TWI620384B - Power balance device for laser beam, laser machining device - Google Patents

Power balance device for laser beam, laser machining device Download PDF

Info

Publication number
TWI620384B
TWI620384B TW106101390A TW106101390A TWI620384B TW I620384 B TWI620384 B TW I620384B TW 106101390 A TW106101390 A TW 106101390A TW 106101390 A TW106101390 A TW 106101390A TW I620384 B TWI620384 B TW I620384B
Authority
TW
Taiwan
Prior art keywords
laser light
retardation plate
laser
power balance
balance device
Prior art date
Application number
TW106101390A
Other languages
Chinese (zh)
Other versions
TW201731187A (en
Inventor
船岡幸治
中筋淑江
滝川靖弘
Original Assignee
三菱電機股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機股份有限公司 filed Critical 三菱電機股份有限公司
Publication of TW201731187A publication Critical patent/TW201731187A/en
Application granted granted Critical
Publication of TWI620384B publication Critical patent/TWI620384B/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/18Diffraction gratings
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/30Polarising elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/42Printed circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Electromagnetism (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Diffracting Gratings Or Hologram Optical Elements (AREA)
  • Lasers (AREA)

Abstract

本發明之目的在於獲得可容易地進行用於被加工物之穩定之雷射加工的雷射加工裝置及使用在該雷射加工裝置的雷射光用之功率平衡裝置。雷射光用之功率平衡裝置係具備有:偏光相位差板,係於一對正反兩面之主面中之一方主面側,形成有使由與基板材料同一材料所構成之複數個凸部以設定週期P各自平行地直線狀延伸的繞射柵格,且形成為可利用前述繞射柵格的構造性複折射,而入射遠紅外線之雷射光,並使前述繞射柵格的前述週期P滿足P<λ/n(λ為入射光之波長,n為前述基板材料的折射率);以及旋轉機構,係使前述偏光相位差板旋轉。 An object of the present invention is to obtain a laser processing device that can easily perform stable laser processing of a workpiece and a power balancing device for laser light used in the laser processing device. The power balance device for laser light is provided with: a polarizing retardation plate, which is attached to one of the main surfaces of the pair of front and back surfaces, and is formed with a plurality of convex portions made of the same material as the substrate The setting periods P are linear diffraction gratings each extending linearly in parallel, and are formed such that the structural birefringence of the diffraction gratings can be utilized to enter the laser light of far infrared rays, and the period P of the diffraction gratings Satisfy P <λ / n (λ is the wavelength of the incident light, n is the refractive index of the aforementioned substrate material); and the rotation mechanism rotates the polarized retardation plate.

Description

雷射光用之功率平衡裝置及雷射加工裝置 Power balance device and laser processing device for laser light

本發明係關於一種對印刷基板等之被加工物進行開孔加工的雷射加工裝置,特別是關於雷射光用之功率平衡裝置、及使用該功率平衡裝置的雷射加工裝置。 The present invention relates to a laser processing device for performing hole processing on a workpiece such as a printed circuit board, in particular to a power balancing device for laser light and a laser processing device using the power balancing device.

就對印刷基板等之被加工物進行開孔加工的CO2雷射加工裝置之生產性提升的方法,有一種將利用雷射振盪器所產生之一個雷射光分割成複數,而同時地開孔加工出複數個孔的方法。在該方法中,當被分割的雷射光之各自的能量並不均勻時,會導致加工孔徑等之加工品質產生不一致。 Regarding the productivity improvement method of the CO 2 laser processing device for performing hole processing on printed substrates and the like, there is a method of dividing a laser light generated by a laser oscillator into a plurality of holes while simultaneously drilling holes A method of machining multiple holes. In this method, when the energy of the divided laser light is not uniform, the processing quality such as the processing aperture may be inconsistent.

因此,在下述之專利文獻1所揭示的方法中,在較分光用偏光件還靠光路上游,以光軸為中心設置具有旋轉調整機構的偏光方位角調整用偏光件。並且,藉由調整透過之P波的偏光方位角,從而調整入射至分光用偏光件之偏光方向P波成分與偏光方向S波成分的平衡,來均勻地調整被分割成透過分光用偏光件的P波成分、與以分光用偏光件反射的S波成分之雷射光的能量。 Therefore, in the method disclosed in Patent Document 1 described below, a polarizer for polarization azimuth angle adjustment having a rotation adjustment mechanism is provided around the optical axis further upstream of the optical path than the polarizer for light splitting. In addition, by adjusting the polarization azimuth of the transmitted P wave, the balance of the polarization direction P wave component and the polarization direction S wave component incident on the polarization polarizer for adjustment can be adjusted to uniformly adjust The energy of the P-wave component and the laser light of the S-wave component reflected by the polarizer for splitting.

在下述之專利文獻2記載了調整YAG(Yttrium Aluminum Garnet,釔鋁石榴石)雷射光之功率平衡的例子。在較分光用偏光件還靠光路上游,以光軸為中心設置具有進行旋轉調整之旋轉調整機構的透過型之1/4波長(π/2)相位差板,藉由調整入射至分光用偏光子之偏光方向P波成分與偏光方向S波成分,從而均勻地調整加工的能量。 An example of adjusting the power balance of YAG (Yttrium Aluminum Garnet) laser light is described in Patent Document 2 below. A transmission type 1/4 wavelength (π / 2) phase difference plate with a rotation adjustment mechanism for rotation adjustment is provided on the optical axis as the center of the optical path upstream of the polarizing member for splitting. By adjusting the incident polarized light for splitting The P-wave component in the polarization direction and the S-wave component in the polarization direction of the sub are used to uniformly adjust the processing energy.

下述專利文獻3,藉由不使用透過光而設僅利用S偏光的偏光方位角調整機構,而防止熱透鏡的產生。 The following Patent Document 3 prevents the generation of a thermal lens by providing a polarization azimuth adjustment mechanism using only S-polarized light without using transmitted light.

近年來,印刷基板等之開孔加工機,隨著貫通孔等之高能量加工及/或加工速度的提升,使雷射光輸出提高。 In recent years, laser processing machines such as printed circuit boards have increased the laser light output due to the high energy processing and / or processing speed of through holes and the like.

(先前技術文獻) (Prior technical literature) (專利文獻) (Patent Literature)

專利文獻1:國際公開第2003/082510號手冊 Patent Literature 1: International Publication No. 2003/082510 Manual

專利文獻2:日本特開平9-108878號公報(第1圖) Patent Document 2: Japanese Patent Laid-Open No. 9-108878 (Figure 1)

專利文獻3:日本特開2011-251306號公報 Patent Document 3: Japanese Patent Laid-Open No. 2011-251306

專利文獻4:日本特開2014-29467號公報 Patent Document 4: Japanese Patent Laid-Open No. 2014-29467

在上述習知技術,例如上述專利文獻1所揭示之構成係使透過偏光方位角調整用偏光件的P波成分往光路下游傳遞。因此,若入射至偏光件之雷射光的功率較 高時,因受偏光件之基板材料之熱透鏡效應而使雷射光之射束直徑變化,透過遮罩之雷射光的能量強度相較於未發生熱透鏡效應的情況較不一致。因此,會有使得被加工物之加工品質劣化或不穩定的問題。 In the above-described conventional technology, for example, the configuration disclosed in Patent Document 1 described above transmits the P-wave component transmitted through the polarizer for polarizing azimuth angle adjustment to the downstream of the optical path. Therefore, if the power of the laser light incident on the polarizer is When it is high, the beam diameter of the laser light changes due to the thermal lens effect of the substrate material of the polarizer, and the energy intensity of the laser light passing through the shield is less consistent than that without the thermal lens effect. Therefore, there is a problem that the processing quality of the workpiece is degraded or unstable.

此外,當在偏光方位角調整時旋轉調整偏光件時,由於光繞射為原因在光軸中心產生些許偏移,而會有使被加工物之加工品質劣化情形的問題。 In addition, when the polarizer is rotated and adjusted during polarization azimuth adjustment, there is a slight shift in the center of the optical axis due to light diffraction, which may cause a problem that the processing quality of the workpiece is deteriorated.

此外,上述專利文獻2所揭示的構成為波長1μm大小之YAG雷射光之用,而無法透過遠紅外線(far-infrared)。透過遠紅外線的複折射材料為具有硫化鎘(CdS,cadmium sulfide),惟其係毒物,且處理困難。 In addition, the configuration disclosed in the above-mentioned Patent Document 2 is for YAG laser light with a wavelength of 1 μm, and cannot transmit far-infrared light. The birefringent material that transmits far infrared rays has cadmium sulfide (CdS), but it is a poison and difficult to handle.

此外,上述專利文獻3所揭示的構成係不使用透過光,而僅利用S偏光,故效率不佳。 In addition, the configuration disclosed in the above-mentioned Patent Document 3 does not use transmitted light but only uses S-polarized light, so the efficiency is not good.

本發明係有鑑於上述課題所研創者,其目的在於獲得:可容易地進行用於被加工物之穩定的雷射加工的雷射加工裝置及使用在該雷射加工裝置的雷射光用之功率平衡裝置。 The present invention has been developed in view of the above-mentioned problems, and its object is to obtain a laser processing device that can easily perform stable laser processing of a workpiece and a laser light power used in the laser processing device Balance device.

本發明之手段在於一種雷射光用之功率平衡裝置,該功率平衡裝置係具備:偏光相位差板,係於一對正反兩面之主面中之一方主面側,形成有使由與基板材料同一材料所構成之複數個凸部以設定週期P各自平行地直線狀延伸的繞射柵格,且形成為可利用前述繞射柵格的構造性複折射,而入射遠紅外線之雷射光,並使前述繞射 柵格的前述週期P滿足P<λ/n(λ為入射光之波長,n為前述基板材料的折射率);以及旋轉機構,係使前述偏光相位差板旋轉。 The method of the present invention is a power balancing device for laser light, which includes a polarizing retardation plate attached to one of the main surfaces of a pair of front and back surfaces, and is formed with a substrate material A plurality of convex portions composed of the same material each extend linearly parallel to each other with a set period P, and are formed to be able to utilize the structural birefringence of the aforementioned diffraction grating, and incident far-infrared laser light, and Make the aforementioned diffraction The period P of the grid satisfies P <λ / n (λ is the wavelength of incident light, n is the refractive index of the substrate material); and the rotation mechanism rotates the polarized retardation plate.

本發明提供:可容易地進行用於被加工物之穩定的雷射加工的雷射加工裝置及使用在該雷射加工裝置的雷射光用之功率平衡裝置。 The present invention provides a laser processing device that can easily perform stable laser processing of a workpiece and a power balancing device for laser light used in the laser processing device.

1‧‧‧雷射振盪器 1‧‧‧Laser oscillator

2‧‧‧雷射光 2‧‧‧Laser

2a、2b‧‧‧雷射光2在圖示位置之偏光方位角 2a, 2b‧‧‧‧Laser 2 polarized azimuth at the position shown

4‧‧‧光罩 4‧‧‧mask

5‧‧‧光束可變部 5‧‧‧beam variable section

6‧‧‧反射鏡 6‧‧‧Reflecting mirror

7‧‧‧偏光光束分光器 7‧‧‧ Polarized beam splitter

8A、8B‧‧‧分散雷射光 8A, 8B‧‧‧Disperse laser light

9A、9B‧‧‧分離方向 9A, 9B‧‧‧ Separation direction

10Ax、10Ay、10Bx、10By‧‧‧電流掃描器 10Ax, 10Ay, 10Bx, 10By‧‧‧‧ current scanner

11A、11B‧‧‧f θ透鏡 11A, 11B‧‧‧f θ lens

12A、12B‧‧‧XY平台 12A 、 12B‧‧‧XY platform

13A、13B‧‧‧被加工物 13A, 13B‧‧‧Workpiece

17‧‧‧偏光件 17‧‧‧ Polarizer

100‧‧‧雷射加工裝置 100‧‧‧Laser processing device

200‧‧‧偏光相位差板 200‧‧‧ Polarized phase difference plate

201‧‧‧繞射柵格 201‧‧‧ Diffraction grid

202‧‧‧基板 202‧‧‧ substrate

203‧‧‧凸部 203‧‧‧Convex

206‧‧‧錐形形狀 206‧‧‧Conical shape

207‧‧‧反射防止膜 207‧‧‧reflective film

210‧‧‧銅鏡 210‧‧‧bronze mirror

211‧‧‧O型環 211‧‧‧O-ring

212‧‧‧按壓板 212‧‧‧Press plate

213‧‧‧旋轉機構 213‧‧‧rotating mechanism

214‧‧‧鏡體支持具 214‧‧‧Mirror support

220‧‧‧旋轉機構 220‧‧‧rotating mechanism

300‧‧‧功率平衡裝置 300‧‧‧Power balance device

A1、A2、A3‧‧‧雷射光束強度分佈 A1, A2, A3 ‧‧‧ laser beam intensity distribution

B1、B2、B3‧‧‧雷射光束強度分佈 B1, B2, B3 ‧‧‧ laser beam intensity distribution

第1圖係顯示根據本發明之實施形態1之雷射加工裝置的構成之一例之圖。 FIG. 1 is a diagram showing an example of the configuration of a laser processing apparatus according to Embodiment 1 of the present invention.

第2圖係顯示構成第1圖之次波長柵格構造之偏光相位差板之一例的立體圖。 Fig. 2 is a perspective view showing an example of a polarizing retardation plate constituting the sub-wavelength grid structure of Fig. 1;

第3圖係顯示根據本發明之實施形態2之雷射加工裝置的構成之一例之圖。 FIG. 3 is a diagram showing an example of the configuration of a laser processing apparatus according to Embodiment 2 of the present invention.

第4圖係顯示第3圖之雷射用之功率平衡裝置之一例的內部分解構成的透視側面圖。 Fig. 4 is a perspective side view showing an internal exploded structure of an example of the laser power balance device of Fig. 3;

第5圖係顯示第3圖之雷射用之功率平衡裝置之另一例的內部分解構成的透視側面圖。 FIG. 5 is a perspective side view showing an internal exploded structure of another example of the laser power balance device of FIG. 3. FIG.

第6圖係用以說明本發明之熱透鏡現象之影響之圖。 FIG. 6 is a diagram for explaining the influence of the thermal lens phenomenon of the present invention.

第7圖係用以說明本發明之熱透鏡現象之抑制效果之圖。 FIG. 7 is a diagram for explaining the suppression effect of the thermal lens phenomenon of the present invention.

本發明,藉由次波長柵格構造 (sub-wavelength lattic structure),可構成在遠紅外線下使用高透過率材料的功率平衡裝置(power balance device),故而提供:防止熱透鏡(thermal lens),及即使在高輸出射束下亦可獲得高加工品質的雷射加工裝置、以及使用在該雷射加工裝置的雷射光用之功率平衡裝置。 The present invention, by the sub-wavelength grid structure (sub-wavelength lattic structure), which can constitute a power balance device using high-transmittance materials under far-infrared, so it provides: prevention of thermal lens and even under high output beam A laser processing device with high processing quality and a power balance device for laser light used in the laser processing device are obtained.

以下,根據各實施形態使用圖示來說明根據本發明之雷射加光裝置及使用在該雷射加光裝置的雷射光用之功率平衡裝置。另外,在各實施形態中,基本上相同或相當部分以相同符號標示,且省略重複說明。 Hereinafter, a laser light adding device according to the present invention and a power balance device for laser light used in the laser light adding device according to the present invention will be described using drawings. In addition, in each embodiment, substantially the same or corresponding parts are denoted by the same symbols, and repeated description is omitted.

實施形態1 Embodiment 1

第1圖係顯示根據本發明實施形態1之雷射加工裝置之構成的一例之圖。 FIG. 1 is a diagram showing an example of the configuration of a laser processing apparatus according to Embodiment 1 of the present invention.

(雷射加工裝置的構成) (Configuration of laser processing device)

雷射加工裝置100係藉由屬於分光部的偏光光束分光器(polarization beam splitter)7來將一個雷射光2分光成兩個分散雷射光8A、8B。大致而言,兩個分散雷射光8A、8B係各自藉由獨立地掃描,最後經由f θ透鏡(LENS),來同時地對XY平台12A、12B上的兩個被加工物13A、13B進行開孔加工。 The laser processing apparatus 100 splits one laser beam 2 into two scattered laser beams 8A and 8B by a polarization beam splitter 7 belonging to a beam splitter. In general, the two scattered laser beams 8A and 8B are scanned independently, and finally through the f θ lens (LENS), the two processed objects 13A and 13B on the XY stages 12A and 12B are simultaneously opened. Hole processing.

電流掃描器(GALVANO SCANNER)10Ax係使分散雷射光8A相對於被加工物13A的照射位置朝X方向移動,而電流掃描器10Ay係使分散雷射光8A相對於被加工物13A的照射位置朝Y方向移動。同樣地,電流掃描器10Bx係使分散雷射光8B相對於被加工物13B的照射位置朝X方 向移動,而電流掃描器10By係使分散雷射光8B相對於被加工物13B的照射位置朝Y方向移動。另外,上述X方向、Y方向係與XY平台同樣地為被加工物13A、13B之平面內之彼此正交的座標,而與後述在偏光相位差板200的xyz方向不同。 The current scanner (GALVANO SCANNER) 10Ax moves the scattered laser light 8A with respect to the irradiation position of the workpiece 13A in the X direction, and the current scanner 10Ay moves the scattered laser light 8A with respect to the irradiation position of the workpiece 13A toward Y Direction of movement. In the same manner, the current scanner 10Bx directs the irradiation position of the scattered laser light 8B with respect to the workpiece 13B toward the X side The current scanner 10By moves the scattered laser light 8B in the Y direction with respect to the irradiation position of the workpiece 13B. The X direction and the Y direction are the coordinates orthogonal to each other in the plane of the workpieces 13A and 13B as in the XY stage, and are different from the xyz direction of the polarizing retardation plate 200 described later.

本實施形態1的雷射加工裝置100,在較偏光光束分光器7還靠光路上游,配置次波長柵格構造的偏光相位差板200。偏差相位差板200係構成為可藉由旋轉機構220而繞著光軸旋轉。 In the laser processing apparatus 100 of the first embodiment, a polarizing retardation plate 200 having a sub-wavelength grid structure is disposed upstream of the polarizing beam splitter 7 on the optical path. The deviation phase difference plate 200 is configured to be rotatable around the optical axis by the rotation mechanism 220.

(次波長柵格構造的偏光相位差板) (Polarized retardation plate with sub-wavelength grid structure)

可透過遠紅外線之次波長柵格構造的偏光相位差板200,例如具有亦顯示在上述專利文獻4的構造。第2圖係顯示第1圖中之次波長柵格構造的偏光相位差板200之一例之構成的立體圖。被入射雷射光的偏光相位差板200係具備基板202、及繞射柵格201,該繞射柵格201係於基板202中一對正反兩面之主面中之一方主面,由與基板202同一材料所形成者。繞射柵格201係將顯示以x、y方向為基板面之彼此成正交方向的x,y,z方向中之與x方向成平行地直線狀延伸的複數個凸部203予以沿著y方向以根據設定週期P之設定間隔整列形成而構成。 The polarizing retardation plate 200 having a sub-wavelength grid structure that can transmit far infrared rays has, for example, a structure also shown in Patent Document 4 described above. FIG. 2 is a perspective view showing an example of the configuration of a polarizing retardation plate 200 having a sub-wavelength grid structure in FIG. 1. The polarized retardation plate 200 to which the laser light is incident includes a substrate 202 and a diffraction grid 201 which is formed on one of the main surfaces of the pair of front and back sides of the substrate 202 and is connected to the substrate 202 Formed by the same material. The diffractive grid 201 displays a plurality of convex portions 203 that extend linearly in parallel with the x direction in the x, y, and z directions with the x and y directions as the substrate surfaces and are orthogonal to each other. The direction is formed by forming a line in a set interval at a set period P.

當光向上述之繞射柵格201沿著z方向而入射時,有關於x方向之偏光成分(TE偏光)的有效折射率、與有關於y方向之偏光成分(TM偏光)的有效折射率即成為彼 此不同,而產生所謂的構造性複折射。結果,在TE偏光與TM偏光之間產生傳遞速度差,而因應於與該傳遞速度差對應之相位差(retardation)而發生橢圓偏光。 When light enters the above-mentioned diffraction grating 201 in the z direction, there is an effective refractive index with respect to the polarization component in the x direction (TE polarization) and an effective refractive index with respect to the polarization component in the y direction (TM polarization) Be the other This difference results in so-called constructive birefringence. As a result, a difference in transmission speed occurs between TE polarized light and TM polarized light, and elliptically polarized light occurs due to retardation corresponding to the difference in transmission speed.

P<λ/n (1) P <λ / n (1)

P:繞射柵格之週期(間隔) P: period (interval) of the diffraction grid

λ:入射光之波長 λ: wavelength of incident light

n:基本材料的折射率 n: refractive index of the basic material

只要預先設成滿足上述式(1)之條件,可知即使垂直入射光,亦可防止高階繞射光的損失。凸部203之剖面形狀係形成為從其底部跨及頂部而形成角度α的錐形形狀(taper shape)206。 As long as the condition of the above formula (1) is satisfied in advance, it can be seen that the loss of high-order diffracted light can be prevented even if the light is normally incident. The cross-sectional shape of the convex portion 203 is formed into a tapered shape 206 that forms an angle α from the bottom to the top.

具體而言:基板202之基板材料為硫化鋅(ZnS)、凸部203的高度H(亦即溝之深度)為4.01μm、錐形形狀206的傾斜角度α為22.2度、填充因子(filling factor)f為0.468、而相位差為λ/8(=π/4)。 Specifically, the substrate material of the substrate 202 is zinc sulfide (ZnS), the height H (that is, the depth of the groove) of the convex portion 203 is 4.01 μm, the inclination angle α of the tapered shape 206 is 22.2 degrees, and the filling factor ) f is 0.468, and the phase difference is λ / 8 (= π / 4).

另外,填充因子f為凸部203之高度H之一半的位置(H/2)之凸部203的寬度W的對於週期P的比率,亦即f=W/P的值。 In addition, the fill factor f is the ratio of the width W of the convex portion 203 at a position (H / 2) of the height H of the convex portion 203 to the period P, that is, the value of f = W / P.

基板202中無繞射柵格201之另一方主面係施予反射防止膜207。該反射防止膜207的材料為鍺(GERMANIUM)。 The other main surface of the substrate 202 without the diffraction grating 201 is provided with an anti-reflection film 207. The material of the anti-reflection film 207 is germanium (GERMANIUM).

(振盪器的直線偏光) (Linear polarized light of the oscillator)

雷射振盪器1係將由屬於遠紅外線之例如直線偏光的CO2雷射光所構成的雷射光2(λ=9.29μm)作為脈衝波(pulse wave)加以射出的雷射裝置。從雷射振盪器1所射出的雷射光2係經由一個或複數個反射鏡(reflecting mirror)6而被引導至屬於次波長柵格相位差板的偏光相位差板200。反射鏡6係反射雷射光2、或分散雷射光8A、8B並往光路下游引導的鏡體。反射鏡6係配置於雷射加工裝置100內之光路上種種不同的位置。 The laser oscillator 1 is a laser device that emits laser light 2 (λ = 9.29 μm) composed of CO 2 laser light that belongs to far infrared rays such as linearly polarized light as a pulse wave. The laser light 2 emitted from the laser oscillator 1 is guided to the polarizing retardation plate 200 belonging to the sub-wavelength grating retardation plate through one or a plurality of reflecting mirrors 6. The reflecting mirror 6 is a mirror body that reflects the laser light 2 or disperses the laser light 8A and 8B and guides the light path downstream. The reflector 6 is arranged at various positions on the optical path in the laser processing apparatus 100.

(偏光光束分光器) (Polarized beam splitter)

屬於分光用偏光光束分光器的偏光光束分光器7係將單束光束狀的雷射光2分光成兩束分散雷射光8A、8B的光束分光器等的偏光件。偏光光束分光器7係透過雷射光2的P波成分,且具有反射S波成分的性質。 The polarizing beam splitter 7 belonging to the polarizing beam splitter for splitting is a polarizer such as a beam splitter that splits a single beam of laser light 2 into two beams of dispersed laser light 8A, 8B. The polarizing beam splitter 7 transmits the P wave component of the laser light 2 and has the property of reflecting the S wave component.

(雷射加工裝置的動作) (Operation of laser processing device)

接著,針對雷射加工裝置100的動作處理順序加以說明。從雷射振盪器1所引導來的偏光方位角θ的雷射光2係透過次波長柵格構造的偏光相位差板200之後,經由光束可變部(beam variable part)5被引導至光罩4。 Next, the operation processing procedure of the laser processing apparatus 100 will be described. The laser light 2 of the polarized azimuth angle θ guided from the laser oscillator 1 passes through the polarized retardation plate 200 of the sub-wavelength grid structure, and is then guided to the reticle 4 via a beam variable part 5 .

光罩4係僅使雷射光2之期望部分透過,藉此將雷射光2整形成適合於雷射加工的光束圖案形狀。經以光罩4整形的雷射光2,以一個或複數個反射鏡6反射來引導至偏光光束分光器7。 The photomask 4 transmits only the desired part of the laser light 2, thereby shaping the laser light 2 into a beam pattern shape suitable for laser processing. The laser light 2 shaped by the reticle 4 is reflected by one or a plurality of reflecting mirrors 6 to be guided to the polarizing beam splitter 7.

偏光光束分光器7中,使雷射光2的P波偏光成分透過偏光光束分光器7並射出分散雷射光8A。此外,雷射光 2的S波偏光成分,以偏光光束分光器7反射而射出分散雷射光8B。為了要不使兩個被加工物13A、13B的加工孔品質產生不一致,必須使分散雷射光8A的能量與分散雷射光8B的能量相等。 In the polarized light beam splitter 7, the P-wave polarized light component of the laser light 2 is transmitted through the polarized light beam splitter 7 and the dispersed laser light 8A is emitted. In addition, the laser light The S-wave polarized light component of 2 is reflected by the polarized beam splitter 7 and emits scattered laser light 8B. In order to prevent the quality of the processed holes of the two workpieces 13A and 13B from being inconsistent, the energy of the scattered laser light 8A and the energy of the scattered laser light 8B must be equal.

(熱透鏡) (Thermal lens)

熱透鏡效應係如下述的現象:當較高功率的雷射光透過屬於偏光件之第1圖之次波長柵格構造的偏光相位差板200的基本材料內時,受基本材料局部性溫度上昇從而產生偏光件的折射率分佈,藉此使偏光件產生透鏡作用。 The thermal lens effect is a phenomenon as follows: when higher-power laser light passes through the base material of the polarizing retardation plate 200 of the sub-wavelength grid structure of the first figure belonging to the polarizer, the local temperature rise of the base material causes The refractive index distribution of the polarizer is generated, thereby causing the polarizer to have a lens effect.

另外,例如上述專利文獻1的情形,在偏光方位角調整用偏光件中會衍生熱透鏡效應。 In addition, for example, in the case of the above-mentioned Patent Document 1, the polarizing member for polarizing azimuth angle adjustment generates a thermal lens effect.

(熱透鏡對於加工的影響) (The influence of thermal lens on processing)

第6圖係用以說明:使透過與本發明之偏光相位差板200相對應之習知的偏光件17的P波成分,往偏光件17之光路下游引導時之熱透鏡現象之圖。第6圖(a)係顯示未發生熱透鏡現象時之雷射光束強度分佈。此外,第6圖(b)係顯示發生熱透鏡現象時之雷射光束強度分佈。 FIG. 6 is a diagram for explaining the thermal lens phenomenon when the P-wave component transmitted through the conventional polarizer 17 corresponding to the polarizing retardation plate 200 of the present invention is guided downstream of the optical path of the polarizer 17. Fig. 6 (a) shows the intensity distribution of the laser beam when the thermal lens phenomenon does not occur. In addition, Fig. 6 (b) shows the laser beam intensity distribution when the thermal lens phenomenon occurs.

第6圖(a)中之未發生熱透鏡現象時,從雷射振盪器1所射出的雷射光係具有雷射光束強度分佈A1。此外,第6圖(b)中之發生熱透鏡現象時,從雷射振盪器1所射出的雷射光係具有雷射光束強度分佈B1。雷射光束強度分佈B1係具有與雷射光束強度分佈A1相同的強度分佈。 When the thermal lens phenomenon does not occur in FIG. 6 (a), the laser light emitted from the laser oscillator 1 has a laser beam intensity distribution A1. In addition, when the thermal lens phenomenon occurs in FIG. 6 (b), the laser light emitted from the laser oscillator 1 has a laser beam intensity distribution B1. The laser beam intensity distribution B1 has the same intensity distribution as the laser beam intensity distribution A1.

並且,來自雷射振盪器1的雷射光2係透過 偏光件17。在此,該偏光件17係例如配置於與習知之偏光方位角調整裝置同樣的位置。此時,若無發生熱透鏡現象,則雷射光束強度分佈A1的雷射光係透過偏光件17,藉此形成雷射光束強度分佈A2的雷射光。此外,若發生熱透鏡現象,則雷射光束強度分佈B1的雷射光係透過偏光件17,藉此形成與雷射光束強度分佈A2不同的雷射光束強度分佈B2的雷射光。 Also, the laser light 2 from the laser oscillator 1 is transmitted Polarizer 17. Here, the polarizer 17 is arranged at the same position as the conventional polarization azimuth adjustment device, for example. At this time, if the thermal lens phenomenon does not occur, the laser beam of the laser beam intensity distribution A1 passes through the polarizer 17, thereby forming the laser beam of the laser beam intensity distribution A2. In addition, if the thermal lens phenomenon occurs, the laser beam of the laser beam intensity distribution B1 passes through the polarizer 17, thereby forming the laser beam of the laser beam intensity distribution B2 different from the laser beam intensity distribution A2.

如第6圖(b)所示,當偏光件17發生熱透鏡現象時,相較於如第6圖(a)所示偏光件17未發生熱透鏡現象的情形,改變了光罩4之雷射光的光束直徑(beam diameter)。熱透鏡現象的程度係依存於入射至偏光件17之雷射光的功率,因此熱透鏡現象在發生時與未發生時,透過光罩4之雷射光的光束能量(beam energy)會有變化。因此,熱透鏡現象在發生時與未發生時,在到達至第1圖之被加工物13A、13B之雷射光的能量會產生不一致。具體而言,當熱透鏡現象未發生時,係雷射光束強度分佈A3的雷射光被引導至光路下游。此外,當熱透鏡現象發生時,係與雷射光束強度分佈A3不同的雷射光束強度分佈B3的雷射光被引導至光路下游。結果,熱透鏡現象在發生時與未發生時,造成被加工物之加工孔的品質產生差異。 As shown in FIG. 6 (b), when the polarizer 17 has a thermal lens phenomenon, compared with the case where the polarizer 17 has no thermal lens phenomenon as shown in FIG. 6 (a), the lightening of the photomask 4 is changed. The beam diameter of the emitted light (beam diameter). The degree of the thermal lens phenomenon depends on the power of the laser light incident on the polarizer 17. Therefore, the beam energy of the laser light transmitted through the photomask 4 changes when the thermal lens phenomenon occurs and when it does not occur. Therefore, when the thermal lens phenomenon occurs and when it does not occur, the energy of the laser light reaching the workpieces 13A and 13B in FIG. 1 may be inconsistent. Specifically, when the thermal lens phenomenon does not occur, the laser light of the laser beam intensity distribution A3 is guided downstream of the optical path. In addition, when the thermal lens phenomenon occurs, laser light having a laser beam intensity distribution B3 different from the laser beam intensity distribution A3 is guided downstream of the optical path. As a result, when the thermal lens phenomenon occurs and when it does not occur, the quality of the processed hole of the workpiece is different.

(發現藉由TFP(Thin-Film Polarizers,薄膜偏光件)吸收之課題。在透過型亦可實施) (I found the problem of absorption by TFP (Thin-Film Polarizers). It can also be implemented in the transmission type)

在本實施形態1中,亦與上述專利文獻1同樣地在偏光相位差板200中雷射光透過具有厚度之基板之點相同, 因此根據基板之直徑方向的溫度梯度,可推想同樣地發生熱透鏡現象。 In the first embodiment, as in the above-mentioned Patent Document 1, the point at which laser light passes through a substrate having a thickness in the polarizing retardation plate 200 is the same. Therefore, according to the temperature gradient in the diameter direction of the substrate, it can be assumed that the thermal lens phenomenon occurs in the same manner.

對此,本發明之調查的結果,使用於上述專利文獻1之偏光光束分光器的TFP(薄膜偏光件),實際上所使用的是經厚度1μm以上的ThF4(thorium fluoride,氟化釷)堆積了數層的構造。具體而言係使ThF4(氟化釷)之層堆積了四層以上。經量測在ThF4膜狀態的吸收係數的結果為19[cm-1],且為屬於母材之ZnSe(zinc selenide,硒化鋅)(5e-4[cm-1])的38000倍。設ThF4膜厚的合計為5μm左右、ZnSe基板厚度為5mm時,ThF4吸收了38倍雷射光。在TFP所吸收的熱,因為薄膜,故往直徑方向的熱傳導性不良,而發生直徑方向的溫度差。亦即,可得知由TFP之熱吸收所造成的影響為主導地位。 In view of this, as a result of the investigation of the present invention, the TFP (thin film polarizer) used in the polarized beam splitter of the above-mentioned Patent Document 1 actually used ThF 4 (thorium fluoride) with a thickness of 1 μm or more. Stacked several layers of structure. Specifically, four or more layers of ThF 4 (thorium fluoride) are deposited. The measurement of the absorption coefficient in the state of ThF 4 film was 19 [cm -1 ], which was 38,000 times that of ZnSe (zinc selenide) (5e -4 [cm -1 ]) belonging to the parent material. When the total thickness of the ThF 4 film is about 5 μm and the thickness of the ZnSe substrate is 5 mm, ThF 4 absorbs 38 times the laser light. The heat absorbed in the TFP is poor in thermal conductivity in the radial direction because of the thin film, and a temperature difference in the radial direction occurs. That is, it can be known that the influence caused by the heat absorption of TFP is dominant.

(次波長柵格構造的作用與效果) (The function and effect of subwavelength grid structure)

相對於此,本實施形態1,藉由使用次波長柵格構造之偏光相位差板200的功率平衡裝置,藉此在遠紅外線中僅以透過率較高的基板材料加以構成,且可排除TFP。結果,不受熱透鏡現象的影響,即可在被加工物13A、13B形成穩定加工品質的加工孔。 On the other hand, in the first embodiment, by using the power balance device of the polarizing retardation plate 200 of the sub-wavelength grid structure, in far infrared ray, it is composed only of the substrate material with high transmittance, and TFP can be eliminated . As a result, processing holes with stable processing quality can be formed in the workpieces 13A and 13B without being affected by the thermal lens phenomenon.

再者,本實施形態1,第2圖所示之偏光相位差板200之基板202的母材(亦即材料)係使用ZnS(硫化鋅)。在紅外線透過材料中,將折射率較小之ZnS使用在基板,藉此防止菲涅耳(Fresnel)反射,即使在柵格上設置YF3(yttrium fluoride,氟化釔)等之吸收率較高材料之膜,亦可以吸收 較少之ZnS單一材料構成波長版(亦即,構成偏光相位差板200),而可抑制熱透鏡的發生。 Furthermore, in the first embodiment, the base material (that is, the material) of the substrate 202 of the polarizing retardation plate 200 shown in FIG. 2 uses ZnS (zinc sulfide). In the infrared transmission material, ZnS with a small refractive index is used on the substrate, thereby preventing Fresnel (Fresnel) reflection, even if YF 3 (yttrium fluoride, yttrium fluoride), etc. are provided on the grid, the absorption rate is high The film of the material can also absorb less ZnS single material to constitute the wavelength plate (that is, constitute the polarizing retardation plate 200), and can suppress the occurrence of the thermal lens.

此外,ZnSe之熱傳導率為18[W/(mK)],相對於此ZnS之熱傳導率為27.2[W/(mK)]較大,故難以產生溫度分佈,抑制了熱透鏡的發生。 In addition, the thermal conductivity of ZnSe is 18 [W / (mK)], and the thermal conductivity of ZnS is 27.2 [W / (mK)], which makes it difficult to generate a temperature distribution and suppress the occurrence of thermal lenses.

作為一例,第7圖顯示評價下述情形熱透鏡現象之影響的結果:就雷射加工裝置的功率平衡裝置,當設置使用專利文獻1所揭示之習知之偏光方位角調整用偏光件的偏光方位角調整裝置的情形、與設置使用次波長柵格構造之偏光相位差板200的功率平衡裝置的情形。雷射加工裝置的功率平衡裝置係配置於與實施形態1同樣的位置。來自雷射振盪器1的雷射光係成為:透過功率平衡裝置後,經由光束可變部5,而在光罩4僅透過所期望部分之構成。 As an example, FIG. 7 shows the results of evaluating the influence of the thermal lens phenomenon in the case where the polarizer of the polarizer for adjusting the polarization azimuth angle disclosed in Patent Document 1 is used when the power balance device of the laser processing device is provided. The case of the angle adjustment device and the case of the power balance device provided with the polarizing retardation plate 200 using the sub-wavelength grid structure. The power balance device of the laser processing apparatus is arranged at the same position as in the first embodiment. The laser light from the laser oscillator 1 is configured to pass through the power balance device, pass through the light beam variable section 5, and pass through only the desired portion in the mask 4.

第7圖(a)係:就雷射加工裝置的功率平衡裝置,當設置專利文獻1所揭示之習知之偏光位角調整裝置之情形下,雷射振盪器之脈衝發生的頻率所相對之到達被加工物之雷射光的能量強度之變化率的量測結果。橫軸顯示雷射振盪器之脈衝發生的頻率(脈衝頻率),而縱軸顯示到達被加工物之雷射光的能量強度的變化率(加工點能量變化率)。 Fig. 7 (a): With respect to the power balance device of the laser processing device, when the conventional polarization position adjustment device disclosed in Patent Document 1 is provided, the frequency of the pulse generation of the laser oscillator is relatively reached The measurement result of the rate of change of the laser beam energy intensity of the workpiece. The horizontal axis shows the frequency (pulse frequency) at which the pulses of the laser oscillator occur, and the vertical axis shows the rate of change of the energy intensity of the laser light reaching the workpiece (processing point energy change rate).

脈衝頻率越高,入射至功率平衡裝置之雷射光的功率越高。加工點能量變化率係設脈衝頻率200Hz左右之較低時的加工點能量為分母、設在各脈衝頻率下之 加工點能量為分子,而經除法運算之值。脈衝頻率較低時,加工點能量變化率縮小,而隨著脈衝頻率變高,加工點能量變化率增大。這顯示:透過偏光方位角調整裝置之雷射光的功率越高,使熱透鏡效應越大,且透過光罩之雷射光的能量強度之變化率增大。 The higher the pulse frequency, the higher the power of the laser light incident on the power balancing device. The energy change rate of the processing point is the energy of the processing point when the pulse frequency is about 200Hz is lower as the denominator, which is set under each pulse frequency The energy at the processing point is a numerator, and the value is calculated by division. When the pulse frequency is low, the energy change rate of the processing point decreases, and as the pulse frequency becomes higher, the energy change rate of the processing point increases. This shows that the higher the power of the laser light transmitted through the polarization azimuth adjustment device, the greater the thermal lens effect, and the change rate of the energy intensity of the laser light transmitted through the reticle increases.

第7圖(b)係就雷射加工裝置的功率平衡裝置,當設置使用次波長柵格構造之偏光相位差板200的功率平衡裝置之情形下,雷射振盪器之脈衝發生的頻率所相對之到達被加工物之雷射光的能量強度之變化率的量測結果。使脈衝平率200Hz至2400Hz變化時之加工點能量變化率的變化範圍:設置習知之偏光方位角調整裝置之情形約7.5%、而設置使用次波長柵格構造之偏光相位差板200的功率平衡裝置之情形為約6%,顯示了將使用次波長柵格構造之偏光相位差板200的功率平衡裝置用在雷射加工裝置,藉此抑制熱透鏡的發生。 Figure 7 (b) is the power balance device of the laser processing device. When the power balance device using the polarizing retardation plate 200 of the sub-wavelength grid structure is provided, the frequency of the pulse of the laser oscillator is relatively The measurement result of the rate of change of the energy intensity of the laser light reaching the workpiece. Variation range of processing point energy change rate when pulse flat rate is changed from 200Hz to 2400Hz: about 7.5% when the conventional polarization azimuth adjustment device is installed, and the power balance of the polarized retardation plate 200 using the sub-wavelength grid structure The case of the device is about 6%, which shows that the power balance device using the polarizing retardation plate 200 of the sub-wavelength grid structure is used in the laser processing device, thereby suppressing the occurrence of the thermal lens.

由第7圖顯示了脈衝頻率與加工點能量變化率成比例關係,當來自雷射振盪器1的雷射光的脈衝頻率越高,雷射光的功率越高,則使藉由使用次波長柵格構造之偏光相位差板200的功率平衡裝置之熱透鏡的抑制效果越增大,即便高輸出光束亦獲得較高加工品質。 Figure 7 shows that the pulse frequency is proportional to the energy change rate of the processing point. When the pulse frequency of the laser light from the laser oscillator 1 is higher, the power of the laser light is higher, so by using the sub-wavelength grid The greater the suppression effect of the thermal lens of the power balance device of the polarized retardation plate 200 constructed, the higher processing quality is obtained even with a high output beam.

(透過型相位差板方式之其他優點) (Other advantages of the transmission phase difference plate method)

下游的光軸,在上述專利文獻1中係隨繞著偏光方位角調整裝置之光軸的旋轉角而變化,而在上述專利文獻3中係隨著相對於光軸之反射面的角度而變化,惟本實施形 態1的構成中,透過光的光軸不隨偏光相位差板200之偏心或傾斜而變化。因此,可利用精密度較低的旋轉機構,而可降低成本。 The downstream optical axis changes in accordance with the rotation angle around the optical axis of the polarization azimuth adjusting device in the above-mentioned Patent Document 1, and changes in accordance with the angle of the reflecting surface with respect to the optical axis in the above-mentioned Patent Document 3. , But the actual form In the configuration of state 1, the optical axis of the transmitted light does not change with the eccentricity or tilt of the polarized retardation plate 200. Therefore, a low-precision rotating mechanism can be used, and the cost can be reduced.

(令相位差小於π/2(90度)之效果,應用次波長柵格之課題) (The effect of making the phase difference less than π / 2 (90 degrees), the problem of applying a sub-wavelength grid)

上述專利文獻2的相位差板係揭示:π、π/2之例。次波長柵格構造中,為了獲得π或π/2的相位差,會有因需要既窄且深之高縱橫比(aspect ratio)之微細構造而難以加工的問題。 The phase difference plate of the above-mentioned Patent Document 2 discloses examples of π and π / 2. In order to obtain a phase difference of π or π / 2 in the sub-wavelength grid structure, there is a problem that it is difficult to process because a fine structure with a high aspect ratio that is both narrow and deep is required.

以下,計算功率平衡調整所需之相位差。 Next, the phase difference required for power balance adjustment is calculated.

設在第1圖所示之偏光光束分光器(PBS)7之9A、9B所示的分離方向為方向a、b、入射至偏光光束分光器7之直線偏光之光的偏光方位角為θ、偏光相位差板200的相位差為、而第2圖中之屬於TM偏光方向的快軸角度為時,入射光e0係以下述(1)式表示。 Let the separation directions shown in 9A and 9B of the polarized beam splitter (PBS) 7 shown in FIG. 1 be directions a and b, and the polarization azimuth angle of linearly polarized light incident on the polarized beam splitter 7 be The phase difference of the polarized phase difference plate 200 is , And the fast axis angle in the direction of TM polarization in Figure 2 is At this time, the incident light e0 is expressed by the following formula (1).

入射光e0通過偏光相位差板200之後的光e1為下述(2)式。 The light e1 after the incident light e0 passes through the polarizing retardation plate 200 has the following formula (2).

e1=Rot(ψ)Re(Φ)Rot(-ψ)e0 (2) e 1 = Rot (ψ) Re (Φ) Rot (-ψ) e0 (2)

光e1係在偏光光束分光器7被分離。經分離之各偏光成分e1a、e1b為下述(3)式。 The light e1 is split by the polarizing beam splitter 7. The separated polarized light components e1a and e1b are represented by the following formula (3).

相對於入射光之功率的各偏光之功率差ΔP為下述(4)式。 The power difference ΔP of each polarized light with respect to the power of incident light is expressed by the following equation (4).

根據上述(4)式,藉由改變所得之ΔP的調整幅度係第2項為固定值,而第1項cos(4 -2 θ)取-1至1之值,因此形成下述(5)式。 According to the above formula (4), by changing The adjustment range of ΔP obtained is that the second term is a fixed value, and the first term cos (4 -2 θ ) takes a value of -1 to 1, so the following formula (5) is formed.

就雷射加工裝置之功率平衡調整而言,以±10%大小的調整幅度較為足夠,根據上述(4)、(5)式,偏光相位差板200所需的相位差如下。 For the adjustment of the power balance of the laser processing device, an adjustment range of ± 10% is sufficient. According to the equations (4) and (5) above, the phase difference required by the polarizing phase difference plate 200 as follows.

>0.64rad=37度 > 0.64rad = 37 degrees

如此,只有功率平衡裝置即使遠小於90度 之相位差亦無實用上問題,因此,可將屬於偏光相位差板200之凸部203之高度H之溝部的深度變淺,而能夠進行製造。 In this way, only the power balance device is even less than 90 degrees There is no practical problem with the phase difference. Therefore, the depth of the groove part belonging to the height H of the convex part 203 of the polarizing phase difference plate 200 can be made shallow, and it can be manufactured.

此外,相位差越小,則旋轉時的調整寬度越窄,亦即,形成平衡變動相對於旋轉角位置偏移較小,故而亦有可低價製造旋轉機構的優點。 In addition, the phase difference The smaller it is, the narrower the adjustment width at the time of rotation, that is, the deviation of the balance change from the rotation angle position is smaller, so there is also an advantage that the rotation mechanism can be manufactured at a low cost.

另外,在實施形態1中,次波長柵格構造的偏光相位差板200與旋轉機構220係構成雷射用之功率平衡裝置。 In the first embodiment, the polarizing retardation plate 200 with the sub-wavelength grid structure and the rotation mechanism 220 constitute a laser power balance device.

實施形態2 Embodiment 2

第3圖係顯示根據本發明之實施形態2之雷射加工裝置的構成之一例之圖。第4圖係顯示第3圖中之雷射用的功率平衡裝置300之一例的內部構成之透視側面圖。第3圖中本實施形態2之雷射加工裝置,係設置有雷射用的功率平衡裝置300,該功率平衡裝置300係彙集包含第1圖之實施形態1之次波長柵格構造之偏光相位差板200與選轉機構220的功能。如第4圖所示,雷射用之功率平衡裝置300係具有下述構造:在屬於鏡體之銅鏡210的上方,使柵格構造以面向表面之方式重疊次波長柵格構造之偏光相位差板200,並收納在鏡體支持具214內,再將O型環211以插入並夾入之方式固定在鏡體支持具214之按壓板212與偏光相位差板200之表面之間。 FIG. 3 is a diagram showing an example of the configuration of a laser processing apparatus according to Embodiment 2 of the present invention. FIG. 4 is a perspective side view showing the internal structure of an example of the laser power balance device 300 in FIG. 3. The laser processing apparatus of the second embodiment in FIG. 3 is provided with a laser power balancing device 300 that collects polarized phases including the sub-wavelength grid structure of the first embodiment in FIG. 1 The function of the difference plate 200 and the rotation selection mechanism 220. As shown in FIG. 4, the laser power balance device 300 has the following structure: above the copper mirror 210 belonging to the mirror body, the grating structure is superimposed so that the grating structure faces the surface with the polarization retardation of the sub-wavelength grating structure The plate 200 is accommodated in the lens holder 214, and then the O-ring 211 is inserted and clamped between the pressing plate 212 of the lens holder 214 and the surface of the polarized retardation plate 200.

入射之雷射光2係透過次波長柵格構造之偏光相位差板200,以銅鏡210的表面反射,而再一次透過次波長柵格構造之偏光相位差板200。如上述方式,兩 次透過偏光相位差板200,因此偏光相位差板200的相位差為一半即可。 The incident laser light 2 passes through the polarized retardation plate 200 of the sub-wavelength grid structure, is reflected by the surface of the copper mirror 210, and passes through the polarized retardation plate 200 of the sub-wavelength grid structure again. As above, two The polarizing retardation plate 200 is transmitted twice, so the phase difference of the polarizing retardation plate 200 may be half.

此外,鏡體支持具214係具備有旋轉機構213,該旋轉機構213可使鏡體支持具214整體繞著銅鏡210之反射面的法線旋轉。 In addition, the mirror support 214 is provided with a rotation mechanism 213 that can rotate the entire mirror support 214 around the normal line of the reflection surface of the copper mirror 210.

其他之基本構成與第1圖中之上述實施形態1相同。 The other basic configuration is the same as the above-mentioned first embodiment in FIG.

(重疊鏡體與波長版之效果) (Effect of overlapping lens body and wavelength version)

根據如第4圖之構成,因使次波長柵格構造之偏光相位差板200的背面與銅鏡210之反射面接觸,故在偏光相位差板200所吸收的熱係朝銅鏡210方向流動而冷卻偏光相位差板200。熱之流動的方向並非為直徑方向而是如箭頭HE所式之光軸方向,故可抑制直徑方向之溫度梯度的發生。結果可防止熱透鏡的發生,進而可進行高功率(high power)的雷射加工。 According to the structure as shown in FIG. 4, since the back surface of the polarizing retardation plate 200 of the sub-wavelength grid structure is in contact with the reflecting surface of the copper mirror 210, the heat absorbed in the polarizing retardation plate 200 flows toward the copper mirror 210 and is cooled Polarized phase difference plate 200. The direction of heat flow is not the diameter direction but the optical axis direction as indicated by the arrow HE, so the occurrence of temperature gradient in the diameter direction can be suppressed. As a result, the occurrence of thermal lenses can be prevented, and high power laser processing can be performed.

第5圖係顯示第3圖之雷射用之功率平衡裝置300之另一例的透過側面圖。第5圖中,次波長柵格構造之偏光相位差板200的凸部側係朝向銅鏡210的表面側,在銅鏡210之上方,使柵格構造之對面的主面以朝向表面之方式重疊次波長柵格構造的偏光相位差板200,並收納於鏡體支持具214。此時,由於柵格未與空氣接觸,可防止廢料等之異物的附著。 FIG. 5 is a transmission side view showing another example of the laser power balance device 300 of FIG. 3. In FIG. 5, the convex side of the polarizing retardation plate 200 of the sub-wavelength grid structure is directed to the surface side of the copper mirror 210, and above the copper mirror 210, the main surface opposite to the grid structure is overlapped so as to face the surface. The polarization retardation plate 200 of the wavelength grid structure is housed in the lens holder 214. At this time, since the grid is not in contact with the air, it is possible to prevent the adhesion of foreign materials such as waste materials.

根據以上本發明,藉由次波長柵格構造,可構成在遠紅外線中使用較高透過率材料的功率平衡裝置、雷射加工裝置,因此防止熱透鏡,即使高輸出光束亦 獲得較高加工品質。 According to the present invention described above, the sub-wavelength grid structure can constitute a power balance device and a laser processing device that use materials with higher transmittance in far infrared rays, thus preventing thermal lenses even with high output beams Obtain higher processing quality.

此外,設偏光相位差板之相位差為π/2以下,藉此使偏光相位差板之柵格的縱橫比縮小,使製造變得容易。 In addition, by setting the phase difference of the polarizing retardation plate to be π / 2 or less, the aspect ratio of the grid of the polarizing retardation plate is reduced, and manufacturing is facilitated.

此外,設偏光相位差板的材料為ZnS,故可防止熱透鏡的發生。 In addition, the material of the polarizing retardation plate is ZnS, so the occurrence of thermal lenses can be prevented.

此外,將鏡體重疊在偏光相位差板,從而可使偏光相位差板背面與鏡體接觸冷卻,故可防止熱透鏡的發生,此外偏光相位差板200的相位差為一半即可。 In addition, the mirror body is superposed on the polarizing retardation plate, so that the back surface of the polarizing retardation plate can be contacted with the mirror body to cool, so that the occurrence of the thermal lens can be prevented. In addition, the phase difference of the polarizing retardation plate 200 may be half.

另外,根據本發明之雷射光用之功率平衡裝置、雷射加工裝置,並不受上述各實施形態所限定。 In addition, the power balance device and laser processing device for laser light according to the present invention are not limited to the above embodiments.

(產業可利用性) (Industry availability)

根據本發明之功率平衡裝置、雷射加工裝置可應用於許多領域的雷射加工。 The power balancing device and the laser processing device according to the present invention can be applied to laser processing in many fields.

Claims (9)

一種雷射光用之功率平衡裝置,具備:偏光相位差板,係於一對正反兩面之主面中之一方主面側,形成有使由與基板材料同一材料所構成之複數個凸部以設定週期P各自平行地直線狀延伸的繞射柵格,且形成為可利用前述繞射柵格的構造性複折射,而入射遠紅外線之雷射光,並使前述繞射柵格的前述週期P滿足P<λ/n(λ為入射光之波長,n為前述基板材料的折射率);以及旋轉機構,係使前述偏光相位差板繞著雷射光的光軸旋轉。A power balancing device for laser light, comprising: a polarizing retardation plate, which is attached to one of the main surfaces of a pair of front and back surfaces, and is formed with a plurality of convex portions made of the same material as the substrate The setting periods P are linear diffraction gratings each extending linearly in parallel, and are formed such that the structural birefringence of the diffraction gratings can be utilized to enter the laser light of far infrared rays, and the period P of the diffraction gratings Satisfy P <λ / n (λ is the wavelength of the incident light, n is the refractive index of the substrate material); and the rotation mechanism rotates the polarizing retardation plate around the optical axis of the laser light. 如申請專利範圍第1項所述之雷射光用之功率平衡裝置,前述偏光相位差板的相位差為π/2以下。According to the power balance device for laser light described in item 1 of the patent application range, the phase difference of the polarizing retardation plate is π / 2 or less. 如申請專利範圍第1項所述之雷射光用之功率平衡裝置,前述偏光相位差板的材料係包含ZnS。As in the power balance device for laser light as described in item 1 of the patent scope, the material of the polarizing retardation plate includes ZnS. 如申請專利範圍第2項所述之雷射光用之功率平衡裝置,前述偏光相位差板的材料係包含ZnS。According to the power balance device for laser light described in item 2 of the patent application range, the material of the polarizing retardation plate includes ZnS. 如申請專利範圍第1項所述之雷射光用之功率平衡裝置,係具備有重疊在前述偏光相位差板之主面的鏡體。The power balance device for laser light as described in item 1 of the patent application scope is provided with a mirror body superimposed on the main surface of the polarized retardation plate. 如申請專利範圍第2項所述之雷射光用之功率平衡裝置,係具備有重疊在前述偏光相位差板之主面的鏡體。The power balance device for laser light as described in item 2 of the patent application scope is provided with a mirror body superimposed on the main surface of the polarized retardation plate. 如申請專利範圍第3項所述之雷射光用之功率平衡裝置,係具備有重疊在前述偏光相位差板之主面的鏡體。The power balance device for laser light as described in item 3 of the patent application scope is provided with a mirror body superimposed on the main surface of the polarized retardation plate. 如申請專利範圍第4項所述之雷射光用之功率平衡裝置,係具備有重疊在前述偏光相位差板之主面的鏡體。The power balance device for laser light as described in item 4 of the patent application scope is provided with a mirror body superimposed on the main surface of the polarized retardation plate. 一種雷射加工裝置,係具備有:如申請專利範圍第1項至第8項中任一項所述之雷射光用之功率平衡裝置;對前述功率平衡裝置之偏光相位差板發生前述雷射光的雷射振盪器;以及在自前述偏光相位差板起至被加工物為止的光程上,將前述雷射光分光成兩束雷射光的分光部。A laser processing device is provided with: a power balance device for laser light as described in any one of claims 1 to 8; and the laser light is generated to a polarizing retardation plate of the power balance device A laser oscillator; and a beam splitter that splits the laser light into two beams of laser light on the optical path from the polarized retardation plate to the workpiece.
TW106101390A 2016-01-18 2017-01-16 Power balance device for laser beam, laser machining device TWI620384B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016-006953 2016-01-18
JP2016006953 2016-01-18
??PCT/JP2017/000455 2017-01-10
PCT/JP2017/000455 WO2017126363A1 (en) 2016-01-18 2017-01-10 Power balance device for laser light, and laser processing device

Publications (2)

Publication Number Publication Date
TW201731187A TW201731187A (en) 2017-09-01
TWI620384B true TWI620384B (en) 2018-04-01

Family

ID=59361548

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106101390A TWI620384B (en) 2016-01-18 2017-01-16 Power balance device for laser beam, laser machining device

Country Status (5)

Country Link
JP (1) JP6590382B2 (en)
KR (1) KR102104782B1 (en)
CN (1) CN108475895B (en)
TW (1) TWI620384B (en)
WO (1) WO2017126363A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6869623B2 (en) * 2017-10-26 2021-05-12 住友重機械工業株式会社 Laser processing equipment
DE112018006546T5 (en) * 2017-12-20 2020-08-27 Sony Corporation LASER DEVICE AND LASER PROCESSING METHOD
CN117559219A (en) * 2022-08-05 2024-02-13 青岛海信宽带多媒体技术有限公司 Laser and optical module

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001269790A (en) * 2000-03-27 2001-10-02 Sumitomo Heavy Ind Ltd Laser beam machining method and device
JP2014029467A (en) * 2012-07-06 2014-02-13 Mitsubishi Electric Corp Polarization retardation plate, and laser beam machine

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09108878A (en) 1995-10-23 1997-04-28 Alps Electric Co Ltd Laser beam machine
WO1997024637A1 (en) * 1996-01-03 1997-07-10 Hughes-Jvc Technology Corporation Fresnel rhomb polarization converter
US6680799B1 (en) * 1999-08-02 2004-01-20 Universite Jean Monnet Optical polarizing device and laser polarization device
US6984802B2 (en) * 2001-11-15 2006-01-10 Mitsubishi Denki Kabushiki Kaisha Laser beam machining device
WO2003082510A1 (en) 2002-03-28 2003-10-09 Mitsubishi Denki Kabushiki Kaisha Laser machining apparatus
KR101233879B1 (en) * 2004-01-16 2013-02-15 칼 짜이스 에스엠티 게엠베하 Polarization-modulating optical element
JP2005230872A (en) * 2004-02-20 2005-09-02 Mitsubishi Electric Corp Laser beam machine and laser beam machining method
JP2008279597A (en) * 2006-05-10 2008-11-20 Oji Paper Co Ltd Concavo-convex pattern forming sheet and its manufacturing method, reflection preventing body, phase difference plate, process sheet original plate, and method for manufacturing optical element
EP2097956A4 (en) * 2006-12-15 2013-01-09 Ellex Medical Pty Ltd Laser
US8116002B2 (en) * 2007-08-27 2012-02-14 Lumella Inc. Grating device with adjusting layer
JP5251671B2 (en) * 2009-03-30 2013-07-31 セイコーエプソン株式会社 Laminated half-wave plate, optical pickup device, polarization conversion element, and projection display device
CN102576114B (en) * 2009-10-24 2016-10-26 3M创新有限公司 There is in selected planes of incidence the immersed reflective polarizer of angle limits
JP5349406B2 (en) * 2010-06-01 2013-11-20 三菱電機株式会社 Polarization azimuth adjusting device and laser processing device
CN102221406A (en) * 2011-05-24 2011-10-19 中国科学院上海技术物理研究所 Monolithic integrated InGaAs near-infrared detector for sub-wavelength micro-polarization grating
CN103529507B (en) * 2012-07-06 2016-05-25 三菱电机株式会社 Polarised light polarizer and laser machine
AU2014294412B2 (en) * 2013-07-26 2017-08-03 Jx Nippon Oil & Energy Corporation Method for manufacturing substrate having textured structure
JP6240497B2 (en) * 2013-12-27 2017-11-29 三星ダイヤモンド工業株式会社 Laser processing equipment
CN104330847A (en) * 2014-11-19 2015-02-04 上海电力学院 Reflective broadband 1/4 wave plate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001269790A (en) * 2000-03-27 2001-10-02 Sumitomo Heavy Ind Ltd Laser beam machining method and device
JP2014029467A (en) * 2012-07-06 2014-02-13 Mitsubishi Electric Corp Polarization retardation plate, and laser beam machine

Also Published As

Publication number Publication date
TW201731187A (en) 2017-09-01
JPWO2017126363A1 (en) 2018-05-24
CN108475895B (en) 2021-07-02
CN108475895A (en) 2018-08-31
KR20180089509A (en) 2018-08-08
KR102104782B1 (en) 2020-04-27
JP6590382B2 (en) 2019-10-16
WO2017126363A1 (en) 2017-07-27

Similar Documents

Publication Publication Date Title
TWI620384B (en) Power balance device for laser beam, laser machining device
US4778263A (en) Variable laser attenuator
WO2018012379A1 (en) Laser machining device
US20010053023A1 (en) Wire grid type polarizer and method of manufacturing the same
US20060256335A1 (en) Optical beam-shaper
KR20050037470A (en) Image projection system with a polarizing beam splitter
WO2003010518A2 (en) Opto-acoustic apparatus with optical heterodyning for measuring solid surfaces and thin films
Sukegawa et al. High-performance astronomical gratings by Canon
TWI648524B (en) Cutting multilayer materials apparatus and method thereof
KR101518122B1 (en) Polarizing phase difference plate and laser processing machine
US9707714B2 (en) Apparatus and method for manufacturing fine pattern using interferogram of optical axis direction
US10976562B2 (en) Nano-structured non-polarizing beamsplitter
TWI510319B (en) Polarizing phase difference plate and laser processing machine
CN112114458A (en) Method for regulating and controlling period of liquid crystal polarization grating
Vedernikov et al. Diffractive elements for a free electron laser
KR101212527B1 (en) Laser processing apparatus and method using interference of polarized laser beams
US10031270B2 (en) Polarization state converting element
Leskova et al. The design and fabrication of one-dimensional random surfaces with specified scattering properties
JP2015118225A (en) Variable attenuator and drawing device
US20230135389A1 (en) Optical system
JP2015060217A (en) Polarizing device
TWI664449B (en) Projection device, projection system and method
JPH10213486A (en) Polarization interferometer
CN112612142B (en) Optical system for generating quasi-flat-top round light spot
JPH0792558B2 (en) Laser beam attenuator