TWI617799B - 用於在半導體晶圓上之缺陷之自動分類的決策樹結構 - Google Patents

用於在半導體晶圓上之缺陷之自動分類的決策樹結構 Download PDF

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Publication number
TWI617799B
TWI617799B TW103138098A TW103138098A TWI617799B TW I617799 B TWI617799 B TW I617799B TW 103138098 A TW103138098 A TW 103138098A TW 103138098 A TW103138098 A TW 103138098A TW I617799 B TWI617799 B TW I617799B
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Taiwan
Prior art keywords
floating
defects
trees
tree
decision tree
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TW103138098A
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English (en)
Chinese (zh)
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TW201525450A (zh
Inventor
千 輝 亞當 陳
克里斯 梅赫
派翠克 修特
泰坎 聶
約翰 雷蒙德 喬丹
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克萊譚克公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/24—Classification techniques
    • G06F18/243—Classification techniques relating to the number of classes
    • G06F18/24323—Tree-organised classifiers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/24—Classification techniques
    • G06F18/245—Classification techniques relating to the decision surface
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Data Mining & Analysis (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Evolutionary Computation (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Artificial Intelligence (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Evolutionary Biology (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW103138098A 2013-11-03 2014-11-03 用於在半導體晶圓上之缺陷之自動分類的決策樹結構 TWI617799B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201361899220P 2013-11-03 2013-11-03
US61/899,220 2013-11-03
US201461972418P 2014-03-31 2014-03-31
US61/972,418 2014-03-31
US14/257,921 2014-04-21
US14/257,921 US9489599B2 (en) 2013-11-03 2014-04-21 Decision tree construction for automatic classification of defects on semiconductor wafers

Publications (2)

Publication Number Publication Date
TW201525450A TW201525450A (zh) 2015-07-01
TWI617799B true TWI617799B (zh) 2018-03-11

Family

ID=53005249

Family Applications (1)

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TW103138098A TWI617799B (zh) 2013-11-03 2014-11-03 用於在半導體晶圓上之缺陷之自動分類的決策樹結構

Country Status (5)

Country Link
US (1) US9489599B2 (cg-RX-API-DMAC7.html)
JP (1) JP6576342B2 (cg-RX-API-DMAC7.html)
KR (1) KR102373941B1 (cg-RX-API-DMAC7.html)
TW (1) TWI617799B (cg-RX-API-DMAC7.html)
WO (1) WO2015066602A1 (cg-RX-API-DMAC7.html)

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JP6162909B2 (ja) * 2015-07-31 2017-07-12 楽天株式会社 木構造データ編集装置、木構造データ編集方法、及びプログラム
JP7015235B2 (ja) * 2015-08-05 2022-02-02 ケーエルエー コーポレイション 範囲に基づくリアルタイム走査電子顕微鏡非可視ビナー
US11205119B2 (en) 2015-12-22 2021-12-21 Applied Materials Israel Ltd. Method of deep learning-based examination of a semiconductor specimen and system thereof
US10204290B2 (en) * 2016-10-14 2019-02-12 Kla-Tencor Corporation Defect review sampling and normalization based on defect and design attributes
CA2989617A1 (en) * 2016-12-19 2018-06-19 Capital One Services, Llc Systems and methods for providing data quality management
TWI660322B (zh) 2018-05-17 2019-05-21 國立成功大學 考慮機台交互作用之辨識良率損失原因的系統與方法
US11321633B2 (en) * 2018-12-20 2022-05-03 Applied Materials Israel Ltd. Method of classifying defects in a specimen semiconductor examination and system thereof
US12038802B2 (en) 2019-10-14 2024-07-16 Pdf Solutions, Inc. Collaborative learning model for semiconductor applications
CN113298166A (zh) * 2021-06-01 2021-08-24 中科晶源微电子技术（北京）有限公司 缺陷分类器和缺陷分类方法、装置、设备及存储介质
WO2023166585A1 (ja) * 2022-03-02 2023-09-07 株式会社アドバンテスト 半導体試験結果分析装置、半導体試験結果分析方法およびコンピュータプログラム
EP4489059A4 (en) * 2022-03-02 2025-12-31 Advantest Corp Device for analyzing the results of semiconductor tests, method for analyzing the results of semiconductor tests, and computer program
US20250117915A1 (en) * 2023-10-06 2025-04-10 Applied Materials, Inc. Optical inspection-based automatic defect classification

Citations (2)

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TW201339572A (zh) * 2012-03-21 2013-10-01 Optivu Vision System Corp 元件內部缺陷之檢測裝置及方法
TW201339778A (zh) * 2012-02-03 2013-10-01 Applied Materials Israel Ltd 基於設計之缺陷分類之方法及系統

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US6148099A (en) 1997-07-03 2000-11-14 Neopath, Inc. Method and apparatus for incremental concurrent learning in automatic semiconductor wafer and liquid crystal display defect classification
US6922482B1 (en) * 1999-06-15 2005-07-26 Applied Materials, Inc. Hybrid invariant adaptive automatic defect classification
JP4118703B2 (ja) * 2002-05-23 2008-07-16 株式会社日立ハイテクノロジーズ 欠陥分類装置及び欠陥自動分類方法並びに欠陥検査方法及び処理装置
US7602962B2 (en) 2003-02-25 2009-10-13 Hitachi High-Technologies Corporation Method of classifying defects using multiple inspection machines
JP4908995B2 (ja) 2006-09-27 2012-04-04 株式会社日立ハイテクノロジーズ 欠陥分類方法及びその装置並びに欠陥検査装置
JP4616864B2 (ja) 2007-06-20 2011-01-19 株式会社日立ハイテクノロジーズ 外観検査方法及びその装置および画像処理評価システム
JP5022174B2 (ja) * 2007-10-22 2012-09-12 株式会社日立製作所 欠陥分類方法及びその装置
US8233494B2 (en) 2008-01-22 2012-07-31 International Business Machines Corporation Hierarchical and incremental multivariate analysis for process control
US8315453B2 (en) 2010-07-27 2012-11-20 Applied Materials Israel, Ltd. Defect classification with optimized purity
JP5342606B2 (ja) * 2011-06-27 2013-11-13 株式会社日立ハイテクノロジーズ 欠陥分類方法及びその装置
US8502146B2 (en) 2011-10-03 2013-08-06 Kla-Tencor Corporation Methods and apparatus for classification of defects using surface height attributes
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Patent Citations (2)

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TW201339778A (zh) * 2012-02-03 2013-10-01 Applied Materials Israel Ltd 基於設計之缺陷分類之方法及系統
TW201339572A (zh) * 2012-03-21 2013-10-01 Optivu Vision System Corp 元件內部缺陷之檢測裝置及方法

Also Published As

Publication number Publication date
KR102373941B1 (ko) 2022-03-11
US9489599B2 (en) 2016-11-08
JP2017502500A (ja) 2017-01-19
KR20160083055A (ko) 2016-07-11
WO2015066602A1 (en) 2015-05-07
JP6576342B2 (ja) 2019-09-18
US20150125064A1 (en) 2015-05-07
TW201525450A (zh) 2015-07-01

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