TWI652366B - Method for arranging protective film on inner wall of cavity of vacuum sputtering machine - Google Patents

Abstract

The invention relates to a method for arranging a protective film on the inner wall of a cavity of a vacuum sputtering machine, the inner wall of the cavity of the vacuum sputtering machine is cleaned and the surface is dried, and the protective film is adhered on the inner wall surface of the cavity of the vacuum sputtering machine, or After the inner wall of the cavity of the vacuum sputtering machine is cleaned and the surface is dried, a substrate processing material is disposed on the inner wall surface of the cavity of the vacuum sputtering machine, and after the substrate processing material is dried, a substrate processing layer is formed. A tearable film layer material is disposed on the material processing layer, and after the tearable film layer material is dried, a tearable film layer is formed, and the substrate processing layer and the tearable film layer are protective films on the inner wall of the cavity of the vacuum sputtering machine.

Description

Method for arranging protective film on inner wall of cavity of vacuum sputtering machine

The present invention relates to a method of arranging a protective film on an inner wall, and more particularly to a method of arranging a protective film on a wall of a cavity of a vacuum sputtering machine.

With the rapid development of the technology industry, the competition in various technology industries is becoming more and more fierce. In the semiconductor and panel industries, in order to maintain competitiveness and even lead in the industry, it is necessary to continuously improve production yield. One of the ways to reduce the manufacturing cost and increase the production yield is to buy the new equipment needed for the production line and replace the old equipment with poor yield or poor production efficiency, but the price of the equipment is very expensive. It will not be able to effectively reduce the manufacturing cost. Therefore, how to use the original equipment to find new ways to overcome the process bottleneck and reduce the production cost, without paying for the equipment, is the direction for the manufacturers.

In the related industries such as semiconductor industry and panel factory, one of the important production equipment vacuum sputtering machines, after the internal wall of the vacuum sputtering machine is used for a period of time, the target material is bombarded by the sputtering material (metal The particles) will continually adhere to the inner wall and accumulate to form deposits, which will affect the production yield. At this time, it is necessary to stop the cavity of the vacuum sputtering machine and then clean the cavity, but then reinstall the cavity, but Since the process of disassembly and cleaning is quite time consuming, it also increases the production cost. In addition, the cleaning method of the inner wall of the current vacuum sputtering machine adopts a chemical, high-pressure water jet, sand blasting, spraying and the like to remove the sputtering material on the inner wall surface of the cavity. In addition to the aforementioned time-consuming problems of the disassembly and cleaning process, these are The cleaning method also has the following problems:

1. Destructive cleaning methods may damage the inner wall of the vacuum sputtering machine due to careless handling by the cleaning personnel.

2. The dirt after cleaning is not easy to handle, and it is less environmentally friendly.

Furthermore, if the inner wall of the vacuum sputtering machine is not completely cleaned, it will affect the subsequent process, resulting in a decrease in yield. Conversely, if the cleaning excessively destroys the inner wall of the vacuum sputtering machine, the ions in the plasma will be affected. Impact, but accelerate the damage of the cavity parts, shorten the life of the cavity parts, and increase the production cost. In summary, how to remove the deposits on the inner wall of the vacuum sputtering machine as much as possible, and not shorten The life of the cavity parts is a necessary issue to be solved.

In view of the problems of the prior art, the object of the present invention is to quickly clean the inner wall of the sputtering chamber of the vacuum sputtering machine and to properly protect the cavity parts.

In order to achieve the above object, the present invention provides a method for arranging a protective film on a cavity wall of a vacuum sputtering machine, which cleans and drys the inner wall of the vacuum sputtering machine, and adheres the protective film to the cavity of the vacuum sputtering machine. On the surface of the wall, the protective film is a multi-layer structure. In the multi-layer structure, the inner wall of the cavity of the vacuum sputtering machine is sequentially a substrate processing layer and a tearable film layer.

According to the purpose of the present invention, the present invention further provides a method for arranging a protective film on a cavity wall of a vacuum sputtering machine, which cleans and drys the inner wall of the vacuum sputtering machine on the inner wall surface of the cavity of the vacuum sputtering machine. The substrate processing material is disposed on the substrate, and after the substrate processing material is dried, the substrate processing layer is formed, and the tearable film layer material is disposed on the substrate processing layer, and after the material of the tearable film layer is dried, a tearable film layer is formed. The substrate treatment layer and the tearable film layer are formed as a protective film on the inner wall of the cavity of the vacuum sputtering machine.

The protective film is disposed on the surface of the inner wall of the cavity of the vacuum sputtering machine by the method of arranging the protective film on the inner wall of the cavity of the vacuum sputtering machine. When the sputtering process is performed, the sputtering material is applied to the vacuum sputtering machine. The splash in the direction of the inner wall of the cavity will adhere to the protective film to accumulate deposits. After the inner wall of the vacuum sputtering machine is cleaned, the protective film can be quickly removed by simply peeling off the protective film. The attachments are removed together.

In summary, the present invention has one or more of the following advantages:

1. Reduce cleaning time, reduce process cost, and increase machine utilization.

2. It is not necessary to use chemical, high-pressure waterjet, sandblasting, spray and other damage methods to clean, so it is more environmentally friendly.

3. Don't worry about the problem of cleaning and cleaning, because the protective film can be completely removed by removing the protective film, so as to reduce the generation of pollutants in the process and improve the process yield.

4. Don't worry that over-cleaning will cause problems such as damage to the cavity parts of the vacuum sputter machine, which can delay the damage of the machine.

5. The protective film can also protect the inner wall of the chamber of the vacuum sputter from damage caused by the sputtering process, thereby delaying the damage of the machine.

1‧‧‧The inner wall of the cavity of the vacuum sputtering machine

2‧‧‧Substrate treatment layer

3‧‧‧Tearable film layer

4‧‧‧Electrical functional layer

S10-S32‧‧‧Steps

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a flow chart showing an embodiment of a method of arranging a protective film on a body wall of a vacuum sputtering machine of the present invention.

2 is a flow chart showing another embodiment of the method of arranging a protective film on the inner wall of a cavity of a vacuum sputtering machine of the present invention.

Fig. 3 is an arrangement of the protective film disposed on the inner wall of the cavity of the vacuum sputtering machine of the present invention.

In order to fully understand the objects, features and advantages of the present invention, the present invention will be described in detail by the following specific embodiments and the accompanying drawings, which are illustrated as follows: FIG. 1 and FIG. It is an embodiment of the method for arranging a protective film on the inner wall of the cavity of the vacuum sputtering machine of the present invention, and the steps are as follows:

Step S10: Clean the inner wall 1 of the cavity of the vacuum sputtering machine and dry the surface.

Step S12: The protective film is adhered to the surface of the inner wall 1 of the cavity of the vacuum sputtering machine. The protective film is a multi-layer structure. In the multi-layer structure, the adhesive surface contacting the inner wall 1 of the vacuum sputtering machine is a substrate processing layer 2, and the substrate processing layer 2 is provided with a tearable film layer 3. In order to enhance the protective ability of the protective film, in the present invention, the protective film is provided with a conductive functional layer 4 on the tearable film layer 3.

In one embodiment of the present invention, any two or more layers of the substrate processing layer 2, the tearable film layer 3 and the conductive functional layer 4 may be integrated, for example, the substrate processing layer 2 and the tearable film layer 3 are integrated. The tearable film layer 3 is integrated with the conductive functional layer 4, or the substrate processing layer 2, the tearable film layer 3, and the conductive functional layer 4, and the three layers are integrated, but not limited thereto. Further, the substrate processing material, the tearable film material, or the conductive functional material may be integrally formed by transfer, immersion, adhesion, or the like.

Referring to FIG. 2 and FIG. 3, another embodiment of the method for arranging a protective film on the inner wall of the cavity of the vacuum sputtering machine of the present invention is as follows:

Step S20: cleaning and drying the inner wall 1 of the vacuum sputtering machine.

Step S22: a substrate processing material is disposed on the surface of the inner wall 1 of the vacuum sputtering machine, and after the substrate processing material is dried, the substrate processing layer 2 is formed.

Step S24: providing a tearable film material on the substrate processing layer 2, after the tearable film material is dried, Further, a tearable film layer 3 is formed, that is, a protective film including a substrate treatment layer 2 and a tearable film layer 3 is formed on the inner wall 1 of the vacuum sputtering machine. Also in order to strengthen the protective ability of the protective film, after the step S24 is completed, the following steps can be performed: Step S26: the conductive functional material is disposed on the tearable film layer 3, and after the conductive functional material is dried, the conductive functional layer 4 is formed. That is, a protective film including a substrate treatment layer 2, a tearable film layer 3, and a conductive functional layer 4 is formed on the inner wall 1 of the vacuum sputtering machine; wherein the substrate processing material, the tearable film material or The conductive functional material can be brushed, sprayed, etc., but not limited thereto.

Wherein, the foregoing substrate processing material, tearable film material and conductive functional material belong to a reaction aqueous dispersion coating of polyethylene terephthalic acid and polyurea and polyvinyl alcohol, and the substrate processing material mainly comprises triethylamine. And dimethyl acetamide, but not limited to this material. After the substrate processing material, the tearable film material and the conductive functional material are sequentially disposed, the drying time is naturally dried at room temperature for 1 minute to 24 hours, or dried at 25 to 200 ° C for 1 minute to 8 hours to complete drying. The optimum conditions are natural air drying time at room temperature for 2 to 8 hours, or drying at 60 to 100 ° C for 30 minutes to 1 hour to complete the drying. The substrate processing layer 2, the tearable film layer 3, and the conductive functional layer 4 have vacuum environment adaptability (10e - ⁵ kpa), temperature resistance (within 250 ° C), and high adhesion (5 N or more per square centimeter), In a vacuum environment, it will not fall off even after being bombarded by plasma, and will be closely adhered to the next layer or the inner wall 1 of the vacuum sputtering machine.

Among them, the substrate treatment layer 2 allows the subsequent materials to be tightly bonded, and the tear film layer 3 allows the protective film to be smoothly removed to prevent the substrate treatment layer 2 from remaining in the cavity of the vacuum sputtering machine. The possibility of secondary cleaning is caused on the wall 1, and the conductive functional layer 4 is doped by doping. Carbon nanospheres or metal particles (such as: magnesium, aluminum, copper) to achieve the conductive function, but not limited to this material, the conductive functional layer 4 can solve the sputtering material adhered to the inner wall of the vacuum sputtering cavity, Further, a large amount of electric charge is accumulated to cause a problem of destruction of the arc discharge, and the sputtering process yield is improved.

After the method of arranging a protective film on the inner wall of the cavity of the vacuum sputtering machine according to the present invention, after the sputtering operation is performed in the future, when the accumulated deposits on the inner wall of the vacuum sputtering machine affect the yield, the following steps can be performed:

Step S30: tearing off the protective film.

Step S32: Arranging the protective film, that is, repeating one of steps S10 to S12, S20 to S24 or S20 to S26. In the cleaning step, only the protective film is torn off, and the attachment of the inner wall 1 of the vacuum sputtering machine can be cleaned, and then the protective film arrangement and the sputtering process of the next cycle can be performed, thereby saving The time and labor cost of cleaning, and the possibility of damaging the cavity of the vacuum sputtering machine during cleaning and the excessive cleaning caused by the current cleaning method, thereby reducing the life of the machine, can be avoided. Cleaning incomplete contaminants causes problems with reduced sputtering process yield.

The present invention has been specifically described above by way of a preferred embodiment, and it should be understood by those skilled in the art that this embodiment is only used to describe the present invention. Those skilled in the art can understand and modify the spirit and principles of the present invention to achieve the equivalent purpose, and such changes and modifications should be included in the scope of the patent application as described later. In the scope of definition.

Claims (14)

A method for arranging a protective film on a wall of a cavity of a vacuum sputtering machine, the method comprising: cleaning and drying a surface of a cavity of the vacuum sputtering machine; and adhering a protective film to a surface of a cavity of the vacuum sputtering machine; The protective film has a multi-layer structure, and the adhesive surface of the cavity of the vacuum sputtering machine is a substrate processing layer, and a tearable film layer is disposed on the substrate processing layer. The method of claim 1, wherein the protective film further comprises a conductive functional layer on the tearable film layer. A method for arranging a protective film on a inner wall of a cavity of a vacuum sputtering machine according to claim 1, wherein one or both of the substrate treatment layer and the tearable film layer are suitable for a vacuum environment and a temperature of 250 ° C . A method of arranging a protective film on a inner wall of a cavity of a vacuum sputtering machine according to claim 2, wherein one or both of the substrate processing layer, the tearable film layer and the conductive functional layer are suitable for Vacuum environment and high temperature of 250 °C. The method for arranging a protective film on a inner wall of a cavity of a vacuum sputtering machine according to claim 2 or 4, wherein the substrate processing layer, the tearable film layer and the material of the conductive functional layer belong to polyethylene terephthalate A water-based dispersion coating of the reaction of formic acid with polyurea and polyvinyl alcohol. A method for arranging a protective film on a wall of a cavity of a vacuum sputtering machine, the method comprising: cleaning and drying a surface of a cavity of the vacuum sputtering machine; and providing a substrate processing material on a surface of the inner wall of the cavity of the vacuum sputtering machine, After the substrate processing material is dried, a substrate processing layer is formed; a tearable film layer material is disposed on the substrate processing layer, and after the tearable film material is dried, A tearable film layer is formed. The method for arranging a protective film on the inner wall of a cavity of a vacuum sputtering machine according to claim 4, wherein after forming a tearable film layer, further comprising the step of disposing a conductive functional material on the tearable film layer, After the conductive functional material is dried, a conductive functional layer is formed. A method of arranging a protective film on a inner wall of a cavity of a vacuum sputtering machine according to claim 6 or 7, wherein one or both of the substrate treatment layer and the tearable film layer are suitable for a vacuum environment and 250 ° C The temperature. A method of arranging a protective film on a inner wall of a cavity of a vacuum sputtering machine according to claim 7, wherein one or more of the substrate treatment layer and the tearable film layer and the conductive functional layer are suitable for Vacuum environment and high temperature of 250 °C. The method for arranging a protective film on a inner wall of a cavity of a vacuum sputtering machine according to claim 7 or 9, wherein the material of the substrate processing layer, the tearable film layer and the conductive functional layer belongs to polyethylene terephthalic acid. A water-dispersible coating for the reaction with polyurea and polyvinyl alcohol. A method of arranging a protective film on a wall of a cavity of a vacuum sputtering machine according to claim 10, wherein the drying is performed at a room temperature for 1 minute to 24 hours. A method of arranging a protective film on a inner wall of a cavity of a vacuum sputtering machine according to claim 10, wherein the drying is performed at a room temperature of 2 to 8 hours when it is naturally air-dried. A method of arranging a protective film on a inner wall of a cavity of a vacuum sputtering machine according to claim 10, wherein the drying is performed at 25 to 200 ° C for 1 minute to 8 hours. A method of arranging a protective film on a inner wall of a cavity of a vacuum sputtering machine according to claim 10, wherein the drying is carried out at 60 to 100 ° C for 30 minutes to 1 hour.