TWI625037B - Heat dissipating system and operating method thereof - Google Patents

Abstract

A heat dissipation system includes a driving chip and a heat dissipation device electrically connected to the driving chip. The heat dissipation device includes a carrier, a magnetic driving module and a swing structure installed on the carrier. The driving chip can perform a test function to sequentially transmit multiple test signals of different frequencies to the magnetic drive module, and measure the current value in the magnetic drive module corresponding to each test signal. The lowest current value among the multiple current values is defined as a running current value, and a test signal corresponding to the running current value is defined as a driving signal. The driving chip can perform a driving function to continuously transmit driving signals to the magnetic driving module, so that the magnetic driving module drives the swing structure to swing. In addition, the present invention discloses a method for operating a heat dissipation system.

Description

Radiating system and its operation method

The invention relates to a heat dissipation system, in particular to a heat dissipation system and an operation method thereof.

The inventor previously proposed a heat dissipation device (Taiwan No. M529149 new patent), which can achieve the effect of rapid heat dissipation through the swing of the blade. However, how to improve the heat dissipation device to reduce the energy consumption of the heat dissipation device has become one of the goals that the inventor is eager to perfect.

Therefore, the present inventor believes that the above-mentioned defects can be improved, and with special research and cooperation with the application of scientific principles, he finally proposes an invention with a reasonable design and effective improvement of the above-mentioned defects.

The embodiments of the present invention provide a heat dissipation system and a method for operating the same, which can effectively improve the defects that may occur in the existing heat dissipation devices.

An embodiment of the present invention discloses a heat dissipation system including: a driving chip capable of selectively performing a test function and a driving function; and a heat dissipation device including: a bearing member; and a magnetic driving module installed on the bearing member. Components are electrically connected to the drive chip, and the magnetic drive module can be used to generate a magnetic field to form two magnetic regions with opposite magnetic properties; wherein the drive chip can perform the test function to sequentially transfer different A plurality of test signals of the frequency to the magnetic drive module, and a current value in the magnetic drive module corresponding to each test signal is measured; wherein the lowest of the plurality of current values is the current Value is defined as a running current The test signal corresponding to the running current value is defined as a driving signal; and at least one oscillating structure includes a blade and a uniformly moving magnetic member mounted on the blade, and the blade is mounted on the carrier, and The actuating magnetic member is located in one of the two magnetic regions, and the driving chip can perform the driving function to continuously transmit the driving signal to the magnetic driving module. Causing the magnetic driving module to periodically and reciprocally change the magnetic properties of the two magnetic regions by driving the driving signal, and the actuating magnetic member is driven and displaced by the corresponding magnetic regions so that The blade is oscillated.

An embodiment of the present invention also discloses a method for operating a heat dissipation system, including: providing a heat dissipation device and a driving chip electrically connected to the heat dissipation device; wherein the heat dissipation device includes a carrier and is mounted on the carrier A magnetic drive module and at least one swing structure installed on the magnetic drive module; performing a test function with the drive chip to sequentially transmit multiple test signals of different frequencies to the magnetic drive module, and Measuring a current value in the magnetic drive module corresponding to the test signal each time; wherein a test signal corresponding to the lowest current value among the plurality of current values is defined as a drive signal; and The driving chip performs a driving function to continuously transmit the driving signal to the magnetic driving module, so that the magnetic driving module generates two magnetic force regions that periodically change magnetic properties by driving the driving signal. To drive at least one of the oscillating structures to oscillate.

In summary, the heat dissipation system and the operation method disclosed in the embodiments of the present invention can perform the test function to know the current frequency that can generate resonance with the blade of the heat dissipation device, so as to drive the chip. When the drive function is performed, a current that resonates with the blade can be input, thereby reducing the energy consumption of the heat sink.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention, but these descriptions and drawings are only used to illustrate the present invention, and not to make any limitation to the protection scope of the present invention. limit.

1000‧‧‧ cooling system

100‧‧‧Cooling device

1‧‧‧carriage

11‧‧‧ base

111‧‧‧ inside

112‧‧‧ outside

113‧‧‧face

114‧‧‧lock hole

12‧‧‧ Connection Department

2‧‧‧ Magnetic Drive Module

21‧‧‧ core

22‧‧‧ Coil

3‧‧‧ swing structure

31‧‧‧ Blade

311‧‧‧Mounting end

312‧‧‧free end

32‧‧‧ bracket (such as: metal bracket)

321‧‧‧ Containment Department

322‧‧‧Positioning Department

33‧‧‧Positioning Rivets

331‧‧‧Shaft

332‧‧‧Crimping part

34‧‧‧ Actuating Magnetic

4‧‧‧Fixed parts

41‧‧‧Press plate

42‧‧‧Rivets

D1, D2, D3 ‧‧‧ Outer diameter

200‧‧‧ driver chip

201‧‧‧Control Module

2011‧‧‧Storage Unit

202‧‧‧Power supply module

203‧‧‧Feedback Module

P‧‧‧Periodic power

FIG. 1 is a functional block diagram of a heat dissipation system of the present invention.

FIG. 2 is a schematic perspective view of a heat sink of a heat sink system of the present invention.

FIG. 3 is an exploded view of FIG. 2.

FIG. 4 is a schematic plan view of FIG. 2.

Fig. 5 is a schematic cross-sectional view taken along the line V-V in Fig. 2.

FIG. 6 is a partially enlarged schematic view of a VI portion in FIG. 5.

FIG. 7 is a schematic plan view of another aspect of the heat dissipation device of the heat dissipation system of the present invention.

FIG. 8 is an exploded perspective view of FIG. 7.

FIG. 9 is a schematic cross-sectional view of FIG. 7.

FIG. 10 is a partially enlarged schematic diagram of an X part in FIG. 9.

FIG. 11 is a schematic diagram of the operation of FIG. 2.

FIG. 12 is another schematic diagram of the operation of FIG. 2.

Please refer to FIGS. 1 to 12, which are embodiments of the present invention. It should be noted that this embodiment corresponds to the related quantities and appearances mentioned in the drawings, and is only used to specifically describe the embodiments of the present invention in order to In order to understand the content of the present invention, it is not intended to limit the protection scope of the present invention.

Please refer to FIG. 1 and FIG. 2. This embodiment discloses a heat dissipation system 1000 including a heat dissipation device 100 and a driving chip 200 electrically connected to the heat dissipation device 100. The driving chip 200 is used to receive a cycle. The power supply P can selectively perform a test function and a driving function, but the driving chip 200 of the present invention is not limited to receiving the periodic power supply P described above.

It should be noted that in this embodiment, the driving chip 200 is electrically connected to a single heat dissipation device 100, but the present invention is not limited thereto, that is, the driving chip 200 may be electrically connected to multiple heat dissipation devices. 100. The following will first discuss the heat dissipation device The structure of 100 is explained, and then the connection relationship between the driving chip 200 and the heat sink 100 is described.

As shown in FIG. 3 to FIG. 6, the heat sink 100 includes a supporting member 1, a magnetic driving module 2, two swinging structures 3, and a plurality of fixing members 4. The magnetic driving module 2 is mounted on the carrier 1 and is electrically connected to the driving chip 200. The two swinging structures 3 are mounted on the carrier 1 through the plurality of fixing members 4 and communicate with the magnetic force. The positions of the drive modules 2 correspond. The number of the fixing members 4 in this embodiment is taken as an example to fix the two swinging structures 3 to the carrier 1 respectively, but the present invention is not limited thereto.

It should be additionally noted that although the application of the swing structure 3 in this embodiment is matched with the above-mentioned carrier 1, the magnetic drive module 2, and the fixing member 4, the application range of the swing structure 3 is not limited to this.

The carrier 1 is a structure suitable for manufacturing by injection molding. The carrier 1 includes two bases 11 and a connecting portion 12 connected in a circular tube shape to the two bases 11. The base 11 is mirror-symmetrical to the connecting portion 12. Among them, since the structures of the two bases 11 are substantially the same, in order to facilitate understanding of this embodiment, this paragraph only describes the structure of one of the bases 11.

The base 11 includes a corresponding inner side surface 111 and an outer side surface 112, and two corresponding end surfaces 113. The top end portion of the inner side surface 111 is connected to the connecting portion 12. The shapes of the two end surfaces 113 are substantially the same, and at least one of the two end surfaces 113 is recessed to form a locking hole 114 so that the load can be carried. The piece 1 can be fixed at an arbitrary position through a locking hole 114 through a screw (not shown). Furthermore, the locking hole 114 may be a blind hole or a through hole.

The magnetic driving module 2 can be used to generate a magnetic field (not shown in the figure) to form two magnetic regions with opposite magnetic properties (not shown in the figure, which is equivalent to the adjacent left side of the magnetic driving module 2 in FIG. 4). Area and adjacent right area). Furthermore, the magnetic driving The module 2 can be driven by the electric power input from the driving chip 200 to generate periodic reciprocating changes in the magnetic properties of the two magnetic force regions. The periodic power source may be a periodic square wave, a triangular wave, a sine wave, or the positive and negative half cycles of alternating current. The periodic power source of this embodiment is described by using the positive and negative half cycles of alternating current as an example, but it is not limited. herein.

In more detail, the magnetic drive module 2 of this embodiment includes a long core 21 (such as an iron core) and a coil 22. The core 21 is tightly fit through the carrier 1. In the connecting portion 12, the coil 22 is wound around the outer edge of the connecting portion 12 of the carrier 1. The coil 22 is electrically connected to the periodic power source. Therefore, when the current of the periodic power source passes through the coil 22, a magnetic field is generated between the coil 22 and the core body 21, and the two magnetic regions with opposite magnetic properties will proceed with time. Periodic magnetic reciprocation.

Since the structures of the two swing structures 3 are substantially the same in this embodiment, in order to facilitate understanding of the above-mentioned swing structures 3, the following first describes the structure of one of the swing structures 3.

The swing structure 3 includes a blade 31, a bracket 32, a positioning rivet 33, and a uniformly moving magnetic member 34. The bracket 32 is fixed to the blade 31 by the positioning rivet 33, and the actuating magnetic member 34 is (detachably) fixed to the bracket 32. Accordingly, the swing structure 3 can be provided with a bracket 32 on the blade 31 with a positioning rivet 33 to avoid the cracking problem caused by actuating the magnetic member 34 and effectively reduce the production cost of the swing structure 3.

Wherein, the blade 31 is a single rectangular sheet body and is preferably a fiberglass blade or a polyester film blade. The blade 31 includes a mounting end portion 311 and a free end portion 312 away from the mounting end portion 311. The positioning rivet 33 is located between the mounting end portion 311 and the free end portion 312 of the blade 31.

The material of the positioning rivet 33 may be plastic or metal and includes a shaft portion 331 and two crimping portions 332, and the two crimping portions 332 are integrally connected to the shaft portion, respectively. Opposite two end edges of 331, and an outer diameter of each crimping portion 332 is larger than an outer diameter of the shaft portion 331. The shaft portion 331 of the positioning rivet 33 is passed through the bracket 32 and the blade 31, and the two crimping portions 332 are pressed against the bracket 32 and the blade 31 respectively. Wherein, in each positioning rivet 33 in this embodiment, the shaft portion 331 and each crimping portion 332 are hollow, but the present invention is not excluded as a solid shape.

In the embodiment, the bracket 32 is described by using a metal bracket 32 as an example, and the actuating magnetic member 34 is a circular magnet, and the actuating magnetic member 34 is magnetically fixed to the above. Bracket 32. It should be noted that the actuating magnetic member 34 is a structure without any perforations, and therefore, any actuating magnetic member having a perforation is not the actuating magnetic member 34 referred to in this embodiment. In addition, in an unillustrated embodiment, the bracket 32 may also be a non-metallic bracket (such as a plastic bracket), and the actuating magnetic member 34 is fixed to the bracket 32 by means of adhesion or the like.

Further, the bracket 32 includes a groove-shaped receiving portion 321 and a positioning portion 322 extending outwardly from a peripheral edge of the receiving portion 321. A part of the positioning rivet 33 (such as the crimping portion 332) is located in the receiving portion 321, and the positioning rivet 33 presses the receiving portion 321 to the blade 31, and the positioning portion 322 is located in the receiving portion 321. The side far from the blade 31 (eg, the left side of the receiving portion 321 in FIG. 6).

Furthermore, the positioning portion 322 is slot-shaped in this embodiment, and is used to restrict the position of the actuating magnetic member 34 relative to the positioning rivet 33 (eg, the actuating magnetic member 34 is confined within the edge of the positioning portion 322 ) So that the center of the actuating magnetic member 34 substantially corresponds to the center of the positioning rivet 33, but the present invention is not limited thereto. For example, in an unillustrated embodiment, the positioning portion 322 may be a planar structure parallel to the blade 31, and the actuating magnetic member 34 is fixed to the positioning portion 322.

It should be noted that, in this embodiment, the outer diameter D1 of the contact area between the blade 31 and the bracket 32 (the accommodating portion 321) is preferably not larger than the outer diameter of the contact area between the blade 31 and the positioning rivet 33. D2 twice. Furthermore, the outer diameter D1 of the contact area between the blade 31 and the bracket 32 (the receiving portion 321) is not larger than the actuating magnetic member. The outer diameter D3 is 1/2 times (preferably 1/3 times).

Therefore, compared with the existing actuating magnetic member directly fixed on the blade (eg, Taiwan's new patent No. M529149), the blade 31 and the bracket 32 of this embodiment have a smaller contact area, so the blade 31 In the process of swinging, there is less stress concentration, which effectively increases the service life of the blade 31.

It should be noted that the swing structure 3 shown in FIG. 2 to FIG. 6 is based on a single bracket 32 and a single actuating magnetic piece 34 as examples, and the bracket 32 and the actuating magnetic piece 34 are facing the magnetic drive module 2, but The invention is not limited to this. For example, the bracket 32 and the actuating magnetic member 34 may both face away from the magnetic driving module 2 (not shown in the figure).

Alternatively, as shown in FIG. 7 to FIG. 10, the number of the brackets 32 (such as the metal bracket 32) and the number of the actuating magnetic members 34 of the swinging structure 3 are each further limited to two. The two brackets 32 (such as the metal bracket 32) are respectively fixed on opposite sides of the blade 31 by positioning the rivets 33, and the two actuating magnetic members 34 are fixed (magnetically) to two A bracket 32 (eg, a metal bracket 32). Furthermore, the shaft portion 331 of the positioning rivet 33 passes through the receiving portion 321 and the blade 31 of the two brackets 32, and the two crimping portions 332 are respectively located in the receiving portion 321 of the two brackets 32 and are pressed on the two载 部 32 的 架 部 32。 32 receiving section 321 of the bracket 32.

In addition, although the swing structure 3 shown in FIGS. 7 to 10 is provided with the same two brackets 32 and the same two actuating magnetic members 34, the present invention is not limited thereto. That is, in the embodiment not shown, the two brackets 32 may have different configurations, and the two actuating magnetic members 34 may also have different configurations.

As shown in FIG. 3 to FIG. 6, the two fixing members 4 respectively fix the mounting end portions 311 of the two blades 31 to two opposite outer sides of the carrier 1, and make the two actuating magnetic members 34 respectively. Located in two magnetic regions. In more detail, each fixing member 4 in this embodiment includes a pressure plate 41 and two rivets 42. Each fixing member 4 and its corresponding blade 31 and base 11 will be described below. The platen 41 and The bottom end position of the outer surface 112 of the base 11 holds the mounting end portion 311 of the blade 31, and each rivet 42 passes through the pressing plate 41, the mounting end portion 311 of the blade 31, and the base 11 in order, so that the blade 31 The mounting end portion 311 is fixed on the base 11 of the carrier 1. In addition, the pressing plate 41 described in this embodiment may be a hard acrylic plate or a soft rubber plate, which is not limited in the present invention.

The above is the description of the structure and connection relationship of the heat sink 100 according to this embodiment. According to this, when the magnetic driving module 2 is driven by the electric power input from the driving chip 200 to generate the magnetic field, the two actuating magnetic The members 34 are respectively displaced by the driving of the two magnetic force regions, so that the free end portion 312 of each blade 31 swings. Wherein, the swing directions of the two blades 31 of the heat sink 100 may be the same direction swing as shown in FIG. 11 or the reverse swing as shown in FIG. 12, which is not limited in the present invention.

As shown in FIG. 1 and FIG. 2, the driving chip 200 can determine the current frequency that can generate resonance with the blade 31 of the heat sink 100 by performing a test function, so that when the driving chip 200 performs the driving function, it can input and The currents that the blades 31 resonate with each other further reduce the power consumption of the heat sink 100.

In more detail, the driving chip 200 can perform a test function to sequentially transmit multiple test signals of different frequencies to the magnetic drive module 2 and measure the magnetic drive module 2 corresponding to each test signal Within a current value (as shown in the table below). The lowest current value (for example, Z ₁₀ mA) among the multiple current values is defined as a running current value, and the test signal corresponding to the running current value is defined as a driving signal. That is, in the process of the driving chip 200 performing the test function, the blades 31 of the heat sink 100 are approximately resonant at a frequency (for example, 50 Hz) corresponding to the operating current value (for example, Z ₁₀ mA).

According to this, the driving chip 200 can perform a driving function to continuously transmit the driving signal to the magnetic driving module 2 so that the magnetic driving module 2 drives the two magnetic regions by driving the driving signals. Magnetic In a complex change, the actuating magnetic piece 34 is driven and displaced by the corresponding magnetic force region to cause the blade 31 to oscillate.

The test function and driving function of the driving chip 200 described above can be implemented by various methods such as software or hardware design. This embodiment is difficult to introduce all possible aspects one by one, so the following is only one of the implementation aspects. The driving chip 200 will be described.

The driving chip 200 includes a control module 201, a power supply module 202 electrically connected to the control module 201, and a feedback module 203 electrically connected to the control module 201 and the magnetic drive module 2. Wherein, when the driving chip 200 performs the test function, the power supply module 202 can sequentially output multiple test signals with different frequencies to the magnetic drive module 2 sequentially according to the instructions of the control module 201, so that the magnetic drive Module 2 operates at different multiple current values (as shown in the table above). The feedback module 203 can measure multiple current values corresponding to the multiple test signals, and transmit the multiple current values to the control module 201.

A storage unit 2011 can be provided in the control module 201 to store data transmitted by the feedback module 203 in the storage module 2011. The control module 201 can define a lowest current value among the plurality of current values as a running current value, and define a test signal corresponding to the running current value as a driving signal.

According to this, when the driving chip 200 performs the driving function, the control module 201 can enable the power supply module 202 to continuously transmit the driving signal to the magnetic driving module 2 of the heat sink 100, so that the blade 31 of the heat sink 100 It can resonate approximately with the frequency of the driving signal, so that the heat sink 100 can operate in a lower energy consumption mode.

It should be noted that the driving chip 200 can perform the test function at different points in time according to the requirements of the designer. For example, when the heat sink 100 is first to be operated, the driving chip 200 can perform the test function first. To facilitate the measurement of the operating current value suitable for the heat sink 100.

In addition, after the heat-dissipating device 100 is operated for a period of time, the frequency of the current that the blade 31 can resonate may change due to aging, dust contamination, or other factors. Therefore, the driving chip 200 can periodically execute the test function to redefine the above-mentioned operating current value and the corresponding driving signal, so that the heat sink 100 can continue to be in a lower energy consumption mode.

Alternatively, the control module 201 can monitor a real-time current value in the magnetic drive module 2 through the feedback module 203 when the drive chip 200 performs a driving function, and the control module 201 can control the real-time current value and the running current in the magnetic drive module 2. When the value difference exceeds a specific difference value, the driving chip 200 is started to perform a test function to redefine the running current value and the corresponding driving signal, so that the heat sink 100 can be continuously in a lower energy consumption mode.

The specific difference can be adjusted and changed in accordance with the needs of the user, and the specific difference in this embodiment is 0.1% to 5% (preferably 3% to 5%) of the running current value, thereby It is beneficial for the heat dissipation device 100 to continue to be in a lower energy consumption mode, but the specific difference of the present invention is not limited thereto.

It should be noted that the driving chip 200 may be mounted on the carrier 1 of the heat dissipation device 100 described above, or the driving chip 200 and the heat dissipation device are separately provided, which is not limited in the present invention.

The above is a description of the heat dissipation system 1000 of this embodiment. Please refer to FIG. 1 for a description of the operation method of the heat dissipation system 1000, but the present invention is not limited thereto.

Step S110: providing the heat sink 100 and the driving chip 200 electrically connected to the heat sink 100 and receiving a periodic power source P. For the specific structure of the heat dissipation device 100 and the possible implementation of the driving chip, please refer to the foregoing in this embodiment, which will not be repeated here.

Step S120: Perform a test function by using the driving chip 200 to sequentially transmit multiple test signals of different frequencies to the magnetic drive module 2 and measure a current in the magnetic drive module 2 corresponding to each test signal Values (as in the table above); wherein, the driving chip 200 can define a test signal corresponding to the lowest current value among the multiple current values as a driving signal.

Step S130: The driving chip 200 performs a driving function to continuously transmit the driving signal to the magnetic driving module 2 of the heat sink 100, so that the magnetic driving module 2 generates a period by driving the driving signal. The two magnetic force regions that change magnetic properties reciprocally are used to drive the swing structure 3 of the heat sink 100 to swing.

It should be noted that the driving chip 200 can execute step S120 at different points in time according to the requirements of the designer. For example, when the heat sink 100 is about to start operation, the driving chip 200 can first perform step S120. In order to facilitate the measurement of the operating current value suitable for the heat sink 100; or, the driving chip 200 periodically executes (for example, once every 5 days) step S120 (test function) to redefine the above-mentioned operating current value and phase. A corresponding driving signal; or, in the process in which the driving chip 200 executes step S130 (driving function), the driving chip 200 monitors an instantaneous current value in the magnetic drive module 2, and when the instantaneous current When the difference between the value and the running current value exceeds a specific difference (eg, 0.1% to 5% of the running current value), the driving chip 200 executes step S120 (test function) to redefine the running current value and the corresponding drive. signal.

[Technical effect of the embodiment of the present invention]

In summary, the heat dissipation system and the operation method disclosed in the embodiments of the present invention can determine the current frequency that can generate resonance with the blades of the heat dissipation device by performing a test function, so that the driving chip can perform the driving function. Input the current that resonates with the blades to reduce the energy consumption of the heat sink.

Furthermore, the heat dissipation device and its swing structure disclosed in the embodiments of the present invention can be equipped with a bracket (or metal bracket) on the blade by positioning rivets, thereby avoiding the problem of cracking due to actuation of the magnetic member and effectively reducing heat dissipation Production cost of the device (or swing structure).

In addition, compared with the existing actuating magnetic member being directly fixed to the blade, the outer diameter of the swinging structure of the embodiment through the contact area between the blade and the bracket is not greater than 1/2 of the outer diameter of the actuating magnetic member. Times (or the outer diameter of the contact area between the blade and the bracket is not greater than twice the outer diameter of the contact area between the blade and the positioning rivet), so there is less stress concentration during the swing of the blade, and it is effective Increase blade life.

The above are only the preferred and feasible embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. Any equal changes and modifications made in accordance with the scope of patent application of the present invention shall fall within the protection scope of the claims of the present invention. .

Claims (8)

A heat dissipation system includes: a driving chip capable of selectively performing a test function and a driving function; and a heat dissipation device including: a carrier; a magnetic drive module mounted on the carrier and electrically connected In the driving chip, the magnetic driving module can be used to generate a magnetic field to form two magnetic regions with opposite magnetic properties; wherein the driving chip can perform the test function to sequentially transmit multiple tests of different frequencies. Signal to the magnetic drive module, and measure a current value in the magnetic drive module corresponding to each test signal; wherein the lowest current value among the plurality of current values is defined as an operation A current value, and a test signal corresponding to the running current value is defined as a driving signal; and at least one oscillating structure includes a blade and a uniformly moving magnetic member mounted on the blade, and the blade is mounted on the carrier, And the actuating magnetic piece is located in one of the two magnetic regions, and the driving chip can perform the driving function. In order to continuously transmit the driving signal to the magnetic driving module, the magnetic driving module causes the magnetic properties of the two magnetic regions to periodically change back and forth through the driving of the driving signal. The piece is driven and moved by the corresponding magnetic region to make the blade oscillate. The driving chip includes: a control module; a power supply module, which is electrically connected to the control module and can pass through the control module. The control module instructs to sequentially output the test signals with different frequencies to the magnetic drive module in order to enable the magnetic drive module to operate at different multiple current values; and a feedback module Is electrically connected to the control module, and the feedback module can measure a plurality of the current values respectively corresponding to the test signal multiple times, and transmit a plurality of the current values to the control module; wherein, The control module enables the power supply module to continuously transmit the driving signal to the magnetic drive module. The heat dissipation system according to claim 1, wherein the control module is capable of monitoring an instantaneous current value in the magnetic drive module through the feedback module when the drive chip performs the drive function; and The control module can activate the driving chip to execute the test function when the instantaneous current value and the operating current value differ by more than a specific difference value to redefine the operating current value and the corresponding Driving signal. The heat dissipation system according to claim 2, wherein the specific difference is 0.1% to 5% of the operating current value. The heat dissipation system according to claim 1, wherein the driving chip can periodically perform the test function to redefine the operating current value and the corresponding driving signal. A heat dissipation system includes: a driving chip capable of selectively performing a test function and a driving function; and a heat dissipation device including: a carrier; a magnetic drive module mounted on the carrier and electrically connected In the driving chip, the magnetic driving module can be used to generate a magnetic field to form two magnetic regions with opposite magnetic properties; wherein the driving chip can perform the test function to sequentially transmit multiple tests of different frequencies. Signal to the magnetic drive module, and measure a current value in the magnetic drive module corresponding to each test signal; wherein the lowest current value among the plurality of current values is defined as an operation A current value, and a test signal corresponding to the running current value is defined as a driving signal; and at least one oscillating structure includes a blade and a uniformly moving magnetic member mounted on the blade, and the blade is mounted on the carrier, And the actuating magnetic piece is located in one of the two magnetic regions, and the driving chip can perform the driving function. In order to continuously transmit the driving signal to the magnetic driving module, the magnetic driving module causes the magnetic properties of the two magnetic regions to periodically change back and forth through the driving of the driving signal. The member is driven and displaced by the corresponding magnetic region to cause the blade to oscillate; wherein the blade includes a mounting end fixed to the carrier and a free end remote from the mounting end. At least one of the swing structures includes a bracket and a positioning rivet, the bracket is fixed to the blade by the positioning rivet, and the positioning rivet is located between the mounting end and the free end The actuating magnetic piece is not formed with any perforations and is fixed on the bracket. The heat dissipation system according to claim 5, wherein the bracket includes a groove-shaped receiving portion and a positioning portion extending outwardly from a periphery of the receiving portion; a portion of the positioning rivet is located in the receiving portion And the positioning rivet compresses the receiving portion on the blade; an outer diameter of a contact area between the blade and the receiving portion is not greater than 1/2 of an outer diameter of the actuating magnetic member. A method for operating a heat dissipation system includes the following steps: providing a heat dissipation device and a driving chip electrically connected to the heat dissipation device; wherein the heat dissipation device includes a carrier and a magnetic force mounted on the carrier A driving module and at least one swing structure installed on the magnetic driving module; performing a test function with the driving chip, transmitting multiple test signals of different frequencies to the magnetic driving module in sequence, and measuring each time A current value in the magnetic drive module corresponding to the test signal; wherein the lowest one of the plurality of current values is defined as a running current value and a corresponding test signal is defined as a drive Signals; and performing a driving function with the driving chip to continuously transmit the driving signals to the magnetic driving module, so that the magnetic driving module generates two magnetic fields with periodic reciprocating changes by driving the driving signals. Magnetic regions to drive at least one of the swinging structures to swing; wherein the driving function is performed on the driving chip During the process, the drive chip monitors an instantaneous current value in the magnetic drive module, and when the instantaneous current value and the running current value differ by more than a specific difference, the drive chip performs the test function To redefine the operating current value and the corresponding driving signal; wherein the specific difference is 0.1% to 5% of the operating current value. The operating method of the heat dissipation system according to claim 7, wherein the driving chip periodically executes the test function to redefine the operating current value and the corresponding driving signal.