TWI650756B - Erasing method used in flash memory - Google Patents

Erasing method used in flash memory Download PDF

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TWI650756B
TWI650756B TW107112482A TW107112482A TWI650756B TW I650756 B TWI650756 B TW I650756B TW 107112482 A TW107112482 A TW 107112482A TW 107112482 A TW107112482 A TW 107112482A TW I650756 B TWI650756 B TW I650756B
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memory
transistor
segment
erased
block
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TW107112482A
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TW201944422A (en
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陳致豪
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晶豪科技股份有限公司
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Abstract

一種快閃記憶體之抹除方法係例示如下,其中快閃記憶體包含至少一記憶區塊,記憶區塊被分為複數個記憶區段。依據區段致能訊號驗證對應於一位址的記憶區塊或記憶區段是否具有至少一抹除不足之電晶體記憶單元,其中區段使能信號係依據記憶區塊是否具有至少一過度抹除之電晶體記憶單元而被確定。若對應於此位址的記憶區塊或記憶區段具有抹除不足之電晶體記憶單元,依據區段致能訊號抹除記憶區塊或記憶區段之電晶體記憶單元。 A method of erasing a flash memory is exemplified as follows, wherein the flash memory includes at least one memory block, and the memory block is divided into a plurality of memory segments. Determining, according to the segment enable signal, whether the memory block or the memory segment corresponding to the one address has at least one erased memory cell, wherein the segment enable signal is based on whether the memory block has at least one over-erase The transistor memory cell is determined. If the memory block or the memory segment corresponding to the address has an insufficient memory cell, the memory cell of the memory block or the memory segment is erased according to the segment enable signal.

Description

用於快閃記憶體之抹除方法 Wiping method for flash memory

本發明係關於一種快閃記憶體,更特別地是關於一種用於快閃記憶體之抹除方法。 This invention relates to a flash memory, and more particularly to an erase method for flash memory.

快閃記憶體包括多個個別的金屬氧化物半導體(MOS)場效應電晶體記憶單元,每個電晶體記憶單元包括源極、汲極、浮動閘極和控制閘極。電晶體記憶單元之上述多個電極可被施加各種電壓,以對電晶體記憶單元進行程式化(即寫入)為二進位的1或0,抹除作為記憶區塊的所有電晶體記憶單元,讀取電晶體記憶單元,驗證電晶體記憶單元被抹除,或驗證電晶體記憶單元沒有被過度抹除。 The flash memory includes a plurality of individual metal oxide semiconductor (MOS) field effect transistor memory cells, each transistor memory cell including a source, a drain, a floating gate, and a control gate. The plurality of electrodes of the transistor memory unit can be applied with various voltages to program (ie, write) the transistor memory cells into binary ones or zeros, and erase all of the transistor memory cells as memory blocks. Read the transistor memory unit, verify that the transistor memory unit is erased, or verify that the transistor memory unit has not been over erased.

如下描述過度抹除之電晶體記憶單元之漏電流的不良影響。在典型的快閃記憶體中,大量電晶體記憶單元的汲極,例如512個電晶體記憶單元連接到每一位元線。如果位元線上的大量電晶體記憶單元正在抽取背景漏電流,則位元線上的總漏電流可能超過單元讀取電流。這使得位元線上的任何電晶體記憶單元的狀態不能被讀取,並因此使快閃記憶體不能運作。 The adverse effects of the leakage current of the over-erased transistor memory cell are described as follows. In a typical flash memory, a large number of transistors of a transistor memory cell, such as 512 transistor memory cells, are connected to each bit line. If a large number of transistor memory cells on the bit line are extracting background leakage current, the total leakage current on the bit line may exceed the cell read current. This prevents the state of any of the transistor memory cells on the bit line from being read and thus rendering the flash memory inoperable.

請參考圖1,圖1為習知抹除方法的流程圖。快閃記憶體包括記憶模組以及電性連接記憶模組的記憶管理裝置,其中記憶模組具有多個記憶體組(memory bank),各記憶體組包含多個記憶區塊,且記憶管理裝置用以對記憶體組的記憶區塊執行抹除方法。 Please refer to FIG. 1. FIG. 1 is a flow chart of a conventional erasing method. The flash memory includes a memory module and a memory management device electrically connected to the memory module, wherein the memory module has a plurality of memory banks, each memory group includes a plurality of memory blocks, and the memory management device Used to perform an erase method on the memory block of the memory group.

於步驟S11,對記憶管理裝置對記憶模組之所有電晶體記體單元進行驗證及預寫入的操作。接著,於步驟S12,記憶管理裝置驗證及抹除作為記憶區塊的所有電晶體記憶單元,也就是說,抹除之單位是一個記憶區塊。最後地,為了避免過度抹除之電晶體記體單元的漏電流造成快閃記憶體不能運作,於步驟S13,記憶管理裝置驗證記憶模組之所有複數個電晶體記體單元,以及當驗證結果顯示至少一過度抹除之電晶體記體單元存在於記憶區塊時,對記憶模組的過度抹除之電晶體記憶單元進行過度抹除之校正。 In step S11, the memory management device performs an operation of verifying and pre-writing all of the transistor body units of the memory module. Next, in step S12, the memory management device verifies and erases all of the transistor memory cells as memory blocks, that is, the erased unit is a memory block. Finally, in order to avoid the flash memory of the over-erased transistor body unit, the flash memory cannot operate, and in step S13, the memory management device verifies all of the plurality of transistor body units of the memory module, and when the verification result When the at least one over-erased transistor body unit is present in the memory block, the over-erasing of the memory module is over-erased.

詳細而言,步驟S12包含步驟S121至S124。於步驟S121,記憶管理裝置驗證對應於一位址的記憶區塊之電晶體記憶單元。然後,於步驟S122,若驗證結果顯示記憶區塊之至少一電晶體記憶單元為抹除不足(under-erased)(即驗證結果顯示此記憶區塊的抹除驗證失敗),記憶管理裝置將會執行步驟S124;否則,記憶管理裝置將會執行步驟S123。 In detail, step S12 includes steps S121 to S124. In step S121, the memory management device verifies the transistor memory unit corresponding to the memory block of the address. Then, in step S122, if the verification result indicates that at least one of the transistor memory cells of the memory block is under-erased (ie, the verification result indicates that the erase verification of the memory block fails), the memory management device will Step S124 is performed; otherwise, the memory management device will perform step S123.

接著,由於記憶區塊之至少一電晶體記憶單元為抹除不足,於步驟S124,記憶管理裝置將抹除擊發(erasing shot)注入於記憶區塊之電晶體記憶單元(即抹除記憶區塊之電晶體記憶單元),以改變記憶區塊之電晶體記憶單元的閥值電壓(即令記憶區塊之電晶體記憶單元被抹除)。接著,步驟S121將會再次執行。然後,若於步驟S122確定了記憶區塊之電晶體記憶單元被抹除之時,步驟S123將會被執行。於步驟S123,記憶管理裝置檢查此位址是否最大位址(即所有記憶區塊之電晶體記憶單元被抹除)。若此位址不是最大位址,步驟S125將會被執行;否則,步驟S13將會被執行。於步驟S125,記憶管理裝置將此位址加上一增量,然後,步驟S121被執行。 Then, since at least one of the transistor memory cells of the memory block is insufficiently erased, in step S124, the memory management device injects an erasing shot into the transistor memory unit of the memory block (ie, erases the memory block). The transistor memory cell) is used to change the threshold voltage of the transistor memory cell of the memory block (ie, the transistor memory cell of the memory block is erased). Then, step S121 will be executed again. Then, if it is determined in step S122 that the transistor memory cell of the memory block is erased, step S123 will be performed. In step S123, the memory management device checks whether the address is the largest address (ie, the memory cells of all the memory blocks are erased). If the address is not the largest address, step S125 will be performed; otherwise, step S13 will be executed. In step S125, the memory management device adds an increment to the address, and then step S121 is executed.

值得注意的是,當較慢抹除的電晶體記憶單元的位元線具有較大的位元線漏電流時,於步驟S13中位元線漏電流恢復後,抹除閥值電壓將變高。同時,更多的過度抹除的電晶體記憶單元將遭受長時間的過度抹除校正時間。 It is worth noting that when the bit line of the slow erased transistor memory cell has a large bit line leakage current, the erase threshold voltage will become higher after the bit line leakage current is restored in step S13. . At the same time, more over-erased transistor memory cells will suffer from long over-erase correction times.

與上述驗證和抹除記憶區塊中所有電晶體記憶單元的做法不同,對於每個記憶區塊,另一種習知抹除方法可以僅抹除記憶區段之電晶體記憶單元中具有之抹除不足之電晶體記憶單元。請參考圖2,圖2為另一執行於記憶區塊之習知抹除方法的示意圖。記憶區塊2被分成幾個記憶區段G1到G15,並且多個旗標暫存器被分別用於記憶區段G1到G15,以記錄記憶區段G1到G15中的所有電晶體記憶單元是否被抹除。 Different from the above method of verifying and erasing all the transistor memory cells in the memory block, for each memory block, another conventional erasing method can erase only the memory cells in the memory segment. Insufficient transistor memory unit. Please refer to FIG. 2. FIG. 2 is a schematic diagram of another conventional erase method performed on a memory block. The memory block 2 is divided into several memory sections G1 to G15, and a plurality of flag registers are used for the memory sections G1 to G15, respectively, to record whether or not all of the transistor memory cells in the memory sections G1 to G15 are recorded. Was erased.

如圖2所示,所有記憶區段G1到G15初始時具有抹除不足之電晶體記憶單元,並因此將抹除擊發注入於記憶區段G1到G15之電晶體記憶單元(即抹除記憶區塊2之電晶體記憶單元)。然後,驗證記憶區塊2之所有電晶體記憶單元2,例如記憶區段G3沒有抹除不足之電晶體記憶單元,且對應於記憶區段G3的旗標暫存器記錄其狀態為已抹除狀態。由此,將抹除擊發注入於記憶區段G1、G2、G4到G15之電晶體記憶單元(即抹除記憶區段G1、G2、G4到G15之電晶體記憶單元)。 As shown in FIG. 2, all of the memory segments G1 to G15 initially have a plasma memory cell with insufficient erase, and thus inject the erase firing into the transistor memory cells of the memory segments G1 to G15 (ie, erase the memory region). Block 2 transistor memory unit). Then, it is verified that all the transistor memory cells 2 of the memory block 2, for example, the memory segment G3, have not erased the insufficient transistor memory cells, and the flag register corresponding to the memory segment G3 records the state as erased. status. Thereby, the erase firing is injected into the transistor memory cells of the memory segments G1, G2, G4 to G15 (i.e., the transistor memory cells that erase the memory segments G1, G2, G4 to G15).

接著,再次驗證記憶區塊2之所有電晶體記憶單元,例如記憶區段G1、G3、G4到G15沒有抹除不足之電晶體記憶單元,且對應於記憶區段G1、G3、G4到G15的旗標暫存器記錄其狀態為已抹除狀態。故此,將抹除擊發注入於記憶區段G2之電晶體記憶單元(即抹取記憶區段G2之電晶體記憶單元)。此習知抹除方法需要複數個額外的旗標暫存器並且耗費更多抹除驗證時間。 Then, all the transistor memory cells of the memory block 2 are verified again, for example, the memory segments G1, G3, G4 to G15 are not erased by the insufficient transistor memory cells, and correspond to the memory segments G1, G3, G4 to G15. The flag register records its status as erased. Therefore, the eraser is injected into the transistor memory unit of the memory section G2 (i.e., the transistor memory unit of the erase memory section G2). This conventional erase method requires a plurality of additional flag registers and consumes more erase verification time.

本揭露之一目的在於提供一種用於一快閃記憶體之抹除方法,此抹除方法不需要額外的多個旗標暫存器,且不需耗費更多的抹除驗證時間。 It is an object of the present disclosure to provide an erase method for a flash memory that does not require an additional plurality of flag registers and does not require more erase verify time.

本揭露之另一目的在於提供一種快閃記憶體,以執行上述抹除方法。 Another object of the present disclosure is to provide a flash memory to perform the above erase method.

為了達成至少上述目的,本揭露提供一種用於快閃記憶體之抹除方法。快閃記憶體包含至少一記憶區塊,記憶區塊被分為複數個記憶區段。抹除方法係例示如下。依據區段致能訊號驗證對應於一位址的記憶區塊或記憶區段是否具有至少一抹除不足之電晶體記憶單元,其中區段使能信號係依據記憶區塊是否具有至少一過度抹除之電晶體記憶單元而被確定。若對應於此位址的記憶區塊或記憶區段具有抹除不足之電晶體記憶單元,依據區段致能訊號抹除記憶區塊或記憶區段之電晶體記憶單元。 In order to achieve at least the above objects, the present disclosure provides an erasing method for flash memory. The flash memory includes at least one memory block, and the memory block is divided into a plurality of memory segments. The erasing method is exemplified as follows. Determining, according to the segment enable signal, whether the memory block or the memory segment corresponding to the one address has at least one erased memory cell, wherein the segment enable signal is based on whether the memory block has at least one over-erase The transistor memory cell is determined. If the memory block or the memory segment corresponding to the address has an insufficient memory cell, the memory cell of the memory block or the memory segment is erased according to the segment enable signal.

為了達成至少上述目的,本揭露提供一種快閃記憶體,其包括:記憶模組及記憶管理裝置。記憶模組包含至少一記憶區塊,記憶區塊被分為複數個記憶區段。記憶管理裝置電性連接於記憶模組。記憶管理裝置依據區段致能訊號驗證對應於一位址的記憶區塊或記憶區段是否具有至少一抹除不足之電晶體記憶單元,其中區段致能訊號係依據記憶區塊是否具有至少一過度抹除之電晶體記憶單元而被確定。若對應於此位址的記憶區塊或記憶區段具有抹除不足之電晶體記憶單元,記憶管理裝置依據區段致能訊號抹除記憶區塊或記憶區段之電晶體記憶單元。 In order to achieve at least the above objects, the present disclosure provides a flash memory including: a memory module and a memory management device. The memory module includes at least one memory block, and the memory block is divided into a plurality of memory segments. The memory management device is electrically connected to the memory module. The memory management device verifies, according to the segment enable signal, whether the memory block or the memory segment corresponding to the one address has at least one erased memory cell, wherein the segment enable signal is based on whether the memory block has at least one It is determined by over-wiping the transistor memory cell. If the memory block or the memory segment corresponding to the address has an insufficient memory cell, the memory management device erases the memory cell of the memory block or the memory segment according to the segment enable signal.

於本揭露之一實施例中,若區段致能訊號被設為主動狀態(asserted)且對應於此位址的記憶區段具有抹除不足之電晶體記憶單元,記憶區段 之等電晶體記憶單元將被注入抹除擊發(erasing shot)至少一次直至記憶區段不具有抹除不足之電晶體記憶單元。 In an embodiment of the present disclosure, if the segment enable signal is asserted and the memory segment corresponding to the address has an erased memory cell, the memory segment The transistor memory cell will be implanted with an erasing shot at least once until the memory segment has no erase memory cells.

於本揭露之一實施例中,若記憶區段不具有抹除不足之電晶體記憶單元,位址將被加上一增量,且之後若對應於此位址的另一記憶區段具有至少一抹除不足之電晶體記憶單元,另一記憶區段之電晶體記憶單元將被注入抹除擊發至少一次直至此另一記憶區段不具有抹除不足之電晶體記憶單元。 In an embodiment of the present disclosure, if the memory segment does not have a transistor memory cell with insufficient erase, the address will be incremented by an increment, and then if another memory segment corresponding to the address has at least Once the insufficient transistor memory cell is erased, the transistor memory cell of the other memory segment will be injected and erased at least once until the other memory segment does not have the erased memory cell.

於本揭露之一實施例中,當此位址達至最大位址時,驗證記憶區塊是否具有過度抹除之電晶體記憶單元,且若於記憶區塊中具有過度抹除之電晶體記憶單元,對過度抹除之電晶體記憶單元進行過度抹除之校正。 In an embodiment of the present disclosure, when the address reaches the maximum address, it is verified whether the memory block has an over-erased transistor memory unit, and if there is excessive erasure of the transistor memory in the memory block Unit, the over-erasing correction of the over-erased transistor memory cell.

於本揭露之一實施例中,在驗證及抹除記憶區塊之電晶體記憶單元之前,對記憶區塊之電晶體記憶單元進行驗證及預寫入動作(pre-programing)。 In one embodiment of the present disclosure, the transistor memory cells of the memory block are verified and pre-programmed prior to verifying and erasing the memory cell of the memory block.

於本揭露之一實施例中,區段致能訊號係初始地被設為非主動狀態(de-asserted),若對應於此位址的記憶區塊具有抹除不足之電晶體記憶單元,記憶區塊之電晶體記憶單元將會被注入一抹除擊發至少一次直至記憶區塊被驗證出具有過度抹除之電晶體記憶單元。 In an embodiment of the disclosure, the segment enable signal is initially set to be de-asserted, and if the memory block corresponding to the address has an erased memory cell, the memory The transistor memory cell of the block will be injected with a wipe memory at least once until the memory block is verified to have an over-erased transistor memory cell.

於本揭露之一實施例中,當記憶區塊被驗證出具有過度抹除之電晶體記憶單元時,過度抹除之校正擊發(over-erased correction shot)被注入至過度抹除之電晶體記憶單元,且區段致能訊號被設定為主動狀態。 In one embodiment of the present disclosure, when the memory block is verified to have an over-erased transistor memory cell, an over-erased correction shot is injected into the over-erased transistor memory. The unit, and the section enable signal is set to the active state.

總而言之,本發明實施例提供的抹除方法不需要額外的多個旗標暫存器以記錄記憶區段之狀態,且不需耗費更多的抹除驗證時間。 In summary, the erasing method provided by the embodiment of the present invention does not require an additional plurality of flag registers to record the state of the memory segment, and does not require more erasure verification time.

S11~S13‧‧‧步驟 S11~S13‧‧‧Steps

S121~S125‧‧‧步驟 S121~S125‧‧‧Steps

G1~G15‧‧‧記憶區段 G1~G15‧‧‧ memory section

S31~S33‧‧‧步驟 S31~S33‧‧‧Steps

S321~S329‧‧‧步驟 S321~S329‧‧‧Steps

〔圖1〕係為習知抹除方法的流程圖。 [Fig. 1] is a flow chart of a conventional erasing method.

〔圖2〕係為另一執行於記憶區塊之習知抹除方法的示意圖。 [Fig. 2] is a schematic diagram of another conventional erasing method performed on a memory block.

〔圖3〕係為依據本揭露之一實施例的用於快閃記憶體之抹除方法的流程圖。 FIG. 3 is a flow chart of a method for erasing a flash memory according to an embodiment of the present disclosure.

為充分瞭解本發明之目的、特徵及功效,茲藉由下述具體之實施例,並配合所附之圖式,對本發明做詳細說明,說明如後。 In order to fully understand the objects, features and advantages of the present invention, the present invention will be described in detail by the accompanying drawings.

本揭露之一實施例提供一種用於快閃記憶體之抹除方法,於驗證及抹除步驟中,於抹除擊發(erasing shot)被注入於記憶區塊之所有電晶體記憶單元(即抹除記憶區塊之所有電晶體記憶單元)之後,所提供之抹除方法會驗證記憶區塊是否具有至少一過度抹除之電晶體記體單元。當記憶區塊具有至少一過度抹除之電晶體記體單元時,所提供之抹除方法將此抹除擊發注入於記憶區段之複數個電晶體記憶單元(即抹除記憶區段之所有電晶體記憶單元),然後,所提供之抹除方法驗證記憶區段之所有電晶體記憶單元是否被抹除。所提供之抹除方法抹除記憶區段之複數個電晶體記憶單元至少一次直至記憶區段之所有電晶體記憶單元都被抹除。接著,所提供之抹除方法抹除在相同記憶區塊中之另一記憶區段之複數個電晶體記憶單元至少一次直至此另一記憶區段之複數個電晶體記憶單元被抹除。當在記憶區塊中之此另一記憶區段之所有電晶體記憶單元被抹除時,將會對再另一記憶區塊執行相似的抹除方案。因此,所提供之抹除方法不需要額外的多個旗標暫存器以記錄記憶區段之狀態,且不需耗費更多的抹除驗證時間。 An embodiment of the present disclosure provides an erasing method for a flash memory in which all of the transistor memory cells (ie, wipes) are injected into the memory block during the verifying and erasing steps. After all of the transistor memory cells of the memory block, the erase method provided verifies whether the memory block has at least one over-erased transistor body unit. When the memory block has at least one over-erased transistor body unit, the erase method is provided to inject the erased shot into the plurality of transistor memory cells of the memory segment (ie, erase all of the memory segments) The transistor memory unit) then provides an erase method to verify that all of the transistor memory cells of the memory segment are erased. The erase method provided erases the plurality of transistor memory cells of the memory segment at least once until all of the transistor memory cells of the memory segment are erased. Next, the erase method is provided to erase a plurality of transistor memory cells of another memory segment in the same memory block at least once until a plurality of transistor memory cells of the other memory segment are erased. When all of the transistor memory cells of the other memory segment in the memory block are erased, a similar erase scheme will be performed for the other memory block. Therefore, the erase method provided does not require an additional plurality of flag registers to record the state of the memory segment and does not require more erase verify time.

請參考圖3,圖3為依據本揭露之一實施例的用於快閃記憶體之抹除方法的流程圖。快閃記憶體(未顯示於圖式中)包括記憶模組及電性連接於記憶模組的記憶管理裝置。其中記憶模組包括複數個記憶體組,各記憶體組包含複數個記憶區塊,各記憶區塊被分為複數個記憶區段。例如,記憶區塊具有64K位元組(即64*8K位元),以及記憶區段具有4K位元組(即4*8K位元)。然而,本揭露不受上述之例子的限制。 Please refer to FIG. 3. FIG. 3 is a flowchart of a method for erasing a flash memory according to an embodiment of the present disclosure. The flash memory (not shown) includes a memory module and a memory management device electrically connected to the memory module. The memory module includes a plurality of memory groups, each memory group includes a plurality of memory blocks, and each memory block is divided into a plurality of memory segments. For example, the memory block has 64K bytes (ie, 64*8K bits), and the memory segment has 4K bytes (ie, 4*8K bits). However, the disclosure is not limited by the examples described above.

於步驟S31,記憶管理裝置對記憶模組之複數個電晶體記體單元進行驗證及預寫入的操作。然後,於步驟S32(即抹除及驗證步驟),記憶管理裝置驗證及抹除記憶模組之複數個電晶體記體單元。應注意的是,於步驟S32,所提供之抹除方法,可以基於過度抹除之校正擊發(over-erased correction shot)是否被注入至此記憶區塊之電晶體記憶單元(即記憶區塊是否具有至少一過度抹除之電晶體記體單元)而抹除記憶區塊或記憶區段之等電晶體記憶單元。最後,為了避免過度抹除之電晶體記體單元的漏電流導致快閃記憶體不能運作,於步驟S33,記憶管理裝置驗證記憶模組之所有電晶體記體單元以及對記憶模組的過度抹除之電晶體記憶單元進行過度抹除之校正。 In step S31, the memory management device performs an operation of verifying and pre-writing a plurality of transistor body units of the memory module. Then, in step S32 (ie, the erasing and verifying step), the memory management device verifies and erases the plurality of transistor body units of the memory module. It should be noted that, in step S32, the erase method provided may be based on whether an over-erased correction shot is injected into the transistor memory unit of the memory block (ie, whether the memory block has The at least one erased transistor cell unit is erased to erase the isoelectric memory cell of the memory block or the memory segment. Finally, in order to avoid the excessively erased leakage current of the transistor body unit, the flash memory cannot be operated. In step S33, the memory management device verifies all the transistor body units of the memory module and the excessive wipe of the memory module. In addition to the transistor memory unit, the correction is performed by over-erasing.

詳細而言,步驟S32包括步驟S321至S329。於步驟S321,記憶管理裝置驗證對應於一位址的記憶區塊或記憶區段之電晶體記憶單元是否被抹除以產生驗證結果。當對應於此記憶區塊的區段致能訊號SEC_EN被設為主動狀態,記憶區段之電晶體記憶單元係被驗證;以及,當對應於此記憶區塊的區段致能訊號SEC_EN被設為非主動狀態,記憶區塊之電晶體記憶單元被驗證,其中對應於此記憶區塊的區段致能訊號SEC_EN係依據記憶區塊是否具有至少一過度抹除之電晶體記憶單元而被確定。若記憶區塊或記憶區段具有至少一抹除不 足之電晶體記憶單元,記憶管理裝置將確定驗證結果為失敗;以及,若記憶區塊或記憶區段不具有至少一抹除不足之電晶體記憶單元,記憶管理裝置確定驗證結果為通過。 In detail, step S32 includes steps S321 to S329. In step S321, the memory management device verifies whether the transistor memory unit corresponding to the memory block or the memory segment of the address is erased to generate a verification result. When the segment enable signal SEC_EN corresponding to the memory block is set to the active state, the transistor memory unit of the memory segment is verified; and when the segment enable signal SEC_EN corresponding to the memory block is set In the inactive state, the memory cell of the memory block is verified, wherein the segment enable signal SEC_EN corresponding to the memory block is determined according to whether the memory block has at least one over-erased transistor memory unit. . If the memory block or the memory segment has at least one erase The memory management unit of the foot, the memory management device will determine that the verification result is a failure; and if the memory block or the memory segment does not have at least one erased memory cell, the memory management device determines that the verification result is a pass.

於步驟S322,記憶管理裝置檢查驗證結果是否為失敗或通過。若驗證結果為失敗,步驟S323將會被執行;否則,步驟S328將會被執行。於步驟S323,記憶管理裝置依據對應於此記憶區塊的區段致能訊號SEC_EN,將此抹除擊發注入於記憶區塊或記憶區段之複數個電晶體記憶單元。若對應於此記憶區塊的區段致能訊號SEC_EN被設為主動狀態,記憶管理裝置將此抹除擊發注入於記憶區塊之複數個電晶體記憶單元;否則,記憶管理裝置此抹除擊發注入於記憶區段之複數個電晶體記憶單元。 In step S322, the memory management device checks if the verification result is a failure or a pass. If the verification result is a failure, step S323 will be executed; otherwise, step S328 will be executed. In step S323, the memory management device injects the erased shot into the plurality of transistor memory units of the memory block or the memory segment according to the segment enable signal SEC_EN corresponding to the memory block. If the segment enable signal SEC_EN corresponding to the memory block is set to the active state, the memory management device injects the erase firing into the plurality of transistor memory units of the memory block; otherwise, the memory management device erases the firing A plurality of transistor memory cells injected into the memory segment.

於步驟S324,記憶管理裝置檢查對應於此記憶區塊的區段致能訊號SEC_EN是否被設為主動狀態。若對應於此記憶區塊的區段致能訊號SEC_EN被設為主動狀態,步驟S321將會被執行;否則,步驟S325將會被執行。於步驟S325,記憶管理裝置驗證記憶區塊是否具有至少一過度抹除之電晶體記體單元,以及當記憶區塊具有至少一過度抹除之電晶體記體單元時,對記憶區塊之電晶體記憶單元進行過度抹除之校正。 In step S324, the memory management device checks whether the segment enable signal SEC_EN corresponding to the memory block is set to the active state. If the section enable signal SEC_EN corresponding to the memory block is set to the active state, step S321 will be performed; otherwise, step S325 will be executed. In step S325, the memory management device verifies whether the memory block has at least one over-erased transistor body unit, and when the memory block has at least one over-erased transistor body unit, the memory block is The crystal memory unit is corrected for over-erasing.

接著,於步驟S326,記憶管理裝置檢查過度抹除之校正是否被執行(即記憶區塊是否具有至少一過度抹除之電晶體記體單元,或者檢查是否有過度抹除之校正(over-erased correction,OEC)擊發被注入至記憶區塊的過度抹除之電晶體記體單元)。若過度抹除之校正被執行,步驟S327將會被執行;否則,步驟S321將會被執行。於步驟S327,記憶管理裝置將對應於此記憶區塊的區段致能訊號SEC_EN設定為主動狀態。於步驟S328,記憶管理裝置檢查此位址是否 達至最大位址。於步驟S329,記憶管理裝置將此位址加上一增量,其中此增量係對應於此記憶區段的大小。 Next, in step S326, the memory management device checks whether the over-erase correction is performed (ie, whether the memory block has at least one over-erased transistor body unit, or checks for over-erasing correction (over-erased). Correction, OEC) fires an over-erased transistor cell unit that is injected into the memory block. If the over-erase correction is performed, step S327 will be performed; otherwise, step S321 will be performed. In step S327, the memory management device sets the segment enable signal SEC_EN corresponding to the memory block to an active state. In step S328, the memory management device checks whether the address is Reach the maximum address. In step S329, the memory management device adds an increment to the address, wherein the increment corresponds to the size of the memory segment.

在初始時,當所提供之抹除方法首先抹除記憶區塊之複數個電晶體記憶單元時,對應於此記憶區塊的區段致能訊號SEC_EN被設為非主動狀態。例如,於步驟S321,首先驗證記憶區塊之複數個電晶體記憶單元;記憶區塊具有抹除不足之電晶體記憶單元,故此於步驟S323,抹除擊發被注入至記憶區塊之複數個電晶體記憶單元。接著,因為對應於此記憶區塊的區段致能訊號SEC_EN被設為非主動狀態,故此於步驟S325,檢查記憶區塊是否具有至少一過度抹除之電晶體記體單元。一般而言,在所提供之抹除方法抹除記憶區塊之等電晶體記憶單元一次或複數次之後,在記憶區塊會有過度抹除之電晶體記體單元,故此,於步驟S327,對應於此記憶區塊的區段致能訊號SEC_EN被設定為主動狀態。 Initially, when the erase method provided first erases a plurality of transistor memory cells of the memory block, the segment enable signal SEC_EN corresponding to the memory block is set to an inactive state. For example, in step S321, a plurality of transistor memory cells of the memory block are first verified; the memory block has a transistor memory cell with insufficient erase, so in step S323, the erased plurality of cells injected into the memory block are erased. Crystal memory unit. Then, since the segment enable signal SEC_EN corresponding to the memory block is set to the inactive state, in step S325, it is checked whether the memory block has at least one over-erased transistor body unit. Generally, after the provided erase method erases the isoelectric memory unit of the memory block one or more times, the memory block unit is over-erased in the memory block, and therefore, in step S327, The section enable signal SEC_EN corresponding to this memory block is set to the active state.

接著,於步驟S321,驗證對應於此位址的記憶區段之電晶體記憶單元,以及於步驟S323,將此抹除擊發注入至對應於此位址的記憶區段之電晶體記憶單元,且直至記憶區段之電晶體記憶單元被抹除,步驟S321與S323會重複地被執行。若對應於此位址的記憶區段之所有電晶體記憶單元被抹除,於步驟S329,此位址將會被加上一增量,對在相同記憶區塊中之此位址對應之另一記憶區段之電晶體記憶單元於步驟S321中進行驗證且於步驟S323中將此抹除擊發注入至在相同記憶區塊中之此位址對應之另一記憶區段之電晶體記憶單元,且直至此另一記憶區段之複數個電晶體記憶單元被抹除,步驟S321與S323會重複地被執行。因此,在此記憶區塊中之所有記憶區段之電晶體記憶單元被抹除後,所提供之抹除方法將會對下一記憶區塊執行相似的抹除方案。 Next, in step S321, the transistor memory unit corresponding to the memory segment of the address is verified, and in step S323, the erase firing is injected into the transistor memory unit of the memory segment corresponding to the address, and Until the transistor memory cells of the memory segment are erased, steps S321 and S323 are repeatedly performed. If all the transistor memory cells of the memory segment corresponding to the address are erased, the address will be incremented by an increment in step S329, and the address corresponding to the address in the same memory block The transistor memory unit of a memory segment is verified in step S321 and the erase firing is injected into the transistor memory unit of another memory segment corresponding to the address in the same memory block in step S323. And until a plurality of transistor memory cells of the other memory segment are erased, steps S321 and S323 are repeatedly performed. Therefore, after the transistor memory cells of all the memory segments in the memory block are erased, the erase method provided will perform a similar erase scheme for the next memory block.

總言之,於驗證及抹除步驟中,依據本揭露之一實施例所提供之用於快閃記憶體之抹除方法,係依據於記憶區塊是否具有至少一過度抹除之電晶體記體單元來抹除記憶區段或記憶區塊之電晶體記憶單元,藉此,使得此抹除方法不需要額外的多個旗標暫存器以記錄記憶區段之狀態。此外,相較於圖2之習知方法將抹除擊發注入以抹除及驗證整個記憶區塊(譬如,驗證的單位為8或更多的位元),在本揭露中之抹除方法係將抹除擊發注入以對整個記憶區塊之位元線進行OEC驗證(譬如,驗證的單位為8或更多的位元),使得本揭露之抹除方法能夠節省更多時間。再者,在記憶區段中之較慢及較快的抹除的電晶體記憶單元連接到相同位元線的機率小,並且本揭露的抹除方法獲得小的抹除閥值電壓分佈,如透過圖2的習知方法獲得的,使得可以避免過度抹除之電晶體記憶單元掩蓋抹除不足之電晶體記憶單元的問題,並且過度抹除之電晶體記憶單元不會遭受長時間的過度抹除之校正時間(over-erased correction time)和後過度抹除之校正時間(post-over-erased correction time)。 In summary, in the verification and erasing steps, the erasing method for flash memory according to an embodiment of the present disclosure is based on whether the memory block has at least one over-erased transistor record. The body unit erases the memory cell of the memory segment or the memory block, whereby the erase method does not require an additional plurality of flag registers to record the state of the memory segment. In addition, the eraser injection method is used to erase and verify the entire memory block compared to the conventional method of FIG. 2 (for example, the verified unit is 8 or more bits), and the erase method in the present disclosure is The erase shot is injected to perform OEC verification on the bit line of the entire memory block (for example, the verified unit is 8 or more bits), so that the erase method of the present disclosure can save more time. Furthermore, the slower and faster erased transistor memory cells in the memory segment are less likely to be connected to the same bit line, and the erase method of the present disclosure achieves a small erase threshold voltage distribution, such as Obtained by the conventional method of FIG. 2, the problem that the over-erased transistor memory unit can be masked to erase the insufficient transistor memory cell can be avoided, and the over-erased transistor memory unit does not suffer from prolonged over-wiping. In addition to the over-erased correction time and the post-over-erased correction time.

本發明在上文中已以較佳實施例揭露,然熟習本項技術者應理解的是,該實施例僅用於描繪本發明,而不應解讀為限制本發明之範圍。應注意的是,舉凡與該實施例等效之變化與置換,均應設為涵蓋於本發明之範疇內。因此,本發明之保護範圍當以申請專利範圍所界定者為準。 The invention has been described above in terms of the preferred embodiments, and it should be understood by those skilled in the art that the present invention is not intended to limit the scope of the invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention. Therefore, the scope of protection of the present invention is defined by the scope of the patent application.

Claims (7)

一種用於一快閃記憶體之抹除方法,該快閃記憶體包含至少一記憶區塊,該記憶區塊被分為複數個記憶區段,該抹除方法包括:依據一區段致能訊號驗證對應於一位址的該記憶區塊或該記憶區段是否具有至少一抹除不足之電晶體記憶單元,其中該區段致能信號係依據該記憶區塊是否具有至少一過度抹除之電晶體記憶單元而被確定;以及若對應於該位址的該記憶區塊或該記憶區段具有該抹除不足之電晶體記憶單元,依據該區段致能訊號抹除該記憶區塊或該記憶區段之複數個電晶體記憶單元;其中該區段致能訊號係初始地被設為非主動狀態(de-asserted),若對應於該位址的該記憶區塊具有該抹除不足之電晶體記憶單元,該記憶區塊之該等電晶體記憶單元將會被注入一抹除擊發至少一次直至該記憶區塊被驗證出具有該過度抹除之電晶體記憶單元。 An erasing method for a flash memory, the flash memory comprising at least one memory block, the memory block being divided into a plurality of memory segments, the erasing method comprising: enabling according to a segment The signal verification corresponds to whether the memory block of the address of the address or the memory segment has at least one erased memory cell, wherein the segment enable signal is based on whether the memory block has at least one over-erasing The transistor memory unit is determined; and if the memory block or the memory segment corresponding to the address has the under-dissolved transistor memory unit, the memory block is erased according to the segment enable signal or a plurality of transistor memory cells of the memory segment; wherein the segment enable signal is initially set to be de-asserted, and if the memory block corresponding to the address has the erase The transistor memory unit, the transistor memory cells of the memory block will be injected with a eraser at least once until the memory block is verified to have the transistor memory unit with the over-erase. 如請求項1所述之抹除方法,其中若該區段致能訊號被設為主動狀態(asserted)且對應於該位址的該記憶區段具有該抹除不足之電晶體記憶單元,該記憶區段之該等電晶體記憶單元將被注入一抹除擊發(erasing shot)至少一次直至該記憶區段不具有該抹除不足之電晶體記憶單元。 The erasing method of claim 1, wherein if the segment enable signal is asserted and the memory segment corresponding to the address has the erased memory cell, The transistor memory cells of the memory segment will be injected with an erasing shot at least once until the memory segment does not have the erased memory cell. 如請求項2所述之抹除方法,其中若該記憶區段不具有該抹除不足之電晶體記憶單元,該位址將被加上一增量,且之後若對應於該位址的另一記憶區段具有至少一抹除不足之電晶體記憶單元,該另一記憶區段之複數個電晶體記憶單元將被注入該抹除擊發至少一次直至該另一記憶區段不具有該抹除不足之電晶體記憶單元。 The erasing method of claim 2, wherein if the memory segment does not have the erase memory cell, the address is added with an increment, and then if the address corresponds to the address a memory segment having at least one erased memory cell, the plurality of transistor memory cells of the other memory segment being injected into the eraser at least once until the other memory segment does not have the erased defect The transistor memory unit. 如請求項3所述之抹除方法,更包括:當該位址達至一最大位址時,驗證該記憶區塊是否具有該過度抹除之電晶體記憶單元,且若於該記憶區塊中具有該過度抹除之電晶體記憶單元,對該過度抹除之電晶體記憶單元進行過度抹除之校正。 The erasing method of claim 3, further comprising: when the address reaches a maximum address, verifying whether the memory block has the over-erased transistor memory unit, and if the memory block is in the memory block The transistor memory cell having the over-erase is corrected for over-erasing the over-erased transistor memory cell. 如請求項1所述之抹除方法,更包括:在驗證及抹除該記憶區塊之該等電晶體記憶單元之前,對該記憶區塊之該等電晶體記憶單元進行驗證及預寫入動作(pre-programing)。 The erasing method of claim 1, further comprising: verifying and pre-writing the transistor memory cells of the memory block before verifying and erasing the transistor memory cells of the memory block. Pre-programing. 如請求項1所述之抹除方法,其中當該記憶區塊被驗證出具有該過度抹除之電晶體記憶單元時,一過度抹除之校正擊發(over-erased correction shot)被注入至該等過度抹除之電晶體記憶單元,且該區段致能訊號被設定為主動狀態。 The erasing method of claim 1, wherein an over-erased correction shot is injected into the memory block when the memory block is verified to have the over-erased transistor memory unit. The transistor memory cell is over-erased, and the segment enable signal is set to an active state. 一種快閃記憶體,其包括:一記憶管理裝置,電性連接於一記憶模組,用以執行如請求項1至6其中一項所述的抹除方法;以及 該記憶模組,包含該記憶區塊。 A flash memory device, comprising: a memory management device electrically connected to a memory module for performing the erasing method according to any one of claims 1 to 6; The memory module includes the memory block.
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