TWI618173B - Component separation device - Google Patents

Abstract

A component separating device includes a first linear module, a first arm, a second arm, and a rotating module. The first arm is coupled to the first linear module and configured to drive a target component to move in a first direction. The second arm is coupled to the first linear module and configured to drive a support substrate to move in the first direction. The rotating module is connected between the first arm and the first linear module or between the second arm and the first linear module.

Description

Component separation device

The present invention relates to a component separation device.

Due to the current development of the microelectronics industry, in order to meet the needs of diversification and thinness and miniaturization of electronic products, semiconductor related industries generally use wafer temporary bonding processes to provide appropriate wafer support. In turn, the process yield is improved.

In the process of temporary bonding of wafers, the wafer and the supporting substrate are usually fixed by using a polymer or a tape to ensure that the wafer is not broken during the process, and the wafer and the supporting substrate are required after completing various processes. Separation of materials. In a typical mechanical separation process, a support arm is pulled by a mechanical arm, and then a dicing frame to which the wafer is attached is removed by another mechanical arm. However, with the division of two mechanical arms, the control is more complicated, and the two sets of mechanical arms need to occupy a large equipment space. Moreover, the number of parts required to form two mechanical arms is large, which also increases the time for equipment maintenance work.

The invention provides a component separating device, which can solve the problems of complicated handling, large volume, many required parts and long maintenance time of the separating device in the prior art.

The component separating device of the present invention comprises a first linear module, a first arm, a second arm and a rotating module. The first arm is coupled to the first linear module and configured to drive a target component to move in a first direction. The second arm is coupled to the first linear module and configured to drive a support substrate to move in the first direction. The rotating module is connected between the first arm and the first linear module or between the second arm and the first linear module.

In an embodiment of the invention, the first linear module moves the first arm and the second arm simultaneously or separately in the first direction.

In an embodiment of the invention, the component separating device further includes a second linear module. The first linear module is disposed on the second linear module, and the second linear module is configured to drive the first arm and the second arm to move in a second direction.

In an embodiment of the invention, the second direction is perpendicular to the first direction.

In an embodiment of the invention, the first arm and the second arm are vacuum adsorption type mechanical arms for vacuum adsorbing the target component and the supporting substrate.

In an embodiment of the invention, a rotating shaft of the rotating module is parallel to a supporting surface of the second arm, and the rotating shaft is spaced apart from the supporting surface.

In an embodiment of the invention, the second arm is trigeminal.

In an embodiment of the invention, the rotary module includes a direct drive motor.

In an embodiment of the invention, the component separating device further includes a first placement area, a second placement area, and a third placement area. The first placement area is for placing the support substrate and the target component. The second placement area is for placing the separated support substrate. The third placement area is for placing the separated target component.

In an embodiment of the invention, the second placement area has a hollow portion for the second arm to pass to retain the support substrate in the second placement area.

Based on the above, in the component separating device of the present invention, the first arm and the second arm are each driven by a linear module and are respectively used to drive the target member and the supporting substrate apart from each other. Therefore, the component separating device of the present invention can save work space, has fewer assembly parts, can reduce the maintenance time of the component separating device, and can also improve the production efficiency of the separation process.

The above described features and advantages of the invention will be apparent from the following description.

Fig. 1A is a schematic view of a component separating device in accordance with an embodiment of the present invention. Referring to FIG. 1A , the component separation device 100 of the present embodiment includes a first linear module 110 , a first arm 120 , a second arm 130 , and a rotation module 140 . The first arm 120 is coupled to the first linear module 110 and configured to drive a target component 150 to move in a first direction D1. The first direction D1 is, for example, the vertical direction in FIG. The second arm 130 is coupled to the first linear module 110 and configured to drive a support substrate 160 to move in the first direction D1. The rotating module 140 is connected between the second arm 130 and the first linear module 110. The material of the first arm 120 and the second arm 130 is, for example, a material that is not easily deformed, such as a metal, an alloy, or a PVC. The invention is not limited thereto. In the present embodiment, the component separation device 100 can be applied to various semiconductor processes to separate the temporarily bonded target component 150 from the support substrate 160 so that the separated target component 150 can proceed to the next process.

Figure 1B is a cross-sectional view taken along the line I-I of Figure 1A. Referring to FIG. 1B , a bonding layer 162 is disposed between the target component 150 and the support substrate 160 , and a bonding layer 164 is disposed between the target component 150 and a support frame 152 . Both sides of the target element 150 are bonded to the support substrate 160 and the support frame 152 through a bonding layer, tape or the like. For example, target component 150 can be a single germanium wafer, or a semi-finished or finished product of other types of components. In general, the area of the support frame 152 is greater than the area of the target component 150 and greater than the area of the support substrate 160. The material of the support substrate 160 is, for example, glass or other suitable material. The support substrate 160 provides appropriate support for the target component 150 to enhance process yield during various processes, and the support substrate 160 is removed after various processes have been completed.

Referring to FIG. 1A and FIG. 1B, in the embodiment, the bonding layer 162 between the target component 150 and the supporting substrate 160 can be selectively lost first, and the first arm 120 of the component separating device 100 can be vacuumed. The support layer 164 is attached to the support frame 152 of the target member 150 by means of adsorption, magnetic attraction or clamping. The second arm 130 can also fix the support substrate 160 by vacuum adsorption, magnetic attraction or clamping. Next, driving the first linear module 110 drives the second arm 130 to move along the first direction D1 to pull the support substrate 160 away from the target component 150. In addition, since the area of the support frame 152 is larger than the area of the support substrate 160, the opening degree of the first arm 120 is greater than the opening degree of the second arm 130, so the second arm 130 does not interfere when moving in the first direction D1. The first arm 120 is used for the purpose of separating the support substrate 160 from the target member 150.

In addition, in an embodiment, the first linear module 110 can be driven to move the first arm 120 along the first direction D1 to lower the target component 150 and the support frame 152 away from the support substrate 160 to achieve separation of the support substrate. 160 with the purpose of the target component 150. In addition, in another embodiment, the first linear module 110 can be driven to simultaneously move the first arm 120 and the second arm 130 in the first direction D1, for example, the first arm 120 moves downward, and the second The arm 130 is moved upward to move the target member 150 and the support substrate 160 away from each other, thereby achieving the purpose of separating the target member 150 from the support substrate 160. Next, the rotating module 140 is driven to rotate the separated supporting substrate 160 by the second arm 130 by 180 degrees, and the separated supporting substrate 160 is placed above the second arm 130 to avoid insufficient adsorption force. An accident that causes the support substrate 160 after separation to fall occurs. In addition, when driving the first linear module 110 to drive the second arm 130 to lift the support substrate 160 in the first direction D1, the first arm 120 is pressed against the support frame 152 of the target component 150, compared to the first One arm 120 fixes the support frame 152 in an adsorption manner during the separation process, and the success rate of this method is high.

Figure 2 is a schematic illustration of a component separation device in accordance with another embodiment of the present invention. Referring to FIG. 1A, FIG. 1B and FIG. 2, the same or similar elements are designated by the same or similar reference numerals and will not be described again. The difference between the component separating device 102 of the present embodiment and the component separating device 100 of FIG. 1A is that the rotating module 140 is connected between the first arm 120 and the first linear module 110. In addition, the position at which the first arm 120 adsorbs the support frame 152 may be on the side that is attached to the target component 150, or may be on the other side of the target component 150, or the side of the support frame 152. This is limited to this.

In the present embodiment, the component separating device 102 removes the supporting substrate 160 in a manner similar to that of FIG. 1A, except that after the target component 150 is separated from the supporting substrate 160, the component separating device 102 drives the rotating module 140 to make One arm 120 is attracted to the support frame 152 of the bonding layer 164 and attached to the target member 150 by 180 degrees, and then transferred to the next process.

Fig. 3 is a schematic view of a component separating device according to still another embodiment of the present invention. Referring to FIG. 1A and FIG. 3, the same or similar elements are designated by the same or similar reference numerals and will not be described again. The component separating device 200 of the present embodiment has a second linear module 270 as compared with the component separating device 100 of FIG. 1A, thereby carrying it, thereby improving the degree of freedom of operation of the component separating device 200. The first linear module 210 is disposed on the second linear module 270 for driving the first arm 220 and the second arm 230 to move in a second direction D2. The second direction D2 is perpendicular to the first direction D1, the second direction D2 is, for example, a horizontal direction, and the first direction D1 is, for example, a vertical direction, that is, the second linear module 270 can move the first arm 220 and the second arm 230 to The specific plurality of positions in the horizontal direction, and the first linear module 210 can move the first arm 220 and the second arm 230 up and down simultaneously or vertically in the vertical direction.

Further, the component separating device 200 of the present embodiment has more the first placement area A, the second placement area B, and the third placement area C than the element separation apparatus 100 of FIG. 1A. The first placement area A is for placing the support substrate 260 and the target component 250. The second placement area B is for placing the separated support substrate 260. The third placement area C is for placing the separated target component 250.

In the present embodiment, the first arm 220 and the second arm 230 are, for example, vacuum suction type robot arms for vacuum adsorbing the target component 250 and the support substrate 260. The second arm 230 is, for example, a trigeminal shape, and can stably adsorb the supporting base material 260 to prevent falling. Since the first arm 220 and the second arm 230 utilize the vacuum adsorption target component 250 and the support substrate 260, the first placement area A, the second placement area B, and the third placement area C can omit the Vacuum adsorption equipment can also reduce equipment costs.

4A is a schematic cross-sectional view of the target component and the support substrate of FIG. 3 in a first state, FIG. 4B is a cross-sectional view of the target component and the support substrate of FIG. 3 in a second state, and FIG. 4C is a target component and support of FIG. FIG. 4D is a schematic cross-sectional view showing the substrate in a third state, and FIG. 4D is a schematic cross-sectional view showing the target member and the supporting substrate of FIG. 3 in a fourth state. Referring to FIG. 3 and FIG. 4A , in the embodiment, the target component 250 and the support substrate 260 are first placed in the first placement area A. Then, the second linear module 270 is driven to drive the first arm 220 and the second arm 230 to move to the first placement area A in the second direction D2. Then, the first linear module 210 is driven to drive the first arm 220 and the second arm 230 to move toward the first direction D1 at an appropriate distance, for example, moving downward, respectively contacting the support layer 264 to the target component 250. Block 252 and support substrate 260. Thereafter, the first linear module 210 is driven to cause the first arm 220 and the second arm 230 to simultaneously extract the target component 250 and the supporting substrate 260 placed in the first placement area A by vacuum adsorption. First state.

Referring to FIG. 3 and FIG. 4B, the second linear module 270 is driven to cause the first arm 220 and the second arm 230 to adhere to the support frame 252 and the supporting substrate 260 of the target component 250 with the bonding layer 264. The second direction D2 moves to the third placement area C. Then, the first linear module 210 is driven to drive the first arm 220 and the second arm 230 to move downward in the first direction D1, and the target component 250 and the supporting substrate 260 are placed in the third placement area C. Then, the second arm 230 adsorbs the supporting substrate 260 in a vacuum manner, and drives the first linear module 210 to move the second arm 230 in the first direction D1 to pull the supporting substrate 260 away from the target component 250, which is In the second state, the purpose of separating the support substrate 260 from the target member 250 is completed.

In detail, when the first linear module 210 is driven to cause the second arm 230 to pull the support substrate 260 in the first direction D1, the first arm 220 is pressed against the support layer 264 to the target member 250. At block 252, the first arm 220 does not need to fix the support frame 252 by means of adsorption to perform the separation process. In addition, since the area of the support frame 252 is larger than the area of the support substrate 260, the opening degree of the first arm 220 is greater than the opening degree of the second arm 230, so the second arm 230 does not interfere when moving in the first direction D1. The first arm 220 smoothly separates the support substrate 260 from the target member 250.

In addition, in an embodiment, the first linear module 210 can be driven to move the first arm 220 along the first direction D1 to lower the target component 250 and the support frame 252 away from the support substrate 260 to achieve separation of the support substrate. 260 and the purpose of the target component 250. In addition, in another embodiment, the first linear module 210 can be driven to simultaneously move the first arm 220 and the second arm 230 in the first direction D1, for example, the first arm 220 moves downward, and the second The arm 230 is moved upward to move the target member 250 and the support substrate 260 away from each other, thereby achieving the purpose of separating the target member 250 from the support substrate 260.

Referring to FIG. 3, FIG. 4C and FIG. 4D, after the target component 250 is separated from the support substrate 260, the target component 250 and the support frame 252 are left in the third placement area C, and the rotation module 240 is driven to drive the second arm. 230 rotates the separated support substrate 260 by 180 degrees, which is the third state. Next, the second linear module 270 is driven to move the support substrate 260 after the second arm 230 is rotated by 180 degrees in the second direction D2 and placed in the second placement area B, which is the fourth state. The rotary module 240 includes, for example, a direct drive motor (not shown). Since the second placement area B has the hollow portion B1, the second arm 230 can be passed, so that the second arm 230 does not collide with the second placement area B when moving downward, and the separated support substrate can be smoothly separated. 260 is left in the second placement zone B. In addition, the separated support substrate 260 can be recycled.

In another embodiment, the timing of driving the rotating module 240 may also be driving the second linear module 270, so that the second arm 230 adsorbs the separated supporting substrate 260 and moves to the second direction along the second direction D2. After the placement area B is above, the rotation module 240 is driven to rotate the separated support substrate 260 by 180 degrees and then placed directly in the second placement area B.

5A is a II-II cross-sectional view of the second arm of FIG. 3 in a first position, and FIG. 5B is a II-II cross-sectional view of the second arm of FIG. 3 at a second position. Referring to FIG. 3 , FIG. 5A and FIG. 5B , a rotating shaft 242 of the rotating module 240 is parallel to a supporting surface 244 of the second arm 230 , and the rotating shaft 242 is spaced apart from the supporting surface 244 . Therefore, when the rotation module 240 drives the second arm 230 to rotate, the support surface 244 of the second arm 230 moves from the first position P1 to the second position P2, and the second position P2 is lower than the first position P1, for example. Close to the second placement zone B. By eccentrically disposing the second arm 230 on the rotating module 240, the supporting substrate 260 can be brought close to the second placement area B while the second arm 230 is rotated, and the second arm 230 can be shortened and then lowered to support The time required for the substrate 260 to be placed in the second placement zone B accelerates the process.

In another embodiment, the second linear module 270 is connected to the first placement area A, the second placement area B, and the third placement area C. In this embodiment, the manner in which the component separation device removes the support substrate 260 is similar to that of FIG. 3, and is not described herein again. The difference is that the first placement area A and the third are driven by driving the second linear module 270. The placement area C and the second placement area B are sequentially moved in the second direction D2 to directly below the first arm 220 and the second arm 230. The first arm 220 and the second arm 230 can be fixed at the same position, and only the first linear module 210 is driven to drive the first arm 220 and the second arm 230 to move along the first direction D1 to separate the target component 250 and support. Substrate 260.

In summary, in the component separating device of the present invention, the first arm and the second arm are connected to the first linear module, and the rotating module is connected to the first arm or the second arm and the first linear module between. The first arm and the second arm respectively drive the target component and the supporting substrate to move in the first direction, thereby completing the purpose of separating the supporting substrate and the target component. The second arm is rotatable to place the separated support substrate. The component separating device of the present invention replaces the traditional two mechanical arm divisions by two mechanical arms on a single linear module. Therefore, only one linear module and one rotating module need to be controlled during operation, so that the complexity of the control is greatly reduced. In addition, the component separating device of the present invention has a small volume, requires less working space than a conventional mechanical arm, and has fewer assembled parts, can reduce the maintenance time of the component separating device, and can also improve the production efficiency of the separating process.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100, 102, 200: component separating device 110, 210: first linear module 120, 220: first arm 130, 230: second arm 140, 240: rotating module 242: rotating shaft 244: supporting surface 150, 250 : Target elements 152, 252: support frames 160, 260: support substrates 162, 164, 264: bonding layer 270: second linear module A: first placement zone B: second placement zone B1: hollow section C : third placement area D1: first direction D2: second direction P1: first position P2: second position

Fig. 1A is a schematic view of a component separating device in accordance with an embodiment of the present invention. Figure 1B is a cross-sectional view taken along the line I-I of Figure 1A. Figure 2 is a schematic illustration of a component separation device in accordance with another embodiment of the present invention. Fig. 3 is a schematic view of a component separating device according to still another embodiment of the present invention. 4A is a schematic cross-sectional view of the target component and the support substrate of FIG. 3 in a first state. 4B is a schematic cross-sectional view of the target element and the support substrate of FIG. 3 in a second state. 4C is a schematic cross-sectional view of the target element and the support substrate of FIG. 3 in a third state. 4D is a schematic cross-sectional view of the target element and the support substrate of FIG. 3 in a fourth state. 5A is a II-II cross-sectional view of the second arm of FIG. 3 in a first position. Figure 5B is a cross-sectional view taken along line II-II of the second arm of Figure 3 in a second position.

Claims (9)

A component separating device includes: a first linear module; a first arm coupled to the first linear module and configured to drive a target component to move in a first direction; and a second arm coupled to And the first linear module is configured to drive a supporting substrate to move in the first direction; a rotating module is connected between the first arm and the first linear module, or is connected to the Between the second arm and the first linear module; and a second linear module, wherein the first linear module is disposed on the second linear module, and the second linear module is used to drive The first arm and the second arm move in a second direction. The component separating device of claim 1, wherein the first linear module moves the first arm and the second arm simultaneously or separately in the first direction. The component separation device of claim 1, wherein the second direction is perpendicular to the first direction. The component separation device of claim 1, wherein the first arm and the second arm are vacuum adsorption robots for vacuum adsorbing the target component and the support substrate. The component separating device of claim 1, wherein a rotating shaft of the rotating module is parallel to a supporting surface of the second arm, and the rotating shaft is spaced apart from the supporting surface. The component separation device of claim 1, wherein the second arm is trigeminal. The component separating device of claim 1, wherein the rotating module comprises a direct drive motor. The component separation device of claim 1, further comprising: a first placement area for placing the support substrate and the target component; and a second placement area for placing and separating The support substrate; and a third placement area for placing the separated target component. The component separation device of claim 8, wherein the second placement area has a hollow portion for the second arm to pass to leave the support substrate in the second placement area.