TWI652179B - Printing screens, methods of fabricating the same and methods of screen printing - Google Patents
Printing screens, methods of fabricating the same and methods of screen printing Download PDFInfo
- Publication number
- TWI652179B TWI652179B TW103136987A TW103136987A TWI652179B TW I652179 B TWI652179 B TW I652179B TW 103136987 A TW103136987 A TW 103136987A TW 103136987 A TW103136987 A TW 103136987A TW I652179 B TWI652179 B TW I652179B
- Authority
- TW
- Taiwan
- Prior art keywords
- stencil
- microns
- layer
- printing
- alternatively
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
- B41N1/243—Stencils; Stencil materials; Carriers therefor characterised by the ink pervious sheet, e.g. yoshino paper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
- B41C1/14—Forme preparation for stencil-printing or silk-screen printing
- B41C1/142—Forme preparation for stencil-printing or silk-screen printing using a galvanic or electroless metal deposition processing step
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
- B41N1/247—Meshes, gauzes, woven or similar screen materials; Preparation thereof, e.g. by plasma treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1225—Screens or stencils; Holders therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Textile Engineering (AREA)
- Printing Plates And Materials Therefor (AREA)
- Mechanical Engineering (AREA)
Abstract
本發明所揭示的模版包括多個第一印刷孔洞以及與第一印刷孔洞交叉的多個第二印刷孔洞,其中第二印刷孔洞包括界定多個次孔洞的網狀物。 The stencil disclosed herein includes a plurality of first printing apertures and a plurality of second printing apertures intersecting the first printing apertures, wherein the second printing apertures include a mesh defining a plurality of secondary apertures.
Description
本發明關於印刷網版,其常常又稱為模版,特別是用於在基板上印刷窄的長形結構(例如矽太陽能電池上的正面導體),以及關於製造此種印刷網版的方法和網版印刷的方法。 The invention relates to a printing screen, often also referred to as a stencil, in particular for printing narrow elongate structures on a substrate, such as a front side conductor on a solar cell, and a method and network for making such a printing screen The method of printing.
於矽光伏電池,對持續發展造成顯著障礙的是正面金屬化的印刷,特別是在正面導體和匯流排棒的接合,並且尤其是在單一印刷操作中來為之。 In the case of photovoltaic cells, a significant obstacle to continued development is the front metallization of the printing, especially in the joining of the front conductor and the bus bar, and especially in a single printing operation.
於一方面,本發明提供一種模版,其包括多個第一印刷孔洞以及與第一印刷孔洞交叉的多個第二印刷孔洞,其中第二印刷孔洞(但不是第一印刷孔洞)包括界定多個次孔洞的網狀物。 In one aspect, the invention provides a stencil comprising a plurality of first printing apertures and a plurality of second printing apertures intersecting the first printing apertures, wherein the second printing apertures (but not the first printing apertures) comprise a plurality of defined apertures The mesh of the secondary hole.
於另一方面,本發明提供一種使用上述模版的網版印刷方法,其中呈交叉關係的第一和第二印刷沉積物是在單一印刷操作中印刷。 In another aspect, the present invention provides a screen printing method using the above stencil, wherein the first and second print deposits in a cross-over relationship are printed in a single printing operation.
於一具體態樣,沿著第一印刷孔洞的長度來施加第一張力,並且跨越第一印刷孔洞的寬度來施加低於第一張力的第二張力,可選擇而言,第一張力是至少1.5倍大於第二張力。 In a specific aspect, a first tension is applied along a length of the first printing aperture, and a second tension lower than the first tension is applied across a width of the first printing aperture, optionally, the first tension is at least 1.5 times greater than the second tension.
於再進一步方面,本發明提供一種製造模版的方法,其包括以下步驟:提供第一圖案化層(其可選擇而言為乾膜阻劑)給電形成設備的心軸;在第一圖案化層中界定孔洞,而在第一圖案化層中留下可以讓材料電形成在心軸上的開放影像;在第一圖案化層的開放影像中累積第一模版材料層;提供第二圖案化層(其可選擇而言為乾膜阻劑)給第一圖案化層,該第二圖案化層的尺寸和形狀對應於第一圖案化層中的孔洞,並且對齊於第一圖案化層中的孔洞;以及在第一圖案化層的剩餘開放影像中累積第二模版材料層。 In still a further aspect, the present invention provides a method of making a stencil comprising the steps of: providing a first patterned layer (which may alternatively be a dry film resist) to a mandrel of an electroforming apparatus; at a first patterned layer a hole is defined in which an open image is formed in the first patterned layer that allows the material to be electrically formed on the mandrel; a first stencil material layer is accumulated in the open image of the first patterned layer; and a second patterned layer is provided ( Optionally selecting a dry film resist) to the first patterned layer, the second patterned layer having a size and shape corresponding to the holes in the first patterned layer and aligned with the holes in the first patterned layer And accumulating a second layer of stencil material in the remaining open image of the first patterned layer.
3‧‧‧模版 3‧‧‧Template
4‧‧‧印刷孔洞 4‧‧‧Printing holes
5‧‧‧框架 5‧‧‧Frame
7‧‧‧第一層 7‧‧‧ first floor
9‧‧‧第二層 9‧‧‧ second floor
15‧‧‧第一印刷孔洞 15‧‧‧First printing hole
17‧‧‧第二印刷孔洞 17‧‧‧Second printing hole
21‧‧‧網狀物 21‧‧‧ mesh
23‧‧‧次孔洞 23‧‧‧ holes
25‧‧‧往內漸薄的表面 25‧‧‧Inwardly thinner surface
27‧‧‧往外漸薄的表面 27‧‧‧Outwardly thinned surface
31‧‧‧第一長形網狀元件 31‧‧‧First elongated mesh element
33‧‧‧第二長形網狀元件 33‧‧‧Second elongate mesh element
41‧‧‧第一印刷孔洞 41‧‧‧First printing hole
43‧‧‧第二印刷孔洞 43‧‧‧Second printing hole
101‧‧‧第一可光影像化層 101‧‧‧The first illuminable imaging layer
101’‧‧‧暴露層 101’‧‧‧ exposed layer
103‧‧‧心軸 103‧‧‧ mandrel
105‧‧‧開放影像 105‧‧‧Open image
107‧‧‧材料 107‧‧‧Materials
111‧‧‧第二可光影像化層 111‧‧‧Second illuminable imaging layer
111’‧‧‧第二暴露層 111’‧‧‧second exposure layer
115‧‧‧預先圖案化的元件 115‧‧‧Pre-patterned components
201‧‧‧正面金屬化線條 201‧‧‧Front metallized lines
203‧‧‧正面匯流排棒 203‧‧‧ positive bus bar
301‧‧‧正面金屬化線條 301‧‧‧Front metallized lines
303‧‧‧正面匯流排棒 303‧‧‧ positive bus bar
d‧‧‧網狀元件的寬度 D‧‧‧ Width of the mesh element
D‧‧‧印刷方向 D‧‧‧Printing direction
F1‧‧‧第一張力 F 1 ‧‧‧First tension
F2‧‧‧第二張力 F 2 ‧‧‧second tension
W1‧‧‧第一印刷孔洞的平均寬度 W 1 ‧‧‧Average width of the first printed hole
W2‧‧‧第二印刷孔洞的平均寬度 W 2 ‧‧‧Average width of the second printing hole
β1‧‧‧往內漸薄的表面所圍出之角度 β 1 ‧‧‧An angle enclosed by a tapered surface
β2‧‧‧往外漸薄的表面所圍出之角度 2 2 ‧‧‧ Angles of the outwardly thinner surface
θ1‧‧‧第一網狀元件與第二印刷孔洞之縱軸所呈的傾斜角度 θ 1 ‧‧‧inclination angle of the first mesh element to the longitudinal axis of the second printing hole
θ2‧‧‧第二網狀元件與第二印刷孔洞之縱軸所呈的傾斜角度 θ 2 ‧‧‧inclination angle of the second mesh element to the longitudinal axis of the second printing hole
現在下文將僅以舉例的方式而參考伴隨的圖式來描述本發明的較佳具體態樣,其中:圖1示範依據本發明之第一具體態樣的印刷網版單元;圖2示範圖1印刷網版單元之模版中的第一和第二印刷孔洞之接合的部分底側圖;圖3示範圖2之模版的第一垂直截面圖(沿著圖2的截面I-I);圖4示範圖2之模版的第二垂直截面圖(沿著圖2的截面II-II);圖5(a)到(g)示範在製造圖2之模版的處理步驟(沿著圖2的截面I-I);圖6(a)到(g)示範在製造圖2之模版的處理步驟(沿著圖2的截面II-II),其對應於圖5(a)到(g),;圖7示範使用圖2的模版所印刷之正面金屬化線條和正面匯流排棒的接合;圖8示範在圖1的印刷網版單元之一修改模版的第一和第二印刷孔洞 中之接合的部分底側圖;圖9示範在圖1的印刷網版單元之另一修改模版的第一和第二印刷孔洞中之接合的部分底側圖;圖10示範在圖1的印刷網版單元之進一步修改模版的第一和第二印刷孔洞中之接合的部分底側圖;圖11示範圖10之模版的第一垂直截面圖(沿著圖10的截面III-III);圖12示範圖10之模版的第二垂直截面圖(沿著圖10的截面IV-IV);以及圖13示範使用圖10的模版所印刷之正面金屬化線條和正面匯流排棒的接合。 The preferred embodiments of the present invention will now be described by way of example only with reference to the accompanying drawings in which: FIG. 1 illustrates a printing screen unit in accordance with a first aspect of the invention; FIG. Partial bottom side view of the joining of the first and second printing holes in the stencil of the printing screen unit; FIG. 3 is a first vertical sectional view of the stencil of FIG. 2 (along the section II of FIG. 2); FIG. a second vertical cross-sectional view of the stencil of 2 (along section II-II of Figure 2); Figures 5 (a) to (g) exemplify the processing steps of manufacturing the stencil of Figure 2 (along section II of Figure 2); Figures 6(a) through (g) illustrate the processing steps in the manufacture of the stencil of Figure 2 (along section II-II of Figure 2), which corresponds to Figures 5(a) through (g); The front metallized line printed by the stencil of 2 and the front bus bar are joined; FIG. 8 exemplifies the modification of the first and second printing holes of the stencil in one of the printing screen units of FIG. Partial bottom side view of the joint; FIG. 9 illustrates a bottom bottom view of the joint in the first and second printing holes of another modified stencil of the printing screen unit of FIG. 1; FIG. 10 illustrates the printing of FIG. A bottom side view of a portion of the first and second printing holes of the stencil that further modifies the stencil; FIG. 11 illustrates a first vertical cross-sectional view of the stencil of FIG. 10 (along section III-III of FIG. 10); 12 demonstrates a second vertical cross-sectional view of the stencil of FIG. 10 (along section IV-IV of FIG. 10); and FIG. 13 demonstrates the joining of the front metallized lines printed with the stencil of FIG. 10 and the front bus bar.
圖1到6示範依據本發明之第一具體態樣的印刷網版單元。 1 through 6 illustrate a printing screen unit in accordance with a first embodiment of the present invention.
印刷網版單元包括:模版3,於此具體態樣為金屬箔,其包括印刷孔洞4的圖案而界定要印刷的影像;以及框架5,其支持模版3並且允許藉由與框架5分開的伸張機制來伸張模版。 The printing screen unit comprises: a stencil 3, the specific aspect being a metal foil comprising a pattern of printing holes 4 defining an image to be printed; and a frame 5 supporting the stencil 3 and allowing for separation by the frame 5 Mechanism to extend the template.
模版3是由第一和第二層7、9所形成;上方的第一層7提供上面橫越印刷元件(未示範,例如橡膠滾筒)的表面,並且下方的第二層9接觸底下的工件(於此具體態樣為用於燃料電池或太陽能電池的晶圓)。 The stencil 3 is formed by the first and second layers 7, 9; the upper first layer 7 provides a surface that traverses over the printing element (not shown, such as a rubber roller), and the lower second layer 9 contacts the underlying workpiece (This is a wafer for a fuel cell or a solar cell).
於此具體態樣,第一層7是金屬層,其是在第二層9之前製造。 In this particular aspect, the first layer 7 is a metal layer that is fabricated prior to the second layer 9.
於此具體態樣,第一層7是電形成層,在此為電形成的鎳層。 In this particular aspect, the first layer 7 is an electrically formed layer, here an electrically formed nickel layer.
於替代性具體態樣,第一層7可藉由化學蝕刻或任何其他適 合的切割科技而由片材所形成。 In an alternative embodiment, the first layer 7 can be chemically etched or any other suitable The cutting technology is formed by sheets.
於此具體態樣,第一層7具有50微米的厚度。 In this particular aspect, the first layer 7 has a thickness of 50 microns.
於較佳具體態樣,第一層7具有從約20微米到約100微米的厚度,可選擇而言從約30微米到約80微米,可選擇而言從約40微米到約60微米。 In a preferred embodiment, first layer 7 has a thickness of from about 20 microns to about 100 microns, alternatively from about 30 microns to about 80 microns, alternatively from about 40 microns to about 60 microns.
於此具體態樣,第二層9是金屬層,其是在第一層7之後製造。 In this particular aspect, the second layer 9 is a metal layer that is fabricated after the first layer 7.
於此具體態樣,第二層9是電形成層,在此為電形成的鎳層。 In this particular aspect, the second layer 9 is an electrically formed layer, here an electrically formed nickel layer.
於替代性具體態樣,第二層9可藉由化學蝕刻或任何其他適合的切割科技而由片材所形成。 In an alternative embodiment, the second layer 9 can be formed from a sheet by chemical etching or any other suitable cutting technique.
於此具體態樣,第二層9具有50微米的厚度。 In this particular aspect, the second layer 9 has a thickness of 50 microns.
於較佳具體態樣,第二層9具有從約20微米到約100微米的厚度,可選擇而言從約30微米到約80微米,可選擇而言從約40微米到約60微米。 In a preferred embodiment, the second layer 9 has a thickness of from about 20 microns to about 100 microns, alternatively from about 30 microns to about 80 microns, alternatively from about 40 microns to about 60 microns.
第一層7包括多個第一印刷孔洞15,於此具體態樣為平行、窄長的線性孔洞,其在此界定太陽能電池的正面金屬化線條。為了容易示範,僅一個印刷孔洞15示範於圖2。 The first layer 7 comprises a plurality of first printing apertures 15, which in this particular are parallel, narrow-length linear apertures, which define the front metallized lines of the solar cell. For ease of demonstration, only one printing aperture 15 is illustrated in FIG.
於此具體態樣,第一印刷孔洞15具有約40微米的平均寬度W1。 In this particular aspect, the first printing aperture 15 has an average width W 1 of about 40 microns.
於較佳具體態樣,第一印刷孔洞15具有從約20微米到約100微米的平均寬度W1,可選擇而言從約20微米到約80微米,可選擇而言從約20微米到約60微米,可選擇而言從約25微米到約50微米。 In a preferred embodiment, the first printing aperture 15 has an average width W 1 from about 20 microns to about 100 microns, alternatively from about 20 microns to about 80 microns, alternatively from about 20 microns to about 60 microns, alternatively from about 25 microns to about 50 microns.
於此具體態樣,第一印刷孔洞15具有約1.25毫米的間距。 In this particular aspect, the first printing aperture 15 has a pitch of about 1.25 mm.
於較佳具體態樣,第一印刷孔洞15具有從約0.5毫米到約2.5毫米的間距,可選擇而言從約0.5毫米到約2.0毫米,可選擇而言從約1毫米到約1.5毫米。 In a preferred embodiment, the first printing aperture 15 has a pitch of from about 0.5 mm to about 2.5 mm, alternatively from about 0.5 mm to about 2.0 mm, alternatively from about 1 mm to about 1.5 mm.
第一層7進一步包括多個第二印刷孔洞17,其在此界定太陽能電池的正面匯流排棒,而於此具體態樣為長形孔洞,其延伸成與第一印刷孔洞15呈實質正交的關係。為了容易示範,僅一個第二印刷孔洞17示範於圖2。 The first layer 7 further includes a plurality of second printing apertures 17 defining the front bus bar of the solar cell, and in this particular aspect is an elongated aperture that extends substantially orthogonal to the first printing aperture 15 Relationship. For ease of demonstration, only one second printing aperture 17 is illustrated in FIG.
於此具體態樣,第二印刷孔洞17具有約1.25毫米的平均寬度W2。 In this particular aspect, the second printing aperture 17 has an average width W 2 of about 1.25 mm.
於較佳具體態樣,第二印刷孔洞17具有從約0.5毫米到約2.5毫米的平均寬度W2,可選擇而言從約0.5毫米到約2.0毫米,可選擇而言從約1毫米到約1.5毫米。 In a preferred embodiment, the second printing aperture 17 has an average width W 2 of from about 0.5 mm to about 2.5 mm, alternatively from about 0.5 mm to about 2.0 mm, alternatively from about 1 mm to about 1.5 mm.
於此具體態樣,第二印刷孔洞17在其長度上是漸細的。 In this particular aspect, the second printing aperture 17 is tapered over its length.
於替代性具體態樣,第二印刷孔洞17在其長度上是呈直線的。 In an alternative embodiment, the second printing aperture 17 is linear over its length.
第二印刷孔洞17包括網狀物21,其包括多個次孔洞23。 The second printing aperture 17 includes a mesh 21 that includes a plurality of secondary holes 23.
於此具體態樣,次孔洞23具有開放區域,其在印刷方向D、至少在其截面上(在此在其下游末端)的側向尺寸有所減少,如此以呈現往內漸薄的表面25。 In this particular aspect, the secondary aperture 23 has an open area which has a reduced lateral dimension in the printing direction D, at least in its cross section (here at its downstream end), so as to present an inwardly tapered surface 25 .
於此具體態樣,往內漸薄的表面25是實質線性的。 In this particular aspect, the inwardly tapered surface 25 is substantially linear.
於此具體態樣,往內漸薄的表面25圍出實質90度的角度 β1。 In this particular aspect, the inwardly tapered surface 25 encloses a substantially 90 degree angle β 1 .
於較佳具體態樣,往內漸薄的表面25所圍出之角度β1小於約120度,可選擇而言小於約100度。 In a preferred embodiment, the angle β 1 enclosed by the inwardly tapered surface 25 is less than about 120 degrees, and optionally less than about 100 degrees.
於較佳具體態樣,往內漸薄的表面25所圍出之角度β1大於約40度,可選擇而言大於約60度。 In a preferred embodiment, the angle β 1 enclosed by the inwardly tapered surface 25 is greater than about 40 degrees, and optionally greater than about 60 degrees.
於替代性具體態樣,往內漸薄的表面25是拱形的,例如由平滑曲線或多個線性或拱形區段所界定。 In an alternative embodiment, the inwardly tapered surface 25 is arcuate, such as defined by a smooth curve or a plurality of linear or arcuate segments.
於此具體態樣,次孔洞23具有開放區域,其在印刷方向D、至少在其截面上(在此在其上游末端)的側向尺寸有所增加,如此以呈現往外漸薄的表面27。 In this particular aspect, the secondary aperture 23 has an open area which increases in lateral direction in the printing direction D, at least in its cross section (here at its upstream end), in order to present an outwardly thinned surface 27.
於此具體態樣,往外漸薄的表面27是實質線性的。 In this particular aspect, the outwardly thinned surface 27 is substantially linear.
於此具體態樣,往外漸薄的表面27圍出實質90度的角度β2。 In this particular aspect, the outwardly thinned surface 27 encloses an angle β 2 of substantially 90 degrees.
於較佳具體態樣,往外漸薄的表面27所圍出之角度β2小於約120度,可選擇而言小於約100度。 In a preferred embodiment, the outwardly tapered surface 27 encloses an angle β 2 of less than about 120 degrees, and optionally less than about 100 degrees.
於較佳具體態樣,往外漸薄的表面27所圍出之角度β2大於約40度,可選擇而言大於約60度。 In a preferred embodiment, the outwardly tapered surface 27 encloses an angle β 2 greater than about 40 degrees, and optionally greater than about 60 degrees.
於替代性具體態樣,往外漸薄的表面27是拱形的,例如由平滑曲線或多個線性或拱形區段所界定。 In an alternative embodiment, the outwardly tapered surface 27 is arcuate, such as defined by a smooth curve or a plurality of linear or arcuate segments.
於此具體態樣,次孔洞23具有實質方形的開放區域,在此其相對角落係對齊於印刷方向D。 In this particular aspect, the secondary aperture 23 has a substantially square open area where its opposing corners are aligned with the printing direction D.
於替代性具體態樣,次孔洞23具有實質菱形或鑽石形的開 放區域,在此其相對角落係對齊於印刷方向D。 In an alternative embodiment, the secondary aperture 23 has a substantially diamond or diamond shape. The area where the opposite corners are aligned with the printing direction D.
於另一替代性具體態樣,次孔洞23具有實質圓形的開放區域。 In another alternative embodiment, the secondary aperture 23 has a substantially circular open area.
於再另一替代性具體態樣,次孔洞23具有實質橢圓形的開放區域,而橢圓的主軸對齊於印刷方向D。 In still another alternative embodiment, the secondary aperture 23 has a substantially elliptical open area with the major axis of the ellipse aligned with the printing direction D.
於此具體態樣,網狀物21是由多個第一長形網狀元件31和多個第二長形網狀元件33所形成,該等多個第一長形網狀元件31安排成平行關係,並且該等多個第二長形網狀元件33安排成平行關係並且與第一網狀元件31呈交叉關係。 In this specific aspect, the mesh 21 is formed by a plurality of first elongate mesh members 31 and a plurality of second elongate mesh members 33, and the plurality of first elongate mesh members 31 are arranged The parallel relationship, and the plurality of second elongate mesh members 33 are arranged in a parallel relationship and in a cross relationship with the first mesh member 31.
於此具體態樣,第一和第二網狀元件31、33安排成正交關係。 In this particular aspect, the first and second mesh members 31, 33 are arranged in an orthogonal relationship.
於此具體態樣,第一和第二網狀元件31、33各延伸於相反方向,而與第二印刷孔洞17的縱軸呈傾斜角度θ1、θ2。於此具體態樣,第一和第二網狀元件31、33的傾斜角度θ1、θ2是相同的。 In this particular aspect, the first and second mesh members 31, 33 each extend in opposite directions and are at an oblique angle θ 1 , θ 2 to the longitudinal axis of the second printing aperture 17 . In this specific aspect, the inclination angles θ 1 and θ 2 of the first and second mesh members 31, 33 are the same.
於此具體態樣,網狀元件31、33具有約30微米的寬度d。 In this particular aspect, the mesh elements 31, 33 have a width d of about 30 microns.
於較佳具體態樣,網狀元件31、33具有從約15微米到約100微米的寬度d,可選擇而言從約15微米到約80微米,可選擇而言從約15微米到約60微米,可選擇而言從約15微米到約45微米。 In a preferred embodiment, the mesh members 31, 33 have a width d from about 15 microns to about 100 microns, alternatively from about 15 microns to about 80 microns, alternatively from about 15 microns to about 60. Micron, alternatively from about 15 microns to about 45 microns.
於此具體態樣,網狀元件31、33各具有約200微米的間距。 In this particular aspect, the mesh members 31, 33 each have a pitch of about 200 microns.
於較佳具體態樣,網狀元件31、33各具有從約100微米到約1000微米的間距,可選擇而言從約100微米到約800微米,可選擇而言從約100微米到約600微米,可選擇而言從約100微米到約400微米,可選 擇而言從約150微米到約300微米。 In a preferred embodiment, the mesh members 31, 33 each have a pitch of from about 100 microns to about 1000 microns, alternatively from about 100 microns to about 800 microns, alternatively from about 100 microns to about 600. Micron, optionally from about 100 microns to about 400 microns, optional Selectively from about 150 microns to about 300 microns.
於此具體態樣,第一和第二網狀元件31、33的傾斜角度θ1、θ2各是45度。 In this specific aspect, the inclination angles θ 1 and θ 2 of the first and second mesh members 31, 33 are each 45 degrees.
於較佳具體態樣,第一和第二網狀元件31、33的傾斜角度θ1、θ2是從約30度到約70度,可選擇而言從約35度到約65度。 In a preferred embodiment, the angles of inclination θ 1 , θ 2 of the first and second mesh members 31, 33 are from about 30 degrees to about 70 degrees, alternatively from about 35 degrees to about 65 degrees.
於此具體態樣,第一印刷孔洞15各具有與第二印刷孔洞17之個別次孔洞23的開放接合。這安排已經由本發明人所發現以在第一和第二印刷孔洞15、17之間提供顯著改善的連接性。 In this particular aspect, the first printing apertures 15 each have an open engagement with the individual apertures 23 of the second printing aperture 17. This arrangement has been discovered by the inventors to provide significantly improved connectivity between the first and second printing apertures 15, 17.
第二層9包括多個第一印刷孔洞41,於此具體態樣為平行、窄長的線性孔洞,其係第一層7之第一印刷孔洞15的對應物,在此一起界定太陽能電池的正面金屬化線條。為了容易示範,僅一個第一印刷孔洞41示範於圖2。 The second layer 9 comprises a plurality of first printing holes 41, which in this particular are parallel, narrow-length linear holes, which are the counterparts of the first printing holes 15 of the first layer 7, together defining the solar cells Front metallized lines. For ease of demonstration, only one first printing aperture 41 is illustrated in FIG.
第二層9進一步包括多個第二印刷孔洞43,於此具體態樣為長形孔洞,其延伸成與第一印刷孔洞41呈實質正交的關係,而為第一層7之第二印刷孔洞17的對應物,在此一起界定太陽能電池的正面匯流排棒。為了容易示範,僅一個第二印刷孔洞43示範於圖2。 The second layer 9 further includes a plurality of second printing holes 43, in this particular aspect being elongated holes extending in a substantially orthogonal relationship with the first printing aperture 41 and a second printing of the first layer 7. The counterparts of the holes 17 together define the front bus bar of the solar cell. For ease of demonstration, only one second printing aperture 43 is illustrated in FIG.
圖5(a)到(g)和6(a)到(g)示範依據本發明一具體態樣之上述模版3的製程。 5(a) to (g) and 6(a) to (g) illustrate the process of the above stencil 3 according to an embodiment of the present invention.
於第一步驟,如圖5(a)和(b)所示範,第一可光影像化層101施加到電形成設備的心軸103。於此具體態樣,可光影像化層101的厚度對應於所需模版3之第一和第二層7、9的組合厚度,在此厚度為100微米。 In a first step, as exemplified in Figures 5(a) and (b), a first photoimageable layer 101 is applied to a mandrel 103 of an electroforming apparatus. In this particular aspect, the thickness of the photoimageable layer 101 corresponds to the combined thickness of the first and second layers 7, 9 of the desired stencil 3, where the thickness is 100 microns.
於此具體態樣,可光影像化層101是由乾膜所形成,例如乾 膜阻劑,其層合於心軸103。 In this embodiment, the photo-imageable layer 101 is formed by a dry film, such as a dry film. A film resist laminated to the mandrel 103.
於第二步驟,如圖5(b)和6(b)所示範,第一層7的第一和第二印刷孔洞15、17和第二層9的第一印刷孔洞41透過圖案化遮罩來使可光影像化層101曝光而界定於可光影像化層101中,然後再後續移除未曝光的材料,而在暴露層101’中留下可以讓材料電形成在心軸103上的開放影像105。 In a second step, as exemplified in Figures 5(b) and 6(b), the first and second printing holes 15, 17 of the first layer 7, and the first printing holes 41 of the second layer 9 pass through the patterned mask. The photoimageable layer 101 is exposed to be exposed in the photoimageable layer 101, and then the unexposed material is subsequently removed, leaving an opening in the exposed layer 101' that allows the material to be electrically formed on the mandrel 103. Image 105.
於此具體態樣,雖然正在使用負阻劑,但是於其他具體態樣,或可使用正阻劑。 In this specific aspect, although a negative resist is being used, in other specific aspects, a positive resist may be used.
於替代性具體態樣,可光影像化層101或可藉由其直接寫入而曝露,例如以雷射工具來為之,然後再後續移除未曝光的材料。再次而言,於其他具體態樣,不是採用負阻劑,或可改為使用正阻劑。 In an alternative embodiment, the photoimageable layer 101 can be exposed by direct writing thereof, such as by a laser tool, and then subsequently removing the unexposed material. Again, in other specific aspects, a negative resist is not used, or a positive resist can be used instead.
於第三步驟,如圖5(c)和6(c)所示範,材料107(於此具體態樣為鎳)累積於暴露層101’的開放影像105中。持續著這電形成過程,直到沉積材料107具有第一層7所需厚度為止,於此具體態樣為50微米。 In a third step, as exemplified in Figures 5(c) and 6(c), material 107 (in this particular aspect nickel) is accumulated in the open image 105 of the exposed layer 101'. This electrical formation process continues until the deposited material 107 has the desired thickness of the first layer 7, which is 50 microns.
於第四步驟,如圖5(d)和6(d)所示範,第二可光影像化層111施加於暴露層101’。於此具體態樣,第二可光影像化層111具有50微米的厚度。 In a fourth step, as illustrated in Figures 5(d) and 6(d), a second photoimageable layer 111 is applied to the exposed layer 101'. In this particular aspect, the second photoimageable layer 111 has a thickness of 50 microns.
於此具體態樣,第二可光影像化層111是由乾膜所形成,例如乾膜阻劑,其施加到暴露層101’。 In this particular aspect, the second photoimageable layer 111 is formed of a dry film, such as a dry film resist, which is applied to the exposed layer 101'.
於此具體態樣,第二可光影像化層111包括預先圖案化的元件115,其尺寸和形狀對應於第二層9的第二印刷孔洞43,而對齊於第一層7的第二印刷孔洞17,後者已經由沉積材料107所界定。 In this particular aspect, the second photoimageable layer 111 includes a pre-patterned element 115 having a size and shape corresponding to the second printing aperture 43 of the second layer 9 and a second printing aligned with the first layer 7. The hole 17, which has been defined by the deposition material 107.
於第五步驟,如圖5(e)和6(e)所示範,第二可光影像化層111熱卷層合於暴露層101’,而使第二可光影像化層111符合暴露層101’的底下結構並且封閉其底下的開放影像105,以及後續暴露以提供第二暴露層111’。 In a fifth step, as illustrated in FIGS. 5(e) and 6(e), the second photoimageable layer 111 is thermally rolled to the exposed layer 101', and the second photoimageable layer 111 is conformed to the exposed layer. The underlying structure of 101' and encloses the underlying open image 105, and subsequent exposure to provide a second exposed layer 111'.
於第六步驟,如圖5(f)和6(f)所示範,材料115(於此具體態樣為鎳)累積於暴露層101’之剩餘的開放影像105中。持續這電形成過程,直到沉積材料115具有第二層9所需厚度為止,於此具體態樣為50微米。 In a sixth step, as exemplified in Figures 5(f) and 6(f), material 115 (in this particular aspect nickel) accumulates in the remaining open image 105 of the exposed layer 101'. This electroforming process is continued until the deposited material 115 has the desired thickness of the second layer 9, which is 50 microns.
於最後第七步驟,如圖5(g)和6(g)所示範,移除第一和第二暴露層101’、111’的材料,而留下電形成的模版3。 In the final seventh step, as exemplified in Figures 5(g) and 6(g), the materials of the first and second exposed layers 101', 111' are removed leaving the electroformed stencil 3.
於此具體態樣,在使用模版3時,可以沿著第一印刷孔洞15、41的長度來應用第一張力F1,並且可以跨越第一印刷孔洞15、41的寬度並且沿著第二印刷孔洞17、43的長度來應用第二張力F2。 In this particular aspect, when the stencil 3 is used, the first tension F 1 can be applied along the length of the first printing apertures 15, 41 and can span the width of the first printing apertures 15, 41 and along the second printing The length of the holes 17, 43 applies the second tension F 2 .
於此具體態樣,第一張力F1是第二張力F2的至少1.5倍,可選擇而言為至少1.75倍,可選擇而言為至少2倍。 In this particular aspect, the first tension F 1 is at least 1.5 times the second tension F 2 , alternatively at least 1.75 times, alternatively at least 2 times.
於此具體態樣,第二張力F2小於25牛頓,可選擇而言小於20牛頓,可選擇而言小於15牛頓,可選擇而言小於10牛頓。 In this particular aspect, the second tension F 2 is less than 25 Newtons, alternatively less than 20 Newtons, alternatively less than 15 Newtons, alternatively less than 10 Newtons.
於此具體態樣,第二張力F2大於2牛頓,可選擇而言大於5牛頓。 In this particular aspect, the second tension F 2 is greater than 2 Newtons, and optionally greater than 5 Newtons.
圖7示範使用上述具體態樣的模版3所印刷之正面金屬化線條201和正面匯流排棒203的接合。 Figure 7 illustrates the joining of the front metallization lines 201 and the front bus bar 203 printed using the stencil 3 of the above specific aspect.
如將所見,在正面金屬化線條201和正面匯流排棒203的接合是優異的,並且正面匯流排棒203是連續的而無缺陷。要求的是這經改 善的印刷是由第一層7之第二印刷孔洞17中的次孔洞23之往內漸薄的面25、27的操作所達成,其相信提供了集中壓力而作用成將印刷媒體驅動到位在第一層7之第二印刷孔洞17下方的第二層9之第二印刷孔洞43的體積裡,並且尤其作用在第一層7的第一印刷孔洞15和第二印刷孔洞17之次孔洞23的接合。 As will be seen, the joining of the front metallization line 201 and the front bus bar 203 is excellent, and the front bus bar 203 is continuous without defects. What is required is this change Good printing is achieved by the operation of the inwardly thinner faces 25, 27 of the secondary holes 23 in the second printing hole 17 of the first layer 7, which is believed to provide concentrated pressure to act to drive the printing media in place. The volume of the second printing hole 43 of the second layer 9 below the second printing hole 17 of the first layer 7, and particularly for the first printing hole 15 of the first layer 7 and the second hole 23 of the second printing hole 17 Engagement.
圖8示範的模版3具有在第一印刷孔洞15和第二印刷孔洞17的個別次孔洞23之間經修改的接合。如所可見,雖然第一印刷孔洞15和個別次孔洞23之間的接合是開放的,但是次孔洞23有不同的尺寸。 The stencil 3 exemplified in Fig. 8 has a modified joint between the first printing aperture 15 and the individual secondary apertures 23 of the second printing aperture 17. As can be seen, although the joint between the first printing aperture 15 and the individual secondary apertures 23 is open, the secondary apertures 23 are of different sizes.
圖9示範的模版3具有在第一印刷孔洞15和第二印刷孔洞17的個別次孔洞23之間的另一第一經修改的接合。如所可見,雖然第一印刷孔洞15和個別次孔洞23之間的接合是開放的,但是次孔洞23有不同的尺寸,並且第一印刷孔洞15具有與次孔洞23呈偏移或不對稱的關係。 The stencil 3 exemplified in Fig. 9 has another first modified joint between the first printing aperture 15 and the individual secondary apertures 23 of the second printing aperture 17. As can be seen, although the joint between the first printing hole 15 and the individual secondary holes 23 is open, the secondary holes 23 have different sizes, and the first printing hole 15 has an offset or asymmetry with the secondary hole 23. relationship.
圖10到12示範的印刷網版3是上述第一具體態樣之印刷網版3的修改版。 The printing screen 3 exemplified in Figures 10 through 12 is a modified version of the printing screen 3 of the first specific aspect described above.
本具體態樣的印刷網版3類似於上述具體態樣的印刷網版3,因此為了避免不必要的重複敘述,將僅詳細描述差異,而相同的部件是由相同的參考符號所指示。 The printing screen 3 of this embodiment is similar to the printing screen 3 of the specific aspect described above, and therefore, in order to avoid unnecessary repetitive description, only the differences will be described in detail, and the same components are denoted by the same reference numerals.
於此具體態樣,印刷網版3在網狀物21的安排上有所不同,其中次孔洞23包括長形孔洞,其延伸於印刷方向D。 In this particular aspect, the printing screen 3 differs in the arrangement of the webs 21, wherein the secondary holes 23 comprise elongated holes extending in the printing direction D.
於此具體態樣,第一網狀元件31具有與首先描述之具體態樣相同的間距,並且第二網狀元件33具有較大的間距,在此為五倍大於首先描述的具體態樣之間距。 In this particular aspect, the first mesh element 31 has the same pitch as the first described specific aspect, and the second mesh element 33 has a larger pitch, here five times greater than the specific aspect first described. spacing.
圖13示範使用上述具體態樣的模版3所印刷之正面金屬化線條301和正面匯流排棒303的接合。 Figure 13 illustrates the joining of the front metallization lines 301 and the front bus bar 303 printed using the stencil 3 of the above specific aspect.
如將所見,雖然在正面金屬化線條201和正面匯流排棒203之間的接合具有連續性,但是這連續性沒有缺陷,就如首先描述的具體態樣之模版3所達成的印刷。已經預期這具體態樣的模版3由於網狀元件31、33相對於第二印刷孔洞17的總面積而言減少了許多面積,而會產出優於首先描述的具體態樣之模版3的印刷;此技藝所理解的是網狀元件佔據的區域阻礙印刷效能,並且此技藝的做法是發展具有盡可能大之開放區域的印刷孔洞。首先描述的具體態樣之模版3所達成的結果和此技藝所理解的相反,因此非常驚人。 As will be seen, although the bond between the front metallization line 201 and the front bus bar 203 is continuous, there is no defect in this continuity, as is the printing achieved by the stencil 3 of the specific aspect first described. It has been expected that the stencil 3 of this specific aspect will have a reduced area due to the total area of the mesh members 31, 33 relative to the second printing hole 17, and will produce a printing of the stencil 3 which is superior to the specific aspect described first. It is understood by the art that the area occupied by the mesh element hinders printing performance, and the art practice is to develop printing holes having as large an open area as possible. The results achieved by the template 3 of the specific description first described are contrary to what is understood by the art, and are therefore very surprising.
最後,將了解本發明已經以其較佳具體態樣來描述,並且可以採許多不同的方式來修改,而不偏離本發明如所附請求項界定的範圍。 In the end, it will be appreciated that the invention has been described in its preferred embodiments, and may be modified in many different ways without departing from the scope of the invention as defined by the appended claims.
舉例而言,雖然上述具體態樣的模版3已經發展成允許將單一印刷操作用於印刷正面金屬化線條和匯流排棒,但是於替代性具體態樣,或可採用雙重印刷過程,其中一模版3a用於一印刷操作而包括第一印刷孔洞15、41,並且另一模版3b用於另一印刷操作而包括第二印刷孔洞17、43。因此,在分開的印刷操作中使用這二個模版3a、3b則允許印刷正面金屬化線條和匯流排棒二者。如上所注意,在使用具有第一印刷孔洞15、41的模版3a時,可以沿著第一印刷孔洞15、41的長度來應用實質較大的張力。 For example, although the stencil 3 of the above specific aspect has been developed to allow a single printing operation to be used to print the front metallization lines and the bus bar, in an alternative embodiment, a dual printing process may be employed, one of which is a template 3a is used for a printing operation to include the first printing holes 15, 41, and the other stencil 3b is used for another printing operation to include the second printing holes 17, 43. Thus, the use of these two stencils 3a, 3b in separate printing operations allows for the printing of both front metallization lines and bus bar. As noted above, when using the stencil 3a having the first printing apertures 15, 41, substantially greater tension can be applied along the length of the first printing apertures 15, 41.
Claims (53)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1318968.3A GB2521344A (en) | 2013-10-27 | 2013-10-27 | Printing screens, methods of fabricating the same and methods of screen printing |
??1318968.3 | 2013-10-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201536565A TW201536565A (en) | 2015-10-01 |
TWI652179B true TWI652179B (en) | 2019-03-01 |
Family
ID=49767221
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103136987A TWI652179B (en) | 2013-10-27 | 2014-10-27 | Printing screens, methods of fabricating the same and methods of screen printing |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP3060401A2 (en) |
CN (1) | CN105658433B (en) |
GB (1) | GB2521344A (en) |
SG (2) | SG10201803319QA (en) |
TW (1) | TWI652179B (en) |
WO (1) | WO2015059307A2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017222079A (en) * | 2016-06-15 | 2017-12-21 | 株式会社コベルコ科研 | Metal foil for screen printing, and screen printing plate including the same |
JP2018154028A (en) * | 2017-03-17 | 2018-10-04 | 株式会社コベルコ科研 | Line pattern printing method and screen printing plate for line pattern printing |
CN109878197B (en) * | 2019-03-15 | 2020-11-03 | 河南理工大学 | Preparation method of metal printing template |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010247534A (en) | 2009-03-27 | 2010-11-04 | Toppan Printing Co Ltd | Method for printing and method for manufacturing printed material |
CN201824658U (en) | 2009-06-09 | 2011-05-11 | Nb科技股份有限公司 | Silk screen forme |
CN103171262A (en) | 2011-12-23 | 2013-06-26 | 昆山允升吉光电科技有限公司 | Solar energy battery electrode printing screen plate |
CN103171244A (en) | 2011-12-23 | 2013-06-26 | 昆山允升吉光电科技有限公司 | Method for manufacturing double-layer solar energy printing screen |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5258606A (en) * | 1975-11-07 | 1977-05-14 | Hitachi Ltd | Printing metal mask |
JP2005219381A (en) * | 2004-02-06 | 2005-08-18 | Nitto Denko Corp | Mask for screen printing and method for manufacturing wiring circuit board using the same |
DE202005007549U1 (en) * | 2005-05-12 | 2005-08-18 | Cadilac Laser Gmbh Cad Industrial Lasercutting | Printing template, especially for use in production of circuit support on ceramic or printed circuit boards and/o for component mounting in circuit boards |
DE102007059794A1 (en) * | 2007-12-11 | 2009-06-25 | Nb Technologies Gmbh | Stencil for screen printing method, has plane stencil body with stencil thickness, where individual carrier net is provided at scraper side and at opposite substrate side through layout recesses till specified depth |
DE102009052647A1 (en) * | 2009-11-10 | 2011-05-12 | Manz Automation Ag | Printing block system for use in screen printing machine for metallization of solar cells, has printing block with openings representing part of metallization pattern, where openings sectionally overlap other openings of another block |
CN201856441U (en) * | 2010-10-26 | 2011-06-08 | 宁波升日太阳能电源有限公司 | Screen plate used for printing silicon solar battery electrode |
JP5871159B2 (en) * | 2011-11-22 | 2016-03-01 | 株式会社村田製作所 | Screen printing version |
CN103223768B (en) * | 2012-01-31 | 2015-01-14 | 彰绅精密工业股份有限公司 | Metal printing template with different diaphragm thicknesses formed by single printing |
JP2013191793A (en) * | 2012-03-15 | 2013-09-26 | Sharp Corp | Screen printing plate, method of manufacturing solar battery, and solar battery |
-
2013
- 2013-10-27 GB GB1318968.3A patent/GB2521344A/en not_active Withdrawn
-
2014
- 2014-10-27 EP EP14792444.3A patent/EP3060401A2/en not_active Withdrawn
- 2014-10-27 WO PCT/EP2014/072964 patent/WO2015059307A2/en active Application Filing
- 2014-10-27 SG SG10201803319QA patent/SG10201803319QA/en unknown
- 2014-10-27 SG SG11201601178UA patent/SG11201601178UA/en unknown
- 2014-10-27 TW TW103136987A patent/TWI652179B/en not_active IP Right Cessation
- 2014-10-27 CN CN201480048833.3A patent/CN105658433B/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010247534A (en) | 2009-03-27 | 2010-11-04 | Toppan Printing Co Ltd | Method for printing and method for manufacturing printed material |
CN201824658U (en) | 2009-06-09 | 2011-05-11 | Nb科技股份有限公司 | Silk screen forme |
CN103171262A (en) | 2011-12-23 | 2013-06-26 | 昆山允升吉光电科技有限公司 | Solar energy battery electrode printing screen plate |
CN103171244A (en) | 2011-12-23 | 2013-06-26 | 昆山允升吉光电科技有限公司 | Method for manufacturing double-layer solar energy printing screen |
Also Published As
Publication number | Publication date |
---|---|
WO2015059307A3 (en) | 2015-06-18 |
CN105658433A (en) | 2016-06-08 |
SG11201601178UA (en) | 2016-05-30 |
GB201318968D0 (en) | 2013-12-11 |
CN105658433B (en) | 2019-06-04 |
TW201536565A (en) | 2015-10-01 |
WO2015059307A2 (en) | 2015-04-30 |
EP3060401A2 (en) | 2016-08-31 |
GB2521344A (en) | 2015-06-24 |
SG10201803319QA (en) | 2018-05-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI652179B (en) | Printing screens, methods of fabricating the same and methods of screen printing | |
JP6086305B2 (en) | Vapor deposition mask manufacturing method and vapor deposition mask | |
JP4996902B2 (en) | Metal sieve material and method for producing the same | |
US8956962B2 (en) | Method for fabricating large-area nanoscale pattern | |
JP6631897B2 (en) | Manufacturing method of evaporation mask and evaporation mask | |
US9340005B2 (en) | Gravure printing plate and manufacturing method thereof, gravure printing machine, and manufacturing method for laminated ceramic electronic component | |
TW200901278A (en) | Method of fabricating pattern in semiconductor device using spacer | |
TWI665715B (en) | Method for patterning a substrate using a layer with multiple materials | |
TW201834003A (en) | Method for self-aligned cutting of single fins | |
JP2007118589A (en) | Metal mask screen plate and its manufacturing method | |
TW200534296A (en) | Method of making thin-film chip resistor | |
KR20060040099A (en) | Printing plate | |
TWI643023B (en) | Mesh member for screen printing and screen printing plate | |
JP4909912B2 (en) | Pattern formation method | |
US9718267B2 (en) | Screen printing apparatus including support bars, and methods of using same | |
KR100602912B1 (en) | Method for manufacturing conductive pattern | |
JP6282466B2 (en) | Metal mask for screen printing and manufacturing method thereof | |
TWI573209B (en) | Conductive ball fixing mask and manufacturing method thereof | |
JP5697830B2 (en) | Screen printing plate and screen printing device | |
TWI588031B (en) | Composite stencil | |
JP6377416B2 (en) | Screen printing version | |
JP2006095803A (en) | Gravure printing press and manufacturing method of multilayer ceramic electronic component | |
JP2018161805A (en) | Screen printing plate | |
JP5486219B2 (en) | Photoresist patterning inspection method | |
JPWO2023204295A5 (en) | Exposure method, vapor deposition mask manufacturing method, and exposure device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |