TWI626774B - Led leadframe and led package structure - Google Patents
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Abstract
本發明涉及一種LED支架和採用該種LED支架的LED封裝結構。LED支架包括:絕緣基板、第一和第二電極墊。絕緣基板形成有碗杯狀固晶區域以及位於碗杯狀固晶區域內的條狀絕緣部,第一和第二電極墊固定在絕緣基板上且藉由條狀絕緣部間隔地位於碗杯狀固晶區域的底部,條狀絕緣部在碗杯狀固晶區域內具有至少一折彎處。本發明藉由對LED支架上電極墊的結構設計,使得其中一電極墊例如正極墊的大小足夠焊線機焊線或者放置一顆極納二極體晶片即可,從而使得另一電極墊盡可能大,如此LED晶片可居中對稱分佈在LED支架上,達成增加晶片發光效率和散熱效果之目的。The invention relates to an LED bracket and an LED package structure using the same. The LED bracket includes: an insulating substrate, first and second electrode pads. The insulating substrate is formed with a cup-shaped solid crystal region and a strip-shaped insulating portion located in the cup-shaped solid crystal region, and the first and second electrode pads are fixed on the insulating substrate and are spaced apart from each other by a strip-shaped insulating portion. At the bottom of the solid crystal region, the strip-shaped insulating portion has at least one bend in the cup-shaped solid crystal region. The invention adopts the structural design of the electrode pad on the LED bracket, so that one of the electrode pads, for example, the positive electrode pad, has a size sufficient for the wire bonding machine wire or a pole nano diode wafer, so that the other electrode is drained. It may be large, so that the LED chips can be symmetrically distributed on the LED bracket, thereby achieving the purpose of increasing the luminous efficiency and heat dissipation effect of the wafer.
Description
本發明涉及LED技術領域,尤其涉及一種LED支架以及一種LED封裝結構。The present invention relates to the field of LED technologies, and in particular, to an LED bracket and an LED package structure.
習知技術技術中的LED(Light Emitting Diode, 發光二極體)支架通常包括:絕緣基板、正極墊和負極墊;其中,絕緣基板典型地居中設置有固晶區域,正極墊和負極墊固定在絕緣基板上且相互間隔地位於所述固晶區域的底部,且負極墊在固晶區域內的面積大於正極墊在固晶區域內的面積。當將此種LED支架應用於LED晶片封裝時,LED晶片會固定在固晶區域內的負極墊上並藉由打線(Wire Bonding)連接至正極墊和負極墊。The LED (Light Emitting Diode) bracket generally includes: an insulating substrate, a positive electrode pad, and a negative electrode pad; wherein the insulating substrate is typically centrally provided with a solid crystal region, and the positive electrode pad and the negative electrode pad are fixed at The insulating substrate is located at the bottom of the solid crystal region at a distance from each other, and an area of the negative electrode pad in the solid crystal region is larger than an area of the positive electrode pad in the solid crystal region. When such an LED holder is applied to an LED chip package, the LED chip is fixed on the negative electrode pad in the solid crystal region and connected to the positive electrode pad and the negative electrode pad by wire bonding.
然而,由於習知的正極墊在固晶區域內的面積過大,導致在LED晶片封裝過程中,LED晶片無法擺放在固晶區域的正中心,這樣會使得LED晶片的發光效率降低;而且由於正極墊在固晶區域內的面積大了,負極墊在固晶區域內的面積就變小了,而LED晶片均擺放在負極墊上,這樣會使得對LED晶片的散熱效果降低。However, since the area of the conventional positive electrode pad in the solid crystal region is too large, the LED chip cannot be placed in the center of the solid crystal region during the LED chip packaging process, which causes the luminous efficiency of the LED wafer to be lowered; The area of the positive electrode pad in the solid crystal region is large, and the area of the negative electrode pad in the solid crystal region is reduced, and the LED chips are all placed on the negative electrode pad, which reduces the heat dissipation effect on the LED chip.
因此,為克服習知技術中的缺陷和不足,本發明提供一種LED支架以及一種LED封裝結構,以提升晶片發光效率及散熱效果。Therefore, in order to overcome the defects and deficiencies in the prior art, the present invention provides an LED bracket and an LED package structure to improve the luminous efficiency and heat dissipation effect of the wafer.
具體地,本發明實施例提出的一種LED支架,包括:絕緣基板、第一電極墊和第二電極墊。所述絕緣基板形成有碗杯狀固晶區域以及位於所述碗杯狀固晶區域內的條狀絕緣部,所述第一電極墊和所述第二電極墊固定在所述絕緣基板上且藉由所述條狀絕緣部間隔地位於所述碗杯狀固晶區域的底部,所述條狀絕緣部在所述碗杯狀固晶區域內具有至少一個折彎處。Specifically, an LED bracket provided by an embodiment of the present invention includes: an insulating substrate, a first electrode pad, and a second electrode pad. The insulating substrate is formed with a cup-shaped solid crystal region and a strip-shaped insulating portion located in the cup-shaped solid crystal region, and the first electrode pad and the second electrode pad are fixed on the insulating substrate and The strip-shaped insulating portion has at least one bend in the cup-shaped solid crystal region by the strip-shaped insulating portion spaced apart at a bottom of the cup-shaped solid crystal region.
在本發明的一個實施例中,所述條狀絕緣部在所述碗杯狀固晶區域內的所述彎折處為多個。In an embodiment of the invention, the strip-shaped insulating portion has a plurality of the bent portions in the cup-shaped solid crystal region.
在本發明的一個實施例中,所述條狀絕緣部在所述碗杯狀固晶區域內包括兩個直線段和連接在所述兩個直線段之間的弧形部,所述第一電極墊在所述碗杯狀固晶區域內鄰近所述條狀絕緣部的一側具有內凹弧形部,且所述第二電極墊在所述碗杯狀固晶區域內鄰近所述條狀絕緣部的一側相應地具有外凸弧形部。In an embodiment of the present invention, the strip-shaped insulating portion includes two straight segments and an arc portion connected between the two straight segments in the cup-shaped solid crystal region, the first The electrode pad has a concave curved portion on a side of the bowl-shaped solid crystal region adjacent to the strip-shaped insulating portion, and the second electrode pad is adjacent to the strip in the cup-shaped solid crystal region One side of the insulating portion correspondingly has a convex arc portion.
在本發明的一個實施例中,所述條狀絕緣部在所述碗杯狀固晶區域內由三個依次相連接的直線段構成而大致呈U型。In an embodiment of the invention, the strip-shaped insulating portion is formed of three straight segments connected in series in the cup-shaped solid crystal region and is substantially U-shaped.
在本發明的一個實施例中,所述條狀絕緣部在所述碗杯狀固晶區域內由兩個相連接的直線段構成而具有一個彎折處,從而大致呈L型。In an embodiment of the invention, the strip-shaped insulating portion is formed by two connected straight segments in the cup-shaped solid crystal region and has a bent portion so as to be substantially L-shaped.
在本發明的一個實施例中,所述第一電極墊和所述第二電極墊在所述碗杯狀固晶區域內的面積比為1:3至1:5。In an embodiment of the invention, an area ratio of the first electrode pad and the second electrode pad in the cup-shaped solid crystal region of the bowl is 1:3 to 1:5.
在本發明的一個實施例中,所述第一電極墊在所述碗杯狀固晶區域內的寬度取值為0.15毫米至0.3毫米。In one embodiment of the invention, the width of the first electrode pad in the cup-shaped solid crystal region of the bowl is from 0.15 mm to 0.3 mm.
在本發明的一個實施例中,所述第一電極墊與所述絕緣基板的結合處以及所述第二電極墊與所述絕緣基板的結合處為台階狀。In an embodiment of the invention, the junction of the first electrode pad and the insulating substrate and the junction of the second electrode pad and the insulating substrate are stepped.
此外,本發明實施例提出的一種LED封裝結構,包括:至少一個LED晶片、封裝體以及前述任意一種LED支架;所述至少一個LED晶片居中對稱分佈在所述LED支架的所述碗杯狀固晶區域內與所述第一電極墊及所述第二電極墊打線連接且固定在所述第二電極墊上;所述封裝體填充在所述碗杯狀固晶區域內並覆蓋所述至少一個LED晶片。In addition, an LED package structure according to an embodiment of the present invention includes: at least one LED chip, a package body, and any one of the foregoing LED holders; wherein the at least one LED chip is centrally symmetrically distributed on the bowl of the LED holder. The first electrode pad and the second electrode pad are wire-bonded and fixed on the second electrode pad; the package is filled in the cup-shaped solid crystal region and covers the at least one LED chip.
在本發明的一個實施例中,所述LED封裝結構還包括極納二極體晶片,焊接固定在所述第一電極墊上且與所述第二電極墊打線連接。In an embodiment of the invention, the LED package structure further includes a nano-anode wafer soldered to the first electrode pad and connected to the second electrode pad.
由上可知,本發明實施例藉由對LED支架上的電極墊的結構設計,使得其中一個電極墊例如正極墊的大小足夠焊線機焊線或者放置一顆極納二極體晶片即可,從而使得另一個電極墊盡可能大,如此LED晶片可以居中對稱分佈在LED支架上,達成增加晶片發光效率和散熱效果之目的。As can be seen from the above, the embodiment of the present invention allows the structure of the electrode pads on the LED holder to be such that one of the electrode pads, such as the positive electrode pad, is of sufficient size to be soldered to the wire bonding machine or to place a nano-anode wafer. Therefore, the other electrode pad is made as large as possible, so that the LED chip can be symmetrically distributed on the LED bracket, thereby achieving the purpose of increasing the luminous efficiency and heat dissipation effect of the wafer.
為使本發明的上述目的、特徵和優點能夠更加明顯易懂,下面結合附圖對本發明的具體實施方式做詳細的說明。The above described objects, features and advantages of the present invention will become more apparent from the aspects of the appended claims.
請參見圖1、圖2、圖3、圖4A和圖4B,本發明實施例提出的一種LED支架10包括:絕緣基板11、正極墊13以及負極墊15。其中,絕緣基板11居中地形成有碗杯狀固晶區域110以及位於碗杯狀固晶區域110內的條狀絕緣部112;負極墊15和正極墊13固定在絕緣基板11上且藉由條狀絕緣部112間隔地位於碗杯狀固晶區域110的底部。典型地,負極墊15、正極墊13與絕緣基板11為注塑一體成型結構。Referring to FIG. 1 , FIG. 2 , FIG. 3 , FIG. 4A and FIG. 4B , an LED holder 10 according to an embodiment of the invention includes an insulating substrate 11 , a positive electrode pad 13 , and a negative electrode pad 15 . The insulating substrate 11 is centrally formed with a cup-shaped solid crystal region 110 and a strip-shaped insulating portion 112 located in the cup-shaped solid crystal region 110; the negative electrode pad 15 and the positive electrode pad 13 are fixed on the insulating substrate 11 and are provided by the strip The insulating portions 112 are spaced apart at the bottom of the cup-shaped solid crystal region 110. Typically, the negative electrode pad 15, the positive electrode pad 13, and the insulating substrate 11 are injection molded integrally formed structures.
如圖3所示,位於正極墊13和負極墊15之間的條狀絕緣部112為非直條狀,其具有兩個折彎處。更具體地,條狀絕緣部112在圖3中由兩個直線部和位於兩個直線部之間的弧形部構成;正極墊13在鄰近條形絕緣部112的一側具有內凹弧形部,相應地負極墊15在鄰近條形絕緣部112的一側具有外凸弧形部,也即正極墊13和負極墊15在碗杯狀固晶區域110內的形狀互補。再者,正極墊13在碗杯狀固晶區域110內的寬度W位於範圍0.15毫米至0.3毫米內,其足夠焊線機焊線或焊接一顆抗靜電用極納(Zener)二極體晶片;正極墊13與負極墊15在碗杯狀固晶區域110內的面積比優選為1:3至1:5,且碗杯負極墊15的外凸弧形部有利於焊接極納二極體晶片時焊線機磁嘴不碰到晶片。在此,由於正極墊13在碗杯狀固晶區域110內的面積因形狀設計而縮小,而負極墊15在碗杯狀固晶區域110內的面積相應地被增加,負極墊15的面積遠遠大於正極墊13,其使得在將LED支架10應用于LED晶片封裝時,LED晶片20例如型號為3030的LED晶片可以居中對稱地放置在LED支架10的碗杯狀固晶區域110內且固定在負極墊15上,這樣可以使螢光粉受激發效率增加,提高晶片的發光效率,而且負極墊15在碗杯狀固晶區域110內的面積增大有利於LED晶片20更好的散熱。As shown in FIG. 3, the strip-shaped insulating portion 112 between the positive electrode pad 13 and the negative electrode pad 15 has a non-straight strip shape and has two bent portions. More specifically, the strip-shaped insulating portion 112 is constituted by two straight portions and an arc portion between the two straight portions in FIG. 3; the positive electrode pad 13 has a concave curved shape on a side adjacent to the strip-shaped insulating portion 112. Accordingly, the negative electrode pad 15 has a convex arc-shaped portion on the side adjacent to the strip-shaped insulating portion 112, that is, the positive electrode pad 13 and the negative electrode pad 15 are complementary in shape in the cup-shaped solid crystal region 110. Furthermore, the width W of the positive electrode pad 13 in the cup-shaped solid crystal region 110 is in the range of 0.15 mm to 0.3 mm, which is sufficient for the wire bonding machine to solder or solder an antistatic Zener diode chip. The area ratio of the positive electrode pad 13 and the negative electrode pad 15 in the cup-shaped solid crystal region 110 is preferably 1:3 to 1:5, and the convex curved portion of the cup negative electrode pad 15 is advantageous for soldering the nano-polar body. The wire bonder does not touch the wafer during the wafer. Here, since the area of the positive electrode pad 13 in the cup-shaped solid crystal region 110 is reduced by the shape design, the area of the negative electrode pad 15 in the cup-shaped solid crystal region 110 is correspondingly increased, and the area of the negative electrode pad 15 is far. Far greater than the positive pad 13, which enables the LED chip 20, such as the model 3030, to be placed symmetrically within the cup-shaped solid crystal region 110 of the LED holder 10 and fixed when the LED holder 10 is applied to the LED chip package. On the negative electrode pad 15, this can increase the excitation efficiency of the phosphor powder, improve the luminous efficiency of the wafer, and the increase in the area of the negative electrode pad 15 in the cup-shaped solid crystal region 110 contributes to better heat dissipation of the LED chip 20.
如圖4A和圖4B所示,正極墊13與絕緣基板11的結合處122設計為台階狀,負極墊15與絕緣基板11的結合處124也設計為台階狀,如此可以延長水分滲透的路徑,增加其氣密性。As shown in FIG. 4A and FIG. 4B, the junction 122 of the positive electrode pad 13 and the insulating substrate 11 is designed to be stepped, and the junction 124 of the negative electrode pad 15 and the insulating substrate 11 is also designed to be stepped, so that the path of moisture penetration can be extended. Increase its air tightness.
參見圖5A-5E,其為本發明實施例提出的LED支架應用于LED晶片封裝的各種舉例。具體地:5A-5E, which are various examples of applying an LED bracket to an LED chip package according to an embodiment of the present invention. specifically:
在圖5A中,條狀絕緣部112由兩個直線部和位於兩個直線部之間的弧形部構成且位於正極墊13和負極墊15之間,兩顆LED晶片20例如規格型號為1846的LED晶片居中對稱設置在碗杯狀固晶區域110內與正極墊13及負極墊15打線連接且固定在負極墊15上,其具體為兩顆LED晶片20橫向排列且相對於經過碗杯狀固晶區域110的幾何中心(圖5A中橫向虛線與縱向虛線的交叉點)的縱向虛線對稱分佈、以及每一顆LED晶片20的幾何中心大致位於經過碗杯狀固晶區域110的幾何中心的橫向虛線上。In FIG. 5A, the strip-shaped insulating portion 112 is composed of two straight portions and an arc portion between the two straight portions and is located between the positive electrode pad 13 and the negative electrode pad 15, and the two LED chips 20 are, for example, the specification model number 1846. The LED chips are symmetrically disposed in the cup-shaped solid crystal region 110 and are connected to the positive electrode pad 13 and the negative electrode pad 15 and are fixed on the negative electrode pad 15. The two LED chips 20 are arranged horizontally and opposite to the cup cup. The longitudinal dashed lines of the geometric centers of the solid crystal regions 110 (the intersections of the horizontal dashed lines and the longitudinal dashed lines in FIG. 5A) are symmetrically distributed, and the geometric center of each of the LED wafers 20 is located substantially at the geometric center of the cup-shaped solid crystal region 110. On the horizontal dotted line.
在圖5B中,條狀絕緣部112由兩個直線部和位於兩個直線部之間的弧形部構成且位於正極墊13和負極墊15之間,兩顆LED晶片20例如規格型號為2240的LED晶片居中對稱設置在碗杯狀固晶區域110內與正極墊13及負極墊15打線連接且固定在負極墊15上,其具體為兩顆LED晶片20縱向排列且相對於經過碗杯狀固晶區域110的幾何中心(圖5B中橫向虛線與縱向虛線的交叉點)的橫向虛線對稱分佈、以及每一顆LED晶片20的幾何中心大致位於經過碗杯狀固晶區域110的幾何中心的縱向虛線上。In FIG. 5B, the strip-shaped insulating portion 112 is composed of two straight portions and an arc portion between the two straight portions and is located between the positive electrode pad 13 and the negative electrode pad 15, and the two LED chips 20 are, for example, the specification model number 2240. The LED chips are symmetrically disposed in the cup-shaped solid crystal region 110 and are connected to the positive electrode pad 13 and the negative electrode pad 15 and are fixed on the negative electrode pad 15. The two LED chips 20 are arranged in a longitudinal direction and are opposite to the cup cup. The geometrical center of the solid crystal region 110 (the intersection of the horizontal dashed line and the longitudinal dashed line in FIG. 5B) is symmetrically distributed with respect to the transverse dashed line, and the geometric center of each LED wafer 20 is located substantially at the geometric center of the cup-shaped solid crystal region 110. Vertically on the dotted line.
在圖5C中,條狀絕緣部112由兩個直線部和位於兩個直線部之間的弧形部構成且位於正極墊13和負極墊15之間,一顆LED晶片20例如規格型號為2240的LED晶片居中對稱設置在碗杯狀固晶區域110內與正極墊13及負極墊15打線連接且固定在負極墊15上,其具體為單顆LED晶片20幾何中心大致與碗杯狀固晶區域110的幾何中心(圖5C中橫向虛線與縱向虛線的交叉點)重合且其長度方向為圖5C所示橫向方向。In FIG. 5C, the strip-shaped insulating portion 112 is composed of two straight portions and an arc portion between the two straight portions and is located between the positive electrode pad 13 and the negative electrode pad 15, and one LED chip 20 is, for example, a model number 2240. The LED chips are symmetrically disposed in the cup-shaped solid crystal region 110 and are connected to the positive electrode pad 13 and the negative electrode pad 15 and are fixed on the negative electrode pad 15. The specific geometric center of the single LED chip 20 is substantially cup-shaped and solid-shaped. The geometric center of the region 110 (the intersection of the horizontal dashed line and the longitudinal dashed line in Fig. 5C) coincides with the length direction of the lateral direction shown in Fig. 5C.
在圖5D中,條狀絕緣部112由兩個直線部和位於兩個直線部之間的弧形部構成且位於正極墊13和負極墊15之間,一顆LED晶片20例如規格型號為2240的LED晶片居中對稱設置在碗杯狀固晶區域110內與正極墊13及負極墊15打線連接且固定在負極墊15上,其具體為單顆LED晶片20幾何中心大致與碗杯狀固晶區域110的幾何中心(圖5D中橫向虛線與縱向虛線的交叉點)重合且其長度方向為圖5D所示縱向方向。In FIG. 5D, the strip-shaped insulating portion 112 is composed of two straight portions and an arc portion between the two straight portions and is located between the positive electrode pad 13 and the negative electrode pad 15, and one LED chip 20 is, for example, a model number 2240. The LED chips are symmetrically disposed in the cup-shaped solid crystal region 110 and are connected to the positive electrode pad 13 and the negative electrode pad 15 and are fixed on the negative electrode pad 15. The specific geometric center of the single LED chip 20 is substantially cup-shaped and solid-shaped. The geometric center of the region 110 (the intersection of the horizontal dashed line and the longitudinal dashed line in Fig. 5D) coincides with the longitudinal direction thereof as shown in the longitudinal direction shown in Fig. 5D.
在圖5E中,條狀絕緣部112由兩個直線部和位於兩個直線部之間的弧形部構成且位於正極墊13和負極墊15之間,兩顆LED晶片20例如規格型號為F2630的LED晶片居中對稱設置在碗杯狀固晶區域110內與正極墊13及負極墊15打線連接且固定在負極墊15上,其具體為兩顆LED晶片20縱向排列且相對於經過碗杯狀固晶區域110的幾何中心(圖5B中橫向虛線與縱向虛線的交叉點)的橫向虛線對稱分佈、以及每一顆LED晶片20的幾何中心大致位於經過碗杯狀固晶區域110的幾何中心的縱向虛線上。再者,正極墊13上焊接固定有抗靜電用極納二極體晶片30且此極納二極體晶片30的正極打線連接至負極墊15。In FIG. 5E, the strip-shaped insulating portion 112 is composed of two straight portions and an arc portion between the two straight portions and is located between the positive electrode pad 13 and the negative electrode pad 15, and the two LED chips 20 are, for example, the specification model F2630. The LED chips are symmetrically disposed in the cup-shaped solid crystal region 110 and are connected to the positive electrode pad 13 and the negative electrode pad 15 and are fixed on the negative electrode pad 15. The two LED chips 20 are arranged in a longitudinal direction and are opposite to the cup cup. The geometrical center of the solid crystal region 110 (the intersection of the horizontal dashed line and the longitudinal dashed line in FIG. 5B) is symmetrically distributed with respect to the transverse dashed line, and the geometric center of each LED wafer 20 is located substantially at the geometric center of the cup-shaped solid crystal region 110. Vertically on the dotted line. Further, a positive electrode pad 30 for antistatic electrodes is soldered and fixed to the positive electrode pad 13, and a positive electrode of the polar nano diode wafer 30 is connected to the negative electrode pad 15.
參見圖6,在本發明其他實施例中,位於正極墊13和負極墊15之間以間隔開正極墊13和負極墊15的條狀絕緣部112雖然也設計成具有兩個折彎處,但其可以是由三個直線段構成,使得其大致為U型。Referring to FIG. 6, in another embodiment of the present invention, the strip-shaped insulating portion 112 between the positive electrode pad 13 and the negative electrode pad 15 to open the positive electrode pad 13 and the negative electrode pad 15 is also designed to have two bends, but It may be composed of three straight segments such that it is generally U-shaped.
參見圖7,在另外的實施例中,位於正極墊13和負極墊15之間以間隔開正極墊13和負極墊15的條狀絕緣部112甚至還可以設計成具有一個折彎處,並且例如是由兩個直線段構成,使得其大致為L型。Referring to FIG. 7, in another embodiment, the strip-shaped insulating portion 112 between the positive electrode pad 13 and the negative electrode pad 15 to space the positive electrode pad 13 and the negative electrode pad 15 may even be designed to have a bend, and for example It consists of two straight segments, making it roughly L-shaped.
最後,本發明實施例還提供一種LED封裝結構,其包括前述任意一個實施例中的LED支架10、居中對稱分佈在LED支架10的碗杯狀固晶區域10內的一個或多個LED晶片20、以及填充在碗杯狀固晶區域10內且覆蓋各個LED晶片20的封裝體(圖中未繪出)。其中,各個LED晶片20固定在負極墊15上並藉由打線方式與正極墊13和負極墊15形成電連接,封裝體例如是螢光膠像混有螢光粉的矽膠或具有螢光粉塗層的矽膠等。Finally, an embodiment of the present invention further provides an LED package structure including the LED holder 10 in any one of the foregoing embodiments, and one or more LED chips 20 centered symmetrically in the cup-shaped solid crystal region 10 of the LED holder 10. And a package (not shown) that is filled in the cup-shaped solid crystal region 10 and covers each of the LED chips 20. Each of the LED chips 20 is fixed on the negative electrode pad 15 and electrically connected to the positive electrode pad 13 and the negative electrode pad 15 by a wire bonding method, for example, a fluorescent rubber image mixed with a fluorescent powder or a fluorescent powder coating. Layer of silicone and so on.
綜上所述,本發明實施例藉由對LED支架上的電極墊(正極墊、負極墊)的結構設計,使得其中一個電極墊例如正極墊的大小足夠焊線機焊線或者放置一顆極納二極體晶片即可,從而使得另一個電極墊盡可能大,如此LED晶片可以居中對稱設置在LED支架上,達成增加晶片發光效率和散熱效果之目的。另外,可以理解的是,位於正極墊和負極墊之間以間隔開正極墊和負極墊的條狀絕緣部並不限於具有前述的一個或兩個折彎處,其可以具有更多個折彎處;此外,LED晶片的型號並不限於前述所列型號,還也可以是其他型號;而且居中對稱設置在LED支架上的LED晶片的個數並不限於前述的一個或兩個,其還可以是更多個。In summary, in the embodiment of the present invention, the structure of the electrode pads (positive pad, negative pad) on the LED bracket is such that one of the electrode pads, such as the positive pad, is of sufficient size to be soldered or placed with a pole. The nano-diode wafer can be used, so that the other electrode pad is as large as possible, so that the LED chip can be symmetrically disposed on the LED bracket, thereby achieving the purpose of increasing the luminous efficiency and heat dissipation effect of the wafer. In addition, it can be understood that the strip-shaped insulating portion between the positive electrode pad and the negative electrode pad to space the positive electrode pad and the negative electrode pad is not limited to have one or two bends as described above, which may have more bends In addition, the model of the LED chip is not limited to the aforementioned models, and may be other models; and the number of LED chips that are symmetrically disposed on the LED bracket is not limited to one or two of the foregoing, and may also be More.
綜上所述,在本發明中, 雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。In the above, in the present invention, the present invention has been disclosed in the above embodiments, and is not intended to limit the present invention, and it is within the spirit and scope of the present invention. The scope of protection of the present invention is defined by the scope of the appended claims.
10‧‧‧LED支架10‧‧‧LED bracket
20‧‧‧LED晶片20‧‧‧LED chip
11‧‧‧絕緣基板11‧‧‧Insert substrate
110‧‧‧碗杯狀固晶區域110‧‧‧ Bowl cup-shaped solid crystal area
112‧‧‧條狀絕緣部112‧‧‧ Strip insulation
13‧‧‧正極墊13‧‧‧ positive pad
15‧‧‧負極墊15‧‧‧Negative pad
W‧‧‧寬度W‧‧‧Width
122‧‧‧正極墊與絕緣基板的結合處122‧‧‧The junction of the positive electrode pad and the insulating substrate
124‧‧‧負極墊與絕緣基板的結合處124‧‧‧The junction of the negative electrode pad and the insulating substrate
30‧‧‧極納二極體晶片30‧‧‧Dano diode wafer
圖1為本發明實施例提出的一種LED支架(帶有LED晶片)的立體結構示意圖。 圖2為圖1所示結構的立體爆炸示意圖。 圖3為圖1所示結構的平面示意圖。 圖4A為沿圖3中剖線IVA-IVA的剖視圖。 圖4B為沿圖3中剖線IVB-IVB的剖視圖。 圖5A-5E為本發明實施例提出的LED支架應用于LED晶片封裝的各種舉例。 圖6為本發明其他實施例提出的一種LED支架(帶有LED晶片)的結構平面示意圖。 圖7為本發明其他實施例提出的另一種LED支架(帶有LED晶片)的結構平面示意圖。FIG. 1 is a schematic perspective structural view of an LED holder (with an LED chip) according to an embodiment of the present invention. 2 is a schematic exploded perspective view of the structure shown in FIG. 1. Figure 3 is a plan view showing the structure of Figure 1. Fig. 4A is a cross-sectional view taken along line IVA-IVA of Fig. 3. Fig. 4B is a cross-sectional view taken along line IVB-IVB of Fig. 3. 5A-5E illustrate various examples of application of an LED bracket to an LED chip package according to an embodiment of the present invention. FIG. 6 is a schematic plan view showing the structure of an LED holder (with an LED chip) according to another embodiment of the present invention. FIG. 7 is a schematic plan view showing another structure of an LED holder (with an LED chip) according to another embodiment of the present invention.
Claims (10)
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TW200901518A (en) * | 2007-04-18 | 2009-01-01 | Cree Inc | Semiconductor light emitting device packages and methods |
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