrate surface pass through the two-dimensional meshes to connect the gaps between the holes.

Generally, these inner metal dielectric layers surround at least these signal lines, these two-dimensional mesh connection holes and these two-dimensional mesh metal layers, and usually fill these signal lines, these two-dimensional mesh connection holes and these two-dimensional meshes. Gap between metal layers. In addition, in order to reduce the influence of capacitive coupling and the like, these inner metal dielectric layers are often formed of a dielectric material having a low dielectric constant. In practical applications, the two ends of any signal line are often connected to different components or different terminals, such as the source / drain / gate of a metal-oxide semiconductor transistor, the end of a capacitor or inductor, or It is used to connect to the interface outside the integrated circuit and so on. In addition, although not specifically drawn in these illustrations, In practical applications, the three-dimensional grid structure 130 is often electrically connected to a certain potential reference point, such as the potential reference point of the substrate 110 or the potential reference points of other semiconductor elements located on the substrate 110.

It must be emphasized that the three-dimensional complementary conduction band structure proposed by the present invention can be applied to both transmission lines and coupling lines, or even to other products. That is, there is no need to limit how many signal lines are in any one structural unit, and the outline shape and routing method of one or more signal lines do not need to be limited. The present invention only requires these signal lines to be between each other. Separate from each other and also from the three-dimensional grid structure 130.

For example, the second diagram A to the second diagram G show the state of the three-dimensional complementary conduction band structure of the present invention when applied to a coupling line. The second diagram A to the second diagram D show the structural units at this time, and the second diagram E and the second diagram G show three examples of three-dimensional wiring. For example, Figures 3A to 3D show the oblique, top, side, and front views of this application where the signal line spirals in the horizontal direction. Figures 3E to 3H show the signal line. Spiral wiring in vertical direction. This application is oblique view, top view, side view, and front view. Figures 3 to 3 show the signal cables in a horizontal and vertical directions. Figure, top view, side view and front view. Here, to simplify the illustration, the signal line 120 is represented by a dark pattern, and most two-dimensional mesh metal layers and most two-dimensional mesh connection holes (even the substrate 110) around the signal line are represented by a light-colored pattern. In order to highlight the various three-dimensional routing methods of the signal lines in the three-dimensional complementary conduction band structure of the present invention. In addition, the port 140 is an interface of the external environment of the signal line 120 and the three-dimensional complementary conduction band structure, and the present invention does not limit its details. Any technology or product that is known or in the future can be used.

As shown in these illustrations, the entire three-dimensional complementary conduction band structure can be regarded as being composed of a plurality of structural units stacked in three dimensions, or it can be regarded as being composed of a plurality of structural units stacked in three dimensions and the signal lines are These structural units are routed internally in three dimensions. Of course, the structural units referred to by these two description methods are slightly different. The former structural unit itself contains signal lines but the latter structural unit itself does not include signal lines. Regardless of the description, compared with the conventional two-dimensional complementary conduction band structure, the three-dimensional complementary conduction band structure proposed by the present invention not only allows three-dimensional routing of one or more signal lines, but also on the same plane (or in other words Between two adjacent two-dimensional mesh metal layers) two or more signal lines may be separated from each other by a two-dimensional mesh connection hole (or even part of the mesh metal layer) and screened.

Figures 4A to 4C summarize the perspective, top, and side views of the structural unit of the three-dimensional complementary conduction band structure proposed by the present invention (taking the application in a transmission line as an example, but the details of the structural unit are also (Can be applied to the coupling line or other applications). The metal layers MET1 and MET3 are two-dimensional mesh metal layers, the metal layer MET2 is a signal line metal layer, and a cylindrical metal patch on each metal layer plane and a metal connection hole embedded in each inner metal dielectric layer (via ) Is used to connect different metal layers to each other, whether it is a metal layer MET1 and a metal layer MET3 or a metal layer MET2 and a metal layer located in another structural unit. Of course, the cylindrical metal nail is only an example. In different embodiments, other shapes of the patch can also be used, or the two-dimensional mesh metal layer and the metal connection hole can be directly connected without using any patch. Or it can be omitted if the design and manufacturing process allows. Use patches. Obviously, by arranging and combining such structural units in the three-dimensional direction, various three-dimensional grid structures 130 (especially the three-dimensional grid structure 130 having a specific period) can be obtained. Obviously, in such a three-dimensional complementary conduction band structure, not only the conventional two-dimensional complementary conduction band structure, but also the signal line routing in the four directions of X, Y, -X and -Y on the horizontal plane, but also The metal connection holes (or even patches) in the vertical direction can provide signal lines in the Z and -Z directions that cannot be provided by the conventional two-dimensional complementary conductive band structure. In this way, the signal lines in any structural unit can be interconnected with the signal lines in other structural units through one or more of the six directions of X, Y, Z, -X, -Y, and -Z, thereby forming A 3D signal line with arbitrary routing. Among these, the illustrated connecting arms (connecting arms) present such a connection mechanism.

As shown in these illustrations, the structural unit periods of the structural units in the three-dimensional grid structure 130 in the X and Y directions on the horizontal plane are Px and Py, and the structural unit periods in the vertical Z direction are Pz. The sizes (or mesh sizes) in the X and Y directions and in the Z direction in the vertical direction are Whx, Why, and Whz, respectively, and the size of the signal line in the X, Y, and vertical Z directions in the horizontal plane (such as the length , Width and thickness) are Sx, Sy and Sz, respectively. In general, the design of the three-dimensional complementary conduction band structure must at least refer to the following factors to determine the size of Px, Py, and Pz: the characteristic impedance range required for the signal line, and the minimum line that can be achieved by the integrated circuit manufacturing process Width and line spacing, and the maximum current carrying of the signal line. In addition, the minimum size of each of Sx, Sy, and Sz depends on at least the limit that the integrated circuit manufacturing process can reach and the required design rules, and by adjusting Whx, Why, and Whz and Sx, Sy, and Sz can also change the three-dimensional complementary conduction band knot Structural characteristic impedance and so on. In general, commercial manufacturing processes tend to fix Sz and adjust only Sx and Sy. In general, the period and size of each structural unit of the entire three-dimensional complementary conduction band structure in three three-dimensional directions and the size of the signal lines located therein are the same, thereby simplifying the structure and related processes. However, in different embodiments, either different structural units in different layers in the vertical direction are allowed to have different structural unit periods, structural unit sizes and / or signal line sizes, or different structural units are allowed to have different structural unit periods and / Or the structural unit size, or allow different structural units to have different numbers of signal lines, signal line sizes, and / or signal line distribution methods.

Compared with the conventional two-dimensional complementary conduction band structure, the three-dimensional complementary conduction band structure proposed by the present invention has at least the following advantages. First, more design parameters further increase design flexibility; second, the signal line is surrounded by a three-dimensional grid structure, and the shielding effect on the signal line can reduce mutual interference between different signal lines; third, the three-dimensional grid The structure is conducive to heat dissipation, reducing the noise or even failure caused by the heat generated during operation cannot be dissipated in time. In particular, since signal lines can be arbitrarily three-dimensionally routed in a three-dimensional grid structure, the area of the substrate can be fully utilized to increase the density of the integrated circuit.

First, the present invention can not only have the signal line size (Sx, Sy), structural unit period (Px, Py), and mesh size (Wx, Wy) These six adjustable parameters can also have three adjustable parameters: the signal line size (Sz), the structural unit period (Pz), and the mesh size (Wz) in the vertical direction (Z direction). Therefore, the present invention can have more adjustable parameters than the conventional two-dimensional complementary conduction band structure, thereby providing more possible adjustment modes. Of course, whether it is in the X, Y, or Z direction, the possible adjustment range of any adjustable parameter is at least related to, for example, semiconductor process technology and semiconductor product specifications. In addition, in X, Y, and Z directions, the possible adjustment ranges of these adjustable parameters can be adjusted separately. In other words, depending on the requirements of the three-dimensional complementary conduction band structure (such as the frequency and wavelength of the signal to be transmitted by the signal line), various parameters in these three directions can be adjusted accordingly. For example, when such a three-dimensional complementary conduction band structure is applied as a three-dimensional periodic guided wave structure, the sizes of Px, Py, and Pz need to be significantly smaller than the guided wave slope length (λ g).

Secondly, compared to the conventional two-dimensional complementary conduction band structure, the signal lines are only shielded by these two-dimensional mesh metal layers in the vertical direction above and / or below (these two-dimensional mesh metal layers are often grounded). The complementary conductive band structure can not only shield the signal lines through the two-dimensional mesh metal layers on these horizontal planes, but also cover the signal lines through the two-dimensional mesh connection holes connecting these two-dimensional mesh metal layers. Therefore, the signal lines between different structural units can be shielded and isolated in three directions in three dimensions, thereby reducing mutual interference between one or more signal lines located in different structural units.

Furthermore, since metal is a good conductor of heat, when the signal line in the structural unit of the three-dimensional complementary conduction band structure is surrounded by the metal in the horizontal and vertical X, Y, and Z directions (regardless of the two-dimensional mesh metal layer) Metal or metal of two-dimensional mesh connection holes), especially when these metals are grounded, the present invention can more efficiently conduct heat conduction occurring in signal lines away from the entire three-dimensional complementary conductive band structure than the conventional two-dimensional complementary conductive band structure . Therefore, when the signal line is electrically connected to an active device and a high-power component, the three-dimensional complementary transmission of the present invention The conduction band structure can more effectively reduce the probability that the heat generated in the signal line causes some components in the integrated circuit to cause excessive noise or even failure due to overheating than the conventional two-dimensional complementary conduction band structure.

In particular, in order to avoid the problem of short circuit or noise caused when two signal lines are in contact with each other (or too close), the conventional two-dimensional complementary conduction band structure must bypass one signal line on the two-dimensional plane and bypass the other. One signal line, but the three-dimensional complementary conduction band structure proposed by the present invention can allow any signal line to cross over from another signal line. Therefore, the present invention can omit the additional area of the substrate occupied by the signal lines on the same plane, and further increase the density of the integrated circuit using the present invention.

For example, Figures 5A to 5C show in summary why the present invention can save substrate area and increase density compared to the conventional two-dimensional complementary conduction band structure. Among them, the routing method and application in transmission lines or The coupling lines are irrelevant, that is, the advantages of the present invention shown in these figures are not only valid for applications such as transmission lines. The fifth A diagram shows the distribution of components (or endpoints) to be connected. Here, A1, B1, C1, and D1 are connected to A2, B2, C2, and D2 through different signal lines, respectively. Figure 5B shows how the signal lines are routed when using the conventional two-dimensional complementary conduction band structure. Here, only half of these signal lines are linearly routed between two components on the horizontal plane, and the other half of the signal lines are On the horizontal plane, this half of the signal line is routed around the straight line to route between the other two components. As shown in the figure, the sides of the base area occupied in this example in the X direction and Y direction on the horizontal plane are five structural units and six structural units, respectively. Figure 5C shows the signal line when using the three-dimensional complementary conduction band structure of the present invention In this way, any signal line is straightly routed between the two components on the horizontal plane, but half of the signal is moved to the other horizontal plane through the vertical wiring to bypass the route only on the same horizontal plane. Level the other half of the signal line. As shown in the figure, the sides of the base area occupied in this example in the X direction and the Y direction on the horizontal plane are four structural units and five structural units, respectively. Obviously, the three-dimensional complementary conduction band structure can reduce the substrate area used and thus increase the density. Here, to simplify the illustration, only the signal lines 120 and the three-dimensional grid structure 130 are drawn.

For example, the fifth D to fifth I pictures show some other examples. Among them, the fifth D and fifth E graphs show that all signal lines are on the same plane (between two two-dimensional mesh metal layers), and the fifth F and fifth G graphs show that all signal lines are distributed above and below The condition of two planes (interlacedly located between three two-dimensional mesh metal layers), and the fifth and fifth images H and I show the situation where all signal lines are distributed on four planes (interlacedly located on five two-dimensional meshes) Between metal layers). Obviously, when the signal line is routed on the upper and lower two planes, it can save about 45 percent of the base area than when the signal line is routed on only one plane. Further saving to 70% of the substrate area. Here, to simplify the illustration, only the signal lines 120 and the three-dimensional grid structure 130 are drawn.

In short, although it is not particularly shown when the number of components to be connected is larger or the distribution of components on the substrate is more complicated, the signal lines need to be routed on the same plane when the number is greater and the distribution is more complicated. The more and more complex the need to avoid mutual contact, the advantages of the three-dimensional complementary conductive band structure of the present invention will become more apparent when the number of components to be connected is more complex.

Further, the three-dimensional complementary conduction band structure of the present invention has more adjustable parameters than the conventional two-dimensional complementary conduction band structure, which is not only conducive to obtaining better isolation / heat dissipation between different structural units, but also is beneficial to such as transmission lines and The routing of signal lines under conditions such as coupling lines is also conducive to adjusting with the fab process to improve both the characteristic impedance and quality factors and reduce the impact on the slow wave coefficient.

For example, when the three-dimensional complementary conduction band structure of the present invention is applied to a microwave millimeter wave integrated circuit, it can support a quasi-transverse electromagnetic wave transmission mode and can reduce the signal line routing mode (such as Bend traces) on the propagation constant (γ) and characteristic impedance. As is well known, the complex propagation constant (γ) can be expressed as γ = α + jβ , where α is the attenuation constant and β is the phase constant. The characteristic impedance, attenuation constant (α), phase constant (β), and quality factor of this transmission line can be obtained by calculating the S-parameters of any signal line with two ends as a transmission line. The relevant calculation formulas are as follows: As everyone knows, in the ideal state, the characteristic impedance and slow wave coefficient of the transmission line do not change with the frequency of the transmitted signal, and the quality factor is proportional to the quarter wavelength of the transmitted signal. The frequency of the transmitted signal.

For example, the sixth diagram A shows the condition of a single transmission line to which the three-dimensional complementary conduction band structure of the present invention is applied, and the sixth diagram B to the sixth diagram D respectively show characteristic impedance, slow wave coefficient and quality factor three under this condition. The result of simulation calculation of the relationship between the transmitter and the frequency of the transmitted signal. The sixth E diagram shows a single bending line condition of the three-dimensional complementary conductive band structure to which the present invention is applied, and the sixth F to sixth H diagrams respectively show the characteristic impedance, the slow wave coefficient, and the quality factor in this condition. Result of simulation calculation of transmission signal frequency. Obviously, the real part (Re (Z _C )) and imaginary part (Im (Z _C )) of the characteristic impedance, as well as the attenuation constant and phase constant, basically do not change with frequency, especially when the frequency is high. At 15GHz, the quality factor and frequency are approximately constant linear proportions, especially when the frequency is higher than 10 ~ 15GHz. In other words, the simulation calculation results show that the present invention can make the relationship between the characteristic impedance, the slow wave coefficient and the quality factor of each unit and the frequency of the transmitted signal close to the ideal state.

For example, in the frequency range of 1-10GHz, the sixth I to sixth K diagrams show the characteristic impedance of the application where the signal lines shown in third A to third D spirally run in the horizontal direction. The simulation calculation results of the relationship between the three, the slow wave coefficient and the quality factor and the frequency of the transmitted signal. The sixth L to sixth N diagrams show that the signal lines shown in the third E to third H spiral spiral in the vertical direction. The simulation results of the relationship between the characteristic impedance, slow wave coefficient and quality factor of this application and the frequency of the transmitted signal, and the sixth O to sixth Q diagrams show the third I to third L diagrams. The simulation results of the relationship between the characteristic impedance, slow wave coefficient, and quality factor of the application of the signal line spiraling in the horizontal and vertical directions and the frequency of the transmitted signal. Obviously, no matter in the three-dimensional routing situation, the simulation results show that the real and imaginary parts of the characteristic impedance, as well as the attenuation constant, phase constant, and quality factor, basically do not change with frequency. , Especially without sudden fluctuations at most At the extremes of high frequency or low frequency, it gradually increases or decreases with increasing or decreasing frequency. In other words, the simulation calculation results show that the present invention can approximate the relationship between the characteristic impedance, slow wave coefficient, and quality factor of the three-dimensional wiring in the three-dimensional complementary conduction band structure and the frequency of the transmitted signal to an ideal state.

Obviously, the present invention may have many amendments and differences, so it needs to be understood within the scope of the appended claims. In addition to the above detailed description, the present invention can be widely implemented in other embodiments. The above are only preferred embodiments of the present invention, and are not intended to limit the scope of patent application of the present invention; all other equivalent changes or modifications made without departing from the spirit disclosed by the present invention should be included in the scope of patent application described below Inside.

Claims (19)

A three-dimensional complementary conductive belt structure includes: a plurality of two-dimensional mesh metal layers stacked on each other in a direction perpendicular to the surface of the substrate; a plurality of two-dimensional mesh connection holes connecting the two-dimensional mesh metal layers in a direction perpendicular to the substrate surface : Most signal line metal layers are stacked on top of each other in a direction perpendicular to the substrate surface and staggered with these two-dimensional mesh metal layers: and a plurality of signal line connection holes are connected to these signal line metal layers in a direction perpendicular to the substrate surface. : Here, any two-dimensional mesh metal layer is a flat metal layer with one or more empty areas. These two-dimensional mesh metal layers and these two-dimensional mesh connection holes together form a three-dimensional grid structure. Here, Any signal line metal layer is one or more metal lines parallel to the surface of the substrate. These signal line metal layers and these signal line connection holes together form one or more signal lines. Here, any signal line is in a three-dimensional grid structure. It is separated from other signal lines, and any signal line can be routed three-dimensionally in this three-dimensional grid structure. According to the three-dimensional complementary conduction band structure described in the first item of the patent application scope, this three-dimensional grid structure is a three-dimensional arrangement of a plurality of structural units, where any one structural unit is adjacent to two sides in the Z direction of the vertical base surface. Two two-dimensional mesh metal layers and two sides in the X direction and the Y direction parallel to the surface direction of the substrate are defined by two adjacent two-dimensional mesh connection holes. According to the three-dimensional complementary conduction band structure described in item 2 of the scope of patent application, at least one of the following items is an adjustable parameter of any structural unit: X-direction signal line size (Sx), Y-direction signal line size (Sy), Z direction Signal line size (Sz), X-direction structural unit period (Px), Y-direction structural unit period (Py), Z-direction structural unit period (Pz), X-direction mesh size (Wx), Y-direction mesh size (Wy), And Z direction mesh size (Wz). According to the three-dimensional complementary conduction band structure described in item 2 of the scope of patent application, there may be one or more signal lines in any one structural unit. For example, the three-dimensional complementary conduction band structure described in item 2 of the scope of patent application, the possible routing of these signal lines in any structural unit is at least the following: a single wiring in the horizontal direction, a bent wiring in the horizontal direction, Single wire in the vertical direction and bent wire in the vertical direction. According to the three-dimensional complementary conduction band structure described in the second item of the patent application scope, at least one of the possible routings of these signal lines in any structural unit is as follows: two parallel parallel lines in the horizontal direction, and two parallel parallel lines in the vertical direction. , The coupling line structure in the horizontal direction, the coupling line structure in the vertical direction, two side-by-side shuttles in the horizontal direction, two side-by-side shuttles in the vertical direction, and three or more signal lines pass respectively. According to the three-dimensional complementary conduction band structure described in the second item of the patent application scope, the possible contours of these signal lines in any structural unit are at least the following: straight shape, L shape, T shape, cross shape, five straight lines Connected or six straight lines are connected to each other. According to the three-dimensional complementary conduction band structure described in item 1 of the scope of patent application, the signal lines pass through the empty areas in a direction perpendicular to the substrate surface, and the signal lines are connected through the two-dimensional meshes in a direction parallel to the substrate surface. Gap between holes. The three-dimensional complementary conductive band structure described in item 1 of the patent application scope further includes a plurality of inner metal dielectric layers, and any one of the inner metal dielectric layers is located between the adjacent two-dimensional mesh metal layer and the signal line metal layer. . The three-dimensional complementary conductive band structure described in item 1 of the patent application scope further includes one of the following: the bottom of the two-dimensional mesh metal layer is directly in contact with the substrate; and the bottom of the signal line metal layer is directly in contact with the substrate. The three-dimensional complementary conduction band structure described in item 1 of the scope of patent application, further includes at least one of the following: the three-dimensional grid structure is grounded; and the signal lines are electrically connected to a plurality of components and / or terminals on the substrate, respectively. point. A three-dimensional complementary conduction band structure includes: a three-dimensional grid structure with a plurality of structural units; and one or more signal lines, which are three-dimensionally routed within the three-dimensional grid structure; here, these structural units are arranged three-dimensionally in a On the substrate; here, any structural unit has at least one empty area; here, these signal lines are routed in three dimensions through the empty areas of the structural units in these structural units; here, in any structural unit There can be one or more signal lines; here, any signal line is separated from the three-dimensional grid structure and other signal lines ; here, the three-dimensional grid structure includes two or more two-dimensional mesh metal layers stacked on top of each other. Each of the two-dimensional mesh metal layers is a planar metal layer having one or more empty areas. Here, the two-dimensional mesh metal layers are connected to each other through a plurality of two-dimensional mesh connection holes. According to the three-dimensional complementary conduction band structure described in item 12 of the patent application scope, any structural unit is adjacent to two two-dimensional mesh metal layers on two sides in the Z direction of the vertical substrate surface, and is in the X direction parallel to the substrate surface direction. The two sides in the Y direction are defined by two adjacent two-dimensional mesh connection holes. For example, the three-dimensional complementary conductive band structure described in item 12 of the patent application scope, at least one of the following is an adjustable parameter of any structural unit: X-direction signal line size (Sx), Y-direction signal line size (Sy), Z direction Signal line size (Sz), X-direction structural unit period (Px), Y-direction structural unit period (Py), Z-direction structural unit period (Pz), X-direction mesh size (Wx), Y-direction mesh size (Wy), And Z direction mesh size (Wz). For example, the three-dimensional complementary conductive band structure described in item 12 of the scope of patent application, there are at least the following possible traces of these signal lines in any structural unit: a single trace in the horizontal direction, a curved trace in the horizontal direction, Single wire in the vertical direction and bent wire in the vertical direction. According to the three-dimensional complementary conduction band structure described in the patent application No. 12, there may be at least the following types of possible signal lines in any structural unit: two parallel parallel lines in the horizontal direction, and two parallel parallel lines in the vertical direction. , The coupling line structure in the horizontal direction, the coupling line structure in the vertical direction, two side-by-side shuttles in the horizontal direction, two side-by-side shuttles in the vertical direction, and three or more signal lines pass respectively. The three-dimensional complementary conductive band structure described in item 12 of the scope of the patent application. The possible contours of these signal lines in any structural unit are at least the following: straight shape, L shape, T shape, cross shape, and five straight lines connected to each other. Or six straight lines are connected to each other. The three-dimensional complementary conduction band structure described in item 12 of the patent application scope further includes at least one of the following: each signal line in each structural unit is separated from each edge of the structural unit; and the three-dimensional grid structure surrounds Dielectric material, which is used to electrically isolate the three-dimensional grid structure from any signal line. The three-dimensional complementary conductive band structure according to item 12 of the scope of patent application, further comprising at least one of the following: the three-dimensional grid structure is grounded; and the signal lines are electrically connected to a plurality of components on the substrate and / or Endpoint.