TW201811577A - Patterned heat transfer structure comprising an elastic layer, an adhesive layer, and a flocking layer - Google Patents

Abstract

A patterned thermal transfer structure comprises an elastic layer, an adhesive layer, and a flocking layer, wherein the elastic layer is made of a tensile elastic material, and the adhesive layer is made of an adhesive elastic material that covers and is attached to a surface of one side of the elastic layer; and the flocking layer is a bonding interface disposed between the elastic layer and the adhesive layer, and comprises a plurality of fuzzes implanted in both the elastic layer and the adhesive layer. The adhesion fastness of the elastic layer and the adhesive layer is greatly improved.

Description

Graphical thermal transfer structure

The invention relates to a thermal transfer structure composed of silicon glue and hot melt adhesive, in particular to a method such as flocking, which uses fleece as a bonding interface of silicon glue and hot melt adhesive to increase silicon glue and hot melt. Adhesion fastness of glue.

The traditional thermal transfer pattern is mainly made by ink screen printing, and the thermal transfer method is used to transfer the pattern to the surface of substrates such as clothing. However, due to the poor elasticity and recovery, especially when the substrate is pulled excessively After being stretched or distorted, the pattern transferred to the substrate will be damaged and deformed irreversibly.

Silicone material is an elastic material with excellent ductility. At the same time, it has the advantages of being free from color restrictions and good hiding power. Therefore, the silicon material has been widely used in thermal transfer structures. It is silky to the touch and is gradually gaining popularity and adoption.

However, due to the incompatibility of two kinds of adhesives, silicon adhesive and hot-melt adhesive, and poor adhesion fastness, after using hot-melt adhesive to adhere to the substrate, silicone peeling may occur after a period of time, but for this problem Point, so far no effective improvement or solution has been proposed.

In view of this, the main object of the present invention is to address the problem of the incompatibility and poor adhesion of two types of silicone and hot melt adhesives in the technical field of thermal transfer structures. A viable solution that will improve adhesion fastness.

According to the above purpose, the present invention proposes a patterned thermal transfer structure, including: an elastic layer made of a stretchable elastic material; an adhesive layer made of an adhesive elastic material, covering Combined with one surface of the elastic layer; and a fluff layer disposed between the elastic layer and the adhesive layer, the flocking layer includes a plurality of fluffs planted simultaneously in the elastic layer and the adhesive layer.

With the above structure, the present invention greatly improves the adhesion fastness of the elastic layer and the adhesive layer by using flock as a bonding interface of the elastic layer and the adhesive layer through processing methods such as flocking.

In the present invention, the elastic layer is silicon rubber, latex, PU or TPU.

In the present invention, the adhesive layer is a hot melt adhesive or a thermoplastic resin having elasticity.

The detailed features and advantages of the present invention are described in detail in the following embodiments. The content is sufficient for any person skilled in the art to understand and implement the technical contents of the present invention. Anyone skilled in the related art can easily understand the related objects and advantages of the present invention.

Please refer to the cross-sectional view of a preferred embodiment of the patterned thermal transfer structure of the present invention disclosed in FIG. 1. The patterned thermal transfer structure 100 mainly includes an elastic layer 1 combined with an upper surface of the elastic layer 1. An adhesive layer 2 and a flocking layer 3 for connecting the elastic layer 1 and the adhesive layer 2.

The elastic layer 1 is made of a ductile elastic material, such as silicone, latex, PU, or TPU. The elastic layer 1 is designed to present a single pattern or consist of multiple block patterns.

The adhesive layer 2 is made of an elastic material with adhesive properties, such as hot-melt adhesive or thermoplastic resin. The shape of the adhesive layer 2 is designed according to the required pattern shape, and is covered and combined with the elastic layer 1 On the surface.

The fluff layer 3 is disposed between the elastic layer 1 and the adhesive layer 2 as a bonding interface between the elastic layer 1 and the adhesive layer 2. The fluff layer 3 is mainly processed by flocking or other processing methods. A plurality of fluffs 31 are planted and distributed in various areas on the upper surface of the elastic layer 1; after the planting operation of the fluffs 31 on the upper surface of the elastic layer 1 is completed, the adhesive layer 2 is combined and covered on the upper surface of the elastic layer 1 to make the fluffs The other end of 31 is implanted into the adhesive layer 2.

It can be known from the above description that the present invention uses the fluff layer 3 as a bonding interface between two different materials of the elastic layer 1 and the adhesive layer 2, regardless of whether the materials used for the elastic layer 1 and the adhesive layer 2 are compatible Capacity and adhesion fastness, through the connection relationship provided by the fluff layer 3, the elastic layer 1 and the adhesive layer 2 can be closely connected as if they have millions of connection posts, greatly increasing Adhesion fastness of the elastic layer 1 and the adhesive layer 2.

During the implementation, in order to protect the surface pattern of the elastic layer 1, a release paper 4 is attached to the lower surface of the elastic layer 1 to prevent dust on the pattern surface of the elastic layer 20 from affecting the gloss and beauty of the pattern.

With the above structure, a patterned thermal transfer structure is formed, which can be transferred to the surface of the substrate by thermal transfer. After the release paper 4 is removed, the surface of the substrate can exhibit the elasticity. The preset pattern for layer 1. The substrate includes, but is not limited to, various fabrics or appliances.

Please refer to FIG. 2, FIG. 3 and FIG. 4 in order. The production of the patterned thermal transfer structure of the present invention includes the following steps:

Print a stretchable elastic material such as silicone, latex, PU or TPU with the proportions and colors printed on a release paper 4 to form an elastic layer 1 having an appropriate thickness and color;

Next, a plurality of fluffs 31 are planted on the upper surface of the elastic layer 1 by processing methods such as flocking, so that a single fluff layer 3 composed of the plurality of fluffs 31 is formed on the upper surface of the elastic layer 1;

Finally, an elastic material such as hot melt adhesive or thermoplastic resin is printed on the upper surface of the elastic layer 1 to form an adhesive layer 2 covering the upper surface of the elastic layer 1.

In this way, a flocking layer 3 is formed as the bonding interface between the elastic layer 1 and the adhesive layer 2, which greatly increases the adhesion fastness of the elastic layer 1 and the adhesive layer 2.

As can be seen from the above description, the patterned thermal transfer structure 100 disclosed in the present invention is an innovative structure capable of achieving the object of the present invention. Through the above detailed description, it can fully show that the object and effect of the present invention have progress in implementation. And it has never been seen before in the market, which fully meets the patent requirements, and applies in accordance with the law; but the above are only the preferred embodiments of the present invention, and should not be used to limit the scope of implementation of the present invention, All equal changes and modifications made according to the patent scope of the present invention should fall within the scope of the present invention.

100‧‧‧ Graphical thermal transfer structure

1‧‧‧ elastic layer

2‧‧‧ Adhesive layer

3‧‧‧ flocking layer

31‧‧‧Fuzz

4‧‧‧ release paper

FIG. 1 is a cross-sectional view of a preferred embodiment of the patterned thermal transfer structure of the present invention; FIG. 2 is a schematic view of the processing and forming of the patterned thermal transfer structure of the present invention; FIG. 3 is a Schematic diagram 2 of the processing and forming of the patterned thermal transfer structure of the present invention; and FIG. 4 is a schematic diagram 3 of the three-dimensional combination of the patterned thermal transfer structure of the present invention.

Claims (4)

A patterned thermal transfer structure includes: an elastic layer made of an elastic material with ductility; an adhesive layer made of an elastic material with adhesiveness, covering and bonding to one surface of the elastic layer And a fleece layer disposed between the elastic layer and the adhesive layer, the flocked layer comprising a plurality of flocks planted simultaneously in the elastic layer and the adhesive layer. The patterned thermal transfer structure according to claim 1, wherein the elastic layer is silicon, latex, PU or TPU. The patterned thermal transfer structure according to claim 1, wherein the adhesive layer is a hot-melt adhesive or a thermoplastic resin. The patterned thermal transfer structure according to claim 1, wherein a release paper is bonded to another surface of the elastic layer.