TWI610812B - Electronic component surface protection material and preparation method thereof - Google Patents

Abstract

The electronic component surface protection material provided by the present invention and a preparation method thereof are prepared by adding an organic carrier, an additive, and a ceramic powder to a glass powder material, and controlling a relative proportion of the ceramic powder with respect to the overall weight to prepare a material having surface roughness characteristics, Electronic component surface protection material with good adhesion to colloids and not easily warped and deformed, so that the electronic component surface protection material can be stably adhered to the circuit board or electronic device through the gel, and will not fall off during wave soldering Material conditions, so that electronic components to achieve moisture resistance, acid and alkali resistance, can also save nearly 20% of the cost of materials at the same time, for the electronic protection component industry to provide a higher level of packaging technology and higher profits.

Description

Electronic component surface protection material and preparation method thereof

The invention relates to an electronic component surface protection material and a preparation method thereof, particularly an electronic component which is applied to electronic components on circuit equipment and has a good combination with colloids, and does not warp and deform due to application of high temperature processing. Surface protection material and preparation method thereof.

The electronic components of the prior art are soldered and fixed on a circuit board or an electronic device by using a wave soldering method. The specific method may be to first place red glue on the corresponding position of the circuit board or the electronic device where the electronic component is to be set. In this way, the electronic component is fixed on the circuit board or the electronic device, and then the wave soldering step is performed on the circuit board or the electronic device, the electronic component and the red glue, so as to solder and fix the electronic component on the circuit board or the electronic device.

However, since the prior art electronic component 120 products such as: thermistors are based on the requirements of moisture resistance and resistance to acid and alkali, the surface of their products is coated with glass paste to form a glass layer 90, as shown in FIG. The effect of acid and alkali, the glass paste composition of the prior art is as follows: glass powder 65-70 wt%, solvent 20-35 wt%, adhesive 1-5 wt%, and additives 0-5 wt%. However, because the glass layer 90 has a smooth surface, the combination effect of the glass layer 90 and the red glue 100 is not good. As a result, the glass layer 90 is often dropped from the circuit board 110 during wave soldering, and the material is cut off, which leads to the customer. V. In addition, due to the different thermal expansion coefficients of glass and ceramic materials, when the thickness of the ceramic body is thin to a certain extent, the ceramic sheet will warp and affect the subsequent processing of electronic components. Therefore, the existing commercially available glass pastes cannot be simultaneously The problems of the combination of the glass layer and the red glue and the warping and deformation of the ceramic body due to heating are overcome.

In view of the shortcomings and problems of the prior art, at the present stage, an electronic component surface protection material capable of effectively solving the problem of blanking is needed, so that the binding ability of the electronic component surface protection material and the red glue can be increased, and the electronic component surface protection material has specific The expansion coefficient will not be warped and deformed due to high temperature processing, which will affect the subsequent processing of electronic components, at the same time reduce the cost of manufacturing surface protection materials for electronic components, and improve the disadvantages of general glass pastes used in the prior art.

In order to achieve the above-mentioned object of the present invention, the technical means adopted in the present invention is to provide a surface protection material for electronic components, which comprises: a glass powder, an organic carrier, an additive, and a ceramic powder.

The advantage of the present invention is that a glass powder, an organic carrier, an additive, and a ceramic powder are mixed to form a new electronic component surface protection material. The addition of ceramic powder increases the surface roughness of the surface protection material of the electronic component and its colloid with the colloid. The adhesive force of the electronic component surface protection material has a specific material expansion coefficient, which is not easy to warp and deform due to high temperature processing, and is suitable for the surface protection of various electronic components.

Preferably, the glass powder is selected from the group consisting of silicon dioxide (SiO ₂ ), zinc oxide (ZnO), boron trioxide (B ₂ O ₃ ), and bismuth trioxide (Bi ₂ O ₃ ), lead oxide (PbO), aluminum oxide (Al ₂ O ₃ ), and combinations thereof; the ceramic powder is aluminum oxide (Al ₂ O ₃ ), silicon dioxide (SiO2), Magnesium oxide (MgO), titanium dioxide (TiO2), zinc oxide (ZnO), and combinations thereof; the organic vehicle includes a solvent and a binder, and the solvent is selected from the group consisting of terpineol ), Diethylene glycol monobutyl ether acetate, Diethylene glycol dibutyl ether, Texanol, and combinations thereof; the binder is fiber Cellulose resin, Ethyl cellulose, Acrylic resin, Polyvinyl butyral resin, Phenolic resin, and combinations thereof The additive is selected from Groups: Dispersant agent, Thixotropic agent, Viscosity adjuster, Antifoaming agent and combinations thereof. This technical means only uses one or more kinds of glass powder, ceramic powder, organic carrier and additive materials to form an electronic component surface protection material, and makes the electronic component by the original material characteristics of these materials and the chemical structure characteristics generated by the interaction. The surface protection material has the effect of preventing moisture and acid and alkali.

The present invention further provides a method for preparing the aforementioned surface protection material for electronic components, which comprises the following steps: at a first temperature, a material selected from the group consisting of silicon dioxide, zinc oxide, boron trioxide, bismuth trioxide, and lead oxide is selected. The glass materials of the group consisting of aluminum oxide, aluminum oxide, and the like are heated and melted and mixed, and then cooled and crushed to provide a glass powder; and the glass powder and an organic carrier at a second temperature, The additives and the ceramic powder are mixed to provide a glass paste, and then the glass paste is used to form an electronic component surface protection material; wherein the second temperature is lower than the first temperature.

The advantage of the present invention is that it is simply used in the crushed glass material (powder) to further add organic carriers, additives and ceramic powder to form a glass paste, and the addition of ceramic powder increases the surface roughness of the surface protection material of electronic components and its The adhesion of the colloid makes the surface protection material of the electronic component have a specific material expansion coefficient, and it is not easy to warp and deform due to high temperature processing. It is suitable for the surface protection of various electronic components.

Preferably, the average particle diameter of the ceramic powder is 0.5-20 microns, and the second temperature is an ambient temperature of -10 ° C to 40 ° C. This technical means only uses the average particle size of the ceramic powder and the temperature when the glass powder is mixed with the organic carrier, additives and ceramic powder to achieve the best mixing effect, and the electronic component surface protection material formed after mixing does have Moisture-proof, anti-acid-base function.

The present invention also provides a method for preparing the surface protection material of the electronic component, which comprises the following steps: at a first temperature, a material selected from the group consisting of silicon dioxide, zinc oxide, boron trioxide, bismuth trioxide, and lead oxide is selected. The glass materials of the group consisting of aluminum oxide, aluminum oxide, and the like are heated and melted and mixed, and then cooled and crushed to provide a glass powder, and the glass powder and an organic carrier at a second temperature and The additives are mixed to provide a glass mother paste; the ceramic powder is mixed with the organic vehicle and the additives at a second temperature to provide a ceramic sub paste, wherein the second temperature is lower than the first temperature; and the glass is mixed A mother paste and a ceramic paste, at a second temperature, the glass mother paste and the ceramic paste are mixed at any ratio, so that the glass mother paste and the ceramic paste are uniformly mixed to form an electron with a surface roughness and a specific expansion coefficient Component surface protection material.

The invention has the advantages of simply preparing a glass mother paste and a ceramic sub paste separately, and then mixing them according to any ratio, thereby formulating a variety of surface protection materials for electronic components with specific roughness and specific expansion coefficients for use. The user can simply adjust the relative mixing ratio of the glass mother paste and the ceramic sub paste to change the surface roughness and specific expansion coefficient of the surface protection material of the electronic component, and simply make a variety of electronic component surface protection materials with different material characteristics.

Preferably, the average particle diameter of the ceramic powder is 0.5-20 microns, and the second temperature is an ambient temperature of -10 ° C to 40 ° C. This technical method only uses the average particle size of the ceramic powder and the temperature when the glass powder is mixed with the organic carrier, additives and ceramic powder to achieve the best mixing effect, and makes the surface protection material of the electronic component formed by the mixing truly moisture-proof. Anti-acid-base function.

In the following, please refer to the drawings and the preferred embodiments of the present invention to further explain the technical means adopted by the present invention to achieve the intended invention purpose.

The relative combination of the electronic component surface protection material 10 of the present invention with the circuit board 20, the electronic component 30, and the red glue 40 is shown in FIG. 1, wherein the electronic component 30 is disposed below the circuit board 20, and the circuit board 20 is opposite to A red glue 40 is coated on one side of the electronic component 30, and the electronic component surface protection material 10 is fixed under the circuit board 20 by the red glue 40, and then the electronic component 30 is fixed to the circuit by wave soldering. Under the board 20, the electronic component 30 soldered under the circuit board 20 has the effects of preventing moisture and acid and alkali.

The electronic component surface protection material 10 of the present invention comprises: a glass powder, an organic carrier, an additive, and a ceramic powder, wherein the glass powder is selected from the group consisting of silicon dioxide, zinc oxide, Boron trioxide, bismuth trioxide, lead oxide, aluminum oxide, and combinations thereof; the ceramic powder is selected from the group consisting of aluminum oxide, silicon dioxide, magnesium oxide, titanium dioxide, Zinc oxide and combinations thereof have an average particle diameter of 0.5-20 microns; the organic vehicle includes a solvent and a binder, and the solvent is selected from the group consisting of terpineol and diethylene glycol monobutylene Ether ether acetate, diethylene glycol dibutyl ether, ester alcohol and combinations thereof; the binder is selected from the group consisting of cellulose resin, ethyl cellulose, acrylic resin, polyethylene A dilute butyral resin, a phenol resin, and a combination thereof; and the additive is selected from the group consisting of a dispersant, a rheological agent, a viscosity modifier, a defoamer, and combinations thereof.

The electronic component surface protection material 10 to which ceramic powder is added is shown in FIG. 2, wherein the surface of the electronic component surface protection material 10 becomes rough due to the addition of ceramic powder, so that the electronic component surface protection material 10 and the red glue 40 are made. The ability to combine with each other is increased, thereby effectively overcoming the problem of blanking caused by the smooth surface of the glass layer formed by the prior art glass paste.

The glass powder, the organic vehicle, and the additives can be mixed in advance to form a glass mother paste. The content of the glass powder accounts for 70% of the weight of the whole glass mother paste. The organic vehicle includes a solvent and a binder, respectively. The content of the additive accounts for 25% by weight of the whole glass mother paste, the content of the binder accounts for 4% by weight of the whole glass mother paste, and the content of the additive accounts for 1% by weight of the whole glass mother paste. The ceramic powder, the organic carrier, and the additives may be mixed in advance to form a ceramic sub-paste, wherein the content of the ceramic powder accounts for 70% of the weight of the entire ceramic sub-paste. The organic carrier includes a solvent and a binder, respectively. The content of the solvent accounts for 25% of the weight of the entire ceramic paste, the content of the binder accounts for 4% of the weight of the entire ceramic paste, and the content of the additive accounts for 1% of the weight of the entire ceramic paste. Then, the glass mother paste and the ceramic sub paste are further mixed in a specific ratio to form the electronic component surface protection material of the present invention. The three types of surface protection materials for electronic components formed by mixing glass mother paste and ceramic sub paste in different proportions are described below one by one according to Examples 1 to 3:

Example 1

The prepared glass mother paste and the ceramic sub paste are mixed in a proportion of 13: 1 by weight, so that the mixed electronic component surface protection material contains 65% by weight of glass powder, Ceramic powder accounts for 5% by weight of the overall electronic component surface protection material, solvent accounts for 25% by weight of the overall electronic component surface protection material, 4% by weight of the binder for the overall electronic component surface protection material, and overall surface protection for the electronic component 1% by weight of the additive. The glass powder is formed by mixing silicon dioxide, zinc oxide, and boron trioxide; the ceramic powder is aluminum oxide; the organic carrier includes a solvent and a binder, and the solvent is composed of terpineol, two Glycol monobutyl ether acetate and diethylene glycol dibutyl ether are mixed together; the binder is a cellulose resin; and the additive is a mixture of a dispersant, a rheological agent, a viscosity adjusting agent, and an antifoaming agent.

Example 2

The prepared glass mother paste and the ceramic paste are mixed in a weight ratio of 4: 1, so that the mixed electronic component surface protection material contains 56% by weight of glass powder, Ceramic powder accounts for 14% by weight of the overall electronic component surface protection material, solvent accounts for 25% by weight of the overall electronic component surface protection material, 4% by weight of the binder for the overall electronic component surface protection material, and overall electronic component surface protection 1% by weight of the additive. The glass powder is formed by mixing silicon dioxide, zinc oxide, and boron trioxide; the ceramic powder is aluminum oxide; the organic carrier includes a solvent and a binder, and the solvent is composed of terpineol, two Glycol monobutyl ether acetate and diethylene glycol dibutyl ether are mixed together; the binder is a cellulose resin; and the additive is a mixture of a dispersant, a rheological agent, a viscosity adjusting agent, and an antifoaming agent.

Example 3

The prepared glass mother paste and the ceramic sub paste are mixed and mixed according to a weight ratio of 4: 3, so that the mixed electronic component surface protection material contains 40% by weight of glass powder, Ceramic powder accounts for 30% by weight of the overall electronic component surface protection material, 25% by weight of the solvent for the overall electronic component surface protection material, 4% by weight of the binder for the overall electronic component surface protection material, and overall electronic component surface protection 1% by weight of the additive. The glass powder is formed by mixing silicon dioxide, zinc oxide, and boron trioxide; the ceramic powder is aluminum oxide; the organic carrier includes a solvent and a binder, and the solvent is composed of terpineol, two Glycol monobutyl ether acetate and diethylene glycol dibutyl ether are mixed together; the binder is a cellulose resin; and the additive is a mixture of a dispersant, a rheological agent, a viscosity adjusting agent, and an antifoaming agent.

The relative weight ratio of each component of the electronic component surface protection material prepared in the above Examples 1 to 3 is shown in Table 1:

Table 1 的 Relative weight ratios of the components of the surface protection materials of electronic components of Examples 1 to 3 <TABLE border = "1" borderColor = "# 000000" width = "85%"> <TBODY> <tr> <td> Items </ td> <td> Example 1 </ td> <td> Example 2 </ td> <td> Example 3 </ td> </ tr> <tr> <td> Glass mother paste and ceramics Mixing weight ratio of paste </ td> <td> 13: 1 </ td> <td> 4: 1 </ td> <td> 4: 3 </ td> </ tr> <tr> <td> glass powder Proportion of total weight </ td> <td> 65% </ td> <td> 56% </ td> <td> 40% </ td> </ tr> <tr> <td> Ceramic powder Overall weight ratio </ td> <td> 5% </ td> <td> 14% </ td> <td> 30% </ td> </ tr> <tr> <td> Solvent in organic vehicle Proportion in total weight </ td> <td> 25% </ td> <td> 25% </ td> <td> 25% </ td> </ tr> <tr> <td> Adhesion in organic carrier Weight ratio of the additive </ td> <td> 4% </ td> <td> 4% </ td> <td> 4% </ td> </ tr> <tr> <td> Overall weight ratio </ td> <td> 1% </ td> <td> 1% </ td> <td> 1% </ td> </ tr> <tr> <td> Total </ td> < td> 100% </ td> <td> 100% </ td> <td> 100% </ td> </ tr> </ TBODY> </ TABLE>

Next, product samples are produced. First, a total of 4 negative temperature coefficient thermistor ceramic sheets of the same batch are prepared, with the same dimensions of 100mm in length, 100mm in width, and 0.7mm in thickness. Then, the conventional glass paste and The electronic component surface protection materials prepared in Examples 1 to 3 were fabricated on the top and bottom of each thermistor ceramic sheet, respectively, and the single layer of the glass layer obtained by curing the conventional glass paste and the electronic component surface protection material was wet. The film thickness is controlled at 25-30 microns. Then the sample was dried at 130 ° C for 10 minutes, and then subjected to a high-temperature glass sintering procedure at 780 ° C for 10 minutes, so that the glass layer formed a single-layer protective layer with a thickness of 20-25 microns. After cooling, the following tests were performed:

Surface roughness test:

The surface roughness measurement method is to measure the object under the probe of the roughness measuring instrument, and the measured value S represents the distance between two peaks of the rough surface of an object 50, as shown in the figure. 3, the measurement results are shown in Table 2:

Table 2 Surface roughness test results <TABLE border = "1" borderColor = "# 000000" width = "85%"> <TBODY> <tr> <td> Items </ td> <td> Roughness test (S) S represents the distance between the wave peaks </ td> </ tr> <tr> <td> No </ td> <td> Conventional glass paste (µm) </ td> <td> Example 1 (µm) </ td > <td> Example 2 (µm) </ td> <td> Example 3 (µm) </ td> </ tr> <tr> <td> 1 </ td> <td> 134 </ td> <td> 101 </ td> <td> 41 </ td> <td> 22 </ td> </ tr> <tr> <td> 2 </ td> <td> 148 </ td> <td> 126 </ td> <td> 58 </ td> <td> 31 </ td> </ tr> <tr> <td> 3 </ td> <td> 141 </ td> <td> 93 </ td> <td> 45 </ td> <td> 39 </ td> </ tr> <tr> <td> 4 </ td> <td> 136 </ td> <td> 88 </ td> < td> 42 </ td> <td> 20 </ td> </ tr> <tr> <td> 5 </ td> <td> 139 </ td> <td> 110 </ td> <td> 51 </ td> <td> 18 </ td> </ tr> <tr> <td> 6 </ td> <td> 152 </ td> <td> 112 </ td> <td> 55 </ td > <td> 26 </ td> </ tr> <tr> <td> 7 </ td> <td> 150 </ td> <td> 105 </ td> <td> 59 </ td> <td > 14 </ td> </ tr> <tr> <td> 8 </ td> <td> 144 </ td> <td> 93 </ td> <td> 49 </ td> <td> 24 < / td> </ tr> <tr> <td> 9 </ td> <td> 147 </ td> <td> 89 </ td> <td> 48 </ td> <td> 27 </ td> </ tr> <tr> <td> 10 </ td> <td> 152 </ td> <td> 94 </ td> <td> 52 </ td> <td> 30 </ td> </ tr> <tr> <td> Average </ td> <td> 144 </ td> <td> 101 </ td> <td> 50 </ td> <td> 25 </ td> </ tr> </ TBODY> </ TABLE>

From the test results in Table 2, it can be known that the average distance between the two peaks on the surface of the conventional glass paste after 10 measurements and average calculations is 144 microns, and the electrons made in Example 1 of the present invention The average distance between the two wave peaks on the surface of the component surface protection material is 101 micrometers. The average distance between the two wave peaks on the surface of the electronic component surface protection material made in Example 2 of the present invention is 50 microns, and the embodiment of the present invention The average distance between the two peaks on the surface of the electronic component surface protection material made in 3 is only 25 micrometers. The smaller the average distance between the two peaks on the measured surface of the material, the more the frequency of the material's surface fluctuations. High, that is, the rougher the surface of the material, the test results in Table 2 can confirm that as the weight ratio of the ceramic powders mixed in Examples 1 to 3 of the present invention gradually increases, the surface of the electronic component surface protection material produced by the same The rougher the nature.

Warpage test:

The method of measuring warpage is to place the tested piece 60 on a granite platform 70, use a micrometer to measure the center thickness of the front and back of the piece 60, and then subtract the center thickness of the front and back of the piece 60. The warpage of the ceramic plate 60 is obtained, as shown in FIGS. 4A and 4B. The measurement results are shown in Table 3:

Table 3 Warpage test results <TABLE border = "1" borderColor = "# 000000" width = "85%"> <TBODY> <tr> <td> items </ td> <td> Warpage test </ TABLE td> </ tr> <tr> <td> No </ td> <td> Custom glass paste (µm) </ td> <td> Example 1 (µm) </ td> <td> Example 2 ( µm) </ td> <td> Example 3 (µm) </ td> </ tr> <tr> <td> 1 </ td> <td> 308 </ td> <td> 153 </ td> <td> 55 </ td> <td> 32 </ td> </ tr> <tr> <td> 2 </ td> <td> 354 </ td> <td> 182 </ td> <td> 48 </ td> <td> 25 </ td> </ tr> <tr> <td> 3 </ td> <td> 312 </ td> <td> 202 </ td> <td> 61 </ td> <td> 28 </ td> </ tr> <tr> <td> 4 </ td> <td> 392 </ td> <td> 178 </ td> <td> 56 </ td> < td> 31 </ td> </ tr> <tr> <td> 5 </ td> <td> 373 </ td> <td> 132 </ td> <td> 53 </ td> <td> 29 </ td> </ tr> <tr> <td> 6 </ td> <td> 331 </ td> <td> 168 </ td> <td> 57 </ td> <td> 20 </ td > </ tr> <tr> <td> 7 </ td> <td> 365 </ td> <td> 133 </ td> <td> 49 </ td> <td> 22 </ td> </ tr> <tr> <td> 8 </ td> <td> 336 </ td> <td> 142 </ td> <td> 63 </ td> <td> 33 </ td> </ tr> < tr> <td> 9 </ td> <td> 328 </ td> <td> 178 </ td> <td> 55 </ td> <td> 17 </ td> </ tr> <tr> < td> 10 </ td> <td> 344 </ td> <td> 184 </ td> <td> 54 </ td> <td> 38 </ td> </ tr> <tr> <td> Average </ td> <td> 344 </ td> <td> 165 </ td > <td> 55 </ td> <td> 28 </ td> </ tr> </ TBODY> </ TABLE>

From the test results in Table 3, it can be known that the average value of the warpage degree of the conventional glass paste after 10 measurements and the average calculation is 344 microns, and the surface of the electronic component made in Example 1 of the present invention The average value of the warpage of the protective material is 165 micrometers. The average value of the warpage of the electronic component surface protection material made in Example 2 of the present invention is 55 micrometers. The average value of the warpage of the electronic component surface protection material is only 28 microns, and the smaller the average value measured, the smaller the degree of warpage and deformation of the material. Therefore, the test results in Table 3 can confirm that with the present invention The weight ratio of the ceramic powders mixed in Examples 1 to 3 is gradually increased, and the surface protection materials of the electronic components manufactured by them are less likely to warp and deform.

Adhesion test:

The method for measuring the adhesion is to cut the above-mentioned sample into 1.6mm and 0.8mm wide grains, and then place the above-mentioned crystal grains on the printed circuit board (PCB) with the bonding agent for the placement of the grains between the solder joints. Then, bake at a high temperature of 140 ° C for 10 minutes, and then test with a thruster to record the maximum thrust before the grains fall off. The measurement results are shown in Table 4:

Table 4 Results of adhesion test <TABLE border = "1" borderColor = "# 000000" width = "85%"> <TBODY> <tr> <td> item </ td> <td> Adhesion test </ td> </ tr> <tr> <td> No </ td> <td> Conventional glass paste (Kg) </ td> <td> Example 1 (Kg) </ td> <td> Example 2 (Kg) </ td> <td> Example 3 (Kg) </ td> </ tr> <tr> <td> 1 </ td> <td> 0.26 </ td> <td> 0.56 </ td> <td > 1.49 </ td> <td> 1.55 </ td> </ tr> <tr> <td> 2 </ td> <td> 0.25 </ td> <td> 0.64 </ td> <td> 1.31 < / td> <td> 1.48 </ td> </ tr> <tr> <td> 3 </ td> <td> 0.36 </ td> <td> 0.73 </ td> <td> 1.3 </ td> <td> 1.74 </ td> </ tr> <tr> <td> 4 </ td> <td> 0.31 </ td> <td> 0.52 </ td> <td> 1.54 </ td> <td> 1.39 </ td> </ tr> <tr> <td> 5 </ td> <td> 0.33 </ td> <td> 0.55 </ td> <td> 1.46 </ td> <td> 1.58 </ td> </ tr> <tr> <td> 6 </ td> <td> 0.28 </ td> <td> 0.48 </ td> <td> 1.28 </ td> <td> 1.67 </ td> < / tr> <tr> <td> 7 </ td> <td> 0.27 </ td> <td> 0.51 </ td> <td> 1.47 </ td> <td> 1.51 </ td> </ tr> <tr> <td> 8 </ td> <td> 0.35 </ td> <td> 0.58 </ td> <td> 1.5 </ td> <td> 1.49 </ td> </ tr> <tr> <td> 9 </ td> <td> 0.26 </ td> <td> 0.64 </ td> <td> 1.31 </ td> <td> 1.63 < / td> </ tr> <tr> <td> 10 </ td> <td> 0.34 </ td> <td> 0.57 </ td> <td> 1.28 </ td> <td> 1.66 </ td> </ tr> <tr> <td> Average </ td> <td> 0.3 </ td> <td> 0.58 </ td> <td> 1.39 </ td> <td> 1.57 </ td> </ tr > </ TBODY> </ TABLE>

From the test results in Table 4, it can be known that the conventional glass paste has been measured 10 times and averaged to obtain a thrust of 0.3 kg to obtain the crystal grains of the sample. The surface protection material of the electronic component manufactured requires a thrust of 0.58Kg before the grains of the sample can fall off. The surface protection material of the electronic component manufactured in Example 2 of the present invention requires a thrust of 1.39Kg. The crystal grains of the sample can be peeled off, and the electronic component surface protection material manufactured in Example 3 of the present invention needs to apply a thrust of 1.57 Kg to cause the crystal grains of the specimen to fall off. A larger value indicates that the material has a better ability to combine with the printed circuit board through an adhesive, so the test results in Table 4 can confirm that as the weight ratio of the ceramic powders mixed in Examples 1 to 3 of the present invention gradually increases, its The better the combination of the surface protection material of the electronic component and the red glue is made, and the less likely that the material will fall out.

The test results of the surface roughness, warpage, and adhesion show that the present invention can effectively increase the surface roughness of the electronic component surface protection material 10 and the electronic component surface protection material 10 by further adding ceramic powder to the conventional glass paste. Adhesion to colloids, and effectively reduce the warpage deformation of the electronic component surface protection material 10 due to high temperature sintering during the manufacturing process, which can not only solve the problem of blanking in the past, but also facilitate the electronic component surface protection material 10 after forming Processing, to provide better surface protection materials for electronic component products, so that electronic components will not be affected by moisture, acid and alkali resistance due to surface protection material blanking, warping and deformation.

The invention further provides a method for easily preparing the aforementioned surface protection material for electronic components, which comprises the following steps: providing a glass powder, and combining a combination of silicon dioxide, zinc oxide, boron trioxide, and the like at a first temperature; After the glass material is heated and melted and mixed, it is then cooled and crushed to form glass frit. Next, a glass paste is provided, and the glass powder is mixed with an organic carrier, an additive, and a ceramic powder at a second temperature to form an electronic component surface protection material, wherein the average particle diameter of the ceramic powder is 1.8 micrometers, and the first The two temperatures are lower than the first temperature, and the second temperature is -10 ° C to 40 ° C.

The invention also provides a method for preparing a surface protection material for electronic components, which is convenient for adjusting the material expansion coefficient and surface roughness, which includes the following steps: providing a glass mother paste, heating and melting the glass material at a first temperature and mixing, It is then cooled and pulverized to form a glass powder, and the glass powder is mixed with an organic carrier and additives at a second temperature to form a glass mother paste. A ceramic paste is provided. The ceramic powder is mixed with an organic vehicle and additives at a second temperature to form a ceramic paste. The average particle diameter of the ceramic powder is 1.8 microns, and the second temperature is the ambient temperature. 10 ° C to 40 ° C, the second temperature is lower than the first temperature. Finally, the above-mentioned glass mother paste and ceramic sub paste are uniformly mixed at any ratio, and the glass mother paste and the ceramic sub paste are mixed at an ambient temperature of -10 ° C to 40 ° C. Proportionally adjusted the surface protection material of electronic components with specific material expansion coefficient and surface roughness.

In summary, the present invention can be used to prepare electronic component surface protection materials by using a simple method, or by using a method that is more complicated but easy to adjust the material expansion coefficient and surface roughness. Compared with the conventional glass paste, its surface is rougher, can adhere closely to the colloid, and is not easy to warp and deform the electronic component surface protection material, thereby solving the poor combination effect of electronic components and red glue in the past and the wave soldering process. The problem of blanking often occurs, and the appearance of the material that is not easily warped and deformed also facilitates the subsequent processing of electronic components, which can effectively improve the yield of electronic products, save nearly 20% of material costs, and reduce the cost of production costs, such as Table 5 shows. In addition, the electronic component surface protection material of the present invention is particularly suitable for SMD-type negative temperature coefficient (NTC) thermistors, SMD-type positive temperature coefficient (PTC) thermistors, and SMD-type zinc oxide varistor (MOV) Provide higher-level technology for the electronic protection component industry.

Table 5: Comparison of surface protection materials of electronic components of the present invention with conventional glass pastes. <TABLE border = "1" borderColor = "# 000000" width = "85%"> <TBODY> <tr> <td> Items </ td> < td> Surface protection material for electronic components of the present invention </ td> <td> Custom glass paste </ td> </ tr> <tr> <td> Surface properties </ td> <td> Rough </ td> <td > Smooth </ td> </ tr> <tr> <td> red glue adhesion </ td> <td> strong </ td> <td> weak </ td> </ tr> <tr> <td> Thermal expansion coefficient </ td> <td> Can be adjusted according to ceramic powder content </ td> <td> Fixed </ td> </ tr> <tr> <td> Material cost </ td> <td> Low (saving About 20%) </ td> <td> High </ td> </ tr> <tr> <td> Cost of material preparation </ td> <td> Low (manufacturer does not need to purchase material) </ td> <td> Long </ td> </ tr> <tr> <td> Product Applications </ td> <td> Diversified </ td> <td> Localized in specific products </ td> </ tr> </ TBODY> </ TABLE>

The above are only the preferred embodiments of the present invention, and are not intended to limit the present invention in any form. Although the present invention has been disclosed as above with the preferred embodiments, they are not intended to limit the present invention. Generally, a person skilled in the art can use the disclosed technical content to make minor changes or modifications to equivalent embodiments without departing from the technical solution of the present invention. Anyone who does not depart from the technical solution of the present invention according to the present invention Technical essence of the invention Any simple modifications, equivalent changes, and modifications made to the above embodiments still fall within the scope of the technical solution of the present invention.

10‧‧‧Electronic component surface protection material
20, 110‧‧‧ circuit board
30, 120‧‧‧Electronic components
40, 100‧‧‧ red plastic
50‧‧‧Measured
60‧‧‧Porcelain to be tested
70‧‧‧ granite platform
90‧‧‧ glass layer
S‧‧‧ peak spacing of material surface

FIG. 1 is a schematic diagram of the combination of the surface protection material for electronic components and related electronic components according to the present invention. FIG. 2 is a schematic diagram showing the bonding of the surface protection material of the electronic component and the red glue of the present invention. FIG. 3 is a schematic diagram of a surface roughness test of a surface protection material of an electronic component of the present invention. FIG. 4A is a schematic diagram of warpage measurement in a first placement state of a surface protection material of an electronic component of the present invention. FIG. 4B is a schematic diagram of warpage measurement in the second placement state of the surface protection material of the electronic component of the present invention. FIG. 5 is a schematic diagram of the prior art smooth glass layer and red glue bonding.

10‧‧‧Electronic component surface protection material

20‧‧‧Circuit Board

30‧‧‧Electronic components

40‧‧‧ red plastic

Claims (9)

An electronic component surface protection material includes: a glass powder, an organic carrier, an additive, and a ceramic powder; wherein the average particle diameter of the ceramic powder is 0.5 micrometer to 20 micrometers. The surface protection material for electronic components according to claim 1, wherein the glass powder is selected from the group consisting of silicon dioxide, zinc oxide, boron trioxide, bismuth trioxide, lead oxide, and dioxide Aluminum and combinations thereof; and the ceramic powder is selected from the group consisting of aluminum oxide, silicon dioxide, magnesium oxide, titanium dioxide, zinc oxide, and combinations thereof. The surface protection material for electronic components according to claim 1 or 2, wherein the organic vehicle comprises a solvent and a binder, and the solvent is selected from the group consisting of terpineol, diethylene glycol monobutyl ether Acetate, diethylene glycol dibutyl ether, ester alcohol, and combinations thereof; and the binder is selected from the group consisting of cellulose resin, ethyl cellulose, acrylic resin, polyethylene Butyral resin, phenol resin, and combinations thereof. The electronic component surface protection material according to claim 1 or 2, wherein the additive is selected from the group consisting of a dispersant, a rheological agent, a viscosity adjusting agent, a defoaming agent, and combinations thereof. The electronic component surface protection material according to claim 3, wherein the additive is selected from the group consisting of a dispersant, a rheological agent, a viscosity adjusting agent, a defoaming agent, and combinations thereof. A method for preparing an electronic component surface protection material according to any one of claims 1 to 5, comprising the steps of: at a first temperature, selecting a material selected from the group consisting of silicon dioxide, zinc oxide, and boron trioxide. Glass materials consisting of bismuth trioxide, lead oxide, aluminum oxide, and combinations thereof are heated and melted and mixed, and then cooled and crushed to provide a glass powder; and The glass powder is mixed with an organic carrier, an additive and a ceramic powder at a second temperature to provide a glass paste, and then the glass paste is used to form an electronic component surface protection material; wherein the average particle diameter of the ceramic powder is 0.5 to 20 microns, the second temperature is lower than the first temperature. The method for preparing a surface protection material for an electronic component according to claim 6, wherein the second temperature is an ambient temperature of -10 ° C to 40 ° C. A method for preparing an electronic component surface protection material according to any one of claims 1 to 5, comprising the steps of: at a first temperature, selecting a material selected from the group consisting of silicon dioxide, zinc oxide, and boron trioxide. Glass materials consisting of bismuth trioxide, lead oxide, alumina, and combinations thereof are heated and melted and mixed, and then cooled and crushed to provide a glass powder, and then at a second temperature The glass powder is mixed with an organic vehicle and additives to provide a glass mother paste; the ceramic powder is mixed with the organic vehicle and additives at a second temperature to provide a ceramic paste, wherein the average of the ceramic powder is The particle diameter is 0.5 micrometer to 20 micrometers, the second temperature is lower than the first temperature; and the glass mother paste and the ceramic sub paste are mixed, and the glass mother paste and the ceramic sub paste are mixed at an arbitrary ratio at the second temperature. The glass mother paste and the ceramic sub paste are uniformly mixed to form an electronic component surface protection material with a surface roughness and a specific expansion coefficient. The method for preparing a surface protection material for an electronic component according to claim 8, wherein the second temperature is -10 ° C to 40 ° C.