CN205122553U - Semiconductor device part load -bearing trolley - Google Patents

Abstract

The utility model provides a semiconductor device part load -bearing trolley. Load -bearing trolley includes platform truck main part, a plurality of wheel, reaches a plurality of convex crossbearers. The platform truck main part is constituteed with a plurality of frame, and a plurality of wheels set up in the below of platform truck main part, and the convex crossbearer is the top that sets up in the platform truck main part, and each convex crossbearer can have a plurality of convex structures to conveniently place rod form or microscler semiconductor device set of component. The platform truck main part has first frame layer and second frame layer, and first frame layer reaches second frame layer has a plurality of squares, in order to hold the part.

Description

Semiconductor equipment part carrying chassis

[technical field]

The utility model relates to a kind of semiconductor equipment part carrying chassis, particularly relates to a kind of carrying chassis relating to the part that can be used for bearing semiconductor process apparatus.

[background technology]

In manufacture of semiconductor, must regularly or aperiodically to the part of semi-conductor processing equipment clean and regenerate, to maintain the usefulness of semi-conductor processing equipment, and can useful life of extension device.

For physical vapour deposition (PVD) processing procedure, physical vapour deposition (PVD) processing procedure mainly deposits a film on a substrate.First utilize a DC power supply to be electrically coupled to a backboard and respectively and cover plate, cover plate by this backboard and this and in this reactor chamber, form electric field ion gun bundle is hit to metal targets.After ion gun bundle clashes into target, the metal sputtering on this target can be formed this film on the substrate.

Usually, the reactor chamber of physical vapour deposition (PVD) in use for some time, this the surface formation metal coating of plate and mother metal can be covered in reactor chamber, therefore must carry out cleaning and regenerate to reactor chamber, prevent metal coating from breaking or peel off the micro dust particle that produces be disseminated to this substrate and affect yield.So-called cleaning means that this covers the suitable method of the material selection of the metal coating of plate and this mother metal and material is removed in reactor chamber, such as soak reactor chamber with acid or alkaline chemical solution, the metal coating separated and dissolved covering plate and mother metal surface will be formed at.So-called regeneration recovers this in the mode such as sandblasting and shaping again after referring to and cleaning and covers plate and the original profile of mother metal and surface characteristic.But above-mentioned clean and regeneration all can corrode with loss reactor chamber in cover the body thickness of plate and mother metal, cause shorten useful life.

In addition, for the screw hole in reaction chamber, such as be locked in the screw hole between this mother metal, above-mentionedly soak reactor chamber with chemical solution, this covered to plate and this step such as mother metal sandblasting and shaping can make screw hole produce reaming phenomenon, therefore after repeatedly carrying out cleaning and regenerate, screw hole size and original size difference to some extent can be caused, cause screw hole and screw to combine time error excessive and make not good even cannot the continuation of locking function use.

Further, owing to clean etc. in process aforementioned, a large amount of acidity or the chemical solution of alkalescence must be used, soak and cover plate and mother metal, with dissolution of metals plated film, make it and cover plate and mother metal is separated.Due to a large amount of acidity or the chemical solution of alkalescence inevitably must be used, thus in the process cleaned, a large amount of clear water must be used to rinse the part of manufacture of semiconductor.

Moreover among the process of cleaning, semiconductor spare part need constantly move between each cleaning step.Therefore, be applicable to mobile carrying and the carrying chassis of various spare part can be born, quite important in the cleaning process of semiconductor spare part.

[utility model content]

Main purpose of the present utility model is to provide a kind of semiconductor equipment part to carry chassis, and described semiconductor equipment part carrying chassis comprises:

Chassis main body, formed with multiple framework, wherein said chassis main body has the first ccf layer and the second ccf layer, described first ccf layer and described second ccf layer have multiple grid, the size of grid described in each is the size of the described part being greater than described semiconductor equipment, to hold described part;

Multiple wheel, is arranged at the below of described chassis main body; And

Multiple convex crossbearer, be arranged at the top of described chassis main body, wherein described in each, convex crossbearer has multiple convex architecture.

In an embodiment of the present utility model, described multiple convex architecture is multiple continuous print chevron convex architecture.

In an embodiment of the present utility model, described multiple convex architecture is multiple discontinuous chevron convex architecture.

In an embodiment of the present utility model, the size of described multiple grid is not identical.

Compared to the problem of existing semiconductor equipment part carrying chassis, in semiconductor equipment part carrying chassis of the present utility model, carrying chassis can be used for the part of bearing semiconductor equipment, and in the cleaning that can conveniently be applied to semiconductor equipment part or regenerative process, to carry and to place the part of semiconductor equipment.This carrying chassis can be provided with multiple convex crossbearer, and each convex crossbearer can have multiple convex architecture, places rod shape or microscler part, avoid rod shape or microscler spare part to rock in handling process, and injure spare part to facilitate.Moreover according to the semiconductor equipment part of multiple different size, carrying chassis has the grid of multiple similar and different size with may correspond to, with the multiple part of convenient for collecting.

For foregoing of the present utility model can be become apparent, preferred embodiment cited below particularly, and coordinate institute's accompanying drawings, be described in detail below:

[accompanying drawing explanation]

Fig. 1 to Fig. 4 is the schematic diagram of an embodiment of semiconductor equipment part of the present utility model carrying chassis.

[embodiment]

The explanation of following embodiment is graphic with reference to what add, can in order to the specific embodiment implemented in order to illustrate the utility model.The direction term that the utility model is mentioned, such as " on ", D score, "front", "rear", "left", "right", " interior ", " outward ", " side " etc., be only the direction with reference to annexed drawings.Therefore, the direction term of use is in order to illustrate and to understand the utility model, and is not used to limit the utility model.

Accompanying drawing and explanation are considered to illustrating property in itself, instead of restrictive.In the drawings, the unit of structural similarity represents with identical label.In addition, in order to understand and be convenient to describe, size and the thickness of each assembly shown in accompanying drawing illustrate arbitrarily, but the utility model is not limited thereto.

In the accompanying drawings, for clarity, the thickness in layer, film, panel, region etc. is exaggerated.In the accompanying drawings, in order to understand and be convenient to describe, the thickness in some layers and region is exaggerated.The assembly that will be appreciated that when such as layer, film, region or substrate is referred to as " " another assembly " on " time, directly on another assembly described, or also can there is intermediate module in described assembly.

In addition, in the description, unless explicitly described as contrary, otherwise word " comprises " being understood to imply and comprises described assembly, but do not get rid of other assembly any.In addition, in the description, " ... on " mean to be positioned at above target element or below, and do not mean must be positioned on the top based on gravity direction.

Please refer to Fig. 1 to Fig. 4, Fig. 1 to Fig. 4 is the schematic diagram of an embodiment of semiconductor equipment part of the present utility model carrying chassis.The carrying chassis of the present embodiment can be used for the part of bearing semiconductor equipment, such as, in the cleaning that can conveniently be applied to semiconductor equipment part or regenerative process, to carry and to place the part of semiconductor equipment.This carrying chassis 101 can comprise chassis main body 102, multiple wheel 103 and multiple convex crossbearer 104.Chassis main body 102 formed with multiple framework 105 (such as metal framework or plastic frame), and multiple wheel can be arranged at the below of chassis main body 102, moves to facilitate carrying chassis 101.Convex crossbearer 104 is the tops being arranged at chassis main body 102, and wherein each convex crossbearer 104 can have multiple convex architecture 106, places rod shape or microscler part, avoid rod shape or microscler spare part to rock in handling process, and injure spare part to facilitate.Wherein, multiple convex architecture 106 of convex crossbearer 104 can be such as continuous or discrete chevron convex architecture.

In one embodiment, chassis main body 102 can have the first ccf layer 107 and the second ccf layer 108 of upper-lower position, first ccf layer 107 and the second ccf layer 108 can have multiple varying in size or identical grid 109, the size of each grid is the size being at least greater than semiconductor equipment part, to hold part in grid 109.Therefore, according to the semiconductor equipment part of multiple different size, carrying chassis 101 has multiple varying in size or identical grid 109, with the multiple part of convenient for collecting with may correspond to.

Then, be described for the spare part cleaning process in the reaction cavity of semiconductor equipment, it is main after aluminium alloy spare part machining completes and applies relevant surface treatment (as anode process, meltallizing process etc.), or machine is descended after semiconductor dry etcher uses, follow-up this cleaning way that all can use carries out ultra-clean cleaning, to meet the ultra-high purity requirement in harsh conductor etching unit room, for the purpose of effect of improving production efficiency and product yield.

Such as be applicable to the spare part that aluminum substrates applies anode process, before cleaning must according to the state of spare part, and make difference and prepare in advance.When spare part is new product part, first uses liquid of soaping to carry out degreasing processing procedure, carry out new anode film process more afterwards, after completing, enter cleaning process.When spare part is anode regeneration part, old anode film need be carried out strip and new anode film regeneration processing procedure and new meltallizing film and regenerate processing procedure, after completing, enter cleaning process.When spare part is upper machine cleaning part, get corresponding liquid according to differential responses cavity processing procedure and carry out membrane removal processing procedure, complete and enter cleaning process.

After being ready to complete before cleaning, can carry out cleaning process, its step is such as sequentially as follows: an IPA wiping, uses non-dust cloth to pick IPA (isopropyl alcohol) evenly wiping spare part surface; Pure water rinsing, continues and uses the complete hydro-peening spare part surface of pure water; Degreasing, then spare part is soaked in configuration temperature 40 ~ 50 DEG C, cleaning agent (ALCONOXLuminox) liquid, to remove spare part surface grease; Second pure water rinses, and re-uses the complete hydro-peening spare part surface of pure water; Secondary IPA wiping, enters dust free room by spare part transposition, spare part is placed in platform, uses non-dust cloth to be stained with a little IPA (isopropyl alcohol) evenly wiping spare part surface; Ultrapure water: on the complete hydro-peening spare part surface of dust free room, 2 ~ 5 minutes time; Hot ultra-pure water soaks, and at dust free room, is soaked in by spare part in the ultra-pure water temperature 40 ~ 50 DEG C of overflow, soak time 5 ~ 15 minutes; Secondary ultrapure water, uses the complete hydro-peening spare part surface of ultra-pure water in dust free room; Ultrasonic washer, is soaked in the ultra-pure water room temperature of overflow in dust free room by spare part, collocation ultrasonic waves frequency 40kHz, carries out ultrasonic washer; Ultrapure water again: at dust free room, uses the complete hydro-peening spare part surface of ultra-pure water; Dry up, at dust free room, use pure air or nitrogen to dry up spare part surface; Dry: enter in dust free room, be placed in by spare part in the Non-dust furnace of 90 ~ 120 DEG C, baking time is greater than 60 minutes, treats that the temperature on spare part surface is lower than 50 DEG C after baking; Nitrogen blowing, at dust free room, takes out the spare part after drying, and uses nitrogen to blow spare part surface; Once pack, at dust free room, spare part is placed in nylon (Nylon) bag being full of nitrogen, utilizes sealing machine and air-extractor to carry out vacuum packaging; Again pack, at dust free room, the packaged spare part of nylon (Nylon) bag is placed in PE bag, utilizes sealing machine and air-extractor to carry out vacuum packaging; Vanning is transported, and spare part takes out dust free room, is placed in special logical case, completes cleaning process, can shipment use to client.

As shown in the above description, before washing or among process, semiconductor spare part need constantly move between each cleaning step.Therefore, be applicable to mobile carrying and the carrying chassis of various spare part can be born, quite important in the cleaning process of semiconductor spare part.

In carrying chassis of the present utility model, carrying chassis can be used for the part of bearing semiconductor equipment, such as, in the cleaning that can conveniently be applied to semiconductor equipment part or regenerative process, to carry and to place the part of semiconductor equipment.This carrying chassis can be provided with multiple convex crossbearer, and each convex crossbearer can have multiple convex architecture, places rod shape or microscler part, avoid rod shape or microscler spare part to rock in handling process, and injure spare part to facilitate.Moreover according to the semiconductor equipment part of multiple different size, carrying chassis has multiple varying in size or identical grid, with the multiple part of convenient for collecting with may correspond to.

" in certain embodiments " and the term such as " in various embodiments " be used repeatedly.This term does not refer to identical embodiment usually; But it can also refer to identical embodiment." comprise ", the word such as " having " and " comprising " is synonym, unless its context meaning demonstrates other meaning.

Although the example of various method, equipment and system has been described in herein, the scope that this disclosure contains has been not limited thereto.On the contrary, this disclosure contains the thing of all methods reasonably dropped in scope that claim defines, equipment, system and manufacture, and the scope of claim should be understood according to the claim interpretation principle be established.Such as, although the example of the system disclosed above also comprise outside other component the software that can perform on hardware or or firmware, it is to be understood that these systems are exemplary example, and should to be read as be restrictive example.In detail, any or all revealed hardware, software and/or firmware component can by some combinations being ad hoc embodied as hardware, be ad hoc embodied as software, be ad hoc embodied as firmware or hardware, software and/or firmware.

In sum; although the utility model discloses as above with preferred embodiment; but above preferred embodiment is also not used to limit the utility model; those of ordinary skill in the art; not departing from spirit and scope of the present utility model; all can do various change and retouching, the scope that therefore protection range of the present utility model defines with claim is as the criterion.

Claims (4)

1. a semiconductor equipment part carrying chassis, is characterized in that: described semiconductor equipment part carrying chassis comprises:

Chassis main body, formed with multiple framework, wherein said chassis main body has the first ccf layer and the second ccf layer, described first ccf layer and described second ccf layer have multiple grid, the size of grid described in each is the size of the described part being greater than described semiconductor equipment, to hold described part;

Multiple wheel, is arranged at the below of described chassis main body; And

Multiple convex crossbearer, be arranged at the top of described chassis main body, wherein described in each, convex crossbearer has multiple convex architecture.

2. semiconductor equipment part carrying chassis according to claim 1, is characterized in that: described multiple convex architecture is multiple continuous print chevron convex architecture.

3. semiconductor equipment part carrying chassis according to claim 1, is characterized in that: described multiple convex architecture is multiple discontinuous chevron convex architecture.

4. semiconductor equipment part carrying chassis according to claim 1, is characterized in that: the size of described multiple grid is not identical.