TWI622884B - Root complex management method and root complex - Google Patents
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Abstract
本發明提出一種根複合體管理方法及根複合體，適用於具有高速週邊元件互連協定的一系統。此方法包括：串接多個根複合體，其中上述根複合體包括第一根複合體及第二根複合體，且第一根複合體串接於第二根複合體的上層；透過第二根複合體判斷第二根複合體的第二識別碼與第一根複合體的第一識別碼是否相同；以及若第二識別碼與該第一識別碼相同，則在系統中隱藏第二根複合體並由第一根複合體來管理第二根複合體。The present invention provides a root complex management method and a root complex suitable for a system having a high speed peripheral component interconnection protocol. The method includes: connecting a plurality of root complexes in series, wherein the root complex comprises a first composite and a second composite, and the first composite is connected in series with the upper layer of the second composite; The root complex determines whether the second identification code of the second complex is the same as the first identification code of the first complex; and if the second identification code is the same as the first identification code, hiding the second root in the system The complex is managed by the first complex and the second complex is managed.
Description
本發明是有關於一種根複合體管理方法及根複合體，且特別是有關於一種適用於具有高速週邊元件互連協定的系統的根複合體管理方法及根複合體。The present invention relates to a root complex management method and a root complex, and more particularly to a root complex management method and root complex suitable for a system having a high speed peripheral component interconnection protocol.
在現有的高速週邊元件互連(Peripheral Component Interface Express，PCIe)根複合體(Root Complex)串接技術中，系統必須準備相當多記憶體資源給新增的根複合體。舉例來說，當系統串接了多個根複合體(或是串接多個與根複合體整合的裝置)時，所有的根複合體都必須將其根埠(Root Port)及對應的端點裝置(Endpoint Device)回報給系統，以建立各別的記憶體映射輸入/輸出(Memory Mapped Input/Output，MMIO)空間給每一個根複合體。這不但會占用過多的系統資源，還可能使驅動程式難以控制過多的根複合體。In the existing high-speed Peripheral Component Interface Express (PCIe) Root Complex serialization technology, the system must prepare a considerable amount of memory resources for the new root complex. For example, when the system is connected in series with multiple root complexes (or multiple devices integrated with the root complex), all root complexes must have their root ports and corresponding ends. The Endpoint Device is returned to the system to create a separate Memory Mapped Input/Output (MMIO) space for each root complex. Not only does this take up too much system resources, it can also make it difficult for drivers to control too many root complexes.
有鑑於此，本發明提供一種根複合體管理方法及根複合體，以解決串接多個根複合體時占用過多系統資源的問題。In view of this, the present invention provides a root complex management method and a root complex to solve the problem of occupying excessive system resources when a plurality of root complexes are connected in series.
本發明提出一種根複合體管理方法，適用於具有高速週邊元件互連協定的一系統。此方法包括：串接多個根複合體，其中上述根複合體包括第一根複合體及第二根複合體，且第一根複合體串接於第二根複合體的上層；透過第二根複合體判斷第二根複合體的第二識別碼與第一根複合體的第一識別碼是否相同；以及若第二識別碼與第一識別碼相同，則在系統中隱藏第二根複合體並由第一根複合體來管理第二根複合體。The present invention proposes a root complex management method suitable for a system having a high speed peripheral component interconnection protocol. The method includes: connecting a plurality of root complexes in series, wherein the root complex comprises a first composite and a second composite, and the first composite is connected in series with the upper layer of the second composite; The root complex determines whether the second identification code of the second complex is the same as the first identification code of the first complex; and if the second identification code is the same as the first identification code, hiding the second composite in the system The second complex is managed by the first complex.
在本發明的一實施例中，上述根複合體管理方法更包括：若第二識別碼與第一識別碼不同，則第二根複合體將第二根複合體及串接於第二根複合體下層的根複合體的資訊回報給系統。In an embodiment of the present invention, the root complex management method further includes: if the second identifier is different from the first identifier, the second complex combines the second complex and the second complex The information of the root complex of the sub-layer is reported back to the system.
在本發明的一實施例中，上述資訊包括第二根複合體及串接於第二根複合體下層的根複合體的每一個的根埠(root port)及透過根埠所耦接的端點裝置。In an embodiment of the invention, the information includes a root port of each of the second complex and the root complex connected in series with the lower layer of the second complex, and a terminal coupled through the root canal Point device.
在本發明的一實施例中，上述第一識別碼與第二識別碼為根複合體的供應商識別碼或裝置識別碼。In an embodiment of the invention, the first identification code and the second identification code are a vendor identification code or a device identification code of the root complex.
在本發明的一實施例中，上述第一根複合體串接於第二根複合體的上層表示第一根複合體與系統的南橋之間所串接的根複合體的數量小於第二根複合體與系統的南橋之間所串接的些根複合體的數量。In an embodiment of the invention, the first complex is connected in series to the upper layer of the second composite, and the number of root complexes connected between the first composite and the south bridge of the system is smaller than the second The number of root complexes that are connected in series between the complex and the south bridge of the system.
本發明提出一種根複合體，適用於具有高速週邊元件互連(PCIe)協定的系統。此系統的南橋串接多個根複合體，上述多個根複合體包括第一根複合體及此根複合體，且第一根複合體串接於此根複合體的上層，此根複合體包括唯讀記憶體，唯讀記憶體儲存此根複合體的韌體。其中韌體判斷此根複合體的第二識別碼與第一根複合體的第一識別碼是否相同。其中若第二識別碼與第一識別碼相同，則韌體在系統中隱藏此根複合體並由第一根複合體來管理此根複合體。The present invention proposes a root complex suitable for use with systems having a High Speed Peripheral Component Interconnect (PCIe) protocol. The south bridge of the system is connected in series with a plurality of root complexes, wherein the plurality of root complexes comprise a first complex and the root complex, and the first complex is connected in series with the upper layer of the complex, the root complex Including read-only memory, read-only memory stores the firmware of this root complex. The firmware determines whether the second identification code of the root complex is the same as the first identification code of the first complex. Wherein if the second identification code is the same as the first identification code, the firmware hides the root complex in the system and manages the root complex by the first complex.
在本發明的一實施例中，若第二識別碼與第一識別碼不同，則韌體將根複合體及串接於根複合體下層的根複合體的資訊回報給系統。In an embodiment of the invention, if the second identification code is different from the first identification code, the firmware returns the information of the root complex and the root complex serially connected to the lower layer of the root complex to the system.
在本發明的一實施例中，上述資訊包括第二根複合體及串接於第二根複合體下層的根複合體的每一個的根埠(root port)及透過根埠所耦接的端點裝置。In an embodiment of the invention, the information includes a root port of each of the second complex and the root complex connected in series with the lower layer of the second complex, and a terminal coupled through the root canal Point device.
在本發明的一實施例中，上述第一識別碼與第二識別碼為根複合體的供應商識別碼或裝置識別碼。In an embodiment of the invention, the first identification code and the second identification code are a vendor identification code or a device identification code of the root complex.
在本發明的一實施例中，上述第一根複合體串接於第二根複合體的上層表示第一根複合體與系統的南橋之間所串接的根複合體的數量小於第二根複合體與系統的南橋之間所串接的些根複合體的數量。In an embodiment of the invention, the first complex is connected in series to the upper layer of the second composite, and the number of root complexes connected between the first composite and the south bridge of the system is smaller than the second The number of root complexes that are connected in series between the complex and the south bridge of the system.
基於上述，本發明的根複合體管理方法及根複合體會判斷第二根複合體的識別碼是否與其上層的第一根複合體的識別碼相同，若兩個根複合體的識別碼相同則第二根複合體的韌體會在系統中隱藏第二根複合體並由第一根複合體來管理第二根複合體，如此就能節省多個根複合體串接而需要的記憶體映射輸入/輸出空間。Based on the above, the root complex management method and the root complex of the present invention determine whether the identification code of the second complex is the same as the identification code of the first complex of the upper layer, and if the identification codes of the two root complexes are the same The firmware of the two complexes hides the second complex in the system and manages the second complex by the first complex, thus saving the memory mapping input required for the serial connection of multiple root complexes/ Output space.
為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the invention will be apparent from the following description.
圖1是根據本發明的一實施例的根複合體管理方法的流程圖。圖2是根據本發明的一實施例串接多個根複合體的示意圖。1 is a flow chart of a root complex management method in accordance with an embodiment of the present invention. 2 is a schematic illustration of a plurality of root complexes in series, in accordance with an embodiment of the present invention.
請參照圖1及圖2，在步驟S101中，串接多個根複合體，其中上述根複合體包括第一根複合體及第二根複合體，且第一根複合體串接於第二根複合體的上層(upstream)。Referring to FIG. 1 and FIG. 2, in step S101, a plurality of root complexes are serially connected, wherein the root complex comprises a first composite and a second composite, and the first composite is connected in series with the second The upper layer of the root complex.
舉例來說，在圖2中，系統200包括第一根複合體211、第二根複合體221、第三根複合體231及中央處理器240。第一根複合體211透過主機板南橋晶片直接耦接到中央處理器240，而第二根複合體221、第三根複合體231則依序串接在第一根複合體211下層。第一根複合體211、第二根複合體221、第三根複合體231透過各自的根埠(Root Port)耦接到高速非揮發性記憶體(Non-Volatile Memory Express，NVMe)裝置，也就是NVMe裝置212、222及232(又稱為端點裝置)。第一根複合體211及NVMe裝置212可整合成為PCIe (Peripheral Component Interface Express) SSD (Solid State Drive)模組210。同樣地，第二根複合體221及NVMe裝置222可整合成為PCIe SSD模組220且第三根複合體231及NVMe裝置232可整合成為PCIe SSD模組230。For example, in FIG. 2, system 200 includes a first composite 211, a second composite 221, a third composite 231, and a central processing unit 240. The first composite body 211 is directly coupled to the central processing unit 240 through the motherboard south bridge wafer, and the second composite body 221 and the third composite body 231 are sequentially connected in series to the lower layer of the first composite body 211. The first composite body 211, the second composite body 221, and the third composite body 231 are coupled to a high-speed non-volatile memory (NVM) device through their respective root ports. These are NVMe devices 212, 222, and 232 (also known as endpoint devices). The first complex 211 and the NVMe device 212 can be integrated into a PCIe (Peripheral Component Interface Express) SSD (Solid State Drive) module 210. Similarly, the second complex 221 and the NVMe device 222 can be integrated into the PCIe SSD module 220 and the third complex 231 and the NVMe device 232 can be integrated into the PCIe SSD module 230.
值得注意的是，第一根複合體211串接於第二根複合體221的上層表示第一根複合體211與系統200的南橋之間所串接的根複合體的數量小於第二根複合體221與該系統200的該南橋之間所串接的根複合體的數量。反之，第三根複合體231串接於第二根複合體221的下層(downstream)表示第三根複合體231與系統200的南橋之間所串接的根複合體的數量大於第二根複合體221與該系統200的該南橋之間所串接的根複合體的數量It should be noted that the first complex 211 is connected in series with the upper layer of the second composite 221, indicating that the number of root complexes connected between the first composite 211 and the south bridge of the system 200 is smaller than the second composite. The number of root complexes that are connected in series between the body 221 and the south bridge of the system 200. On the contrary, the third complex 231 is connected in series to the lower layer of the second composite 221, indicating that the number of root complexes connected in series between the third complex 231 and the south bridge of the system 200 is greater than the second composite. Number of root complexes connected between body 221 and the south bridge of system 200
在步驟S103中，透過第二根複合體判斷第二根複合體的第二識別碼與第一根複合體的第一識別碼是否相同。具體來說，第二根複合體221可包括唯讀記憶體(Read Only Memory，ROM)用以儲存韌體。當第二根複合體221串接到第一根複合體211上時，第二根複合體221的韌體會判斷第二根複合體221與第一根複合體211的識別碼是否相同。上述識別碼可為供應商識別碼或裝置識別碼。In step S103, it is determined whether the second identification code of the second complex is the same as the first identification code of the first complex through the second complex. Specifically, the second complex 221 may include a Read Only Memory (ROM) for storing the firmware. When the second composite 221 is connected to the first composite 211, the firmware of the second composite 221 determines whether the identification code of the second composite 221 and the first composite 211 are the same. The above identification code may be a vendor identification code or a device identification code.
若第二識別碼與該第一識別碼相同，在步驟S105中，在系統中隱藏第二根複合體並由第一根複合體來管理第二根複合體。具體來說，第二根複合體221的韌體不會將自己的根埠及NVMe裝置222的資訊回報給系統200，因此系統200並不會建立建立第二根複合體221所對應的的記憶體映射輸入/輸出空間。第二根複合體221的一般用途輸入/輸出(General Purpose I/O)功能則會轉換為韌體內部處理，也就是由第一根複合體211的韌體來同時控制第一根複合體211及第二根複合體221的輸入/輸出功能。If the second identification code is the same as the first identification code, in step S105, the second complex is hidden in the system and the second complex is managed by the first complex. Specifically, the firmware of the second complex 221 does not report the information of the root and the NVMe device 222 to the system 200, so the system 200 does not establish the memory corresponding to the second complex 221. Volume mapped input/output space. The general purpose input/output (General Purpose I/O) function of the second complex 221 is converted into internal firmware processing, that is, the first composite 211 is simultaneously controlled by the firmware of the first composite 211. And the input/output function of the second complex 221 .
如此一來，PCIe SSD模組210、220之間的PCIe實體層(Physical Layer，PHY)就變成第一根複合體211及第二根複合體221之間的溝通橋樑。此外，串接的NVMe裝置212、222的電源管理也可由第一根複合體211的韌體來執行。第一根複合體211的韌體只需配合第一根複合體211被指派的記憶體映射輸入/輸出(MMIO)驅動程式的運作即可進行NVMe裝置212、222的電源管理。藉由根複合體的韌體統一管理NVMe裝置212、222的電源，可避免直接由根複合體的時脈請求(CLKREQ)針腳控制NVMe裝置等端點裝置是否進入PCIe的L1.2省電子狀態而發生電源供應不同步的問題。As a result, the PCIe physical layer (PHY) between the PCIe SSD modules 210 and 220 becomes a communication bridge between the first complex 211 and the second complex 221 . In addition, power management of the serially connected NVMe devices 212, 222 can also be performed by the firmware of the first complex 211. The firmware of the first complex 211 can be used to manage the power of the NVMe devices 212, 222 only in conjunction with the operation of the memory mapped input/output (MMIO) driver assigned by the first complex 211. By uniformly managing the power of the NVMe devices 212, 222 by the firmware of the root complex, it is possible to avoid whether the endpoint device such as the NVMe device enters the L1.2 provincial electronic state of the PCIe directly by the clock request (CLKREQ) of the root complex. And the problem of power supply out of sync.
在一實施例中，若第一根複合體211、第二根複合體221、第三根複合體231的識別碼皆相同，則可藉由第一根複合體211的韌體同時控制第一根複合體211、第二根複合體221、第三根複合體231，因此第一根複合體211、第二根複合體221、第三根複合體231則可視為一個根複合體集合250，用以控制NVMe裝置212、222及232。In an embodiment, if the identification codes of the first composite 211, the second composite 221, and the third composite 231 are the same, the first composite 211 can be controlled by the firmware of the first composite 211 at the same time. Since the root complex 211, the second complex 221, and the third complex 231, the first complex 211, the second complex 221, and the third complex 231 can be regarded as a root complex set 250. Used to control the NVMe devices 212, 222, and 232.
在一實施例中，若第一根複合體211、第二根複合體221、第三根複合體231的識別碼皆相同，使用者還可利用主機板廠商所提供的延伸韌體介面(Extended Firmware Interface，EFI)，以延伸韌體介面殼層腳本(shell script)的實作方式將多個球柵陣列封裝(Ball Grid Array，BGA) NVMe裝置組成一個磁碟陣列(Redundant Array of Independent Disks，RAID)，例如將NVMe裝置212、222及232或更多的NVMe裝置組成磁碟陣列。如此一來，系統200只會偵測到第一根複合體211及其對應的根埠，而其他根複合體所對應的根埠及NVMe裝置都可藉由第一根複合體211的韌體來統一控制，如此可以在串接多個根複合體的狀態下只回報一個根複合體的記憶體映射輸入/輸出空間，以節省大量系統資源。In an embodiment, if the identification codes of the first composite 211, the second composite 221, and the third composite 231 are the same, the user can also use the extended firmware interface provided by the motherboard manufacturer (Extended Firmware Interface (EFI), which integrates multiple Ball Grid Array (BGA) NVMe devices into a disk array (Redundant Array of Independent Disks) in the form of a extended shell interface script (shell script). RAID), for example, NVMe devices 212, 222 and 232 or more NVMe devices are grouped into a disk array. In this way, the system 200 only detects the first complex 211 and its corresponding root 埠, and the root 埠 and NVMe devices corresponding to the other root complex can be the firmware of the first complex 211. To control the unified, so that only one root complex's memory mapped input/output space can be returned in the state of connecting multiple root complexes in series, thereby saving a lot of system resources.
請回到圖1，若第二識別碼與第一識別碼不同，在步驟S107中，第二根複合體將第二根複合體及串接於第二根複合體下層的根複合體的資訊回報給系統。Referring back to FIG. 1, if the second identification code is different from the first identification code, in step S107, the second composite body and the second complex are connected to the root complex of the lower layer of the second composite. Return to the system.
具體來說，第二根複合體221的韌體會將第二根複合體221、第三根複合體231的根埠以及NVMe裝置222、232的資訊整合並回報給系統200，以建立第二根複合體221、第三根複合體231及其根埠以及NVMe裝置222、232的記憶體映射輸入/輸出空間。Specifically, the firmware of the second complex 221 integrates the information of the second complex 221, the root of the third complex 231, and the NVMe devices 222, 232 into the system 200 to establish a second root. The complex 221, the third complex 231 and its roots, and the memory mapped input/output space of the NVMe devices 222, 232.
值得注意的是，若第二根複合體221與第一根複合體211的識別碼不同但第三根複合體231與第二根複合體221的識別碼相同時，則第二根複合體221就不會回報第三根複合體231的相關資訊給系統200，而可藉由第二根複合體221的韌體控制第二根複合體221及第三根複合體231所對應的根埠及NVMe裝置222、232。在這個情況下，第二根複合體221及第三根複合體231可被系統200視為一個根複合體集合。It should be noted that if the identification code of the second complex 221 and the first complex 211 are different but the identification codes of the third complex 231 and the second complex 221 are the same, then the second complex 221 The information about the third complex 231 is not reported to the system 200, and the roots corresponding to the second complex 221 and the third complex 231 can be controlled by the firmware of the second complex 221 and NVMe devices 222, 232. In this case, the second complex 221 and the third complex 231 can be considered by the system 200 as a set of root complexes.
綜上所述，本發明的根複合體管理方法及根複合體會判斷第二根複合體的識別碼是否與其上層的第一根複合體的識別碼相同，若兩個根複合體的識別碼相同則第二根複合體的韌體會在系統中隱藏第二根複合體並由第一根複合體來管理第二根複合體。若兩個根複合體的識別碼不同則第二根複合體的韌體會整合第二根複合體下層的所有根複合體的資訊並將此資訊回報給系統以建立記憶體映射輸入/輸出空間。透過本發明的根複合體管理方法，使用者可購買相同供應商的固態硬碟產品並將其直接串接在南橋下，透過直接穿接到南橋的固態硬碟中的韌體就能將串接於其後的多個固態硬碟自動整合成一個裝置，而不需要占用過多的系統資源。In summary, the root complex management method and the root complex of the present invention determine whether the identification code of the second complex is the same as the identification code of the first complex of the upper layer, if the identification codes of the two root complexes are the same Then the firmware of the second complex hides the second complex in the system and the second complex is managed by the first complex. If the identification codes of the two root complexes are different, the firmware of the second complex will integrate the information of all the root complexes of the lower layer of the second complex and report this information to the system to establish a memory mapped input/output space. Through the root complex management method of the present invention, a user can purchase a solid state hard disk product of the same supplier and directly connect it under the south bridge, and can pass the string through the firmware directly attached to the solid state hard disk of the south bridge. The multiple solid state drives that follow are automatically integrated into one device without consuming too much system resources.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.
S101、S103、S105、S107‧‧‧根複合體管理方法的步驟
200‧‧‧系統
210、220、230‧‧‧PCIe SSD模組
211‧‧‧第一根複合體
212、222、232‧‧‧NVMe裝置
221‧‧‧第二根複合體
231‧‧‧第三根複合體
240‧‧‧中央處理器
250‧‧‧根複合體集合Steps of S101, S103, S105, S107‧‧‧ root complex management method
200‧‧‧ system
210, 220, 230‧‧‧ PCIe SSD Module
211‧‧‧First complex
212, 222, 232‧‧‧NVMe devices
221‧‧‧Second complex
231‧‧‧The third complex
240‧‧‧Central Processing Unit
250‧‧‧ root complex collection
圖1是根據本發明的一實施例的根複合體管理方法的流程圖。 圖2是根據本發明的一實施例串接多個根複合體的示意圖。1 is a flow chart of a root complex management method in accordance with an embodiment of the present invention. 2 is a schematic illustration of a plurality of root complexes in series, in accordance with an embodiment of the present invention.
Claims (10)
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