TWI661483B - Etching system - Google Patents

Etching system Download PDF

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TWI661483B
TWI661483B TW104139435A TW104139435A TWI661483B TW I661483 B TWI661483 B TW I661483B TW 104139435 A TW104139435 A TW 104139435A TW 104139435 A TW104139435 A TW 104139435A TW I661483 B TWI661483 B TW I661483B
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etching
etching solution
membrane
filter device
circulation line
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TW104139435A
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TW201631651A (en
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三好雄三
山崎銀兵
石垣暢規
島田和哉
家田智之
西川晴香
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日商Nsc股份有限公司
日商松下電器產業股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/08Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/10Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/14Removing waste, e.g. labels, from cleaning liquid; Regenerating cleaning liquids
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Surface Treatment Of Glass (AREA)
  • Liquid Crystal (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)

Abstract

提供一種蝕刻系統,可有效在循環線路使用加壓式過濾裝置,在壓低成本下進行蝕刻液的清淨化。 Provided is an etching system, which can effectively use a pressurized filter device in a circulation line, and clean the etching solution at a low cost.

蝕刻系統,係具備:蝕刻裝置、循環線路、膜式過濾裝置、及加壓式過濾裝置。蝕刻裝置,係被構成為至少具備蝕刻液槽,使收容於蝕刻液槽的蝕刻液接觸於玻璃基板從而進行蝕刻處理。循環線路,係被構成為將蝕刻液槽的蝕刻液取出至外部,同時進行過濾而送返至蝕刻液槽。膜式過濾裝置,係配置於循環線路,具備針對被導入的蝕刻液進行過濾的浸漬膜。加壓式過濾裝置,係被構成為配置於循環線路上的膜式過濾裝置的下游,接收以浸漬膜而捕捉的漿料而進行固液分離。 The etching system includes an etching device, a circulation circuit, a membrane filter device, and a pressure filter device. The etching apparatus is configured to include at least an etching solution tank, and an etching solution stored in the etching solution tank is brought into contact with a glass substrate to perform an etching process. The circulation circuit is configured to take out the etchant in the etchant bath to the outside, filter it, and return it to the etchant bath at the same time. The membrane filter device is arranged on a circulation line and includes an immersion membrane for filtering an introduced etching solution. The pressure filtration device is configured downstream of the membrane filtration device arranged on the circulation line, and receives the slurry captured by immersing the membrane to perform solid-liquid separation.

Description

蝕刻系統 Etching system

本發明,係關於對平板顯示器用玻璃基板執行蝕刻處理的蝕刻系統,尤其關於將加壓過濾裝置有效配置於循環線路而可低成本地進行蝕刻液的循環的蝕刻系統。 The present invention relates to an etching system for performing an etching process on a glass substrate for a flat panel display, and more particularly to an etching system in which a pressurizing filter device is efficiently arranged in a circulation line and the etching solution can be circulated at low cost.

利用於液晶顯示器等的平板顯示器的玻璃基板,係存在薄型化的要求。在將平板顯示器用玻璃基板進行薄型化的處理方面,迄今為止一般而言泛用使含氫氟酸的蝕刻液接觸於玻璃基板的蝕刻處理。在如此之蝕刻處理方面,係存在以下方法:將待處理玻璃基板浸漬於裝有蝕刻液的槽,或將蝕刻液吹至待處理玻璃基板。 Glass substrates used in flat-panel displays such as liquid crystal displays require a reduction in thickness. In terms of a process for reducing the thickness of a glass substrate for a flat panel display, an etching process in which a hydrofluoric acid-containing etching solution is brought into contact with a glass substrate has been generally used. In terms of such an etching process, there are the following methods: immersing the glass substrate to be processed in a tank filled with an etching solution, or blowing the etching solution onto the glass substrate to be processed.

進行對於上述的玻璃基板的蝕刻處理的情況下,產生的排液的處理變得重要。歷來,係多半將壓濾器等的加壓式過濾裝置配置於排液線路上,適當進行排液的固液分離、脫水等從而進行產業廢棄物處理(例如,專利文獻1參照)。其理由,係在於:加壓式過濾裝置一般而言具有大的過濾面積,故處理能力高而可處理大量的排 水。此外,據說:加壓式過濾裝置,係過濾壓力高,故可獲得低含水率的濾餅,且亦具有可比浸漬膜方式壓低生產成本、運轉費用等優點。 When the above-mentioned etching process is performed on the glass substrate, the process of generating liquid discharge becomes important. In the past, pressurized filtering devices such as a pressure filter are mostly arranged on a liquid discharge line, and solid waste and liquid separation and dehydration of the liquid are appropriately performed to perform industrial waste treatment (for example, refer to Patent Document 1). The reason is that the pressurized filter device generally has a large filtration area, so it has a high processing capacity and can handle a large amount of drainage. water. In addition, it is said that the pressurized filter device has a high filtration pressure, so a filter cake with a low water content can be obtained, and it also has the advantages of reducing production costs and operating costs compared with the immersion membrane method.

先前技術文獻 Prior art literature 專利文獻 Patent literature

專利文獻1:日本發明專利5143440號 Patent Document 1: Japanese Invention Patent No. 5143440

然而,加壓式過濾裝置,係雖適於在排液線路作使用,惟在循環線路作使用係存在不妥。其理由,係在於:要以加壓式過濾裝置有效地進行固液分離,係一般而言採用將凝聚劑添加於被導入的用完的蝕刻液的手段。若添加凝聚劑,則一方面變得可有效進行固液分離,另一方面存在如下不妥:在過濾後的蝕刻液中溶解有可能對蝕刻造成不良影響的成分的可能性變高,變得難以再利用過濾後的蝕刻液。在另一方面,不使用凝聚劑而在循環線路使用加壓式過濾裝置的情況下,存在過濾效率變差而變得難以在循環線路進行充分的過濾的情形。 However, although the pressure filter device is suitable for use in the drainage line, it is not suitable for use in the circulation line. The reason for this is to effectively perform solid-liquid separation with a pressure filter device, and generally, a method of adding a coagulant to the used etching solution that has been introduced. When a flocculant is added, solid-liquid separation becomes effective on the one hand, and on the other hand, there is a problem that the possibility of dissolving a component that may adversely affect the etching in the filtered etching solution becomes high, and It is difficult to reuse the filtered etchant. On the other hand, when a pressure filtering device is used in a circulation line without using an aggregating agent, the filtration efficiency may be deteriorated and it may become difficult to perform sufficient filtration in the circulation line.

本發明的目的,係在於提供一種蝕刻系統,可有效在循環線路使用加壓式過濾裝置,在壓低成本下進行蝕刻液的清淨化。 An object of the present invention is to provide an etching system which can effectively use a pressurized filter device in a circulation circuit and perform cleaning and purification of an etching solution at a low cost.

本發明相關之蝕刻系統,係被構成為對平板顯示器用玻璃基板執行蝕刻處理。此蝕刻系統,係至少具備蝕刻裝置、循環線路、膜式過濾裝置、及加壓式過濾裝置。 An etching system according to the present invention is configured to perform an etching process on a glass substrate for a flat panel display. This etching system includes at least an etching device, a circulation circuit, a membrane filter device, and a pressure filter device.

蝕刻裝置,係被構成為至少具備蝕刻液槽,使收容於蝕刻液槽的蝕刻液接觸於玻璃基板從而進行蝕刻處理。循環線路,係被構成為將蝕刻液槽的蝕刻液取出至外部,同時進行過濾而送返至蝕刻液槽。膜式過濾裝置,係配置於循環線路,具備針對被導入的蝕刻液進行過濾的浸漬膜。加壓式過濾裝置,係被構成為配置於循環線路上的膜式過濾裝置的下游,接收以浸漬膜而捕捉的漿料而進行固液分離。 The etching apparatus is configured to include at least an etching solution tank, and an etching solution stored in the etching solution tank is brought into contact with a glass substrate to perform an etching process. The circulation circuit is configured to take out the etchant in the etchant bath to the outside, filter it, and return it to the etchant bath at the same time. The membrane filter device is arranged on a circulation line and includes an immersion membrane for filtering an introduced etching solution. The pressure filtration device is configured downstream of the membrane filtration device arranged on the circulation line, and receives the slurry captured by immersing the membrane to perform solid-liquid separation.

此構成中,係並非蝕刻液被直接導入配置於循環線路的加壓式過濾裝置,而是以配置於其前階的膜式過濾裝置而捕捉的漿料被導入加壓式過濾裝置。亦即,在污泥等的不需要的物料的濃度變高的狀態下被導入加壓式過濾裝置,故變得可在不使用凝聚劑下有效進行固液分離。在加壓式過濾裝置,係變得可施加高的過濾壓力,故由於獲得低含水率的濾餅,使得廢棄物的處理亦變得容易進行。 In this configuration, instead of the etching solution being directly introduced into the pressure-type filtering device arranged in the circulation line, the slurry captured by the membrane-type filtering device arranged in the preceding stage is introduced into the pressure-type filtering device. That is, since the pressure filter device is introduced in a state where the concentration of unnecessary materials such as sludge is high, solid-liquid separation can be effectively performed without using a coagulant. In the pressurized filter device, it becomes possible to apply a high filtration pressure. Therefore, since a filter cake having a low water content is obtained, the disposal of waste becomes easy.

上述的構成中,被構成為以膜式過濾裝置及加壓式過濾裝置進行過濾後的蝕刻液被分別送返至蝕刻液槽為優選。依此構成時,從膜式過濾裝置及加壓式過濾裝 置的雙方回收可再利用的蝕刻液,故蝕刻液的利用效率提高。 In the above-mentioned configuration, it is preferable that the etching solution filtered by the membrane filter device and the pressure filter device is returned to the etching solution tank, respectively. In this configuration, the membrane filter device and the pressure filter device Since both sides of the installation recover a reusable etchant, the use efficiency of the etchant is improved.

此外,亦可作成被以加壓式過濾裝置而過濾的蝕刻液被送返至循環線路上的膜式過濾裝置的前階。採用此構成的情況下,係變成以加壓式過濾裝置所回收的蝕刻液進一步經由膜式過濾裝置,故變得可使從循環線路送返至蝕刻液槽的蝕刻液的清淨性進一步提升。 In addition, it is also possible to prepare a pre-stage of a membrane filter device in which an etching solution filtered by a pressure filter device is returned to a circulation line. With this configuration, since the etching solution recovered by the pressurized filter device passes through the membrane filter device, the cleaning performance of the etching solution returned from the circulation line to the etching solution tank can be further improved.

在膜式過濾裝置方面係採用MF膜濾裝置為優選,在加壓式過濾裝置方面係採用壓濾器為優選。依此構成時,變得能夠以MF膜濾裝置及壓濾器的加成效果壓制循環線路上的過濾成本,同時提高過濾效率。 It is preferable to use an MF membrane filter in terms of a membrane filter device, and it is preferable to use a pressure filter in terms of a pressure filter device. According to this structure, it becomes possible to suppress the filtration cost on a circulation line with the addition effect of an MF membrane filtration device and a filter press, and to improve filtration efficiency at the same time.

依本發明時,變得可有效在循環線路使用加壓式過濾裝置,在壓低成本下進行蝕刻液的清淨化。 According to the present invention, it becomes possible to effectively use a pressurized filter device in a circulation circuit, and to perform cleaning and cleaning of an etching solution at a low cost.

10‧‧‧蝕刻系統 10‧‧‧ Etching System

14‧‧‧蝕刻裝置 14‧‧‧ Etching device

16‧‧‧過濾處理部 16‧‧‧ Filtration Department

18‧‧‧MF過濾裝置 18‧‧‧MF filter device

20‧‧‧壓濾器 20‧‧‧Press Filter

22‧‧‧污泥收容槽 22‧‧‧Sludge holding tank

100‧‧‧玻璃基板 100‧‧‧ glass substrate

142‧‧‧蝕刻處理部 142‧‧‧Etching Department

144‧‧‧蝕刻液供應部 144‧‧‧Etchant supply department

182‧‧‧MF過濾槽 182‧‧‧MF filter tank

184‧‧‧微濾器 184‧‧‧microfilter

186‧‧‧散氣管裝置 186‧‧‧ diffuser device

188‧‧‧泥漿收容槽 188‧‧‧ Mud Containment Tank

〔圖1〕針對本發明的一實施形態相關之蝕刻系統的概略進行繪示的圖。 [FIG. 1] A diagram showing an outline of an etching system according to an embodiment of the present invention.

〔圖2〕針對蝕刻系統中的過濾處理的一例進行繪示的圖。 [FIG. 2] A diagram illustrating an example of a filtering process in an etching system.

〔圖3〕在蝕刻系統所使用的MF過濾裝置的示意圖。 [Fig. 3] A schematic diagram of an MF filter device used in an etching system.

〔圖4〕針對本發明的其他實施形態相關之蝕刻系統的概略進行繪示的圖。 [FIG. 4] A diagram showing an outline of an etching system according to another embodiment of the present invention.

利用圖1(A)及圖1(B)而說明本發明的蝕刻系統的一實施形態相關之蝕刻系統10。蝕刻系統10,係被構成為對液晶顯示器、有機EL顯示器等的平板顯示器用玻璃基板執行蝕刻處理。蝕刻系統10,係至少具備:蝕刻裝置14、循環線路15、及過濾處理部16。蝕刻裝置14,係具備:具有蝕刻液槽145的蝕刻液供應部144;以及被構成為使蝕刻液接觸於玻璃基板從而進行蝕刻處理的蝕刻處理部142。蝕刻液槽145,係被構成為收容在蝕刻裝置14所使用的蝕刻液。在本實施形態下,係雖採用含5~25重量%的氫氟酸的蝕刻液,惟蝕刻液的組成係不限定於此。 An etching system 10 according to an embodiment of the etching system of the present invention will be described with reference to FIGS. 1 (A) and 1 (B). The etching system 10 is configured to perform an etching process on a glass substrate for a flat panel display such as a liquid crystal display or an organic EL display. The etching system 10 includes at least an etching device 14, a circulation line 15, and a filter processing unit 16. The etching device 14 includes an etching solution supply unit 144 including an etching solution tank 145 and an etching processing unit 142 configured to perform an etching process by contacting an etching solution with a glass substrate. The etching solution tank 145 is configured to receive an etching solution used in the etching device 14. In this embodiment, although an etching solution containing 5 to 25% by weight of hydrofluoric acid is used, the composition of the etching solution is not limited to this.

蝕刻液供應部144,係被構成為將蝕刻液槽145內的蝕刻液對蝕刻處理部142供應。在蝕刻裝置14方面,在本實施形態下,係採用被構成為如下的單片式的蝕刻裝置14:對1或複數個蝕刻處理部142每次1個連續搬送玻璃基板100,同時在蝕刻處理部142將蝕刻液對玻璃基板100噴射。在此蝕刻裝置14中,係蝕刻液被從蝕刻液槽145藉泵浦等的周知的液送手段而供應至蝕刻處理部142。在蝕刻處理部142係蝕刻液被噴射至玻璃基板100的上表面、下表面、或上下兩面。 The etching solution supply unit 144 is configured to supply the etching solution in the etching solution tank 145 to the etching processing unit 142. With regard to the etching device 14, in this embodiment, a single-chip etching device 14 configured as follows is used: The glass substrate 100 is continuously conveyed one at a time to one or a plurality of etching processing units 142, and the etching processing is performed simultaneously. The part 142 sprays an etching liquid on the glass substrate 100. In this etching apparatus 14, an etching solution is supplied from the etching solution tank 145 to the etching processing unit 142 by a well-known liquid feeding means such as a pump. In the etching processing part 142, an etching solution is sprayed onto the upper surface, the lower surface, or both the upper and lower surfaces of the glass substrate 100.

噴射至玻璃基板100而與玻璃基板接觸的蝕刻液,係流下至蝕刻處理部142的底部而回收至蝕刻液槽145。此被回收的蝕刻液中係含從玻璃基板100溶解的矽系化合物、鋁系的化合物等。為此,蝕刻系統10,係具備被構成為如下的循環線路15:將蝕刻液槽145的蝕刻液取出至外部,同時進行過濾而送返至蝕刻液槽145。並且,在蝕刻系統10,係隨時從蝕刻液槽145經由循環線路15朝過濾處理部16送出蝕刻液,將被過濾的蝕刻液送返蝕刻液槽145從而維持蝕刻液的品質。 The etching solution sprayed onto the glass substrate 100 and brought into contact with the glass substrate is flowed down to the bottom of the etching treatment section 142 and recovered in the etching solution tank 145. The recovered etching solution contains a silicon-based compound, an aluminum-based compound, and the like dissolved from the glass substrate 100. For this purpose, the etching system 10 includes a circulation line 15 configured to take out the etching solution from the etching solution tank 145 to the outside, and simultaneously filter and return the etching solution to the etching solution tank 145. In the etching system 10, the etching solution is sent from the etching solution tank 145 to the filter processing unit 16 via the circulation line 15 at any time, and the filtered etching solution is returned to the etching solution tank 145 to maintain the quality of the etching solution.

接著利用圖2(A)而說明過濾處理部16中的處理的一例。過濾處理部16,係具備:配置於循環線路15,具備針對被導入的蝕刻液進行過濾的浸漬膜的MF過濾裝置18;及被構成為配置於循環線路15上的MF過濾裝置18的下游,接收以浸漬膜所捕捉的漿料而進行固液分離的壓濾器20。MF過濾裝置18,係對應於本發明的膜式過濾裝置,壓濾器20係對應於本發明的加壓式過濾裝置。其中,在膜式過濾裝置方面,可應用採用RO膜、NF膜、UF膜等的MF膜以外的浸漬膜的裝置,在加壓式過濾裝置方面,亦可應用密閉式葉濾器、密閉式多階過濾器等的壓濾器以外的裝置。 Next, an example of processing in the filtering processing unit 16 will be described using FIG. 2 (A). The filtration processing unit 16 includes: an MF filter device 18 disposed on the circulation line 15 and provided with an immersion membrane for filtering the introduced etching solution; and a downstream of the MF filter device 18 disposed on the circulation line 15, The filter press 20 receiving solid-liquid separation by immersing the slurry captured by the membrane is received. The MF filter device 18 corresponds to the membrane filter device of the present invention, and the pressure filter 20 corresponds to the pressure filter device of the present invention. Among them, in the membrane filter device, a device using an immersion membrane other than an MF membrane such as a RO membrane, a NF membrane, and a UF membrane can be applied. In the pressure filter device, a closed leaf filter, a closed type Devices other than filter presses such as stage filters.

過濾處理部16,係被構成為針對在蝕刻裝置14使用中的蝕刻液進行清淨化。過濾處理部16,係連接於污泥收容槽22。污泥收容槽22,係被構成為針對在壓濾器20被施加壓力而脫水的濾餅進行收容。收容於污泥 收容槽22的濾餅係被作為產業廢棄物而適當處理。 The filtration processing unit 16 is configured to purify an etching solution used in the etching device 14. The filtration processing unit 16 is connected to the sludge storage tank 22. The sludge storage tank 22 is configured to store a cake that has been dehydrated by applying pressure to the filter press 20. Contained in sludge The filter cake of the storage tank 22 is appropriately treated as industrial waste.

於此,利用圖3,而說明關於MF過濾裝置18。MF過濾裝置18係被構成為:被藉蝕刻供應部144而供應使用中的蝕刻液,並貯存於MF過濾裝置過濾槽182。被供應的蝕刻液係被藉微濾器184而吸濾,濾液係被返往蝕刻供應部144。另一方面,漿料在微濾器184的表面被捕捉。被捕捉的漿料,係為了過濾器的阻塞防止而被藉從配置於底部的散氣管裝置186引發的起泡所致的壓力而從過濾器表面剝落而往泥漿收容槽188沉澱。泥漿收容槽188係被構成為底面朝中央傾斜,有效回收漿料。泥漿收容槽188係在底面所回收的漿料被經由周知的泥漿泵(Warman Pump等)、配管等而送往壓濾器20。 Here, the MF filter device 18 will be described using FIG. 3. The MF filter device 18 is configured such that an etching solution in use is supplied by the etching supply unit 144 and stored in the MF filter device filter tank 182. The supplied etching solution is suction-filtered by the microfilter 184, and the filtrate is returned to the etching supply unit 144. On the other hand, the slurry is captured on the surface of the microfilter 184. The trapped slurry is peeled from the surface of the filter by the pressure caused by the bubbling caused by the air diffuser device 186 disposed at the bottom to prevent clogging of the filter, and precipitates into the slurry storage tank 188. The mud storage tank 188 is configured such that the bottom surface is inclined toward the center, and the mud is efficiently recovered. The slurry collected on the bottom surface of the slurry storage tank 188 is sent to the pressure filter 20 through a well-known slurry pump (Warman Pump, etc.), piping, and the like.

MF過濾裝置18係予以滲透複數個微濾器184作吸引從而過濾,易於依排液的處理量使微濾器184的數量增減從而調整處理效率。 The MF filter device 18 is configured to permeate a plurality of microfilters 184 for suction, thereby filtering, and it is easy to increase or decrease the number of the microfilters 184 according to the amount of liquid discharged to adjust the processing efficiency.

藉泥漿收容槽188而搬運的漿料,係被藉壓濾器20而過濾。一般而言,壓濾器20,係對於待過濾液體添加凝聚劑從而有效進行固液分離。為此,歷來並非如本實施形態配置在供於針對使用中的蝕刻液進行清淨化用的循環線路15,而是配置在供於將用畢的蝕刻液排出用的排液線路。其理由,係在於:在循環線路15使用凝聚劑時在過濾後的蝕刻液中溶解有對蝕刻處理造成不良影響(玻璃基板100的突起、白濁化等)的成分的可能性高。在本實施形態下,係由於將藉MF過濾裝置18而捕捉的 漿料導入至壓濾器20因而可在不使用凝聚劑下有效進行固液分離,故可在循環線路15使壓濾器20有效運轉。 The slurry conveyed by the slurry storage tank 188 is filtered by the pressure filter 20. Generally speaking, the filter 20 is added with a coagulant to the liquid to be filtered to effectively perform solid-liquid separation. For this reason, it is not conventionally arranged in the circulation line 15 for cleaning and cleaning the etching solution in use as in this embodiment, but in the drainage line for discharging the used etching solution. The reason for this is that when a flocculant is used in the circulation line 15, there is a high possibility that a component that adversely affects the etching process (such as protrusions of the glass substrate 100, whitening, and the like) is dissolved in the filtered etchant after filtration. In this embodiment, it is captured by the MF filter device 18 Since the slurry is introduced into the filter press 20, solid-liquid separation can be effectively performed without using a flocculant. Therefore, the filter press 20 can be effectively operated in the circulation line 15.

在本實施形態下,被以MF過濾裝置18及壓濾器20濾過的蝕刻液,係如示於圖2(A),雖分別送返蝕刻液供應部144的蝕刻液槽145,惟並未限定於此構成。例如,亦可構成為:如示於圖2(B),被以壓濾器20而過濾的蝕刻液送返循環線路15上的MF過濾裝置18的前階。採用此構成的情況下,將以壓濾器20而回收的蝕刻液進一步以MF過濾裝置18而濾過後送返至蝕刻液供應部144的蝕刻液槽145,故可使蝕刻液的清淨性進一步提升。 In this embodiment, the etching solution filtered by the MF filter device 18 and the pressure filter 20 is as shown in FIG. 2 (A). Although the etching solution tank 145 is returned to the etching solution supply unit 144, it is not limited. Make up here. For example, as shown in FIG. 2 (B), the etching liquid filtered by the filter 20 is returned to the front stage of the MF filter device 18 on the circulation line 15. With this configuration, the etching solution recovered by the filter 20 is further filtered by the MF filter device 18 and returned to the etching solution tank 145 of the etching solution supply unit 144, so that the cleaning performance of the etching solution can be further improved. .

壓濾器20係被導入的化學溶液中漿料、污泥含越多越可效率佳地進行過濾。本來雖採用對過濾前槽添加凝聚劑的手段,惟藉微濾器184而捕捉的污泥係泥漿狀且即使不添加凝聚劑仍回收對壓濾器20而言最佳的污泥。因此,如上所述,在不使用凝聚劑的循環線路15中仍可進行效率佳的過濾。此外,壓濾器20,係過濾壓力高,故可獲得低含水率的濾餅。為此除了可再利用蝕刻液更多以外,可將污泥等的產業廢棄物費用壓低。 The more the slurry and sludge contained in the chemical solution introduced into the filter press 20, the more efficiently the filtration can be performed. Although the method of adding a coagulant to the pre-filtration tank was originally used, the sludge-based sludge that was captured by the microfilter 184 was collected and the best sludge for the filter press 20 was recovered without adding the coagulant. Therefore, as described above, it is possible to perform highly efficient filtration in the circulation line 15 without using the coagulant. In addition, since the filter pressure 20 has a high filtration pressure, a filter cake having a low water content can be obtained. For this reason, in addition to more reusable etching solutions, the cost of industrial waste such as sludge can be reduced.

再者,僅使用膜式過濾裝置而進行蝕刻液的清淨化及污泥的處理的情況下,需要多階地配置高價的膜式過濾裝置等的構成,惟如本實施形態將膜式過濾裝置及加壓式過濾裝置有效組合而配置,使得比僅以膜式過濾裝置而構成的情況可大幅削減成本。 In addition, in the case where the cleaning of the etching solution and the treatment of the sludge are performed using only the membrane filter device, it is necessary to configure a multi-stage membrane filter device or the like in multiple stages. However, in this embodiment, the membrane filter device is used. It is effectively combined with the pressure filter device and is arranged, so that the cost can be significantly reduced compared to a case where the filter filter device is configured only.

在上述之實施形態下,係雖以單片搬送式且將蝕刻液對玻璃基板噴灑的方式說明蝕刻裝置14之例,惟蝕刻裝置14之例不限定於此。例如,如示於圖4(A)及圖4(B),在一次處理複數個玻璃基板100的批量式且予以浸漬於蝕刻液而進行蝕刻的浸漬式的蝕刻裝置方面亦可應用本發明。 In the above-mentioned embodiment, although the example of the etching device 14 is described in the form of a single-piece conveying type and the etchant is sprayed on the glass substrate, the example of the etching device 14 is not limited to this. For example, as shown in FIG. 4 (A) and FIG. 4 (B), the present invention can also be applied to a batch-type immersion type etching apparatus that processes a plurality of glass substrates 100 and immerses them in an etching solution to perform etching.

上述的實施形態的說明,係在各方面均為例示,應認定為非限制性者。本發明的範圍,係並非上述之實施形態下,而是藉申請專利範圍而表示。再者,於本發明的範圍,係旨在包含與申請專利範圍均等的意思及範圍內的所有變更。 The description of the above-mentioned embodiment is an example in all aspects and should be considered as a non-limiting person. The scope of the present invention is not shown in the foregoing embodiment, but is expressed by the scope of patent application. The scope of the present invention is intended to include all changes within the meaning and scope equivalent to the scope of patent application.

Claims (1)

一種蝕刻系統,其係對平板顯示器用玻璃基板執行蝕刻處理者,具備:單片式且噴灑式的蝕刻裝置,其被構成為至少具備蝕刻液槽,將收容於蝕刻液槽的蝕刻液對一次一個而連續搬送的玻璃基板噴射從而進行蝕刻處理;不使用凝聚劑的循環線路,其被構成為將前述蝕刻液槽的蝕刻液取出至外部,同時將為了捕捉從玻璃基板溶解的化合物而與玻璃基板接觸的蝕刻液進行過濾而送返至前述蝕刻液槽;膜式過濾裝置,其配置於前述循環線路,為具備針對被導入的蝕刻液進行過濾的浸漬膜者,用於在前述循環線路的下游有效率地進行固液分離;以及加壓式過濾裝置,其被構成為配置於前述循環線路上的前述膜式過濾裝置的下游,接收以前述浸漬膜而捕捉的漿料而進行固液分離;其中,以前述膜式過濾裝置及前述加壓式過濾裝置進行過濾後的蝕刻液分別送返至前述蝕刻液槽,且前述膜式過濾裝置為MF膜濾裝置,前述加壓式過濾裝置為壓濾器。An etching system for performing an etching process on a glass substrate for a flat panel display. The etching system includes a single-piece and spray-type etching device configured to include at least an etching solution tank, and the etching solution stored in the etching solution tank is aligned once. One continuous conveyed glass substrate is sprayed to perform an etching process; a circulation line that does not use an aggregating agent is configured to take out the etching solution of the etching solution tank to the outside, and at the same time, to capture compounds dissolved from the glass substrate and the glass The etching solution in contact with the substrate is filtered and returned to the etching solution tank. The membrane filter device is disposed on the circulation line and is provided with an immersion membrane that filters the introduced etching solution. A solid-liquid separation is efficiently performed downstream; and a pressure filtration device configured to be disposed downstream of the membrane filtration device disposed on the circulation line, and receives the slurry captured by the impregnated membrane to perform solid-liquid separation. ; Wherein, the etching solution filtered by the membrane filter device and the pressure filter device is sent back separately The etching tank and the membrane filtration device as MF membrane filtration apparatus, the filtration device is a pressure filter press.
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