TWI641296B - Signal transmission device - Google Patents

Abstract

The invention provides a signal transmission device. The signal transmission device includes a substrate, a circuit layer disposed on the substrate, a protective layer disposed on the circuit layer, a shielding film disposed on the protective layer, and a side disposed on a side of the shielding film and connected to the protective layer. Department of Protection.

Description

Signal transmission device

The invention relates to a signal transmission device. Specifically, the present invention relates to a signal transmission device having an electromagnetic wave shielding film.

In various electronic devices, such as signal transmission devices, in order to avoid or reduce possible electromagnetic interference (EMI), radio frequency interference (RFI), or electrostatic discharge (ESD) and other unexpected electrical interference Factors, various devices or methods are gradually being developed for electromagnetic wave shielding. For example, an electromagnetic wave shielding film can be used for flexible printed circuit boards (FPC) to block electromagnetic waves that may affect its normal function operation or may even damage it.

In general, a metal layer is often used as a part of a material for an electromagnetic wave shielding film. However, an electromagnetic wave shielding film subjected to processes such as stamping, cutting, or etching may expose the metal layer unnecessarily, thereby increasing the possibility of the metal layer coming into contact with unexpected electronic components. Since such contact may cause various problems including short circuits, abrasion, interference, etc., it is necessary to develop electromagnetic wave shielding methods or devices that reduce or avoid such problems.

To solve the above problems, an embodiment of the present invention provides a signal transmission device. The signal transmission device includes a substrate, a circuit layer disposed on the substrate, a protective layer disposed on the circuit layer, a shielding film disposed on the protective layer, and a side disposed on a side of the shielding film and connected to the protective layer. Department of Protection.

The signal transmission device according to the embodiment of the present invention has a side shield to protect the shielding film, so as to reduce or avoid the chance of the shielding film from unintended contact with other electronic components. Therefore, the signal transmission device provided by the present invention can reduce or avoid various potential problems caused by the contact of the shielding film with other electronic components.

100, 110, 100 ’, 100”, 200, 300, 400, 500, 600, 600 ’, 700, 800‧‧‧ signal transmission devices

21‧‧‧ valid line

22‧‧‧ auxiliary line

35‧‧‧Striped area

45‧‧‧ top surface

46‧‧‧ lower surface

55‧‧‧Top of wall

37, 47‧‧‧ side surface

105, 115‧‧‧transmission side

106‧‧‧Joints

116‧‧‧pin

125, 135‧‧‧ side

10‧‧‧ substrate

20‧‧‧Circuit layer

30‧‧‧ protective layer

40‧‧‧shielding film

50, 60‧‧‧ Side Guard

401‧‧‧Anisotropic conductive adhesive

402‧‧‧metal layer

403, 404‧‧‧ Insulation

405‧‧‧ Overlay

D1, D2‧‧‧ vertical distance

W‧‧‧ Pitch

d‧‧‧width

FIG. 1A is a schematic diagram of a signal transmission device according to an embodiment of the present invention.

FIG. 1B is a schematic diagram of a signal transmission device according to another embodiment of the present invention.

1C and FIG. 1D are schematic cross-sectional views of a signal transmission device according to two different embodiments of the present invention.

2A to 2C are schematic diagrams of an embodiment in which the shielding film has different orthographic projection ranges on the circuit layer.

FIG. 3 is a schematic diagram of an embodiment of a laminated structure of a shielding film.

FIG. 4A to FIG. 4D are top views of various embodiments of the configuration of the side protection portion and the shielding film. 视 Schematic.

5 and 6 are schematic top views of the configuration and configuration of a signal transmission device according to other embodiments of the present invention.

7 to 9B are schematic diagrams of a signal transmission device according to another embodiment of the present invention.

FIG. 10 is a schematic diagram of a signal transmission device according to another embodiment of the present invention.

FIG. 11 is a schematic diagram of a signal transmission device according to another embodiment of the present invention.

12A to 12C are schematic diagrams illustrating a method of manufacturing a signal transmission device according to different embodiments of the present invention.

13A to 13C are schematic diagrams illustrating a method for manufacturing a signal transmission device according to different embodiments of the present invention.

Various embodiments will be described below, and those with ordinary knowledge in the technical field can easily understand the spirit and principles of the present invention by referring to the description and the accompanying drawings. However, although some specific embodiments will be specifically described in the text, these embodiments are merely exemplary and are not to be considered in a limiting or exhaustive sense in all respects. Therefore, for those with ordinary knowledge in the technical field, various changes and modifications to the invention should be obvious and easily achievable without departing from the spirit and principles of the invention.

Hereinafter, a message according to an embodiment of the present invention will be described first with reference to FIG. 1A. No. transmission device 100. As shown in FIG. 1A, the signal transmission device 100 includes a substrate 10, a circuit layer 20 disposed on the substrate 10, a protective layer 30 disposed on the circuit layer 20, a shielding film 40 disposed on the protective layer 30, and A side shield 50 on a side of the shielding film 40 and connected to the protection layer 30. In the embodiment shown in FIG. 1A, the side protecting portion 50 may be a wall-like structure, which is arranged like a moat along the length extension direction of the signal transmission device 100, and the wall-like structure has a wall top surface 55. In this embodiment, the vertical distance D1 between the wall top surface 55 and the substrate 10 is greater than or equal to the vertical distance D2 between the upper surface 45 of the shielding film 40 and the substrate 10. That is, the thickness of the side guard portion 50 is at least the same as the thickness of the shielding film 40, or the thickness of the side guard portion 50 is greater than the thickness of the shielding film 40. However, the present invention is not limited to this, and according to other embodiments of the present invention, the thickness of the side protection portion 50 may be smaller than the thickness of the shielding film 40.

For example, referring to the signal transmission device 110 shown in FIG. 1B, the thickness of the side protection portion 50 may be smaller than the thickness of the shielding film 40, and other structures are the same as the signal transmission device 100 shown in FIG. 1A. In this embodiment, the thickness of the side guard portion 50 that is smaller than the thickness of the shielding film 40 may be set higher than the top surface of a specific interlayer in the shielding film 40. That is, when the shielding film 40 is a multilayer stacked structure, the thickness of the side protection portion 50 may be higher than the top surface of a specific interlayer in the stacked structure. For example, it is higher than the top surface of the metal layer in the laminated structure of the shielding film 40, so that the edges of the metal layer can be completely covered.

An example of the shielding film 40 including a laminated structure will be further described later with reference to FIG. 3.

Here, the signal transmission device 100 or 110 shown in FIG. 1A and FIG. 1B may be a Flexible Printed Circuit (FPC), and the substrate 10 may be made of a flexible material. However, the present invention is not limited thereto, and the present invention includes any signal transmission device 100 or 110 without departing from the spirit of the present invention. Under the assumption that the signal transmission device 100 or 110 is not a flexible printed circuit board, the substrate 10 may also be made of a non-flexible material. For example, flexible or non- The flexible substrate 10 may be a glass substrate, a metal substrate, a plastic substrate, and the like, and the plastic substrate may be, for example, a polyimide film, a polyester resin film, or polyethylene terephthalate. Polyester films (Polyethylene terephthalate film) and other materials that can be used as the bottom layer.

The circuit layer 20 may be a circuit pattern layer for layout circuits. Specifically, the circuit of the circuit layer 20 may include at least a plurality of effective lines. For example, when the signal transmission device 100 or 110 is a flexible printed circuit board, multiple effective lines can be used to transmit signals to communicate with different electronic components or devices. However, in addition to messaging, the effective lines can also be circuits used for various purposes, such as drive circuits, control circuits, voltage regulator circuits, and so on. In addition, in addition to the circuit layout including effective circuits, the circuits of the circuit layer 20 may also include other auxiliary circuits, such as virtual circuits, ground circuits, or quality control test circuits. Generally speaking, compared with effective lines, virtual lines, ground lines or quality control test lines have better tolerance to unexpected electrical interference factors such as electromagnetic interference, radio frequency interference or electrostatic discharge, or even if they are interfered, It has little or no impact on the operation of the overall signal transmission device 100 or 110.

Circuit patterns for circuit layout can be made from a variety of conventional or future materials, including but not limited to gold, silver, copper, platinum, iridium, palladium, ruthenium, cadmium, nickel, indium, tin, and alloys material.

The above description of the circuit layer 20 is for illustrative purposes only, and the circuit layer 20 of the signal transmission device 100 or 110 of the present invention may be various functional layers for performing or operating the functions of the signal transmission device 100 or 110.

The protective layer 30 provided on the circuit layer 20 is used to protect the circuit layer 20. For example, the protective layer 30 may reduce or avoid contact of the circuit layer 20 with other structures; or, for example, reduce or Avoid various problems such as line oxidation, line moisture, impurity pollution, welding short circuit, and user electric shock caused by unprotected lines. In this case, the protective layer 30 may be a layer of various materials conventionally used for circuit protection or functional layer protection. For example, the protective layer 30 may be made of polyimide, polyester resin, polyethylene terephthalate, polyacrylonitrile, or polyvinyl alcohol. ), Ethylene vinyl acetate copolymer (Ethyl Vinyl Alcohol), polyethylene naphthalate (Poly (Ethylene Naphthalate), cyclic olefin copolymers (Cyclic Olefincopolymer) and other materials made of various materials. However, the above for protection The description of the layer 30 is merely an example, and the present invention is not limited thereto.

The shielding film 40 disposed on the protective layer 30 can be retracted along the overall signal transmission device 100 or 110, such as 0.2 to 0.5 mm, and the orthographic projection range of the shielding film 40 on the circuit layer 20 covers the above circuit. At least part of it. For example, a valid line is fully covered and an auxiliary line is completely covered, a valid line is partially covered and the auxiliary line is completely covered, a valid line is fully covered and the auxiliary line is partially covered, or a valid line is partially covered and the auxiliary line is covered. In a preferred embodiment, the shielding film 40 can cover all the lines of the signal transmission device 100 or 110 that are affected by unintended electrical interference in the normal projection range of the circuit layer 20.

For example, referring to FIG. 1C and FIG. 1D, according to the signal transmission devices 100 ′ and 100 ″ according to different embodiments of the present invention, the circuit layer 20 may include an effective line 21 and an auxiliary line 22, and the protective layer 30 covers the effective line. 21 and the auxiliary circuit 22 are layers for protecting the effective circuit 21 and the auxiliary circuit 22 and planarizing the surface. However, the present invention is not limited to this, and when the circuit layer 20 is another functional layer, the circuit layer 20 itself may be integrally formed. Or a layer whose surface is flattened, and the protective layer 30 is a layer further stacked on the circuit layer 20 for protecting the circuit layer 20. Therefore, FIG. 1C and FIG. 1D are only the signal transmission device 100 shown in FIG. 1A and FIG. 1B Or 110 possible implementations, and the present invention is not limited herein.

Referring to FIG. 1C, in a preferred embodiment, the shielding film 40 can simultaneously cover all effective circuits 21 and all auxiliary circuits 22 in the orthographic projection range of the circuit layer 20. On the other hand, in another embodiment, referring to FIG. 1D, the shielding film 40 may cover all the effective circuits 21 and a part of the auxiliary circuits 22 in a normal projection range of the circuit layer 20. However, the above is only an example, and the lines that the shielding film 40 needs to cover in the orthographic range of the circuit layer 20 can be targeted for individual electronic devices according to the impact of unexpected electrical interference on the overall signal transmission device 100 or 110 operation. To decide.

For example, various embodiments in which the orthographic projection range of the shielding film 40 on the circuit layer 20 covers different ranges will be described below with reference to FIGS. 2A to 2C. In FIGS. 2A to 2C, for convenience of explanation, the shielding film 40 and the circuit layer 20 will be mainly shown, and the protective layer 30 sandwiched between the shielding film 40 and the circuit layer 20 and the side on the side of the shielding film 40 will be omitted.护 部 50。 The protective section 50.

Referring to FIG. 2A, when the signal transmission device 100 is viewed from the front side of the shielding film 40 side, the shielding film 40 may cover a part of the circuit layer 20. Specifically, the signal transmission device 100 further includes transmission ends 105 and 115 and two sides 125 and 135 connected to the transmission ends 105 and 115. Among them, the circuit layer 20 provided between the substrate and the shielding film 40 includes a plurality of effective circuits, and these effective circuits can be completely covered by the shielding film 40. For example, the effective line may be a line that transmits a signal from the transmission end 105 to the transmission end 115 (or a signal transmitted from the transmission end 115 to the transmission end 105), and the shielding film 40 may completely cover the transmission signal between the two transmission ends 105 and 115. The lines. However, this is only an example, and the effective line of the present invention is not limited to this.

In contrast, some of the lines near the sides 125 and 135 that are not completely covered by the shielding film 40 may be auxiliary lines, such as virtual lines, ground lines, or lines for quality control testing. That is, the shielding film 40 can cover all valid circuits, and partially or completely exclude the auxiliary circuits. line. In another embodiment, the portion covered by the shielding film 40 may include all effective lines and auxiliary lines, and the portions not covered by the shielding film 40 near the sides 125 and 135 may not include any lines.

Here, the transmission ends 105 and 115 can be electrically connected to the transmission ends of different electronic devices or devices that transmit signals through the signal transmission device 100, respectively. However, the present invention is not limited to this, and the transmission ends 105 and 115 can be connected to any device connected to the signal transmission device 100, and the type and number of the devices connected to the transmission ends 105 and 115 are not particularly limited.

Next, referring to the embodiment of FIG. 2B, the difference from FIG. 2A is that the effective circuit is only partially covered by the shielding film 40. For example, when the effective line is a line transmitting a signal from the transmission end 105 to the transmission end 115, or when the effective line is a line transmitting a signal from the transmission end 115 to the transmission end 105, the shielding film 40 does not cover the proximity to the transmission end 115 The end of the effective line.

Further, in the embodiment with reference to FIG. 2C, the shielding film 40 may only cover the middle part of the effective line for transmitting signals between the two transmission ends 105 and 115, but does not cover the effective line close to the two transmission ends 105 and 115. End.

The above-mentioned configuration of the shielding film 40 covering the circuit layer 20 is merely an example, and the shielding film 40 may have various shapes and sizes of configurations under the intention of the present invention.

In the above embodiment, the shielding film 40 may be, for example, a metal shielding tape. In a specific embodiment, the shielding film 40 may be SF-PC5600 of TATSUTA. Specifically, referring to FIG. 3, the shielding film 40 may be a stacked structure of an anisotropic conductive adhesive 401 sequentially stacked, a metal layer 402 mainly for shielding electromagnetic waves, insulating layers 403 and 404, and a cover layer 405.

It should be noted that, here, the size of each layer of the laminated structure of the shielding film 40 is shown to be different for convenience of explanation, and it does not represent the relative area size of the actual layers.

Here, the metal layer 402 may be a silver film, an aluminum foil, or a copper foil, and the cover layer 405 It can be a polyester (PET) film. However, the present invention is not limited to this, and the shielding film 40 may be any laminated structure including at least one metal layer to intercept a path from a source of electromagnetic wave interference to a circuit layer 20 that may receive the electromagnetic wave interference. In essence, the shielding film 40 can be made of various materials under the condition that it can shield electromagnetic waves or electrical interference factors, and the present invention is not limited to the embodiment specifically described here.

As mentioned above, according to the embodiment of the present invention, since the shielding film 40 is retracted along the overall signal transmission device 100 or 110, the side protection portions 50 can be disposed on both sides of the shielding film 40. For example, in one embodiment, since the shielding film 40 can be retracted by 0.2 to 0.5 mm along the overall signal transmission device 100 or 110, the side guard portion 50 can be set in a width ranging from 0.2 to 0.5 mm. On both sides of the shielding film 40. The side shields 50 provided on the two sides of the shielding film 40 can shield the two sides of the shielding film 40 and reduce or avoid the cross-section conductors exposed by the shielding film 40 due to various factors, such as the metal layer 402, from contacting other electronic components.

According to the embodiment when the shielding film 40 is a laminated structure, the side protection portion 50 may be provided equal to or higher than the entire shielding film 40, or may be provided only with an electromagnetic wave shielding layer higher than, for example, the metal layer 402 or other materials, and protects against metal The cross section of the layer 402 or the electromagnetic wave shielding layer of other materials is in contact with other components.

In a specific embodiment, the side protection portion 50 may be formed of the same material as the protection layer 30. For example, when the protective layer 30 is made of polyimide (PI), the side protective portion 50 may also be made of polyimide (PI). In such an embodiment, since the same material as that of the protective layer 30 is used, the material, equipment, process, etc. for preparing the protective layer 30 can be used to prepare the side guard portion 50, thereby simplifying the manufacturing process.

Next, various embodiments of the configuration of the side guard portion 50 and the shielding film 40 will be described with reference to FIGS. 4A to 4D. Referring to FIGS. 4A and 4B, the side guards 50 may cut the sides 125 and 135. among them, There is a gap between the side protecting portion 50 and the shielding film 40 in FIG. 4A to expose the protective layer 30, but the side protecting portion 50 and the shielding film 40 in FIG. Alternatively, referring to FIG. 4C and FIG. 4D, the side guard portion 50 may be disposed closer to the side edges 125 and 135 than the shielding film 40, but not aligned with the side edges 125 and 135 and having a distance from the side edges 125 and 135. Therefore, the protective layer 30 on the sides 125 and 135 can be exposed. Among them, there is a gap between the side guard portion 50 and the shielding film 40 in FIG. 4C to expose the protective layer 30, and the side guard portion 50 and the shielding film 40 in FIG. 4D can be closely adhered without a gap, and are in contact with the side edges 125 and 135. With a distance.

The above-mentioned signal transmission device may further include or configure components or structures required for various signal transmission devices. For example, referring to FIG. 5, according to an embodiment, the signal transmission device 200 may further include a pin 116 at the transmission end 115 and a joint 106 at the transmission end 105. In addition, the signal transmission device 200 may be non-rectangular, and may have a zigzag configuration. In this state, the shielding film 40 is retracted in accordance with the outline of the signal transmission device 200 and has a configuration of a small zigzag. In addition, referring to FIG. 6, according to another embodiment, the signal transmission device 300 may have a U-shaped configuration, and the shielding film 40 is U-shaped with a small area according to the contraction of the outline of the signal transmission device 300. structure.

The configuration or form of the signal transmission device shown in the various embodiments described above is merely an example, and the signal transmission device may have various configurations or forms as long as it is retracted within the shielding film 40 and side guards 50 are provided on both sides.

Next, the signal transmission devices 400 to 600 'according to other embodiments of the present invention will be described with reference to FIGS. 7 to 9B. Here, detailed descriptions that are the same as or similar to those of the signal transmission devices of the above embodiments will be briefly described or omitted for clarity.

7 and 8, the signal transmission devices 400 and 500 include a substrate 10 and a circuit layer. 20. The protective layer 30, the shielding film 40, and the side protection portion 60. The difference between the signal transmission devices 400 and 500 and the signal transmission device 100 shown in FIG. 1A described above with reference to FIG. 1A lies in the side guard portion 60. As shown in FIG. 7 and FIG. 8, unlike the side protection portion 50, the side protection portion 60 is an insulating varnish, silicon resin, or other insulating materials that are separately processed and disposed at the two end surfaces of the shielding film 40. As mentioned above, the additional processing and setting, for example, the insulating paint, silicone resin, or other insulating material provided by coating, is not a wall-like structure, but may be a dam-like structure or a dyke-like structure. In such an embodiment, compared with, for example, the embodiment shown in FIG. 1A, the procedure or required for evaluating the distance between the side shield and the shielding film or the required process tolerance can be simplified or omitted. Process accuracy.

In the embodiment of FIG. 7, the side protection portion 60 is closely attached to the edge of the shielding film 40 and extends from the protective layer 30 toward the upper surface 45 of the shielding film 40 along the edge of the shielding film 40, but does not cover the upper surface of the shielding film 40. 45. Therefore, it is possible to save required preparation materials (such as insulating paint, silicone resin, or other insulating materials) of the side guard portion 60, or to avoid the stepped structure that may be caused when the shield film 40 is constructed with any structure.

On the other hand, in the embodiment of FIG. 8, the side guard portion 60 may further extend until the side guard portion 60 covers a portion of the upper surface 45 of the shielding film 40. In this state, since no precise control such as the position of applying insulating paint, silicone resin or other insulating materials is required, the process of preparing the side guard 60 can be relatively simplified and easier to achieve.

In the signal transmission devices 400 and 500, the shielding film 40 has an upper surface 45 and a lower surface 46 opposite to each other, and a side surface 47 connecting the upper surface 45 and the lower surface 46, and the shielding film 40 is on the front projection range and side of the substrate 10. There is a gap W between the sides (such as the side 125 or 135). As a result, the side guard portion 60 may cover at least a part of the interval W and selectively cover a part of the edge of the shielding film 40. For example, a part of the edge of the shielding film 40 may include a side surface 47 and an upper surface 45. however, This is merely an example, and for the convenience of the process or other considerations, the side guard portion 60 may also cover the entire pitch W and selectively cover a part of the edge of the shielding film 40.

Here, the protective layer 30 has a strip-shaped region 35 between the shielding film 40 and the side 125 or 135, which is not covered by the shielding film 40 and is covered by the side-protecting portion 60, and the strip-shaped region 35 falls at a distance W Inside. Specifically, the width d of the strip-shaped region 35 in the direction of the pitch W may be smaller than or equal to the pitch W.

For example, referring to FIG. 9A, according to a signal transmission device 600 according to an embodiment of the present invention, the side guard portion 60 may completely cover the protective layer 30 with a pitch W but not the upper surface 45 of the shielding film 40. However, in other embodiments, referring to FIG. 9B, in the Z-shaped signal transmission device 600 ′ provided with the side protection portion 60, the side protection portion 60 may overlap the edges of the shielding film 40 at the same time when viewed from the side of the shielding film 40. A portion and at least a portion of the protective layer 30 in the range of the pitch W. In addition, in FIG. 9A, according to an embodiment of the present invention, the distance (ie, the distance D) between the portion of the effective circuit 21 covered by the shielding film 40 and each side 125 and 135 is not less than that of the shielding film 40 and each The distance between the sides 125 and 135 (ie, the distance W).

Next, a signal transmission device according to other embodiments of the present invention will be further described. Referring to FIG. 10, in a signal transmission device 700 according to another embodiment of the present invention, the side protection portion 60 may simultaneously cover the side surfaces 47 and 37 (side end surfaces) corresponding to the shielding film 40 and the protective layer 30. In this embodiment, for example, a material for preparing the side protection portion 60 such as an insulating varnish, a silicone resin, or other insulation materials may be applied to the side surfaces 47 and 37 and cured so that the side protection portion 60 covers the entirety. The protective layers 30 at a distance W extend beyond the side edges 125 or 135 and further cover part of the side surfaces 37 of the protective layer 30. In this case, the width d of the strip-shaped region 35 in the direction of the pitch W is equal to the pitch W.

Here, although the side guard 60 of the signal transmission device 700 according to FIG. 10 is extended To the upper surface 45 of the shielding film 40, however, the present invention is not limited thereto, and the side protection portion 60 of the signal transmission device 700 may not cover a part of the upper surface 45 as in the embodiment shown in FIG. The strip-shaped region 35 and the side surface 47 of the shielding film 40 are provided.

Referring to FIG. 11, according to another embodiment of the present invention, similar to the signal transmission device 700, the side protection portion 60 of the signal transmission device 800 can simultaneously cover the side surfaces 47 and 37 (side end faces) of the shielding film 40 and the protective layer 30. ). However, in the embodiment shown in FIG. 11, the side surfaces 47 and 37 corresponding to the shielding film 40 and the protective layer 30 may be aligned with each other without forming a stepped structure. In conclusion, in this embodiment, it is not necessary to specifically shrink the shielding film 40 relative to the overall signal transmission device 800, thereby expanding the area that can be shielded by the shielding film 40. In addition, as described above with reference to FIG. 10, the side guard portion 60 of the embodiment of FIG. 11 can also be modified as shown in FIG. 7 to not cover a part of the upper surface 45.

The overall shape of the side guard portion 60 shown in FIG. 10 and FIG. 11 is merely an example, and in accordance with the above description, the side guard portion 60 may have various shapes according to process differences or other factors.

The embodiments of the various signal transmission devices described above can be used in combination with each other without conflicting with each other, in accordance with the purpose of the present invention, and can be combined with known or future stereoscopic configurations among various devices. application.

Next, a method for manufacturing the signal transmission device 100 or 110 shown in FIG. 1A or FIG. 1B according to different embodiments of the present invention will be described with reference to FIGS. 12A to 12C.

Referring to FIG. 12A, according to an embodiment of the present invention, a method for manufacturing a signal transmission device 100 or 110 includes providing a substrate 10; providing a circuit layer 20 on the substrate 10; and providing a protective layer 30 on the circuit layer 20.

Next, referring to FIG. 12B, after the structure of FIG. 12A is completed, the manufacturing method according to an embodiment of the present invention further includes providing a shielding film 40 on the protective layer 30, and then shielding the film. A side protection portion 50 is provided on the side of the film 40, and the side protection portion 50 is connected to the protection layer 30, thereby completing the preparation of the signal transmission device 100 or 110. The side protection portion 50 can use the same material as the protection layer 30, so the process provided by the side protection portion 50 can be similar to the process provided by the protection layer 30; in other words, the process of forming the protection layer 30 is repeated once and patterned. The side protection portion 50 is formed on the partial protection layer 30.

In another embodiment, referring to FIG. 12C, after the structure of FIG. 12A is completed, the manufacturing method further includes forming a side protection portion 50 on the protection layer 30 near the side, and then surrounding the side protection portion 50 on the protection layer 30. A shielding film 40 is disposed in the living space, thereby completing the preparation of the signal transmission device 100 or 110. For example, the shielding film 40 with a smaller area is attached to a space defined by the side guard 50. Here, the manufacturing process of the side protection portion 50 may be performed as described in FIG. 12B described above, or a protective layer 30 other than the predetermined side protection portion 50 may be partially thinned by a process such as etching, and the present invention is not limited thereto. In the embodiment where the side guard portion 50 and the protective layer 30 are from the same material layer and are integrally formed, the process of applying the material layer of the side guard portion 50 can be omitted.

In the above manufacturing method with reference to FIGS. 12A to 12C, the step of providing the side protection portion 50 includes forming the side protection portion 50 as a wall-like structure standing on the protection layer 30 and extending along the side of the protection layer 30. In contrast, the step of setting the shielding film 40 includes disposing the shielding film 40 in a defined area surrounded by the side guards 50 that have been formed or are expected to be formed.

According to an embodiment of the present invention, when the side protection portion 50 of the wall-shaped structure is provided, the outer surface of the shielding film 40 may not protrude from the top surface 55 of the wall-shaped structure.

According to another embodiment of the present invention, when the side protection portion 50 of the wall structure is provided, the side protection portion 50 may be formed of the same material as the protective layer 30. However, according to another embodiment of the present invention, the side protection portion 50 may be formed of a material different from that of the protection layer 30.

Next, different implementations according to the present invention will be described with reference to FIGS. 13A to 13C. An example is a method of manufacturing the signal transmission device 700 shown in FIG. 10 and the signal transmission device 800 shown in FIG. 11.

Referring to FIG. 13A, according to another embodiment of the present invention, a method of manufacturing signal transmission devices 700 and 800 includes providing a substrate 10; providing a circuit layer 20 on the substrate 10; and providing a protective layer 30 on the circuit layer 20.

Next, in the case of preparing the signal transmission device 700, referring to FIG. 13B, on the structure completed in FIG. 13A, the manufacturing method further includes providing a shielding film 40 that is retracted with respect to the side of the protective layer 30. In the process of setting the shielding film 40, both ends of the protective layer 30 have strip-shaped regions 35 protruding from the edges of the shielding film 40, and then, for example, a barrier material is used along the sides of the protective layer 30 in a coating manner ( For example, the side surface 37) and the edge of the shielding film 40 (for example, the side surface 47 and the upper surface 45) are provided with a side guard 60. The formed side protection portion 60 may be film-shaped, and part of the side protection portion 60 may cover the strip-shaped region 35, and part of the side protection portion 60 may cover the side end surface of the shielding film 40. That is, the side guard portion 60 may partially extend to cover the outer surface of the shielding film 40, thereby completing the preparation of the signal transmission device 700.

Further, in the case of preparing the signal transmission device 800, referring to FIG. 13C, on the structure completed in FIG. 13A, the manufacturing method further includes setting a shielding film 40 aligned with the sides of the protective layer 30. That is, the side surface 47 of the shielding film 40 and the side surface 37 of the protective layer 30 are aligned correspondingly. For example, when the shielding film 40 is set, it can be set corresponding to the size of the protective layer 30. For example, the shielding film 40 of the corresponding size can be aligned and attached or hot-pressed on the protective film 30, or the protective layer 30 can be set after the shielding film 40 is set. After the shielding film 40 is punched or etched, the side end surfaces corresponding to the shielding film 40 and the protective layer 30 are aligned.

Next, on the structure completed in FIG. 13C, an insulating material (such as insulating paint, silicone resin, or other insulating material) is used, for example, in a coating manner, along the protective layer 30 and the shielding film 40. Corresponding side surfaces 37 and 47 are provided with side guards 60. The formed side protection portion 60 can be film-shaped and can simultaneously cover the side end surfaces corresponding to the shielding film 40 and the protective layer 30, that is, the side surfaces 47 and 37 are simultaneously covered, thereby completing the preparation of the signal transmission device 800.

In the embodiment of preparing the signal transmission device 800, the side guard portion 60 may further cover a part of the upper surface 45 near the side surface 47 of the shielding film 40.

The method for manufacturing a signal transmission device described above with reference to FIGS. 12A to 13C is merely an example, and other embodiments of the signal transmission device of the present invention can be manufactured by following the same method or similar to the method of FIGS. 12A to 13C described above, and This will not be repeated here.

As mentioned above, the signal transmission device according to the present invention has a side protection portion, so that the side section of the shielding film is less likely to contact with other components. Therefore, various problems such as short circuit, wear, interference, etc. caused by unintended contact can be reduced or avoided. For example, it is possible to reduce or avoid the contact of the exposed conductor of the shielding film with the stamped cross section with other electronic components, thereby causing a short circuit.

What is described herein are only some preferred embodiments of the present invention. It should be noted that various changes and modifications can be made to the present invention without departing from the spirit and principles of the present invention. Those with ordinary knowledge in the technical field should understand that the present invention is defined by the scope of the attached application patents, and that all possible substitutions, combinations, modifications, and diversions are within the scope of the present invention within the meaning of the present invention. The scope defined by the scope of the attached patent application.

Claims (11)

A signal transmission device includes: a substrate; a circuit layer disposed on the substrate; a protective layer disposed on the circuit layer; a shielding film disposed on the protective layer; and a side protective portion Is disposed on the side of the shielding film and is connected to the protective layer, wherein the signal transmission device includes two transmission ends disposed at both ends of the substrate, the substrate includes two sides connected to the transmission ends, and the side protection The parts respectively extend along the two sides of the substrate. The signal transmission device according to claim 1, wherein the shielding film is a laminated structure including a metal layer. The signal transmission device according to claim 1, wherein the circuit layer includes a plurality of effective lines, and the shielding film covers the effective lines in an orthographic projection range of the circuit layer. The signal transmission device according to claim 1, wherein the circuit layer includes a plurality of effective lines connected to the transmission ends, and a distance between a portion of the effective lines covered by the shielding film and each of the sides is not less than the shielding film. The distance from each side. The signal transmission device according to claim 1, wherein the side protective portion covers a side surface of the shielding film. The signal transmission device according to claim 1, wherein the side protection portion is a wall structure having a wall top surface, and the vertical distance between the wall top surface and the substrate is greater than an upper surface of the shielding film The vertical distance from the substrate. The signal transmission device according to claim 2, wherein the side protection portion is a wall structure having a wall top surface, and a vertical distance between the wall top surface and the substrate is greater than an upper surface of the metal layer The vertical distance from the substrate. The signal transmission device according to claim 5, wherein the side guard portion and the protective layer are formed of the same material. The signal transmission device according to claim 1, wherein the protective layer has a strip-shaped region not covered by the shielding film, and the side protection portion covers the strip-shaped region and a side surface of the shielding film. The signal transmission device according to claim 1, wherein the side protection portion simultaneously covers the shielding film and the side end surface corresponding to the protection layer. The signal transmission device according to claim 10, wherein the shielding film and the side end surface corresponding to the protective layer are aligned with each other.