TWI655698B - Magnetic coupling package structure for inductive coupling isolator based on duo leadframes and method for manufacturing the same - Google Patents

Abstract

The invention discloses a double lead frame magnetic coupling package structure for a magnetic coupling isolator and a manufacturing method thereof. The manufacturing method includes a lead frame providing step, a wafer connecting step, and a coil alignment step. The lead frame providing step includes providing the first and second sets of lead frames, and the first and second sets of lead frames each include a wafer carrying portion, a coil portion, a lead portion, and a floating pin. The wafer bonding step includes disposing the first and second wafers on the wafer carrier and electrically connecting to the lead portions, respectively. The coil alignment step includes disposing the first set of lead frames above or below the second set of lead frames, and applying the first and second magnetic fields to the first and second sets of lead frames, respectively, so that the two sets of coil portions are opposite each other Bit. Thereby, it is possible to control the magnetic coupling effect produced by the two sets of coil portions being matched with each other.

Description

Double lead frame magnetic coupling package structure for magnetic coupling isolator and manufacturing method thereof

The present invention relates to a magnetically coupled package structure and a method of fabricating the same, and more particularly to a dual leadframe magnetically coupled package structure for a magnetically coupled isolator and a method of fabricating the same.

In some industrial applications, in order to maintain a safe voltage in the user interface and prevent transient transmission from the signal source to low voltage circuits such as computers, microprocessors, etc., before low voltage circuits and high voltage circuits, Adopt galvanic isolation technology. When there is more than one conductive path between two circuits, the ground loop usually exists, and the presence of multiple ground paths creates a current path that affects system performance. Typically, electrical insulation is applied to disconnect the ground loop. In the prior art, there are three main isolation technologies: Optocouplers composed of LEDs and photo sensors, Capacitive coupled isolators, and Magnetically coupled isolators.

In the optocoupler, the electronic input signal drives the LED to emit an optical signal, the optical signal passes through the electrically insulating material and illuminates the photosensor, and the photo sensor converts the optical signal into an electrical signal. Capacitively coupled insulators use high-voltage capacitors with small capacitance values to block DC electronic signals, but allow high-frequency signals to pass, thereby achieving galvanic isolation.

Magnetically coupled isolators include transmitters, receivers, and receivers A communication unit that passes signals between them. Inductive coupling or magnetic coupling is used to achieve the effect of transmitting signals between the transmitter and the receiver.

Magnetically coupled isolators typically include a driver circuit that operates at high frequencies, a pair of coils between microns (μm) and millimeters (mm), and a high frequency receiver. One set of coils (first coil) is connected to the output of the drive circuit, and the other set of coils (second coil) is connected to the input of the receiver. The two sets of coils are galvanic isolated from each other so that there is no electrical connection between them. In operation, the high frequency signal from the drive circuit is converted to a high frequency magnetic field by the first coil and transmitted to the second coil by magnetic coupling. The second coil converts the received magnetic signal into a high frequency voltage and inputs it to the receiving circuit.

In the prior art, there are two main structural designs for the magnetic coupling package structure having coupling effects between the coils: (1) forming a coupling coil directly on the wafer (for example, the technology used by Analog Devices), or (2) Two relatively small coils are formed on the plane of the same lead frame to achieve coupling effects (for example, the technology used by PI (Power integration)). However, each of the above designs has its drawbacks. Specifically, forming a coil directly on a wafer has a certain degree of technical difficulty, and it is relatively difficult to meet the industrial requirements for ultra-high voltage insulation. In other words, in this technical field, there is a high demand for semiconductor manufacturing technology and a high price. The formation of two matching coils on a single lead frame plane not only limits the size of the coil, but also limits the coupling efficiency. Based on its structural design, it can only be used to produce single-channel devices, and cannot be manufactured more than two. Multichannel devices with channels.

In addition, in order to achieve an effective coupling effect between the two sets of coils, it is necessary to accurately design the relative positions of the two sets of coils in the lateral direction and the spacing in the vertical direction so that the two sets of coils are aligned with each other in the lateral direction. At the same time, the spacing between the two sets of coils must also be controlled within the design range. In this way, the isolation distance of the two lead frame assemblies respectively provided with two sets of coils can be adjusted, thereby adjusting the effect of galvanic islolated between the two sets of coils. In the prior art, there is still a lack of production process A manufacturing method and a lead frame assembly that can easily adjust the coupling amount between two sets of coils. Furthermore, as previously stated, there is a need to provide a magnetically coupled package structure and a method of fabricating the same to fabricate a multi-channel device in a simple manner. In other words, the prior art magnetically coupled package structure and its method of manufacture still have room for improvement.

The technical problem to be solved by the present invention is to provide a simple and low-cost magnetic coupling package structure and a manufacturing method thereof for the deficiencies of the prior art. The manufacturing method provided by the present invention is to form a first group of lead frames and a second group of lead frames respectively by two independent lead frame structures, and the lead frames of the upper and lower rows can be arranged by applying magnetic fields to the two sets of lead frames respectively. The coil portions are aligned with each other. In addition, the present invention can also adjust the coupling effect of the magnetic coupling package structure by adjusting the spacing between the two sets of lead frames.

In order to solve the above technical problem, one of the technical solutions adopted by the present invention is to provide a method for manufacturing a dual lead frame magnetic coupling package structure for a magnetic coupling isolator, comprising a lead frame providing step, a wafer connecting step, and A coil alignment step. The lead frame providing step includes providing a first set of lead frames and a second set of lead frames, wherein the first set of lead frames includes a first wafer carrier, at least one first coil portion, and a plurality of first pins And a plurality of first floating pins, and the second group of lead frames includes a second wafer carrier, at least one second coil portion, a plurality of second pin portions, and a plurality of second floating pins. The wafer connecting step includes disposing at least one first wafer and at least one second wafer on the first wafer carrying portion and the second wafer carrying portion, respectively, and electrically connecting to the first lead portion and the respectively The second pin portion is described. The coil alignment step includes disposing the first set of lead frames above or below the second set of lead frames, and applying a first magnetic field and a second magnetic field to the first set of lead frames and the The second set of lead frames are such that the first coil portion and the second coil portion are aligned with each other.

In order to solve the above technical problem, another technical solution adopted by the present invention A dual lead frame magnetically coupled package structure for a magnetically coupled isolator is provided that includes a first set of lead frames, a second set of lead frames, a first wafer, a second wafer, and an insulative package. The first set of lead frames includes a first wafer carrying portion, at least one first coil portion, a plurality of first lead portions, and a plurality of first floating pins, and the second set of lead frames includes a first a second wafer carrying portion, at least one second coil portion, a plurality of second lead portions, and a plurality of second floating pins. The first wafer is disposed on the first wafer carrier and the second wafer is disposed on the second wafer carrier. The insulating package encapsulates the first wafer and the second wafer and connects the first set of lead frames and the second set of lead frames, wherein a portion of each of the first lead portions is exposed The insulating package is external to the body, and a portion of each of the second lead portions is exposed outside the insulating package, and the portion of the first lead portion and the portion of the second lead portion are used To provide an isolation voltage to the first set of lead frames and the second set of lead frames, respectively. The first set of lead frames are disposed above or below the second set of lead frames, and the first set of lead frames and the second set of lead frames have a height difference, and the first set of leads The frame and the second set of lead frames are electrically isolated from each other, and the first coil portion and the second coil portion are matched to each other to generate magnetic coupling.

One of the advantageous effects of the present invention is a dual lead frame magnetic coupling package structure for a magnetic coupling isolator provided by the present invention and a method of fabricating the same, which can be provided by "setting the first set of lead frames in the Upper or lower of the two sets of lead frames, and applying a first magnetic field and a second magnetic field to the first set of lead frames and the second set of lead frames, respectively, such that the first coil portion and the first The two coil portions are aligned with each other or the first group of lead frames are disposed above or below the second group of lead frames, and a height between the first group of lead frames and the second group of lead frames Poor, and the first set of lead frames and the second set of lead frames are electrically isolated from each other, and the first coil portion and the second coil portion are matched to each other to generate magnetic coupling" The accuracy with which the coil portion and the second coil portion are aligned with each other, and controls the magnetic coupling effect generated when the first coil portion and the second coil portion are matched with each other.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.

P‧‧‧Double lead frame magnetic coupling package structure

1‧‧‧First set of lead frames

10‧‧‧First body

11‧‧‧First wafer carrier

12,12’‧‧‧First coil

13‧‧‧First pin section

14‧‧‧First floating pin

2‧‧‧Second set of lead frames

20‧‧‧Second body

21‧‧‧Second wafer carrier

22‧‧‧second coil

23‧‧‧Second pin section

24‧‧‧Second floating pin

3‧‧‧First chip

31‧‧‧First cable

4‧‧‧second chip

41‧‧‧second cable

5‧‧‧Package

B, B’‧‧‧Bend

D‧‧‧ height difference

1 is a schematic plan view of a first set of lead frames used in one embodiment of the present invention; FIG. 2 is a schematic cross-sectional view taken along line II-II of FIG. 1; FIG. 3 is used in one embodiment of the present invention. FIG. 4 is a schematic cross-sectional view taken along line IV-IV of FIG. 3; FIG. 5 is a double lead frame magnetic coupling for a magnetic coupling isolator according to an embodiment of the present invention. FIG. 6 is a schematic cross-sectional view of the first set of lead frames shown in FIG. 2 after bending the lead portions; FIG. 7 is a view of the second set of lead frames shown in FIG. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 8 is a schematic view showing a manufacturing method of a double lead frame magnetic coupling package structure for a magnetic coupling isolator according to an embodiment of the present invention after a coil alignment step; FIG. A schematic diagram of a dual lead frame magnetic coupling package structure for a magnetic coupling isolator provided by an embodiment; FIG. 10 is a double lead frame magnetic coupling package structure for a magnetic coupling isolator according to another embodiment of the present invention; Schematic diagram; Figure 11 is another FIG. 12 is a top plan view of a first set of lead frames used in another embodiment of the present invention; FIG. 13 is a first view of another embodiment of the present invention; a top view of the set of lead frames before the wafer is placed; Figure 14 is a top plan view of the structure of Figure 13 after the wafer is placed.

The following is a description of an embodiment of the present invention relating to a "two-lead frame magnetic coupling package structure for a magnetic coupling isolator and a method of manufacturing the same", which can be disclosed by those skilled in the art by a specific embodiment. The advantages and effects of the present invention are understood. The present invention may be carried out or applied in various other specific embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention. In addition, the drawings of the present invention are merely illustrative and are not intended to be stated in the actual size. The following embodiments will further explain the related technical content of the present invention, but the disclosure is not intended to limit the scope of the present invention.

Please refer to Figure 1 to Figure 4. 1 and 3 are top plan views of a first set of lead frames and a second set of lead frames used in an embodiment of the present invention, and FIGS. 2 and 4 are first sets of lead frames shown in FIGS. 1 and 3, respectively. A schematic view of the section taken along the section line. The manufacturing method of the double lead frame magnetic coupling package structure for magnetic coupling isolator provided by the present invention can utilize two independent lead frame structures, that is, the first group of lead frames 1 and the second group of lead frames 2 are combined with each other. The resulting double lead frame assembly. Next, taking the two independent lead frame structures shown in FIG. 1 and FIG. 2 as constituent elements as an example, the manufacturing of the double lead frame magnetic coupling package structure for the magnetic coupling isolator provided by the embodiment of the present invention is provided. The method is described in detail.

Please refer to FIG. 5. FIG. 5 is a flow chart of a method for manufacturing a dual lead frame magnetic coupling package structure for a magnetic coupling isolator according to an embodiment of the present invention. As shown in FIG. 5, the manufacturing method of the double lead frame magnetic coupling package structure for a magnetic coupling isolator provided by the present invention includes a lead frame providing step (step S100), a wafer connecting step (step S102), and a coil alignment step. (Step S104). Specifically, in the lead frame providing step, the first group of lead frames 1 and the second group of lead frames 2 which are separated from each other are provided.

As shown in FIG. 1, the first set of lead frames 1 includes a first wafer carrying portion 11, first The coil portion 12, the plurality of first lead portions 13, and the plurality of first floating pins 14. As shown in FIG. 3, the second set of lead frames 2 includes a second wafer carrying portion 21, a second coil portion 22, a plurality of second lead portions 23, and a plurality of second floating pins 24. It can be seen from comparison between FIG. 1 and FIG. 3 that the first set of lead frames 1 and the second set of lead frames 2 have a similar structure, that is, all include a wafer carrying portion, a coil portion, a lead portion, and a floating pin, but only The structural configurations are mirror images of each other.

In addition, the first set of lead frames 1 and the second set of lead frames 2 may further include a first frame body 10 as a support frame and a second frame body 20. As shown in FIG. 1 and FIG. 2, in one embodiment of the present invention, the first wafer carrier 11 in the first set of lead frames 1 is surrounded by the first coil portion 12, and the first wafer carrier portion 11 and The first coil portion 12 is connected to the first frame body 10 through the first lead portion 13. Similarly, as shown in FIGS. 3 and 4, the second wafer carrier portion 21 of the second group of lead frames 2 is surrounded by the second coil portion 22, and the second wafer carrier portion 21 and the second coil portion 22 are both passed. The second lead portion 23 is connected to the second frame body 20. In addition, the first floating pin 14 and the second floating pin 24 are respectively used to support the first coil portion 12 and the second coil portion 22.

It should be noted that the structural design of the first set of lead frames 1 and the second set of lead frames 2 shown in FIGS. 1 to 4, such as the relative relationship between the wafer carrying portion and the coil portion, is only one of the implementations of the present invention. example. Different structural designs for the first set of lead frames 1 and the second set of lead frames 2 will be described later in the specification.

In other words, as long as the first coil portion 12 and the second coil portion 22 in the magnetic coupling package structure can be matched to each other to transmit signals by electromagnetic coupling, between the first wafer carrying portion 11 and the first coil portion 12 and second The relative positional relationship between the wafer setting portion 21 and the second coil 22 is not limited in the present invention.

However, the structural design of the first set of lead frames 1 and the second set of lead frames 2 as shown in FIGS. 1 to 4 can effectively save the overall volume of the formed double lead frame magnetically coupled package structure and enhance the coupling effect. Therefore, preferably, in the present invention, the first coil portion 12 surrounds the first wafer carrying portion 11, and the second coil portion 22 surrounds the second crystal The sheet carrier portion 21 can be arranged to effectively reduce the overall volume of the formed lead frame assembly or the double lead frame magnetically coupled package structure and enhance electrical isolation and magnetic coupling effects under the use of the maximum coil area.

The first set of lead frames 1 and the second set of lead frames 2 may all be made of a conductive material such as metal, and the materials thereof may be the same or different. The first frame body 10 of the first group of lead frames 1, the first wafer carrier portion 11, the first coil portion 12, and the first lead portion 13 may be integrally formed of the same material. Similarly, the second frame body 20, the second wafer carrier portion 21, the second coil portion 22, and the second lead portion 23 of the second group of lead frames 2 may be integrally formed of the same material.

The first coil portion 12 and the second coil portion 22 may be formed of a metal frame or a metal ring formed of a strip metal of the first group of lead frames 1 and the second group of lead frames 2. The first coil portion 12 and the second coil portion 22 may be a single coil or a multi-turn coil. Further, in the present invention, the number of the first coil portion 12 and the second coil portion 22 is not limited thereto. For example, two first coil portions 12 symmetrically distributed therein may be included in the first set of lead frames 1, and two second coils symmetrically distributed therein may be included in the second group of lead frames 2 Part 22. Specifically, the two first coil portions 12 may be distributed on opposite sides of the first wafer carrying portion 11, and the two second coil portions 22 may be distributed on opposite sides of the second wafer carrying portion 21, thereby forming two Telecommunications channels. However, in the following description, the first group of lead frames 1 and the second group of lead frames 2 respectively include a first coil portion 12 and a second coil portion 22.

Next, please refer to Figure 5 again. Step S102 is a wafer connection step, which includes disposing at least one first wafer and at least one second wafer on the first wafer carrier 11 and the second wafer carrier 21, respectively, and electrically connected to the first lead portion, respectively. 13 and the second lead portion 23.

As shown in FIG. 1 and FIG. 3, in addition to the two lead frame structures (the first group of lead frames 1 and the second group of lead frames 2), FIGS. 1 and 3 are simultaneously disposed on the first wafer carrying portion 11. a first wafer 3 and a second wafer carrier 21 The second wafer 4 and the plurality of first connecting lines 31 and the plurality of second connecting lines 41 for respectively electrically connecting the first wafer 3 and the second wafer 4 are provided. 2 and 4 also show the first wafer 3 and the second wafer 4, but in order to maintain the simplicity of the drawing, only one of the first connecting lines 31 and one of the second connecting lines 41 are shown.

As shown in FIG. 1 and FIG. 3, the first wafer carrying portion 11 and the first coil portion 12 are electrically connected to each other through the first connecting line 31, and the second wafer carrying portion 21 and the second through the second connecting line 41. The coil portions 22 are electrically connected to each other. In addition, the first wafer carrying portion 11 and the second wafer carrying portion 21 may be electrically connected to the first lead portion 13 and the second lead portion 23 through the other first connecting line 31 and the second connecting line 41, respectively. . Other unnumbered first and second connection lines may be designed in accordance with the general knowledge in the art and will not be described in detail herein.

In the present invention, the number and shape of the plurality of first lead portions 13 and the plurality of second lead portions 23 can be designed and adjusted according to product requirements, and are not limited in the present invention. In addition, the connection manner and specific types of the plurality of first connecting lines 31 and the plurality of second connecting lines 41 are also not limited in the present invention, and may be based on the general knowledge in the technical field of the invention. Expertise is understood and designed.

For example, the first wafer 3 and the second wafer 4 are integrated circuit wafers (ICs). In one embodiment of the invention, the first wafer 3 comprises a coil drive circuit unit and the second wafer 4 comprises a receive circuit unit. The high frequency signal is electrically connected to the first coil portion 12 through the coil driving circuit unit to be transmitted to the first coil portion 12, and the second coil portion 22 is electrically connected to the second coil portion 22 through the receiving circuit unit to receive high. Frequency voltage. Alternatively, in another embodiment, the first wafer 3 may include a receiving circuit unit, and the second wafer 4 includes a coil driving circuit unit.

The arrangement of the first wafer 3 and the second wafer 4 in step S102 is not limited in the present invention. Further, in step S102, the first connection line 31 and the second connection line 41 may be provided while the first wafer 3 and the second wafer 4 are disposed. For example, the first connection line 31 can be connected to the first wafer 3 in a wire bonding manner, first Between the wafer carrying portion 11 and the first lead portion 13, and the second connecting line 41 may be wire-bonded to the second wafer 4, the second wafer carrying portion 21, the second coil portion 22, and the second lead portion Between 23 .

Thereby, the input signal input by the coil driving circuit unit can be transmitted to the output terminal (receiving circuit unit) by the effective magnetic coupling generated by the first coil portion 12 and the second coil portion 22 being aligned with each other in the lateral direction. Specifically, the first coil portion 12 of the first group of lead frames 1 forms a first closed circuit together with the first wafer 3 through the first connection line 31. A high frequency alternating magnetic field can be generated by applying current to the first closed circuit. The high frequency alternating magnetic field is magnetically coupled to the second coil portion 22 by the first coil portion 12, and the second coil portion 22, the second connecting line 41, and the second wafer 4 of the second group of lead frames 2 are formed in a second closed state. High frequency alternating current is generated in the circuit. Accordingly, the electrical signal can be transmitted from the first wafer 21 (e.g., the transmitter) to the second wafer 4 (e.g., the receiver) that is electrically isolated from the first wafer 3.

After the step S102 is completed, the manufacturing method of the double lead frame magnetic coupling package structure for coupling the isolator provided by the present invention may further comprise forming a bend in each of the first set of lead frames 1 and the second set of lead frames 2 Steps of the department. Please refer to FIG. 2, FIG. 4, FIG. 6, and FIG. 6 is a cross-sectional schematic view of the first set of lead frames 1 shown in FIG. 2 after bending the lead portions, and FIG. 7 is a cross-sectional view of the second set of lead frames 2 shown in FIG. Schematic view.

It is worth mentioning that in the manufacturing method of the double lead frame magnetic coupling package structure for coupling the isolator provided by the present invention, the step S102 and the step of forming the bent portion are not necessarily performed in accordance with the above sequence. In other words, before step S104 shown in FIG. 5, that is, before the coil alignment step, the first wafer 3 and the second wafer 4 may be first formed to form a bent portion, or a bent portion may be formed first. The first wafer 3 and the second wafer 4 are disposed on the first wafer carrier 11 and the second wafer carrier 21, respectively. In the following description, the case where the bent portion is formed in step S102 will be described.

In fact, in the present invention, the bent portions B, B' may be formed in the first set of lead frames 1 is either formed in the second set of lead frames 2, or both the first set of lead frames 1 and the second set of lead frames 2 are formed with bent portions B, B'. In other words, the manufacturing method provided by the present invention may include forming at least one bent portion on at least one of the first set of lead frames 1 and the second set of lead frames 2.

In the embodiment shown in Figs. 6 and 7, the first group of lead frames 1 is formed with a bent portion B, and the second group of lead frames 2 is formed with a bent portion B'. The bent portion B may be formed between the first lead portion 13 and the first coil portion 12 and between the first lead portion 13 and the first wafer carrying portion 11. The bent portion B' may be formed between the second lead portion 23 and the second coil portion 22, and between the second lead portion 23 and the second wafer carrying portion 12.

Specifically, the formation of the bent portions B, B' can prevent the first coil portion 12 and the second coil portion 22 from contacting each other in a subsequent step, and the first wafer 3 disposed on the first wafer carrying portion 11 can also be avoided. The second wafers 4 disposed on the second wafer carrier 21 are in contact with each other. Therefore, as long as the above-mentioned avoidance of the first group of lead frames 1 and the second group of lead frames 2 not in contact with each other in the product can be achieved, that is, to ensure that the first group of lead frames 1 and the second group of lead frames 2 are electrically insulated from each other, The specific size of the bent portions B, B', the number of bends, and the direction of the bend can also be adjusted. Specifically, the detailed parameters of the bent portions B, B' can be designed in accordance with the flow of the manufacturing method and the magnetic coupling and voltage insulating properties of the target product. For example, the bending direction of the bent portion 1131 can be determined depending on the arrangement positions of the first wafer 3 and the second wafer 4 (for example, on surfaces facing each other or on surfaces facing each other, etc.).

By the arrangement of the bent portions B, B', the subsequent step of aligning the coils can be made easier. In addition, by controlling the bending direction of the bending portions B, B' and the amount of bending (the amplitude or height of the bending formed), the magnetic coupling package structure formed after the subsequent coil alignment step can be made. A coil portion 11 and the second coil portion 21 have a height difference d (indicated in Fig. 9). The height difference d can be designed according to the magnetic coupling and voltage insulation characteristics of the target product. In other words, adjusting the height difference d can adjust the isolation voltage between the two lead frames and the magnetic between the two coil portions. Coupling strength.

For example, in the present invention, the height difference d is preferably between 100 and 500 microns. In other words, in the target product (magnetic coupling package structure), the distance between the first coil portion 12 and the second coil portion 22 is preferably between 100 and 500 μm. Controlling the height difference d between 100 and 500 μm can effectively reduce the volume of the target product in addition to the isolation voltage and magnetic coupling efficiency between the first coil portion 12 and the second coil portion 22.

Next, please refer to Figure 5 again. In step S104 (coil alignment step), the first group of lead frames 1 are disposed above or below the second group of lead frames 2, and the first magnetic field and the second magnetic field are respectively applied to the first group of lead frames 1 And the second set of lead frames 2 such that the first coil portion 12 and the second coil portion 22 are aligned with each other.

Specifically, step S104 is to vertically align the first coil portion 12 of the first group of lead frames 1 and the second coil portion 22 of the second group of lead frames 2 to each other. In this way, when the first coil portion 12 is driven by the first wafer 3 or the second coil portion 22 is driven by the second wafer 4, the first coil portion 12 and the second coil portion 22 can be matched with each other to generate Magnetic coupling.

Please refer to FIG. 8. FIG. 8 is a schematic diagram of a method for manufacturing a dual lead frame magnetic coupling package structure for a coupling isolator after a coil alignment step according to an embodiment of the present invention. In step S104, the first set of lead frames 1 are first placed above or below the second set of lead frames 2. The embodiment shown in Figure 8 is to position the first set of lead frames 1 above the second set of lead frames. At this time, the first coil portion 12 of the first group of lead frames 1 and the second coil portion 22 of the second group of lead frames 2 are approximately vertically aligned with each other.

Next, two magnetic fields in opposite directions are applied to the first coil portion 12 of the first group of lead frames 1 and the second coil portion 22 of the second group of lead frames 2, respectively. In this way, the first coil portion 12 and the second coil portion 22 are magnetically aligned with each other such that the first coil portion 12 of the first group of lead frames 1 and the second coil portion 22 of the second group of lead frames 2 are mutually up and down correspond. In other words, after step S104 is completed, as shown in FIG. 8, the first coil portion 12 is disposed directly above the second coil portion 22 and with the second coil portion 22 Parallel to each other. In addition, the first coil portion 12 and the second coil portion 22 are aligned with each other, thereby ensuring the coupling effect between the first coil portion 12 and the second coil portion 22. In addition to this, there is a non-conductive gap between the first coil portion 12 and the second coil portion 22 (the separation distance is the height difference d).

Therefore, in the above manner, the manufacturing method of the magnetic coupling package structure provided by the present invention can achieve the effect of aligning the first coil portion 12 and the second coil portion 22 with each other with a relatively simple technical means.

The manufacturing method of the dual lead frame magnetic coupling package structure for coupling the isolator provided by the present invention may further include a packaging step. Please refer to FIG. 9. FIG. 9 is a schematic diagram of a magnetic coupling package structure according to an embodiment of the present invention.

The packaging step includes forming an insulating package 5 to package the first wafer 3 and the second wafer 4 and connect the first set of lead frames 1 and the second set of lead frames 2. After being packaged, a portion of each of the first lead portions 13 is exposed outside the insulating package 5, and a portion of each of the second lead portions 23 is exposed outside the insulating package 5.

Specifically, after the first coil portion 12 and the second coil portion 22 are aligned with each other, the insulating package 5 can be formed, and the package 5 covers the first wafer carrier portion 11 and the first coil of the first group of lead frames 1. a second wafer carrying portion 21, a second coil portion 22 of the second set of lead frames 2, and a first wafer 3 and a second wafer 4 respectively disposed on the first wafer carrying portion 11 and the second wafer carrying portion 21. . A portion of the package 5 is filled between the first set of lead frames 1 and the second set of lead frames 2 to insulate the first coil portion 12 and the second coil portion 22 from each other.

In addition, a portion of each of the first lead portions 13 is exposed outside the insulating package 5, and a portion of each of the second lead portions 23 is exposed outside the insulating package 5. A portion of the first lead portion 13 exposed by the package 5 and a portion of the second lead portion 23 may be electrically connected to other electronic components. For example, a portion of the first lead portion 13 and a portion of the second lead portion 23 may provide an isolation voltage required for the magnetically coupled package structure.

Finally, the double lead frame magnetic body for coupling the isolator provided by the embodiment of the present invention The method of manufacturing the coupled package structure may further include the step of removing the frame. Specifically, the first frame body 10 and the second frame body 20 can be used to support the first group of lead frames 1 and the second group of lead frames 2, respectively, during the manufacturing process. After the first set of lead frames 1 and the second set of lead frames 2 are connected through the package 5, the first frame body 10 and the second frame body 20 can be trimmed and removed. The manner in which the first frame body 10 and the second frame body 20 are removed is not limited in the present invention.

It should be noted that, in the present invention, before forming the package 5, a poly-imine material, such as a polyimide film, may be disposed between the first set of lead frames 1 and the second set of lead frames 2, To increase the isolation voltage. In other words, the polyimide film enhances the electrical isolation between the first set of lead frames 1 and the second set of lead frames 2. Further, by providing the polyimide film, the difference in height (i.e., the distance of the interval) between the first coil portion 12 and the second coil portion 22 can be effectively reduced to between 100 and 200 μm. In this way, the magnetic coupling efficiency can be increased while ensuring the isolation voltage.

Next, please refer to Figure 10. FIG. 10 is a schematic diagram of a dual lead frame magnetic coupling package structure for a coupling isolator according to another embodiment of the present invention. Compared with the embodiment shown in FIG. 9, in the embodiment shown in FIG. 10, the arrangement of the first wafer 3 and the second wafer 4 is different. Specifically, in FIG. 10, the first wafer 3 and the second wafer 4 are respectively disposed on the two wafer carriers facing away from each other. In other words, the two wafers provided with the first wafer 3 and the second wafer 4 in the double-lead magnetic coupling package structure P of FIG. 9 are oriented in the same direction, the first wafer 3 and the first in FIG. The two wafers 4 are disposed on two wafer carriers facing away from each other. In fact, the manner in which the first wafer 3 and the second wafer 4 are disposed is not limited in the present invention.

In fact, as previously described for the structural design of the first set of lead frames 1 and the second set of lead frames 2, the respective portions (each element) of the first set of lead frames 1 and the second set of lead frames 2 may be different Mode configuration. Please refer to FIG. 11 and FIG. 11 and FIG. 12 are respectively a view of the first set of lead frames 1 used in different embodiments of the present invention. See the schematic. Since the first group of lead frames 1 and the second group of lead frames 2 can have a similar structure in the same embodiment, only the structure of the first group of lead frames 1 is shown in FIGS. 11 and 12.

As shown in FIG. 11, the first wafer carrying portion 11 and the first coil portion 12 in the first group of lead frames 1 are separated from each other and disposed adjacent to each other. In addition, in the present invention, the number of the first coil portion 12 and the second coil portion 22 is not limited thereto. In the embodiment shown in FIG. 12, the first set of lead frames 1 includes two first coil portions 12, 12', and the two first coil portions 12, 12' are separated from the first wafer carrying portion 11 and Adjacent settings. Specifically, as shown in FIG. 12, the two first coil portions 12, 12' are respectively disposed on both sides of the first wafer carrying portion 11 and supported by the first floating pins 14, so that the first coil portion 12, Both of 12' can be driven by the first wafer 3 on the first wafer carrier 11 by means of different first connecting lines 31.

In this way, the second set of lead frames 2 that cooperate with the first set of lead frames 1 also have two second coil portions, which are in the double lead frame magnetically coupled package structure P and the first The coil portions 12, 12' are aligned with each other and matched with the design of the first wafer 3 and the second wafer 4, so that the double lead frame magnetic coupling package structure P can be a two-channel device.

Next, please refer to FIG. 13 and FIG. 14. 13 and FIG. 14 are respectively top plan views of the first set of lead frames used in the front and rear of the wafer according to an embodiment of the present invention. When the first group of lead frames 1 includes two or more first coil portions 12, in addition to the structural design shown in FIG. 12, the first coil portion 12 may be designed to surround the first wafer mounting portion 11 A structural configuration of a set of lead frames 1.

As shown in Fig. 13, the first group of lead frames 1 includes two first coil portions 12, 12', and both of the first coil portions 12, 12' are disposed around the first wafer carrying portion 11. Specifically, the first coil portion 12 surrounds the periphery of the first wafer carrying portion 11, and the first coil portion 12' recirculates around the periphery of the first coil portion 12. In this way, the effect of forming a two-channel device can be achieved under the premise of saving the overall volume of the double-lead frame magnetic coupling package structure P.

As shown in FIG. 14, in the step of performing wafer bonding on the first group of lead frames 1 shown in FIG. 13, the first wafer 3 may be disposed on the first wafer carrier portion 11 such that the first wafer 3 covers a portion of the The first coil portion 12. In other words, in this embodiment, the first coil portion 12 and the second coil portion 22 can also be supported by at least a portion of the wafer carrying portion, thereby reducing the overall size of the product. Accordingly, the arrangement of the first coil portions 12, 12' can be designed without being limited to the size of the first wafer 3, thereby reducing the overall volume of the double lead frame magnetically coupled package structure P, and ensuring a two-channel device ( The magnetic coupling effect of the double lead frame magnetically coupled package structure P).

The present invention further provides a magnetically coupled package structure. The detailed structure of the double lead frame magnetic coupling package structure P is illustrated in FIGS. 9 and 10, respectively. The double lead frame magnetic coupling package structure P provided by the present invention can be formed by the above-described manufacturing method of the magnetic coupling package structure. Therefore, the structure and manufacturing method of the double lead frame magnetic coupling package structure P will not be described again.

[Advantageous Effects of Embodiments]

The beneficial effects of the present invention are the dual lead frame magnetic coupling package structure P for coupling the isolator provided by the present invention and the manufacturing method thereof, which can be provided by "setting the first group of lead frames 1 in the second group of lead frames 2" Above or below, and applying a first magnetic field and a second magnetic field to the first set of lead frames 1 and the second set of lead frames 2, respectively, such that the first coil portion 12 and the second coil portion 22 are aligned with each other "or" A set of lead frames 1 are disposed above or below the second set of lead frames 2, and a height difference d between the first set of lead frames 1 and the second set of lead frames 2, and the first set of lead frames 1 and the second set of leads The frame 2 is electrically isolated from each other, and the first coil portion 12 and the second coil portion 22 are matched to each other to generate a magnetic coupling" to improve the accuracy of aligning the first coil portion 12 and the second coil portion 22 with each other, and to control The magnetic coupling effect produced by the first coil portion 12 and the second coil portion 22 are matched with each other.

In particular, the dual lead frame magnetic coupling package structure P for coupling the isolator provided by the present invention can be applied to a semiconductor package component, for example, a micro transformer. Moreover, the effect of automatically aligning the coil portions respectively located in the two independent lead frame structures (the first group of lead frames 1 and the second group of lead frames 2) can be achieved by a simple manufacturing method in combination with the dimensional design. In addition to this, the first coil portion 12 and the second coil portion 22 are highly insulated from each other by the arrangement of the package 5. The double lead frame magnetic coupling package structure P provided by the present invention may have an insulation voltage of 5 kV or more.

In addition, in the present invention, the first coil portion 12 and the second coil portion 22 are laterally aligned with each other to generate an effective magnetic coupling, so that the signal can be transmitted to the output through the coil coupling by the input terminal (for example, a reflector). End (such as receiver) and output. In addition to this, the vertical distance of the first coil portion 12 and the second coil portion 22 can be controlled by the design of the lead frame structure 1. For example, adjusting the isolation distance between the first set of lead frames 11 where the first coil portion 12 is located and the second set of lead frames 12 where the second coil portion 22 is located can adjust the effect of electrically insulating the two coils from each other.

The above disclosure is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, any equivalent technical changes made by using the present specification and the contents of the drawings are included in the application of the present invention. Within the scope of the patent.

Claims (10)

A method of manufacturing a dual lead frame magnetically coupled package structure for a magnetically coupled isolator, comprising: a lead frame providing step, comprising: providing a first set of lead frames and a second set of lead frames, wherein the The set of lead frames includes a first wafer carrier, at least one first coil portion, a plurality of first pin portions, and a plurality of first floating pins, and the second group of lead frames includes a second wafer carrier At least one second coil portion, a plurality of second lead portions, and a plurality of second floating pins; a wafer connecting step including disposing at least one first wafer and at least one second wafer respectively at the first And the second lead portion and the second lead portion are respectively electrically connected to the first lead portion and the second lead portion; and a coil alignment step, including the first set of leads a shelf is disposed above or below the second set of lead frames, and respectively applying a first magnetic field and a second magnetic field to the first set of lead frames and the second set of lead frames, such that the first The coil portion and the second coil portion are opposite each other . The method of manufacturing a dual lead frame magnetic coupling package structure for a magnetic coupling isolator according to claim 1, wherein after the coil alignment step, further comprising: forming an insulating package to encapsulate the a first wafer and the second wafer are connected to the first set of lead frames and the second set of lead frames, wherein a portion of each of the first lead portions is exposed outside the insulating package, and each A portion of one of the second lead portions is exposed outside the insulating package. A method of manufacturing a dual lead frame magnetic coupling package structure for a magnetic coupling isolator according to claim 1, wherein the first magnetic field and the second magnetic field have opposite directions. A method of manufacturing a dual lead frame magnetic coupling package structure for a magnetic coupling isolator according to claim 1, wherein the first group of lead frames includes two first coils And the second set of lead frames includes two second coil portions, and the two first coil portions are respectively aligned with the two second coil portions. A method of manufacturing a dual lead frame magnetic coupling package structure for a magnetic coupling isolator according to claim 1, wherein in the lead frame providing step, the first group of lead frames and the second group of leads The shelves are separated from each other. A dual lead frame magnetic coupling package structure for a magnetically coupled isolator, comprising: a first set of lead frames, the first set of lead frames comprising a first wafer carrying portion, at least one first coil portion, and a plurality of a first lead portion and a plurality of first floating pins; a second set of lead frames, the second set of lead frames further comprising a second wafer carrying portion, at least one second coil portion, and a plurality of second pins And a plurality of second floating pins; a first wafer, the first wafer is disposed on the first wafer carrier; a second wafer, the second wafer is disposed on the second wafer carrier; And an insulative package encapsulating the first wafer and the second wafer and connecting the first set of lead frames and the second set of lead frames, wherein each of the first leads a portion of the foot is exposed outside the insulating package, and a portion of each of the second lead portions is exposed outside the insulating package, the portion of the first lead portion and the second pin The portion of the portion is used to provide an isolation voltage to the a first set of lead frames and the second set of lead frames; wherein the first set of lead frames are disposed above or below the second set of lead frames, the first set of lead frames and the second set There is a height difference between the lead frames, and the first set of lead frames and the second set of lead frames are electrically isolated from each other, and the first coil portion and the second coil portion are matched to each other to generate magnetic coupling. The dual lead frame magnetic coupling package structure for a magnetic coupling isolator according to claim 6, wherein the first wafer includes a coil driving circuit unit, and the second The chip includes a receiving circuit unit, the first wafer forms a first closed circuit with the first coil portion through a first connecting line, and the second chip passes through a second connecting line and the second connecting line The coil portion forms a second closed circuit. The dual lead frame magnetic coupling package structure for a magnetic coupling isolator according to claim 7, wherein a high frequency signal is electrically connected through the coil driving circuit unit and the first coil portion to transmit To the first coil portion, and the second coil portion is electrically connected to both the receiving circuit unit and the second coil portion to receive a high frequency voltage. A two-lead frame magnetic coupling package structure for a magnetically coupled isolator according to claim 6, wherein the first wafer and the second wafer are disposed opposite to each other. The dual lead frame magnetic coupling package structure for a magnetic coupling isolator according to claim 6, wherein the height difference between the first coil portion and the second coil portion is between 100 and 500 μm Between the first coil portion and the second coil portion is filled with a polyimide material.