CN205752164U - Rectifier bridge chip - Google Patents
Rectifier bridge chip Download PDFInfo
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- CN205752164U CN205752164U CN201620645065.6U CN201620645065U CN205752164U CN 205752164 U CN205752164 U CN 205752164U CN 201620645065 U CN201620645065 U CN 201620645065U CN 205752164 U CN205752164 U CN 205752164U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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Abstract
Rectifier bridge chip.Relate to electronic technology field, particularly relate to the improvement to chip rectifier bridge.Provide a kind of perfect heat-dissipating, chip volume is little, reliability is high rectifier bridge chip.Described packaging body is placed in the front of described substrate, and the reverse side of described substrate is welded on described pcb board；Described pcb board is divided into insulating barrier one, board layer, insulating barrier two, heat radiation flaggy and insulating barrier three from top to bottom, and the reverse side of described substrate contacts with described heat radiation flaggy, and described board layer is for other devices of connecting PCB board.Described rectifier circuit includes diode chip for backlight unit one A ~ diode chip for backlight unit four A, and described substrate is divided into region one A ~ region four A of mutually insulated；Set diode one A welding position and diode two A welding position on described region one A, described region two A sets diode three A welding position；This utility model improves heat dispersion, it is ensured that Circuit Connectivity and the stability of work.
Description
Technical field
This utility model relates to electronic technology field, particularly relates to the improvement to chip rectifier bridge.
Background technology
At present, chip rectifier bridge is in order to typically use full encapsulation mode, and i.e. in addition to pin, remainder plastic packaging wraps up
Thus reach the purpose of insulation, but this kind of chip wraps up due to plastic packaging in actual application, and heat dispersion is poor, causes core
Sheet temperature raises, thus affects chip performance, and then affects stability.For heat radiation performance, copper base size in chip
That must do is relatively large, and the heat that could be distributed by chip is uniform, thus reduces chip operating temperature, promotes chip
The purpose of energy.But, add production cost, be unfavorable for large-scale production.
State Intellectual Property Office 2014-06-18 disclose an application for a patent for invention (application number: 2014100662098,
Title: a kind of chip cooling mode) specifically disclose a kind of chip cooling mode, including chip body, polymer encapsulation material
Layer and at least two panels thermo bimetal chip module, chip generates heat when, cooling surface area increases, when chip is athermic time,
Cooling surface area increases little, decreases the dust accretions of heat-delivery surface, improves the radiating efficiency of encapsulating structure, but, structure is multiple
Miscellaneous, it is unfavorable for large-scale production.
Utility model content
This utility model is for problem above, it is provided that the rectification that a kind of perfect heat-dissipating, chip volume are little, reliability is high
Bridge chip.
The technical solution of the utility model is: includes packaging body and stretches out the pin one ~ pin four of packaging body, described encapsulation
Internal portion is provided with the rectifier circuit being welded on substrate；
Described packaging body is placed in the front of described substrate, and the reverse side of described substrate is welded on described pcb board；
Described pcb board is divided into insulating barrier one, board layer, insulating barrier two, heat radiation flaggy and insulating barrier from top to bottom
Three,
The reverse side of described substrate contacts with described heat radiation flaggy, and described board layer is for other devices of connecting PCB board.
Described rectifier circuit includes diode chip for backlight unit one A ~ diode chip for backlight unit four A, and described substrate is divided into mutually insulated
Region one A ~ region four A；
Set diode one A welding position and diode two A welding position on described region one A, described region two A sets diode
Three A welding positions, described region four A sets diode four A welding position；
It is additionally provided with pin one A stretching out packaging body on described region one A, described region two A is additionally provided with and stretches out packaging body
Pin two A, described region three A is additionally provided with pin three A stretching out packaging body, described region four A is additionally provided with and stretches out encapsulation
Pin four A of body；
Described diode chip for backlight unit one A negative pole is welded on downwards in described diode one A welding position, described diode chip for backlight unit two
A negative pole is welded on downwards in described diode two A welding position, and described diode chip for backlight unit three A negative pole is welded on downwards described two poles
In pipe three A welding position, described diode chip for backlight unit four A negative pole is welded on downwards in described diode four A welding position；
The positive pole of described diode chip for backlight unit one A is connected with described region two A by wire jumper, described diode chip for backlight unit two A's
Positive pole is connected with described region four A by wire jumper, the positive pole of described diode chip for backlight unit three A, the positive pole difference of diode chip for backlight unit four A
It is connected with described region three A by wire jumper；
Described pin one A is positive pole output pin, and institute book pin two A is exchange input pin one, and described pin three A is negative
Pole output pin, described pin four A is exchange input pin two.
Described rectifier circuit includes diode chip for backlight unit one B ~ diode chip for backlight unit four B, and described substrate is divided into mutually insulated
Region one B ~ region four B；
Set diode three B welding position on described region one B, described region three B sets and diode one B welding position and two poles
Pipe two B welding position, described region four B sets diode four B welding position；
It is additionally provided with pin one B stretching out packaging body on described region one B, described region two B is additionally provided with and stretches out packaging body
Pin two B, described region three B is additionally provided with pin three B stretching out packaging body, described region four B is additionally provided with and stretches out encapsulation
Pin four B of body；
Described diode chip for backlight unit one B negative pole is welded on downwards in described diode one B welding position, described diode chip for backlight unit two
B negative pole is welded on downwards in described diode two B welding position, and described diode chip for backlight unit three B negative pole is welded on downwards described two poles
In pipe three B welding position, described diode chip for backlight unit four B negative pole is welded on downwards in described diode four B welding position；
The positive pole of described diode chip for backlight unit one B is connected with described region four B by wire jumper, described diode chip for backlight unit two B's
Positive pole is connected with described region one B by wire jumper, the positive pole of described diode chip for backlight unit three B, the positive pole difference of diode chip for backlight unit four B
It is connected with described region two B by wire jumper；
Described pin one B is exchange input pin one, and described pin two B is negative pole output pin, and described pin three B is just
Pole output pin, described pin four B is exchange input pin two.
Described rectifier circuit includes diode chip for backlight unit one C ~ diode chip for backlight unit four C, and described substrate is divided into mutually insulated
Region one C ~ region four C；
Set diode one C welding position and diode two C welding position on described region two C, described region three C sets and two poles
Pipe three C welding position, described region four C sets diode four C welding position；
It is additionally provided with pin one C stretching out packaging body on described region one C, described region two C is additionally provided with and stretches out packaging body
Pin two C, described region three C is additionally provided with pin three C stretching out packaging body, described region four C is additionally provided with and stretches out encapsulation
Pin four C of body；
Described diode chip for backlight unit one C negative pole is welded on downwards in described diode one C welding position, described diode chip for backlight unit two
C negative pole is welded on downwards in described diode two C welding position, and described diode chip for backlight unit three C negative pole is welded on downwards described two poles
In pipe three C welding position, described diode chip for backlight unit four C negative pole is welded on downwards in described diode four C welding position；
The positive pole of described diode chip for backlight unit one C is connected with described region four C by wire jumper, described diode chip for backlight unit two C's
Positive pole is connected with described region three C by wire jumper, the positive pole of described diode chip for backlight unit three C, the positive pole difference of diode chip for backlight unit four C
It is connected with described region one C by wire jumper；
Described pin one C is negative pole output pin, and described pin two C is positive pole output pin, and described pin three C is exchange
Input pin one, described pin four C is exchange input pin two.
Described pin is provided with cross section, and described cross section has groove.
It is characterized in that described wire jumper is bridge like.
This utility model increases heat radiation flaggy on traditional PCB plate, utilizes heat radiation flaggy to contact, by two with the direct of substrate
During the die work of pole, produced heat is transferred to, via substrate, the flaggy that dispels the heat, thus reduces substrate and diode chip for backlight unit
Temperature during work, improves the stability of chip.Heat radiation flaggy uses insulant to make, and will not cause the performance of chip
Impact, is provided with insulating barrier in the middle of heat radiation flaggy and board layer, will not be by heat sink when having ensured chip operation further
The impact of layer.Improve stability and the safety of chip.Chip uses half packing forms (the one side encapsulation of substrate, another side
Expose), on the premise of ensureing heat dispersion so that the relative position between substrate with diode chip for backlight unit will not change,
Ensure that the stability of chip operation.Cross section is set so that pin, substrate are fitted completely with pcb board between substrate and pin,
Ensure the connectedness of circuit, also improve heat dispersion simultaneously.Cross section is provided with groove so that chip is in encapsulation process
Thermoplastic used by encapsulation will not flow to the reverse side (i.e. needing the one side contacted with pcb board) of pin thus ensure that circuit is even
The general character and the stability of work.
Accompanying drawing explanation
Fig. 1 is this utility model structural representation,
Fig. 2 is this utility model embodiment one board structure schematic diagram,
Fig. 3 is this utility model embodiment one chip connecting structure schematic diagram,
Fig. 4 is this utility model embodiment two board structure schematic diagram,
Fig. 5 is this utility model embodiment two chip connecting structure schematic diagram,
Fig. 6 this utility model embodiment three board structure schematic diagram,
Fig. 7 is this utility model embodiment three chip connecting structure schematic diagram
Fig. 8 is this utility model jumper wire construction schematic diagram,
Fig. 9 is the top view of Fig. 8,
Figure 10 is this utility model pcb board structural representation,
Figure 11 is that this utility model uses view,
Figure 12 is electrical schematic diagram of the present utility model；
In figure, 1 is packaging body, and 2 is substrate,
21A be region one A, 22A be region two A, 23A be region three A, 24A be region four A,
21B be region one B, 22B be region two B, 23B be region three B, 24A be region four B,
21C be region one C, 22C be region two C, 23C be region three C, 24C be region four C,
31A is diode chip for backlight unit one A welding position, and 32A is diode chip for backlight unit two A welding position, and 33A is diode chip for backlight unit three A
Welding position, 34A is diode chip for backlight unit four A welding position,
31B is diode chip for backlight unit one B welding position, and 32B is diode chip for backlight unit two B welding position, and 33B is diode chip for backlight unit three B
Welding position, 34B is diode chip for backlight unit four A welding position,
31C is diode chip for backlight unit one C welding position, and 32C is diode chip for backlight unit two C welding position, and 33A is diode chip for backlight unit three C
Welding position, 34C is diode chip for backlight unit four C welding position,
41 is positive pole output pin, and 42 is negative pole output pin, and 43 is exchange input pin one, and 44 is exchange input pin
Two,
41A be pin one A, 42A be pin two A, 43A be pin three A, 44A be pin four A,
41B be pin one B, 42B be pin two B, 43B be pin three B, 44B be pin four B,
41C be pin one C, 42C be pin two C, 43C be pin three C, 44A be pin four C,
51 is diode chip for backlight unit one, and 52 is diode chip for backlight unit two, and 53 is diode chip for backlight unit three, and 54 is diode chip for backlight unit four,
51A be diode chip for backlight unit one A, 52A be diode chip for backlight unit two A, 53A be diode chip for backlight unit three A, 54A be diode
Chip four A,
51B be diode chip for backlight unit one B, 52B be diode chip for backlight unit two B, 53B be diode chip for backlight unit three B, 54B be diode
Chip four B,
51C be diode chip for backlight unit one C, 52C be diode chip for backlight unit two C, 53C be diode chip for backlight unit three C, 54C be diode
Chip four C,
6 is pcb board, and 61 is insulating barrier one, 62 board layers, and 63 is insulating barrier two, and 64 is heat radiation flaggy, and 65 is insulating barrier
Three,
7 is wire jumper,
81 is positive pole output pin, and 82 is negative pole output pin, and 83 is exchange input pin one, and 84 is exchange input pin
Two.
Detailed description of the invention
This utility model as shown in figs. 1-12, including packaging body and the pin one ~ pin four stretching out packaging body, described encapsulation
Internal portion is provided with the rectifier circuit being welded on substrate；Described packaging body is placed in the front of described substrate, described substrate anti-
Face is welded on described pcb board；Described pcb board is divided into insulating barrier one, board layer, insulating barrier two, heat radiation from top to bottom
Flaggy and insulating barrier three, the reverse side of described substrate contacts with described heat radiation flaggy, and described board layer is used for its of connecting PCB board
His device.Board layer other devices on connecting PCB board, constitute complete circuit.Board layer and heat sink in pcb board
It is provided with insulating barrier two, it is to avoid board layer directly contacts with heat radiation flaggy, it is to avoid short circuit in the middle of layer.The front of pcb board is provided with absolutely
Edge layer one, board layer is wrapped up by insulating barrier one and insulating barrier two two-layer megohmite insulant, is only connected with device chip at needs
Place expose circuit board, so can facilitate and arrange to each device, determine the position of each device, reduce and produce into
This so that operating procedure is simple.It is i.e. heat radiation flaggy below board layer, uses the insulant of good heat conductivity to make,
Will not conduct electricity while passing to heat, i.e. not interfere with the function of circuit board itself.By direct for the substrate of packaging body during use
It is fitted on heat radiation flaggy, makes substrate and heat sink swap heat radiation, reduce the temperature of copper base so that chip operation is steady
Fixed, improve the heat dispersion of chip, improve the stability of chip operation.
Described pin is provided with cross section, and described cross section has groove.For pcb board of fitting, pin is arranged
Cross section, it is possible to substrate is fitted on heat sink completely reach optimal radiating effect.Set groove on cross section simultaneously,
When being packaged, the material of packaging body terminates in groove, will not pollute pin and cause open circuit.
Embodiment one
Described rectifier circuit includes diode chip for backlight unit one A ~ diode chip for backlight unit four A, and described substrate is divided into mutually insulated
Region one A ~ region four A；Diode one A welding position and diode two A welding position is set, on described region two A on described region one A
If diode three A welding position, described region four A sets diode four A welding position.The purpose arranging welding position is when paster
Time can quickly find the position that each diode chip for backlight unit is corresponding, reduces the time selecting and producing, and improves production efficiency.
It is additionally provided with pin one A stretching out packaging body on described region one A, described region two is additionally provided with on A and stretches out encapsulation
Pin two A of body, described region three A is additionally provided with pin three A stretching out packaging body, described region four A is additionally provided with and stretches out envelope
Pin four A of dress body；Four pins are for being attached constituting complete circuit with the board layer on pcb board.
Described diode chip for backlight unit one A negative pole is welded on downwards in described diode one A welding position, described diode chip for backlight unit two
A negative pole is welded on downwards in described diode two A welding position, and described diode chip for backlight unit three A negative pole is welded on downwards described two poles
In pipe three A welding position, described diode chip for backlight unit four A negative pole is welded on downwards in described diode four A welding position.Four diodes
The equal P of chip was welded on substrate towards upper (i.e. positive pole is upwards, and negative pole is downward), the stress produced when reducing welding, improved stable
Property.
The positive pole of described diode chip for backlight unit one A is connected with described region two A by wire jumper, described diode chip for backlight unit two A's
Positive pole is connected with described region four A by wire jumper, the positive pole of described diode chip for backlight unit three A, the positive pole difference of diode chip for backlight unit four A
It is connected with described region three A by wire jumper；Described pin one A is positive pole output pin, and institute book pin two A is exchange input pin
One, described pin three A is negative pole output pin, and described pin four A is exchange input pin two.Wire jumper can make have connection and close
System and need to carry out the diode chip for backlight unit of great-leap-forward connection a kind of connected mode is provided so that need the diode being attached
It is attached and avoids the diode being made without connecting, on the one hand can be prevented effectively from short circuit, on the other hand can optimize base
Plate structure, reduces substrate volume, saves material.
Embodiment two
Described rectifier circuit includes diode chip for backlight unit one B ~ diode chip for backlight unit four B, and described substrate is divided into mutually insulated
Region one B ~ region four B；Set diode three B welding position on described region one B, described region three B sets and welds with diode one B
Position and diode two B welding position, described region four B sets diode four B welding position；The purpose of welding position is set at paster
Time can quickly find the position that each diode chip for backlight unit is corresponding, reduce the time selecting and producing, improve production efficiency.
It is additionally provided with pin one B stretching out packaging body on described region one B, described region two is additionally provided with on B and stretches out encapsulation
Pin two B of body, described region three B is additionally provided with pin three B stretching out packaging body, described region four B is additionally provided with and stretches out envelope
Pin four B of dress body；Four pins are for being attached constituting complete circuit with the board layer on pcb board.
Described diode chip for backlight unit one B negative pole is welded on downwards in described diode one B welding position, described diode chip for backlight unit two
B negative pole is welded on downwards in described diode two B welding position, and described diode chip for backlight unit three B negative pole is welded on downwards described two poles
In pipe three B welding position, described diode chip for backlight unit four B negative pole is welded on downwards in described diode four B welding position.Four diodes
The equal P of chip was welded on substrate towards upper (i.e. positive pole is upwards, and negative pole is downward), the stress produced when reducing welding, improved stable
Property.
The positive pole of described diode chip for backlight unit one B is connected with described region four B by wire jumper, described diode chip for backlight unit two B's
Positive pole is connected with described region one B by wire jumper, the positive pole of described diode chip for backlight unit three B, the positive pole difference of diode chip for backlight unit four B
It is connected with described region two B by wire jumper；Described pin one B is exchange input pin one, and described pin two B is that negative pole output is drawn
Foot, described pin three B is positive pole output pin, and described pin four B is exchange input pin two.Wire jumper can make have connection and close
System and need to carry out the diode chip for backlight unit of great-leap-forward connection a kind of connected mode is provided so that need the diode being attached
It is attached and avoids the diode being made without connecting, on the one hand can be prevented effectively from short circuit, on the other hand can optimize base
Plate structure, reduces substrate volume, saves material.
Embodiment three
Described rectifier circuit includes diode chip for backlight unit one C ~ diode chip for backlight unit four C, and described substrate is divided into mutually insulated
Region one C ~ region four C；Diode one C welding position and diode two C welding position is set, on described region three C on described region two C
If with diode three C welding position, described region four C setting diode four C welding position.The purpose of welding position is set at paster
Time can quickly find the position that each diode chip for backlight unit is corresponding, reduce the time selecting and producing, improve production efficiency.
It is additionally provided with pin one C stretching out packaging body on described region one C, described region two is additionally provided with on C and stretches out encapsulation
Pin two C of body, described region three C is additionally provided with pin three C stretching out packaging body, described region four C is additionally provided with and stretches out envelope
Pin four C of dress body；
Described diode chip for backlight unit one C negative pole is welded on downwards in described diode one C welding position, described diode chip for backlight unit two
C negative pole is welded on downwards in described diode two C welding position, and described diode chip for backlight unit three C negative pole is welded on downwards described two poles
In pipe three C welding position, described diode chip for backlight unit four C negative pole is welded on downwards in described diode four C welding position；Four diodes
The equal P of chip was welded on substrate towards upper (i.e. positive pole is upwards, and negative pole is downward), the stress produced when reducing welding, improved stable
Property.
The positive pole of described diode chip for backlight unit one C is connected with described region four C by wire jumper, described diode chip for backlight unit two C's
Positive pole is connected with described region three C by wire jumper, the positive pole of described diode chip for backlight unit three C, the positive pole difference of diode chip for backlight unit four C
It is connected with described region one C by wire jumper.Described pin one C is negative pole output pin, and described pin two C is that positive pole output is drawn
Foot, described pin three C is exchange input pin one, and described pin four C is exchange input pin two.Wire jumper can make have connection
Relation and needing carries out the diode chip for backlight unit of great-leap-forward connection provides a kind of connected mode so that need two poles being attached
Pipe is attached and avoids the diode being made without connecting, and on the one hand can be prevented effectively from short circuit, on the other hand can optimize
Board structure, reduces substrate volume, saves material.
Claims (6)
1. rectifier bridge chip, is welded on pcb board, and including packaging body and the pin one ~ pin four stretching out packaging body, its feature exists
In, described package interior is provided with the rectifier circuit being welded on substrate；
Described packaging body is placed in the front of described substrate, and the reverse side of described substrate is welded on described pcb board；
Described pcb board is divided into insulating barrier one, board layer, insulating barrier two, heat radiation flaggy and insulating barrier three from top to bottom,
The reverse side of described substrate contacts with described heat radiation flaggy, and described board layer is for other devices of connecting PCB board.
Rectifier bridge chip the most according to claim 1, it is characterised in that described rectifier circuit includes diode chip for backlight unit one
A ~ diode chip for backlight unit four A, described substrate is divided into region one A ~ region four A of mutually insulated；
Set diode one A welding position and diode two A welding position on described region one A, described region two A sets diode three A
Welding position, described region four A sets diode four A welding position；
It is additionally provided with pin one A stretching out packaging body on described region one A, described region two A is additionally provided with and stretches out drawing of packaging body
Foot two A, described region three A is additionally provided with pin three A stretching out packaging body, described region four A is additionally provided with and stretches out packaging body
Pin four A；
Described diode chip for backlight unit one A negative pole is welded on downwards in described diode one A welding position, and described diode chip for backlight unit two A bears
Being welded on downwards in described diode two A welding position, described diode chip for backlight unit three A negative pole is welded on downwards described diode three
In A welding position, described diode chip for backlight unit four A negative pole is welded on downwards in described diode four A welding position；
The positive pole of described diode chip for backlight unit one A is connected with described region two A by wire jumper, the positive pole of described diode chip for backlight unit two A
Being connected with described region four A by wire jumper, the positive pole of described diode chip for backlight unit three A, the positive pole of diode chip for backlight unit four A pass through respectively
Wire jumper is connected with described region three A；
Described pin one A is positive pole output pin, and institute book pin two A is exchange input pin one, and described pin three A is that negative pole is defeated
Going out pin, described pin four A is exchange input pin two.
Rectifier bridge chip the most according to claim 1, it is characterised in that described rectifier circuit includes diode chip for backlight unit one
B ~ diode chip for backlight unit four B, described substrate is divided into region one B ~ region four B of mutually insulated；
Set diode three B welding position on described region one B, described region three B sets and diode one B welding position and diode two
B welding position, described region four B sets diode four B welding position；
It is additionally provided with pin one B stretching out packaging body on described region one B, described region two B is additionally provided with and stretches out drawing of packaging body
Foot two B, described region three B is additionally provided with pin three B stretching out packaging body, described region four B is additionally provided with and stretches out packaging body
Pin four B；
Described diode chip for backlight unit one B negative pole is welded on downwards in described diode one B welding position, and described diode chip for backlight unit two B bears
Being welded on downwards in described diode two B welding position, described diode chip for backlight unit three B negative pole is welded on downwards described diode three
In B welding position, described diode chip for backlight unit four B negative pole is welded on downwards in described diode four B welding position；
The positive pole of described diode chip for backlight unit one B is connected with described region four B by wire jumper, the positive pole of described diode chip for backlight unit two B
Being connected with described region one B by wire jumper, the positive pole of described diode chip for backlight unit three B, the positive pole of diode chip for backlight unit four B pass through respectively
Wire jumper is connected with described region two B；
Described pin one B is exchange input pin one, and described pin two B is negative pole output pin, and described pin three B is that positive pole is defeated
Going out pin, described pin four B is exchange input pin two.
Rectifier bridge chip the most according to claim 1, it is characterised in that described rectifier circuit includes diode chip for backlight unit one
C ~ diode chip for backlight unit four C, described substrate is divided into region one C ~ region four C of mutually insulated；
Set diode one C welding position and diode two C welding position on described region two C, described region three C sets and diode three
C welding position, described region four C sets diode four C welding position；
It is additionally provided with pin one C stretching out packaging body on described region one C, described region two C is additionally provided with and stretches out drawing of packaging body
Foot two C, described region three C is additionally provided with pin three C stretching out packaging body, described region four C is additionally provided with and stretches out packaging body
Pin four C；
Described diode chip for backlight unit one C negative pole is welded on downwards in described diode one C welding position, and described diode chip for backlight unit two C bears
Being welded on downwards in described diode two C welding position, described diode chip for backlight unit three C negative pole is welded on downwards described diode three
In C welding position, described diode chip for backlight unit four C negative pole is welded on downwards in described diode four C welding position；
The positive pole of described diode chip for backlight unit one C is connected with described region four C by wire jumper, the positive pole of described diode chip for backlight unit two C
Being connected with described region three C by wire jumper, the positive pole of described diode chip for backlight unit three C, the positive pole of diode chip for backlight unit four C pass through respectively
Wire jumper is connected with described region one C；
Described pin one C is negative pole output pin, and described pin two C is positive pole output pin, and described pin three C is exchange input
Pin one, described pin four C is exchange input pin two.
Rectifier bridge chip the most according to claim 1, it is characterised in that described pin is provided with cross section, described offset
Groove is had on face.
6. according to the rectifier bridge chip described in claim 2-4 any one, it is characterised in that described wire jumper is bridge like.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620645065.6U CN205752164U (en) | 2016-06-24 | 2016-06-24 | Rectifier bridge chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620645065.6U CN205752164U (en) | 2016-06-24 | 2016-06-24 | Rectifier bridge chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205752164U true CN205752164U (en) | 2016-11-30 |
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Family Applications (1)
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| CN201620645065.6U Active CN205752164U (en) | 2016-06-24 | 2016-06-24 | Rectifier bridge chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110138236A (en) * | 2019-05-27 | 2019-08-16 | 扬州扬杰电子科技股份有限公司 | A kind of new-type rectifier bridge |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110138236A (en) * | 2019-05-27 | 2019-08-16 | 扬州扬杰电子科技股份有限公司 | A kind of new-type rectifier bridge |
| CN110138236B (en) * | 2019-05-27 | 2024-01-26 | 扬州扬杰电子科技股份有限公司 | Novel rectifier bridge |
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