TWI630101B - Metal resin joint body and its manufacturing method - Google Patents

Metal resin joint body and its manufacturing method Download PDF

Info

Publication number
TWI630101B
TWI630101B TW103111246A TW103111246A TWI630101B TW I630101 B TWI630101 B TW I630101B TW 103111246 A TW103111246 A TW 103111246A TW 103111246 A TW103111246 A TW 103111246A TW I630101 B TWI630101 B TW I630101B
Authority
TW
Taiwan
Prior art keywords
resin
metal
film
oxygen
group
Prior art date
Application number
TW103111246A
Other languages
Chinese (zh)
Other versions
TW201504036A (en
Inventor
Masanori Endo
遠藤正憲
Reiko Takasawa
高澤令子
Miyuki Yoshida
吉田美悠姬
Hidemi Kondo
近藤秀水
Atsuko Ishida
石田敦子
Mitsunori Matsushima
松島三典
Ryota Takahashi
高橋亮太
Original Assignee
Nippon Light Metal Company, Ltd.
日本輕金屬股份有限公司
Polyplastics Co., Ltd.
波利塑膠股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Light Metal Company, Ltd., 日本輕金屬股份有限公司, Polyplastics Co., Ltd., 波利塑膠股份有限公司 filed Critical Nippon Light Metal Company, Ltd.
Publication of TW201504036A publication Critical patent/TW201504036A/en
Application granted granted Critical
Publication of TWI630101B publication Critical patent/TWI630101B/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14311Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0001Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor characterised by the choice of material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/60Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
    • C23C22/66Treatment of aluminium or alloys based thereon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/68Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous solutions with pH between 6 and 8
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/73Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals characterised by the process
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/78Pretreatment of the material to be coated
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2705/00Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts

Abstract

本發明係提供一種可展現優異之接合強度同時於耐久試驗後不引起強度降低、可長時間維持優異接合強度的金屬樹脂接合體。 The present invention provides a metal-resin bonded body that can exhibit excellent bonding strength without causing a decrease in strength after a durability test and can maintain excellent bonding strength for a long time.

本發明之金屬樹脂接合體,係具有:金屬基材、於此金屬基材之表面藉有意地施以使氧含量增加之處理所形成之含有氧之含氧皮膜、與接合於此含氧皮膜之上之且含有具有與含氧皮膜反應之特定官能基之添加劑化合物之熱可塑性樹脂組成物所形成的樹脂成形體之金屬樹脂接合體,前述添加劑化合物之官能基係選自羧基及其鹽及其酯、環氧基、環氧丙基、異氰酸酯基、碳二醯亞胺基、胺基及其鹽、以及酸酐基及其酯所構成群中之至少1種。 The metal-resin bonded body of the present invention comprises a metal substrate, an oxygen-containing oxygen-containing film formed on the surface of the metal substrate by intentionally applying a treatment for increasing the oxygen content, and the oxygen-containing film A metal resin bonded body of a resin molded article formed from a thermoplastic resin composition having an additive compound having a specific functional group that reacts with an oxygen-containing film above, and the functional group of the aforementioned additive compound is selected from a carboxyl group and a salt thereof, and At least one of the group consisting of an ester, an epoxy group, an epoxy propyl group, an isocyanate group, a carbodiimide group, an amine group and a salt thereof, and an acid anhydride group and an ester thereof.

Description

金屬樹脂接合體及其製造方法 Metal resin joint body and its manufacturing method

本發明係關於由金屬所構成之金屬基材與熱可塑性樹脂之樹脂成形體,藉由熱可塑性樹脂之射出成形或熱壓接,可強固地接合成一體金屬樹脂接合體及其之製造方法。 The present invention relates to a resin-molded body made of a metal base material made of metal and a thermoplastic resin. The injection-molding or thermocompression bonding of the thermoplastic resin can be used to firmly join the integrated metal-resin bonded body and a method for manufacturing the same.

近年來,於汽車之各種感測零件、家庭電化製品零件、產業機器零件等領域,廣泛使用將由放熱性或導電性非常高之銅或銅合金所構成之銅基材、由放熱性高且較其他金屬輕量之鋁或鋁合金所構成之鋁基材、與絕緣性能高、輕量且廉價之熱可塑性樹脂製之樹脂成形體接合成一體的金屬樹脂接合體,且其之用途日益擴大。 In recent years, copper substrates composed of copper or copper alloys with very high heat dissipation or electrical conductivity have been widely used in various sensing parts of automobiles, household electrical parts, and industrial machine parts. Aluminium base materials composed of other metals, lightweight aluminum or aluminum alloys, are metal resin joined bodies integrated with resin moldings made of thermoplastic resins with high insulation performance, light weight, and low cost, and their uses are expanding.

而於以往,如此之不同材質之金屬基材與樹脂成形體互相地接合成一體之金屬樹脂接合體,係使用於金屬基材與樹脂成形體之間以接著劑於加壓下接合者。然而,現今作為工業上較佳之接合方法,開發了下述方法:將金屬基材嵌入至射出成型用模具內,將熔融之熱可塑性樹脂射出至此嵌入之金屬基材的表面,以於藉由熱可塑性樹脂之射 出成形以成形樹脂成形體之際同時將金屬基材與樹脂成形體之間接合的方法,並提出了用以使金屬基材與樹脂成形體之間的接合可更便宜、且更提升接合強度的幾個方法。而如此之提案,多是對金屬基材之表面施以適當的表面處理者。 In the past, metal substrates and resin molded bodies of such different materials were joined together to form a metal resin bonded body, which was used for bonding between the metal substrate and the resin molded body with an adhesive under pressure. However, nowadays, as the industrially preferred joining method, the following method has been developed: a metal substrate is embedded in a mold for injection molding, and a molten thermoplastic resin is injected onto the surface of the embedded metal substrate so as to be heated by heat. Plastic resin shot A method for joining a metal substrate and a resin molded body at the same time when forming a resin molded body is proposed, and a method for making the bonding between the metal substrate and the resin molded body cheaper and to improve the bonding strength is proposed. Several methods. Such proposals are mostly those who apply an appropriate surface treatment to the surface of a metal substrate.

例如,本發明人等,提出一種鋁‧樹脂射出一體成形品,其特徵係藉由既存之鋁材之凹狀部與熱可塑性樹脂之嵌入部,而使鋁形狀體與樹脂成形體相互地嵌合(專利文獻1),又,亦提出一種鋁合金構件,其特徵係具有由矽結晶所構成之凸部(專利文獻2)。 For example, the present inventors have proposed an aluminum-resin injection-molded integrally molded product, which is characterized in that an aluminum-shaped body and a resin-molded body are embedded with each other by a recessed portion of an existing aluminum material and an embedded portion of a thermoplastic resin. (Patent Document 1), and also proposes an aluminum alloy member characterized by having a convex portion made of silicon crystal (Patent Document 2).

又,例如,分別提出:藉由將經浸漬於選自氨水、聯氨、及水溶性胺化合物之1種以上之水溶液的前處理所得之鋁合金物、與熱可塑性樹脂組成物射出成形之一體化的技術(專利文獻3、4),及使用將三嗪二硫酚類之水溶液、或各種有機溶劑作為溶劑的溶液作為電鍍溶液,進行金屬之電氣化學之化學表面處理之後,將該表面處理後之金屬與橡膠或塑膠接合的技術(專利文獻5),以及,將接著劑塗布於金屬板上、或者進行表面處理以形成有機皮膜,之後藉由射出成形以將金屬與樹脂一體化的技術(專利文獻6),將金屬之表面以酸或鹼處理之後以矽烷耦合劑處理,之後藉由射出成形與樹脂接合的技術(專利文獻7)。 In addition, for example, it has been proposed that an aluminum alloy object obtained by pretreatment immersed in an aqueous solution selected from the group consisting of ammonia water, hydrazine, and a water-soluble amine compound, and a thermoplastic resin composition are injection molded. Technology (Patent Documents 3 and 4), and the use of an aqueous solution of triazine dithiophenols or a solution of various organic solvents as a solvent as a plating solution to perform a chemical surface treatment of the electrochemistry of a metal, and then the surface treatment Technology for joining metal to rubber or plastic (Patent Document 5), and technology for applying an adhesive on a metal plate or performing surface treatment to form an organic film, and then integrating the metal and resin by injection molding (Patent Document 6) A technique in which the surface of a metal is treated with an acid or an alkali, and then treated with a silane coupling agent, and then bonded to a resin by injection molding (Patent Document 7).

再者,分別提出:於形成有含有微多孔質之羥基之皮膜的金屬表面,將熱可塑性樹脂射出,透過上述皮膜使金 屬與熱可塑性樹脂一體化的技術(專利文獻8),及以聚芳硫醚樹脂為主體,於其使用配合有特定之醯烴系共聚物及無機充填劑之樹脂材料,以將金屬端子等嵌入以接合的技術(專利文獻9)。 Furthermore, it is proposed that a thermoplastic resin is injected on the metal surface on which a film containing a microporous hydroxyl group is formed, and gold is transmitted through the film. It is a technology integrated with a thermoplastic resin (Patent Document 8), and a polyarylene sulfide resin is used as a main body, and a resin material mixed with a specific fluorene-based copolymer and an inorganic filler is used for metal terminals, etc. A technique of embedding and joining (Patent Document 9).

專利文獻1:WO2009-151099號公報 Patent Document 1: WO2009-151099

專利文獻2:日本特開2010-174372號公報 Patent Document 2: Japanese Patent Application Laid-Open No. 2010-174372

專利文獻3:日本專利第3954379號公報 Patent Document 3: Japanese Patent No. 3954379

專利文獻4:日本專利第4270444號公報 Patent Document 4: Japanese Patent No. 4270444

專利文獻5:日本特公平05-051671號公報 Patent Document 5: Japanese Patent Publication No. 05-051671

專利文獻6:日本專利3016331號公報 Patent Document 6: Japanese Patent No. 3016331

專利文獻7:日本特開2003-103562號公報 Patent Document 7: Japanese Patent Application Laid-Open No. 2003-103562

專利文獻8:日本特開2003-162115號公報 Patent Document 8: Japanese Patent Application Laid-Open No. 2003-162115

專利文獻9:日本特開平04-211916號公報 Patent Document 9: Japanese Patent Application Laid-Open No. 04-211916

此處,專利文獻3、4所記載之利用氨水、聯氨、及水溶性胺化合物之方法中,由於處理後至射出成形為止之時間有限制,故有可維持安定之表面狀態之時間短的問題。又,專利文獻5所記載之處理方法,有處理複雜的問題,又,關於專利文獻6或7所記載之方法,亦有步驟複雜或處理成本高的問題。 Here, in the method using ammonia water, hydrazine, and water-soluble amine compounds described in Patent Documents 3 and 4, there is a limitation in the time from the treatment to the injection molding, so that the time for maintaining a stable surface state is short. problem. Further, the processing method described in Patent Document 5 has a problem of complicated processing, and the method described in Patent Document 6 or 7 has problems of complicated steps or high processing cost.

然而,如專利文獻1或專利文獻2之記載,本發明人等,目前為止主要係提出基於定準效應之嵌合的物理接合,其之手法,係提出藉由於處理浴含有鹵素離子之特殊之蝕刻處理的方法。該等方法,雖於接合強度或接合部分之氣密性等性能上沒有問題,但於該蝕刻處理中產生來自 鹵素的氣體,不使周邊之金屬零件或裝置腐蝕,又,必須提出不污染周邊環境之對策,而出現其他課題。 However, as described in Patent Document 1 or Patent Document 2, the present inventors have so far mainly proposed the physical bonding of the chimera based on the alignment effect, and the method thereof is based on the special Etching method. Although these methods have no problem in performance such as joint strength or air-tightness of the joint portion, they are caused by the etching process. The halogen gas does not corrode surrounding metal parts or devices, and it is necessary to propose countermeasures that do not pollute the surrounding environment, and other problems arise.

又,於專利文獻8記載與多孔質之含有羥基之皮膜的定準效應與化學作用、與使用添加有熱可塑性彈性體之熱可塑性樹脂組成物的效果,於專利文獻9記載於聚芳硫醚樹脂配合烯烴系共聚物等之樹脂材料與金屬的密合性,但關於因金屬之表面處理與樹脂組成物之官能基的組合所致之對接合強度或密合性的效果並不明。 Further, Patent Document 8 describes the alignment effect and chemical action with a porous hydroxyl-containing film, and the effect of using a thermoplastic resin composition added with a thermoplastic elastomer is described in Patent Document 9 in a polyarylene sulfide. The resin mixes the adhesion of resin materials such as olefin-based copolymers with metals, but the effect on the bonding strength or adhesion caused by the combination of the metal surface treatment and the functional group of the resin composition is unknown.

因此,本發明人等對於將金屬基材與熱可塑性樹脂製之樹脂成形體之間接合之際,必須開發可對周邊之設備或環境無問題、以簡單之操作且低成本、且可達成長期之優異接合強度的方法而努力探討的結果發現,藉由於金屬基材之表面藉有意地施以使氧含量增加之處理以形成含有氧之含氧皮膜,於該含有氧之含氧皮膜上以熱可塑性樹脂組成物將所形成之樹脂成形體接合之際,藉由於此熱可塑性樹脂組成物中添加具有可與含氧皮膜反應之特定官能基的添加劑化合物,金屬基材與樹脂成形體之間之藉射出成形與熱壓接之接合(金屬-樹脂間接合)之際,可於金屬基材表面之含氧皮膜與樹脂成形體之間形成長期而強固的接合,而完成本發明。 Therefore, the present inventors have to develop a simple operation at a low cost and a long-term long-term operation for joining metal substrates and resin molded articles made of a thermoplastic resin without problems in surrounding equipment or the environment. As a result of diligent research on the method of excellent bonding strength, it was found that the surface of the metal substrate was intentionally treated by increasing the oxygen content to form an oxygen-containing oxygen film, and the oxygen-containing oxygen film was formed on the oxygen-containing oxygen film. When the thermoplastic resin composition joins the formed resin bodies, an additive compound having a specific functional group capable of reacting with an oxygen-containing film is added to the thermoplastic resin composition, so that between the metal substrate and the resin body In the case of injection molding and thermocompression bonding (metal-resin bonding), the present invention can be completed by forming a long-term and strong bond between the oxygen-containing film on the surface of the metal substrate and the resin molded body.

因此,本發明之目的在於提供一種金屬樹脂接合體, 其可展現優異之金屬-樹脂間之接合強度同時於耐久試驗後不引起強度降低、可長時間維持優異之金屬-樹脂間之接合強度。 Therefore, an object of the present invention is to provide a metal resin bonded body, It can exhibit excellent metal-resin bonding strength while not causing a decrease in strength after the endurance test, and can maintain excellent metal-resin bonding strength for a long time.

亦即,本發明係提供一種金屬樹脂接合體,其特徵係具有:由金屬所成之金屬基材、於此金屬基材之表面藉由有意地施以使氧含量增加之處理所形成之含有氧之含氧皮膜、與接合於該含氧皮膜之上且以熱可塑性樹脂組成物所形成的樹脂成形體,前述熱可塑性樹脂組成物,係含有具有可與前述含氧皮膜反應之官能基的添加劑化合物,前述添加劑化合物係具有選自羧基及其鹽及其酯、環氧基、環氧丙基、異氰酸酯基、碳二醯亞胺基、胺基及其鹽、以及酸酐基及其酯所構成群中之至少1種的官能基。 That is, the present invention provides a metal-resin bonded body, which is characterized by having a metal substrate made of a metal and a content formed on the surface of the metal substrate by intentionally applying a treatment for increasing the oxygen content. An oxygen-containing film and a resin molded body formed of a thermoplastic resin composition bonded to the oxygen-containing film, the thermoplastic resin composition contains a functional group having a functional group capable of reacting with the oxygen-containing film. An additive compound having a group selected from the group consisting of a carboxyl group and a salt thereof and an ester thereof, an epoxy group, an epoxy propyl group, an isocyanate group, a carbodiimide group, an amine group and a salt thereof, and an acid anhydride group and an ester thereof; A functional group constituting at least one of the groups.

又,本發明亦提供一種金屬樹脂接合體之製造方法,其係具有下述步驟:於由金屬所成之金屬基材之表面藉由有意地施以使氧含量增加之處理以形成含氧皮膜之皮膜形成步驟、與於以此皮膜形成步驟所得之經表面處理之金屬基材之含氧皮膜之上,藉由熱可塑性樹脂組成物之射出成形以形成樹脂成形體之樹脂成形步驟,其係透過前述含氧皮膜以製造金屬基材與樹脂成形體接合之金屬樹脂接合體之金屬樹脂接合體之製造方法,前述熱可塑性樹脂組成物係含有具有可與含氧皮膜反 應之官能基的添加劑化合物,前述添加劑化合物係具有選自羧基及其鹽及其酯、環氧基、環氧丙基、異氰酸酯基、碳二醯亞胺基、胺基及其鹽、以及酸酐基及其酯所構成群中之至少1種的官能基。 In addition, the present invention also provides a method for manufacturing a metal-resin bonded body, which comprises the steps of forming an oxygen-containing film on a surface of a metal substrate made of a metal by intentionally applying a treatment for increasing an oxygen content. The film forming step of the film forming step, and the resin forming step of forming a resin molded body by injection molding of a thermoplastic resin composition on the oxygen-containing film of the surface-treated metal substrate obtained in this film forming step, are A method for producing a metal-resin bonded body through which the metal substrate and the resin molded body are joined through the oxygen-containing film, wherein the thermoplastic resin composition contains Functional compound additive compound, the aforementioned additive compound has a compound selected from a carboxyl group and a salt thereof, an ester thereof, an epoxy group, an epoxy propyl group, an isocyanate group, a carbodiimide group, an amine group and a salt thereof, and an acid anhydride A functional group of at least one of the group consisting of a group and its ester.

再者,本發明亦提供一種金屬樹脂接合體之製造方法,其係具有下述步驟:於由金屬所成之金屬基材之表面藉由有意地施以使氧含量增加之處理以形成含氧皮膜之皮膜形成步驟、藉由熱可塑性樹脂組成物之射出成形以形成樹脂成形體之樹脂成形步驟、與於以前述皮膜形成步驟所得之經表面處理之金屬基材之含氧皮膜之上,將前述樹脂成形步驟所得之樹脂成形體藉由射出成形或熱壓接接合之金屬樹脂接合步驟,其係透過前述含氧皮膜以製造金屬基材與樹脂成形體接合之金屬樹脂接合體之金屬樹脂接合體之製造方法,前述熱可塑性樹脂組成物,含有具有可與含氧皮膜反應之官能基的添加劑化合物,前述添加劑化合物係具有選自羧基及其鹽及其酯、環氧基、環氧丙基、異氰酸酯基、碳二醯亞胺基、胺基及其鹽、以及酸酐基及其酯所構成群中之至少1種的官能基。 Furthermore, the present invention also provides a method for manufacturing a metal-resin joint, which has the following steps: intentionally applying a treatment for increasing the oxygen content on the surface of a metal substrate made of a metal to form oxygen-containing A film forming step of a film, a resin forming step of forming a resin molded body by injection molding of a thermoplastic resin composition, and an oxygen-containing film of a surface-treated metal substrate obtained by the aforementioned film forming step, The resin-molded body obtained by the aforementioned resin-molding step is subjected to injection-molding or thermocompression bonding, which is a metal-resin bonding of a metal-resin bonded body through which the aforementioned oxygen-containing film is passed to manufacture a metal substrate and a resin-molded body. The manufacturing method of the body, the thermoplastic resin composition contains an additive compound having a functional group capable of reacting with an oxygen-containing film, and the additive compound has a compound selected from a carboxyl group and a salt thereof, an ester thereof, an epoxy group, and an epoxypropyl group. At least one member of the group consisting of isocyanate group, carbodiimide group, amine group and its salt, and acid anhydride group and its ester Energy base.

本發明中,關於原料之金屬基材,由銅或銅合金所構成之銅基材、鐵或鐵合金所構成之鐵基材、鋁或鋁合金所構成之鋁基材等,並無特別限制,可根據使用其所形成之金屬樹脂接合體之用途或該用途所要求之強度、耐蝕性、加工性等各種物性來決定。又,關於鋁基材之材質或形狀 等,只要為鋁或鋁合金所構成者即可,並無特別限制,可根據使用其所形成之鋁樹脂接合體之用途或該用途所要求之強度、耐蝕性、加工性等各種物性來決定。 In the present invention, there are no particular restrictions on the metal substrate of the raw material, the copper substrate composed of copper or copper alloy, the iron substrate composed of iron or iron alloy, the aluminum substrate composed of aluminum or aluminum alloy, etc. It can be determined according to the use of the metal-resin joint formed by the use or various physical properties such as strength, corrosion resistance, and processability required for the use. The material or shape of the aluminum substrate It is not particularly limited as long as it is made of aluminum or an aluminum alloy, and can be determined according to various physical properties such as the use of the aluminum-resin joint formed by using it or the strength, corrosion resistance, and workability required for the use. .

又,關於如此之金屬基材表面以皮膜形成步驟所形成之含有氧之含氧皮膜,只要為與金屬基材之密合性良好者即可,並無特別限定,當金屬基材為銅基材時,可例示如以黑化處理所得之含氧皮膜、以雷射處理所得之含氧皮膜(熱氧化皮膜),又,當金屬基材為鐵基材時,可舉例如以鍍鋅處理所得之來自鋅皮膜之含氧皮膜等,再者,當金屬基材為鋁基材時,可例示如以使用含鋅離子之鹼水溶液之皮膜形成處理所得之含有鋅之含鋅皮膜、或使用91℃以上100℃以下之熱水之皮膜形成處理、或使用60℃以上90℃以下之溫水之皮膜形成處理所得之水和氧化物皮膜、或於鋁基材表面以施以雷射處理之皮膜形成處理所得之氧化物皮膜等。 Further, the oxygen-containing oxygen-containing film formed on the surface of the metal substrate in the film-forming step is not particularly limited as long as it has good adhesion to the metal substrate. When the metal substrate is copper-based For example, an oxygen-containing film obtained by blackening treatment, an oxygen-containing film (thermal oxidation film) obtained by laser treatment, and, for example, when the metal substrate is an iron substrate, for example, galvanizing treatment may be used. The obtained oxygen-containing film derived from the zinc film and the like, and when the metal substrate is an aluminum substrate, for example, a zinc-containing zinc-containing film obtained by a film-forming treatment using an alkaline aqueous solution containing zinc ions, or the Film formation treatment of hot water of 91 ° C to 100 ° C, or water and oxide film obtained from film formation treatment of warm water of 60 ° C to 90 ° C, or laser treatment on the surface of an aluminum substrate An oxide film or the like obtained by a film formation process.

此處,關於用以於鋁基材表面形成作為含氧皮膜之含有鋅之含鋅皮膜的皮膜形成處理,只要能於鋁基材表面形成與鋅元素一同以氧氧化鋅(ZnO)、氧化鋅鐵(ZnFeO)、氧化鋅鋁(ZnAlO)等之形式含有的皮膜即可,藉由熱可塑性樹脂組成物之射出成形等成形為樹脂成形體之際,或者,藉由將此熱可塑性樹脂組成物成形所得之樹脂成形體之熱壓接,與於此含氧皮膜之上所形成之樹脂成形體之間,可達成強固之鋁-樹脂間之接合強度。 Here, as for the film formation treatment for forming a zinc-containing zinc-containing film as an oxygen-containing film on the surface of an aluminum substrate, as long as zinc oxide and zinc oxide (ZnO) and zinc oxide can be formed on the surface of the aluminum substrate together with the zinc element. Films contained in the form of iron (ZnFeO), zinc aluminum oxide (ZnAlO), etc. may be used. When the resin molded body is formed by injection molding of a thermoplastic resin composition or the like, or by using the thermoplastic resin composition The thermocompression bonding of the formed resin molded body and the resin molded body formed on the oxygen-containing film can achieve a strong aluminum-resin bonding strength.

而關於使用該含鋅之鹼水溶液之皮膜形成處理,較佳 為使用以重量比(MOH/Zn2+)1以上100以下之比例、較佳為2以上20以下之比例、更佳為3以上10以下之比例含有氫氧化鹼(MOH)與鋅離子(Zn2+)的含鋅之鹼水溶液,藉由使此含鋅之鹼水溶液於常溫下接觸於鋁基材表面,以於鋁基材表面形成含有氧之含鋅皮膜。該氫氧化鹼(MOH)與鋅離子(Zn2+)之重量比(MOH/Zn2+)若小於1(MOH<Zn2+),則鋅無法充分溶解故無法充分發揮其之效果,相反的,若大於100(MOH>Zn2+),則鋁基材之溶解較鋅之取代析出還快,使鋅不易析出至此鋁基材的表面。 For the film formation treatment using the zinc-containing alkaline aqueous solution, it is preferred to use a ratio of 1 to 100 by weight (MOH / Zn 2+ ), preferably a ratio of 2 to 20, and more preferably 3 or more. A zinc-containing alkali aqueous solution containing alkali hydroxide (MOH) and zinc ions (Zn 2+ ) in a ratio of 10 or less, and the zinc-containing alkali aqueous solution is brought into contact with the surface of an aluminum substrate at normal temperature, so that the aluminum substrate A zinc-containing film containing oxygen is formed on the surface. If the weight ratio (MOH / Zn 2+ ) of the alkali hydroxide (MOH) to zinc ions (Zn 2+ ) is less than 1 (MOH <Zn 2+ ), zinc cannot be fully dissolved and its effect cannot be fully exerted. On the contrary If it is greater than 100 (MOH> Zn 2+ ), the dissolution of the aluminum substrate is faster than the substitution and precipitation of zinc, making it difficult for zinc to precipitate onto the surface of the aluminum substrate.

此處,關於含有鋅離子之鹼水溶液中之鹼源,較佳為使用選自氫氧化鈉、氫氧化鉀、及氫氧化鋰之任一種以上,又,作為此含有鋅離子之鹼水溶液中之鋅離子源,較佳為使用選自氧化鋅、氫氧化鋅、過氧化鋅、氯化鋅、硫酸鋅、及硝酸鋅之任一種以上。 Here, as the alkali source in the alkali aqueous solution containing zinc ions, it is preferable to use any one or more selected from the group consisting of sodium hydroxide, potassium hydroxide, and lithium hydroxide. The zinc ion source is preferably any one or more selected from the group consisting of zinc oxide, zinc hydroxide, zinc peroxide, zinc chloride, zinc sulfate, and zinc nitrate.

而於此含有鋅離子之鹼水溶液中,關於氫氧化鉀濃度,以10g/L以上1000g/L以下、較佳為50g/L以上300g/L以下為佳,又,關於鋅離子濃度,以1g/L以上200g/L以下、較佳為10g/L以上100g/L以下為佳。藉由使含有鋅離子之鹼水溶液的組成為上述範圍內,於鋁基材表面,鋁與鋅離子會產生取代反應,鋁溶解,而鋅離子作為微細粒析出,其之結果,於鋁基材表面形成含有氧元素與鋅元素的含氧皮膜(含鋅皮膜)。亦即,鋁會邊形成凹部邊溶解,鋅析出於該凹部內,而形成含有鋅之含鋅皮膜。此處,當氫氧化鹼濃度未滿10g/L時,會有含有鋅之含鋅 皮膜的形成不充分的問題。相反的,若超過1000g/L,則鹼所致之鋁的溶解速度快而產生無法形成含有鋅之含鋅皮膜的問題。又,當鋅離子濃度未滿1g/L時,會有含鋅皮膜的形成耗費時間的問題,相反的,若超過200g/L,則無法控制鋅析出速度而產生成不均勻表面的問題。 In the alkaline aqueous solution containing zinc ions, the concentration of potassium hydroxide is preferably 10 g / L or more and 1000 g / L or less, preferably 50 g / L or more and 300 g / L or less, and the zinc ion concentration is 1 g It is preferably at least 200 g / L, preferably at least 10 g / L and at most 100 g / L. When the composition of the alkaline aqueous solution containing zinc ions is within the above range, a substitution reaction between aluminum and zinc ions occurs on the surface of the aluminum substrate, the aluminum dissolves, and zinc ions are precipitated as fine particles. As a result, the aluminum substrate An oxygen-containing film (zinc-containing film) containing oxygen and zinc elements is formed on the surface. That is, aluminum is dissolved while forming a recessed portion, and zinc precipitates in the recessed portion to form a zinc-containing film containing zinc. Here, when the alkali hydroxide concentration is less than 10 g / L, there will be zinc containing zinc. The problem of insufficient film formation. On the contrary, if it exceeds 1000 g / L, the dissolution rate of aluminum due to alkali is high, and a problem that a zinc-containing film containing zinc cannot be formed occurs. In addition, when the zinc ion concentration is less than 1 g / L, there is a problem that it takes time to form a zinc-containing film. Conversely, if it exceeds 200 g / L, the zinc deposition rate cannot be controlled and a non-uniform surface occurs.

又,關於用以於鋁基材表面形成作為含氧皮膜之水和氧化物皮膜的皮膜形成處理,首先,使用導電率為0.01mS/m以上20mS/m以下、較佳為0.01mS/m以上10mS/m以下之91℃以上100℃以下的熱水,將該鋁基材浸漬於此熱水中一般為0.5分鐘以上30分鐘以下、較佳為1分鐘以上10分鐘以下以形成水和氧化物,或者,使用導電率為0.01mS/m以上20mS/m以下、較佳為0.01mS/m以上10mS/m以下之60℃以上90℃以下的溫水,將該鋁基材浸漬於此溫水中一般為0.5分鐘以上30分鐘以下、較佳為1分鐘以上10分鐘以下以形成水和氧化物。用以形成此水和氧化物皮膜之皮膜形成處理所使用之熱水或溫水以純水為佳。用以形成此水和氧化物皮膜之皮膜形成處理所使用之熱水或溫水的導電率若未滿0.01mS/m,則由於係超純水的範圍,故純水之製造成本過高而難以實用化或工業化,相反的,若超過20mS/m,則無法形成水和氧化物皮膜,且皮膜形成速度極端變慢,且,有因雜質之存在而容易產生水和皮膜之皮膜缺陷的問題。 Moreover, regarding the film formation process for forming water and an oxide film as an oxygen-containing film on the surface of an aluminum substrate, first, a conductivity of 0.01 mS / m or more and 20 mS / m or less, preferably 0.01 mS / m or more, is used. 10mS / m or less of 91 ° C to 100 ° C hot water, immersing the aluminum substrate in the hot water is generally 0.5 minutes to 30 minutes, preferably 1 minute to 10 minutes to form water and oxides Or, use warm water having a conductivity of 0.01 mS / m or more and 20 mS / m or less, preferably 0.01 mS / m or more and 10 mS / m or less, at 60 ° C to 90 ° C, and immerse the aluminum substrate in the warm water It is generally 0.5 minutes to 30 minutes, preferably 1 minute to 10 minutes to form water and oxides. The hot water or warm water used for the film formation treatment for forming the water and oxide film is preferably pure water. If the conductivity of the hot water or warm water used to form the film forming process of this water and oxide film is less than 0.01mS / m, it is in the range of ultrapure water, so the production cost of pure water is too high and It is difficult to put it into practical use or industrialization. Conversely, if it exceeds 20 mS / m, water and oxide films cannot be formed, and the film formation rate is extremely slow. Moreover, the defects of water and film are liable to occur due to the presence of impurities. .

關於此鋁基材表面所形成之水和氧化皮膜,以X射線繞射確認的結果,使用91℃以上100℃以下之熱水的 皮膜形成處理,為確認有以水鋁石(boehmite)或類水鋁石(pseudoboehmite)為主體之寬廣波峰的皮膜,又,使用60℃以上90℃以下之溫水的皮膜形成處理,為未確認到來自結晶性成分之波峰之主要以非晶質(amorphous)為主體的皮膜。 The water and oxide film formed on the surface of the aluminum substrate were confirmed by X-ray diffraction. The film formation process was not confirmed to confirm the presence of a broad wave film with boehmite or pseudoboehmite as the main body, and the film formation process using warm water of 60 ° C to 90 ° C was not confirmed. The peak derived from the crystalline component is mainly an amorphous film.

又,關於水和氧化物皮膜之X射線繞射之測定,係由於藉皮膜形成處理之鋁基材表面形成作為含氧皮膜之水和氧化物皮膜後之經表面處理之鋁基材,裁成30mm×30mm製作成測定用試樣,將該試樣固定於X射線繞射裝置[(股)理學公司製:RAD-rR]之玻璃試樣板(試樣部24mm角‧貫穿),以X射線源:Cu旋轉對陰極靶(使用X射線及波長:CuKα 1.5418Å)、X射線輸出:50kV、200mA、檢測器:閃爍檢測器、光學系屬性:Bragg-Brentano光學系(集中法)、發散狹縫1°、散射狹縫1°、及受光狹縫0.3mm的條件測定,鑑定含有成分,接著,檢測出之代表各相之波峰之中,關於強度高之不與來自其他成分之波峰重複的1波峰,累積積分繞射強度來求出。 In addition, the X-ray diffraction measurement of water and oxide film was made by forming a surface-treated aluminum substrate on the surface of the aluminum substrate treated with the film to form an oxygen-containing film of water and an oxide film. A measurement sample of 30 mm × 30 mm was prepared, and the sample was fixed to a glass sample plate (sample portion 24 mm angle and penetration) of an X-ray diffraction device [manufactured by Rigaku Corporation: RAD-rR]. X-ray source: Cu rotating counter-cathode target (using X-ray and wavelength: CuKα 1.5418Å), X-ray output: 50kV, 200mA, detector: flicker detector, optical system attributes: Bragg-Brentano optical system (concentration method), divergence Measured under conditions of a slit of 1 °, a scattering slit of 1 °, and a light-receiving slit of 0.3 mm. The components were identified. Then, among the peaks representing the respective phases, the peaks of high intensity do not overlap with the peaks of other components. The peak of 1 is calculated by integrating the integral diffraction intensity.

再者,關於皮膜形成步驟所進行之用以於鋁基材表面形成作為含氧皮膜之氧化物皮膜的雷射處理,只要可將鋁基材之表面附近、較佳為僅於表面附近的部分,加熱至鋁基材之熔融溫度以上使其氧化,使氧化鋁(Al2O3)析出至鋁基材之表面附近而形成含有此氧化鋁(Al2O3)的含氧皮膜即可,例如,可使用雷射蝕刻裝置等進行。 Furthermore, as for the laser treatment performed on the surface of the aluminum substrate to form an oxide film as an oxygen-containing film on the surface of the aluminum substrate, as long as the portion near the surface of the aluminum substrate, and preferably only near the surface, can be processed It can be heated above the melting temperature of the aluminum substrate to oxidize it, so that alumina (Al 2 O 3 ) is precipitated near the surface of the aluminum substrate to form an oxygen-containing film containing the alumina (Al 2 O 3 ). For example, it can be performed using a laser etching apparatus or the like.

關於如此於上述皮膜形成步驟於鋁基材表面形成含氧 皮膜所得之經表面處理之鋁基材,由其之最表面至深度3μm為止的表層中,以EPMA所測定之含氧率為0.1重量%以上50重量%以下、較佳為1.0重量%以上30重量%以下。該經表面處理之鋁基材之表層中之含氧率若低於0.1重量%,則皮膜過薄而會難以於鋁基材與樹脂成形體之間達成充分之鋁-樹脂間的接合強度,相反的,若含氧率高至超過50重量%,則皮膜過厚使皮膜產生凝集破壞,而無法得到充分之鋁-樹脂間的接合強度。 In this way, in the film formation step described above, oxygen-containing material is formed on the surface of the aluminum substrate. The surface-treated aluminum substrate obtained from the film has an oxygen content of 0.1 to 50% by weight, preferably 1.0 to 30% by weight, as measured by EPMA in the surface layer from the outermost surface to a depth of 3 μm. 30 % By weight or less. If the oxygen content in the surface layer of the surface-treated aluminum substrate is less than 0.1% by weight, the film will be too thin and it will be difficult to achieve sufficient aluminum-resin bonding strength between the aluminum substrate and the resin molded body. Conversely, if the oxygen content is as high as more than 50% by weight, the film will be too thick to cause aggregation and destruction of the film, and sufficient aluminum-resin bonding strength cannot be obtained.

又,關於此皮膜形成步驟之於鋁基材表面所形成之含氧皮膜的皮膜厚度,通常以0.06μm以上2μm以下為佳、較佳為0.1μm以上1μm以下。此含氧皮膜的厚度若未滿0.06μm,則皮膜過薄而無法得到充分之鋁-樹脂間的接合強度,相反的,若超過2μm,則皮膜過厚使皮膜產生凝集破壞,而無法得到充分之鋁-樹脂間的接合強度。 The film thickness of the oxygen-containing film formed on the surface of the aluminum substrate in the film formation step is usually preferably 0.06 μm or more and 2 μm or less, and more preferably 0.1 μm or more and 1 μm or less. If the thickness of this oxygen-containing film is less than 0.06 μm, the film is too thin to obtain sufficient aluminum-resin bonding strength. Conversely, if it exceeds 2 μm, the film is too thick to cause the film to agglomerate and fail to obtain sufficient thickness. Al-resin bonding strength.

而使用91℃以上100℃以下之熱水之皮膜形成處理於鋁基材表面所形成之水和氧化物皮膜的厚度,通常以0.1μm以上1μm以下為佳、更佳為0.2μm以上0.5μm以下。該水和氧化物皮膜的皮膜厚度若未滿0.1μm,則皮膜過薄而無法得到充分之鋁-樹脂間的接合強度,相反的,若超過1μm,則皮膜過厚使皮膜產生凝集破壞,而無法得到充分之鋁-樹脂間的接合強度。 The thickness of the water and oxide film formed on the surface of the aluminum substrate using a film formation treatment using hot water of 91 ° C to 100 ° C is usually 0.1 μm to 1 μm, and more preferably 0.2 μm to 0.5 μm. . If the film thickness of the water and oxide film is less than 0.1 μm, the film is too thin to obtain sufficient aluminum-resin bonding strength. Conversely, if it exceeds 1 μm, the film is too thick, causing the film to agglomerate and break. A sufficient aluminum-resin bonding strength cannot be obtained.

又,使用60℃以上90℃以下之溫水之皮膜形成處理於鋁基材表面所形成之水和氧化物皮膜的厚度,通常以0.1μm以上1μm以下為佳、更佳為0.2μm以上0.5μm以 下。該含氧皮膜的皮膜厚度若未滿0.1μm,則皮膜過薄而無法得到充分之鋁-樹脂間的接合強度,相反的,若超過1μm,則皮膜過厚使皮膜產生凝集破壞,而無法得到充分之鋁-樹脂間的接合強度。 In addition, the thickness of the water and oxide film formed on the surface of the aluminum substrate by the film formation treatment using warm water of 60 ° C. to 90 ° C. is usually preferably 0.1 μm to 1 μm, and more preferably 0.2 μm to 0.5 μm. To under. If the film thickness of the oxygen-containing film is less than 0.1 μm, the film is too thin to obtain sufficient aluminum-resin bonding strength. Conversely, when the film thickness is more than 1 μm, the film is too thick, causing the film to agglomerate and fail to obtain the film. Full aluminum-resin bonding strength.

本發明中,關於上述皮膜形成步驟所得之於表面具有含氧皮膜的經表面處理之鋁基材,係以於此含氧皮膜上藉熱可塑性樹脂組成.物之射出成形以將樹脂成形體接合成一體的樹脂成形步驟來製造鋁樹脂接合體,或者,以藉熱可塑性樹脂組成物之射出成形來形成樹脂成形體的樹脂成形步驟、與將所得之樹脂成形體於經表面處理之鋁基材之含氧皮膜上藉由使用雷射焊接、振動焊接、超音波焊接、熱壓焊接、熱板焊接、非接觸熱板焊接、或高頻焊接等手段之熱壓接接合成一體的鋁樹脂接合步驟,來製造鋁樹脂接合體。 In the present invention, the surface-treated aluminum substrate having an oxygen-containing film on the surface obtained in the above-mentioned film-forming step is composed of a thermoplastic resin formed on the oxygen-containing film by injection molding to connect the resin molded body. An integrated resin molding step to produce an aluminum resin bonded body, or a resin molding step of forming a resin molded body by injection molding of a thermoplastic resin composition, and a surface-treated aluminum substrate with the obtained resin molded body The oxygen-containing film is combined with aluminum resin bonding by thermal compression bonding using laser welding, vibration welding, ultrasonic welding, thermal compression welding, hot plate welding, non-contact hot plate welding, or high frequency welding. Steps to produce an aluminum resin bonded body.

而於本發明中,上述樹脂成形步驟所使用之熱可塑性樹脂組成物,具體而言,可舉例如,聚苯硫醚(PPS)等之聚芳硫醚系樹脂或碸系樹脂等之含有硫元素之樹脂,例如聚對苯二甲酸丁二酯(PBT)等之聚酯樹脂、液晶聚合物、聚碳酸酯系樹脂、聚縮醛系樹脂、聚醚系樹脂、聚二苯醚系樹脂等之含有氧原子之樹脂,例如聚醯胺(PA)、ABS、聚醯亞胺、聚醚醯亞胺等之含有氮原子之熱可塑性樹脂等所構成之樹脂組成物,其中,由於金屬樹脂接合體的需求大之汽車零件之耐熱性及剛性的觀點,又,由於電機、電子零件之剛性的觀點,以PPS、PBT、液晶聚合物、聚縮 醛等之工程塑膠為特佳。 In the present invention, the thermoplastic resin composition used in the resin molding step may specifically include, for example, polyarylene sulfide-based resins such as polyphenylene sulfide (PPS) or fluorene-based resins. Elemental resins, such as polyester resins such as polybutylene terephthalate (PBT), liquid crystal polymers, polycarbonate resins, polyacetal resins, polyether resins, polydiphenyl ether resins, etc. Oxygen-containing resins, such as resin compositions composed of nitrogen atom-containing thermoplastic resins such as polyamide (PA), ABS, polyimide, polyetherimide, etc. From the viewpoint of heat resistance and rigidity of automobile parts with large demand, and from the viewpoint of rigidity of motors and electronic parts, PPS, PBT, liquid crystal polymer, polycondensation Engineering plastics such as aldehyde are particularly good.

又,上述之樹脂形成步驟所使用之熱可塑性樹脂組成物,係使用含有具有可與含氧皮膜反應之特定官能基之添加劑化合物的樹脂組成物。此處,前述添加劑化合物,只要為構成熱可塑性樹脂組成物之熱可塑性樹脂以外的物質即可,又,只要為可添加於熱可塑性樹脂組成物中使用者即可,並無特別限制,可考量熱可塑性樹脂組成物之製造、熱可塑性樹脂組成物之成形性及加工性、將熱可塑性樹脂組成物成形所得之樹脂成形體之特性等以各種目的來添加,可例示如抗氧化劑、脫模劑、可塑劑、紫外線吸收劑、熱安定劑、抗靜電劑、染料、顏料、潤滑劑、矽烷耦合劑、填料、彈性體等各種添加劑,其中,由緩和因線膨脹差所產生之金屬、樹脂間之應變的觀點,特別以彈性體作為添加劑為佳。 The thermoplastic resin composition used in the resin forming step is a resin composition containing an additive compound having a specific functional group capable of reacting with an oxygen-containing film. Here, the aforementioned additive compound may be any substance other than the thermoplastic resin constituting the thermoplastic resin composition, and may be any user that can be added to the thermoplastic resin composition, and is not particularly limited, and may be considered. The thermoplastic resin composition is manufactured, the moldability and processability of the thermoplastic resin composition, the characteristics of the resin molded body obtained by molding the thermoplastic resin composition, and the like are added for various purposes, and examples thereof include antioxidants and release agents. , Plasticizers, ultraviolet absorbers, heat stabilizers, antistatic agents, dyes, pigments, lubricants, silane coupling agents, fillers, elastomers and other additives, among them, the metal and resin produced by the relaxation of linear expansion difference From the viewpoint of strain, an elastomer is particularly preferred as an additive.

此處,前述添加劑化合物,只要為具有選自羧基及其鹽及其酯、環氧基、環氧丙基、異氰酸酯基、碳二醯亞胺基、胺基及其鹽、以及酸酐基及其酯所構成群中之至少1種官能基的化合物即可,其中,以具有環氧丙基之化合物為特佳。前述添加劑化合物,較佳為含有來自α-烯烴之構成單位與來自α,β-不飽和酸之環氧丙酯之構成單位所成的烯烴系共聚物,又,更佳為含有來自(甲基)丙烯酸酯之構成單位的烯烴系共聚物。又,以下,亦將(甲基)丙烯酸酯稱為(甲基)丙烯酸酯。例如,亦將(甲基)丙烯酸環氧丙酯稱為環氧丙基(甲基)丙烯酸酯。又,本說明書中,「(甲 基)丙烯酸」,係指丙烯酸與甲基丙烯酸兩者之意,「(甲基)丙烯酸酯」,係指丙烯酸酯與甲基丙烯酸酯兩者之意。 Here, the aforementioned additive compound may be selected from the group consisting of a carboxyl group and a salt thereof, an ester thereof, an epoxy group, an epoxy propyl group, an isocyanate group, a carbodiimide group, an amine group and a salt thereof, and an acid anhydride group and a A compound having at least one functional group in the ester group may be used, and among them, a compound having an epoxy group is particularly preferred. The additive compound is preferably an olefin-based copolymer containing a constituent unit derived from an α-olefin and a constituent unit derived from an propylene oxide derived from an α, β-unsaturated acid. ) An olefin-based copolymer as a constituent unit of an acrylate. Hereinafter, the (meth) acrylate is also referred to as a (meth) acrylate. For example, glycidyl (meth) acrylate is also referred to as glycidyl (meth) acrylate. In this specification, "(甲 "Base" acrylic acid means both acrylic acid and methacrylic acid, and "(meth) acrylate" means both acrylic acid and methacrylic acid.

α-烯烴,並無特別限定,可舉例如乙烯、丙烯、丁烯等,而以乙烯為特佳。α-烯烴,可單獨使用1種、亦可併用2種以上。 The α-olefin is not particularly limited, and examples thereof include ethylene, propylene, and butene, and ethylene is particularly preferred. The α-olefin may be used singly or in combination of two or more kinds.

藉由使前述添加劑化合物含有來自α-烯烴之構成單位,可容易對樹脂成形體賦予可撓性。藉由該可撓性的賦予,樹脂成形體變軟、可展現優異之金屬-樹脂間之接合強度並且防止耐久試驗後之強度降低,而容易長期地維持優異之金屬-樹脂間的接合強度。 When the additive compound contains a constituent unit derived from an α-olefin, flexibility can be easily imparted to the resin molded body. By providing this flexibility, the resin molded body is softened, exhibits excellent metal-resin bonding strength, and prevents a decrease in strength after the endurance test, and it is easy to maintain excellent metal-resin bonding strength for a long period of time.

α,β-不飽和酸之環氧丙酯,並無特別限定,可舉例如丙烯酸環氧丙酯、甲基丙烯酸環氧丙酯、乙基丙烯酸環氧丙酯等,特別以甲基丙烯酸環氧丙酯為佳。α,β-不飽和酸之環氧丙酯,可單獨使用1種、亦可併用2種以上。藉由使前述添加劑化合物含有α,β-不飽和酸之環氧丙酯,可得金屬-樹脂間之接合強度之提升效果。 The propylene oxide of α, β-unsaturated acid is not particularly limited, and examples thereof include propylene acrylate, propylene methacrylate, and propylene acrylate. Oxypropyl esters are preferred. The propylene oxide of α, β-unsaturated acid may be used singly or in combination of two or more kinds. When the aforementioned additive compound contains propylene oxide of an α, β-unsaturated acid, the effect of improving the bonding strength between the metal and the resin can be obtained.

(甲基)丙烯酸酯,並無特別限定,可舉例如丙烯酸甲酯、丙烯酸乙酯、丙烯酸正丙酯、丙烯酸異丙酯、丙烯酸正丁酯、丙烯酸正己酯、丙烯酸正辛酯等丙烯酸酯;甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸正丙酯、甲基丙烯酸異丙酯、甲基丙烯酸正丁酯、甲基丙烯酸異丁酯、甲基丙烯酸正己酯、甲基丙烯酸正辛酯等甲基丙烯酸酯。其中,特別以丙烯酸甲酯為佳。(甲基)丙烯酸酯,可單獨 使用1種、亦可併用2種以上。來自(甲基)丙烯酸酯之構成單位,有助於金屬-樹脂間之接合強度的提升。 The (meth) acrylate is not particularly limited, and examples thereof include acrylates such as methyl acrylate, ethyl acrylate, n-propyl acrylate, isopropyl acrylate, n-butyl acrylate, n-hexyl acrylate, and n-octyl acrylate; Methyl methacrylate, ethyl methacrylate, n-propyl methacrylate, isopropyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, n-hexyl methacrylate, n-methacrylate Methacrylate such as octyl ester. Among them, methyl acrylate is particularly preferred. (Meth) acrylate, available separately Use 1 type, or you can use 2 or more types together. The constituent unit derived from (meth) acrylate contributes to the improvement of the bonding strength between metal and resin.

含有來自α-烯烴之構成單位與來自α,β-不飽和酸之環氧丙酯之構成單位的烯烴系共聚物、以及再含有來自(甲基)丙烯酸酯之構成單位的烯烴系共聚物,可藉由以習知之方法聚合來製造。例如,藉由以一般周知之自由基聚合反應來進行共聚合,可得上述共聚物。共聚物之種類並無特別限定,例如,可為無規共聚物、亦可為嵌段共聚物。又,可為於該烯烴系共聚物,分支狀或交聯構造地化學鍵結例如聚甲基丙烯酸甲酯、聚甲基丙烯酸乙酯、聚丙烯酸甲酯、聚丙烯酸乙酯、聚丙烯酸丁酯、聚丙烯酸2-乙基己酯、聚苯乙烯、聚丙烯醯腈、聚丙烯醯腈‧苯乙烯共聚物、丙烯酸丁酯‧苯乙烯共聚物等的烯烴系接枝共聚物。 An olefin-based copolymer containing a constituent unit derived from an α-olefin and a constituent unit derived from an propylene oxide of an α, β-unsaturated acid, and an olefin-based copolymer further containing a constituent unit derived from a (meth) acrylate, It can be produced by polymerization in a conventional manner. For example, the above copolymer can be obtained by copolymerization by a generally known radical polymerization reaction. The type of the copolymer is not particularly limited, and may be, for example, a random copolymer or a block copolymer. The olefin-based copolymer may be chemically bonded in a branched or cross-linked structure such as polymethyl methacrylate, polyethyl methacrylate, polymethyl acrylate, polyethyl acrylate, polybutyl acrylate, Polyethylene 2-hexyl acrylate, polystyrene, polyacrylonitrile nitrile, polyacrylonitrile nitrile · styrene copolymer, butyl acrylate · styrene copolymer, and other olefin-based graft copolymers.

本發明所使用之烯烴系共聚物,於不損害本發明效果的範圍內,可含有來自其他共聚物成分之構成單位。 The olefin-based copolymer used in the present invention may contain constituent units derived from other copolymer components as long as the effects of the present invention are not impaired.

又,關於前述添加劑化合物之官能基,於熱可塑性樹脂組成物中係以0.5~150μmol/g、較佳為0.5~50μmol/g、更佳為2~25μmol/g的比例含有。此熱可塑性樹脂組成物中之官能基的比例若低於0.5μmol/g,則金屬-樹脂間之接合強度容易降低,相反的若高於150μmol/g,則容易對樹脂材料之特性、特別是流動性、拉伸強度或彎曲強度等機械強度、及剛性造成不良影響,故不佳。 The functional group of the aforementioned additive compound is contained in the thermoplastic resin composition at a ratio of 0.5 to 150 μmol / g, preferably 0.5 to 50 μmol / g, and more preferably 2 to 25 μmol / g. If the ratio of the functional groups in the thermoplastic resin composition is less than 0.5 μmol / g, the bonding strength between the metal and the resin is liable to decrease. Conversely, if it is higher than 150 μmol / g, it is easy to affect the characteristics of the resin material, especially Mechanical properties such as fluidity, tensile strength, and flexural strength, as well as rigidity, are not good because they are adversely affected.

此處,熱可塑性樹脂組成物中之官能基的比例,當視此熱可塑性樹脂組成物中所添加之添加劑化合物中之“每 1個官能基之分子量”為M時,此添加劑化合物中之官能基的量為1/M(mol/g),故若於熱可塑性樹脂組成物中例如以1質量%的比例添加此添加劑化合物,則以(1/M)×(1/100)=1/100M(mol/g)計算。又,前述“每1個官能基之分子量”M,當添加劑化合物具有複數、例如2個官能基時,則為添加劑化合物其本身之分子量Mw之1/2。 Here, the proportion of the functional groups in the thermoplastic resin composition should be regarded as "per 10,000" of the additive compounds added to the thermoplastic resin composition. When the molecular weight of one functional group is M, the amount of functional groups in this additive compound is 1 / M (mol / g). Therefore, if the additive compound is added to the thermoplastic resin composition, for example, in a proportion of 1% by mass , It is calculated as (1 / M) × (1/100) = 1 / 100M (mol / g). Moreover, the aforementioned “molecular weight per functional group” M, when the additive compound has a plurality, for example, 2 functional groups , It is 1/2 of the molecular weight Mw of the additive compound itself.

又,本發明中,於原料之金屬基材之表面整體形成含氧皮膜,可僅於所得之經表面處理之金屬基材之必要之部位藉由射出成形、或藉由熱壓接將樹脂成形體接合,或者,考量成本性,亦可僅於金屬基材表面之一部分或必要之部位形成含氧皮膜、於所得之經表面處理之金屬基材之必要之部位藉由射出成形、或藉由熱壓接將樹脂成形體接合。而僅於金屬基材表面之一部分或必要之部位形成含氧皮膜時,亦可將形成有含氧皮膜部分以外的部分,例如以遮罩膠帶等遮罩後進行用以形成含氧皮膜的處理,接著除去此遮罩部分之遮罩膠帶等即可。 In addition, in the present invention, an oxygen-containing film is formed on the entire surface of the metal substrate of the raw material, and the resin can be formed by injection molding only at a necessary portion of the obtained surface-treated metal substrate, or by thermocompression bonding. It is also possible to form an oxygen-containing film only on a part of a surface of a metal substrate or a necessary portion in consideration of cost, and to mold the necessary portion of the obtained surface-treated metal substrate by injection molding, or Thermocompression bonding joins the resin molded body. When the oxygen-containing film is formed only on a part of the surface of the metal substrate or a necessary part, a portion other than the portion where the oxygen-containing film is formed may be treated with a masking tape or the like to form an oxygen-containing film. , And then remove the masking tape, etc. of this mask part.

本發明中之金屬樹脂接合體之製造方法,視需要除了上述形成含氧皮膜之皮膜形成步驟外,作為金屬基材之表面的前處理,亦可進行選自脫脂處理、蝕刻處理、去污處理、粗面化處理、化學研磨處理、及電解研磨處理中之1種或2種以上的處理。 In addition to the above-mentioned film-forming step for forming an oxygen-containing film, the method for producing a metal-resin bonded body in the present invention may be selected from a degreasing treatment, an etching treatment, and a decontamination treatment as a pretreatment of the surface of the metal substrate, if necessary. , Roughening treatment, chemical polishing treatment, and electrolytic polishing treatment.

關於上述作為前處理所進行之脫脂處理,可使用由氫氧化鈉、碳酸鈉、磷酸鈉、界面活性劑等所構成之一般之脫脂浴進行,處理條件,通常,浸漬溫度為15℃以上 55℃以下、較佳為25℃以上40℃以下,浸漬時間為1分鐘以上10分鐘以下、較佳為3分鐘以上6分鐘以下。 The degreasing treatment performed as the pretreatment can be performed using a general degreasing bath composed of sodium hydroxide, sodium carbonate, sodium phosphate, a surfactant, and the like. The treatment conditions are usually an immersion temperature of 15 ° C or higher. 55 ° C or lower, preferably 25 ° C or higher and 40 ° C or lower, and the immersion time is 1 minute to 10 minutes, preferably 3 minutes to 6 minutes.

又,關於上述作為前處理所進行之蝕刻處理,通常,係使用氫氧化鈉等之鹼水溶液、或硫酸-磷酸混合水溶液等之酸水溶液。而當使用鹼水溶液時,可使用濃度20g/L以上200g/L以下、較佳為50g/L以上150g/L以下者,以浸漬溫度為30℃以上70℃以下、較佳為40℃以上60℃以下、及處理時間為0.5分鐘以上5分鐘以下、較佳為1分鐘以上3分鐘以下之處理條件進行浸漬處理。又,當使用酸水溶液之硫酸-磷酸混合水溶液時,可使用硫酸濃度10g/L以上500g/L以下、較佳為30g/L以上300g/L以下、及磷酸濃度為10g/L以上200g/L以下、較佳為30g/L以上500g/L以下者,以浸漬溫度為30℃以上110℃以下、較佳為55℃以上75℃以下、及浸漬時間為0.5分鐘以上15分鐘以下、較佳為1分鐘以上6分鐘以下之處理條件進行浸漬處理。 In addition, as for the etching treatment performed as the pretreatment, an alkaline aqueous solution such as sodium hydroxide or an acid aqueous solution such as a sulfuric acid-phosphoric acid mixed aqueous solution is usually used. When using an alkaline aqueous solution, a concentration of 20 g / L or more and 200 g / L or less, preferably 50 g / L or more and 150 g / L or less, and an immersion temperature of 30 ° C. or higher and 70 ° C. or lower, preferably 40 ° C. or higher 60 The immersion treatment is performed under the conditions of a temperature of not more than 0 ° C and a treatment time of 0.5 minutes to 5 minutes, preferably 1 minute to 3 minutes. When a sulfuric acid-phosphoric acid mixed aqueous solution of an acid aqueous solution is used, a sulfuric acid concentration of 10 g / L or more and 500 g / L or less, preferably 30 g / L or more and 300 g / L or less, and a phosphoric acid concentration of 10 g / L or more and 200 g / L can be used. Below, preferably 30 g / L or more and 500 g / L or less, the immersion temperature is 30 ° C or higher and 110 ° C or lower, preferably 55 ° C or higher and 75 ° C or lower, and the immersion time is 0.5 minutes or longer and 15 minutes or lower, preferably The immersion treatment is performed under the treatment conditions of 1 minute to 6 minutes.

再者,關於上述作為前處理所進行之去污處理,例如,可使用由1~30%濃度之消酸水溶液所構成之去污浴,以浸漬溫度為15℃以上55℃以下、較佳為25℃以上40℃以下、及浸漬時間為1分鐘以上10分鐘以下、較佳為3分鐘以上6分鐘以下之處理條件進行浸漬處理。 Furthermore, regarding the above-mentioned decontamination treatment performed as the pretreatment, for example, a decontamination bath composed of a 1-30% strength deacidified aqueous solution can be used, and the immersion temperature is preferably 15 ° C or higher and 55 ° C or lower, preferably The immersion treatment is performed under the treatment conditions of 25 ° C. to 40 ° C. and immersion time of 1 minute to 10 minutes, preferably 3 minutes to 6 minutes.

再者,關於上述作為前處理所進行之粗面化處理,可例示如於鋁基材之前處理後,浸漬於以酸性氟化銨為主成分之處理液(日本CB化藥製商品名:JCB-3712)中的方 法等。藉由此處理,即使對於合金中含有Si之Al材,亦可不使Si殘存地溶解除去,故之後即使附有含氧皮膜,亦不會產生缺陷等問題,而可得良好的接合強度。 In addition, the roughening treatment performed as the pretreatment mentioned above can be exemplified by immersion in a treatment liquid containing acidic ammonium fluoride as a main component (trade name of Japan CB Chemical Co., Ltd .: JCB) after the pretreatment of the aluminum substrate. -3712) in the square Law, etc. By this treatment, even for the Al material containing Si in the alloy, Si can be removed without being dissolved. Therefore, even if an oxygen-containing film is attached, problems such as defects do not occur, and good bonding strength can be obtained.

又,作為上述前處理所進行之化學研磨或電解研磨處理,可採用習知之方法。 In addition, as the chemical polishing or electrolytic polishing treatment performed in the pretreatment, a conventional method can be adopted.

本發明中之金屬基材與樹脂成形體之間的接合原理,雖然不明朗的地方仍很多,但於金屬基材與樹脂成形體之接合之後,金屬基材表面所形成之含氧皮膜可不被破壞地殘存,又,如以下的驗證結果,可推測如以下。 Although the principle of bonding between the metal substrate and the resin molded body in the present invention is still unclear, after the metal substrate and the resin molded body are bonded, the oxygen-containing film formed on the surface of the metal substrate may not be covered. The destruction remains, and the following verification results can be estimated as follows.

例如,當金屬為鋁基材時,形成複數之於鋁基材之表面具有含氧皮膜之經表面處理之鋁基材,對於一部分之經表面處理之鋁基材,於其表面藉由具有環氧丙基之聚苯硫醚(PPS)之射出成形將PPS接合而作成鋁PPS接合體。又,對於剩餘之經表面處理之鋁基材,首先,於保持為100℃之電爐中使硬脂酸揮發,使經表面處理之鋁基材暴露於其中24小時,作成於含氧皮膜上具有硬脂酸之單分子膜的經硬脂酸處理之鋁基材,於該經硬脂酸處理之鋁基材表面,藉由具有環氧丙基之PPS之射出成形將PPS接合而作成硬脂酸處理鋁PPS接合體。 For example, when the metal is an aluminum substrate, a plurality of surface-treated aluminum substrates having an oxygen-containing film on the surface of the aluminum substrate are formed. For a part of the surface-treated aluminum substrates, a ring is formed on the surface thereof. Injection molding of oxypropyl polyphenylene sulfide (PPS) joins PPS to form an aluminum PPS joint. In addition, for the remaining surface-treated aluminum substrate, first, stearic acid was volatilized in an electric furnace maintained at 100 ° C, and the surface-treated aluminum substrate was exposed to it for 24 hours to prepare an oxygen-containing film. Stearic acid-treated aluminum substrate of stearic acid monomolecular film, and on the surface of the stearic acid-treated aluminum substrate, PPS is bonded by injection molding of PPS with epoxypropyl group to make stearin. Acid-treated aluminum PPS joint.

而測定該等鋁PPS接合體與硬脂酸處理鋁PPS接合體之間之接合強度之差異的結果,硬脂酸處理鋁PPS接合體中之接合強度,與鋁PPS接合體的接合強度相比,明確降低。 As a result of measuring the difference in bonding strength between these aluminum PPS joints and stearic acid-treated aluminum PPS joints, the bonding strength in the stearic acid-treated aluminum PPS joints was compared with that of the aluminum PPS joints. Clearly reduced.

硬脂酸有一併具有親水基之羧基(COOH)與疏水基之 烷基(C17H35)、及形成具有1分子之厚度之單分子膜的性質。於硬脂酸處理鋁PPS接合體中,此鋁基材之含氧皮膜與硬脂酸之羧基側會化學鍵結,成為烷基側與PPS成形體接觸的形狀,其之結果,阻礙了鋁基材與PPS成形體的化學鍵結,而推測使接合強度較鋁PPS接合體的接合強度低。 Stearic acid has the properties of having a hydrophilic carboxyl group (COOH) and a hydrophobic group alkyl group (C 17 H 35 ), and forming a single-molecule film having a thickness of 1 molecule. In stearic acid-treated aluminum PPS joints, the oxygen-containing film of this aluminum substrate and the carboxyl side of stearic acid are chemically bonded to form a shape in which the alkyl side is in contact with the PPS molded body. As a result, aluminum-based materials are hindered. It is estimated that the bonding strength between the material and the PPS molded body is lower than that of the aluminum PPS bonded body.

又,關於硬脂酸處理前後之經表面處理之鋁基材,觀察其之表面以比較探討,但未見因硬脂酸單分子膜的有無所造成之表面構造的不同。另一方面,關於硬脂酸處理後之經表面處理之鋁基材,使液滴垂落並測定其之接觸角時,接觸角接近於180°,液滴大致成球形。其係硬脂酸之烷基側偏在於鋁基材之最表層側的結果。 In addition, regarding the surface-treated aluminum substrate before and after stearic acid treatment, the surface of the aluminum substrate was observed for comparison, but no difference in the surface structure caused by the presence or absence of the stearic acid monomolecular film was observed. On the other hand, regarding the surface-treated aluminum substrate after the stearic acid treatment, when the droplet was dropped and the contact angle was measured, the contact angle was close to 180 °, and the droplet was approximately spherical. This is a result of stabilizing the alkyl side of the stearic acid on the outermost surface side of the aluminum substrate.

由以上可知,本發明之金屬樹脂接合體中之經表面處理之金屬基材與具有環氧丙基之樹脂成形體之間,含氧皮膜之氧與樹脂中之環氧丙基之間產生化學鍵結,推測由於該化學鍵結的作用而發揮提高金屬基材與樹脂成形體之間之接合強度的效果。 From the above, it can be known that a chemical bond is generated between the surface-treated metal substrate in the metal-resin bonded body of the present invention and the resin molded body having an epoxy group, and between the oxygen of the oxygen-containing film and the epoxy group in the resin It is presumed that the effect of improving the bonding strength between the metal substrate and the resin molded body is exerted by the chemical bonding effect.

本發明之金屬樹脂接合體,係將金屬基材之表面以藉由有意地施以使氧含量增加之處理所形成之含有氧之含氧皮膜被覆,又,使用作為熱可塑性組成物之含有具有可與含氧皮膜反應之特定官能基之添加劑化合物的樹脂組成物,藉由此熱可塑性樹脂組成物之射出成形,或者,藉由 將此熱可塑性樹脂組成物之射出成形所得之樹脂成形體之熱壓接,而可於金屬基材表面之含氧皮膜之上將樹脂成形體接合者,不僅可透過含氧皮膜使金屬基材與樹脂成形體強固地接合,亦可長期維持優異之金屬-樹脂間的接合強度者。 The metal-resin bonded body of the present invention is formed by coating the surface of a metal base material with an oxygen-containing oxygen-containing film formed by intentionally applying a treatment for increasing the oxygen content. In addition, it is used as a thermoplastic composition. A resin composition of an additive compound having a specific functional group that can react with an oxygen-containing film is formed by injection molding of the thermoplastic resin composition, or If the resin molded body obtained by injection molding of this thermoplastic resin composition is thermocompression bonded, and the resin molded body can be joined on the oxygen-containing film on the surface of the metal substrate, the metal substrate can not only be passed through the oxygen-containing film Those that are strongly bonded to the resin molded body and can maintain excellent metal-resin bonding strength for a long period of time.

又,藉由本發明之金屬樹脂接合體之製造方法,於金屬基材之表面,藉由有意地施以使氧含量增加之處理以形成含氧皮膜的皮膜形成步驟中,除不會產生氣體等之外,亦可於常溫下操作,於周邊的設備及環境沒有問題,能以簡單之操作且低成本,製造能長期發揮優異之金屬-樹脂間之接合強度的金屬樹脂接合體。 In addition, according to the method for producing a metal-resin bonded body of the present invention, the surface of the metal substrate is subjected to a process of intentionally increasing the oxygen content to form an oxygen-containing film. In addition, it can be operated at normal temperature, and there is no problem in the surrounding equipment and environment. It can be manufactured with simple operation and low cost, and can produce a metal-resin bonded body that can exhibit excellent bonding strength between metal and resin for a long time.

1‧‧‧鋁樹脂接合體 1‧‧‧ aluminum resin joint

2‧‧‧經表面處理之鋁基材 2‧‧‧ Surface-treated aluminum substrate

3‧‧‧PPS成形體(樹脂成形體) 3‧‧‧PPS molded body (resin molded body)

4‧‧‧前端接合部 4‧‧‧ front joint

5‧‧‧針點澆口 5‧‧‧ pin point gate

6‧‧‧冶具 6‧‧‧tool

7‧‧‧荷重 7‧‧‧Load

圖1,係用以說明本發明之實施例1所製作之金屬樹脂接合體之說明圖。 FIG. 1 is an explanatory diagram for explaining a metal-resin joint produced in Example 1 of the present invention.

圖2,係用以說明本發明之實施例1所實施之金屬-樹脂間之接合強度之評價試驗方法之說明圖。 FIG. 2 is an explanatory diagram for explaining a test method for evaluating a joint strength between a metal and a resin implemented in Example 1 of the present invention.

以下,根據實施例及比較例,具體說明本發明之金屬樹脂接合體及其製造方法。 Hereinafter, the metal-resin bonded body of this invention and its manufacturing method are demonstrated concretely based on an Example and a comparative example.

1.於以下之實施例及比較例中,作為前處理所進行之粗面化處理及形成含氧皮膜之皮膜形成處理,係如以下所述。 1. In the following examples and comparative examples, the roughening treatment performed as the pretreatment and the film formation treatment for forming an oxygen-containing film are as follows.

[粗面化處理] [Roughening treatment]

首先,作為前處理,將鋁基材於室溫下以0.5分鐘之條件浸漬於調整為30質量%之硝酸水溶液中,之後,以50℃、0.5分鐘之條件浸漬於調整為5質量%之氫氧化鈉水溶液中,再者,以室溫、0.5分鐘之條件浸漬於調整為30質量%之硝酸水溶液中,接著,將前處理後之鋁基材,以溫度40℃、10分鐘之條件浸漬於濃度調整為20質量%之以酸性氟化銨為主成分之處理液(日本CB化藥製:JCB-3712)中,製作成經粗面化處理之鋁基材。 First, as a pretreatment, an aluminum substrate was immersed in a nitric acid aqueous solution adjusted to 30% by mass at room temperature for 0.5 minutes, and then immersed in hydrogen adjusted to 5% by mass at 50 ° C for 0.5 minutes. The sodium oxide aqueous solution was immersed in a nitric acid aqueous solution adjusted to 30% by mass under the conditions of room temperature and 0.5 minutes, and then the pretreated aluminum substrate was immersed in the temperature of 40 ° C and 10 minutes. A roughened aluminum substrate was prepared from a treatment liquid (Japanese CB Chemical Co., Ltd .: JCB-3712) containing acidic ammonium fluoride as a main component whose concentration was adjusted to 20% by mass.

[含氧皮膜之皮膜形成處理] [Film formation treatment of oxygen-containing film] (1)處理法A(含鋅皮膜之形成) (1) Treatment method A (formation of zinc-containing film)

調製氫氧化鈉濃度100g/L及氧化鋅濃度25g/L(作為Zn2+為20g/L)之含有鋅離子之鈉水溶液(NaOH-Zn2+溶液)作為皮膜形成處理劑。接著,將鋁基材於室溫下浸漬於此含有鋅離子之鈉水溶液中1分鐘(注:比較例1時僅進行5分鐘的浸漬),之後進行水洗,而製作成於表面形成有作為含氧皮膜之含有鋅元素之含鋅皮膜的試驗用之經表面處理之鋁基材。 A zinc ion-containing sodium aqueous solution (NaOH-Zn 2+ solution) having a sodium hydroxide concentration of 100 g / L and a zinc oxide concentration of 25 g / L (20 g / L as Zn 2+ ) was prepared as a film-forming treatment agent. Next, the aluminum substrate was immersed in the aqueous sodium ion solution containing zinc ions at room temperature for 1 minute (Note: only 5 minutes of immersion was performed in Comparative Example 1), and then washed with water to prepare a surface containing Surface-treated aluminum substrate for testing of zinc-containing zinc-containing films of oxygen film.

(2)處理法B(藉熱水之水和氧化物皮膜之形成) (2) Treatment method B (water formation by hot water and oxide film)

將鋁基材浸漬於91~100℃之熱水(純水)中0.5~30分鐘,製作成於表面形成有作為含氧皮膜之以水鋁石 或類水鋁石為主體之水和氧化物皮膜的試驗用之經表面處理之鋁基材。 The aluminum base material is immersed in hot water (pure water) at 91 to 100 ° C for 0.5 to 30 minutes, and is prepared with gibbsite as an oxygen-containing film formed on the surface. Or boehmite-based surface-treated aluminum substrate for testing water and oxide films.

(3)處理法C(藉熱水之水和氧化物皮膜之形成) (3) Treatment method C (the formation of water and oxide film by hot water)

除使用溫度60~80℃之溫水(純水)、浸漬時間更改為1~5分鐘之外,與處理法B(藉熱水之水和氧化物皮膜之形成)同樣地,製作於鋁基材之表面形成有作為含氧皮膜之以非晶質成分為主體之水和氧化物皮膜的試驗用之經表面處理之鋁基材。 Except for using warm water (pure water) with a temperature of 60 to 80 ° C and changing the immersion time to 1 to 5 minutes, it is made on aluminum substrate in the same way as treatment method B (the formation of water and oxide film by hot water). The surface of the material is formed with a surface-treated aluminum substrate for testing the water and oxide film mainly composed of amorphous components as an oxygen-containing film.

(4)處理法D(藉雷射處理之水和氧化物皮膜之形成) (4) Treatment method D (the formation of water and oxide film by laser treatment)

於雷射蝕刻處理(裝置名:米亞基科技/ML-7112A;雷射光波長:1064nm、孔徑:50~60μm、振動方式:Q切換派波、頻率:10kHz)中,對鋁基材之表面以間距寬度50μm間隔朝同一方向進行雷射照射,製作成於鋁基材之表層形成有作為含氧皮膜之氧化物皮膜(Al2O3)的試驗用之經表面處理之鋁基材。 In the laser etching process (device name: Miyaji Technology / ML-7112A; laser light wavelength: 1064nm, aperture: 50 ~ 60μm, vibration mode: Q-switched wave, frequency: 10kHz), the surface of the aluminum substrate Laser irradiation was performed at a pitch width of 50 μm in the same direction, and a surface-treated aluminum substrate was formed on the surface of the aluminum substrate to form an oxide film (Al 2 O 3 ) as an oxygen-containing film.

2.於以下之實施例及比較例中,所使用之樹脂組成物中之樹脂種類及添加劑化合物係如以下所述。 2. In the following examples and comparative examples, the resin types and additive compounds in the resin composition used are as follows.

[樹脂組成物中之樹脂種類] [Type of resin in resin composition]

PPS(1):PPS系樹脂組成物[聚塑膠(股)製商品名:Durafide(註冊商標)RSF-10719;含有後述之添加劑化合物a及b、與後述之無機系填充材料50%]。 PPS (1): PPS-based resin composition [trade name: Durafide (registered trademark) RSF-10719, made of polyplastics (stock); containing additive compounds a and b described later, and inorganic filler 50% described later].

PPS(2):PPS樹脂[(股)Kureha製商品名:Fortron KPS W203A{熔融黏度:30Pa‧s(剪切速度:1216sec-1、310℃)}] PPS (2): PPS resin [(share) Kureha product name: Fortron KPS W203A {melt viscosity: 30Pa‧s (shear speed: 1216sec -1 , 310 ° C)}]

PBT:PBT樹脂[WinTech Polymer(股)製商品名:TRB-CP] PBT: PBT resin [WinTech Polymer (trade name) TRB-CP]

PP:PP系樹脂組成物[(股)Prime Polymer製商品名:R-350G] PP: PP-based resin composition [(share) Product made by Prime Polymer: R-350G]

POM:POM樹脂[使三96.7質量%與1,3-二惡茂烷3.3質量%共聚合所得之聚縮醛共聚物,熔融指數(以190℃、荷重2160g測定):9g/10min] POM: POM resin [Make three Polyacetal copolymer obtained by copolymerizing 96.7% by mass with 3.3% by mass of 1,3-dioxane, melt index (measured at 190 ° C, load 2160g): 9g / 10min]

LCP:芳香族聚酯液晶樹脂[熔點:280℃、熔融黏度(300℃):50.1Pa‧s] LCP: aromatic polyester liquid crystal resin [melting point: 280 ° C, melt viscosity (300 ° C): 50.1Pa‧s]

又,上述之芳香族聚酯液晶樹脂(LCP),係以如下方式所製造者。 The above-mentioned aromatic polyester liquid crystal resin (LCP) was manufactured as follows.

使用具備攪拌機、蒸餾管、氣體導入管、排出孔等之反應器,於反應器內裝填對羥基苯甲酸345重量份(73mol%)、6-羥基-2-萘甲酸175重量份(27mol%)、乙酸鉀0.02重量份、及乙酸酐350重量份,使該反應器以氮充分地置換後,於常壓下使溫度上升至150℃,開始攪拌。以150℃攪拌30分鐘,再慢慢地提升溫度,將副生成之乙酸蒸餾除去。當溫度達300℃之後使反應器內慢慢地減壓,以5Torr(即665Pa)之壓力持續攪拌1小時,於達到目標之攪拌轉矩之時間點,打開反應器下部之排出孔,使用氮壓將所生成之樹脂擠出成股狀取出。將取出之股以製粒 機成形為粒子狀。 A reactor equipped with a stirrer, a distillation tube, a gas introduction tube, and a discharge hole was used to fill the reactor with 345 parts by weight (73 mol%) of p-hydroxybenzoic acid and 175 parts by weight (27 mol%) of 6-hydroxy-2-naphthoic acid. , 0.02 parts by weight of potassium acetate, and 350 parts by weight of acetic anhydride. After the reactor was sufficiently replaced with nitrogen, the temperature was increased to 150 ° C. under normal pressure, and stirring was started. The mixture was stirred at 150 ° C for 30 minutes, and the temperature was gradually increased to distill off by-product acetic acid. When the temperature reaches 300 ° C, the inside of the reactor is gradually depressurized, and stirring is continued for 1 hour at a pressure of 5 Torr (that is, 665Pa). At the time when the target stirring torque is reached, the discharge hole at the lower part of the reactor is opened, and nitrogen is used. The resulting resin was extruded into a strand shape and taken out. The removed strands are granulated The machine is shaped into particles.

[樹脂組成物中之添加劑化合物] [Additive compounds in resin composition]

添加劑化合物a:含環氧丙基之彈性體[日油(股)製商品名:Modiper A4300] Additive compound a: Glycidyl-containing elastomer [Nippon Oil Co., Ltd. trade name: Modiper A4300]

添加劑化合物b:不含官能基之彈性體[達烏化藥日本(股)製商品名:Engage 8440] Additive Compound b: Elastomers without functional groups [Dawu Chemical Pharmaceutical Co., Ltd. product name: Engage 8440]

添加劑化合物c:含環氧丙基之彈性體[住友化學(股)製商品名:BONDFAST 7L] Additive compound c: Glycidyl-containing elastomer [Product name: Sumitomo Chemical Co., Ltd .: BONDFAST 7L]

添加劑化合物d:異氰酸酯化合物[Degussa Japan(股)製商品名:Vestanat T1890/100] Additive compound d: Isocyanate compound [Degussa Japan (trade name): Vestanat T1890 / 100]

添加劑化合物e:環氧系化合物[三菱化學(股)製商品名:Epikote JER1004K] Additive compound e: epoxy-based compound [Mitsubishi Chemical Corporation's product name: Epikote JER1004K]

添加劑化合物f:酯系彈性體[日本Unicar(股)製商品名:NUC-6570] Additive compound f: Ester-based elastomer [trade name: NUC-6570, manufactured by Unicar (Japan)]

添加劑化合物g:二氰二胺[日本Carbide工業(股)製商品名:二氰二胺G] Additive compound g: dicyandiamine [trade name of Carbide Industries (Japan): dicyandiamine G]

添加劑化合物h:碳二醯亞胺化合物[Rhein Chemie Japan(股)製商品名:斯達巴克索魯P400] Additive compound h: carbodiimide compound [Rhein Chemie Japan (stock) trade name: Starbucks Solu P400]

添加劑化合物i:含環氧丙基之彈性體[住友化學(股)製商品名:BONDFAST E] Additive compound i: Glycidyl-containing elastomer [Product name: Sumitomo Chemical Co., Ltd .: BONDFAST E]

3.於以下之實施例及比較例中,鋁基材表面所形成之含氧皮膜之「含氧率」及「皮膜厚度」、與「鋁樹脂接合體之皮膜厚度」,係以如下方式測定。 3. In the following examples and comparative examples, the "oxygen content" and "film thickness" of the oxygen-containing film formed on the surface of the aluminum substrate and the "film thickness of the aluminum resin joint" were measured as follows. .

[含氧皮膜之氧含有率之測定] [Determination of oxygen content of oxygen-containing film]

對鋁樹脂接合體之製造過程所得之經表面處理之鋁基材,使用EPMA(島津製:EPMA1610),以照射徑40μm/step,朝縱橫方向分別實施512step測定對應分析。此處,測定面積為20.48mm×20.48mm,1step之取樣時間為20ms,加速電壓為15kV,氧之深度方向之分解能為3μm以下。接著,由事前製作之檢量線,將所檢測出之氧強度計算出重量百分率(wt%)。又,檢量線,係使用Al2O3標準試樣(氧含有率:48wt%)之氧強度與高純度Al箔之氧強度的2點所計算製作者。 For the surface-treated aluminum substrate obtained in the manufacturing process of the aluminum resin bonded body, EPMA (made by Shimadzu: EPMA1610) was used, and the irradiation diameter was 40 μm / step, and corresponding analysis was performed at 512 steps in the vertical and horizontal directions. Here, the measurement area is 20.48 mm × 20.48 mm, the sampling time for 1 step is 20 ms, the acceleration voltage is 15 kV, and the decomposition energy in the depth direction of oxygen is 3 μm or less. Next, the weight percentage (wt%) of the detected oxygen intensity was calculated from the calibration line prepared beforehand. The calibration curve was calculated by using two points of the oxygen strength of the Al 2 O 3 standard sample (oxygen content rate: 48 wt%) and the oxygen strength of the high-purity Al foil.

[含氧皮膜之皮膜厚度之測定] [Determination of film thickness of oxygen-containing film]

對鋁樹脂接合體、與該鋁樹脂接合體之製造過程所得之經表面處理之鋁基材,分別使用型聚焦離子束加工裝置(FEI公司製:Quanta 3D型),使聚焦離子束對準試樣表面,使表面的原子彈飛以取出觀察部位,並且加工成厚度約100nm的薄膜狀以製作成觀察試樣。觀察,係使用透過電子顯微鏡(TEM)(FEI製:Tecnnai G2 F20 S-TWIN),以加速電壓200kV之條件實施。 For the aluminum resin bonded body and the surface-treated aluminum substrate obtained from the manufacturing process of the aluminum resin bonded body, a focused ion beam processing device (FEI company: Quanta 3D type) was used to align the focused ion beam to the test. The sample surface was made to fly by the atomic bomb on the surface to take out the observation site, and processed into a thin film with a thickness of about 100 nm to make an observation sample. The observation was performed using a transmission electron microscope (TEM) (manufactured by FEI: Tecnnai G2 F20 S-TWIN) at an acceleration voltage of 200 kV.

[實施例1] [Example 1] (1)經表面處理之鋁基材之製作 (1) Production of surface treated aluminum substrate

由市售之鋁板材(A5052;板厚2.0mm)裁切出 50mm×25m大小之鋁基材。接著,藉由上述之處理法A(含鋅皮膜之形成),製作成於表面形成有含有鋅之含氧皮膜的試驗用經表面處理之鋁基材。 Cut from commercially available aluminum sheet (A5052; plate thickness 2.0mm) 50mm × 25m aluminum substrate. Next, by the above-mentioned treatment method A (formation of a zinc-containing film), a test-treated aluminum substrate having an oxygen-containing film containing zinc formed on the surface was prepared.

對所得之經表面處理之鋁基材,進行氧含量測定、氧強度測定、及皮膜厚度測定。 The obtained surface-treated aluminum substrate was subjected to an oxygen content measurement, an oxygen intensity measurement, and a film thickness measurement.

將結果示於表1。 The results are shown in Table 1.

(2)樹脂組成物 (2) Resin composition

作為熱可塑性樹脂組成物,使用表1所示之添加劑化合物a及添加劑化合物b、與無機系充填材料50%之PPS系樹脂組成物[PPS(1)]。該PPS系樹脂組成物[PPS(1)]係熔融黏度為230Pa‧s(310℃、1000s-1)之樹脂組成物。 As the thermoplastic resin composition, the additive compound a and the additive compound b shown in Table 1 and a PPS-based resin composition [PPS (1)] with 50% of the inorganic filler were used. This PPS-based resin composition [PPS (1)] is a resin composition having a melt viscosity of 230 Pa · s (310 ° C, 1000 s -1 ).

(3)鋁樹脂接合體之製作 (3) Production of aluminum resin joints

將以上所得之樹脂組成物導入至射出成形機後,安裝於試驗用之經表面處理之鋁基材射出成形機之模具內,以模具溫度160℃、汽缸溫度320℃、射出速度70mm/s、保持壓力80MPa、保持壓力時間5秒鐘之射出成形條件,進行樹脂之射出成形,製作成圖1所示之試驗用之鋁樹脂接合體1。 After the resin composition obtained above is introduced into an injection molding machine, it is installed in a mold of a surface-treated aluminum substrate injection molding machine for testing, at a mold temperature of 160 ° C, a cylinder temperature of 320 ° C, an injection speed of 70mm / s, The injection molding conditions at a holding pressure of 80 MPa and a holding pressure time of 5 seconds were used to perform injection molding of the resin to produce an aluminum-resin bonded body 1 for testing as shown in FIG. 1.

該鋁樹脂接合體1,係具有厚度2mm之經表面處理之鋁基材2、於前端具有5mm×5mm×10mm大小之前端接合部4,並且該前端接合部4以外之厚度為4mm之鋁樹脂接合體1,係與以前述前端接合部4接合,故具有50mm2的 接合面積,又,於前端接合部4之部分,形成有1.5mmΦ之針點澆口5。 The aluminum resin bonded body 1 is a surface-treated aluminum base material 2 having a thickness of 2 mm, and has a front end bonding portion 4 having a size of 5 mm × 5 mm × 10 mm at the front end, and an aluminum resin having a thickness of 4 mm other than the front end bonding portion 4. The joint body 1 is joined to the front-end joint portion 4 so that the joint body 1 has a joint area of 50 mm 2. A 1.5 mm Φ pinpoint gate 5 is formed on the front-end joint portion 4.

[鋁樹脂接合體之接合強度之評價試驗] [Evaluation test of bonding strength of aluminum resin bonded body]

對此鋁樹脂接合體1,以下述之方法進行此鋁-樹脂間之接合強度之評價試驗。 With respect to this aluminum-resin bonded body 1, an evaluation test of the bonding strength between this aluminum-resin was performed by the following method.

如圖2所示,將鋁樹脂接合體1之經表面處理之鋁基材2固定於冶具6,於PPS成形體3之上端,由其上方以1mm/min之速度施加荷重7,實施破壞經表面處理之鋁基材2與樹脂成形體3之間之接合部分的試驗。之後,對斷裂面之鋁側,以目視判斷判定樹脂凝集破壞率。 As shown in FIG. 2, the surface-treated aluminum base material 2 of the aluminum resin bonded body 1 is fixed to a metal mold 6, and a load 7 is applied from the top of the PPS molded body 3 at a speed of 1 mm / min to implement a warping process. Test of the joint between the surface-treated aluminum substrate 2 and the resin molded body 3. Then, the resin agglomeration failure rate was judged visually on the aluminum side of the fracture surface.

將結果示於表1。 The results are shown in Table 1.

[實施例2~47] [Examples 2 to 47]

關於鋁基材、含氧皮膜之皮膜形成處理、含氧皮膜、樹脂組成物、及樹脂成形條件,係分別如表1~表8所示,與實施例1同樣地進行接合強度的試驗。 The film formation treatment of the aluminum substrate, the oxygen-containing film, the oxygen-containing film, the resin composition, and the resin molding conditions were as shown in Tables 1 to 8, respectively, and the joint strength test was performed in the same manner as in Example 1.

又,實施例29係使用30wt% HNO3溶液,於實施例30中,係使用0.1M之NaOH將熱水的導電率調整成表5所示之數值。 In Example 29, a 30 wt% HNO 3 solution was used. In Example 30, the conductivity of hot water was adjusted to the values shown in Table 5 using 0.1M NaOH.

又,於實施例3、4、12~14、18、23、24、29~34、42、43、45、及46,係使用與實施例1相同之PPS系樹脂組成物[PPS(1)]。又,使用PPS樹脂[PPS(2)]之實施例2中,係於樹脂組成物中添加40質量%之玻璃系填 充材料,又,使用PBT之實施例5~9、15~17、19~22、25~28、35、36、44、及47、以及使用PP之實施例10及11中,係於樹脂組成物中添加30質量%之玻璃系填充材料,再者,使用POM之實施例37~40中,係添加有25質量%之玻璃系填充材料,再者,使用LCP之實施例41中,係添加有50質量%之玻璃系填充材料。 In addition, in Examples 3, 4, 12 to 14, 18, 23, 24, 29 to 34, 42, 43, 45, and 46, the same PPS-based resin composition as in Example 1 was used [PPS (1) ]. Furthermore, in Example 2 using a PPS resin [PPS (2)], a glass-based filler was added to the resin composition in an amount of 40% by mass. Filling materials, Examples 5 to 9, 15 to 17, 19 to 22, 25 to 28, 35, 36, 44, and 47 using PBT, and Examples 10 and 11 using PP are based on resin composition. 30 mass% of the glass-based filler is added to the material, and in Examples 37 to 40 using POM, 25 mass% of the glass-based filler is added, and in Example 41 where LCP is used, the additive is added. 50% by mass of glass-based filler.

又,實施例3及27,作為耐久性評價試驗,係使用與接合強度之評價試驗所使用之鋁-樹脂接合體相同之試驗片,實施下述之冷熱衝擊試驗,評價此冷熱衝擊試驗後之接合強度。 In Examples 3 and 27, as the durability evaluation test, the same test piece as the aluminum-resin joint used in the evaluation test of the bonding strength was used, and the following cold and hot shock test was performed, and the results after the cold and hot shock test were evaluated. Joint strength.

[冷熱衝擊試驗] [Cold and hot shock test]

使用冷熱衝擊試驗機[Espec(股)製],以既定之循環條件進行冷熱衝擊試驗,100循環後取出,與實施例1同樣地進行接合強度之評價試驗,評價耐久性。 A cold and hot impact tester [manufactured by Espec] was used to perform a cold and hot impact test under predetermined cycle conditions, and was taken out after 100 cycles. The joint strength evaluation test was performed in the same manner as in Example 1 to evaluate durability.

上述之循環條件,於實施例3,係以160℃、1.5小時之加熱後、降溫至-40℃冷卻1.5小時、之後再升溫至160℃的加熱-冷卻過成為1循環,又,於實施例27,係以140℃、1.5小時之加熱後、降溫至-40℃冷卻1.5小時、之後再升溫至140℃的加熱-冷卻過成為1循環。 The above-mentioned cycle conditions are in Example 3, after heating at 160 ° C for 1.5 hours, cooling down to -40 ° C for 1.5 hours, and then heating up to 160 ° C for 1 hour. 27. After heating at 140 ° C for 1.5 hours, the temperature was lowered to -40 ° C for 1.5 hours, and then the temperature was increased to 140 ° C for 1 hour.

將結果示於表1~表8。 The results are shown in Tables 1 to 8.

[比較例1~18] [Comparative Examples 1 to 18]

關於鋁基材、含氧皮膜之皮膜形成處理、含氧皮膜、 樹脂組成物、及樹脂成形條件,係分別如表9~表11所示,與實施例1同樣地進行接合強度的評價試驗。 Film formation treatment of aluminum substrate, oxygen-containing film, oxygen-containing film, The resin composition and the resin molding conditions are shown in Tables 9 to 11, respectively, and the joint strength evaluation test was performed in the same manner as in Example 1.

又,比較例4及7~10,係使用與實施例1相同之PPS系樹脂組成物[PPS(1)]。又,使用PPS樹脂[PPS(2)]之比較例1、11、17及18中,係於樹脂組成物中添加40質量%之玻璃系填充材料,又,使用PBT之比較例2、5、12及16、以及使用PP之比較例3、6及15中,係於樹脂組成物中添加30質量%之玻璃系填充材料,再者,使用POM之比較例13中,係添加有25質量%之玻璃系填充材料,再者,使用LCP之比較例14中,係添加有30質量%之玻璃系填充材料。 In Comparative Examples 4 and 7 to 10, the same PPS-based resin composition [PPS (1)] as in Example 1 was used. In Comparative Examples 1, 11, 17, and 18 using PPS resin [PPS (2)], 40% by mass of a glass-based filler was added to the resin composition, and Comparative Examples 2, 5, and PBT were used. In 12 and 16, and in Comparative Examples 3, 6, and 15 using PP, 30% by mass of a glass-based filler was added to the resin composition, and in Comparative Example 13 using POM, 25% by mass was added. The glass-based filler was 30% by mass of the glass-based filler in Comparative Example 14 using LCP.

又,於比較例4~6中,未進行作為前處理之粗面化處理與形成含氧皮膜之皮膜形成處理(表面處理),又,關於比較例9及10,未進行形成含氧皮膜之皮膜形成處理(表面處理),分別使用鋁基材,除此之外,與上述之實施例同樣地製作鋁樹脂接合體,與實施例1同樣地進行接合強度之評價試驗。 In Comparative Examples 4 to 6, the roughening treatment as the pretreatment and the film formation treatment (surface treatment) for forming an oxygen-containing film were not performed, and for Comparative Examples 9 and 10, the formation of an oxygen-containing film was not performed. In the film formation treatment (surface treatment), except that an aluminum substrate was used, an aluminum resin bonded body was produced in the same manner as in the above-mentioned Example, and an evaluation test of the bonding strength was performed in the same manner as in Example 1.

又,比較例7、8中,係使用0.1M之NaOH水將熱水之導電率調整為表10所示之數值。 In Comparative Examples 7 and 8, the conductivity of hot water was adjusted to the values shown in Table 10 using 0.1M NaOH water.

將結果示於表9~表11。 The results are shown in Tables 9 to 11.

[含氧皮膜之皮膜形成處理之參考例] [Reference Example of Film Formation Process of Oxygen-containing Film]

對與實施例1相同之鋁基材,使用導電率25mS/m之自來水,以95℃ 1分鐘之條件以熱水進行皮膜形成處理。 The same aluminum substrate as in Example 1 was subjected to a film formation treatment using hot water at a temperature of 95 ° C. for 1 minute using tap water having a conductivity of 25 mS / m.

結果,鋁基材表面所形成之含氧皮膜,其之厚度雖有偏差但不超過0.02~0.05μm。 As a result, the thickness of the oxygen-containing film formed on the surface of the aluminum substrate does not exceed 0.02 to 0.05 μm, although the thickness varies.

[產業上之可利用性] [Industrial availability]

本發明之金屬樹脂接合體,由於耐久試驗之前後中皆具有優異之接合強度,故可利用於汽車之各種感測零件、家庭電化製品零件、產業機器零件等各種零件的製造。 The metal-resin bonded body of the present invention has excellent bonding strength before and after the endurance test. Therefore, the metal-resin bonded body can be used for manufacturing various parts such as automotive sensing parts, household electrical parts, and industrial machine parts.

Claims (21)

一種金屬樹脂接合體,其特徵係具有:由金屬所成之金屬基材、於此金屬基材之表面藉由有意地施以使氧含量增加之處理所形成之含有氧之含氧皮膜、與接合於此含氧皮膜之上且以熱可塑性樹脂組成物所形成的樹脂成形體,前述熱可塑性樹脂組成物,係含有具有可與前述含氧皮膜反應之官能基的添加劑化合物,前述添加劑化合物係具有選自羧基及其鹽及其酯、環氧基、環氧丙基、異氰酸酯基、碳二醯亞胺基、胺基及其鹽、以及酸酐基及其酯所構成群中之至少1種的官能基,前述添加劑化合物之官能基,於熱可塑性樹脂組成物中係以0.5~150μmol/g的比例含有。A metal-resin joint comprising: a metal substrate made of a metal; an oxygen-containing oxygen-containing film formed on a surface of the metal substrate by intentionally applying a treatment for increasing an oxygen content; and A resin molded body formed of a thermoplastic resin composition bonded to the oxygen-containing film, the thermoplastic resin composition contains an additive compound having a functional group capable of reacting with the oxygen-containing film, and the additive compound is It has at least one selected from the group consisting of a carboxyl group and a salt thereof, an epoxy group, an epoxy propyl group, an isocyanate group, a carbodiimide group, an amine group and a salt thereof, and an acid anhydride group and an ester thereof. The functional group, the functional group of the aforementioned additive compound, is contained in the thermoplastic resin composition at a ratio of 0.5 to 150 μmol / g. 如請求項1之金屬樹脂接合體,其中,前述添加劑化合物係含有來自α-烯烴之構成單位與來自α,β-不飽和酸之環氧丙酯之構成單位所成的烯烴系共聚物。The metal-resin bonded body according to claim 1, wherein the additive compound is an olefin-based copolymer comprising a constituent unit derived from an α-olefin and a constituent unit derived from an propylene oxide of an α, β-unsaturated acid. 如請求項1之金屬樹脂接合體,其中,前述添加劑化合物係含有來自(甲基)丙烯酸酯之構成單位的烯烴系共聚物。The metal-resin bonded body according to claim 1, wherein the additive compound is an olefin-based copolymer containing a constituent unit derived from a (meth) acrylate. 如請求項1之金屬樹脂接合體,其中,於樹脂成形體接合前之表面具有含氧皮膜之金屬基材係由其最表面至深度3μm為止的表層中,以EPMA所測定之氧含有率為0.1~50重量%的範圍內。For example, the metal-resin bonded body of claim 1, wherein the metal substrate having an oxygen-containing film on the surface before the resin molded body is bonded is a surface layer from the outermost surface to a depth of 3 μm, and the oxygen content rate measured by EPMA is Within the range of 0.1 to 50% by weight. 如請求項1之金屬樹脂接合體,其中,於含氧皮膜之上接合樹脂成形體的方法係藉由射出成形或熱壓接之方法。The metal-resin bonded body according to claim 1, wherein the method of bonding the resin molded body to the oxygen-containing film is a method of injection molding or thermocompression bonding. 如請求項1之金屬樹脂接合體,其中,形成有含氧皮膜之金屬基材係由鋁或鋁合金所構成之鋁基材。The metal-resin bonded body according to claim 1, wherein the metal substrate on which the oxygen-containing film is formed is an aluminum substrate composed of aluminum or an aluminum alloy. 如請求項1之金屬樹脂接合體,其中,以皮膜形成處理所得之氧化物皮膜係厚度為0.06μm以上2μm以下之氧化物皮膜。The metal-resin bonded body according to claim 1, wherein the oxide film obtained by the film formation treatment is an oxide film having a thickness of 0.06 μm or more and 2 μm or less. 如請求項1之金屬樹脂接合體,其中,含氧皮膜係以使用含有鋅離子之鹼水溶液之皮膜形成處理所得之含有鋅元素之含鋅皮膜。The metal-resin bonded body according to claim 1, wherein the oxygen-containing film is a zinc-containing film containing zinc element obtained by a film-forming treatment using an alkaline aqueous solution containing zinc ions. 如請求項1之金屬樹脂接合體,其中,含氧皮膜係以使用導電率為0.01mS/m以上20mS/m以下之91℃以上100℃以下之熱水之皮膜形成處理所形成且厚度為0.1μm以上1μm以下之水合氧化物皮膜。For example, the metal-resin joint of claim 1, wherein the oxygen-containing film is formed by a film forming process using hot water having a conductivity of 0.01 mS / m or more and 20 mS / m or less and 91 ° C or more and 100 ° C or less, and the thickness is 0.1. A hydrated oxide film having a thickness of 1 μm or more and 1 μm or less. 如請求項1之金屬樹脂接合體,其中,含氧皮膜係以使用導電率為0.01mS/m以上20mS/m以下之60℃以上90℃以下之溫水之皮膜形成處理所形成之厚度為0.1μm以上1μm以下之水合氧化物皮膜。For example, the metal-resin joint of claim 1, wherein the thickness of the oxygen-containing film is 0.1 by a film forming treatment using warm water having a conductivity of 0.01 mS / m to 20 mS / m and a temperature of 60 ° C to 90 ° C. A hydrated oxide film having a thickness of 1 μm or more and 1 μm or less. 如請求項1之金屬樹脂接合體,其中,含氧皮膜係以對鋁基材之表面施以雷射處理之皮膜形成處理所得之氧化物皮膜。The metal-resin bonded body according to claim 1, wherein the oxygen-containing film is an oxide film obtained by subjecting a surface of an aluminum substrate to a laser film-forming treatment. 如請求項1~11中任一項之金屬樹脂接合體,其中,構成熱可塑性樹脂組成物之熱可塑性樹脂係選自聚芳硫醚系樹脂、聚酯系樹脂、聚碳酸酯系樹脂、聚縮醛系樹脂、聚醚系樹脂、聚二苯醚系樹脂、聚醯亞胺系樹脂、聚醚醯亞胺系樹脂、液晶聚合物、碸系樹脂、聚苯醚系樹脂、聚醯胺系樹脂、及聚丙烯系樹脂所構成之群中之任1種或2種以上之樹脂。The metal resin joined body according to any one of claims 1 to 11, wherein the thermoplastic resin constituting the thermoplastic resin composition is selected from the group consisting of polyarylene sulfide resin, polyester resin, polycarbonate resin, and Acetal-based resin, polyether-based resin, polydiphenylene-based resin, polyfluorene-based resin, polyether-fluorine-based resin, liquid crystal polymer, fluorene-based resin, polyphenylene-ether-based resin, polyfluorene-based resin Resin and any one or more resins in the group consisting of polypropylene resin. 一種金屬樹脂接合體之製造方法,其係具有下述步驟:於由金屬所成之金屬基材之表面藉由有意地施以使氧含量增加之處理以形成含氧皮膜之皮膜形成步驟、與於以此皮膜形成步驟所得之經表面處理之金屬基材之含氧皮膜之上,藉由熱可塑性樹脂組成物之射出成形以形成樹脂成形體之樹脂成形步驟,其係透過前述含氧皮膜以製造金屬基材與樹脂成形體接合之金屬樹脂接合體之金屬樹脂接合體之製造方法,前述熱可塑性樹脂組成物係含有具有可與含氧皮膜反應之官能基的添加劑化合物,前述添加劑化合物係具有選自羧基及其鹽及其酯、環氧基、環氧丙基、異氰酸酯基、碳二醯亞胺基、胺基及其鹽、以及酸酐基及其酯所構成群中之至少1種的官能基,於前述熱可塑性樹脂組成物中,前述添加劑化合物之官能基係以成為0.5~150μmol/g的比例添加。A method for producing a metal-resin bonded body, comprising the steps of: a film forming step for forming an oxygen-containing film by intentionally applying a treatment for increasing an oxygen content on a surface of a metal substrate made of a metal; and The resin forming step of forming a resin molded body by injection molding of a thermoplastic resin composition on the oxygen-containing film of the surface-treated metal substrate obtained in this film-forming step is performed through the aforementioned oxygen-containing film to A method for producing a metal-resin bonded body of a metal-resin bonded body in which a metal substrate and a resin molded body are manufactured, the thermoplastic resin composition contains an additive compound having a functional group capable of reacting with an oxygen-containing film, and the additive compound has At least one selected from the group consisting of a carboxyl group and a salt thereof, an epoxy group, an epoxy group, an isocyanate group, a carbodiimide group, an amine group and a salt thereof, and an acid anhydride group and an ester thereof; The functional group is added to the thermoplastic resin composition, and the functional group of the additive compound is added at a ratio of 0.5 to 150 μmol / g. 如請求項13之金屬樹脂接合體之製造方法,其中,形成有含氧皮膜之金屬基材係由鋁或鋁合金所構成之鋁基材。The method for producing a metal-resin joint according to claim 13, wherein the metal substrate on which the oxygen-containing film is formed is an aluminum substrate composed of aluminum or an aluminum alloy. 如請求項14之金屬樹脂接合體之製造方法,其中,皮膜形成步驟係藉由將鋁基材浸漬於以重量比(MOH/Zn2+)1~100之比例含有氫氧化鹼(MOH)與鋅離子(Zn2+)之含鋅離子之鹼水溶液中的皮膜形成處理,而於此鋁基材之表面形成含有鋅元素之含鋅皮膜。The method for manufacturing a metal-resin joint according to claim 14, wherein the film formation step is performed by immersing the aluminum substrate in a ratio of 1 to 100 by weight (MOH / Zn 2+ ) containing alkali hydroxide (MOH) and The film formation treatment of the zinc ion (Zn 2+ ) -containing alkaline aqueous solution containing zinc ions, and a zinc-containing film containing zinc element is formed on the surface of the aluminum substrate. 如請求項15之金屬樹脂接合體之製造方法,其中,含鋅離子之鹼水溶液中之鹼源係選自氫氧化鈉、氫氧化鉀、及氫氧化鋰所構成之群中之任1種或2種以上的氫氧化鹼。The method for producing a metal resin joined body according to claim 15, wherein the alkali source in the alkali aqueous solution containing zinc ions is any one selected from the group consisting of sodium hydroxide, potassium hydroxide, and lithium hydroxide, or Two or more types of alkali hydroxide. 如請求項15之金屬樹脂接合體之製造方法,其中,含鋅離子之鹼水溶液中之鋅離子源係選自氧化鋅、氫氧化鋅、過氧化鋅、氯化鋅、硫酸鋅、及硝酸鋅所構成之群中之任1種或2種以上的鋅鹽。The method for producing a metal resin joint according to claim 15, wherein the source of zinc ions in the aqueous alkali solution containing zinc ions is selected from the group consisting of zinc oxide, zinc hydroxide, zinc peroxide, zinc chloride, zinc sulfate, and zinc nitrate. Any one or more zinc salts in the group. 如請求項14項之金屬樹脂接合體之製造方法,其中,皮膜形成步驟係於鋁基材之表面,藉由使用導電率為0.01mS/m以上20mS/m以下之91℃以上100℃以下之熱水之皮膜形成處理,而形成厚度為0.1μm以上1μm以下之水合氧化物皮膜。For example, the method for manufacturing a metal-resin joint according to item 14, wherein the film formation step is performed on the surface of the aluminum substrate, and the electrical conductivity is from 0.01 mS / m to 20 mS / m to 91 ° C to 100 ° C. A film forming treatment of hot water forms a hydrated oxide film having a thickness of 0.1 μm to 1 μm. 如請求項14之金屬樹脂接合體之製造方法,其中,皮膜形成步驟係於鋁基材之表面,藉由使用導電率為0.01mS/m以上20mS/m以下之60℃以上90℃以下之溫水之皮膜形成處理,形成厚度為0.1μm以上1μm以下之水合氧化物皮膜。For example, the method for manufacturing a metal-resin joint according to claim 14, wherein the film formation step is performed on the surface of the aluminum substrate, and a temperature of 60 ° C to 90 ° C is used when the conductivity is 0.01 mS / m or more and 20 mS / m or less The film formation treatment of water forms a hydrated oxide film having a thickness of 0.1 μm to 1 μm. 如請求項14之金屬樹脂接合體之製造方法,其中,皮膜形成步驟係藉由施以加熱鋁基材之表面附近之雷射處理的皮膜形成處理,而形成氧化物皮膜。The method for manufacturing a metal-resin bonded body according to claim 14, wherein the film formation step is to form an oxide film by applying a film formation treatment to heat a laser treatment near the surface of the aluminum substrate. 如請求項13~20中任一項之金屬樹脂接合體之製造方法,其中,構成熱可塑性樹脂組成物之熱可塑性樹脂係選自聚芳硫醚系樹脂、聚酯系樹脂、聚碳酸酯系樹脂、聚縮醛系樹脂、聚醚系樹脂、聚二苯醚系樹脂、聚醯亞胺系樹脂、聚醚醯亞胺系樹脂、液晶聚合物、碸系樹脂、聚苯醚系樹脂、聚醯胺系樹脂、及聚丙烯系樹脂所構成之群中之任1種或2種以上之樹脂。The method for producing a metal resin joint according to any one of claims 13 to 20, wherein the thermoplastic resin constituting the thermoplastic resin composition is selected from the group consisting of polyarylene sulfide resin, polyester resin, and polycarbonate resin. Resins, polyacetal resins, polyether resins, polydiphenyl ether resins, polyimide resins, polyether imine resins, liquid crystal polymers, ammonium resins, polyphenylene ether resins, poly Any one or two or more resins in the group consisting of a fluorene-based resin and a polypropylene-based resin.
TW103111246A 2013-03-26 2014-03-26 Metal resin joint body and its manufacturing method TWI630101B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013065268 2013-03-26
JP2013-065268 2013-03-26

Publications (2)

Publication Number Publication Date
TW201504036A TW201504036A (en) 2015-02-01
TWI630101B true TWI630101B (en) 2018-07-21

Family

ID=51624254

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103111246A TWI630101B (en) 2013-03-26 2014-03-26 Metal resin joint body and its manufacturing method

Country Status (5)

Country Link
JP (1) JP6017675B2 (en)
KR (1) KR102016783B1 (en)
CN (1) CN105073375B (en)
TW (1) TWI630101B (en)
WO (1) WO2014157289A1 (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6077248B2 (en) * 2012-09-21 2017-02-08 株式会社Uacj Surface-treated aluminum material and method for producing the same
JP5945650B1 (en) * 2014-09-11 2016-07-05 オリンパス株式会社 Insert molded product, apparatus using the insert molded product, and method of manufacturing the insert molded product
JP6476081B2 (en) * 2015-06-26 2019-02-27 株式会社豊田中央研究所 Metal resin bonding member and method for manufacturing the same
JP6384411B2 (en) * 2015-06-29 2018-09-05 マツダ株式会社 Method of joining metal member and resin member, and metal member used in the method
JP6621694B2 (en) * 2016-03-25 2019-12-18 株式会社神戸製鋼所 Surface-treated steel sheet for bonding polyolefin resin and composite member using the same
JP6315017B2 (en) * 2016-03-29 2018-04-25 マツダ株式会社 Method of joining metal member and resin member
JP6810538B2 (en) * 2016-06-03 2021-01-06 三井化学株式会社 Method for manufacturing surface roughened metal member and method for manufacturing metal / resin composite structure
JP6803155B2 (en) * 2016-06-03 2020-12-23 三井化学株式会社 Method for manufacturing surface roughened metal member and method for manufacturing metal / resin composite structure
KR101707789B1 (en) * 2017-01-20 2017-02-20 주식회사 우신엠에스 Apparatus for manufacturing light emitting metal knob
JP2018144475A (en) * 2017-03-03 2018-09-20 三井化学株式会社 Aluminum-based metal/resin composite structure, aluminum-based metallic member, production method of aluminum-based metallic member and production method of aluminum-based metal/resin composition structure
JP6351902B1 (en) * 2017-09-26 2018-07-04 住友理工株式会社 Manufacturing method of composite member
CN111344428B (en) 2017-11-16 2022-08-16 睦月电机株式会社 Metal member, method for producing metal member, metal-resin bonded body, and method for producing metal-resin bonded body
CN111565906B (en) * 2017-12-28 2022-08-23 株式会社电装 Resin molded article and method for producing same
JP6837580B2 (en) * 2018-05-18 2021-03-03 ポリプラスチックス株式会社 Powdered liquid crystal resin for hot press molded products and hot press molded products
JP6568983B2 (en) * 2018-06-05 2019-08-28 住友理工株式会社 Manufacturing method of composite member
US20200070269A1 (en) * 2018-08-30 2020-03-05 GM Global Technology Operations LLC Laser-induced anti-corrosion micro-anchor structural layer for metal-polymeric composite joint and methods of manufacturing thereof
KR20210035293A (en) * 2018-10-12 2021-03-31 디아이씨 가부시끼가이샤 Metal resin composite and its manufacturing method
WO2020158820A1 (en) * 2019-01-29 2020-08-06 三井化学株式会社 Aluminum-based metal-resin composite structure, aluminum-based metal member, method for manufacturing aluminum-based metal member, and method for manufacturing aluminum-based metal-resin composite structure
WO2020183747A1 (en) * 2019-03-08 2020-09-17 睦月電機株式会社 Method for producing synthetic resin molded body, and method for producing metal resin joined body
WO2020218277A1 (en) * 2019-04-22 2020-10-29 三井化学株式会社 Electronic equipment housing, method for manufacturing same, and metal-resin composite
JP2021004377A (en) * 2019-06-25 2021-01-14 本田技研工業株式会社 Manufacturing method of aluminum member and aluminum member
JP7070804B2 (en) * 2019-12-27 2022-05-18 Dic株式会社 Composite structure and its manufacturing method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100173125A1 (en) * 2008-11-19 2010-07-08 Lanxess Deutschland Gmbh Lightweight component of hybrid design

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2702814B2 (en) 1990-03-09 1998-01-26 ポリプラスチックス株式会社 Molded product with metal inserted
JPH0551671A (en) 1991-08-21 1993-03-02 Nikko Kyodo Co Ltd High-strength and high-conductivity copper alloy for electronic equipment excellent in bendability and stress relaxation property
JP3016331B2 (en) 1993-09-07 2000-03-06 富士通株式会社 Manufacturing method of electronic equipment housing
CA2250136C (en) * 1996-03-27 2005-01-18 Toyo Kohan Co., Ltd. Thermoplastic resin-coated aluminum alloy plate and process and apparatus for producing the same
JP2003103562A (en) 2001-09-28 2003-04-09 Toray Ind Inc Manufacturing method for metal insert resin joined molded article, and manufacturing method for pressure gauge having metal insert resin joined molded article
JP3954379B2 (en) 2001-12-28 2007-08-08 大成プラス株式会社 Aluminum alloy-resin composite and its manufacturing method
JP4270444B2 (en) 2003-10-14 2009-06-03 大成プラス株式会社 Aluminum alloy / resin composite and method for producing the same
US20100304083A1 (en) * 2006-12-22 2010-12-02 Taisei Plas Co., Ltd. Composite of metal and resin and method for manufacturing the same
JP5058593B2 (en) 2006-12-28 2012-10-24 Ykk株式会社 Method for producing composite of metal and resin
EP2221398B1 (en) * 2007-12-14 2016-10-19 Toadenka Corporation Resin-metal bonded body and method for producing the same
WO2009139450A1 (en) 2008-05-13 2009-11-19 住友化学株式会社 Alumina composite material
JPWO2009151099A1 (en) 2008-06-12 2011-11-17 日本軽金属株式会社 Aluminum / resin injection integrated molded product and its manufacturing method
JP5381687B2 (en) 2008-12-29 2014-01-08 日本軽金属株式会社 Aluminum alloy member excellent in resin bondability and manufacturing method thereof
JP2011076887A (en) * 2009-09-30 2011-04-14 Toppan Printing Co Ltd Packaging material for lithium ion battery
JP4930565B2 (en) * 2009-09-30 2012-05-16 ブラザー工業株式会社 Developer container and image forming apparatus
JP5499741B2 (en) * 2010-02-04 2014-05-21 三菱樹脂株式会社 Resin / metal laminate, resin / metal composite injection molded body, and method for producing the same
JP5501026B2 (en) 2010-02-22 2014-05-21 日新製鋼株式会社 Composite in which stainless steel plate and thermoplastic resin composition are joined, and method for producing the same
JP5423468B2 (en) * 2010-02-23 2014-02-19 オムロン株式会社 Anomaly analyzer and control method of anomaly analyzer
JP2011173353A (en) * 2010-02-25 2011-09-08 Toray Ind Inc Composite structure
JP5622785B2 (en) * 2011-04-21 2014-11-12 大成プラス株式会社 Aluminum alloy-resin composite and method for producing the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100173125A1 (en) * 2008-11-19 2010-07-08 Lanxess Deutschland Gmbh Lightweight component of hybrid design

Also Published As

Publication number Publication date
WO2014157289A1 (en) 2014-10-02
TW201504036A (en) 2015-02-01
CN105073375A (en) 2015-11-18
CN105073375B (en) 2018-01-05
JPWO2014157289A1 (en) 2017-02-16
JP6017675B2 (en) 2016-11-02
KR102016783B1 (en) 2019-08-30
KR20150134384A (en) 2015-12-01

Similar Documents

Publication Publication Date Title
TWI630101B (en) Metal resin joint body and its manufacturing method
JP4927871B2 (en) Metal-resin composite and method for producing the composite
JP5055288B2 (en) Metal-resin composite and method for producing the same
JP6387301B2 (en) Aluminum resin bonded body and manufacturing method thereof
JP6004046B2 (en) Manufacturing method of aluminum resin joined body
EP2174766B1 (en) Composite of metal with resin and process for producing the same
JP6503936B2 (en) Metal-resin composite molded article and method for producing the same
KR101115786B1 (en) Process for production of highly corrosion-resistant composite
JP4965649B2 (en) Copper alloy composite and manufacturing method thereof
US20110165342A1 (en) Process for producing composite of metal and resin
JP2011174133A (en) Method for manufacturing surface-roughened stainless steel sheet, composite formed of stainless steel sheet joined with molding of thermoplastic resin composition, and method for manufacturing the same
JP2012157991A (en) Metal-resin composite and production process thereof
TW201144075A (en) Aluminum/resin/copper composite article, its manufacturing method, and lid member for sealed battery
KR102471455B1 (en) Plastic Overmolding Methods and Plastic-Metal Hybrid Components on Metal Surfaces
JP2017500228A (en) Portable electronic device parts
JP2008131005A (en) Structure for electrical and electronic components having terminals, and method of manufacturing the same
WO2016047454A1 (en) Heat exchanger
JP2006305838A (en) Resin composite and its manufacturing method