TWI665069B - Gripper device for insertion - Google Patents
Gripper device for insertion Download PDFInfo
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- TWI665069B TWI665069B TW107131950A TW107131950A TWI665069B TW I665069 B TWI665069 B TW I665069B TW 107131950 A TW107131950 A TW 107131950A TW 107131950 A TW107131950 A TW 107131950A TW I665069 B TWI665069 B TW I665069B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
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Abstract
一種用於插件的夾取裝置,包含驅動總成以及二夾爪。二夾爪連接於驅動總成,並且驅動總成驅動二夾爪的至少其中之一在水平驅動方向移動而互相靠近;二夾爪分別具有垂直部以及夾取部,垂直部具有第一端以及第二端,第一端連接於驅動總成,並且夾取部連接於第二端;二夾爪的夾取部互相平行地並列設置,並且垂直於水平驅動方向。利用此一夾取裝置,電子元件的本體的前側面及後側面預留給夾爪的操作空間可以有效地縮小。A clamping device for an insert card includes a driving assembly and two clamping jaws. The two clamping jaws are connected to the driving assembly, and the driving assembly drives at least one of the two clamping jaws to move in the horizontal driving direction to approach each other; the two clamping jaws have a vertical portion and a gripping portion, respectively, and the vertical portion has a first end and The second end, the first end is connected to the driving assembly, and the clamping portion is connected to the second end; the clamping portions of the two clamping jaws are arranged in parallel with each other and perpendicular to the horizontal driving direction. With this clamping device, the operation space reserved for the clamping claws on the front and rear sides of the body of the electronic component can be effectively reduced.
Description
本發明有關於夾取裝置,特別是關於一種用於插件的夾取裝置。The present invention relates to a gripping device, and more particularly to a gripping device for a card.
現行電路板的插件作業,亦即將電子元件1的連接引腳2插入電路板的導電通孔的作業,是利用插件設備執行。插件設備上設置由氣壓缸3驅動的夾爪4,由送料機構夾取電子元件1,並且移動電子元件1到電路板上以將引腳2插入對應的導電通孔後,釋放電子元件1於電路板上。The current plug-in operation of the circuit board, that is, the operation of inserting the connection pin 2 of the electronic component 1 into the conductive through hole of the circuit board, is performed using a plug-in device. The plug-in device is provided with a clamping jaw 4 driven by a pneumatic cylinder 3, the electronic component 1 is gripped by the feeding mechanism, and the electronic component 1 is moved to the circuit board to insert the pin 2 into the corresponding conductive through hole, and then the electronic component 1 is released on the Circuit board.
圖1以陶瓷電容器作為電子元件1的範例說明,陶瓷電容器具有一個扁平的本體。二夾爪4是向下延伸後,水平地朝彼此延伸,以分別從電子元件1的兩個扁平側夾取本體。因此,本體的兩個扁平側之外必須預留夾爪4的操作空間S,才能讓夾爪4把電子元件1移動到插件位置後,還可以張開並且釋放電子元件1。Figure 1 illustrates a ceramic capacitor as an example of the electronic component 1. The ceramic capacitor has a flat body. After the two clamping claws 4 extend downward, they horizontally extend toward each other, so as to clamp the bodies from the two flat sides of the electronic component 1 respectively. Therefore, the operating space S of the gripper 4 must be reserved outside the two flat sides of the body, so that the gripper 4 can open and release the electronic component 1 after the electronic component 1 is moved to the insertion position.
然而,扁平的電子元件1最佳化的空間配置是以扁平側互相平行排列設置,並且盡可能地減少相鄰電子元件1之間的間隔距離。為了確保夾爪4可以操作,此間隔距離往往受限於夾爪4的操作空間S限制,無法任意的縮小,而影響到電路板上的空間利用效率。即使,電子元件1不是陶瓷電容,例如圓柱狀的電解電容,相鄰電解電容之間仍需要預留夾爪4的操作空間S。However, the optimized spatial configuration of the flat electronic components 1 is such that flat sides are arranged in parallel to each other, and the distance between adjacent electronic components 1 is reduced as much as possible. In order to ensure that the clamping claw 4 can be operated, this interval is often limited by the operating space S of the clamping claw 4 and cannot be arbitrarily reduced, which affects the space utilization efficiency of the circuit board. Even if the electronic component 1 is not a ceramic capacitor, such as a cylindrical electrolytic capacitor, an operating space S of the clamping claw 4 still needs to be reserved between adjacent electrolytic capacitors.
為了解決縮小預留給夾爪的操作空間從而縮短相鄰電子元件之間的間隔距離的技術課題,本發明提出一種用於插件的夾取裝置,用於解決前述技術課題。In order to solve the technical problem of reducing the operation space reserved for the clamping jaws and thereby shortening the distance between adjacent electronic components, the present invention proposes a clamping device for a plug-in, which is used to solve the aforementioned technical problem.
本發明提出一種用於插件的夾取裝置,包含驅動總成以及二夾爪。二夾爪連接於驅動總成,並且驅動總成驅動二夾爪的至少其中之一在水平驅動方向移動而互相靠近;二夾爪分別具有垂直部以及夾取部,垂直部具有第一端以及第二端,第一端連接於驅動總成,並且夾取部連接於第二端;二夾爪的夾取部互相平行地並列設置,並且垂直於水平驅動方向。The invention proposes a clamping device for a card, which comprises a driving assembly and two clamping jaws. The two clamping jaws are connected to the driving assembly, and the driving assembly drives at least one of the two clamping jaws to move in the horizontal driving direction to approach each other; the two clamping jaws have a vertical portion and a gripping portion, respectively, and the vertical portion has a first end and The second end, the first end is connected to the driving assembly, and the clamping portion is connected to the second end; the clamping portions of the two clamping jaws are arranged in parallel with each other and perpendicular to the horizontal driving direction.
在至少一實施例中,夾取裝置更包含水平致動部,二夾爪的至少其中之一的垂直部連接於水平致動部,並且水平致動部驅動二夾爪的至少其中之一在水平驅動方向上移動。In at least one embodiment, the gripping device further includes a horizontal actuation portion, a vertical portion of at least one of the two grippers is connected to the horizontal actuation portion, and the horizontal actuation portion drives at least one of the two grippers to Move in the horizontal drive direction.
在至少一實施例中,每一夾取部分別具有至少一定位凹槽,位於二夾取部互相面對的一側面,並且二夾取部的定位凹槽是成對配置而可結合為一定位穿孔。In at least one embodiment, each gripping portion has at least one positioning groove, which is located on a side of the two gripping portions facing each other, and the positioning grooves of the two gripping portions are configured in pairs and can be combined into one. Position the perforation.
在至少一實施例中,二夾取部的其中一個夾取部具有至少一定位凹槽,並且另一個夾取部具有至少一定位凸塊,定位凹槽與定位凸塊分別位於二夾取部互相面對的一側面,定位凹槽與定位凸塊成對配置,並且定位凸塊突出的高度小於定位凹槽內凹的深度。In at least one embodiment, one of the two gripping portions has at least one positioning groove, and the other gripping portion has at least one positioning protrusion. The positioning groove and the positioning protrusion are respectively located in the two gripping portions. On a side facing each other, the positioning groove and the positioning projection are arranged in pairs, and the protruding height of the positioning projection is smaller than the depth of the indentation of the positioning groove.
在至少一實施例中,每一夾爪更包含水平延伸部,延伸於第二端,每一夾爪的水平延伸部朝向另一夾爪延伸,並且夾取部延伸於水平延伸部而間接地連接於第二端。In at least one embodiment, each jaw further includes a horizontal extension portion extending to the second end, the horizontal extension portion of each jaw extends toward the other jaw, and the grip portion extends indirectly to the horizontal extension portion. Connected to the second end.
在至少一實施例中,水平延伸部平行於水平驅動方向。In at least one embodiment, the horizontally extending portion is parallel to the horizontal driving direction.
在至少一實施例中,夾取裝置更包含支撐杆,連接於驅動總成,並且支撐杆具有支撐部,支撐部位於二夾取部之間,並且與二夾取部平行。In at least one embodiment, the gripping device further includes a support rod connected to the drive assembly, and the support rod has a support portion located between the two gripping portions and parallel to the two gripping portions.
在至少一實施例中,支撐杆更包含連接部,連接部的一端連接於驅動總成,並且支撐部連接於連接部的另一端。In at least one embodiment, the support rod further includes a connection portion, one end of the connection portion is connected to the drive assembly, and the support portion is connected to the other end of the connection portion.
在至少一實施例中,在二夾取部的頂緣之間定義夾取平面,支撐部的頂面位於夾取平面。In at least one embodiment, a clamping plane is defined between the top edges of the two clamping portions, and the top surface of the supporting portion is located on the clamping plane.
在至少一實施例中,在二夾取部的頂緣之間定義夾取平面,夾取平面位於支撐部的頂面與驅動總成之間。In at least one embodiment, a clamping plane is defined between the top edges of the two clamping portions, and the clamping plane is located between the top surface of the support portion and the driving assembly.
透過前述的夾取裝置,電子元件的本體的前側面及後側面預留給夾爪的操作空間可以有效地縮小,使得電子元件與前後的其他電子元件之間的間隔距離可以縮短,而提升電路板上電子元件配置空間的利用率。Through the aforementioned clamping device, the operation space reserved for the clamping claws on the front and rear sides of the electronic component body can be effectively reduced, so that the distance between the electronic component and other electronic components in the front and rear can be shortened, and the circuit can be improved. Utilization of space for electronic components on board.
參閱圖2、圖3以及圖4所示,是本發明第一實施例的一種用於插件的夾取裝置100。插件(Insertion)是指將電子元件200的引腳220插入電路板300的導電通孔310(Plating Through Hole)的作業。前述的電子元件200包含本體210以及多個引腳220;電子元件200的一具體實施例是陶瓷電容器,具有扁平的本體210以及兩個平行的引腳220。夾取裝置100用於從送料機構或送料盤夾取電子元件200,將電子元件200放置於一電路板300,並且將引腳220插入電路板300的導電通孔310中。後續再透過焊接作業,將引腳220固定於導電通孔310,使電子元件200與電路板300達成電性連接。Referring to FIG. 2, FIG. 3 and FIG. 4, a first embodiment of the present invention is a clamping device 100 for a card. Insertion refers to the operation of inserting the pins 220 of the electronic component 200 into the conductive through holes 310 (Plating Through Hole) of the circuit board 300. The aforementioned electronic component 200 includes a main body 210 and a plurality of pins 220. A specific embodiment of the electronic component 200 is a ceramic capacitor, which has a flat body 210 and two parallel pins 220. The clamping device 100 is used to clamp the electronic component 200 from the feeding mechanism or the feeding tray, place the electronic component 200 on a circuit board 300, and insert the pins 220 into the conductive through holes 310 of the circuit board 300. Subsequently, the lead 220 is fixed to the conductive through hole 310 through a soldering operation, so that the electronic component 200 and the circuit board 300 are electrically connected.
如圖2以及圖3所示,第一實施例的夾取裝置100包含驅動總成110以及二夾爪120。驅動總成110用於沿插件方向Y以及平移方向X移動,並且插件方向Y與平移方向X垂直。平移方向X平行於電路板300的表面,而插件方向Y垂直於電路板300的表面。驅動總成110也在水平驅動方向Z驅動二夾爪120互相靠近或遠離,以夾取或釋放電子元件200。同時,驅動總成110用於帶動夾爪120沿著插件方向Y朝向電路板300移動或遠離電路板300,以將電子元件200放置於電路板300上,並且將引腳220插入導電通孔310中。在一具體實施例中,驅動總成110設置於二軸移動平台,而被二軸移動平台帶動平移,而沿著平移方向X移動於送料機構以及電路板300之間,並且二軸移動平台可以上下沿著插件方向Y移動驅動總成110,使得驅動總成110可以沿著插件方向Y朝向電路板300接近。As shown in FIG. 2 and FIG. 3, the clamping device 100 of the first embodiment includes a driving assembly 110 and two clamping jaws 120. The driving assembly 110 is configured to move in the plug-in direction Y and the translation direction X, and the plug-in direction Y is perpendicular to the translation direction X. The translation direction X is parallel to the surface of the circuit board 300, and the plug-in direction Y is perpendicular to the surface of the circuit board 300. The driving assembly 110 also drives the two clamping jaws 120 toward or away from each other in the horizontal driving direction Z to clamp or release the electronic component 200. At the same time, the driving assembly 110 is used to drive the gripper 120 to move toward or away from the circuit board 300 along the plug-in direction Y to place the electronic component 200 on the circuit board 300 and insert the pin 220 into the conductive through hole 310 in. In a specific embodiment, the driving assembly 110 is disposed on the two-axis mobile platform, and is driven to translate by the two-axis mobile platform, and moves along the translation direction X between the feeding mechanism and the circuit board 300, and the two-axis mobile platform can be The drive assembly 110 is moved up and down along the plug-in direction Y so that the drive assembly 110 can be approached toward the circuit board 300 along the plug-in direction Y.
如圖2、圖3以及圖4所示,二夾爪120連接於驅動總成110。驅動總成110至少具有一個水平致動部112,二夾爪120的至少其中之一連接於水平致動部112,水平致動部112在水平驅動方向Z驅動二夾爪120的至少其中之一移動。二夾爪120分別具有垂直部122以及夾取部124。垂直部122具有第一端1221以及第二端1222。第一端1221連接於驅動總成110,並且夾取部124直接或間接地連接於第二端1222。在實際配置夾爪120以及驅動總成110時,垂直部122的延伸方向垂直於水平驅動方向Z,並且平行於插件方向Y,而由驅動總成110朝電路板300的表面延伸。As shown in FIGS. 2, 3 and 4, the two clamping jaws 120 are connected to the driving assembly 110. The driving assembly 110 has at least one horizontal actuating portion 112, at least one of the two grippers 120 is connected to the horizontal actuating portion 112, and the horizontal actuating portion 112 drives at least one of the two grippers 120 in the horizontal driving direction Z. mobile. The two clamping jaws 120 each include a vertical portion 122 and a clamping portion 124. The vertical portion 122 has a first end 1221 and a second end 1222. The first end 1221 is connected to the driving assembly 110, and the gripping portion 124 is directly or indirectly connected to the second end 1222. When the gripper 120 and the driving assembly 110 are actually arranged, the extending direction of the vertical portion 122 is perpendicular to the horizontal driving direction Z and parallel to the plug-in direction Y, and the driving assembly 110 extends toward the surface of the circuit board 300.
如圖2、圖3以及圖4所示,驅動總成110用於驅動二夾爪120的至少其中之一移動,而使得二夾爪120互相靠近,由此利用二夾爪120的夾取部124夾取電子元件200的本體210。在一具體實施例中,二夾爪120其中之一的垂直部122,以其第一端1221連接於驅動總成110的水平致動部112,使得一個夾爪120可以在垂直於水平驅動方向Z的方向上移動並且朝向另一個夾爪120靠近,而使二夾取部124夾取電子元件200。較佳地配置方式是二夾爪120的垂直部122分別以第一端1221連接於水平致動部112,並且水平致動部112可以驅動二夾爪120在水平驅動方向上互相反向的移動,而驅動夾爪120移動而互相靠近或是遠離。As shown in FIG. 2, FIG. 3, and FIG. 4, the driving assembly 110 is used to drive at least one of the two clamping jaws 120 to move, so that the two clamping jaws 120 are close to each other, thereby utilizing the clamping portion of the two clamping jaws 120. 124 clamps the body 210 of the electronic component 200. In a specific embodiment, the vertical portion 122 of one of the two clamping jaws 120 is connected to the horizontal actuating portion 112 of the driving assembly 110 with the first end 1221 thereof, so that one clamping jaw 120 can be perpendicular to the horizontal driving direction. The electronic device 200 moves in the direction of Z and approaches toward the other clamping claw 120, so that the two clamping portions 124 clamp the electronic component 200. The preferred configuration is that the vertical portions 122 of the two jaws 120 are connected to the horizontal actuation portion 112 with the first ends 1221, respectively, and the horizontal actuation portion 112 can drive the two jaws 120 to move in opposite directions in the horizontal driving direction. , And the driving jaws 120 move to approach each other or away from each other.
如圖4所示,二夾爪120的夾取部124互相平行地並列設置,並且垂直於水平驅動方向Z,而以夾取部124側面夾取本體210。當夾取裝置100對水平放置(平行於平移方向X)的電路板300執行插件作業時,夾取部124可以平行於水平面,有利於對電子元件200平衡施力。As shown in FIG. 4, the clamping portions 124 of the two clamping jaws 120 are arranged in parallel with each other, and are perpendicular to the horizontal driving direction Z, and the body 210 is clamped by the side of the clamping portion 124. When the gripping device 100 performs a plug-in operation on the circuit board 300 placed horizontally (parallel to the translation direction X), the gripping portion 124 may be parallel to a horizontal plane, which is beneficial to balance and force the electronic component 200.
二夾爪120的夾取部124可以直接夾取電子元件200的本體210,特別是接觸扁平狀本體210的兩扁平側面進行夾取。在電子元件200的引腳220數量只有兩個,或者引腳220數量多於兩個並且引腳220是互相平行地配置在同一平面,夾取部124也可以夾取引腳220。The clamping portion 124 of the two clamping claws 120 can directly clamp the main body 210 of the electronic component 200, in particular, the two flat side surfaces contacting the flat body 210 for clamping. The number of pins 220 of the electronic component 200 is only two, or the number of pins 220 is more than two, and the pins 220 are arranged parallel to each other on the same plane, and the gripping portion 124 can also grip the pins 220.
如圖2、圖3以及圖4所示,每一夾爪120更包含水平延伸部126,延伸於垂直部122的第二端1222,並且水平延伸部126可平行於水平驅動方向Z。每一夾爪120的水平延伸部126朝向另一夾爪120延伸,而使二夾爪120的水平延伸部126相對地延伸。每一夾取部124延伸於每一水平延伸部126而間接地連接於每一第二端1222。As shown in FIG. 2, FIG. 3 and FIG. 4, each gripper 120 further includes a horizontal extension portion 126 extending from the second end 1222 of the vertical portion 122, and the horizontal extension portion 126 may be parallel to the horizontal driving direction Z. The horizontal extending portion 126 of each clamping jaw 120 extends toward the other clamping jaw 120, and the horizontal extending portions 126 of the two clamping jaws 120 extend relatively. Each gripping portion 124 extends from each horizontally extending portion 126 and is indirectly connected to each second end 1222.
如圖所示,透過水平延伸部126的設置,二個垂直部122之間的間隔距離,就不需要等於二個夾取部124之間的間隔距離,亦即,夾取部124之間的間隔距離可以透過水平延伸部126調整,而不受限於垂直部122之間的間隔距離。因此,夾爪120的垂直部122仍可連接於尺寸相對較大的驅動總成110,而透過水平延伸部126調整夾取部124之間的間隔距離,仍可適用於夾取小尺寸的電子元件200。As shown in the figure, through the arrangement of the horizontally extending portion 126, the separation distance between the two vertical portions 122 need not be equal to the separation distance between the two clamping portions 124, that is, the distance between the clamping portions 124 The separation distance can be adjusted through the horizontal extension portion 126 without being limited by the separation distance between the vertical portions 122. Therefore, the vertical portion 122 of the clamping jaw 120 can still be connected to a relatively large-sized drive assembly 110, and the distance between the clamping portions 124 can be adjusted by the horizontal extension portion 126, which is still suitable for clamping small-sized electronics. Component 200.
如圖2、圖3以及圖4所示,每一夾取部124分別具有至少一定位凹槽1242,位於二夾取部124互相面對的一側面,並且二夾取部124的定位凹槽1242是成對配置而可結合為一定位穿孔125。針對兩個引腳220的電子元件200所設計的二夾爪120中,每一夾取部124分別具有兩個定位凹槽1242,並且在二夾取部124上形成兩對定位凹槽1242。As shown in FIG. 2, FIG. 3, and FIG. 4, each gripping portion 124 has at least one positioning groove 1242, which is located on a side of the two gripping portions 124 facing each other, and the positioning grooves of the two gripping portions 124. 1242 is a pair configuration and can be combined into a positioning perforation 125. In the two clamping jaws 120 designed for the electronic component 200 with two pins 220, each clamping portion 124 has two positioning grooves 1242, and two pairs of positioning grooves 1242 are formed on the two clamping portions 124.
如圖5以及圖6所示,當各夾取部124互相靠近後,兩對定位凹槽1242形成兩個定位穿孔125,兩個定位穿孔125平行於插件方向Y,並且兩個定位穿孔125之間的間隔距離等於兩個引腳220之間的間隔距離。定位穿孔125用於容置引腳220,使得引腳220在平移方向X不會滑動,並且定位穿孔125在插件方向Y上也可以對引腳220形成拘束作用,使得引腳220不會偏斜,而可準確插入電路板300的引腳220插孔中。在一具體實施例中,定位穿孔125的直徑等於或是小於引腳220的直徑,以確保二夾取部124可以夾住引腳220。As shown in FIG. 5 and FIG. 6, when the gripping portions 124 are close to each other, two pairs of positioning grooves 1242 form two positioning holes 125, the two positioning holes 125 are parallel to the inserting direction Y, and The separation distance is equal to the separation distance between the two pins 220. The positioning hole 125 is used to receive the pin 220 so that the pin 220 does not slide in the translation direction X, and the positioning hole 125 can also restrain the pin 220 in the plug-in direction Y so that the pin 220 does not deflect , And can be accurately inserted into the 220-pin jack of the circuit board 300. In a specific embodiment, the diameter of the positioning through hole 125 is equal to or smaller than the diameter of the pin 220 to ensure that the two clamping portions 124 can clamp the pin 220.
參閱圖7所示,當引腳220數量多於兩個並且引腳220是互相平行地配置在同一平面,則定位凹槽1242的數量也設置為與引腳220的數量相同。例如當引腳220數量為三個時,定位凹槽1242的數量增加為三個,並且相鄰的定位凹槽1242之間的間隔距離,等於相鄰的引腳220之間的間隔距離。在二夾取部124上形成三對定位凹槽1242,當夾取部124互相靠近後,三對定位凹槽1242形成三個定位穿孔125,用於夾取三個引腳220。Referring to FIG. 7, when there are more than two pins 220 and the pins 220 are arranged in parallel on the same plane, the number of the positioning grooves 1242 is also set to be the same as the number of pins 220. For example, when the number of pins 220 is three, the number of positioning grooves 1242 is increased to three, and the separation distance between adjacent positioning grooves 1242 is equal to the separation distance between adjacent pins 220. Three pairs of positioning grooves 1242 are formed on the two clamping portions 124. When the clamping portions 124 are close to each other, the three positioning grooves 1242 form three positioning holes 125 for clamping three pins 220.
參閱圖8以及圖9所示,為另一種定位結構的變化例。二夾取部124其中之一具有至少一定位凹槽1242,並且另一個夾取部124具有一定位凸塊1246,定位凹槽1242與定位凸塊1246分別位於二夾取部124互相面對的一側面,並且定位凹槽1242與定位凸塊1246是成對配置。定位凸塊1246突出於夾取部124的高度小於定位凹槽1242在夾取部124內凹的深度,而使定位凹槽1242與定位凸塊1246可結合為定位空間128。實際夾取引腳220時,是用定位凸塊1246對引腳220施壓,將引腳220壓制固定於定位凹槽1242中。Refer to FIG. 8 and FIG. 9, which are modified examples of another positioning structure. One of the two gripping portions 124 has at least one positioning groove 1242, and the other gripping portion 124 has a positioning protrusion 1246. The positioning groove 1242 and the positioning protrusion 1246 are respectively located on the two gripping portions 124 facing each other. On one side, the positioning groove 1242 and the positioning projection 1246 are arranged in pairs. The height of the positioning protrusion 1246 protruding from the gripping portion 124 is smaller than the depth of the positioning groove 1242 recessed in the gripping portion 124, so that the positioning groove 1242 and the positioning protrusion 1246 can be combined into a positioning space 128. When the pin 220 is actually clamped, the positioning pin 1246 is used to press the pin 220, and the pin 220 is pressed and fixed in the positioning groove 1242.
如圖10所示,二夾取部124並排平行,並且是從垂直部122朝同一側水平延伸。夾取裝置100夾取電子元件200時,二夾取部124是從電子元件200的單側邊伸入本體210下方,而非由本體210上方向下移動至本體210的兩側面。釋放電子元件200後,夾取部124同樣先水平移動,而從本體210單側邊離開。因此本體210兩側面不需預留大空間供夾取部124上下移動,相鄰的電子元件200之間的間隔距離可以縮小,僅需要保留一側邊供夾爪120的夾取部124沿著平移方向X移動即可。As shown in FIG. 10, the two clamping portions 124 are parallel to each other and extend horizontally from the vertical portion 122 toward the same side. When the gripping device 100 grips the electronic component 200, the two gripping portions 124 extend from one side of the electronic component 200 below the main body 210, instead of moving downward from the top of the main body 210 to both sides of the main body 210. After the electronic component 200 is released, the gripping portion 124 is also first moved horizontally, and is separated from one side of the main body 210. Therefore, there is no need to leave a large space on both sides of the body 210 for the gripping portion 124 to move up and down, and the distance between adjacent electronic components 200 can be reduced. Only one side of the gripping portion 124 for the gripper 120 needs to be kept along. Just move in the pan direction X.
再參閱圖11所示,在沒有操作空間限制的情況下,夾取部124仍可由本體210的側面伸入本體210下方,並且以二夾取部124由引腳220的外側分別抵靠一隻引腳220以適當壓力來抓取引腳220。此時,二夾取部124上成對配置的定位凹槽1242可供引腳220嵌入,而避免引腳220橫向滑動造成電子元件200由二夾取部124之間脫落。Referring again to FIG. 11, in the case that there is no operating space limitation, the gripping portion 124 can still extend below the body 210 from the side of the body 210, and the two gripping portions 124 abut against one of the pins 220 from the outside. The pin 220 grasps the pin 220 with an appropriate pressure. At this time, the positioning grooves 1242 arranged in pairs on the two clamping portions 124 can be inserted into the pins 220 to prevent the electronic components 200 from falling off between the two clamping portions 124 due to the lateral sliding of the pins 220.
參閱圖12、圖13以及圖14所示,是本發明第二實施例的一種用於插件的夾取裝置100。第二實施例的夾取裝置100所適用的電子元件200包含本體210以及多對成對配置的引腳220,引腳220對稱地設置於本體210的兩側,而朝向同一方向延伸。Referring to FIG. 12, FIG. 13 and FIG. 14, a second embodiment of the present invention is a clamping device 100 for a card. The electronic component 200 to which the gripping device 100 of the second embodiment is applicable includes a main body 210 and a plurality of pairs of pins 220 arranged in pairs. The pins 220 are symmetrically disposed on both sides of the main body 210 and extend in the same direction.
如圖12以及圖13所示,第二實施例的夾取裝置100包含驅動總成110、二夾爪120以及支撐杆130。驅動總成110以及二夾爪120大致與第一、第二實施例的驅動總成110、夾爪120相同。支撐杆130連接於驅動總成110,並且位於二夾爪120之間。支撐杆130至少具有連接部132以及支撐部134。連接部132的一端連接於驅動總成110,並且支撐部134連接於連接部132的另一端,使得支撐部134位於二夾取部124之間,用於承載電子元件200的本體210,並且每一對引腳220對稱地位於支撐部134的兩側。支撐部134大致平行於平移方向X,亦即支撐部134與二夾取部124平行,由此使得二夾取部124可以夾住本體210或是夾取位於支撐部134兩側的引腳220。As shown in FIG. 12 and FIG. 13, the gripping device 100 of the second embodiment includes a driving assembly 110, two clamping jaws 120, and a supporting rod 130. The driving assembly 110 and the two clamping jaws 120 are substantially the same as the driving assembly 110 and the clamping jaws 120 of the first and second embodiments. The support rod 130 is connected to the driving assembly 110 and is located between the two clamping jaws 120. The support rod 130 includes at least a connection portion 132 and a support portion 134. One end of the connecting portion 132 is connected to the driving assembly 110, and the supporting portion 134 is connected to the other end of the connecting portion 132, so that the supporting portion 134 is located between the two gripping portions 124 for carrying the body 210 of the electronic component 200, and each A pair of pins 220 are symmetrically located on both sides of the supporting portion 134. The support portion 134 is substantially parallel to the translation direction X, that is, the support portion 134 is parallel to the two gripping portions 124, so that the two gripping portions 124 can grip the body 210 or the pins 220 located on both sides of the support portion 134. .
如圖15所示,在第二實施例中,二夾取部124的頂緣之間定義夾取平面C,支撐部134的頂面大致位於夾取平面C。也就是說,當二夾取部124持續互相靠近之後,二夾取部124最後會夾住支撐部134或夾住引腳220。在該實施例中,支撐部134用以支撐電子元件200的本體210底部,也就是承載本體210於支撐部134上。而二夾取部124持續互相靠近之後,分別以適當力道接觸對稱設置的引腳220,從而固定電子元件200於支撐部134上。透過這種夾持方式,可以使得引腳220的延伸方向保持指向電路板300的表面,而可在驅動總成110沿著插件方向Y朝電路板300移動時,確保引腳220可以順利的插入導電通孔310。As shown in FIG. 15, in the second embodiment, a gripping plane C is defined between the top edges of the two gripping portions 124, and the top surface of the supporting portion 134 is substantially located at the gripping plane C. That is, after the two clamping portions 124 continue to approach each other, the two clamping portions 124 finally clamp the supporting portion 134 or the pin 220. In this embodiment, the supporting portion 134 is used to support the bottom of the body 210 of the electronic component 200, that is, the supporting body 210 is supported on the supporting portion 134. After the two clamping portions 124 continue to approach each other, they respectively contact the symmetrically disposed pins 220 with an appropriate force, so as to fix the electronic component 200 on the supporting portion 134. Through this clamping method, the extension direction of the pin 220 can be kept pointing to the surface of the circuit board 300, and the pin 220 can be smoothly inserted when the driving assembly 110 is moved toward the circuit board 300 in the plug-in direction Y. Conductive via 310.
圖16是另一種夾取部124與支撐杆130的相對位置關係。同樣地,二夾取部124頂緣之間定義夾取平面C,夾取平面C位於支撐部134頂面與驅動總成110之間。也就是當驅動總成110在上而夾爪120在下時,夾取平面C的高度高於支撐部134頂面所在的高度。支撐部134同樣用於支撐電子元件200的本體210底部,而承載本體210於支撐部134上。此時的夾取平面C透過本體210,因此當二夾取部124持續互相靠近之後,二夾取部124夾持本體210,從而固定電子元件200於支撐部134上。這種夾持方式可以有效固定本體210,而同樣地使得引腳220的延伸方向指向電路板300的表面。FIG. 16 is another relative positional relationship between the clamping portion 124 and the support rod 130. Similarly, a clamping plane C is defined between the top edges of the two clamping portions 124, and the clamping plane C is located between the top surface of the support portion 134 and the driving assembly 110. That is, when the driving assembly 110 is up and the clamping claw 120 is down, the height of the clamping plane C is higher than the height of the top surface of the support portion 134. The supporting portion 134 is also used to support the bottom of the main body 210 of the electronic component 200, and the supporting body 210 is supported on the supporting portion 134. At this time, the gripping plane C penetrates the body 210, so after the two gripping portions 124 continue to approach each other, the two gripping portions 124 grip the body 210, thereby fixing the electronic component 200 on the supporting portion 134. This clamping method can effectively fix the body 210, and similarly, the extension direction of the pin 220 is directed to the surface of the circuit board 300.
透過前述實施方式的夾取裝置100,執行插件作業夾取電子元件200時,夾取裝置100是由電子元件200的側向伸入電子元件200下方執行夾取,釋放電子元件200後夾取裝置100也是由電子元件200的側向脫離,不需通過電子元件200的本體210的前側面及後側面。因此,本體210的前側面及後側面預留給夾爪120的操作空間可以有效地縮小,使得電子元件200與前後的其他電子元件200之間的間隔距離可以縮短,而提升電路板300上電子元件200配置空間的利用率。Through the gripping device 100 of the foregoing embodiment, when the plug-in operation is performed to grip the electronic component 200, the gripping device 100 extends from the side of the electronic component 200 to the underside of the electronic component 200 to perform gripping, and the gripping device is released after the electronic component 200 is released. 100 is also separated from the side of the electronic component 200 without passing through the front side and the rear side of the body 210 of the electronic component 200. Therefore, the operation space reserved for the gripper 120 on the front side and the rear side of the body 210 can be effectively reduced, so that the distance between the electronic component 200 and other electronic components 200 in the front and rear can be shortened, and the electronics on the circuit board 300 can be improved. Utilization of the space for the configuration of the component 200.
1‧‧‧電子元件1‧‧‧Electronic components
2‧‧‧引腳2‧‧‧ pins
3‧‧‧氣壓缸3‧‧‧ pneumatic cylinder
4‧‧‧夾爪4‧‧‧Jaw
S‧‧‧操作空間S‧‧‧Operating space
100‧‧‧夾取裝置100‧‧‧Clamping device
110‧‧‧驅動總成110‧‧‧Drive Assembly
112‧‧‧水平致動部112‧‧‧Horizontal Actuator
120‧‧‧夾爪120‧‧‧Claw
122‧‧‧垂直部122‧‧‧Vertical
1221‧‧‧第一端1221‧‧‧ the first end
1222‧‧‧第二端1222‧‧‧Second End
124‧‧‧夾取部124‧‧‧Pick-up section
1242‧‧‧定位凹槽1242‧‧‧Pocket
1246‧‧‧定位凸塊1246‧‧‧Positioning bump
125‧‧‧定位穿孔125‧‧‧ positioning perforation
126‧‧‧水平延伸部126‧‧‧Horizontal extension
128‧‧‧定位空間128‧‧‧ positioning space
130‧‧‧支撐杆130‧‧‧ support bar
132‧‧‧連接部132‧‧‧Connection Department
134‧‧‧支撐部134‧‧‧ support
200‧‧‧電子元件200‧‧‧Electronic components
210‧‧‧本體210‧‧‧ Ontology
220‧‧‧引腳220‧‧‧pin
300‧‧‧電路板300‧‧‧Circuit Board
310‧‧‧導電通孔310‧‧‧ conductive via
X‧‧‧平移方向X‧‧‧ pan direction
Y‧‧‧插件方向Y‧‧‧plugin direction
Z‧‧‧水平驅動方向Z‧‧‧Horizontal driving direction
C‧‧‧夾取平面C‧‧‧Clamping plane
圖1是先前技術中夾爪的主視圖。 圖2是本發明第一實施例中,夾取裝置的立體分解圖。 圖3是本發明第一實施例中,夾取裝置的立體圖。 圖4是本發明第一實施例中,夾取裝置的另一立體圖,顯示夾取裝置夾取電子元件並進行插件作業。 圖5是本發明第一實施例中,夾取部的俯視圖,顯示成對配置的定位凹槽。 圖6是本發明第一實施例中,夾取部的另一俯視圖,顯示定位凹槽結合成為定位插孔。 圖7是本發明第一實施例中,夾取部的另一俯視圖,顯示每一夾取部具有二個以上定位凹槽。 圖8是本發明第一實施例中,夾取部的另一俯視圖,顯示成對配置的定位凹槽以及定位凸塊。 圖9是本發明第一實施例中,夾取部的另一俯視圖,顯示定位凹槽以及定位凸塊結合成為定位空間。 圖10是本發明第一實施例中,夾取裝置的另一立體圖,顯示夾取裝置完成插件作業後脫離電子元件的移動方向。 圖11是本發明第一實施例中,夾取裝置的另一立體圖,顯示夾取裝置夾取電子元件。 圖12是本發明第二實施例中,夾取裝置的立體分解圖。 圖13是本發明第二實施例中,夾取裝置的立體圖。 圖14是本發明第二實施例中,夾取裝置的另一立體圖,顯示夾取裝置夾取電子元件。 圖15是本發明第二實施例中,夾取部與支撐部的主視圖,顯示夾取平面、夾取部與支撐部的相對位置。 圖16是本發明第二實施例中,夾取部與支撐部的另一主視圖,顯示夾取平面、夾取部與支撐部的相對位置。FIG. 1 is a front view of a clamping jaw in the prior art. FIG. 2 is an exploded perspective view of a gripping device in the first embodiment of the present invention. 3 is a perspective view of a gripping device in the first embodiment of the present invention. FIG. 4 is another perspective view of the gripping device in the first embodiment of the present invention, showing the gripping device gripping electronic components and performing a plug-in operation. FIG. 5 is a plan view of a gripping portion in a first embodiment of the present invention, showing positioning grooves arranged in pairs. FIG. 6 is another plan view of the clamping portion in the first embodiment of the present invention, showing that the positioning groove is combined into a positioning socket. FIG. 7 is another plan view of the clamping portion in the first embodiment of the present invention, showing that each clamping portion has more than two positioning grooves. FIG. 8 is another plan view of the clamping portion in the first embodiment of the present invention, showing the positioning grooves and the positioning protrusions arranged in pairs. FIG. 9 is another plan view of the clamping portion in the first embodiment of the present invention, showing that the positioning groove and the positioning projection are combined into a positioning space. FIG. 10 is another perspective view of the gripping device in the first embodiment of the present invention, showing the moving direction of the gripping device away from the electronic component after the insertion operation is completed. FIG. 11 is another perspective view of the gripping device in the first embodiment of the present invention, showing the gripping device gripping electronic components. FIG. 12 is an exploded perspective view of a gripping device in a second embodiment of the present invention. 13 is a perspective view of a gripping device in a second embodiment of the present invention. FIG. 14 is another perspective view of the gripping device in the second embodiment of the present invention, showing the gripping device gripping electronic components. 15 is a front view of a gripping portion and a supporting portion in a second embodiment of the present invention, showing a gripping plane, and relative positions of the gripping portion and the supporting portion. FIG. 16 is another front view of the gripping portion and the supporting portion in the second embodiment of the present invention, showing the gripping plane, and the relative positions of the gripping portion and the supporting portion.
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CN113347871B (en) * | 2021-06-07 | 2023-03-10 | 东莞市冠佳电子设备有限公司 | Special-shaped part taking and inserting device |
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CN202804729U (en) * | 2012-09-26 | 2013-03-20 | 香港商台本机械有限公司 | Clamping jaw with multiple included angles |
JP6019410B2 (en) * | 2013-11-13 | 2016-11-02 | パナソニックIpマネジメント株式会社 | Electronic component mounting apparatus and electronic component mounting method |
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US3818784A (en) * | 1973-01-03 | 1974-06-25 | Scient Components Inc | Changeable tip tweezers and the like |
US4699414A (en) * | 1986-04-21 | 1987-10-13 | The United States Of America As Represented By The Secretary Of The Air Force | Multi use gripper for industrial robot |
US5332275A (en) * | 1991-11-27 | 1994-07-26 | Microscience Group, Inc. | Microgripper |
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CN110831425B (en) | 2021-06-04 |
CN110831425A (en) | 2020-02-21 |
TW202009118A (en) | 2020-03-01 |
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