TWI643701B - 控制硏磨的方法，及其電腦程式產品和硏磨設備 - Google Patents

控制硏磨的方法，及其電腦程式產品和硏磨設備 Download PDF

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Publication number
TWI643701B
TWI643701B TW102137537A TW102137537A TWI643701B TW I643701 B TWI643701 B TW I643701B TW 102137537 A TW102137537 A TW 102137537A TW 102137537 A TW102137537 A TW 102137537A TW I643701 B TWI643701 B TW I643701B
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TW
Taiwan
Prior art keywords
spectrum
sequence
measured
spectral
measurement
Prior art date
Application number
TW102137537A
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English (en)
Chinese (zh)
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TW201422368A (zh
Inventor
錢隽
迪漢達潘尼席維庫瑪
傑瑞安班傑明
歐斯特赫德湯瑪士Ｈ
大衛傑弗瑞杜魯
敏克葛利格瑞Ｅ
史威克柏格斯勞Ａ
班尼特杜里Ｅ
Original Assignee
美商應用材料股份有限公司
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Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TW201422368A publication Critical patent/TW201422368A/zh
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Publication of TWI643701B publication Critical patent/TWI643701B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW102137537A 2012-10-23 2013-10-17 控制硏磨的方法，及其電腦程式產品和硏磨設備 TWI643701B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/658,737 US9221147B2 (en) 2012-10-23 2012-10-23 Endpointing with selective spectral monitoring
US13/658,737 2012-10-23

Publications (2)

Publication Number Publication Date
TW201422368A TW201422368A (zh) 2014-06-16
TWI643701B true TWI643701B (zh) 2018-12-11

Family

ID=50485749

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102137537A TWI643701B (zh) 2012-10-23 2013-10-17 控制硏磨的方法，及其電腦程式產品和硏磨設備

Country Status (4)

Country Link
US (1) US9221147B2 (https=)
JP (1) JP6292819B2 (https=)
KR (1) KR101980921B1 (https=)
TW (1) TWI643701B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9248544B2 (en) * 2012-07-18 2016-02-02 Applied Materials, Inc. Endpoint detection during polishing using integrated differential intensity
EP3221897A1 (en) 2014-09-08 2017-09-27 The Research Foundation Of State University Of New York Metallic gratings and measurement methods thereof
CN107097154B (zh) * 2017-04-28 2023-06-13 昆明理工大学 一种简易抛光液流量控制供给装置及其控制方法
US10964609B2 (en) 2018-11-30 2021-03-30 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for detecting end point
KR20250025007A (ko) * 2022-06-22 2025-02-20 어플라이드 머티어리얼스, 인코포레이티드 연마 프로세스의 제어를 위한 윈도우 로직

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200830397A (en) * 2006-10-31 2008-07-16 Applied Materials Inc Peak based endpointing for chemical mechanical polishing
TW201022870A (en) * 2008-10-27 2010-06-16 Applied Materials Inc Goodness of fit in spectrographic monitoring of a substrate during processing
US20110081829A1 (en) * 2009-10-06 2011-04-07 Shinrou Ohta Polishing endpoint detection method and polishing endpoint detection apparatus
TW201128336A (en) * 2009-11-03 2011-08-16 Applied Materials Inc Endpoint method using peak location of spectra contour plots versus time
TW201213050A (en) * 2010-08-05 2012-04-01 Applied Materials Inc Spectrographic monitoring using index tracking after detection of layer clearing
TW201228772A (en) * 2010-10-20 2012-07-16 Applied Materials Inc Multiple matching reference spectra for in-situ optical monitoring

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5747380A (en) 1996-02-26 1998-05-05 Taiwan Semiconductor Manufacturing Company, Ltd. Robust end-point detection for contact and via etching
US6271047B1 (en) 1998-05-21 2001-08-07 Nikon Corporation Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same
TW398036B (en) 1998-08-18 2000-07-11 Promos Technologies Inc Method of monitoring of chemical mechanical polishing end point and uniformity
US6358327B1 (en) 1999-06-29 2002-03-19 Applied Materials, Inc. Method for endpoint detection using throttle valve position
JP3932836B2 (ja) * 2001-07-27 2007-06-20 株式会社日立製作所 薄膜の膜厚計測方法及びその装置並びにそれを用いたデバイスの製造方法
US6618130B2 (en) 2001-08-28 2003-09-09 Speedfam-Ipec Corporation Method and apparatus for optical endpoint detection during chemical mechanical polishing
US6806948B2 (en) 2002-03-29 2004-10-19 Lam Research Corporation System and method of broad band optical end point detection for film change indication
US7226339B2 (en) 2005-08-22 2007-06-05 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
WO2007024807A2 (en) * 2005-08-22 2007-03-01 Applied Materials, Inc. Apparatus and methods for spectrum based monitoring of chemical mechanical polishing
US8260446B2 (en) 2005-08-22 2012-09-04 Applied Materials, Inc. Spectrographic monitoring of a substrate during processing using index values
KR101504508B1 (ko) * 2007-02-23 2015-03-20 어플라이드 머티어리얼스, 인코포레이티드 연마 엔드포인트들을 결정하기 위한 스펙트럼 사용
US8751033B2 (en) 2008-11-14 2014-06-10 Applied Materials, Inc. Adaptive tracking spectrum features for endpoint detection
US20100316962A1 (en) 2009-06-10 2010-12-16 Heidi Elise Newell Method for embodying an incense-coated template in variety of ornate and complex designs or patterns
US8834229B2 (en) * 2010-05-05 2014-09-16 Applied Materials, Inc. Dynamically tracking spectrum features for endpoint detection
US20110282477A1 (en) * 2010-05-17 2011-11-17 Applied Materials, Inc. Endpoint control of multiple substrates with multiple zones on the same platen in chemical mechanical polishing
US8930013B2 (en) * 2010-06-28 2015-01-06 Applied Materials, Inc. Adaptively tracking spectrum features for endpoint detection
TWI478259B (zh) * 2010-07-23 2015-03-21 應用材料股份有限公司 用於終點偵測之二維光譜特徵追蹤
US8694144B2 (en) * 2010-08-30 2014-04-08 Applied Materials, Inc. Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishing
US8825988B2 (en) * 2010-11-12 2014-09-02 Advanced Micro Devices, Inc. Matrix algorithm for scheduling operations
US20120278028A1 (en) 2011-04-28 2012-11-01 Jeffrey Drue David Generating model based spectra library for polishing
WO2013133974A1 (en) 2012-03-08 2013-09-12 Applied Materials, Inc. Fitting of optical model to measured spectrum
US8563335B1 (en) 2012-04-23 2013-10-22 Applied Materials, Inc. Method of controlling polishing using in-situ optical monitoring and fourier transform
US20140020829A1 (en) 2012-07-18 2014-01-23 Applied Materials, Inc. Sensors in Carrier Head of a CMP System
US8808059B1 (en) * 2013-02-27 2014-08-19 Applied Materials, Inc. Spectraphic monitoring based on pre-screening of theoretical library

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200830397A (en) * 2006-10-31 2008-07-16 Applied Materials Inc Peak based endpointing for chemical mechanical polishing
TW201022870A (en) * 2008-10-27 2010-06-16 Applied Materials Inc Goodness of fit in spectrographic monitoring of a substrate during processing
US20110081829A1 (en) * 2009-10-06 2011-04-07 Shinrou Ohta Polishing endpoint detection method and polishing endpoint detection apparatus
TW201128336A (en) * 2009-11-03 2011-08-16 Applied Materials Inc Endpoint method using peak location of spectra contour plots versus time
TW201213050A (en) * 2010-08-05 2012-04-01 Applied Materials Inc Spectrographic monitoring using index tracking after detection of layer clearing
TW201228772A (en) * 2010-10-20 2012-07-16 Applied Materials Inc Multiple matching reference spectra for in-situ optical monitoring

Also Published As

Publication number Publication date
KR20140051798A (ko) 2014-05-02
JP6292819B2 (ja) 2018-03-14
US9221147B2 (en) 2015-12-29
US20140113524A1 (en) 2014-04-24
TW201422368A (zh) 2014-06-16
JP2014086733A (ja) 2014-05-12
KR101980921B1 (ko) 2019-05-21

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