TWI629928B - Heat dissipating system and operating method thereof - Google Patents

Heat dissipating system and operating method thereof Download PDF

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Publication number
TWI629928B
TWI629928B TW106127308A TW106127308A TWI629928B TW I629928 B TWI629928 B TW I629928B TW 106127308 A TW106127308 A TW 106127308A TW 106127308 A TW106127308 A TW 106127308A TW I629928 B TWI629928 B TW I629928B
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Taiwan
Prior art keywords
driving
current value
piezoelectric sheet
heat dissipation
piezoelectric
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Application number
TW106127308A
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Chinese (zh)
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TW201912002A (en
Inventor
蘇献欽
王岩
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蘇献欽
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Publication of TWI629928B publication Critical patent/TWI629928B/en
Publication of TW201912002A publication Critical patent/TW201912002A/en

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Abstract

A heat dissipation system includes a driving chip and a heat sink electrically connected to the driving wafer. The heat sink includes a carrier and a swinging structure. The oscillating structure includes a piezoelectric piece and a blade attached to one end of the piezoelectric piece, and the other end of the piezoelectric piece is fixed to the carrier. The driving chip can perform a test function to sequentially transmit a plurality of test signals of different frequencies to the piezoelectric piece, and measure the current value in the piezoelectric piece corresponding to each test signal. The highest current value among the plurality of current values is defined as the operating current value, and the test signal corresponding to the operating current value is defined as the driving signal. The driving wafer can perform a driving function to continuously transmit a driving signal to the piezoelectric piece, causing the piezoelectric piece to oscillate and synchronously driving the blade to oscillate. In addition, the present invention further discloses a method of operating a heat dissipation system.

Description

Heat dissipation system and its operation method

The invention relates to a heat dissipation system, in particular to a heat dissipation system for dissipating heat by blade oscillation and a method for operating the same.

The inventors previously proposed a heat sink (Taiwan No. M529149) which is capable of achieving rapid heat dissipation through the oscillation of the blade. However, how to improve the above-mentioned heat dissipating device, thereby more effectively improving the heat dissipating effect of the heat dissipating device, has become one of the objects that the inventors intend to perfect.

Accordingly, the inventors believe that the above-mentioned defects can be improved, and that the invention has been studied with great interest and with the use of scientific principles, and finally proposes a present invention which is rational in design and effective in improving the above-mentioned defects.

The embodiment of the invention provides a heat dissipation system and a method for operating the same, which can effectively improve the defects that may occur in the existing heat dissipation device.

The embodiment of the invention discloses a heat dissipation system comprising: a driving chip capable of selectively performing a testing function and a driving function; and a heat dissipating device comprising: a carrier; and at least one swinging structure comprising a piezoelectric piece And a blade mounted on the piezoelectric sheet, the piezoelectric sheet has a fixed end and a swing end, the fixed end of the piezoelectric piece is fixed to the carrier, and the blade is connected to the The oscillating end of the piezoelectric sheet, and the blade includes a free end remote from the oscillating end; wherein the driving wafer is capable of performing the test function to sequentially transmit a plurality of test signals of different frequencies to the a piezoelectric piece, and measuring each test signal Corresponding a current value in the piezoelectric sheet; wherein a highest one of the plurality of current values is defined as an operating current value, and a test signal corresponding to the operating current value is defined as a driving signal Wherein the driving chip is capable of performing the driving function to continuously transmit the driving signal to the piezoelectric sheet, so that the piezoelectric sheet generates a period of the swing end by driving the driving signal The reciprocating swing of the nature causes the free end of the blade to simultaneously oscillate.

The embodiment of the invention also discloses a method for operating a heat dissipation system, comprising: providing a heat dissipation device and a driving chip electrically connected to the heat dissipation device; wherein the heat dissipation device comprises a carrier and is mounted on the carrier a piezoelectric sheet, and a blade mounted on the piezoelectric sheet; performing a test function on the driving wafer to sequentially transmit a plurality of test signals of different frequencies to the piezoelectric sheet, and measuring each a current value in the piezoelectric sheet corresponding to the test signal; wherein, a test signal corresponding to a highest one of the plurality of current values is defined as a driving signal; and The wafer performs a driving function to continuously transmit the driving signal to the piezoelectric sheet, causing the piezoelectric sheet to generate a periodic reciprocating oscillation by driving of the driving signal to synchronously drive the blade to swing.

In summary, the heat dissipation system and the operation method thereof disclosed in the embodiments of the present invention can learn the current frequency that can resonate with the blades of the heat dissipation device by performing the test function, thereby enabling the drive wafer to perform the driving function. The current (drive signal) that resonates with the blades is input, thereby effectively improving the heat dissipation effect of the heat sink.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying claims limit.

1000‧‧‧heating system

100‧‧‧heating device

1‧‧‧ Carrier

11‧‧‧Upper end

12‧‧‧ lower end

13‧‧‧fixed slot

14‧‧‧Lock hole

2‧‧‧ swing structure

21‧‧‧ Piezo Pieces

211‧‧‧ fixed end

212‧‧‧Swing end

22‧‧‧ blades

221‧‧‧Free end

222‧‧‧Installation end

200‧‧‧ drive chip

201‧‧‧Control Module

2011‧‧‧ storage unit

202‧‧‧Power supply module

203‧‧‧Feedback module

P‧‧‧Power supply

1 is a functional block diagram of a heat dissipation system of the present invention.

2 is a perspective view of a heat dissipation device of a heat dissipation system of the present invention.

Figure 3 is an exploded perspective view of Figure 2.

Figure 4 is a schematic view of the operation of Figure 2.

FIG. 5 is another schematic diagram of the operation of FIG. 2.

Fig. 6 is a schematic view showing the oscillating end of the piezoelectric piece of the heat dissipating device of the present invention partially embedded in the mounting end portion of the blade.

Fig. 7 is a schematic view showing the blade of the heat sink of the present invention attached to the side of the swing end of the piezoelectric sheet.

Figure 8 is a schematic view of the two swinging structures of the heat sink of the present invention mounted on a carrier.

FIG. 9 is a schematic view showing the two swinging structures of the heat dissipating device of the present invention respectively mounted on corresponding bearing members.

Please refer to FIG. 1 to FIG. 9 for an embodiment of the present invention. It should be noted that the related embodiments of the present invention are only used to specifically describe the embodiments of the present invention, so that It is to be understood that the scope of the invention is not intended to limit the scope of the invention.

Referring to FIG. 1 and FIG. 2 , the present embodiment discloses a heat dissipation system 1000 including a heat dissipation device 100 and a driving chip 200 electrically connected to the heat dissipation device 100 , and the driving chip 200 is configured to receive a power source P and A test function and a driving function can be selectively performed, but the driving chip 200 of the present invention is not limited to receiving the above-described power source P.

It should be noted that, in this embodiment, the driving die 200 is electrically connected to the single heat sink 100, but the invention is not limited thereto, that is, the driving chip 200 may be electrically connected to the plurality of heat sinks. 100. Hereinafter, the configuration of the heat sink 100 will be described first, and then the connection relationship between the drive wafer 200 and the heat sink 100 will be described.

As shown in FIG. 2 to FIG. 3 , the heat dissipation device 100 includes a carrier 1 and a swing structure 2 . The swinging structure 2 is mounted on the carrier 1 .

The carrier 1 is of a configuration suitable for manufacturing by injection molding, and the carrier 1 has an upper end portion 11 and a lower end portion 12. The upper end portion 11 is recessed to form a fixing groove 13 for fixing a one-piece member (for example, the piezoelectric sheet 21), and the lower end portion 12 is recessed to form a locking hole 14, thereby the carrier member is 1 can be fixed to any position of an electronic device (especially a position requiring heat dissipation) through a locking hole 14 via a screw (not shown). Furthermore, the locking hole 14 can be a blind hole or a through hole.

The oscillating structure 2 includes a piezoelectric sheet 21 and a blade 22 mounted on the piezoelectric sheet 21.

The piezoelectric sheet 21 is made of a piezoelectric material (for example, at least one of a piezoelectric single crystal, a piezoelectric polycrystal, a piezoelectric polymer, and a piezoelectric composite). The piezoelectric piece 21 has a fixed end 211 and a swing end 212, and the fixed end 211 of the piezoelectric piece 21 is fixed in the fixing groove 13 of the carrier 1 by the snapping manner, but the present invention does not Limited by this. Further, the piezoelectric sheet 21 is electrically connected to the driving wafer 200 (eg, FIG. 1), and the piezoelectric sheet 21 can transmit a driving signal outputted by the driving wafer 200 according to an inverse piezoelectric effect. The drive signal is converted to a mechanical energy to produce a mechanical swing. Since the fixed end 211 of the piezoelectric piece 21 is fixed in the fixing groove 13 of the carrier 1, the piezoelectric piece 21 is mainly oscillated through the swing end 212 thereof.

The blade 22 is a single rectangular piece and is preferably a fiberglass blade or a polyester film blade. The blade 22 is coupled to the oscillating end 212 of the piezoelectric sheet 21 and the blade 22 includes a free end 221 remote from the oscillating end 212. Preferably, the blade 22 further includes a mounting end portion 222 fixed to the piezoelectric piece 21, and the swing end 212 of the piezoelectric piece 21 is completely embedded in the mounting end portion 222 of the blade 22. Thereby, the blade 22 can be stably mounted on the piezoelectric sheet 21, and the free end portion 221 of the blade 22 can swing with the swinging end of the piezoelectric piece 21 (see FIG. 4 and Figure 5). It is worth mentioning that, in this embodiment, the oscillating end 212 of the piezoelectric piece 21 is completely buried in the mounting end portion 222 of the blade 22. However, the invention is not limited thereto. For example, the oscillating end 212 of the piezoelectric sheet 21 may also be partially embedded in the mounting end portion 222 of the blade 22 (eg, FIG. 6), or the blade 22 may also be laminated. The manner of attaching to the side of the swing end 212 of the piezoelectric piece 21 (for example, FIG. 7) allows the piezoelectric piece 21 to simultaneously drive the blade 22 freely as long as the piezoelectric piece 21 is coupled to the blade 22. The end portion 221 can be swung.

It should be noted that the number of the swinging structures 2 in the present embodiment is exemplified, but the present invention is not limited thereto. For example, the number of the swinging structures 2 may be two or more. The number of the carriers 1 or the number of the fixing grooves 13 of the carrier 1 can be adjusted correspondingly with the number of the swinging structures 2. As shown in Fig. 8, the number of the swinging structures 2 is two, and the number of the fixing grooves 13 of the carrier 1 is also two (one carrier 1 has two fixing grooves 13). Alternatively, as shown in FIG. 9, the number of the swinging structures 2 is two, and the number of the carriers 1 is also two (two carriers 1 each have one fixing groove 13).

As shown in FIG. 1 and FIG. 2, the driving wafer 200 can know the current frequency that can resonate with the blades 22 of the heat sink 100 by performing a test function, thereby enabling the driving wafer 200 to input and perform a driving function. The currents that the blades 22 resonate with each other, thereby causing the blades 22 to enhance their swinging effect while resonating with the input current, thereby improving the heat dissipation effect of the heat sink 100.

In more detail, the driving wafer 200 can perform a test function to sequentially transmit a plurality of test signals of different frequencies to the piezoelectric sheet 21, and measure the piezoelectric sheet 21 corresponding to each of the test signals. A current value inside (as shown in the table below). The highest current value (eg, Z 10 mA) of the plurality of current values is defined as an operating current value, and the test signal corresponding to the operating current value is defined as a driving signal. That is, in the process in which the driving chip 200 performs the test function, the blade 22 of the heat sink 100 is substantially resonant with a frequency (eg, 50 Hz) corresponding to the above-described operating current value (eg, Z 10 mA).

According to this, the driving wafer 200 can perform a driving function to continuously transmit the driving signal to the piezoelectric sheet 21, so that the piezoelectric sheet 21 drives the swing end of the piezoelectric sheet 21 by driving of a driving signal. The 212 produces a periodic reciprocating swing to simultaneously drive the free end 221 of the blade 22 to oscillate.

The test function and the driving function of the driving chip 200 described above can be realized by various methods such as software or hardware design. This embodiment is difficult to introduce all possible aspects one by one, so the following only one embodiment is adopted. A description will be given of the drive wafer 200.

The driving chip 200 includes a control module 201, a power supply module 202 electrically connected to the control module 201 and the piezoelectric sheet 21, and a feedback module electrically connected to the control module 201 and the piezoelectric sheet 21. 203. The power supply module 202 can sequentially output a plurality of test signals respectively having different frequencies to the piezoelectric sheet 21 through the indication of the control module 201, so that the piezoelectric Sheet 21 operates at different current values (as listed above). The feedback module 203 can measure a plurality of current values respectively corresponding to the plurality of test signals, and transmit the plurality of current values to the control module 201.

The storage module 201 can be configured to store the data transmitted by the feedback module 203. The control module 201 can The highest current value among the current values is defined as the operating current value, and the test signal corresponding to the above-described operating current value is defined as a driving signal.

Accordingly, when the driving chip 200 performs the driving function, the control module 201 enables the power supply module 202 to continuously transmit the driving signal to the piezoelectric sheet 21 of the heat sink 100, thereby causing the blade 22 of the heat sink 100 The frequency of the above-mentioned driving signal can be substantially resonated, thereby further improving the heat dissipation effect of the heat sink 100.

It should be noted that the driving chip 200 can perform the testing function at different time points according to the needs of the designer. For example, when the heat sink 100 is initially to be operated, the driving chip 200 can perform the testing function first. In order to facilitate measuring the operating current value of the heat sink 100.

Moreover, since the heat sink 100 is operating for a period of time, the blades 22 may cause a change in the frequency of the current that the blades 22 can resonate due to aging, contamination of dust, or other factors. Therefore, the driving chip 200 can periodically perform the testing function to redefine the operating current value and the corresponding driving signal, thereby enabling the heat sink 100 to continuously improve its heat dissipation effect.

Alternatively, the control module 201 can monitor an instantaneous current value in the piezoelectric sheet 21 through the feedback module 203 when the driving chip 200 performs a driving function, and the control module 201 can operate at the instantaneous current value. When the current values differ by more than a certain difference, the driving chip 200 is activated to perform a test function to redefine the operating current value and the corresponding driving signal, thereby enabling the heat sink 100 to continuously improve its heat dissipation effect.

Wherein, the specific difference can be adjusted and changed according to the needs of the user, and the specific difference in the embodiment is 0.01% to 5% (preferably 3% to 5%) of the running current value, thereby Conducive to the heat sink 100 continues to enhance its heat dissipation effect, but the specific difference of the present invention is not limited thereto.

It should be noted that the driving chip 200 may be mounted on the carrier 1 of the heat dissipating device 100, or the driving chip 200 may be disposed separately from the heat dissipating device, and the invention is not limited thereto.

The above description of the heat dissipation system 1000 of the present embodiment, please refer to FIG. 1 , which generally illustrates the operation method of the heat dissipation system 1000 described above, but the invention is not limited thereto.

Step S110: providing the heat sink 100 and the driving chip 200 electrically connected to the heat sink 100 and receiving the power source P. For the specific configuration of the heat sink 100 and the possible implementation of the driving chip 200, please refer to the above description of the embodiment, and details are not described herein.

Step S120: Perform a test function on the driving chip 200 to sequentially transmit a plurality of test signals of different frequencies to the piezoelectric sheet 21, and measure a current in the piezoelectric sheet 21 corresponding to each test signal. The value (as in the above table); wherein the driving chip 200 can define a test signal corresponding to the highest current value among the plurality of current values as a driving signal.

Step S130: performing a driving function on the driving wafer 200 to continuously transmit the driving signal to the piezoelectric sheet 21 of the heat dissipating device 100, so that the piezoelectric sheet 21 generates periodicity by driving the driving signal. The reciprocating oscillations drive the blades 22 to oscillate in synchronization.

It should be noted that the driving chip 200 can perform step S120 at different time points according to the needs of the designer. For example, when the heat sink 100 is initially to be operated, the driving chip 200 can first perform step S120. In order to facilitate measuring the operating current value suitable for the heat sink 100; or, the driving wafer 200 is periodically executed (eg, every 5 days) in step S120 (test function) to redefine the operating current value and phase Corresponding driving signal; or alternatively, in the process of the driving wafer 200 performing step S130 (driving function), the driving wafer 200 monitors an instantaneous current value in the piezoelectric sheet 21, and when the current is current When the value differs from the operating current value by more than a specific difference (eg, 0.01% to 5% of the operating current value), the driving wafer 200 performs step S120 (test function) to redefine the operating current value and the corresponding driving. signal.

[Technical effect of the embodiment of the present invention]

In summary, the heat dissipation system and the operation method thereof disclosed in the embodiments of the present invention can learn the current frequency that can resonate with the blades of the heat dissipation device by performing the test function, thereby enabling the drive wafer to perform the driving function. The current (drive signal) that resonates with the blades is input, thereby effectively improving the heat dissipation effect of the heat sink.

Furthermore, the heat dissipating device and the swinging structure thereof disclosed in the embodiments of the present invention can effectively reduce the number of parts required for the heat dissipating device by providing a piezoelectric piece in the swinging structure, thereby effectively reducing the heat dissipating device (or The volume, weight and production cost of the oscillating structure).

In addition, the heat dissipating device and the swinging structure thereof disclosed in the embodiments of the present invention can increase the swing amplitude of the whole swinging structure by connecting the vanes at the swing end of the piezoelectric sheet, thereby more effectively lifting the heat dissipating device. (or swing structure) heat dissipation effect.

The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. The equivalents and modifications made by the scope of the present invention should fall within the scope of the claims of the present invention. .

Claims (10)

  1. A heat dissipation system comprising: a driving chip capable of selectively performing a test function and a driving function; and a heat sink comprising: a carrier; and at least one swing structure including a piezoelectric piece and mounted on the a blade on the piezoelectric sheet, the piezoelectric sheet having a fixed end and a swing end, the fixed end of the piezoelectric piece being fixed to the carrier, the blade being connected to the piezoelectric piece a swing end, and the blade includes a free end remote from the swing end; wherein the drive wafer is capable of performing the test function to sequentially transmit a plurality of test signals of different frequencies to the piezoelectric sheet, And measuring a current value in the piezoelectric sheet corresponding to each of the test signals; wherein a highest one of the plurality of current values is defined as an operating current value, the operating current value The corresponding test signal is defined as a driving signal; wherein the driving chip can perform the driving function to continuously transmit the driving signal to the piezoelectric sheet, and pass the piezoelectric sheet through the driving signal The order of the oscillating end drive and generate a periodic swing back and forth in a synchronous drive the free end of the blade pivot generated.
  2. The heat dissipation system of claim 1, wherein the driving chip comprises: a control module; a power supply module electrically connected to the piezoelectric piece and capable of sequentially outputting respectively through the indication of the control module And having a plurality of the test signals of the different frequencies to the piezoelectric sheet, so that the piezoelectric sheet operates under different current values; and a feedback module electrically connected to the control module, The feedback module can measure a plurality of the current values respectively corresponding to the test signal multiple times, and transmit a plurality of the current values to the control module; wherein the control module enables the power supply module to continuously transmit the drive signal to the piezoelectric sheet.
  3. The heat dissipation system of claim 2, wherein the control module is capable of monitoring an instantaneous current value in the piezoelectric sheet by the feedback module when the driving function is performed by the driving chip; The control module can activate the driving chip to perform the testing function to redefine the operating current value and the corresponding one when the instantaneous current value and the operating current value differ by more than a specific difference Drive signal.
  4. The heat dissipation system of claim 3, wherein the specific difference is 0.01% to 5% of the operating current value.
  5. The heat dissipation system of claim 1, wherein the drive wafer is capable of periodically performing the test function to redefine the operating current value and the corresponding drive signal.
  6. The heat dissipation system according to any one of claims 1 to 5, wherein the blade includes a mounting end fixed to the piezoelectric piece, and the oscillating end of the piezoelectric piece is embedded Inside the mounting end.
  7. A method for operating a heat dissipation system includes: providing a heat sink and a driving chip electrically connected to the heat sink; wherein the heat sink comprises a carrier, a piezoelectric piece mounted on the carrier, And a blade mounted on the piezoelectric sheet; performing a test function on the driving wafer to sequentially transmit a plurality of test signals of different frequencies to the piezoelectric sheet, and measuring each of the test signals Corresponding a current value in the piezoelectric sheet; wherein a highest one of the plurality of current values is defined as an operating current value and a corresponding test signal is defined as a driving signal; The driving wafer performs a driving function to continuously transmit the driving signal to the piezoelectric sheet, so that the piezoelectric sheet generates periodic reciprocating oscillation by driving of the driving signal to synchronously drive the blade to generate swing.
  8. The method of operating a heat dissipation system according to claim 7, wherein the driving wafer monitors an instantaneous current value in the piezoelectric sheet during the driving of the driving function, and when The drive die performs the test function to redefine the operating current value and the corresponding drive signal when the instantaneous current value differs from the operating current value by more than a certain difference.
  9. The method for operating a heat dissipation system according to claim 8, wherein the specific difference is 0.01% to 5% of the operating current value.
  10. The method of operating a heat dissipation system of claim 7, wherein the drive wafer periodically performs the test function to redefine the operating current value and the corresponding drive signal.
TW106127308A 2017-08-11 2017-08-11 Heat dissipating system and operating method thereof TWI629928B (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101978172A (en) * 2008-03-25 2011-02-16 株式会社村田制作所 Piezoelectric fan device and air-cooling apparatus using the piezoelectric fan device
TWI454620B (en) * 2012-07-10 2014-10-01 Hsiao Kang Ma Magnetic-force interactive fan
TWM521322U (en) * 2015-12-18 2016-05-01 Xian-Qin Su Heat dissipation device and swing structure thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101978172A (en) * 2008-03-25 2011-02-16 株式会社村田制作所 Piezoelectric fan device and air-cooling apparatus using the piezoelectric fan device
TWI454620B (en) * 2012-07-10 2014-10-01 Hsiao Kang Ma Magnetic-force interactive fan
TWM521322U (en) * 2015-12-18 2016-05-01 Xian-Qin Su Heat dissipation device and swing structure thereof

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