TWI638983B - A differential pressure detecting sensor and a producing method thereof - Google Patents

Abstract

A differential pressure sensor is a gas pipeline formed in the IC carrier board, and two air holes communicating with the gas pipeline are disposed on the top surface of the IC carrier board, and a pressure sensing covering one of the air holes is combined on the IC carrier board. a wafer, a top cover is adhered to the top surface of the IC carrier, and two upper cavities are disposed on the upper cover corresponding to the positions of the two air holes, and the upper cover is provided with two ventilation pipes respectively connecting the cavities; the invention is combined in use The circuit board, through the guiding of the two air holes and the gas pipeline, simultaneously senses the high pressure gas and the low pressure gas input by the two vent pipes on both the front and the back sides of the pressure sensing wafer, and realizes the electrical signal transmission by using the mature mass production IC carrier board technology. With the function of gas pressure transmission, the difficulty and cost of manufacturing are greatly reduced.

Description

Differential pressure sensor and method of manufacturing same

The present invention relates to a construction of a sensor, and more particularly to a differential pressure sensor manufactured by an IC carrier package technology and a method of fabricating the same.

The existing differential pressure sensor must be provided with two pressure sampling tubes, and the two pressure sampling tubes are respectively connected to the high voltage input source of the gas and the low pressure input source, and the gas pressure of the two input sources must be internal structure of the differential pressure sensor. The high and low pressure gas pressure is transmitted to the surface of the sensing film of the pressure sensing wafer. The main function of the pressure sensing chip is to convert the pressure intensity into an electrical signal.

The general differential pressure sensor is used to realize the pressure transmission. The main purpose is to guide the gas pressure to the front and back sides of the pressure sensing wafer by the design of the package structure. The method is usually pre-mold. The lead frame of the form is combined with a plastic structure having a pressure transmitting function. Another approach is to use two pressure sensing wafers to achieve differential pressure measurement of the high voltage input source and low pressure input source of the gas.

The above-mentioned existing production method using a pre-mold lead frame and a plastic structure is a structure in which a plastic structure is assembled to form a guiding gas pressure, and there is a disadvantage that a mold cost is high in production, and the production package must be targeted The appearance of the lead frame adjusts the line equipment and process methods, so it is difficult to produce without flexibility and selectivity; the differential pressure sensor using two pressure sensing wafers will result in higher manufacturing costs.

Due to the packaging structure of the existing differential pressure sensor, there is a disadvantage that production is difficult and the cost is high. To this end, the present invention proposes a new packaging technology to solve the problem of differential pressure sensor transmitting signals and transmitting gas pressure with an economical, mature production technology and low cost IC carrier structure.

To achieve the above object, the present invention provides a differential pressure sensor comprising:

An IC carrier board is provided with a carrier body comprising two or more layers of a sheet-like substrate stacked one on another, a gas pipe is formed in the carrier body, and is disposed on a top surface of the carrier body Two air holes respectively communicating with the gas pipe are provided with a plurality of welding points around the carrier body, and a conductive line is disposed on the carrier body, and the conductive line is connected with a plurality of welding points;

a signal processing chip bonded to the carrier body and connected to the conductive line;

a pressure sensing wafer having a front surface and a reverse surface, the pressure sensing wafer being bonded to a top surface of the carrier body and covering the air hole with the reverse surface, the pressure sensing wafer being connected to the conductive line and facing the front surface And the signal sensed on the reverse side is transmitted to the signal processing chip by the conductive line;

An upper cover is provided with a joint block, and the bottom surface of the joint block is adhered to the top surface of the carrier body in a close contact manner, and two cavities are recessed on the bottom surface of the joint block corresponding to the positions of the two air holes, wherein one cavity is accommodated The pressure sensing chip has another cavity communicating with another air hole. Two vent pipes are formed in the bonding block, and a vent hole is formed in each vent pipe, and inner ends of the vent holes are respectively communicated with the respective cavities.

Further, the signal processing chip of the present invention is disposed in the range in which the bonding block is adhered and bonded to the carrier body, and a position of the signal processing chip is recessed on the bottom surface of the bonding block, and the signal processing is performed. The wafer is housed in the wafer chamber, and a pressure balance hole is bored in the surface of the bond block, and the gas pressure balance hole communicates with the wafer chamber.

Further, the gas pipe of the present invention is a linearly extending elongated pipe, wherein the two air holes are respectively communicated with the two ends of the gas pipe, and the signal processing chip is coupled to the top surface of the carrier body at two positions. The part between the pores.

Preferably, the carrier body of the present invention comprises two layers of sheet-like substrates stacked one on top of the other, and a long groove is recessed in a top surface of the lower sheet-shaped substrate, and the gas pipe is formed on the upper side. Between the bottom surface of the sheet-like substrate and the long groove, the two pores are holes penetrating vertically through the sheet-like substrate on the upper side.

Preferably, the carrier body of the present invention comprises three layers of sheet-like substrates stacked one above another, the sheet-like substrate in the middle vertically extending through a long hole, and the gas pipe is formed on the upper side. Between the bottom surface of the substrate, the top surface of the lower sheet-like substrate, and the long hole, the two pores are holes penetrating vertically through the sheet-like substrate on the upper side.

To achieve the above object, the present invention provides a method of manufacturing a differential pressure sensor, the steps of which include:

An IC carrier board is provided. The top surface of the IC carrier board has air holes communicating with the inner end of the IC carrier board. The IC carrier board has a plurality of soldering points around the board, and the IC board has a plurality of solder joints. Conductive line

Bonding a signal processing chip package to the IC carrier board, connecting the signal processing chip to the conductive line, and bonding a pressure sensing chip package to the top surface of the IC carrier board to provide one of the air holes for the pressure sensing chip Covering the air hole and connecting the pressure sensing chip to the signal processing chip through the conductive line;

An upper cover having two cavities is adhesively bonded to the top surface of the IC carrier. The two cavities are respectively communicated by two vent pipes. When the upper cover is pasted, one of the cavities accommodates the pressure sensing wafer, and the other cavity and the other cavity The pores of the pressure sensing wafer are not combined with the pores of the pressure sensing wafer to complete the finished product of the differential pressure sensor.

Preferably, the present invention performs a step of manufacturing an IC carrier before the step of providing an IC carrier, which is to first manufacture a carrier body, and when the carrier body is manufactured, take a sheet-like substrate on the side. A long groove is formed in the top surface of the lower sheet-like substrate, and the depth of the long groove is not more than the thickness of the lower sheet-like substrate itself, and an upper sheet-like substrate is bonded to the lower sheet-like substrate. a top surface of the material, the gas pipe is formed between the bottom surface of the upper sheet-like substrate and the long groove, and the two air holes are penetrated in the top surface of the upper sheet substrate, so that the two air holes The gas pipeline is connected to complete the carrier body, and finally the plurality of solder joints and the conductive lines are formed on the carrier body, and the IC carrier is fabricated.

Preferably, the present invention performs a step of manufacturing an IC carrier before the step of providing an IC carrier, which is to first manufacture a carrier body, and take an intermediate sheet-like substrate when manufacturing the carrier body. The middle of the intermediate sheet-like substrate penetrates a long hole, and the depth of the long groove is equal to the thickness of the intermediate sheet-like substrate itself, and then the upper sheet substrate and the lower sheet substrate are respectively bonded in the middle. The top surface and the bottom surface of the sheet-like substrate form the gas conduit between the bottom surface of the upper sheet substrate, the long hole, and the top surface of the lower sheet substrate, and the upper sheet The top surface of the substrate penetrates through the two air holes, the two air holes are connected to the gas pipe to complete the carrier body, and finally the plurality of solder joints and the conductive lines are formed on the carrier body. The IC carrier board is manufactured.

When the differential pressure sensor of the present invention is used, the IC carrier board is soldered to the circuit board, the solder joint is electrically connected to the circuit board, and the two vent pipes are respectively connected to the high voltage input source of the gas and the low voltage input source. The front side of the pressure sensing wafer can sense the high pressure air input by one of the vent pipes through the cavity, and the low pressure air input into the cavity by the other vent tube is connected to the pressure sensing through the two air holes of the IC carrier board and the internal gas pipeline. The reverse side of the wafer causes the pressure sensing wafer to simultaneously sense the air pressure of the high pressure air source and the air pressure of the low pressure air source, convert the pressure into an electrical signal, send it to the signal processing wafer, and then transfer it to the circuit board.

The utility model has the advantages that the IC carrier can bear the electrical connection and constitute the gas pressure transmission channel with a single component, and electrically connect the two together with the conductive circuit while carrying the signal processing chip and the pressure sensing wafer, and can The upper cover is matched with the structure of the two gas pipes and the gas pipe to realize the function of transmitting high and low gas pressure to the same pressure sensing wafer sensing. The structure of the IC carrier is a separate component in the process, and the gas pipeline can be provided inside without assembling a plurality of plastic structures, and the package structure of the IC carrier is a mature mass production technology. In the manufacturing process, as long as the IC carrier board is obtained, the process of packaging the wafer can be combined with the signal processing chip, the pressure sensing chip and the upper cover to complete the invention, which is easy to manufacture, cost-effective and can be applied to the original package IC. The production line equipment of the carrier board is used for production.

In order to understand the technical features and practical effects of the present invention in detail, it can be implemented in accordance with the contents of the specification, and further described in detail with reference to the preferred embodiments shown in the drawings.

As shown in the first preferred embodiment of FIG. 1 to FIG. 4, the present invention provides a differential pressure sensor including an IC (wafer/integrated circuit) carrier 10 and a signal respectively coupled to the IC carrier 10. Processing the wafer 20, a pressure sensing wafer 30, and an upper cover 40, wherein:

The IC carrier 10 is provided with a carrier body 11 comprising two or more layers of sheet-like substrate 111 stacked one on top of the other. In the preferred embodiment, the two layers are stacked on top of each other. The material 111 has a long groove 112 recessed in the middle of the top surface of the lower sheet substrate 111. The long groove 112 is an elongated groove extending linearly in the left-right direction, and the bottom surface and the lower side of the upper sheet substrate 111 A gas pipe 12 is formed between the long grooves 112 of the sheet-like base material 111, and corresponding to the left and right ends of the gas pipe 12, the upper sheet-like base material 111 vertically penetrates the two air holes 13 so that the two air holes 13 are bored therein. The left and right sides of the top surface of the carrier body 11 are respectively communicated with the two ends of the gas pipe 12, and a plurality of soldering points 14 are disposed on the front and rear sides of the carrier body 11, and a conductive line is disposed on the carrier body 11. 15. The conductive line 15 is connected to a plurality of solder joints 14.

The signal processing chip 20 is packaged between the two air holes 13 in the middle of the top surface of the carrier body 11. The signal processing chip 20 is connected to the conductive line 15.

The pressure sensing wafer 30 has a front surface 31 and a reverse surface 32. The front surface 31 and the back surface 32 sense gas pressure from different sources. The pressure sensing wafer 30 is packaged on the top surface of the carrier body 11 and covered by the reverse surface 32. One of the air holes 13 enables the pressure sensing wafer 30 to sense the air pressure from the gas pipe 12 with the reverse surface 32. The pressure sensing chip 30 is connected to the conductive line 15, and the signal sensed by the front surface 31 and the back surface 32 is The conductive line 15 is transmitted to the signal processing chip 20, and the signal processing chip 20 transmits the processed signal from the conductive line 15 to each solder joint 14 so that the processed signal can be outputted outward from the IC carrier 10.

The upper cover 40 is provided with a joint block 41. The joint block 41 is a rectangular plastic block. The bottom surface of the joint block 41 is adhered to the top surface of the carrier body 11 in a close contact manner, corresponding to the positions of the two air holes 13. Two cavities 411 are recessed on the left and right sides of the bottom surface of the bonding block 41. One cavity 411 is for receiving the pressure sensing wafer 30, and the other cavity 411 is connected to another air hole 13 not provided with the pressure sensing wafer 30. Two vent pipes 42 are formed on the left and right sides of the top of the joint block 41, and a vent hole 421 is formed in each vent pipe 42. The inner ends of the vent holes 421 are respectively communicated with the respective cavities 411, corresponding to the signal processing chip. a wafer chamber 412 is recessed in the middle of the bottom surface of the bonding block 41. The signal processing wafer 20 is received in the wafer chamber 412, and a pressure balance hole 413 is bored in the middle of the surface of the bonding block 41. The air pressure balance hole 413 communicates with the wafer chamber 412 such that the air pressure inside the wafer chamber 412 can be balanced with the atmospheric pressure of the outside.

The IC carrier 10 in the first preferred embodiment is a separate component, and the carrier body 11 of the two layers stacked one above another is manufactured. As shown in FIG. 5, the sheet substrate 111 of the lower side is first removed. A long groove 112 is formed from the top surface of the lower sheet substrate 111 by machining, laser processing or chemical etching, and the depth of the long groove 112 is machined and etched to a depth not greater than the lower side. The thickness of the sheet substrate 111 itself. Next, the upper sheet substrate 111 is bonded to the top surface of the lower sheet substrate 111, and the gas pipe 12 is formed between the bottom surface of the upper sheet substrate 111 and the long groove 112, and finally mechanically processed. Laser processing or chemical etching liquid etching from the top surface of the completed carrier body 11, that is, the top surface of the upper sheet substrate 111, through the two holes 13 to make two holes 13 is connected at both ends of the gas pipe 12 to form a continuous gas pressure transmission passage.

When used in the present invention, the IC carrier 10 is solder bonded to a product, such as a circuit board of a respirometer. The plurality of solder joints 14 are electrically connected to the circuit board, and the two vent pipes 42 of the two upper covers 40 are respectively connected to the high voltage input source of the gas and the low voltage input source.

As shown in FIG. 3, the front surface 31 of the pressure sensing wafer 30 can sense the high pressure air input to the left side cavity 411 by the vent tube 42 on the left side, and the low pressure air input into the right side cavity 411 by the vent tube 42 on the right side. Through the communication function of the gas pipe 12 inside the IC carrier 10, the pressure of the low-pressure air is transmitted from the gas pipe 12 to the reverse surface 32 of the pressure sensing wafer 30, so that the pressure sensing wafer 30 can simultaneously sense the high-pressure air-derived air. The pressure and the air pressure of the low-pressure air source are converted into electrical signals and sent to the signal processing chip 20 for processing. The signal processed by the signal processing chip 20 is transmitted from the solder joints 14 of the IC carrier 10 to the circuit of the product. On the board.

The effect of the present invention is that the IC carrier 10 is a mass-produced technology, and the process of manufacturing the IC carrier 10 is easier and cost-effective than the mold injection molding configuration. In the structure of the present invention, the IC carrier 10 can bear the role of electrical connection after the package and the gas pressure transmission channel with a single component, and the conductive line 15 is carried while carrying the signal processing chip 20 and the pressure sensing wafer 30. The two are electrically connected to each other, and the signal processed by the signal processing chip 20 is outputted through a plurality of soldering points 14. The gas pipe 12 is matched with the structure of the upper cover 40, and the function of pressure transmission can be realized, so as to be located in one of the cavities 411. The pressure sensing wafer 30 can simultaneously sense the pressure of the high pressure gas and the low pressure gas which are respectively input into the two cavities 411 by the two vent pipes 42.

The process of packaging the signal processing chip 20, the pressure sensing wafer 30, and the upper cover 40 on the IC carrier 10 is the same as the process of generally bonding the wafer to the package material on the IC carrier 10. Since the IC carrier 10 is a separate component and does not need to be separately assembled, after the signal processing chip 20 and the pressure sensing wafer 30 are coupled to the IC carrier 10, the upper cover 40 is adhered to the IC carrier 10. The assembly process of the present invention can be completed, and the production line equipment and the manufacturing method of the packaged IC carrier 10 need not be greatly adjusted during production, and the manufacturing and manufacturing are flexible and selective, and the production is relatively easy, the manufacturing is more economical, and the cost is saved.

In addition to the foregoing first preferred embodiment, the carrier body 11 of the IC carrier 10 is two layers of sheet-like substrate 111 laminated on top of each other, as shown in the second preferred embodiment of FIG. The carrier body 11 may also include three layers of sheet-like base material 111 which are laminated one above another, and the sheet-like base material 111 in the middle thereof is vertically penetrated through a long hole 113 extending in the left-right direction, and the sheet on the upper side. A gas pipe 12 is formed between the bottom surface of the substrate 111, the long hole 113, and the top surface of the lower sheet substrate 111, corresponding to the left and right ends of the gas pipe 12, at the top of the upper sheet substrate 111 The two air holes 13 are penetrated face down so that the two air holes 13 communicate with both ends of the gas pipe 12. Since the rest of the configuration and the functions of the second preferred embodiment are the same as those described in the first preferred embodiment, the present invention is not described herein.

In the second preferred embodiment, the three-layer stacked carrier body 11 is assembled at the time of manufacture. As shown in FIG. 7, the intermediate sheet-like substrate 111 is first taken through mechanical processing, laser processing or chemical etching solution. In the manner of etching, the long hole 113 is formed through the middle of the intermediate sheet-like substrate 111, and the depth of the long groove 112 is machined and etched downward to be equal to the thickness of the intermediate sheet-like substrate 111 itself. Then, the upper sheet substrate 111 and the lower sheet substrate 111 are bonded to the top surface and the bottom surface of the intermediate sheet substrate 111, and the bottom surface of the upper sheet substrate 111, the long hole 113, and The gas pipe 12 is formed between the top surfaces of the lower sheet-like substrate 111, and finally passes through the machining, laser processing or chemical etching liquid etching from the top surface of the completed carrier body 11 That is, the top surface of the upper sheet-like substrate 111 is bored inwardly through the two air holes 13, so that the two air holes 13 are connected to both ends of the gas pipe 12 to form a continuous gas pressure transmission passage.

The invention also provides a method for manufacturing a differential pressure sensor for manufacturing the differential pressure sensor described above, the method steps of which are as follows:

An IC carrier 10 is formed on the inside of the IC carrier 10. The top surface of the IC carrier 10 has two air holes 13 respectively communicating with the gas pipe 12. The two sides of the IC carrier 10 have a plurality of soldering points 14 on both sides. The IC carrier 10 has conductive traces 15 connected to a plurality of solder joints 14.

A signal processing chip 20 is packaged on the IC carrier 10, the signal processing chip 20 is connected to the conductive line 15, and a pressure sensing wafer 30 having a front side 31 and a back side 32 for sensing gas pressures from different sources is prepared. The pressure sensing wafer 30 is packaged on the top surface of the IC carrier 10 and provided with one of the air holes 13 so that the pressure sensing wafer 30 covers one of the air holes 13 of the two air holes 13 with the reverse surface 32, and the pressure sensing chip 30 is provided. The conductive circuit 15 is connected to the pressure sensing chip 30 to sense the air pressure from the gas pipe 12 on the reverse side 32, and then the signal sensed by the front surface 31 and the reverse surface 32 is transmitted to the signal processing chip by the conductive line 15. 20, and the signal processing chip 20 transmits the processed signal from the conductive line 15 to each solder joint 14, so that the processed signal can be outputted outward from the solder joints 14 of the IC carrier 10.

An upper cover 40 having two cavities 411 is formed. The upper cover 40 has two vent pipes 42 respectively connecting the two cavities 411. The upper cover 40 is adhesively bonded to the top surface of the IC carrier 10, so that one of the cavities 411 is accommodated. The pressure sensing wafer 30, the other cavity 411 is in communication with the air hole 13 of the other uncompressed pressure sensing wafer 30, and the finished product of the differential pressure sensor is completed.

In the method of the present invention, before the step of providing an IC carrier 10 for internally forming the gas conduit 12, a step of manufacturing the IC carrier 10 can be performed. As shown in FIG. 5, a carrier body 11 is first fabricated. The sheet-like substrate 111 on the lower side is manufactured by machining, laser processing or chemical etching to form a long groove 112 from the top surface of the lower sheet substrate 111, and the long groove 112 is machined and etched. The depth of 112 is not greater than the thickness of the lower sheet substrate 111 itself; then an upper sheet substrate 111 is bonded to the top surface of the lower sheet substrate 111, and the upper sheet substrate 111 is The gas pipe 12 is formed between the bottom surface and the long groove 112, and finally drilled through the top surface of the completed carrier body 11 through machining, laser processing or chemical etching liquid penetration through the two said The air holes 13 are connected to the two ends of the gas pipe 12 to complete the carrier body 11, and finally a plurality of solder joints 14 are formed on the front and rear sides of the carrier body 11, and the carrier body 11 is Conductive line 15 connected to a plurality of solder joints 14 The IC substrate 10 is manufactured to complete.

As shown in FIG. 6, in the step of manufacturing the IC carrier 10, the manner of manufacturing the carrier body 11 can be changed by first taking an intermediate sheet substrate 111 through mechanical processing, laser processing or chemistry. The etching liquid is etched by forming the long hole 113 from the middle of the intermediate sheet substrate 111, and the depth of the long groove 112 is machined and etched to be equal to the thickness of the intermediate sheet substrate 111 itself; The upper sheet substrate 111 and the lower sheet substrate 111 are bonded to the top surface and the bottom surface of the intermediate sheet substrate 111, and the bottom surface of the upper sheet substrate 111, the long hole 113, and the bottom portion The gas pipe 12 is formed between the top surfaces of the lower sheet-like substrate 111, and finally bored from the top surface of the completed carrier body 11 by machining, laser processing or chemical etching. The carrier body 11 is completed by connecting the two air holes 13 to both ends of the gas pipe 12 through the two air holes 13 described above.

The above description is only the preferred embodiment of the present invention, and is not intended to limit the scope of the claims of the present invention, and other equivalent changes or modifications which are not departing from the spirit of the present invention should be included in the present invention. Within the scope of the patent application.

10 IC carrier board 11 carrier board body 111 sheet substrate 112 long groove 113 long hole 12 gas pipe 13 air hole 14 soldering point 15 conductive line 20 signal processing wafer 30 pressure sensing wafer 31 front side 32 reverse side 40 upper cover 41 bonding block 411 cavity 412 Wafer chamber 413 air pressure balance hole 42 vent tube 421 vent

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is an exploded view of a first preferred embodiment of the present invention. Figure 2 is a perspective view of a first preferred embodiment of the present invention. Figure 3 is a cross-sectional view showing the first preferred embodiment of the present invention. Figure 4 is a block diagram of a first preferred embodiment of the present invention. Figure 5 is a schematic view showing the manufacturing process of the carrier body of the first preferred embodiment of the present invention. Figure 6 is a cross-sectional view showing a second preferred embodiment of the present invention. Figure 7 is a schematic view showing the manufacturing process of the carrier body of the second preferred embodiment of the present invention.

Claims (4)

A differential pressure sensor comprising: an IC carrier board, and a carrier body comprising: two or more layers of sheet-like substrates stacked one on top of the other, wherein a gas pipe is formed in the carrier body, The top surface of the plate body is provided with two air holes respectively communicating with the gas pipe, and a plurality of welding points are arranged around the carrier body, and a conductive line is arranged on the carrier body, and the conductive line is connected with a plurality of welding points; a signal processing chip coupled to the carrier body and connected to the conductive line; a pressure sensing wafer having a front surface and a reverse surface, the pressure sensing wafer being bonded to the top surface of the carrier body and The reverse sensing surface covers one of the air holes, and the pressure sensing chip is connected to the conductive line, and the signals sensed by the front side and the back side are transmitted to the signal processing chip by the conductive line; and an upper cover is provided with a bonding block, and the bottom surface of the bonding block is The adhesive form is adhered to the top surface of the carrier body, and two cavities are recessed on the bottom surface of the bonding block corresponding to the positions of the two air holes, wherein a cavity accommodates the pressure feeling The other cavity is connected to the other air hole, and two vent pipes are formed in the joint block, and a vent hole is formed in each vent pipe, and inner ends of the vent holes are respectively communicated with the respective cavities; and the signal processing chip The photo processing chip is recessed in the wafer chamber, and the signal processing wafer is accommodated in the wafer chamber. A surface of the bonding block is bored with a gas pressure balancing hole that communicates with the wafer chamber. The differential pressure sensor of claim 1, wherein the gas conduit is a linearly extending elongated conduit, the two air holes respectively communicating with the two ends of the gas tube, and the signal processing wafer is coupled to the carrier The top surface of the body is located between the two air holes. The differential pressure sensor of claim 1 or 2, wherein the carrier body comprises three layers of sheet-like substrates stacked one above another, the sheet-like substrate in the middle vertically extending through a long hole, and the gas pipe is shaped Between the bottom surface of the upper sheet-like base material, the top surface of the lower sheet-shaped base material, and the long hole, the two air holes are holes penetrating vertically through the upper sheet-shaped base material. A method for manufacturing a differential pressure sensor, the method comprising: providing an IC carrier board having a top surface having air holes communicating with two gas ends at a inner end, the IC carrier board having a plurality of solder joints around the board The IC carrier board has a conductive line connected to the plurality of solder joints; a signal processing chip package is coupled to the IC carrier board to connect the signal processing chip to the conductive line, and a pressure sensing chip package is bonded to the IC The top surface of the carrier is provided with one of the air holes, so that the pressure sensing chip covers the air hole, and the pressure sensing chip is connected to the signal processing chip through the conductive line; and an upper cover having two cavities is adhered thereto. On the top surface of the IC carrier, the two cavities are respectively communicated by two vent pipes. When the upper cover is pasted, one of the cavities accommodates the pressure sensing wafer, and the other cavity communicates with another vent hole not combined with the pressure sensing wafer to complete the differential pressure. The finished product of the sensor; the step of manufacturing the IC carrier before performing the step of providing an IC carrier is to first manufacture a carrier body, and take an intermediate piece when manufacturing the carrier body a substrate having a long hole penetrating from the middle of the intermediate sheet-like substrate, the depth of the long groove being processed to be equal to the thickness of the intermediate sheet-like substrate itself, and then the upper sheet substrate and the lower sheet substrate Adhering to the top surface and the bottom surface of the intermediate sheet-like substrate, respectively, forming the gas conduit between the bottom surface of the upper sheet substrate, the long hole, and the top surface of the lower sheet substrate. The top surface of the upper sheet-like substrate penetrates through the two air holes, the two air holes are connected to the gas pipe to complete the carrier body, and finally the plurality of solder joints are formed on the carrier body and the The conductive circuit is completed by manufacturing the IC carrier.