TWI623443B - Graphical thermal transfer structure - Google Patents

Abstract

A patterned thermal transfer structure comprising an elastic layer, an adhesive layer and a pile layer, the elastic layer being made of a malleable elastic material, the adhesive layer being made of an adhesive elastic material, covering Bonding to one side surface of the elastic layer; the pile layer is a subsequent interface disposed between the elastic layer and the adhesive layer, and includes a plurality of fluffs simultaneously implanted in the elastic layer and the adhesive layer, which greatly increases elasticity The adhesion of the layer to the adhesive layer.

Description

Graphical thermal transfer structure

The invention relates to a thermal transfer structure which can be applied to a silicone rubber and a hot melt adhesive, in particular to a processing method of flocking and the like, and a veneer and a hot melt adhesive are used as a bonding interface to increase the silicone and the hot melt. Adhesive fastness of the glue.

The traditional thermal transfer pattern is mainly made by ink screen printing, and then transferred to the surface of the substrate such as clothes by thermal transfer, but the elasticity and recovery are not good, especially when the substrate is excessively pulled. After stretching or twisting, the pattern attached to the substrate is damaged and deformed irreversibly.

Silicone material is an elastic material with excellent ductility and has the advantages of no color limitation and good hiding power. Therefore, silicone materials have been widely used in thermal transfer structures, and the color fastness after transfer is good. The touch is smooth, so it is gradually popular and adopted.

However, since the two kinds of rubbers such as silicone rubber and hot melt adhesive are incompatible and the adhesion fastness is not good, after the hot melt adhesive is adhered to the substrate, the peeling of the silicone rubber may occur after a certain period of time, but the problem is solved. Point, so far no effective improvements or solutions have been proposed.

In view of this, the main object of the present invention is to provide a method for the thermal offset structure in the technical field that the silicone rubber and the hot melt adhesive are incompatible and the adhesion fastness is not good. A viable solution that will improve adhesion fastness.

According to the above object, the present invention provides a patterned thermal transfer structure comprising: an elastic layer made of a malleable elastic material; and an adhesive layer made of an adhesive elastic material covering And a fluff layer disposed between the elastic layer and the adhesive layer, the fluff layer comprising a plurality of fluffs simultaneously implanted in the elastic layer and the adhesive layer.

According to the above configuration, the present invention greatly increases the adhesion between the elastic layer and the adhesive layer by means of flocking and the like, by using the pile as the adhesive layer and the adhesive layer.

In the present invention, the elastic layer is silicone, latex, PU or TPU.

In the present invention, the adhesive layer is a hot melt adhesive or a thermoplastic resin.

The detailed features and advantages of the present invention are set forth in the Detailed Description of the Detailed Description of the <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> </ RTI> <RTIgt; The objects and advantages associated with the present invention can be readily understood by those skilled in the art.

100‧‧‧ Graphical thermal transfer structure

1‧‧‧elastic layer

2‧‧‧Adhesive layer

3‧‧‧Fleece

31‧‧‧ fluff

4‧‧‧ release paper

1 is a cross-sectional view showing a preferred embodiment of the patterned thermal transfer structure of the present invention; and FIG. 2 is a schematic view of the processing of the patterned thermal transfer structure of the present invention; 3 is a schematic view of the processing and molding of the patterned thermal transfer structure of the present invention; and FIG. 4 is a three-dimensional combination schematic diagram 3 of the patterned thermal transfer structure of the present invention.

Referring to FIG. 1, a cross-sectional view of a preferred embodiment of the patterned thermal transfer structure of the present invention, the patterned thermal transfer structure 100 mainly includes an elastic layer 1 bonded to the upper surface of the elastic layer 1. An adhesive layer 2, and a pile layer 3 for connecting the elastic layer 1 and the adhesive layer 2.

The elastic layer 1 is made of a malleable elastic material such as silicone, latex, PU or TPU, etc., and the elastic layer 1 is designed to be a single pattern or composed of a plurality of block patterns.

The adhesive layer 2 is made of an adhesive elastic material, such as a hot melt adhesive or a thermoplastic resin. The shape of the adhesive layer 2 is designed according to a desired pattern shape, and is covered and bonded to the elastic layer 1 . Upper surface.

The pile layer 3 is disposed between the elastic layer 1 and the adhesive layer 2 as an interface between the elastic layer 1 and the adhesive layer 2, and the pile layer 3 is mainly processed by flocking or the like. The plurality of fluff 31 is planted in each region of the upper surface of the elastic layer 1; after the tufting of the upper surface of the elastic layer 1 is completed, the adhesive layer 2 is bonded to the upper surface of the elastic layer 1 to make the fluff The other end of 31 is implanted with the adhesive layer 2.

It can be seen from the above description that the present invention is used as the interface between the elastic layer 1 and the adhesive layer 2, regardless of whether the elastic layer 1 and the adhesive layer 2 are made of a material. The adhesion and the adhesion fastness, the elastic layer can be made by the connection relationship provided by the pile layer 3 1 and the adhesive layer 2, as with millions of connecting columns, are closely connected, greatly increasing the adhesion fastness of the elastic layer 1 and the adhesive layer 2.

In order to protect the surface pattern of the elastic layer 1 , a release paper 4 is attached to the lower surface of the elastic layer 1 to prevent the pattern surface of the elastic layer 20 from being contaminated with dust, which affects the gloss and appearance of the pattern.

With the above configuration, a patterned thermal transfer structure is constructed, and can be transferred to the surface of the substrate by thermal transfer, and then the release paper 4 is removed, so that the surface of the substrate can exhibit the elasticity. The pattern preset by layer 1. The substrates include, but are not limited to, various fabrics or utensils.

Please refer to FIG. 2, FIG. 3 and FIG. 4 in sequence. The patterned thermal transfer structure of the present invention comprises the following steps: extending the proportion and color of the silicone, latex, PU or TPU. The elastic material is printed on a release paper 4 to form an elastic layer 1 having a suitable thickness and color; and then, a plurality of fluffs 31 are planted on the upper surface of the elastic layer 1 by flocking or the like to make the elasticity The upper surface of the layer 1 is formed with a pile layer 3 composed of a plurality of piles 31; finally, an adhesive elastic material such as hot melt adhesive or thermoplastic resin is printed on the upper surface of the elastic layer 1 to form a cover layer bonded to the elastic layer. 1 an adhesive layer 2 on the upper surface.

Thus, a fluff layer 3 is formed as the subsequent interface between the elastic layer 1 and the adhesive layer 2, which greatly increases the adhesion fastness of the elastic layer 1 and the adhesive layer 2.

It can be seen from the above description that the patterned thermal transfer structure 100 disclosed in the present invention is an innovative structure capable of achieving the object of the present invention. Through the above detailed description, the object and the efficacy of the present invention can be fully demonstrated. Sexuality, which is unprecedented in the market, fully meets the patent requirements, and applies in accordance with the law; only the above is only the preferred embodiment of the present invention, when it cannot be used All changes and modifications made to the scope of the invention are intended to be within the scope of the invention.

Claims (4)

A patterned thermal transfer structure comprises: an elastic layer made of a malleable elastic material; an adhesive layer made of an adhesive elastic material covering the side surface of the elastic layer And a layer of fluff disposed between the elastic layer and the adhesive layer, the pile layer comprising a plurality of fluffs simultaneously implanted in the elastic layer and the adhesive layer. The patterned thermal transfer structure of claim 1, wherein the elastic layer is silicone, latex, PU or TPU. The patterned thermal transfer structure of claim 1, wherein the adhesive layer is a hot melt adhesive or a thermoplastic resin. A patterned thermal transfer structure according to claim 1, wherein the other side surface of the elastic layer is bonded to a release paper.