TWI617599B - Thermoplastic resin shaped article and method for producing the same, thermoplastic resin light-guiding article, light source device and liquid crystal display device - Google Patents

Thermoplastic resin shaped article and method for producing the same, thermoplastic resin light-guiding article, light source device and liquid crystal display device Download PDF

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TWI617599B
TWI617599B TW103106161A TW103106161A TWI617599B TW I617599 B TWI617599 B TW I617599B TW 103106161 A TW103106161 A TW 103106161A TW 103106161 A TW103106161 A TW 103106161A TW I617599 B TWI617599 B TW I617599B
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thermoplastic resin
light
resin molded
material body
light source
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TW103106161A
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TW201439155A (en
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吉村朋也
八木健二
池野順一
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三菱化學股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/0266Local curing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C71/00After-treatment of articles without altering their shape; Apparatus therefor
    • B29C71/02Thermal after-treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C71/00After-treatment of articles without altering their shape; Apparatus therefor
    • B29C71/04After-treatment of articles without altering their shape; Apparatus therefor by wave energy or particle radiation, e.g. for curing or vulcanising preformed articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00Producing optical elements, e.g. lenses or prisms
    • B29D11/00663Production of light guides
    • B29D11/00721Production of light guides involving preforms for the manufacture of light guides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/08Heat treatment
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12Chemical modification
    • C08J7/123Treatment by wave energy or particle radiation
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033Means for improving the coupling-out of light from the light guide
    • G02B6/0035Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/004Scattering dots or dot-like elements, e.g. microbeads, scattering particles, nanoparticles
    • G02B6/0041Scattering dots or dot-like elements, e.g. microbeads, scattering particles, nanoparticles provided in the bulk of the light guide
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033Means for improving the coupling-out of light from the light guide
    • G02B6/005Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
    • G02B6/0051Diffusing sheet or layer
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0065Manufacturing aspects; Material aspects
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073Light emitting diode [LED]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0838Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using laser
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C71/00After-treatment of articles without altering their shape; Apparatus therefor
    • B29C71/02Thermal after-treatment
    • B29C2071/022Annealing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00Shaping characteristics in general
    • B29C2791/004Shaping under special conditions
    • B29C2791/009Using laser
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2033/00Use of polymers of unsaturated acids or derivatives thereof as moulding material
    • B29K2033/04Polymers of esters
    • B29K2033/08Polymers of acrylic acid esters, e.g. PMA, i.e. polymethylacrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2205/00Foams characterised by their properties
    • C08J2205/04Foams characterised by their properties characterised by the foam pores
    • C08J2205/044Micropores, i.e. average diameter being between 0,1 micrometer and 0,1 millimeter
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2333/00Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
    • C08J2333/04Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
    • C08J2333/06Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C08J2333/10Homopolymers or copolymers of methacrylic acid esters
    • C08J2333/12Homopolymers or copolymers of methyl methacrylate

Abstract

本發明提供一種形成有光出射效率良好的空孔的熱可塑性樹脂成形體及使用其的熱可塑性樹脂導光體。對熱可塑性樹脂成形原料體的內部,於使焦點對準的狀態下照射脈波雷射,於熱可塑性樹脂成形原料體的內部形成裂縫後,於構成熱可塑性樹脂成形原料體的熱可塑性樹脂的玻璃轉移溫度以上的溫度下進行加熱處理,獲得僅於距表面10μm以上的內部具有最小徑為30μm以上的大致球形的空孔244的熱可塑性樹脂成形體20。 The present invention provides a thermoplastic resin molded body in which pores having excellent light-emitting efficiency are formed, and a thermoplastic resin light-guiding body using the same. The inside of the thermoplastic resin-molded material body is irradiated with a pulsed laser beam in a state of being focused, and a crack is formed inside the thermoplastic resin-molded material body, and then the thermoplastic resin constituting the thermoplastic resin-molded material body is formed. Heat treatment is performed at a temperature higher than the glass transition temperature to obtain a thermoplastic resin molded body 20 having only a substantially spherical pore 244 having a minimum diameter of 30 μm or more inside the surface of 10 μm or more.

Description

熱可塑性樹脂成形體及其製造方法、熱可塑性樹脂導光體、光源裝置及液晶顯示裝置 Thermoplastic resin molded body, method for producing the same, thermoplastic resin light guide, light source device, and liquid crystal display device

本發明是有關於一種熱可塑性樹脂成形體及其製造方法、熱可塑性樹脂導光體、光源裝置及液晶顯示裝置。 The present invention relates to a thermoplastic resin molded body, a method for producing the same, a thermoplastic resin light guide, a light source device, and a liquid crystal display device.

液晶顯示裝置基本上是由光源裝置及液晶顯示元件所構成。就液晶顯示裝置的精簡(compact)化的觀點而言,光源裝置大多使用邊緣照明(edge light)方式的背光(背面光源裝置)。於邊緣照明方式的背光中,使用矩形板狀的導光體的至少一個側端面作為光入射端面,沿著光入射端面來配置直管型螢光燈等線狀或棒狀的一次光源或者發光二極體(Light Emitting Diode,LED)等點狀的一次光源,使由一次光源發出的光於導光體的光入射端面入射並將其導入至導光體內部,自作為導光體的兩個主表面中的一個面的光出射面出射。自導光體的光出射面出射的光藉由配置於光出射面上的光擴散膜等光擴散元件而被擴散,藉由稜鏡片 (prism sheet)等光偏向元件而朝所需的方向偏向。光亦自導光體的與光出射面為相反側的主表面即背面出射,為了使該光回到導光體內,以與背面相對向的方式而配置有光反射片等光反射元件。 The liquid crystal display device is basically composed of a light source device and a liquid crystal display element. From the viewpoint of compacting the liquid crystal display device, a backlight (back light source device) of an edge light type is often used as the light source device. In the backlight of the edge illumination method, at least one side end surface of the rectangular plate-shaped light guide body is used as a light incident end surface, and a linear or rod-shaped primary light source such as a straight tube type fluorescent lamp or a light source is disposed along the light incident end surface. a point-like primary light source such as a light emitting diode (LED), such that light emitted from the primary light source is incident on the light incident end surface of the light guide body and introduced into the light guide body, and two light guide bodies are used. The light exit surface of one of the major surfaces emerges. The light emitted from the light exit surface of the light guide is diffused by a light diffusing element such as a light diffusing film disposed on the light emitting surface, by the cymbal The optical deflecting element such as a prism sheet is deflected in a desired direction. The light is also emitted from the main surface which is the main surface opposite to the light exit surface of the light guide, and a light reflection element such as a light reflection sheet is disposed so as to face the back surface in order to return the light to the light guide body.

如上所述的導光體可使用在作為導光體的材料的熱可塑性樹脂成形體中形成各種光學功能結構而成者。光學功能結構例如可列舉用以使於導光體內經導光的光出射的光出射機構。 The light guide body as described above can be formed by forming various optical functional structures in a thermoplastic resin molded body which is a material of a light guide. The optical functional structure includes, for example, a light emitting means for emitting light guided through the light guide body.

已揭示有使用氣泡來作為該光出射機構的方法,上述氣泡是藉由賦予放射線能量及熱能而形成(例如參照專利文獻1)。 It has been disclosed that a bubble is used as the light-emitting means, and the bubble is formed by imparting radiation energy and heat energy (for example, see Patent Document 1).

[先前技術文獻] [Previous Technical Literature]

[專利文獻] [Patent Literature]

[專利文獻1]日本專利特開2006-155937號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2006-155937

伴隨著液晶顯示裝置的高精細化或低消耗電力化,對背光要求能以更少光量的一次光源來進行更高亮度的發光。因此,對於作為背光的構成構件的形成於導光體中的光出射機構,要求能使來自一次光源的光高效地出射的功能。 Along with the high definition of the liquid crystal display device or the low power consumption, it is required for the backlight to perform higher-luminance illumination with a primary light source having a smaller amount of light. Therefore, the light emitting means formed in the light guide body as the constituent member of the backlight is required to have a function of efficiently emitting light from the primary light source.

然而,專利文獻1中揭示的導光體雖然使用以既定的密度形成的氣泡作為光出射機構,但氣泡徑小至20μm以下、具體為0.3μm左右,故各氣泡的光出射效率低,其亮度不可謂充分。 However, the light guide disclosed in Patent Document 1 uses bubbles formed at a predetermined density as the light-emitting means, but the bubble diameter is as small as 20 μm or less, specifically about 0.3 μm, so that the light emission efficiency of each bubble is low, and the brightness thereof is low. Not enough.

另外,專利文獻1的導光體的製造方法中,為了形成氣泡而必須添加誘發氣泡的特定的添加劑。 Further, in the method for producing a light guide of Patent Document 1, it is necessary to add a specific additive for inducing bubbles in order to form bubbles.

進而,專利文獻1的導光體的製造方法中,於經放射線能量照射的部分形成氣泡,故雖可於放射線能量的照射面內控制 氣泡的形成位置,但難以於與放射線能量的照射方向平行的深度方向上控制氣泡的形成位置。 Further, in the method for producing a light guide of Patent Document 1, since bubbles are formed in a portion irradiated with the radiation energy, the radiation can be controlled in the irradiation surface of the radiation energy. The position at which the bubble is formed is difficult to control the position at which the bubble is formed in the depth direction parallel to the irradiation direction of the radiation energy.

本發明的課題在於提供一種形成有光出射效率良好的空孔的熱可塑性樹脂成形體及使用其的熱可塑性樹脂導光體,另外提供一種使用該熱可塑性樹脂導光體的光源裝置及液晶顯示裝置。 An object of the present invention is to provide a thermoplastic resin molded body having pores having excellent light-emitting efficiency and a thermoplastic resin light-guiding body using the same, and a light source device and liquid crystal display using the thermoplastic resin light-guiding body. Device.

本發明的其他課題在於提供一種無需添加劑來製造形成有光出射效率良好的空孔的熱可塑性樹脂成形體的方法。 Another object of the present invention is to provide a method of producing a thermoplastic resin molded article having pores having excellent light-emitting efficiency without using an additive.

本發明的另一課題在於提供一種熱可塑性樹脂成形體的製造方法,其可於成形體的內部的任意位置形成光出射效率良好的空孔。 Another object of the present invention is to provide a method for producing a thermoplastic resin molded body which can form pores having excellent light emission efficiency at arbitrary positions inside the molded body.

上述課題是藉由下述發明[1]~發明[13]來解決。 The above problems are solved by the following inventions [1] to [13].

[1]一種熱可塑性樹脂成形體,其僅於距表面10μm以上的內部具有最小徑為30μm以上的大致球形的空孔。 [1] A thermoplastic resin molded article having substantially spherical pores having a minimum diameter of 30 μm or more only inside the surface of 10 μm or more from the surface.

[2]如[1]所記載的熱可塑性樹脂成形體,其具有透明性。 [2] The thermoplastic resin molded article according to [1], which has transparency.

[3]一種熱可塑性樹脂成形體,其為於以下所示的脈波雷射(pulsed laser)照射步驟後經過以下所示的加熱處理步驟而獲得的熱可塑性樹脂成形體,且僅於距熱可塑性樹脂成形體的表面10μm以上的內部具有最小徑為30μm以上的大致球形的空孔; [3] A thermoplastic resin molded body obtained by the following heat treatment step after the pulsed laser irradiation step shown below, and only in the heat of the heat The inside of the surface of the plastic resin molded body having a surface of 10 μm or more has substantially spherical pores having a minimum diameter of 30 μm or more;

(脈波雷射照射步驟) (pulse laser irradiation step)

對距熱可塑性樹脂成形原料體的表面10μm以上的內部,於 使脈波雷射的焦點對準的狀態下,照射脈波雷射,僅於熱可塑性樹脂成形原料體的內部形成裂縫的步驟; The inside of the surface of the thermoplastic resin molding material body is 10 μm or more, a step of irradiating a pulse laser in a state in which the pulse laser is in focus, and forming a crack only inside the thermoplastic resin forming material body;

(加熱處理步驟) (heating process step)

於構成熱可塑性樹脂成形原料體的熱可塑性樹脂的玻璃轉移溫度以上的溫度下,對形成有裂縫的熱可塑性樹脂成形原料體進行加熱處理,僅於距熱可塑性樹脂成形原料體的表面10μm以上的內部形成最小徑為30μm以上的大致球形的空孔的步驟。 The thermoplastic resin molding material body in which the crack is formed is heat-treated at a temperature equal to or higher than the glass transition temperature of the thermoplastic resin constituting the thermoplastic resin molding material body, and is only 10 μm or more from the surface of the thermoplastic resin molding material body. The step of forming a substantially spherical void having a minimum diameter of 30 μm or more is formed inside.

[4]如[1]至[3]中任一項所記載的熱可塑性樹脂成形體,其中於空孔內具有構成熱可塑性樹脂成形原料體的熱可塑性樹脂的分解生成氣體。 The thermoplastic resin molded article according to any one of the aspects of the present invention, wherein the thermoplastic resin molded body of the thermoplastic resin molding raw material body has a decomposition-forming gas in the pores.

[5]一種熱可塑性樹脂成形體的製造方法,其為於以下所示的脈波雷射照射步驟後經過以下所示的加熱處理步驟而獲得的熱可塑性樹脂成形體的製造方法,且上述熱可塑性樹脂成形體僅於距熱可塑性樹脂成形體的表面10μm以上的內部具有最小徑為30μm以上的大致球形的空孔; [5] A method for producing a thermoplastic resin molded body, which is a method for producing a thermoplastic resin molded body obtained by the following heat treatment step after the pulse wave laser irradiation step described below, and the heat is The plastic resin molded body has substantially spherical pores having a minimum diameter of 30 μm or more only inside the surface of the thermoplastic resin molded body of 10 μm or more;

(脈波雷射照射步驟) (pulse laser irradiation step)

對距熱可塑性樹脂成形原料體的表面10μm以上的內部,於使脈波雷射的焦點對準的狀態下照射脈波雷射,僅於熱可塑性樹脂成形原料體的內部形成裂縫的步驟; a step of irradiating a pulse laser in a state where the surface of the thermoplastic resin molding material body is 10 μm or more, in a state in which the pulse laser is in focus, and forming a crack only inside the thermoplastic resin molding material body;

(加熱處理步驟) (heating process step)

於構成熱可塑性樹脂成形原料體的熱可塑性樹脂的玻璃轉移溫度以上的溫度下,對形成有裂縫的熱可塑性樹脂成形原料體進 行加熱處理,僅於距熱可塑性樹脂成形原料體的表面10μm以上的內部形成最小徑為30μm以上的大致球形的空孔的步驟。 The thermoplastic resin molding material having cracks formed therein is formed at a temperature equal to or higher than the glass transition temperature of the thermoplastic resin constituting the thermoplastic resin molding material body. In the heat treatment, a substantially spherical pore having a minimum diameter of 30 μm or more is formed only inside the surface of the thermoplastic resin-molded material body by 10 μm or more.

[6]如[5]所記載的熱可塑性樹脂成形體的製造方法,其中脈波雷射具有1080nm以下的波長、200飛秒(femto second)以下的脈寬及5μJ/脈波(pulse)以上的能量。 [6] The method for producing a thermoplastic resin molded article according to the above aspect, wherein the pulse wave laser has a wavelength of 1080 nm or less, a pulse width of 200 femtosecond or less, and a pulse of 5 μJ/pulse or more. energy of.

[7]如[5]或[6]所記載的熱可塑性樹脂成形體的製造方法,其中加熱處理的時間為3分鐘以上、30分鐘以下。 [7] The method for producing a thermoplastic resin molded article according to the above [5], wherein the heat treatment time is 3 minutes or longer and 30 minutes or shorter.

[8]如[5]至[7]中任一項所記載的熱可塑性樹脂成形體的製造方法,其中加熱處理的溫度為構成熱可塑性樹脂成形原料體的熱可塑性樹脂的玻璃轉移溫度+30℃以上。 The method for producing a thermoplastic resin molded article according to any one of the above aspects, wherein the temperature of the heat treatment is a glass transition temperature of the thermoplastic resin constituting the thermoplastic resin molded material body + 30 Above °C.

[9]一種熱可塑性樹脂導光體,其使用如[1]至[4]中任一項所記載的熱可塑性樹脂成形體,具有被導入至內部的光所入射的光入射端面、及於內部經導光的光所出射的光出射面,且霧值為5%以下。 [9] A thermoplastic resin molded body according to any one of [1] to [4], which has a light incident end surface to which light introduced into the interior is incident, and The light exiting surface emitted by the light guided by the inside, and the haze value is 5% or less.

[10]一種熱可塑性樹脂導光體,其具有被導入至內部的光所入射的光入射端面、及於內部經導光的光所出射的光出射面,且霧值為5%以下,並且上述熱可塑性樹脂導光體僅於距光出射面10μm以上的內部具有最小徑為30μm以上的大致球形的空孔。 [10] A thermoplastic resin light guide comprising: a light incident end surface on which light introduced into the inside enters, and a light exit surface emitted from light guided inside, and having a haze value of 5% or less, and The thermoplastic resin light guide has substantially spherical pores having a minimum diameter of 30 μm or more only inside the light emitting surface of 10 μm or more.

[11]如[9]或[10]所記載的熱可塑性樹脂導光體,具有芯層(core)-包覆層(clad)結構。 [11] The thermoplastic resin light guide according to [9] or [10], which has a core-clad structure.

[12]一種光源裝置,其為於如[9]或[10]所記載的熱可塑性樹脂導光體上具備一次光源的光源裝置,並且一次光源是鄰接於熱 可塑性樹脂導光體的光入射端面而配置。 [12] A light source device comprising the primary light source of the thermoplastic resin light guide according to [9] or [10], wherein the primary light source is adjacent to the heat The light incident end surface of the plastic resin light guide is disposed.

[13]一種光源裝置,其為於如[11]所記載的熱可塑性樹脂導光體上具備一次光源的光源裝置,並且一次光源是鄰接於熱可塑性樹脂導光體的光入射端面而配置。 [13] A light source device comprising the primary light source of the thermoplastic resin light guide according to [11], wherein the primary light source is disposed adjacent to the light incident end surface of the thermoplastic resin light guide.

[14]一種液晶顯示裝置,其具備如[12]所記載的光源裝置。 [14] A liquid crystal display device comprising the light source device according to [12].

[15]一種液晶顯示裝置,其具備如[13]所記載的光源裝置。 [15] A liquid crystal display device comprising the light source device according to [13].

根據本發明,可提供一種形成有光出射效率良好的空孔的熱可塑性樹脂成形體及使用其的熱可塑性樹脂導光體。 According to the invention, it is possible to provide a thermoplastic resin molded body having pores having excellent light-emitting efficiency and a thermoplastic resin light-guiding body using the same.

另外,藉由使用該熱可塑性樹脂導光體,可提供一種高亮度發光的光源裝置及液晶顯示裝置。 Further, by using the thermoplastic resin light guide, it is possible to provide a light source device and a liquid crystal display device which emit light with high luminance.

進而,根據本發明,無需添加劑便可形成光出射效率良好的空孔,故可提供一種簡便且可實現低成本化的熱可塑性樹脂成形體的製造方法。 Further, according to the present invention, it is possible to form a pore having a good light-emitting efficiency without an additive, and therefore, it is possible to provide a method for producing a thermoplastic resin molded article which is simple and can be reduced in cost.

另外,根據本發明的熱可塑性樹脂成形體的製造方法,可於熱可塑性樹脂成形體的內部的任意位置形成光出射效率良好的空孔,故可提供一種可使來自一次光源的光高效地出射的熱可塑性樹脂成形體。 Further, according to the method for producing a thermoplastic resin molded article of the present invention, pores having excellent light emission efficiency can be formed at any position inside the thermoplastic resin molded body, so that light from the primary light source can be efficiently emitted. A thermoplastic resin molded body.

使用本發明的熱可塑性樹脂導光體所構成的光源裝置例如適於個人電腦(personal computer)等的監視器(monitor)、液晶電視等液晶顯示裝置的背光或雲幕燈(ceiling light)等室內照明、照明廣告牌等照明裝置中使用的光源。 The light source device using the thermoplastic resin light guide of the present invention is suitable, for example, for a monitor such as a personal computer, a backlight of a liquid crystal display device such as a liquid crystal display, or a ceiling light or the like. Light source used in lighting devices such as lighting and lighting billboards.

另外,本發明的熱可塑性樹脂成形體例如亦可用作個人電腦等的監視器、液晶電視等液晶顯示裝置的擴散板,或雲幕燈等室內照明、照明廣告牌等照明裝置中使用的擴散板,或建材、廣告牌、面板等設計板。 Further, the thermoplastic resin molded article of the present invention can be used, for example, as a monitor for a personal computer or the like, a diffusion plate for a liquid crystal display device such as a liquid crystal television, or a diffusion device for use in an illumination device such as an indoor illumination or a lighting billboard such as a cloud curtain lamp. Board, or design board for building materials, billboards, panels, etc.

1‧‧‧飛秒雷射光源 1‧‧‧ femtosecond laser source

2‧‧‧半波長板 2‧‧‧Half-wavelength board

3‧‧‧葛蘭雷射稜鏡 3‧‧‧Granley

4‧‧‧光閘 4‧‧‧Shingles

5、5'、5"‧‧‧鏡 5, 5', 5" ‧ ‧ mirror

6‧‧‧物鏡 6‧‧‧ Objective lens

7‧‧‧飛秒雷射光 7‧‧‧ femtosecond laser light

8‧‧‧熱可塑性樹脂成形原料體 8‧‧‧ thermoplastic resin forming material body

9‧‧‧z軸平台 9‧‧‧z axis platform

10‧‧‧自動雙軸平台 10‧‧‧Automatic twin-axis platform

20‧‧‧熱可塑性樹脂成形體 20‧‧‧ thermoplastic resin molded body

22、340‧‧‧LED 22, 340‧‧‧LED

24、600‧‧‧熱可塑性樹脂導光體 24, 600‧‧‧ thermoplastic resin light guide

26‧‧‧光擴散元件 26‧‧‧Light diffusing elements

28‧‧‧第1光偏向元件 28‧‧‧1st optical deflecting element

30‧‧‧第2光偏向元件 30‧‧‧2nd optical deflecting element

32‧‧‧光反射元件 32‧‧‧Light reflecting elements

100‧‧‧飛秒雷射加工裝置 100‧‧‧ femtosecond laser processing equipment

101‧‧‧脈波雷射照射區域 101‧‧‧ Pulse laser irradiation area

241、302‧‧‧光入射端面 241, 302‧‧‧light incident end face

242、304‧‧‧光出射面 242, 304‧‧‧ light exit surface

243、303‧‧‧背面 243, 303‧‧‧ back

244‧‧‧空孔 244‧‧‧ holes

300‧‧‧亮度測定區域 300‧‧‧Brightness measurement area

310‧‧‧反射片 310‧‧‧reflector

320‧‧‧遮罩 320‧‧‧ mask

360‧‧‧亮度計 360‧‧‧Brightness meter

501‧‧‧裂縫 501‧‧‧ crack

700、900‧‧‧形成有裂縫的片 700, 900‧‧‧ Formed with cracks

1301‧‧‧芯層 1301‧‧ ‧ core layer

1302‧‧‧包覆層 1302‧‧‧Cladding

圖1為表示本發明的熱可塑性樹脂成形體的一實施形態的示意性立體圖。 Fig. 1 is a schematic perspective view showing an embodiment of a thermoplastic resin molded body of the present invention.

圖2為表示脈波雷射的照射時所用的飛秒雷射加工裝置的一實施形態的示意圖。 Fig. 2 is a schematic view showing an embodiment of a femtosecond laser processing apparatus used for irradiation of a pulse laser.

圖3為表示本發明的熱可塑性樹脂導光體的一實施形態的示意性剖面圖。 Fig. 3 is a schematic cross-sectional view showing an embodiment of a thermoplastic resin light guide of the present invention.

圖4為表示本發明的光源裝置的一實施形態的示意性剖面圖。 Fig. 4 is a schematic cross-sectional view showing an embodiment of a light source device according to the present invention.

圖5(a)~圖5(b)為表示熱可塑性樹脂導光體的法線亮度的測定裝置的一實施形態的示意圖。 5(a) to 5(b) are schematic views showing an embodiment of a measuring device for normal brightness of a thermoplastic resin light guide.

圖6為表示實施例中製作的熱可塑性樹脂導光體的空孔的排列的一實施形態的示意圖。 Fig. 6 is a schematic view showing an embodiment of the arrangement of the pores of the thermoplastic resin light guide produced in the example.

圖7為實施例中製作的形成有裂縫的片的概略圖。 Fig. 7 is a schematic view showing a sheet in which cracks are formed in the examples.

圖8(a)~圖8(b)為實施例中製作的熱可塑性樹脂導光體的概略圖。 8(a) to 8(b) are schematic views of the thermoplastic resin light guide produced in the examples.

圖9(a)~圖9(b)為參考例中製作的形成有裂縫的片的概略圖。 9(a) to 9(b) are schematic views of a sheet in which cracks are formed in the reference example.

圖10為表示參考例1中的各種加熱處理的溫度下的熱可塑性樹脂成形體的加熱處理的時間與熱可塑性樹脂成形體中的空孔的最小徑之關係的圖表。 FIG. 10 is a graph showing the relationship between the heat treatment time of the thermoplastic resin molded body at the temperature of various heat treatments in Reference Example 1 and the minimum diameter of the pores in the thermoplastic resin molded body.

圖11為表示參考例2中的各種加熱處理的溫度下的熱可塑性樹脂成形體的加熱處理的時間與熱可塑性樹脂成形體中的空孔的最小徑之關係的圖表。 FIG. 11 is a graph showing the relationship between the heat treatment time of the thermoplastic resin molded body at the temperature of various heat treatments in Reference Example 2 and the minimum diameter of the pores in the thermoplastic resin molded body.

圖12為表示參考例2中製作的熱可塑性樹脂成形體的空孔部的一實施形態的光學顯微鏡照片。 FIG. 12 is an optical microscopic photograph showing an embodiment of the pore portion of the thermoplastic resin molded body produced in Reference Example 2. FIG.

圖13為表示本發明的熱可塑性樹脂成形體的一實施形態的示意性立體圖。 Fig. 13 is a schematic perspective view showing an embodiment of a thermoplastic resin molded body of the present invention.

<熱可塑性樹脂成形體> <The thermoplastic resin molded body>

本發明的實施形態的熱可塑性樹脂成形體僅於距熱可塑性樹脂成形體的表面10μm以上的內部具有最小徑為30μm以上的大致球形的空孔。 The thermoplastic resin molded article according to the embodiment of the present invention has a substantially spherical pore having a minimum diameter of 30 μm or more only inside the surface of the thermoplastic resin molded body of 10 μm or more.

構成熱可塑性樹脂成形體的熱可塑性樹脂例如可列舉:丙烯酸系樹脂、聚碳酸酯樹脂、甲基丙烯酸酯-苯乙烯共聚物(Methyl methacrylate-Styrene copolymer,MS樹脂)、環狀烯烴樹脂(Cyclo Olefin Polymers,COP)及丙烯腈-丁二烯-苯乙烯(Acrylonitrile-Butadiene-Styrene,ABS)樹脂。將熱可塑性樹脂成形體用於光學用途的情形時的熱可塑性樹脂較佳為於廣泛的波長範圍內具有高的光透射性的丙烯酸系樹脂。 Examples of the thermoplastic resin constituting the thermoplastic resin molded body include an acrylic resin, a polycarbonate resin, a methacrylate-styrene copolymer (MS resin), and a cyclic olefin resin (Cyclo Olefin). Polymers, COP) and Acrylonitrile-Butadiene-Styrene (ABS) resin. When the thermoplastic resin molded article is used for optical applications, the thermoplastic resin is preferably an acrylic resin having high light transmittance in a wide wavelength range.

熱可塑性樹脂成形體可根據熱可塑性樹脂成形體的用途而使用各種形狀。將熱可塑性樹脂成形體用作導光體的情形時的熱可塑性樹脂成形體的形狀例如可列舉板狀。 The thermoplastic resin molded body can be used in various shapes depending on the use of the thermoplastic resin molded body. The shape of the thermoplastic resin molded body in the case where the thermoplastic resin molded body is used as the light guide body is, for example, a plate shape.

熱可塑性樹脂成形體中,可使用具有與用途相對應的透明性者。例如於使用熱可塑性樹脂成形體作為導光體的情形時,熱可塑性樹脂成形體較佳為具有霧值為5%以下的透明性者。 In the thermoplastic resin molded body, those having transparency corresponding to the use can be used. For example, when a thermoplastic resin molded body is used as the light guide, the thermoplastic resin molded body preferably has a transparency of 5% or less.

<空孔> <empty hole>

本發明的實施形態中,所謂空孔,是指存在於熱可塑性樹脂成形體或後述熱可塑性樹脂導光體的內部的空間。例如可利用熱使藉由構成熱可塑性樹脂成形體或熱可塑性樹脂導光體的熱可塑性樹脂的解聚合或熱分解等而產生的裂縫膨脹,形成空孔。於該情形時,於空孔內存在熱可塑性樹脂的分解生成氣體。 In the embodiment of the present invention, the void refers to a space existing inside the thermoplastic resin molded body or a thermoplastic resin light guide to be described later. For example, the crack generated by depolymerization or thermal decomposition of the thermoplastic resin constituting the thermoplastic resin molded body or the thermoplastic resin light guide can be expanded by heat to form voids. In this case, a decomposition gas of the thermoplastic resin exists in the pores.

空孔僅存在於距熱可塑性樹脂成形體或熱可塑性樹脂導光體的表面10μm以上的內部。藉由空孔僅存在於距熱可塑性樹脂成形體或熱可塑性樹脂導光體的表面10μm以上的內部,可抑制自導光體出射的光的閃爍。空孔較佳為僅存在於距熱可塑性樹脂成形體或熱可塑性樹脂導光體的表面20μm以上的內部,更佳為僅存在於距表面30μm以上的內部。 The pores are present only inside the surface of the thermoplastic resin molded body or the thermoplastic resin light guide by 10 μm or more. The voids are present only within 10 μm or more from the surface of the thermoplastic resin molded body or the thermoplastic resin light guide, and the flicker of the light emitted from the light guide can be suppressed. The pores are preferably present only inside the surface of the thermoplastic resin molded body or the thermoplastic resin light guide by 20 μm or more, and more preferably only in the interior of 30 μm or more from the surface.

空孔的最小徑為30μm以上。藉由將空孔的最小徑設定為30μm以上,可使將熱可塑性樹脂成形體用作熱可塑性樹脂導光體時的光出射效率良好。另一方面,空孔的最小徑較佳為50μm以上,更佳為70μm以上。就抑制自導光體出射的光的亮度不均 的方面而言,空孔的最大徑較佳為20mm以下。於使用熱可塑性樹脂成形體作為重視光學透明性的熱可塑性樹脂導光體的情形時,空孔的最大徑較佳為1mm以下,於使用熱可塑性樹脂成形體作為重視設計性的熱可塑性樹脂設計板的情形時,空孔的最大徑較佳為20mm以下。 The minimum diameter of the pores is 30 μm or more. By setting the minimum diameter of the pores to 30 μm or more, the light-emitting efficiency when the thermoplastic resin molded body is used as the thermoplastic resin light guide can be improved. On the other hand, the minimum diameter of the pores is preferably 50 μm or more, and more preferably 70 μm or more. Inhibiting uneven brightness of light emitted from the light guide body In terms of the aspect, the maximum diameter of the pores is preferably 20 mm or less. When a thermoplastic resin molded body is used as a thermoplastic resin light guide that emphasizes optical transparency, the maximum diameter of the pores is preferably 1 mm or less, and the thermoplastic resin molded body is used as a design thermoplastic resin. In the case of a plate, the maximum diameter of the holes is preferably 20 mm or less.

以下,使用圖1對空孔的最小徑進行說明。圖1為表示本發明的熱可塑性樹脂成形體的一實施形態的示意性立體圖。此處,於熱可塑性樹脂成形體20為板狀的情形時,將其厚度方向設定為z軸方向,將與其正交且彼此正交的方向設定為x軸方向及y軸方向。於本發明的實施形態中,將自z軸方向及y軸方向觀察空孔244的情形時的空孔244的最小寬度設定為最小徑、空孔244的最大寬度設定為最大徑。另外,縱橫比為將最大徑除以最小徑所得的值。 Hereinafter, the minimum diameter of the hole will be described using FIG. Fig. 1 is a schematic perspective view showing an embodiment of a thermoplastic resin molded body of the present invention. When the thermoplastic resin molded body 20 is in the form of a plate, the thickness direction thereof is set to the z-axis direction, and the directions orthogonal to each other and orthogonal to each other are set to the x-axis direction and the y-axis direction. In the embodiment of the present invention, the minimum width of the hole 244 when the hole 244 is viewed from the z-axis direction and the y-axis direction is set to the minimum diameter, and the maximum width of the hole 244 is set to the maximum diameter. Further, the aspect ratio is a value obtained by dividing the maximum diameter by the minimum diameter.

對於存在於熱可塑性樹脂導光體的內部的空孔而言,上述最小徑及縱橫比的說明亦同樣適用。 The description of the minimum diameter and the aspect ratio described above is also applicable to the void existing in the interior of the thermoplastic resin light guide.

空孔的形狀為大致球形。所謂大致球形是指形狀接近球,並無角。藉由將空孔的形狀設定為大致球形,可使將熱可塑性樹脂成形體用作熱可塑性樹脂導光體時的光出射效率良好。空孔的縱橫比較佳為3以下。 The shape of the void is substantially spherical. The so-called roughly spherical shape means that the shape is close to the ball and there is no angle. By setting the shape of the pores to be substantially spherical, the light-emitting efficiency when the thermoplastic resin molded body is used as the thermoplastic resin light guide can be improved. The aspect ratio of the holes is preferably 3 or less.

<熱可塑性樹脂成形原料體> <The thermoplastic resin forming raw material body>

熱可塑性樹脂成形原料體(constitution)是為了獲得熱可塑性樹脂成形體而使用的材料,且為形成空孔之前的階段的材料。 熱可塑性樹脂成形原料體可根據熱可塑性樹脂成形體的用途而使用各種形狀。例如於使用熱可塑性樹脂成形體作為導光體的情形時,熱可塑性樹脂成形原料體的形狀例如可列舉板狀。 The thermoplastic resin molding raw material is a material used to obtain a thermoplastic resin molded body, and is a material at a stage before the formation of voids. The thermoplastic resin molded material body can be used in various shapes depending on the use of the thermoplastic resin molded body. For example, when a thermoplastic resin molded body is used as the light guide, the shape of the thermoplastic resin molded material body is, for example, a plate shape.

熱可塑性樹脂成形原料體中,可使用具有與用途相對應的透明性者。例如於將熱可塑性樹脂成形體用作導光體的情形時,熱可塑性樹脂成形原料體較佳為具有霧值為5%以下的透明性者。 In the thermoplastic resin molded material body, those having transparency corresponding to the use can be used. For example, when the thermoplastic resin molded article is used as a light guide, the thermoplastic resin molded material preferably has a transparency of 5% or less.

<熱可塑性樹脂成形體的製造方法> <Method for Producing Thermoplastic Resin Molded Body>

熱可塑性樹脂成形體的製造方法例如可列舉:於脈波雷射照射步驟後經過加熱處理步驟來製造熱可塑性樹脂成形體的方法,上述脈波雷射照射步驟對距熱可塑性樹脂成形原料體的表面10μm以上的內部,於使脈波雷射的焦點對準的狀態下照射脈波雷射,僅於熱可塑性樹脂成形原料體的內部形成裂縫;上述加熱處理步驟於構成熱可塑性樹脂成形原料體的熱可塑性樹脂的玻璃轉移溫度以上的溫度下,對形成有裂縫的熱可塑性樹脂成形原料體進行加熱處理,僅於距熱可塑性樹脂成形原料體的表面10μm以上的內部,形成最小徑為30μm以上的大致球形的空孔。 The method for producing a thermoplastic resin molded body includes, for example, a method of producing a thermoplastic resin molded body by a heat treatment step after a pulse wave laser irradiation step, and the pulse wave laser irradiation step is performed on a thermoplastic resin molded material body. The inside of the surface of 10 μm or more is irradiated with a pulse laser in a state in which the pulse laser is in focus, and cracks are formed only in the thermoplastic resin molding material body; and the heat treatment step is to form a thermoplastic resin molding material body. The thermoplastic resin molded material body in which the crack is formed is heat-treated at a temperature equal to or higher than the glass transition temperature of the thermoplastic resin, and the minimum diameter is 30 μm or more only inside the surface of the thermoplastic resin molded material body of 10 μm or more. A generally spherical hollow.

(脈波雷射照射步驟) (pulse laser irradiation step)

脈波雷射照射步驟中,對距熱可塑性樹脂成形原料體的表面10μm以上的內部,於使脈波雷射的焦點對準的狀態下照射脈波雷射,藉此於熱可塑性樹脂成形原料體的內部的目標部位形成裂縫。關於脈波雷射的焦點的位置,可根據目的而設定於熱可塑性 樹脂成形原料體內部的任意的位置及深度。 In the pulse laser irradiation step, the pulse laser is irradiated to the inside of the surface of the thermoplastic resin-molded material body by 10 μm or more in the state in which the pulse laser is in focus, thereby forming the raw material of the thermoplastic resin. A crack is formed at a target portion inside the body. The position of the focus of the pulse laser can be set to the thermoplasticity according to the purpose. Any position and depth inside the resin molded material body.

為了僅於距熱可塑性樹脂成形原料體的表面10μm以上的內部形成裂縫,較佳為使用具有透射構成熱可塑性樹脂成形原料體的熱可塑性樹脂的波長的脈波雷射,更佳為使用具有引起多光子吸收(multiphoton absorption)的脈寬的脈波雷射。藉由使用具有此種波長及脈寬的脈波雷射,對熱可塑性樹脂成形原料體的內部於使焦點對準的狀態下照射,可使照射能量集中於目標位置。結果,產生多光子吸收,由此導致構成熱可塑性樹脂成形原料體的熱可塑性樹脂發生解聚合或熱分解,可於熱可塑性樹脂成形原料體的內部的目標位置形成裂縫。 In order to form a crack only inside the surface of the thermoplastic resin-molded material body by 10 μm or more, it is preferable to use a pulse laser having a wavelength of a thermoplastic resin that transmits the thermoplastic resin-forming material body, and it is more preferable to use it. Multi-photon absorption pulse width laser pulse. By using a pulse laser having such a wavelength and a pulse width, the inside of the thermoplastic resin molded material body is irradiated in a state of being focused, and the irradiation energy can be concentrated at the target position. As a result, multiphoton absorption is generated, whereby the thermoplastic resin constituting the thermoplastic resin molding material body is depolymerized or thermally decomposed, and cracks can be formed at a target position inside the thermoplastic resin molding material body.

例如於使用丙烯酸系樹脂作為構成熱可塑性樹脂成形原料體的熱可塑性樹脂的情形時,脈波雷射可使用在350nm~1080nm的波長下具有20奈秒以下的脈寬者。例如於脈寬為20奈秒以下的脈波雷射的情況下,可列舉波長為355nm、525nm、780nm、790nm、808nm、830nm及1064nm的脈波雷射。另外,例如於脈寬為200飛秒以下的脈波雷射的情況下,可列舉波長為780nm、790nm、808nm及830nm的脈波雷射。 For example, when an acrylic resin is used as the thermoplastic resin constituting the thermoplastic resin molding material body, the pulse wave laser may have a pulse width of 20 nm or less at a wavelength of 350 nm to 1080 nm. For example, in the case of a pulse laser having a pulse width of 20 nm or less, pulse lasers having wavelengths of 355 nm, 525 nm, 780 nm, 790 nm, 808 nm, 830 nm, and 1064 nm can be cited. Further, for example, in the case of a pulse laser having a pulse width of 200 femtosecond or less, pulse lasers having wavelengths of 780 nm, 790 nm, 808 nm, and 830 nm are exemplified.

裂縫的大小有脈波雷射的輸出越高則越變大的傾向,且有照射脈波數越多則越變大的傾向。因此,藉由控制脈波雷射的輸出及照射脈波數,可調整裂縫的大小。 The size of the crack tends to increase as the output of the pulse laser increases, and the larger the number of the irradiation pulse, the larger the tendency. Therefore, the size of the crack can be adjusted by controlling the output of the pulse laser and the number of the pulse waves.

為了將熱可塑性樹脂成形原料體的分子鍵切斷,脈波雷射較佳為於1080nm以下的波長下具有200飛秒以下的脈寬,且 具有5μJ/脈波以上的能量。 In order to cut the molecular bond of the thermoplastic resin molded material body, the pulse wave laser preferably has a pulse width of 200 femtosecond or less at a wavelength of 1080 nm or less, and It has an energy of 5 μJ/pulse or more.

用以對熱可塑性樹脂成形原料體照射脈波雷射的裝置例如可列舉圖2所示的飛秒雷射加工裝置100。 The apparatus for irradiating the pulsed laser beam to the thermoplastic resin molded material body is, for example, a femtosecond laser processing apparatus 100 shown in Fig. 2 .

於圖2中,飛秒雷射加工裝置100是由飛秒雷射光源1、半波長板2、葛蘭雷射稜鏡(Glan Laser prism)3、光閘(shutter)4、鏡(mirror)5、鏡5'、鏡5"、物鏡(objective lens)6、z軸平台9及自動雙軸平台10所構成。於z軸平台9上載置作為被加工物的熱可塑性樹脂成形原料體8。 In FIG. 2, the femtosecond laser processing apparatus 100 is composed of a femtosecond laser light source 1, a half-wavelength plate 2, a Glan laser prism 3, a shutter 4, and a mirror. 5. A mirror 5', a mirror 5", an objective lens 6, a z-axis stage 9, and an automatic biaxial stage 10. The thermoplastic resin molding material body 8 as a workpiece is placed on the z-axis stage 9.

由飛秒雷射光源1發出的飛秒雷射光7經過半波長板2、葛蘭雷射稜鏡3、光閘4、鏡5、鏡5'、鏡5"及物鏡6,以聚焦的狀態而照射於z軸平台9上的熱可塑性樹脂成形原料體8的內部的既定部位。再者,飛秒雷射的照射脈波數可藉由利用光閘4變更雷射照射時間來設定。另外,焦點位置的調整是藉由z軸平台9及自動雙軸平台10而進行。 The femtosecond laser light 7 emitted by the femtosecond laser light source 1 passes through a half-wavelength plate 2, a Graham Ray 3, a shutter 4, a mirror 5, a mirror 5', a mirror 5", and an objective lens 6 in a focused state. Further, the thermoplastic resin is irradiated onto a predetermined portion of the inside of the thermoplastic resin molding material body 8. Further, the number of irradiation pulses of the femtosecond laser can be set by changing the laser irradiation time by the shutter 4. The adjustment of the focus position is performed by the z-axis platform 9 and the automatic biaxial platform 10.

(加熱處理步驟) (heating process step)

於加熱處理步驟中,於構成熱可塑性樹脂成形原料體的熱可塑性樹脂的玻璃轉移溫度以上的溫度下,對在內部形成有裂縫的熱可塑性樹脂成形原料體進行加熱處理。藉此,裂縫成長為空孔,可獲得僅於內部具有最小徑為30μm以上的大致球形的空孔的熱可塑性樹脂成形體。 In the heat treatment step, the thermoplastic resin molded material body having cracks formed therein is heat-treated at a temperature equal to or higher than the glass transition temperature of the thermoplastic resin constituting the thermoplastic resin molded material body. Thereby, the crack grows into a void, and a thermoplastic resin molded body having only a substantially spherical pore having a minimum diameter of 30 μm or more inside can be obtained.

空孔的大小可藉由控制裂縫的大小來調整。空孔有脈波雷射照射步驟中形成的裂縫越大則越變大的傾向。 The size of the holes can be adjusted by controlling the size of the cracks. The hole has a tendency to become larger as the crack formed in the pulse laser irradiation step is larger.

熱可塑性樹脂成形體中的空孔的位置與形成於熱可塑性樹脂成形原料體中的裂縫的位置基本相同,故形成空孔的位置可藉由形成裂縫的位置來調整。本發明的實施形態中,藉由脈波雷射的焦點位置來控制熱可塑性樹脂成形原料體內部的裂縫的形成位置,故可於熱可塑性樹脂成形體的內部的任意位置形成空孔。 The position of the pores in the thermoplastic resin molded body is substantially the same as the position of the crack formed in the thermoplastic resin molded material body, so that the position at which the pores are formed can be adjusted by the position at which the crack is formed. In the embodiment of the present invention, since the position at which the crack is formed in the thermoplastic resin molded material body is controlled by the focal position of the pulse laser, the pores can be formed at any position inside the thermoplastic resin molded body.

熱可塑性樹脂成形原料體的加熱處理的溫度較佳為構成熱可塑性樹脂成形原料體的熱可塑性樹脂的玻璃轉移溫度以上。藉由將熱可塑性樹脂成形原料體的加熱處理的溫度設定為熱可塑性樹脂的玻璃轉移溫度以上,熱可塑性樹脂軟化,故可於短時間內使空孔成長。熱可塑性樹脂成形原料體的加熱處理的溫度更佳為熱可塑性樹脂的玻璃轉移溫度+30℃以上,進而佳為熱可塑性樹脂的玻璃轉移溫度+50℃以上。 The temperature of the heat treatment of the thermoplastic resin molded material body is preferably equal to or higher than the glass transition temperature of the thermoplastic resin constituting the thermoplastic resin molded material body. By setting the temperature of the heat treatment of the thermoplastic resin molded material body to be equal to or higher than the glass transition temperature of the thermoplastic resin, the thermoplastic resin is softened, so that the pores can be grown in a short time. The temperature of the heat treatment of the thermoplastic resin molded material body is more preferably the glass transition temperature of the thermoplastic resin + 30 ° C or more, and further preferably the glass transition temperature of the thermoplastic resin + 50 ° C or more.

加熱處理的溫度越高,有空孔的成長速度越變快的傾向,但有所成長的空孔的大小的不均一變大的傾向。另一方面,加熱處理的溫度越低,有空孔的成長速度越變慢的傾向,但有所成長的空孔的大小的不均一變小的傾向。 The higher the temperature of the heat treatment, the higher the growth rate of the pores tends to be, but the unevenness of the size of the grown pores tends to be large. On the other hand, the lower the temperature of the heat treatment, the more the growth rate of the pores tends to be slower, but the unevenness of the size of the grown pores tends to be small.

另外,加熱處理的時間越長,有空孔越變大的傾向,且有接近空孔的縱橫比為1的球形的傾向。就減小空孔的大小的不均一的方面而言,加熱處理的時間較佳為3分鐘以上,就提高生產性的方面而言,加熱處理的時間較佳為30分鐘以下。 Further, the longer the heat treatment time, the more the pores tend to become larger, and the spherical shape having an aspect ratio of 1 close to the pores tends to be large. The heat treatment time is preferably 3 minutes or more in terms of reducing the unevenness of the pore size, and the heat treatment time is preferably 30 minutes or less in terms of improving productivity.

加熱處理的方法例如可列舉:利用熱風乾燥機等加熱爐進行加熱的方法、利用紅外線加熱器等的熱線進行加熱的方法及 與高溫的金屬板等熱介質接觸而進行加熱的方法。 Examples of the method of the heat treatment include a method of heating by a heating furnace such as a hot air dryer, a method of heating by a hot wire such as an infrared heater, and the like. A method of heating in contact with a heat medium such as a high-temperature metal plate.

實施加熱處理步驟的部位可為整個熱可塑性樹脂成形原料體,亦可僅為形成空孔的部位。 The portion where the heat treatment step is performed may be the entire thermoplastic resin molded material body or may be only a portion where voids are formed.

加熱處理步驟中,為了抑制熱可塑性樹脂成形原料體的變形,例如較佳為於懸吊熱可塑性樹脂成形原料體的狀態、或以夾持熱可塑性樹脂成形原料體的外周部的方式固定於固持器(holder)上的狀態下進行加熱處理。本發明的實施形態中,視需要亦可於加熱處理步驟之後,將所得的熱可塑性樹脂成形體的不需要的部分修剪(trimming)。 In the heat treatment step, in order to suppress deformation of the thermoplastic resin molded material body, for example, it is preferable to fix the resin material in a state in which the thermoplastic resin is molded, or to fix the outer peripheral portion of the raw material body by holding the thermoplastic resin. The heat treatment is performed in a state on the holder. In the embodiment of the present invention, an unnecessary portion of the obtained thermoplastic resin molded body may be trimmed after the heat treatment step as needed.

<熱可塑性樹脂導光體> <Thermoplastic resin light guide>

本發明的實施形態的熱可塑性樹脂導光體具有被導入至熱可塑性樹脂導光體的內部的光入射的光入射端面、及於熱可塑性樹脂導光體的內部經導光的光出射的光出射面,且霧值為5%以下,並且僅於距光出射面10μm以上的內部,具有最小徑為30μm以上且大致球形的空孔。再者,就透明性的方面而言,熱可塑性樹脂導光體的霧值較佳為5%以下。另外,熱可塑性樹脂導光體中,可使用熱可塑性樹脂成形體。 The thermoplastic resin light guide of the embodiment of the present invention has a light incident end surface into which light introduced into the thermoplastic resin light guide is incident, and light emitted from the light guided inside the thermoplastic resin light guide. The exit surface has a haze value of 5% or less, and has a pore having a minimum diameter of 30 μm or more and a substantially spherical shape only inside the light emission surface of 10 μm or more. Further, in terms of transparency, the haze value of the thermoplastic resin light guide is preferably 5% or less. Further, a thermoplastic resin molded body can be used for the thermoplastic resin light guide.

構成熱可塑性樹脂導光體的熱可塑性樹脂例如可列舉:丙烯酸系樹脂、聚碳酸酯樹脂、甲基丙烯酸酯-苯乙烯共聚物(MS樹脂)及環狀烯烴樹脂(COP)。該些樹脂中,較佳為於廣泛的波長範圍內具有高的光透射性的丙烯酸系樹脂。 Examples of the thermoplastic resin constituting the thermoplastic resin light guide include an acrylic resin, a polycarbonate resin, a methacrylate-styrene copolymer (MS resin), and a cyclic olefin resin (COP). Among these resins, an acrylic resin having high light transmittance in a wide wavelength range is preferable.

為了獲得熱可塑性樹脂導光體所使用的板狀的熱可塑 性樹脂原料體例如可列舉:將丙烯酸系樹脂顆粒作為原料,藉由射出成形法或擠出成形法等熱熔融製程所製造的成形體、或將丙烯酸系單體作為原料,利用澆鑄聚合法所製造的壓克力澆鑄片(acrylic cast sheet)。 Plate-shaped thermoplastic for use in obtaining thermoplastic resin light guides For example, a molded article produced by a hot-melt process such as an injection molding method or an extrusion molding method, or an acrylic monomer as a raw material, using a propylene resin particle as a raw material, by a casting polymerization method Manufactured acrylic cast sheet.

圖3為表示本發明的熱可塑性樹脂導光體的一實施形態的示意性剖面圖。 Fig. 3 is a schematic cross-sectional view showing an embodiment of a thermoplastic resin light guide of the present invention.

對於熱可塑性樹脂導光體24,將圖3中的上下方向設定為厚度方向,於與紙面垂直的方向上展寬,整體呈矩形板狀。熱可塑性樹脂導光體24具有光入射端面241。光入射端面241為鄰接配置有一次光源的面。熱可塑性樹脂導光體24的四個側端面中的至少一個面成為光入射端面241。熱可塑性樹脂導光體24具有作為一個主面的光出射面242、及作為其相反側的主面的背面243。再者,本實施形態中,僅將上表面設定為光出射面242,但亦可將兩面設定為光出射面242。另外,本實施形態中,例示了光出射面242為平滑面(鏡面)的熱可塑性樹脂導光體,但不限定於此,可於光出射面上形成稜鏡形狀、雙凸透鏡(lenticular lens)形狀、微透鏡形狀等各種賦予功能的形狀。 The thermoplastic resin light guide 24 is set to a thickness direction in the vertical direction in FIG. 3, and is widened in a direction perpendicular to the paper surface, and has a rectangular plate shape as a whole. The thermoplastic resin light guide 24 has a light incident end surface 241. The light incident end surface 241 is a surface adjacent to the primary light source. At least one of the four side end faces of the thermoplastic resin light guide body 24 serves as a light incident end face 241. The thermoplastic resin light guide 24 has a light exit surface 242 as one main surface and a back surface 243 as a main surface on the opposite side. Further, in the present embodiment, only the upper surface is set as the light exit surface 242, but both surfaces may be set as the light exit surface 242. In the present embodiment, the thermoplastic resin light guide body having the smooth surface (mirror surface) of the light exit surface 242 is exemplified. However, the present invention is not limited thereto, and a lenticular lens or a lenticular lens can be formed on the light exit surface. Various shapes that give functions such as shape and microlens shape.

熱可塑性樹脂導光體24於其內部具有空孔244。 The thermoplastic resin light guide body 24 has a void 244 therein.

於空孔244中例如內包有構成熱可塑性樹脂成形原料體的熱可塑性樹脂的分解生成氣體等氣體,該氣體的折射率與構成熱可塑性樹脂成形原料體的熱可塑性樹脂大不相同,因此空孔244作為對光的透射及反射的擴散部而發揮功能。藉此,於光入射端 面241入射、且於熱可塑性樹脂導光體24的內部經導光的光於空孔244中發生折射、反射或散射,一部分自光出射面242出射。因此,空孔244作為用以使於熱可塑性樹脂導光體24的內部經導光的光自光出射面出射的光出射機構而發揮功能。 For example, a gas such as a decomposition-generating gas of a thermoplastic resin constituting the thermoplastic resin molding material body is contained in the pores 244, and the refractive index of the gas is greatly different from that of the thermoplastic resin constituting the thermoplastic resin molding material body. The hole 244 functions as a diffusing portion that transmits and reflects light. Thereby, at the light incident end The light incident on the surface 241 and guided by the inside of the thermoplastic resin light guide 24 is refracted, reflected or scattered in the holes 244, and a part is emitted from the light exit surface 242. Therefore, the void 244 functions as a light emitting means for emitting light guided through the inside of the thermoplastic resin light guide 24 from the light exit surface.

空孔244可於熱可塑性樹脂導光體24的內部的任意位置設置多個,可適當調整空孔244的個數及排列圖案以獲得所需的光學性能。空孔244的排列圖案例如可列舉隨機狀、棋盤格狀及最密填充狀。 The plurality of holes 244 may be provided at any position inside the thermoplastic resin light guide body 24, and the number and arrangement pattern of the holes 244 may be appropriately adjusted to obtain desired optical performance. The arrangement pattern of the holes 244 is, for example, a random shape, a checkerboard pattern, and a most densely packed shape.

另外,空孔244可僅形成於熱可塑性樹脂導光體24的一部分區域中,亦可形成於所有區域中。 In addition, the voids 244 may be formed only in a partial region of the thermoplastic resin light guide 24, or may be formed in all regions.

熱可塑性樹脂導光體24中,視需要可於導光體24的光出射面242及背面243的至少一個面上形成追加的光出射機構。追加的光出射機構例如可列舉微小凹凸結構及印刷光散射性油墨所得的點(dot)。 In the thermoplastic resin light guide 24, an additional light emitting means can be formed on at least one of the light exit surface 242 and the back surface 243 of the light guide body 24 as needed. Examples of the additional light-emitting means include a micro uneven structure and a dot obtained by printing a light-scattering ink.

熱可塑性樹脂導光體24的厚度例如為0.1mm~10mm。 The thickness of the thermoplastic resin light guide 24 is, for example, 0.1 mm to 10 mm.

熱可塑性樹脂導光體24除了如圖3所示般的整體為均一厚度的板狀者以外,可使用厚度自光入射端面241朝相反端面逐漸變薄的楔狀者等各種剖面形狀者。熱可塑性樹脂導光體例如可使用藉由射出成形法所製造的熱可塑性樹脂成形原料體而獲得。 In addition to the plate shape of the uniform thickness as shown in FIG. 3, the thermoplastic resin light guide body 24 may have various cross-sectional shapes such as a wedge shape whose thickness is gradually reduced from the light incident end surface 241 toward the opposite end surface. The thermoplastic resin light guide can be obtained, for example, by using a thermoplastic resin molded material body produced by an injection molding method.

熱可塑性樹脂導光體24的顏色可根據目的而選擇。例如於使一次光源的顏色直接出射的情形時,就熱可塑性樹脂導光 體的光透射率的觀點而言,較佳為無色透明。另外,於使與一次光源的顏色不同的顏色出射的情形時,可使用經著色者。 The color of the thermoplastic resin light guide 24 can be selected according to the purpose. For example, when the color of the primary light source is directly emitted, the thermoplastic resin is guided. From the viewpoint of light transmittance of the body, colorless transparency is preferred. Further, in the case of emitting a color different from the color of the primary light source, a colored person can be used.

如圖13所示,熱可塑性樹脂成形體例如視需要可設定為多層化的板狀體。圖13的熱可塑性樹脂成形體20具有作為低折射率樹脂層的包覆層1302、作為高折射率樹脂層的芯層1301及作為低折射率樹脂層的包覆層1302的三層結構的芯層-包覆層結構。藉由設定為該結構,可賦予以下特征:即便熱可塑性樹脂成形體20的表面因灰塵或指紋而被污染,該污染亦不易引人注目。關於芯層與包覆層的材料,只要為將芯層設定為丙烯酸系樹脂且將包覆層設定為聚偏二氟乙烯的組合、或將芯層設定為聚碳酸酯樹脂且將包覆層設定為丙烯酸系樹脂的組合等包覆層的材料的折射率低於芯層的材料的折射率的組合,則可選擇任意的組合。 As shown in FIG. 13, the thermoplastic resin molded body can be set as a multilayered plate-shaped body, if necessary. The thermoplastic resin molded body 20 of Fig. 13 has a cladding layer 1302 as a low refractive index resin layer, a core layer 1301 as a high refractive index resin layer, and a core of a three-layer structure as a cladding layer 1302 of a low refractive index resin layer. Layer-cladding structure. By setting this structure, it is possible to impart a characteristic that even if the surface of the thermoplastic resin molded body 20 is contaminated by dust or fingerprints, the contamination is not noticeable. The material of the core layer and the cladding layer is a combination of setting the core layer to an acrylic resin and setting the coating layer to polyvinylidene fluoride, or setting the core layer to a polycarbonate resin and coating the coating layer. Any combination of a refractive index of a material of a coating layer such as a combination of acrylic resins and a refractive index of a material of the core layer may be selected.

熱可塑性樹脂導光體可使用熱可塑性樹脂成形原料體藉由與熱可塑性樹脂成形體的製造方法相同的方法來製造。 The thermoplastic resin light guide can be produced by the same method as the method of producing a thermoplastic resin molded body using a thermoplastic resin molded material.

<一次光源> <primary light source>

本發明的實施形態中使用的一次光源例如可列舉白色光及著色光。白色光例如可列舉白色LED。著色光例如可列舉著色LED。白色LED的具體例可列舉NSSW020BT(日亞化學工業(股)製造,商品名)。著色LED的具體例可列舉NESB064(日亞化學工業(股)製造,商品名)。 Examples of the primary light source used in the embodiment of the present invention include white light and colored light. The white light is exemplified by a white LED. The colored light is exemplified by a colored LED. Specific examples of the white LED include NSSW020BT (manufactured by Nichia Chemical Industry Co., Ltd., trade name). Specific examples of the colored LED include NESB064 (manufactured by Nichia Chemical Industry Co., Ltd., trade name).

<光源裝置> <Light source device>

本發明的實施形態的光源裝置為於熱可塑性樹脂導光體上具 備一次光源的光源裝置,與熱可塑性樹脂導光體的光入射端面鄰接而配置有一次光源。 The light source device of the embodiment of the present invention is provided on the thermoplastic resin light guide body. A light source device for the primary light source is disposed adjacent to the light incident end surface of the thermoplastic resin light guide, and a primary light source is disposed.

將本發明的光源裝置的一實施形態的示意性剖面圖示於圖4中。 A schematic cross-sectional view of an embodiment of a light source device of the present invention is shown in Fig. 4 .

圖4中具備LED 22作為一次光源,亦可設置多個LED 22。於設置多個LED 22的情形時,LED 22可於與圖4的紙面垂直的方向上以所需的間隔配置。再者,於設置多個LED 22的情形時,較佳為以由各LED 22所發出的光的最大強度的方向平行的方式配置。 In FIG. 4, the LED 22 is provided as a primary light source, and a plurality of LEDs 22 may be provided. In the case where a plurality of LEDs 22 are provided, the LEDs 22 may be arranged at a desired interval in a direction perpendicular to the plane of the paper of FIG. Further, in the case where a plurality of LEDs 22 are provided, it is preferable to arrange them in such a manner that the direction of the maximum intensity of the light emitted from each of the LEDs 22 is parallel.

將光擴散元件26配置於熱可塑性樹脂導光體24的光出射面242上。於自光出射面242出射的光的指向性具有所需的出射角度及視角的情形時,亦可省略光擴散元件26。光擴散元件26例如可列舉光擴散膜。 The light diffusing element 26 is disposed on the light emitting surface 242 of the thermoplastic resin light guide 24. When the directivity of the light emitted from the light exit surface 242 has a desired exit angle and viewing angle, the light diffusing element 26 may be omitted. The light diffusing element 26 is exemplified by a light diffusing film.

將第1光偏向元件28配置於光擴散元件26上,將第2光偏向元件30配置於第1光偏向元件28上。第1光偏向元件28或第2光偏向元件30例如可列舉朝上的稜鏡片。第1光偏向元件28及第2光偏向元件30可為相同類型亦可為不同類型。 The first optical deflecting element 28 is disposed on the light diffusing element 26, and the second optical deflecting element 30 is disposed on the first optical deflecting element 28. The first optical deflecting element 28 or the second optical deflecting element 30 may, for example, be a cymbal facing upward. The first optical deflecting element 28 and the second optical deflecting element 30 may be of the same type or of different types.

第1光偏向元件28與第2光偏向元件30的出光面的多條稜鏡列的稜線彼此正交。第1光偏向元件28的出光面的多條稜鏡列的稜線與光入射端面241平行,第2光偏向元件30的出光面的多條稜鏡列的稜線與光入射端面241垂直。另外,亦可使第1光偏向元件28的出光面的多條稜鏡列的稜線及第2光偏向元件30 的出光面的多條稜鏡列的稜線兩者相對於光入射端面241傾斜且彼此正交。 The ridgelines of the plurality of rows of the first light deflecting element 28 and the light exiting surface of the second light deflecting element 30 are orthogonal to each other. The ridge lines of the plurality of lines of the light-emitting surface of the first light deflecting element 28 are parallel to the light incident end surface 241, and the ridge lines of the plurality of lines of the light-emitting surface of the second light deflecting element 30 are perpendicular to the light incident end surface 241. Further, a plurality of ridge lines and a second light deflecting element 30 of the light-emitting surface of the first light deflecting element 28 may be provided. Both of the ridgelines of the plurality of columns of the light-emitting surface are inclined with respect to the light incident end surface 241 and are orthogonal to each other.

第1光偏向元件28及第2光偏向元件30的厚度例如為30μm~350μm。 The thickness of the first optical deflecting element 28 and the second optical deflecting element 30 is, for example, 30 μm to 350 μm.

於自光出射面242出射的光的指向性具有所需的出射角度及視角的情形時,亦可省略第1光偏向元件28及第2光偏向元件30的至少一個。 When the directivity of the light emitted from the light exit surface 242 has a desired exit angle and viewing angle, at least one of the first light deflecting element 28 and the second light deflecting element 30 may be omitted.

將光反射元件32配置於背面243的下方。光反射元件32例如可列舉:於表面具有金屬蒸鍍反射層的塑膠片、含有顏料的白色的片及氣泡片等光反射片。上述顏料例如可列舉氧化鈦、硫酸鋇、碳酸鈣及碳酸鎂。再者,於自背面243出射的光量少至可忽視的程度的情形時,亦可省略光反射元件32。 The light reflecting element 32 is disposed below the back surface 243. Examples of the light reflecting element 32 include a plastic sheet having a metal vapor deposition reflective layer on its surface, a white sheet containing a pigment, and a light reflection sheet such as a bubble sheet. Examples of the pigment include titanium oxide, barium sulfate, calcium carbonate, and magnesium carbonate. Further, when the amount of light emitted from the back surface 243 is as small as negligible, the light reflecting element 32 may be omitted.

於本發明的實施形態的光源裝置中,視需要亦可於熱可塑性樹脂導光體24的光入射端面241以外的側端面配置與光反射元件32相同的光反射元件。 In the light source device according to the embodiment of the present invention, the light reflection element similar to the light reflection element 32 may be disposed on the side end surface other than the light incident end surface 241 of the thermoplastic resin light guide 24 as needed.

<液晶顯示裝置> <Liquid crystal display device>

本發明的實施形態的液晶顯示裝置具備本發明的實施形態的光源裝置,例如可列舉於圖4的光源裝置上配置液晶顯示元件而成者。 A liquid crystal display device according to an embodiment of the present invention includes a light source device according to an embodiment of the present invention, and for example, a liquid crystal display device is disposed on the light source device of FIG.

[實施例] [Examples]

以下使用實施例對本發明加以說明。 The invention will now be described using the examples.

<空孔及裂縫的評價> <Evaluation of voids and cracks>

使用光學顯微鏡(尼康(Nikon)(股)製造,商品名:積體電路(Integrated Circuit,IC)檢查顯微鏡ECLIPSE L200N),對與圖1所示的空孔的情形同樣地形成於熱可塑性樹脂成形體或熱可塑性樹脂導光體的內部的空孔自z軸方向及y軸方向進行觀察。將自z軸方向及y軸方向觀察時的空孔的最小寬度設定為最小徑、最大寬度設定為最大徑。另外,將最大徑除以最小徑所得的值作為縱橫比。再者,最小徑及縱橫比是指自16個裂縫中任意選擇的3個裂縫的最小徑及縱橫比各自的平均值。 An optical microscope (manufactured by Nikon Co., Ltd., trade name: Integrated Circuit (IC) inspection microscope ECLIPSE L200N) was formed in the same manner as in the case of the void shown in Fig. 1 in the formation of thermoplastic resin. The pores inside the body or thermoplastic resin light guide are observed from the z-axis direction and the y-axis direction. The minimum width of the hole when viewed from the z-axis direction and the y-axis direction is set to the minimum diameter, and the maximum width is set to the maximum diameter. Further, the value obtained by dividing the maximum diameter by the minimum diameter is taken as the aspect ratio. In addition, the minimum diameter and the aspect ratio mean the average value of the minimum diameter and the aspect ratio of the three cracks arbitrarily selected from the 16 cracks.

另外,關於裂縫,亦利用與空孔的情形相同的方法進行評價。 Further, the crack was also evaluated by the same method as in the case of the void.

<法線亮度的測定> <Measurement of normal brightness>

使用光源裝置,藉由以下所示的法線亮度的測定來評價空孔的光出射效率。 Using the light source device, the light emission efficiency of the holes was evaluated by the measurement of the normal brightness shown below.

利用黑色的遮罩將具有圖5(a)~圖5(b)所示的結構的光源裝置的光出射面的亮度測定區域以外的區域覆蓋後,使作為一次光源的LED 340以20mA發光,使用亮度計360(拓普康(Topcon Technohouse)(股)製造,商品名:色彩亮度計BM-7),測定自亮度測定區域300的出射光的法線亮度。再者,法線亮度為將使用獲得熱可塑性樹脂導光體前的形成有裂縫的片來代替熱可塑性樹脂導光體的情形時的法線亮度設定為1.0時的相對值。 By covering a region other than the luminance measurement region of the light exit surface of the light source device having the configuration shown in FIGS. 5( a ) to 5 ( b ) with a black mask, the LED 340 serving as the primary light source emits light at 20 mA. The normal brightness of the light emitted from the luminance measurement region 300 was measured using a luminance meter 360 (manufactured by Topcon Technohouse Co., Ltd., trade name: color luminance meter BM-7). In addition, the normal brightness is a relative value when the normal brightness in the case where the crack-formed sheet before the thermoplastic resin light guide is obtained is used instead of the thermoplastic resin light guide is set to 1.0.

(製作例1)飛秒雷射加工裝置的製作 (Production Example 1) Production of a femtosecond laser processing apparatus

使用光創(QUANTRONIX)公司製造的Integra-C(商品名,波長:790nm,脈寬:120飛秒,脈波頻率:1kHz)作為雷射光 源1,製作圖2所示的飛秒雷射加工裝置100。 Integra-C (trade name, wavelength: 790 nm, pulse width: 120 femtoseconds, pulse wave frequency: 1 kHz) manufactured by QUANTRONIX Co., Ltd. was used as the laser light. Source 1, a femtosecond laser processing apparatus 100 shown in Fig. 2 is produced.

(實施例1) (Example 1)

將丙烯酸系樹脂顆粒(三菱麗陽(股)製造,商品名:壓克力派特(Acrypet)VH6#001,質量平均分子量為8.6萬,玻璃轉移溫度為110℃)作為原料來製造厚度為3mm的壓克力擠出片。繼而,自所得的壓克力擠出片中以160mm×100mm的長方形切出,獲得熱可塑性樹脂成形原料體。 The acrylic resin pellet (manufactured by Mitsubishi Rayon Co., Ltd., trade name: Acrypet VH6 #001, mass average molecular weight: 86,000, glass transition temperature: 110 ° C) was used as a raw material to produce a thickness of 3 mm. Acrylic extruded tablets. Then, it was cut out from the obtained acrylic extruded sheet in a rectangular shape of 160 mm × 100 mm to obtain a thermoplastic resin molded material body.

使用飛秒雷射加工裝置100,使脈波雷射的焦點對準距熱可塑性樹脂成形原料體的表面1.5mm深度的位置,於雷射輸出為30mW及照射脈波數為2脈波的條件下照射脈波雷射,僅於熱可塑性樹脂成形原料體的內部形成裂縫。一面使自動雙軸平台10移動一面將上述脈波雷射的照射操作進一步重複15次,於熱可塑性樹脂成形原料體的主表面中央的6mm×6mm的區域(圖7的脈波雷射照射區域101)中形成具有如圖6所示般的排列圖案的裂縫,獲得圖7所示的形成有裂縫的片700。 Using the femtosecond laser processing apparatus 100, the focus of the pulse laser is aligned to a depth of 1.5 mm from the surface of the thermoplastic resin molded material body, and the laser output is 30 mW and the number of irradiation pulses is 2 pulses. The laser beam is irradiated downward to form a crack only inside the thermoplastic resin-forming material body. The irradiation operation of the pulse laser is further repeated 15 times while moving the automatic biaxial stage 10, and is in a region of 6 mm × 6 mm in the center of the main surface of the thermoplastic resin molded material body (the pulse laser irradiation region of Fig. 7). A crack having an arrangement pattern as shown in Fig. 6 is formed in 101), and the crack-formed sheet 700 shown in Fig. 7 is obtained.

所得的形成有裂縫的片700於距主表面1.5mm的深度的位置具有裂縫的中心,裂縫的最小徑為17μm,且裂縫的縱橫比為10.7。 The resulting crack-forming sheet 700 had the center of the crack at a depth of 1.5 mm from the main surface, the minimum diameter of the crack was 17 μm, and the aspect ratio of the crack was 10.7.

繼而,以鋁製固持器來夾持形成有裂縫的片700的外周,使用熱風乾燥機(佐竹化學機械工業(股)製造,產品名:熱風循環高溫乾燥器41-S5),於180℃下進行6.5分鐘加熱處理而使裂縫成長為空孔,獲得具有空孔的熱可塑性樹脂成形體。 Then, the outer periphery of the sheet 700 on which the crack was formed was held by an aluminum holder, and a hot air dryer (manufactured by Satake Chemical Industry Co., Ltd., product name: hot air circulation high temperature dryer 41-S5) was used at 180 ° C. Heat treatment was performed for 6.5 minutes to grow cracks into voids, and a thermoplastic resin molded body having pores was obtained.

自具有空孔的熱可塑性樹脂成形體中切出於主表面的中央具有脈波雷射照射區域101的熱可塑性樹脂導光體用試片後,藉由金剛石鑽頭(diamond bit)將該試片的所有側端面切削為鏡面,製作圖8(a)~圖8(b)所示的30mm×100mm的大小的熱可塑性樹脂導光體600。 After the test piece for the thermoplastic resin light guide having the pulsed laser irradiation region 101 in the center of the main surface is cut out from the thermoplastic resin molded body having the void, the test piece is punched by a diamond bit. All of the side end faces were cut into a mirror surface, and a thermoplastic resin light guide 600 having a size of 30 mm × 100 mm as shown in Figs. 8(a) to 8(b) was produced.

所得的熱可塑性樹脂成形體及熱可塑性樹脂導光體於距主表面1.5mm的深度的位置具有空孔的中心,空孔的最小徑為85μm,且空孔的縱橫比為2.4。 The obtained thermoplastic resin molded body and the thermoplastic resin light guide had a center of a hole at a depth of 1.5 mm from the main surface, the smallest diameter of the hole was 85 μm, and the aspect ratio of the hole was 2.4.

如圖5(a)~圖5(b)所示,以與熱可塑性樹脂導光體600的光入射端面302相對向的方式配置一個LED 340(日亞化學工業(股)製造,商品名:白色LED NSSW020BT)。於與光出射面304為相反側的背面303,以與背面303相對向的方式配置反射片310(帝人杜邦膜(Teijin-Dupont Film)(股)製造,商品名:蒂托輪膜(Tetoron Film)UX,厚度為225μm),獲得光源裝置。對所得的光源裝置的法線亮度進行測定。法線亮度為6.3。 As shown in Fig. 5 (a) to Fig. 5 (b), one LED 340 is disposed so as to face the light incident end surface 302 of the thermoplastic resin light guide 600 (Manufactured by Nichia Chemical Industry Co., Ltd., trade name: White LED NSSW020BT). The reflection sheet 310 is disposed on the back surface 303 opposite to the light exit surface 304 so as to face the back surface 303 (made by Teijin-Dupont Film Co., Ltd., trade name: Tetoron Film) UX, thickness 225 μm), to obtain a light source device. The normal brightness of the obtained light source device was measured. The normal brightness is 6.3.

再者,法線亮度為將後述比較例1中所得的形成有裂縫的片的法線亮度設定為1.0時的相對值。 In addition, the normal brightness is a relative value when the normal brightness of the crack-formed sheet obtained in Comparative Example 1 described later is set to 1.0.

將脈波雷射照射及加熱處理的加工條件以及所得的熱可塑性樹脂導光體的評價結果示於表1中。 The processing conditions of the pulse laser irradiation and heat treatment and the evaluation results of the obtained thermoplastic resin light guide are shown in Table 1.

(實施例2~實施例4) (Example 2 to Example 4)

除了將加熱處理的加工條件設定為表1所示的條件以外,與實施例1同樣地獲得熱可塑性樹脂導光體。將熱可塑性樹脂導光 體的評價結果示於表1中。 A thermoplastic resin light guide was obtained in the same manner as in Example 1 except that the processing conditions of the heat treatment were set to the conditions shown in Table 1. Directing thermoplastic resin The evaluation results of the bodies are shown in Table 1.

(比較例1) (Comparative Example 1)

除了不實施加熱處理以外,與實施例1同樣地獲得形成有裂縫的片。將形成有裂縫的片的評價結果示於表1中。 A sheet in which cracks were formed was obtained in the same manner as in Example 1 except that the heat treatment was not performed. The evaluation results of the sheet in which the crack was formed are shown in Table 1.

(實施例5~實施例7) (Examples 5 to 7)

除了將脈波雷射照射及加熱處理的加工條件設定為表2所記載的條件以外,與實施例1同樣地獲得熱可塑性樹脂導光體。將熱可塑性樹脂導光體的評價結果示於表2中。 A thermoplastic resin light guide was obtained in the same manner as in Example 1 except that the processing conditions of the pulse laser irradiation and the heat treatment were set to the conditions described in Table 2. The evaluation results of the thermoplastic resin light guide are shown in Table 2.

再者,法線亮度為將後述比較例2中所得的形成有裂縫的片的法線亮度設定為1.0時的相對值。 In addition, the normal brightness is a relative value when the normal brightness of the crack-formed sheet obtained in Comparative Example 2 described later is set to 1.0.

(比較例2) (Comparative Example 2)

除了不實施加熱處理以外,與實施例5同樣地獲得形成有裂縫的片。將形成有裂縫的片的評價結果示於表2中。 A sheet in which cracks were formed was obtained in the same manner as in Example 5 except that the heat treatment was not performed. The evaluation results of the sheet in which the crack was formed are shown in Table 2.

(參考例1) (Reference example 1)

將丙烯酸系樹脂顆粒(三菱麗陽(股)製造,商品名:壓克力派特(Acrypet)VH6#001,質量平均分子量為8.6萬,玻璃轉移溫度為110℃)作為原料,製造厚度為3mm的壓克力擠出片。繼而,自所得的壓克力擠出片中以160mm×100mm的長方形切出,獲得熱可塑性樹脂成形原料體。 Acrylic resin particles (manufactured by Mitsubishi Rayon Co., Ltd., trade name: Acrypet VH6 #001, mass average molecular weight: 86,000, glass transition temperature: 110 ° C) were used as raw materials to produce a thickness of 3 mm. Acrylic extruded tablets. Then, it was cut out from the obtained acrylic extruded sheet in a rectangular shape of 160 mm × 100 mm to obtain a thermoplastic resin molded material body.

使用飛秒雷射加工裝置100,使脈波雷射的焦點對準距熱可塑性樹脂成形原料體的表面1.5mm深度的位置,於雷射輸出為30mW及照射脈波數為2脈波的條件下,照射脈波雷射,僅於熱可塑性樹脂成形原料體的內部形成裂縫。一面使自動雙軸平台10移動一面將上述脈波雷射的照射操作進一步重複3次,形成具有如圖9(a)~圖9(b)所示般的排列圖案的裂縫501,獲得形成有裂縫的片900。 Using the femtosecond laser processing apparatus 100, the focus of the pulse laser is aligned to a depth of 1.5 mm from the surface of the thermoplastic resin molded material body, and the laser output is 30 mW and the number of irradiation pulses is 2 pulses. Next, the pulse laser is irradiated to form a crack only inside the thermoplastic resin molded material body. The irradiation operation of the pulse laser is further repeated three times while moving the automatic biaxial stage 10 to form a crack 501 having an arrangement pattern as shown in FIGS. 9(a) to 9(b), and is formed with A piece of crack 900.

繼而,以鋁製固持器來夾持形成有裂縫的片900的外周,使用熱風乾燥機(佐竹化學機械工業(股)製造,商品名: 熱風循環高溫乾燥器41-S5),以表3所示的溫度及時間進行加熱處理,獲得熱可塑性樹脂成形體。將加工條件及所得的熱可塑性樹脂成形體的評價結果示於表3中。 Then, the outer periphery of the sheet 900 on which the crack was formed was sandwiched by an aluminum holder, and a hot air dryer (manufactured by Satake Chemical Industry Co., Ltd.) was used. The hot air circulation high-temperature dryer 41-S5) was heat-treated at the temperature and time shown in Table 3 to obtain a thermoplastic resin molded body. The processing conditions and the evaluation results of the obtained thermoplastic resin molded body are shown in Table 3.

再者,參考例的最小徑及縱橫比為形成於熱可塑性樹脂成形體的內部的4個空孔的最小徑及縱橫比各自的平均值。 In addition, the minimum diameter and the aspect ratio of the reference example are the average values of the minimum diameter and the aspect ratio of the four pores formed in the inside of the thermoplastic resin molded body.

將各加熱處理的溫度下的加熱處理的時間與空孔的最小徑之關係示於圖10中。再者,圖10中的誤差線(error bar)表示4個空孔的最小徑的不均一的範圍。 The relationship between the time of the heat treatment at the temperature of each heat treatment and the minimum diameter of the pores is shown in Fig. 10 . Furthermore, the error bar in FIG. 10 indicates a non-uniform range of the minimum diameters of the four holes.

(參考例2) (Reference example 2)

除了將脈波雷射照射及加熱處理的加工條件設定為表4中記載的條件以外,與參考例1同樣地獲得熱可塑性樹脂成形體。將評價結果示於表4中。 A thermoplastic resin molded body was obtained in the same manner as in Reference Example 1 except that the processing conditions of the pulse laser irradiation and the heat treatment were set to the conditions described in Table 4. The evaluation results are shown in Table 4.

將各加熱處理的溫度下的加熱處理的時間與空孔的最小徑之關係示於圖11中。再者,圖11中的誤差線表示4個空孔的最小徑的不均一的範圍。 The relationship between the time of the heat treatment at the temperature of each heat treatment and the minimum diameter of the pores is shown in Fig. 11 . Furthermore, the error bars in Fig. 11 indicate the non-uniform range of the minimum diameters of the four holes.

作為空孔的一例,將自z軸方向及y軸方向觀察於條件27下所得的空孔時的光學顯微鏡照片示於圖12中。 As an example of the pores, an optical micrograph at the time of observing the pores obtained under the condition 27 from the z-axis direction and the y-axis direction is shown in FIG.

由表3、表4及圖10、圖11明確得知,根據本發明的實施例的製造方法,可於不使用添加劑的情況下,於熱可塑性樹脂成形體的內部形成空孔。另外得知,藉由控制脈波雷射照射及加熱處理的加工條件,可形成具有任意的最小徑及縱橫比的空孔。 As is apparent from Tables 3 and 4, and Figs. 10 and 11, the manufacturing method according to the embodiment of the present invention can form voids in the inside of the thermoplastic resin molded body without using an additive. Further, it has been found that by controlling the processing conditions of the pulse laser irradiation and the heat treatment, voids having an arbitrary minimum diameter and an aspect ratio can be formed.

另外,由圖10及圖11表明存在以下傾向:加熱處理溫度越高,形成空孔所需要的時間越變短,但空孔尺寸的不均一越變大。另一方面,有以下傾向:加熱處理溫度越低,則形成空孔所需要的時間越變長,但空孔尺寸的不均一越變小(即,容易形成大小一致的空孔)。 Further, as shown in Fig. 10 and Fig. 11, there is a tendency that the higher the heat treatment temperature, the shorter the time required to form the pores, but the larger the unevenness of the pore size. On the other hand, there is a tendency that the lower the heat treatment temperature, the longer the time required to form the pores, but the smaller the pore size is (i.e., the pores having the same size are easily formed).

(參考例3) (Reference Example 3)

除了將脈波雷射照射及加熱處理的加工條件設定為表5中記載的條件以外,與參考例1同樣地求出空孔的最小徑及縱橫比。其中,加熱處理中使用馬弗爐(muffle furnace)(五十鈴製作所(Isuzu Seisakusho)(股)製造,商品名:EPTS-11K)。將評價結果示於表5中。 The minimum diameter and the aspect ratio of the voids were determined in the same manner as in Reference Example 1 except that the processing conditions of the pulse laser irradiation and the heat treatment were set to the conditions described in Table 5. Among them, a muffle furnace (manufactured by Isuzu Seisakusho Co., Ltd., trade name: EPTS-11K) was used for the heat treatment. The evaluation results are shown in Table 5.

由表5明確得知,於在構成熱可塑性樹脂成形體的熱可塑性樹脂的玻璃轉移溫度以下的加熱溫度下實施加熱處理的情形時,可形成縱橫比為3以下的空孔。 As is clear from Table 5, when heat treatment is performed at a heating temperature equal to or lower than the glass transition temperature of the thermoplastic resin constituting the thermoplastic resin molded body, voids having an aspect ratio of 3 or less can be formed.

Claims (14)

一種熱可塑性樹脂成形體,其僅於距成為光出射面的表面10μm以上的內部具有最小徑為30μm的大致球形的空孔,且於上述空孔內具有構成熱可塑性樹脂成形原料體的熱可塑性樹脂的分解生成氣體。 A thermoplastic resin molded body having a substantially spherical pore having a minimum diameter of 30 μm only inside a surface of 10 μm or more from a surface to be a light-emitting surface, and having thermoplasticity constituting a thermoplastic resin-forming raw material body in the above-mentioned pores The decomposition of the resin generates a gas. 如申請專利範圍第1項所述的熱可塑性樹脂成形體,其具有霧值為5%以下的透明性。 The thermoplastic resin molded article according to claim 1, which has a transparency of a haze value of 5% or less. 一種熱可塑性樹脂成形體,其為於以下所示的脈波雷射照射步驟之後經過以下所示的加熱處理步驟而獲得的熱可塑性樹脂成形體,並且僅於距上述熱可塑性樹脂成形體的成為光出射面的表面10μm以上的內部具有最小徑為30μm的大致球形的空孔,且於上述空孔內具有構成熱可塑性樹脂成形原料體的熱可塑性樹脂的分解生成氣體;(脈波雷射照射步驟)對距熱可塑性樹脂成形原料體的成為光出射面的表面10μm以上的內部,於使脈波雷射的焦點對準的狀態下照射脈波雷射,僅於上述熱可塑性樹脂成形原料體的內部形成裂縫的步驟;(加熱處理步驟)於構成上述熱可塑性樹脂成形原料體的熱可塑性樹脂的玻璃轉移溫度以上的溫度下,對形成有裂縫的上述熱可塑性樹脂成形原料體進行加熱處理,僅於距上述熱可塑性樹脂成形原料體的成為光出射面的表面10μm以上的內部形成最小徑為30μm的大致 球形的空孔的步驟。 A thermoplastic resin molded body obtained by the following heat treatment step after the pulse wave laser irradiation step shown below, and which is formed only from the thermoplastic resin molded body The surface of the light-emitting surface having a surface of 10 μm or more has a substantially spherical pore having a minimum diameter of 30 μm, and has a decomposition-forming gas of a thermoplastic resin constituting the thermoplastic resin-forming material body in the pore; (Pulse laser irradiation) Step) Irradiating the pulse laser in a state where the surface of the thermoplastic resin molded material body which is the light-emitting surface is 10 μm or more, in a state in which the pulse laser is in focus, and the thermoplastic resin-forming material body is formed only a step of forming a crack in the inside; (heating step) heat-treating the thermoplastic resin molding material body in which the crack is formed at a temperature equal to or higher than a glass transition temperature of the thermoplastic resin constituting the thermoplastic resin molding material body. Only within 10 μm or more of the surface of the thermoplastic resin molded material body to be the light-emitting surface Minimum diameter of 30μm is formed approximately The step of a spherical void. 一種熱可塑性樹脂成形體的製造方法,其為於以下所示的脈波雷射照射步驟之後經過以下所示的加熱處理步驟而獲得的熱可塑性樹脂成形體的製造方法,並且上述熱可塑性樹脂成形體僅於距上述熱可塑性樹脂成形體的成為光出射面的表面10μm以上的內部具有最小徑為30μm的大致球形的空孔,且於上述空孔內具有構成熱可塑性樹脂成形原料體的熱可塑性樹脂的分解生成氣體;(脈波雷射照射步驟)對距熱可塑性樹脂成形原料體的成為光出射面的表面10μm以上的內部,於使脈波雷射的焦點對準的狀態下照射脈波雷射,僅於上述熱可塑性樹脂成形原料體的內部形成裂縫的步驟;(加熱處理步驟)於構成上述熱可塑性樹脂成形原料體的熱可塑性樹脂的玻璃轉移溫度以上的溫度下,對形成有裂縫的上述熱可塑性樹脂成形原料體進行加熱處理,僅於距上述熱可塑性樹脂成形原料體的成為光出射面的表面10μm以上的內部形成最小徑為30μm的大致球形的空孔的步驟。 A method for producing a thermoplastic resin molded body, which is a method for producing a thermoplastic resin molded body obtained by a heat treatment step described below after a pulse wave laser irradiation step shown below, and wherein the thermoplastic resin is formed The body has a substantially spherical pore having a minimum diameter of 30 μm inside the surface of the thermoplastic resin molded body which is 10 μm or more from the surface on which the light-emitting surface is formed, and has thermoplasticity constituting the thermoplastic resin-forming raw material body in the pore. (Decomposition of the resin to generate a gas; (pulse-wave laser irradiation step) irradiates the pulse wave in a state where the surface of the thermoplastic resin molded material body is 10 μm or more which is the surface of the light-emitting surface, and the focus of the pulse laser is aligned. The step of forming a crack only in the inside of the thermoplastic resin molded material body; (heating step) forming a crack at a temperature higher than a glass transition temperature of the thermoplastic resin constituting the thermoplastic resin molded material body The above thermoplastic resin molding material body is subjected to heat treatment only from the above thermoplastic resin A step of forming a substantially spherical pore having a minimum diameter of 30 μm in the inside of the surface of the molded material body which is a surface of the light-emitting surface of 10 μm or more. 如申請專利範圍第4項所述的熱可塑性樹脂成形體的製造方法,其中上述脈波雷射具有1080nm以下的波長、200飛秒以下的脈寬及5μJ/pulse以上的能量。 The method for producing a thermoplastic resin molded article according to claim 4, wherein the pulse wave laser has a wavelength of 1080 nm or less, a pulse width of 200 femtosecond or less, and an energy of 5 μJ/pulse or more. 如申請專利範圍第4項或第5項所述的熱可塑性樹脂成形 體的製造方法,其中上述加熱處理的時間為3分鐘以上、30分鐘以下。 Forming thermoplastic resin as described in claim 4 or 5 In the method for producing a body, the heat treatment time is 3 minutes or longer and 30 minutes or shorter. 如申請專利範圍第4項所述的熱可塑性樹脂成形體的製造方法,其中上述加熱處理的溫度為構成上述熱可塑性樹脂成形原料體的上述熱可塑性樹脂的玻璃轉移溫度+30℃以上。 The method for producing a thermoplastic resin molded article according to the fourth aspect of the invention, wherein the temperature of the heat treatment is a glass transition temperature of the thermoplastic resin constituting the thermoplastic resin molding material body + 30 ° C or higher. 一種熱可塑性樹脂導光體,其使用如申請專利範圍第1項所述的熱可塑性樹脂成形體,具有被導入至內部的光所入射的光入射端面、及於內部經導光的光所出射的光出射面,且霧值為5%以下。 A thermoplastic resin molded body using the thermoplastic resin molded body according to the first aspect of the invention, which has an incident end surface of light incident on the inside and a light guided inside. The light exit surface has a haze value of 5% or less. 一種熱可塑性樹脂導光體,其具有被導入至內部的光所入射的光入射端面、及於內部經導光的光所出射的光出射面,且霧值為5%以下,並且上述熱可塑性樹脂導光體僅於距上述成為光出射面的表面10μm以上的內部具有最小徑為30μm的大致球形的空孔,且於上述空孔內具有構成熱可塑性樹脂成形原料體的熱可塑性樹脂的分解生成氣體。 A thermoplastic resin light guide having a light incident end surface on which light introduced into the inside and a light exit surface emitted from light guided inside, and having a haze value of 5% or less, and the above thermoplasticity The resin light guide body has a substantially spherical pore having a minimum diameter of 30 μm in a distance of 10 μm or more from the surface on which the light exit surface is formed, and has a decomposition of the thermoplastic resin constituting the thermoplastic resin molded material body in the pore. Generate gas. 如申請專利範圍第8項或第9項所述的熱可塑性樹脂導光體,其具有芯層-包覆層結構。 The thermoplastic resin light guide body according to claim 8 or 9, which has a core layer-clad layer structure. 一種光源裝置,其為於如申請專利範圍第8項或第9項所述的熱可塑性樹脂導光體上具備一次光源的光源裝置,且上述一次光源是鄰接於上述熱可塑性樹脂導光體的上述光入射端面而配置。 A light source device comprising a primary light source on a thermoplastic resin light guide according to claim 8 or 9, wherein the primary light source is adjacent to the thermoplastic resin light guide. The light is incident on the end surface. 一種光源裝置,其為於如申請專利範圍第10項所述的熱 可塑性樹脂導光體上具備一次光源的光源裝置,且上述一次光源是鄰接於上述熱可塑性樹脂導光體的上述光入射端面而配置。 A light source device is the heat as described in claim 10 The plastic resin light guide body is provided with a light source device of a primary light source, and the primary light source is disposed adjacent to the light incident end surface of the thermoplastic resin light guide. 一種液晶顯示裝置,其具備如申請專利範圍第11項所述的光源裝置。 A liquid crystal display device comprising the light source device according to claim 11 of the patent application. 一種液晶顯示裝置,其具備如申請專利範圍第12項所述的光源裝置。 A liquid crystal display device comprising the light source device according to claim 12 of the patent application.
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