CN108695583A - Three-dimensional complementary conducts band structure - Google Patents
Three-dimensional complementary conducts band structure Download PDFInfo
- Publication number
- CN108695583A CN108695583A CN201710225765.9A CN201710225765A CN108695583A CN 108695583 A CN108695583 A CN 108695583A CN 201710225765 A CN201710225765 A CN 201710225765A CN 108695583 A CN108695583 A CN 108695583A
- Authority
- CN
- China
- Prior art keywords
- dimensional
- structural unit
- cabling
- band structure
- signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/10—Wire waveguides, i.e. with a single solid longitudinal conductor
Abstract
The invention discloses a kind of three-dimensional complementaries to conduct band structure.Most two-dimentional mesh metal layers mutual storehouse and are interconnected to a three dimensional network structure by a most metal connecting holes up and down, several one or more signal wires three-dimensional cabling and are separated from each other in this three dimensional network structure with three dimensional network structure.In addition, each two dimension mesh metal layer is the plane metal layer with one or more basket empty regions, three dimensional network structure is grounded and one or more components or endpoint is electrically connected in one or more signal wires, and dielectric material is used to mutually electrically isolate three dimensional network structure and these signal wires.
Description
Technical field
The invention relates to complementation conduction band structure (complementary-conducting-strip
Structure), in particular to one or more signal wires can Arbitrary 3 D cabling wherein three-dimensional complementary conduction band knot
Structure, this three-dimensional complementary conduction band structure can be used in such as microwave&millimeter-wave IC and be interconnected with radio frequency system intermodule
Line etc..
Background technology
The development of semiconductor industry in these years, for having many advantages, such as that area is small with the high High Density Integration of operation rate
The demand of circuit is constantly to increase, whether central processing unit (central processing unit, CPU), graphics process
Device (graphic processing unit, CPU) is applied in the wireless products such as microwave and millimeter wave or SHF communication
Integrated circuit or other products.
In addition to this developing direction for the characteristic size (critical dimension, CD) for directly reducing component (seems
The newly-developeds component such as fin transistor (FinFET) and carbon nanotube (carbon nanotube)) except, using multi-level whole
Conjunction technology (multilayered integration technology) transmits signal between multiple components and/or endpoint
One developing direction.For example, thin film microstrip (thin-film microstrips, TFMSs) and complementary conduction band
(complementary-conducting-strip, CCS) is generally developed and applies in recent years in such as monocrystalline microwave
Signal wire is formed in the applications such as integrated circuit (monolithic microwave integrated circuit, MMIC)
The technology of (signal line).Anyway, all prior arts save wafer area, reduce interference, advantageous heat dissipation with
And all there is room for improvement in flexible design degree etc. demand.
In conclusion there is a need to improve the prior art or development new technology, further developing and realizing high density collection
At circuit, especially when commercial applications need more dense integrated circuit more efficiently.
Invention content
The present invention proposes that three-dimensional complementary conducts band structure, can at least apply in transmission line (transmission
) and coupling line (coupled lines) line.Wherein, two or multiple two-dimentional mesh metal layer (two-dimensional mesh
Metal layer) mutual storehouse and pass through one or more metal connecting holes (via) (two-dimentional mesh connecting hole can be considered as) up and down
It is interconnected to a three dimensional network structure (three-dimensional network structure), and one or more is believed
Number line three-dimensional cabling in this three dimensional network structure.Here, any signal line can be by one or more sections of horizontal metals
The line metal connecting hole vertical with one or more (can be considered as signal wire connecting hole) is connected with each other.
The present invention proposes that three-dimensional complementary conducts band structure, can apply in transmission line and coupling line etc..Wherein, one or
Most signal lines three-dimensional cabling in the majority structural unit (unit cell) of three-dimensional arrangement, and any signal line
Cabling mode be all can arbitrarily change (seem bending signal wire, meander signal lines).At any one
In structural unit, all it is separated from each other with each edge of structural unit and other signal wires per signal line.
Three-dimensional complementary proposed by the present invention conduction band structure be located in substrate (substrate), and can be considered as by
Alternately vertical stack adds in substrate and connects this for the two-dimentional mesh metal layers of majority and most signal wire metal layers
The two-dimentional mesh connecting hole of majority of a little two dimension mesh metal layers connects with the majority signal wire for connecting these signal wire metal layers
Hole is connect to be collectively formed.Wherein, each two-dimentional mesh metal layer is that have one or more basket empty regions (empty area)
Plane metal layer (planar metal layer), and each signal wire metal layer be by be located at approximately the same plane (or
Say be located between adjacent two two-dimentional mesh metal layers) one or more metal wire (be especially parallel to substrate surface and/or
One or more metal wire of these two-dimentional mesh metal layers) it is formed.In addition, in these signals on substrate surface direction
Line is by these basket empty regions, and these signal wires are by these two-dimentional meshes connections on being parallel to substrate surface direction
Gap between hole.Here, being two-dimentional mesh metal layer or signal wire metal layer is in direct contact substrate (or says it is to be located at these metals
The bottom of layer) it does not need to limit.In addition, a most dielectric substance layers (or saying it is metal dielectrics layer) can be located at
Between wantonly two adjacent metal layers (or being incorporated into same layer with certain metal layers), so as to provide need electrically isolate with
Mechanical support etc..Here, edge of the dielectric substance layer at least about these signal wires and these structural units, and be usually filled with
Space between these signal wires and the edge of these structural units.
In general, to be how how cabling is distributed do not need to limit these signal wires, as long as different signal wires is not
It can contact with each other and with these two-dimentional mesh metal layers and to connect these two-dimensional mesh of these two-dimentional mesh metal layers
Mesh connecting hole is all separated from each other.For example, in any structural unit, the possibility cablings of these signal wires at least under
It arranges several:Single cabling in horizontal direction, the parallel cabling of double joint in horizontal direction, bending cabling, vertical direction in horizontal direction
On upper single cabling, vertical direction the parallel cabling of double joint, Vertical Square be folded upward at cabling, the coupled line structure in horizontal direction,
On coupled line structure, horizontal direction in vertical direction two shuttle side by side, in vertical direction two shuttle side by side, three or more
Signal line passes through respectively.In addition, the possibility profile in any structural unit these signal wires is at least following several:Straight line
Shape, L-type shape, T-type shape, cross-type shape, five straight lines are connected with each other or six straight lines are connected with each other.
Three-dimensional complementary proposed by the invention conducts band structure, whether applies in transmission line, coupling line or other necks
Domain, compared to the existing complementary conduction all at least following several advantages of band structure of known two dimension.The first, more flexible design
Property, because the vertical direction of three dimensional network structure provides the existing complementary conduction unexistent adjustment bullet of band structure of known two dimension
Property.The second, preferable bridging effect, because of the three-dimensional that can be grounded with vertical three-dimensional in level per signal line
Network is covered.Third, preferable heat dissipation, because per signal line in level and all neighbouring composition of vertical three-dimensional
The metal (no matter signal wire connecting hole of the two-dimentional mesh metal layer or vertical direction that are horizontally oriented) of three dimensional network structure.
4th, the area for saving integrated circuit, because these signal wires can be with Arbitrary 3 D cabling, to connect identical quantity
The occupied integrated circuit area of majority signal line of component/endpoint can be relatively using the existing known complementary conduction band structure of two dimension
When come to obtain reduce.In addition, more adjustable parameters and more adjustable range, are also beneficial to cooperation fab manufacturing process
Etc. adjustment improve characteristic impedance (characteristic impedance, Zc) and qualitative factor (quality
Factor, Q value) influence of the two and reduction to slow wave coefficient (slow wave factor, SWF).
Above description is only the general introduction of technical solution of the present invention, in order to better understand the technical means of the present invention,
And can be implemented in accordance with the contents of the specification, and in order to allow the above and other objects, features and advantages of the present invention can
It is clearer and more comprehensible, it is special below to lift preferred embodiment, and coordinate attached drawing, detailed description are as follows.
Description of the drawings
Figure 1A, Figure 1B, Fig. 1 C compendiously show that the three-dimensional complementary conduction band structure of the present invention is applied with Fig. 1 D and are passing respectively
The oblique view of one sample of defeated line, the side view of upward view and two different angles.
Fig. 2A to Fig. 2 G compendiously show that the three-dimensional complementary conduction band structure of the present invention applies one in coupling line respectively
The structural unit of sample and three kinds of three-dimensional cablings.
Fig. 3 A to Fig. 3 D, Fig. 3 E to Fig. 3 H and Fig. 3 I to Fig. 3 L difference display signal line in the horizontal direction spiral cabling,
In vertical direction spiral cabling with simultaneously in the horizontal direction and the vertical direction spiral cabling these three application oblique view, overlook
Figure, side view and front view.
Fig. 4 A to Fig. 4 C compendiously show that three-dimensional complementary conduction band structure proposed by the invention applies the knot in transmission line
Oblique view, vertical view and the side view of structure unit.
Fig. 5 A show that the distribution for the component that need connecting, Fig. 5 B displays use the existing known complementary conduction band structure of two dimension
When signal wire cabling mode, and Fig. 5 C be shown in using three-dimensional complementary of the present invention conduct band structure when signal wire cabling side
Formula.Fig. 5 D and Fig. 5 E show that the situation of all signal wires in the same plane, Fig. 5 F and Fig. 5 G show all signal wires upper
The situation of lower two planes, and Fig. 5 H and Fig. 5 I show all signal wires in the situation of totally four planes up and down.
Fig. 6 A show single transmission line situation and Fig. 6 B to Fig. 6 D are respectively displayed on characteristic impedance under this situation, slow wave coefficient
With the simulation result of qualitative factor three and the relationship for being transmitted signal frequency.Fig. 6 E show single folding line situation and scheme
6F to Fig. 6 H are respectively displayed on characteristic impedance under this situation, slow wave coefficient and qualitative factor three and the pass for being transmitted signal frequency
The simulation result of system.Fig. 6 I to Fig. 6 K show characteristic impedance, slow wave coefficient and the matter of the application shown by Fig. 3 A to Fig. 3 D
Amount factor three and the simulation result for being transmitted signal frequency relationship, Fig. 6 L to Fig. 6 N are shown shown by Fig. 3 E to Fig. 3 H
The characteristic impedance of application, slow wave coefficient and qualitative factor three and it is transmitted the simulation result of signal frequency relationship, and schemed
6O to Fig. 6 Q show characteristic impedance, slow wave coefficient and the qualitative factor three for the application that Fig. 3 I to Fig. 3 L are shown and are transmitted signal
The simulation result of frequency relation.
[Main element symbol description]
100:Three-dimensional complementary conducts band structure 110:Substrate
120:Signal wire 130:Three dimensional network structure
140:Port MET:Metal layer
IMD:Metal dielectrics layer
Specific implementation mode
The present invention will be described in some following embodiments.However, other than disclosed embodiment, the present invention also may be used
To be widely used in other many variations.The scope of the present invention is not limited to disclosed embodiment, but with Shen
It please be subject to the scope of the claims.Even and if being to provide clearer description to be familiar with this those skilled in the art and can understand present disclosure, it is illustrated that
Interior each section is not drawn according to its practical relative size, the ratio or convex of certain portion sizes and other scale dependents
It shows or is simplified, and incoherent detail section is not also drawn completely, in the hope of the succinct of diagram.
The invention relates to three-dimensional complementaries to conduct band structure, that is, relate to complementary this technology of conduction band structure neck
The further improvement in domain is innovated.The details of existing known two dimension complementation conduction band structure will omit few repetition, and only focus on
In three-dimensional complementary conduction band structure not existing together relative to the existing known complementary conduction band structure of two dimension proposed by the invention
With advantage.About the content of the existing complementary conduction band structure of known two dimension, whether apply in transmission line (transmission
Line), coupling line (coupled lines) or other, whether by most signal wires and most two-dimentional mesh metals
The interlaced storehouse of interlayer or most signal wires are placed on storehouse some two-dimentional mesh metal layers top or its
His correlative detail can be understood by reference at least following archives:US8183961, US8106729, US8106721 with
US8085113。
Figure 1A compendiously shows a sample applied in transmission line of three-dimensional complementary conduction band structure proposed by the invention
The oblique view of example, Figure 1B are corresponding upward view and Fig. 1 C and side view that Fig. 1 D are corresponding different angle.Entire three
The complementary conduction band structure 100 of dimension is located at 110 top of substrate, and included in the mutual heap on the direction on 110 surface of substrate
N-layer metal layer (metal layer) MET1, MET2, MET3 ... MET10 and MTE11 of stack and alternately be located at adjacent metal
Interlayer (or saying it is to be embedded in adjacent metal interlayer) metal dielectrics layer (inter-metal dielectric layer,
IMD)IMD1-2,IMD2-3…IMD10-11.Wherein, it is all at least one basket empty region that MET1, MET3, MET5 ..., which are waited,
Plane metal layer also can be considered to be all two-dimentional mesh metal layer.Wherein, either one or two of MET2, MET4, MET6 ... are all to be located at together
An at least metal wire for one plane (or saying it is to be located at adjacent two two-dimentional mesh metal interlevels), or can be considered to be all signal wire
Metal layer.Wherein, the metal wire (or say and be different signal wire metal layer) of Different Plane is connected by one or more signal wires
Connect hole be linked to each other to form can in the horizontal direction with the signal wire of vertical direction cabling 120.Due to being applied in transmission line
Sample, be total to the two-dimentional mesh connecting hole that connect these two dimension mesh metal layers by these two-dimentional mesh metal layers
Each structural unit (unit cell) with the three dimensional network structure 130 constituted only has a signal line 120.It is apparent that
This three dimensional network structure 130 can be considered as the three-dimensional arrangement of most structural units, in this any structural unit vertical
Two sides of the Z-direction of substrate surface are for adjacent two two-dimentional mesh metal layers and in the X-direction of parallel substrate surface direction and the side Y
It is all limited to two sides respectively by adjacent two-dimentional mesh connecting hole.It is apparent that as shown in Figure 1A to Fig. 1 D, in any one knot
In structure unit, the cabling mode of these signal wires includes single straight line and single folding line in horizontal direction, is also included vertical
Histogram single straight line and single folding line upwards.Whereby, any signal line can be inside this three dimensional network structure 130
Arbitrarily three-dimensional cabling (whether the bending cabling in some plane or straight-line track in a certain direction).Here,
Perpendicular to substrate surface direction, these signal wires are and to be parallel to these signals of substrate surface direction by these basket empty regions
Line is by the gap between these two-dimentional mesh connecting holes.
In general, these metal dielectrics layers at least about these signal wires, these two-dimentional mesh connecting holes and this
A little two dimension mesh metal layers, and it is usually filled with these signal wires, these two-dimentional mesh connecting holes and these two-dimentional mesh metals
The gap of interlayer.Also, to reduce the influence of capacitive coupling etc., these metal dielectrics layers are often by with low dielectric system
Several dielectric materials are formed.In practical application, the both ends of any signal line be often attached to different components or
Different endpoints seems the source/drain/gate of MOS transistor, endpoint inductively or capacitively or to be connected to collection
At the interface etc. of circuit external.Though in addition, not drawn especially in these diagrams, three dimensional network structure 130 is in practical application
In be all often to be electrically connected to some reference point of potential, seem the reference point of potential of substrate 110 or its positioned at substrate 110
The reference point of potential of its semiconductor subassembly.
It must be stressed that three-dimensional complementary conduction band structure proposed by the invention can apply in transmission line or
It applies in coupling line, or even can be applied to other products.That is, how many signal in any structural unit
Line does not need to limit, and the contour shape of this one or more signal wire and cabling mode etc. do not need to limit yet, this
Invention only requires that these signal wires are separated from each other and are also separated from each other with three dimensional network structure 130 to each other.
For example, Fig. 2A to Fig. 2 G show that the three-dimensional complementary conduction band structure of the present invention applies the shape in coupling line
Condition.Wherein Fig. 2A to Fig. 2 D show structural unit at this time, and Fig. 2 E and Fig. 2 G show the sample of three kinds of three-dimensional cablings.Citing comes
It says, the oblique view of Fig. 3 A to Fig. 3 D display signal lines this application of spiral cabling in the horizontal direction, vertical view, side view are with before
View, the oblique view of Fig. 3 E to Fig. 3 H display signal lines this application of spiral cabling in vertical direction, vertical view, side view with
Front view, the strabismus of Fig. 3 I to Fig. 3 L display signal lines while in the horizontal direction and the vertical direction this application of spiral cabling
Figure, vertical view, side view and front view.Here, being simplified, signal wire 120 is indicated with dark images, in signal wire week
The two-dimentional mesh metal layer of majority enclosed and most two-dimentional mesh connecting holes (or even substrate 110) are indicated with light pattern, are borrowed
Various three-dimensional cabling modes of signal wire in three-dimensional complementary conduction band structure to highlight the present invention.In addition, port (port) 140
The interface of the external environment of band structure is conducted for signal wire 120 and three-dimensional complementary, the present invention is not intended to limit its details, any known
Or the technology that will appear can be used with product in the future.
As illustrated in these figures, entire three-dimensional complementary conduction band structure can be considered as by most structural units in three-dimensional
Direction storehouse forms, or can be considered as being formed in three-dimensional storehouse by a most structural units and signal wire is at these
Structural unit interior three-dimensional cabling.Certainly, the structural unit of this two kinds of describing mode meanings is slightly different, the former structural unit
Inherently contain signal wire but the structural unit of the latter itself does not cover signal wire.Either that is described, and existing
There is the complementary conduction band structure of known two dimension to compare, three-dimensional complementary proposed by the invention conduction band structure not only allows one or more
The three-dimensional cabling of signal wire, and (or saying in adjacent two layers two-dimentional mesh metal interlevel) two or multi signal in the same plane
Line can be separated by two-dimentional mesh connecting hole the mesh metal layer of part (or even) each other and shield us.
Fig. 4 A to Fig. 4 C compendiously show the strabismus of the structural unit of three-dimensional complementary conduction band structure proposed by the invention
(to apply the situation in transmission line as sample, but the details of structural unit can also be applied to coupling for figure, vertical view and side view
Line or other application).Metal layer MET1 and MET3 is two-dimentional mesh metal layer, and metal layer MET2 is signal wire metal layer, and
And the cylindrical metal patch (patch) of each metal layer plane and the metal connecting hole (via) for being embedded in each inner metal dielectric layer
It is whether to connect metal layer MET1 and metal layer MET3 for being connected with each other different metal layers or connect metal layer MET2
With the metal layer positioned at another structural unit.Certainly, cylindrical metal patch is only for example, different embodiments can also
Using the patch of other shapes, or directly by both two-dimentional mesh metal layer and metal connecting hole link together without the use of
Any patch, or can also be omitted without using patch under conditions of design allows with manufacturing process.It is apparent that by will
Such structural unit permutation and combination on three-dimensional, can obtain various three dimensional network structures 130 (especially has specific
The three dimensional network structure 130 in period).It is apparent that band structure is conducted in such three-dimensional complementary, it not only can be as known
Two-dimentional complementary conduction band structure, X, Y ,-X and-Y this four direction offer signal wire cabling in the horizontal plane, can also pass through
The metal connecting hole (or even patch) of vertical direction provides the Z that the existing complementary conduction band structure of known two dimension can not provide
With the signal wire cabling in this two directions-Z.Whereby, the signal wire in any structural unit can pass through X, Y, Z ,-X ,-Y
It is connected with each other with one or more and the signal wire in other structures unit of-Z this six direction, and then forms the three of arbitrary cabling
Dimensional signal line.Wherein, the linking arm (connecting arm) of these diagrams presents such connection mechanism.
As shown in these icons, these structural units of three dimensional network structure 130 in the horizontal plane X-direction in Y-direction
The structural unit period be respectively Px and Py and be Pz in the structural unit period of vertical Z-direction, horizontal plane X-direction with
It is respectively Whx, Why and Whz that Y-direction, which also has the size (or saying it is size of mesh) of vertical direction Z-direction, and in horizontal plane
X-direction, Y-direction and the signal line dimensions (seeming length, width and thickness) of vertical Z-direction are respectively Sx, Sy and Sz.Generally
For, the design that three-dimensional complementary conducts band structure will at least refer to following several sizes because usually determining Px, Py and Pz three:
The required characteristic-impedance range of signal wire, the attainable minimum feature of integrated circuit fabrication process institute and line spacing, Yi Jixin
The maximum carrying electric current of number line.In addition, the respective minimum dimension of Sx, Sy and Sz three is at least dependent on IC manufacturing work
Skill the attainable limit and required design rule (design rule), and by adjustment Whx, Why and Whz tri-
Person and Sx, Sy and Sz three can also change the characteristic impedance etc. of three-dimensional complementary conduction band structure.In general, it is commercialized
Manufacturing process often fix Sz and only adjust Sx and Sy.In general, each knot of entire three-dimensional complementary conduction band structure
Period and size of the structure unit on three three-dimensionals and to be located therein the size of signal wire be all identical, so as to simplification
Structure and related manufacturing process.But in different embodiments, or the different structure unit in vertical direction different layers is allowed to have
There are different structural unit periods, structural unit size and/or signal line dimensions, or different structural units is allowed to have not
With the structural unit period and/or structural unit size, or allow different structural unit have different line number signals,
Signal line dimensions and/or signal wire distribution mode.
Compared with the existing complementary conduction band structure of known two dimension, three-dimensional complementary proposed by the invention conducts band structure
At least following several advantages.The first, more design parameters, further increase design flexibility;The second, signal wire is three-dimensional
Network is surrounded, interfering with each other can reducing unlike signal line to the masking effectiveness of signal wire;Third, three-dimensional grid knot
Structure is conducive to radiate, and caused noise or even failure cannot be distributed in time by reducing the heat generated in operation.Especially
Be, due to signal wire can in three dimensional network structure arbitrarily three-dimensional cabling, can adequately be promoted using area of base
The closeness of integrated circuit.
First, the present invention may not only have horizontal plane (X and Y bis- as the existing known complementary conduction band structure of two dimension
Direction) signal line dimensions (Sx, Sy), the adjustable ginseng of structural unit period (Px, Py) and size of mesh (Wx, Wy) this six
Number, can also with the signal line dimensions (Sz) of vertical direction (Z-direction), structural unit period (Pz) and size of mesh (Wz) this
Three adjustable parameters.Therefore, the present invention can the more existing known complementary conduction band structure of two dimension there are more adjustable ginsengs
Number, and then providing more may adjustment mode.Certainly, whether in that direction X, Y, Z, any one adjustable parameters can
Energy adjusting range is all at least related to such as semiconductor fabrication technique and semiconductor product specification etc..In addition, X, Y,
Tri- directions Z, the possibility adjusting range of these adjustable parameters are respectively to adjust.That is, regarding three-dimensional complementary
Conduct the demand (seeming the frequency and wavelength depending on the signal wire signal to be transmitted) of band structure, various parameters in these three directions
It corresponding can adjust.For example, when such three-dimensional complementary conduction band structure is used to as three-dimensional periodic guided wave
When structure, the size of Px, Py and Pz three need significantly less than guided wave length of grade (λ g).
Secondly, compared to the existing known complementary conduction band structure of two dimension, signal wire only in the upper surface of vertical direction and/or
Below (these two-dimentional mesh metal layers are often grounded), three-dimensional complementary of the invention are covered by these two dimension mesh metal layers
Conducting band structure not only can be by the two-dimentional mesh metal layer of these horizontal planes come mask signal line, can also be by connecting this
The two-dimentional mesh connecting hole of a little two dimension mesh metal layers carrys out mask signal line.Therefore, signal wire can be between different structure unit
The three-dimensional all shielded isolation in three directions, and then reduce mutual dry between one or more signal wires of different structure unit
It disturbs.
Furthermore since metal is the good conductor of heat, when signal wire exists in the structural unit that three-dimensional complementary conducts band structure
It is horizontal that (the whether metal or two-dimensional mesh of two-dimentional mesh metal layer is all surrounded by metal with vertical tri- directions X, Y, Z
The metal of mesh connecting hole), especially when these metals are all grounded, the present invention can the more existing known complementary conduction band structure of two dimension
The heat transfer that efficiently will appear in signal wire leaves entire three-dimensional complementary conduction band structure.Therefore, when signal wire is electric
Property is connected to active device (active device) and large power assembly (high-power component), and of the invention three
The complementary conduction band structure of dimension can the more existing known complementary conduction band structure of two dimension more effectively reduces generation signal wire heat
So that the probability that certain components excessive noise occur or even fail because of overheat in entire integrated circuit.
In particular, short circuit or noise in order to avoid being caused when certain two signal line contacts with each other (or too close to each other)
Problem, existing the known complementary conduction band structure of two dimension must detour be believed around another on two dimensional surface by a certain signal line
Number line, but three-dimensional complementary conduction band structure proposed by the invention can allow any signal line from the upper of another signal line
The past is crossed in side or lower section.Therefore, the present invention can be omitted the signal wire base that detour cabling additionally occupies on same level
Floor space, and then promote the closeness of the integrated circuit using the present invention.
For example, Fig. 5 A to Fig. 5 C compendiously show why the present invention can the more existing known complementary conduction band knot of two dimension
Structure saves area of base and promotes closeness, wherein it must be emphasized that ground be cabling mode and apply transmission line or coupling line without
It closes, that is, the advantage of the present invention shown by these icons is not only effective to being applied as transmission line.Fig. 5 A, which are shown, to be needed to connect
The distribution of the component (or saying endpoint) connect, this A1, B1, C1 and D1 to be connected respectively to by unlike signal line A2, B2, C2 with
D2.Fig. 5 B show the cabling mode using signal wire when existing known two dimension complementation conduction band structure, herein these signal wires
Half be in the horizontal plane linearly in two inter-module cablings, and in addition half signal wire be in the horizontal plane detour around
This half signal wire for crossing straight-line track comes in another two inter-module cablings.As shown, the occupied base in this sample
The length of side of X-direction and Y-direction is respectively five structural units and six structural units to floor space in the horizontal plane.Fig. 5 C are shown in
The cabling mode of signal wire, is all straight in the horizontal plane in this either signal line when conducting band structure using three-dimensional complementary of the present invention
Line in two inter-module cablings, but have the signal of half be by vertical cabling be moved to other horizontal planes into walking line come
Around only in the other half signal wire of same level horizontal cable run.As shown, the occupied substrate in this sample
The length of side of X-direction and Y-direction is respectively four structural units and five structural units to area in the horizontal plane.It is apparent that three-dimensional
Complementation conduction band structure can reduce used area of base and and then promote closeness.Here, being simplified, only draw
Signal wire 120 and three dimensional network structure 130.
For example, Fig. 5 D to Fig. 5 I show other sample.Wherein, Fig. 5 D and Fig. 5 E show all signal wires
Situation (being located at two two-dimentional mesh metal interlevels) in the same plane, Fig. 5 F and Fig. 5 G show that all signal wires are distributed in
The situation (being alternately located at three two-dimentional mesh metal interlevels) of upper and lower two planes, and Fig. 5 H and Fig. 5 I show all signal wires
It is distributed in the situation (being alternately located at five two-dimentional mesh metal interlevels) of totally four planes up and down.It is apparent that when signal wire exists
When upper and lower two plane cablings, the area of base of about percentage 45 relatively can be only saved in some plane cabling, and work as
Signal wire can further save the area of base of percentage 70 in totally four plane cablings up and down.Here, to simplify
Icon only draws signal wire 120 and three dimensional network structure 130.
In short, when though special icon does not need the component count connected more or component distribution mode is more in substrate
Situation when complicated, since signal wire needs detour cabling to avoid phase in the same plane when number is much more complicated with distribution
The group that the demand mutually contacted can be connected mostly with the advantages of more complicated therefore of the invention three-dimensional complementary conduction band structure in needs
Number of packages mesh will mostly become apparent from when being distributed more complicated.
Further, the also more existing complementary conduction band structure of known two dimension of three-dimensional complementary of the invention conduction band structure has
More adjustable parameters are not only conducive to obtain preferably isolation/radiate and be conducive to such as between different structure unit
The cabling of signal wire when the situations such as transmission line and coupling line is also beneficial to cooperation fab manufacturing process etc. and is adjusted to carry
The influence of both high characteristic impedance and qualitative factor and reduction to slow wave coefficient.
For example, when the three-dimensional complementary of present invention conduction band structure is used in microwave&millimeter-wave IC,
Can support quasi- transverse electromagnetic wave transmission mode and can more various existing known techniques can more reduce signal wire cabling mode
The influence of (seeming to bend cabling) for propagation constant (γ) and characteristic impedance.As well known, complex propagation constant (γ) can
To be expressed as γ=α+j β, wherein for α attenuation constants and β is phase constant.It can be by any tool for being used as transmission line
There is the S parameter of the signal wire at two ends that the characteristic impedance of this transmission lines, attenuation constant (α), phase constant (β) and matter is calculated
Amount factor.Relevant calculation formula difference is as follows:
As well known, ideally the characteristic impedance of transmission line and slow wave coefficient can't be with being transmitted signal
Frequency changes and changes, and qualitative factor be in the quarter-wave range for being transmitted signal direct proportion in being transmitted
The frequency of signal.
For example, Fig. 6 A show it is a kind of application the present invention three-dimensional complementary conduction band structure single transmission line situation and
Fig. 6 B to Fig. 6 D are respectively displayed on characteristic impedance under this situation, slow wave coefficient and qualitative factor three and are transmitted signal frequency
The simulation result of relationship.Fig. 6 E show a kind of single folding line situation of the three-dimensional complementary conduction band structure of the application present invention
And Fig. 6 F to Fig. 6 H are respectively displayed on characteristic impedance under this situation, slow wave coefficient and qualitative factor three and are transmitted signal frequency
Relationship simulation result.It is apparent that real part (Re (the Z of characteristic impedanceC)) and imaginary part (Im (ZC)) also have and decline
Subtract constant and phase constant, being substantially all will not change with frequency shift, especially when frequency is higher than 15GHz, and
Qualitative factor is substantially in fixed linear scale with frequency, especially when frequency is higher than 10~15GHz.In other words, it emulates
Result of calculation show the present invention can allow in each unit characteristic impedance, slow wave coefficient and qualitative factor three be transmitted letter
The relationship of number frequency approaches perfect condition.
For example, in the frequency range of 1-10GHz, Fig. 6 I to Fig. 6 K show the signal wire shown by Fig. 3 A to Fig. 3 D
Characteristic impedance, slow wave coefficient and the qualitative factor three of this application of spiral cabling in the horizontal direction and it is transmitted signal frequency
The simulation result of relationship, Fig. 6 L to Fig. 6 N show the spiral cabling in vertical direction of the signal wire shown by Fig. 3 E to Fig. 3 H
Characteristic impedance, slow wave coefficient and the qualitative factor three of this application and the simulation result for being transmitted signal frequency relationship,
And Fig. 6 O to Fig. 6 Q show the signal wire shown by Fig. 3 I to Fig. 3 L that spiral cabling is this in the horizontal direction and the vertical direction answers
Characteristic impedance, slow wave coefficient and qualitative factor three and the simulation result for being transmitted signal frequency relationship.It is apparent that
Whether in the situation of that three-dimensional cabling, simulation result all shows that the real part of characteristic impedance also has with imaginary part and decays
Constant, phase constant and qualitative factor three, are substantially all and are unlikely to change with frequency shift, do not have especially suddenly
Fluctuations and extremely gradually slightly increase with increasing or decreasing for frequency in high-frequency or low frequency two at most
Or it reduces.In other words, the simulation result display three-dimensional cabling of the invention that can be allowed in three-dimensional complementary conducts band structure
Characteristic impedance, slow wave coefficient and qualitative factor three and be transmitted the relationship of signal frequency and approach perfect condition.
The above described is only a preferred embodiment of the present invention, limitation in any form not is done to the present invention, though
So the present invention has been disclosed as a preferred embodiment, and however, it is not intended to limit the invention, any technology people for being familiar with this profession
Member, without departing from the scope of the present invention, when the technology contents using the disclosure above make a little change or modification
For the equivalent embodiment of equivalent variations, as long as being the content without departing from technical solution of the present invention, according to the technical essence of the invention
Any simple modification, equivalent change and modification made to the above embodiment, in the range of still falling within technical solution of the present invention.
Claims (20)
1. a kind of three-dimensional complementary conducts band structure, it is characterised in that include:
Most two-dimentional mesh metal layers, in the mutual storehouse on substrate surface direction;
Most two-dimentional mesh connecting holes are connecting up these two-dimentional mesh metal layers perpendicular to substrate surface side respectively:
Most signal wire metal layers are handed in the mutual storehouse on substrate surface direction and with these two-dimentional mesh metal layers
Mistake arrangement:And
Most signal wire connecting holes, are connecting up these signal wire metal layers perpendicular to substrate surface side respectively:
Here, any two dimension mesh metal layer is all the plane metal layer with one or more basket empty regions, these two-dimentional meshes
A three dimensional network structure is collectively formed with these two-dimentional mesh connecting holes in metal layer;
Here, either signal line metal layer is all one or more metal wires on parallel substrate surface, these signal wire metal layers and this
One or more signal wires are collectively formed in a little signal wire connecting holes;
Here, either signal line is all separated from each other with three dimensional network structure and other signals line, and either signal line all may be used
With the three-dimensional cabling in this three dimensional network structure.
2. three-dimensional complementary according to claim 1 conducts band structure, it is characterised in that:This three dimensional network structure is majority
The three-dimensional arrangement of a structural unit, this any structural unit two sides of the Z-direction of vertical substrate surface be adjacent two
Two-dimentional mesh metal layer and in two sides of the X-direction of parallel substrate surface direction and Y-direction respectively all by adjacent two two-dimensional mesh
Mesh connecting hole is limited.
3. three-dimensional complementary according to claim 2 conducts band structure, which is characterized in that at least one following items are any
The adjustable parameters of a structural unit:X-direction signal line dimensions (Sx), Y-direction signal line dimensions (Sy), Z-direction signal wire ruler
Very little (Sz), X-direction structural unit period (Px), Y-direction structural unit period (Py), Z-direction structural unit period (Pz), the side X
To size of mesh (Wx), Y-direction size of mesh (Wy) and Z-direction size of mesh (Wz).
4. three-dimensional complementary according to claim 2 conducts band structure, it is characterised in that:It can be in any structural unit
There are one or more signal wires.
5. three-dimensional complementary according to claim 2 conducts band structure, which is characterized in that in any structural unit these
The possibility cabling of signal wire is at least following several:Single cabling in horizontal direction, bending cabling, vertical direction in horizontal direction
Upper single cabling, Vertical Square are folded upward at cabling.
6. three-dimensional complementary according to claim 2 conducts band structure, which is characterized in that in these letters of any structural unit
The possibility cabling of number line is at least following several:The parallel cabling of double joint in horizontal direction, the parallel cabling of double joint, water in vertical direction
Square upward coupled line structure, the coupled line structure in vertical direction, in horizontal direction two shuttle side by side, in vertical direction
Two shuttle, three or more signal lines pass through respectively side by side.
7. three-dimensional complementary according to claim 2 conducts band structure, which is characterized in that in these letters of any structural unit
The possibility profile of number line is at least following several:Rectilinear form, L-type shape, T-type shape, cross-type shape, five straight lines are mutual
Connection or six straight lines are connected with each other.
8. three-dimensional complementary according to claim 1 conducts band structure, it is characterised in that:On substrate surface direction
These signal wires are by these basket empty regions, these signal wires are by these two-dimensional mesh on being parallel to substrate surface direction
Gap between mesh connecting hole.
9. three-dimensional complementary according to claim 1 conducts band structure, it is characterised in that:Further include most metal dielectrics
Matter layer, any one metal dielectrics layer are to be located at adjacent two-dimentional mesh metal layer and signal wire metal interlevel.
10. three-dimensional complementary according to claim 1 conducts band structure, it is characterised in that further include one of following:
These two-dimentional bottom one of mesh metal layers are directly contacted with substrate;And
Bottom one of these signal wire metal layers are directly contacted with substrate.
11. three-dimensional complementary according to claim 1 conducts band structure, it is characterised in that further include at least one of following:
This three dimensional network structure is grounded;And
These signal wires are electrically connected respectively to majority component and/or endpoint positioned at substrate respectively.
12. a kind of three-dimensional complementary conducts band structure, it is characterised in that include:
Three dimensional network structure has most structural units;And
Or multi signal line, in this three dimensional network structure interior three-dimensional cabling;
Here, these structural units are three-dimensional arrangements in substrate;
Here, any structural unit all has at least one basket empty region;
Here, these signal wires are these basket empty regions via these structural units in these structural unit three-dimensional cablings;
Here, can have one or more signal wires in any structural unit;
Here, either signal line is all separated from each other with three dimensional network structure and other signal wires.
13. three-dimensional complementary according to claim 12 conducts band structure, it is characterised in that:Three dimensional network structure includes up and down
Two or multiple two-dimentional mesh metal layers of mutual storehouse, each two-dimentional mesh metal layer is that have one or more basket dead zones herein
The plane metal layer in domain, these two-dimentional mesh metal layers are connected with each other by most two-dimentional mesh connecting holes herein.
14. three-dimensional complementary according to claim 13 conducts band structure, it is characterised in that:Any structural unit is vertical
Two sides of the Z-direction of substrate surface are for adjacent two two-dimentional mesh metal layers and in the X-direction of parallel substrate surface direction and the side Y
It is all limited to two sides respectively by adjacent two two-dimentional mesh connecting holes.
15. three-dimensional complementary according to claim 12 conducts band structure, which is characterized in that at least following one is any one
The adjustable parameters of structural unit:X-direction signal line dimensions (Sx), Y-direction signal line dimensions (Sy), Z-direction signal line dimensions
(Sz), X-direction structural unit period (Px), Y-direction structural unit period (Py), Z-direction structural unit period (Pz), X-direction
Size of mesh (Wx), Y-direction size of mesh (Wy) and Z-direction size of mesh (Wz).
16. three-dimensional complementary according to claim 12 conducts band structure, which is characterized in that in any structural unit this
The possibility cabling of a little signal wires is at least following several:Single cabling in horizontal direction, bending cabling, Vertical Square in horizontal direction
Upward single cabling, Vertical Square are folded upward at cabling.
17. three-dimensional complementary according to claim 12 conducts band structure, which is characterized in that any structural unit these
The possibility cabling of signal wire is at least following several:The parallel cabling of double joint in horizontal direction, the parallel cabling of double joint in vertical direction,
The coupled line structure on coupled line structure, vertical direction in horizontal direction, in horizontal direction two shuttle side by side, vertical direction
Upper two shuttle, three or more signal lines pass through respectively side by side.
18. three-dimensional complementary according to claim 12 conducts band structure, which is characterized in that any structural unit these
The possibility profile of signal wire is at least following several:Rectilinear form, L-type shape, T-type shape, cross-type shape, five straight line phases
It connects or six straight lines is connected with each other.
19. three-dimensional complementary according to claim 12 conducts band structure, it is characterised in that further include at least one of following:
Any signal line is all separated from each other with each edge of structural unit in each structural unit;And
It is to three dimensional network structure and either signal line is all mutually electrical around the dielectric material of three dimensional network structure
Isolation.
20. three-dimensional complementary according to claim 12 conducts band structure, it is characterised in that further include at least one of following:
Three dimensional network structure is ground connection;And
These signal wires are electrically connected respectively to majority component and/or endpoint positioned at substrate respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710225765.9A CN108695583A (en) | 2017-04-07 | 2017-04-07 | Three-dimensional complementary conducts band structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710225765.9A CN108695583A (en) | 2017-04-07 | 2017-04-07 | Three-dimensional complementary conducts band structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108695583A true CN108695583A (en) | 2018-10-23 |
Family
ID=63842988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710225765.9A Withdrawn CN108695583A (en) | 2017-04-07 | 2017-04-07 | Three-dimensional complementary conducts band structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108695583A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101752343A (en) * | 2008-12-09 | 2010-06-23 | 台湾积体电路制造股份有限公司 | Integrated circuit structure |
| CN101752350A (en) * | 2008-12-18 | 2010-06-23 | 庄晴光 | Multi-layer complementary metal transmission line structure |
| CN101859773A (en) * | 2009-04-02 | 2010-10-13 | 台湾积体电路制造股份有限公司 | Circuit and method for improving radiation reinforcement degree of memory element |
| US20140262475A1 (en) * | 2013-03-12 | 2014-09-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | 3D Shielding Case and Methods for Forming the Same |
| CN104103627A (en) * | 2013-04-09 | 2014-10-15 | 瑞萨电子株式会社 | Semiconductor device and interconnect substrate |
| CN106450631A (en) * | 2016-11-21 | 2017-02-22 | 天津大学 | Marchand balun based on complementary type metal coupling line |
-
2017
- 2017-04-07 CN CN201710225765.9A patent/CN108695583A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101752343A (en) * | 2008-12-09 | 2010-06-23 | 台湾积体电路制造股份有限公司 | Integrated circuit structure |
| CN101752350A (en) * | 2008-12-18 | 2010-06-23 | 庄晴光 | Multi-layer complementary metal transmission line structure |
| CN101859773A (en) * | 2009-04-02 | 2010-10-13 | 台湾积体电路制造股份有限公司 | Circuit and method for improving radiation reinforcement degree of memory element |
| US20140262475A1 (en) * | 2013-03-12 | 2014-09-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | 3D Shielding Case and Methods for Forming the Same |
| CN104103627A (en) * | 2013-04-09 | 2014-10-15 | 瑞萨电子株式会社 | Semiconductor device and interconnect substrate |
| CN106450631A (en) * | 2016-11-21 | 2017-02-22 | 天津大学 | Marchand balun based on complementary type metal coupling line |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI423515B (en) | Integrated circuit structure | |
| TW461108B (en) | Semiconductor device | |
| CN109087905B (en) | Semiconductor package device and semiconductor wiring board thereof | |
| TWI415327B (en) | Integrated circuit structure | |
| CN103050483A (en) | Vertically oriented semiconductor device and shielding structure thereof | |
| US9831173B2 (en) | Slot-shielded coplanar strip-line compatible with CMOS processes | |
| DE112015007233B4 (en) | MICROPROCESSOR HOUSING WITH GROUND ISOLATION FABRIC STRUCTURE WITH FIRST LEVEL CONTACT BUMPS AND METHOD FOR FORMING A GROUND ISOLATION FABRIC STRUCTURE HOUSING FROM CONDUCTIVE MATERIAL | |
| JP2010519777A (en) | Improved noise isolation in high speed digital systems on packages and printed circuit boards (PCBs) | |
| EP3062340B1 (en) | Transit card and electronic component | |
| US20120135599A1 (en) | Circuit structures and methods with beol layers configured to block electromagnetic edge interference | |
| US6781236B2 (en) | Semiconductor device using a multilayer wiring structure | |
| CN108695583A (en) | Three-dimensional complementary conducts band structure | |
| US9978699B1 (en) | Three-dimensional complementary-conducting-strip structure | |
| TW201906123A (en) | Semiconductor package and its semiconductor wiring substrate | |
| KR20050022321A (en) | A substrate having micro strip line structure, a semiconductor having micro strip line structure, and a manufacturing method of a substrate having micro strip line structure | |
| TWI665781B (en) | Three-dimentsional complementary-conducting-strip structure | |
| CN113887732B (en) | Quantum chip and method for inhibiting signal crosstalk in quantum chip | |
| Veremey et al. | A technique for fast calculation of capacitance matrices of interconnect structures | |
| KR20150025706A (en) | Structure of a slow-wave microstrip line with high Q factor and a shorter wavelength | |
| Sharma et al. | Characteristic impedance of a microstrip-like interconnect line in presence of ground plane aperture | |
| Biswas et al. | Customary of CPW configuration’s in silicon RF technology targeting monolithic integration for GHz to THz frequency band | |
| TW486789B (en) | Semiconductor device | |
| Lam et al. | A 50-Ohm semi-enclosed stripline design in a 90-nm CMOS Process for silicon-based monolithic microwave wave integrated circuits | |
| Rashid et al. | Efficient design of integrated antennas on si for on-chip wireless interconnects in multi-layer metal process | |
| Cai et al. | Scaling superconducting quantum chip with highly integratable quantum building blocks |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20181023 |