TWI624619B - Light-emitting device - Google Patents

Light-emitting device Download PDF

Info

Publication number
TWI624619B
TWI624619B TW106112311A TW106112311A TWI624619B TW I624619 B TWI624619 B TW I624619B TW 106112311 A TW106112311 A TW 106112311A TW 106112311 A TW106112311 A TW 106112311A TW I624619 B TWI624619 B TW I624619B
Authority
TW
Taiwan
Prior art keywords
light
cover
layer
radiation
reflective layer
Prior art date
Application number
TW106112311A
Other languages
Chinese (zh)
Other versions
TW201837371A (en
Inventor
彭耀祈
李柏蒼
簡銘宏
Original Assignee
光寶電子(廣州)有限公司
光寶科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 光寶電子(廣州)有限公司, 光寶科技股份有限公司 filed Critical 光寶電子(廣州)有限公司
Priority to TW106112311A priority Critical patent/TWI624619B/en
Application granted granted Critical
Publication of TWI624619B publication Critical patent/TWI624619B/en
Publication of TW201837371A publication Critical patent/TW201837371A/en

Links

Landscapes

  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

發光裝置包括燈罩、透光前罩、發光元件、輻射層及反射層。透光前罩與燈罩結合且兩者之間形成腔體。發光元件配置在燈罩上且位於腔體內。發光元件用以朝向透光前罩發射光線。輻射層形成於燈罩上且其上設有反射層。 The light emitting device comprises a lamp cover, a light transmissive front cover, a light emitting element, a radiation layer and a reflective layer. The light transmissive front cover is combined with the lamp cover and a cavity is formed therebetween. The illuminating element is disposed on the lamp cover and located within the cavity. The illuminating element is configured to emit light toward the light transmissive front cover. A radiation layer is formed on the lamp cover and a reflective layer is disposed thereon.

Description

發光裝置 Illuminating device

本發明是有關於一種發光裝置,且特別是有關於一種具有輻射層的發光裝置。 The present invention relates to a light-emitting device, and more particularly to a light-emitting device having a radiation layer.

傳統發光裝置在發光的同時不可避免地會產生熱量。愈多的發光元件,產生的熱量愈多,如此可能導致發光裝置超過熱負荷而失效。因此,有需要提出一種新的可提升散熱效率的發光裝置。 Conventional light-emitting devices inevitably generate heat while emitting light. The more light-emitting elements, the more heat is generated, which may cause the light-emitting device to fail beyond the thermal load. Therefore, there is a need to propose a new light-emitting device that can improve heat dissipation efficiency.

本發明係有關於一種發光裝置,可改善前述問題。 The present invention relates to a light-emitting device that can ameliorate the aforementioned problems.

根據本發明之一實施例,提出一種發光裝置。發光裝置包括一燈罩、一透光前罩、一發光元件、一輻射層及一反射層。透光前罩與燈罩結合且兩者之間形成一腔體。發光元件配置在燈罩上且位於腔體內,發光元件用以朝向透光前罩發射光線。輻射層形成於燈罩上且其上設有反射層。 According to an embodiment of the invention, a lighting device is proposed. The light emitting device comprises a lamp cover, a light transmissive front cover, a light emitting element, a radiation layer and a reflective layer. The light transmissive front cover is combined with the lamp cover and a cavity is formed therebetween. The illuminating element is disposed on the lamp cover and located in the cavity, and the illuminating element is configured to emit light toward the transparent front cover. A radiation layer is formed on the lamp cover and a reflective layer is disposed thereon.

為了對本發明之上述及其他方面有更佳的瞭解,下文特舉實施例,並配合所附圖式詳細說明如下: In order to better understand the above and other aspects of the present invention, the following detailed description of the embodiments and the accompanying drawings

100‧‧‧發光裝置 100‧‧‧Lighting device

120‧‧‧燈罩 120‧‧‧shade

110‧‧‧透光前罩 110‧‧‧Light front cover

120s1‧‧‧內表面 120s1‧‧‧ inner surface

120s2‧‧‧外表面 120s2‧‧‧ outer surface

125‧‧‧電路板 125‧‧‧Circuit board

130‧‧‧發光元件 130‧‧‧Lighting elements

131‧‧‧透鏡 131‧‧‧ lens

140‧‧‧輻射層 140‧‧‧radiation layer

150‧‧‧反射層 150‧‧‧reflective layer

H1‧‧‧熱量 H1‧‧‧heat

L1‧‧‧光線 L1‧‧‧Light

R1‧‧‧腔體 R1‧‧‧ cavity

T1、T2、T3‧‧‧厚度 T1, T2, T3‧‧‧ thickness

第1圖繪示依照本發明一實施例之發光裝置的示意圖。 FIG. 1 is a schematic view of a light emitting device according to an embodiment of the invention.

第2圖繪示第1圖之發光裝置沿方向2-2’的部分剖視圖。 Fig. 2 is a partial cross-sectional view of the light-emitting device of Fig. 1 taken along the direction 2-2'.

請參照第1及2圖,第1圖繪示依照本發明一實施例之發光裝置100的示意圖,而第2圖繪示第1圖之發光裝置100沿方向2-2’的部分剖視圖。 1 and 2, FIG. 1 is a schematic view of a light-emitting device 100 according to an embodiment of the present invention, and FIG. 2 is a partial cross-sectional view of the light-emitting device 100 of FIG. 1 along a direction 2-2'.

發光裝置100可應用於路燈或其它需要照明的產品。發光裝置100包括透光前罩110、燈罩120、電路板125、至少一發光元件130、輻射層140及反射層150。 The illumination device 100 can be applied to street lamps or other products that require illumination. The light emitting device 100 includes a light transmissive front cover 110, a lamp cover 120, a circuit board 125, at least one light emitting element 130, a radiation layer 140, and a reflective layer 150.

透光前罩110與燈罩120結合且兩者之間形成一腔體R1。雖然圖未繪示,然透光前罩110與燈罩120可透過卡合、鎖固或黏合方式彼此固定,使透光前罩110與燈罩120之間的腔體R1如同密閉空間,進而使外界環境因子(如液體、水氣、雜質等)不易進入腔體R1內。 The light transmissive front cover 110 is combined with the lamp cover 120 and a cavity R1 is formed therebetween. Although the figure is not shown, the light-transmitting front cover 110 and the lamp cover 120 can be fixed to each other by snapping, locking or bonding, so that the cavity R1 between the light-transmitting front cover 110 and the lamp cover 120 is like a closed space, thereby making the outside world Environmental factors (such as liquids, moisture, impurities, etc.) do not easily enter the cavity R1.

電路板125配置在燈罩120上。發光元件130配置在電路板125上,並朝向透鏡131及透光前罩110發射光線L1,其中光線L1例如是可見光。透鏡131及透光前罩110經過設計,使得光線L1透過透鏡131及透光前罩110後產生預定的照明區域。電路板125、發光元件130及透鏡131位於腔體R1內,以受到透光前罩110與燈罩120的保護,減少或避免受到外界環境的侵害。燈罩120例如是壓鑄件。燈罩120的材料例如是金屬,如鋁或其它散熱佳的材料,可將發光元件130產生的熱量H1快速地對流或輻射至環境中,以增加散熱效果。 The circuit board 125 is disposed on the lamp cover 120. The light-emitting element 130 is disposed on the circuit board 125 and emits light L1 toward the lens 131 and the light-transmitting front cover 110, wherein the light L1 is, for example, visible light. The lens 131 and the light-transmitting front cover 110 are designed such that the light L1 passes through the lens 131 and the light-transmitting front cover 110 to generate a predetermined illumination area. The circuit board 125, the light-emitting element 130 and the lens 131 are located in the cavity R1 to be protected by the transparent front cover 110 and the lamp cover 120, thereby reducing or avoiding damage from the external environment. The globe 120 is, for example, a die cast. The material of the lamp cover 120 is, for example, a metal such as aluminum or other heat-dissipating material, and the heat H1 generated by the light-emitting element 130 can be quickly convected or radiated into the environment to increase the heat dissipation effect.

輻射層140形成於燈罩120上。例如,輻射層140可採用噴塗方式直接或間接形成在燈罩120之內表面120s1中受到腔體R1覆蓋的部分。在另一實施例中,輻射層140可更形成在燈罩120之內表面120s1中受到腔體R1覆蓋的部分外,如燈罩120之外表面120s2或燈罩120的整個內外表面。 The radiation layer 140 is formed on the globe 120. For example, the radiation layer 140 may be formed directly or indirectly by spraying in a portion of the inner surface 120s1 of the globe 120 that is covered by the cavity R1. In another embodiment, the radiation layer 140 may be formed more outside the portion of the inner surface 120s1 of the globe 120 that is covered by the cavity R1, such as the outer surface 120s2 of the globe 120 or the entire inner and outer surfaces of the globe 120.

輻射層140可將腔體R1內的熱量H1傳導至燈罩120,以提升發光裝置100的散熱效率。詳言之,受到腔體R1的限制,光線L1可能在腔體R1內循環反射,而導致腔體R1內的熱量H1累積,造成發光裝置100溫度上升,但由於本發明實施例之輻射層140的設計,發光元件130所產生的熱能透過輻射層140可迅速傳導至燈罩120,然後再透過燈罩120輻射至外界環境,其輻射能量包含於光線L1中的可見光或不可見的波長範圍,使發光裝置100的散熱效率得以提升。因此,本發明實施例之輻射層140可做為一熱傳導層。 The radiation layer 140 can conduct the heat H1 in the cavity R1 to the lamp cover 120 to improve the heat dissipation efficiency of the light emitting device 100. In detail, limited by the cavity R1, the light L1 may be cyclically reflected in the cavity R1, causing the heat H1 in the cavity R1 to accumulate, causing the temperature of the light-emitting device 100 to rise, but due to the radiation layer 140 of the embodiment of the present invention. The heat energy generated by the light-emitting element 130 can be quickly transmitted to the lamp cover 120 through the radiation layer 140, and then radiated to the external environment through the lamp cover 120, and the radiant energy is included in the visible light or invisible wavelength range of the light L1, so that the light is emitted. The heat dissipation efficiency of the device 100 is improved. Therefore, the radiation layer 140 of the embodiment of the present invention can be used as a heat conduction layer.

由於發光裝置100的散熱效率提升,因此發光元件130可以配置在密閉的腔體R1內,不需在燈罩120的部位開孔以提升散熱效率,或者降低透光前罩110與燈罩120之間的密合性。詳言之,發光元件130發出的光線L1雖然無可避免地在腔體R1內循環折射,然由於輻射層140的設計,光線L1的部分輻射熱量能迅速透過輻射層140傳導至燈罩120,再透過燈罩120輻射至外界環境,因此可降低腔體R1內的溫度及壓力變動幅度,進而能減少或避免透光前罩110與燈罩120之間的密合性的下降,因為若腔體R1的溫度變動幅度增大,則壓力變動幅度也會劇烈,必然降低透光前罩110與燈罩120之間的密合性。 Since the heat dissipation efficiency of the light-emitting device 100 is improved, the light-emitting element 130 can be disposed in the sealed cavity R1 without opening a hole in the lamp cover 120 to improve heat dissipation efficiency, or reduce the gap between the light-transmitting front cover 110 and the lamp cover 120. Adhesion. In detail, although the light L1 emitted from the light-emitting element 130 is inevitably refracted in the cavity R1, due to the design of the radiation layer 140, part of the radiant heat of the light L1 can be quickly transmitted to the lamp cover 120 through the radiation layer 140, and then The radiation is radiated to the external environment through the lamp cover 120, so that the temperature and pressure fluctuation range in the cavity R1 can be reduced, thereby reducing or avoiding the decrease in the adhesion between the light-transmitting front cover 110 and the lamp cover 120, because if the cavity R1 is When the temperature fluctuation range is increased, the pressure fluctuation range is also severe, and the adhesion between the light-transmitting front cover 110 and the lamp cover 120 is inevitably lowered.

在一實施例中,燈罩120的熱輻射效率小於輻射層140的熱輻射效率。由於輻射層140提供一較高的熱輻射效率,因此即使燈罩120的熱輻射效率是低的,僅透過輻射層140也能提升發光裝置100的整體散熱效率。在一實施例中,輻射層140的熱輻射效率是大於0.9,而燈罩120的熱輻射效率約為0.4。 In an embodiment, the heat radiation efficiency of the globe 120 is less than the heat radiation efficiency of the radiation layer 140. Since the radiation layer 140 provides a higher heat radiation efficiency, even if the heat radiation efficiency of the globe 120 is low, the overall heat dissipation efficiency of the light-emitting device 100 can be improved only by the radiation layer 140. In one embodiment, the heat radiation efficiency of the radiation layer 140 is greater than 0.9, and the heat radiation efficiency of the globe 120 is about 0.4.

在一實施例中,輻射層140的厚度T1與反射層150的厚度T2的總厚度可介於60微米與200微米之間。由於本發明實施例之輻射層140能將熱量H1迅速傳導至燈罩120,相較於無輻射層140及反射層150的設計,雖然本發明實施例的發光裝置100的厚度T3因輻射層140及反射層150而增加,但發光裝置100的散熱效率反而提升。依據實驗,本發明實施例的發光裝置100的散熱效率提升3%。 In an embodiment, the total thickness of the thickness T1 of the radiation layer 140 and the thickness T2 of the reflective layer 150 may be between 60 microns and 200 microns. Because the radiation layer 140 of the embodiment of the present invention can quickly transfer the heat H1 to the lamp cover 120, compared with the design of the non-radiation layer 140 and the reflective layer 150, although the thickness T3 of the light-emitting device 100 of the embodiment of the present invention is due to the radiation layer 140 and The reflective layer 150 is increased, but the heat dissipation efficiency of the light-emitting device 100 is instead increased. According to the experiment, the heat dissipation efficiency of the light-emitting device 100 of the embodiment of the present invention is increased by 3%.

由於本發明實施例之發光裝置100能有效提升散熱效率,因此即使發光元件130的數量較多,仍可確保散熱效率。在一實施例中,發光元件130的數量例如是12個。 Since the light-emitting device 100 of the embodiment of the present invention can effectively improve the heat dissipation efficiency, even if the number of the light-emitting elements 130 is large, the heat dissipation efficiency can be ensured. In an embodiment, the number of light emitting elements 130 is, for example, twelve.

反射層150形成於輻射層140上,其中輻射層140位於反射層150與燈罩120之間。反射層150反射在腔體R1內循環的光線L1,進而能提升發光裝置100的出光強度。由於輻射層140的設計,使反射層150可具有一高的反射率。高反射率的反射層150會提昇在腔體R1內由發光元件130所發出光線的回收效率,減少熱量H1於腔體R1內的累積量,然透過輻射層140的設計,仍可將此些累積的熱量H1迅速地傳導至燈罩120,然後再透過燈罩120輻射或對流至外界環境。在一實施例中,反射層150的反射率可大於85%。此外,反射層150的材料可 包括氧化鈦或氧化鋅。氧化鈦或氧化鋅的重量百分比可介於約0.5%至15%之間。 The reflective layer 150 is formed on the radiation layer 140, wherein the radiation layer 140 is located between the reflective layer 150 and the globe 120. The reflective layer 150 reflects the light ray L1 circulating in the cavity R1, thereby improving the light-emitting intensity of the light-emitting device 100. Due to the design of the radiation layer 140, the reflective layer 150 can have a high reflectivity. The high reflectivity reflective layer 150 enhances the recovery efficiency of the light emitted by the light-emitting element 130 in the cavity R1, and reduces the accumulated amount of heat H1 in the cavity R1. However, the design of the radiation layer 140 can still be used. The accumulated heat H1 is quickly conducted to the globe 120 and then radiated or convected through the globe 120 to the outside environment. In an embodiment, the reflective layer 150 may have a reflectivity greater than 85%. In addition, the material of the reflective layer 150 can be Includes titanium oxide or zinc oxide. The weight percentage of titanium oxide or zinc oxide may be between about 0.5% and 15%.

反射層150可採用例如是噴塗方式(如烤漆)直接或間接形成在輻射層140上。由於反射層150與輻射層140係分別形成,因此輻射層140與反射層150為二層不同的結構,二者間具有一明顯的分界面。在另一實施例中,視反射層150及輻射層140的材料及/或製程而定,輻射層140與反射層150之間的分界面也可能不明顯或幾乎無法分辨。 The reflective layer 150 can be formed directly or indirectly on the radiation layer 140, for example, by spraying (e.g., baking varnish). Since the reflective layer 150 and the radiation layer 140 are respectively formed, the radiation layer 140 and the reflective layer 150 have a two-layer different structure with a distinct interface therebetween. In another embodiment, depending on the material and/or process of the reflective layer 150 and the radiation layer 140, the interface between the radiation layer 140 and the reflective layer 150 may also be insignificant or nearly indistinguishable.

本發明實施例藉由輻射層140及反射層150的設置,使得光線L1經反射層150的反射後由透光前罩110出光,產生的熱量H1可由輻射層140傳導至燈罩120,因此發光裝置100的整體光學效率可達95%。 In the embodiment of the present invention, the radiation layer 140 and the reflective layer 150 are disposed, so that the light L1 is reflected by the reflective layer 150 and then emitted by the transparent front cover 110, and the generated heat H1 can be transmitted from the radiation layer 140 to the lamp cover 120. The overall optical efficiency of 100 is up to 95%.

綜上所述,雖然本發明已以實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。 In conclusion, the present invention has been disclosed in the above embodiments, but it is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

Claims (8)

一種發光裝置,包括:一燈罩;一透光前罩,與該燈罩結合且兩者之間形成一腔體;一發光元件,配置在該燈罩上且位於該腔體內,該發光元件發出的光線透過該透光前罩而出光;一輻射層,形成於該燈罩上;以及一反射層,形成於該輻射層上;其中該燈罩的熱輻射效率小於該輻射層的熱輻射效率。 A light-emitting device comprising: a light cover; a light-transmissive front cover coupled to the light cover and forming a cavity therebetween; a light-emitting element disposed on the light cover and located in the cavity, the light emitted by the light-emitting element Light is emitted through the transparent front cover; a radiation layer is formed on the lamp cover; and a reflective layer is formed on the radiation layer; wherein the heat radiation efficiency of the lamp cover is less than the heat radiation efficiency of the radiation layer. 如申請專利範圍第1項所述之發光裝置,其中該反射層的反射率大於85%。 The illuminating device of claim 1, wherein the reflective layer has a reflectance greater than 85%. 如申請專利範圍第1項所述之發光裝置,其中該反射層的材料包括氧化鈦或氧化鋅。 The illuminating device of claim 1, wherein the material of the reflective layer comprises titanium oxide or zinc oxide. 如申請專利範圍第3項所述之發光裝置,其中該氧化鈦或氧化鋅的重量百分比介於0.5%至15%之間。 The illuminating device of claim 3, wherein the titanium oxide or zinc oxide has a weight percentage of between 0.5% and 15%. 如申請專利範圍第1項所述之發光裝置,其中該輻射層與該反射層之間具有一分界面。 The illuminating device of claim 1, wherein the radiation layer and the reflective layer have an interface. 如申請專利範圍第1項所述之發光裝置,其中該輻射層與該反射層為二層不同的結構。 The illuminating device of claim 1, wherein the radiant layer and the reflective layer have a different structure. 一種發光裝置,包括:一燈罩;一透光前罩,與該燈罩結合且兩者之間形成一腔體; 一發光元件,配置在該燈罩上且位於該腔體內,該發光元件發出的光線透過該透光前罩而出光;一輻射層,形成於該燈罩上;以及一反射層,形成於該輻射層上;其中該輻射層的厚度與該反射層的厚度的總和介於60微米與200微米之間。 A light-emitting device comprising: a lamp cover; a light-transmitting front cover combined with the lamp cover and forming a cavity therebetween; a light-emitting element disposed on the lamp cover and located in the cavity, the light emitted by the light-emitting element is transmitted through the transparent front cover; a radiation layer is formed on the lamp cover; and a reflective layer is formed on the radiation layer And wherein the sum of the thickness of the radiation layer and the thickness of the reflective layer is between 60 microns and 200 microns. 一種發光裝置,包括:一燈罩;一透光前罩,與該燈罩結合且兩者之間形成一腔體;一發光元件,配置在該燈罩上且位於該腔體內,該發光元件發出的光線透過該透光前罩而出光;一輻射層,形成於該燈罩上;以及一反射層,形成於該輻射層上;其中該輻射層的熱輻射效率大於0.9。 A light-emitting device comprising: a light cover; a light-transmissive front cover coupled to the light cover and forming a cavity therebetween; a light-emitting element disposed on the light cover and located in the cavity, the light emitted by the light-emitting element Light is emitted through the transparent front cover; a radiation layer is formed on the lamp cover; and a reflective layer is formed on the radiation layer; wherein the radiation layer has a heat radiation efficiency greater than 0.9.
TW106112311A 2017-04-13 2017-04-13 Light-emitting device TWI624619B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW106112311A TWI624619B (en) 2017-04-13 2017-04-13 Light-emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW106112311A TWI624619B (en) 2017-04-13 2017-04-13 Light-emitting device

Publications (2)

Publication Number Publication Date
TWI624619B true TWI624619B (en) 2018-05-21
TW201837371A TW201837371A (en) 2018-10-16

Family

ID=62951788

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106112311A TWI624619B (en) 2017-04-13 2017-04-13 Light-emitting device

Country Status (1)

Country Link
TW (1) TWI624619B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111998310A (en) * 2020-08-19 2020-11-27 浙江工业大学 Multistage infrared heat dissipation street lamp shade

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002090515A (en) * 2000-07-12 2002-03-27 Toray Ind Inc White film for reflecting member of surface light source
JP2003114431A (en) * 2001-10-04 2003-04-18 Matsushita Electric Ind Co Ltd Illumination unit and liquid crystal display device using the same
TW200538767A (en) * 2004-04-28 2005-12-01 Nippon Steel Corp Visible light reflector and electrical/electronic device incorporating the same
KR20090068927A (en) * 2007-12-24 2009-06-29 (주)보광라이팅 Light utensils

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002090515A (en) * 2000-07-12 2002-03-27 Toray Ind Inc White film for reflecting member of surface light source
JP2003114431A (en) * 2001-10-04 2003-04-18 Matsushita Electric Ind Co Ltd Illumination unit and liquid crystal display device using the same
TW200538767A (en) * 2004-04-28 2005-12-01 Nippon Steel Corp Visible light reflector and electrical/electronic device incorporating the same
KR20090068927A (en) * 2007-12-24 2009-06-29 (주)보광라이팅 Light utensils

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111998310A (en) * 2020-08-19 2020-11-27 浙江工业大学 Multistage infrared heat dissipation street lamp shade

Also Published As

Publication number Publication date
TW201837371A (en) 2018-10-16

Similar Documents

Publication Publication Date Title
JP5410167B2 (en) Light emitting module and vehicle headlamp
TWI520383B (en) Light emitting diode package structure
TW201320386A (en) Light emitting unit
JP2017513182A (en) Incorporating optical reflectors as part of the heat dissipation path for LED systems
TWI573960B (en) Straight tube type light emitting diode type lighting
TWI624619B (en) Light-emitting device
TWI651869B (en) Light emitting diode
JP6093017B2 (en) LIGHTING DEVICE, LIGHTING REFLECTOR AND MANUFACTURING METHOD THEREOF
US10508872B2 (en) Street lamp with enchanced heat dissipation
JP5446594B2 (en) lighting equipment
JP2014011088A (en) Illumination device
US7314292B2 (en) Lighting device
TWM513962U (en) Lighting device
JP2013093191A (en) Led bulb
JP2011171236A (en) Luminaire
TWI468805B (en) Backlight module and light device thereof
TWI573962B (en) Lamp structure
TWI586919B (en) Illumination device
TWI573951B (en) Led light guide lamp
KR20170048514A (en) Light source
TWM554149U (en) Lamp
US20130314894A1 (en) Lighting apparatus
GB2544139A (en) Electronic device and circuit module thereof
JP2006295054A (en) Light source
JP6620892B2 (en) Semiconductor lamp