TWI649022B - Spherical body forming heat dissipation structure - Google Patents
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Abstract
本發明提供一種球狀體成型散熱結構,包含複數個球型散熱單元,各散熱單元係排列為一矩型立方體或依需求排列為任一形狀,當任一散熱單元與相鄰之任一散熱單元連接時,散熱單元之球心與相鄰散熱單元之球心之距離係為散熱單元之直徑,而在各相鄰之散熱單元間形成自然氣孔,本發明之球狀體成型散熱結構目的在於,相同體積空間時,可增加散熱結構之總表面積以及增加氣流在氣孔與各散熱單元之流動率,進而提升散熱結構整體散熱效率。 The invention provides a spherical body forming heat dissipating structure, which comprises a plurality of spherical heat dissipating units, wherein the heat dissipating units are arranged in a rectangular cube or arranged in any shape according to requirements, and any one of the heat dissipating units and the adjacent one of the heat dissipating units When the unit is connected, the distance between the center of the heat dissipating unit and the center of the adjacent heat dissipating unit is the diameter of the heat dissipating unit, and a natural air hole is formed between the adjacent heat dissipating units. The spherical body forming heat dissipating structure of the present invention is aimed at In the same volume space, the total surface area of the heat dissipation structure can be increased and the flow rate of the airflow in the air holes and the heat dissipation units can be increased, thereby improving the overall heat dissipation efficiency of the heat dissipation structure.
Description
本發明係為一散熱結構,特別為一以複數個球狀體的散熱單元所組合之散熱結構。 The invention is a heat dissipating structure, in particular, a heat dissipating structure combined with a plurality of spheroidal heat dissipating units.
隨著電子資訊產業快速發展,如中央處理器、顯示卡、主機板等電子元件已成為各種電子裝置所不可或缺的一部分,其中當電子元件工作效率提升,其運作時會產生熱量亦隨著增加,然而此熱量之累積,明顯與電子元件甚至整體裝置之使用壽命有極大的關聯。一般而言,當電子元件之平均工作溫度較低時,較能發揮最佳的處理效率以及最長的使用壽命,因此散熱結構的配置便是電子元件調節工作溫度的常用手段。 With the rapid development of the electronic information industry, electronic components such as central processing units, display cards, and motherboards have become an indispensable part of various electronic devices. When electronic components work more efficiently, they generate heat when they operate. Increase, however, this accumulation of heat is significantly associated with the life of electronic components and even the overall device. In general, when the average operating temperature of the electronic component is low, the optimal processing efficiency and the longest service life are exhibited, and thus the configuration of the heat dissipation structure is a common means for the electronic component to adjust the operating temperature.
現有的散熱結構,通常係為導熱部與散熱部之組合,其中導熱部係與電子元件接觸,並將所產生之熱量以導熱部傳導至散熱結構後,再藉由散熱部與氣體對流將熱能散出,其中散熱部為整齊排列之鰭片式結構為主流。然而其缺點在於鰭片式散熱部與外部空間的接觸並未能有最佳的利用,即達到最大之接觸面積,而未能發揮最佳的散熱效率,此外,鰭片式散熱部於生產步驟上,常以一整塊合金削切加工而成,其切割過程繁雜且產生許多廢料。故,如何將上述缺失問題加以改進,乃為本案發明 人所欲解決之技術困難點之所在。 The existing heat dissipation structure is usually a combination of a heat conduction portion and a heat dissipation portion, wherein the heat conduction portion is in contact with the electronic component, and the generated heat is conducted to the heat dissipation structure by the heat conduction portion, and then the heat is convected by the heat dissipation portion to heat the heat. Dissipated, in which the heat dissipating portion is a neatly arranged fin structure is the mainstream. However, the disadvantage is that the contact between the finned heat sink and the external space is not optimally utilized, that is, the maximum contact area is achieved, and the optimum heat dissipation efficiency is not achieved, and the fin heat sink is in the production step. It is often cut from a single piece of alloy, which is complicated to cut and produces a lot of waste. Therefore, how to improve the above-mentioned missing problems is the invention of this case. The technical difficulties that people want to solve are located.
有鑑於上述現有技藝之問題,本發明提供一種球狀體成型散熱結構。 In view of the above problems of the prior art, the present invention provides a spherical body heat dissipating structure.
本發明提供一種球狀體成型散熱結構,包含複數個散熱單元,各散熱單元係為球型,當任一散熱單元與相鄰之任一散熱單元連接時,散熱單元之球心與相鄰散熱單元之球心之距離係為散熱單元之直徑,其中各散熱單元係以M×N×K之排列為一矩型立方體,其中M係為大於及等於2之正整數,N係為大於及等於2之正整數,K係為大於及等於1之正整數。 The invention provides a spherical body forming heat dissipation structure, which comprises a plurality of heat dissipating units, wherein each heat dissipating unit is a ball type. When any one of the heat dissipating units is connected with any adjacent heat dissipating unit, the center of the heat dissipating unit and the adjacent heat dissipating unit The distance between the center of the unit is the diameter of the heat dissipating unit, wherein each of the heat dissipating units is arranged in a matrix of M×N×K as a rectangular cube, wherein M is a positive integer greater than or equal to 2, and N is greater than or equal to A positive integer of 2, K is a positive integer greater than or equal to 1.
本發明提供另一種球狀體成型散熱結構,包含複數個散熱單元,各散熱單元係為球型,其中任一層之各該散熱單元係與相鄰之任一層之各該散熱單元交錯排列。 The present invention provides another spherical body heat dissipating structure, comprising a plurality of heat dissipating units, each of which is a spherical type, wherein each of the heat dissipating units of any one of the layers is staggered with each of the heat dissipating units of any adjacent layer.
本發明之球狀體成型散熱結構,更進一步包含一導熱部,當導熱部為一基板或一平面基板時,導熱部之一側係與球狀體成型散熱結構連接,而另一側係與一外部發熱源連接,當導熱部為一柱狀體時,導熱部之一端係與一外部發熱源連接,而球狀體成型散熱結構與導熱部之一側連接。 The spherical body heat dissipating structure of the present invention further includes a heat conducting portion. When the heat conducting portion is a substrate or a flat substrate, one side of the heat conducting portion is connected to the spherical body forming heat dissipating structure, and the other side is coupled to An external heat source is connected. When the heat conducting portion is a columnar body, one end of the heat conducting portion is connected to an external heat source, and the spherical body forming heat dissipating structure is connected to one side of the heat conducting portion.
本發明提供又一種球狀體成型散熱結構,包含複數個第一散熱單元以及複數個第二散熱單元,其中第一散熱單元與第二散熱單元皆為球型,而在任一第一散熱單元與相鄰之各第一散熱單元之間係設有第 二散熱單元。 The present invention provides a ball-shaped body heat dissipating structure, comprising a plurality of first heat dissipating units and a plurality of second heat dissipating units, wherein the first heat dissipating unit and the second heat dissipating unit are both spherical and in any of the first heat dissipating units Between the adjacent first heat dissipating units Two cooling units.
本發明提供再一種散熱結構,係以複數個散熱單元,各散熱單元係以M×N×K之排列為一立方體,其中M係為大於及等於2之正整數,N係為大於及等於2之正整數,K係為大於及等於1之正整數,其中各該散熱單元係為正多邊形,或不具規則之多邊形。 The invention provides a heat dissipating structure, which is a plurality of heat dissipating units, wherein each heat dissipating unit is arranged in a matrix of M×N×K, wherein the M system is a positive integer greater than or equal to 2, and the N system is greater than or equal to 2 A positive integer, K is a positive integer greater than or equal to 1, wherein each of the heat dissipating units is a regular polygon, or a non-regular polygon.
其中,上述結構中,各相連接之散熱單元間之間隙,進一步形成複數個氣孔。 In the above structure, a gap between the heat dissipating units connected to each phase further forms a plurality of air holes.
其中,本發明之散熱單元、導熱部係皆以含有鋁、銅、石墨、高分子等任何可用於導熱之材質的其中之一或多種組合之合金或複合物所組成。 Wherein, the heat dissipating unit and the heat conducting portion of the present invention are all composed of an alloy or a composite containing one or more combinations of any material which can be used for heat conduction such as aluminum, copper, graphite, or polymer.
上列詳細說明係針對本發明之一可行實施例之具體說明,惟該實施例並非用以限制本發明之專利範圍,凡未脫離本發明技藝精神所為之等效實施或變更,均應包含於本案之專利範圍中。 The detailed description of the preferred embodiments of the present invention is intended to be limited to the scope of the invention, and is not intended to limit the scope of the invention. The patent scope of this case.
綜上所述,本案不但在空間型態上確屬創新,並能較習用物品增進上述多項功效,應已充分符合新穎性及進步性之法定發明專利要件,爰依法提出申請,懇請 貴局核准本件發明專利申請案,以勵發明,至感德便。 In summary, this case is not only innovative in terms of space type, but also can enhance the above-mentioned multiple functions compared with the customary items. It should fully meet the statutory invention patent requirements of novelty and progressiveness, and apply for it according to law. This invention patent application, in order to invent invention, to the sense of virtue.
100‧‧‧散熱單元 100‧‧‧heating unit
110‧‧‧氣孔 110‧‧‧ stomata
200‧‧‧第二散熱單元 200‧‧‧second heat sink unit
300‧‧‧導熱部 300‧‧‧Transfer Department
310‧‧‧導熱管 310‧‧‧Heat pipe
400‧‧‧導熱部 400‧‧‧Transfer Department
500‧‧‧散熱單元 500‧‧‧heating unit
600‧‧‧散熱單元 600‧‧‧heating unit
700‧‧‧散熱單元 700‧‧‧heating unit
圖1係為現有具鰭片式散熱部之散熱結構。 FIG. 1 is a heat dissipation structure of a conventional fin-type heat dissipation portion.
圖2係為本發明之球狀體成型散熱結構。 2 is a spheroidal shaped heat dissipation structure of the present invention.
圖3係為本發明之球狀體成型散熱結構 3 is a spherical body forming heat dissipation structure of the present invention
圖4係為本發明之球狀體成型散熱結構截面示意圖。 4 is a schematic cross-sectional view showing a spherical heat dissipation structure of the present invention.
圖5係為本發明之球狀體成型散熱結構截面示意圖。 Fig. 5 is a schematic cross-sectional view showing the spherical body heat dissipating structure of the present invention.
圖6係為本發明之球狀體成型散熱結構截面示意圖。 Fig. 6 is a schematic cross-sectional view showing the spherical body heat dissipating structure of the present invention.
圖7係為本發明之球狀體成型散熱結構。 Figure 7 is a spheroidal shaped heat dissipation structure of the present invention.
圖8係為本發明之球狀體成型散熱結構。 Fig. 8 is a spheroidal shaped heat dissipating structure of the present invention.
圖9係為本發明之散熱結構。 Figure 9 is a heat dissipation structure of the present invention.
圖10係為本發明之散熱結構。 Figure 10 is a heat dissipation structure of the present invention.
圖11係為本發明之散熱結構。 Figure 11 is a heat dissipation structure of the present invention.
圖12係為本發明之散熱結構。 Figure 12 is a heat dissipation structure of the present invention.
為利 貴審查委員了解本發明之技術特徵、內容與優點及其所能達到之功效,茲將本發明配合附圖,並以實施例之表達形式詳細說明如下,而其中所使用之圖式,其主旨僅為示意及輔助說明書之用,未必為本發明實施後之真實比例與精準配置,故不應就所附之圖式的比例與配置關係解讀、侷限本發明於實際實施上的權利範圍,合先敘明。 The technical features, contents, and advantages of the present invention, as well as the advantages thereof, can be understood by the reviewing committee, and the present invention will be described in detail with reference to the accompanying drawings. The subject matter is only for the purpose of illustration and description. It is not intended to be a true proportion and precise configuration after the implementation of the present invention. Therefore, the scope and configuration relationship of the attached drawings should not be interpreted or limited. First described.
請參閱圖1,為現有具鰭片式散熱部之散熱結構,而圖2為本發明之球狀體成型散熱結構,其係為與圖1具有相同體積空間(如虛線所示)的球狀體成型散熱結構,進一步而言,圖2之球狀體成型散熱結構係由多個球型的散熱單元100所依序排列而成,且各散熱單元100皆與相鄰散熱單元100緊密連接,因此任一散熱單元100之球心與相鄰之散熱單 元100之球心之距離係為散熱單元100之直徑。 Please refer to FIG. 1 , which is a heat dissipation structure of a conventional fin-shaped heat dissipation portion, and FIG. 2 is a spherical body heat dissipation structure of the present invention, which is a spherical shape having the same volume space as that shown in FIG. 1 (shown by a broken line). The heat dissipating structure of the body is further formed by the plurality of spherical heat dissipating units 100, and each of the heat dissipating units 100 is closely connected to the adjacent heat dissipating unit 100. Therefore, the center of any heat dissipating unit 100 and the adjacent heat sink The distance between the centers of the elements 100 is the diameter of the heat dissipation unit 100.
請再次參閱圖1及圖2,如圖所示,在相同體積空間內,本發明之球狀體成型散熱結構之表面積明顯較現有具鰭片式散熱部之散熱結構增加,有利於提升散熱結構整體之散熱效率。然而,本發明之球狀體成型散熱結構之形狀,並不僅限於如圖1之現有具鰭片式散熱部之散熱結構,其可依據所需而排列成各種形狀。 Please refer to FIG. 1 and FIG. 2 again. As shown in the figure, in the same volume space, the surface area of the spherical shaped heat dissipating structure of the present invention is obviously larger than that of the existing fin-shaped heat dissipating portion, which is advantageous for improving the heat dissipating structure. Overall heat dissipation efficiency. However, the shape of the spherical body heat dissipating structure of the present invention is not limited to the heat dissipating structure of the conventional fin type heat dissipating portion as shown in FIG. 1, and may be arranged in various shapes as needed.
請參閱圖3,為本發明之另一種球狀體成型散熱結構,係為以多個球型的散熱單元100,依序以M×N×K之排列方式,而形成一矩型立方體,其中M、N係為大於及等於2之正整數,K係為大於及等於1之正整數。其中,以一邊長10公分之立方體為例,該邊長10公分之立方體之表面積為600平方公分,而以本發明之球狀體成型散熱結構佔相同體積空間時為例,若當各散熱單元100之直徑為1公分時,則10公分之邊長內及可容納10個散熱單元100,在邊長10公分的體積空間內,則具有1000個散熱單元100,故其表面積約為3140立方公分,由此可見,在相同體積空間時,本發明之球狀體成型散熱結構可將散熱結構之表面積提升,增加整體散熱效率。 Please refer to FIG. 3 , which is another spherical body heat dissipating structure according to the present invention, in which a plurality of spherical heat dissipating units 100 are sequentially arranged in an M×N×K manner to form a rectangular cube, wherein M and N are positive integers greater than or equal to 2, and K is a positive integer greater than or equal to 1. For example, a cube having a length of 10 cm is used as an example, and the surface area of the cube having a side length of 10 cm is 600 cm 2 , and the spheroid shaped heat dissipation structure of the present invention occupies the same volume space as an example, if each heat dissipation unit When the diameter of 100 is 1 cm, the length of 10 cm can accommodate 10 heat dissipating units 100, and in the volume of 10 cm side, there are 1000 heat dissipating units 100, so the surface area is about 3140 cm cm. It can be seen that, in the same volume space, the spherical body forming heat dissipation structure of the present invention can increase the surface area of the heat dissipation structure and increase the overall heat dissipation efficiency.
請參閱圖4,為本發明之球狀體成型散熱結構截面示意圖,如圖所示,當任一散熱單元100與相鄰之任一散熱單元100連接時,散熱單元100之球心與相鄰散熱單元100之球心之距離係為散熱單元100之直徑,如圖所示,本發明之球狀體成型散熱結構之在相鄰散熱單元100間所形成的自然氣孔110,此氣孔110亦能取代現有具鰭片式散熱部之散熱結構之通氣流道。 Please refer to FIG. 4 , which is a schematic cross-sectional view of a spherical body forming heat dissipation structure according to the present invention. As shown in the figure, when any heat dissipation unit 100 is connected to any adjacent heat dissipation unit 100 , the center of the heat dissipation unit 100 is adjacent to the center of the heat dissipation unit 100 . The distance between the center of the heat dissipating unit 100 is the diameter of the heat dissipating unit 100. As shown in the figure, the natural air hole 110 formed between the adjacent heat dissipating units 100 of the spherical body forming heat dissipating structure of the present invention can also be used. It replaces the existing airflow path of the heat dissipation structure with the fin heat sink.
請參閱圖5,為本發明之另一球狀體成型散熱結構截面示意圖,如圖所示,其中任一層之散熱單元100係與相鄰之一層的散熱單元100交錯排列。 Please refer to FIG. 5 , which is a schematic cross-sectional view of another spherical shaped heat dissipating structure according to the present invention. As shown in the figure, the heat dissipating unit 100 of any one of the layers is staggered with the adjacent one of the heat dissipating units 100 .
請參閱圖6,為本發明之又一球狀體成型散熱結構截面示意圖,如圖所示,在散熱單元100與相鄰散熱單元100之間係設有第二散熱單元200。 Please refer to FIG. 6 , which is a schematic cross-sectional view of another spherical body heat dissipation structure according to the present invention. As shown in the figure, a second heat dissipation unit 200 is disposed between the heat dissipation unit 100 and the adjacent heat dissipation unit 100 .
請參閱圖7,為本發明之一種球狀體成型散熱結構,如圖所示,其中更進一步包含一導熱部300,其中當導熱部300為一基板的高導熱平面體時,導熱部300之一側與散熱單元100連接,而導熱部300另一側係與外部發熱源連接或貼合,其目的在於能將熱量快速由外部發熱源傳導至本發明之球狀體成型散熱結構,以利快速散熱。 Please refer to FIG. 7 , which is a spherical body heat dissipating structure according to the present invention. As shown in the figure, the method further includes a heat conducting portion 300. When the heat conducting portion 300 is a high thermal plane of a substrate, the heat conducting portion 300 One side is connected to the heat dissipating unit 100, and the other side of the heat conducting part 300 is connected or attached to an external heat source, and the purpose thereof is to quickly transfer heat from the external heat source to the spherical body forming heat dissipating structure of the present invention. Fast heat dissipation.
請參閱圖8,為本發明之一種球狀體成型散熱結構,如圖所示,其中包含一導熱部300及多個導熱管310,其中導熱管310之一端係與導熱部300連接,而導熱管310之側邊周緣則與散熱單元100連接,其目的在於以導熱管310先將導熱部300連接或貼合之外部發熱源之熱量快速傳導至所連接之散熱單元100後,再配合散熱單元100間之氣孔,以利快速散熱,換而言之,此種結構係將水平方向之外部發熱源之熱量快速吸收提升至垂直方向的導熱部300、導熱管310以及散熱單元100上後,再加以散熱,並能保持外部發熱源之溫度及穩定的散熱效率。 Please refer to FIG. 8 , which is a spherical body heat dissipating structure according to the present invention. As shown in the figure, a heat conducting portion 300 and a plurality of heat conducting tubes 310 are included, wherein one end of the heat conducting tube 310 is connected to the heat conducting portion 300, and the heat conduction is performed. The side of the side of the tube 310 is connected to the heat dissipating unit 100. The purpose is to quickly transfer the heat of the external heat source connected or bonded to the heat conducting portion 300 to the connected heat dissipating unit 100 by the heat pipe 310, and then cooperate with the heat dissipating unit. 100 holes for rapid heat dissipation. In other words, this structure quickly absorbs the heat of the external heat source in the horizontal direction to the heat conduction portion 300, the heat pipe 310, and the heat dissipation unit 100 in the vertical direction, and then It dissipates heat and maintains the temperature of the external heat source and stable heat dissipation efficiency.
請參閱圖9,為本發明之一種球狀體成型散熱結構,如圖所示,其中更一步包含一柱狀體之導熱部400,其中散熱單元100係以散射狀依序排列於導熱部400之側邊周緣,而導熱部400之一端係與外部 發熱源連接或貼合,其目的在於能將熱量快速由外部發熱源傳導至本發明之球狀體成型散熱結構,以利快速散熱,而球狀體成型散熱結構與導熱部之一側連接,。 Please refer to FIG. 9 , which is a spherical body heat dissipating structure according to the present invention. As shown in the figure, a heat exchange portion 400 of a columnar body is further included, wherein the heat dissipating unit 100 is sequentially arranged in a scattering manner on the heat conducting portion 400 . The side edge of the side, and one end of the heat conducting portion 400 is external The heat source is connected or bonded, and the purpose thereof is to quickly transfer heat from the external heat source to the spherical body heat dissipating structure of the present invention to facilitate rapid heat dissipation, and the spherical body heat dissipating structure is connected to one side of the heat conducting portion. .
請參閱圖10,為本發明之型散熱結構,係為多個正多邊型的散熱單元500以M×N×K之排列為一矩型立方體,其中M係為大於及等於2之正整數,N係為大於及等於2之正整數,K係為大於及等於1之正整數。 Please refer to FIG. 10 , which is a heat dissipation structure of the present invention, in which a plurality of positive-polyid heat dissipation units 500 are arranged in a matrix of M×N×K as a rectangular cube, wherein M is a positive integer greater than or equal to 2. N is a positive integer greater than or equal to 2, and K is a positive integer greater than or equal to 1.
請參閱圖11,為本發明之型散熱結構,係為在體積空間內以各不同大小之散熱單元600所組成之型散熱結構,請參閱圖12,為本發明之型散熱結構,係為在體積空間內以不規則形狀之散熱單元700所組成之型散熱結構,而在圖11、圖12中,各相鄰散熱單元600、散熱單元700間之形成的自然氣孔,其目的在於提升相同體積空間內之散熱的表面積,增加整體散熱效率。 Referring to FIG. 11 , a heat dissipation structure of the present invention is a heat dissipation structure composed of heat dissipation units 600 of different sizes in a volume space. Referring to FIG. 12 , the heat dissipation structure of the present invention is In the volume space, a heat dissipation structure composed of an irregularly shaped heat dissipation unit 700, and in FIGS. 11 and 12, a natural air hole formed between each adjacent heat dissipation unit 600 and the heat dissipation unit 700 is intended to increase the same volume. The surface area of heat dissipation in the space increases the overall heat dissipation efficiency.
其中,本發明之散熱單元、導熱部係皆以含有鋁、銅、石墨、高分子等任何可用於導熱之材質的其中之一或多種組合之合金或複合物所組成。 Wherein, the heat dissipating unit and the heat conducting portion of the present invention are all composed of an alloy or a composite containing one or more combinations of any material which can be used for heat conduction such as aluminum, copper, graphite, or polymer.
本發明較現有具鰭片式散熱部之散熱結構,除了在相同體積空間內增加數倍的散熱表面積,以及眾多自然氣孔以增加氣流在各散熱單元間之流動率等優勢外,本發明之球狀體成型散熱結構在製程亦與現有技術有顯著的不同,有具鰭片式散熱部之散熱結構於生產步驟上,常以一整塊合金削切加工而成,其切割過程繁雜耗時,且產生許多廢料(約40%以上),而本案僅需將散熱單元以所需形狀排列,或置於所需形狀之模具 後,以熱壓方式將溫度提升至散熱單元之熔點後即完成,其過程快速簡易且並不會有廢料產生。 Compared with the existing heat dissipating structure with a fin-type heat dissipating portion, the present invention has the advantages of increasing the heat dissipating surface area of several times in the same volume space, and numerous natural air holes to increase the flow rate between the heat dissipating units. The shape forming heat dissipating structure is also significantly different from the prior art in the manufacturing process. The heat dissipating structure with the fin type heat dissipating portion is often formed by cutting a whole piece of alloy in the production step, and the cutting process is complicated and time consuming. And a lot of waste (about 40% or more) is produced, and in this case, only the heat dissipating unit needs to be arranged in a desired shape or placed in a mold of a desired shape. After that, the temperature is raised to the melting point of the heat dissipating unit by hot pressing, and the process is quick and simple, and no waste is generated.
綜上所述,本發明不僅於技術思想上確屬創新,並具備習用之傳統方法所不及之上述多項功效,已充分符合新穎性及進步性之法定發明專利要件,爰依法提出申請,懇請 貴局核准本件發明專利申請案,以勵發明,至感德便。 In summary, the present invention is not only innovative in terms of technical thinking, but also has the above-mentioned plurality of functions that are not in the conventional methods of the conventional use, and has fully complied with the statutory invention patent requirements of novelty and progressiveness, and applied for it according to law. The bureau approved the application for the invention patent, in order to invent the invention, to the sense of virtue.
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TWM329809U (en) * | 2007-06-13 | 2008-04-01 | Huang-Han Chen | Improved heat sink structure |
TW201043128A (en) * | 2009-05-18 | 2010-12-01 | Chih-Peng Lin | The high light efficient convection heat sink |
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TWM329809U (en) * | 2007-06-13 | 2008-04-01 | Huang-Han Chen | Improved heat sink structure |
TW201043128A (en) * | 2009-05-18 | 2010-12-01 | Chih-Peng Lin | The high light efficient convection heat sink |
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