TWI631735B - Light-emitting diode bracket, package, and packaging method thereof - Google Patents

Abstract

A light-emitting diode support comprising a plurality of electrode plates and a reflective cup for use as a light-emitting diode package; the reflective cup body has an inner wall surface which is outwardly inclined and enlarged, and has an opaque inner surface and a glossy surface The resin film layer provides a reflection surface as light in the side direction of the illuminator, so that the light-emitting diode holder has a good and long-life light reflection effect. The invention relates to a package of a light-emitting diode, wherein the light-emitting diode support is fixedly and electrically connected with a light-emitting diode, so that the light-emitting diode has a good and long-life light-emitting effect. A method for encapsulating a light-emitting diode is to form a opaque and glossy resin film layer on the inner wall surface of the reflector cup in a simple manner to form a package of the light-emitting diode.

Description

Light-emitting diode bracket, package, and packaging method thereof

The invention relates to a LED lead frame, a light emitting diode package, and a light emitting diode packaging method.

A light-emitting diode support is provided for use as a packaged light-emitting diode.

1 and 2 are respectively an external view and a cross-sectional view of a conventional light-emitting diode support. As shown in the drawings, a conventional light-emitting diode support includes a plurality of electrode plates 100a, 100b, etc., which are located at the bottom of the reflective cup body for fixing and electrically connecting the light-emitting diodes, and a reflecting surface of the light in the direction of the light emitting diode or the phosphor powder; and a reflecting cup body 200 having an inner wall surface 210 that is outwardly inclined and enlarged for use as a side light of the light emitting diode or the phosphor powder Reflective surface.

The package of the light-emitting diode has two kinds of monochromatic light and white light. When the white light is packaged, the light-emitting diode is covered with an appropriate amount of phosphor powder to make the light and the fluorescent light of the monochromatic light-emitting diode. The light powder is obtained by mixing light excited by the light of the monochromatic light-emitting diode. For example, the yellow phosphor is excited by the blue light-emitting diode to obtain white light, so that the light reflected by the light-emitting diode holder is the light of the light-emitting diode or the light of the fluorescent powder.

3 and 4 are respectively an external view and a cross-sectional view of a package of a conventional light-emitting diode, and the package is fixed and electrically connected to the plurality of electrode plates 100a, 100b of the light-emitting diode support. Light-emitting diode 300. The packaged light-emitting diodes can be used in a variety of products, such as soldering to circuit boards for illumination.

In the above-mentioned light-emitting diode support, the reflective cup 200 is generally made of a thermoplastic plastic, in particular, a white opaque denatured nylon (PPA). This is because nylon is resistant to temperature and does not melt and deform when subjected to surface adhesion (SMT). However, the surface of the denatured nylon mold formed by the mold is not smooth enough, and it is difficult to be shiny, so that the light reflection effect is not good; in addition, the denatured nylon is still not resistant to the qualitative change caused by light and heat, and the packaged light-emitting two When the polar body is used, it will emit heat, so that the surface of the denatured nylon will turn yellow after a period of time, so that the light reflection effect is deteriorated. Therefore, using the package of the conventional light-emitting diode holder, the light-emitting effect is attenuated with the use time, so that the brightness life performance is not good.

Due to the above reasons, the light-emitting effect and the brightness life of the conventional light-emitting diode bracket and its packaged product are not good, and there is room for improvement.

In view of the disadvantages of the light-emitting effect and the poor brightness life of the reflective cup of the conventional light-emitting diode support after packaging, it is an object of the present invention to provide a light-emitting diode support having a good and long-life light reflection effect.

Another object of the present invention is to provide a light emitting diode package having a good and long life light-emitting effect.

It is still another object of the present invention to provide a method of encapsulating a light-emitting diode which produces a light-emitting diode package having a good and long-life light-emitting effect in an extremely simple manner.

In accordance with one of the above objects, an aspect of the present invention provides a light-emitting diode support having a good and long-life light reflection effect, which includes a plurality of electrode plates, a reflective cup, and a resin film layer. a plurality of electrode plates are located at the bottom of the reflector cup for fixing and electrically connecting the light emitting diodes, and providing a reflecting surface as a light source under the light emitting diode or the phosphor powder; the reflecting cup body has an outward direction An inner wall surface that is inclined and enlarged; a resin film layer having a white opaque surface and a glossy surface is provided on the inner wall surface, and the resin film layer is used as a reflecting surface of the side light of the light emitting diode or the fluorescent powder without using conventional The molding surface of the reflecting cup body serves as a reflecting surface of the light.

The white opaque and glossy resin film layer is a thermosetting liquid resin, and is a composite material containing a enamel resin material, an epoxy resin material, or a ruthenium resin and an epoxy resin, and is applied to the inner wall surface of the reflective cup body. After curing and natural setting, a very lustrous surface can be obtained, and the light reflection effect is very good. Moreover, the thermosetting material is not easily deteriorated by light and heat, and a long-life light reflection effect can be obtained.

According to another object of the present invention, an aspect of the present invention provides a light emitting diode package having a good long-life light-emitting effect, comprising a plurality of electrode plates, a reflective cup body, a resin film layer, and a light-emitting diode body. A plurality of electrode plates are located at the bottom of the reflector cup for fixing and electrically connecting the light-emitting diodes and serving as a reflecting surface for the light under the light-emitting diode or the phosphor powder; the reflecting cup body is inclined outward An enlarged inner wall surface; a resin film layer having a white opaque surface and a glossy surface on the inner wall surface, and the resin film layer is used as a reflecting surface of the side direction light of the illuminant (ie, the light emitting diode or the phosphor powder), and The reflective surface of the conventional reflective cup body is not used as a light reflecting surface; the electrode plates are fixed and electrically connected to the light emitting diode. The resin film layer which is opaque and has a glossy surface on the inner wall surface of the reflector cup has the same purpose as described above, so that the package of the light-emitting diode has a good and long-life light-emitting effect.

According to still another object of the present invention, an aspect of the present invention provides a method of light emitting diode package comprising the steps of: preparing an electrode plate for a plurality of; and molding a reflective cup body having an outward direction Inclining the enlarged inner wall surface on the outer edge of the electrode plates; applying a liquid opaque resin to form a resin film layer on the inner wall surface; the resin film layer is solidified and solidified; fixing and electrically connecting the light emitting diodes to the electrode plates . Accordingly, the package body of the light-emitting diode is made in a simple manner to have a resin film layer having an opaque surface and a glossy surface.

According to an embodiment of the present invention, the liquid opaque resin is applied to form a resin film layer on the inner wall surface, and may be diffused by dots, dipped, coated, sprayed, or printed. In a manner, an appropriate amount of opaque liquid resin is applied to the inner wall surface, and after the liquid resin is naturally solidified, it becomes a resin film layer having a glossy surface.

5 and 6 are respectively an external view and a cross-sectional view of a light-emitting diode holder according to an embodiment of the present invention. As shown in these figures, the light-emitting diode support includes a reflective cup 200 and a plurality of electrode plates. In the embodiment of the drawings, a plurality of electrode plates are shown as having two electrode plates 100a and 100b, which may be made of a metal plate or a circuit board or the like, and are located at the bottom of the reflecting cup 200.

The reflecting cup body 200 has an inner wall surface 210 which is outwardly inclined and enlarged, and the inner wall surface 210 is provided with a resin film layer 220 which is white opaque and has a glossy surface. In practice, the setting method may be a method in which the liquid resin is infiltrated and diffused by itself, a method of dipping, a method of coating, a method of spraying, or a printing method, and applying an appropriate amount of opaque liquid resin to the inner wall surface. 210 forms a film layer which, after being solidified by curing, becomes a resin film layer 220 having a glossy surface, and thus has a good light reflection effect. Further, the material of the resin film layer 220 is a thermosetting resin such as Silicone or Epoxy, or a composite material of a resin and an epoxy resin, which is not easily deteriorated by light and heat, so that The resin film layer 220 has a long-life light reflection effect.

7 and 8 are respectively an external view and a cross-sectional view of a light emitting diode package according to an embodiment of the present invention. As shown in the drawings, the package of the light emitting diode includes a plurality of electrode plates, for example, two electrode plates 100a and 100b; the reflective cup 200 is an inner wall surface 210 having an outwardly inclined enlargement, and the inner wall surface 210 is provided with white. a resin film layer 220 that is opaque and has a glossy surface; and a light emitting diode 300.

The structures and compositions of the electrode plates 100a and 100b, the reflector cup 200, the inner wall surface 210, and the resin film layer 220 are the same as those of the fifth and sixth figures and the above description; the electrode plates are fixed and electrically connected. The light-emitting diodes 300 are connected by a gold wire 310 as shown in the drawing.

Further, the light-emitting diode 300 may be sealed with a transparent resin (not shown) in the resin film layer 220, or an appropriate amount of phosphor powder (not shown) may be added to the transparent resin to cause light mixing.

According to the light-emitting diode package of the present embodiment, the holder has the same use effect as described above, thereby making the light-emitting diode package have a good and long-life light-emitting effect.

FIG. 9 is a flow chart showing a method for packaging a light emitting diode according to an embodiment of the present invention. The packaging step is: (1) preparing an electrode plate, for example, two electrode plates 100a and 100b (S1) The electrode plate may be made of a metal plate or a circuit board; (2) a molded reflector cup 200 having an outwardly inclined inner wall surface 210 located on the outer edge of the electrode plates 100a and 100b (S2); (3) applying an opaque liquid resin to form a resin film layer 220 on the inner wall surface 210 (S3); (4). The resin film layer 220 is solidified and solidified (S4); (5). Fixing and electrical connection The light emitting diode 300 is on the electrode plates 100a and 100b (S5). Accordingly, a light-emitting diode package having an opaque and glossy resin film layer as a light-reflecting surface is produced in a simple manner. Moreover, the opaque and glossy surface of the resin film layer 220 is applied before the light-emitting diode 300 is fixed and electrically connected, so that there is no contamination of the light-emitting diode during the packaging process.

In the implementation, the method of forming the resin film layer 220 on the inner wall surface 210 by applying the opaque liquid resin may be a method of diffusing by dots, a method of immersing, a method of coating, a method of spraying, or a method of printing. An appropriate amount of the opaque liquid resin is applied to the inner wall surface of the cup body 210 of the reflector cup 200, and after being solidified by curing, it becomes a resin film layer 220 having a glossy surface.

Further, the light-emitting diode 300 may be sealed with a transparent resin (not shown) in the resin film layer 220, or an appropriate amount of phosphor powder (not shown) may be added to the transparent resin to cause light mixing.

100a, 100b. . . Electrode plate

200. . . Reflective cup

210. . . Inner wall

220. . . Resin film

300. . . Light-emitting diode

310. . . Gold Line

Fig. 1 is a view showing the appearance of a conventional light-emitting diode holder.

Fig. 2 is a cross-sectional view taken along line A-A of the conventional light-emitting diode holder shown in Fig. 1.

FIG. 3 is a perspective view showing a conventional light emitting diode package.

Fig. 4 is a cross-sectional view showing the B-B line taken along the conventional LED package shown in Fig. 3.

Fig. 5 is a perspective view showing a light-emitting diode holder according to an embodiment of the present invention.

Figure 6 is a cross-sectional view taken along line C-C of the light-emitting diode holder shown in Figure 5.

FIG. 7 is a perspective view showing a light emitting diode package according to an embodiment of the present invention.

Figure 8 is a cross-sectional view taken along the line D-D of the light-emitting diode package shown in Figure 7.

FIG. 9 is a flow chart showing a method of a light emitting diode package according to an embodiment of the invention.

Claims (16)

A light-emitting diode support comprises: a reflective cup body having a bottom surface, an outer wall surface and an outwardly inclined inner wall surface, the bottom surface abutting the outer wall surface and the inner wall surface, and one of the reflective cups The bottom portion has an opening, and the inner wall surface is provided with a resin film layer which is opaque and has a glossy surface, and provides a reflecting surface which is a side light of the light emitting diode or the phosphor powder, wherein the resin film layer is made of a thermosetting liquid state. a resin; and a plurality of electrode plates at the bottom of the reflective cup, the electrode plates enclosing the opening of the bottom of the reflective cup, the electrode plates protruding from the outer wall surface of the reflective cup, The electrode plate is in contact with the bottom surface of the reflective cup, and the electrode plates are provided for fixing and electrically connecting the light emitting diode, and are used as the light emitting diode or the direction light of the fluorescent powder. Reflective surface. The light-emitting diode support of claim 1, wherein the plurality of electrode plates are made of a metal plate or a circuit board. The light-emitting diode support according to claim 1, wherein the opaque and glossy resin film layer is a resin film layer containing a bismuth resin material. The light-emitting diode support according to claim 1, wherein the opaque and glossy resin film layer is a resin film layer containing an epoxy resin material. The light-emitting diode support according to claim 1, wherein the opaque and glossy resin film layer is a resin film layer comprising a composite material of a resin and an epoxy resin. A package of a light-emitting diode includes: a light-emitting diode; a reflective cup body having a bottom surface, an outer wall surface and an outer wall surface that is inclined outwardly, the bottom surface abutting the outer wall surface and the inner wall surface, and One of the bottoms of the reflective cup has an opening, and the inner wall surface is provided with a resin film layer which is opaque and has a glossy surface, and is provided as the light emitting diode or the side of the fluorescent powder disposed above the light emitting diode a reflective surface of the directional light, wherein the resin film layer is made of a thermosetting liquid resin; and a plurality of electrode plates are located at the bottom of the reflective cup, the electrode plates closing the opening of the bottom of the reflective cup, The electrode plate protrudes from the outer wall surface of the reflective cup, the electrode plates are in contact with the bottom surface of the reflective cup, and the electrode plates are provided for fixing and electrically connecting the light emitting diode, and It is the light-emitting diode or the reflecting surface of the light under the fluorescent powder. The light emitting diode package of claim 6, wherein the plurality of electrode plates are made of a metal plate or a circuit board. The light-emitting diode package of claim 6, wherein the opaque and glossy resin film layer is a ruthenium-containing resin material. Resin film layer. The light-emitting diode package according to claim 6, wherein the opaque and glossy resin film layer is a resin film layer containing an epoxy resin material. The light-emitting diode package according to claim 6, wherein the opaque and glossy resin film layer is a resin film layer comprising a composite material of a resin and an epoxy resin. A method for packaging a light-emitting diode, comprising the steps of: preparing an electrode plate, which is made up of a metal plate or a circuit board; and molding a reflective cup body having a bottom surface and a The outer wall surface and the outwardly inclined inner wall surface are located on the outer edge of the electrode plates, the bottom surface is adjacent to the outer wall surface and the inner wall surface, and an opening of one of the reflective cup bodies has an opening, and the electrode plates are closed The opening of the bottom portion of the reflective cup, the electrode plates protrude from the outer wall surface of the reflective cup, the electrode plates are in contact with the bottom surface of the reflective cup; and an opaque thermosetting liquid resin is applied to the inner wall surface Forming a resin film layer; the resin film layer is solidified naturally; and fixing and electrically connecting the light emitting diode to the electrode plates. The light emitting diode package as described in claim 11 According to the method, the step of forming the resin film layer on the inner wall surface by applying the opaque liquid resin is performed by the liquid resin on the inner wall surface of the reflecting cup body and diffusing on the inner wall surface of the reflecting cup body. The method of claim 2, wherein the step of forming an opaque liquid resin to form a resin film layer on the inner wall surface is formed by dipping a liquid resin on an inner wall surface of the reflective cup body. . The method of claim 2, wherein the step of forming an opaque liquid resin to form a resin film on the inner wall surface is coated with a liquid resin on an inner wall surface of the reflective cup. . The method of claim 2, wherein the step of forming an opaque liquid resin to form a resin film on the inner wall surface is performed by spraying a liquid resin on an inner wall surface of the reflector cup. . The method of claim 2, wherein the step of forming a resin film layer on the inner wall surface of the opaque liquid resin is printed on the inner wall surface of the reflector cup with a liquid resin.