TWI664254B - Adhesive composition for touch panel, adhesive sheet and laminate - Google Patents

Adhesive composition for touch panel, adhesive sheet and laminate Download PDF

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TWI664254B
TWI664254B TW104132358A TW104132358A TWI664254B TW I664254 B TWI664254 B TW I664254B TW 104132358 A TW104132358 A TW 104132358A TW 104132358 A TW104132358 A TW 104132358A TW I664254 B TWI664254 B TW I664254B
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mass
component
monomer
adhesive composition
adhesive
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TW201619333A (en
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横倉精二
清水政一
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日商綜研化學股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/208Touch screens

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)

Abstract

本發明提供一種觸控面板用黏著劑組成物,係含有:(A)丙烯酸系聚合物,其係重量平均分子量為10萬以上且未達80萬,而且實質上不含有酸性基;及(B)交聯劑,其係以下述通式(1)或下述通式(2)表示;相對於前述(A)丙烯酸系聚合物100質量份,含有0.04質量份以上且10質量份以下之前述(B)交聯劑。 The present invention provides an adhesive composition for a touch panel, comprising: (A) an acrylic polymer having a weight average molecular weight of 100,000 or more and less than 800,000, and does not substantially contain an acidic group; and (B) ) A cross-linking agent, which is represented by the following general formula (1) or (2); and contains 0.04 parts by mass or more and 10 parts by mass or less with respect to 100 parts by mass of the acrylic polymer (A). (B) Crosslinking agent.

Description

觸控面板用黏著劑組成物、黏著片,以及積層體 Adhesive composition for touch panel, adhesive sheet, and laminated body

本發明係有關於觸控面板用黏著劑組成物、黏著片、以及積層體。 The present invention relates to an adhesive composition for a touch panel, an adhesive sheet, and a laminate.

相較於影像顯示裝置,由於觸控面板多半是被使用在車內和室外等較嚴苛的環境下(例如、高溫及/或高濕環境下),所以對於貼合在觸控面板所含有之構成觸控面板單元的各種構件之黏著劑,亦要求即便在嚴格的條件下亦能夠發揮穩定的特性。 Compared with image display devices, touch panels are mostly used in harsh environments such as indoors and outdoors (for example, in high temperature and / or high humidity environments). The adhesives of various components constituting the touch panel unit also require stable properties to be exhibited even under severe conditions.

又,因為各種構件的積層體之觸控面板單元,係被配置在畫面的最表面,所以被要求較高的透明性,同時由於水分從外部侵入致使在該觸控面板單元所含有的黏著劑層容易產生發泡。又,起因於從構成觸控面板單元之各種構件所產生的水蒸氣、二氧化碳等的氣體,而有在黏著劑層產生發泡之情形。 In addition, since the touch panel unit of the laminated body of various members is disposed on the outermost surface of the screen, high transparency is required, and the moisture contained in the touch panel unit causes an adhesive contained in the touch panel unit. The layer is prone to foaming. In addition, it may be caused by gas such as water vapor or carbon dioxide generated from various members constituting the touch panel unit, and foaming may occur in the adhesive layer.

而且,近年來,在主流的靜電電容方式之觸控面板,形成配線之導電膜與黏著劑係有直接接觸之情形。因此,黏著劑係被要求不會使導電膜特性變動。 In recent years, in the touch panel of the mainstream electrostatic capacitance method, the conductive film forming the wiring is in direct contact with the adhesive. Therefore, the adhesive system is required not to change the characteristics of the conductive film.

因為導電膜通常係由如氧化銦錫(ITO)、氧化銻錫(ATO)般的金屬或金屬氧化物形成,所以導電膜與酸接觸而產生腐蝕,其結果有時會導電膜的電阻值上升。 The conductive film is usually formed of a metal or metal oxide such as indium tin oxide (ITO) or antimony tin oxide (ATO). Therefore, the conductive film is in contact with acid to cause corrosion. As a result, the resistance of the conductive film may increase. .

另一方面,為了提高黏著劑層的耐熱性或耐濕熱性,通常係採用使用酸成分的黏著劑之方法。但是如上述,因為在導電膜容易產生腐蝕,所以在觸控面板所使用的黏著劑,係難以使用酸成分。因而,眾所周知的黏著劑組成物要在滿足高接著力、高透明性、及不腐蝕導電膜的特性(導電膜非腐蝕性)的要求之同時,在嚴格的耐濕熱條件下能夠抑制產生發泡係非常困難的。 On the other hand, in order to improve the heat resistance or humidity and heat resistance of the adhesive layer, a method using an adhesive with an acid component is generally used. However, as described above, since the conductive film is easily corroded, it is difficult to use an acid component for the adhesive used in the touch panel. Therefore, the well-known adhesive composition must meet the requirements of high adhesion, high transparency, and non-corrosive conductive film characteristics (non-corrosive conductive film), and can suppress foaming under strict humidity and heat resistance conditions. Department is very difficult.

[先前技術文獻] [Prior technical literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開2010-77287號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2010-77287

本發明係提供一種在濕熱條件下能夠抑制產生發泡,而且具有優異的黏著力、耐久性、及透明性且具有導電膜非腐蝕性之觸控面板用黏著劑組成物、黏著片、以及積層體。 The present invention provides an adhesive composition, an adhesive sheet, and a laminate for a touch panel that can suppress foaming under humid and hot conditions, have excellent adhesion, durability, and transparency, and have non-corrosive properties of a conductive film. body.

為了解決前述課題,本發明者等發現即便含有實質上不含有酸性基的丙烯酸系聚合物之黏著劑組成物,只要藉由使用特定的交聯劑,即能夠得到在濕熱條件 下能夠抑制發泡,而且具有優異的透明性、黏著力、耐久性及導電膜非腐蝕性之黏著劑組成物。 In order to solve the aforementioned problems, the present inventors have found that even in the case of an adhesive composition containing an acrylic polymer that does not substantially contain an acidic group, it is possible to obtain a wet heat condition by using a specific crosslinking agent. An adhesive composition capable of suppressing foaming and having excellent transparency, adhesion, durability, and non-corrosiveness of the conductive film.

1.本發明的一態樣之觸控面板用黏著劑組成物,係含有:(A)丙烯酸系聚合物,其係重量平均分子量為10萬以上且未達80萬,而且實質上不含有酸性基;及(B)交聯劑,其係以下述通式(1)或下述通式(2)表示;前述(A)丙烯酸系聚合物係含有(a1)(甲基)丙烯酸烷酯及(a2)含羥基的單體之單體成分的共聚物,相對於前述(A)丙烯酸系聚合物100質量份,含有0.04質量份以上且10質量份以下之前述(B)交聯劑。 1. An adhesive composition for a touch panel according to the present invention, which comprises: (A) an acrylic polymer whose weight average molecular weight is 100,000 or more and less than 800,000, and does not substantially contain acid. And (B) a cross-linking agent, which is represented by the following general formula (1) or the following general formula (2); the (A) acrylic polymer contains (a1) an alkyl (meth) acrylate and (a2) A copolymer of a monomer component of a hydroxyl group-containing monomer, containing 0.04 parts by mass or more and 10 parts by mass or less of the (B) crosslinking agent with respect to 100 parts by mass of the acrylic polymer (A).

(式中,R1A、R1B、R1C係獨立且為含有以下述通式(3)表示的基及/或下述通式(4)表示的基之基,R2A、R2B、R2C係以-(CH2)6-表示的基), (式中,R1A、R1B、R1C係獨立且為含有以下述通式(3)表示的基及/或下述通式(4)表示的基之基,R2A、R2B、R2C、R3A、R3B、R3C、R3D、R3E、R3F係以-(CH2)6-表示的基), (式中,x係2以上且10以下的整數,m係1以上且10以下的整數), (式中,X係表示單鍵或-O-,y係2以上且10以下的整數,n係1以上且10以下的整數)。 (In the formula, R 1A , R 1B , and R 1C are independent and are a group containing a group represented by the following general formula (3) and / or a group represented by the following general formula (4). R 2A , R 2B , R 2C is a group represented by- (CH 2 ) 6- ), (In the formula, R 1A , R 1B , and R 1C are independent and are a group containing a group represented by the following general formula (3) and / or a group represented by the following general formula (4). R 2A , R 2B , R 2C , R 3A , R 3B , R 3C , R 3D , R 3E , and R 3F are groups represented by- (CH 2 ) 6- ), (Where x is an integer of 2 to 10 and m is an integer of 1 to 10), (In the formula, X is a single bond or -O-, y is an integer from 2 to 10 and n is an integer from 1 to 10).

2.如上述1所述之觸控面板用黏著劑組成物,其中前述單體成分係可含有:前述(a1)(甲基)丙烯酸烷酯為45質量%以上且99質量%以下;前述(a2)含羥基的單體為1質量%以上且40質量%以下;以及為(a1)成分及(a2)成分以外的單體且在分子內具有1個烯烴性雙鍵之單體為0質量%以上且15質量%以下。 2. The adhesive composition for a touch panel according to the above 1, wherein the monomer component may contain: the (a1) (meth) acrylic acid alkyl ester is 45% by mass or more and 99% by mass or less; a2) a hydroxyl-containing monomer is 1 mass% or more and 40 mass% or less; and a monomer other than the components (a1) and (a2) and having one olefinic double bond in the molecule is 0 mass % To 15% by mass.

3.如上述2所述之觸控面板用黏著劑組成物,其中作為前述(a1)成分及(a2)成分以外的單體且在分子內具有1個烯烴性雙鍵之單體,前述單體成分可以是進一步含有(a3)含氮的單體,為0.1質量%以上且7質量%以下;以及(a4)為(a1)成分、(a2)成分及(a3)成分以外的單體且在分子內具有1個烯烴性雙鍵之單體為0質量%以上且10質量%以下(在此,(a1)成分+(a2)成分+(a3)成分+(a4)成分=100質量%)。 3. The adhesive composition for a touch panel according to the above 2, wherein the monomer is a monomer other than the components (a1) and (a2) and has one olefinic double bond in the molecule, and the monomer The body composition may further contain (a3) a nitrogen-containing monomer, which is 0.1 mass% or more and 7 mass% or less; and (a4) is a monomer other than the (a1) component, the (a2) component, and the (a3) component, and The monomer having one olefinic double bond in the molecule is 0% by mass or more and 10% by mass or less (here, (a1) component + (a2) component + (a3) component + (a4) component = 100% by mass ).

4.本發明的一態樣之觸控面板用黏著片,係在支撐物的單面或兩面具有上述1至3項中任一項所述之觸控面板用黏著劑組成物。 4. One aspect of the present invention is an adhesive sheet for a touch panel, which is provided on one or both sides of a support with the adhesive composition for a touch panel according to any one of items 1 to 3 above.

5.本發明的一態樣之積層體,係包含第1基材、第2基材、及從上述1至3項中任一項所述之觸控面板用黏著劑組成物所得到的黏著劑層;前述第1基材及前述第2基材係透過前述黏著劑層而貼合,前述第1基材及第2基材係各自含有玻璃或樹脂。 5. A laminated body according to one aspect of the present invention includes an adhesive obtained from the first substrate, the second substrate, and the adhesive composition for a touch panel according to any one of items 1 to 3 above. Agent layer; the first substrate and the second substrate are bonded through the adhesive layer, and the first substrate and the second substrate each contain glass or resin.

使用上述1至3項之觸控面板用黏著劑組成物時,由於含有前述(A)丙烯酸系聚合物及前述(B)交聯劑;前述(A)丙烯酸系聚合物係含有(a1)(甲基)丙烯酸烷酯及(a2)含羥基的單體之單體成分的共聚物,藉由相對於前述(A)丙烯酸系聚合物100質量份,含有0.04質量份以上且10質量份以下之前述(B)交聯劑,故起因於(B)交聯劑的構造而能夠形成彈性高的黏著劑層。藉此,能夠抑制從支撐物或被黏著物(以下,在本發明亦稱為「基材」)產生氣體,而且能夠抑制源自與(B)交聯劑的反應而產生氣體。因此,藉由使用前述黏著劑組成物,能夠得到一種在濕熱條件下能夠抑制發泡且具有優異的透明性、黏著力、耐久性及導電膜非腐蝕性之黏著劑層。 When the adhesive composition for a touch panel according to items 1 to 3 is used, the (A) acrylic polymer and the (B) crosslinking agent are contained; the (A) acrylic polymer contains (a1) ( The copolymer of the monomer components of the alkyl (meth) acrylate and (a2) a hydroxyl group-containing monomer contains 0.04 parts by mass or more and 10 parts by mass or less based on 100 parts by mass of the (A) acrylic polymer. The aforementioned (B) crosslinking agent can form a highly elastic adhesive layer due to the structure of the (B) crosslinking agent. Thereby, generation of gas from a support or an adherend (hereinafter, also referred to as a "base material" in the present invention) can be suppressed, and generation of a gas from a reaction with the (B) crosslinking agent can be suppressed. Therefore, by using the aforementioned adhesive composition, it is possible to obtain an adhesive layer capable of suppressing foaming under moist heat conditions and having excellent transparency, adhesion, durability, and non-corrosiveness of the conductive film.

上述黏著片因為係從上述1至3項之觸控面板用黏著劑組成物所得到,所以能夠抑制在濕熱條件下的發泡,而且具有優異的透明性、黏著力、耐久性及導電膜非腐蝕性。 The adhesive sheet is obtained from the adhesive composition for a touch panel according to items 1 to 3 above, so it can suppress foaming under hot and humid conditions, and has excellent transparency, adhesion, durability, and non-conductive film. Corrosive.

上述積層體,係藉由含有從上述1至3項之觸控面板用黏著劑組成物所得到的黏著劑層,而該黏著劑層係因於前述(B)交聯劑的構造而具有優異的彈性。藉此,該黏著劑層係能夠使從、第1基材及第2基材所產生的氣體逃脫,而且能夠抑制源自(B)交聯劑反應而產生的氣體。因此,該積層體係能夠在濕熱條件下抑制發泡且具有優異的透明性,而且不容易產生起因於該黏著劑層高的黏著力 及耐久性而在該黏著劑層與第1基材及第2基材之間造成之剝落。 The laminated body is an adhesive layer obtained by containing the adhesive composition for a touch panel according to items 1 to 3, and the adhesive layer is excellent because of the structure of the (B) crosslinking agent. The flexibility. Thereby, the adhesive layer system can escape the gas generated from the first substrate and the second substrate, and can suppress the gas generated from the reaction of the (B) crosslinking agent. Therefore, the laminated system can suppress foaming under moist heat conditions and has excellent transparency, and it is not easy to generate high adhesion due to the adhesive layer. And durability and peeling between the adhesive layer and the first substrate and the second substrate.

10‧‧‧黏著劑層 10‧‧‧ Adhesive layer

20‧‧‧第1基材 20‧‧‧ the first substrate

30‧‧‧第2基材 30‧‧‧ 2nd substrate

100‧‧‧積層體 100‧‧‧Laminated body

第1圖係示意地顯示本發明的一實施形態之積層體之剖面圖。 FIG. 1 is a cross-sectional view schematically showing a laminated body according to an embodiment of the present invention.

用以實施發明之形態 Forms used to implement the invention

以下,係一邊參照圖式一邊詳細地說明本發明。又,在本發明,係只要未特別地說明之下,「份」係意味著「質量份」,「%」係意味著「質量%」。 Hereinafter, the present invention will be described in detail with reference to the drawings. In the present invention, unless otherwise specified, "part" means "mass part", and "%" means "mass%".

1.觸控面板用黏著劑組成物 1. Adhesive composition for touch panel

本發明的一實施形態之觸控面板用黏著劑組成物(以下,有時亦簡記為「黏著劑組成物」),係含有重量平均分子量為10萬以上且未達80萬,而且實質上不含有酸性基的丙烯酸系聚合物(A)(以下,有時亦簡記為「(A)成分」);以及以下述通式(1)或下述通式(2)表示之交聯劑(B)(以下,有時亦簡記為「(B)成分」)。 An adhesive composition for a touch panel according to an embodiment of the present invention (hereinafter, sometimes referred to simply as an "adhesive composition") contains a weight average molecular weight of 100,000 or more and less than 800,000, and does not substantially Acidic group-containing acrylic polymer (A) (hereinafter, may be abbreviated as "(A) component"); and a crosslinking agent (B) represented by the following general formula (1) or the following general formula (2) ) (Hereinafter may be abbreviated as "(B) component").

(式中,R1A、R1B、R1C係獨立且為含有以下述通式(3)表示的基及/或下述通式(4)表示的基之基,R2A、R2B、R2C係以-(CH2)6-表示的基), (式中,R1A、R1B、R1C係獨立且為下述通式(3)表示的基及/或下述通式(4)表示的基之基,R2A、R2B、R2C、R3A、R3B、R3C、R3D、R3E、R3F係以-(CH2)6-表示的基), (式中,x係2以上且10以下的整數,m係1以上且10以下的整數), (式中,X係表示單鍵或-O-、y係2以上且10以下的整數,n係1以上且10以下的整數)。 (In the formula, R 1A , R 1B , and R 1C are independent and are a group containing a group represented by the following general formula (3) and / or a group represented by the following general formula (4). R 2A , R 2B , R 2C is a group represented by- (CH 2 ) 6- ), (Wherein R 1A , R 1B , and R 1C are each independently a group represented by the following general formula (3) and / or a group represented by the following general formula (4): R 2A , R 2B , R 2C , R 3A , R 3B , R 3C , R 3D , R 3E , R 3F are groups represented by- (CH 2 ) 6- ), (Where x is an integer of 2 to 10 and m is an integer of 1 to 10), (In the formula, X is a single bond or -O-, y is an integer of 2 to 10 and n is an integer of 1 to 10).

1.1.(A)成分 1.1. (A) Ingredient

(A)成分,係含有(a1)(甲基)丙烯酸烷酯(以下,有時亦簡記為「(a1)成分」)、以及(a2)含羥基的單體(以下,有時亦簡記為「(a2)成分」)之單體成分的共聚物。(a1)成分及(a2)成分係以不具有酸性基為佳。 The component (A) contains (a1) (meth) acrylic acid alkyl ester (hereinafter, sometimes referred to simply as "(a1) component") and (a2) a hydroxyl-containing monomer (hereinafter, sometimes referred to simply as "(A2) component") is a copolymer of monomer components. The component (a1) and the component (a2) are preferably those having no acidic group.

在本發明,所謂「丙烯酸系聚合物」,係在構成單元中含有50質量%以上選自丙烯酸、丙烯酸鹽、丙烯酸酯、甲基丙烯酸、甲基丙烯酸鹽、及甲基丙烯酸酯的至少1種之聚合物。 In the present invention, the "acrylic polymer" includes at least one selected from the group consisting of acrylic acid, acrylate, acrylate, methacrylic acid, methacrylate, and methacrylate in the constituent unit. Of polymers.

(A)成分係實質上不含有酸性基。在此,所 謂(A)成分係不具有酸性基,係指在前述單體成分中,具有酸性基之單體的含量為0.5質量%以下(較佳為0質量%)、較佳是在前述單體成分中,不有意圖地調配具有酸性基之單體。更具體地,係(A)成分不具有酸性基時,(A)成分的酸價係通常為0.5mg/KOH以下。藉由(A)成分係實質上不含有酸性基,能夠防止在觸控面板所含有的導電膜產生腐蝕。在本發明之「酸性基」並無限定,例如可舉出羧基、硫氧基(sulfoxyl)、氰基。 (A) The component system does not contain an acidic group substantially. Here, all The component (A) does not have an acidic group, and means that the content of the monomer having an acidic group in the aforementioned monomer component is 0.5% by mass or less (preferably 0% by mass), preferably in the aforementioned monomer component. However, a monomer having an acidic group was not intentionally blended. More specifically, when the component (A) does not have an acidic group, the acid value of the component (A) is usually 0.5 mg / KOH or less. Since the component (A) does not substantially contain an acidic group, it is possible to prevent the conductive film contained in the touch panel from being corroded. The "acidic group" in the present invention is not limited, and examples thereof include a carboxyl group, a sulfoxyl group, and a cyano group.

相對於本實施形態之黏著劑組成物100質量份,在本實施形態之黏著劑組成物(將溶劑除去後之固體含量)之(A)成分的含量,可為90質量份以上且99.9質量份以下。 The content of the component (A) in the adhesive composition (solid content after removal of the solvent) of the adhesive composition (solid content after removing the solvent) of the adhesive composition of this embodiment may be 90 parts by mass or more and 99.9 parts by mass. the following.

從在濕熱條件下能夠更確實地保持彈性且在濕熱條件下能夠更抑制發泡的觀點而言,在本實施形態之黏著劑組成物,前述單體成分可含有(a1)成分45質量%以上且99質量%以下(較佳是62質量%以上且98質量%以下);及(a2)成分1質量%以上且40質量%以下(較佳是2質量%以上30質量%以下)(在此,係將單體成分中的單體總量設作100質量%)。此時,在前述單體成分之(a1)成分與(a2)成分的合計量,係以85質量%以上且100質量%以下為佳。又,前述單體成分,亦能夠進一步含有0質量%以上且15質量%以下之為(a1)成分及(a2)成分以外的單體且在分子內具有1個烯烴性雙鍵之單體。 From the viewpoints that the elasticity can be more reliably maintained under moist heat conditions and foaming can be more suppressed under moist heat conditions, in the adhesive composition of this embodiment, the monomer component may contain (a1) component at 45% by mass or more. And 99% by mass or less (preferably 62% by mass or more and 98% by mass or less); and (a2) 1% by mass or more and 40% by mass or less (preferably 2% by mass or more and 30% by mass or less) (herein (The total amount of monomers in the monomer component is set to 100% by mass). At this time, the total amount of the (a1) component and the (a2) component of the monomer component is preferably 85% by mass or more and 100% by mass or less. The monomer component may further contain a monomer other than the component (a1) and the component (a2) of 0% by mass to 15% by mass, and a monomer having one olefinic double bond in the molecule.

於從本實施形態之黏著劑組成物所得到的 黏著劑層中,所謂在濕熱條件下能夠抑制發泡,係意味著例如在車內、室外、蒸氣浴室、浴室等的高溫及/或高濕條件下使用中具有耐久性。特別是因為攜帶用觸控面板式影像顯示裝置係設想在各式各樣的環境下使用,從在濕熱條件下使用能夠抑制產生發泡且具有黏著力、耐久性、透明性及導電膜非腐蝕性而言,從本實施形態之黏著劑組成物所得到的黏著劑層係有用的。 Obtained from the adhesive composition of this embodiment The pressure-sensitive adhesive layer is capable of suppressing foaming under hot and humid conditions, which means that it has durability in use under high temperature and / or high humidity conditions such as in a car, outdoor, steam bath, and bathroom. In particular, the portable touch panel type image display device is intended to be used in various environments, and it can suppress foaming from being used under hot and humid conditions, and has adhesion, durability, transparency, and non-corrosive conductive film. In terms of properties, the adhesive layer obtained from the adhesive composition of this embodiment is useful.

1.1.1.(a1)成分 1.1.1. (A1) Ingredients

(a1)成分,係能夠有助於本實施形態之黏著劑組成物的黏著力。(a1)成分係例如能夠以下述的式(5)表示。 (a1) component is a component which can contribute to the adhesive force of the adhesive composition of this embodiment. (a1) A component system can be represented by following formula (5), for example.

(式中,R1係表示氫原子或甲基,R2係表示烷基或芳烷基)。 (In the formula, R 1 represents a hydrogen atom or a methyl group, and R 2 represents an alkyl group or an aralkyl group).

在上述通式(5),作為以R2表示之烷基,可為直鏈狀或分枝狀,例如可舉出碳原子數1以上且18以下的烷基(例如甲基、乙基、正丙基、異丙基、正丁基、異丁基、第三丁基、正戊基、異戊基、新戊基、第三戊基、2-甲基丁基、1-甲基丁基、正己基、異己基、3-甲基戊基、2-甲基戊基、1-甲基戊基、正庚基、正辛基、異辛基、2-乙基己基、正壬基、正癸基、異癸基、正十一基、正十二 基(月桂基)、正十三基、正十四基(肉豆蔻基)、異肉豆蔻基、正十六基(棕櫚基)、正十八基(硬脂醯基)、異硬脂醯基)等。 In the general formula (5), the alkyl group represented by R 2 may be linear or branched, and examples thereof include alkyl groups having 1 to 18 carbon atoms (for example, methyl, ethyl, N-propyl, isopropyl, n-butyl, isobutyl, third butyl, n-pentyl, isopentyl, neopentyl, third pentyl, 2-methylbutyl, 1-methylbutyl Base, n-hexyl, isohexyl, 3-methylpentyl, 2-methylpentyl, 1-methylpentyl, n-heptyl, n-octyl, isooctyl, 2-ethylhexyl, n-nonyl , N-decyl, isodecyl, n-undecyl, n-dodecyl (lauryl), n-tridecyl, n-tetradecyl (myristoyl), iso-myristyl, n-hexadecyl (palmityl) ), N-octadecyl (stearyl), isostearyl) and the like.

又,在上述通式(5),所謂「芳烷基(aralkyl group)」,係指一個烷基的氫原子係被芳基取代之烷基。在上述通式(5),作為以R2表示之芳烷基,可舉出碳原子數1以上且18以下的芳烷基(例如苄基(苯基甲基)、苯乙基(苯基乙基))。 In the above general formula (5), the "aralkyl group" refers to an alkyl group in which a hydrogen atom of one alkyl group is substituted with an aryl group. Examples of the aralkyl group represented by R 2 in the general formula (5) include aralkyl groups having 1 to 18 carbon atoms (for example, benzyl (phenylmethyl), phenethyl (phenyl Ethyl)).

(a1)成分係能夠使用將1種或2種以上組合而使用。尤其是前述單體成分,因為能夠更良好地保持黏著力,以在單體成分中含有35質量%以上且(較佳為)99質量%以下之選自丙烯酸2-乙基己酯、甲基丙烯酸2-乙基己酯及丙烯酸正丁酯之1種或2種以上為佳。 (a1) A component system can be used combining 1 type or 2 or more types. In particular, the aforementioned monomer component, because it can maintain adhesion better, contains 35% by mass or more (preferably) 99% by mass or less of the monomer component selected from 2-ethylhexyl acrylate and methyl One or more of 2-ethylhexyl acrylate and n-butyl acrylate are preferred.

1.1.2.(a2)成分 1.1.2. (A2) Ingredient

(a2)成分係能夠有助於與(B)成分反應而形成交聯結構。更具體地,藉由在(a2)成分所含有的羥基與(B)成分中的異氰酸酯基進行反應,而能夠形成交聯結構。 The (a2) component system can contribute to the reaction with the (B) component to form a crosslinked structure. More specifically, a cross-linked structure can be formed by reacting a hydroxyl group contained in the component (a2) with an isocyanate group in the component (B).

作為(a2)成分,例如可舉出丙烯酸2-羥基乙酯、甲基丙烯酸2-羥基乙酯、丙烯酸2-羥丙酯、甲基丙烯酸2-羥丙酯、丙烯酸4-羥基丁酯、甲基丙烯酸4-羥基丁酯、丙烯酸2-羥基-3-氯丙酯、甲基丙烯酸2-羥基-3-氯丙酯、丙烯酸2-羥基-3-苯氧基丙酯、甲基丙烯酸2-羥基-3-苯氧基丙酯等的含羥基的(甲基)丙烯酸酯等,其中,能夠使用1種或將2種以上組合而使用。尤其是作為(a2)成分,係以 使用碳原子數1以上且6以下之含羥基的(甲基)丙烯酸酯為佳。 Examples of the component (a2) include 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, 4-hydroxybutyl acrylate, and methyl formate. 4-hydroxybutyl acrylate, 2-hydroxy-3-chloropropyl acrylate, 2-hydroxy-3-chloropropyl methacrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-methacrylate Among the hydroxyl-containing (meth) acrylates such as hydroxy-3-phenoxypropyl ester, etc., one type or a combination of two or more types can be used. Especially as (a2) component, it is It is preferable to use a hydroxyl group-containing (meth) acrylate having 1 to 6 carbon atoms.

1.1.3.(a3)成分 1.1.3. (A3) Ingredient

作為前述單體成分係為(a1)成分及(a2)成分以外的單體且在分子內具有1個烯烴性雙鍵之單體,係能夠進一步含有0質量%以上且7質量%以下之(a3)含氮的單體(以下,有時亦簡記為「(a3)成分」)。 The monomer component is a monomer other than the component (a1) and the component (a2) and has one olefinic double bond in the molecule, and can further contain 0% by mass or more and 7% by mass or less ( a3) Nitrogen-containing monomer (hereinafter, sometimes referred to simply as "(a3) component").

作為(a3)成分,例如可舉出丙烯酸N,N-二甲胺基乙酯、甲基丙烯酸N,N-二甲胺基乙酯、甲基丙烯酸N,N-二乙胺基乙酯、丙烯醯胺、N,N-二甲胺基丙基丙烯醯胺、雙丙酮丙烯醯胺、丙烯醯基嗎啉,其中,能夠使用1種或將2種以上組合而使用。其中就形成交聯結構具有優異的效率就而言,(a3)成分係以丙烯醯胺為更佳。 Examples of the component (a3) include N, N-dimethylaminoethyl acrylate, N, N-dimethylaminoethyl methacrylate, N, N-diethylaminoethyl methacrylate, Acrylamide, N, N-dimethylaminopropylacrylamide, diacetone acrylamide, and acrylmorpholine can be used singly or in combination of two or more. Among them, acrylamide is more preferred as the component (a3) because it has excellent efficiency in forming a crosslinked structure.

為了在濕熱條件下能夠更確實地抑制產生發泡,而且得到具有更優異的耐久性之黏著劑層,在前述單體成分中之(a3)成分的含量,係以0質量%以上且5質量%以下為佳,以0.1質量%以上為佳,0.2質量%以上為較佳,另一方面,以4質量%以下為佳。 In order to more surely suppress foaming under moist heat conditions, and to obtain an adhesive layer having more excellent durability, the content of the component (a3) in the monomer component is 0 mass% or more and 5 masses. % Or less is preferable, 0.1 mass% or more is preferable, 0.2 mass% or more is preferable, and 4 mass% or less is more preferable.

1.1.4.(a4)成分 1.1.4. (A4) Ingredients

又,用以得到(A)成分之聚合物之前述單體成分,係能夠進一步含有0質量%以上且10質量%以下之(a4),其係為(a1)成分、(a2)成分及(a3)成分以外的單體且在分子內具有 1個烯烴性雙鍵之單體(以下,有時亦簡記為「(a4)成分」)。又,在本說明書,(a1)成分+(a2)成分+(a3)成分+(a4)成分=100質量%。亦即,(A)成分係能夠是含有(a1)成分、(a2)成分、以及視需要之(a3)成分及/或(a4)成分之單體成分的共聚物。 In addition, the monomer component for obtaining the polymer of the component (A) may further contain (a4) of 0% by mass to 10% by mass, which is (a1) component, (a2) component, and ( a3) A monomer other than the component and having in the molecule One olefinic double bond monomer (hereinafter, sometimes referred to simply as "(a4) component"). In this specification, (a1) component + (a2) component + (a3) component + (a4) component = 100% by mass. That is, the (A) component can be a copolymer of a monomer component containing (a1) component, (a2) component, and (a3) component and / or (a4) component as needed.

作為(a4)成分,例如可舉出乙酸乙烯酯、苯乙烯、丙烯腈、將乙烯基聚合而成之單體末端具有自由基聚合性乙烯基之巨分子單體類、(甲基)丙烯酸、伊康酸、順丁烯二酸等具有羧基之單體等。為了調整(A)成分的酸價而防止導電膜腐蝕,在前述單體成分中之(a4)成分的含量係以0質量%以上且0.2質量%以下為佳。 Examples of the component (a4) include vinyl acetate, styrene, acrylonitrile, macromonomers having a radical polymerizable vinyl group at the end of a monomer obtained by polymerizing a vinyl group, (meth) acrylic acid, Monomers having a carboxyl group, such as itaconic acid and maleic acid. In order to adjust the acid value of the component (A) to prevent corrosion of the conductive film, the content of the component (a4) in the monomer component is preferably 0% by mass or more and 0.2% by mass or less.

1.1.5.Tg 1.1.5.Tg

從能夠更確實地達成良好的接著性及耐久性以及減低漏光的觀點而言,在本實施形態之黏著劑組成物之(A)成分的Tg,係以-80℃以上且20℃以下為佳,以-80℃以上且0℃以下為較佳。又,在本發明,(A)成分的Tg係從下述式(6)(FOX的式)算出之值。 From the viewpoint of more reliably achieving good adhesion and durability and reducing light leakage, the Tg of the component (A) of the adhesive composition of this embodiment is preferably -80 ° C or higher and 20 ° C or lower. It is preferably -80 ° C or higher and 0 ° C or lower. In the present invention, the Tg of the component (A) is a value calculated from the following formula (6) (formula of FOX).

1/TgA=Wa1/Tga1+Wa2/Tga2+Wa3/Tga3+Wa4/Tga4‧‧‧‧(6)(式中,TgA係表示(A)成分的玻璃轉移溫度(K),Tga1、Tga2、Tga3、Tga4係各自表示從構成單體(a1)、(a2)、(a3)、(a4)所調製成的均聚物之玻璃轉移溫度(Tg(K)),Wa1、Wa2、Wa3、Wa4係各自表示在(A)成分中所含有之(a1)成分、(a2)成分、 (a3)成分、(a4)成分的重量分率)。 1 / Tg A = W a1 / Tg a1 + W a2 / Tg a2 + W a3 / Tg a3 + W a4 / Tg a4 ‧‧‧‧ (6) ( in the formula, Tg A is the glass transition lines (A) component Temperature (K), Tg a1 , Tg a2 , Tg a3 , and Tg a4 each represent the glass transition temperature of the homopolymer prepared from the constituent monomers (a1), (a2), (a3), and (a4) ( Tg (K)), W a1 , W a2 , W a3 , and W a4 each represent the weight of the component (a1), (a2), (a3), and (a4) contained in the component (A) Score).

又,由於在上述式(6)TgA係算出作為絕對溫度(K),所以能夠視需要換算成為攝氏溫度(℃)。 In addition, since the Tg A system is calculated as the absolute temperature (K) in the above formula (6), it can be converted into a Celsius temperature (° C) if necessary.

又,從代表性的單體所調製成的均聚物之玻璃轉移溫度,係如下述表1所顯示,更具體地,係例如記載在聚合物手冊4版(Polymer Handbook Fourth Edition,Wiley-Interscience,1999)等。 The glass transition temperature of a homopolymer prepared from a representative monomer is shown in Table 1 below. More specifically, it is described in, for example, the Polymer Handbook Fourth Edition (Wiley-Interscience). , 1999) and so on.

1.1.7.重量平均分子量(Mw) 1.1.7. Weight average molecular weight (Mw)

又,從能夠更確實地達成良好的接著性及耐久性的觀點而言,在本實施形態之黏著劑組成物之(A)成分,重量平均分子量(Mw)係以5萬以上且75萬以下為佳,以10萬以上為較佳,以15萬以上為更佳,另一方面以60萬以下為佳,以50萬以下為較佳,以40萬以下為更佳。在此,(A)成分的重量平均分子量係使用GPC(凝膠滲透層析法),在下述的條件下求取標準聚苯乙烯換算之重量平均分子量(Mw)。 In addition, from the viewpoint of achieving better adhesion and durability, the weight average molecular weight (Mw) of the component (A) of the adhesive composition of this embodiment is 50,000 or more and 750,000 or less. More preferably, more than 100,000 is more preferable, more than 150,000 is more preferable, on the other hand is preferably less than 600,000, more preferably less than 500,000, more preferably less than 400,000. Here, the weight average molecular weight of (A) component uses GPC (gel permeation chromatography), and the weight average molecular weight (Mw) of a standard polystyrene conversion was calculated | required under the following conditions.

<GPC測定條件> <GPC measurement conditions>

測定裝置:HLC-8120GPC(TOSOH公司製) Measuring device: HLC-8120GPC (manufactured by TOSOH)

GPC管柱構成:以下的5連接管柱(全部TOSOH公司製) GPC column configuration: The following 5 connection columns (all manufactured by TOSOH)

(1)TSK-GEL HXL-H(保護管柱) (1) TSK-GEL HXL-H (protection column)

(2)TSK-GEL G7000HXL (2) TSK-GEL G7000HXL

(3)TSK-GEL GMHXL (3) TSK-GEL GMHXL

(4)TSK-GEL GMHXL (4) TSK-GEL GMHXL

(5)TSK-GEL G2500HXL (5) TSK-GEL G2500HXL

試樣濃度:以成為1.0mg/cm3的方式使用四氫呋喃稀釋 Sample concentration: diluted with tetrahydrofuran so as to be 1.0 mg / cm 3

移動相溶劑:四氫呋喃 Mobile phase solvent: tetrahydrofuran

流量:1.0cm3/分鐘 Flow: 1.0cm 3 / min

管柱溫度:40℃ Column temperature: 40 ℃

1.2.(B)成分 1.2. (B) ingredients

如上述,在本實施形態之黏著劑組成物,其(B)成分之交聯劑,係含有以上述通式(1)或上述通式(2)所表示之交聯劑。 As described above, in the adhesive composition of this embodiment, the crosslinking agent of the component (B) contains a crosslinking agent represented by the general formula (1) or the general formula (2).

在本實施形態之黏著劑組成物,從賦予更優異的接著力及耐久性且能夠更確實地防止漏光的觀點而言,在上述通式(1)或上述通式(2)所含有的R1A、R1B、R1C之以上述通式(3)表示的基,x係2以上且10以下的整數為較佳(更佳為4以上且8以下的整數),m係1以上且10以下的整數為較佳(更佳為1以上且6以下的整數)。 In the adhesive composition of this embodiment, from the viewpoint of providing more excellent adhesion and durability and more reliably preventing light leakage, R contained in the general formula (1) or the general formula (2) 1A , R1B , and R1C are the groups represented by the general formula (3), x is an integer of 2 or more and 10 or less (more preferably, it is an integer of 4 or more and 8 or less), and m is 1 or more and 10 The following integer is preferable (more preferably, it is an integer of 1 or more and 6 or less).

又,在上述通式(1)或上述通式(2)所含有的R1A、R1B、R1C之以上述通式(4)表示的基,y係2以上且10以下的整數為較佳,以4至8的整數為更佳,n係1以上且10以下的整數為較佳,1以下6以下的整數為更佳。又,在上述通式(1)及上述通式(2),R1A、R1B、R1C係可以相同,或者亦可以不同,亦可以組合複數個。 In addition, in the group represented by the above-mentioned general formula (4) for R 1A , R 1B , and R 1C contained in the general formula (1) or the general formula (2), an integer of 2 or more and 10 or less is y. Preferably, an integer of 4 to 8 is more preferable, n is an integer of 1 or more and 10 or less, and an integer of 1 to 6 is more preferable. Further, in the general formula (1) and the general formula (2), R 1A , R 1B , and R 1C may be the same or different, or a plurality of them may be combined.

(B)成分係異氰酸酯系交聯劑,更具體地,(B)成分係如上述通式(1)或上述通式(2)所顯示,具源自有三羥甲基丙烷之骨架(-(O-CH2-)3-C-CH2CH3)、及異氰酸酯(-N=C=O)基。 (B) component-based isocyanate-based cross-linking agent, more specifically, component (B) has a skeleton derived from trimethylolpropane as shown in the above general formula (1) or (2) (-( O-CH 2- ) 3 -C-CH 2 CH 3 ), and an isocyanate (-N = C = O) group.

從能夠對本實施形態之黏著劑組成物賦予適當的彈性的觀點而言,(B)成分係例如能夠是交聯度(在1分子的(B)成分中所含有的異氰酸酯基之數目)為1以上且9以下,交聯度係以3以上且6以下為佳。(B)成分係例如能夠藉由使三羥甲基丙烷、與具有異氰酸酯基之醯鹵(或酯、或羧酸)縮合而得到。 From the viewpoint of imparting appropriate elasticity to the adhesive composition of this embodiment, the (B) component system can be, for example, a degree of crosslinking (the number of isocyanate groups contained in one molecule of the (B) component) is 1. It is preferably from 9 to 9, and the degree of crosslinking is preferably from 3 to 6. The (B) component system can be obtained, for example, by condensing trimethylolpropane and a halogen halide (or an ester, or a carboxylic acid) having an isocyanate group.

在本實施形態之黏著劑組成物,就能夠更提高彈性之觀點,(B)成分的分子量係以500以上且10,000以下為佳,以2,000以上且7,000以下為較佳。 From the viewpoint of improving the elasticity of the adhesive composition of this embodiment, the molecular weight of the component (B) is preferably 500 or more and 10,000 or less, and more preferably 2,000 or more and 7,000 or less.

對此,本實施形態之黏著劑組成物係藉由含有(B)成分,起因於在(B)成分所含有之以上述通式(3)表示的基及/或上述通式(4)表示的基(鄰接源自三羥甲基丙烷之骨架之直鏈構造(在上述通式(1)及上述通式(2)係以R1A、R1B、R1C的方式表示)),而能夠提高該黏著劑組成物 的彈性。藉此,能夠抑制從該黏著劑層與貼合的基材(例如玻璃和聚碳酸酯)產生之氣體。又,因為(B)成分相對水及羥基之安定性較高,(B)成分與水及羥基等的官能基反應而造成從黏著劑層產生的氣體(例如二氧化碳、水蒸氣、單體、副產物等)為較少。 In contrast, the adhesive composition of the present embodiment contains the component (B) due to the group represented by the general formula (3) and / or the general formula (4) contained in the component (B). Group (adjacent to a linear structure derived from a trimethylolpropane skeleton (in the general formula (1) and the general formula (2), R 1A , R 1B , and R 1C are represented)), Improve the elasticity of the adhesive composition. This makes it possible to suppress gas generated from the adhesive layer and the substrate (for example, glass and polycarbonate) to be bonded. In addition, since the stability of the component (B) with respect to water and a hydroxyl group is high, the gas (for example, carbon dioxide, water vapor, monomers, Products, etc.) are less.

如此,從本實施形態之黏著劑組成物所得到的黏著劑層,係因為能夠抑制從基材產生氣體,且從該黏著劑層本身產生的氣體較少,所以能夠在濕熱條件下抑制產生發泡。 As described above, the adhesive layer obtained from the adhesive composition of this embodiment can suppress the generation of gas from the base material, and since less gas is generated from the adhesive layer itself, it is possible to suppress the generation of hair under hot and humid conditions. bubble.

從抑制發泡且能夠提高接著力及耐久性的觀點而言,在本實施形態之黏著劑組成物之(B)成分的含量,相對於本實施形態之(A)成分100質量份係以0.04質量份以上且10質量份以下為佳,以0.05質量份以上且10質量份以下為較佳,以0.06質量份以上為更佳,以0.07質量份以上為特佳,另一方面,以2質量份以下為佳。 From the viewpoint of suppressing foaming and improving adhesion and durability, the content of the component (B) in the adhesive composition of the present embodiment is 0.04 based on 100 parts by mass of the component (A) of the present embodiment. It is preferably more than 10 parts by mass, more preferably more than 0.05 parts by mass and less than 10 parts by mass, more preferably 0.06 parts by mass or more, particularly preferably 0.07 parts by mass or more, and 2 parts by mass Serve below.

作為(B)成分,係能夠使用市售的交聯劑。例如作為(B)成分,能夠使用D-94(銷售處:綜研化學股份公司)、E405-70B(銷售處:旭化成股份公司)、MFA-75B(銷售處:旭化成股份公司)等。 As (B) component, a commercially available crosslinking agent can be used. For example, as component (B), D-94 (Sales Office: Asahi Kasei Corporation), E405-70B (Sales Office: Asahi Kasei Corporation), MFA-75B (Sales Office: Asahi Kasei Corporation) can be used.

相較於不具有以上述通式(1)或上述通式(2)之交聯劑(例如市售的異氰酸酯系交聯劑之L-45(銷售處:綜研化學股份公司)、CORONATE HL(銷售處:日本POLYURETHANE股份公司)等),使用本實施形態之觸控面板用黏著劑組成物時,藉由含有以上述通式(1)或上述通式 (2)表示之(B)交聯劑,因為彈性較高,所以能夠抑制發泡。 Compared with the cross-linking agent (for example, commercially available isocyanate-based cross-linking agent L-45 (Sales Office: Soken Chemical Co., Ltd.), CORONATE HL ( Sales Office: POLYURETHANE Co., Ltd., etc.) When using the adhesive composition for a touch panel according to this embodiment, the adhesive composition containing the general formula (1) or the general formula is used. The crosslinking agent (B) shown in (2) has high elasticity and can suppress foaming.

作為(B)交聯劑,例如能夠舉出後述在實施例所記載之交聯劑1至3。 Examples of the (B) crosslinking agent include the crosslinking agents 1 to 3 described in Examples described later.

1.3.其他成分 1.3. Other ingredients 1.3.1.(C)矽烷偶合劑 1.3.1. (C) Silane coupling agent

本實施形態之黏著劑組成物,係能夠視需要而進一步含有(A)成分及(B)成分以外的成分。例如本實施形態之黏著劑組成物,亦可在不損害本發明的效果之範圍,調配(C)矽烷偶合劑(以下,有時亦簡記為「(C)成分」)、(D)離子性化合物(以下,有時亦簡記為「(D)成分」)、抗氧化劑、紫外線吸收劑、賦黏劑、塑化劑等。 The adhesive composition of this embodiment can further contain components other than (A) component and (B) component as needed. For example, the adhesive composition of this embodiment can also be formulated with (C) a silane coupling agent (hereinafter, also sometimes simply referred to as "(C) component") and (D) ionicity within a range that does not impair the effect of the present invention. Compounds (hereinafter may be abbreviated as "(D) component"), antioxidants, ultraviolet absorbers, tackifiers, plasticizers, and the like.

(C)成分,係例如可以是乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷及甲基三丙烯氧基丙基三甲氧基矽烷等的含有聚合性不飽和基之矽化合物;3-環氧丙氧基丙基三甲氧基矽烷、3-環氧丙氧基丙基甲基二甲氧基矽烷及2-(3,4-環氧環己基)乙基三甲氧基矽烷等具有環氧構造之矽化合物;3-胺基丙基三甲氧基矽烷、N-(2-胺乙基)3-胺基丙基三甲氧基矽烷及N-(2-胺乙基)-3-胺基丙基甲基二甲氧基矽烷等的含有胺基之矽化合物;以及3-氯丙基三甲氧基矽烷;寡聚物型矽烷偶合劑等,尤其是從在濕熱環境下不容易產生剝落而言,以具有與在(A)成分中所含有的官能基進行反應的官能基之矽烷偶合劑為佳。 (C) The component is, for example, a silicon compound containing a polymerizable unsaturated group such as vinyltrimethoxysilane, vinyltriethoxysilane, and methyltripropoxypropyltrimethoxysilane; 3- Glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, etc. Silicon compounds of oxygen structure; 3-aminopropyltrimethoxysilane, N- (2-aminoethyl) 3-aminopropyltrimethoxysilane and N- (2-aminoethyl) -3-amine Amino-containing silicon compounds such as propylmethyldimethoxysilane; and 3-chloropropyltrimethoxysilane; oligomeric silane coupling agents, etc., which are not prone to spalling especially in hot and humid environments A silane coupling agent having a functional group that reacts with a functional group contained in the component (A) is preferred.

在本實施形態之黏著劑組成物調配(C)成分 時,相對於(A)成分100質量份,(C)成分的含量係能夠是0.01質量份以上且0.5質量份以下,以0.05質量份以上且0.3質量份以下為佳。 (C) component is mix | blended with the adhesive composition of this embodiment In this case, the content of the component (C) can be 0.01 parts by mass or more and 0.5 parts by mass or less, and preferably 0.05 parts by mass or more and 0.3 parts by mass or less with respect to 100 parts by mass of the component (A).

1.3.2.(D)離子性化合物 1.3.2. (D) Ionic compounds

又,本實施形態之黏著劑組成物亦可含有(D)離子性化合物。作為(D)成分,例如可舉出由陰離子及陽離子所構成且在25℃為液體狀或固體狀之離子性化合物,具體而言,可舉出鹼金屬鹽、離子性液體(在25℃為液體狀)、界面活性劑等。 Moreover, the adhesive composition of this embodiment may contain (D) an ionic compound. Examples of the component (D) include ionic compounds composed of anions and cations that are liquid or solid at 25 ° C, and specific examples include alkali metal salts and ionic liquids (25 ° C Liquid), surfactants, etc.

相對於本實施形態之(A)成分100質量份,在本實施形態之黏著劑組成物之(D)成分的含量能夠是0.01質量份以上3質量份以下,以0.05質量份以上且2.5質量份以下為佳。 The content of the component (D) in the adhesive composition of this embodiment can be 0.01 mass parts or more and 3 mass parts or less, and 0.05 mass parts or more and 2.5 mass parts with respect to 100 mass parts of the (A) component of this embodiment. The following is better.

1.4.(A)成分的聚合方法 1.4. (A) Polymerization method of component

(A)成分的聚合方法係沒有特別限制,能夠使用溶液聚合、乳化聚合、懸浮聚合等的眾所周知的方法來聚合,但是就使用從聚合所得到的共聚物之混合物而在製造本發明的黏著劑組成物時,處理步驟比較簡單且能夠以短時間進行的觀點而言,係以藉由溶液聚合來聚合為佳。 (A) The polymerization method of the component is not particularly limited. It can be polymerized by a well-known method such as solution polymerization, emulsion polymerization, suspension polymerization, and the like, and a mixture of copolymers obtained from the polymerization is used to produce the adhesive of the present invention. In the case of a composition, from the viewpoint of relatively simple processing steps and being able to be performed in a short time, it is preferable to polymerize by solution polymerization.

溶液聚合,係通常能夠藉由在聚合槽內添加預定有機溶劑、各單體、聚合起始劑、及能夠視需要而使用之鏈轉移劑等,在氮氣流或有機溶劑的回流溫度下邊 攪拌邊使其加熱反應數小時來進行。 Solution polymerization is generally performed by adding a predetermined organic solvent, each monomer, a polymerization initiator, and a chain transfer agent that can be used as needed in a polymerization tank under a nitrogen stream or an organic solvent reflux temperature. The reaction was allowed to proceed for several hours while stirring.

又,此時,亦可逐次添加有機溶劑、單體及/或聚合起始劑的至少一部。作為有機溶劑,例如能夠舉出苯、甲苯、乙苯、正丙苯、第三丁苯、鄰二甲苯、間二甲苯、對二甲苯、四氫萘、十氫萘、芳香族石油腦等的芳香族烴類;例如、正己烷、正庚烷、正辛烷、異辛烷、正癸烷、二戊烯、石油精、石油腦、松節油(Turpentine)等的脂肪系或脂環族系烴類;例如乙酸乙酯、乙酸正丁酯、乙酸正戊酯、乙酸2-羥基乙酯、乙酸2-丁氧基乙酯、乙酸3-甲氧基丁酯、苯甲酸甲酯等的酯類;例如丙酮、甲基乙基酮、甲基異丁基酮、異佛爾酮、環己酮、甲基環己酮等的酮類;例如乙二醇單甲醚、乙二醇單乙醚、乙二醇單丁醚、二乙二醇單甲醚、二乙二醇單乙醚、二乙二醇單丁醚等的二醇醚類;例如甲醇、乙醇、正丙醇、異丙醇、正丁醇、異丁醇、第二丁醇、第三丁醇類等的醇類類等。該等有機溶劑係能夠各自單獨、或混合2種以上而使用。 In this case, at least a part of the organic solvent, the monomer, and / or the polymerization initiator may be sequentially added. Examples of the organic solvent include benzene, toluene, ethylbenzene, n-propylbenzene, tert-butylbenzene, o-xylene, m-xylene, p-xylene, tetrahydronaphthalene, decahydronaphthalene, and aromatic petroleum naphthalene. Aromatic hydrocarbons; for example, aliphatic or alicyclic hydrocarbons such as n-hexane, n-heptane, n-octane, isooctane, n-decane, dipentene, petroleum spirits, petroleum naphtha, turpentine Types; for example, esters of ethyl acetate, n-butyl acetate, n-pentyl acetate, 2-hydroxyethyl acetate, 2-butoxyethyl acetate, 3-methoxybutyl acetate, methyl benzoate, and the like ; For example, ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, isophorone, cyclohexanone, methyl cyclohexanone; for example, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, Glycol ethers such as ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, and diethylene glycol monobutyl ether; for example, methanol, ethanol, n-propanol, isopropanol, n- Alcohols such as butanol, isobutanol, second butanol, and third butanol, and the like. These organic solvents can be used individually or in mixture of 2 or more types.

該等聚合用有機溶劑之中,在(A)成分的聚合時,係在聚合反應中不容易產生鏈轉移的有機溶劑,例如以使用酯類、酮類為佳、特別是就(A)成分的溶解性、聚合反應容易性等而言,以使用乙酸乙酯、甲基乙基酮、丙酮等為佳。 Among the organic solvents for polymerization, when the component (A) is polymerized, it is an organic solvent that does not easily undergo chain transfer during the polymerization reaction. For example, esters and ketones are preferably used, and in particular, the component (A) is used. In terms of solubility, ease of polymerization reaction, and the like, it is preferable to use ethyl acetate, methyl ethyl ketone, acetone, and the like.

作為前述聚合起始劑,能夠使用在通常的溶液聚合能夠使用之有機過氧化物、偶氮化合物等。作為此種有機過氧化物,例如可舉出第三丁基過氧化氫、異丙 苯過氧化氫、過氧化二異丙苯、過氧化苯甲醯、過氧化月桂醯、過氧化己醯、過氧化二碳酸二異丙酯、過氧化碳酸二-2-乙基己酯、過氧2-甲基丙酸第三丁酯(t-butyl peroxypivalate)、2,2-雙(4,4-二-第三丁基過氧化環己基)丙烷、2,2-雙(4,4-二-第三戊基過氧化環己基)丙烷、2,2-雙(4,4-二-第三辛基過氧化環己基)丙烷、2,2-雙(4,4-二-α-異丙苯基過氧化環己基)丙烷、2,2-雙(4,4-二-第三丁基過氧化環己基)丁烷、2,2-雙(4,4-二-第三辛基過氧化環己基)丁烷等,作為偶氮化合物例如能夠舉出2,2′-偶氮雙-異丁腈、2,2′-偶氮雙-2,4-二甲基戊腈、2,2′-偶氮雙-4-甲氧基-2,4-二甲基戊腈等。 As said polymerization initiator, the organic peroxide, azo compound, etc. which can be used for general solution polymerization can be used. Examples of such an organic peroxide include third butyl hydrogen peroxide, isopropyl Benzene hydroperoxide, dicumyl peroxide, benzoyl peroxide, lauryl peroxide, hexamidine peroxide, diisopropyl peroxide, di-2-ethylhexyl peroxide, T-butyl peroxypivalate, 2,2-bis (4,4-di-tert-butylcyclohexyl peroxide) propane, 2,2-bis (4,4 -Di-tertiary pentylcyclohexyl peroxide) propane, 2,2-bis (4,4-di-tertiary octyl cyclohexyl peroxide) propane, 2,2-bis (4,4-di-α -Cumyl peroxide cyclohexyl) propane, 2,2-bis (4,4-di-third-butylcyclohexyl peroxide) butane, 2,2-bis (4,4-di-third Examples of azo compounds include 2,2′-azobis-isobutyronitrile and 2,2′-azobis-2,4-dimethylvaleronitrile. , 2,2′-azobis-4-methoxy-2,4-dimethylvaleronitrile and the like.

該等聚合起始劑之中,係以在(A)成分的聚合反應中,不產生接枝反應之聚合起始劑為佳、特別是以偶氮系聚合起始劑為佳。相對於單體合計100質量份,其使用量係通常為0.01質量份以上且2質量份以下,較佳為0.1質量份以上且1.0質量份以下。 Among these polymerization initiators, a polymerization initiator that does not cause a graft reaction during the polymerization reaction of the component (A) is preferred, and an azo-based polymerization initiator is particularly preferred. The usage amount is usually 0.01 parts by mass or more and 2 parts by mass or less, preferably 0.1 parts by mass or more and 1.0 part by mass or less with respect to 100 parts by mass of the total monomer.

又,在製造在本發明的黏著劑組成物所含有的(A)成分時,通常係不使用鏈轉移劑,但是在不損害本發明的目的及效果之範圍,亦能夠視需要而使用。 In the production of the component (A) contained in the adhesive composition of the present invention, a chain transfer agent is usually not used, but it can also be used as needed, as long as the object and effect of the present invention are not impaired.

作為此種鏈轉移劑,例如可舉出氰乙酸;氰乙酸之碳原子數1以上且8以下的烷酯類;溴乙酸;溴乙酸之碳原子數1以上且8以下的烷酯類;蒽、菲、茀、9-苯基茀等的芳香族化合物類;對硝基苯胺、硝基苯、二硝基苯、對硝基苯甲酸、對硝基苯酚、對硝基甲苯等的芳香 族硝基化合物類;苯醌、2,3,5,6-四甲基-對苯醌等的苯醌衍生物類;四丁基硼烷等的硼烷衍生物;四溴化碳、四氯化碳、1,1,2,2-四溴乙烷、三溴乙烯、三氯乙烯、溴三氯甲烷、三溴甲烷、3-氯-1-丙烷等的鹵化烴類;氯醛(chloral)、糠醛(furaldehyde)等的醛類:碳原子數1以上且18以下的烷基硫醇類;苯硫酚、甲苯硫醇等的芳香族硫醇類;氫硫基乙酸、氫硫基乙酸的碳原子數1以上且10以下的烷酯類;碳原子數1以上且12以下的羥烷基硫醇類;蒎烯、萜品油烯(terpinolene)等的萜烯類等。 Examples of such a chain transfer agent include cyanoacetic acid; alkyl esters of cyanoacetic acid having 1 or more and 8 carbon atoms; bromoacetic acid; alkyl esters of bromoacetic acid having 1 or more and 8 carbon atoms; anthracene , Phenanthrene, pyrene, 9-phenylpyrene and other aromatic compounds; p-nitroaniline, nitrobenzene, dinitrobenzene, p-nitrobenzoic acid, p-nitrophenol, p-nitrotoluene and other aromatic compounds Group nitro compounds; benzoquinone derivatives such as benzoquinone, 2,3,5,6-tetramethyl-p-benzoquinone; borane derivatives such as tetrabutylborane; carbon tetrabromide; Halogenated hydrocarbons such as carbon chloride, 1,1,2,2-tetrabromoethane, tribromoethylene, trichloroethylene, bromotrichloromethane, tribromomethane, and 3-chloro-1-propane; chloral ), Furaldehyde (furaldehyde) and other aldehydes: alkyl thiols having 1 or more and 18 carbon atoms; aromatic thiols such as thiophenol and tolthiol; hydrothioacetic acid, hydrothioacetic acid Alkyl esters having 1 to 10 carbon atoms; hydroxyalkyl mercaptans having 1 to 12 carbon atoms; terpenes such as pinene and terpinolene.

作為(A)成分的聚合溫度,係通常為約30℃以上且180℃以下,較佳為40℃以上且150℃以下,較佳為50℃以上且90℃以下的範圍。又,在藉由溶液聚合法等而得到的聚合物中含有未反應的單體時,為了除去該單體,亦可藉由使用甲醇等之再沈澱法來進行純化。 The polymerization temperature of the component (A) is usually in the range of about 30 ° C to 180 ° C, preferably 40 ° C to 150 ° C, and more preferably 50 ° C to 90 ° C. When the polymer obtained by the solution polymerization method or the like contains an unreacted monomer, in order to remove the monomer, it may be purified by a reprecipitation method using methanol or the like.

1.5.黏著劑組成物的製造 1.5. Manufacture of adhesive composition

本實施形態之黏著劑組成物,係通常能夠將前述(A)成分及(B)成分及視需要之任意成分,同時或依照任意的順序進行混合而調製。又,在將(A)成分與(B)成分混合時,藉由溶液聚合而調製(A)成分時,可以在含有聚合完成後的(A)成分之溶液添加(B)成分,但是藉由塊狀聚合而調製(A)成分時,因為在聚合完成後,會變得難以均勻混合,故以在該聚合的途中添加(B)成分並混合為佳。 The adhesive composition according to this embodiment is generally capable of being prepared by mixing the aforementioned (A) component and (B) component, and optionally any components at the same time or in an arbitrary order. When the component (A) is mixed with the component (B) and the component (A) is prepared by solution polymerization, the component (B) may be added to a solution containing the component (A) after the polymerization is completed, but by When the component (A) is prepared by block polymerization, it is difficult to uniformly mix the component after the polymerization is completed. Therefore, it is preferable to add the component (B) and mix it during the polymerization.

1.6.用途及作用效果 1.6. Uses and effects

本實施形態之黏著劑組成物,係能夠適合使用作為觸控面板用的接著劑。使用本實施形態之黏著劑組成物時,在濕熱條件下能夠發揮優異的耐久性,而且使用於與基材(例如玻璃或樹脂)之被黏著物進行接著時,能夠在濕熱條件下抑制在該黏著劑層產生發泡。 The adhesive composition of this embodiment can be suitably used as an adhesive for touch panels. When the adhesive composition of this embodiment is used, excellent durability can be exhibited under moist heat conditions, and when it is used for adhering to an adherend on a substrate (for example, glass or resin), it can be suppressed under moist heat conditions. Foam is generated in the adhesive layer.

在黏著劑層產生發泡的原因主要係認為有二個。第1個原因係貼合在黏著劑層之基材所產生之氣體。第2個原因是起因於構成黏著劑層的成分所產生之氣體。 There are two main reasons why foaming occurs in the adhesive layer. The first reason is the gas generated by the substrate bonded to the adhesive layer. The second reason is due to the gas generated by the components constituting the adhesive layer.

首先,第1個原因之來自基材的氣體,係例如從聚碳酸酯、聚甲基丙烯酸甲酯、聚醯亞胺等的有機材料(樹脂)產生的氣體。 First, the first cause of the gas from the substrate is a gas generated from an organic material (resin) such as polycarbonate, polymethyl methacrylate, and polyimide.

例如,就材質上的特性而言,聚碳酸酯已知在高溫條件下有產生排氣(CO2)之情形。又,聚碳酸酯係容易使水蒸氣(H2O)通過,特別是在高溫條件下,水蒸氣的透過變為顯著。由於該等氣體,致使在聚碳酸酯所貼合的黏著劑層有產生發泡之情形。又,為聚甲基丙烯酸甲酯時,水蒸氣、未反應的單體有以氣體的方式產生之情形。 For example, in terms of material characteristics, polycarbonate is known to generate exhaust gas (CO 2 ) under high temperature conditions. In addition, polycarbonates easily pass water vapor (H 2 O), and particularly under high temperature conditions, the transmission of water vapor is significant. Due to these gases, foaming may occur in the adhesive layer to which the polycarbonate is bonded. In the case of polymethyl methacrylate, water vapor and unreacted monomer may be generated as a gas.

第2個原因之起因於構成黏著劑層的成分之氣體,係由於在黏著劑組成物所含有的成分進行反應而產生的氣體。例如在異氰酸酯系交聯劑,異氰酸酯基會與水進行反應而有產生二氧化碳。 The second reason is that the gas due to the components constituting the adhesive layer is a gas generated by the reaction of the components contained in the adhesive composition. For example, in an isocyanate-based crosslinking agent, isocyanate groups react with water to generate carbon dioxide.

對此,為本實施形態之黏著劑組成物的一 個作用效果之發泡防止特性,推測係藉由以下的作用機構而來。 In this regard, one of the adhesive compositions of this embodiment is It is estimated that the foaming prevention characteristics of each effect are obtained by the following action mechanisms.

亦即,使用本實施形態之黏著劑組成物而在基材表面設置黏著劑層時,藉由該黏著劑組成物所具有的(B)成分,由於於在(B)成分所含有之以上述通式(1)表示的基及/或上述通式(2)表示的基使彈性提高之結果,能夠抑制從基材產生氣體。又,在本實施形態之黏著劑組成物,與(B)成分反應而產生的氣體較少。依照上述,使用本實施形態之黏著劑組成物用以形成將構成觸控面板之構件貼合之黏著劑層時,因為該黏著劑層能夠抑制產生發泡,而且該黏著劑層係具有優異的黏著力及耐久性(濕熱耐久性),所以使用該黏著劑層而貼合構成觸控面板之構件時,不容易產生剝落。而且,因為本實施形態之黏著劑組成物係不含有酸成分,所以具有優異的導電膜非腐蝕性。 That is, when using the adhesive composition of this embodiment to provide an adhesive layer on the surface of a substrate, the component (B) contained in the adhesive composition is used as described above in the component (B). As a result of improving the elasticity of the group represented by the general formula (1) and / or the group represented by the general formula (2), it is possible to suppress the generation of gas from the substrate. In addition, in the adhesive composition of this embodiment, the gas generated by the reaction with the component (B) is small. According to the above, when the adhesive composition of this embodiment is used to form an adhesive layer for bonding members constituting a touch panel, the adhesive layer can suppress foaming, and the adhesive layer has excellent Adhesive force and durability (damp heat durability). Therefore, when the members constituting a touch panel are bonded together by using this adhesive layer, peeling does not easily occur. Moreover, since the adhesive composition system of this embodiment does not contain an acid component, it has the outstanding non-corrosiveness of a conductive film.

2.黏著片 2. Adhesive sheet

本發明之另外的一實施形態之黏著片(黏著劑層),係在支撐物的單面或兩面具有含有上述實施形態之觸控面板用黏著劑組成物之黏著劑層。 An adhesive sheet (adhesive layer) according to another embodiment of the present invention includes an adhesive layer containing the adhesive composition for a touch panel of the above embodiment on one or both sides of a support.

在製造本實施形態之黏著片時,上述黏著劑層係可以藉由使用凹版塗佈機、邁耶氏棒(Mayer’s bar)塗佈機、氣動刮塗機、輥塗佈機等將上述黏著劑組成物塗佈在支撐物上,將在黏著片上所塗佈的黏著劑組成物在常溫或加熱進行乾燥及交聯而形成,或者亦可將黏著劑層設 置在剝離薄膜上,將其轉貼至被黏著物而形成。 When manufacturing the adhesive sheet of this embodiment, the above-mentioned adhesive layer can be obtained by using a gravure coater, Mayer's bar coater, pneumatic blade coater, roll coater, etc. The composition is coated on a support, and the adhesive composition applied on the adhesive sheet is formed by drying and crosslinking at normal temperature or heating, or an adhesive layer may also be formed. It is formed by putting it on a peeling film and transferring it to an adherend.

又,黏著片的厚度通常係乾燥厚為10μm以上且1000μm以下,較佳為25μm以上且500μm以下左右。又,在使用黏著片前,亦可使該黏著劑層表面層積剝離薄膜,以用以保護黏著劑層。 The thickness of the adhesive sheet is usually a dry thickness of 10 μm or more and 1000 μm or less, preferably 25 μm or more and 500 μm or less. In addition, before using the adhesive sheet, a peeling film may be laminated on the surface of the adhesive layer to protect the adhesive layer.

支撐物係例如可舉出聚碳酸酯、聚甲基丙烯酸甲酯、聚對酞酸乙二酯(PET)等的聚酯、三乙酸纖維素(TAC)、聚碸、聚醯亞胺、聚苯乙烯、聚四氟乙烯、聚乙烯、聚氯乙烯等的有機高分子、及玻璃。 Examples of the support system include polycarbonate, polymethyl methacrylate, polyester such as polyethylene terephthalate (PET), cellulose triacetate (TAC), polyfluorene, polyimide, and polyimide. Organic polymers such as styrene, polytetrafluoroethylene, polyethylene, polyvinyl chloride, and glass.

被黏著物,係可舉出附導電膜層的玻璃或附導電膜的樹脂薄膜、聚碳酸酯、聚甲基丙烯酸甲酯、聚對酞酸乙二酯(PET)等的聚酯、三乙酸纖維素(TAC)、聚碸、聚醯亞胺、聚苯乙烯、聚四氟乙烯、聚乙烯、聚氯乙烯等的有機高分子、及玻璃等。 Examples of the adherend include glass with a conductive film layer, resin film with a conductive film, polycarbonate, polymethyl methacrylate, polyester such as polyethylene terephthalate (PET), and triacetic acid. Organic polymers such as cellulose (TAC), polyfluorene, polyimide, polystyrene, polytetrafluoroethylene, polyethylene, polyvinyl chloride, and glass.

上述支撐物或被黏著物(基材)的厚度,係沒有特別限定,有機高分子時係例如以12μm以上且75μm以下為佳。又,上述基材係可以具有單層及複數層的任一種形態。又,在基材表面,例如亦可施行電暈放電處理、電漿處理等的物理處理、底塗處理等的化學處理等眾所周知慣用的表面處理。玻璃時係以25μm以上且2000μm以下為佳。 The thickness of the support or adherend (substrate) is not particularly limited, and in the case of an organic polymer, it is preferably 12 μm or more and 75 μm or less. Moreover, the said base material system can have any form of a single layer and multiple layers. In addition, a well-known and commonly used surface treatment such as a physical treatment such as a corona discharge treatment, a plasma treatment, or a chemical treatment such as a primer treatment may be performed on the surface of the substrate. In the case of glass, the thickness is preferably 25 μm or more and 2000 μm or less.

3.積層體 3.Laminated body

本發明的一實施形態之積層體100,係如第1圖所顯示,含有第1基材20、第2基材30及黏著劑層10;第1基材20與第2基材30係透過黏著劑層10而貼合。 A laminated body 100 according to an embodiment of the present invention includes a first substrate 20, a second substrate 30, and an adhesive layer 10 as shown in FIG. 1; the first substrate 20 and the second substrate 30 are transparent. The adhesive layer 10 is bonded together.

本實施形態之積層體,係能夠藉由透過從在上述實施形態記載的觸控面板用黏著劑組成物所得到的黏著劑層,將第1基材與第2基材貼合之步驟而得到。 The laminated body of this embodiment can be obtained by the step of bonding the first substrate and the second substrate through the adhesive layer obtained from the adhesive composition for a touch panel described in the above embodiment. .

更具體地,藉由將從上述實施形態之觸控面板用黏著劑組成物所得到的黏著片(黏著劑層10)貼附在第1基材20或第2基材30,而能夠配置在第1基材20與第2基材30之間。亦即,藉由將黏著劑層10的表面貼附在第1基材20或第2基材30的任一方的表面之後,將該黏著劑層10的另一表面(背面)貼附在第2基材30或第1基材20之另一方的表面,而能夠藉由黏著劑層10將第1基材20與第2基材30貼合。 More specifically, the adhesive sheet (adhesive layer 10) obtained from the adhesive composition for a touch panel of the above-mentioned embodiment can be attached to the first base material 20 or the second base material 30, and can be disposed on the first base material 20 or the second base material 30. Between the first base material 20 and the second base material 30. That is, after the surface of the adhesive layer 10 is attached to either the first substrate 20 or the second substrate 30, the other surface (back surface) of the adhesive layer 10 is attached to the first The other surface of the second base material 30 or the first base material 20 can be bonded to the first base material 20 and the second base material 30 via the adhesive layer 10.

第1基材20及第2基材30係各自能夠含有玻璃或樹脂。作為一個例子,第1基材20係可含有玻璃,而第2基材30係可含有樹脂。 Each of the first base material 20 and the second base material 30 can contain glass or resin. As an example, the first base material 20 may contain glass, and the second base material 30 may contain resin.

作為構成第1基材20及/或第2基材30之樹脂,例如可舉出在上述所例示的有機高分子作為支撐物。由於附加熱量,有時會從該等樹脂產生由該樹脂所含有的水分、該樹脂分解而產生的氣體、源自該樹脂的原料之單體、副產物的氣體。因為黏著劑層10係從本實施形態之黏著劑組成物所得到者,其彈性較高,所以能夠抑制從第1基材20及/或第2基材30產生氣體。 Examples of the resin constituting the first base material 20 and / or the second base material 30 include the organic polymer exemplified above as a support. Due to the additional heat, gas contained in the resin, gas generated by decomposition of the resin, monomers derived from raw materials of the resin, and gas produced as a by-product may be generated from the resin. Since the adhesive layer 10 is obtained from the adhesive composition of this embodiment and has high elasticity, it is possible to suppress the generation of gas from the first substrate 20 and / or the second substrate 30.

本實施形態之積層體100,藉由第1基材20與第2基材30係透過黏著劑層10而貼合,除了起因於黏著劑層10的彈性,使得黏著劑層10能夠抑制從第1基材20及/或第2基材30產生氣體以外,從黏著劑層10本身產生的氣體亦較少。因此,能夠抑制在黏著劑層10產生發泡。因而,黏著劑層10係具有優異的透明性,而且藉由具有優異的黏著力之黏著劑層10將第1基材20與第2基材30貼合,所以積層體100不容易產生剝落。 The laminated body 100 of this embodiment is adhered by the first base material 20 and the second base material 30 through the adhesive layer 10, and in addition to the elasticity of the adhesive layer 10, the adhesive layer 10 can be suppressed from the first layer In addition to the gas generated from the 1 base material 20 and / or the second base material 30, the gas generated from the adhesive layer 10 itself is also small. Therefore, it is possible to suppress foaming in the adhesive layer 10. Therefore, the adhesive layer 10 has excellent transparency, and the first base material 20 and the second base material 30 are bonded together by the adhesive layer 10 having excellent adhesive force, so that the laminated body 100 is unlikely to peel off.

4.實施例 4. Examples

以下,基於下述實施例而說明本發明,但是本發明係不限定於實施例。 Hereinafter, the present invention will be described based on the following examples, but the present invention is not limited to the examples.

4.1.(A)成分的調製 4.1. (A) Component modulation 4.1.1.聚合物A、C至G的調製 4.1.1. Modulation of polymers A, C to G

在具備有攪拌機、回流冷卻器、溫度計及氮導入管之反應裝置,添加具有下述表2所顯示的調配比率之單體成分,其次,以單體濃度成為50質量%的調配量添加乙酸乙酯。其次,添加偶氮雙異丁腈0.1質量份,一邊使用氮氣取代反應容器內的空氣一邊進行攪拌且升溫至60℃之後,使其反應6小時。反應結束後,使用乙酸乙酯(溶劑)稀釋而得到(A)成分(丙烯酸系聚合物A至E)的溶液。又,丙烯酸系聚合物A、C至F的酸價係任一者均是0mg/KOH。丙烯酸系聚合物G的酸價為4mg/KOH。 To a reaction device equipped with a stirrer, a reflux cooler, a thermometer, and a nitrogen introduction tube, a monomer component having a blending ratio shown in Table 2 below was added, and then ethyl acetate was added at a blending amount with a monomer concentration of 50% by mass. ester. Next, 0.1 part by mass of azobisisobutyronitrile was added, and the temperature was raised to 60 ° C. while stirring while replacing the air in the reaction vessel with nitrogen, and then allowed to react for 6 hours. After completion of the reaction, the solution was diluted with ethyl acetate (solvent) to obtain a solution of the component (A) (acrylic polymers A to E). The acid values of the acrylic polymers A and C to F were 0 mg / KOH. The acid value of the acrylic polymer G was 4 mg / KOH.

4.1.2.聚合物B的調製 4.1.2. Preparation of polymer B

在具備有攪拌機、回流冷卻器、溫度計及氮導入管之反應裝置,添加具有下述表2所顯示的調配比率之單體成分,其次,以單體濃度成為40質量%的調配量添加乙酸乙酯。其次,添加偶氮雙異丁腈0.1質量份,邊使用氮氣取代反應容器內的空氣邊進行攪拌且升溫至60℃之後,使其反應6小時。反應結束後,使用乙酸乙酯(溶劑)稀釋而得到(A)成分(丙烯酸系聚合物B)的溶液。又,丙烯酸系聚合物B的酸價為0mg/KOH。 To a reaction device equipped with a stirrer, a reflux cooler, a thermometer, and a nitrogen introduction tube, a monomer component having a blending ratio shown in Table 2 below was added, and then ethyl acetate was added at a blending amount with a monomer concentration of 40% by mass. ester. Next, 0.1 parts by mass of azobisisobutyronitrile was added, and the temperature was increased to 60 ° C. while stirring while replacing the air in the reaction vessel with nitrogen, followed by a reaction for 6 hours. After completion of the reaction, it was diluted with ethyl acetate (solvent) to obtain a solution of the component (A) (acrylic polymer B). The acid value of the acrylic polymer B was 0 mg / KOH.

4.2.黏著劑組成物的調製及評價用黏著片的製作 4.2. Preparation of adhesive composition and production of adhesive sheet for evaluation

使用上述4.1.得到的(A)成分,依據下述表3的調配(在表3,各成分的調配量係表示除去溶劑後之固體含量中的比例)添加各成分而得到實施例1至9及比較例1至7之黏著劑組成物的溶液。 Using the component (A) obtained in the above 4.1., The components were added according to the following Table 3 (in Table 3, the amount of each component represents the proportion of the solid content after removing the solvent) to obtain Examples 1 to 9 And solutions of the adhesive composition of Comparative Examples 1 to 7.

其次,藉由將該黏著劑組成物的溶液塗佈在剝離處理後之聚酯薄膜的表面且使其乾燥,來得到具有厚度50μm的黏著劑層之黏著片。將該黏著片在23℃/50%RH的條件下於暗處使其熟化7天之後,貼附在膜厚100μm的聚對酞酸丁二酯薄膜之單面而得到評價用黏著片。 Next, the solution of the adhesive composition was coated on the surface of the polyester film after the peeling treatment and dried to obtain an adhesive sheet having an adhesive layer having a thickness of 50 μm. This adhesive sheet was aged at 23 ° C / 50% RH for 7 days in a dark place, and then attached to one side of a polybutylene terephthalate film having a film thickness of 100 µm to obtain an adhesive sheet for evaluation.

又,作為(B)成分,係如下述表3所顯示,使用交聯劑1至3。交聯劑1至5係各自具有以下述的構造式(7)至(11)所顯示之構造。又,交聯劑1的重量平均分 子量(MW)為約4,000,交聯劑2的重量平均分子量(MW)係例如約3,700,交聯劑3的重量平均分子量(MW)係例如約4,000。 As the component (B), as shown in Table 3 below, the crosslinking agents 1 to 3 were used. Each of the crosslinking agents 1 to 5 has a structure shown by the following structural formulae (7) to (11). Moreover, the weight average score of the crosslinking agent 1 The molecular weight (MW) is about 4,000, the weight average molecular weight (MW) of the crosslinking agent 2 is, for example, about 3,700, and the weight average molecular weight (MW) of the crosslinking agent 3 is, for example, about 4,000.

[交聯劑1] [Crosslinking agent 1]

(式中,l係1以上且10以下,m係1以上且10以下,n係1以上且10以下)。 (In the formula, l is 1 or more and 10 or less, m is 1 or more and 10 or less, and n is 1 or more and 10 or less).

[交聯劑2] [Crosslinking Agent 2]

(式中,l係1以上且10以下,m係1以上且10以下,n係1以上且10以下,a係1以上且10以下,b係1以上且10以下,c係1以上且10以下)。 (In the formula, l is 1 or more and 10 or less, m is 1 or more and 10 or less, n is 1 or more and 10 or less, a is 1 or more and 10 or less, b is 1 or more and 10 or less, and c is 1 or more and 10 or less. the following).

[交聯劑3] [Crosslinking Agent 3]

(式中,l係1以上且10以下,m係1以上且10以下,n係1以上且10以下)。 (In the formula, l is 1 or more and 10 or less, m is 1 or more and 10 or less, and n is 1 or more and 10 or less).

[交聯劑4] [Crosslinking agent 4]

[交聯劑5] [Crosslinking agent 5]

針對各評價用黏著片,使用以下的方法進行評價180°剝離力及耐濕耐久性(表3)。 For each evaluation adhesive sheet, the 180 ° peeling force and moisture resistance durability were evaluated using the following methods (Table 3).

4.3.評價方法 4.3. Evaluation method 4.3.1.180°剝離力(黏著力) 4.3.1. 180 ° peeling force (adhesive force)

將在上述4.2所得到的評價用黏著片裁斷成為25mm×150mm,將單面的剝離片剝下,將其貼附在表3所記載的各被黏著物且使用重量2kg的輥筒進行3來回壓黏。壓黏後在23℃×50%RH環境下放置20分鐘之後,將試片的短邊以剝下速度300mm/分在180°方向拉伸且將10次的測定值之平均值設作剝離力。 The adhesive sheet for evaluation obtained in the above 4.2 was cut into 25 mm × 150 mm, and the one-sided release sheet was peeled off and attached to each adherend described in Table 3 using a roller weighing 2 kg for 3 round trips. Pressure stick. After being pressed for 20 minutes in an environment of 23 ° C. × 50% RH, the short side of the test piece was stretched at a peeling speed of 300 mm / min in a direction of 180 ° and the average value of the measured values 10 times was set as the peeling force. .

4.3.2.耐濕耐久性 4.3.2. Moisture resistance and durability

將上述4.2所得到的評價用黏著片裁斷成為50mm×60mm,將一側的剝離片剝下且貼附在表3所記載的各被黏著物且使用重量2kg的輥筒進行3來回壓黏。壓黏後在50℃×5atm進行高壓釜處理20分鐘。其次,在1小時靜置室溫之後,於85℃/85%RH環境下放置24小時且於23℃/50%RH靜置1小時之後,藉由目視確認黏著劑層有無產生發泡。評價的基準係如下述。 The adhesive sheet for evaluation obtained in 4.2 above was cut into 50 mm × 60 mm, and the release sheet on one side was peeled off and attached to each of the adherends described in Table 3, and pressed back and forth 3 times using a 2 kg roller. After pressure bonding, autoclave treatment was performed at 50 ° C. × 5 atm for 20 minutes. Next, after standing at room temperature for 1 hour, leaving it to stand at 85 ° C / 85% RH for 24 hours and leaving it at 23 ° C / 50% RH for 1 hour, the presence or absence of foaming in the adhesive layer was visually confirmed. The evaluation criteria are as follows.

(評價) (Evaluation)

○:以目視在黏著劑層無法確認氣泡。 ○: Bubbles could not be confirmed visually on the adhesive layer.

×:以目視在黏著劑層能夠確認大氣泡。或是黏著劑層從支撐物或被黏著物浮起。 ×: Large bubbles can be confirmed visually on the adhesive layer. Or the adhesive layer floats from the support or the adherend.

4.3.3.導電膜非腐蝕性 4.3.3. Non-corrosive conductive film

將上述4.2所得到的評價用黏著片裁斷成為10mm×60mm,將一側的剝離片剝下而貼附在經裁斷成為10mm×100mm之ITO蒸鍍PET薄膜,在50℃×5atm進行高壓釜處理20分鐘。其次,在室溫靜置1小時之後,於60℃且90%RH的環境下放置500小時,在23℃且濕度65%RH的條件下靜置1小時之後,測定ITO蒸鍍薄膜的電阻值,而且與預先測定之試驗前的電阻值比較且求取相對於試驗前的電阻值之電阻值的變化率。又,電阻值的測定係使用TESTER(三和電氣計器(股)製、DIGITAL MULTIMETER PC510)。 The adhesive sheet for evaluation obtained in 4.2 above was cut into 10 mm × 60 mm, and the release sheet on one side was peeled off and attached to an ITO vapor-deposited PET film cut into 10 mm × 100 mm. The autoclave treatment was performed at 50 ° C. × 5 atm. 20 minutes. Next, after standing at room temperature for 1 hour, it was left to stand at 60 ° C and 90% RH for 500 hours, and at 23 ° C and 65% RH for 1 hour, and then the resistance value of the ITO vapor-deposited film was measured. In addition, the resistance value is compared with the resistance value measured before the test and the change rate of the resistance value with respect to the resistance value before the test is obtained. The measurement of the resistance value was performed using TESTER (Sanwa Electric Co., Ltd., DIGITAL MULTIMETER PC510).

(評價) (Evaluation)

○:相對於試驗前的電阻值之電阻值的變化率未達115% ○: The rate of change of the resistance value with respect to the resistance value before the test did not reach 115%

×:相對於試驗前的電阻值之電阻值的變化率為115%以上 ×: The rate of change of the resistance value with respect to the resistance value before the test is 115% or more

4.3.4.薄片的霧度 4.3.4. Haze of flakes

脫泡處理之後,將實施例1至9及比較例1至7的黏著劑組成物各自使用刮刀片而塗佈在經厚度38μm之剝離處理後的聚對酞酸乙二酯薄膜(以下:隔離膜)上,於90℃乾燥3分鐘而形成乾燥膜厚50μm的塗膜。在塗膜之與前述聚對酞酸乙二酯薄膜的貼附面為相反面,進一步貼合隔離膜,而得到具有厚度50μm的黏著劑層之評價用黏著片,其中該黏著劑層係被2片隔離膜夾住。其次,將使用 本欄所記載的方法而得到的前述評價用黏著片之單面的隔離膜剝離,且貼合在1.0mm厚的載玻片,而且將黏著片之另單面的隔離膜剝離,且使用霧度計量器HM-150(村上色彩技研研究所)而測定只有黏著劑層的霧度。 After the defoaming treatment, each of the adhesive compositions of Examples 1 to 9 and Comparative Examples 1 to 7 was applied to a polyethylene terephthalate film after peeling treatment with a thickness of 38 μm using a doctor blade (hereinafter: isolation Film), and dried at 90 ° C. for 3 minutes to form a coating film having a dry film thickness of 50 μm. On the opposite side of the coating film from the above-mentioned polyethylene terephthalate film, the release film was further bonded to obtain an adhesive sheet for evaluation with an adhesive layer having a thickness of 50 μm, wherein the adhesive layer was Clamped by 2 isolation films. Second, will use The one-sided release film of the above-mentioned adhesive sheet for evaluation obtained by the method described in this column was peeled off, and was attached to a 1.0 mm-thick glass slide. The other one-sided release film of the adhesive sheet was peeled off, and mist was used. The meter HM-150 (Murakami Color Research Institute) measures the haze of the adhesive layer only.

又,在表2及表3之略語係有下列的意思。 The abbreviations in Tables 2 and 3 have the following meanings.

AA:丙烯酸 AA: Acrylic

AM:丙烯醯胺 AM: Acrylamide

BA:丙烯酸正丁酯 BA: n-butyl acrylate

2EHA:丙烯酸2-乙基己酯 2EHA: 2-ethylhexyl acrylate

2EHMA:甲基丙烯酸2-乙基己酯 2EHMA: 2-ethylhexyl methacrylate

MA:丙烯酸甲酯 MA: methyl acrylate

HEA:丙烯酸2-羥基乙酯 HEA: 2-hydroxyethyl acrylate

HEMA:甲基丙烯酸2-羥基乙酯 HEMA: 2-hydroxyethyl methacrylate

ISTA:丙烯酸異硬脂基酯 ISTA: Isostearyl Acrylate

從表3的結果,上述實施例1至9的組成物,係藉由含有上述通式(1)表示的交聯劑1或交聯劑2、或上述通式(2)表示的交聯劑3作為(B)成分,在濕熱條件下能夠抑制產生發泡,而且能夠實現較高的黏著力及優異的耐久性及透明性,係能夠理解的。 From the results in Table 3, the compositions of Examples 1 to 9 were obtained by including the crosslinking agent 1 or the crosslinking agent 2 represented by the general formula (1) or the crosslinking agent represented by the general formula (2). 3 As component (B), it is understandable that foaming can be suppressed under humid and hot conditions, and high adhesion and excellent durability and transparency can be achieved.

相對於此,上述比較例1至6的組成物,能夠理解因為不含有上述通式(1)表示的交聯劑及上述通式(2)表示的交聯劑之任一者作為(B)成分(亦即,在比較例1至6所使用的交聯劑4及交聯劑5,係不具有上述通式(1)或上述通式(2)表示的構造),故無法充分地減低發泡。又,比較例2係在基材(聚碳酸酯)貼附有評價用黏著片之例子,但亦能夠理解使用含有交聯劑4的黏著劑組成物之黏著劑層,黏著力較低。又,能夠理解因為比較例7的組成物含有具有酸性基之聚合物G,所以導電膜非腐蝕性較差。 In contrast, it is understood that the compositions of Comparative Examples 1 to 6 do not contain any of the crosslinking agent represented by the general formula (1) and the crosslinking agent represented by the general formula (2) as (B). The components (that is, the cross-linking agent 4 and the cross-linking agent 5 used in Comparative Examples 1 to 6 do not have the structure represented by the general formula (1) or the general formula (2)), and therefore cannot be sufficiently reduced. Foaming. Further, Comparative Example 2 is an example in which an adhesive sheet for evaluation is attached to a substrate (polycarbonate). However, it can be understood that an adhesive layer using an adhesive composition containing a crosslinking agent 4 has a low adhesive force. In addition, it can be understood that the composition of Comparative Example 7 contains a polymer G having an acidic group, so that the non-corrosiveness of the conductive film is poor.

又,在上述實施例1至9,係除了添加(A) 成分及(B)成分以外,亦進一步調配(C)成分1質量份及(D)成分0.1質量份而調製黏著劑組成物,且使用該黏著劑組成物而製造黏著片時,與上述結果同樣地,所得到的該黏著片,係在濕熱條件下能夠抑制發泡,而且具有較高的黏著力及優異的耐久性及透明性。 In addition, in Examples 1 to 9, the addition of (A) In addition to the component and the (B) component, 1 part by mass of the (C) component and 0.1 part by mass of the (D) component are further blended to prepare an adhesive composition, and when an adhesive sheet is produced using the adhesive composition, the same results as above are obtained. The obtained adhesive sheet is capable of suppressing foaming under humid and hot conditions, and has high adhesive force and excellent durability and transparency.

Claims (5)

一種觸控面板用黏著劑組成物,係含有:(A)丙烯酸系聚合物,其係重量平均分子量為10萬以上且未達80萬,而且實質上不含有酸性基;及(B)交聯劑,其係以下述通式(1)或下述通式(2)表示;前述(A)丙烯酸系聚合物係含有(a1)(甲基)丙烯酸烷酯及(a2)含羥基的單體之單體成分的共聚物,相對於前述(A)丙烯酸系聚合物100質量份,含有0.04質量份以上且10質量份以下之前述(B)交聯劑,(式中,R1A、R1B、R1C係獨立且為含有以下述通式(3)表示的基及/或下述通式(4)表示的基之基,R2A、R2B、R2C係以-(CH2)6-表示的基),(式中,R1A、R1B、R1C係獨立且為含有以下述通式(3)表示的基及/或下述通式(4)表示的基之基,R2A、R2B、R2C、R3A、R3B、R3C、R3D、R3E、R3F係以-(CH2)6-表示的基),(式中,x係2以上且10以下的整數,m係1以上且10以下的整數),(式中,X係表示單鍵或-O-,y係2以上且10以下的整數,n係1以上且10以下的整數)。An adhesive composition for a touch panel, comprising: (A) an acrylic polymer having a weight-average molecular weight of 100,000 or more and less than 800,000, and substantially containing no acidic group; and (B) cross-linking The agent is represented by the following general formula (1) or (2); the (A) acrylic polymer contains (a1) (meth) acrylic acid alkyl ester and (a2) hydroxyl-containing monomer The copolymer of a monomer component contains 0.04 parts by mass or more and 10 parts by mass or less of the (B) crosslinking agent with respect to 100 parts by mass of the acrylic polymer (A), (In the formula, R 1A , R 1B , and R 1C are independent and are a group containing a group represented by the following general formula (3) and / or a group represented by the following general formula (4). R 2A , R 2B , R 2C is a group represented by- (CH 2 ) 6- ), (In the formula, R 1A , R 1B , and R 1C are independent and are a group containing a group represented by the following general formula (3) and / or a group represented by the following general formula (4). R 2A , R 2B , R 2C , R 3A , R 3B , R 3C , R 3D , R 3E , and R 3F are groups represented by- (CH 2 ) 6- ), (Where x is an integer of 2 to 10 and m is an integer of 1 to 10), (In the formula, X is a single bond or -O-, y is an integer from 2 to 10 and n is an integer from 1 to 10). 如申請專利範圍第1項所述之觸控面板用黏著劑組成物,其中前述單體成分係含有:前述(a1)(甲基)丙烯酸烷酯,為45質量%以上且99質量%以下;前述(a2)含羥基的單體,為1質量%以上且40質量%以下;以及為(a1)成分及(a2)成分以外的單體且在分子內具有1個烯烴性雙鍵之單體,為0質量%以上且15質量%以下。The adhesive composition for a touch panel according to item 1 of the scope of the patent application, wherein the monomer component contains: (a1) (meth) acrylic acid alkyl ester, at least 45% by mass and at most 99% by mass; The (a2) hydroxyl-containing monomer is 1% by mass to 40% by mass; and a monomer other than the components (a1) and (a2) and having one olefinic double bond in the molecule 0% to 15% by mass. 如申請專利範圍第2項所述之觸控面板用黏著劑組成物,其中作為前述(a1)成分及(a2)成分以外的單體且在分子內具有1個烯烴性雙鍵之單體,前述單體成分係進一步含有(a3)含氮的單體,為0.1質量%以上且7質量%以下;以及(a4)為(a1)成分、(a2)成分及(a3)成分以外的單體且在分子內具有1個烯烴性雙鍵之單體,為0質量%以上且10質量%以下,在此,(a1)成分+(a2)成分+(a3)成分+(a4)成分=100質量%。The adhesive composition for a touch panel according to item 2 of the scope of patent application, wherein the monomer is a monomer other than the components (a1) and (a2) and has an olefinic double bond in the molecule, The monomer component further contains (a3) a nitrogen-containing monomer in an amount of 0.1 mass% to 7 mass%; and (a4) is a monomer other than the components (a1), (a2), and (a3) The monomer having one olefinic double bond in the molecule is 0% by mass or more and 10% by mass or less. Here, (a1) component + (a2) component + (a3) component + (a4) component = 100 quality%. 一種黏著片,係在支撐物的單面或兩面具有申請專利範圍第1至3項中任一項所述之觸控面板用黏著劑組成物。An adhesive sheet is an adhesive composition for a touch panel according to any one of claims 1 to 3 on one or both sides of a support. 一種積層體,係包含第1基材、第2基材、及從申請專利範圍第1至3項中任一項所述之觸控面板用黏著劑組成物所得到的黏著劑層;前述第1基材及前述第2基材係透過前述黏著劑層而貼合,前述第1基材及第2基材係各自含有玻璃或樹脂。A laminated body comprising a first substrate, a second substrate, and an adhesive layer obtained from the adhesive composition for a touch panel according to any one of claims 1 to 3; The 1 base material and the second base material are bonded together through the adhesive layer, and the first base material and the second base material each contain glass or resin.
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