TWI650427B - Titanium plate - Google Patents

Titanium plate Download PDF

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TWI650427B
TWI650427B TW106129961A TW106129961A TWI650427B TW I650427 B TWI650427 B TW I650427B TW 106129961 A TW106129961 A TW 106129961A TW 106129961 A TW106129961 A TW 106129961A TW I650427 B TWI650427 B TW I650427B
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phase
strength
test piece
less
intermetallic compound
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TW201912806A (en
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岳邊秀德
高橋一浩
藤井秀樹
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日商新日鐵住金股份有限公司
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Abstract

一種鈦板,其化學成分以質量%計為Cu:0.70~1.50%、Cr:0~0.40%、Mn:0~0.50%、Si:0.10~0.30%、O:0~0.10%、Fe:0~0.06%、N:0~0.03%、C:0~0.08%、H:0~0.013%、除上述與Ti以外之元素:各為0~0.1%且其等之總和在0.3%以下、以及剩餘部分:Ti;(1)式所定義之A値在1.15~2.5質量%;其金屬組織中,α相的面積分率在95%以上,β相的面積分率在5%以下,金屬間化合物的面積分率在1%以下;α相的平均結晶粒徑D(μm)為20~70μm且滿足(2)式。A titanium plate whose chemical composition is Cu: 0.70 to 1.50%, Cr: 0 to 0.40%, Mn: 0 to 0.50%, Si: 0.10 to 0.30%, O: 0 to 0.10%, Fe: 0 in mass% ~0.06%, N: 0 to 0.03%, C: 0 to 0.08%, H: 0 to 0.013%, except for the above elements other than Ti: each of 0 to 0.1% and the sum of them is 0.3% or less, and The remainder: Ti; the A値 defined by the formula (1) is 1.15~2.5 mass%; in the metal structure, the area fraction of the α phase is above 95%, and the area fraction of the β phase is below 5%. The area fraction of the compound is 1% or less; the average crystal grain size D (μm) of the α phase is 20 to 70 μm and the formula (2) is satisfied.

Description

鈦板Titanium plate

本發明與鈦板相關。The invention relates to titanium sheets.

迄今,鈦板是使用於熱交換器、熔接管、消音器等二輪排氣系統及建材等多數用途。近年,為謀求該些製品的薄化、輕量化,鈦板的高強度化需求也逐漸升高。並且,也期望在是高強度的同時,亦能維持可耐受成形為複雜形狀的成形性。而現狀是使用JIS H4600之1種的鈦,雖然強度方面是藉由增加板厚來解決,但若板厚增加便無法充分發揮鈦的輕量之特徵。其中,板式熱交換器(PHE)中會施行複雜形狀的壓製成型,故要求充分之成形性。為因應該需求,而使用即便在鈦之中成形性仍優異的鈦。Heretofore, the titanium plate has been used for many purposes such as a two-wheel exhaust system such as a heat exchanger, a fusion pipe, a muffler, and a building material. In recent years, in order to reduce the thickness and weight of these products, the demand for high strength of titanium sheets has gradually increased. Further, it is also desired to maintain the formability which can withstand the formation into a complicated shape while being high in strength. In the current state of the art, titanium of one type of JIS H4600 is used, and although the strength is solved by increasing the thickness of the sheet, if the sheet thickness is increased, the lightweight characteristics of titanium cannot be sufficiently exhibited. Among them, in the plate heat exchanger (PHE), a complicated shape press molding is performed, so that sufficient formability is required. Titanium which is excellent in formability even in titanium is used for the demand.

對於PHE會追求提升熱交換效率,而為此則必須薄化。在已進行薄化的情況下,會發生成形性降低、耐壓性能降低,因此必須兼顧確保充分的成形性及提升強度。所以,以往為了獲得較一般的鈦更優異的強度-成形性平衡,進行了O量、Fe量等的最佳化、或進行有關結晶粒徑控制之研討、或者是使用調質軋延。For PHE, we will pursue an increase in heat exchange efficiency, and for this we must be thin. When the thickness is reduced, the moldability is lowered and the pressure resistance is lowered. Therefore, it is necessary to ensure sufficient moldability and strength. Therefore, conventionally, in order to obtain a more excellent strength-formability balance of titanium, the amount of O, the amount of Fe, and the like have been optimized, or the control of the crystal grain size has been studied, or the temper rolling has been used.

例如,專利文獻1中揭示有具有30μm以上之平均結晶粒徑之鈦板。然而,專利文獻1的鈦板,其強度低劣。For example, Patent Document 1 discloses a titanium plate having an average crystal grain size of 30 μm or more. However, the titanium plate of Patent Document 1 is inferior in strength.

所以,專利文獻2中揭示有規定O含量,並含有作為β安定元素之Fe,且α相的平均結晶粒徑為10μm以下的鈦合金板。專利文件3中揭示有減低Fe、O量並含有Cu,使Ti 2Cu相析出而利用釘紮效果來抑制結晶粒的成長,且平均結晶粒徑為12μm以下之鈦合金薄板。專利文獻4中則揭示有含有Cu並且減低O含量之鈦合金。 Therefore, Patent Document 2 discloses a titanium alloy sheet having a predetermined O content and containing Fe as a β-stabilizing element and having an α-phase average crystal grain size of 10 μm or less. Patent Document 3 discloses a titanium alloy sheet in which the amount of Fe and O is reduced and Cu is contained, and the Ti 2 Cu phase is precipitated to suppress the growth of crystal grains by the pinning effect, and the average crystal grain size is 12 μm or less. Patent Document 4 discloses a titanium alloy containing Cu and reducing the O content.

根據專利文獻2~4所揭示的技術,利用若鈦含有較多合金元素,結晶粒會變微細而容易成為高強度,並且還藉由減低O含量或Fe含量來謀求確保成形性。然而,前述文獻中所揭示的技術無法在可對應近年的需求之程度上維持充分之成形性並顯示高強度。According to the technique disclosed in Patent Documents 2 to 4, when titanium contains a large amount of alloying elements, the crystal grains become fine and easily become high strength, and the moldability is also ensured by reducing the O content or the Fe content. However, the technique disclosed in the aforementioned documents cannot maintain sufficient formability and exhibit high strength to the extent that it can correspond to the demand in recent years.

另一方面,與上述文獻所揭示的技術相對照,正研討一種含有合金元素並謀求結晶粒的粗粒化之技術。On the other hand, in contrast to the technique disclosed in the above documents, a technique of containing alloying elements and coarse graining of crystal grains is being studied.

專利文獻5中揭示有具有含Cu及Ni之化學組合,且藉由在600~850℃的溫度區中進行退火而將結晶粒徑調整為5~50μm,並且用於電解銅箔製造用陰極電極之鈦合金及其製造方法。專利文獻6中揭示有具有含Cu、Cr、少量Fe及O的化學組成之電解銅箔製造滾筒用鈦板及其製造方法。該專利文獻6中記載有在630~870℃下進行退火的例子。除此之外,專利文獻6所記載的技術,其Fe含量控制得低。當藉由回收而使用廢料為原料來製造鈦板時,Fe含量會因廢料中的Fe而變多,因此要製造將Fe含量控制得低之鈦板實屬困難。因此,為了要藉由回收來製造專利文獻6中記載之鈦板時,必須要有使用Fe含量低之廢料等的限制。Patent Document 5 discloses a chemical composition comprising Cu and Ni, and the crystal grain size is adjusted to 5 to 50 μm by annealing in a temperature range of 600 to 850 ° C, and is used for a cathode electrode for electrolytic copper foil production. Titanium alloy and its manufacturing method. Patent Document 6 discloses a titanium plate for producing an electrolytic copper foil having a chemical composition containing Cu, Cr, a small amount of Fe, and O, and a method for producing the same. Patent Document 6 describes an example of annealing at 630 to 870 °C. In addition, in the technique described in Patent Document 6, the Fe content is controlled to be low. When a titanium plate is produced by using waste as a raw material by recycling, the Fe content is increased by Fe in the scrap, and it is difficult to manufacture a titanium plate having a low Fe content. Therefore, in order to manufacture the titanium plate described in Patent Document 6 by recycling, it is necessary to use a waste such as a scrap having a low Fe content.

在專利文獻7及8中揭示有在令冷軋延的軋縮率小到20%以下,並令退火溫度在825℃以上且β變態點以下之條件下,將含有Si及Al之鈦高溫化,藉此令平均結晶粒徑在15μm以上之技術。Patent Documents 7 and 8 disclose that high temperature of titanium containing Si and Al is obtained under conditions in which the rolling reduction ratio of the cold rolling is as small as 20% or less and the annealing temperature is 825 ° C or higher and the β transformation point or lower. This is a technique whereby the average crystal grain size is 15 μm or more.

另,專利文獻9中記載有含有Cu:0.5~1.8%、Si:0.1~0.6%及氧:0.1%以下,剩餘部分是由Ti及無法避免的不純物所構成,且耐氧化性及成形性優異之排氣系統零件用鈦合金材。Further, Patent Document 9 discloses that Cu: 0.5 to 1.8%, Si: 0.1 to 0.6%, and oxygen: 0.1% or less, and the balance is composed of Ti and unavoidable impurities, and is excellent in oxidation resistance and formability. The exhaust system parts are made of titanium alloy.

專利文獻10中記載有由0.3~1.8%的Cu、0.18%以下的氧、0.30%以下的Fe以及剩餘部分為Ti及低於0.3%之不純物元素所構成,且冷加工性優異之耐熱鈦合金板。此外,專利文獻11中記載有高強度且成形性優異之鈦合金板,該鈦合金板中,β相的最大結晶粒徑:15μm以下、α相面積率:80~97%、α相的平均結晶粒徑:20μm以下,且α相之結晶粒徑的標準偏差÷α相的平均結晶粒徑×100是在30%以下。並且,在專利文獻12中記載有鈦薄板,該鈦薄板具有以質量%計,Cu:0.1~1.0%、Ni:0.01~0.20%、Fe:0.01~0.10%、O:0.01~0.10%、Cr:0~0.20%、剩餘部分:Ti及無法避免的不純物,並滿足0.04≦0.3Cu+Ni≦0.44%之化學組成,且α相的平均結晶粒徑為15μm以上,Cu及/或Ni與Ti的金屬間化合物為2.0體積%以下。Patent Document 10 describes a heat-resistant titanium alloy sheet which is composed of 0.3 to 1.8% of Cu, 0.18% or less of oxygen, 0.30% or less of Fe, and the remaining part of Ti and less than 0.3% of an impurity element, and is excellent in cold workability. . Further, Patent Document 11 discloses a titanium alloy sheet having high strength and excellent moldability. In the titanium alloy sheet, the maximum crystal grain size of the β phase is 15 μm or less, the α phase area ratio is 80 to 97%, and the average of the α phase. Crystal grain size: 20 μm or less, and the standard deviation of the crystal grain size of the α phase ÷ α phase average crystal grain size × 100 is 30% or less. Further, Patent Document 12 describes a titanium thin plate having a mass ratio of Cu: 0.1 to 1.0%, Ni: 0.01 to 0.20%, Fe: 0.01 to 0.10%, and O: 0.01 to 0.10%, Cr. :0~0.20%, the remainder: Ti and unavoidable impurities, and satisfy the chemical composition of 0.04≦0.3Cu+Ni≦0.44%, and the average crystal grain size of the α phase is 15μm or more, Cu and/or metal of Ni and Ti The amount of the compound is 2.0% by volume or less.

先前技術文獻 專利文獻 專利文獻1:日本專利第4088183號公報 專利文獻2:日本專利特開2010-031314號公報 專利文獻3:日本專利特開2010-202952號公報 專利文獻4:日本專利第4486530號公報 專利文獻5:日本專利第4061211號公報 專利文獻6:日本專利第4094395號公報 專利文獻7:日本專利第4157891號公報 專利文獻8:日本專利第4157893號公報 專利文獻9:日本專利特開2009-68026號公報 專利文獻10:日本專利特開2005-298970號公報 專利文獻11:日本專利特開2010-121186號公報 專利文獻12:WO2016/140231A1號公報CITATION LIST Patent Literature Patent Literature 1: Japanese Patent No. 4,087,183, Patent Document 2: Japanese Patent Laid-Open Publication No. 2010-031314, Patent Document 3: Japanese Patent Laid-Open Publication No. 2010-202952, Patent Document 4: Japanese Patent No. 4486530 Japanese Patent No. 4091211 Patent Document 6: Japanese Patent No. 4094395 Patent Document 7: Japanese Patent No. 4,147,891 Patent Document 8: Japanese Patent No. 4,147, 893 Patent Document 9: Japanese Patent Laid-Open No. 2009 Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei.

發明概要 發明欲解決之課題 高強度化手法是利用合金化、結晶粒之微細化及調質軋延等加工而進行。另一方面,成形性提升是與高強度化有抵換關係。因此,要確保高強度與充分的成形性是有困難的。即便如專利文獻中2~11中所揭示的技術,藉由含有合金元素而令結晶粒微細或粗大,仍難以稱得上有充分兼顧近年對鈦板所要求的致斷延伸率在42%以上之優異成形性、以及降伏強度為200MPa以上的高強度化。此外,在鈦中雖無法避免含有某個程度之氧,但0.01質量%左右的氧量變動即會導致強度及成形性特性大幅變動,而無法獲得所需強度與成形性。以0.01質量%左右之微量等級嚴密管理氧量而製造鈦合金板,在技術上非常困難,且會耗費高額成本。SUMMARY OF THE INVENTION Problems to be Solved by the Invention The high-strength method is carried out by processing such as alloying, refinement of crystal grains, and temper rolling. On the other hand, the improvement in formability is incompatible with the high strength. Therefore, it is difficult to ensure high strength and sufficient formability. Even if the crystal grains are fine or coarse by containing an alloying element as in the technique disclosed in Patent Documents 2 to 11, it is difficult to claim that the breaking elongation required for the titanium plate in recent years is more than 42%. The excellent moldability and the strength at which the fall strength is 200 MPa or more are increased. Further, although it is unavoidable to contain a certain degree of oxygen in titanium, the fluctuation in the amount of oxygen of about 0.01% by mass causes a large fluctuation in strength and moldability, and the required strength and formability cannot be obtained. It is technically very difficult to manufacture a titanium alloy sheet by strictly managing the amount of oxygen at a trace level of about 0.01% by mass, and it is costly.

此外,以汽車用為首之構造物的材料所用之鈦板多會施行熔接。故,為製得具有穩定特性的製品,會要求抑制因熔接所伴隨之HAZ部的結晶粒粗大化而造成的強度降低。In addition, the titanium plates used for the materials of the structures such as automobiles are often welded. Therefore, in order to obtain a product having stable characteristics, it is required to suppress a decrease in strength due to coarsening of crystal grains in the HAZ portion accompanying welding.

因此,本發明之課題在於提供一種延展性與強度之平衡優異,且在熔接後仍能確保充分強度之鈦板。Therefore, an object of the present invention is to provide a titanium plate which is excellent in balance between ductility and strength and which can ensure sufficient strength even after welding.

用以解決課題之手段 用以解決上述課題之本發明要旨如下。 (1)一種鈦板, 其化學成分以質量%計為 Cu:0.70~1.50%、 Cr:0~0.40%、 Mn:0~0.50%、 Si:0.10~0.30%、 O:0~0.10%、 Fe:0~0.06%、 N:0~0.03%、 C:0~0.08%、 H:0~0.013%、 除上述及Ti以外之元素:各為0~0.1%,且其等之總和在0.3%以下、及 剩餘部分:Ti; 下述(1)式所定義之A值為1.15~2.5質量%; 其金屬組織中, α相的面積分率在95%以上, β相的面積分率在5%以下, 金屬間化合物的面積分率在1%以下; α相的平均結晶粒徑D(μm)為20~70μm且滿足下述(2)式; A=[Cu]+0.98[Cr]+1.16[Mn]+3.4[Si] … (1)式 D[μm]≧0.8064×e 45.588[O]… (2)式 惟,e為自然對數的底數。 (2)如(1)之鈦板,其中前述金屬組織之α相、β相及金屬間化合物的面積分率總計為100%。 (3)如(1)或(2)之鈦板,其中前述金屬間化合物為Ti-Si系金屬間化合物與Ti-Cu系金屬間化合物。 (4)如(1)至(3)中任一項之鈦板,其板厚為0.3~1.5mm,0.2%降伏強度在215MPa以上,且在試驗片之平行部寬度為6.25mm、試驗片之原評點間距離為25mm、試驗片厚度為原本板厚之扁平型拉伸試驗片測得之致斷延伸率為42%以上。 Means for Solving the Problems The gist of the present invention for solving the above problems is as follows. (1) A titanium plate whose chemical composition is Cu: 0.70 to 1.50%, Cr: 0 to 0.40%, Mn: 0 to 0.50%, Si: 0.10 to 0.30%, O: 0 to 0.10%, in terms of mass%, Fe: 0 to 0.06%, N: 0 to 0.03%, C: 0 to 0.08%, H: 0 to 0.013%, elements other than the above and Ti: each of 0 to 0.1%, and the sum of them is 0.3 % or less and the remainder: Ti; The A value defined by the following formula (1) is 1.15 to 2.5% by mass; in the metal structure, the area fraction of the α phase is 95% or more, and the area fraction of the β phase is 5% or less, the area fraction of the intermetallic compound is 1% or less; the average crystal grain size D (μm) of the α phase is 20 to 70 μm and satisfies the following formula (2); A = [Cu] + 0.98 [Cr ]+1.16[Mn]+3.4[Si] (1) Formula D[μm]≧0.8064×e 45.588[O] (2) Equation, e is the base of the natural logarithm. (2) The titanium plate according to (1), wherein an area fraction of the α phase, the β phase, and the intermetallic compound of the metal structure is 100% in total. (3) The titanium plate according to (1) or (2), wherein the intermetallic compound is a Ti-Si-based intermetallic compound and a Ti-Cu-based intermetallic compound. (4) The titanium plate according to any one of (1) to (3), wherein the plate thickness is 0.3 to 1.5 mm, the 0.2% relief strength is 215 MPa or more, and the width of the parallel portion of the test piece is 6.25 mm, and the test piece The elongation at break of the flat tensile test piece having a distance of 25 mm between the original evaluation points and a test piece thickness of the original plate thickness was 42% or more.

發明效果 根據本發明,即可提供延展性與強度之平衡優異且在熔接後仍能確保充分強度之鈦板。Advantageous Effects of Invention According to the present invention, it is possible to provide a titanium plate which is excellent in balance between ductility and strength and which can ensure sufficient strength even after welding.

用以實施發明之形態 本發明人等為在高強度化的同時確保成形性,且在熔接後仍能確保充分強度,而研討鈦板的化學成分、金屬組織及結晶粒徑的最佳化,藉此摸索出可具有充分強度及成形性,且可抑制因熔接所伴隨之HAZ部的結晶粒粗大化而造成的強度降低。其結果,可利用添加預定量的Cu、Si作為合金元素而導致的合金化來高強度化,且可藉由控制金屬組織與結晶粒徑,而在高水準兼顧強度及成形性與HAZ部的強度降低。In order to carry out the invention, the inventors of the present invention have been able to ensure the formability while increasing the strength, and to ensure sufficient strength after welding, and to optimize the chemical composition, metal structure and crystal grain size of the titanium plate. Thereby, it is possible to exhibit sufficient strength and formability, and it is possible to suppress a decrease in strength due to coarsening of crystal grains in the HAZ portion accompanying welding. As a result, it is possible to increase the strength by alloying by adding a predetermined amount of Cu or Si as an alloying element, and by controlling the metal structure and the crystal grain size, the strength and formability of the HAZ portion can be achieved at a high level. The strength is reduced.

(本發明之鈦板的目標特性) 0.2%降伏強度:215MPa以上 本發明之鈦板的母材強度以0.2%降伏強度計是設為215MPa以上。(Target Characteristics of Titanium Sheet of the Present Invention) 0.2% Degradation Strength: 215 MPa or more The base material strength of the titanium sheet of the present invention is set to 215 MPa or more in terms of 0.2% of the drop strength.

致斷延伸率:42%以上 此外,從成形性這一點來看,鈦板母材在拉伸試驗時之致斷延伸率是以42%以上為指標。更佳之致斷延伸率為45%以上。致斷延伸率為在板厚為0.3~1.5mm,且試驗片的平行部寬度為6.25mm、試驗片之原評點間距離為25mm、試驗片厚度為原本板厚之扁平型拉伸試驗片之致斷延伸率。Breaking elongation: 42% or more Further, from the viewpoint of formability, the elongation at break of the titanium plate base material at the time of the tensile test is an index of 42% or more. A better elongation at break is 45% or more. The elongation at break is a flat tensile test piece having a thickness of 0.3 to 1.5 mm and a parallel portion width of the test piece of 6.25 mm, a distance between the original evaluation points of the test piece of 25 mm, and a test piece thickness of the original plate thickness. Breaking elongation.

熔接接頭的強度降低量 (開發目標值):10MPa以下 熔接時的熔接輸入熱會造成熔接熱影響部(Heat Affected Zone:HAZ部)的強度降低,若母材與HAZ部的強度差變大,於使用中變形會僅集中於HAZ部而不佳。因此,母材與熔接接頭的強度降低量Δ0.2%降伏強度(開發目標值:熔接接頭的0.2%降伏強度-母材的0.2%降伏強度)是以10MPa以下為目標。The amount of decrease in the strength of the welded joint (development target value): The heat of fusion at the time of welding at 10 MPa or less causes the strength of the heat affected zone (Heat Affected Zone: HAZ) to decrease, and if the difference between the strength of the base material and the HAZ portion is large, Deformation in use will only focus on the HAZ. Therefore, the strength reduction amount of the base material and the welded joint by Δ0.2% is the development target value: 0.2% of the weld joint of the fusion joint - 0.2% of the strength of the base material, and the target is 10 MPa or less.

(鈦板的化學成分) 以下,化學成分的%為「質量%」。(Chemical composition of titanium plate) Hereinafter, the % of the chemical component is "% by mass".

Cu:0.70~1.50% Cu對於高強度化大有助益,於形成鈦且具有hcp構造之α相中的固熔量也較多。但,即便是在固熔範圍內,若添加量過多便會抑制結晶粒成長,而延伸率降低。因此,必須含有其0.70%以上且1.50%以下。針對上限,較佳為1.45%、1.40%、1.35%或1.30%以下,更佳為1.20%或1.10%以下。另一方面,針對下限,除Cu以外未含有Cr、Mn之任一者時,若未添加0.70%以上便無法獲得所需強度。為提升強度,亦可令其下限為0.75%、0.80%、0.85%或是0.90%。Cu: 0.70 to 1.50% Cu is advantageous for high strength, and a large amount of solid solution is formed in the α phase in which titanium is formed and has a hcp structure. However, even in the solid solution range, if the amount added is too large, the growth of crystal grains is suppressed, and the elongation is lowered. Therefore, it must contain 0.70% or more and 1.50% or less. The upper limit is preferably 1.45%, 1.40%, 1.35% or 1.30% or less, more preferably 1.20% or less. On the other hand, when any of Cr and Mn is not contained in addition to Cu, the required strength cannot be obtained without adding 0.70% or more. In order to increase the strength, the lower limit may be 0.75%, 0.80%, 0.85% or 0.90%.

Si:0.10~0.30% 為了有助於強度提升,要添加0.10%以上的Si。然而,若添加量過多,會促進Ti-Si系金屬間化合物的生成而抑制結晶粒成長,導致延伸率降低。尤其是,相較於Cu、Cr、Mn及Ni,即便添加質量為少量,結晶粒的微細化及提升強度的效果仍大。故,添加量要設為0.30%以下。另,Si添加量也會影響熔接後的強度確保(抑制HAZ部的粗大化)。為了抑制HAZ部中的降伏強度降低,Si量亦要設為0.10~0.30%。且,視所需,其下限亦可設為0.12%、0.14%或0.16%,其上限亦可設為0.28%、0.26%、0.24%或0.22%。Si: 0.10 to 0.30% In order to contribute to strength improvement, 0.10% or more of Si is added. However, when the amount added is too large, the formation of a Ti-Si-based intermetallic compound is promoted, and the growth of crystal grains is suppressed, resulting in a decrease in elongation. In particular, compared with Cu, Cr, Mn, and Ni, even if the added mass is small, the effect of refining the crystal grains and improving the strength is large. Therefore, the amount of addition should be set to 0.30% or less. In addition, the amount of Si added also affects the strength after welding (to suppress the coarsening of the HAZ portion). In order to suppress the decrease in the drop strength in the HAZ portion, the amount of Si is also set to be 0.10 to 0.30%. Further, the lower limit may be set to 0.12%, 0.14% or 0.16% as needed, and the upper limit may be set to 0.28%, 0.26%, 0.24% or 0.22%.

Cr:0~0.40% 為了有助於強度提升,可視所需來添加Cr。然而,若添加量過多,會促進β相生成而抑制結晶粒成長,導致延伸率降低,故要設為0.40%以下。當藉由添加Cu、Mn、Si及Ni而充分強化時,亦可不含有。為了提升強度,Cr之下限亦可設為0.05%或0.10%。但,並不一定要含有Cr,其下限為0%。且,視所需,亦可將其上限設為0.35%、0.30%、0.25%或0.20%。Cr: 0 to 0.40% In order to contribute to the strength improvement, Cr may be added as needed. However, when the amount added is too large, the formation of the β phase is promoted, and the growth of the crystal grains is suppressed, and the elongation is lowered. Therefore, it is required to be 0.40% or less. When it is sufficiently strengthened by adding Cu, Mn, Si, and Ni, it may not be contained. In order to increase the strength, the lower limit of Cr may also be set to 0.05% or 0.10%. However, it is not necessary to contain Cr, and the lower limit is 0%. Further, the upper limit may be set to 0.35%, 0.30%, 0.25% or 0.20% as needed.

Mn:0~0.50% 為了有助於強度提升,可視所需來添加Mn。然而,若添加量過多,會促進β相生成而抑制結晶粒成長,導致延伸率降低,故要設為0.50%以下。當藉由添加Cu、Cr、Si及Ni而充分強化時,亦可不含有。為了提升強度,Mn之下限亦可設為0.05%或0.10%。但,並不一定要含有Mn,其下限為0%。且,視所需,亦可將其上限設為0.40%、0.30%、0.25%、0.15%或0.10%。Mn: 0 to 0.50% In order to contribute to strength improvement, Mn may be added as needed. However, when the amount added is too large, the formation of the β phase is promoted, and the growth of the crystal grains is suppressed, and the elongation is lowered. Therefore, it is required to be 0.50% or less. When it is sufficiently strengthened by adding Cu, Cr, Si, and Ni, it may not be contained. In order to increase the strength, the lower limit of Mn may also be set to 0.05% or 0.10%. However, it is not necessary to contain Mn, and the lower limit is 0%. Further, the upper limit may be set to 0.40%, 0.30%, 0.25%, 0.15% or 0.10% as needed.

O:0~0.10% 氧(O)與Ti的結合力強,且是在工業製造金屬Ti時無法避免含有的不純物,但若O量過多便會高強度化,而成形性劣化。因此,必須抑制在0.10%以下。O是作為不純物而含有,不須規定其下限,其下限為0%。然而,亦可將其下限設為0.005%、0.010%、0.015%、0.020%或0.030%。且亦可將其上限設為0.090%、0.080%、0.070%或0.065%。O: 0 to 0.10% Oxygen (O) has a strong binding force with Ti, and is an impurity which cannot be avoided when industrially producing metal Ti. However, if the amount of O is too large, the strength is increased and the formability is deteriorated. Therefore, it must be suppressed to 0.10% or less. O is contained as an impurity, and the lower limit is not required, and the lower limit is 0%. However, the lower limit may also be set to 0.005%, 0.010%, 0.015%, 0.020% or 0.030%. It is also possible to set the upper limit to 0.090%, 0.080%, 0.070% or 0.065%.

Fe:0~0.06% 鐵(Fe)是在工業製造金屬Ti時無法避免含有的不純物,若Fe量過多便會促進β相生成,而抑制結晶粒成長。故,鐵量要設為0.06%以下。若在0.06%以下,則對0.2%降伏強度的影響小而可忽略。較佳是在0.05%以下,在0.04%以下更佳。且,Fe為不純物,其下限為0%。但,亦可將其下限設為0.01%、0.015%、0.02%或0.03%。Fe: 0 to 0.06% Iron (Fe) is an impurity that cannot be avoided when industrially producing metal Ti. If the amount of Fe is too large, the formation of the β phase is promoted, and the growth of the crystal grains is suppressed. Therefore, the amount of iron should be set to 0.06% or less. If it is below 0.06%, the effect on the 0.2% drop strength is small and negligible. It is preferably 0.05% or less, more preferably 0.04% or less. Further, Fe is an impurity, and the lower limit thereof is 0%. However, the lower limit may be set to 0.01%, 0.015%, 0.02% or 0.03%.

N:0~0.03% 氮(N)也會促進與氧同等之高強度化,而使成形性劣化。但,於原料中所含的量較O為少,故可減為較O少。因此,是設為0.03%以下。且以在0.025%以下或0.02%以下為佳,更佳是在0.015%以下或0.01%以下。另,雖在工業製造時會含有0.0001%以上的N之案例多,但其下限為0%。亦可將其下限設為0.0001%、0.001%或0.002%。且亦可將其上限設為0.025%或0.02%。N: 0 to 0.03% Nitrogen (N) also promotes high strength equivalent to oxygen and deteriorates formability. However, since the amount contained in the raw material is less than O, it can be reduced to less than O. Therefore, it is set to 0.03% or less. Further, it is preferably 0.025% or less or 0.02% or less, more preferably 0.015% or less or 0.01% or less. In addition, although there are many cases where 0.0001% or more of N is contained in industrial production, the lower limit is 0%. The lower limit can also be set to 0.0001%, 0.001% or 0.002%. It is also possible to set the upper limit to 0.025% or 0.02%.

C:0~0.08% C與氧或氮一樣會促進高強度化,但其效果較氧或氮為小。且相較於氧為一半以下,若含量在0.08%以下,則可忽略對於0.2%降伏強度的影響。然而,含量越少則成形性越優異,故以在0.05%以下為佳,更佳是在0.03%以下、0.02%以下或為0.01%。且,無須規定C量之下限,其下限為0%。如有需要,則亦可將其下限設為0.001%。C: 0 to 0.08% C promotes high strength like oxygen or nitrogen, but its effect is smaller than oxygen or nitrogen. And if it is less than half of oxygen, if the content is 0.08% or less, the influence on the 0.2% fall strength can be ignored. However, the smaller the content, the more excellent the moldability, so it is preferably 0.05% or less, more preferably 0.03% or less, 0.02% or less, or 0.01%. Moreover, it is not necessary to specify the lower limit of the amount of C, and the lower limit is 0%. If necessary, the lower limit can also be set to 0.001%.

H:0~0.013% H是引起脆化的元素,在室溫下之固熔限制在10ppm上下,因此當含有此數值以上之H時,會有形成氫化物而脆化之疑慮。一般而言,只要含量在0.013%以下,雖有脆化的疑慮但在實用上毫無問題地是可被使用的。並且,其含量較氧少,故可忽略對0.2%降伏強度的影響。較佳是在0.010%以下,且更佳是在0.008%以下、0.006%以下、0.004%以下或0.003%以下。且,不須規定H量的下限,其下限為0%。如有需要,則亦可將其下限設為0.0001%。H: 0 to 0.013% H is an element causing embrittlement, and the solid solution at room temperature is limited to about 10 ppm. Therefore, when H of this value or more is contained, there is a fear that hydride is formed and embrittlement is formed. In general, as long as the content is 0.013% or less, there is a problem of embrittlement, but it can be used without any problem in practical use. Moreover, its content is less than that of oxygen, so the influence on the 0.2% drop strength can be ignored. It is preferably 0.010% or less, and more preferably 0.008% or less, 0.006% or less, 0.004% or less, or 0.003% or less. Further, it is not necessary to specify the lower limit of the amount of H, and the lower limit thereof is 0%. If necessary, the lower limit can also be set to 0.0001%.

除上述及Ti以外之元素:各為0~0.1%,且其等之總和在0.3%以下,剩餘部分:Ti。The elements other than the above and Ti are each 0 to 0.1%, and the sum of them is 0.3% or less, and the remainder: Ti.

除Cu、Cr、Mn、Si、Fe、N、O及H之外所含之不純物元素亦可分別含有0.10%以下,但其等不純物元素含量總計,亦即其等之總量是設為0.3%以下。上述是為了活用廢料,但也是為了充分含有合金元素而高強度化,且不使成形性過度劣化。有混入之可能性的元素為Al、Mo、V、Sn、Co、Zr、Nb、Ta、W、Hf、Pd及Ru等。其為不純物元素,下限為0%。視所需,亦可將各不純物元素之上限設為0.08%、0.06%、0.04%或0.03%。其等之總和下限為0%。且亦可將總和的上限設為0.25%、0.20%、0.15%或0.10%。The impurities contained in addition to Cu, Cr, Mn, Si, Fe, N, O, and H may also be contained in an amount of 0.10% or less, respectively, but the total amount of such impurities is, for example, the total amount thereof is set to 0.3. %the following. The above is for the purpose of utilizing the waste material, but it is also high in strength in order to sufficiently contain the alloying element, and the moldability is not excessively deteriorated. The elements which are likely to be mixed are Al, Mo, V, Sn, Co, Zr, Nb, Ta, W, Hf, Pd, Ru, and the like. It is an impurity element with a lower limit of 0%. The upper limit of each impurity element may also be set to 0.08%, 0.06%, 0.04% or 0.03% as needed. The lower limit of the sum is 0%. The upper limit of the sum may also be set to 0.25%, 0.20%, 0.15% or 0.10%.

(A值) 本發明之鈦板滿足上述化學成分,並且,下述(1)式所定義之A值為1.15~2.5質量%。 A=[Cu]+0.98[Cr]+1.16[Mn]+3.4[Si] … (1)式(A value) The titanium plate of the present invention satisfies the above chemical composition, and the A value defined by the following formula (1) is 1.15 to 2.5% by mass. A=[Cu]+0.98[Cr]+1.16[Mn]+3.4[Si] (1)

以真空電弧熔解製作在本發明化學成分範圍內含有Cu、Si、Mn及Cr之100g的Ti鑄塊,並將其等加熱至1100℃後,熱軋延且切削除去表面。之後,在與熱軋延相同方向上進行冷軋延,而作成板厚為0.5mm之薄板。以各種條件對該薄板進行熱處理,而調整結晶粒徑。於圖1中顯示A值與0.2%降伏強度之關係。且於圖2中顯示A值與延伸率之關係。另,圖1、2中的各繪製點為A值以外的金屬組織、α相的平均結晶粒徑D皆在本發明範圍內。亦即,其等為α相的面積分率在95%以上、β相的面積分率在5%以下、金屬間化合物的面積分率在1%以下、α相的平均結晶粒徑D(μm)為20~70μm,且滿足後述(2)式者。A 100 g of Ti ingot containing Cu, Si, Mn, and Cr in the chemical composition range of the present invention was produced by vacuum arc melting, and the like was heated to 1,100 ° C, and then hot rolled and cut to remove the surface. Thereafter, cold rolling was performed in the same direction as the hot rolling, and a sheet having a thickness of 0.5 mm was formed. The sheet was heat-treated under various conditions to adjust the crystal grain size. The relationship between the A value and the 0.2% fall strength is shown in FIG. The relationship between the A value and the elongation is shown in FIG. Further, each of the plotted points in Figs. 1 and 2 is a metal structure other than the A value, and the average crystal grain size D of the α phase is within the scope of the present invention. That is, the area fraction of the α phase is 95% or more, the area fraction of the β phase is 5% or less, the area fraction of the intermetallic compound is 1% or less, and the average crystal grain size D of the α phase (μm). ) is 20 to 70 μm and satisfies the formula (2) described later.

即便Cu、Si、Mn及Cr的各含量在本發明之化學成分範圍內,但若A值過小,強度仍會降低。為使0.2%降伏強度不低於215MPa,要令A值之下限值為1.15質量%。且,為提升0.2%降伏強度,亦可將A值之下限設為1.20%或1.25%。另一方面,若A值變得過大,延伸率便會降低而加工性劣化。為使致斷延伸率不低於42%,要令A值之上限值為2.5質量%。且,為提升致斷延伸率,亦可將A值之上限設為2.40%、2.30%、2.20%、2.10%或2.00%。Even if the respective contents of Cu, Si, Mn, and Cr are within the chemical composition range of the present invention, if the A value is too small, the strength is still lowered. In order to make the 0.2% fall strength not lower than 215 MPa, the lower limit of the A value is 1.15 mass%. Moreover, in order to increase the 0.2% drop strength, the lower limit of the A value may be set to 1.20% or 1.25%. On the other hand, if the A value becomes too large, the elongation is lowered and the workability is deteriorated. In order to make the elongation at break not less than 42%, the upper limit of the A value is 2.5% by mass. Moreover, in order to increase the elongation at break, the upper limit of the A value may be set to 2.40%, 2.30%, 2.20%, 2.10% or 2.00%.

(金屬組織) 本發明之鈦板的α相的面積分率為95%以上,β相的面積分率為5%以下,金屬間化合物的面積分率為1%以下。(Metal Structure) The titanium plate of the present invention has an area fraction of the α phase of 95% or more, an area fraction of the β phase of 5% or less, and an area fraction of the intermetallic compound of 1% or less.

於圖3中顯示β相的面積分率與0.2%降伏強度之關係。另,圖3中的各繪製點為β相的面積分率以外之金屬組織、α相的平均結晶粒徑D、化學成分範圍及A值皆在本發明範圍內。為使0.2%降伏強度不低於215MPa,要令β相的面積分率上限為5%。且為提升0.2%降伏強度,亦可將β相的面積分率上限設為3%、2%、1%、0.5%或0.1%。The relationship between the area fraction of the β phase and the 0.2% fall strength is shown in FIG. Further, each of the plotted points in Fig. 3 is a metal structure other than the area fraction of the β phase, the average crystal grain size D of the α phase, the chemical composition range, and the A value are all within the scope of the present invention. In order to make the 0.2% drop strength not lower than 215 MPa, the upper limit of the area fraction of the β phase is 5%. In order to increase the 0.2% drop strength, the upper limit of the area fraction of the β phase may also be set to 3%, 2%, 1%, 0.5% or 0.1%.

此外,於圖4中顯示金屬間化合物的面積分率與致斷延伸率關係。又,圖4之各繪製點為金屬間化合物的面積分率以外之金屬組織、α相的平均結晶粒徑D、化學成分範圍及A值皆在本發明範圍內。為使致斷延伸率不低於42%,要令金屬間化合物的面積分率上限值為1.0%。為提升致斷延伸率,亦可將金屬間化合物的面積分率上限設為0.8%、0.6%、0.4%或0.3%。本發明之鈦板並無α相、β相及金屬間化合物以外之組織。視所需,亦可將α相的面積率下限設為97%、98%、99%及99.5%。Further, the relationship between the area fraction of the intermetallic compound and the elongation at break is shown in FIG. Further, each of the plotted points in Fig. 4 is a metal structure other than the area fraction of the intermetallic compound, the average crystal grain size D of the α phase, the chemical composition range, and the A value are all within the scope of the present invention. In order to make the elongation at break not less than 42%, the upper limit of the area fraction of the intermetallic compound is 1.0%. In order to increase the elongation at break, the upper limit of the area fraction of the intermetallic compound may also be set to 0.8%, 0.6%, 0.4% or 0.3%. The titanium plate of the present invention has no structures other than the α phase, the β phase, and the intermetallic compound. The lower limit of the area ratio of the α phase may be set to 97%, 98%, 99%, and 99.5%, as needed.

另,β相及金屬間化合物以外之金屬組織為α相,且α相、β相及金屬間化合物的面積分率總計宜為100%。金屬間化合物為Ti-Cu系金屬間化合物及Ti-Si系金屬間化合物。Ti-Cu系金屬間化合物的代表為Ti 2Cu,而Ti-Si系金屬間化合物的代表為Ti 3Si、Ti 5Si 3Further, the metal phase other than the β phase and the intermetallic compound is an α phase, and the area fraction of the α phase, the β phase, and the intermetallic compound is preferably 100% in total. The intermetallic compound is a Ti-Cu-based intermetallic compound and a Ti-Si-based intermetallic compound. The Ti-Cu-based intermetallic compound is represented by Ti 2 Cu, and the Ti-Si-based intermetallic compound is represented by Ti 3 Si and Ti 5 Si 3 .

(金屬組織的測量方法) α相、β相及金屬間化合物的各面積分率,是藉由利用SEM觀察及EPMA分析來求得面積率而進行。在SEM觀察中,觀察背向散射電子影像(組成影像),藉此可看到Ti-Si系金屬間化合物呈黑色。而Ti-Cu系金屬間化合物與β相是呈白色,故必須將其等分離。為此,除對Si、Cu及Fe以15kV之加速電壓,在500倍的1個視野(相等於200μm×200μm)中利用EPMA進行面分析之外,若含有Cr、Mn則亦針對Cr、Mn進行。又,亦可不限於1個視野,而在多數個視野中觀察相當於總計為200μm×200μm的面積,並求算其等之平均。於β相中會有Fe、Cr及Mn濃化,而在Ti-Cu系金屬間化合物中則未濃化。因此,藉由比較背向散射電子影像與元素分布,便可分離辨別白色部。之後,測量背向散射電子影像中的面積率,藉此設為各自的面積分率。測量試樣會在測量面利用鑽石粒子進行鏡面精加工,為確保導電性亦可進行C或Au的蒸鍍。於圖5中,顯示針對Ti-Cu-Si-Mn成分系在約100μm×約100μm的區域中進行EPMA分析後的示意圖。以灰色到黑色來表示各元素的濃化位置。且,圖中的虛線是表示組織的晶界。Fe、Mn是在相同位置濃化,且存在於晶界或晶粒內。雖然會有Cu在與Fe、Mn相同的位置濃化之部分,但Cu也會存在於與Fe、Mn不同處,此即為Ti-Cu系金屬間化合物。Si則幾乎存在於與Fe、Mn及Cu不同處。因此,藉由測量在Cu的濃化位置中未有Fe、Mn濃化之處(箭頭部分)的面積率,即可求算金屬間化合物的面積率。具體而言,是將Fe為0.2%以上的區域視為β相,將在Fe低於0.2%的區域中,Cu為5%以上的區域視為Ti-Cu系金屬間化合物,且將Si為1%以上的區域視為Ti-Si系金屬間化合物。如上述進行分離,並求算所得之區域的面積率。(Measuring Method of Metal Structure) The area fractions of the α phase, the β phase, and the intermetallic compound were determined by SEM observation and EPMA analysis to obtain an area ratio. In the SEM observation, a backscattered electron image (composed image) was observed, whereby the Ti-Si-based intermetallic compound was observed to be black. On the other hand, the Ti-Cu-based intermetallic compound and the β-phase are white, and therefore it is necessary to separate them. For this reason, in addition to the acceleration voltage of 15 kV for Si, Cu, and Fe, the surface analysis is performed by EPMA in 500 fields of one field (equivalent to 200 μm × 200 μm), and Cr and Mn are also used for Cr and Mn. get on. Further, the area corresponding to a total of 200 μm × 200 μm may be observed in a plurality of fields of view without being limited to one field of view, and the average of these may be calculated. Fe, Cr, and Mn are concentrated in the β phase, but not concentrated in the Ti-Cu intermetallic compound. Therefore, by comparing the backscattered electron image with the element distribution, the white portion can be separated and distinguished. Thereafter, the area ratio in the backscattered electron image is measured, thereby setting the respective area fractions. The measurement sample is mirror-finished using diamond particles on the measurement surface, and C or Au vapor deposition can be performed to ensure conductivity. In Fig. 5, a schematic diagram showing the EPMA analysis in the region of about 100 μm × about 100 μm for the Ti-Cu-Si-Mn component is shown. The rich position of each element is indicated in gray to black. Moreover, the broken line in the figure indicates the grain boundary of the tissue. Fe and Mn are concentrated at the same position and exist in grain boundaries or grains. Although there is a portion where Cu is concentrated at the same position as Fe and Mn, Cu is also present in a different portion from Fe and Mn, and this is a Ti-Cu-based intermetallic compound. Si is almost present in different places from Fe, Mn and Cu. Therefore, the area ratio of the intermetallic compound can be calculated by measuring the area ratio at which no Fe and Mn are concentrated in the concentrated position of Cu (arrow portion). Specifically, a region in which Fe is 0.2% or more is regarded as a β phase, and in a region where Fe is less than 0.2%, a region in which Cu is 5% or more is regarded as a Ti—Cu-based intermetallic compound, and Si is A region of 1% or more is regarded as a Ti-Si-based intermetallic compound. Separation was carried out as described above, and the area ratio of the obtained region was calculated.

(結晶粒徑) α相的平均結晶粒徑D(μm):20~70μm 於圖6中,顯示α相的平均結晶粒徑D(μm)與TIG熔接前後之0.2%降伏強度的變化量Δ0.2%降伏強度(=母材的0.2%降伏強度-熔接接頭的0.2%降伏強度)之關係。另,圖6中的各繪製點為α相的平均結晶粒徑以外的化學成分範圍(除了氧(O))及A值皆在本發明範圍內。具體而言,是以Ti-1.01%Cu-0.19%Si-0.03%Fe成分系,使氧量變化且熔解,並利用熱軋延、冷軋延及退火而製得板厚為0.5mm的薄板。且將熱處理條件作各種變更而調整結晶粒徑。組織皆無β相,且金屬間化合物的面積分率亦在1%以下。將製得之薄板進行TIG熔接,並以熔接焊珠在平行部中央部之方式採取熔接接頭之拉伸試驗片。TIG熔接時,是使用日鐵住金熔接工業股份有限公司製之NSSW Ti-28(相當於JIS Z3331 STi0100J)。熔接條件為電流:50A、電壓:15V、速度:80cm/min。拉伸試驗片的形狀為平行部寬度為6.25mm、試驗片之原評點間距離為25mm,且試驗片的厚度為原本板厚之扁平型拉伸試驗片。然而,在熔接時板子會翹曲故會進行形狀矯正,為除去形狀矯正所造成之應變,會以550℃進行30分鐘的退火。且確認到並無因該退火而導致的粒徑變化。應變速度是以0.5%/min進行至應變量為1%為止,之後則以30%/min進行至斷裂為止。(Crystal grain size) Average crystal grain size D (μm) of the α phase: 20 to 70 μm In Fig. 6, the average crystal grain size D (μm) of the α phase and the change amount of the 0.2% fall strength of the TIG before and after the TIG fusion are shown. .2% drop strength (= 0.2% relief strength of the base metal - 0.2% fall strength of the welded joint). Further, each of the plotted points in Fig. 6 is a range of chemical components other than the average crystal grain size of the α phase (except oxygen (O)) and A value are within the scope of the present invention. Specifically, a Ti-1.01% Cu-0.19% Si-0.03% Fe component system is used, and the amount of oxygen is changed and melted, and a sheet having a thickness of 0.5 mm is obtained by hot rolling, cold rolling, and annealing. . Further, the crystal grain size was adjusted by variously changing the heat treatment conditions. The tissue has no β phase, and the area fraction of the intermetallic compound is also less than 1%. The obtained sheet was subjected to TIG welding, and a tensile test piece of a welded joint was taken in such a manner that the welded bead was in the central portion of the parallel portion. When TIG is welded, NSSW Ti-28 (corresponding to JIS Z3331 STi0100J) manufactured by Nippon Steel & Sumitomo Metal Co., Ltd. is used. The welding conditions were current: 50 A, voltage: 15 V, and speed: 80 cm/min. The shape of the tensile test piece was a flat tensile test piece having a parallel portion width of 6.25 mm, a distance between the original evaluation points of the test piece of 25 mm, and a test piece thickness of the original plate thickness. However, the shape is corrected when the plate is warped during welding, and the strain caused by the shape correction is removed, and annealing is performed at 550 ° C for 30 minutes. It was confirmed that there was no change in particle size due to the annealing. The strain rate was carried out at 0.5%/min until the strain amount was 1%, and then proceeded to break at 30%/min.

α相的平均結晶粒徑D低於20μm時,Δ0.2%降伏強度會變大為10MPa以上。另一方面,若α相的平均結晶粒徑D超過70μm,則粒徑會變得過大,而有在成形時出現皺褶或階差之疑慮。因此,要令α相的平均結晶粒徑D為20~70μm。視所需,亦可將α相的平均結晶粒徑D下限設為23μm、25μm或28μm,且亦可將其上限設為60μm、55μm、50μm或45μm。When the average crystal grain size D of the α phase is less than 20 μm, the Δ0.2% fall strength becomes 10 MPa or more. On the other hand, when the average crystal grain size D of the α phase exceeds 70 μm, the particle diameter becomes excessively large, and there is a fear that wrinkles or steps are formed at the time of molding. Therefore, the average crystal grain size D of the α phase is made 20 to 70 μm. The lower limit of the average crystal grain size D of the α phase may be 23 μm, 25 μm or 28 μm as needed, and the upper limit thereof may be 60 μm, 55 μm, 50 μm or 45 μm.

(氧量與α相的平均結晶粒徑D之關係) 又,經針對從母材取出之試驗片進行拉伸試驗,並針對氧量與α相的平均結晶粒徑D之關係和致斷延伸率進行調查,而呈如圖7。於圖7中,○:致斷延伸率在42%以上,×:致斷延伸率低於42%,實線:(2)式。在不低於圖7中所記入之曲線即(2)式之範圍中,致斷延伸率為42%以上。故,是以(2)式為條件。(Relationship between the amount of oxygen and the average crystal grain size D of the α phase) Further, the tensile test was performed on the test piece taken out from the base material, and the relationship between the amount of oxygen and the average crystal grain size D of the α phase and the elongation at break were determined. The rate was investigated and presented as shown in Figure 7. In Fig. 7, ○: the elongation at break is 42% or more, ×: the elongation at break is less than 42%, and the solid line is (2). The breaking elongation is 42% or more in a range not less than the curve recited in Fig. 7, that is, the formula (2). Therefore, it is conditional on (2).

D[μm]≧0.8064×e 45.588[O]… (2)式 惟,e為自然對數之底數。 D[μm]≧0.8064×e 45.588[O] (2) where e is the base of the natural logarithm.

(Si添加量對於母材與熔接部之強度降低量之影響) 本發明之鈦板是如上述含有Si:0.10~0.30%,而Si添加量也會影響熔接接頭之強度確保(抑制HAZ部的粗大化)。當對鈦板施行熔接後,從熔融部至母材部會形成溫度分布,而連續形成以下區域:[1]熔融部、以及被加熱至β變態點以上或β變態點附近而針狀組織化之區域,[2]夾雜有α相與β相而導致α相之晶粒成長受到抑制的區域,[3]β相或α相粗大化之區域,[4]析出金屬間化合物之區域。區域[1]是因集合組織的隨機化或晶粒形状、以及在熔接時吸收O、N等,而較母材部略呈高強度。區域[2]或區域[4]是因β相或金屬間化合物導致α相的晶粒成長受到抑制,故維持與母材部相同程度的結晶粒徑,而不會與母材有大幅強度差。另一方面,區域[3]中α相粗大化,故依Hall-Petch法則而強度降低。因此,在試驗片寬度為6.25mm左右的窄寬度之熔接接頭拉伸試驗中,即便是在HAZ部中仍會在已粗粒化之區域[3]發生破裂。(Effect of the amount of addition of Si on the amount of strength reduction of the base material and the welded portion) The titanium plate of the present invention contains Si: 0.10 to 0.30% as described above, and the amount of Si added also affects the strength of the welded joint (inhibition of the HAZ portion) Coarse). When the titanium plate is welded, a temperature distribution is formed from the molten portion to the base material portion, and the following regions are continuously formed: [1] the molten portion, and heated to a point above the β-metamorphic point or near the β-metamorphic point and needle-like texturization In the region, [2] a region in which the α phase and the β phase are mixed to cause grain growth of the α phase, [3] a region in which the β phase or the α phase is coarsened, and [4] a region in which an intermetallic compound is precipitated. The region [1] is slightly higher in strength than the base material portion due to the randomization or grain shape of the aggregate structure and the absorption of O, N, etc. during welding. In the region [2] or the region [4], the crystal growth of the α phase is suppressed by the β phase or the intermetallic compound, so that the crystal grain size of the same level as that of the base material portion is maintained without a large difference in strength from the base material. . On the other hand, in the region [3], the α phase is coarsened, so the strength is lowered by the Hall-Petch rule. Therefore, in the tensile test of the welded joint of the narrow width of the test piece having a width of about 6.25 mm, cracking occurred in the coarsely granulated region [3] even in the HAZ portion.

圖8為顯示Si量、與在HAZ部分中包含有粗粒化之區域[3]的TIG熔接接頭之0.2%降伏強度和母材的0.2%降伏強度的差Δ0.2%降伏強度(=母材的0.2%降伏強度-熔接接頭的0.2%降伏強度)之關係的圖表。以真空電弧熔解製作含有Cu、Si、Cr及Mn的100g鑄塊,並將其等加熱至1100℃後,熱軋延且切削除去表面。之後,在與熱軋延相同方向上進行冷軋延,而作成板厚為0.5mm之薄板。以各種條件對該薄板進行熱處理,而將平均結晶粒徑調整為20~30μm左右。又,圖8中的各繪製點為Si量以外的化學成分範圍、A值、α相的平均結晶粒徑D皆在本發明範圍內。金屬間化合物的面積分率低於1%,且β相的面積分率低於3%。以與上述結晶粒徑的情況相同之方法進行TIG熔接及拉伸試驗後之結果,在0.10%的Si以上時,可將熔接後的強度降低抑制在10MPa以下。因此,必須含有0.10%以上的Si。為抑制熔接後的強度降低,亦可將Si量的下限設為0.14%、0.17%或0.20%。Figure 8 is a graph showing the difference between the amount of Si, the 0.2% drop strength of the TIG fusion joint of the region containing the coarse grained portion [3] in the HAZ portion, and the 0.2% fall strength of the base material (= mother A graph of the relationship between the 0.2% relief strength of the material and the 0.2% relief strength of the welded joint. A 100 g ingot containing Cu, Si, Cr, and Mn was produced by vacuum arc melting, and the like was heated to 1,100 ° C, and then hot rolled and cut to remove the surface. Thereafter, cold rolling was performed in the same direction as the hot rolling, and a sheet having a thickness of 0.5 mm was formed. The sheet was heat-treated under various conditions to adjust the average crystal grain size to about 20 to 30 μm. Further, each of the plotted points in Fig. 8 is a chemical component range other than the amount of Si, an A value, and an average crystal grain size D of the α phase are within the scope of the present invention. The area fraction of the intermetallic compound is less than 1%, and the area fraction of the β phase is less than 3%. As a result of performing TIG welding and tensile test in the same manner as in the case of the above-described crystal grain size, when 0.10% or more of Si is used, the decrease in strength after welding can be suppressed to 10 MPa or less. Therefore, it is necessary to contain 0.10% or more of Si. In order to suppress the decrease in strength after welding, the lower limit of the amount of Si may be set to 0.14%, 0.17% or 0.20%.

(製造方法之一例) 本發明之鈦板可藉由對滿足上述化學成分及A值之Ti鑄塊施行熱軋延、冷軋延,並令冷軋延後之退火條件為預定之條件而製造。且視所需,亦可在冷軋延後的退火之後進行調質軋延。針對各製造條件,於以下詳細說明。(An example of the production method) The titanium plate of the present invention can be produced by subjecting a Ti ingot satisfying the above chemical composition and the A value to hot rolling, cold rolling, and annealing conditions after the cold rolling is delayed. . Quenching and tempering may also be performed after the cold rolling delay annealing, as needed. The respective manufacturing conditions will be described in detail below.

(熱軋延條件) 於熱軋延是使用利用VAR(真空電弧熔解)、EBR(電子束熔解)或電漿電弧熔解等,以一般方式製得之鑄錠。若其為矩形,則亦可直接進行熱軋延。若非上述情形時,則進行鍛造或分塊軋延以成形為矩形。如上述而得之矩形扁胚會以一般的熱軋溫度及軋縮率,即800~1000℃、50%以上之軋來進行熱軋延。(Hot Rolling Condition) The hot rolling is an ingot obtained by a general method using VAR (vacuum arc melting), EBR (electron beam melting) or plasma arc melting. If it is rectangular, it can also be directly subjected to hot rolling. If it is not the case, it is forged or rolled to form a rectangle. The rectangular flat embryo obtained as described above is subjected to hot rolling at a general hot rolling temperature and a rolling reduction ratio of 800 to 1000 ° C and 50% or more.

(冷軋延條件) 於冷軋延前,進行去應變之退火及一般的脫鏽。亦可不實施去應變退火(中間退火),且並無特別限制溫度或時間。作為慣例,去應變退火是以較β變態點低之溫度進行,具體而言是以較β變態點低30℃以上之溫度進行。本合金系中β變態點雖亦會依合金組成而有所不同,但會在860~900℃的範圍內,故在本發明中宜在800℃上下實施。脫鏽之方法並無限制,可為噴砂、酸洗或機械切削等。但,若未充分脫鏽,在冷軋時會有發生破損的情況。另,冷軋延是依往常對熱軋板以50%以上之軋縮率進行。(Cold rolling condition) Before the cold rolling, the strain relief annealing and general derusting are performed. It is also possible not to perform strain relief annealing (intermediate annealing), and there is no particular limitation on temperature or time. As a rule, strain relief annealing is performed at a temperature lower than the β-deformation point, specifically, at a temperature lower than the β-deformation point by 30 ° C or more. The β-metamorphic point in the alloy system may vary depending on the alloy composition, but it is in the range of 860 to 900 ° C. Therefore, in the present invention, it is preferable to carry out the method at 800 ° C or higher. There is no limitation on the method of derusting, and it may be sand blasting, pickling or mechanical cutting. However, if the rust is not sufficiently removed, damage may occur during cold rolling. In addition, the cold rolling is conventionally performed on the hot rolled sheet at a rolling reduction ratio of 50% or more.

(退火條件) 冷軋延後的退火,首先一開始是進行低溫之分批式退火,接著必須設成為高溫之連續式退火。以其他方法譬如僅以1次的退火(高溫或低溫之分批式或連續式退火)並無法獲得本發明之組織,而無法達成目標特性。且,即便是2次的退火,以低溫之分批式退火後的高溫之連續式退火之外的方法,仍無法獲得本發明組織,而無法達成目標特性。(annealing conditions) Annealing after cold rolling is first performed at a low temperature batch annealing, followed by continuous annealing at a high temperature. The structure of the present invention cannot be obtained by other methods such as annealing only once (high-temperature or low-temperature batch or continuous annealing), and the target characteristics cannot be achieved. Further, even in the case of the secondary annealing, the method of the present invention cannot be obtained by a method other than the continuous annealing at a high temperature after the low-temperature batch annealing, and the target characteristics cannot be achieved.

於此,分批式之低溫退火的目的為Cu之固熔與α相之晶粒成長。分批式之退火中由於卷料內的升溫速度不同,故必須進行8小時以上的退火,以抑制卷料內之不均一。且為了防止卷料之接合,退火必須是在730℃以下。此外,在低溫區中,會有Ti-Cu系金屬間化合物與Ti-Si系金屬間化合物析出。因此,必須設定退火溫度的上限,以使該等金屬間化合物不會成長,且需退火溫度的下限,以使Cu之固熔與α相之晶粒成長能夠進行。故,退火溫度是設為700~730℃。Here, the purpose of batch-type low-temperature annealing is the solid growth of Cu and the grain growth of the α phase. In the batch type annealing, since the temperature rise rate in the coil material is different, it is necessary to perform annealing for 8 hours or more to suppress unevenness in the coil material. And in order to prevent the bonding of the coils, the annealing must be below 730 °C. Further, in the low temperature region, a Ti-Cu-based intermetallic compound and a Ti-Si-based intermetallic compound are precipitated. Therefore, it is necessary to set the upper limit of the annealing temperature so that the intermetallic compounds do not grow, and the lower limit of the annealing temperature is required, so that the solidification of Cu and the grain growth of the α phase can be performed. Therefore, the annealing temperature is set to 700 to 730 °C.

(高溫退火條件) 為減少在低溫分批式退火中析出之金屬間化合物,接著在高溫退火中至少保持於高溫區10秒以上。保持溫度是設為780~820℃。若令此時之保持時間為長時間則會使硬化層增厚,故最久也是設為2分鐘。以分批式退火並無法進行如上述之短時間退火,而必須設為連續式退火。以高溫之連續式退火雖可降低Ti-Si系金屬間化合物的面積分率,但因Ti-Si系金屬間化合物較早析出,故從保持溫度至550℃為止的高溫之連續式退火後的冷卻速度是設為5℃/s以上。(High-temperature annealing conditions) In order to reduce the intermetallic compound precipitated in the low-temperature batch annealing, it is maintained at at least a high temperature region for at least 10 seconds in the high-temperature annealing. Keep the temperature at 780~820 °C. If the holding time at this time is long, the hardened layer will be thickened, so the longest time is also set to 2 minutes. Annealing in batch mode does not allow for a short time anneal as described above, but must be a continuous anneal. Although continuous annealing at a high temperature can reduce the area fraction of the Ti-Si-based intermetallic compound, since the Ti-Si-based intermetallic compound precipitates early, the continuous annealing from a high temperature up to 550 ° C is maintained. The cooling rate is set to 5 ° C / s or more.

實施例 以真空電弧熔解製作表1~3中記載之No.1~No.97之含Cu、Si、Mn及Cr的300g的Ti鑄塊,並將其等加熱至1100℃後,熱軋延且切削除去表面。之後,在與熱軋延相同方向上進行冷軋延,而作成板厚為0.5mm之薄板。以表4~6中記載的各種條件對該薄板(No.1~No.97)進行退火(將最初之退火標記為「退火1」,其次的退火標記為「退火2」)。又,對於退火,若冷卻為FC(爐冷)時,實施分批式(真空) 退火(表4~6中標記為「分批式」),而其他情況則實施連續式(Ar氣體) 退火(表4~6中標記為「連續式」)。分批式退火是模擬卷料製造,將2片薄板重疊進行退火。僅在進行分批式退火後,調查退火後2片薄板有無接合。當無伴隨大幅變形而可剝離2片薄板時評價為○,雖有變形但可剝離者評價為△,而無法剝離者則評價為×。在調查有無接合時,若有變形的情況下,是呈以接合部分為起點之彎曲變形。另,若未進行分批式退火,則在「有無分批式接合」的欄位中填入「-」。在退火2之各欄位皆為「-」者並未進行退火2。In the examples, 300 g of Ti ingots containing Cu, Si, Mn, and Cr of Nos. 1 to 97 described in Tables 1 to 3 were produced by vacuum arc melting, and the like was heated to 1,100 ° C, and then hot rolled. And cutting removes the surface. Thereafter, cold rolling was performed in the same direction as the hot rolling, and a sheet having a thickness of 0.5 mm was formed. The thin plates (No. 1 to No. 97) were annealed under various conditions described in Tables 4 to 6 (the first annealing was marked as "annealing 1", and the next annealing was marked as "annealing 2"). Further, for annealing, if the cooling is FC (furnace cooling), batch (vacuum) annealing is performed (labeled as "batch type" in Tables 4 to 6), and in other cases, continuous (Ar gas) annealing is performed. (marked as "continuous" in Tables 4-6). Batch annealing is an analog coil manufacturing process in which two sheets are overlapped for annealing. Only after batch annealing was performed, the presence or absence of joining of the two sheets after annealing was investigated. When two sheets were peeled off without a large deformation, the evaluation was ○, and although it was deformed, the peelable one was evaluated as Δ, and the peelable one was evaluated as ×. In the case of investigation of the presence or absence of the joint, in the case of deformation, it is a bending deformation starting from the joint portion. In addition, if batch annealing is not performed, fill in "-" in the field of "with or without batch bonding". Anneal 2 was not performed in the column where the annealing 2 was "-".

又,針對有接合者,不進行TIG熔接等評價,僅進行拉伸試驗與平均結晶粒徑之測量。此外,確認進行至退火2後的板子之表面狀態,將相當於現行之實機量產材的等級評價為○,無法作為製品出貨之等級則評價為×(顯示為「表面狀態」)。除此之外,進行使用有厚度為50μm之鐵氟龍(註冊商標)片作為潤滑劑之球頭突出試驗直到突出高度達到15mm為止,並觀察外觀的皺褶發生程度,令並未發生表面粗化者為○,且令發生表面粗化者為×(顯示為「加工後的表面」)。Further, for the jointed person, the TIG welding or the like was not evaluated, and only the tensile test and the measurement of the average crystal grain size were performed. In addition, the surface state of the board after the annealing 2 was confirmed, and the grade corresponding to the current actual mass production material was evaluated as ○, and the grade which could not be shipped as the product was evaluated as × (displayed as "surface state"). In addition, a ball-end protrusion test using a Teflon (registered trademark) sheet having a thickness of 50 μm as a lubricant was performed until the protrusion height reached 15 mm, and the degree of occurrence of wrinkles was observed, so that the surface roughness did not occur. The dermatizer is ○, and the surface roughening is × (displayed as "processed surface").

將製得之薄板進行TIG熔接,並以熔接焊珠在平行部中央部之方式採取拉伸試驗片。TIG熔接時,考量到廣用性而是使用日鐵住金熔接工業股份有限公司製之製品NSSW Ti-28(相當於JIS Z3331 STi0100J)。熔接條件為電流:50A、電壓:15V、速度:80cm/min。拉伸試驗片的形狀為平行部寬度為6.25mm、試驗片之原評點間距離為25mm,且試驗片的厚度為原本板厚之扁平型拉伸試驗片。然而,在熔接時板子會翹曲故會進行形狀矯正,為除去形狀矯正所造成之應變,會以550℃進行30分鐘的退火(平均結晶粒徑無變化)。應變速度是以0.5%/min進行至應變量為1%為止,之後則以30%/min進行至斷裂為止。另,TIG熔接及熔接後的拉伸試驗是針對一部分進行試驗。且令TIG熔接前後的0.2%降伏強度差(顯示為Δ0.2%降伏強度(MPa))在10MPa以下時為合格。於表7~9中顯示針對No.1~No.97之各薄板求得之α相的平均結晶粒徑D(顯示為粒徑(μm))、α相的面積分率(顯示為α相率(%))、β相的面積分率(顯示為β相率(%))、金屬間化合物的面積分率(顯示為金屬間化合物(%))、0.2%降伏強度(顯示為降伏強度(MPa))、致斷延伸率(顯示為延伸率(%))、外觀(顯示為表面狀態)、0.8064×e 45.588[O]之值((2)式的右邊:顯示為「(2)式(μm)」)、(2)式的判定結果(顯示為「(2)式(μm)判定」):令D-0.8064×e 45.588[O]的值為負時為「×」,0以上時為「○」)、以及本發明與比較例之分類。 The obtained thin plate was subjected to TIG welding, and a tensile test piece was taken in such a manner that the welded bead was in the central portion of the parallel portion. In the case of TIG welding, NSSW Ti-28 (corresponding to JIS Z3331 STi0100J) manufactured by Nippon Steel & Sumitomo Metal Co., Ltd. was used in consideration of versatility. The welding conditions were current: 50 A, voltage: 15 V, and speed: 80 cm/min. The shape of the tensile test piece was a flat tensile test piece having a parallel portion width of 6.25 mm, a distance between the original evaluation points of the test piece of 25 mm, and a test piece thickness of the original plate thickness. However, the shape is corrected when the plate is warped at the time of welding, and the strain due to the shape correction is removed, and annealing is performed at 550 ° C for 30 minutes (the average crystal grain size is not changed). The strain rate was carried out at 0.5%/min until the strain amount was 1%, and then proceeded to break at 30%/min. In addition, the TIG welding and the tensile test after welding are tested for a part. Moreover, the 0.2% drop strength difference (shown as Δ0.2% drop strength (MPa)) before and after TIG welding was acceptable when it was 10 MPa or less. Tables 7 to 9 show the average crystal grain size D (shown as particle diameter (μm)) of the α phase obtained for each of the sheets of No. 1 to No. 97, and the area fraction of the α phase (shown as α phase). Rate (%)), area fraction of β phase (shown as β phase ratio (%)), area fraction of intermetallic compound (shown as intermetallic compound (%)), 0.2% drop strength (shown as fall strength) (MPa)), elongation at break (displayed as elongation (%)), appearance (displayed as surface state), value of 0.8064 × e 45.588 [O] (right of formula (2): display as "(2) The judgment result of the formula (μm)") and (2) (displayed as "(2) Formula (μm) judgment"): when the value of D-0.8064 × e 45.588 [O] is negative, it is "X", 0 The above is "○"), and the classification of the present invention and the comparative example.

化學成分範圍、A值、金屬組織及α相的平均結晶粒徑D皆在本發明範圍內之No.1、34~37、60~62、80、86~97(本發明例)滿足以下各項:0.2%降伏強度:215MPa以上、致斷延伸率:42%以上、熔接接頭的強度降低量:10MPa以下。The chemical composition range, the A value, the metal structure, and the average crystal grain size D of the α phase are all in the range of No. 1, 34 to 37, 60 to 62, 80, 86 to 97 (invention of the present invention) within the scope of the present invention. Item: 0.2% relief strength: 215 MPa or more, elongation at break: 42% or more, strength reduction of welded joint: 10 MPa or less.

其他(比較例)則如下所示。 No.2的A值小於1.15質量%,且0.2%降伏強度低。且,因並未添加有Si,故熔接接頭之強度降低變大。 No.3並未添加有Si,故熔接接頭之強度降低變大。 No.4的A值小於1.15質量%,且0.2%降伏強度低。又,熔接接頭之強度降低較小是因母材之α相的平均結晶粒徑D大之故。 No.5之母材之α相的平均結晶粒徑D超過70μm,而在加工時於表面發生皺褶。又,因粒徑D大,故即便A值在1.15以上,0.2%降伏強度仍低。另,熔接接頭之強度降低較小是因母材之α相的平均結晶粒徑D大之故。 No.6的A值小於1.15質量%,且0.2%降伏強度低。且,因並未添加有Si,故熔接接頭之強度降低變大。 No.7並未添加有Si,故熔接接頭之強度降低變大。 No.8的A值小於1.15質量%,且0.2%降伏強度低。且,因並未添加有Si,故熔接接頭之強度降低變大。 No.9並未添加有Si,故熔接接頭之強度降低變大。 No.10的A值小於1.15質量%,且0.2%降伏強度低。且,因並未添加有Si,故熔接接頭之強度降低變大。 No.11並未添加有Si,故熔接接頭之強度降低變大。 No.12的A值小於1.15質量%,且0.2%降伏強度低。且,因並未添加有Si,故熔接接頭之強度降低變大。 No.13並未添加有Si,故熔接接頭之強度降低變大。 No.14、15因退火過於低溫而α相的平均結晶粒徑D小於20μm,且致斷延伸率變小。 No.16、17因退火導致2片薄板接合且無法剝離。故未實施拉伸試驗。 No.18、19因退火過於低溫而α相的平均結晶粒徑D小於20μm,且致斷延伸率變小。 No.20、21因在高溫區長時間退火,故致斷延伸率變小。 No.22~29之α相的平均結晶粒徑D未滿足(2)式,且致斷延伸率變小,熔接接頭的強度降低亦變大。此外,No.22~25因退火過於低溫而α相的平均結晶粒徑D小於20μm,且金屬間化合物的面積分率也變高。 No.30~33之α相的平均結晶粒徑D小於20μm,且致斷延伸率變小。並且,熔接接頭的強度降低變大。 No.38、39之退火過於低溫且為爐冷,故α相的平均結晶粒徑D小於20μm,金屬間化合物的面積分率也變高。 No.40、41之退火為高溫,故2片薄板接合且無法剝離。因此,未實施拉伸試驗。 No.42、43之退火過於低溫且為爐冷,故α相的平均結晶粒徑D小於20μm,金屬間化合物的面積分率也變高。 No.44、45之α相的平均結晶粒徑D未滿足(2)式,且致斷延伸率變小。 No.46~49之退火過於低溫且為爐冷,故α相的平均結晶粒徑D小於20μm,金屬間化合物的面積分率也變高。 No.50、51之母材之α相的平均結晶粒徑D超過70μm,而在加工時於表面發生皺褶,且0.2%降伏強度低。且,因並未添加有Si,故熔接接頭之強度降低變大。 No.52、53之α相的平均結晶粒徑D小於20μm,且因並未添加有Si而熔接接頭的強度降低變大。 No.54~56並未添加有Si,故熔接接頭的強度降低變大。 No.57~59之α相的平均結晶粒徑D小於20μm,且因並未添加有Si而熔接接頭的強度降低變大。 No.63之α相的平均結晶粒徑D未滿足(2)式,且致斷延伸率變小。 No.64之α相的平均結晶粒徑D小於20μm,且致斷延伸率變小。 No.65之α相的平均結晶粒徑D未滿足(2)式,且致斷延伸率變小。 No.66、67之α相的平均結晶粒徑D小於20μm,且致斷延伸率變小。 No.68之退火為高溫,故2片薄板接合且無法剝離。因此,未實施拉伸試驗。 No.69之A值小於1.15質量%,且0.2%降伏強度低。 No.70、71並未添加有Si,故熔接接頭之強度降低變大。 No.72~75之α相的平均結晶粒徑D小於20μm,且熔接接頭之強度降低變大。 No.76~79之金屬間化合物的面積分率超過1%,而致斷延伸率變小。 No.81之α相的平均結晶粒徑D小於20μm,且致斷延伸率變小。 No.82、83之分批式退火的冷卻速度較慢,故金屬間化合物的面積分率超過1%,而致斷延伸率變小。並且,外觀差。 No.84在分批式退火中發生燒黏,而外觀差。 No.85因連續式退火為高溫,故β相的面積分率超過5%,而致斷延伸率變小。Other (comparative examples) are as follows. The A value of No. 2 was less than 1.15 mass%, and the 0.2% fall strength was low. Further, since Si is not added, the strength of the welded joint is lowered. No. 3 is not added with Si, so the strength of the welded joint is lowered. The A value of No. 4 was less than 1.15 mass%, and the 0.2% fall strength was low. Further, the decrease in the strength of the welded joint is small because the average crystal grain size D of the α phase of the base material is large. The α-phase of the base material of No. 5 had an average crystal grain size D of more than 70 μm, and wrinkles were formed on the surface during processing. Further, since the particle diameter D is large, even if the A value is 1.15 or more, the 0.2% lodging strength is low. Further, the decrease in the strength of the welded joint is small because the average crystal grain size D of the α phase of the base material is large. The A value of No. 6 was less than 1.15 mass%, and the 0.2% fall strength was low. Further, since Si is not added, the strength of the welded joint is lowered. No. 7 is not added with Si, so the strength of the welded joint is lowered. The A value of No. 8 was less than 1.15 mass%, and the 0.2% fall strength was low. Further, since Si is not added, the strength of the welded joint is lowered. No. 9 is not added with Si, so the strength of the welded joint is lowered. The A value of No. 10 was less than 1.15 mass%, and the 0.2% fall strength was low. Further, since Si is not added, the strength of the welded joint is lowered. No. 11 is not added with Si, so the strength of the welded joint is lowered. The A value of No. 12 was less than 1.15 mass%, and the 0.2% fall strength was low. Further, since Si is not added, the strength of the welded joint is lowered. No. 13 is not added with Si, so the strength of the welded joint is lowered. No. 14 and 15 were too low in annealing, and the average crystal grain size D of the α phase was less than 20 μm, and the elongation at break was small. No. 16, 17 caused the joining of two sheets due to annealing and could not be peeled off. Therefore, the tensile test was not carried out. No. 18 and 19 were too low in annealing, and the average crystal grain size D of the α phase was less than 20 μm, and the elongation at break was small. Since No. 20 and 21 are annealed for a long time in a high temperature region, the elongation at break becomes small. The average crystal grain size D of the α phase of No. 22 to 29 does not satisfy the formula (2), and the elongation at break becomes small, and the strength of the welded joint is also lowered. Further, in Nos. 22 to 25, the annealing averaged too low, and the average crystal grain size D of the α phase was less than 20 μm, and the area fraction of the intermetallic compound also became high. The average crystal grain size D of the α phase of No. 30 to 33 is less than 20 μm, and the elongation at break becomes small. Further, the strength of the welded joint is lowered. Since the annealing of No. 38 and 39 is too low temperature and furnace cooling, the average crystal grain size D of the α phase is less than 20 μm, and the area fraction of the intermetallic compound also becomes high. The annealing of No. 40 and 41 was at a high temperature, so that two sheets were joined and could not be peeled off. Therefore, the tensile test was not carried out. Since the annealing of Nos. 42 and 43 is too low temperature and furnace cooling, the average crystal grain size D of the α phase is less than 20 μm, and the area fraction of the intermetallic compound also becomes high. The average crystal grain size D of the α phase of No. 44 and 45 did not satisfy the formula (2), and the elongation at break became small. Since the annealing of No. 46 to 49 is too low and the furnace is cooled, the average crystal grain size D of the α phase is less than 20 μm, and the area fraction of the intermetallic compound is also high. The α-phase of the base material of No. 50 and 51 had an average crystal grain size D of more than 70 μm, and wrinkles were formed on the surface during processing, and the 0.2% lodging strength was low. Further, since Si is not added, the strength of the welded joint is lowered. The average crystal grain size D of the α phase of Nos. 52 and 53 is less than 20 μm, and the strength of the welded joint is lowered due to the absence of Si. No. 54 to 56 are not added with Si, so the strength of the welded joint is lowered. The average crystal grain size D of the α phase of No. 57 to 59 is less than 20 μm, and the strength of the welded joint is lowered due to the absence of Si. The average crystal grain size D of the α phase of No. 63 does not satisfy the formula (2), and the elongation at break becomes small. The average crystal grain size D of the α phase of No. 64 is less than 20 μm, and the elongation at break becomes small. The average crystal grain size D of the α phase of No. 65 does not satisfy the formula (2), and the elongation at break becomes small. The average crystal grain size D of the α phase of No. 66 and 67 was less than 20 μm, and the elongation at break was small. The annealing of No. 68 was at a high temperature, so that two sheets were joined and could not be peeled off. Therefore, the tensile test was not carried out. The A value of No. 69 is less than 1.15 mass%, and the 0.2% fall strength is low. No. 70 and 71 were not added with Si, so the strength of the welded joint was lowered. The average crystal grain size D of the α phase of No. 72 to 75 is less than 20 μm, and the strength of the welded joint is lowered. The area fraction of the intermetallic compound of No. 76 to 79 exceeds 1%, and the elongation at break becomes small. The average crystal grain size D of the α phase of No. 81 is less than 20 μm, and the elongation at break becomes small. The batch annealing of No. 82 and 83 has a slow cooling rate, so the area fraction of the intermetallic compound exceeds 1%, and the elongation at break becomes small. Also, the appearance is poor. No. 84 burned in batch annealing and had a poor appearance. No. 85 is a high temperature due to continuous annealing, so the area fraction of the β phase exceeds 5%, and the elongation at break becomes small.

[表1] [表2] [表3] [表4] [表5] [表6] [表7] [表8] [表9] [Table 1] [Table 2] [table 3] [Table 4] [table 5] [Table 6] [Table 7] [Table 8] [Table 9]

產業上之可利用性 本發明之鈦板可適當應用於例如熱交換器、熔接管、消音器等二輪排氣系統及建材等。Industrial Applicability The titanium plate of the present invention can be suitably applied to, for example, a two-wheel exhaust system such as a heat exchanger, a fusion pipe, a muffler, and the like.

圖1是顯示A值與0.2%降伏強度之關係的圖表。 圖2是顯示A值與致斷延伸率之關係的圖表。 圖3是顯示β相的面積分率與0.2%降伏強度之關係的圖表。 圖4是顯示金屬間化合物的面積分率與延伸率之關係的圖表。 圖5是針對Ti-Cu-Si-Mn成分系在約100μm×約100μm的區域中進行EPMA分析後的示意圖。 圖6是顯示α相的平均結晶粒徑D(μm)與TIG熔接接頭與母材的0.2%降伏強度的變化量之關係的圖表。 圖7是顯示氧量與α相的平均結晶粒徑D與母材的致斷延伸率之關係的圖表。 圖8是顯示Si量與HAZ部中粗粒化後的區域[3]之TIG熔接前後的降伏強度降低量Δ0.2%降伏強度的關係之圖表。Figure 1 is a graph showing the relationship between the A value and the 0.2% fall strength. Figure 2 is a graph showing the relationship between the A value and the elongation at break. Fig. 3 is a graph showing the relationship between the area fraction of the β phase and the 0.2% fall strength. 4 is a graph showing the relationship between the area fraction of an intermetallic compound and the elongation. Fig. 5 is a schematic view showing the EPMA analysis of the Ti-Cu-Si-Mn component in a region of about 100 μm × about 100 μm. Fig. 6 is a graph showing the relationship between the average crystal grain size D (μm) of the α phase and the amount of change in the 0.2% drop strength of the TIG fusion joint and the base material. Fig. 7 is a graph showing the relationship between the amount of oxygen and the average crystal grain size D of the α phase and the elongation at break of the base material. Fig. 8 is a graph showing the relationship between the amount of Si and the amount of decrease in the drop strength of the Δ0.2% before and after the TIG welding in the region [3] after coarsening in the HAZ portion.

Claims (8)

一種鈦板,其化學成分以質量%計為Cu:0.70~1.50%、Cr:0~0.40%、Mn:0~0.50%、Si:0.10~0.30%、O:0~0.10%、Fe:0~0.06%、N:0~0.03%、C:0~0.08%、H:0~0.013%、除上述及Ti以外之元素:各為0~0.1%,且其等之總和在0.3%以下、及剩餘部分:Ti;下述(1)式所定義之A值為1.15~2.5質量%;其金屬組織中,α相的面積分率在95%以上,β相的面積分率在5%以下,金屬間化合物的面積分率在1%以下;α相的平均結晶粒徑D(μm)為20~70μm且滿足下述(2)式;A=[Cu]+0.98[Cr]+1.16[Mn]+3.4[Si]...(1)式D[μm]≧0.8064×e45.588[O]...(2)式 惟,e為自然對數的底數。 A titanium plate whose chemical composition is Cu: 0.70 to 1.50%, Cr: 0 to 0.40%, Mn: 0 to 0.50%, Si: 0.10 to 0.30%, O: 0 to 0.10%, Fe: 0 in mass% ~0.06%, N: 0~0.03%, C: 0~0.08%, H: 0~0.013%, elements other than the above and Ti: each is 0~0.1%, and the sum of them is less than 0.3%, And the remainder: Ti; the A value defined by the following formula (1) is 1.15 to 2.5% by mass; in the metal structure, the area fraction of the α phase is 95% or more, and the area fraction of the β phase is 5% or less. The area fraction of the intermetallic compound is 1% or less; the average crystal grain size D (μm) of the α phase is 20 to 70 μm and satisfies the following formula (2); A = [Cu] + 0.98 [Cr] + 1.16 [ Mn]+3.4[Si] (1) Formula D [μm] ≧ 0.8064 × e 45.588 [O] (2) Formula, where e is the base of the natural logarithm. 如請求項1之鈦板,其中前述金屬組織之α相、β相及金屬間化合物的面積分率總計為100%。 The titanium plate according to claim 1, wherein the area fraction of the α phase, the β phase, and the intermetallic compound of the metal structure is 100% in total. 如請求項1之鈦板,其中前述金屬間化合物為Ti-Si系金屬間化合物與Ti-Cu系金屬間化合物。 The titanium plate according to claim 1, wherein the intermetallic compound is a Ti-Si-based intermetallic compound and a Ti-Cu-based intermetallic compound. 如請求項2之鈦板,其中前述金屬間化合物為Ti-Si系金屬間化合物與Ti-Cu系金屬間化合物。 The titanium plate according to claim 2, wherein the intermetallic compound is a Ti-Si-based intermetallic compound and a Ti-Cu-based intermetallic compound. 如請求項1之鈦板,其板厚為0.3~1.5mm,0.2%降伏強度在215MPa以上,且在試驗片之平行部寬度為6.25mm、試驗片之原評點間距離為25mm、試驗片厚度為原本板厚之扁平型拉伸試驗片測得之致斷延伸率為42%以上。 The titanium plate of claim 1 has a plate thickness of 0.3 to 1.5 mm, a 0.2% relief strength of 215 MPa or more, and a parallel portion width of the test piece of 6.25 mm, a distance between the original evaluation points of the test piece of 25 mm, and a test piece thickness. The elongation at break measured for the flat tensile test piece of the original thickness was 42% or more. 如請求項2之鈦板,其板厚為0.3~1.5mm,0.2%降伏強度在215MPa以上,且在試驗片之平行部寬度為6.25mm、試驗片之原評點間距離為25mm、試驗片厚度為原本板厚之扁平型拉伸試驗片測得之致斷延伸率為42%以上。 The titanium plate of claim 2 has a plate thickness of 0.3 to 1.5 mm, a 0.2% relief strength of 215 MPa or more, and a parallel portion width of the test piece of 6.25 mm, a distance between the original evaluation points of the test piece of 25 mm, and a test piece thickness. The elongation at break measured for the flat tensile test piece of the original thickness was 42% or more. 如請求項3之鈦板,其板厚為0.3~1.5mm,0.2%降伏強度在215MPa以上,且在試驗片之平行部寬度為6.25mm、試驗片之原評點間距離為25mm、試驗片厚度為原本板厚之扁平型拉伸試驗片測得之致斷延伸率為42%以上。 The titanium plate of claim 3 has a plate thickness of 0.3 to 1.5 mm, a 0.2% relief strength of 215 MPa or more, and a parallel portion width of the test piece of 6.25 mm, a distance between the original evaluation points of the test piece of 25 mm, and a test piece thickness. The elongation at break measured for the flat tensile test piece of the original thickness was 42% or more. 如請求項4之鈦板,其板厚為0.3~1.5mm,0.2%降伏強度在215MPa以上,且在試驗片 之平行部寬度為6.25mm、試驗片之原評點間距離為25mm、試驗片厚度為原本板厚之扁平型拉伸試驗片測得之致斷延伸率為42%以上。 The titanium plate of claim 4 has a plate thickness of 0.3 to 1.5 mm, a 0.2% drop strength of 215 MPa or more, and a test piece. The flat elongation test piece having a width of 6.25 mm in parallel and a distance between the original evaluation points of the test piece of 25 mm and a test piece thickness of the original plate thickness was measured to have a breaking elongation of 42% or more.
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