TWI659118B - Solar absorption device - Google Patents
Solar absorption device Download PDFInfo
- Publication number
- TWI659118B TWI659118B TW107119497A TW107119497A TWI659118B TW I659118 B TWI659118 B TW I659118B TW 107119497 A TW107119497 A TW 107119497A TW 107119497 A TW107119497 A TW 107119497A TW I659118 B TWI659118 B TW I659118B
- Authority
- TW
- Taiwan
- Prior art keywords
- solar
- solar energy
- energy absorbing
- top surface
- film
- Prior art date
Links
- 238000010521 absorption reaction Methods 0.000 title claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 239000000203 mixture Substances 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 230000005457 Black-body radiation Effects 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- FHKBQTYCGXHYRV-UHFFFAOYSA-N N.[O-2].[Ti+4] Chemical compound N.[O-2].[Ti+4] FHKBQTYCGXHYRV-UHFFFAOYSA-N 0.000 description 1
- 229910000681 Silicon-tin Inorganic materials 0.000 description 1
- 206010042618 Surgical procedure repeated Diseases 0.000 description 1
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- LQJIDIOGYJAQMF-UHFFFAOYSA-N lambda2-silanylidenetin Chemical compound [Si].[Sn] LQJIDIOGYJAQMF-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02167—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/02168—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells the coatings being antireflective or having enhancing optical properties for the solar cells
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0676—Oxynitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0688—Cermets, e.g. mixtures of metal and one or more of carbides, nitrides, oxides or borides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/083—Oxides of refractory metals or yttrium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3492—Variation of parameters during sputtering
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24S—SOLAR HEAT COLLECTORS; SOLAR HEAT SYSTEMS
- F24S70/00—Details of absorbing elements
- F24S70/10—Details of absorbing elements characterised by the absorbing material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/024—Arrangements for cooling, heating, ventilating or temperature compensation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/308—Oxynitrides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/40—Solar thermal energy, e.g. solar towers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
本發明係一種太陽能吸收裝置,由一基材與一太陽能吸收膜所組成,該太陽能吸收膜具有一底面與一頂面,該底面係與該基材連接,該頂面則相背與該底面,該太陽能吸收膜之成份為TiN
xO
y,由該底面至該頂面,x由1變至0.1,y由0.2變至2;藉此,該太陽能吸收裝置不僅結構單純、製程快速,而且成本低廉,極具市場競爭潛力。
Description
本發明與太陽能吸收裝置有關,特別是指一種具有太陽能吸收膜的太陽能吸收裝置,結構單純、製程快速且成本低廉。
習知太陽能吸收裝置係於一基材上設置有多層鍍膜,用來提高太陽能吸收率並降低熱放射率,該基材為玻璃、不鏽鋼或銅合金等金屬,該多層鍍膜包括由內而外依序設在基材表面的金屬紅外光反射層、選擇性吸收層與抗反射層,該選擇性吸收層可提高太陽能的吸收率,該抗反射層具有高透明度而可提高太陽光入射量,同時可降低太陽光反射量,藉由此種多層鍍膜結構,可有效提高太陽能的吸收率。
然而,此種多層鍍膜結構製造時需要分成三個步驟,於基材上依序鍍上不同成份的薄層,因此,不僅製造費工、耗時,更連帶提高製造成本,降低產品的市場競爭力。
本發明之另一目的在於提供一種具有太陽能吸收膜的太陽能吸收裝置,結構單純、製程快速且成本低廉,極具市場競爭潛力。
為了達成上述目的,本發明之太陽能吸收裝置係由一基材與一太陽能吸收膜所組成,該太陽能吸收膜具有一底面與一頂面,該底面係與該基材連接,該頂面則相背與該底面,該太陽能吸收膜之成份為TiN
xO
y,由該底面至該頂面,x由1變至0.1,y由0.2變至2。
藉此,該太陽能吸收裝置不僅結構單純、製程快速,而且成本低廉,極具市場競爭潛力。
以下藉由一較佳實施例配合圖式,詳細說明本發明的技術內容及特徵,如第1圖所示,係本發明一較佳實施例所提供之太陽能吸收裝置1,係由一基材10與一太陽能吸收膜20所組成。
該基材10為不鏽鋼材質,於其他實施例,亦可為矽、玻璃、銅合金、其他金屬或其他材質。
該太陽能吸收膜20具有一與該基材10連接的底面22、以及一相背於該底面22之頂面24,該太陽能吸收膜20之成份為TiN
xO
y,由該底面22至該頂面24,x由0.89變至0.23,y由0.37變至1.91,該太陽能吸收膜20的成份變化是階段性的,該太陽能吸收膜20可細分為六小層,總厚度約200nm,由該底面22至該頂面24依序為第一層25、第二層26、第三層27、第四層28、第五層29與第六層30,各小層的x與y數值如表一所示,該些數值是以X光光電子能譜儀(ULVAC-PHI PHI 5000 VersaProbe)分析出各小層的Ti-2p、N-1s、O-1s能峰,計算各元素能峰積分面積I,另於文獻查詢各元素靈敏因子F,代入以下公式求得元素比例:
表一
x值 | y值 | |
第六層 | 0.23 | 1.91 |
第五層 | 0.29 | 1.70 |
第四層 | 0.50 | 1.27 |
第三層 | 0.65 | 0.93 |
第二層 | 0.70 | 0.80 |
第一層 | 0.89 | 0.37 |
其中,各小層25~30的N/O含量不同,由第一層25至第六層30氮氧化鈦的特性由導體轉變成半導體,甚至是絕緣體,光性也同時由不透明轉變半透明,最後到透明,具有導體特性的氮氧化鈦能夠取代習知結構中的金屬紅外光反射層,具有半導體特性的氮氧化鈦可作為習知結構中的選擇性吸收層,透明且具有絕緣特性的氮氧化鈦則可作為習知結構中的抗反射層,因此以氮氧化鈦單一種材料即能夠取代習知太陽能吸收裝置中的多層鍍膜結構。
為了驗證本發明之效果,取該太陽能吸收裝置1進行太陽能吸收率(Solar absorptance) 與熱放射率(Thermal emittance)之量測,其中,太陽能吸收率即該太陽能吸收裝置1能吸收的太陽光能量強度與太陽光原始能量強度之比值,計算式如下:
利用含積分球之紫外光-可見光-近紅外光光譜儀(HITACHI U4100),以空氣作為背景值,量測波長範圍0.25~2.5 μm之反射率R(λ),並以上式計算出太陽能吸收率為85.2%,其中I
s(λ)是採用ISO標準9845-1(1992)定義之空氣質量(Air mass, AM) 1.5的太陽輻射能量來計算。
熱放射率即該太陽能吸收裝置1本身熱的輻射強度與黑體的熱輻射強度之比值,計算式如下:
實際量測作業是利用傅立葉轉換紅外線光譜儀(Thermo Scientific Nicolet iS5),以金作為背景值,量測特定溫度下波長範圍2.5~25 μm之反射率R(λ,T),並以上式計算出熱放射率為7.2%,I
b(λ,T)係依據普朗克黑體輻射定律(Blackbody radiation law)求得。
依據上述量側方法,本實施例之太陽能吸收裝置1的太陽能吸收率為85.2%,熱放射率為7.2%,與習知具有多層鍍膜的太陽能吸收裝置效果接近,但本發明之太陽能吸收裝置1僅具有單一太陽能吸收膜20,其中各小層25~30的成份雖不同,然濺鍍各小層25~30時可藉由調整空氣與氬氣的比例,即可相當容易地調整TiN
xO
y中x與y的數值,因此,省去了習知結構濺鍍金屬紅外光反射層、選擇性吸收層與抗反射層三個程序中重複抽真空等步驟,不僅節省製程時間,更能降低製造成本,提升產品的市場競爭力,從而達成本發明之目的。
除了以上實施例外,進一步的研究結果顯示,該基材10以不鏽鋼以外的其他材質替代效果均佳,實際量測數據如表二所列,甚至,將原本分成若干小層的結構改成漸變式的,亦即,x與y的數值變化由階段性的改成連續性的,亦具有相當高的太陽能吸收率與相當低的熱放射率,並且,進一步的實驗顯示,該太陽能吸收膜之成份(TiN
xO
y)由該底面至該頂面,x由1變至0.1,y由0.2變至2,其吸收太陽熱能的效果均佳,舉凡此等變化均應為本發明申請專利範圍所涵蓋。 表二
太陽能吸收膜/基材 | TiNxOy/矽 | TiNxOy/玻璃 | TiNxOy/銅 |
太陽能吸收率(%) | 84.3-86.3 | 84.1-86.4 | 82.2 |
熱放射率(%) | 11.3-13.2 | 12.2-15.5 | 6.7 |
1‧‧‧太陽能吸收裝置
10‧‧‧基材
20‧‧‧太陽能吸收膜
22‧‧‧底面
24‧‧‧頂面
25‧‧‧第一層
26‧‧‧第二層
27‧‧‧第三層
28‧‧‧第四層
29‧‧‧第五層
30‧‧‧第六層
第1圖為本發明一較佳實施例之剖視圖。
Claims (5)
- 一種太陽能吸收裝置,係由一基材與一太陽能吸收膜所組成;該太陽能吸收膜具有: 一底面,係與該基材連接; 一頂面,相背於該底面; 該太陽能吸收膜之成份為TiN xO y,由該底面至該頂面,x由1變至0.1,y由0.2變至2。
- 如請求項1所述之太陽能吸收裝置,由該太陽能吸收膜之底面至該頂面,x由0.89變至0.23,y由0.37變至1.91。
- 如請求項1或2所述之太陽能吸收裝置,由該太陽能吸收膜之底面至該頂面,x與y的數值變化是階段性的。
- 如請求項1或2所述之太陽能吸收裝置,由該太陽能吸收膜之底面至該頂面,x與y的數值變化是連續性的。
- 如請求項1或2所述之太陽能吸收裝置,其中該基材為金屬、玻璃或矽材質。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW107119497A TWI659118B (zh) | 2018-06-06 | 2018-06-06 | Solar absorption device |
US16/160,565 US10600924B2 (en) | 2018-06-06 | 2018-10-15 | Solar energy absorbing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW107119497A TWI659118B (zh) | 2018-06-06 | 2018-06-06 | Solar absorption device |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI659118B true TWI659118B (zh) | 2019-05-11 |
TW202000949A TW202000949A (zh) | 2020-01-01 |
Family
ID=67348929
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107119497A TWI659118B (zh) | 2018-06-06 | 2018-06-06 | Solar absorption device |
Country Status (2)
Country | Link |
---|---|
US (1) | US10600924B2 (zh) |
TW (1) | TWI659118B (zh) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1360084A (zh) * | 2001-12-31 | 2002-07-24 | 清华大学 | 太阳光谱选择性吸收涂层 |
CN101240944A (zh) * | 2008-02-21 | 2008-08-13 | 常州博士新能源科技有限公司 | 太阳平板集热器的板芯及其集热板选择性吸收膜的镀膜方法 |
CN103302917A (zh) * | 2013-05-27 | 2013-09-18 | 欧阳俊 | 一种双吸收层TiON耐候性光热涂层及其制备方法 |
CN104930735A (zh) * | 2015-03-24 | 2015-09-23 | 江苏奥蓝工程玻璃有限公司 | 一种太阳能吸收膜及其制备方法 |
CN105568238A (zh) * | 2015-12-30 | 2016-05-11 | 中国建材国际工程集团有限公司 | 具有太阳能选择性吸收薄膜膜系的制备方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4920006A (en) * | 1987-03-26 | 1990-04-24 | Ppg Industries, Inc. | Colored metal alloy/oxynitride coatings |
FR2708924B1 (fr) * | 1993-08-12 | 1995-10-20 | Saint Gobain Vitrage Int | Procédé de dépôt d'une couche de nitrure métallique sur un substrat transparent. |
US5670248A (en) * | 1994-07-15 | 1997-09-23 | Lazarov; Miladin P. | Material consisting of chemical compounds, comprising a metal from group IV A of the periodic system, nitrogen and oxygen, and process for its preparation |
CN1158403C (zh) * | 1999-12-23 | 2004-07-21 | 西南交通大学 | 一种人工器官表面改性方法 |
AU2006203466A1 (en) * | 2006-02-21 | 2007-09-06 | Council Of Scientific & Industrial Research | An improved solar selective coating having higher thermal stability useful for harnessing solar energy and a process for the preparation thereof |
ES2411711T3 (es) * | 2006-03-03 | 2013-07-08 | Shenzhen Commonpraise Solar Co., Ltd | Capas con absorción selectiva de la luz y procedimiento de fabricación |
US7759747B2 (en) * | 2006-08-31 | 2010-07-20 | Micron Technology, Inc. | Tantalum aluminum oxynitride high-κ dielectric |
EP2217865A4 (en) * | 2007-10-18 | 2014-03-05 | Alliance Sustainable Energy | SOLAR-LENS HIGH-TEMPERATURE COATINGS |
DE202009015334U1 (de) * | 2009-11-11 | 2010-02-25 | Almeco-Tinox Gmbh | Optisch wirksames Mehrschichtsystem für solare Absorption |
SI2564129T1 (sl) * | 2010-04-28 | 2017-07-31 | Savo-Solar Oy | Postopek za izdelavo toplotnega absorberja |
ES2583766T3 (es) * | 2011-12-15 | 2016-09-22 | Council Of Scientific & Industrial Research | Revestimiento solar selectivo mejorado de alta estabilidad térmica y proceso para su preparación |
US8962078B2 (en) * | 2012-06-22 | 2015-02-24 | Tokyo Electron Limited | Method for depositing dielectric films |
CN102721208A (zh) * | 2012-06-29 | 2012-10-10 | 苏州嘉言能源设备有限公司 | 太阳能集热器集热板 |
JP6185591B2 (ja) * | 2012-09-27 | 2017-08-23 | シーゲイト テクノロジー エルエルシーSeagate Technology LLC | TiN−X中間層を含む磁気スタック |
DE102015215006A1 (de) * | 2014-08-06 | 2016-02-18 | Council Of Scientific & Industrial Research | Verbesserte mehrschichtige solar selektive Beschichtung für Hochtemperatur-Solarthermie |
US10586879B2 (en) * | 2015-04-03 | 2020-03-10 | China Building Materials Academy | Spectrally selective solar absorbing coating and a method for making it |
US9540729B1 (en) * | 2015-08-25 | 2017-01-10 | Asm Ip Holding B.V. | Deposition of titanium nanolaminates for use in integrated circuit fabrication |
US9564310B1 (en) * | 2015-11-18 | 2017-02-07 | International Business Machines Corporation | Metal-insulator-metal capacitor fabrication with unitary sputtering process |
DE102016108734B4 (de) * | 2016-05-11 | 2023-09-07 | Kennametal Inc. | Beschichteter Körper und Verfahren zur Herstellung des Körpers |
US9941142B1 (en) * | 2017-01-12 | 2018-04-10 | International Business Machines Corporation | Tunable TiOxNy hardmask for multilayer patterning |
-
2018
- 2018-06-06 TW TW107119497A patent/TWI659118B/zh active
- 2018-10-15 US US16/160,565 patent/US10600924B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1360084A (zh) * | 2001-12-31 | 2002-07-24 | 清华大学 | 太阳光谱选择性吸收涂层 |
CN101240944A (zh) * | 2008-02-21 | 2008-08-13 | 常州博士新能源科技有限公司 | 太阳平板集热器的板芯及其集热板选择性吸收膜的镀膜方法 |
CN103302917A (zh) * | 2013-05-27 | 2013-09-18 | 欧阳俊 | 一种双吸收层TiON耐候性光热涂层及其制备方法 |
CN104930735A (zh) * | 2015-03-24 | 2015-09-23 | 江苏奥蓝工程玻璃有限公司 | 一种太阳能吸收膜及其制备方法 |
CN105568238A (zh) * | 2015-12-30 | 2016-05-11 | 中国建材国际工程集团有限公司 | 具有太阳能选择性吸收薄膜膜系的制备方法 |
Also Published As
Publication number | Publication date |
---|---|
TW202000949A (zh) | 2020-01-01 |
US10600924B2 (en) | 2020-03-24 |
US20190378938A1 (en) | 2019-12-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Alonso-Álvarez et al. | ITO and AZO films for low emissivity coatings in hybrid photovoltaic-thermal applications | |
Granqvist et al. | Surfaces for radiative cooling: Silicon monoxide films on aluminum | |
Zhao et al. | Optimization of solar absorbing three-layer coatings | |
CN108866483A (zh) | 一种智能热控器件及其制备方法 | |
Wang et al. | Spectrally selective solar absorber stable up to 900° C for 120 h under ambient conditions | |
KR101499288B1 (ko) | 저방사 코팅막 및 이를 포함하는 건축 자재 | |
US11472935B2 (en) | Colored radiative cooler based on Tamm structure | |
CN209027681U (zh) | 一种非制冷红外焦平面阵列探测器 | |
Bilokur et al. | High temperature spectrally selective solar absorbers using plasmonic AuAl2: AlN nanoparticle composites | |
Raaif et al. | The effect of Cu on the properties of CdO/Cu/CdO multilayer films for transparent conductive electrode applications | |
TWI659118B (zh) | Solar absorption device | |
Arslan et al. | Structural and optical properties of copper enriched ZnSe thin films prepared by closed space sublimation technique | |
Tian et al. | High-temperature and abrasion-resistant metal-insulator-metal metamaterials | |
Bou et al. | Numerical and experimental investigation of transparent and conductive TiOx/Ag/TiOx electrode | |
Xu et al. | Optical optimization and thermal stability of SiN/Ag/SiN based transparent heat reflecting coatings | |
JP4638014B2 (ja) | 高耐熱性反射膜、これを用いた積層体、液晶表示素子用反射板及び建材ガラス | |
Alexander et al. | Development and characterization of transparent and conductive InZnO films by magnetron sputtering at room temperature | |
CN114231922B (zh) | 一种vo2基多层薄膜结构和其产品的制备方法 | |
Wang et al. | Enhanced electrical outputs of thin-film solar thermoelectric generator with optimized metal/dielectric multilayered solar selective absorber | |
CN114635105B (zh) | 双织构表面太阳能选择性吸收涂层的制备方法及该涂层 | |
US10254169B2 (en) | Optical detector based on an antireflective structured dielectric surface and a metal absorber | |
Ni et al. | Transparent and high infrared reflection film having sandwich structure of SiO2/Al: ZnO/SiO2 | |
TWI411699B (zh) | 太陽能選擇性吸收膜及其製造方法 | |
CN114107902B (zh) | 一种vo2基多层薄膜结构及其产品和应用 | |
Sella et al. | Adjustable optical properties of coatings based on cermet thin films near the percolation threshold |