TWI649620B - 含有光產鹼劑的光可成像組成物 - Google Patents

含有光產鹼劑的光可成像組成物 Download PDF

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Publication number
TWI649620B
TWI649620B TW105103253A TW105103253A TWI649620B TW I649620 B TWI649620 B TW I649620B TW 105103253 A TW105103253 A TW 105103253A TW 105103253 A TW105103253 A TW 105103253A TW I649620 B TWI649620 B TW I649620B
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TW
Taiwan
Prior art keywords
hept
ene
bicyclo
polymer
oxirane
Prior art date
Application number
TW105103253A
Other languages
English (en)
Chinese (zh)
Other versions
TW201636734A (zh
Inventor
漢德拉 恩
偉 鄭
Original Assignee
日商住友電木股份有限公司
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Filing date
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Application filed by 日商住友電木股份有限公司 filed Critical 日商住友電木股份有限公司
Publication of TW201636734A publication Critical patent/TW201636734A/zh
Application granted granted Critical
Publication of TWI649620B publication Critical patent/TWI649620B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0751—Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW105103253A 2015-02-18 2016-02-02 含有光產鹼劑的光可成像組成物 TWI649620B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562117769P 2015-02-18 2015-02-18
US62/117,769 2015-02-18

Publications (2)

Publication Number Publication Date
TW201636734A TW201636734A (zh) 2016-10-16
TWI649620B true TWI649620B (zh) 2019-02-01

Family

ID=55699781

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105103253A TWI649620B (zh) 2015-02-18 2016-02-02 含有光產鹼劑的光可成像組成物

Country Status (5)

Country Link
US (1) US9823565B2 (enExample)
JP (1) JP6442618B2 (enExample)
KR (1) KR20170117103A (enExample)
TW (1) TWI649620B (enExample)
WO (1) WO2016133794A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI649620B (zh) * 2015-02-18 2019-02-01 日商住友電木股份有限公司 含有光產鹼劑的光可成像組成物
CN111788246B (zh) * 2018-03-16 2022-06-10 3M创新有限公司 组合物、粘结方法和粘结组件

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060020068A1 (en) * 2004-07-07 2006-01-26 Edmund Elce Photosensitive compositions based on polycyclic polymers for low stress, high temperature films
US20070249484A1 (en) * 2004-07-21 2007-10-25 Johannes Benkhoff Process for the Photoactivation and use of a Catalyst by an Inverted Two-Stage Procedure
US20130181199A1 (en) * 2012-01-16 2013-07-18 Sumitomo Bakelite Co., Ltd. Thermo-oxidatively Stable, Side Chain Polyether Functionalized Polynorbornenes for Microelectronic and Optoelectronic Devices and Assemblies Thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6849377B2 (en) * 1998-09-23 2005-02-01 E. I. Du Pont De Nemours And Company Photoresists, polymers and processes for microlithography
EP1246013A3 (en) * 2001-03-30 2003-11-19 E.I. Du Pont De Nemours And Company Photoresists, polymers and processes for microlithography
US6737215B2 (en) * 2001-05-11 2004-05-18 Clariant Finance (Bvi) Ltd Photoresist composition for deep ultraviolet lithography
US8030425B2 (en) 2002-07-03 2011-10-04 Promerus Llc Photosensitive compositions based on polycyclic polymers for low stress, high temperature films
JP5521999B2 (ja) * 2009-11-26 2014-06-18 住友化学株式会社 化学増幅型フォトレジスト組成物及びレジストパターンの製造方法
WO2012053052A1 (ja) * 2010-10-19 2012-04-26 住友ベークライト株式会社 感光性樹脂組成物および半導体装置
US9261782B2 (en) * 2012-09-25 2016-02-16 Promerus, Llc Maleimide containing cycloolefinic polymers and applications thereof
TWI649620B (zh) * 2015-02-18 2019-02-01 日商住友電木股份有限公司 含有光產鹼劑的光可成像組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060020068A1 (en) * 2004-07-07 2006-01-26 Edmund Elce Photosensitive compositions based on polycyclic polymers for low stress, high temperature films
US20070249484A1 (en) * 2004-07-21 2007-10-25 Johannes Benkhoff Process for the Photoactivation and use of a Catalyst by an Inverted Two-Stage Procedure
US20130181199A1 (en) * 2012-01-16 2013-07-18 Sumitomo Bakelite Co., Ltd. Thermo-oxidatively Stable, Side Chain Polyether Functionalized Polynorbornenes for Microelectronic and Optoelectronic Devices and Assemblies Thereof

Also Published As

Publication number Publication date
WO2016133794A1 (en) 2016-08-25
JP2018511819A (ja) 2018-04-26
JP6442618B2 (ja) 2018-12-19
US20160238931A1 (en) 2016-08-18
US9823565B2 (en) 2017-11-21
KR20170117103A (ko) 2017-10-20
TW201636734A (zh) 2016-10-16

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