TWI637893B - Tape punching apparatus and tape punching method - Google Patents
Tape punching apparatus and tape punching method Download PDFInfo
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- TWI637893B TWI637893B TW107108663A TW107108663A TWI637893B TW I637893 B TWI637893 B TW I637893B TW 107108663 A TW107108663 A TW 107108663A TW 107108663 A TW107108663 A TW 107108663A TW I637893 B TWI637893 B TW I637893B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B13/00—Bundling articles
- B65B13/02—Applying and securing binding material around articles or groups of articles, e.g. using strings, wires, strips, bands or tapes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B13/00—Bundling articles
- B65B13/18—Details of, or auxiliary devices used in, bundling machines or bundling tools
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- Mechanical Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Basic Packing Technique (AREA)
Abstract
一種打帶設備及打帶方法,係藉由移除裝置自動移除用以固定複數托盤之魔術帶,以取代人工方式移除魔術帶,避免托盤相互分離之問題,進而避免容置於該托盤上之半導體封裝件掉落而導致該半導體封裝件損壞之問題。 A tape driving device and a tape driving method are used to automatically remove a magic tape for fixing a plurality of trays by a removing device, instead of manually removing the magic tapes, to avoid the problem of the trays being separated from each other, and thus to avoid being contained in the trays. The semiconductor package is dropped and the semiconductor package is damaged.
Description
本發明係關於一種用於半導體封裝成品之設備,特別是關於一種用於包裝出貨作業之打帶設備及打帶方法。 The present invention relates to a device for a finished semiconductor package, and more particularly to a tape device and a tape method for packaging and shipping operations.
請參閱第1圖,傳統半導體封裝製程中,半導體封裝件10於模壓(molding)作業後會放置於托盤(tray)1a中,並堆疊複數個托盤1a,以形成如第1圖所示之具六個托盤1a之堆疊組1,再利用人工方式直接以魔術帶(圖略)捆綁該堆疊組1並存放於倉庫,且於出貨前採用人工方式將該魔術帶拆卸,作業員再操作打帶機,以進行X方向及Y方向的打帶作業,亦即將包裝帶(圖略)配置於該堆疊組1之外觀。 Please refer to FIG. 1. In a conventional semiconductor packaging process, the semiconductor package 10 is placed in a tray 1 a after a molding operation, and a plurality of trays 1 a are stacked to form a mold as shown in FIG. 1. The stacking group 1 of the six trays 1a is then manually bound with a magic belt (not shown) and stored in a warehouse. The magic belt is manually disassembled before shipment, and the operator then operates The belt machine is used to perform the tapping operation in the X direction and the Y direction, and the packaging tape (not shown) is arranged on the appearance of the stacking group 1.
惟,習知打帶作業中,採用人工方式拆卸該魔術帶係容易造成上、下托盤1a分離,致使該托盤1a上的半導體封裝件10掉落,因而導致該半導體封裝件10損壞。 However, in the conventional tape-tapping operation, manually disassembling the magic tape system easily causes the upper and lower trays 1a to be separated, causing the semiconductor package 10 on the tray 1a to fall, thereby causing the semiconductor package 10 to be damaged.
再者,於進行打帶作業時,因每次打帶的位置會依需求而不同,且出貨的打帶條件亦會依需求改變,故採用人工方式(或作業員)操作該打帶機容易發生打帶錯誤,致 使降低出貨品質。 Furthermore, when performing the tapping operation, since the position of each taping will vary according to demand, and the taping conditions for shipment will also change according to demand, the manual (or operator) operation of the tapping machine is used. Prone to tape errors Reduced shipping quality.
因此,如何克服上述習知技術中之種種問題,實已成目前亟欲解決的課題。 Therefore, how to overcome the various problems in the conventional techniques has become an urgent problem to be solved.
鑑於上述習知技術之種種缺失,本發明遂提供一種打帶設備,係包括:移除裝置,係用於移除目標物上之多餘物件;以及打帶裝置,係用於接收來自該移除裝置之目標物,以將包裝帶配置於該目標物上。 In view of the various shortcomings of the above-mentioned conventional technologies, the present invention provides a tape driving device, which includes: a removing device for removing an unnecessary object on a target object; and a tape driving device for receiving The target of the device is arranged to arrange the packaging tape on the target.
本發明亦提供一種打帶方法,係包括:提供一前述之打帶設備;藉由該移除裝置移除目標物上之多餘物件;藉由該打帶裝置接收來自該移除裝置之目標物;以及藉由該打帶裝置將包裝帶配置於該目標物上。 The present invention also provides a tape driving method, which includes: providing the aforementioned tape driving equipment; removing excess objects on the target by the removing device; and receiving the target from the removing device by the tape driving device. ; And the packaging tape is arranged on the target by the tapping device.
前述之打帶設備及打帶方法中,該多餘物件係為制動件,其用於限制運送中之該目標物之運動。 In the aforementioned tape driving device and method, the redundant object is a braking member, which is used to restrict the movement of the target during transportation.
前述之打帶設備及打帶方法中,該移除裝置係包含帶動構件,其用於帶動該多餘物件位移。進一步,該移除裝置更包含導引構件,其用於導引該多餘物件之位移方向。進一步,該移除裝置更包含止擋構件,其用於制止該導引構件導引該多餘物件。進一步,該移除裝置更包含收納構件,用於收納從該目標物上脫離之該多餘物件。例如,該移除裝置之運作過程係包括:將該多餘物件固設於該導引構件上,以定向該多餘物件;藉由該帶動構件帶動該多餘物件與該導引構件進行同步位移;以及於該同步位移時,藉由該止擋構件制止該多餘物件位移,以令該導引構件無 法導引該多餘物件,使該導引構件與該多餘物件分離,且該收納構件中會收納分離之該多餘物件。 In the aforementioned tape driving device and method, the removing device includes a driving member for driving the excess object to move. Further, the removing device further includes a guide member for guiding a displacement direction of the redundant object. Further, the removing device further includes a stopper member for preventing the guide member from guiding the unnecessary object. Further, the removing device further includes a accommodating member for accommodating the redundant object detached from the target object. For example, the operation process of the removal device includes: fixing the redundant object on the guide member to orient the redundant object; the driving member drives the redundant object to perform synchronous displacement with the guide member; and During the synchronous displacement, the stopper member is used to stop the displacement of the redundant object, so that the guide member is free of It is necessary to guide the redundant object so that the guide member is separated from the redundant object, and the separated redundant object is stored in the storage member.
前述之打帶設備及打帶方法中,該打帶裝置係包含定位組件,以調整該目標物之方位。 In the aforementioned tape driving device and method, the tape driving device includes a positioning component to adjust the orientation of the target.
前述之打帶設備及打帶方法中,該打帶裝置係用於將該包裝帶沿不同方向或相同方向配置於該目標物上。 In the aforementioned tape driving device and method, the tape driving device is used to arrange the packaging tape on the target in different directions or the same direction.
前述之打帶設備及打帶方法中,復包括輸送裝置,係用於接收來自該打帶裝置之目標物以運送移動至下一作業區。 In the aforementioned tape driving device and method, the method further includes a conveying device, which is used for receiving the target object from the tape driving device to transport and move to the next work area.
前述之打帶設備及打帶方法中,復包括位移裝置,係用於位移該目標物。 In the foregoing tape driving device and method, the method further includes a displacement device for displacing the target.
前述之打帶設備及打帶方法中,該打帶設備定義有進料區、拆帶區、打帶區、回流區以及目標區。該進料區佈設有置放裝置,該拆帶區佈設有該移除裝置,該打帶區佈設有該打帶裝置,該回流區佈設有輸送裝置,該目標區佈設有該置放裝置。該置放裝置用以置放至少一目標物,該輸送裝置係用於接收來自該打帶裝置之目標物並移往該目標區。 In the foregoing tape driving device and method, the tape driving device is defined with a feeding area, a tape removing area, a tape driving area, a reflow area, and a target area. The feeding area is provided with a placing device, the unwinding area is provided with the removing device, the tapping area is provided with the tapping device, the returning area is provided with a conveying device, and the target area is provided with the placing device. The placing device is used for placing at least one target, and the conveying device is used for receiving the target from the tape driving device and moving to the target area.
由上可知,本發明之打帶設備及打帶方法,主要藉由該移除裝置移除該多餘物件,以取代人工方式,而避免該目標物發生突發狀況,故相較於習知技術,本發明之打帶設備能避免用於承載如半導體封裝件之托盤相互分離之問題,進而避免該托盤上之半導體封裝件掉落而導致該半導體封裝件損壞之問題。 It can be known from the above that the tape driving device and the tape driving method of the present invention mainly remove the redundant object by the removing device to replace the manual method and avoid the sudden situation of the target object, so compared with the conventional technology The tape driving device of the present invention can avoid the problem of separation of the trays used to carry semiconductor packages, for example, thereby avoiding the problem that the semiconductor packages on the tray fall and cause damage to the semiconductor packages.
再者,藉由該打帶裝置之定位組件的移動、定位及旋轉之設計,以準確控制每次的打帶位置及方向,故當打帶的位置依需求而不同或出貨的打帶條件依需求改變時,本發明之打帶設備能避免發生打帶錯誤之情況,因而能有效提高出貨品質。 Furthermore, by designing the movement, positioning, and rotation of the positioning device of the tape driving device to accurately control the tape position and direction of each time, when the position of the tape is different according to demand or the shipping conditions of the tape When the demand changes, the tape driving device of the present invention can avoid the occurrence of tape error, and can effectively improve the quality of shipment.
1‧‧‧堆疊組 1‧‧‧ stacked group
1a,9a‧‧‧托盤 1a, 9a‧‧‧Tray
10‧‧‧半導體封裝件 10‧‧‧ semiconductor package
2‧‧‧打帶設備 2‧‧‧Tapping equipment
21‧‧‧置放裝置 21‧‧‧ placement device
22‧‧‧移除裝置 22‧‧‧ Remove device
220‧‧‧帶動構件 220‧‧‧ Drive components
221‧‧‧導引構件 221‧‧‧Guide members
222‧‧‧止擋構件 222‧‧‧stop member
223‧‧‧收納構件 223‧‧‧Storage member
2230‧‧‧容置空間 2230‧‧‧Accommodation space
224‧‧‧止動結構 224‧‧‧stop structure
23‧‧‧打帶裝置 23‧‧‧Tapping device
230‧‧‧定位組件 230‧‧‧ Positioning components
231‧‧‧第一打帶機組 231‧‧‧The first hit belt unit
232‧‧‧第二打帶機組 232‧‧‧Second hit belt unit
24‧‧‧輸送裝置 24‧‧‧ Conveying device
25‧‧‧位移裝置 25‧‧‧Displacement device
5a,5b,6‧‧‧包裝帶 5a, 5b, 6‧‧‧ packing tape
70‧‧‧轉軸桿 70‧‧‧ shaft
71‧‧‧傳輸帶 71‧‧‧conveyor belt
72‧‧‧軌道 72‧‧‧ track
73‧‧‧滑車 73‧‧‧ tackle
8‧‧‧多餘物件 8‧‧‧ Extra items
9‧‧‧目標物 9‧‧‧ target
90‧‧‧凹槽 90‧‧‧ groove
A‧‧‧進料區 A‧‧‧Feeding area
B‧‧‧拆帶區 B‧‧‧ Strip zone
C‧‧‧打帶區 C‧‧‧Tapping zone
C1‧‧‧第一作業處 C1‧‧‧First Operation Office
C2‧‧‧第二作業處 C2‧‧‧Second Operation Office
D‧‧‧回流區 D‧‧‧ reflow zone
E‧‧‧目標區 E‧‧‧Target area
G,H,t,W‧‧‧箭頭方向 G, H, t, W‧‧‧Arrow direction
K‧‧‧移動方向 K‧‧‧ direction of movement
S‧‧‧間隔空間 S‧‧‧ Space
X‧‧‧第一方向 X‧‧‧ first direction
Y‧‧‧第二方向 Y‧‧‧ second direction
第1圖係為習知用於放置半導體封裝件之托盤之堆疊組之立體示意圖;第2圖係為本發明之打帶設備之佈設示意圖;第3A至3B圖係為本發明之打帶設備之進料區與拆帶區之運作過程之前視示意圖;第4A至4D圖係為本發明之打帶設備之移除裝置之運作過程之上視示意圖;第4B’及4D’圖係為第4B及4D圖省略帶動構件之側視示意圖;第4C-1及4C-2圖係為第4C圖省略帶動構件之作動過程之側視示意圖;第5A至5E圖係為本發明之打帶設備之打帶裝置之第一打帶機組之運作過程之上視示意圖;第6A至6B圖係為本發明之打帶設備之打帶裝置之第二打帶機組之運作過程之上視示意圖;第7A至7C圖係為本發明之打帶設備之輸送裝置之不同實施例之立體示意圖;以及第8圖係為本發明之打帶設備之位移裝置之不同實施 例之立體示意圖。 Figure 1 is a perspective view of a conventional stacking group of trays used for placing semiconductor packages. Figure 2 is a schematic diagram of the layout of the tape device of the present invention. Figures 3A to 3B are tape devices of the present invention. The front view of the operation process of the feeding area and the tape unwinding area; Figures 4A to 4D are schematic top views of the operation process of the removal device of the tape removing device of the present invention; Figures 4B 'and 4D' are the first Figures 4B and 4D are schematic side views of the driving member omitted; Figures 4C-1 and 4C-2 are schematic side views of the driving process of Figure 4C without the driving member; Figures 5A to 5E are tape driving devices of the present invention. The top view of the operation process of the first tape unit of the tape drive device; Figures 6A to 6B are the top view of the operation process of the second tape unit of the tape drive device of the tape device of the present invention; 7A to 7C are three-dimensional schematic diagrams of different embodiments of the conveying device of the tape driving device of the present invention; and FIG. 8 is a different implementation of the displacement device of the tape driving device of the present invention Example of a three-dimensional schematic.
以下藉由特定的具體實施例說明本發明之實施方式,熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點及功效。 The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.
須知,本說明書所附圖式所繪示之結構、比例、大小等,均僅用於配合說明書所揭示之內容,以供熟悉此技藝之人士之瞭解與閱讀,並非用於限定本發明可實施之限定條件,故不具技術上之實質意義,任何結構之修飾、比例關係之改變或大小之調整,在不影響本發明所能產生之功效及所能達成之目的下,均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。同時,本說明書中所引用之如「上」、「下」、「左」、「右」、「前」、「後」及「一」等之用語,亦僅為便於敘述之明瞭,而非用於限定本發明可實施之範圍,其相對關係之改變或調整,在無實質變更技術內容下,當亦視為本發明可實施之範疇。 It should be noted that the structures, proportions, sizes, etc. shown in the drawings in this specification are only used to match the content disclosed in the description for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. The limited conditions are not technically significant. Any modification of the structure, change of the proportional relationship, or adjustment of the size should still fall within the scope of this invention without affecting the effects and goals that can be achieved by the present invention. The technical content disclosed by the invention can be covered. At the same time, the terms such as "up", "down", "left", "right", "front", "back", and "one" quoted in this manual are only for the convenience of narrative, rather than Used to limit the scope of the present invention that can be implemented, and the changes or adjustments in its relative relationship should be regarded as the scope of the present invention that can be implemented without substantial changes in the technical content.
第2圖係為本發明之打帶設備2之佈設示意圖。該打帶設備2係包括:一置放裝置21、一移除裝置22、一打帶裝置23、一輸送裝置24以及一位移裝置25(詳第8圖所示)。 FIG. 2 is a schematic diagram of the layout of the tape driving device 2 of the present invention. The tape driving device 2 includes a placing device 21, a removing device 22, a tape driving device 23, a conveying device 24, and a displacement device 25 (shown in detail in FIG. 8).
所述之打帶設備2係定義有用於佈設該置放裝置21之進料區A、用於佈設該移除裝置22之拆帶區B、用於佈設該打帶裝置23之打帶區C、用於佈設該輸送裝置24之回流區D、以及用於佈設該置放裝置21之目標區E。 The tape driving device 2 is defined as a feeding area A for laying the placement device 21, a tape removing area B for laying the removing device 22, and a tape driving area C for laying the tape driving device 23. , A return area D for laying the conveying device 24 and a target area E for laying the placing device 21.
於本實施例中,該打帶設備2係大致呈矩形體外觀,如第2圖所示,且可依製程步驟之需求規劃上述區域。例如,該進料區A與該目標區E係可為相連通之單一空間,其位於該矩形體右側,且該拆帶區B與該打帶區C係依序並排於該矩形體前側且鄰接該進料區A,並使該回流區D位於該矩形體後側且鄰接該目標區E。有關該打帶設備2之形體及各區域之規劃方式繁多,並不限於上述。 In this embodiment, the tapping device 2 has a substantially rectangular appearance, as shown in FIG. 2, and the above-mentioned areas can be planned according to the requirements of the process steps. For example, the feeding area A and the target area E may be a single space connected to each other, which is located on the right side of the rectangular body, and the stripping area B and the tapping area C are sequentially side by side on the front side of the rectangular body and Adjacent to the feed zone A, the recirculation zone D is located on the rear side of the rectangular body and adjacent to the target zone E. There are many ways to plan the shape of the tape driving device 2 and various regions, and they are not limited to the above.
再者,該打帶設備2係配載自動化系統,以自動控制該移除裝置22、打帶裝置23、輸送裝置24及位移裝置25之運作。例如,該自動化系統可配載可程式邏輯控制器(programmable logic controller,簡稱PLC),以規劃該移除裝置22、打帶裝置23、輸送裝置24及位移裝置25之間的配合動作。應可理解地,亦可採用適當的軟體或韌體控制該打帶設備2之作動。 Furthermore, the tape driving device 2 is a loading automation system to automatically control the operation of the removing device 22, the tape driving device 23, the conveying device 24, and the displacement device 25. For example, the automation system may be equipped with a programmable logic controller (PLC) to plan the cooperative actions among the removing device 22, the tape driving device 23, the conveying device 24, and the displacement device 25. It should be understood that the operation of the tape driving device 2 may also be controlled by using appropriate software or firmware.
請配合參閱第3A及3B圖,係為本發明之打帶設備之進料區與拆帶區之運作過程之前視示意圖。所述之置放裝置21係為可移動式承載座(如推拉式台車),以置放或承載至少一目標物9,如包含複數托盤(tray)9a(如第4B’圖所示)之堆疊組。 Please refer to FIG. 3A and FIG. 3B, which are schematic diagrams of the front view of the operation process of the feeding area and the unwinding area of the tapping equipment of the present invention. The placement device 21 is a movable carrier (such as a push-pull trolley) to place or carry at least one target object 9, such as a plurality of trays 9a (as shown in FIG. 4B ′). Stacking group.
於本實施例中,該目標物9係用於承載複數半導體封裝件(如第1圖所示之半導體封裝件10),且於該進料區A中,該目標物9係配有多餘物件8。例如,該多餘物件8係為制動件,其用於限制運送中之該目標物9之運動。具體地,該多餘物件8係為繩帶狀(如魔術帶),其以捆綁方 式將複數該托盤9a相互固定,使該置放裝置21從該打帶設備2之外部以人工方式移動至(或推入)該進料區A(如第3A圖所示)或從該進料區A利用該位移裝置25(如第8圖所示)移動至該拆帶區B(如第3B圖所示)時,能避免該托盤9a散落。 In this embodiment, the target object 9 is used to carry a plurality of semiconductor packages (such as the semiconductor package 10 shown in FIG. 1), and in the feeding area A, the target object 9 is provided with excess objects. 8. For example, the redundant object 8 is a braking component, which is used to restrict the movement of the target object 9 during transportation. Specifically, the redundant object 8 is in the shape of a rope (such as a magic belt). The plurality of trays 9a are fixed to each other, so that the placement device 21 is manually moved (or pushed into) the feeding area A (as shown in FIG. 3A) from the outside of the tapping device 2 or from the feeding area. When the material area A is moved to the tape removal area B (as shown in FIG. 3B) by using the displacement device 25 (as shown in FIG. 8), the tray 9a can be prevented from falling.
如第3B圖所示,所述之移除裝置22係配置於拆帶區B,用於接收來自該進料區A之目標物9(即配有該多餘物件8之目標物9),並從該目標物9上移除該多餘物件8。 As shown in FIG. 3B, the removing device 22 is disposed in the unwinding zone B, and is used for receiving the target 9 (that is, the target 9 equipped with the redundant object 8) from the feeding area A, and The redundant object 8 is removed from the target 9.
請配合參閱第4A至4D圖,係為本發明之打帶設備之移除裝置之運作過程之上視示意圖。於本實施例中,如第4A圖所示,該移除裝置22包含至少一帶動構件220、至少一導引構件221、至少一止擋構件222以及至少一收納構件223。例如,該帶動構件220係用於帶動該多餘物件8位移;該導引構件221係用於導引該多餘物件8之位移方向;該止擋構件222係用於制止該導引構件221導引該多餘物件8;該收納構件223係用於收納從該目標物9上脫離之該多餘物件8。 Please refer to Figs. 4A to 4D, which are schematic top views of the operation process of the removing device of the tape removing device of the present invention. In this embodiment, as shown in FIG. 4A, the removing device 22 includes at least one driving member 220, at least one guiding member 221, at least one stopping member 222, and at least one receiving member 223. For example, the driving member 220 is used to drive the displacement of the redundant object 8; the guide member 221 is used to guide the displacement direction of the redundant object 8; the stop member 222 is used to stop the guide member 221 from guiding The excess object 8; the storage member 223 is used to store the excess object 8 detached from the target object 9.
具體地,該帶動構件220係位於該目標物9之前後方,以朝該目標物9之左右方向施予作用力(如推力)於該多餘物件8上。該導引構件221係為片狀,其位於該目標物9之下方,以於該目標物9底部之凹槽90(如第4B’圖所示)中卡住或勾住該多餘物件8而將該多餘物件8定向,並使該導引構件221較該多餘物件8更靠近該目標物9之左右兩側之邊緣。該止擋構件222係為擋板,其位於 該目標物9之左右兩側之至少一者之外,使該止擋構件222與該目標物9之左右側邊緣之間具有一間隔空間S。該收納構件223係具有容置空間2230,並設於該間隔空間S之下方。 Specifically, the driving member 220 is located in front of and behind the target object 9 to apply a force (such as a thrust force) on the redundant object 8 in a left-right direction of the target object 9. The guide member 221 is in the shape of a sheet, and is located below the target 9 so that the excess object 8 is caught or hooked in a groove 90 (shown in FIG. 4B ′) at the bottom of the target 9. Orient the redundant object 8 and make the guide member 221 closer to the edges of the left and right sides of the target 9 than the redundant object 8. The stop member 222 is a baffle, which is located at In addition to at least one of the left and right sides of the target 9, a space S is formed between the stopper member 222 and the left and right edges of the target 9. The storage member 223 has a receiving space 2230 and is disposed below the space S.
再者,可依需求設置至少一止動結構224,例如,設置於該目標物9之左右兩側之邊緣處之外,以將該帶動構件220定位而停止推動該多餘物件8。 Furthermore, at least one stopper structure 224 may be provided according to requirements, for example, the stopper structure 224 is provided outside the edges of the left and right sides of the target 9 to position the driving member 220 to stop pushing the redundant object 8.
因此,該移除裝置22於作動時,係先將該導引構件221移動至該凹槽90中以碰觸該多餘物件8(如第4B及4B’圖所示),再轉動該導引構件221以卡住或勾住該多餘物件8(如第4C-1圖所示之箭頭方向t)且使該導引構件221大致移出該凹槽90(該導引構件221之卡勾處位於該凹槽90中),藉由該帶動構件220朝該目標物9之左右兩側(如第4B及4C-1圖所示之箭頭方向H)推動該多餘物件8且同步帶動該導引構件221(如第4B至4C圖或4C-1至4C-2圖所示之推動過程)。接著,當該帶動構件220推動該多餘物件8抵達該間隔空間S後(如第4D圖所示),該止動結構224會止動該帶動構件220,使該帶動構件220不再推動該多餘物件8,且該導引構件221已通過該間隔空間S(甚至通過該止擋構件222下方,如第4D’圖所示),此時該止擋構件222會擋住該多餘物件8,使該導引構件221與該多餘物件8分離,故該多餘物件8會從該間隔空間S之處掉落至該收納構件223之容置空間2230中(如第4D’圖所示之箭頭方向G)。之後,該位移裝置25會將 該目標物9(其已移除該多餘物件8)移至該打帶區C,且該導引構件221會回到該原始位置(如對應該凹槽90下方之處),以進行下一個具有多餘物件8之目標物9之拆帶作業。 Therefore, when the removing device 22 is actuated, the guide member 221 is first moved into the groove 90 to touch the redundant object 8 (as shown in FIGS. 4B and 4B ′), and then the guide is rotated. The member 221 is used to catch or hook the extra object 8 (in the arrow direction t shown in FIG. 4C-1) and move the guide member 221 out of the groove 90 (the hook of the guide member 221 is located at In the groove 90), the driving member 220 pushes the excess object 8 toward the left and right sides of the target 9 (in the arrow direction H shown in FIGS. 4B and 4C-1) and synchronously drives the guide member 221 (as shown in Figures 4B to 4C or 4C-1 to 4C-2). Then, when the driving member 220 pushes the redundant object 8 to the space S (as shown in FIG. 4D), the stopping structure 224 stops the driving member 220, so that the driving member 220 no longer pushes the redundant object 8 Object 8, and the guide member 221 has passed through the space S (even through the stopper member 222, as shown in FIG. 4D '), at this time, the stopper member 222 will block the excess object 8, so that the The guide member 221 is separated from the redundant object 8, so the redundant object 8 will fall from the space S to the accommodation space 2230 of the storage member 223 (as indicated by the arrow direction G in FIG. 4D '). . After that, the displacement device 25 will The target 9 (which has been removed from the redundant object 8) is moved to the tapping area C, and the guide member 221 is returned to the original position (such as corresponding to the position below the groove 90) for the next step Untapping of the target 9 with the excess 8.
請配合參閱第5A至5E圖及第6A至6B圖,所述之打帶裝置23係用於接收來自該移除裝置22之目標物9(即已移除該多餘物件8之目標物9),以將至少一包裝帶5a,5b,6配置於該目標物9上。 Please refer to FIGS. 5A to 5E and FIGS. 6A to 6B. The tape driving device 23 is used to receive the target 9 from the removing device 22 (that is, the target 9 from which the redundant object 8 has been removed). To arrange at least one packaging tape 5a, 5b, 6 on the target object 9.
於本實施例中,該打帶裝置23係包含至少一定位組件230(如塊體模組)、第一打帶機組231(如第2圖所示,其位於該打帶區C之第一作業處C1)與第二打帶機組232(如第2圖所示,其位於該打帶區C之第二作業處C2)。 In this embodiment, the tape driving device 23 includes at least one positioning component 230 (such as a block module) and a first tape driving unit 231 (as shown in FIG. 2, which is located at the first position in the tape driving area C). The working place C1) and the second tape driving unit 232 (as shown in FIG. 2, it is located at the second working place C2 of the tape driving area C).
具體地,該定位組件230係用於調整該目標物9之方位,且該第一打帶機組231係用於將該包裝帶5a,5b沿第一方向X(如第5A至5E圖所示之座標軸)配置於該目標物9上(如第5A至5E圖所示),而該第二打帶機組232係用於將該包裝帶6沿第二方向Y(如第6A至6B圖所示之座標軸)配置於該目標物9上(如第6A至6B圖所示),其中,該第一方向X與該第二方向Y係相互垂直。 Specifically, the positioning assembly 230 is used to adjust the orientation of the target 9, and the first tape driving unit 231 is used to move the packaging tapes 5a, 5b along the first direction X (as shown in FIGS. 5A to 5E). The coordinate axis) is arranged on the target 9 (as shown in Figs. 5A to 5E), and the second tape driving unit 232 is used to move the packaging tape 6 in the second direction Y (as shown in Figs. 6A to 6B). The coordinate axis shown in the figure is arranged on the target 9 (as shown in FIGS. 6A to 6B), wherein the first direction X and the second direction Y are perpendicular to each other.
因此,該打帶裝置23於作動時,先將該目標物9藉由該定位組件230定位於該第一打帶機組231之第一作業處C1之預定位置上,以令該目標物9呈現如第5A圖所示之短邊打帶方位,再藉由該第一打帶機組231於該目標物9之其中一側進行短邊打帶作業,即如第5B至5C圖所示 之沿該第一方向X配置一包裝帶5a。接著,藉由該定位組件230將該目標物9水平旋轉180度(如第5C圖所示之箭頭方向W),以於該目標物9之另一側進行短邊打帶作業,即第5D至5E圖所示之沿該第一方向X配置另一包裝帶5b)。 Therefore, when the tape driving device 23 is actuated, the target object 9 is first positioned at a predetermined position of the first operation site C1 of the first tape driving unit 231 by the positioning assembly 230 so that the target object 9 appears. As shown in FIG. 5A, the short-side taping position is performed by the first tapping unit 231 on one side of the target 9, that is, as shown in FIGS. 5B to 5C. A packaging tape 5a is arranged along the first direction X. Next, the target 9 is rotated 180 degrees horizontally (as indicated by the arrow direction W in FIG. 5C) by the positioning assembly 230, so as to perform a short-side tape operation on the other side of the target 9, that is, 5D As shown in Figs. 5E, another packaging tape 5b) is arranged along the first direction X.
之後,藉由該定位組件230將該目標物9移動至該第二打帶機組232之第二作業處C2之預定位置(如第2圖所示之移動方向K)上,並藉由該定位組件230將該目標物9水平旋轉90度,以令該目標物9呈現如第6A圖所示之長邊打帶方位,再藉由該第二打帶機組232於該目標物9上進行長邊打帶作業,即第6A至6B圖所示之沿該第二方向Y配置該包裝帶6。 After that, the target 9 is moved to a predetermined position (moving direction K shown in FIG. 2) of the second operation site C2 of the second tape driving unit 232 by the positioning assembly 230, and the positioning is performed by the positioning assembly 230. The component 230 rotates the target 9 horizontally by 90 degrees, so that the target 9 exhibits a long-side taping position as shown in FIG. 6A, and then the second tapping unit 232 is used to lengthen the target 9 Tape tapping operation, that is, the packaging tape 6 is arranged along the second direction Y as shown in FIGS. 6A to 6B.
應可理解地,該打帶裝置23不限於包含複數打帶機組。具體地,藉由該定位組件230能調整該目標物9之方位,該打帶裝置23可依需求僅有單一打帶機組,亦即,在完成該第一方向X的短邊打帶作業後,該定位組件230將該目標物9旋轉90度,即可進行第二方向Y的長邊打帶作業。 It should be understood that the tape driving device 23 is not limited to include a plurality of tape driving units. Specifically, the orientation of the target 9 can be adjusted by the positioning assembly 230, and the tape driving device 23 can have only a single tape unit as required, that is, after completing the short-side tape operation in the first direction X , The positioning component 230 rotates the target 9 by 90 degrees to perform the long-side tape tapping operation in the second direction Y.
再者,該打帶裝置23可將全部該包裝帶5a,5b,6沿不同方向配置於該目標物9上,亦可將全部該包裝帶5a,5b沿相同方向配置於該目標物9上,故可依需求佈設該包裝帶之打帶方向與數量。 In addition, the tape driving device 23 can arrange all the packaging tapes 5a, 5b, 6 on the target 9 in different directions, and can also arrange all the packaging tapes 5a, 5b on the target 9 in the same direction. Therefore, the direction and quantity of the packaging tape can be arranged according to demand.
另外,該打帶裝置23之種類繁多,且該打帶機組之整體構造係為業界所熟知,並可依需求設計,故於本實施 例中不詳加贅述該打帶裝置23之型式。 In addition, there are many types of the tapping device 23, and the overall structure of the tapping unit is well known in the industry, and can be designed according to requirements, so this implementation The type of the tape driving device 23 is not described in detail in the example.
所述之輸送裝置24係用於接收來自該打帶裝置23之目標物9(即已完成打帶作業之目標物9),以將該目標物9移往該目標區E。詳言之,該目標物9從該打帶裝置23之第二打帶機組232藉由該位移裝置25移至該輸送裝置24之前端,經由輸送裝置24之輸送,再將該目標物9從該輸送裝置24之後端藉由該位移裝置25移至該目標區E之置放裝置21。 The conveying device 24 is used to receive the target object 9 from the tape driving device 23 (that is, the target object 9 having completed the tape-tapping operation), so as to move the target object 9 to the target area E. In detail, the target 9 is moved from the second driving unit 232 of the tape driving device 23 to the front end of the conveying device 24 through the displacement device 25, and is conveyed by the conveying device 24, and then the target 9 is removed from the The rear end of the conveying device 24 is moved to the placement device 21 in the target area E by the displacement device 25.
請配合參閱第7A至7C圖,於本實施例中,該輸送裝置24之種類繁多,例如,輪桿式(如第7A圖所示之轉軸桿70)、帶狀式(如第7B圖所示之傳輸帶71)、軌道式(如第7C圖所示之軌道72,可含承載該目標物9之滑車73)或其它適當結構,並無特別限制。 Please refer to FIGS. 7A to 7C for cooperation. In this embodiment, there are many types of the conveying device 24, such as a wheel lever type (such as the rotating shaft lever 70 shown in FIG. 7A) and a belt type (as shown in FIG. 7B The transmission belt 71 shown), the track type (the track 72 shown in FIG. 7C may include a pulley 73 carrying the target object 9), or other suitable structures are not particularly limited.
所述之位移裝置25係用於移動該目標物9進出該打帶設備2之不同區域,例如,該目標物9從該進料區A之置放裝置21移動至該移除裝置22、從該移除裝置22移動至該打帶裝置23、從該打帶裝置23移動至該輸送裝置24、或從該輸送裝置24移動至該目標區E之置放裝置21。 The displacement device 25 is used to move the target object 9 into and out of different areas of the tape driving device 2. For example, the target object 9 is moved from the placement device 21 in the feeding area A to the removal device 22, The removing device 22 is moved to the tape driving device 23, from the tape driving device 23 to the conveying device 24, or from the conveying device 24 to the placement device 21 of the target area E.
於本實施例中,該位移裝置25係為至少一組機器手臂,如第8圖所示,但不限於此種類。 In this embodiment, the displacement device 25 is at least one set of robot arms, as shown in FIG. 8, but is not limited to this type.
因此,本發明之打帶設備2之打帶作業之整體流程係依序經過該進料區A、拆帶區B、打帶區C、回流區D及目標區E,使作業員只需將該置放裝置21推入該進料區A,再從該目標區E推出該置放裝置21,即可獲取所需之 具有包裝帶5a,5b,6之目標物9,以達到自動化打帶作業之目的。 Therefore, the overall process of the tape-tapping operation of the tape-tapping device 2 of the present invention sequentially passes through the feeding area A, tape-removing area B, tape-taking area C, return area D, and target area E, so that the operator only needs to The placement device 21 is pushed into the feeding area A, and the placement device 21 is pushed out from the target area E to obtain the required With the target 9 of the packaging tapes 5a, 5b, 6 to achieve the purpose of automatic tape-tapping operation.
另外,本發明之打帶設備2可依需求配置多組拆帶區B及打帶區C,以同時進行多組目標物9的打帶作業。 In addition, the tape driving device 2 of the present invention may be configured with a plurality of sets of tape removing areas B and tape driving areas C as required, so as to perform tape driving operations for multiple groups of target objects 9 at the same time.
綜上所述,本發明之打帶設備2及打帶方法係藉由自動化整合系統之設計,以將具有多餘物件8(魔術帶)之目標物9(包含複數托盤9a)藉由該位移裝置25穩定地放置於該拆帶區B的移除作業之預定位置上,再利用該移除裝置22移除該多餘物件8,因而能避免該目標物9之托盤9a相互分離,進而能避免該托盤9a上之半導體封裝件掉落而導致該半導體封裝件損壞之問題。 To sum up, the tape driving device 2 and the tape driving method of the present invention are designed by an automatic integration system, so that the target 9 (including a plurality of trays 9a) with redundant objects 8 (magic tape) is moved by the displacement device. 25 is stably placed at a predetermined position in the removal operation of the tape unwinding area B, and then the excess device 8 is removed by using the removing device 22, so that the trays 9a of the target 9 can be prevented from being separated from each other, thereby avoiding the The semiconductor package on the tray 9a is dropped and the semiconductor package is damaged.
再者,當該打帶裝置23進行打帶作業時,因每次打帶的位置會依需求而不同,且出貨的打帶條件亦會依需求改變,故藉由該定位組件230的移動、定位及旋轉,能準確控制每次的打帶位置及方向,以避免發生打帶錯誤之情況,因而能有效提高出貨品質。 In addition, when the tape driving device 23 performs tape operation, since the position of each tape is different according to demand, and the tape delivery conditions of the shipment are also changed according to demand, the movement of the positioning assembly 230 is used. , Positioning and rotation, can accurately control the position and direction of each time to avoid tape errors, so it can effectively improve the quality of shipment.
上述實施例係用於例示性說明本發明之原理及其功效,而非用於限制本發明。任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下,對上述實施例進行修改。因此本發明之權利保護範圍,應如後述之申請專利範圍所列。 The above embodiments are used to exemplify the principle of the present invention and its effects, but not to limit the present invention. Anyone skilled in the art can modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be listed in the scope of patent application described later.
Claims (24)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW107108663A TWI637893B (en) | 2018-03-14 | 2018-03-14 | Tape punching apparatus and tape punching method |
CN201810250959.9A CN110271701B (en) | 2018-03-14 | 2018-03-26 | Tape printing equipment and tape printing method |
Applications Claiming Priority (1)
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TW107108663A TWI637893B (en) | 2018-03-14 | 2018-03-14 | Tape punching apparatus and tape punching method |
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TWI637893B true TWI637893B (en) | 2018-10-11 |
TW201938471A TW201938471A (en) | 2019-10-01 |
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TW107108663A TWI637893B (en) | 2018-03-14 | 2018-03-14 | Tape punching apparatus and tape punching method |
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JP2000142611A (en) * | 1998-11-02 | 2000-05-23 | Naigai Kk | Method for removing band from which object has come off |
US6426460B1 (en) * | 1999-05-10 | 2002-07-30 | St Assembly Test Services Pte Ltd | Velcro strapping for semiconductor carrying trays |
CN1616304A (en) * | 2004-11-08 | 2005-05-18 | 云南昆船设计研究院 | Automatic dismantling and recovering method and device for case packaging belt |
TWM269283U (en) * | 2005-01-04 | 2005-07-01 | Hwa Shu Entpr Co Ltd | Semiconductor tray |
CN206417256U (en) * | 2016-12-30 | 2017-08-18 | 佛山市顺德区天键包装材料机械有限公司 | It is automatically positioned and makes belting |
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Publication number | Publication date |
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TW201938471A (en) | 2019-10-01 |
CN110271701A (en) | 2019-09-24 |
CN110271701B (en) | 2021-09-07 |
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