TWI633805B - Heating film structure - Google Patents

Abstract

A heating sheet structure comprising an electrothermal layer and a reflective layer, the electrothermal layer comprises a base layer, an electric heating coating, a plurality of electrodes and a plurality of conductive columns; the base layer is a non-conductive material; the electric heating coating is disposed on one side of the base layer; The electrode is disposed on one of the opposite sides of the electric heating coating; at least one conductive column is disposed on each of the electrodes, and each of the conductive columns penetrates the base layer; the reflective layer is a conductive material disposed on the base layer to be electrically heated The other side of the coating layer is provided with an insulating region on the reflective layer, and the insulating region separates the reflective layer into one of the first electrical region and the second electrical region, the first electrical region and the second electrical region. The regions are in contact with at least one of the conductive posts.

Description

Heating sheet structure

The invention relates to a heating sheet structure, in particular to a heating sheet structure which can be heated in a large area, has low impedance, effectively reduces the parallel complexity and improves the utilization ratio of the heating area.

In the currently available electric heating products (for example, personal wear care products), the commonly used heating methods are mainly divided into linear nickel alloy electric resistance wires and soft sheet electric heating sheets, among which nickel alloy electric resistance wires are most commonly used. However, it has the disadvantages of complicated process, uneven heating and single circuit fault; while the sheet heater can improve the above-mentioned linear heating sheet, but it is limited by the low conductivity of the heating material, and can only be applied to the area. For small products, large voltage or complicated parallel design is required for large-area applications, which also leads to a significant increase in cost.

In order to allow the heater chip to be used under conditions of large area and low voltage, the resistance value of the heater chip needs to be reduced, and the most common method is to use the finger fork electrode for parallel design. The disadvantages of the interdigitated electrode include: 1. It is easy to have hot spots and affect the uniformity of heat generation. Because the electrode spacing is different at the corner of the fork, it is easy to occur hot spots and uneven temperature; 2. Reduce the effective heating area, the electrode is Non-heating zone, so the effective heating area is small; 3. Complex pattern design is difficult, limited by the limitations of the electrodes to be connected, it is difficult to reach the heating zone of complex patterns.

Therefore, how to have a "heating sheet structure" capable of heating in a large area, low impedance, effectively reducing the parallel complexity and improving the utilization of the heating area is an urgent problem to be solved in the related art.

In one embodiment, the present invention provides a heating sheet structure comprising: an electrothermal layer comprising: a base layer, which is a non-conductive material; an electric heating coating disposed on one side of the base layer; and a plurality of electrodes disposed on the electric heating The coating has opposite sides of the two sides; the plurality of conductive columns are provided with at least one conductive column on each electrode, and each conductive column penetrates the base layer; and a reflective layer is a conductive material disposed on the base layer opposite to the base layer The other side of the electric heating coating is provided with an insulating region on the reflective layer, and the insulating region separates the reflective layer into one of the first electrical region and the second electrical region, the first electrical region and the second region. The electrical regions are in contact with at least one of the conductive posts.

100, 100A, 100B, 100C‧‧‧ heating sheet structure

10, 10B, 10C‧‧‧Electrical layer

11, 11B, 11C‧‧‧ grassroots

12, 12B, 12C‧‧‧Electrical heating coating

13, 13A, 13B, 13C‧‧‧ electrodes

131C‧‧‧Circular electrode

132C‧‧‧Round electrode

14, 14B, 14C‧‧‧ conductive column

111, 121, 131‧‧‧ holes

20, 20B, 20C‧‧‧reflective layer

21, 21A, 21B, 21C‧‧‧ insulated area

22, 22A, 22B, 22C‧‧‧ first electrical area

23, 23A, 23B, 23C‧‧‧ second electrical area

24‧‧‧ holes

30‧‧‧Power cord

31, 32‧‧‧ wires

40‧‧‧Upper cover

50‧‧‧Under cover

1 is a schematic view showing a combined structure of an embodiment of the present invention.

FIG. 2 is a schematic exploded view of the embodiment of FIG. 1. FIG.

3 is a schematic cross-sectional view of the A-A of the embodiment of FIG. 1.

4 is a cross-sectional view showing the structure of the upper cover layer and the lower cover layer in the embodiment of FIG. Figure.

FIG. 5 is a schematic structural view of another embodiment of the present invention.

FIG. 6 is a schematic diagram of a combined structure according to still another embodiment of the present invention.

Figure 7 is a schematic exploded view of the embodiment of Figure 6.

Figure 8 is a schematic cross-sectional view of the B-B of the embodiment of Figure 6.

FIG. 9 is a schematic diagram of a combined structure according to still another embodiment of the present invention.

Figure 10 is a schematic exploded view of the embodiment of Figure 9.

Referring to the embodiment shown in FIG. 1 to FIG. 3 , the heater chip structure 100 includes an electrothermal layer 10 and a reflective layer 20 .

The electrothermal layer 10 includes a base layer 11, an electrothermal coating 12, a plurality of electrodes 13, and a plurality of conductive columns 14. The base layer 11 is a non-conductive material, and may be, for example, one of polyimine (PI) or polyethylene terephthalate (PET). The electrothermal heat-generating coating 12 is disposed on one surface of the base layer 11, and the electrothermal heat-generating coating 12 is formed of a resin in which the micro-nano conductive powder is mixed with a flexibility. The plurality of electrodes 13 are disposed on either one of opposite sides of the electrothermal heat-generating coating 12. In the present example, four electrodes 13 which are parallel to each other and have a long rectangular shape are provided. The electrodes 13 are disposed on the top surface of the electric heat-generating coating layer 12, and the electric heat-generating coating layer 12 is disposed on the top surface of the base layer 11. Holes 111, 121, and 131 are respectively disposed at corresponding positions of the base layer 11, the electric heating coating 12, and the electrode 13 for penetrating a conductive pillar 14, and each of the conductive pillars 14 penetrates the base layer 11. In the embodiment shown in FIG. 1, the electrode 13 and the conductive post 14 are disposed on the surface of the electrothermal heat-generating coating 12 opposite to the base layer 11.

The reflective layer 20 is a conductive material, especially a conductive material having thermal radiation reflection characteristics. The reflective layer 20 is disposed on the base layer 11 opposite to one surface of the electrically heat-generating coating layer 12 (The illustrated embodiment is the bottom surface of the base layer 11), and the reflective layer 20 is provided with holes 24 corresponding to the positions of the holes 111, 121, and 131. An insulating region 21 is disposed on the reflective layer 20. The reflective layer 20 is separated by the insulating region 21 into a first electrical region 22 and a second electrical region 23. In this embodiment, the first electrical region 22 is The second electrical regions 23 are in contact with the two conductive pillars 14, respectively. The first electrical region 22 and the second electrical region 23 are respectively connected to the wires 31, 32 of a power line 30 to connect a power source (not shown). It should be noted that the electrical properties of the first electrical region 22 and the second electrical region 23 depend on the electrical properties of the connected wires 31, 32, that is, when the wires 31 are connected to the positive power and the wires 32 are connected to the negative battery. The first electrical region 22 is a positively charged region, and the second electrical region 23 is a negatively charged region, and vice versa. As for the power source to which the power line 30 is connected, it may be one of an alternating current or a direct current, such as a direct current low voltage power source.

Since the reflective layer 20 is made of a conductive material, it can be used as an electrode. The electrode 13 and the reflective layer 20 are connected by the conductive pillars 14, so that the current can be simultaneously transmitted in the horizontal and vertical directions for the purpose of heating a large area, and the heat radiation can be reflected by the reflective layer 20 to increase the heat utilization rate, and the electrode can be lowered. The number of 13. The aspect of the conductive post 14 is not limited. For example, the electrode 13, the electrothermal heat-generating coating 12, the base layer 11, and the reflective layer 20 may be penetrated by a rivet.

As shown in FIG. 4, an insulating material overcoat layer 40 may be disposed on the surface of the electrothermal layer 10 opposite to the reflective layer 20, and the reflective layer 20 is provided with an insulating material opposite to one surface of the electrothermal layer 10. Cover layer 50. The upper cover layer 40 and the lower cover layer 50 provide protection to the outer surfaces of the electric heating layer 10 and the reflective layer 20.

Referring to the embodiment shown in FIG. 5, the heater chip structure 100A has four strip-shaped rectangular electrodes 13A. The electrodes 13A are parallel to each other and have the same length, but have a plurality of different widths, and the distance between the electrodes 13A is not equal; Due to the insulation zone 21A Since the division paths are different, the distribution areas of the first electrical region 22A and the second electrical region 23A are different, so that the electric wires 31, 32 of the power supply line 30 can be disposed at the bottom edge of the heater chip structure 100A.

1 and 5 illustrate that the widths of the electrodes of the plurality of elongated rectangles may be different, and the distance between the electrodes of the plurality of elongated rectangles may be different, and the shape of the insulating region of the present invention is not limited.

Referring to the embodiment shown in FIG. 6 to FIG. 8, the heater chip structure 100B includes an electrothermal layer 10B and a reflective layer 20B. The electrothermal layer 10B includes a base layer 11B, an electrothermal heat-generating coating layer 12B, a plurality of electrodes 13B, and a plurality of conductive pillars 14B. The reflective layer 20B is disposed on the base layer 11B opposite to the surface on which the electric heating coating 12B is disposed, and the reflective layer 20B is provided with an insulating region 21B to partition the reflective layer 20B into a first electrical region 22B and a second electrical region 23B. The first electrical region 22B and the second electrical region 23B are respectively connected to the wires 31 and 32 of a power source line 30 to connect the power source. The embodiment of the base layer 11B, the electrothermal heat-generating coating layer 12B, the plurality of electrodes 13B, the plurality of conductive pillars 14B and the reflective layer 20B used in this embodiment is the same as the embodiment of FIGS. 1 to 3, except that the electrode 13B and the conductive pillar are used in this embodiment. 14B is disposed between the electric heating coating 12B and the base layer 11B.

The embodiment of Figures 1 and 6 illustrates that the heater chip structure of the present invention can be disposed on either side of the opposite sides of the electrothermal heat-generating coating.

Referring to the embodiment shown in FIG. 9 and FIG. 10, the heater chip structure 100C includes an electrothermal layer 10C and a reflective layer 20C. The electrothermal layer 10C includes a base layer 11C, an electrothermal heat-generating coating 12C, a plurality of electrodes 13C, and a plurality of conductive pillars 14C. The reflective layer 20C is disposed on the base layer 11C with respect to one surface on which the electric heat-generating coating layer 12C is provided. The positional arrangement of the base layer 11C, the electrothermal heat-generating coating 12C, the complex electrode 13C, the plurality of electric pillars 14C, and the reflective layer 20C used in this embodiment is the same as that of the embodiment of FIGS. 1 to 3, and the difference lies in this embodiment. The plurality of electrodes 13C include a circular electrode 131C concentrically disposed and an annular electrode 132C, and the inner diameter of the annular electrode 132C is larger than the outer diameter of the circular electrode 131C. The conductive electrode 14C and the annular electrode 132C are respectively disposed through the electric heating coating 12C, the base layer 11C and the reflective layer 20C, and an insulating region 21C is disposed on the reflective layer 20C to separate the reflective layer 20C. As a first electrical region 22C and a second electrical region 23C, in this embodiment, the first electrical region 22C and the second electrical region 23C are respectively in contact with a conductive pillar 14C, and the first electrical region 22C The electric wires 31, 32 respectively connected to the second electric region 23C with a power source line 30 are connected to the power source. In addition, at least two annular electrodes 132C having at least two diameters and concentrically disposed may be disposed outside the circular electrode 131C, and the shape of the insulating region may be designed according to the number of the conductive pillars.

The above embodiments of the heater chip structures 100A, 100B, and 100C shown in FIGS. 5, 6, and 9 can be provided with the upper cover layer 40 and the lower cover layer 50 as shown in FIG. 4 to face the heater chip structures 100A, 100B, and 100C. Provides protection.

In summary, the heating sheet structure provided by the present invention connects the electrode and the reflective layer through the conductive column, so that the current can be transmitted in the horizontal and vertical directions at the same time, thereby achieving the purpose of heating a large area, and the reflective layer can be used to reflect heat. Radiation to increase heat utilization. In addition, the embodiments of FIG. 1 , FIG. 5 and FIG. 9 show that the shape of the electrode of the present invention is not limited, and may be a long rectangular shape, a circular shape or a circular shape, and the width of the electrode is not limited, and the distance between the electrodes is not limited, and the conductive is not limited. The position of the column is not limited, the path of the insulation zone is not limited, and the wiring position of the power line is not limited, and the design can be changed according to actual needs, so that the pattern of the heating zone can have greater design space and flexibility; The invention has no electrode corners, so no hot spots are generated, and the heat generation is more uniform. The invention can be applied to a large area only by low-voltage power supply, and is advantageous for expanding the application and market of the electric heating products.

However, the specific embodiments described above are merely used to exemplify the features and functions of the present invention, and are not intended to limit the scope of the present invention, and may be applied without departing from the spirit and scope of the present invention. Equivalent changes and modifications made to the disclosure of the present invention are still covered by the scope of the following claims.

Claims (12)

Patent Application The utility model relates to a heating sheet structure, comprising: an electric heating layer comprising: a base layer which is a non-conductive material; an electric heating coating disposed on one side of the base layer; and a plurality of electrodes disposed on opposite sides of the electric heating coating Any one of the plurality of conductive columns, each of the electrodes is provided with at least one of the conductive pillars, and each of the conductive pillars penetrates the base layer; and a reflective layer is a conductive material disposed on the base layer relative to the surface Having one surface of the electric heating coating, the reflective layer is provided with an insulating region, the insulating region separating the reflective layer into a first electrical region and a second electrical region opposite to each other, the first electrical The sexual region and the second electrical region are respectively in contact with at least one of the conductive pillars. The heating sheet structure of claim 1, wherein the electric heating layer is provided with an insulating material overcoat layer opposite to one surface of the reflective layer. The heating sheet structure of claim 1, wherein the reflective layer is provided with an underlying layer of insulating material relative to a surface on which the electrothermal layer is disposed. The heating sheet structure of claim 1, wherein the first electrical region and the second electrical region are respectively provided with a wire connected to the power source. The heater chip structure of claim 1, wherein the plurality of electrodes are electrodes that are disposed in parallel with each other and are elongated rectangles. The heating sheet structure according to claim 1, wherein the plurality of electrodes comprise a circular electrode and a ring-shaped electrode concentrically disposed, the inner diameter of the annular electrode being larger than the outer diameter of the circular electrode . The heater chip structure of claim 6, wherein the plurality of electrodes comprises at least two annular electrodes having at least two diameters and concentrically nested. The heating sheet structure according to claim 1, wherein the base material is made of polyimine (PI) or polyethylene terephthalate (PET). The heating sheet structure according to claim 1, wherein the reflective layer is a conductive material having heat radiation reflection characteristics. The heating sheet structure according to claim 1, wherein the electric heat-generating coating layer is formed by mixing a micronized conductive powder with a resin having flexibility. The heating sheet structure of claim 1, wherein the plurality of electrodes and the plurality of conductive pillars are disposed on the surface of the electrically heat-generating coating opposite to the substrate. The heating sheet structure of claim 1, wherein the plurality of electrodes and the plurality of conductive pillars are disposed between the electrothermal heat-generating coating and the base layer.