TWI662376B - Exposure device, exposure method, and article manufacturing method - Google Patents

Abstract

Provided is an exposure device that is advantageous in terms of uniformity of the exposure amount.

An exposure device that scans and exposes the substrate (W) for each shooting area while moving the substrate (W) and the original plate (R). The exposure device includes: shaping the exposure light that exposes the shooting area. A shaping unit (117); a lighting unit (114) that adjusts the light amount distribution of the exposure light; and a control unit (170) that controls the shaping unit (117) and the lighting unit (114); wherein the control unit (170) controls the lighting Section (114) to equalize the cumulative exposure distributions of the first and second areas separated in the non-scanning direction within the subject area, and control the shaping section (117) so that the scanning direction in the subject area The cumulative exposure is even.

Description

   Exposure device, exposure method, and article manufacturing method   

The present invention relates to an exposure apparatus, an exposure method, and an article manufacturing method.

In a photolithography process, which is one of manufacturing processes of a liquid crystal display device and the like, a scanning type exposure apparatus is used in which an original plate and a substrate are moved synchronously and a pattern of the original plate is transferred to an exposure area on the substrate via a projection optical system. (scanner). Furthermore, in recent years, in order to allow the scanner to cope with an increase in the area of the exposure area as the substrate becomes larger, a development has been developed to divide the exposure area into a plurality of unit exposure areas (photographed areas) and to correspond to each of the photographed areas. Method of sequential exposure of patterned images. In this method, a bonding exposure is performed in which a part of a subject area adjacent to a direction orthogonal to the scanning direction is bonded and exposed.

The portions (joining portions) that are joined to each other overlap each other, so that the exposure amount is greater than that of the portions other than the joining portions, and the line width of the pattern becomes uneven at the joining portions and other portions. As an exposure device that makes the exposure amount of the joint portion and other portions uniform, Patent Document 1 discloses an exposure device that adjusts the exposure amount of the joint portion by a light shielding plate provided between the light source and the original plate.

    [Prior Art Literature]    

Patent Document 1: Japanese Patent No. 3711586

In a scanner, for example, a subject area is exposed by a slit-shaped irradiation area (illumination light) capable of adjusting a slit width. By adjusting the slit width, it is possible to make the distribution of the cumulative exposure amount at each position in the photographed area uniform when the photographed area is scanned and exposed by the illumination light. However, in the above-mentioned Patent Document 1, when the slit area in the scanning direction is adjusted to change the irradiation area, the distribution of the cumulative exposure amount at each position in the non-scanning direction is the same as that in the case where the slit width is not adjusted. The distribution of cumulative exposures will vary. Therefore, it may be difficult to make the distribution of the cumulative exposure amount in the subject area uniform.

An object of the present invention is to provide, for example, an exposure device that is advantageous at a point where the exposure amount is uniformized.

In order to solve the above-mentioned problem, an exposure apparatus according to one aspect of the present invention is an exposure apparatus that scans and exposes a substrate for each shooting area while moving the substrate and the original plate. The exposure device includes: A shaping section that shapes the exposure light; a lighting section that adjusts the light amount distribution of the exposure light; and a control section that controls the shaping section and the lighting section; wherein the control section controls the lighting section so that the The cumulative exposure amount distribution of each of the first region and the second region is equal, and the shaping section is controlled so that the cumulative exposure amount in the scanning direction in the photographed region is uniform.

According to the present invention, for example, it is possible to provide an exposure device that is advantageous at a point where the exposure amount is uniformized.

100‧‧‧ exposure device

110‧‧‧lighting optical system

120‧‧‧ projection optical system

130‧‧‧Photomask mounting table

140‧‧‧ substrate mounting table

150‧‧‧illumination sensor

160‧‧‧Light-shielding blade mechanism (light-shielding section)

161, 162‧‧‧ shade blades

170‧‧‧Control Department

111‧‧‧light source

112‧‧‧ Elliptical Mirror

113‧‧‧The first condenser

114‧‧‧Fly-eye lens (lighting section)

115‧‧‧Second condenser

116‧‧‧ flat mirror

117‧‧‧Variable slit mechanism (shaping department)

118‧‧‧ Imaging Optical System

171‧‧‧illuminance distribution adjustment device

172‧‧‧Light source lighting section

173‧‧‧Fly-eye lens driver

1141 ~ 1144‧‧‧ cylindrical lens

155‧‧‧Shading blade driving device

R‧‧‧Photomask (mask, original)

W‧‧‧ substrate

FIG. 1 is a schematic diagram showing a configuration of an exposure apparatus according to a first embodiment.

[Fig. 2] Fig. 2 is a diagram illustrating a feature of an illuminance distribution correction section and a shape of a projection region.

FIG. 3 is a diagram illustrating a mechanism for adjusting the opening shape of the variable slit mechanism.

[Fig. 4] Fig. 4 is a diagram showing a projection area in a case where normal exposure is performed.

[Fig. 5] Fig. 5 is a diagram illustrating a state of light blocking during the first scanning exposure in the case of performing joint exposure.

FIG. 6 is a diagram showing a state of light blocking during a second scanning exposure in the case of performing a joint exposure.

FIG. 7 is a graph showing the relationship between the projection area and the joint width in the projection area, and the distribution of the cumulative illuminance in the projection area.

[Fig. 8] Fig. 8 is a graph showing an exposure amount when the projection area is illuminated with a uniform illuminance distribution, as shown in Figs. 5 and 6, and a joint exposure is performed.

[Fig. 9] Fig. 9 shows a case where the projection area is illuminated with the illuminance distribution of Fig. 7 (B), and the illuminance distribution in the scanning direction is adjusted, as shown in Figs. 5 and 6, and the joint exposure is performed. Graphic of exposure.

FIG. 10 is a graph showing the exposure amount when the projection area is illuminated with the illuminance distribution of FIG. 7 (C), as shown in FIGS. 5 and 6, and the joint exposure is performed.

11 is a graph showing a distribution of an exposure amount when a lenticular lens is driven in the optical axis direction.

12 is a flowchart showing a process of bonding exposure in the first embodiment.

13 is an XY plan view of an illumination optical system included in the exposure apparatus according to the second embodiment.

14 is a graph showing a relationship between a projection area and a joint width in the projection area, and a distribution of a cumulative illuminance in the projection area.

15 is a diagram showing a state of light-shielding when a normal exposure is performed and a joint exposure is performed.

FIG. 16 is a graph showing the distribution of the exposure amount when the projection area is illuminated with a uniform illuminance distribution and joint exposure is performed.

17 is a flowchart showing a process of bonding exposure in the second embodiment.

Hereinafter, specific embodiments will be described with reference to the drawings and the like.

    (First Embodiment)    

FIG. 1 (A) is a schematic diagram showing a configuration of an exposure apparatus according to a first embodiment of the present invention. FIG. 1B is an XY plan view of an illumination optical system included in the exposure apparatus according to the first embodiment of the present invention. The exposure device 100 can be used, for example, in a photolithography process in a manufacturing process of a flat plate such as a liquid crystal display device or an organic EL device. In particular, in this embodiment, the exposure apparatus 100 is a scanning projection exposure apparatus that transfers (exposes) an image of a pattern formed on a photomask (mask) R onto a substrate W by a step-and-scan method. The exposure apparatus 100 includes an illumination optical system 110, a projection optical system 120, a mask mounting table 130, a substrate mounting table 140, an illuminance sensor 150, a light blocking blade mechanism (light blocking section) 160, and a control section 170. In each of the figures below and in FIG. 1, the scanning direction of the mask R and the substrate W when exposed in a plane perpendicular to the Z axis that is the vertical direction is set to the Y axis, and the non-scanning orthogonal to the Y axis is set. The direction is set to the X axis. The substrate W is a substrate to be processed made of, for example, a glass material and the surface of which is coated with a photosensitizer (photoresist). Further, the photomask R is, for example, an original plate made of a glass material and formed with a pattern (fine uneven pattern) to be transferred to the substrate W.

The illumination optical system 110 includes an illumination section that adjusts the light amount distribution of the exposure light, and a shaping section that shapes the exposure light. The illumination optical system 110 includes, for example, a light source 111, an elliptical mirror 112, a first condenser lens 113, a fly-eye lens (illumination section) 114, a second condenser mirror 115, a flat mirror 116, a variable slit mechanism (shaping section) 117, and an imaging optical system 118 . In addition, the illuminance of the illumination optical system 110 to illuminate the mask R (substrate W) is adjusted by a command from the illuminance distribution adjustment device 171 connected to the control unit 170 to the light source lighting unit 172 and the fly-eye lens driving unit 173.

As the light source 111, for example, an Hg lamp can be used, but a part of the output wavelength of an Hg lamp such as an i-line, an h-line, or a g-line may be used. The light emitting portion of the light source 111 is disposed at a first focus of the elliptical mirror 112. The light beam emitted from the light source 111 is condensed by the elliptical mirror 112 to the second focal plane F of the elliptical mirror 112.

In FIG. 1, the light-emitting portion of the light source 111 is a sphere, and the light rays from the center point of the sphere are represented by a solid line, and the light rays emitted from the vertices (left and right) in the Y-axis direction of the surface of the sphere are represented by dashed lines. After the light emitted from the center point of the light emitting portion of the light source 111 is reflected at the center of the reflecting surface of the elliptical mirror 112, it is condensed to one point on the second focal plane F of the elliptical mirror 112. On the other hand, after the light emitted from the left vertex of the light emitting portion of the light source 111 is reflected at the left end of the reflection surface of the elliptical mirror 112, it is condensed to one point behind the second focal plane F of the elliptical mirror 112. In addition, the light emitted from the right vertex of the light emitting portion of the light source 111 is reflected at the left end of the reflecting surface of the elliptical mirror 112 and then is condensed to one point in front of the second focal plane F of the elliptical mirror 112. Therefore, on the second focal plane F of the elliptical mirror 112, the light emitted from the left vertex of the light emitting section of the light source 111 and the light emitted from the right vertex are expanded and condensed.

The first condenser lens 113 magnifies and images an image of a light beam that is expanded and condensed on the second focal plane F by the elliptical mirror 112 on the incident surface of the fly-eye lens 114. The fly-eye lens 114 is, for example, an optical element including a lenticular lens 1141 to 1144 and an illuminance distribution correction unit 1145. As shown in FIG. 1 (A) and the XY plan view of the illumination optical system 110, as shown in FIG. 1 (B), the lenticular lenses 1141, 1143 have curvature in the YZ plane, and the lenticular lenses 1142, 1144 have curvature in the XY plane. . The light beam exiting the fly-eye lens 114 will have different NAs in the YZ plane and the XY plane.

The variable slit mechanism 117 is arranged in a light path shape of a light beam emitted from the fly-eye lens 114 and incident on the mask R and the substrate W. After the light beam emitted from the fly-eye lens 114 is reflected by the plane mirror 116 via the second condenser 115, the variable slit mechanism 117 is illuminated. At this time, the second condenser 115 performs Kohler illumination on the variable slit mechanism 117, and the exit surface of the light beam of the fly-eye lens 114 and the surface on which the variable slit mechanism 117 is arranged are optically in a relationship of a pupil plane and an image plane. In Kohler illumination, the size of the illumination range of the image plane is determined by the NA emitted from the pupil plane. The lenticular lens 1141 and the lenticular lens 1143 determine the irradiation area in the Y direction on the variable slit mechanism 117, and the lenticular lens 1142 and the lenticular lens 1144 determine the irradiation area in the X direction on the variable slit mechanism 117.

FIG. 2A is a diagram illustrating the characteristics of the illuminance distribution correction unit 1145. The figure is viewed from the -Y direction, and for illustration, the lenticular lens 1142 and the illuminance distribution correction section 1145 are shown side by side in the vertical direction. The light beam enters the lenticular lens 1142 through the lenticular lens 1141 through the illuminance distribution correction unit 1145. The lenticular lens 1142 includes lenticular lenses 1142a to 1142c, and the illuminance distribution correction section 1145 has a transmittance distribution corresponding to the lenticular lenses 1142a to 1142c and divided into three in the X direction.

For example, each divided region of the illuminance distribution correction unit 1145 has a tendency that the transmittance gradually increases from the X-direction center of the region to the periphery. In the present embodiment, the surface on which the variable slit mechanism 117 is arranged is illuminated in a long rectangular shape in the X direction. The illuminance distribution correction unit 1145 corrects the light intensity distribution in the X direction to a predetermined distribution in combination with the lenticular lens 1142 that adjusts the position in the optical axis direction (Y direction).

The illuminance distribution adjustment device 171 issues an instruction to the lens driving unit 1730 according to an instruction from the control unit 170, drives the lenticular lens 1142 in the optical axis direction (Y direction), and issues an instruction to the light source lighting unit 172 to adjust the output of the light source 111 . When the distance between the lenticular lens 1142 and the lenticular lens 1144 is changed, the illuminance distribution (exposure amount distribution) in the X direction of the irradiation area on the variable slit mechanism 117 changes.

As shown in FIG. 1 (B), the variable slit mechanism 117 has a long arc-shaped opening in the X direction, and the light beam passing through the variable slit mechanism 117 is on the mask R surface through the imaging optical system 118. Imaging to form an arc-shaped illuminated area.

The projection optical system 120 includes a flat mirror 121, a concave mirror 122, a convex mirror 123, and a flat mirror 124, and forms an image of a pattern formed on the R surface of the mask on the substrate W to form a circular arc-shaped projection as shown in FIG. 2 (B). Area (photographed area) PA.

The illuminance sensor 150 is, for example, a light amount sensor having a pinhole opening at the same height as the surface of the substrate W. The substrate mounting table 140 is driven to measure the inside of the arc-shaped projection area PA (in the subject area). Illumination distribution at a plurality of points in the Y direction and the X direction.

The light-shielding blade mechanism 160 can advance and retreat in the scanning direction. When performing joint exposure, the shape of the arc-shaped projection area PA can be adjusted by shielding the exposure light. Here, the joint exposure means that a part of the subject area adjacent to each other in a direction (X direction) orthogonal to the scanning direction (Y direction) is joined and exposed. The joined part is called a joining area.

The control unit 170 synchronously scans and exposes the mask mounting table 130 holding the mask R and the substrate mounting table 140 holding the substrate W in the Y direction, and transfers the pattern on the mask R to the photosensitive material coated thereon. On the substrate W.

FIG. 3 is a diagram illustrating a mechanism for adjusting the shape of the opening of the variable slit mechanism 117. The variable slit mechanism 117 forms an arc-shaped opening by fixing the light shielding portion 1170 and driving the light shielding portions 117a to 117q. The variable slit driving device 154 drives the driving light-shielding sections 117 a to 117 q according to a command from the control section 170 to adjust the slit widths Wa to Wq in the Y direction of the arc-shaped opening. With this, the exposure light is shaped.

4 to 6 are diagrams illustrating the relationship between the structure of the light-shielding blade mechanism 160 and the light-shielded arc-shaped projection area PA. The light-shielding blade mechanism 160 has two light-shielding blades 161 and 162, and the light-shielding blade driving device 155 drives the two light-shielding blades 161 and 162 in the Y direction and the X direction, respectively, according to a command from the control unit 170.

FIG. 4 shows a case where normal exposure is performed. The control unit 170 retracts the two light-shielding blades 161 and 162 to a position outside the arc-shaped projection area PA. One end of the projection area PA in the −X direction and the other end of the + direction include the bonding areas d ₁ and d _{2, respectively} .

FIG. 5 is a view showing a state of light blocking during the first scanning exposure in the case of performing the joint exposure. The control unit 170 moves the light shielding blade 161 into the projection area PA, and divides the projection area PA into a bonding area d ₁ and a non-bonding area d ₁₀ other than the bonding area.

FIG. 6 is a diagram illustrating a state of light blocking during the second scanning exposure in the case of performing the joint exposure. The control unit 170 moves the light-shielding blade 162 into the projection area PA, and divides the projection area PA into a joint area d ₂ and a non-joint area d ₂₀ .

The above is the configuration of the exposure apparatus according to this embodiment. Next, using FIG. 7 to FIG. 10, exposure unevenness that may occur when performing joint exposure in the exposure apparatus 100 including the variable slit mechanism 117 will be described.

FIGS. 7A to 7C are graphs showing the relationship between the projection area PA and the joint width in the projection area PA, and the cumulative illuminance in the projection area PA. In order to simplify the description, the shape of the projection area PA is rectangular. The graphs on the left of (A) to (C) in FIG. 7 show the cumulative illuminance (cumulative exposure) with the horizontal axis at the X position and the vertical axis at the Y direction when the projection area PA is viewed from the -Y direction. ) (Exposure distribution in the non-scanning direction). On the other hand, in the graphs on the right of (A) to (C) of FIG. 7, when the projection area PA is viewed from the + X direction, the horizontal axis is set to the Y position and the vertical axis is set to the cumulative illuminance in the X direction. Pattern (exposure distribution in the scanning direction).

The graph shown in (A) of FIG. 7 is a case where the projection area PA is illuminated with a uniform illuminance distribution. The cumulative illuminance in the projection area PA remains constant regardless of whether it is viewed from the −Y direction or the + X direction. The graph shown in (B) of FIG. 7 is to project the projection area PA with a cumulative illuminance in the Y direction that rises to the right in the + X direction and maintain a constant illuminance distribution regardless of the Y direction. Graphics in the case of lighting. When viewed from the -Y direction, the cumulative illuminance in the Y direction tends to become stronger as it moves toward the + X direction (the figure on the left). When viewed from the + X direction, the cumulative illuminance in the X direction does not matter what the Y position is Both remain constant. The graph shown in (C) of FIG. 7 performs the projection area PA with the cumulative illuminance in the X direction that rises to the right in the + Y direction and maintains a constant illuminance distribution regardless of the X direction. Graphic of the lighting situation. When viewed from the -Y direction, the cumulative illuminance in the Y direction remains constant regardless of the X direction. When viewed from the + X direction, the cumulative illuminance in the X direction tends to become stronger as it progresses in the + Y direction.

(A) to (C) of FIG. 8 show a case where the projection area PA is illuminated with the illuminance distribution of (A) of FIG. 7, and is shielded from light as shown in FIG. 5 and FIG. 6 to perform joint exposure. A graph of the cumulative exposure amount (cumulative illuminance) in the Y direction when the axis is set to the X position. (A) of FIG. 8 shows the exposure amount when scanning exposure is performed with light-shielding as shown in FIG. 5, and FIG. 8 (B) shows the exposure amount when scanning exposure is performed with light-shielding as shown in FIG. 6. (C) represents the exposure amount by adding the first and second exposure amounts together.

When the exposure is performed with the illuminance distribution in FIG. 7 (A), the control unit 170 causes the variable slit driving device 154 to drive the driving light-shielding portions 117a to 117q, and the slit width Wa in the Y direction of the arc-shaped opening ~ Wq is all adjusted to equal width. In addition, if the sizes of the joint regions d ₁ and d ₂ in the X direction are made equal, the first cumulative illuminance ((A) in FIG. 8) and the second cumulative illuminance ((B in FIG. 8) )) When added up, as shown in FIG. 8 (C), the cumulative illuminance becomes uniform with respect to the X position.

(A) to (C) of FIG. 9 show that when the projection area PA is illuminated with the illuminance distribution of (B) of FIG. 7, the illuminance distribution in the non-scanning direction is adjusted, as shown in FIGS. 5 and 6. A pattern of the illuminance distribution in the non-scanning direction when the light is shielded and the joint exposure is performed. (A) of FIG. 9 shows the exposure amount in the case of shading and scanning exposure as shown in FIG. 5, and FIG. 9 (B) shows the exposure amount in the case of shading and scanning exposure as shown in FIG. 6, and FIG. 9 (C) represents the exposure amount by adding the first and second exposure amounts together.

When the projection area PA is illuminated with the illuminance distribution in FIG. 7 (B), the illuminance distribution in the non-scanning direction is made uniform before the joint exposure is performed. That is, the variable slit driving device 154 drives the driving light-shielding sections 117a to 117q under the instruction of the control section 170, and adjusts the slit widths Wa to Wq in the Y direction of the arc-shaped opening. Since the illuminance distribution in (B) of FIG. 7 has a cumulative illuminance in the Y direction which rises to the right in the + X direction, the slit width at one end in the -X direction is made larger and the slit width at the other end in the + X direction is made smaller . At this time, the bonding region d _{1 is} wider than the case of FIG. 8 (A), and the bonding region d _{2 is} narrower than the case of FIG. 8 (B). As a result, when the first cumulative illuminance and the second cumulative illuminance are added, as shown in (C) of FIG. 9, the illuminance distribution in the non-scanning direction becomes uneven.

The uneven projection area is divided into three areas. That is, a portion that is double-exposed in the non-joined region d ₂₀ and the bonded region d ₁ , a portion that is double-exposed in the bonded region d ₁ and the bonded region d ₂ , and a portion that is exposed only in the bonded region d ₁ .

In addition, (A) to (C) of FIG. 10 show a case where the projection area PA is illuminated with the illuminance distribution of (C) of FIG. 7, as shown in FIGS. 5 and 6, and the joint exposure is performed. Graph of illuminance distribution in the non-scanning direction. (A) of FIG. 10 shows the exposure amount in the case of shading and scanning exposure as shown in FIG. 5, and FIG. 10 (B) shows the exposure amount in the case of shading and scanning exposure as shown in FIG. 6, and FIG. 10 (C) represents the exposure amount by adding the first and second exposure amounts together.

When the projection area PA is illuminated with the illuminance distribution in FIG. 7 (C), since the illuminance distribution in the non-scanning direction is uniform, the slit widths Wa to Wq before the joint exposure are all equal. At this time, the sizes in the X direction of the bonding regions d ₁ and d ₂ are equal. However, when the illuminance distribution in (C) of FIG. 7 is viewed from the + X direction, since the cumulative illuminance in the X direction rises to the right in the + Y direction, the exposure amount based on the first scan exposure will be as shown in FIG. 10 ( As shown in A), in the area exposed by the bonding area d _1, an arc-shaped increase tendency appears in the + X direction. Further, based on the exposure amount of the second scanning exposure as shown in (B) 10 is shown, by joining in the region of the exposed region d ₂ in the + X direction will show a decreasing tendency of the arc-shaped. As a result, when the first cumulative illuminance and the second cumulative illuminance are added, as shown in FIG. 10 (C), the illuminance distribution in the non-scanning direction becomes uneven.

As described above, when the illuminance distribution in the projection area PA is uneven, even if the variable slit mechanism 117 is used to adjust the illuminance distribution in the non-scanning direction to be uniform. The illuminance distribution in the scanning direction also becomes uneven. According to this embodiment, it is possible to uniformize the cumulative exposure amount in the scanning direction (Y direction) by the variable slit mechanism 117 and to uniformize the illuminance in the X direction by the joint exposure. The following is the specific method.

(A) and (B) of FIG. 11 show the distribution of the exposure amount in the projection area PA when the lenticular lens 1142 is driven in the optical axis direction (Y direction). For example, when the position of the lenticular lens 1142 is shifted in the -Y direction along the optical axis from the position showing a uniform illuminance distribution shown in (A) of FIG. 7, a concave as shown in (A) of FIG. 11 is presented. Shaped illumination distribution. When moving in the + Y direction, a convex illuminance distribution as shown in FIG. 11 (B) is presented.

In this way, the illuminance distribution adjusting device 171 can instruct the lens driving unit 173 to drive the lenticular lens 1142 in the fly-eye lens 114 in the optical axis direction (Y direction), so that the exposure amount distribution in the non-scanning direction in the projection area PA follows Quadratic curve change.

When the projection area PA is illuminated with the illuminance distribution of FIG. 7 (B), the curvature component of the illuminance distribution is adjusted to make the illuminance distribution uniform. In this case, the illuminance distribution adjustment device 171 individually corrects the integrated illuminance of the bonding areas d ₁ and d ₂ in the projection area PA.

First, when the cumulative illuminance of the joining area d ₁ is corrected, the control unit 170 retracts the two light-shielding blades 161 and 162 to the outside of the projection area PA as shown in FIG. 4, and sets the slit width Wb in the joining area d ₁ as shown in FIG. 4. And Wc is consistent with a predetermined width. The illuminance distribution adjusting device 171 moves the lenticular lens 1142 in the + Y direction to flatten the integrated illuminance of the bonding area d ₁ , and adjusts the output of the light source 111 to correct the integrated illuminance of the bonding area d ₁ to a predetermined value.

Next, when the cumulative illuminance of the joining area d ₂ is corrected, the control unit 170 retracts the two light-shielding blades 161 and 162 to the outside of the projection area PA as shown in FIG. 4, and sets the slit width in the joining area d ₂ as shown in FIG. 4. Wo and Wp are consistent with a predetermined width. The illuminance distribution adjustment device 171 moves the lenticular lens 1142 in the -Y direction to flatten the cumulative illuminance of the bonding area d ₂ , and adjusts the output of the light source 111 to correct the cumulative illuminance of the bonding area d ₂ to a predetermined value.

By performing the adjustment as described above, the illuminance distribution in the joint area where the first cumulative illuminance and the second cumulative illuminance are added becomes uniform in the X direction.

When the projection area PA is illuminated with the illuminance distribution of FIG. 7 (C), the illuminance distribution uniformized by the adjustment of the curvature component of the illuminance distribution will be described. Similar to the correction of the illuminance distribution in (B) of FIG. 7, the integrated illuminances of the joint areas d ₁ and d ₂ are individually corrected.

First, when the cumulative illuminance of the joining area d ₁ is corrected, the control unit 170 sets the slit widths Wb and Wc in the joining area d ₁ in a state where the light shielding blade 161 is driven to the projection area PA as shown in FIG. 5. Consistent for a predetermined width. At this time, as shown in FIG. 10 (A), the cumulative illuminance of the bonding area d ₁ in the projection area PA has a tendency to increase in an arc shape.

The illuminance distribution adjusting device 171 moves the lenticular lens 1142 in the -Y direction (or + Y direction), makes the slope of the cumulative illuminance of the bonding area d ₁ linear, and adjusts the output of the light source 111 to integrate the total of the bonding area d ₁ The illuminance is corrected to a predetermined value.

Next, when the integrated illuminance of the joining area d ₂ is corrected, the control unit 170 sets the slit widths Wo, Wp in the joining area d ₂ in a state where the light shielding blade 162 is driven to the projection area PA as shown in FIG. 6. Consistent for a predetermined width. At this time, as shown in FIG. 10 (B), the cumulative illuminance of the bonding area d ₂ in the projection area PA shows an arc-shaped decreasing tendency.

The illuminance distribution adjusting device 171 moves the lenticular lens 1142 in the -Y direction (or + Y direction), makes the slope of the cumulative illuminance of the bonding area d ₂ linear, and adjusts the output of the light source 111 to integrate the integration of the bonding area d ₂ The illuminance is corrected to a predetermined value.

By the adjustment as described above, the illuminance distribution in the joint area where the first cumulative illuminance and the second cumulative illuminance are added becomes uniform in the X direction.

In addition, in the above, when the illumination is performed with the illuminance distribution of FIG. 7 (B), the exposure amount is adjusted so that the exposure amount in the bonded area becomes uniform and changes in the bonded area and the non-bonded area at a total time. Get even. However, it is also possible to adjust the slope of the exposure amount in the bonding area so that the total time becomes uniform. In addition, when the illumination is performed with the illuminance distribution in the X direction in FIG. 7 (C), the exposure amount of the bonding area may be made uniform to make the total time uniform.

FIG. 12 is a flowchart showing a process of bonding exposure in the present embodiment. The instruction from the control unit 170 is executed. The joint exposure is divided into the first scanning exposure of processes S11 to S17 and the second scanning exposure of processes S21 to S27.

In the process S11, the control unit 170 issues an instruction to the light-shielding blade driving device 155, and drives the light-shielding blade 161 into the projection area PA as shown in FIG. Engineering S12, the control unit 170 instructs the drive apparatus 171 to variable slit, driving the light shielding portions 117b, 117c to drive the engagement region in _a slit width d Wb, Wc is consistent with a predetermined width. Engineering S13, the control unit 170 drives the substrate mounting table 140, an illuminance sensor 150 is determined by the engagement direction in the scanning region d ₁ (Y direction) cumulative illuminance.

Engineering S14, the control unit 170 to the illuminance distribution adjusting means 171 instructs the scanning direction engaging cumulative illuminance in the area d ₁ is adjusted to a predetermined value. Engineering S15, the control unit 170 drives the substrate mounting table 140, an illuminance sensor 150 measured by the accumulated non-bonded region d illuminance in the scanning direction _10. Engineering S16, the control unit 170 instructs the drive apparatus 171 to variable slit, adjusting the slit within the non-bonded region ₁₀ of the width d Wd ~ Wq, accumulated in the scanning direction of the illumination area ₁₀ d engaging the non-adjusted to a predetermined Value. In process S17, the control unit 170 drives the substrate mounting table 140 to place the substrate W at a predetermined position, and then performs the first scanning exposure.

In the process S21, the control unit 170 issues an instruction to the light-shielding blade driving device 155, and drives the light-shielding blade 162 into the projection area PA as shown in FIG. In the process S22, the control unit 170 issues a command to the variable slit driving device 171, and drives the driving light-shielding units 117o and 117p so that the slit widths Wo and Wp in the joint region d ₂ are uniform to a predetermined width. In process S23, the control unit 170 drives the substrate mounting table 140 and measures the integrated illuminance in the scanning direction in the bonding area d ₂ by the illuminance sensor 150.

In process S24, the control unit 170 issues an instruction to the illuminance distribution adjustment device 171 to adjust the accumulated illuminance in the scanning direction in the bonding area d ₂ to a predetermined value. Engineering S25, the control unit 170 drives the substrate mounting table 140, an illuminance sensor 150 measured by the accumulated non-bonded region d illuminance in the scanning direction _20. Engineering S26, the control unit 170 instructs the drive apparatus 171 to variable slit, adjusting the slit within the non-bonded region ₂₀ of the width d Wa ~ Wn, the total non-joint region d illuminance in the scanning direction ₂₀ is adjusted to a predetermined Value. In process S27, the control unit 170 drives the substrate mounting table 140 to arrange the substrate W to a predetermined position, and then performs a second scanning exposure.

As described above, the exposure apparatus of this embodiment can uniformize the illuminance in the scanning direction (Y direction) by the variable slit mechanism 117 and uniformize the illuminance in the X direction by bonding exposure. According to this embodiment, it is possible to provide an exposure apparatus that is advantageous in terms of the uniformity of the exposure amount.

    (Second Embodiment)    

FIG. 13 is an XY plan view of the illumination optical system 210 included in the exposure apparatus according to the second embodiment of the present invention. The same components as those in the first embodiment are assigned the same reference numerals, and descriptions thereof are omitted. The illumination optical system 210 includes two light sources 211 and 212, two elliptical mirrors 213 and 214, a composite mirror 215, two front-side condensers 216 and 217, and a rear-side condenser 218.

The light emitting portion of the light source 211 is disposed at the first focus of the elliptical mirror 213. After the light beam emitted from the light source 211 is reflected by the elliptical mirror 213, it is deflected by the combining mirror 215 and condensed onto the second focal plane F1 of the elliptical mirror 213. Similarly, the light emitting portion of the light source 212 is disposed at the first focus of the elliptical mirror 214. After the light beam emitted from the light source 212 is reflected by the elliptical mirror 214, it is deflected by the combining mirror 215 and condensed onto the second focal plane F2 of the elliptical mirror 214.

The front condenser 216 or the front condenser 217 and the rear condenser 218 each perform the same function as the first condenser 113 of the first embodiment. The front condenser 216 and the rear condenser 218 magnify and form an image of the expanded light beam focused by the elliptical mirror 213 onto the second focal plane F1 on the incident surface of the fly-eye lens 114. Similarly, the front condenser 217 and the rear condenser 218 magnify and form an image of the expanded light beam focused by the elliptical mirror 214 to the second focal plane F2 on the incident surface of the fly-eye lens 114.

On the incident surface of the fly-eye lens 114, the position of the image formed by the light beam emitted from the light source 211 and the position of the image formed by the light beam emitted from the light source 212 overlap to form an image. An exit pupil of the front condenser 216 and an exit pupil of the front condenser 217 are arranged off-center on the entrance pupil P of the rear condenser 218. At this time, the entrance pupil P plane of the rear condenser 218 is optically related to the pupil plane and the image plane with respect to the entrance plane of the fly-eye lens 114, and the exit plane of the fly-eye lens 114 is optically conjugated. Therefore, the rear condenser 218 uses the light beams 211 and 212 formed off-center with respect to the plane P of the incident pupil to perform Kohler illumination on the incident surface of the fly-eye lens 114.

14A to 14E are graphs showing the relationship between the projection area PA and the joint width in the projection area PA, and the cumulative illuminance in the projection area PA. The graphs on the left of (A) to (E) in FIG. 14 are illuminance distributions in the non-scanning direction. On the other hand, the graphs to the right of (A) to (E) in FIG. 14 are illuminance distributions in the scanning direction.

FIGS. 14A and 14B show the cumulative illuminance in the scanning direction in the projection area PA when only a single light source is turned on among the two light sources shown in FIG. 13. In an illumination optical system that uses a light beam from a plurality of off-center light sources to illuminate the incident surface of the fly-eye lens 114 and uses the fly-eye lens 114 to illuminate the irradiated surface, when only a single light source is used for illumination, The illuminance distribution of a surface becomes a sloped distribution.

FIG. 14A shows a case where only the light source 211 is made to emit light, and the cumulative illuminance in the scanning direction in the projection area PA tends to decrease to the right. FIG. 14B shows a case where only the light source 212 is made to emit light, and the cumulative illuminance in the scanning direction in the projection area PA tends to rise to the right.

(C) and (D) of FIG. 14 are the cases where two light sources are turned on at the same time. The accumulated illuminance obtained by the light source 211 is indicated by a dot chain line, and the accumulated illuminance obtained by the light source 212 is indicated by a dotted line. (C) of FIG. 14 is a case where the outputs of the light source 211 and the light source 212 are equal, and the cumulative illuminance obtained by the two light sources is a flat distribution as shown by the solid line. (D) of FIG. 14 is a case where the output of the light source 211 is set to be greater than the output of the light source 212, and the cumulative illuminance obtained by the two light sources is a distribution falling to the right as shown by the solid line.

In this way, the illumination optical system of this embodiment can change the illuminance distribution of the irradiation surface according to a linear curve by the output balance of the two light sources.

Therefore, in a case where the illuminance distribution in the non-scanning direction in the projection area PA is rising to the right as shown in FIG. 7 (B), by adjusting the output balance of the two light sources, the joint area d ₁ can be adjusted. , the distribution of the entire region ₂ d of the cumulative illuminance planarized.

On the other hand, FIG. 14 (E) shows a state where the illuminance distribution in the non-scanning direction in the projection area PA has a mountain shape (curvature component), and the apex of the distribution is shifted to the right (linear component). In this case, the illuminance distribution adjustment device 171 divides the distribution of the cumulative illuminance in the scanning direction in the projection area PA into a curvature component and a linear component, and adjusts them independently.

The illuminance distribution adjustment device 171 issues a command to the lens driving unit 173 to move the lenticular lens 1142 to change the exposure amount distribution in a quadratic curve shape, thereby correcting it. Furthermore, a command is issued to the light source lighting unit 172, and the distribution of the integrated illuminance is linearly changed by the output balance of the light sources 211 and 212 to correct it.

As described above, the illumination optical system 210 of the present embodiment can simultaneously correct the distribution of the cumulative illuminance and the linear component of the cumulative illuminance distribution so that the distributions of the cumulative illuminance of the joint regions d ₁ and d ₂ can be flattened simultaneously.

Next, a description will be given of a case where three exposure areas are joined using an exposure apparatus including the illumination optical system 210 of the present embodiment, with reference to FIGS. 15 to 17.

FIGS. 15A and 15B are diagrams showing the state of light-shielding in the projection area PA in the case of normal exposure and in the case of joint exposure. During the normal exposure shown in FIG. 15A, the control unit 170 retracts the two light-shielding blades 161 and 162 to a position outside the arc-shaped projection area PA.

The joint area of the projection area PA is provided at one end in the −X direction and the other end in the + direction. The three subject areas are joined by three scanning exposures. In the first scanning exposure, a bonding area d ₁ is set at one end in the -X direction for exposure, and in the second scanning exposure, a bonding area d ₂₁ is set at the other end in the + X direction, and The other end is provided with a bonding area d ₂₂ for exposure. In the third scanning exposure, a bonding area d ₃ is provided at the other end in the + X direction to perform exposure. The bonding region d ₁ overlaps the bonding region d ₂₁ , and the bonding region d ₃ overlaps the bonding region d ₂₂ . When the illumination optical system 210 of this embodiment is used, the cumulative exposure amounts of the bonding areas d ₂₁ and d ₂₁ at both ends of the projection area PA can be simultaneously adjusted to a predetermined distribution.

FIG. 15 (B) is a diagram showing how light is blocked during the second scanning exposure. The control unit 170 moves the light shielding blades 162 and 161 into the projection area PA, and divides the projection area PA into a bonding area d ₂₁ , a bonding area d ₂₂ , and a non-bonding area d ₂₀ . In the first scanning exposure, the light is shielded in the same manner as in FIG. 5, and in the third scanning exposure, the light is shielded in the same manner as in FIG. 6.

(A) to (D) of FIG. 16 show that the projection area PA is illuminated with a uniform illuminance distribution as shown in (A) of FIG. 7, and is shielded from light as shown in (B) of FIG. 5, FIG. 6, and FIG. 15. In a case where the joint exposure is performed on the ground, a graph of the cumulative exposure amount (cumulative illuminance) in the Y direction when the horizontal axis is set to the X position. FIG. 16 (A) shows the exposure amount in the case of light-shielding as shown in FIG. 5, FIG. 16 (B) shows the exposure amount in the case of light-shielding as shown in FIG. 15 (B), and FIG. 16 (C) shows The exposure amount in the case of light-shielding is shown in FIG. 6, and (D) in FIG. 16 represents the exposure amounts added up respectively. As shown in (D) of FIG. 16, it is possible to obtain a uniform cumulative illuminance at the X position by bonding exposure.

Fig. 17 is a flowchart showing a process of performing a joint exposure by using the exposure apparatus of the projection optical system 210 of this embodiment. Each process is executed by a command from the control unit 170. The joint exposure is divided into the first scanning exposure of the process S31, the second scanning exposure of the processes S32 to S37, and the third scanning exposure of the process S38. The process S31 for the first scanning exposure is the same as the processes S11 to S17 of the first embodiment, and the process S38 for the third scanning exposure is the same as the processes S21 to S27 of the first embodiment.

First, in process S31, the first scanning exposure is performed. Next, in the process S32, the control unit 170 issues a command to the light-shielding blade driving device 155, and drives the light-shielding blades 161 and 162 into the projection area PA as shown in FIG. 15 (B). In the process S33, the control unit 170 issues a command to the variable slit driving device 171, and drives the driving light-shielding units 117o and 117p so that the slit widths Wo and Wp in the joint area d ₂₁ coincide with each other to a predetermined width. At the same time, the control unit 170 issues a command to the variable slit driving device 171 to drive the driving light-shielding units 117b and 117c so that the slit widths Wb and Wc in the joint area d ₂₂ are uniform to a predetermined width.

In process S34, the control unit 170 drives the substrate mounting table 140 and measures the integrated illuminance in the scanning direction in the bonding areas d ₂₁ and d ₂₂ by the illuminance sensor 7. In process S35, the control unit 170 issues an instruction to the illuminance distribution adjustment device 171 to adjust the cumulative illuminance in the scanning direction in the bonding areas d ₂₁ and d ₂₂ to a predetermined value.

At this time, in order to adjust the cumulative illuminance in the scanning direction in the two joint regions d ₂₁ and d ₂₂ at different positions, the illuminance distribution adjusting device 171 divides the cumulative illuminance distribution in the scanning direction in the projection area PA into a curvature component and a linearity. The ingredients are adjusted independently.

Engineering S36, the control unit 170 drives the substrate mounting table 140, the non-engaging region 7 was measured by the illuminance sensor d cumulative illuminance in the scanning direction _20. Engineering S37, the control unit 170 instructs the drive apparatus 171 to variable slit, adjusting the slit within the non-bonded region ₂₀ of the width d Wd ~ Wn, the total non-joint region d illuminance in the scanning direction ₂₀ is adjusted to a predetermined Value for the second scan exposure. In the process S38, the third scanning exposure is performed.

In addition, the adjustments performed in S31 and S38 may be the same as those in the first embodiment, but may be adjusted separately and separately into a curvature component and a linear component as in the process S35. As described above, according to this embodiment, the same effect as that of the first embodiment can be obtained even when two or more regions are joined.

In addition, in the above-mentioned embodiment, the light-shielding blade mechanism 160 is formed directly above the substrate W, but it may also be formed directly above or below the variable slit mechanism 117 which is an optically conjugated position. Exposure light on the light path. Furthermore, it may be arrange | positioned near the position optically conjugated with the mask R and the board | substrate W. In addition to the above embodiment, the interval between the lenticular lens 1141 and the lenticular lens 1143 constituting the fly-eye lens 114 may be changed to correct the illuminance distribution in the Y direction of the irradiation area on the variable slit mechanism 117.

The second embodiment shows an illumination system composed of two light sources, but three or more light sources may be configured. In this case, at least two light sources are in a direction orthogonal to the scanning direction of the illumination area PA. The off-center state is subjected to Kohler illumination on the incident surface of the fly-eye lens 114. Furthermore, the illuminance distribution adjusting device 171 may be used to adjust the cumulative illuminance in the scanning direction in the bonded area and the non-bonded area to a predetermined value while the width of the variable slit mechanism 117 in the scanning direction is maintained constant.

    (Embodiment Related to Article Manufacturing Method)    

The method for manufacturing an article according to this embodiment is suitable for manufacturing, for example, articles such as micro-devices such as semiconductor devices and components having fine structures. The method for manufacturing an article according to this embodiment includes a process of forming a latent image pattern (the process of exposing a substrate) to a photosensitive agent applied to a substrate using the exposure apparatus described above, and a substrate on which a latent image pattern is formed in the process. Development works. Furthermore, the above-mentioned manufacturing method includes other known processes (oxidation, film formation, vapor deposition, doping, planarization, etching, photoresist peeling, dicing, adhesion, packaging, etc.). Compared with the conventional method, the manufacturing method of the article of this embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of an article.

    (Other embodiments)    

As mentioned above, although preferred embodiment of this invention was described, this invention is not limited to these embodiment, Various deformation | transformation and change are possible within the range of the summary.

Claims (7)

An exposure device is an exposure device that scans and exposes a substrate by scanning exposure light in a subject area of the substrate. The exposure device performs joint exposure. The joint exposure is a first subject area and a non-scanning direction. The second shot area adjacent to the first shot area covers a part of the bonding area that covers a part of the exposure area, and includes: a shaping portion that shapes the exposure light; a lighting portion that adjusts a light amount distribution of the exposure light; and controls the shaping. And the control unit of the lighting unit; the first light-shielding unit is used to expose the first subject area, and the first light-shielding unit is used to expose the light in the first subject area among the areas of the exposure light; Part of the exposure light in the first area of the bonding area is shielded from light; the second light-shielding section is used to expose the second subject area, and the second light-shielding section is used to expose the area of the exposure light to the first A part of the exposure light in the second area of the bonding area in the subject area is shielded from light; wherein the control unit controls the lighting unit by: So that the cumulative exposure amount accumulated in the scanning direction of the exposure light is adjusted in the joint area in the subject area and the area outside the joint area, and the shaping section is controlled so that the In the bonding area and the area other than the bonding area, adjusting a cumulative exposure amount in which the exposure light is accumulated in the scanning direction; thereby adjusting the bonding area when the first shooting area and the second shooting area are exposed. And the cumulative exposure amount distribution in a region other than the aforementioned bonding region. The exposure device according to claim 1, wherein the illumination unit includes: a first light source that emits a light beam that exposes the photographed area with a first exposure amount distribution in the non-scanning direction; and the non-scanning direction A second light source that emits a light beam that exposes the subject area with a second exposure amount distribution; wherein the control unit individually controls the output of the first light source and the second light source so that the part in the subject area The exposure amount distribution in the non-scanning direction changes in a curve. The exposure device according to claim 2, wherein the illumination unit includes an optical element that changes an exposure amount distribution in the non-scanning direction in the subject area in a quadratic curve shape. The exposure apparatus according to claim 1, wherein the shaping unit is disposed at a position optically conjugated to the original plate and the substrate, and changes a width of the exposure light in the scanning direction. The exposure apparatus according to claim 1, wherein the first light-shielding portion and the second light-shielding portion are arranged near positions optically conjugated to the original plate and the substrate. An article manufacturing method comprising: a process of forming a pattern on a substrate using the exposure apparatus according to any one of claims 1 to 5; and a process of processing the substrate on which the pattern is formed by the aforementioned process; The processed substrate gets an article. The exposure device according to claim 1, wherein the control unit controls the illumination unit and the shaping unit so that a cumulative exposure amount distribution in the joint area when the first and second subject areas are exposed, And the cumulative exposure amount distribution in areas other than the aforementioned bonding area becomes uniform.