TWI644603B - Folding magnetic coupling package structure, leadframe component thereof and method for manufacturing the same - Google Patents

Abstract

A method of fabricating a flip-type magnetic coupling package structure according to the present invention includes providing a lead frame structure having a frame body and first and second sets of lead frames connected to the frame body, the first group of lead frames including a first wafer carrier portion, a coil portion, a plurality of first lead portions and a first floating pin, the second set of lead frames including a second wafer carrying portion, a second coil portion, a plurality of second lead portions and a second floating pin; The first and second wafers are respectively disposed on the first and second wafer carrying portions and electrically connected to the first and second lead portions respectively; and flipping the first set of lead frames relative to the frame body and connecting the first set of leads The shelves are moved up or down to the second set of lead frames to create electrical isolation between the first and second sets of lead frames, the first and second coil portions being aligned with one another to create a magnetic coupling.

Description

Flip type magnetic coupling package structure and lead frame assembly thereof and manufacturing method thereof

The present invention relates to a lead frame assembly, a magnetic coupling package structure including the lead frame assembly, and a method of fabricating the same, and more particularly to a flip type lead frame assembly manufactured using a single lead frame, a magnetic coupling package structure including the lead frame assembly, and Production method.

In general, there will be a transmission method in the electronic device for transmitting signals between the transmitter and the receiver. For example, the signal transmission methods of the known electrical isolation function are: photoelectric coupling type, capacitive coupling type, inductive coupling or magnetic coupling.

In the prior art, magnetic coupling isolation technology can be used in common electronic components to give electronic components in addition to optocouplers and optotransistors. Isolation function to integrate the isolator and functional semiconductor device into a semiconductor component, such as a magnetic management energy management IC, a magnetically coupled isolated controller area network transmitter receiver ( Magnetic coupling CAN bus tranceiver) and so on.

Semiconductor spacers using magnetic coupling technology typically include a driver circuit that operates at high frequencies, a pair of microils (micrometers) and millimeters (mm), and a high frequency receiver. One set of coils (first coil) is connected to the drive power At the output of the path, another set of coils (second coil) is connected to the input of the receiver. The two sets of coils are galvanic isolated from each other so that there is no electrical connection between them. In operation, the high frequency signal from the drive circuit passes through the first coil, creating a high frequency magnetic field between the first coil and the second coil, the high frequency signal being transmitted to the second coil by magnetic coupling. The second coil converts the received magnetic signal into a high frequency voltage and inputs it to the receiving circuit.

However, in order to achieve an effective coupling effect between the two sets of coils, it is necessary to accurately design the relative positions of the two sets of coils in the lateral direction and the pitch in the vertical direction so that the two sets of coils are aligned with each other in the lateral direction. At the same time, the spacing between the two sets of coils must also be controlled within the design range. In this way, the isolation distance of the two lead frame assemblies respectively provided with two sets of coils can be adjusted, thereby adjusting the effect of galvanic isolation of the two sets of coils. In the prior art, there is still a lack of a manufacturing method and lead frame assembly that is simple in fabrication and can easily adjust the amount of coupling between two sets of coils. In other words, the leadframe assembly and the method of fabricating the package structure including the leadframe assembly still have improved space.

The technical problem to be solved by the present invention is to provide a flip type lead frame assembly, a magnetic coupling package structure including the flip type lead frame assembly, and a manufacturing method thereof, in view of the deficiencies of the prior art. The manufacturing method provided by the present invention is a method of folding a single lead frame structure and a lead frame, and a specific design thereof to form a lead frame assembly ("double lead frame assembly"), and can adjust a specific area in the lead frame structure The size of the segments is adjusted to include the coupling effect of the magnetically coupled package structure of the dual leadframe assembly. The magnetically coupled package structure provided by the present invention can be used to isolate semiconductor components, such as an isolator.

In order to solve the above technical problem, one technical solution adopted by the present invention is to provide a manufacturing method of a flip type magnetic coupling package structure, comprising: providing a lead frame structure, the lead frame structure having a frame body and a connection On the frame a first set of lead frames and a second set of lead frames connected to the frame body, wherein the first set of lead frames comprises a first wafer carrying portion, at least one first coil portion, and a plurality of first pins And a plurality of first floating pins, and the second set of lead frames includes a second wafer carrier, at least one second coil portion, a plurality of second pin portions, and a plurality of second floating pins; The at least one first wafer and the at least one second wafer are respectively disposed on the first wafer carrying portion and the second wafer carrying portion and electrically connected to the first lead portion and the second lead respectively And flipping the first set of lead frames relative to the frame and moving the first set of lead frames above or below the second set of lead frames to be in the first set of lead frames Generating a height difference from the second set of lead frames and electrically isolating the first set of lead frames from the second set of lead frames; the first coil portion and the second coil portion are mutually Alignment produces magnetic coupling.

In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a lead frame assembly including a first set of lead frames and a second set of lead frames, the first set of lead frames including a a first wafer carrier portion carrying at least one first wafer, a first coil portion, a plurality of first lead portions, and a plurality of first floating pins, the second group of lead frames including one for carrying at least one a second wafer carrier portion of the second wafer, a second coil portion, a plurality of second pin portions, and a plurality of second floating pins. The first set of lead frames are disposed above or below the second set of lead frames such that the first coil portion and the second coil portion are aligned with each other.

In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a flip type magnetic coupling package structure, which comprises a first set of lead frames, a second set of lead frames, a first chip, and a A second wafer and an insulating package. The first set of lead frames includes a first wafer carrier, a first coil portion, a plurality of first lead portions, and a plurality of first floating pins. The second set of lead frames includes a second wafer carrying portion, a second coil portion, a plurality of second lead portions, and a plurality of second floating pins. The first wafer is disposed on the first wafer carrier and the second wafer is disposed on the second wafer carrier. The insulating package encapsulates the first wafer And connecting the first set of lead frames and the second set of lead frames to the second wafer, wherein a portion of each of the first lead portions is exposed outside the insulating package, and each of the A portion of the second lead portion is exposed outside the insulating package. The first set of lead frames are disposed above or below the second set of lead frames such that the first coil portion and the second coil portion are aligned with each other to generate magnetic coupling; wherein the first The set of lead frames and the second set of lead frames are electrically isolated from each other.

One of the beneficial effects of the present invention is that the flip type magnetic coupling package structure and the lead frame assembly and the manufacturing method thereof provided by the present invention can be provided by the first set of lead frames on the second set of lead frames. Upper or lower, such that the first coil portion and the second coil portion are aligned with each other to generate magnetic coupling" or "turning the first group of lead frames relative to the frame body, and the first a technical solution of moving the lead frame to the upper or lower side of the second set of lead frames to improve the accuracy of alignment of the first coil portion and the second coil portion with each other, and controlling the first coil portion and the second coil portion to mutually The magnetic coupling effect produced after matching.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.

P‧‧‧Magnetic coupling package structure

1‧‧‧ lead frame structure

10‧‧‧ ‧ body

11‧‧‧First set of lead frames

111‧‧‧First wafer carrier

112‧‧‧First coil

113‧‧‧First pin section

114‧‧‧First floating pin

12‧‧‧Second set of lead frames

121‧‧‧Second wafer carrier

122‧‧‧Second coil

123‧‧‧Second pin section

124‧‧‧Second floating pin

21‧‧‧First chip

211‧‧‧First cable

22‧‧‧second chip

221‧‧‧second cable

3‧‧‧Package

A‧‧‧ cutting line

B‧‧‧Flip axis

D‧‧‧ height difference

S‧‧‧Bend

R‧‧‧Rotation direction

1 is a top plan view of a lead frame structure used in one embodiment of the present invention; FIG. 2 is a top plan view of a lead frame structure used in another embodiment of the present invention; FIG. 3 is a flip type according to an embodiment of the present invention; FIG. 4 is a flow chart of a method for manufacturing a flip-type magnetic coupling package structure according to another embodiment of the present invention; FIG. 5 is a partial cross-sectional view taken along line VV of FIG. 1; 6 is a schematic diagram of one step of a method of fabricating a flip-type magnetic coupling package structure according to an embodiment of the present invention; FIG. 7 is a schematic diagram showing another step of a manufacturing method of a flip type magnetic coupling package structure according to an embodiment of the present invention; FIG. 8 is still another step of a manufacturing method of a flip type magnetic coupling package structure according to an embodiment of the present invention; FIG. 9 is a schematic diagram of a flip-type magnetic coupling package structure according to an embodiment of the present invention; FIG. 10 is a schematic diagram of a flip-type magnetic coupling package structure according to another embodiment of the present invention; and FIG. A schematic diagram of a flip-type magnetically coupled package structure provided by an embodiment.

The following is a description of an embodiment of the present invention relating to a "flip type magnetic coupling package structure and its lead frame assembly and manufacturing method" by a specific embodiment, and those skilled in the art can understand the present invention from the contents disclosed in the present specification. Advantages and effects. The present invention may be carried out or applied in various other specific embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention. In addition, the drawings of the present invention are merely illustrative and are not intended to be stated in the actual size. The following embodiments will further explain the related technical content of the present invention, but the disclosure is not intended to limit the scope of the present invention.

Please refer to Figure 1 and Figure 2. 1 and 2 are top plan views of a lead frame structure used in various embodiments of the present invention. The method of fabricating the flip-type magnetically coupled package structure provided by the present invention can be formed using a single leadframe structure 1. In other words, the lead frame assembly and the flip type magnetic coupling package structure can be formed in a simple manufacturing step by, for example, the lead frame structure 1 as shown in FIGS. 1 and 2, while ensuring the lead frame assembly and the flip type magnetic coupling package. Alignment accuracy and electrical insulation properties of a pair of coils in a structure.

As shown in FIGS. 1 and 2, the lead frame structure 1 used in the present invention includes a frame body 10 and a first set of lead frames 11 and a second set of lead frames 12 connected to the frame body 10. The first set of lead frames 11 includes a first wafer carrier 111, a first coil portion 112, a plurality of first pin portions 113, and a plurality of first floating pins 114. The second set of lead frames includes a second wafer carrier 121, a second coil portion 122, a plurality of second pin portions 123, and a plurality of second floating pins 124. The frame body 10, the first set of lead frames 11 and the second set of lead frames 12 may be made of a conductive material such as metal. The materials of the frame 10, the first set of lead frames 11, and the second set of lead frames 12 may be the same or different.

The first coil portion 112 and the second coil portion 122 may be formed of a metal frame or a metal ring formed of a strip metal of the lead frame structure 1. The first coil portion 112 and the second coil portion 122 may be a single coil or a multi-turn coil. The first coil portion 112 and the second coil portion 122 are respectively connected to the first floating pin 114 and the second floating pin 124. The first floating pin 114 is for supporting the first coil portion 112, and the second floating pin 124 is for supporting the second coil portion 122. Further, in the present invention, the number of the first coil portion 112 and the second coil portion 122 is not limited thereto. For example, two first coil portions 112 symmetrically distributed therein may be included in the first set of lead frames 11, and two second coils symmetrically distributed therein may be included in the second set of lead frames 12 Part 122. Specifically, the two first coil portions 112 may be distributed on opposite sides of the first wafer carrying portion 111, and the two second coil portions 122 may be distributed on opposite sides of the second wafer carrying portion 121, thereby forming two Telecommunications channels.

It should be noted that, in addition to the lead frame structure 1, FIGS. 1 and 2 simultaneously illustrate the first wafer 21 disposed on the first wafer carrier 111 and the second wafer 22 disposed on the second wafer carrier 121. And a plurality of first connection lines 211 and a plurality of second connection lines 221 for providing electrical connection to the first wafer 21 and the second wafer 22, respectively. In addition, FIG. 1 differs from FIG. 2 in that the first wafer carrier portion 111 and the first coil portion 112 of the first group of lead frames 11 and the second wafer carrier portion 121 and the second of the second group of lead frames 12 The arrangement positions of the coil portions 122 are different.

Referring first to FIG. 1, in one embodiment of the present invention, a first set of lead frames The first wafer carrying portion 111 of the first wafer carrying portion 111 is surrounded by the first coil portion 112, and the first wafer carrying portion 111 and the first coil portion 112 are both connected to the frame body 10 through the first floating pin 114. Similarly, the second wafer carrying portion 121 of the second set of lead frames 12 is surrounded by the second coil portion 122, and the second wafer carrying portion 121 and the second coil portion 122 are both passed through the second floating pin 124 and the frame. 10 connections.

As shown in FIG. 2, in another embodiment of the present invention, the first wafer carrier portion 111 and the first coil portion 112 of the first group of lead frames 11 are separated from each other and disposed adjacent to each other, and the second group of lead frames The second wafer carrying portion 121 and the second coil portion 122 of 12 are disposed apart from each other and disposed adjacent to each other. In the present invention, the relative positional relationship between the first wafer carrying portion 111 and the first coil portion 112 and between the second wafer setting portion 121 and the second coil portion 122 can be adjusted according to the requirements of the product, in the present invention. There are no restrictions.

In other words, the first wafer carrier portion 111 and the first coil portion 112 can be made as long as the first coil portion 112 and the second coil portion 122 in the lead frame assembly or the magnetic coupling package structure can be matched to each other to transmit signals by electromagnetic coupling. The relative positional relationship between the second wafer setting portion 121 and the second coil portion 122 is not limited in the present invention. However, the arrangement of the first wafer carrier 111, the first coil portion 112, the second wafer carrier 121, and the second coil portion 122 as shown in FIG. 1 can effectively save the formed leads under the use of the maximum coil area. The frame assembly is either the overall volume of the magnetically coupled package structure and enhances the coupling effect. Therefore, preferably, the first coil portion 112 surrounds the first wafer carrier portion 111, and the second coil portion 122 surrounds the second wafer carrier portion 121.

In addition, in other embodiments of the present invention, the first coil portion 112 and the second coil portion 122 may also be supported by at least a portion of the wafer carrying portion, thereby reducing the overall size of the product.

Please also refer to Figure 1 and Figure 2. The first set of lead frames 11 and the second set of lead frames 12 are further provided with a plurality of first connecting lines 211 and a plurality of second connecting lines 221. Through a plurality of first connecting lines 211 and a plurality of second connecting lines 221 (for example, as shown in FIG. 1 Two of the first connecting lines 211 and two of the second connecting lines 221), the first wafer carrying portion 111 and the first coil portion 112 are electrically connected to each other to form a loop, and the second wafer carrying portion 121 and the second The coil portions 122 are electrically connected to each other to form a closed circuit, and the first wafer carrier portion 111 and the second wafer carrier portion 121 may also pass through a plurality of other first connection lines 211 and a plurality of second connection lines 221 (for example, The other four first connecting lines 211 and the other four second connecting lines 221) shown in FIG. 1 are electrically connected to the first lead portion 113 and the second lead portion 123, respectively, to form a closed circuit.

In the present invention, the number and shape of the plurality of first lead portions 113 and the plurality of second lead portions 123 can be designed and adjusted according to product requirements, and are not limited in the present invention. In addition, the connection manner and specific types of the plurality of first connecting lines 211 and the plurality of second connecting lines 221 are also not limited in the present invention, and may be based on the general knowledge in the technical field of the invention. Expertise is understood and designed.

Next, please refer to FIG. 3 and FIG. 4. 3 and 4 are flow charts of a method of fabricating a magnetically coupled package structure in accordance with various embodiments of the present invention, respectively. As shown in FIG. 3, the manufacturing method of the magnetic coupling package structure includes: providing a lead frame structure, the lead frame structure having a frame body, a first group of lead frames connected to the frame body, and a second group of lead frames connected to the frame body, wherein The first set of lead frames includes a first wafer carrying portion, a first coil portion, and a plurality of first lead portions, and the second set of lead frames includes a second wafer carrying portion, a second coil portion, and a plurality of second pins a portion (step S100); the at least one first wafer and the at least one second wafer are respectively disposed on the first wafer carrying portion and the second wafer carrying portion and electrically connected to the first lead portion and the second lead portion, respectively (Step S102); and flipping the first set of lead frames with respect to the frame body, and moving the first set of lead frames above or below the second set of lead frames such that the first coil portion and the second coil portion match each other ( Step S104) to generate magnetic coupling.

The manufacturing method of the magnetic coupling package structure shown in FIG. 4 further includes steps S103 and S105, and the manufacturing method of the magnetic coupling package structure shown in FIG. S106. Specifically, the manufacturing method shown in FIG. 4 includes the following steps: providing a lead frame structure having a frame body, a first group of lead frames connected to the frame body, and a second group of lead frames connected to the frame body, wherein The first set of lead frames includes a first wafer carrying portion, a first coil portion, and a plurality of first lead portions, and the second set of lead frames includes a second wafer carrying portion, a second coil portion, and a plurality of second pins a portion (step S100); the at least one first wafer and the at least one second wafer are respectively disposed on the first wafer carrying portion and the second wafer carrying portion and electrically connected to the first lead portion and the second lead portion, respectively (Step S102): forming at least one bent portion in the first set of lead frames (step S103); inverting the first set of lead frames with respect to the frame body, and moving the first set of lead frames to above the second set of lead frames Or underneath, so that the first coil portion and the second coil portion are matched with each other (step S104); forming an insulating package to encapsulate the first wafer and the second wafer and connecting the first set of lead frames and The second set of lead frames (step S105); and the removal frame Body (step S106).

It should be noted that in the manufacturing method of the magnetic coupling package structure provided by the present invention, step S102 and step S103 are not necessarily performed in accordance with the above sequence. In other words, before the first set of lead frames is flipped relative to the frame body, that is, before the step S104, the first wafer 21 and the second wafer 22 may be disposed first to form a bent portion, or the bent portion may be formed first. The first wafer 21 and the second wafer 22 are respectively disposed on the first wafer carrying portion 111 and the second wafer carrying portion 121. In the following description, the case where the step S102 is performed first and then the step S103 is performed will be described.

Please also cooperate with Figure 1 and Figures 5 to 8. 5 is a partial cross-sectional view taken along line V-V of FIG. 1. FIG. 6 is a schematic view of step S103 of the method of manufacturing a magnetic coupling package structure, FIG. 7 is a schematic view of step S104, and FIG. 8 is a schematic view of step S105.

First, in step S100, the lead frame structure 1 is provided. The lead frame structure 1 may be the lead frame structure 1 shown in FIG. 1 or FIG. 2, which has a frame body 10, a first set of lead frames 11, and a second set of lead frames 12. As shown in FIG. 5, the first set of lead frames 11 and the second set of lead frames 12 of the lead frame structure 1 are adjacent to each other and have a similar structure. The first set of lead frames 11 includes a first wafer carrying portion 111, a first coil portion 112, and a first lead portion 113, and the second set of lead frames 12 includes a second wafer carrying portion 121, a second coil portion 122, and a second Pin portion 123. In addition, the first set of lead frames 11 and the second set of lead frames 12 further include a plurality of first floating pins 114 and a plurality of second floating pins 124, respectively.

Next, in step 102, the first wafer 21 and the second wafer 22 are respectively disposed on the first wafer bearing portion 111 and the second wafer carrier portion 121 to be electrically connected to the first lead portion 113 and the second portion, respectively. Pin portion 123. The number of each of the first wafer 21 and the second wafer 22 is not limited in the present invention. In the embodiment shown in FIGS. 1 and 2, the first set of lead frames 11 and the second set of lead frames 12 of the lead frame structure 1 respectively include a first wafer 21 and a second wafer 22. For example, the first wafer 21 and the second wafer 22 are integrated circuit wafers (ICs).

For example, the first wafer 21 includes a coil driving circuit unit, and the second wafer 22 includes a receiving circuit unit. A high frequency signal is electrically connected to the first coil portion 112 through the coil driving circuit unit to be transmitted to the first coil portion 112, and the second coil portion 122 is electrically connected to the second coil portion 122 through the receiving circuit unit to receive A high frequency voltage. Alternatively, in another embodiment, the first wafer 21 may include a receiving circuit unit and the second wafer 22 includes a coil driving circuit unit.

Thereby, the input signal input by the coil driving circuit unit can be transmitted to the output terminal (receiving circuit unit) by the effective magnetic coupling generated by the first coil portion 112 and the second coil portion 122 being aligned with each other in the lateral direction. Specifically, the first coil portion 112 of the first group of lead frames 11 forms a first closed circuit together with the first wafer 21 through a portion of the first connection line 211. A high frequency alternating magnetic field can be generated by applying current to the first closed circuit. The high frequency alternating magnetic field is magnetically coupled to the second coil portion 122 by the first coil portion 112, and formed at the second coil portion 122 of the second group of lead frames 12, a portion of the second connecting line 221, and the second wafer 22 A high frequency alternating current is generated in the second closed circuit. Accordingly, the electrical signal can be transmitted from the first wafer 21 (e.g., the transmitter) to the second wafer 22 (e.g., the receiver) that is electrically isolated from the first wafer 21.

The arrangement of the first wafer 21 and the second wafer 22 in step S102 is not limited in the present invention. In addition, in step S102, a plurality of first connection lines 211 and a plurality of second connection lines 221 may be provided while the first wafer 21 and the second wafer 22 are disposed. For example, the first connection line 211 and the second connection line 221 may be connected to the first wafer 21, the second wafer 22, the first wafer carrier 111, the second wafer carrier 121, and the first coil portion 112 in a wire bonding manner. The second coil portion 122 is between the first lead portion 113 and the second lead portion 123.

Next, please refer to Figure 6. In step S103, at least one bent portion S is formed in the first group of lead frames 11. In fact, in the present invention, the bent portion S may be formed in the first set of lead frames 11 or in the second set of lead frames 12. In other words, the manufacturing method provided by the present invention may include forming at least one bent portion on at least one of the first set of lead frames 11 and the second set of lead frames 12. In the embodiment shown in FIG. 6, the bent portion S is formed between the first lead portion 113 and the first coil portion 112 and between the first lead portion 113 and the first wafer carrying portion 111. For example, the bent portion S can be formed by bending the first floating pin 114. Forming the bent portion S can prevent the first coil portion 112 and the second coil portion 122 from contacting each other in a subsequent step, and can also prevent the first wafer 21 disposed on the first wafer carrier portion 111 from being disposed on the second wafer carrier The second wafers 22 on the portion 121 are in contact with each other.

As described above, as long as the above-mentioned avoidance of avoiding mutual contact between the first set of lead frames 11 and the second set of lead frames 12 in the product can be achieved, that is, ensuring that the first set of lead frames 11 and the second set of lead frames 12 are electrically connected to each other The insulating material, the specific size of the bent portion S and the direction of the bending can also be adjusted. Specifically, the detailed parameters of the bent portion S can be designed according to the flow of the manufacturing method and the magnetic coupling and voltage insulation characteristics of the target product. For example, the bending direction of the bending portion S can be determined according to the turning direction of the first group of lead frames 11 in the subsequent step S104.

As shown in FIG. 6, in this embodiment, the bent portion S is formed in the first group of lead frames 11. Please be cut along the cutting line A indicated in the first set of lead frames 11 so as to be close to the junction of the first set of lead frames 11 and the second set of lead frames 12 before forming the bent portion S. The plurality of first pin portions 113 and the plurality of first floating pins 114 are bent downward. In other words, as seen from the drawing of FIG. 1, the plurality of first pin portions 113 and the plurality of first floating pins 114 located on the right side of the line connecting the two cutting lines A may (in the direction of entering the drawing) ) is bent such that the first wafer carrying portion 121 and the first coil portion 122 located on the left side of the line connecting the two cutting lines A are displaced downward (i.e., in the direction of entering the drawing) to another plane.

As described above, the first wafer carrier 111 and the first coil portion 112 for carrying the first wafer 21 are lowered downward to the other plane with respect to the second group of lead frames 12. In other words, by the arrangement of the bent portion S, the first wafer carrying portion 111 and the first coil portion 112 are displaced downward such that a difference in height between a portion of the first set of lead frames 11 and the second set of lead frames 12 d, such that the distance between the first coil portion 112 and the second coil portion 122 is equal to the height difference d.

As mentioned above, the height difference d can be designed according to the magnetic coupling and voltage insulation characteristics of the target product. In other words, adjusting the height difference d can adjust the isolation voltage between the two sets of lead frames and the magnetic coupling strength between the two coil portions. In the present invention, the height difference d is preferably between 100 and 500 μm. In other words, in the target product (lead frame assembly or magnetically coupled package structure), the distance between the first coil portion 112 and the second coil portion 122 is preferably between 100 and 500 microns. Controlling the height difference d between 100 and 500 μm can effectively reduce the volume of the target product in addition to the isolation voltage and magnetic coupling efficiency between the first coil portion 112 and the second coil portion 122.

Next, please refer to Figure 7. In step S104, the first set of lead frames 11 are flipped relative to the frame body 1, and the first set of lead frames 11 are moved above or below the second set of lead frames 12 such that the first coil portion 112 and the second coil Portions 122 match each other and create a magnetic coupling. Specifically, referring to FIG. 1 , the first set of lead frames 11 are flipped 180 degrees with respect to the frame body 1 along the inversion axis B toward the rotation axis R, so that the first group of lead frames 11 are moved to the second position. Above the set of lead frames 12. When the step S104 is performed, the frame 1 is held at the original position.

It is to be noted that, in the step S103 of forming the bent portion S, the bent portion S is formed by bending the first lead portion 113 of the first group of lead frames 11 downward, in step S104, The first set of lead frames 11 are flipped over the second set of lead frames 12 to prevent the first wafer 21 and the second wafer 22 from contacting each other or the first coil portion 112 and the second coil portion 122 are in contact with each other. In contrast, if the bending portion S is formed by bending the first lead portion 113 of the first group of lead frames 11 upward in step S103, the first group of lead frames 11 is turned over to step S104. The second set of lead frames 12 is below. In other words, the step of forming the bent portion S and the step of turning the first set of lead frames 11 must cooperate.

In step S104, the first coil portion 112 of the first group of lead frames 11 and the second coil portion 122 of the second group of lead frames 12 have a height difference d formed by the bent portion S. As previously mentioned, by controlling the value of d, the coupling and voltage insulation effects of the subsequently formed leadframe assembly or magnetically coupled package structure can be adjusted. In addition to this, the step of flipping the first set of lead frames 11 can be performed at one time, that is, by 180 degrees in the same step, or in successive steps, that is, flipping at different angles in a plurality of steps, respectively.

In the embodiment shown in FIG. 5 to FIG. 8 , after step S104 is completed, as shown in FIG. 8 , the first coil portion 112 is disposed directly above the second coil portion 122 and parallel to the second coil portion 122 . The first wafer 21 is disposed opposite to the second wafer 22. In addition, the first coil portion 112 and the second coil portion 122 are aligned with each other, thereby ensuring the coupling effect between the first coil portion 112 and the second coil portion 122. In addition to this, there is a non-conductive interval between the first coil portion 112 and the second coil portion 122 (the separation distance is the height difference d).

After the first coil portion 112 and the second coil portion 122 are matched with each other, step S105 may be further performed, that is, the insulating package 3 is formed to mold the first wafer 21 and the second wafer 22 and connect the first group of leads. The frame 11 and the second set of lead frames 12. Referring to FIG. 9 , the package 3 covers the first wafer carrier portion 111 of the first group of lead frames 11 , the first coil portion 112 , the second wafer carrier portion 121 of the second group of lead frames 12 , and the second coil portion 122 and respectively disposed on the first wafer carrier 111 And the first wafer 21 and the second wafer 22 on the second wafer carrier 121. A portion of the package 3 is filled (disposed) between the first set of lead frames 11 and the second set of lead frames 12 to insulate the first coil portion 112 and the second coil portion 122 from each other.

In addition, a portion of each of the first lead portions 113 is exposed outside the insulating package 3, and a portion of each of the second lead portions 123 is exposed outside the insulating package 3. A portion of the first floating pin 114 is exposed outside the insulating package 3, and a portion of the second floating pin 124 is exposed outside the insulating package 3. A portion of the first lead portion 113 exposed by the package 3 and a portion of the second lead portion 123 may be electrically connected to other electronic components. For example, a portion of the first lead portion 113 and a portion of the second lead portion 123 can provide an isolation voltage required for the magnetically coupled package structure.

Referring to FIG. 4 again, after the step S105, the method for manufacturing the magnetic coupling package structure provided by the embodiment of the present invention further includes removing the frame 10. In particular, the frame 10 can be used to support the first set of lead frames 11 and the second set of lead frames 12 during fabrication. After the first set of lead frames 11 and the second set of lead frames 12 are connected through the package 3, the frame 10 can be trimmed (deflash, trim and form) and removed. The manner in which the frame body 10 is removed is not limited in the present invention. While the frame body 10 is being removed, the first floating pin 114 and the second floating pin 124 exposed outside the insulated package 3 are cut off. It should be noted that, in the present invention, the first floating pin 114 and the second floating pin 124 are opposite to each other, and are cut outward from the inside of the semiconductor component package to increase the isolation distance, thereby ensuring the isolation voltage.

It should be noted that, in the present invention, after step S104 and before step S105, a polyimide film may be disposed between the first set of lead frames 11 and the second set of lead frames 12 to increase the isolation voltage. In other words, the polyimide film enhances the electrical isolation between the first set of lead frames 11 and the second set of lead frames 12. Further, by providing the polyimide film, the difference in height (i.e., the distance of the interval) between the first coil portion 112 and the second coil portion 122 can be effectively reduced to between 100 and 200 μm. In this way, the magnetic coupling effect can be increased while ensuring the isolation voltage. rate.

Next, please refer to FIG. 10 and FIG. 10 and 11 are schematic views of a magnetic coupling package structure provided by two other embodiments of the present invention. The magnetic coupling package structure P of the embodiment shown in FIGS. 10 and 11 differs in the number of the bent portions and the positions at which the first wafer 21 and the second wafer 22 are disposed, compared to the embodiment shown in FIG. . Specifically, as shown in FIG. 10, in addition to the first lead portion 113 of the first group of lead frames 11, a second bent portion S is formed, and the second lead portion 123 of the second set of lead frames 12 is also formed with a bent portion. Folding part S. In other words, the distance between the first coil portion 112 and the second coil portion 122 can pass through the first lead portion 113, the first floating pin 114, the second lead portion 123, and the second floating pin 124. The bent portion S is formed to be adjusted.

Compared with FIG. 9 and FIG. 10, in the embodiment shown in FIG. 11, the arrangement of the first wafer 21 and the second wafer 22 is different. Specifically, in FIG. 11, the first wafer 21 and the second wafer 22 are respectively disposed on the two wafer carriers facing away from each other such that the first wafer 21 and the second wafer 22 are disposed opposite each other. In other words, the two surfaces of the magnetic coupling package structure P in which the first wafer 21 and the second wafer 22 are disposed are opposed to each other such that the first wafer 21 and the second wafer 22 are disposed opposite each other, FIG. The first wafer 21 and the second wafer 22 are opposite to each other. In this way, the height difference d can be reduced to increase the magnetic coupling efficiency. In fact, the manner in which the first wafer 21 and the second wafer 22 are disposed is not limited in the present invention.

The present invention further provides a lead frame assembly, and a magnetically coupled package structure. The lead frame assembly and the magnetic coupling package structure P provided by the present invention can be formed by the above-described manufacturing method of the magnetic coupling package structure. Therefore, the structure and manufacturing method of the lead frame assembly and the magnetic coupling package structure P will not be described again.

[Advantageous Effects of Embodiments]

The beneficial effects of the present invention are the lead frame assembly provided by the technical solution of the present invention, the magnetic coupling package structure P including the lead frame assembly, and the manufacturing method thereof, which can be provided by the first set of lead frames 11 Above the two sets of lead frames 12 or Bottom, such that the first coil portion 112 and the second coil portion 122 are matched to each other to generate a magnetic coupling" or "the first set of lead frames 11 are inverted with respect to the frame body 10, and the The first set of lead frames 11 are moved to the upper or lower side of the second set of lead frames 12 to improve the accuracy of the alignment of the first coil portion 112 and the second coil portion 122 with each other, and to control the first coil portion The magnetic coupling effect produced by the matching of the second coil portion 122 and the second coil portion 122.

In particular, the magnetic coupling package structure P provided by the present invention can be applied to a semiconductor package component, such as a micro-transformer, and can be dimensioned to achieve different regions of a single leadframe structure 1 by a simple manufacturing method ( The effect of the automatic alignment of the coil portions in the first set of lead frames 11 and the second set of lead frames 12). In addition to this, the first coil portion 112 and the second coil portion 122 are highly insulated from each other by the arrangement of the package 3. The magnetic coupling package structure P provided by the present invention may have an insulation voltage of 5 kV or more.

In addition, in the present invention, the first coil portion 112 and the second coil portion 122 are laterally aligned with each other to generate an effective magnetic coupling, so that the signal can be transmitted to the output through the coil coupling by the input terminal (eg, a reflector). End (such as receiver) and output. In addition to this, the vertical distance of the first coil portion 112 and the second coil portion 122 can be controlled by the design of the lead frame structure 1. For example, adjusting the isolation distance between the first set of lead frames 11 where the first coil portion 112 is located and the second set of lead frames 12 where the second coil portion 122 is located can adjust the effect of electrically insulating the two coils from each other.

The above disclosure is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, any equivalent technical changes made by using the present specification and the contents of the drawings are included in the application of the present invention. Within the scope of the patent.

Claims (10)

A manufacturing method of a flip-type magnetic coupling package structure, comprising: providing a lead frame structure, the lead frame structure having a frame body, a first set of lead frames connected to the frame body, and a frame connected to the frame a second set of lead frames, wherein the first set of lead frames includes a first wafer carrying portion, at least one first coil portion, a plurality of first lead portions, and a plurality of supporting the first coil portions a first floating pin, and the second set of lead frames includes a second wafer carrier, at least one second coil portion, a plurality of second pin portions, and a plurality of second floats supporting the second coil portion a pin; at least one first wafer and at least one second wafer are respectively disposed on the first wafer bearing portion and the second wafer carrier portion and electrically connected to the first pin portion and the a second lead portion; and flipping the first set of lead frames relative to the frame body and moving the first set of lead frames above or below the second set of lead frames to Generating a height between a set of lead frames and the second set of lead frames And the first set and the second set of lead frame are electrically isolated from the lead frame; the first coil portion and the second coil portion are aligned with each other to generate magnetic coupling. The manufacturing method of the flip-type magnetic coupling package structure of claim 1, wherein before the flipping the first set of lead frames with respect to the frame body, the method further includes: forming at least one bent portion at the At least one of a set of lead frames and the second set of lead frames. The manufacturing method of the flip-type magnetic coupling package structure of claim 1, wherein after the first set of lead frames are reversed with respect to the frame body, the method further includes: forming an insulating package to encapsulate the a first wafer and the second wafer are connected to the first set of lead frames and the second set of lead frames, wherein a portion of the first floating pins are exposed outside the insulating package and the second float a portion of the movable pin is exposed outside the insulating package; and removing a portion of the first floating pin exposed outside the insulating package and a portion of the second floating pin exposed to the insulating package; Wherein a portion of each of the first lead portions is exposed outside the insulating package, and a portion of each of the second lead portions is exposed outside the insulating package, the first lead portion And the portion of the second lead portion for providing an isolation voltage to the first set of lead frames and the second set of lead frames, respectively; wherein the first floating pin is exposed And a portion of the second floating pin that is exposed is removed in an opposite direction; wherein a portion of the insulating package is disposed on the first set of lead frames and the second set of lead frames between. The manufacturing method of the flip-type magnetic coupling package structure according to claim 3, further comprising, before the step of forming the insulating package, the first set of lead frames and the second set of lead frames A polyimide film is placed between them to increase the isolation voltage. A lead frame assembly includes: a first set of lead frames, the first set of lead frames including a first wafer carrying portion for carrying at least one first wafer, a first coil portion, and a plurality of first leads a leg and a plurality of first floating pins supporting the first coil portion; and a second set of lead frames, the second group of lead frames including a second wafer carrier for carrying at least one second wafer a second coil portion, a plurality of second lead portions, and a plurality of second floating pins supporting the second coil portion; wherein the first set of lead frames are disposed on the second set of lead frames Upper or lower, such that the first coil portion and the second coil portion are aligned with each other, and the first wafer is disposed opposite to the second wafer. The lead frame assembly of claim 5, wherein the first coil portion and the second coil portion have a height difference of between 100 and 500 microns. A flip type magnetic coupling package structure includes: a first set of lead frames, the first set of lead frames including a first wafer carrying portion, a first coil portion, a plurality of first lead portions, and a plurality of supports a first floating lead of the first coil portion; a second set of lead frames, the second set of lead frames including a second wafer carrying portion, a second coil portion, a plurality of second lead portions, and a plurality a second floating pin supporting the second coil portion; a first wafer, the first wafer is disposed on the first wafer carrier; a second wafer, the second wafer is disposed in the first a second wafer carrying portion; and an insulating package encapsulating the first wafer and the second wafer and connecting the first set of lead frames and the second set of lead frames, wherein each a portion of the first lead portion is exposed outside the insulating package, and a portion of each of the second lead portions is exposed outside the insulating package; wherein the first set of lead frames are disposed on the Above or below the second set of lead frames The first coil portion and the second coil portion are aligned with each other to generate magnetic coupling; wherein the first set and the second set of lead frame lead frame are electrically isolated. The flip-type magnetic coupling package structure of claim 7, wherein the first wafer comprises a coil driving circuit unit, the second wafer comprises a receiving circuit unit, and the first wafer passes through a first connecting line And forming a first closed circuit with the first coil portion, the second wafer forming a second closed circuit with the second coil portion through a second connecting line. The flip-type magnetic coupling package structure of claim 7, wherein a high frequency signal is electrically connected to the first coil portion through a coil driving circuit unit to be transmitted to the first coil portion, and The second coil portion is electrically connected to the second coil portion through a receiving circuit unit to receive a high frequency voltage. The flip type magnetic coupling package structure according to claim 7, wherein the first crystal The sheet and the second wafer are opposite each other.