TWI618911B - Wafer packaging device and heat sink and heat sink manufacturing method thereof - Google Patents

Abstract

a heat dissipating member bonded to a layer of a substrate and defining a receiving space with the substrate, the receiving space being electrically connected to a wafer of the substrate, the heat dissipating member comprising: facing the wafer and facing the wafer a base wall separated by a gap, and a surrounding wall connected around the base wall. The surrounding wall includes a plurality of dish holes through which the rubber is infiltrated. Each of the cells has a first hole segment adjacent to the substrate, a second hole segment away from the first hole segment, and a minimum aperture between the first hole segment and the second hole segment An engaging section, the connecting section is covered by a rubber compound. Thereby, the design of the connecting sections can not only improve the surface area during bonding, but also enable the rubber which penetrates into the holes of the holes and covers the connecting sections to exhibit a rivet-like shape and a riveting effect, and strengthen The heat sink and the substrate are combined to maintain the bonding strength.

Description

Wafer packaging device and heat sink and heat sink manufacturing method thereof

The present invention relates to a heat sink for packaging, and more particularly to a package device for a wafer and a method for manufacturing the heat sink and the heat sink.

Referring to Figure 1, a conventional packaging device 1 for packaging a wafer 2. The packaging device 1 includes a substrate 11 electrically connected to the wafer 2, a layer of rubber 12 coated on the substrate 11 and wound around the wafer 2, and bonded to the substrate 11 through the rubber 12 without A heat sink 13 in contact with the wafer 2. The heat sink 13 includes a plurality of perforations 131. Therefore, when the heat dissipating member 13 is pressed against the rubber 12, the rubber 12 penetrates into the through holes 131, so that the heat dissipating member 13 is bonded to the substrate 11 through the rubber 12, and the wafer is packaged. The purpose of 2.

However, the inner surface of the perforations 131 has a small surface area and is generally a smooth surface. Therefore, in the state of long-term use and thermal expansion and contraction, the bonding strength with the rubber 12 is insufficient, and it is easy. There is a problem with falling off.

Accordingly, it is an object of the present invention to provide a package apparatus for a wafer capable of improving bonding holding force and bonding strength, and a method of manufacturing the heat sink and the heat sink.

Thus, a heat dissipating member of the present invention is bonded to a layer of a substrate and defines a receiving space with the substrate, the receiving space is electrically connected to a wafer of the substrate, the heat dissipating member comprising: a base The wall, and a wall around it.

The base wall faces the wafer and is separated from the wafer by a gap.

The surrounding wall is connected around the base wall and includes an inner surface facing the substrate, an outer surface opposite to the inner surface, a plurality of holes extending through the inner surface and the outer surface for the rubber to penetrate Each of the wells has a first hole section adjacent to the substrate, a second hole section away from the first hole section, and between and between the first hole section and the second hole section and having a minimum aperture One of the connecting sections, the connecting section is covered by the rubber.

The packaging device of the present invention is for packaging a wafer, the packaging device comprising: a substrate, and the aforementioned heat sink.

The substrate includes a surface that carries the wafer, and a layer of glue coated on the surface.

The heat dissipating member of the present invention is manufactured by using a punching punch and two pressing punches as tools, and an outer diameter of at least one of the pressing punches is larger than an outer diameter of the punching punch, and the heat dissipating member is made of a metal material. The manufacturing method comprises the following steps:

Step a: impacting the perforated punch in an impact direction and penetrating the heat dissipation The surrounding wall of the piece forms a perforation around the wall.

Step b: impinging on the surrounding wall of the heat dissipating member with the perforating punch in the impact direction, forming the first hole section and the second hole section of the dish hole, and forcing the surrounding of the perforation around the surrounding wall The metallic material forms the engagement section between the forced extrusion punches.

The utility model has the advantages that: the design of the connecting sections can not only improve the surface area during bonding, but also enable the rubber which penetrates into the holes of the holes and covers the connecting sections to have a rivet-like shape and a riveting effect. The reinforcing holding force of the heat sink and the substrate is strengthened to further improve the bonding strength.

3‧‧‧Substrate

30‧‧‧ accommodation space

4‧‧‧Material

5‧‧‧chip

6‧‧‧ base wall

7‧‧‧ Around the wall

70‧‧‧Perforation

701‧‧‧ inner surface

702‧‧‧ outer surface

71‧‧‧ holes

712‧‧‧Second hole section

713‧‧‧Connecting section

7131‧‧‧ first side

7132‧‧‧ second side

7133‧‧‧ side

81‧‧‧punch punch

82‧‧‧Forced punch

821‧‧‧Shaping surface

83‧‧‧Forced punch

831‧‧‧Shaping surface

711‧‧‧ first hole section

D‧‧‧ gap

Other features and advantages of the present invention will be apparent from the embodiments of the present invention. FIG. 1 is a cross-sectional view showing a conventional packaging device. FIG. 2 is a cross-sectional view showing the present invention. One embodiment of the invention is used to package a wafer; FIG. 3 is a partially enlarged cross-sectional view of the embodiment; FIG. 4 is a partially enlarged cross-sectional view showing the second of a heat sink in the embodiment. Figure 5 is a partially enlarged cross-sectional view showing the third aspect of a heat sink in the embodiment; Figure 6 is a partially enlarged cross-sectional view showing the fourth aspect of a heat dissipating member in the embodiment; Figure 7 is a partially enlarged cross-sectional view showing the fifth state of a heat dissipating member in the embodiment. And FIG. 8 to FIG. 10 are schematic views illustrating a method of manufacturing a dish hole for manufacturing the heat sink of the present invention.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

Referring to Figures 2 and 3, an embodiment of the heat sink of the present invention is a metal material bonded to a layer of glue 4 of a substrate 3 and defining a receiving space 30 with the substrate 3. The accommodating space 30 is electrically connected to a wafer 5 of the substrate 3 for accommodation. The heat sink comprises: a base wall 6 and a surrounding wall 7.

The base wall 6 faces the wafer 5 and is separated from the wafer 5 by a gap d.

The surrounding wall 7 is connected around the base wall 6 and includes an inner surface 701 facing the substrate 3, an outer surface 702 opposite to the inner surface 701, and the inner surface 701 and the outer surface 702. A plurality of cells 71 penetrated by the compound 4. Each of the holes 71 has a first hole segment 711 adjacent to the substrate 3, a second hole segment 712 away from the first hole segment 711, and the first hole segment 711 and the second hole segment are connected and connected Between 712 And a connecting section 713 having the smallest aperture.

In this embodiment, the aperture of the first hole segment 711 is larger than the aperture of the second hole segment 712.

The engaging section 713 has a first face 7131 facing the substrate 3 and a second face 7132 opposite to the first face 7131. In this embodiment, the first surface 7131 is a flat surface. The second side 7132 is a sloped surface.

Thereby, when the surrounding wall 7 is pressed toward the substrate 3, the rubber 4 penetrates from the first hole segment 711 of the holes 71 and flows toward the second hole segments 712 to cover the And so on. Thereby, when the rubber material 4 is cured, a rivet-like shape and a riveting effect are obtained, so that the heat dissipating member is combined with the rubber material 4 and the substrate 3 through the dish hole 71 on the surrounding wall 7 to form the packaged wafer. 5 packaged device.

Referring to FIG. 4 to FIG. 7 , it is a second aspect to a fifth aspect of the heat dissipating component of the present invention, which is substantially the same as the dish hole 71 in FIG. 3 , and the difference lies in: FIG. 4 , the first surface 7131 It is a plane. The second surface 7132 is a convex curved surface.

Referring to Figure 5, the first side 7131 is a bevel. The second surface 7132 is a convex curved surface.

Referring to Figure 6, the first face 7131 is a flat surface. The second side 7132 is a flat surface.

Referring to FIG. 7, the engaging portion 713 of the dish hole 71 further has a side surface 7133 connecting one end of the first surface 7131 and one end of the second surface 7132. The first face 7131 is a flat surface. The second side 7132 is a flat surface. This side surface 7133 is a flat surface.

Thereby, the design of the connecting sections 713 can be used to make the cured The rubber 4 exhibits a rivet-like shape and a riveting effect, and the heat sink passes through the opening 71 of the surrounding wall 7 and the rubber 4 and the substrate 3 to form a packaging device for packaging the wafer 5. Since the general knowledge in the art can infer the details of the expansion based on the above description, it will not be explained.

8 to 10, a manufacturing method of a dish hole 71 for manufacturing the heat dissipating member of the present invention, with a punch punch 81, an extruding punch 82, and an outer diameter larger than the pressing punch 82. A forced punch 83 and a trim punch 84 having an outer diameter smaller than the punch punch 81 are tools. The outer diameter of the forced punch 82 may be slightly smaller than the perforating punch 81, or slightly larger than the outer diameter of the perforating punch 81, or equal to the outer diameter of the perforating punch 81, and have a shape formed at the end edge. Face 821. The molding surface 821 and the second surface 7132 of the engaging portion 713 of the dish hole 71 may be a flat surface, a sloped surface, or a concave curved surface. The forced punch 83 has a shaping surface 831 formed at the end edge. The shaping surface 831 and the first surface 7131 of the engaging portion 713 of the dish hole 71 may be a flat surface or a sloped surface. It is worth noting that, although not shown, the shaping surface 831 may also be a concave curved surface, and correspondingly The first face 7131 forms a convex curved surface.

The manufacturing method comprises the following steps:

Step a: Referring to Fig. 8, the perforating punch 81 is impacted in an impact direction L and penetrates the surrounding wall 7 of the heat dissipating member, so that the surrounding wall 7 forms a perforation 70.

Step b: Referring to FIG. 9, the forced punching punches 82, 83 impact the surrounding wall 7 of the heat dissipating member relative to the through hole 70 in the impact direction L to form a second hole segment of the dish hole 71. The metal material around the perforations 70 (Fig. 8) of the first hole segment 711 and the first hole segment 711 is forced to form the engaging portion 713 between the forced punches 82, 83.

Step c: The trimming punch 84 passes through the dish hole 71 in the impact direction L, so that the edge of the engaging section 713 extends in the impact direction.

Thereby, when the edge of the engaging section 713 is as shown in FIG. 3 to FIG. 5, the burr is removed due to the step c. When the edge of the engaging section 713 is as shown in Fig. 7, the side surface 7133 is formed by the step c.

It should be noted that the present invention may also omit the step c, whereby when the shaping faces 821, 831 of the pressing punches 82, 83 are all flat, the step c is omitted, as shown in FIG. The flange state.

In addition, it should be noted that in the present embodiment, the outer diameter of the pressing punch 82 is slightly larger than the punching punch 81, and therefore, the perforation 70 is opposed to the pressing punch 82 to impact the heat sink. In the process of the wall 7, there is a situation in which the metal material is forced to be squeezed. When the outer diameter of the pressing punch 82 is the same as the outer diameter of the punching punch 81, although there is no forced extrusion of the metal material, the punch 70 can be impacted against the pressing punch 82. During the process of surrounding the wall 7 of the heat dissipating member, a space for deforming the metal material is formed by the molding surface 821. When the pressing punch 82 is smaller than the punching punch 81, a gap for the flash is formed with the punching hole 70. Since the flashing material forms an irregular surface, the bonding surface area with the rubber 4 can be further amplified.

Through the above description, the advantages of the foregoing embodiments can be summarized as follows:

1. The present invention utilizes the design of the engaging segments 713 to not only improve the surface area of the heat sink when it is bonded, but also to allow the rubber 4 that penetrates into the holes 71 and covers the engaging segments 713 to have a rivet-like shape. And the riveting effect, and the bonding holding force of the heat sink and the substrate 3 is strengthened to further improve the bonding strength.

2. The molding method of the holes 71 can be completed by stamping, and the process is quite simple and fast.

However, the above is only the embodiment of the present invention, and the scope of the invention is not limited thereto, and all the simple equivalent changes and modifications according to the scope of the patent application and the patent specification of the present invention are still Within the scope of the invention patent.

Claims (10)

A heat dissipating member is bonded to a layer of a substrate and defines a receiving space with the substrate, the receiving space is electrically connected to a wafer of the substrate, the heat dissipating member comprising: a base wall facing the wafer And a gap from the wafer; and a surrounding wall connected around the base wall and including an inner surface facing the substrate, an outer surface opposite to the inner surface, the inner surface and the outer surface And a plurality of dish holes for the rubber to infiltrate, each of the holes having a first hole segment adjacent to the substrate, a second hole segment away from the first hole segment, and the first hole segment being connected and connected An engaging section between the second hole segments and having the smallest diameter, the connecting section is covered by the rubber. The heat sink of claim 1, wherein the first hole segment has a larger diameter than the second hole segment. The heat sink of claim 2, wherein the engaging section has a first face facing the substrate and a second face opposite the first face. The heat sink of claim 3, wherein the first surface is one of a flat surface, a sloped surface, and a convex curved surface. The heat sink of claim 3, wherein the second surface is one of a flat surface, a sloped surface, and a convex curved surface. The heat sink of claim 3, wherein the engaging section further has a side that connects one end of the first face to one end of the second face. A packaging device for packaging a wafer, the packaging device comprising: a substrate, including a surface carrying the wafer, and coated thereon a layer of rubber on the surface; and a heat sink as claimed in claim 1. A manufacturing method of the heat sink according to claim 1, wherein a punching punch and two pressing punches are used as tools, and an outer diameter of the at least one forced punch is larger than an outer diameter of the punching punch, and the heat sink is a metal material, the manufacturing method comprising the steps of: step a: impinging the punching punch in an impact direction and penetrating the surrounding wall of the heat sink to form a perforation; and step b: punching with the force The head impacts the surrounding wall of the heat sink relative to the perforation along the impact direction, forming a first hole section and a second hole section of the dish hole, and forcing the metal material around the perforation surrounding the wall to form the forced extrusion The junction between the heads. The manufacturing method according to claim 8, further comprising a trimming punch having an outer diameter smaller than the punching punch as a tool, and further comprising the step of: step c: passing the dish in the impact direction with the trimming punch a hole extending the edge of the engaging section in the direction of impact. The manufacturing method of claim 8, wherein at least one of the pressing punches has a molding surface formed on the end edge, and the molding surface may be one of a flat surface, a sloped surface, and a concave curved surface, wherein The metal material forced by the forced punches in step b will follow the contoured faces to form the engaging sections.